Freescale K20P144M120SF3 K20 sub-family data sheet Datasheet

Freescale Semiconductor
Data Sheet: Advance Information
Document Number: K20P144M120SF3
Rev. 3, 2/2012
K20P144M120SF3
K20 Sub-Family Data Sheet
Supports the following:
MK20FX512VLQ12,
MK20FN1M0VLQ12,
MK20FX512VMD12,
MK20FN1M0VMD12
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 120 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 1024 KB program flash memory on nonFlexMemory devices
– Up to 512 KB program flash memory on
FlexMemory devices
– Up to 512 KB FlexNVM on FlexMemory devices
– 16 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
– NAND flash controller interface
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 32-channel DMA controller, supporting up to 128
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
• Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
• Analog modules
– Four 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– Two 12-bit DACs
– Four analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Two 8-channel motor control/general purpose/PWM
timers
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
This document contains information on a new product. Specifications and
information herein are subject to change without notice.
© 2012 Freescale Semiconductor, Inc.
Preliminary
• Communication interfaces
– USB high-/full-/low-speed On-the-Go controller with ULPI interface
– USB full-/low-speed On-the-Go controller with on-chip transceiver
– Two Controller Area Network (CAN) modules
– Three SPI modules
– Two I2C modules
– Six UART modules
– Secure Digital host controller (SDHC)
– Two I2S modules
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
2
Preliminary
Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................5
5.4.2
Thermal attributes...............................................23
1.1 Determining valid orderable parts......................................5
6 Peripheral operating requirements and behaviors....................24
2 Part identification......................................................................5
6.1 Core modules....................................................................24
2.1 Description.........................................................................5
6.1.1
Debug trace timing specifications.......................24
2.2 Format...............................................................................5
6.1.2
JTAG electricals..................................................25
2.3 Fields.................................................................................5
6.2 System modules................................................................28
2.4 Example............................................................................6
6.3 Clock modules...................................................................28
3 Terminology and guidelines......................................................6
6.3.1
MCG specifications.............................................28
3.1 Definition: Operating requirement......................................6
6.3.2
Oscillator electrical specifications.......................30
3.2 Definition: Operating behavior...........................................6
6.3.3
32kHz Oscillator Electrical Characteristics.........32
3.3 Definition: Attribute............................................................7
6.4 Memories and memory interfaces.....................................33
3.4 Definition: Rating...............................................................7
6.4.1
Flash (FTFE) electrical specifications.................33
3.5 Result of exceeding a rating..............................................8
6.4.2
EzPort Switching Specifications.........................36
3.6 Relationship between ratings and operating
6.4.3
NFC specifications..............................................37
6.4.4
Flexbus Switching Specifications........................40
requirements......................................................................8
3.7 Guidelines for ratings and operating requirements............8
6.5 Security and integrity modules..........................................43
3.8 Definition: Typical value.....................................................9
6.6 Analog...............................................................................43
3.9 Typical value conditions....................................................10
6.6.1
ADC electrical specifications..............................43
4 Ratings......................................................................................10
6.6.2
CMP and 6-bit DAC electrical specifications......52
4.1 Thermal handling ratings...................................................10
6.6.3
12-bit DAC electrical characteristics...................54
4.2 Moisture handling ratings..................................................11
6.6.4
Voltage reference electrical specifications..........57
4.3 ESD handling ratings.........................................................11
6.7 Timers................................................................................58
4.4 Voltage and current operating ratings...............................11
6.8 Communication interfaces.................................................58
5 General.....................................................................................12
6.8.1
USB electrical specifications...............................58
5.1 AC electrical characteristics..............................................12
6.8.2
USB DCD electrical specifications......................59
5.2 Nonswitching electrical specifications...............................12
6.8.3
USB VREG electrical specifications...................59
5.2.1
Voltage and current operating requirements......12
6.8.4
ULPI timing specifications...................................60
5.2.2
LVD and POR operating requirements...............13
6.8.5
CAN switching specifications..............................61
5.2.3
Voltage and current operating behaviors............14
6.8.6
DSPI switching specifications (limited voltage
5.2.4
Power mode transition operating behaviors.......15
5.2.5
Power consumption operating behaviors............16
5.2.6
EMC radiated emissions operating behaviors....20
5.2.7
Designing with radiated emissions in mind.........21
6.8.8
I2C switching specifications................................64
5.2.8
Capacitance attributes........................................21
6.8.9
UART switching specifications............................65
6.8.10
SDHC specifications...........................................65
6.8.11
I2S/SAI Switching Specifications........................66
range).................................................................61
6.8.7
range).................................................................63
5.3 Switching specifications.....................................................21
5.3.1
Device clock specifications.................................21
5.3.2
General switching specifications.........................22
6.9 Human-machine interfaces (HMI)......................................68
5.4 Thermal specifications.......................................................23
5.4.1
Thermal operating requirements.........................23
DSPI switching specifications (full voltage
6.9.1
TSI electrical specifications................................68
7 Dimensions...............................................................................69
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
3
7.1 Obtaining package dimensions.........................................69
8.2 K20 Pinouts.......................................................................76
8 Pinout........................................................................................69
9 Revision History........................................................................78
8.1 K20 Signal Multiplexing and Pin Assignments..................69
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
4
Preliminary
Freescale Semiconductor, Inc.
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to http://www.freescale.com and perform a part number
search for the following device numbers: PK20 and MK20.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Description
Values
Q
Qualification status
• M = Fully qualified, general market flow
• P = Prequalification
K##
Kinetis family
• K20
A
Key attribute
• D = Cortex-M4 w/ DSP
• F = Cortex-M4 w/ DSP and FPU
M
Flash memory type
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
5
Terminology and guidelines
Field
Description
Values
FFF
Program flash memory size
•
•
•
•
•
•
32 = 32 KB
64 = 64 KB
128 = 128 KB
256 = 256 KB
512 = 512 KB
1M0 = 1 MB
T
Temperature range (°C)
• V = –40 to 105
• C = –40 to 85
PP
Package identifier
• LQ = 144 LQFP (20 mm x 20 mm)
• MD = 144 MAPBGA (13 mm x 13 mm)
CC
Maximum CPU frequency (MHz)
• 12 = 120 MHz
N
Packaging type
• R = Tape and reel
• (Blank) = Trays
2.4 Example
This is an example part number:
MK20FN1M0VLQ12
3 Terminology and guidelines
3.1 Definition: Operating requirement
An operating requirement is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
3.1.1 Example
This is an example of an operating requirement, which you must meet for the
accompanying operating behaviors to be guaranteed:
Symbol
VDD
Description
1.0 V core supply
voltage
Min.
0.9
Max.
1.1
Unit
V
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
6
Preliminary
Freescale Semiconductor, Inc.
Terminology and guidelines
3.2 Definition: Operating behavior
An operating behavior is a specified value or range of values for a technical
characteristic that are guaranteed during operation if you meet the operating requirements
and any other specified conditions.
3.2.1 Example
This is an example of an operating behavior, which is guaranteed if you meet the
accompanying operating requirements:
Symbol
IWP
Description
Min.
Digital I/O weak pullup/ 10
pulldown current
Max.
130
Unit
µA
3.3 Definition: Attribute
An attribute is a specified value or range of values for a technical characteristic that are
guaranteed, regardless of whether you meet the operating requirements.
3.3.1 Example
This is an example of an attribute:
Symbol
CIN_D
Description
Input capacitance:
digital pins
Min.
—
Max.
7
Unit
pF
3.4 Definition: Rating
A rating is a minimum or maximum value of a technical characteristic that, if exceeded,
may cause permanent chip failure:
• Operating ratings apply during operation of the chip.
• Handling ratings apply when the chip is not powered.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
7
Terminology and guidelines
3.4.1 Example
This is an example of an operating rating:
Symbol
VDD
Description
Min.
1.0 V core supply
voltage
Max.
–0.3
Unit
1.2
V
3.5 Result of exceeding a rating
Failures in time (ppm)
40
30
The likelihood of permanent chip failure increases rapidly as
soon as a characteristic begins to exceed one of its operating ratings.
20
10
0
Operating rating
Measured characteristic
3.6 Relationship between ratings and operating requirements
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- No permanent failure
- Possible decreased life
- Possible incorrect operation
- Probable permanent failure
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- No permanent failure
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–∞
3.7 Guidelines for ratings and operating requirements
Follow these guidelines for ratings and operating requirements:
• Never exceed any of the chip’s ratings.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
8
Preliminary
Freescale Semiconductor, Inc.
Terminology and guidelines
• During normal operation, don’t exceed any of the chip’s operating requirements.
• If you must exceed an operating requirement at times other than during normal
operation (for example, during power sequencing), limit the duration as much as
possible.
3.8 Definition: Typical value
A typical value is a specified value for a technical characteristic that:
• Lies within the range of values specified by the operating behavior
• Given the typical manufacturing process, is representative of that characteristic
during operation when you meet the typical-value conditions or other specified
conditions
Typical values are provided as design guidelines and are neither tested nor guaranteed.
3.8.1 Example 1
This is an example of an operating behavior that includes a typical value:
Symbol
IWP
Description
Digital I/O weak
pullup/pulldown
current
Min.
10
Typ.
70
Max.
130
Unit
µA
3.8.2 Example 2
This is an example of a chart that shows typical values for various voltage and
temperature conditions:
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
9
Ratings
5000
4500
4000
TJ
IDD_STOP (μA)
3500
150 °C
3000
105 °C
2500
25 °C
2000
–40 °C
1500
1000
500
0
0.90
0.95
1.05
1.00
1.10
VDD (V)
3.9 Typical value conditions
Typical values assume you meet the following conditions (or other conditions as
specified):
Symbol
Description
Value
Unit
TA
Ambient temperature
25
°C
VDD
3.3 V supply voltage
3.3
V
4 Ratings
4.1 Thermal handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
TSTG
Storage temperature
–55
150
°C
1
TSDR
Solder temperature, lead-free
—
260
°C
2
1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
10
Preliminary
Freescale Semiconductor, Inc.
Ratings
4.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
Max.
Unit
Notes
—
3
—
1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.3 ESD handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
VHBM
Electrostatic discharge voltage, human body model
-2000
+2000
V
1
VCDM
Electrostatic discharge voltage, charged-device model
-500
+500
V
2
Latch-up current at ambient temperature of 105°C
-100
+100
mA
ILAT
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
4.4 Voltage and current operating ratings
Symbol
Description
Min.
Max.
Unit
VDD
Digital supply voltage1
–0.3
3.8
V
IDD
Digital supply current
—
300
mA
VDIO
Digital input voltage (except RESET, EXTAL0/XTAL0, and
EXTAL1/XTAL1) 2
–0.3
5.5
V
VAIO
Analog3, RESET, EXTAL0/XTAL0, and EXTAL1/XTAL1 input
voltage
–0.3
VDD + 0.3
V
ID
Instantaneous maximum current single pin limit (applies to all
digital pins except pins)
–25
25
mA
VDDA
Analog supply voltage
VDD – 0.3
VDD + 0.3
V
VUSB_DP
USB_DP input voltage
–0.3
3.63
V
VUSB_DM
USB_DM input voltage
–0.3
3.63
V
VREGIN
USB regulator input
–0.3
6.0
V
RTC battery supply voltage
–0.3
3.8
V
VBAT
1. It applies for all port pins.
2. It covers digital pins.
3. Analog pins are defined as pins that do not have an associated general purpose I/O port function.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
11
General
5 General
5.1 AC electrical characteristics
Unless otherwise specified, propagation delays are measured from the 50% to the 50%
point, and rise and fall times are measured at the 20% and 80% points, as shown in the
following figure.
