SUPPLEMENT Am29F016B Known Good Die 16 Megabit (2 M x 8-Bit) CMOS 5.0 Volt-only, Sector Erase Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS ■ 5.0 V ± 10%, single power supply operation — Minimizes system level power requirements ■ Manufactured on 0.35 µm process technology ■ High performance — 120 ns access time ■ Low power consumption — 25 mA typical active read current — 30 mA typical program/erase current — <1 µA typical standby current (standard access time to active mode) ■ Flexible sector architecture — 32 uniform sectors of 64 Kbytes each — Any combination of sectors can be erased. — Supports full chip erase — Group sector protection: A hardware method of locking sector groups to prevent any program or erase operations within that sector group Temporary Sector Group Unprotect allows code changes in previously locked sectors ■ Embedded Algorithms ■ Minimum 100,000 write/erase cycles guaranteed ■ Compatible with JEDEC standards — Pinout and software compatible with single-power-supply Flash standard — Superior inadvertent write protection ■ Data# Polling and toggle bits — Provides a software method of detecting program or erase cycle completion ■ Ready/Busy output (RY/BY#) — Provides a hardware method for detecting program or erase cycle completion ■ Erase Suspend/Resume — Suspends a sector erase operation to read data from, or program data to, a non-erasing sector, then resumes the erase operation ■ Hardware reset pin (RESET#) — Resets internal state machine to the read mode ■ Tested to datasheet specifications at temperature ■ Quality and reliability levels equivalent to standard packaged components — Embedded Erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors — Embedded Program algorithm automatically writes and verifies bytes at specified addresses 2/17/98 Publication# 21551 Rev: A Amendment/+1 Issue Date: February 1998 S U P P L E M E N T GENERAL DESCRIPTION The Am29F016B in Known Good Die (KGD) form is a 16 Mbit, 5.0 volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reliability and quality as AMD products in packaged form. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. A sector is typically erased and verified within one second. The device is erased when shipped from the factory. Am29F016B Features The hardware sector group protection feature disables both program and erase operations in any combination of the eight sector groups of memory. A sector group consists of four adjacent sectors. The Am29F016B is a 16 Mbit, 5.0 volt-only Flash memory organized as 2,097,152 bytes of 8 bits each. The 2 Mbytes of data are divided into 32 sectors of 64 Kbytes each for flexible erase capability. The 8 bits of data appear on DQ0–DQ7. The Am29F016B is manufactured using AMD’s 0.35 µm process technology. This device is designed to be programmed in-system with the standard system 5.0 volt VCC supply. A 12.0 volt V P P is n ot required for program or erase operations. The device can also be programmed in standard EPROM programmers. The standard device offers an access time of 120 ns, allowing high-speed microprocessors to operate without wait states. To eliminate bus contention, the device has separate chip enable (CE#), write enable (WE#), and output enable (OE#) controls. The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from 12.0 volt Flash or EPROM devices. The device is programmed by executing the program command sequence. This invokes the Embedded Program algorithm—an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. The device is erased by executing the erase command sequence. This invokes the Embedded Erase algorithm—an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin. The Erase Suspend feature enables the system to put erase on hold for any period of time to read data from, or program data to, a sector that is not being erased. True background erase can thus be achieved. The device requires only a single 5.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. A low VCC detector automatically inhibits write operations during power transitions. The host system can detect whether a program or erase cycle is complete by using the RY/BY# pin, the DQ7 (Data# Polling) or DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device automatically returns to the read mode. A hardware RESET# pin terminates any operation in progress. The internal state machine is reset to the read mode. The RESET# pin may be tied to the system reset circuitry. Therefore, if a system reset occurs during either an Embedded Program or Embedded Erase algorithm, the device is automatically reset to the read mode. This enables the system’s microprocessor to read the boot-up firmware from the Flash memory. AMD’s Flash technology combines years of Flash memory manufacturing experience