TI CY74FCT244TSOCG4 8-bit buffers/line drivers with 3-state output Datasheet

CY54FCT244T, CY74FCT244T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS071 – OCTOBER 2001
D
D
D
D
D
D
D
D
OEA
DA0
OB0
DA1
OB1
DA2
OB2
DA3
OB3
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
OEB
OA0
DB0
OA1
DB1
OA2
DB2
OA3
DB3
CY54FCT244T . . . L PACKAGE
(TOP VIEW)
OB0
DA0
OEA
VCC
OEB
D
CY54FCT244T . . . D PACKAGE
CY74FCT244T . . . P, Q, OR SO PACKAGE
(TOP VIEW)
Function, Pinout, and Drive Compatible
With FCT and F Logic
Reduced VOH (Typically = 3.3 V) Versions
of Equivalent FCT Functions
Edge-Rate Control Circuitry for
Significantly Improved Noise
Characteristics
Ioff Supports Partial-Power-Down Mode
Operation
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
Matched Rise and Fall Times
Fully Compatible With TTL Input and
Output Logic Levels
CY54FCT244T
– 48-mA Output Sink Current
12-mA Output Source Current
CY74FCT244T
– 64-mA Output Sink Current
32-mA Output Source Current
3-State Outputs
DA1
OB1
DA2
OB2
DA3
4
3
2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
OA0
DB0
OA1
DB1
OA2
OB 3
GND
DB 3
OA 3
DB 2
D
description
The ’FCT244T devices are octal buffers and line drivers designed to be employed as memory address drivers,
clock drivers, and bus-oriented transmitters/receivers. These devices provide speed and drive capabilities
equivalent to their fastest bipolar logic counterparts, while reducing power consumption. The input and output
voltage levels allow direct interface with TTL, NMOS, and CMOS devices without external components.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CY54FCT244T, CY74FCT244T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS071 – OCTOBER 2001
ORDERING INFORMATION
QSOP – Q
0°C to 70°C
TOP-SIDE
MARKING
3.6
CY74FCT244DTQCT
Tube
3.6
CY74FCT244DTSOC
Tape and reel
3.6
CY74FCT244DTSOCT
Tube
4.1
CY74FCT244CTSOC
Tape and reel
4.1
CY74FCT244CTSOCT
QSOP – Q
Tape and reel
4.1
CY74FCT244CTQCT
FCT244C
DIP – P
Tube
4.6
CY74FCT244ATPC
CY74FCT244ATPC
Tube
4.6
CY74FCT244ATSOC
Tape and reel
4.6
CY74FCT244ATSOCT
Tape and reel
4.6
CY74FCT244ATQCT
Tube
6.5
CY74FCT244TSOC
Tape and reel
6.5
CY74FCT244TSOCT
QSOP – Q
Tape and reel
6.5
CY74FCT244TQCT
CDIP – D
Tube
4.6
CY54FCT244CTDMB
LCC – L
Tube
4.6
CY54FCT244CTLMB
CDIP – D
Tube
5.1
CY54FCT244ATDMB
LCC – L
Tube
5.1
CY54FCT244ATLMB
CDIP – D
Tube
7
CY54FCT244TDMB
SOIC – SO
SOIC – SO
QSOP – Q
SOIC – SO
–55°C
55°C to 125°C
ORDERABLE
PART NUMBER
Tape and reel
SOIC – SO
40°C to 85°C
–40°C
SPEED
(ns)
PACKAGE†
TA
FCT244D
FCT244D
FCT244C
FCT244A
FCT244A
FCT244
FCT244
LCC – L
Tube
7
CY54FCT244TLMB
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OEA
OEB
D
OUTPUT
O
L
L
L
L
L
L
H
H
H
H
X
Z
H = High logic level, L = Low logic level,
X = Don’t care, Z = High-impedance state
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CY54FCT244T, CY74FCT244T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS071 – OCTOBER 2001
logic diagram (positive logic)
OEA
1
2
18
DA1
4
16
DA2
6
14
8
12
DA0
DA3
OEB
DB0
DB1
DB2
DB3
OA0
OA1
OA2
OA3
19
17
3
15
5
13
7
11
9
OB0
OB1
OB2
OB3
absolute maximum rating over operating free-air temperature range (unless otherwise noted)†
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Package thermal impedance, θJA (see Note 1): P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W
SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
CY54FCT244T, CY74FCT244T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS071 – OCTOBER 2001
recommended operating conditions (see Note 2)
CY54FCT244T
CY74FCT244DT
CY74FCT244T
MIN
NOM
MAX
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.75
5
5.25
4.75
5
5.25
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.8
0.8
0.8
V