Figure 1. Input signal measurement reference
All digital I/O switching characteristics assume:
1. output pins
• have CL=30pF loads,
• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
• are configured for high drive strength (PORTx_PCRn[DSE]=1)
2. input pins
• have their passive filter disabled (PORTx_PCRn[PFE]=0)
5.2 Nonswitching electrical specifications
5.2.1 Voltage and current operating requirements
Table 1. Voltage and current operating requirements
Symbol
Description
Min.
Max.
Unit
VDD
Supply voltage
1.71
3.6
V
VDDA
Analog supply voltage
1.71
3.6
V
VDD – VDDA VDD-to-VDDA differential voltage
–0.1
0.1
V
VSS – VSSA VSS-to-VSSA differential voltage
–0.1
0.1
V
1.71
3.6
V
VBAT
RTC battery supply voltage
Notes
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
12
Preliminary
Freescale Semiconductor, Inc.
General
Table 1. Voltage and current operating requirements (continued)
Symbol
Min.
Max.
Unit
• 2.7 V ≤ VDD ≤ 3.6 V
0.7 × VDD
—
V
• 1.7 V ≤ VDD ≤ 2.7 V
0.75 × VDD
—
V
• 2.7 V ≤ VDD ≤ 3.6 V
—
0.35 × VDD
V
• 1.7 V ≤ VDD ≤ 2.7 V
—
0.3 × VDD
V
VHYS
Input hysteresis (digital pins)
0.06 × VDD
—
V
IICDIO
Digital pin negative DC injection current — single pin
-5
—
mA
VIH
VIL
Description
Input high voltage (digital pins)
Input low voltage (digital pins)
1
• VIN < VSS-0.3V
IICAIO
IICcont
3
Analog2, EXTAL0/XTAL0, and EXTAL1/XTAL1 pin DC
injection current — single pin
mA
• VIN < VSS-0.3V (Negative current injection)
-5
—
• VIN > VDD+0.3V (Positive current injection)
—
+5
-25
—
—
+25
1.2
—
V
VPOR_VBAT
—
V
Contiguous pin DC injection current —regional limit,
includes sum of negative injection currents or sum of
positive injection currents of 16 contiguous pins
• Negative current injection
• Positive current injection
VRAM
VRFVBAT
Notes
VDD voltage required to retain RAM
VBAT voltage required to retain the VBAT register file
mA
1. All 5 V tolerant digital I/O pins are internally clamped to VSS through a ESD protection diode. There is no diode connection
to VDD. If VIN greater than VDIO_MIN (=VSS-0.3V) is observed, then there is no need to provide current limiting resistors at
the pads. If this limit cannot be observed then a current limiting resistor is required. The negative DC injection current
limiting resistor is calculated as R=(VDIO_MIN-VIN)/|IIC|.
2. Analog pins are defined as pins that do not have an associated general purpose I/O port function.
3. All analog pins are internally clamped to VSS and VDD through ESD protection diodes. If VIN is greater than VAIO_MIN
(=VSS-0.3V) and VIN is less than VAIO_MAX(=VDD+0.3V) is observed, then there is no need to provide current limiting
resistors at the pads. If these limits cannot be observed then a current limiting resistor is required. The negative DC
injection current limiting resistor is calculated as R=(VAIO_MIN-VIN)/|IIC|. The positive injection current limiting resistor is
calcualted as R=(VIN-VAIO_MAX)/|IIC|. Select the larger of these two calculated resistances.
5.2.2 LVD and POR operating requirements
Table 2. LVD and POR operating requirements
Symbol
VPOR
Description
Min.
Typ.
Max.
Unit
Falling VDD POR detect voltage
0.8
1.1
1.5
V
Notes
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
13
General
Table 2. LVD and POR operating requirements (continued)
Symbol
VLVDH
Description
Min.
Typ.
Max.
Unit
Falling low-voltage detect threshold — high
range (LVDV=01)
2.48
2.56
2.64
V
Low-voltage warning thresholds — high range
1
VLVW1H
• Level 1 falling (LVWV=00)
2.62
2.70
2.78
V
VLVW2H
• Level 2 falling (LVWV=01)
2.72
2.80
2.88
V
VLVW3H
• Level 3 falling (LVWV=10)
2.82
2.90
2.98
V
VLVW4H
• Level 4 falling (LVWV=11)
2.92
3.00
3.08
V
—
±80
—
mV
1.54
1.60
1.66
V
VHYSH
Low-voltage inhibit reset/recover hysteresis —
high range
VLVDL
Falling low-voltage detect threshold — low range
(LVDV=00)
Low-voltage warning thresholds — low range
1
VLVW1L
• Level 1 falling (LVWV=00)
1.74
1.80
1.86
V
VLVW2L
• Level 2 falling (LVWV=01)
1.84
1.90
1.96
V
VLVW3L
• Level 3 falling (LVWV=10)
1.94
2.00
2.06
V
VLVW4L
• Level 4 falling (LVWV=11)
2.04
2.10
2.16
V
—
±60
—
mV
VHYSL
Low-voltage inhibit reset/recover hysteresis —
low range
Notes
VBG
Bandgap voltage reference
0.97
1.00
1.03
V
tLPO
Internal low power oscillator period
900
1000
1100
μs
factory trimmed
1. Rising thresholds are falling threshold + hysteresis voltage
Table 3. VBAT power operating requirements
Symbol
Description
VPOR_VBAT Falling VBAT supply POR detect voltage
Min.
Typ.
Max.
Unit
0.8
1.1
1.5
V
Notes
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
14
Preliminary
Freescale Semiconductor, Inc.
General
5.2.3 Voltage and current operating behaviors
Table 4. Voltage and current operating behaviors
Symbol
Min.
Max.
Unit
• 2.7 V ≤ VDD ≤ 3.6 V, IOH = -9mA
VDD – 0.5
—
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOH = -3mA
VDD – 0.5
—
V
• 2.7 V ≤ VDD ≤ 3.6 V, IOH = -2mA
VDD – 0.5
—
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOH = -0.6mA
VDD – 0.5
—
V
Output high current total for all ports
—
100
mA
Output high current total for fast digital ports
—
100
mA
• 2.7 V ≤ VDD ≤ 3.6 V, IOL = 9mA
—
0.5
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOL = 3mA
—
0.5
V
• 2.7 V ≤ VDD ≤ 3.6 V, IOL = 2mA
—
0.5
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOL = 0.6mA
—
0.5
V
Output low current total for all ports
—
TBD
mA
Output low current total for fast digital ports
—
TBD
mA
IIN
Input leakage current (per pin) for full temperature
range
—
1
μA
1
IIN
Input leakage current (per pin) at 25°C
—
0.025
μA
1
IOZ
Hi-Z (off-state) leakage current (per pin)
—
1
μA
RPU
Internal pullup resistors
20
50
kΩ
2
RPD
Internal pulldown resistors
20
50
kΩ
3
VOH
Description
Notes
Output high voltage — high drive strength
Output high voltage — low drive strength
IOHT
IOHT_io60
VOL
Output low voltage — high drive strength
Output low voltage — low drive strength
IOLT
IOLT_io60
1. Measured at VDD=3.6V
2. Measured at VDD supply voltage = VDD min and Vinput = VSS
3. Measured at VDD supply voltage = VDD min and Vinput = VDD
5.2.4 Power mode transition operating behaviors
All specifications except tPOR, and VLLSx→RUN recovery times in the following table
assume this clock configuration:
• CPU and system clocks = FEI 100 MHz
• Bus clock = 50 MHz
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
15
General
• FlexBus clock = 50 MHz
• Flash clock = 25 MHz
Table 5. Power mode transition operating behaviors
Symbol
tPOR
Description
After a POR event, amount of time from the point VDD
reaches 1.71 V to execution of the first instruction
across the operating temperature range of the chip.
• VLLS1 → RUN
• VLLS2 → RUN
• VLLS3 → RUN
• LLS → RUN
• VLPS → RUN
• STOP → RUN
Min.
Max.
Unit
Notes
—
300
μs
1
—
126
μs
—
82
μs
—
82
μs
—
5.0
μs
—
TBD
μs
—
TBD
μs
1. Normal boot (FTFE_FOPT[LPBOOT]=1)
5.2.5 Power consumption operating behaviors
Table 6. Power consumption operating behaviors
Symbol
IDDA
IDD_RUN
Description
Min.
Typ.
Max.
Unit
Notes
Analog supply current
—
—
See note
mA
1
Run mode current — all peripheral clocks
disabled, code executing from flash
—
65
TBD
mA
—
65
TBD
mA
—
95
TBD
mA
—
95
TBD
mA
2
• @ 1.8V
• @ 3.0V
IDD_RUN
Run mode current — all peripheral clocks
enabled, code executing from flash
3
• @ 1.8V
• @ 3.0V
IDD_WAIT
Wait mode high frequency current at 3.0 V — all
peripheral clocks disabled
—
37
TBD
mA
2
IDD_WAIT
Wait mode reduced frequency current at 3.0 V
— all peripheral clocks disabled
—
21
TBD
mA
4
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
16
Preliminary
Freescale Semiconductor, Inc.
General
Table 6. Power consumption operating behaviors (continued)
Symbol
Description
IDD_STOP
Stop mode current at 3.0 V
• @ –40 to 25°C
• @ 70°C
Min.
Typ.
Max.
Unit
—
TBD
TBD
mA
—
TBD
TBD
mA
—
TBD
TBD
mA
Notes
• @ 105°C
IDD_VLPR
Very-low-power run mode current at 3.0 V — all
peripheral clocks disabled
—
2.3
TBD
mA
5
IDD_VLPR
Very-low-power run mode current at 3.0 V — all
peripheral clocks enabled
—
3.1
TBD
mA
6
IDD_VLPW
Very-low-power wait mode current at 3.0 V
—
1.8
TBD
mA
7
IDD_VLPS
Very-low-power stop mode current at 3.0 V
—
200
TBD
μA
—
TBD
TBD
μA
—
TBD
TBD
μA
—
200
TBD
μA
—
TBD
TBD
μA
—
TBD
TBD
μA
—
6.5
TBD
μA
—
37.4
TBD
μA
—
148.3
TBD
μA
—
3.4
TBD
μA
—
13.4
TBD
μA
—
58.5
TBD
μA
—
2.9
TBD
μA
—
9.8
TBD
μA
—
44.7
TBD
μA
—
0.91
1.1
μA
• @ –40 to 25°C
—
1.5
1.85
μA
• @ 70°C
—
4.3
4.3
μA
• @ –40 to 25°C
• @ 70°C
• @ 105°C
IDD_LLS
Low leakage stop mode current at 3.0 V
• @ –40 to 25°C
• @ 70°C
8
• @ 105°C
IDD_VLLS3
Very low-leakage stop mode 3 current at 3.0 V
• @ –40 to 25°C
• @ 70°C
#newreference/
llsramg
• @ 105°C
IDD_VLLS2
Very low-leakage stop mode 2 current at 3.0 V
• @ –40 to 25°C
• @ 70°C
• @ 105°C
IDD_VLLS1
Very low-leakage stop mode 1 current at 3.0 V
• @ –40 to 25°C
• @ 70°C
• @ 105°C
IDD_VBAT
Average current when CPU is not accessing
RTC registers at 3.0 V
9
• @ 105°C
1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See
each module's specification for its supply current.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
17
General
2. 120 MHz core and system clock, 60 MHz bus, 30 MHz FlexBus clock, and 20 MHz flash clock. MCG configured for PEE
mode. All peripheral clocks disabled.