to produce the hi g h e st leve l s o f q u a li ty, r e li a bi li t y, a n d co s t effectiveness. The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunneling. The bytes are programmed one byte at a time using the EPROM programming mechanism of hot electron injection. ELECTRICAL SPECIFICATIONS Refer to the Am29F016B data sheet, PID 21444, for full electrical specifications on the Am29F016B in KGD form. PRODUCT SELECTOR GUIDE Family Part Number Am29F016B KGD Speed Option (VCC = 5.0 V ± 10%) -120 Max Access Time, tACC (ns) 120 Max CE# Access, tCE (ns) 120 Max OE# Access, tOE (ns) 50 2 Am29F016B Known Good Die 2/17/98 S U P P L E M E N T DIE PHOTOGRAPH Orientation relative to leading edge of tape and reel Orientation relative to top left corner of Gel-Pak DIE PAD LOCATIONS 8 7 6 5 4 3 2 1 37 36 35 34 33 32 31 30 29 9 AMD logo location 10 28 1112 13 14 15 16 17 18 19 2/17/98 20 21 22 23 24 25 26 27 Am29F016B Known Good Die 3 S U P P L E M E N T PAD DESCRIPTION Pad Signal 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 VCC DQ4 DQ5 DQ6 DQ7 RY/BY# OE# WE# A20 A19 A18 A17 A16 A15 A14 A13 A12 CE# VCC RESET# A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 DQ3 VSS Pad Center (mils) X Y 0.00 0.00 –10.60 0.00 –24.00 0.00 –37.20 0.00 –50.50 0.00 –68.90 0.00 –84.20 0.00 –111.80 0.00 –119.30 –8.50 –119.30 –245.30 –109.10 –258.20 –100.20 –258.20 –88.20 –258.20 –79.00 –258.20 –67.00 –258.20 –57.80 –258.20 –45.80 –258.20 –36.60 –258.20 –27.20 –258.20 45.00 –258.20 57.20 –258.20 69.20 –258.20 78.40 –258.20 90.60 –258.20 99.80 –258.20 112.00 –258.20 121.10 –258.20 131.20 –245.30 131.20 –8.50 123.80 0.00 111.90 0.00 102.40 0.00 74.40 0.00 61.20 0.00 47.90 0.00 34.70 0.00 21.70 0.00 Pad Center (millimeters) X Y 0.00 0.00 –0.27 0.00 –0.61 0.00 –0.94 0.00 –1.28 0.00 –1.75 0.00 –2.14 0.00 –2.84 0.00 –3.03 –0.22 –3.03 –6.23 –2.77 –6.56 –2.55 –6.56 –2.24 –6.56 –2.01 –6.56 –1.70 –6.56 –1.47 –6.56 –1.16 –6.56 –0.93 –6.56 –0.69 –6.56 1.14 –6.56 1.45 –6.56 1.76 –6.56 1.99 –6.56 2.30 –6.56 2.53 –6.56 2.84 –6.56 3.08 –6.56 3.33 –6.23 3.33 –0.22 3.14 0.00 2.84 0.00 2.60 0.00 1.89 0.00 1.55 0.00 1.22 0.00 0.88 0.00 0.55 0.00 Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment. 4 Am29F016B Known Good Die 2/17/98 S U P P L E M E N T ORDERING INFORMATION Standard Products AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: Am29F016B -120 DP C 1 DIE REVISION This number refers to the specific AMD manufacturing process and product technology reflected in this document. It is entered in the revision field of AMD standard product nomenclature. TEMPERATURE RANGE C = Commercial (0°C to +70°C) I = Industrial (–40°C to +85°C) PACKAGE TYPE AND MINIMUM ORDER QUANTITY DP = Waffle Pack 100 die per 5 tray stack DG = Gel-Pak® Die Tray 294 die per 6 tray stack DT = Surftape™ (Tape and Reel) 1600 per 7-inch reel DW = Gel-Pak® Wafer Tray (sawn wafer on frame) Call AMD sales office for minimum order quantity SPEED OPTION See Valid Combinations DEVICE NUMBER/DESCRIPTION Am29F016B Known Good Die 16 Megabit (2 M x 8-Bit) CMOS Flash Memory—Die Revision 1 5.0 Volt-only Read, Program, and Erase Valid Combinations Am29F016B-120 2/17/98 DPC 1, DPI 1, DGC 1, DGI 1, DTC 1, DTI 1, DWC 1, DWI 1 Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations. Am29F016B Known Good Die 5 S U P P L E M E N T PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29F016B product qualification database supplement for KGD. AMD implements quality assurance procedures throughout the product test flow. In addition, Wafer Sort 1 Bake 24 hours at 250°C Wafer Sort 2 Wafer Sort 3 High Temperature Packaging for Shipment an off-line quality monitoring program (QMP) further guarantees AMD quality standards are met on Known Good Die products. These QA procedures also allow AMD to produce KGD products without requiring or implementing burn-in. DC Parameters Functionality Programmability Erasability Data Retention DC Parameters Functionality Programmability Erasability DC Parameters Functionality Programmability Erasability Speed Incoming Inspection Wafer Saw Die Separation 100% Visual Inspection Die Pack Shipment Figure 1. 6 AMD KGD Product Test Flow Am29F016B Known Good Die 2/17/98 S U P P L E M E N T PHYSICAL SPECIFICATIONS MANUFACTURING INFORMATION Die dimensions, X x Y . . . . . . . . . 267 mils x 280 mils . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.78 mm x 7.11 mm Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL Die Thickness. . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils Manufacturing ID . . . . . . . . . . . . . . . . . . . . . 98163DK Bond Pad Size . . . . . . . . . . . . . X3.94 mils x 3.94 mils . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 µm x 100 µm Preparation for Shipment . . . . . . . . Penang, Malaysia Pad Area Free of Passivation . . . . . . . . . .15.52 mils2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 µm 2 Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC Fabrication Process . . . . . . . . . . . . . . . . . . . . . . CS39 Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si SPECIAL HANDLING INSTRUCTIONS Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal, may be grounded (optional) Processing VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V Do not expose KGD products to ultraviolet light or process them at temperatures greater than 250°C. Failure to adhere to these handling instructions will result in irreparable damage to the devices. For best yield, AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. Junction Temperature Under Bias . .TJ (max) = 130°C Storage Operating Temperature Commercial . . . . . . . . . . . . . . . . . . . 0°C to +70°C Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C Store at a maximum temperature of 30°C in a nitrogenpurged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures. Passivation . . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride DC OPERATING CONDITIONS 2/17/98 Am29F016B Known Good Die 7 S U P P L E M E N T TERMS AND CONDITIONS OF SALE FOR AMD NON-VOLATILE MEMORY DIE All transactions relating to AMD Products under this agreement shall be subject to AMD’s standard terms and conditions of sale, or any revisions thereof, which revisions AMD reserves the right to make at any time and from time to time. In the event of conflict between the provisions of AMD’s standard terms and conditions of sale and this agreement, the terms of this agreement shall be controlling. AMD warrants articles of its manufacture against defective materials or workmanship for a period of ninety (90) days from date of shipment. This warranty does not extend beyond AMD’s customer, and does not extend to die which has been affixed onto a board or substrate of any kind. The liability of AMD under this warranty is limited, at AMD’s option, solely to repair or to replacement with equivalent articles, or to make an appropriate credit adjustment not to exceed the original sales price, for articles returned to AMD, provided that: (a) The Buyer promptly notifies AMD in writing of each and every defect or nonconformity in any article for which Buyer wishes to make a warranty claim against AMD; (b) Buyer obtains authorization from AMD to return the article; (c) the article is returned to AMD, transportation charges paid by AMD, F.O.B. AMD’s factory; and (d) AMD’s examination of such article discloses to its satisfaction that such alleged defect or nonconformity actually exists and was not caused by negligence, misuse, improper installation, accident or unauthorized repair or alteration by an entity other than AMD. The aforementioned provisions do not extend the original warranty period of any article which has either been repaired or replaced by AMD. THIS WARRANTY IS EXPRESSED IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THE IMPLIED WARRANTY OF MERCHANTABILITY AND OF ALL OTHER OBLIGATIONS OR LIABILITIES ON AMD’S PART, AND IT NEITHER ASSUMES NOR AUTHORIZES ANY OTHER PERSON TO ASSUME FOR AMD ANY OTHER LIABILITIES. THE FOREGOING CONSTITUTES THE BUYERS SOLE AND EXCLUSIVE REMEDY FOR THE FURNISHING OF DEFECTIVE OR NON CONFORMING ARTICLES AND AMD SHALL NOT IN AN Y EVENT BE LIABLE FOR DAMAGES BY REASON OF FAILURE OF ANY PRODUCT TO FUNCTION PROPERLY OR FOR ANY SPECIAL, INDIRECT, CONSEQUENTIAL, INCIDENTAL OR EXEMPLARY DAMAGES, INCLUDING BUT NOT LIMITED TO, LOSS OF PROFITS, LOSS OF USE OR COST OF LABOR BY REASON OF THE FACT THAT SUCH ARTICLES SHALL HAVE BEEN DEFECTIVE OR NON CONFORMING. Buyer agrees that it will make no warranty representations to its customers which exceed those given by AMD to Buyer unless and until Buyer shall agree to indemnify AMD in writing for any claims which exceed AMD’s warranty. Buyer assumes all responsibility for successful die prep, die attach and wire bonding processes. Due to the unprotected nature of the AMD Products which are the subject hereof, AMD assumes no responsibility for environmental effects on die. AMD products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in a personal injury. Buyer’s use of AMD products for use in life support applications is at Buyer’s own risk and Buyer agrees to fully indemnify AMD for any damages resulting in such use or sale. REVISION SUMMARY FOR AM29F016B KGD Valid Combinations Physical Specifications Deleted designators in base part number to top and bottom boot. Clarified X and Y die dimensions Manufacturing Information Deleted references to top and bottom boot Trademarks Copyright © 1998 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies. 8 Am29F016B Known Good Die 2/17/98