High-level output current
–12
–32
–32
mA
IOL
TA
Low-level output current
48
64
64
mA
85
°C
High-level input voltage
Operating free-air temperature
2
–55
2
125
0
2
70
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
4
UNIT
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
–40
V
V
CY54FCT244T, CY74FCT244T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS071 – OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
CY54FCT244T
TYP† MAX
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.75 V,
IIN = –18 mA
IIN = –18 mA
VCC = 4.5 V,
IOH = –12 mA
IOH = –32 mA
VCC = 4
4.75
75 V
MIN
–0.7
–1.2
–0.7
2.4
2.4
Vhys
All inputs
II
VCC = 5.5 V,
VCC = 5.25 V,
VIN = VCC
VIN = VCC
5
IIH
VCC = 5.5 V,
VCC = 5.25 V,
VIN = 2.7 V
VIN = 2.7 V
±1
IIL
VCC = 5.5 V,
VCC = 5.25 V,
VIN = 0.5 V
VIN = 0.5 V
±1
IOZH
VCC = 5.5 V,
VCC = 5.25 V,
VOUT = 2.7 V
VOUT = 2.7 V
10
IOZL
VCC = 5.5 V,
VCC = 5.25 V,
VOUT = 0.5 V
VOUT = 0.5 V
–10
IOS‡
VCC = 5.5 V,
VCC = 5.25 V,
VOUT = 0 V
VOUT = 0 V
VCC = 0 V,
VCC = 5.5 V,
VOUT = 4.5 V
VIN ≤ 0.2 V,
∆ICC
0.3
3.3
0.55
IOL = 64 mA
0.3
0.2
0.55
0.2
±1
±1
10
–10
–120
–225
–60
–120
±1
VIN ≥ VCC – 0.2 V
VIN ≥ VCC – 0.2 V
VCC = 5.25 V,
VIN ≤ 0.2 V,
VCC = 5.5 V, VIN = 3.4 V§, f1 = 0, Outputs open
VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open
0.1
0.5
VCC = 5.5 V, One input switching at 50% duty cycle,
Outputs open, OEA = OEB = GND,
VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V
0.06
V
V
5
–60
V
V
2
IOH = –15 mA
IOL = 48 mA
VCC = 4.5 V,
VCC = 4.75 V,
ICC
–1.2
UNIT
3.3
VOL
Ioff
CY74FCT244T
TYP† MAX
MIN
–225
±1
0.2
0.1
0.2
0.5
2
2
µA
µA
µA
µA
µA
mA
µA
mA
mA
0.12
mA/
MHz
VCC = 5.25 V, One input switching at 50% duty cycle,
Outputs open, OEA = OEB = GND,
0.06
0.12
VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V
† Typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or
sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged
shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence
of parameter tests, IOS tests should be performed last.
§ Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND
¶ This parameter is derived for use in total power-supply calculations.
ICCD¶
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
CY54FCT244T, CY74FCT244T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS071 – OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
PARAMETER
CY54FCT244T
TYP† MAX
TEST CONDITIONS
MIN
One bit switching VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
at f1 = 10 MHz
at 50% duty cycle V = 3.4 V or GND
IN
IC#
VCC = 5.5 V,
Outputs open,
Eight bits
VIN = 0.2 V or
OEA = OEB = GND switching
VIN ≥ VCC – 0.2 V
at f1 = 2.5
2 5 MHz
at 50% duty cycle VIN = 3.4 V or GND
0.7
1.4
1
2.4
1.3
2.6||
3.3
10.6||
UNIT
mA
One bit switching VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
at f1 = 10 MHz
at 50% duty cycle V = 3.4 V or GND
IN
VCC = 5.25 V,
Outputs open,
Eight bits
VIN = 0.2 V or
OEA = OEB = GND switching
VIN ≥ VCC – 0.2 V
at f1 = 2.5
2 5 MHz
at 50% duty cycle VIN = 3.4 V or GND
0.7
1.4
1
2.4
1.3
2.6||
3.3
10.6||
Ci
5
10
5
10
pF
Co
9
12
9
12
pF
† Typical values are at VCC = 5 V, TA = 25°C.
# IC
= ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1)
Where:
= Total supply current
IC
ICC = Power-supply current with CMOS input levels
∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V)
DH
= Duty cycle for TTL inputs high
NT
= Number of TTL inputs at DH
ICCD = Dynamic current caused by an input transition pair (HLH or LHL)
f0
= Clock frequency for registered devices, otherwise zero
f1
= Input signal frequency
N1
= Number of inputs changing at f1
All currents are in milliamperes and all frequencies are in megahertz.
|| Values for these conditions are examples of the ICC formula.
