ISL8487E, ISL81487L, ISL81487E ® Data Sheet September 15, 2005 ±15kV ESD Protected, 1/8 Unit Load, 5V, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers FN6051.6 Features • RS-485 I/O Pin ESD Protection . . . . . . . . . . ±15kV HBM - Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM These Intersil RS-485/RS-422 devices are ESD protected, fractional unit load (UL), BiCMOS, 5V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. Each driver output/ receiver input is protected against ±15kV ESD strikes, without latch-up. Unlike competitive devices, this Intersil family is specified for 10% tolerance supplies (4.5V to 5.5V). • Fractional Unit Load Allows up to 256 Devices on the Bus • Specified for 10% Tolerance Supplies • High Data Rate Version (ISL81487E) . . . . . up to 5Mbps • Slew Rate Limited Versions for Error Free Data Transmission (ISL8487E, ISL81487L) . . . . .up to 250kbps • Low Current Shutdown Mode (Except ISL81487E). . . 0.5µA All devices present a 1/8 “unit load” to the RS-485 bus, which allows up to 256 transceivers on the network for large node count systems (e.g., process automation, remote meter reading systems). In a remote utility meter reading system, individual (apartments for example) utility meter readings are routed to a concentrator via an RS-485 network, so the high allowed node count minimizes the number of repeaters required to network all the meters. Data for all meters is then read out from the concentrator via a single access port, or a wireless link. • Low Quiescent Supply Current: - ISL8487E, ISL81487L . . . . . . . . . . . . . . . 145µA (Max.) - ISL81487E . . . . . . . . . . . . . . . . . . . . . . . . 420µA (Max.) • -7V to +12V Common Mode Input Voltage Range • Three State Rx and Tx Outputs • 30ns Propagation Delays, 5ns Skew (ISL81487E) • Half Duplex Pinouts • Operate from a Single +5V Supply (10% Tolerance) Slew rate limited drivers on the ISL8487E and ISL81487L reduce EMI, and minimize reflections from improperly terminated transmission lines, or unterminated stubs in multidrop and multipoint applications. Data rates up to 250kbps are achievable with these devices. • Current Limiting and Thermal Shutdown for Driver Overload Protection • Pin Compatible Replacements for: MAX487E, (ISL8487E); LTC1487, ADM1487 (ISL81487L); MAX1487E, ST485ER (ISL81487E) Data rates up to 5Mbps are achievable by using the ISL81487E, which features higher slew rates. • Pb-Free Plus Anneal Available (RoHS Compliant) Receiver (Rx) inputs feature a “fail-safe if open” design, which ensures a logic high Rx output if Rx inputs are floating. Applications • High Node Count Networks Driver (Tx) outputs are short circuit protected, even for voltages exceeding the power supply voltage. Additionally, on-chip thermal shutdown circuitry disables the Tx outputs to prevent damage if power dissipation becomes excessive. • Automated Utility Meter Reading Systems • Factory Automation • Security Networks These half duplex devices multiplex the Rx inputs and Tx outputs to allow transceivers with Rx and Tx disable functions in 8 lead packages. • Building Environmental Control Systems • Industrial/Process Control Networks TABLE 1. SUMMARY OF FEATURES PART NUMBER HALF/FULL DUPLEX NO. OF DEVICES DATA RATE ALLOWED ON BUS (Mbps) ISL8487E Half 256 0.25 Yes Yes 120 Yes 8 ISL81487L Half 256 0.25 Yes Yes 120 Yes 8 ISL81487E Half 256 5 No Yes 350 No 8 1 SLEW-RATE LIMITED? RECEIVER/ QUIESCENT LOW POWER PIN