LM185-2.5QML www.ti.com SNVS385A – NOVEMBER 2005 – REVISED MARCH 2013 Micropower Voltage Reference Diode Check for Samples: LM185-2.5QML FEATURES DESCRIPTION 1 • • • • 2 Operating Current of 20 μA to 20 mA 0.6Ω Dynamic Impedance (A grade) Low Temperature Coefficient Low Voltage Reference—2.5V The LM185-2.5 are micropower 2-terminal band-gap voltage regulator diodes. Operating over a 20 μA to 20 mA current range, they feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming is used to provide tight voltage tolerance. Since the LM185-2.5 band-gap reference uses only transistors and resistors, low noise and good long term stability result. Careful design of the LM185-2.5 has made the device exceptionally tolerant of capacitive loading, making it easy to use in almost any reference application. The wide dynamic operating range allows its use with widely varying supplies with excellent regulation. The extremely low power drain of the LM185-2.5 makes it useful for micropower circuitry. This voltage reference can be used to make portable meters, regulators or general purpose analog circuitry with battery life approaching shelf life. Further, the wide operating current allows it to replace older references with a tighter tolerance part. For applications requiring 1.2V see LM185-1.2. Connection Diagram N/C 1 10 N/C 2 9 N/C N/C 3 8 N/C N/C 4 7 N/C V- 5 6 N/C + VREF Figure 1. CLGA Package-Top View See Package Number NAC Figure 2. PFM Metal Can Package- Bottom View See Package Number NDU 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2013, Texas Instruments Incorporated LM185-2.5QML SNVS385A – NOVEMBER 2005 – REVISED MARCH 2013 www.ti.com Schematic Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Reverse Current 30 mA Forward Current 10 mA −55°C ≤ TA ≤ + 125°C Operating Temperature Range −55°C ≤ TA ≤ + 150°C Storage Temperature Maximum Junction Temperature (TJmax) (2) Lead Temperature (Soldering, 10 sec) θJA Thermal Resistance θJC Package Weight (Typical) ESD Tolerance (1) (2) (3) 2 150°C PFM Metal Can 300°C Ceramic CLGA 260°C PFM Metal Can (Still Air) 300°C/W PFM Metal Can (500LF / Min Air Flow) 139°C/W Ceramic CLGA (Still Air) 194°C/W Ceramic CLGA (500LF / Min Air Flow) 128°C/W PFM Metal Can 57°C/W Ceramic CLGA 23°C/W PFM Metal Can TBD Ceramic CLGA 210 mg (3) 4000V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. Human body model, 1.5 kΩ in series with 100 pF Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5QML LM185-2.5QML www.ti.com SNVS385A – NOVEMBER 2005 – REVISED MARCH 2013 Table 1. Quality Conformance Inspection (1) (1) Subgroup Description Temp °C 1 Static tests at 25 2 Static tests at 125 3 Static tests at -55 4 Dynamic tests at 25 5 Dynamic tests at 125 6 Dynamic tests at -55 7 Functional tests at 25 8A Functional tests at 125 8B Functional tests at -55 9 Switching tests at 25 10 Switching tests at 125 11 Switching tests at -55 12 Settling time at 25 13 Settling time at 125 14 Settling time at -55 Mil-Std-883, Method 5005 - Group A LM185–2.5 Electrical Characteristics DC Parameters Symbol VRef Parameter Reverse Breakdown Voltage Conditions Notes Max Units IR = 20µA 2.462 2.538 V 1 IR = 30µA 2.425 2.575 V 2, 3 IR = 1mA 2.462 2.538 V 1 2.425 2.575 V 2, 3 2.462 2.538 V 1 2, 3 IR = 20mA ΔVRef / ΔIR Reverse Breakdown Voltage Change with Current VF Forward Bias Voltage Subgroups Min 2.425 2.575 V 20µA ≤ IR ≤ 1mA -1.0 1.0 mV 1 30µA ≤ IR ≤ 1mA -1.5 1.5 mV 2, 3 1mA ≤ IR ≤ 20mA -10.0 10.0 mV 1 -20.0 20.0 mV 2, 3 -1.0 -0.4 V 1 IF = 2mA LM185–2.5 Electrical Characteristics DC Drift Parameters Delta calculations performed on QMLV devices at group B , subgroup 5, unless otherwise specified on IPI. Symbol VRef Min Max Units Subgroups IR = 20µA -10 10 mV 1 IR = 20mA -10 10 mV 1 Parameter Reverse Breakdown Voltage Conditions Notes Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5QML 3 LM185-2.5QML SNVS385A – NOVEMBER 2005 – REVISED MARCH 2013 www.ti.com LM185BY–2.5 Electrical Characteristics DC Parameters Symbol VRef Parameter Reverse Breakdown Voltage Conditions Notes Max Units IR = 20µA 2.462 2.538 V 1 IR = 30µA 2.425 2.575 V 2, 3 IR = 1mA 2.462 2.538 V 1 2.425 2.575 V 2, 3 2.462 2.538 V 1 2, 3 IR = 20mA ΔVRef / ΔIR Reverse Breakdown Voltage Change with Current VF Forward Bias Voltage TC Temperature Coefficient (1) Subgroups Min 2.425 2.575 V 20µA ≤ IR ≤ 1mA -1.0 1.0 mV 1 30µA ≤ IR ≤ 1mA -1.5 1.5 mV 2, 3 1mA ≤ IR ≤ 20mA -10.0 10.0 mV 1 -20.0 20.0 mV 2, 3 −1.0 −0.4 V 1 50 PPM/°C 2, 3 IF = 2mA (1) The average temperature coefficient