3. 120 MHz core and system clock, 60 MHz bus, 50 MHz FlexBus clock, and 20 MHz flash clock. MCG configured for PEE
mode. All peripheral clocks enabled, but peripherals are not in active operation.
4. 25 MHz core and system clock, 25 MHz bus clock, and 12.5 MHz FlexBus and flash clock. MCG configured for FEI mode.
5. 4 MHz core, system, 2 MHz FlexBus, and 2 MHz bus clock and 1 MHz flash clock. MCG configured for BLPE mode. All
peripheral clocks disabled.
6. 4 MHz core, system, 2 MHz FlexBus, and 2 MHz bus clock and 1 MHz flash clock. MCG configured for BLPE mode. All
peripheral clocks disabled.
7. 4 MHz core, system, 2 MHz FlexBus, and 2 MHz bus clock and 1 MHz flash clock. MCG configured for BLPE mode. All
peripheral clocks disabled.
8. Data reflects devices with 128 KB of RAM. For devices with 64 KB of RAM, power consumption is reduced by 2 μA. For
devices with 32 KB of RAM, power consumption is reduced by 3 μA.
9. Includes 32kHz oscillator current and RTC operation.
5.2.5.1
Diagram: Typical IDD_RUN operating behavior
The following data was measured under these conditions:
• MCG in FBE mode for 50 MHz and lower frequencies. MCG in FEE mode at greater
than 50 MHz frequencies. MCG in PEE mode is greater than 100 MHz frequencies.
• USB regulator disabled
• No GPIOs toggled
• Code execution from flash with cache enabled
• For the ALLOFF curve, all peripheral clocks are disabled except FTFL
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
18
Preliminary
Freescale Semiconductor, Inc.
General
Figure 2. Run mode supply current vs. core frequency
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
19
General
Figure 3. VLPR mode supply current vs. core frequency
5.2.6 EMC radiated emissions operating behaviors
Table 7. EMC radiated emissions operating behaviors for 256MAPBGA
Symbol
Description
Frequency
band (MHz)
Typ.
Unit
VRE1
Radiated emissions voltage, band 1
0.15–50
TBD
dBμV
VRE2
Radiated emissions voltage, band 2
50–150
TBD
dBμV
VRE3
Radiated emissions voltage, band 3
150–500
TBD
dBμV
VRE4
Radiated emissions voltage, band 4
500–1000
TBD
dBμV
IEC level
0.15–1000
K
—
VRE_IEC
Notes
1,
2
2, 3
1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150
kHz to 1 GHz Part 1: General Conditions and Definitions and IEC Standard 61967-2, Integrated Circuits - Measurement of
Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method. Measurements were made while the microcontroller was running basic application code. The reported
emission level is the value of the maximum measured emission, rounded up to the next whole number, from among the
measured orientations in each frequency range.
2. VDD = 3.3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 96 MHz, fBUS = 48 MHz
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
20
Preliminary
Freescale Semiconductor, Inc.
General
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method
5.2.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
1. Go to http://www.freescale.com.
2. Perform a keyword search for “EMC design.”
5.2.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol
Description
Min.
Max.
Unit
CIN_A
Input capacitance: analog pins
—
7
pF
CIN_D
Input capacitance: digital pins
—
7
pF
Input capacitance: fast digital pins
—
9
pF
CIN_D_io60
5.3 Switching specifications
5.3.1 Device clock specifications
Table 9. Device clock specifications
Symbol
Description
Min.
Max.
Unit
System and core clock
—
120
MHz
fSYS_USBFS
System and core clock when Full Speed USB in
operation
20
—
MHz
fSYS_USBHS
System and core clock when High Speed USB in
operation
60
—
MHz
Bus clock
—
60
MHz
FlexBus clock
—
50
MHz
fFLASH
Flash clock
—
25
MHz
fLPTMR
LPTMR clock
—
25
MHz
—
4
MHz
Notes
Normal run mode
fSYS
fBUS
FB_CLK
VLPR mode1
fSYS
System and core clock
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
21
General
Table 9. Device clock specifications (continued)
Symbol
Min.
Max.
Unit
Bus clock
—
4
MHz
FlexBus clock
—
4
MHz
fFLASH
Flash clock
—
1
MHz
fLPTMR
LPTMR clock
—
4
MHz
fBUS
FB_CLK
Description
Notes
1. The frequency limitations in VLPR mode here override any frequency specification listed in the timing specification for any
other module.
5.3.2 General switching specifications
These general purpose specifications apply to all signals configured for GPIO, UART,
CAN, CMT, and I2C signals.
Table 10. General switching specifications
Symbol
tio50
Description
Min.
Max.
Unit
Notes
GPIO pin interrupt pulse width (digital glitch filter
disabled) — Synchronous path
1.5
—
Bus clock
cycles
1
GPIO pin interrupt pulse width (digital glitch filter
disabled, analog filter enabled) — Asynchronous path
100
—
ns
2
GPIO pin interrupt pulse width (digital glitch filter
disabled, analog filter disabled) — Asynchronous path
16
—
ns
2
External reset pulse width (digital glitch filter disabled)
100
—
ns
2
Mode select (EZP_CS) hold time after reset
deassertion
2
—
Bus clock
cycles
Port rise and fall time (high drive strength)
—
TBD
ns
3
—
TBD
ns
4
—
TBD
ns
3
—
TBD
ns
4
—
TBD
ns
3
—
TBD
ns
4
—
TBD
ns
3
—
TBD
ns
4
• Slew disabled
• Slew enabled
tio50
Port rise and fall time (low drive strength)
• Slew disabled
• Slew enabled
tio60
Port rise and fall time (high drive strength)
• Slew disabled
• Slew enabled
tio60
Port rise and fall time (low drive strength)
• Slew disabled
• Slew enabled
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
22
Preliminary
Freescale Semiconductor, Inc.
General
Table 10. General switching specifications (continued)
Symbol
ttamper
Description
Min.
Max.
Unit
Notes
—
TBD
ns
5
—
TBD
ns
6
—
TBD
ns
7
—
TBD
ns
8
Port rise and fall time (high drive strength)
• Slew disabled
• Slew enabled
ttamper
Port rise and fall time (low drive strength)
• Slew disabled
• Slew enabled
1.
2.
3.
4.
5.
6.
7.
8.
The greater synchronous and asynchronous timing must be met.
This is the shortest pulse that is guaranteed to be recognized.
25pF load
15pF load
75pF load
15pF load
75pF load
15pF load
5.4 Thermal specifications
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
105
°C
5.4.2 Thermal attributes
Board type
Symbol
Description
144 LQFP
Single-layer
(1s)
RθJA
Thermal
45
resistance,
junction to
ambient (natural
convection)
Four-layer
(2s2p)
RθJA
Thermal
36
resistance,
junction to
ambient (natural
convection)
144
MAPBGA
Unit
Notes
50
°C/W
1
30
°C/W
1
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
23
Peripheral operating requirements and behaviors
Board type
Symbol
Description
Unit
Notes
Single-layer
(1s)
RθJMA
Thermal
36
resistance,
junction to
ambient (200 ft./
min. air speed)
41
°C/W
1
Four-layer
(2s2p)
RθJMA
Thermal
30
resistance,
junction to
ambient (200 ft./
min. air speed)
27
°C/W
1
—
RθJB
Thermal
resistance,
junction to
board
24
17
°C/W
2
—
RθJC
Thermal
resistance,
junction to case
9
10
°C/W
3
—
ΨJT
Thermal
2
characterization
parameter,
junction to
package top
outside center
(natural
convection)
2
°C/W
4
1.
2.
3.
4.
144 LQFP
144
MAPBGA
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 Debug trace timing specifications
Table 12. Debug trace operating behaviors
Symbol
Description
Tcyc
Clock period
Min.
Max.
Unit
Frequency dependent
MHz
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
24
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 12. Debug trace operating behaviors (continued)
Symbol
Description
Min.
Max.
Unit
Twl
Low pulse width
2
—
ns
Twh
High pulse width
2
—
ns
Tr
Clock and data rise time
—
3
ns
Tf
Clock and data fall time
—
3
ns
Ts
Data setup
3
—
ns
Th
Data hold
2
—
ns
Figure 4. TRACE_CLKOUT specifications
TRACE_CLKOUT
Ts
Th
Ts
Th
TRACE_D[3:0]
Figure 5. Trace data specifications
6.1.2 JTAG electricals
Table 13. JTAG voltage range electricals
Symbol
J1
Description
Min.
Max.
Unit
Operating voltage
2.7
5.5
V
TCLK frequency of operation
MHz
• JTAG
—
10
• CJTAG
—
5
J2
TCLK cycle period
1/J1
—
ns
J3
TCLK clock pulse width
• JTAG
100
—
ns
• CJTAG
200
—
ns
—
ns
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
25
Peripheral operating requirements and behaviors
Table 13. JTAG voltage range electricals (continued)
Symbol
Description
Min.
Max.
Unit
—
1
ns
—
ns
—
ns
—
ns
—
ns
J4
TCLK rise and fall times
J5
TMS input data setup time to TCLK rise
• JTAG
• CJTAG
112
J6
TDI input data setup time to TCLK rise
8
J7
TMS input data hold time after TCLK rise
• JTAG
• CJTAG
53
3.4
3.4
J8
TDI input data hold time after TCLK rise
3.4
J9
TCLK low to TMS data valid
• JTAG
• CJTAG
—
J10
TCLK low to TDO data valid
—
48
ns
J11
Output data hold/invalid time after clock edge1
—
3
ns
48
ns
85
1. They are common for JTAG and CJTAG.
J2
J3
J3
TCLK (input)
J4
J4
Figure 6. Test clock input timing
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
26
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
TCLK
J5
Data inputs
J6
Input data valid
J7
Data outputs
Output data valid
J8
Data outputs
J7
Data outputs
Output data valid
Figure 7. Boundary scan (JTAG) timing
TCLK
J9
TDI/TMS
J10
Input data valid
J11
TDO
Output data valid
J12
TDO
J11
TDO
Output data valid
Figure 8. Test Access Port timing
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
27
Peripheral operating requirements and behaviors
TCLK
J14
J13
TRST
Figure 9. TRST timing
6.2 System modules
There are no specifications necessary for the device's system modules.
6.3 Clock modules
6.3.1 MCG specifications
Table 14. MCG specifications
Symbol
Description
Min.
Typ.
Max.
Unit
—
32.768
—
kHz
31.25
—
39.0625
kHz
Internal reference (slow clock) current
—
TBD
—
µA
Δfdco_res_t
Resolution of trimmed average DCO output
frequency at fixed voltage and temperature —
using SCTRIM and SCFTRIM
—
± 0.3
± 0.6
%fdco
1
Δfdco_res_t
Resolution of trimmed average DCO output
frequency at fixed voltage and temperature —
using SCTRIM only
—
± 0.2
± 0.5
%fdco
1
Δfdco_t
Total deviation of trimmed average DCO output
frequency over voltage and temperature
—
± 10
—
%fdco
1
Δfdco_t
Total deviation of trimmed average DCO output
frequency over fixed voltage and temperature
range of 0–70°C
—
± 4.5
—
%fdco
1
4
MHz
fints_ft
Internal reference frequency (slow clock) —
factory trimmed at nominal VDD and 25 °C
fints_t
Internal reference frequency (slow clock) — user
trimmed
Iints
fintf_ft
Internal reference frequency (fast clock) —
factory trimmed at nominal VDD and 25°C
fintf_t
Internal reference frequency (fast clock) — user
trimmed at nominal VDD and 25 °C
3
—
5
MHz
Internal reference (fast clock) current
—
TBD
—
µA
Iintf
Notes
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
28
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 14. MCG specifications (continued)
Symbol
Description
Min.