DRIVER ENABLE? ICC (µA) SHUTDOWN? COUNT CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2003-2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL8487E, ISL81487L, ISL81487E Pinout Truth Tables ISL8487E, ISL81487L, ISL81487E (PDIP, SOIC) TOP VIEW TRANSMITTING INPUTS RO 1 R RE 2 DE 3 D DI 4 8 VCC RE DE DI Z Y 7 B/Z X 1 1 0 1 6 A/Y X 1 0 1 0 5 GND 0 0 X High-Z High-Z 1 0 X High-Z * High-Z * Ordering Information PART NO. (BRAND) TEMP. RANGE (°C) OUTPUTS *Shutdown Mode for ISL8487E, ISL81487L (See Note 7) PACKAGE PKG. DWG. # ISL8487EIB* (8487EIB) -40 to 85 8 Ld SOIC M8.15 ISL8487EIBZ* (8487EIB)(Note) -40 to 85 8 Ld SOIC (Pb-free) M8.15 ISL8487EIP -40 to 85 8 Ld PDIP E8.3 ISL81487LIB* (81487LIB) -40 to 85 8 Ld SOIC M8.15 ISL81487LIBZ* (81487LIB)(Note) -40 to 85 8 Ld SOIC (Pb-free) M8.15 ISL81487LIP -40 to 85 8 Ld PDIP E8.3 ISL81487EIB* (81487EIB) -40 to 85 8 Ld SOIC M8.15 ISL81487EIBZ* (81487EIB)(Note) -40 to 85 8 Ld SOIC (Pb-free) M8.15 ISL81487EIP -40 to 85 8 Ld PDIP E8.3 ISL81487EIPZ (ISL81487EIPZ)(Note) -40 to 85 8 Ld PDIP (Pb-free) E8.3 RECEIVING INPUTS OUTPUT RE DE A-B RO 0 0 ≥ +0.2V 1 0 0 ≤ -0.2V 0 0 0 Inputs Open 1 1 0 X High-Z * 1 1 X High-Z *Shutdown Mode for ISL8487E, ISL81487L (See Note 7) *Add “-T” suffix to part number for tape and reel packaging. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Pin Descriptions PIN FUNCTION RO Receiver output: If A > B by at least 0.2V, RO is high; If A < B by 0.2V or more, RO is low; RO = High if A and B are unconnected (floating). RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND Ground connection. A/Y ±15kV HBM ESD Protected, RS-485/422 level, noninverting receiver input and non-inverting driver output. Pin is an input (A) if DE = 0; pin is an output (Y) if DE = 1. B/Z ±15kV HBM ESD Protected, RS-485/422 level, inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is an output (Z) if DE = 1. VCC System power supply input (4.5V to 5.5V). 2 FN6051.6 ISL8487E, ISL81487L, ISL81487E Typical Operating Circuits ISL8487E, ISL81487L, ISL81487E +5V +5V + 8 0.1µF 0.1µF + 8 VCC 1 RO VCC R D 2 RE B/Z 7 3 DE A/Y 6 4 DI RT RT 7 B/Z DE 3 6 A/Y RE 2 R D GND GND 5 5 3 DI 4 RO 1 FN6051.6 ISL8487E, ISL81487L, ISL81487E Absolute Maximum Ratings Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V) Input/Output Voltages A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Resistance (Typical, Note 1) θJA (°C/W) 8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . 170 8 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . 140 Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C (SOIC - Lead Tips Only) Operating Conditions Temperature Range ISL8XXXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. ( Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C, (Note 2) PARAMETER SYMBOL TEST CONDITIONS TEMP (°C) MIN TYP MAX UNITS DC CHARACTERISTICS Driver Differential VOUT (no load) VOD1 Driver Differential VOUT (with load) VOD2 Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Full - - VCC V R = 50Ω (RS-422), (Figure 1) Full 2 3 - V R = 27Ω (RS-485), (Figure 1) Full 1.5 2.3 5 V ∆VOD R = 27Ω or 50Ω, (Figure 1) Full - 0.01 0.2 V VOC R = 27Ω or 50Ω, (Figure 1) Full - - 3 V ∆VOC R = 27Ω or 50Ω, (Figure 1) Full - 0.01 0.2 V Logic Input High Voltage VIH DE, DI, RE Full 2 - - V Logic Input Low Voltage VIL DE, DI, RE Full - - 0.8 V Logic Input Current IIN1 DE, DI, RE Full -2 - 2 µA Input Current (A/Y, B/Z), (Note 10) IIN2 DE = 0V, VCC = 4.5 to 5.5V IIN2 Receiver Differential Threshold Voltage VTH DE = 0V, VCC = 0V -7V ≤ VCM ≤ 12V VIN = 12V Full - - 140 µA VIN = -7V Full - - -120 µA VIN = 12V Full - - 180 µA VIN = -7V Full - - -100 µA Full -0.2 - 0.2 V Receiver Input Hysteresis ∆VTH VCM = 0V 25 - 70 - mV Receiver Output High Voltage VOH IO = -4mA, VID = 200mV Full 3.5 - - V Receiver Output Low Voltage VOL IO = -4mA, VID = 200mV Full - - 0.4 V Three-State (high impedance) Receiver Output Current IOZR 0.4V ≤ VO ≤ 2.4V Full - - ±1 µA Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V Full 96 - - kΩ 4 FN6051.6 ISL8487E, ISL81487L, ISL81487E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C, (Note 2) (Continued) PARAMETER SYMBOL No-Load Supply Current, (Note 3) ICC TEST CONDITIONS ISL81487E, DI, RE = 0V DE = VCC or VCC DE = 0V ISL8487E, ISL81487L, DI, RE = 0V or VCC TEMP (°C) MIN TYP MAX UNITS Full - 400 500 µA Full - 350 420 µA DE = VCC Full - 160 200 µA DE = 0V Full - 120 145 µA Shutdown Supply Current ISHDN (Note 7), DE = 0V, RE = VCC, DI = 0V or VCC Full - 0.5 8 µA Driver Short-Circuit Current, VO = High or Low IOSD1 DE = VCC, -7V ≤ VY or VZ ≤ 12V, (Note 4) Full 35 - 250 mA Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC Full 7 - 85 mA tPLH, tPHL RDIFF = 54Ω, CL = 100pF, (Figure 2) Full 15 24 50 ns tSKEW RDIFF = 54Ω, CL = 100pF, (Figure 2) Full - 3 10 ns tR, tF RDIFF = 54Ω, CL = 100pF, (Figure 2) Full 3 12 25 ns tZH CL = 100pF, SW = GND, (Figure 2) Full - 14 70 ns SWITCHING CHARACTERISTICS (ISL81487E) Driver Input to Output Delay Driver Output Skew Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low tZL CL = 100pF, SW = VCC, (Figure 2) Full - 14 70 ns Driver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 2) Full - 44 70 ns Driver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 2) Full - 21 70 ns Receiver Input to Output Delay tPLH, tPHL (Figure 4) Full 30 90 150 ns tSKD (Figure 4) 25 - 5 - ns tZH CL = 15pF, SW = GND, (Figure 5) Full - 9 50 ns Receiver Skew | tPLH - tPHL | Receiver Enable to Output High Receiver Enable to Output Low tZL CL = 15pF, SW = VCC, (Figure 5) Full - 9 50 ns Receiver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 5) Full - 9 50 ns Receiver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 5) Full - 9 50 ns Full 5 - - Mbps Maximum Data Rate fMAX SWITCHING CHARACTERISTICS (ISL8487E) Driver Input to Output Delay Driver Output Skew Driver Differential Rise or Fall Time tPLH, tPHL RDIFF = 54Ω, CL = 100pF, (Figure 2) Full 250 650 2000 ns tSKEW RDIFF = 54Ω, CL = 100pF, (Figure 2) Full - 160 800 ns tR, tF RDIFF = 54Ω, CL = 100pF, (Figure 2) Full 250 900 2000 ns Driver Enable to Output High tZH CL = 100pF, SW = GND, (Figure 3, Note 5) Full 250 1000 2000 ns Driver Enable to Output Low tZL CL = 100pF, SW = VCC, (Figure 3, Note 5) Full 250 860 2000 ns Driver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 3) Full 300 660 3000 ns Driver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 3) Full 300 640 3000 ns Receiver Input to Output Delay tPLH, tPHL (Figure 4) Full 250 500 2000 ns tSKD Receiver Skew | tPLH - tPHL | (Figure 4) 25 - 60 - ns Receiver Enable to Output High tZH CL = 15pF, SW = GND, (Figure 5, Note 6) Full - 10 50 ns Receiver Enable to Output Low tZL CL = 15pF, SW = VCC, (Figure 5, Note 6) Full - 10 50 ns Receiver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 5) Full - 10 50 ns Receiver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 5) Full - 10 50 ns Full 250 - - kbps (Note 7) Full 50 120 600 ns Maximum Data Rate fMAX Time to Shutdown tSHDN Driver Enable from Shutdown to Output High tZH(SHDN) CL = 100pF, SW = GND, (Figure 3, Notes 7, 8) Full - 1000 2000 ns Driver Enable from Shutdown to Output Low tZL(SHDN) CL = 100pF, SW = VCC, (Figure 3, Notes 7, 8) Full - 1000 2000 ns 5 FN6051.6 ISL8487E, ISL81487L, ISL81487E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C, (Note 2) (Continued) TEMP (°C) MIN TYP MAX UNITS CL = 15pF, SW = GND, (Figure 5, Notes 7, 9) Full - 800 2500 ns CL = 15pF, SW = VCC, (Figure 5, Notes 7, 9) Full - 800 2500 ns tPLH, tPHL RDIFF = 54Ω, CL = 100pF, (Figure 2) Full 150 650 1200 ns tSKEW RDIFF = 54Ω, CL = 100pF, (Figure 2) Full - 160 600 ns tR, tF RDIFF = 54Ω, CL = 100pF, (Figure 2) Full 250 900 1200 ns tZH CL = 100pF, SW = GND, (Figure 3, Note 5) Full 100 1000 1500 ns PARAMETER SYMBOL Receiver Enable from Shutdown to Output High tZH(SHDN) Receiver Enable from Shutdown to Output Low tZL(SHDN) TEST CONDITIONS SWITCHING CHARACTERISTICS (ISL81487L) Driver Input to Output Delay Driver Output Skew Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low tZL CL = 100pF, SW = VCC, (Figure 3, Note 5) Full 100 1000 1500 ns Driver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 3) Full 150 750 1500 ns Driver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 3) Full 150 750 1500 ns Receiver Input to Output Delay tPLH, tPHL (Figure 4) Full 30 175 250 ns tSKD (Figure 4) 25 - 13 - ns Receiver Skew | tPLH - tPHL | Receiver Enable to Output High tZH CL = 15pF, SW = GND, (Figure 5, Note 6) Full - 10 50 ns Receiver Enable to Output Low tZL CL = 15pF, SW = VCC, (Figure 5, Note 6) Full - 10 50 ns Receiver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 5) Full - 10 50 ns Receiver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 5) Full - 10 50 ns Full 250 - - kbps Maximum Data Rate fMAX Time to Shutdown tSHDN (Note 7) Full 50 140 600 ns Driver Enable from Shutdown to Output High tZH(SHDN) CL = 100pF, SW = GND, (Figure 3, Notes 7, 8) Full - 1100 2000 ns Driver Enable from Shutdown to Output Low tZL(SHDN) CL = 100pF, SW = VCC, (Figure 3, Notes 7, 8) Full - 1000 2000 ns Receiver Enable from Shutdown to Output High tZH(SHDN) CL = 15pF, SW = GND, (Figure 5, Notes 7, 9) Full - 900 2000 ns Receiver Enable from Shutdown to Output Low tZL(SHDN) CL = 15pF, SW = VCC, (Figure 5, Notes 7, 9) Full - 900 2000 ns Human Body Model 25 - ±15 - kV 25 - >±7 - kV ESD PERFORMANCE RS-485 Pins (A/Y, B/Z) All Other Pins NOTES: 2. Currents into device pins are positive; currents out of device pins are negative. Voltages are referenced to ground unless otherwise specified. 3. Supply current specification is valid for loaded drivers when DE = 0V. 4. Applies to peak current. See “Typical Performance Curves” for more information. 5. When testing the ISL8487E and ISL81487L, keep RE = 0 to prevent the device from entering SHDN. 6. When testing the ISL8487E and ISL81487L, the RE signal high time must be short enough (typically <200ns) to prevent the device from entering SHDN. 7. The ISL8487E and ISL81487L are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See “Low-Power Shutdown Mode” section. 8. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN. 9. Set the RE signal high time >600ns to ensure that the device enters SHDN. 10. Devices meeting these limits are denoted as “1/8 unit load (1/8 UL)” transceivers. The RS-485 standard allows up to 32 Unit Loads on the bus, so there can be 256 1/8 UL devices on a bus. 6 FN6051.6 ISL8487E, ISL81487L, ISL81487E Test Circuits and Waveforms R DE VCC Z DI VOD D Y VOC R FIGURE 1. DRIVER VOD AND VOC 3V DI 1.5V 1.5V 0V tPLH tPHL VOH VCC CL = 100pF DE 50% OUT (Y) VOL Z DI tPHL RDIFF D Y CL = 100pF 50% tPLH VOH OUT (Z) 50% 50% VOL SIGNAL GENERATOR 90% DIFF OUT (Y - Z) +VOD 90% 10% 10% tR -VOD tF SKEW = |tPLH (Y or Z) - tPHL (Z or Y)| FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE DI SIGNAL GENERATOR Z 500Ω VCC D SW Y GND CL 3V DE NOTE 7 1.5V 1.5V 0V tZH, tZH(SHDN) PARAMETER OUTPUT RE DI SW CL (pF) tHZ Y/Z X 1/0 GND 15 tLZ Y/Z X 0/1 VCC 15 tZH Y/Z 0 (Note 5) 1/0 GND 100 tZL Y/Z 0 (Note 5) 0/1 VCC 100 tZH(SHDN) Y/Z 1 (Note 7) 1/0 GND 100 tZL(SHDN) Y/Z 1 (Note 7) OUTPUT HIGH NOTE 7 (SHDN) for ISL8487E and ISL81487L only. 0/1 VCC FIGURE 3A. TEST CIRCUIT tHZ VOH - 0.5V OUT (Y, Z) VOH 2.3V 0V tZL, tZL(SHDN) tLZ NOTE 7 VCC OUT (Y, Z) 2.3V OUTPUT LOW 100 VOL + 0.5V V OL FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES 7 FN6051.6 ISL8487E, ISL81487L, ISL81487E Test Circuits and Waveforms (Continued) RE +1.5V 3V 15pF B R A A RO 1.5V 1.5V 0V tPHL tPLH VCC SIGNAL GENERATOR 50% RO 50% 0V FIGURE 4A. TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS FIGURE 4. RECEIVER PROPAGATION DELAY RE B SIGNAL GENERATOR 1kΩ RO R VCC SW A GND NOTE 7 3V 15pF RE 1.5V 1.5V 0V tZH, tZH(SHDN) (SHDN) for ISL8487E and ISL81487L only. OUTPUT HIGH NOTE 7 PARAMETER DE A SW tHZ 0 +1.5V GND tLZ 0 -1.5V VCC tZH (Note 6) 0 +1.5V GND tZL, tZL(SHDN) tZL (Note 6) 0 -1.5V VCC NOTE 7 tZH(SHDN) (Note 7) 0 +1.5V GND RO tZL(SHDN) (Note 7) 0 -1.5V VCC FIGURE 5A. TEST CIRCUIT tHZ VOH - 0.5V RO VOH 1.5V 0V tLZ VCC 1.5V OUTPUT LOW VOL + 0.5V V OL FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER ENABLE AND DISABLE TIMES Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a pointto-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 spec requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000’, so the wide CMR is necessary to handle 8 ground potential differences, as well as voltages induced in the cable by external fields. Receiver Features These devices utilize a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is ±200mV, as required by the RS-422 and RS-485 specifications. Receiver input resistance of 96kΩ surpasses the RS-422 spec of 4kΩ, and is eight times the RS-485 “Unit Load (UL)” requirement of 12kΩ minimum. Thus, these products are known as “one-eighth UL” transceivers, and there can be up to 256 of these devices on a network while still complying with the RS-485 loading spec. Receiver inputs function with common mode voltages as great as ±7V outside the power supplies (i.e., +12V and -7V), making them ideal for long networks where induced voltages are a realistic concern. FN6051.6 ISL8487E, ISL81487L, ISL81487E All the receivers include a “fail-safe if open” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating). Receivers easily meet the data rates supported by the corresponding driver, and receiver outputs are three-statable via the active low RE input. Driver Features The RS-485/422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485), and at least 2V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width, and to minimize EMI. Driver outputs are three-statable via the active high DE input. The ISL8487E and ISL81487L driver outputs are slew rate limited to minimize EMI, and to minimize reflections in unterminated or improperly terminated networks. Data rate on these slew rate limited versions is a maximum of 250kbps. ISL81487E drivers are not limited, so faster output transition times allow data rates of at least 5Mbps. Data Rate, Cables, and Terminations RS-485/422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 5Mbps are limited to lengths less than a few hundred feet, while the 250kbps versions can operate at full data rates with lengths in excess of 1000’. Twisted pair is the cable of choice for RS-485/422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. To minimize reflections, proper termination is imperative when using the 5Mbps device. Short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 spec, even at the common mode voltage range extremes. Additionally, these devices utilize a foldback circuit which reduces the short circuit current, and thus the power dissipation, whenever the contending voltage exceeds either supply. In the event of a major short circuit condition, these devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops about 15 degrees. If the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. Low Power Shutdown Mode (Excluding ISL81487E) These CMOS transceivers all use a fraction of the power required by their bipolar counterparts, but the ISL8487E and ISL81487L include a shutdown feature that reduces the already low quiescent ICC to a 500nA trickle. They enter shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 50ns guarantees that shutdown is not entered. Note that receiver and driver enable times increase when enabling from shutdown. Refer to Notes 5-9, at the end of the Electrical Specification table, for more information. ESD Protection All pins on these interface devices include class 3 Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±15kV HBM. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. Built-In Driver Overload Protection As stated previously, the RS-485 spec requires that drivers survive worst case bus contentions undamaged. These devices meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. 9 FN6051.6 ISL8487E, ISL81487L, ISL81487E Human Body Model Testing As the name implies, this test method emulates the ESD event delivered to an IC during human handling. The tester delivers the charge stored on a 100pF capacitor through a 1.5kΩ current limiting resistor into the pin under test. The The RS-485 pin survivability on this high ESD family has been characterized to be in excess of ±15kV, for discharges to GND. VCC = 5V, TA = 25°C, ISL8487E, ISL81487L and ISL81487E; Unless Otherwise Specified 90 3.6 80 3.4 DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) Typical Performance Curves HBM method determines an IC’s ability to withstand the ESD events typically present during handling and manufacturing. 70 60 50 40 30 20 10 0 0 1 2 3 4 3.2 RDIFF = 100Ω 3 2.8 2.6 2.4 RDIFF = 54Ω 2.2 2 -40 5 -25 DIFFERENTIAL OUTPUT VOLTAGE (V) FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE 25 50 75 85 FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 400 160 ISL81487E, DE = VCC, RE = X 140 ISL81487E 120 350 Y OR Z = LOW 100 80 ISL81487E, DE = GND, RE = X ISL8487E, ISL81487L 300 60 40 ICC (µA) OUTPUT CURRENT (mA) 0 TEMPERATURE (°C) 20 0 -20 200 Y OR Z = HIGH -40 250 ISL8487E, ISL81487L, DE = VCC, RE = X -60 ISL81487E -80 ISL8487E, ISL81487L -100 150 -120 100 -40 -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) ISL8487E, ISL81487L, DE = GND, RE = GND 8 10 12 FIGURE 8. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE 10 -25 0 25 TEMPERATURE (°C) 50 75 85 FIGURE 9. SUPPLY CURRENT vs TEMPERATURE FN6051.6 ISL8487E, ISL81487L, ISL81487E Typical Performance Curves VCC = 5V, TA = 25°C, ISL8487E, ISL81487L and ISL81487E; Unless Otherwise Specified (Continued) 250 750 200 tPLHY tPLHZ 650 |tPLHY - tPHLZ| 150 600 SKEW (ns) PROPAGATION DELAY (ns) 700 tPHLY 550 tPHLZ |tPHLY - tPLHZ| 100 50 500 |CROSS PT. OF Y↑ & Z↓ - CROSS PT. OF Y↓ & Z↑| 450 -40 -25 0 25 TEMPERATURE (°C) 50 0 -40 85 75 FIGURE 10. DRIVER PROPAGATION DELAY vs TEMPERATURE (ISL8487E, ISL81487L) -25 0 25 TEMPERATURE (°C) 50 85 75 FIGURE 11. DRIVER SKEW vs TEMPERATURE (ISL8487E, ISL81487L) 30 5 4 |tPHLY - tPLHZ| 26 3 24 tPLHY 22 tPHLZ tPLHZ 20 |tPLHY - tPHLZ| SKEW (ns) 2 1 18 |CROSSING PT. OF Y↑ & Z↓ - CROSSING PT. OF Y↓ & Z↑| tPHLY 16 -40 -25 0 25 50 0 -40 85 75 -25 TEMPERATURE (°C) RO 0 5 RO 0 ISL81487L ISL8487E 4 3 2 RECEIVER OUTPUT (V) 5 0 DRIVER INPUT (V) 5 RDIFF = 54Ω, CL = 100pF B/Z A/Y 1 0 TIME (400ns/DIV) FIGURE 14. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL8487E, ISL81487L) 11 25 50 85 75 FIGURE 13. DRIVER SKEW vs TEMPERATURE (ISL81487E) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) FIGURE 12. DRIVER PROPAGATION DELAY vs TEMPERATURE (ISL81487E) DI 0 TEMPERATURE (°C) RDIFF = 54Ω, CL = 100pF DI 5 RO 0 5 RO 0 ISL81487L 5 0 DRIVER INPUT (V) PROPAGATION DELAY (ns) 28 ISL8487E 4 3 2 A/Y B/Z 1 0 TIME (400ns/DIV) FIGURE 15. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL8487E, ISL81487L) FN6051.6 ISL8487E, ISL81487L, ISL81487E 0 5 RO 0 4 3 2 B/Z A/Y 1 0 TIME (20ns/DIV) FIGURE 16. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL81487E) RDIFF = 54Ω, CL = 100pF DI 5 0 5 RO 0 DRIVER INPUT (V) DI 5 RECEIVER OUTPUT (V) RDIFF = 54Ω, CL = 100pF DRIVER INPUT (V) VCC = 5V, TA = 25°C, ISL8487E, ISL81487L and ISL81487E; Unless Otherwise Specified (Continued) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves 4 3 2 A/Y B/Z 1 0 TIME (20ns/DIV) FIGURE 17. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL81487E) Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 518 PROCESS: Si Gate CMOS 12 FN6051.6 ISL8487E, ISL81487L, ISL81487E Dual-In-Line Plastic Packages (PDIP) E8.3 (JEDEC MS-001-BA ISSUE D) N 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 -B- -AD E BASE PLANE -C- SEATING PLANE A2 A L D1 e B1 D1 A1 eC B 0.010 (0.25) M C A B S MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.15 1.77 8, 10 eA C 0.008 0.014 0.204 C D 0.355 0.400 9.01 D1 0.005 - 0.13 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. e 0.100 BSC 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. eA 0.300 BSC 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. eB - L 0.115 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . N 8 0.355 10.16 5 2.54 BSC - 7.62 BSC 6 0.430 - 0.150 2.93 10.92 3.81 8 7 4 9 Rev. 0 12/93 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 13 FN6051.6 ISL8487E, ISL81487L, ISL81487E Small Outline Plastic Packages (SOIC) M8.15 (JEDEC MS-012-AA ISSUE C) N INDEX AREA 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M MIN MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.1890 0.1968 4.80 5.00 3 E 0.1497 0.1574 3.80 4.00 4 e α B S 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 N α NOTES: MILLIMETERS 8 0° 1.27 8 8° 0° 6 7 8° 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. Rev. 1 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 14 FN6051.6