is defined as the maximum deviation of reference voltage, at all measured temperatures between the operating TMin & TMax, divided by (TMax − TMin). The measured temperatures (TMeasured) are −55°C, 25°C, & 125°C or ΔVRef / (TMax − TMin) LM185BY–2.5 Electrical Characteristics DC Drift Parameters Delta calculations performed on QMLV devices at group B , subgroup 5, unless otherwise specified on IPI. Symbol Parameter Conditions Notes Min Max Units Subgroups VRef 1 Reverse Breakdown Voltage IR = 20µA -10 10 mV 1 VRef 2 Reverse Breakdown Voltage IR = 20mA -10 10 mV 1 4 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5QML LM185-2.5QML www.ti.com SNVS385A – NOVEMBER 2005 – REVISED MARCH 2013 Typical Performance Characteristics Reverse Characteristics Reverse Characteristics Figure 3. Figure 4. Forward Characteristics Temperature Drift Figure 5. Figure 6. Reverse Dynamic Impedance Reverse Dynamic Impedance Figure 7. Figure 8. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5QML 5 LM185-2.5QML SNVS385A – NOVEMBER 2005 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Noise Voltage Filtered Output Noise Figure 9. Figure 10. Response Time Figure 11. 6 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5QML LM185-2.5QML www.ti.com SNVS385A – NOVEMBER 2005 – REVISED MARCH 2013 APPLICATIONS Figure 12. Wide Input Range Reference Figure 13. Micropower Reference from 9V Battery Figure 14. Micropower 5V Reference IQ ≃ 40 μA Figure 15. Micropower 10V Reference IQ ≃ 30 μA standby current Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5QML 7 LM185-2.5QML SNVS385A – NOVEMBER 2005 – REVISED MARCH 2013 www.ti.com Precision 1 μA to 1 mA Current Sources METER THERMOMETERS Figure 16. 0°C–100°C Thermometer Calibration 8 1. Short LM385-2.5, adjust R3 for IOUT= temp at 1μA/°K 2. Remove short, adjust R2 for correct reading in centigrade Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5QML LM185-2.5QML www.ti.com SNVS385A – NOVEMBER 2005 – REVISED MARCH 2013 Figure 17. 0°F–50°F Thermometer Calibration 1. Short LM385-2.5, adjust R3 for IOUT=temp at 1.8 μA/°K 2. Remove short, adjust R2 for correct reading in °F Figure 18. Improving Regulation of Adjustable Regulators Figure 19. Micropower Thermocouple Cold Junction Compensator Adjustment Procedure 1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck coefficient. 2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5QML 9 LM185-2.5QML SNVS385A – NOVEMBER 2005 – REVISED MARCH 2013 www.ti.com Thermocouple Type Seebeck Co-efficient (μV/°C) R1 (Ω) R2 (Ω) Voltage Across R1 @25°C (mV) Voltage Across R2 (mV) J 52.3 523 1.24k 15.60 14.32 T 42.8 432 1k 12.77 11.78 K 40.8 412 953Ω 12.17 11.17 S 6.4 63.4 150Ω 1.908 1.766 REVISION HISTORY SECTION Released 10 Revision Section 11/08/05 A New Release, Corporate format 03/20/13 A All Originator L. Lytle Changes 2 MDS data sheets converted into one Corp. data sheet format. MNLM185-2.5-X Rev 2A2 and MNLM185-2.5BY-X Rev 1B1 will be archived. Changed layout of National Data Sheet to TI format. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5QML PACKAGE OPTION ADDENDUM www.ti.com 26-Jul-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-8759402XA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759402XA Q 5962-8759402YA ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG2.5/883 Q 5962-87594 02YA ACO 02YA >T 5962-8759406VXA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759406VXA Q LM185-2.5 MD8 ACTIVE DIESALE Y 0 100 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 LM185BYH2.5-QV ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759406VXA Q LM185BYH2.5/883 ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 LM185BY2.5 Q LM185H-2.5-SMD ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759402XA Q LM185H-2.5/883 ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 LM185-2.5 Q LM185WG-2.5/883 ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG2.5/883 Q 5962-87594 02YA ACO 02YA >T (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 26-Jul-2016 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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OTHER QUALIFIED VERSIONS OF LM185-2.5QML, LM185-2.5QML-SP : • Military: LM185-2.5QML • Space: LM185-2.5QML-SP NOTE: Qualified Version Definitions: • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 2 MECHANICAL DATA NAC0010A WG10A (Rev H) www.ti.com MECHANICAL DATA NDU0002A H02A (Rev F) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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