Typ.
Max.
Unit
floc_low
Loss of external clock minimum frequency —
RANGE = 00
(3/5) x
fints_t
—
—
kHz
floc_high
Loss of external clock minimum frequency —
RANGE = 01, 10, or 11
(16/5) x
fints_t
—
—
kHz
31.25
—
39.0625
kHz
20
20.97
25
MHz
40
41.94
50
MHz
60
62.91
75
MHz
80
83.89
100
MHz
—
23.99
—
MHz
—
47.97
—
MHz
—
71.99
—
MHz
—
95.98
—
MHz
—
180
—
—
150
—
FLL accumulated jitter of DCO output over a 1µs
time window
—
TBD
—
ps
FLL target frequency acquisition time
—
—
1
ms
8
—
16
MHz
Notes
FLL
ffll_ref
fdco
FLL reference frequency range
DCO output
frequency range
Low range (DRS=00)
2, 3
640 × ffll_ref
Mid range (DRS=01)
1280 × ffll_ref
Mid-high range (DRS=10)
1920 × ffll_ref
High range (DRS=11)
2560 × ffll_ref
fdco_t_DMX3 DCO output
frequency
2
Low range (DRS=00)
4, 5
732 × ffll_ref
Mid range (DRS=01)
1464 × ffll_ref
Mid-high range (DRS=10)
2197 × ffll_ref
High range (DRS=11)
2929 × ffll_ref
Jcyc_fll
FLL period jitter
• fVCO = 48 MHz
• fVCO = 98 MHz
Jacc_fll
tfll_acquire
ps
6
PLL0,1
fpll_ref
PLL reference frequency range
fvcoclk_2x
VCO output frequency
fvcoclk
PLL output frequency
fvcoclk_90
Ipll
—
90
PLL quadrature output frequency
PLL operating current (fast)
—
180
—
90
—
TBD
360
180
180
—
MHz
MHz
MHz
µA
7
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
29
Peripheral operating requirements and behaviors
Table 14. MCG specifications (continued)
Symbol
Description
Min.
Typ.
Max.
Unit
—
TBD
—
µA
Ipll
PLL operating current (fast)
tpll_lock
Lock detector detection time
—
—
100 × 10-6
+ 1075(1/
fpll_ref)
s
Jcyc_pll
Jitter (cycle to cycle)
—
50
TBD
ps
Jacc_pll
Jitter (accumulated)
—
500
TBD
ps
Notes
7
8
9
1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock
mode).
2. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=0.
3. The resulting system clock frequencies should not exceed their maximum specified values. The DCO frequency deviation
(Δfdco_t) over voltage and temperature should be considered.
4. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=1.
5. The resulting clock frequency must not exceed the maximum specified clock frequency of the device.
6. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed,
DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE,
FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running.
7. Excludes any oscillator currents that are also consuming power while PLL is in operation.
8. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled
(BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes
it is already running.
9. Accumulated jitter will depend on VCO frequency and VDIV.
6.3.2 Oscillator electrical specifications
This section provides the electrical characteristics of the module.
6.3.2.1
Symbol
VDD
IDDOSC
Oscillator DC electrical specifications
Table 15. Oscillator DC electrical specifications
Description
Min.
Typ.
Max.
Unit
Supply voltage
1.71
—
3.6
V
Supply current — low-power mode (HGO=0)
Notes
1
• 32 kHz
—
500
—
nA
• 4 MHz
—
200
—
μA
• 8 MHz (RANGE=01)
—
300
—
μA
• 16 MHz
—
950
—
μA
• 24 MHz
—
1.2
—
mA
• 32 MHz
—
1.5
—
mA
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
30
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 15. Oscillator DC electrical specifications (continued)
Symbol
Description
Min.
IDDOSC
Supply current — high gain mode (HGO=1)
Typ.
Max.
Unit
Notes
1
• 32 kHz
—
25
—
μA
• 4 MHz
—
400
—
μA
• 8 MHz (RANGE=01)
—
500
—
μA
• 16 MHz
—
2.5
—
mA
• 24 MHz
—
3
—
mA
• 32 MHz
—
4
—
mA
Cx
EXTAL load capacitance
—
—
—
2, 3
Cy
XTAL load capacitance
—
—
—
2, 3
RF
Feedback resistor — low-frequency, low-power
mode (HGO=0)
—
—
—
MΩ
Feedback resistor — low-frequency, high-gain
mode (HGO=1)
—
10
—
MΩ
Feedback resistor — high-frequency, low-power
mode (HGO=0)
—
—
—
MΩ
Feedback resistor — high-frequency, high-gain
mode (HGO=1)
—
1
—
MΩ
Series resistor — low-frequency, low-power
mode (HGO=0)
—
—
—
kΩ
Series resistor — low-frequency, high-gain mode
(HGO=1)
—
200
—
kΩ
Series resistor — high-frequency, low-power
mode (HGO=0)
—
—
—
kΩ
—
0
—
kΩ
Peak-to-peak amplitude of oscillation (oscillator
mode) — low-frequency, low-power mode
(HGO=0)
—
0.6
—
V
Peak-to-peak amplitude of oscillation (oscillator
mode) — low-frequency, high-gain mode
(HGO=1)
—
VDD
—
V
Peak-to-peak amplitude of oscillation (oscillator
mode) — high-frequency, low-power mode
(HGO=0)
—
0.6
—
V
Peak-to-peak amplitude of oscillation (oscillator
mode) — high-frequency, high-gain mode
(HGO=1)
—
VDD
—
V
RS
2, 4
Series resistor — high-frequency, high-gain
mode (HGO=1)
Vpp5
1.
2.
3.
4.
VDD=3.3 V, Temperature =25 °C
See crystal or resonator manufacturer's recommendation
Cx,Cy can be provided by using either the integrated capacitors or by using external components.
When low power mode is selected, RF is integrated and must not be attached externally.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
31
Peripheral operating requirements and behaviors
5. The EXTAL and XTAL pins should only be connected to required oscillator components and must not be connected to any
other devices.
6.3.2.2
Symbol
Oscillator frequency specifications
Table 16. Oscillator frequency specifications
Description
Min.
Typ.
Max.
Unit
fosc_lo
Oscillator crystal or resonator frequency — low
frequency mode (MCG_C2[RANGE]=00)
32
—
40
kHz
fosc_hi_1
Oscillator crystal or resonator frequency — high
frequency mode (low range)
(MCG_C2[RANGE]=01)
3
—
8
MHz
fosc_hi_2
Oscillator crystal or resonator frequency — high
frequency mode (high range)
(MCG_C2[RANGE]=1x)
8
—
32
MHz
fec_extal
Input clock frequency (external clock mode)
—
—
60
MHz
tdc_extal
Input clock duty cycle (external clock mode)
40
50
60
%
Crystal startup time — 32 kHz low-frequency,
low-power mode (HGO=0)
—
1000
—
ms
Crystal startup time — 32 kHz low-frequency,
high-gain mode (HGO=1)
—
500
—
ms
Crystal startup time — 8 MHz high-frequency
(MCG_C2[RANGE]=01), low-power mode
(HGO=0)
—
0.6
—
ms
Crystal startup time — 8 MHz high-frequency
(MCG_C2[RANGE]=01), high-gain mode
(HGO=1)
—
1
—
ms
tcst
Notes
1
2, 3
4, 5
1. Frequencies less than 8 MHz are not in the PLL range.
2. Other frequency limits may apply when external clock is being used as a reference for the FLL or PLL.
3. When transitioning from FBE to FEI mode, restrict the frequency of the input clock so that, when it is divided by FRDIV, it
remains within the limits of the DCO input clock frequency.
4. Proper PC board layout procedures must be followed to achieve specifications.
5. Crystal startup time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S register
being set.
6.3.3 32kHz Oscillator Electrical Characteristics
This section describes the module electrical characteristics.
6.3.3.1
Symbol
VBAT
RF
32kHz oscillator DC electrical specifications
Table 17. 32kHz oscillator DC electrical specifications
Description
Min.
Typ.
Max.
Unit
Supply voltage
1.71
—
3.6
V
—
100
—
MΩ
Internal feedback resistor
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
32
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 17. 32kHz oscillator DC electrical specifications (continued)
Symbol
Description
Min.
Typ.
Max.
Unit
Cpara
Parasitical capacitance of EXTAL32 and XTAL32
—
5
7
pF
Vpp1
Peak-to-peak amplitude of oscillation
—
0.6
—
V
1. The EXTAL32 and XTAL32 pins should only be connected to required oscillator components and must not be connected to
any other devices.
6.3.3.2
Symbol
fosc_lo
tstart
32kHz oscillator frequency specifications
Table 18. 32kHz oscillator frequency specifications
Description
Min.
Typ.
Max.
Unit
Oscillator crystal
—
32.768
—
kHz
Crystal start-up time
—
1000
—
ms
Notes
1
1. Proper PC board layout procedures must be followed to achieve specifications.
6.4 Memories and memory interfaces
6.4.1 Flash (FTFE) electrical specifications
This section describes the electrical characteristics of the FTFE module.
6.4.1.1
Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 19. NVM program/erase timing specifications
Symbol
Description
Min.
Typ.
Max.
Unit
thvpgm4
Notes
Program Phrase high-voltage time
—
7.5
TBD
μs
thversscr
Erase Flash Sector high-voltage time
—
13
TBD
ms
1
thversblk
Erase Flash Block high-voltage time
—
425
TBD
ms
1
1. Maximum time based on expectations at cycling end-of-life.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
33
Peripheral operating requirements and behaviors
6.4.1.2
Symbol
Flash timing specifications — commands
Table 20. Flash command timing specifications
Min.
Typ.
Max.
