Spec. No. : C894FP Issued Date : 2015.09.10 Revised Date : Page No. : 1/ 8 CYStech Electronics Corp. N-Channel Enhancement Mode Power MOSFET MTED6N25FP BVDSS ID@VGS=10V, TC=25°C RDS(ON)@VGS=10V, ID=5A 250V 9A 410 mΩ(typ) Features • Low On Resistance • Simple Drive Requirement • Low Gate Charge • Fast Switching Characteristic • Insulating package, front/back side insulating voltage=2500V(AC) • RoHS compliant package Symbol Outline TO-220FP MTED6N25FP G：Gate D：Drain S：Source G D S Ordering Information Device MTED6N25FP-0-UB-X Package TO-220FP (RoHS compliant) Shipping 50 pcs/tube, 20 tubes/box, 4 boxes / carton Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, UB : 50 pcs / tube, 20 tubes/box Product rank, zero for no rank products Product name MTED6N25FP CYStek Product Specification Spec. No. : C894FP Issued Date : 2015.09.10 Revised Date : Page No. : 2/ 8 CYStech Electronics Corp. Absolute Maximum Ratings (TC=25°C) Parameter Symbol Limits Drain-Source Voltage (Note 1) Gate-Source Voltage Continuous Drain Current @TC=25°C, VGS=10V (Note 1) Continuous Drain Current @TC=100°C, VGS=10V (Note 1) Continuous Drain Current @TA=25°C, VGS=10V (Note 2) Continuous Drain Current @TA=70°C, VGS=10V (Note 2) Pulsed Drain Current @ VGS=10V (Note 3) Avalanche Current (Note 3) Single Pulse Avalanche Energy @ L=2mH, ID=3 Amps, VDD=50V VDS VGS IDM IAS 250 ±20 9* 5.7* 1.2 0.96 20* 3 EAS 9 EAR 3.6 36 14 2 1.3 (Note 2&4) Repetitive Avalanche Energy (Note 3) TC=25°C (Note 1) TC=100°C (Note 1) Power Dissipation TA=25°C (Note 2) TA=70°C (Note 2) Maximum Temperature for Soldering @ Lead at 0.063 in(1.6mm) from case for 10 seconds Maximum Temperature for Soldering @ Package Body for 10 seconds Operating Junction and Storage Temperature ID IDSM PD PDSM TL 300 TPKG 260 Tj, Tstg -55~+150 Unit V A mJ W °C *Drain current limited by maximum junction temperature Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max (Note 2) Symbol RθJC RθJA Value 3.5 62.5 Unit °C/W Note : 1.The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. 2. The value of RθJA is measured with the device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment with TA=25°C. The power dissipation PDSM is based on RθJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on the user’s specific board design. 3. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and low duty cycles to keep initial TJ=25°C. 4.100% tested by conditions of L=2mH, IAS=1A, VGS=10V, VDD=50V, rated 250V. MTED6N25FP CYStek Product Specification CYStech Electronics Corp. Spec. No. : C894FP Issued Date : 2015.09.10 Revised Date : Page No. : 3/ 8 Characteristics (Tj=25°C, unless otherwise specified) Symbol Static BVDSS ∆BVDSS/∆Tj VGS(th) *GFS IGSS IDSS Min. Typ. Max. Unit Test Conditions 250 2.0 - 0.22 2.6 410 4.0 ±100 1 25 520 V V/°C V S nA mΩ VGS=0V, ID=250μA Reference to 25°C, ID=250μA VDS = VGS, ID=250μA VDS =40V, ID=3A VGS=±20V VDS =200V, VGS =0V VDS =200V, VGS =0V, Tj=125°C VGS =10V, ID=5A 14.2 2.7 5.8 10.2 18.4 23.4 15.2 497 43 25 - nC VDS=200V, ID=5A,VGS=10V ns VDS=125V, ID=5A, VGS=10V, RG=2.7Ω pF VGS=0V, VDS=25V, f=1MHz 0.74 74 176 9 20 1 - *RDS(ON) Dynamic *Qg *Qgs *Qgd *td(ON) *tr *td(OFF) *tf Ciss Coss Crss Source-Drain Diode *IS *ISM *VSD *trr *Qrr - μA A V ns nC IS=1A, VGS=0V VGS=0V, IF=5A, dIF/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% MTED6N25FP CYStek Product Specification Spec. No. : C894FP Issued Date : 2015.09.10 Revised Date : Page No. : 4/ 8 CYStech Electronics Corp. Typical Characteristics Brekdown Voltage vs Ambient Temperature Typical Output Characteristics 1.4 10 10V 9V 8V 7V 6V 6 5.5V 4 BVDSS, Normalized Drain-Source Breakdown Voltage ID, Drain Current (A) 8 5V 2 VGS=4.5V 1.2 1 0.8 0.6 ID=250μA, VGS=0V 0.4 0 0 3 6 9 12 VDS, Drain-Source Voltage(V) -75 -50 -25 15 Static Drain-Source On-State resistance vs Drain Current Reverse Drain Current vs Source-Drain Voltage 10000 VSD, Source-Drain Voltage(V) R DS(on), Static Drain-Source On-State Resistance(mΩ) 1.2 VGS=4.5V VGS=6V 1000 VGS=10V VGS=0V 1 Tj=25°C 0.8 0.6 Tj=150°C 0.4 0.2 100 0.01 0.1 1 10 ID, Drain Current(A) 0 100 2 10 4 6 8 IDR , Reverse Drain Current(A) Drain-Source On-State Resistance vs Junction Tempearture Static Drain-Source On-State Resistance vs Gate-Source Voltage 1000 3 R DS(on), Normalized Static DrainSource On-State Resistance R DS(on), Static Drain-Source OnState Resistance(mΩ) 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) ID=5A 900 800 700 600 500 400 300 2.5 VGS=10V, ID=5A 2 1.5 1 0.5 RDS(ON) @Tj=25°C : 410mΩ 0 200 0 MTED6N25FP 2 4 6 8 VGS, Gate-Source Voltage(V) 10 -65 -35 -5 25 55 85 115 Tj, Junction Temperature(°C) 145 175 CYStek Product Specification Spec. No. : C894FP Issued Date : 2015.09.10 Revised Date : Page No. : 5/ 8 CYStech Electronics Corp. Typical Characteristics(Cont.) Threshold Voltage vs Junction Tempearture Capacitance vs Drain-to-Source Voltage VGS(th), Normalized Threshold Voltage 1000 Capacitance---(pF) Ciss C oss 100 Crss 1.4 1.2 ID=1mA 1 0.8 ID=250μA 0.6 0.4 10 0.1 1 10 VDS, Drain-Source Voltage(V) -65 100 -35 -5 25 55 85 115 Tj, Junction Temperature(°C) Forward Transfer Admittance vs Drain Current 10 VDS=125V VGS, Gate-Source Voltage(V) GFS , Forward Transfer Admittance(S) 175 Gate Charge Characteristics 10 1 0.1 VDS=40V Ta=25°C Pulsed 0.01 0.001 8 VDS=50V 6 VDS=200V 4 2 ID=5A 0 0.01 0.1 1 ID, Drain Current(A) 0 10 2 4 6 8 10 12 Qg, Total Gate Charge(nC) 14 16 Maximum Drain Current vs Case Temperature Maximum Safe Operating Area 12 1 μs RDSON Limited 10 100μs 1ms 10ms 1 100ms 0.1 TC=25°C, Tj=150°C VGS=10V, RθJC=3.5°C/W Single Pulse DC ID, Maximum Drain Current(A) 100 ID, Drain Current(A) 145 10 8 6 4 2 VGS=10V, RθJC=3.5°C/W 0 0.01 0.1 MTED6N25FP 1 10 100 VDS, Drain-Source Voltage(V) 1000 25 50 75 100 125 TC , Case Temperature(°C) 150 175 CYStek Product Specification Spec. No. : C894FP Issued Date : 2015.09.10 Revised Date : Page No. : 6/ 8 CYStech Electronics Corp. Typical Characteristics(Cont.) Single Pulse Power Rating, Junction to Case Typical Transfer Characteristics 1000 10 900 9 VDS=10V 700 7 Power (W) ID, Drain Current(A) TJ(MAX) =150°C TC=25°C RθJC=3.5°C/W 800 8 6 5 4 600 500 400 3 300 2 200 1 100 0 0 2 4 6 8 VGS, Gate-Source Voltage(V) 10 0 0.001 0.01 0.1 Pulse Width(s) 1 10 Transient Thermal Response Curves 1 r(t), Normalized Effective Transient Thermal Resistance D=0.5 0.2 0.1 0.1 1.RθJC(t)=r(t)*RθJC 2.Duty Factor, D=t1/t2 3.TJM-TC=PDM*RθJC(t) 4.RθJC=3.5 ° C/W 0.05 0.02 0.01 0.01 Single Pulse 0.001 1.E-05 MTED6N25FP 1.E-04 1.E-03 1.E-02 1.E-01 t1, Square Wave Pulse Duration(s) 1.E+00 1.E+01 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C894FP Issued Date : 2015.09.10 Revised Date : Page No. : 7/ 8 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTED6N25FP CYStek Product Specification CYStech Electronics Corp. Spec. No. : C894FP Issued Date : 2015.09.10 Revised Date : Page No. : 8/ 8 TO-220FP Dimension Marking: Device Name ED6 N25 Date Code 3-Lead TO-220FP Plastic Package CYStek Package Code: FP Style: Pin 1.Gate 2.Drain 3.Source *Typical Inches Min. Max. 0.171 0.183 0.051 REF 0.112 0.124 0.102 0.110 0.020 0.030 0.031 0.041 0.047 REF 0.020 0.030 0.396 0.404 0.583 0.598 0.100 * 0.106 REF DIM A A1 A2 A3 b b1 b2 c D E e F Millimeters Min. Max. 4.35 4.65 1.300 REF 2.85 3.15 2.60 2.80 0.50 0.75 0.80 1.05 1.20 REF 0.500 0.750 10.06 10.26 14.80 15.20 2.54* 2.70 REF DIM G H H1 H2 J K L L1 L2 M N Inches Min. Max. 0.246 0.258 0.138 REF 0.055 REF 0.256 0.272 0.031 REF 0.020 1.102 1.118 0.043 0.051 0.036 0.043 0.067 REF 0.012 REF Millimeters Min. Max. 6.25 6.55 3.50 REF 1.40 REF 6.50 6.90 0.80 REF 0.50 REF 28.00 28.40 1.10 1.30 0.92 1.08 1.70 REF 0.30 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTED6N25FP CYStek Product Specification