Material Content Data Sheet Sales Product Name TLE8386-2EL Issued MA# MA001140392 Package PG-SSOP-14-3 28. August 2013 Weight* 83.39 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 2.378 2.85 0.009 0.01 0.034 0.04 413 0.689 0.83 8263 27.978 33.55 34.43 335522 344301 0.211 0.25 0.25 2526 2526 0.098 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.85 28520 28520 103 1175 4.509 5.41 44.399 53.25 58.78 532460 587704 0.976 1.17 1.17 11706 11706 0.768 0.92 0.92 9206 9206 0.334 0.40 1.003 1.20 54069 4009 1.60 12028 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 16037 1000000