Unit
Read 1s Block execution time
—
1.5
TBD
ms
trd1sec4k
Read 1s Section execution time (4KB flash)
—
50
TBD
μs
1
tpgmchk
Program Check execution time
—
35
TBD
μs
1
trdrsrc
Read Resource execution time
—
35
TBD
μs
1
tpgm8
Program Phrase execution time
—
65
TBD
μs
tersblk
Erase Flash Block execution time
—
450
TBD
ms
2
tersscr
Erase Flash Sector execution time
—
15
TBD
ms
2
Program Section execution time (4KB flash)
—
20
TBD
ms
trd1all
Read 1s All Blocks execution time
—
1.5
TBD
ms
trdonce
Read Once execution time
—
17
TBD
μs
Program Once execution time
—
65
TBD
μs
tersall
Erase All Blocks execution time
—
900
TBD
ms
2
tvfykey
Verify Backdoor Access Key execution time
—
25
TBD
μs
1
trd1blk
tpgmsec4k
tpgmonce
Description
Notes
1
Swap Control execution time
tswapx01
• control code 0x01
—
185
TBD
μs
tswapx02
• control code 0x02
—
65
TBD
μs
tswapx04
• control code 0x04
—
65
TBD
μs
tswapx08
• control code 0x08
—
25
TBD
μs
—
TBD
TBD
ms
tpgmpart
Program Partition for EEPROM execution time
Set FlexRAM Function execution time:
tsetram64k
• 64 KB EEPROM backup
—
TBD
TBD
ms
tsetram128k
• 128 KB EEPROM backup
—
TBD
TBD
ms
tsetram256k
• 256 KB EEPROM backup
—
TBD
TBD
ms
tsetram512k
• 512 KB EEPROM backup
—
TBD
TBD
ms
—
100
TBD
μs
teewr8bers
Byte-write to erased FlexRAM location execution
time
3
Byte-write to FlexRAM execution time:
teewr8b64k
• 64 KB EEPROM backup
—
TBD
TBD
ms
teewr8b128k
• 128 KB EEPROM backup
—
TBD
TBD
ms
teewr8b256k
• 256 KB EEPROM backup
—
TBD
TBD
ms
teewr8b512k
• 512 KB EEPROM backup
—
TBD
TBD
ms
—
100
TBD
μs
teewr16bers
16-bit write to erased FlexRAM location
execution time
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
34
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 20. Flash command timing specifications (continued)
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
16-bit write to FlexRAM execution time:
teewr16b64k
• 64 KB EEPROM backup
—
TBD
TBD
ms
teewr16b128k
• 128 KB EEPROM backup
—
TBD
TBD
ms
teewr16b256k
• 256 KB EEPROM backup
—
TBD
TBD
ms
teewr16b512k
• 512 KB EEPROM backup
—
TBD
TBD
ms
—
200
TBD
μs
teewr32bers
32-bit write to erased FlexRAM location
execution time
teewr32b64k 32-bit-write to FlexRAM execution time:
teewr32b128k
• 64 KB EEPROM backup
—
TBD
TBD
ms
teewr32b256k
• 128 KB EEPROM backup
—
TBD
TBD
ms
teewr32b512k
• 256 KB EEPROM backup
—
TBD
TBD
ms
• 512 KB EEPROM backup
—
TBD
TBD
ms
1. Assumes 25MHz flash clock frequency.
2. Maximum times for erase parameters based on expectations at cycling end-of-life.
3. For byte-writes to an erased FlexRAM location, the aligned word containing the byte must be erased.
6.4.1.3
Flash (FTFE) current and power specfications
Table 21. Flash (FTFE) current and power specfications
Symbol
Description
IDD_PGM
Worst case programming current in program flash
6.4.1.4
Symbol
Typ.
Unit
10
mA
Reliability specifications
Table 22. NVM reliability specifications
Description
Min.
Typ.1
Max.
Unit
Notes
Program Flash
tnvmretp10k
Data retention after up to 10 K cycles
5
50
—
years
2
tnvmretp1k
Data retention after up to 1 K cycles
10
100
—
years
2
tnvmretp100
Data retention after up to 100 cycles
15
100
—
years
2
10 K
35 K
—
cycles
3
nnvmcycp
Cycling endurance
Data Flash
tnvmretd10k
Data retention after up to 10 K cycles
5
50
—
years
2
tnvmretd1k
Data retention after up to 1 K cycles
10
100
—
years
2
tnvmretd100
Data retention after up to 100 cycles
15
100
—
years
2
10 K
35 K
—
cycles
3
nnvmcycd
Cycling endurance
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
35
Peripheral operating requirements and behaviors
Table 22. NVM reliability specifications (continued)
Symbol
Description
Min.
Typ.1
Max.
Unit
Notes
FlexRAM as EEPROM
tnvmretee100 Data retention up to 100% of write endurance
5
50
—
years
2
tnvmretee10
Data retention up to 10% of write endurance
10
100
—
years
2
tnvmretee1
Data retention up to 1% of write endurance
15
100
—
years
2
Write endurance
4
nnvmwree16
• EEPROM backup to FlexRAM ratio = 16
TBD
TBD
—
writes
nnvmwree128
• EEPROM backup to FlexRAM ratio = 128
TBD
TBD
—
writes
nnvmwree512
• EEPROM backup to FlexRAM ratio = 512
TBD
TBD
—
writes
nnvmwree4k
• EEPROM backup to FlexRAM ratio = 4096
TBD
TBD
—
writes
nnvmwree32k
• EEPROM backup to FlexRAM ratio =
32,768
TBD
TBD
—
writes
1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant
25°C profile. Engineering Bulletin EB618 does not apply to this technology.
2. Data retention is based on Tjavg = 55°C (temperature profile over the lifetime of the application).
3. Cycling endurance represents number of program/erase cycles at -40°C ≤ Tj ≤ 125°C.
4. Write endurance represents the number of writes to each FlexRAM location at -40°C ≤Tj ≤ 125°C influenced by the cycling
endurance of the FlexNVM (same value as data flash) and the allocated EEPROM backup per subsystem. Minimum and
typical values assume all byte-writes to FlexRAM.
6.4.1.5
Write endurance to FlexRAM for EEPROM
TBD
6.4.2 EzPort Switching Specifications
Table 23. EzPort switching specifications
Num
Description
Min.
Max.
Unit
Operating voltage
1.71
3.6
V
EP1
EZP_CK frequency of operation (all commands except
READ)
—
fSYS/2
MHz
EP1a
EZP_CK frequency of operation (READ command)
—
fSYS/8
MHz
EP2
EZP_CS negation to next EZP_CS assertion
2 x tEZP_CK
—
ns
EP3
EZP_CS input valid to EZP_CK high (setup)
5
—
ns
EP4
EZP_CK high to EZP_CS input invalid (hold)
5
—
ns
EP5
EZP_D input valid to EZP_CK high (setup)
2
—
ns
EP6
EZP_CK high to EZP_D input invalid (hold)
5
—
ns
EP7
EZP_CK low to EZP_Q output valid
—
16
ns
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
36
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 23. EzPort switching specifications (continued)
Num
Description
Min.
Max.
Unit
EP8
EZP_CK low to EZP_Q output invalid (hold)
0
—
ns
EP9
EZP_CS negation to EZP_Q tri-state
—
12
ns
EZP_CK
EP3
EP2
EP4
EZP_CS
EP9
EP8
EP7
EZP_Q (output)
EP5
EP6
EZP_D (input)
Figure 10. EzPort Timing Diagram
6.4.3 NFC specifications
The NAND flash controller (NFC) implements the interface to standard NAND flash
memory devices. This section describes the timing parameters of the NFC.
In the following table:
• TH is the flash clock high time and
• TL is flash clock low time,
which are defined as:
T NFC = T L + T H =
T input clock
SCALER
The SCALER value is derived from the fractional divider specified in the SIM's
CLKDIV4 register:
SCALER =
SIM_CLKDIV4[NFCFRAC] + 1
SIM_CLKDIV4[NFCDIV] + 1
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
37
Peripheral operating requirements and behaviors
In case the reciprocal of SCALER is an integer, the duty cycle of NFC clock is 50%,
means TH = TL. In case the reciprocal of SCALER is not an integer:
T L = (1 + SCALER / 2) x
T H = (1 – SCALER / 2) x
T NFC
2
T NFC
2
For example, if SCALER is 0.2, then TH = TL = TNFC/2.
TNFC
TH
TL
However, if SCALER is 0.667, then TL = 2/3 x TNFC and TH = 1/3 x TNFC.
TNFC
TH
TL
NOTE
The reciprocal of SCALER must be a multiple of 0.5. For
example, 1, 1.5, 2, 2.5, etc.
Table 24. NFC specifications
Num
Description
Min.
Max.
Unit
tCLS
NFC_CLE setup time
2TH + TL – 1
—
ns
tCLH
NFC_CLE hold time
TH + TL – 1
—
ns
tCS
NFC_CEn setup time
2TH + TL – 1
—
ns
tCH
NFC_CEn hold time
TH + TL
—
ns
tWP
NFC_WP pulse width
TL – 1
—
ns
tALS
NFC_ALE setup time
2TH + TL
—
ns
tALH
NFC_ALE hold time
TH + TL
—
ns
tDS
Data setup time
TL – 1
—
ns
tDH
Data hold time
TH – 1
—
ns
tWC
Write cycle time
TH + TL – 1
—
ns
tWH
NFC_WE hold time
TH – 1
—
ns
tRR
Ready to NFC_RE low
4TH + 3TL + 90
—
ns
tRP
NFC_RE pulse width
TL + 1
—
ns
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
38
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 24. NFC specifications (continued)
Num
Description
Min.
Max.
Unit
tRC
Read cycle time
TL + TH – 1
—
ns
tREH
NFC_RE high hold time
TH – 1
—
ns
tIS
Data input setup time
11
—
ns
NFC_CLE
tCLS
tCLH
NFC_CEn
tCS
tWP
tCH
NFC_WE
tDS
tDH
NFC_IOn
Figure 11. Command latch cycle timing
NFC_ALE
tALS
tALH
NFC_CEn
tCS
tWP
tCH
NFC_WE
tDS
NFC_IOn
tDH
address
Figure 12. Address latch cycle timing
tCS
tCH
tWC
NFC_CEn
tWP
tWH
tDS
tDH
NFC_WE
NFC_IOn
data
data
data
Figure 13. Write data latch cycle timing
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
39
Peripheral operating requirements and behaviors
tCH
tRC
NFC_CEn
tREH
tRP
NFC_RE
tIS
NFC_IOn
data
data
data
tRR
NFC_RB
Figure 14. Read data latch cycle timing in non-fast mode
tCH
tRC
NFC_CEn
tRP
tREH
NFC_RE
tIS
NFC_IOn
data
data
data
tRR
NFC_RB
Figure 15. Read data latch cycle timing in fast mode
6.4.4 Flexbus Switching Specifications
All processor bus timings are synchronous; input setup/hold and output delay are given in
respect to the rising edge of a reference clock, FB_CLK. The FB_CLK frequency may be
the same as the internal system bus frequency or an integer divider of that frequency.
The following timing numbers indicate when data is latched or driven onto the external
bus, relative to the Flexbus output clock (FB_CLK). All other timing relationships can be
derived from these values.
Table 25. Flexbus limited voltage range switching specifications
Num
FB1
Description
Min.
Max.
Unit
Operating voltage
2.7
3.6
V
Frequency of operation
—
FB_CLK
MHz
Clock period
20
—
ns
Notes
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
40
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 25. Flexbus limited voltage range switching specifications (continued)
Num
Description
Min.
Max.
Unit
Notes
FB2
Address, data, and control output valid
—
11.5
ns
1
FB3
Address, data, and control output hold
0.5
—
ns
1
FB4
Data and FB_TA input setup
8.5
—
ns
2
FB5
Data and FB_TA input hold
0.5
—
ns
2
1. Specification is valid for all FB_AD[31:0], FB_BE/BWEn, FB_CSn, FB_OE, FB_R/W,FB_TBST, FB_TSIZ[1:0], FB_ALE,
and FB_TS.
2. Specification is valid for all FB_AD[31:0] and FB_TA.
Table 26. Flexbus full voltage range switching specifications
Num
Description
Min.
Max.
Unit
Operating voltage
1.71
3.6
V
—
FB_CLK
MHz
1/FB_CLK
—
ns
Frequency of operation
Notes
FB1
Clock period
FB2
Address, data, and control output valid
—
13.5
ns
1
FB3
Address, data, and control output hold
0
—
ns
1
FB4
Data and FB_TA input setup
13.7
—
ns
2
FB5
Data and FB_TA input hold
0.5
—
ns
2
1. Specification is valid for all FB_AD[31:0], FB_BE/BWEn, FB_CSn, FB_OE, FB_R/W,FB_TBST, FB_TSIZ[1:0], FB_ALE,
and FB_TS.
2. Specification is valid for all FB_AD[31:0] and FB_TA.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
41
Peripheral operating requirements and behaviors
FB1
FB_CLK
FB3
FB5
FB_A[Y]
Address
FB4
FB2
FB_D[X]
Address
Data
FB_RW
FB_TS
FB_ALE
AA=1
FB_CSn
AA=0
FB_OEn
FB4
FB_BEn
FB5
AA=1
FB_TA
FB_TSIZ[1:0]
AA=0
TSIZ
Figure 16. FlexBus read timing diagram
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
42
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
FB1
FB_CLK
FB2
FB3
FB_A[Y]
FB_D[X]
Address
Address
Data
FB_RW
FB_TS
FB_ALE
AA=1
FB_CSn
AA=0
FB_OEn
FB4
FB_BEn
FB5
AA=1
FB_TA
FB_TSIZ[1:0]
AA=0
TSIZ
Figure 17. FlexBus write timing diagram
6.5 Security and integrity modules
There are no specifications necessary for the device's security and integrity modules.
6.6 Analog
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
43
Peripheral operating requirements and behaviors
6.6.1 ADC electrical specifications
The 16-bit accuracy specifications listed in Table 27 and Table 28 are achievable on the
differential pins ADCx_DP0, ADCx_DM0.
The ADCx_DP2 and ADCx_DM2 ADC inputs are connected to the PGA outputs and are
not direct device pins. Accuracy specifications for these pins are defined in Table 29 and
Table 30.
All other ADC channels meet the 13-bit differential/12-bit single-ended accuracy
specifications.
6.6.1.1
16-bit ADC operating conditions
Table 27. 16-bit ADC operating conditions
Description
Conditions
Min.
Typ.1
Max.
Unit
VDDA
Supply voltage
Absolute
1.71
—
3.6
V
ΔVDDA
Supply voltage
Delta to VDD (VDDVDDA)
-100
0
+100
mV
2
ΔVSSA
Ground voltage
Delta to VSS (VSSVSSA)
-100
0
+100
mV
2
VREFH
ADC reference
voltage high
1.13
VDDA
VDDA
V
VREFL
Reference
voltage low
VSSA
VSSA
VSSA
V
VADIN
Input voltage
VREFL
—
VREFH
V
CADIN
Input
capacitance
• 16 bit modes
—
8
10
pF
• 8/10/12 bit
modes
—
4
5
—
2
5
Symbol
RADIN
RAS
fADCK
fADCK
Input resistance
Analog source
resistance
13/12 bit modes
ADC conversion
clock frequency
≤ 13 bit modes
ADC conversion
clock frequency
16 bit modes
fADCK < 4MHz
Notes
kΩ
3
—
—
5
kΩ
4
1.0
—
18.0
MHz
4
2.0
—
12.0
MHz
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
44
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 27. 16-bit ADC operating conditions (continued)
Symbol
Crate
Description
Conditions
ADC conversion
rate
≤ 13 bit modes
Min.
Typ.1
Max.
Unit
Notes
5
No ADC hardware
averaging
20.000
—
818.330
Ksps
Continuous
conversions enabled,
subsequent conversion
time
Crate
ADC conversion
rate
16 bit modes
5
No ADC hardware
averaging
37.037
—
461.467
Ksps
Continuous
conversions enabled,
subsequent conversion
time
1. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2. DC potential difference.
3. This resistance is external to MCU. The analog source resistance should be kept as low as possible in order to achieve the
best results. The results in this datasheet were derived from a system which has <8 Ω analog source resistance. The RAS/
CAS time constant should be kept to <1ns.
4. To use the maximum ADC conversion clock frequency, the ADHSC bit should be set and the ADLPC bit should be clear.
5. For guidelines and examples of conversion rate calculation, download the ADC calculator tool: http://cache.freescale.com/
files/soft_dev_tools/software/app_software/converters/ADC_CALCULATOR_CNV.zip?fpsp=1
SIMPLIFIED
INPUT PIN EQUIVALENT
CIRCUIT
Pad
leakage
due to
input
protection
Z AS
R AS
Z ADIN
SIMPLIFIED
CHANNEL SELECT
CIRCUIT
R ADIN
ADC SAR
ENGINE
V ADIN
C AS
V AS
R ADIN
INPUT PIN
INPUT PIN
R ADIN
R ADIN
INPUT PIN
C ADIN
Figure 18. ADC input impedance equivalency diagram
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
45
Peripheral operating requirements and behaviors
6.6.1.2
16-bit ADC electrical characteristics
Table 28. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA)
Symbol
Description
IDDA_ADC
Supply current
fADACK
ADC
asynchronous
clock source
Sample Time
TUE
DNL
INL
EFS
Conditions1
Min.
Typ.2
Max.
Unit
Notes
0.215
—
1.7
mA
3
• ADLPC=1, ADHSC=0
1.2
2.4
3.9
MHz
• ADLPC=1, ADHSC=1
3.0
4.0
7.3
MHz
tADACK = 1/
fADACK
• ADLPC=0, ADHSC=0
2.4
5.2
6.1
MHz
• ADLPC=0, ADHSC=1
4.4
6.2
9.5
MHz
LSB4
5
LSB4
5
LSB4
5
LSB4
VADIN =
VDDA
See Reference Manual chapter for sample times
Total unadjusted
error
• 12 bit modes
—
±4
±6.8
• <12 bit modes
—
±1.4
±2.1
Differential nonlinearity
• 12 bit modes
—
±0.7
-1.1 to
+1.9
• <12 bit modes
—
±0.2
• 12 bit modes
—
±1.0
• <12 bit modes
—
±0.5
-0.7 to
+0.5
• 12 bit modes
—
-4
-5.4
• <12 bit modes
—
-1.4
-1.8
Integral nonlinearity
Full-scale error
-0.3 to 0.5
-2.7 to
+1.9
5
EQ
ENOB
Quantization
error
• 16 bit modes
—
-1 to 0
—
• ≤13 bit modes
—
—
±0.5
Effective number 16 bit differential mode
of bits
• Avg=32
LSB4
6
• Avg=4
12.8
14.5
—
bits
11.9
13.8
—
bits
12.2
13.9
—
bits
11.4
13.1
—
bits
16 bit single-ended mode
• Avg=32
• Avg=4
SINAD
THD
Signal-to-noise
plus distortion
See ENOB
Total harmonic
distortion
16 bit differential mode
6.02 × ENOB + 1.76
7
• Avg=32
16 bit single-ended mode
• Avg=32
dB
—
–94
—
dB
—
-85
—
dB
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
46
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 28. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued)
Symbol
SFDR
Description
Conditions1
Spurious free
dynamic range
16 bit differential mode
Min.
16 bit single-ended mode
EIL
Max.
Unit
Notes
7
• Avg=32
• Avg=32
Typ.2
82
95
—
dB
78
90
—
dB
Input leakage
error
IIn × RAS
mV
IIn =
leakage
current
(refer to
the MCU's
voltage
and
current
operating
ratings)
VTEMP25
Temp sensor
slope
–40°C to 105°C
—
1.715
—
mV/°C
Temp sensor
voltage
25°C
—
719
—
mV
1. All accuracy numbers assume the ADC is calibrated with VREFH = VDDA
2. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 2.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
3. The ADC supply current depends on the ADC conversion clock speed, conversion rate and the ADLPC bit (low power).
For lowest power operation the ADLPC bit should be set, the HSC bit should be clear with 1MHz ADC conversion clock
speed.
4. 1 LSB = (VREFH - VREFL)/2N
5. ADC conversion clock <16MHz, Max hardware averaging (AVGE = %1, AVGS = %11)
6. Input data is 100 Hz sine wave. ADC conversion clock <12MHz.
7. Input data is 1 kHz sine wave. ADC conversion clock <12MHz.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
47
Peripheral operating requirements and behaviors
Figure 19. Typical ENOB vs. ADC_CLK for 16-bit differential mode
Figure 20. Typical ENOB vs. ADC_CLK for 16-bit single-ended mode
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
48
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
6.6.1.3
16-bit ADC with PGA operating conditions
Table 29. 16-bit ADC with PGA operating conditions
Description
Conditions
Min.
Typ.1
Max.
Unit
VDDA
Supply voltage
Absolute
1.71
—
3.6
V
VREFPGA
PGA ref voltage
Symbol
VADIN
VCM
RPGAD
VREF_OU VREF_OU VREF_OU
T
T
T
V
Notes
2, 3
Input voltage
VSSA
—
VDDA
V
Input Common
Mode range
VSSA
—
VDDA
V
Gain = 1, 2, 4, 8
—
128
—
kΩ
IN+ to IN-4
Gain = 16, 32
—
64
—
Gain = 64
—
32
—
Differential input
impedance
RAS
Analog source
resistance
—
100
—
Ω
5
TS
ADC sampling
time
1.25
—
—
µs
6
18.484
—
450
Ksps
7
37.037
—
250
Ksps
8
Crate
ADC conversion
rate
≤ 13 bit modes
No ADC hardware
averaging
Continuous
conversions enabled
Peripheral clock = 50
MHz
16 bit modes
No ADC hardware
averaging
Continuous
conversions enabled
Peripheral clock = 50
MHz
1. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 6 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2. ADC must be configured to use the internal voltage reference (VREF_OUT)
3. PGA reference is internally connected to the VREF_OUT pin. If the user wishes to drive VREF_OUT with a voltage other
than the output of the VREF module, the VREF module must be disabled.
4. For single ended configurations the input impedance of the driven input is RPGAD/2
5. The analog source resistance (RAS), external to MCU, should be kept as minimum as possible. Increased RAS causes drop
in PGA gain without affecting other performances. This is not dependent on ADC clock frequency.
6. The minimum sampling time is dependent on input signal frequency and ADC mode of operation. A minimum of 1.25µs
time should be allowed for Fin=4 kHz at 16-bit differential mode. Recommended ADC setting is: ADLSMP=1, ADLSTS=2 at
8 MHz ADC clock.
7. ADC clock = 18 MHz, ADLSMP = 1, ADLST = 00, ADHSC = 1
8. ADC clock = 12 MHz, ADLSMP = 1, ADLST = 01, ADHSC = 1
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
49
Peripheral operating requirements and behaviors
6.6.1.4
16-bit ADC with PGA characteristics
Table 30. 16-bit ADC with PGA characteristics
Symbol
Description
Conditions
IDDA_PGA
Supply current
Low power
(ADC_PGA[PGALPb]=0)
IDC_PGA
Input DC current
G
BW
Gain4
Input signal
bandwidth
Min.
Typ.1
Max.
Unit
Notes
—
420
644
μA
2
A
3
Gain =1, VREFPGA=1.2V,
VCM=0.5V
—
1.54
—
μA
Gain =64, VREFPGA=1.2V,
VCM=0.1V
—
0.57
—
μA
• PGAG=0
0.95
1
1.05
• PGAG=1
1.9
2
2.1
• PGAG=2
3.8
4
4.2
• PGAG=3
7.6
8
8.4
• PGAG=4
15.2
16
16.6
• PGAG=5
30.0
31.6
33.2
• PGAG=6
58.8
63.3
67.8
—
—
4
kHz
—
—
40
kHz
—
-84
—
dB
VDDA= 3V
±100mV,
fVDDA= 50Hz,
60Hz
VCM=
500mVpp,
fVCM= 50Hz,
100Hz
• 16-bit modes
• < 16-bit modes
PSRR
Power supply
rejection ratio
CMRR
Common mode
rejection ratio
• Gain=1
—
-84
—
dB
• Gain=64
—
-85
—
dB
Input offset
voltage
• Chopping disabled
(ADC_PGA[PGACHPb]
=1)
• Chopping enabled
(ADC_PGA[PGACHPb]
=0)
—
2.4
TBD
mV
—
0.2
—
mV
Output offset =
VOFS*(Gain+1)
—
—
10
µs
5
—
TBD
TBD
ppm/°C
0 to 50°C
—
TBD
TBD
ppm/°C
—
TBD
TBD
ppm/°C
0 to 50°C, ADC
Averaging=32
—
TBD
TBD
%/V
—
TBD
TBD
%/V
VDDA from 1.71
to 3.6V
VOFS
TGSW
Gain switching
settling time
dG/dT
Gain drift over
temperature
dVOFS/dT
Offset drift over
temperature
dG/dVDDA
Gain drift over
supply voltage
Gain=1
RAS < 100Ω
• Gain=1
• Gain=64
Gain=1
• Gain=1
• Gain=64
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
50
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 30. 16-bit ADC with PGA characteristics (continued)
Symbol
Description
Conditions
EIL
Input leakage
error
All modes
Min.
Typ.1
Max.
IIn × RAS
Unit
Notes
mV
IIn = leakage
current
(refer to the
MCU's voltage
and current
operating
ratings)
VPP,DIFF
SNR
THD
SFDR
ENOB
SINAD
Maximum
differential input
signal swing
V
6
16-bit
differential
mode,
Average=32
where VX = VREFPGA × 0.583
Signal-to-noise
ratio
• Gain=1
80
90
—
dB
• Gain=64
52
66
—
dB
Total harmonic
distortion
• Gain=1
85
100
—
dB
• Gain=64
49
95
—
dB
Spurious free
dynamic range
• Gain=1
85
105
—
dB
• Gain=64
53
88
—
dB
Effective number
of bits
• Gain=1, Average=4
11.6
13.4
—
bits
• Gain=1, Average=8
TBD
12.7
—
bits
• Gain=64, Average=4
7.2
9.6
—
bits
• Gain=64, Average=8
TBD
8.7
—
bits
• Gain=1, Average=32
12.8
14.5
—
bits
• Gain=2, Average=32
11.0
14.3
—
bits
• Gain=4, Average=32
7.9
13.8
—
bits
• Gain=8, Average=32
7.3
13.1
—
bits
• Gain=16, Average=32
6.8
12.5
—
bits
• Gain=32, Average=32
6.8
11.5
—
bits
• Gain=64, Average=32
7.5
10.6
—
bits
Signal-to-noise
plus distortion
ratio
See ENOB
6.02 × ENOB + 1.76
16-bit
differential
mode,
Average=32,
fin=100Hz
16-bit
differential
mode,
Average=32,
fin=100Hz
16-bit
differential
mode,fin=100H
z
dB
1. Typical values assume VDDA =3.0V, Temp=25°C, fADCK=6MHz unless otherwise stated.
2. This current is a PGA module adder, in addition to and ADC conversion currents.
3. Between IN+ and IN-. The PGA draws a DC current from the input terminals. The magnitude of the DC current is a strong
function of input common mode voltage (VCM) and the PGA gain.
4. Gain = 2PGAG
5. After changing the PGA gain setting, a minimum of 2 ADC+PGA conversions should be ignored.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
51
Peripheral operating requirements and behaviors
6. Limit the input signal swing so that the PGA does not saturate during operation. Input signal swing is dependent on the
PGA reference voltage and gain setting.
6.6.2 CMP and 6-bit DAC electrical specifications
Table 31. Comparator and 6-bit DAC electrical specifications
Symbol
VDD
Description
Min.
Typ.
Max.
Unit
Supply voltage
1.71
—
3.6
V
IDDHS
Supply current, High-speed mode (EN=1, PMODE=1)
—
—
200
μA
IDDLS
Supply current, low-speed mode (EN=1, PMODE=0)
—
—
20
μA
VAIN
Analog input voltage
VSS – 0.3
—
VDD
V
VAIO
Analog input offset voltage
—
—
20
mV
• CR0[HYSTCTR] = 00
—
5
—
mV
• CR0[HYSTCTR] = 01
—
10
—
mV
• CR0[HYSTCTR] = 10
—
20
—
mV
• CR0[HYSTCTR] = 11
—
30
—
mV
VH
Analog comparator hysteresis1
VCMPOh
Output high
VDD – 0.5
—
—
V
VCMPOl
Output low
—
—
0.5
V
tDHS
Propagation delay, high-speed mode (EN=1,
PMODE=1)
20
50
200
ns
tDLS
Propagation delay, low-speed mode (EN=1,
PMODE=0)
80
250
600
ns
Analog comparator initialization delay2
—
—
40
μs
6-bit DAC current adder (enabled)
—
7
—
μA
IDAC6b
INL
6-bit DAC integral non-linearity
–0.5
—
0.5
LSB3
DNL
6-bit DAC differential non-linearity
–0.3
—
0.3
LSB
1. Typical hysteresis is measured with input voltage range limited to 0.6 to VDD-0.6V.
2. Comparator initialization delay is defined as the time between software writes to change control inputs (Writes to DACEN,
VRSEL, PSEL, MSEL, VOSEL) and the comparator output settling to a stable level.
3. 1 LSB = Vreference/64
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
52
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
0.08
0.07
0.06
HYSTCTR
Setting
CM P Hystereris (V)
0.05
00
0.04
01
10
11
0.03
0.02
0.01
0
0.1
0.4
0.7
1
1.3
1.6
1.9
Vin level (V)
2.2
2.5
2.8
3.1
Figure 21. Typical hysteresis vs. Vin level (VDD=3.3V, PMODE=0)
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
53
Peripheral operating requirements and behaviors
0.18
0.16
0.14
CMP
P Hystereris (V)
0.12
HYSTCTR
Setting
0.1
00
01
0
08
0.08
10
11
0.06
0.04
0.02
0
0.1
0.4
0.7
1
1.3
1.6
Vin level (V)
1.9
2.2
2.5
2.8
3.1
Figure 22. Typical hysteresis vs. Vin level (VDD=3.3V, PMODE=1)
6.6.3 12-bit DAC electrical characteristics
6.6.3.1
Symbol
12-bit DAC operating requirements
Table 32. 12-bit DAC operating requirements
Desciption
Min.
Max.
Unit
VDDA
Supply voltage
1.71
3.6
V
VDACR
Reference voltage
1.13
3.6
V
TA
Temperature
−40
105
°C
CL
Output load capacitance
—
100
pF
IL
Output load current
—
1
mA
Notes
1
2
1. The DAC reference can be selected to be VDDA or the voltage output of the VREF module (VREF_OUT)
2. A small load capacitance (47 pF) can improve the bandwidth performance of the DAC
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
54
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
6.6.3.2
Symbol
12-bit DAC operating behaviors
Table 33. 12-bit DAC operating behaviors
Description
IDDA_DACL Supply current — low-power mode
Min.
Typ.
Max.
Unit
—
—
150
μA
—
—
700
μA
Notes
P
IDDA_DAC Supply current — high-speed mode
HP
tDACLP
Full-scale settling time (0x080 to 0xF7F) —
low-power mode
—
100
200
μs
1
tDACHP
Full-scale settling time (0x080 to 0xF7F) —
high-power mode
—
15
30
μs
1
tCCDACLP Code-to-code settling time (0xBF8 to
0xC08) — low-power mode and high-speed
mode
—
0.7
1
μs
1
Vdacoutl
DAC output voltage range low — highspeed mode, no load, DAC set to 0x000
—
—
100
mV
Vdacouth
DAC output voltage range high — highspeed mode, no load, DAC set to 0xFFF
VDACR
−100
—
VDACR
mV
INL
Integral non-linearity error — high speed
mode
—
—
±8
LSB
2
DNL
Differential non-linearity error — VDACR > 2
V
—
—
±1
LSB
3
DNL
Differential non-linearity error — VDACR =
VREF_OUT
—
—
±1
LSB
4
VOFFSET
Offset error
—
±0.4
±0.8
%FSR
5
EG
Gain error
—
±0.1
±0.6
%FSR
5
Power supply rejection ratio, VDDA > = 2.4 V
60
90
dB
TCO
Temperature coefficient offset voltage
—
3.7
—
μV/C
TGE
Temperature coefficient gain error
—
0.000421
—
%FSR/C
Rop
Output resistance load = 3 kΩ
—
—
250
Ω
SR
Slew rate -80h→ F7Fh→ 80h
PSRR
1.
2.
3.
4.
5.
V/μs
• High power (SPHP)
1.2
1.7
—
• Low power (SPLP)
0.05
0.12
—
—
—
-80
CT
Channel to channel cross talk
BW
3dB bandwidth
6
dB
kHz
• High power (SPHP)
550
—
—
• Low power (SPLP)
40
—
—
Settling within ±1 LSB
The INL is measured for 0+100mV to VDACR−100 mV
The DNL is measured for 0+100 mV to VDACR−100 mV
The DNL is measured for 0+100mV to VDACR−100 mV with VDDA > 2.4V
Calculated by a best fit curve from VSS+100 mV to VDACR−100 mV
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
55
Peripheral operating requirements and behaviors
6. VDDA = 3.0V, reference select set for VDDA (DACx_CO:DACRFS = 1), high power mode(DACx_C0:LPEN = 0), DAC set
to 0x800, Temp range from -40C to 105C
Figure 23. Typical INL error vs. digital code
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
56
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Figure 24. Offset at half scale vs. temperature
6.6.4 Voltage reference electrical specifications
Table 34. VREF full-range operating requirements
Symbol
Description
Min.
Max.
Unit
Supply voltage
1.71
3.6
V
TA
Temperature
−40
105
°C
CL
Output load capacitance
VDDA
100
nF
Notes
1, 2
1. CL must be connected to VREF_OUT if the VREF_OUT functionality is being used for either an internal or external
reference.
2. The load capacitance should not exceed +/-25% of the nominal specified CL value over the operating temperature range of
the device.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
57
Peripheral operating requirements and behaviors
Table 35. VREF full-range operating behaviors
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
Vout
Voltage reference output with factory trim at
nominal VDDA and temperature=25C
1.1965
1.2
1.2027
V
Vout
Voltage reference output with— factory trim
1.1584
—
1.2376
V
Vout
Voltage reference output — user trim
1.198
—
1.202
V
Vstep
Voltage reference trim step
—
0.5
—
mV
Vtdrift
Temperature drift (Vmax -Vmin across the full
temperature range)
—
—
80
mV
Ibg
Bandgap only current
—
—
80
µA
1
Itr
High-power buffer current
—
—
TBD
mA
1
mV
1, 2
ΔVLOAD
Load regulation
• current = + 1.0 mA
—
2
—
• current = - 1.0 mA
—
5
—
Tstup
Buffer startup time
—
—
100
µs
Vvdrift
Voltage drift (Vmax -Vmin across the full voltage
range)
—
2
—
mV
1
1. See the chip's Reference Manual for the appropriate settings of the VREF Status and Control register.
2. Load regulation voltage is the difference between the VREF_OUT voltage with no load vs. voltage with defined load
Table 36. VREF limited-range operating requirements
Symbol
Description
Min.
Max.
Unit
TA
Temperature
0
50
°C
Notes
Table 37. VREF limited-range operating behaviors
Symbol
Vout
Description
Voltage reference output with factory trim
Min.
Max.
Unit
1.173
1.225
V
Notes
6.7 Timers
See General switching specifications.
6.8 Communication interfaces
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
58
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
6.8.1 USB electrical specifications
The USB electricals for the USB On-the-Go module conform to the standards
documented by the Universal Serial Bus Implementers Forum. For the most up-to-date
standards, visit http://www.usb.org.