6
CY74FCT244T
TYP† MAX
MIN
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CY54FCT244T, CY74FCT244T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS071 – OCTOBER 2001
switching characteristics over operating free-air temperature range (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
D
O
tPZH
tPZL
OE
O
tPHZ
tPLZ
OE
O
CY54FCT244T
CY54FCT244AT
CY54FCT244CT
MIN
MAX
MIN
MAX
MIN
MAX
1.5
7
1.5
5.1
1.5
4.6
1.5
7
1.5
5.1
1.5
4.6
1.5
8.5
1.5
6.5
1.5
6.5
1.5
8.5
1.5
6.5
1.5
6.5
1.5
7.5
1.5
5.9
1.5
5.7
1.5
7.5
1.5
5.9
1.5
5.7
UNIT
ns
ns
ns
switching characteristics over operating free-air temperature range (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
D
O
tPZH
tPZL
OE
O
tPHZ
tPLZ
OE
O
CY74FCT244T
CY74FCT244AT
CY74FCT244CT
CY74FCT244DT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
1.5
6.5
1.5
4.6
1.5
4.1
1.5
3.6
1.5
6.5
1.5
4.6
1.5
4.1
1.5
3.6
1.5
8
1.5
6.2
1.5
5.8
1.5
4.8
1.5
8
1.5
6.2
1.5
5.8
1.5
4.8
1.5
7
1.5
5.6
1.5
5.2
1.5
4
1.5
7
1.5
5.6
1.5
5.2
1.5
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
7
CY54FCT244T, CY74FCT244T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS071 – OCTOBER 2001
PARAMETER MEASUREMENT INFORMATION
7V
From Output
Under Test
From Output
Under Test
Test
Point
CL = 50 pF
(see Note A)
Open
TEST
GND
CL = 50 pF
(see Note A)
500 Ω
S1
500 Ω
S1
Open
7V
Open
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
500 Ω
LOAD CIRCUIT FOR
3-STATE OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
tsu
3V
1.5 V
Input
1.5 V
th
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
1.5 V
1.5 V
VOL
tPHL
Out-of-Phase
Output
tPLZ
≈3.5 V
1.5 V
tPZH
VOH
1.5 V
VOL
1.5 V
0V
Output
Waveform 1
(see Note B)
tPLH
1.5 V
1.5 V
tPZL
VOH
In-Phase
Output
3V
Output
Control
Output
Waveform 2
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9220301M2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9220301MRA
ACTIVE
CDIP
J
20
1
TBD
5962-9220301MSA
ACTIVE
CFP
W
20
1
TBD
5962-9220302M2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9220302MRA
ACTIVE
CDIP
J
20
1
TBD
5962-9220302MSA
ACTIVE
CFP
W
20
1
TBD
5962-9220303M2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9220303MRA
ACTIVE
CDIP
J
20
1
TBD
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
Call TI
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
Call TI
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
5962-9220303MSA
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
CY54FCT244ATDMB
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CY54FCT244ATLMB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
CY54FCT244ATW
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
CY54FCT244CTDMB
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CY54FCT244CTW
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
CY54FCT244TDMB
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CY54FCT244TLMB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
CY54FCT244TW
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
CY74FCT244ATPC
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CY74FCT244ATPCE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CY74FCT244ATQCT
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT244ATQCTE4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT244ATQCTG4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT244ATSOC
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244ATSOCE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244ATSOCG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244ATSOCT
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244ATSOCTE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244ATSOCTG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244CTQCT
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT244CTQCTE4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT244CTQCTG4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT244CTSOC
ACTIVE
SOIC
DW
20
CU NIPDAU
Level-1-260C-UNLIM
25
Addendum-Page 1
Green (RoHS &
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2008
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CY74FCT244CTSOCE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244CTSOCG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244CTSOCT
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244CTSOCTG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244DTQCT
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT244DTQCTE4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT244DTQCTG4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT244DTSOC
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244DTSOCE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244DTSOCG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244DTSOCT
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244DTSOCTE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244DTSOCTG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244TQCT
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT244TQCTG4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT244TSOC
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244TSOCE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244TSOCG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244TSOCT
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244TSOCTE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT244TSOCTG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2008
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CY74FCT244ATQCT
Package Package Pins
Type Drawing
SSOP/
QSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DBQ
20
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CY74FCT244ATSOCT
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CY74FCT244CTQCT
SSOP/
QSOP
DBQ
20
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CY74FCT244CTSOCT
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CY74FCT244DTQCT
SSOP/
QSOP
DBQ
20
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CY74FCT244DTSOCT
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CY74FCT244TQCT
SSOP/
QSOP
DBQ
20
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CY74FCT244TSOCT
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CY74FCT244ATQCT
SSOP/QSOP
DBQ
20
2500
346.0
346.0
33.0
CY74FCT244ATSOCT
SOIC
DW
20
2000
346.0
346.0
41.0
CY74FCT244CTQCT
SSOP/QSOP
DBQ
20
2500
346.0
346.0
33.0
CY74FCT244CTSOCT
SOIC
DW
20
2000
346.0
346.0
41.0
CY74FCT244DTQCT
SSOP/QSOP
DBQ
20
2500
346.0
346.0
33.0
CY74FCT244DTSOCT
SOIC
DW
20
2000
346.0
346.0
41.0
CY74FCT244TQCT
SSOP/QSOP
DBQ
20
2500
346.0
346.0
33.0
CY74FCT244TSOCT
SOIC
DW
20
2000
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated