TI LM3630ATME Lm3630a high-efficiency dual-string white led driver Datasheet

LM3630A
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SNVS974 – APRIL 2013
LM3630A High-Efficiency Dual-String White LED Driver
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FEATURES
DESCRIPTION
•
•
•
The LM3630A is a current mode boost converter
which supplies the power and controls the current in
up to two strings of 10 LEDs per string. Programming
is done over an I2C-compatible interface. The
maximum LED current is adjustable from 5 mA to
28.5 mA. At any given maximum LED current the
LED brightness is further adjusted with 256
exponential or linear dimming steps. Additionally,
pulsed width modulation ("PWM") brightness control
can be enabled allowing for LED current adjustment
by a logic level PWM signal.
1
2
•
•
•
•
•
•
•
•
•
•
Drives up to 2 strings of 10 series LEDs
Up to 87% efficient
8-bit I2C-Compatible Programmable
Exponential or Linear Brightness Control
PWM Brightness Control for CABC Operation
Independent Current Control per String
True Shutdown Isolation for LEDs
Internal Soft-Start Limits Inrush Current
Wide 2.3V to 5.5V Input Voltage Range
Adaptive Headroom
Programmable 16V/24V/32V/40V Over-Voltage
Protection
Selectable Boost Frequency of 500 kHz or
1MHz with optionally additional offset
Low Profile 12-Bump DSBGA Package
Solution Size 32mm²
The boost switching frequency is programmable at
500 kHz for low switching loss performance or 1MHz
to allow the use of tiny low profile inductors. A setting
for a 10% offset of these frequencies is available.
Over-voltage protection is programmable at 16V,
24V, 32V, or 40V to accommodate a wide variety of
LED configurations and Schottky Diode/Output
Capacitor combinations.
The device operates over the 2.3V to 5.5V operating
voltage range and -40°C to +85°C ambient
temperature range. The LM3630A is available in an
ultra-small 12-bump DSBGA package.
APPLICATIONS
•
•
Smart-Phone LCD Backlighting
LCD + Keypad Lighting
TYPICAL APPLICATION CIRCUIT
L
VOUT up to 40V
D1
VIN
CIN
COUT
IN
SW
OVP
SDA
SCL
AP
INTN
LM3630A
LED1
HWEN
LED2
PWM
SEL
GND
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
LM3630A
SNVS974 – APRIL 2013
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TYPICAL PCB LAYOUT
Schottky
(SOD-323 40V)
COUT (603 1uF)
4mm
Inductor
(VLF302512MT)
CIN (0402 2.2uF)
8mm
Figure 1. Typical PCB Layout (2 x 10 LED Application)
CONNECTION DIAGRAM
Bottom View
Top View
SDA
SCL
SW
SW
SCL
SDA
HWEN
INTN
GND
GND
INTN
HWEN
PWM
SEL
IN
IN
SEL
PWM
OVP
ILED2
ILED1
ILED1
ILED2
OVP
Figure 2. Package Number YFQ12HNA
AVAILABLE OPTIONS
PART NUMBER
PACKAGE MARKING
LM3630ATME
YM
LM3630ATMX
D6
(1)
2
(1)
PACKAGE
YFQ12HNA
SUPPLIED AS
250 Units, Tape & Reel
3000 Units, Tape & Reel
YM = Date Code.
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PIN DESCRIPTIONS
Ball
Name
Description
2
A1
SDA
Serial Data Connection for I C-Compatible Interface
A2
SCL
Serial Clock Connection for I2C-Compatible Interface
A3
SW
Inductor Connection, Diode Anode Connection, and Drain Connection for Internal NFET.
Connect the inductor and diode as close as possible to SW to reduce inductance and capacitive
coupling to nearby traces.
B1
HWEN
B2
INTN
Interrupt output for fault status change. Open drain active low signal.
Logic High Hardware Enable
B3
GND
Ground
C1
PWM
External PWM Brightness Control Input
C2
SEL
Selects I2C-compatible address. Ground selects 7-bit address 36h. VIN selects address 38h.
C3
IN
D1
OVP
D2
ILED2
Input Terminal to Internal Current Sink #2.
D3
ILED1
Input Terminal to Internal Current Sink #1.
Input Voltage Connection. Connect a 2.3V to 5.5V supply to IN and bypass to GND with a 2.2 µF
or greater ceramic capacitor.
Output Voltage Sense Connection for Over Voltage Sensing. Connect OVP to the positive
terminal of the output capacitor.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
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ABSOLUTE MAXIMUM RATINGS
(1) (2)
VALUE
UNIT
IN, HWEN, PWM, SCL, SDA, INTN, SEL to
GND
−0.3 to 6.0
SW, OVP, ILED1, ILED2 to GND
−0.3 to 45
Continuous Power Dissipation
(3)
Internally Limited
Maximum Junction Temperature
150
−45 to +150
Storage Temperature Range
T(J-MAX)
ESD Rating
Operating Ratings
Maximum Lead Temperature (Soldering)
Vapor Phase (60 sec.)
(4)
215
Maximum Lead Temperature (Soldering)
Infrared (15 sec.)
(4)
220
Human Body Model
(5)
V
Charged Device Mod
°C
2
kV
500
V
(1) (2)
VIN
Input Voltage Range
TA
Operating Ambient Temperature Range
(6)
2.3 to 5.5
V
−40 to +85
°C
Thermal Properties
θJA
(1)
(2)
(3)
(4)
(5)
(6)
(7)
4
Junction-to-Ambient Thermal Resistance, YFQ12
package (7)
78.1
°C/W
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pin.
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 140°C (typ.) and
disengages at TJ = 125°C (typ.).
For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer Level
Chip Scale Package (AN-1112)
The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7) .
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to Texas
Instruments Application Note 1112: DSBGA Wafer Level Chip Scale Package.
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ELECTRICAL CHARACTERISTICS
(1)
Limits in standard typeface are for TA = 25°C, and limits in boldface type apply over the full operating ambient temperature
range (−40°C ≤ TA ≤ +85°C). Unless otherwise specified, VIN = 3.6V.
Symbol
Parameter
Condition
Min
Typ
Max
Units
19
20
21
mA
-1
0.5
1
%
-2.5
0.5
2.5
ILED1, ILED2
Output Current Regulation 2.5V ≤ VIN ≤ 5.5V, Full Scale Current = 20 mA
IMATCH
ILED1 to ILED2 Current
Matching (2)
2.5V ≤ VIN ≤ 5.5V, ILED =
10 mA, TA = +25°C
ILED1 on A
2.5V ≤ VIN ≤ 5.5V, ILED = ILED2 on B
10 mA, 0°C ≤ TA ≤ +70°C
VREG_CS
Regulated Current Sink
Headroom Voltage
ILED = 5 mA
250
VHR
Current Sink Minimum
Headroom Voltage
ILED = 95% of nominal, ILED = 20 mA
160
RDSON
NMOS Switch On
Resistance
ISW = 100 mA
0.25
mV
480
NMOS Switch Current
Limit
ICL
VOVP
Output Over-Voltage
Protection
DMAX
800
960
1000
1200
960
1200
1440
ON Threshold, 2.3V ≤ VIN ≤ 5.5V, 24V option
23
24
25
ON Threshold, 2.3V ≤ VIN ≤ 5.5V, 40V option
39
41
44
2.5V ≤ VIN ≤ 5.5V
538
Quiescent Current into
Device, Not Switching.
VIN = 3.6V
ISHDN
Shutdown Current
2.3V ≤ VIN ≤ 5.5V
481
500
518
1077
1120
1163
1MHz shift = 0
962
1000
1038
Initialization Timing
kHz
94
%
ILED1 = ILED2 =
20mA, Feedback
disabled.
350
µA
HWEN = VIN, I2C
Shutdown
1
4
HWEN = GND
1
4
Full Scale Current = 20 mA, BRT = 0x01,
Exponential Mapping Mode
+140
°C
15
Time period to wait from the assertion of HWEN
or after Software Reset, before an I2C transaction
will be ACK'ed. During this time period an I2C
transaction will be NAK'ed
µA
13
Hysteresis
tWAIT
V
582
1.12 MHz shift = 1
Thermal Shutdown
TSD
560
500 kHz shift = 0
Maximum Duty Cycle
Minimum LED Current in
ILED1 or ILED2
mA
1
IQ
ILED_MIN
720
800
560 kHz shift = 1
Switching Frequency
Ω
640
2.5V ≤ VIN ≤ 5.5V
Hysteresis
fSW
600
240
1
ms
Logic Inputs (PWM, HWEN, SEL, SCL, SDA)
VIL
Input Logic Low
0
0.4
VIH
Input Logic High
1.2
VIN
VOL
Output Logic Low (SDA,
INTN)
fPWM
PWM Input Frequency
CIN
Input Capacitance
(1)
(2)
2.3V ≤ VIN ≤ 5.5V
10
SDA
4.5
SCL
5.0
V
400
mV
80
kHz
pF
Min and Max limits are specified by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most
likely norm. Unless otherwise specified, conditions for typical specifications are: VIN = 3.6V and TA = +25ºC.
LED current sink matching between LED1 and LED2 is given by taking the difference between ILED1 and ILED2 and dividing by the
average. This simplifies to (ILED1 − ILED2)/(ILED1 + ILED2) x 2 at ILED = 10 mA. ILED1 is driven by Bank A and ILED2 is driven by Bank B.
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ELECTRICAL CHARACTERISTICS (1) (continued)
Limits in standard typeface are for TA = 25°C, and limits in boldface type apply over the full operating ambient temperature
range (−40°C ≤ TA ≤ +85°C). Unless otherwise specified, VIN = 3.6V.
Symbol
Parameter
Condition
I2C-Compatible Timing Specifications (SCL, SDA)
Min
t1
SCL (Clock Period)
2.5
t2
Data in Setup Time to
SCL High
100
t3
Data in Setup Time to
SCL Low
0
t4
SDA Low Setup Time to
SCL Low (Start)
100
t5
SDA High Hold Time to
SCL High (Stop)
100
(3)
Typ
Max
Units
(3)
µs
ns
SCL and SDA must be glitch-free in order for proper brightness to be realized.
TYPICAL PERFORMANCE CHARACTERISTICS
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
Boost and LED Efficiency at VIN = 2.7V, 2p6s, Freq=500kHz,
L=22uH
90
90
80
80
Efficiency %
Efficiency %
Boost and LED Efficiency at VIN = 2.5V, 2p6s, Freq=500kHz,
L=22uH
70
60
50
VIN = 2.5V
Freq = 500kHz
LED = 2p6s
L = 22uH
Boost
LED
70
60
50
Boost
LED
40
40
0
20
40
60
80
Brightness %
100
0
20
40
60
80
Brightness %
C001
100
C058
Figure 4.
Boost and LED Efficiency at VIN = 3.6V, 2p6s, Freq=500kHz,
L=22µH
Boost and LED Efficiency at VIN = 4.2V, 2p6s, Freq=500kHz,
L=22uH
90
90
80
80
Efficiency %
Efficiency %
Figure 3.
70
60
50
VIN = 3.6V
Freq = 500kHz
LED = 2p6s
L = 22uH
Boost
LED
70
60
50
VIN = 4.2V
Freq = 500kHz
LED = 2p6s
L = 22uH
Boost
LED
40
40
0
20
40
60
Brightness %
80
100
0
C059
Figure 5.
6
VIN = 2.7V
Freq = 500kHz
LED = 2p6s
L = 22uH
20
40
60
Brightness %
80
100
C060
Figure 6.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
Boost and LED Efficiency at VIN = 2.5V, 2p6s, Freq=500kHz,
L=10uH
90
90
80
80
Efficiency %
Efficiency %
Boost and LED Efficiency at VIN = 5.5V, 2p6s, Freq=500kHz,
L=22uH
70
VIN = 5.5V
Freq = 500kHz
LED = 2p6s
L = 22uH
60
50
70
60
50
Boost
VIN = 2.5V
Freq = 500kHz
LED = 2p6s
L = 10uH
Boost
LED
LED
40
40
0
20
40
60
80
Brightness %
100
0
20
40
60
80
Brightness %
C061
100
C003
Figure 8.
Boost and LED Efficiency at VIN = 2.7V, 2p6s, Freq=500kHz,
L=10uH
Boost and LED Efficiency at VIN = 3.6V, 2p6s, Freq=500kHz,
L=10uH
90
90
80
80
Efficiency %
Efficiency %
Figure 7.
70
60
50
VIN = 2.7V
Freq = 500kHz
LED = 2p6s
L = 10uH
Boost
LED
70
60
50
VIN = 3.6V
Freq = 500kHz
LED = 2p6s
L = 10uH
Boost
LED
40
40
0
20
40
60
80
Brightness %
100
0
20
40
60
80
Brightness %
C004
100
C005
Figure 10.
Boost and LED Efficiency at VIN = 4.2V, 2p6s, Freq=500kHz,
L=10uH
Boost and LED Efficiency at VIN = 5.5V, 2p6s, Freq=500kHz,
L=10uH
90
90
80
80
Efficiency %
Efficiency %
Figure 9.
70
60
50
VIN = 4.2V
Freq = 500kHz
LED = 2p6s
L = 10uH
Boost
LED
70
60
50
VIN = 5.5V
Freq = 500kHz
LED = 2p6s
L = 10uH
Boost
LED
40
40
0
20
40
60
Brightness %
80
100
0
C006
Figure 11.
20
40
60
80
Brightness %
100
C007
Figure 12.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
Boost and LED Efficiency at VIN = 2.7V, 1p10s,
Freq=500kHz, L=22uH
90
90
80
80
Efficiency %
Efficiency %
Boost and LED Efficiency at VIN = 2.5V, 1p10s,
Freq=500kHz, L=22uH
70
60
50
VIN = 2.5V
Freq = 500kHz
LED = 1p10s
L = 22uH
Boost
LED
20
40
60
80
Boost
LED
100
Brightness %
0
20
40
60
80
Brightness %
C008
Figure 14.
Boost and LED Efficiency at VIN = 3.6V, 1p10s,
Freq=500kHz, L=22uH
Boost and LED Efficiency at VIN = 4.2V, 1p10s,
Freq=500kHz, L=22uH
90
80
80
Efficiency %
90
70
60
VIN = 3.6V
Freq = 500kHz
LED = 1p10s
L = 22uH
Boost
LED
70
60
50
VIN = 4.2V
Freq = 500kHz
LED = 1p10s
L = 22uH
Boost
LED
40
100
C009
Figure 13.
50
40
0
20
40
60
80
100
Brightness %
0
20
40
60
80
Brightness %
C010
100
C011
Figure 15.
Figure 16.
Boost and LED Efficiency at VIN = 5.5V, 1p10s,
Freq=500kHz, L=22uH
Boost and LED Efficiency at VIN = 2.5V, 1p10s,
Freq=500kHz, L=10uH
90
90
80
80
70
Efficiency %
VIN = 5.5V
Freq = 500kHz
LED = 1p10s
L = 22uH
60
50
70
60
50
Boost
VIN = 2.5V
Freq = 500kHz
LED = 1p10s
L = 10uH
Boost
LED
LED
40
40
0
20
40
60
Brightness %
80
100
0
C012
Figure 17.
8
VIN = 2.7V
Freq = 500kHz
LED = 1p10s
L = 22uH
40
0
Efficiency %
60
50
40
Efficiency %
70
20
40
60
Brightness %
80
100
C013
Figure 18.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
Boost and LED Efficiency at VIN = 3.6V, 1p10s,
Freq=500kHz, L=10uH
90
90
80
80
Efficiency %
Efficiency %
Boost and LED Efficiency at VIN = 2.7V, 1p10s,
Freq=500kHz, L=10uH
70
60
50
VIN = 2.7V
Freq = 500kHz
LED = 1p10s
L = 10uH
Boost
LED
60
50
VIN = 3.6V
Freq = 500kHz
LED = 1p10s
L = 10uH
Boost
LED
40
40
0
20
40
60
80
100
Brightness %
0
20
40
60
80
100
Brightness %
C014
C015
Figure 19.
Figure 20.
Boost and LED Efficiency at VIN = 4.2V, 1p10s,
Freq=500kHz, L=10uH
Boost and LED Efficiency at VIN = 5.5V, 1p10s,
Freq=500kHz, L=10uH
90
90
80
80
70
60
VIN = 4.2V
Freq = 500kHz
LED = 1p10s
L = 10uH
50
Boost
Efficiency %
Efficiency %
70
70
VIN = 5.5V
Freq = 500kHz
LED = 1p10s
L = 10uH
60
50
Boost
LED
LED
40
40
0
20
40
60
80
100
Brightness %
0
20
40
60
80
100
Brightness %
C016
C017
Figure 22.
Boost and LED Efficiency at VIN = 2.5V, 2p10s, Freq=1MHz,
L=10uH
Boost and LED Efficiency at VIN = 2.7V, 2p10s, Freq=1MHz,
L=10uH
90
90
80
80
Efficiency %
Efficiency %
Figure 21.
70
60
VIN = 2.5V
Freq = 1MHz
LED = 2p10s
L = 10uH
50
70
VIN = 2.7V
Freq = 1MHz
LED = 2p10s
L = 10uH
60
50
Boost
Boost
LED
LED
40
40
0
20
40
60
Brightness %
80
100
0
C018
Figure 23.
20
40
60
80
Brightness %
100
C019
Figure 24.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
Boost and LED Efficiency at VIN = 4.2V, 2p10s, Freq=1MHz,
L=10uH
90
90
80
80
Efficiency %
Efficiency %
Boost and LED Efficiency at VIN = 3.6V, 2p10s, Freq=1MHz,
L=10uH
70
60
50
VIN = 3.6V
Freq = 1MHz
LED = 2p10s
L = 10uH
Boost
LED
70
VIN = 4.2V
Freq = 1MHz
LED = 2p10s
L = 10uH
60
50
Boost
LED
40
40
0
20
40
60
80
100
Brightness %
0
40
60
80
Brightness %
Boost and LED Efficiency at VIN = 5.5V, 2p10s, Freq=1MHz,
L=10uH
Boost and LED Efficiency at VIN = 2.7V, 2p10s,
Freq=500kHz, L=10uH
90
80
80
70
Efficiency %
Efficiency %
Figure 26.
90
VIN = 5.5V
Freq = 1MHz
LED = 2p10s
L = 10uH
60
70
60
50
Boost
LED
40
0
20
40
60
80
Brightness %
100
0
20
40
60
80
Brightness %
C022
Figure 28.
Boost and LED Efficiency at VIN = 3.6V, 2p10s,
Freq=500kHz, L=10uH
Boost and LED Efficiency at VIN = 4.2V, 2p10s,
Freq=500kHz, L=10uH
90
90
80
80
70
60
50
VIN = 3.6V
Freq = 500kHz
LED = 2p10s
L = 10uH
Boost
LED
70
60
50
VIN = 4.2V
Freq = 500kHz
LED = 2p10s
L = 10uH
Boost
LED
40
100
C023
Figure 27.
Efficiency %
Efficiency %
VIN = 2.7V
Freq = 500kHz
LED = 2p10s
L = 10uH
Boost
LED
40
100
C021
Figure 25.
50
40
0
20
40
60
Brightness %
80
100
0
C024
Figure 29.
10
20
C020
20
40
60
Brightness %
80
100
C025
Figure 30.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
Boost and LED Efficiency at VIN = 5.5V, 2p10s,
Freq=500kHz, L=10uH
IIN across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
3.0
90
2p6s, L=10uH,Freq=500kHz
2.5
2.0
70
IIN (mA)
Efficiency %
80
VIN = 5.5V
Freq = 500kHz
LED = 2p10s
L = 10uH
60
50
1.5
1.0
Boost
0.5
LED1 & 2 on DACA
IIN vs VIN
LED
40
2.7V
3.05V
3.6V
4.2V
5.5V
0.0
0
20
40
60
80
Brightness %
100
0
20
40
60
80
Brightness %
C026
100
C029
Figure 32.
PWR_IN across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 & 2
on DACA, ILED Full Scale=28.5mA
VOUT across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
17.0
2.7V
3.05V
3.6V
4.2V
5.5V
24
22
20
18
16
14
12
10
8
6
4
2
0
LED1 & 2 on DACA
PWR_IN vs VIN
2.7V
3.05V
3.6V
4.2V
5.5V
16.5
16.0
2p6s, L=10uH,Freq=500kHz
VOUT (V)
PWR_IN (mW)
Figure 31.
15.5
15.0
2p6s, L=10uH,Freq=500kHz
14.5
LED1 & 2 on DACA
VOUT vs VIN
14.0
0
20
40
60
80
Brightness %
0
100
20
40
60
80
Brightness %
C030
100
C003
Figure 33.
Figure 34.
IOUT across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
PWR_OUT across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 &
2 on DACA, ILED Full Scale=28.5mA
60
40
2.7V
3.05V
3.6V
4.2V
5.5V
900
800
PWR_OUT (mW)
50
IOUT (mA)
1000
2.7V
3.05V
3.6V
4.2V
5.5V
2p6s, L=10uH,Freq=500kHz
30
20
2p6s, L=10uH,Freq=500kHz
600
500
400
300
200
LED1 & 2 on DACA
IOUT vs VIN
10
700
LED1 & 2 on DACA
PWR_OUT vs VIN
100
0
0
0
20
40
60
Brightness %
80
100
0
C032
Figure 35.
20
40
60
80
Brightness %
100
C033
Figure 36.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
ILED across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
30
2.7V
3.05V
3.6V
4.2V
5.5V
400
350
I_Inductor (mA)
20
ILED (mA)
450
2.7V
3.05V
3.6V
4.2V
5.5V
2p6s, L=10uH,Freq=500kHz
25
I_Inductor across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 &
2 on DACA, ILED Full Scale=28.5mA
15
10
300
2p6s,L=10uH,Freq=500kHz
250
200
150
100
LED1 & 2 on DACA
ILED vs VIN
5
LED1 & 2 On DACA
I_Inductor vs VIN
50
0
0
0
20
40
60
80
0
100
Brightness %
40
60
80
Brightness %
100
C035
Figure 37.
Figure 38.
IIN across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 on DACA,
LED2 on DACB, ILED Full Scale=28.5mA
PWR_IN across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
3.0
2p6s, L=10uH,Freq=500kHz
2.5
1.5
1.0
2.7V
3.05V
3.6V
4.2V
5.5V
LED1 DACA
LED2 DACB
IIN vs VIN
0.5
0.0
0
20
40
60
80
Brightness %
2.7V
3.05V
3.6V
4.2V
5.5V
2p6s, L=10uH,Freq=500kHz
24
22
20
18
16
14
12
10
8
6
4
2
0
100
0
20
40
LED1 DACA
LED2 DACB
PWR_IN vs VIN
60
80
Brightness %
C029
100
C030
Figure 39.
Figure 40.
VOUT across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
IOUT across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
17.0
60
2.7V
3.05V
3.6V
4.2V
5.5V
16.0
2.7V
3.05V
3.6V
4.2V
5.5V
50
2p6s, L=10uH,Freq=500kHz
40
15.5
IOUT (mA)
16.5
VOUT (V)
PWR_IN (mW)
IIN (mA)
2.0
2p6s, L=10uH,Freq=500kHz
15.0
30
20
LED1 DACA
LED 2 DACB
VOUT vs VIN
14.5
LED1 DACA
LED2 DACB
IOUT vs VIN
10
14.0
0
0
20
40
60
Brightness %
80
100
0
C003
Figure 41.
12
20
C034
20
40
60
Brightness %
80
100
C032
Figure 42.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
PWR_OUT across VIN, 2p6s, Freq=500kHz, L=10uH, LED1
on DACA, LED2 on DACB, ILED Full Scale=28.5mA
1200
30
2.7V
3.05V
3.6V
4.2V
5.5V
800
2.7V
3.05V
3.6V
4.2V
5.5V
25
20
ILED (mA)
1000
PWR_OUT (mW)
ILED across VIN, 2p6s, Freq=500kHz, L=10uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
2p6s, L=10uH,Freq=500kHz
600
400
2p6s, L=10uH,Freq=500kHz
15
10
LED1 DACA
LED2 DACB
PWR_OUT vs VIN
200
LED1 DACA
LED2 DACB
ILED vs VIN
5
0
0
0
20
40
60
80
Brightness %
100
0
20
40
60
80
100
Brightness %
C033
C034
Figure 43.
Figure 44.
I_Inductor across VIN, 2p6s, Freq=500kHz, L=10uH, LED1
on DACA, LED2 on DACB, ILED Full Scale=28.5mA
IIN across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
450
2.7V
3.05V
3.6V
4.2V
5.5V
400
300
4.0
3.5
2p6s,L=10uH,Freq=500kHz
250
2p10s, L=10uH,Freq=1MHz
4.5
LED1 DACA
LED2 DACB
I_Inductor vs
VIN
IIN (mA)
I_Inductor (mA)
350
5.0
200
150
3.0
2.5
2.0
2.7V
3.05V
3.6V
4.2V
5.5V
1.5
100
1.0
50
0.5
0
LED1 & 2 on DACA
IIN vs VIN
0.0
0
20
40
60
80
Brightness %
0
100
20
40
60
80
Brightness %
C035
100
C029
Figure 46.
PWR_IN across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 & 2
on DACA, ILED Full Scale=28.5mA
VOUT across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
28
2.7V
3.05V
3.6V
4.2V
5.5V
2.7V
3.05V
3.6V
4.2V
5.5V
LED1 & 2 on DACA
PWR_IN vs VIN
27
VOUT (V)
PWR_IN (mW)
Figure 45.
2p10s, L=10uH,Freq=1MHz
26
2p10s, L=10uH,Freq=1MHz
25
LED1 & 2 on DACA
VOUT vs VIN
24
0
20
40
60
Brightness %
80
100
0
C030
Figure 47.
20
40
60
80
Brightness %
100
C003
Figure 48.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
IOUT across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
60
2.7V
3.05V
3.6V
4.2V
5.5V
1600
1400
PWR_OUT (mW)
40
IOUT (mA)
1800
2.7V
3.05V
3.6V
4.2V
5.5V
50
PWR_OUT across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 &
2 on DACA, ILED Full Scale=28.5mA
2p10s, L=10uH,Freq=1MHz
30
20
1200
800
600
400
LED1 & 2 on DACA
IOUT vs VIN
10
2p10s, L=10uH,Freq=1MHz
1000
LED1 & 2 on DACA
PWR_OUT vs VIN
200
0
0
0
20
40
60
80
100
Brightness %
0
20
40
60
80
Brightness %
C032
100
C033
Figure 49.
Figure 50.
ILED across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
I_Inductor across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 &
2 on DACA, ILED Full Scale=28.5mA
30
20
2.7V
3.05V
3.6V
4.2V
5.5V
800
700
I_Inductor (mA)
25
ILED (mA)
900
2.7V
3.05V
3.6V
4.2V
5.5V
2p10s, L=10uH,Freq=1MHz
15
10
600
2p10s,L=10uH,Freq=1MHz
500
400
300
200
LED1 & 2 on DACA
ILED vs VIN
5
LED1 & 2 On DACA
I_Inductor vs VIN
100
0
0
0
20
40
60
80
100
Brightness %
0
40
60
80
Brightness %
100
C035
Figure 51.
Figure 52.
IIN across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 on DACA,
LED2 on DACB, ILED Full Scale=28.5mA
PWR_IN across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
50
5.0
2p10s, L=10uH,Freq=1MHz
4.0
40
3.5
35
3.0
2.5
2.0
2.7V
3.05V
3.6V
4.2V
5.5V
1.5
LED1 DACA
LED2 DACB
IIN vs VIN
1.0
0.5
0.0
0
20
40
2.7V
3.05V
3.6V
4.2V
5.5V
45
PWR_IN (mW)
IIN (mA)
4.5
60
Brightness %
80
LED1 DACA
LED2 DACB
PWR_IN vs VIN
2p10s, L=10uH,Freq=1MHz
30
25
20
15
10
5
0
100
0
C029
Figure 53.
14
20
C034
20
40
60
Brightness %
80
100
C030
Figure 54.
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SNVS974 – APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
VOUT across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
28
60
2.7V
3.05V
3.6V
4.2V
5.5V
2.7V
3.05V
3.6V
4.2V
5.5V
2p10s, L=10uH,Freq=1MHz
50
40
IOUT (mA)
27
VOUT (V)
IOUT across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
26
2p10s, L=10uH,Freq=1MHz
30
20
25
LED1 DACA
LED 2 DACB
VOUT vs VIN
LED1 DACA
LED2 DACB
IOUT vs VIN
10
24
0
0
20
40
60
80
Brightness %
100
0
20
40
60
80
100
Brightness %
C003
C032
Figure 55.
Figure 56.
PWR_OUT across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
ILED across VIN, 2p10s, Freq=1MHz, L=10uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
1800
1400
1200
20
2p10s, L=10uH,Freq=1MHz
1000
800
2p10s,L=10uH,Freq=1MHz
15
10
600
LED1 DACA
LED2 DACB
PWR_OUT vs VIN
400
200
LED1 DACA
LED2 DACB
ILED vs VIN
5
0
0
0
20
40
60
80
Brightness %
0
100
20
40
60
80
100
Brightness %
C033
C034
Figure 57.
Figure 58.
I_Inductor across VIN, 2p10s, Freq=1MHz, L = 10uH, LED1
on DACA, LED2 on DACB, ILED Full Scale=28.5mA
IIN across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
1000
2.7V
3.05V
3.6V
4.2V
5.5V
900
800
700
600
3.0
2p6s, L=22uH,Freq=500kHz
LED1 DACA
LED2 DACB
I_Inductor vs
VIN
2.5
2.0
2p10s,L=10uH,Freq=1MHz
IIN (mA)
I_Inductor (mA)
2.7V
3.05V
3.6V
4.2V
5.5V
25
ILED (mA)
1600
PWR_OUT (mW)
30
2.7V
3.05V
3.6V
4.2V
5.5V
500
400
1.5
1.0
300
200
0.5
LED1 & 2 on DACA
IIN vs VIN
100
0
2.7V
3.05V
3.6V
4.2V
5.5V
0.0
0
20
40
60
Brightness %
80
100
0
C035
Figure 59.
20
40
60
80
Brightness %
100
C029
Figure 60.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
17.0
2.7V
3.05V
3.6V
4.2V
5.5V
24
22
20
18
16
14
12
10
8
6
4
2
0
VOUT across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
LED1 & 2 on DACA
PWR_IN vs VIN
2.7V
3.05V
3.6V
4.2V
5.5V
16.5
16.0
2p6s, L=22uH,Freq=500kHz
VOUT (V)
PWR_IN (mW)
PWR_IIN across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 & 2
on DACA, ILED Full Scale=28.5mA
15.5
2p6s, L=22uH,Freq=500kHz
15.0
14.5
LED1 & 2 on DACA
VOUT vs VIN
14.0
0
20
40
60
80
Brightness %
0
100
40
60
80
Brightness %
100
C003
Figure 61.
Figure 62.
IOUT across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
PWR_IOUT across VIN, 2p6s, Freq=500kHz, L=22uH, LED1
& 2 on DACA, ILED Full Scale=28.5mA
60
2.7V
3.05V
3.6V
4.2V
5.5V
1000
PWR_OUT (mW)
40
IOUT (mA)
1200
2.7V
3.05V
3.6V
4.2V
5.5V
50
2p6s, L=22uH,Freq=500kHz
30
20
LED1 & 2 on DACA
IOUT vs VIN
10
800
2p6s, L=22uH,Freq=500kHz
600
400
LED1 & 2 on DACA
PWR_OUT vs VIN
200
0
0
0
20
40
60
80
Brightness %
100
0
20
40
60
80
Brightness %
C032
100
C033
Figure 63.
Figure 64.
ILED across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 & 2 on
DACA, ILED Full Scale=28.5mA
I_Inductor across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 &
2 on DACA, ILED Full Scale=28.5mA
30
2.7V
3.05V
3.6V
4.2V
5.5V
450
400
I_Inductor (mA)
20
ILED (mA)
500
2.7V
3.05V
3.6V
4.2V
5.5V
25
2p6s,L=22uH,Freq=500kHz
15
10
350
300
2p6s,L=22uH,Freq=500kHz
250
200
150
100
LED1 & 2 on DACA
ILED vs VIN
5
LED1 & 2 On DACA
I_Inductor vs VIN
50
0
0
0
20
40
60
Brightness %
80
100
0
C034
Figure 65.
16
20
C030
20
40
60
Brightness %
80
100
C035
Figure 66.
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SNVS974 – APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
IIN across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 on DACA,
LED2 on DACB, ILED Full Scale=28.5mA
PWR_IIN across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
3.0
2.5
1.5
1.0
2.7V
3.05V
3.6V
4.2V
5.5V
LED1 DACA
LED2 DACB
IIN vs VIN
0.5
0.0
0
20
40
60
80
Brightness %
100
0
40
60
80
Brightness %
C029
100
C030
Figure 68.
VOUT across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
IOUT across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
60
2.7V
3.05V
3.6V
4.2V
5.5V
16.0
2.7V
3.05V
3.6V
4.2V
5.5V
50
2p6s, L=22uH,Freq=500kHz
40
IOUT (mA)
16.5
15.5
2p6s, L=22uH,Freq=500kHz
15.0
30
20
LED1 DACA
LED 2 DACB
VOUT vs VIN
14.5
LED1 DACA
LED2 DACB
IOUT vs VIN
10
14.0
0
0
20
40
60
80
Brightness %
100
0
20
40
60
80
Brightness %
C003
100
C032
Figure 69.
Figure 70.
PWR_OUT across VIN, 2p6s, Freq=500kHz, L=22uH, LED1
on DACA, LED2 on DACB, ILED Full Scale=28.5mA
ILED across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 on
DACA, LED2 on DACB, ILED Full Scale=28.5mA
1200
30
2.7V
3.05V
3.6V
4.2V
5.5V
800
2.7V
3.05V
3.6V
4.2V
5.5V
25
20
ILED (mA)
1000
PWR_OUT (mW)
20
LED1 DACA
LED2 DACB
PWR_IN vs VIN
Figure 67.
17.0
VOUT (V)
PWR_IN (mW)
IIN (mA)
2.0
2.7V
3.05V
3.6V
4.2V
5.5V
2p6s, L=22uH,Freq=500kHz
24
22
20
18
16
14
12
10
8
6
4
2
0
2p6s, L=22uH,Freq=500kHz
2p6s, L=22uH,Freq=500kHz
600
400
2p6s, L=22uH,Freq=500kHz
15
10
LED1 DACA
LED2 DACB
PWR_OUT vs VIN
200
LED1 DACA
LED2 DACB
ILED vs VIN
5
0
0
0
20
40
60
Brightness %
80
100
0
C033
Figure 71.
20
40
60
80
Brightness %
100
C034
Figure 72.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25°C, ILED Full Scale = 20.0mA unless specified otherwise.
I_Inductor across VIN, 2p6s, Freq=500kHz, L=22uH, LED1 on DACA, LED2 on DACB, ILED Full Scale=28.5mA
500
2.7V
3.05V
3.6V
4.2V
5.5V
450
I_Inductor (mA)
400
350
300
LED1 DACA
LED2 DACB
I_Inductor vs
VIN
2p6s,L=22uH,Freq=500kHz
250
200
150
100
50
0
0
20
40
60
Brightness %
80
100
C035
Figure 73.
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FUNCTIONAL DESCRIPTION
VIN
CIN
COUT
SW
HWEN
Global Enable/
Disable
Reference and
Thermal Shutdown
OVP
Programmable Over
Voltage Protection
(16V, 24V, 32V, 40V)
Boost
Converter
1A Current Limit
Current Sinks
Programmable
500 kHz/1 Mhz
Switching
Frequency
LED1
LED String Open/
Short Detection
LED2
Backlight LED Control
PWM
PWM Sampler
1. 5-bit Full Scale
Current Select
2. 8-bit brightness
adjustment
3. Linear/Exponential
Dimming
SDA
SCL
2
I CCompatible
Interface
4. LED Current Ramping
Fault Detection
OVP
OCP
TSD
INTN
SEL
Operation
The LM3630A provides the power for two high-voltage LED strings (up to 40V at 28.5 mA each). The two highvoltage LED strings are powered from an integrated asynchronous boost converter. The device is programmable
over an I2C-compatible interface. Additional features include a PWM input for content adjustable brightness
control, programmable switching frequency, and programmable over voltage protection (OVP).
Control Bank Mapping
Control of the LM3630A’s current sinks is not done directly, but through the programming of Control Banks. The
current sinks are then assigned to the programmed Control Bank (see Figure 74). Both current sinks can be
assigned to Control Bank A or LED1 can use Control Bank A while LED2 uses Control Bank B. Assigning LED1
to Control Bank A and LED2 to Control Bank B allows for better LED current matching. Assigning each current
sink to different control banks allows for each current sink to be programmed with a different current or have the
PWM input control a specific current sink.
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Current Sinks
Control
Banks
Internal PWM
Filter
PWM
Input
(Assigned to Control Banks)
LED1
BANK A
LE
D2
PWM
Input
PWM
_O
N_
A
=1
LED2
BANK B
LED2_ON_A = 0
Figure 74. Control Diagram
Table 1. Bank Configuration Examples-Register Values
(1)
Registers to
Program
ILED1 on A, ILED2 on B with
PWM Dimming (1)
ILED1 and ILED2 on A with PWM
Dimming
ILED1 on A with PWM
ILED2 on B no PWM
Control
1EH linear or 06h exp
15h linear or 05h exp
1EH linear or 06h exp
Configuration
1Bh
09h
19h
Brightness A
used for A
used for both
used for A
Brightness B
used for B
not used
used for B
(A and B do not have to be equal)
LED current matching is specified using this configuration.
PWM Input Polaritiy
The PWM Input can be set for active high (default) or active low polarity. With active low polarity the LED current
is a function of the negative duty cycle at PWM.
HWEN Input
HWEN is the global hardware enable to the LM3630A. HWEN must be pulled high to enable the device. HWEN
is a high-impedance input so it cannot be left floating. When HWEN is pulled low the LM3630A is placed in
shutdown and all the registers are reset to their default state.
SEL Input
SEL is the select pin for the serial bus device address. When this pin is connected to ground, the seven-bit
device address is 36H. When this pin is tied to the VIN power rail, the device address is 38H.
INTN Output
The INTN pin is an open drain active low output signal which will indicate detected faults. The signal will assert
low when either OCP, OVP, or TSD is detected by the LED driver. The Interrupt Enable register must be set to
connect these faults to the INTN pin.
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Boost Converter
The high-voltage boost converter provides power for the two current sinks (ILED1 and ILED2). The boost circuit
operates using a 10 μH to 22 μH inductor and a 1μF output capacitor. The selectable 500 kHz or 1MHz switching
frequency allows for the use of small external components and provides for high boost converter efficiency. Both
LED1 and LED2 feature an adaptive voltage regulation scheme where the feedback point (LED1 or LED2) is
regulated to a minimum of 300 mV. When there are different voltage requirements in both high-voltage LED
strings, because of different programmed voltages or string mismatch, the LM3630A will regulate the feedback
point of the highest voltage string to 300 mV and drop the excess voltage of the lower voltage string across the
lower strings current sink.
Boost Switching Frequency Select
The LM3630A’s boost converter can have a 1MHz or 500 kHz switching frequency. For a 500 kHz switching
frequency the inductor must be between 10 μH and 22 μH. For the 1MHz switching frequency the inductor can
be between 10 μH and 22 μH. Additionally there is a Frequency Shift bit which will offset the frequency
approximately 10%. For the 500 kHz setting, Shift = 0. The boost frequency is shifted to 560 kHz when Shift = 1.
For the 1MHz setting, Shift = 0. The boost frequency is shifted to 1120 kHz when Shift = 1.
Adaptive Headroom
Reference Figure 75 and Figure 76 for the following description.
The adaptive headroom circuit controls the Boost output voltage to provide the minimal headroom voltage
necessary for the current sinks to provide the specified ILED current. The headroom voltage is fed back to the
Error Amplifier to dynamically adjust the Boost output voltage. The Error Amplifier's reference voltage is adjusted
as the brightness level is changed, since the currents sinks require less headroom at lower ILED currents than at
higher ILED currents. Note that the VHR Min block dynamically selects the LED string that requires the higher
Boost voltage to maintain the ILED current, this string will have the lower headroom voltage. In Figure 76 this is
LED string 2. The headroom voltage on LED string 1 is higher, but this is due to LED string 2 have an overall
higher forward voltage than LED string 1. LED strings that have closely matched forward voltages will have
closely matched headroom voltages and better overall efficiency.
In a single string LED configuration the Feedback enable must be enabled for only that string (LED1 or LED2).
The adaptive headroom circuit is control by that single string. In a two string LED configuration the Feedback
enable must be enabled for both strings (LED1 and LED2). The VHR Min block then dynamically selects the LED
string to control the adaptive headroom circuit.
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VIN
SW
COUT
OVP
Headroom
Control
Boost
Controller
+
IIN
Error
Amplifier
CIN
Brightness
Control
LED1
VHR
Min
LED2
Feedback
Enable
GND
Figure 75. Adaptive Headroom Block Diagram
0.35
VHR1
Headroom Voltage (V)
VHR2
0.30
0.25
0.20
0
20
40
60
Brightness %
80
100
C001
Figure 76. Typical Headroom Voltage Curves
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Current Sinks
LED1 and LED2 control the current up to a 40V LED string voltage. Each current sink has 5-bit full-scale current
programmability and 8-bit brightness control. Either current sink has its current set through a dedicated
brightness register and can additionally be controlled via the PWM input.
Current String Biasing
Each current string can be powered from the LM3630A’s boost or from an external source. When powered from
an external source the feedback input for either current sink can be disabled in the Configuration register so it no
longer controls the boost output voltage.
Full-Scale LED Current
The LM3630A’s full-scale current is programmable with 32 different full scale levels. The full-scale current is the
LED current in the control bank when the brightness code is at max code (0xFF). The 5 bit full-scale current vs
code is given by the following equation:
ILED FULLSCALE = 5 mA + Code x 0.75 mA
(1)
With a maximum full-scale current of 28.5 mA.
Brightness Register
Each control bank has its own 8-bit brightness register. The brightness register code and the full-scale current
setting determine the LED current depending on the programmed mapping mode.
Exponential Mapping
In exponential mapping mode the brightness code to backlight current transfer function is given by the equation:
§Code +1·º
ª
«44 - ¨5.81818¸»
©
¹¼
ILED = ILED_ FULLSCALE x 0.85 ¬
x DPWM
(2)
Where ILED_FULLSCALE is the full-scale LED current setting, Code is the backlight code in the brightness register,
and DPWM is the PWM input duty cycle. Figure 77 and Figure 78 show the approximate backlight code to LED
current response using exponential mapping mode. Figure 77 shows the response with a linear Y axis, and
Figure 78 shows the response with a logarithmic Y axis. In exponential mapping mode the current ramp (either
up or down) appears to the human eye as a more uniform transition then the linear ramp. This is due to the
logarithmic response of the eye.
LED CURRENT (% of Full Scale)
100
90
80
70
60
50
40
30
20
10
0
0
51
102
153
204
255
BACKLIGHT CODE (D)
Figure 77. Exponential Mapping Mode (Linear Scale)
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LED CURRENT (% of Full Scale)
100
10
1
0.1
0
51
102
153
204
255
BACKLIGHT CODE (D)
Figure 78. Exponential Mapping Mode (Log Scale)
Linear Mapping
In linear mapping mode the brightness code to backlight current has a linear relationship and follows the
equation:
ILED = ILED_ FULLSCALE x
1
x Code x DPWM
255
(3)
Where ILED_FULLSCALE is the full scale LED current setting, Code is the backlight code in the brightness register,
and DPWM is the PWM input duty cycle. Figure 79 shows the backlight code to LED current response using
linear mapping mode. The Configuration register must be set to enable linear mapping.
100
LED CURRENT (% Full Scale)
90
80
70
60
50
40
30
20
10
0
0
16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256
BACKLIGHT CODE (D)
Figure 79. Linear Mapping Mode
LED Current Ramping
Startup/Shutdown Ramp
The LED current turn on time from 0 to the initial LED current set-point is programmable. Similarly, the LED
current shutdown time to 0 is programmable. Both the startup and shutdown times are independently
programmable with 8 different levels. The Startup times are independently programmable from the Shutdown
times, but not independently programmable for each Control bank. For example, programming a Start-up or
Shutdown time, programs the same ramp time for each Control Bank. The Startup time is used when the device
is first enabled to a non-zero brightness value. The Shutdown time is used when the brightness value is
programmed to zero. If HWEN is used to disable the device, the action is immediate and the Shutdown time is
not used. The zero code does take a small amount of time which is approximately 0.5 ms.
Table 2. Startup/Shutdown Times
24
Code
Startup Time
Shutdown Time
000
4 ms
0
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Table 2. Startup/Shutdown Times (continued)
Code
Startup Time
Shutdown Time
001
261 ms
261 ms
010
522 ms
522 ms
011
1.045s
1.045s
100
2.091s
2.091s
101
4.182s
4.182s
110
8.364s
8.364s
111
16.73s
16.73s
Run-Time Ramp
Current ramping from one brightness level to the next is programmable. There are 8 different ramp up times and
8 different ramp down times. The ramp up time is independently programmable from the ramp down time, but not
independently programmable for each Control Bank. For example, programming a ramp up time or a ramp down
time will program the same ramp time for each control bank. The run time ramps are used whenever the device
is enabled with a non-zero brightness value and a new non-zero brightness value is written.
Table 3. LED Current Run Ramp Times
Code
Ramp-Up Time
Ramp-Down Time
000
0
0
001
261 ms
261 ms
010
522 ms
522 ms
011
1.045s
1.045s
100
2.091s
2.091s
101
4.182s
4.182s
110
8.364s
8.364s
111
16.73s
16.73s
Test Features
The LM3630A contains an LED open, an LED short, and Over Voltage manufacturing fault detection. This fault
detection is designed to be used during the manufacturing process only and not normal operation. These faults
do not set the INTN pin.
Open LED String (LED1 and LED2)
An open LED string is detected when the voltage at the input to either LED1 or LED2 has fallen below 200 mV
and the boost output voltage has hit the OVP threshold. This test assumes that the LED string that is being
detected for an open is being powered from the boost output (Feedback Enabled). For an LED string not
connected to the boost output, and connected to another voltage source, the boost output would not trigger the
OVP flag. In this case an open LED string would not be detected.
Shorted LED String
The LM3630A features an LED short fault flag indicating if either of the LED strings have experienced a short.
There are two methods that can trigger a short in the LED strings
1. An LED current sink with feedback enabled and the difference between OVP input and the LED current sink
input voltage goes below 1V.
2. An LED current sink is configured with feedback disabled (not powered from the boost output) and the
difference between VIN and the LED current sink input voltage goes below 1V.
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Over-Voltage Protection (Manufacturing Fault Detection and Shutdown)
The LM3630A provides an Over-Voltage Protection (OVP) mechanism specifically for manufacturing test where a
display may not be connected to the device. The over voltage protection threshold (OVP) on the LM3630A has 4
different programmable options (16V, 24V, 32V, and 40V). The manufacturing protection is enabled in the Fault
Status register bit 0. When enabled, this feature will cause the boost converter to shutdown anytime the selected
OVP threshold is exceeded. The OVP_fault bit in the Fault Status register will be set to one. The boost converter
will not resume operation until the LM3630A is reset with either a write to the Software Reset bit in the Software
Reset register or a cycling of the HWEN pin. The reset will clear the fault.
Fault Flags/Protection Features
The Interrupt Status register contains the status of the protection circuits of the LM3630A. The corresponding bits
will be set to one if an OVP, OCP, or TSD event occurs. These faults do set the INTN pin when the
corresponding bit is set in the Interrupt Enable register.
Over-Voltage Protection (Inductive Boost Operation)
The over-voltage protection threshold (OVP) on the LM3630A has 4 different programmable options (16V, 24V,
32V, and 40V). Over voltage protection protects the device and associated circuitry from high voltages in the
event the feedback enabled LED string becomes open. During normal operation, the LM3630A’s inductive boost
converter will boost the output up so as to maintain at least 300 mV at the active current sink inputs. When a
high-voltage LED string becomes open the feedback mechanism is broken, and the boost converter will
inadvertently over boost the output. When the output voltage reaches the over voltage protection (OVP)
threshold the boost converter will stop switching, thus allowing the output node to discharge. When the output
discharges to VOVP – 1V the boost converter will begin switching again. The OVP sense is at the OVP pin, so
this pin must be connected directly to the inductive boost output capacitor’s positive terminal.
For current sinks that have feedback disabled the over voltage sense mechanism is not in place to protect from
potential over-voltage conditions. In this situation the application must ensure that the voltage at LED1 or LED2
doesn’t exceed 40V.
The default setting for OVP is set at 24V. For applications that require higher than 24V at the boost output the
OVP threshold will have to be programmed to a higher level at power up.
Current Limit
The switch current limit for the LM3630A’s inductive boost is set at 1A. When the current through the NFET
switch hits this over current protection threshold (OCP) the device turns the NFET off and the inductor’s energy
is discharged into the output capacitor. Switching is then resumed at the next cycle. The current limit protection
circuitry can operate continuously each switch cycle. The result is that during high output power conditions the
device can continuously run in current limit. Under these conditions the LM3630A’s inductive boost converter
stops regulating the headroom voltage across the high voltage current sinks. This results in a drop in the LED
current.
Thermal Shutdown
The LM3630A contains thermal shutdown protection. In the event the die temperature reaches +140°C, the boost
power supply and current sinks will shut down until the die temperature drops to typically +125°C.
Initialization Timing
Initialization Timing with HWEN tied to VIN
If the HWEN input is tied to VIN, then the tWAIT time starts when VIN crosses 2.5V as shown below. The initial I2C
transaction can occur after the tWAIT time expires. Any I2C transaction during the tWAIT period will be NAK'ed.
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2.5V
twait = 1 ms
VIN
HWEN
SCL
SDA
Figure 80. Initialization Timing with HWEN is tied to VIN
Initialization Timing with HWEN driven by GPIO
If the HWEN input is driven by a GPIO then the tWAITtime starts when HWEW crosses 1.2V as shown below. The
initial I2C transaction can occur after the tWAIT time expires. Any I2C transaction during the tWAIT period will be
NAK'ed
VIN
twait = 1 ms
1.2V
HWEN
SCL
SDA
Figure 81. Initialization Timing with HWEN driven by a GPIO
Initialization after Software Reset
The time between the I2C transaction that issues the software reset, and the subsequent I2C transaction (ie to
configure the LM3630A) must be at greater or equal to the tWAIT period of 1ms. Any I2C transaction during the
tWAIT period will be NAK'ed
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I2C-COMPATIBLE INTERFACE
Data Validity
The data on SDA line must be stable during the HIGH period of the clock signal (SCL). In other words, state of
the data line can only be changed when SCL is LOW.
SCL
SDA
data
change
allowed
data
valid
data
change
allowed
data
valid
data
change
allowed
Figure 82. Data Validity Diagram
A pull-up resistor between the controller's VIO line, and SDA must be greater than [(VIO-VOL) / 3mA] to meet the
VOL requirement on SDA. Using a larger pull-up resistor results in lower switching current with slower edges,
while using a smaller pull-up results in higher switching currents with faster edges.
Start And Stop Conditions
START and STOP conditions classify the beginning and the end of the I2C session. A START condition is
defined as SDA signal transitioning from HIGH to LOW while SCL line is HIGH. A STOP condition is defined as
the SDA transitioning from LOW to HIGH while SCL is HIGH. The I2C master always generates START and
STOP conditions. The I2C bus is considered to be busy after a START condition and free after a STOP condition.
During data transmission, the I2C master can generate repeated START conditions. First START and repeated
START conditions are equivalent, function-wise.
SDA
SCL
S
P
START condition
STOP condition
Figure 83. Start and Stop Conditions
Transfering Data
Every byte put on the SDA line must be eight bits long, with the most significant bit (MSB) transferred first. Each
byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated by the
master. The master releases the SDA line (HIGH) during the acknowledge clock pulse. The LM3630A pulls down
the SDA line during the 9th clock pulse, signifying an acknowledge. The LM3630A generates an acknowledge
after each byte is received.
After the START condition, the I2C master sends a chip address. This address is seven bits long followed by an
eighth bit which is a data direction bit (R/W). The LM3630A address is 36h. For the eighth bit, a “0” indicates a
WRITE and a “1” indicates a READ. The second byte selects the register to which the data will be written. The
third byte contains data to write to the selected register.
I2C Compatible Address
MSB
0
Bit 7
LSB
1
Bit 6
1
Bit 5
0
Bit 4
1
Bit 3
1
Bit 2
0
Bit 1
R/W
Bit 0
Figure 84. I2C-Compatible Chip Address (0x36), SEL = 0
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I2C Compatible Address
MSB
0
Bit 7
LSB
1
Bit 6
1
Bit 5
1
Bit 4
0
Bit 3
0
Bit 2
0
Bit 1
R/W
Bit 0
Figure 85. I2C-Compatible Chip Address (0x38), SEL = 1
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LM3630A I2C Register Map
This table summarizes LM3630A I2C-compatible register usage and shows default register bit values after reset,
as programmed by the factory. The following sub-sections provide additional details on the use of individual
registers. Register bits which are blank in the following tables are considered undefined. Undefined bits should
be ignored on reads and written as zero.
Slave Address [0x36h for SEL = 0, 0x38h for SEL = 1]
Base Registers
Register Name
Address
Type
Default Reset Values
Control
0x00
R/W
0xC0
Configuration
0x01
R/W
0x18
Boost Control
0x02
R/W
0x38
Brightness A
0x03
R/W
0x00
Brightness B
0x04
R/W
0x00
Current A
0x05
R/W
0x1F
Current B
0x06
R/W
0x1F
On/Off Ramp
0x07
R/W
0x00
Run Ramp
0x08
R/W
0x00
Interrupt Status
0x09
R/W
0x00
Interrupt Enable
0x0A
R/W
0x00
Fault Status
0x0B
R/W
0x00
Software Reset
0x0F
R/W
0x00
PWM Out Low
0x12
Read
0x00
PWM Out High
0x13
Read
0x00
Revision
0x1F
Read
0x02
Filter Strength
0x50
R/W
0x00
Register Descriptions
Control (Offset = 0x00, Default = 0xC0)
Register Bits
7
6
SLEEP_CMD
SLEEP_
STATUS
5
4
3
2
1
0
LINEAR_A
LINEAR_B
LED_A_EN
LED_B_EN
LED2_ON_A
Name
Bit
Access
SLEEP_CMD
7
R/W
Description
The device is put into sleep mode when set to '1'
SLEEP_STATUS
6
Read
Reflects the sleep mode status. A '1' indicates the part is in sleep mode.
Used to determine when part has entered or exited sleep mode after writing the
SLEEP_CMD bit.
30
5
Read
LINEAR_A
4
R/W
Enables the linear output mode for Bank A when set to '1'.
LINEAR_B
3
R/W
Enables the linear output mode for Bank B when set to '1'.
LED_EN_A
2
R/W
Enables the LED A output
LED_EN_B
1
R/W
Enables the LED B output
LED2_ON_A
0
R/W
Connect the LED2 output to Bank A Control
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Configuration (Offset = 0x01, Default = 0x18)
Register Bits
7
Name
6
5
4
3
2
1
0
FB_EN_B
FB_EN_A
PWM_LOW
PWM_EN-B
PWM_EN_A
Bit
Access
Description
7
Read
6
Read
5
Read
FB_EN_B
4
R/W
Enable Feedback on Bank B
FB_EN_A
3
R/W
Enable Feedback on Bank A
PWM_LOW
2
R/W
Sets the PWM to active low
PWM_EN_B
1
R/W
Enables the PWM for Bank B
PWM_EN_A
0
R/W
Enables the PWM for Bank A
Boost Control (Offset = 0x02, Default = 0x38)
Register Bits
7
6
5
4
3
2
BOOST_OVP[1] BOOST_OVP[0] BOOST_OCP[1] BOOST_OCP[0] SLOW_STAR
T
Name
1
0
SHIFT
FMODE
Bit
Access
7
Read
Description
BOOST_OVP
6:5
R/W
Selects the voltage limit for over-voltage protection:
00 = 16V
01 = 24V
10 = 32V
11 = 40V
BOOST_OCP
4:3
R/W
Selects the current limit for over-current protection:
00 = 600 mA
01 = 800 mA
10 = 1.0A
11 = 1.2A
SLOW_START
2
R/W
Slows the boost output transition
SHIFT
1
R/W
Enables the alternate oscillator frequencies:
For FMODE = 0: SHIFT = 0F = 500 kHz; SHIFT 1F = 560 kHz
For FMODE = 1: SHIFT = 0F = 1 MHz; SHIFT 1F = 1120 MHz
FMODE
0
R/W
Selects the boost frequency:
0 = 500 kHz, 1 = 1MHz
Brightness A (Offset = 0x03, Default = 0x00) (1)
Register Bits
(1)
7
6
5
4
3
2
1
0
A[7]
A[6]
A[5]
A[4]
A[3]
A[2]
A[1]
A[0]
Name
Bit
Access
A
[7:0]
R/W
Description
Sets the 8-bit brightness value for outputs connected to Bank A. Minimum brightness
setting is code 04h.
These registers will not update if the device is in Sleep Mode (Control: SLEEP_STATUS = 1).
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Brightness B (Offset = 0x04, Default = 0x00) (1)
Register Bits
(1)
7
6
5
4
3
2
1
0
B[7]
B[6]
B[5]
B[4]
B[3]
B[2]
B[1]
B[0]
Name
Bit
Access
B
[7:0]
R/W
Description
Sets the 8-bit brightness value for outputs connected to Bank B. Minimum brightness
setting is code 04h.
These registers will not update if the device is in Sleep Mode (Control: SLEEP_STATUS = 1).
Current A (Offset = 0x05, Default 0x1F)
Register Bits
7
6
Hysteresis
Lower Bound
5
4
3
2
1
0
A[4]
A[3]
A[2]
A[1]
A[0]
Name
Bit
Access
Hysteresis
7
R/W
Determines the hysteresis of the PWM Sampler. Clearing this bit, the PWM sampler
changes its output upon detecting at least 3 equivalent code changes on the PWM
input. Setting this bit, the PWM sampler changes its output upon detecting 2 equivalent
code changes on the PWM input.
Lower Bound
6
R/W
Determines the lower bound of the PWM Sampler. Clearing this bit, the PWM sampler
outputs code 6 when it detects equivalent codes 2 thru 6; and code 0 when it detects
equivalent codes 0 thru 1. Setting this bit, the PWM sampler can output codes below 6,
based upon the Hysteresis setting and equivalent code sampled from the input PWM.
5
Read
[4:0]
R/W
A
Description
Sets the 5-bit full-scale current for outputs connected to Bank A.
Current B (Offset = 0x06, Default = 0x1F)
Register Bits
7
6
5
Name
Bit
Access
B
[4:0]
R/W
4
3
2
1
0
B[4]
B[3]
B[2]
B[1]
B[0]
Description
Sets the 5-bit full-scale current for outputs connected to Bank B
On/Off Ramp (Offset = 0x07, Default 0x00)
Register Bits
7
Name
32
6
5
4
3
2
1
0
T_START[2]
T_START[1]
T_START[0]
T_SHUT[2]
T_SHUT[1]
T_SHUT[0]
Bit
Access
Description
7
Read
6
Read
T_START
[5:3]
R/W
Ramp time for startup events.
T_SHUT
[2:0]
R/W
Ramp time for shutdown events.
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Code
Start-Up Time
000
4 ms
Shutdown Time
0*
001
261 ms
261 ms
010
522 ms
522 ms
011
1.045s
1.045s
100
2.091s
2.091s
101
4.182s
4.182s
110
8.364s
8.364s
111
16.73s
16.73s
*Code 0 results in approximately 0.5 ms ramp time.
Run Ramp (Offset = 0x08, Default = 0x00)
Register Bits
7
6
Name
5
4
3
2
1
0
T_UP[2]
T_UP[1]
T_UP[0]
T_DOWN[2]
T_DOWN[1]
T_DOWN[0]
Bit
Access
7
Read
Description
6
Read
T_UP
[5:3]
R/W
Time for ramp-up events
T_DOWN
[2:0]
R/W
Time for ramp-down events
Code
Ramp-Up Time
Ramp-down Time
000
0*
0*
001
261 ms
261 ms
010
522 ms
522 ms
011
1.045s
1.045s
100
2.091s
2.091s
101
4.182s
4.182s
110
8.364s
8.364s
111
16.73s
16.73s
*Code 0 results in approximately 0.5 ms ramp time.
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Interrupt Status (Offset = 0x09, Default = 0x00)
Register Bits
7
Name
6
5
4
3
Bit
Access
7
Read
6
Read
5
Read
4
Read
3
Read
OCP
2
R/W
An over-current condition occurred.
OVP
1
R/W
An over-voltage condition occurred.
TSD
0
R/W
A thermal shutdown event occurred.
2
1
0
OCP
OVP
TSD
Description
The interrupt status register is cleared upon a read of the register. If the condition that caused the interrupt is still
present, then the bit will be set to one again and another interrupt is signaled on the INTN output pin. The
interrupt status register is not cleared if the device is in sleep mode (Control: SLEEP_STATUS = 1). To
disconnect the interrupt condition from the INTN pin during sleep mode, disable the fault connection in the
Interrupt Enable register. An interrupt condition will set the status bit and cause an event on the INTN pin only if
the corresponding bit in the Interrupt Enable register is one and the Global Enable bit is also one.
Interrupt Enable (Offset = 0x0A, Default = 0x00)
Register Bits
7
6
5
4
3
2
1
0
OCP
OVP
TSD
Name
Bit
Access
GLOBAL
7
R/W
Description
6
Read
5
Read
4
Read
3
Read
OCP
2
R/W
Set to '1' to enable the over-current condition interrupt.
OVP
1
R/W
Set to '1' to enable the over-voltage condition interrupt.
TSD
0
R/W
Set to '1' to enable the thermal shutdown interrupt.
Set to '1' to enable interrupts to drive the INTN pin.
Fault Status (Offset = 0x0B, Default = 0x00)
Register Bits
7
Name
6
5
4
3
2
1
0
OPEN
LED2_SHORT
LED1_SHORT
SHORT_EN
OVP_FAULT
OVP_F_EN
Bit
Access
7
Read
6
Read
Description
.
OPEN
5
R/W
An open circuit was detected on one of the LED strings.
LED2_SHORT
4
R/W
A short was detected on LED string 2.
LED1_SHORT
3
R/W
A short was detected on LED string 1.
SHORT_EN
2
R/W
Set to '1' to enable short test.
OVP_FAULT
1
R/W
An OVP occurred in manufacturing test.
OVP_F_EN
0
R/W
Set to '1' to enable OVP manufacturing test.
34
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Software Reset (Offset = 0x0F, Default = 0x00)
Register Bits
7
6
5
4
3
2
1
0
SW_RESET
Name
SW_RESET
Bit
Access
7
Read
6
Read
5
Read
4
Read
3
Read
2
Read
1
Read
0
R/W
Description
.
Set to '1' to reset the device. This is a full reset which clears the registers, executes a
power-on reset, and reads the EPROM configuration.
PWM Out Low (Offset = 0x12, Default 0x00)
Register Bits
7
6
5
4
3
2
1
0
PWM_OUT[7]
PWM_OUT[6]
PWM_OUT[5]
PWM_OUT[4]
PWM_OUT[3]
PWM_OUT[2]
PWM_OUT[1]
PWM_OUT[0]
2
1
PWM Out High (Offset = 0x13, Default 0x00)
Register Bits
7
6
5
4
3
0
PWM_OUT[8]
Name
Bit
Access
PWM_OUT
[7:0]
R/W
Description
The value of the PWM detector. Maximum value is 256 or 100h. If PWM_OUT[7:0] is
non-zero PWM_OUT[8] will be zero.
Revision (Offset = 0x1F, Default = 0x02)
Register Bits
7
6
5
4
3
2
1
0
REV[7]
REV[6]
REV[5]
REV[4]
REV[3]
REV[2]
REV[1]
REV[0]
Name
Bit
Access
Description
REV
[7:0]
R/W
Revision value
Filter Strength (Offset = 0x50, Default = 0x00)
Register Bits
7
6
5
Name
Bit
Access
FLTR_STR
[1:0]
R/W
4
3
2
1
0
FLTR_STR[1]
FLTR_STR[0]
Description
Filter Strength
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APPLICATION INFORMATION
Recommended Initialization Sequence
The recommended initialization sequence for the device registers is listed below.
1. Set Filter Strength register (offset=50h) to 03h.
2. Set Configuration register (offset=01h) to enable the PWM and the feedback for Bank A, For example writing
09h to the Configuration register, enables PWM and feedback for Bank A. Note the Bank B PWM and
feedback need to be configured if Bank B is used, otherwise disable the Bank B feedback by clearing bit 4
and disable the Bank B PWM by clearing bit 1.
3. Configure the Boost Control register (offset=02h) to select the OVP, OCP and FMODE. For example writing
78h to the Boost Control register sets OVP to 40V, OCP to 1.2A and FMODE to 500 kHz.
4. Set the full scale LED current for Bank A and Bank B(if used), by writing to the Current A (offset=05h), and
Current B(offset=06) registers. For example writing 14h to the Current A register selects a full scale LED
current of 20 mA for Bank A.
5. Set the PWM Sampler Hysteresis to 2 codes by setting Bit 7 of the Current A register. Set the PWM Sampler
Lower Bound code to 6 by clearing Bit 6 of the Current A register. Note these settings apply to both Bank A
and Bank B. If only Bank B is used, these setting are still necessary when PWM is enabled.
6. Select the current control and enable or disable the LED Bank A and/or B by writing to Control
register(offset=00h). For example writing 14h to the Control register select linear current control and enables
Bank A.
7. Set the LED brightness by writing to Brightness A (Offset=03h) and Brightness B(Offset=04h) registers. For
example writing FFh to Brightness A will set the LED current to 20 mA, with the Current A register set to 14h
and the PWM input is high.
PWM Operation
Current Scaling
2 MHz clock
Filter
Strength
PWM Input
Sample
Period
LPF
ILED
Brightness R3 & R4
Hysteresis
Min
PWM value
Full Scale R5 & R6
Figure 86. PWM Sampler
36
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Hysteresis Block
Output Previous
Previous Value
No
LPF
Output
Sampled
Value
Yes
Sampled > Previous +2?
or
Sampled < Previous
Output Sample
Figure 87. Hysteresis Block (Details)
Min Block
Input <= 2
Hysteresis
Output
Input
Value
Is input >
code 6?
No
Output = 0
Yes
Output =
Input
PWM
Value
Output = 6
Figure 88. Min Block (Details)
PWM Input
The PWM input can be assigned to any control bank. When assigned to a control bank, the programmed current
in the control bank also becomes a function of the duty cycle at the PWM input. The PWM input is sampled by a
digital circuit which outputs a brightness code that is equivalent to the PWM input duty cycle. The resultant
brightness value is a combination of the maximum current setting, the brightness registers, and the equivalent
PWM brightness code.
PWM input Frequency
The specified input frequency of the PWM signal is 10 kHz to 80 kHz. The recommended frequency is 30 kHz or
greater. The PWM input sampler will operate beyond those frequency limits. Performance will change based on
the input frequency used. It is not recommended to use frequencies outside the specified range. Lower PWM
input frequency increases the likelihood that the output of the sampler may change and that a single brightness
step may be visible on the screen. This may be visible at low brightness because the step change is large
relative to the output level.
Recommended Settings
For best performance of the PWM sampler it is recommended to have a PWM input frequency of at least 30 kHz.
The Filter Strength (register 50h) should be set to 03h. The Hysteresis 1 bit should be set in register 05h to 1
when setting the maximum current for bank A. For example if max current is 20 mA, register 05h is set to 14h,
change that to 94h for 1 bit hysteresis and a smooth min-to-max brightness transition.
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Adjustments to PWM sampler
The digital sampler has controls for hysteresis and minimum output brightness which allow the optimization of
sampler output. The default hysteresis mode of the PWM sampler requires detecting a two code change in the
input to increase brightness. Reducing the hysteresis to change on 1 code will allow a smoother brightness
transition when the brightness control is swept across the screen in a system. The filter strength bits affect the
speed of the output transitions from the PWM sampler. A lower bound to the brightness is enabled by default
which will limit the minimum output of the PWM sampler to an equivalent code of 6 when the LEDs are turned
on. A detected code of 1 will be forced to off. A minimum 2% PWM input duty cycle is recommended. Input duty
cycles of 1% or less will cause delayed off to on transitions.
Filter Strength, Register 50h Bits [1:0]
•
•
o Filter Strength controls the amount of sampling cycles that are fed back to the PWM input sampler. A filter
strength of 00b allows the output of the PWM sampler to change on every Sample Period. A filter strength of
01b allows the output of the PWM sampler to change every two Sample Periods. A filter strength of 10b
allows the output of the PWM sampler to change every four Sample Periods. A filter strength of 11b allows
the output of the PWM sampler to change every eight Sample Periods.
o The effect of setting this value to 11b forces the output of the PWM sampler to change less frequently then
lower values. The benefit is this will reduce the appearance of flicker because the output is slower to change.
The negative is that the output is slower to change.
Hysteresis 1 bit, Register 05h, Bit 7
•
•
o The default setting for the LM3630A has Bit 7 of register 05h is 0b. This requires the detection of a PWM
input change that is at least 3 equivalent codes higher than the present code. If this bit is set to 1b, the
hysteresis is turned off and the PWM sampler output is allowed to change by 2 code.
o Setting this bit to 1b will turn off the 2 code requirement for the PWM sampler output to change. The benefit
is the output change will be smoother. The negative is that there may be some PWM input value where the
output could change by one code and it might appear as flicker.
Lower Bound Disable, Register 05h, Bit 6
•
•
•
o The default setting for the LM3630A has Bit 6 of register 05h is 0b. This turns on the lower bound where the
minimum output value of the PWM sampler is an equivalent code of 6. If the PWM sampler detects an
equivalent code of 0 or 1, the output will be 0 and the LEDs will be off. If the PWM sampler detects an
equivalent code of 2 through 6, a current equal to code 6 will be output. Detection of any higher code will
output that code conforming to the rules of Hysteresis above.
o Setting Bit 6 of register 05h to 1b can be used to allow the output to be below an equivalent code 6. The
output of the PWM sampler will match the input pulse width conforming to the rules of Hysteresis and
equivalent codes 1, 2, 3, 4, and 5 are also allowed. The benefit is the output is allowed to go dimmer than in
the default mode. The negative is at the low codes of 1 and 2, the LEDs may not turn on or the LEDs may
appear to flicker.
o Disabling the Lower Bound (05h Bit 6 = 1b) allows the minimum duty cycle to be detected at 0.35% PWM
input duty cycle. At 30kHz PWM input frequency, the minimum pulse width required to turn on the LEDs is
0.39% X 33 µS = 129 ns. There is no specified tolerance to this value.
Minimum TON Pulse Width
The minimum TON pulse width required to produce a non-zero output is dependent upon the LM3630A settings.
The default setting of the LM3630A requires a minimum of 0.78% duty cycle for the output to be turned on.
Because the lower bound feature is enabled, a value of 0.78% (equivalent brightness code 2) up to 2.35%
(equivalent brightness code 6) will all produce an output equivalent to brightness code 6. At 30 kHz PWM input
frequency, the minimum pulse width required to turn on the LEDs is 0.78% X 33uS = 260ns.
Because of the hysteresis on the PWM input, this pulse width may not be sufficient to turn on the LEDs. It is
recommended that a minimum pulse width of 2% be used. 2% X 33 µS = 660 ns at 30 kHz input frequency.
Disabling the Lower Bound as described will allow a smaller minimum pulse width.
38
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Maximum Power Output
The LM3630A's maximum output power is governed by two factors: the peak current limit (ICL = 1.2A max.), and
the maximum output voltage (VOVP = 40V min.). When the application causes either of these limits to be reached
it is possible that the proper current regulation and matching between LED current strings will not be met.
In the case of a peak current limited situation, when the peak of the inductor current hits the LM3630A's current
limit the NFET switch turns off for the remainder of the switching period. If this happens, each switching cycle the
LM3630A begins to regulate the peak of the inductor current instead of the headroom across the current sinks.
This can result in the dropout of the feedback-enabled current sinks and the current dropping below its
programmed level.
The peak current in a boost converter is dependent on the value of the inductor, total LED current (IOUT), the
output voltage (VOUT) (which is the highest voltage LED string + 0.3V regulated headroom voltage), the input
voltage VIN, and the efficiency (Output Power/Input Power). Additionally, the peak current is different depending
on whether the inductor current is continuous during the entire switching period (CCM) or discontinuous (DCM)
where it goes to 0 before the switching period ends.
For Continuous Conduction Mode the peak inductor current is given by:
IPEAK =
VIN x efficiency
VIN
IOUT x VOUT
x 1+
VOUT
2 x fsw x L
VIN x efficiency
(4)
For Discontinuous Conduction Mode the peak inductor current is given by:
IPEAK =
2 x IOUT
fsw x L x efficiency
x VOUT - VIN x efficiency
(5)
To determine which mode the circuit is operating in (CCM or DCM) it is necessary to perform a calculation to test
whether the inductor current ripple is less than the anticipated input current (IIN). If ΔIL is < then IIN then the
device will be operating in CCM. If ΔIL is > IIN then the device is operating in DCM.
VIN x efficiency
VIN
IOUT x VOUT
x 1>
VOUT
VIN x efficiency fsw x L
(6)
Typically at currents high enough to reach the LM3630A's peak current limit, the device will be operating in CCM.
The following figures show the output current and output voltage derating for a 10 µH and a 22 µH inductor, at
switch frequencies of 500 kHz and 1 MHz. A 10 µH will typically be a smaller device with lower on resistance, but
the peak currents will be higher. A 22 µH provides for lower peak currents, but to match the DC resistance of a
10 µH requires a larger sized device.
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Maximum Boost Output Power vs VIN, Freq=500kHz, L=10uH
43
42
41
3.0
3.1
40
3.2
3.3
39
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
34
4.3
4.4
33
4.5
4.6
32
4.7
4.8
31
4.9
5.0
30
5.1
5.2
5.3
5.4
38
Vout (V)
37
36
35
Freq = 500kHz
L = 10uH
VIN = 3.0V to 5.5V
29
28
5.5
27
0
10
20
30
40
50
60
70
80
IOUT (mA)
C002
Figure 89.
Maximum Boost Output Power vs VIN, Freq=1MHz, L=10uH
43
42
Vout (V)
41
40
39
38
Freq = 1MHz
L = 10uH
VIN = 3.0V to 5.5V
37
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
5.5
36
0
10
20
30
40
50
60
70
80
IOUT (mA)
C002
Figure 90.
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Vout (V)
Maximum Boost Output Power vs VIN, Freq=500kHz, L=22uH
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
Freq = 500kHz
L = 22uH
VIN = 3.0V to 5.5V
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
5.5
0
10
20
30
40
50
60
70
80
IOUT (mA)
C002
Figure 91.
Maximum Boost Output Power vs VIN, Freq=1MHz, L=22uH
41
40
39
3.0
3.1
38
3.2
3.3
3.4
3.5
3.6
3.7
34
3.8
3.9
33
4.0
4.1
32
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
37
36
Vout (V)
35
31
30
29
28
27
Freq = 1MHz
L = 22uH
VIN = 3.0V to 5.5V
26
25
5.5
24
0
10
20
30
40
50
60
70
80
IOUT (mA)
C002
Figure 92.
Inductor Selection
The LM3630A is designed to work with a 10 µH to 22 µH inductor. When selecting the inductor, ensure that the
saturation rating for the inductor is high enough to accommodate the peak inductor current . The following
equation calculates the peak inductor current based upon LED current, VIN, VOUT, and Efficiency.
I PEAK =
I LED VOUT
+ 'I L
×
K
VIN
(7)
where:
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'IL =
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VIN x (VOUT - VIN )
2 x f SW x L x VOUT
(8)
When choosing L, the inductance value must also be large enough so that the peak inductor current is kept
below the LM3630A's switch current limit. This forces a lower limit on L given by the following equation.
VIN x (VOUT - VIN)
L>
§
I LED _ MAX x VOUT
©
K x VIN
2 x f SW x VOUT x ¨
¨I SW_MAX -
·
¸¸
¹
(9)
ISW_MAX is given in the Electrical Table, efficiency (η) is shown in theTYPICAL PERFORMANCE
CHARACTERISTICS , and ƒSW is typically 500 kHz or 1 MHz.
Table 4. Inductors
Manufacturer
Part Number
Value
Size
Current Rating
DC Resistance
TDK
VLF4014ST100M1R0
10 µH
3.8 mm x 3.6 mm x 1.4 mm
1A
0.22 Ω
TDK
VLF302512MT-220M
22 µH
3 mm x 2.5 mm x 1.2 mm
0.43A
0.583 Ω
42
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PACKAGE OPTION ADDENDUM
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9-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM3630ATME
ACTIVE
DSBGA
YFQ
12
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
D6
LM3630ATMX
ACTIVE
DSBGA
YFQ
12
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
D6
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
MECHANICAL DATA
YFQ0012xxx
D
0.600
±0.075
E
TMD12XXX (Rev B)
D: Max = 1.94 mm, Min = 1.88 mm
E: Max = 1.42 mm, Min = 1.36 mm
4215079/A
NOTES:
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
www.ti.com
12/12
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