6.8.2 USB DCD electrical specifications
Table 38. USB DCD electrical specifications
Symbol
Description
Min.
Typ.
Max.
Unit
VDP_SRC
USB_DP source voltage (up to 250 μA)
0.5
—
0.7
V
Threshold voltage for logic high
0.8
—
2.0
V
VLGC
IDP_SRC
USB_DP source current
7
10
13
μA
IDM_SINK
USB_DM sink current
50
100
150
μA
RDM_DWN
D- pulldown resistance for data pin contact detect
14.25
—
24.8
kΩ
VDAT_REF
Data detect voltage
0.25
0.325
0.4
V
6.8.3 USB VREG electrical specifications
Table 39. USB VREG electrical specifications
Symbol
Description
Min.
Typ.1
Max.
Unit
VREGIN
Input supply voltage
2.7
—
5.5
V
IDDon
Quiescent current — Run mode, load current
equal zero, input supply (VREGIN) > 3.6 V
—
120
186
μA
IDDstby
Quiescent current — Standby mode, load
current equal zero
—
1.1
1.54
μA
IDDoff
Quiescent current — Shutdown mode
—
650
—
nA
—
—
4
μA
• VREGIN = 5.0 V and temperature=25C
• Across operating voltage and temperature
ILOADrun
Maximum load current — Run mode
—
—
120
mA
ILOADstby
Maximum load current — Standby mode
—
—
1
mA
VReg33out
Regulator output voltage — Input supply
(VREGIN) > 3.6 V
3
3.3
3.6
V
2.1
2.8
3.6
V
2.1
—
3.6
V
• Run mode
• Standby mode
VReg33out
Regulator output voltage — Input supply
(VREGIN) < 3.6 V, pass-through mode
Notes
2
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
59
Peripheral operating requirements and behaviors
Table 39. USB VREG electrical specifications
(continued)
Symbol
Description
Min.
Typ.1
Max.
Unit
COUT
External output capacitor
1.76
2.2
8.16
μF
ESR
External output capacitor equivalent series
resistance
1
—
100
mΩ
ILIM
Short circuit current
—
290
—
mA
Notes
1. Typical values assume VREGIN = 5.0 V, Temp = 25 °C unless otherwise stated.
2. Operating in pass-through mode: regulator output voltage equal to the input voltage minus a drop proportional to ILoad.
6.8.4 ULPI timing specifications
The ULPI interface is fully compliant with the industry standard UTMI+ Low Pin
Interface. Control and data timing requirements for the ULPI pins are given in the
following table. These timings apply to synchronous mode only. All timings are
measured with respect to the clock as seen at the USB_CLKIN pin.
Table 40. ULPI timing specifications
Num
Description
Min.
Typ.
Max.
Unit
USB_CLKIN
operating
frequency
—
60
—
MHz
USB_CLKIN duty
cycle
—
50
—
%
U1
USB_CLKIN clock
period
—
16.67
—
ns
U2
Input setup (control
and data)
5
—
—
ns
U3
Input hold (control
and data)
1
—
—
ns
U4
Output valid
(control and data)
—
—
9.5
ns
U5
Output hold
(control and data)
1
—
—
ns
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
60
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
U1
USB_CLKIN
U2
U3
ULPI_DIR/ULPI_NXT
(control input)
ULPI_DATAn (input)
U5
U4
ULPI_STP
(control output)
ULPI_DATAn (output)
Figure 25. ULPI timing diagram
6.8.5 CAN switching specifications
See General switching specifications.
6.8.6 DSPI switching specifications (limited voltage range)
The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with
master and slave operations. Many of the transfer attributes are programmable. The tables
below provide DSPI timing characteristics for classic SPI timing modes. Refer to the
DSPI chapter of the Reference Manual for information on the modified transfer formats
used for communicating with slower peripheral devices.
Table 41. Master mode DSPI timing (limited voltage range)
Num
Description
Min.
Max.
Unit
Operating voltage
2.7
3.6
V
Frequency of operation
—
30
MHz
2 x tBUS
—
ns
Notes
DS1
DSPI_SCK output cycle time
DS2
DSPI_SCK output high/low time
(tSCK/2) − 2
(tSCK/2) + 2
ns
DS3
DSPI_PCSn valid to DSPI_SCK delay
(tBUS x 2) −
2
—
ns
1
DS4
DSPI_SCK to DSPI_PCSn invalid delay
(tBUS x 2) −
2
—
ns
2
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
61
Peripheral operating requirements and behaviors
Table 41. Master mode DSPI timing (limited voltage range) (continued)
Num
Description
Min.
Max.
Unit
DS5
DSPI_SCK to DSPI_SOUT valid
—
8.5
ns
DS6
DSPI_SCK to DSPI_SOUT invalid
−2
—
ns
DS7
DSPI_SIN to DSPI_SCK input setup
15
—
ns
DS8
DSPI_SCK to DSPI_SIN input hold
0
—
ns
Notes
1. The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK].
2. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC].
DSPI_PCSn
DS3
DS1
DS2
DS4
DSPI_SCK
DS8
DS7
(CPOL=0)
DSPI_SIN
Data
First data
Last data
DS5
DSPI_SOUT
DS6
First data
Data
Last data
Figure 26. DSPI classic SPI timing — master mode
Table 42. Slave mode DSPI timing (limited voltage range)
Num
Description
Operating voltage
Min.
Max.
Unit
2.7
3.6
V
15
MHz
4 x tBUS
—
ns
(tSCK/2) − 2
(tSCK/2) + 2
ns
Frequency of operation
DS9
DSPI_SCK input cycle time
DS10
DSPI_SCK input high/low time
DS11
DSPI_SCK to DSPI_SOUT valid
—
10
ns
DS12
DSPI_SCK to DSPI_SOUT invalid
0
—
ns
DS13
DSPI_SIN to DSPI_SCK input setup
2
—
ns
DS14
DSPI_SCK to DSPI_SIN input hold
7
—
ns
DS15
DSPI_SS active to DSPI_SOUT driven
—
14
ns
DS16
DSPI_SS inactive to DSPI_SOUT not driven
—
14
ns
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
62
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
DSPI_SS
DS10
DS9
DSPI_SCK
DS15
(CPOL=0)
DSPI_SOUT
DS12
First data
DS13
DSPI_SIN
DS16
DS11
Last data
Data
DS14
First data
Data
Last data
Figure 27. DSPI classic SPI timing — slave mode
6.8.7 DSPI switching specifications (full voltage range)
The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with
master and slave operations. Many of the transfer attributes are programmable. The tables
below provides DSPI timing characteristics for classic SPI timing modes. Refer to the
DSPI chapter of the Reference Manual for information on the modified transfer formats
used for communicating with slower peripheral devices.
Table 43. Master mode DSPI timing (full voltage range)
Num
Description
Operating voltage
Frequency of operation
Min.
Max.
Unit
Notes
1.71
3.6
V
1
—
15
MHz
4 x tBUS
—
ns
DS1
DSPI_SCK output cycle time
DS2
DSPI_SCK output high/low time
(tSCK/2) - 4
(tSCK/2) + 4
ns
DS3
DSPI_PCSn valid to DSPI_SCK delay
(tBUS x 2) −
4
—
ns
2
DS4
DSPI_SCK to DSPI_PCSn invalid delay
(tBUS x 2) −
4
—
ns
3
DS5
DSPI_SCK to DSPI_SOUT valid
—
10
ns
DS6
DSPI_SCK to DSPI_SOUT invalid
-4.5
—
ns
DS7
DSPI_SIN to DSPI_SCK input setup
20.5
—
ns
DS8
DSPI_SCK to DSPI_SIN input hold
0
—
ns
1. The DSPI module can operate across the entire operating voltage for the processor, but to run across the full voltage
range the maximum frequency of operation is reduced.
2. The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK].
3. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC].
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
63
Peripheral operating requirements and behaviors
DSPI_PCSn
DS3
DS1
DS2
DS4
DSPI_SCK
DS8
DS7
(CPOL=0)
DSPI_SIN
Data
First data
Last data
DS5
DSPI_SOUT
DS6
First data
Data
Last data
Figure 28. DSPI classic SPI timing — master mode
Table 44. Slave mode DSPI timing (full voltage range)
Num
Description
Operating voltage
Frequency of operation
Min.
Max.
Unit
1.71
3.6
V
—
7.5
MHz
8 x tBUS
—
ns
(tSCK/2) - 4
(tSCK/2) + 4
ns
DS9
DSPI_SCK input cycle time
DS10
DSPI_SCK input high/low time
DS11
DSPI_SCK to DSPI_SOUT valid
—
20
ns
DS12
DSPI_SCK to DSPI_SOUT invalid
0
—
ns
DS13
DSPI_SIN to DSPI_SCK input setup
2
—
ns
DS14
DSPI_SCK to DSPI_SIN input hold
7
—
ns
DS15
DSPI_SS active to DSPI_SOUT driven
—
19
ns
DS16
DSPI_SS inactive to DSPI_SOUT not driven
—
19
ns
DSPI_SS
DS10
DS9
DSPI_SCK
(CPOL=0)
DS15
DSPI_SOUT
First data
DS13
DSPI_SIN
DS12
DS16
DS11
Data
Last data
DS14
First data
Data
Last data
Figure 29. DSPI classic SPI timing — slave mode
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
64
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
6.8.8 I2C switching specifications
See General switching specifications.
6.8.9 UART switching specifications
See General switching specifications.
6.8.10 SDHC specifications
The following timing specs are defined at the chip I/O pin and must be translated
appropriately to arrive at timing specs/constraints for the physical interface.
Table 45. SDHC switching specifications
Num
Symbol
Description
Min.
Max.
Unit
Operating voltage
2.7
3.6
V
Card input clock
SD1
fpp
Clock frequency (low speed)
0
400
kHz
fpp
Clock frequency (SD\SDIO full speed)
0
25
MHz
fpp
Clock frequency (MMC full speed)
0
20
MHz
fOD
Clock frequency (identification mode)
0
400
kHz
SD2
tWL
Clock low time
7
—
ns
SD3
tWH
Clock high time
7
—
ns
SD4
tTLH
Clock rise time
—
3
ns
SD5
tTHL
Clock fall time
—
3
ns
SDHC output / card inputs SDHC_CMD, SDHC_DAT (reference to SDHC_CLK)
SD6
tOD
SDHC output delay (output valid)
-5
6.5
ns
SDHC input / card inputs SDHC_CMD, SDHC_DAT (reference to SDHC_CLK)
SD7
tISU
SDHC input setup time
5
—
ns
SD8
tIH
SDHC input hold time
0
—
ns
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
65
Peripheral operating requirements and behaviors
SD3
SD2
SD1
SDHC_CLK
SD6
Output SDHC_CMD
Output SDHC_DAT[3:0]
SD7
SD8
Input SDHC_CMD
Input SDHC_DAT[3:0]
Figure 30. SDHC timing
6.8.11 I2S/SAI Switching Specifications
This section provides the AC timing for the I2S/SAI module in master mode (clocks are
driven) and slave mode (clocks are input). All timing is given for noninverted serial clock
polarity (TCR2[BCP] is 0, RCR2[BCP] is 0) and a noninverted frame sync (TCR4[FSP]
is 0, RCR4[FSP] is 0). If the polarity of the clock and/or the frame sync have been
inverted, all the timing remains valid by inverting the bit clock signal (BCLK) and/or the
frame sync (FS) signal shown in the following figures.
Table 46. I2S/SAI master mode timing
Num.
Characteristic
Min.
Max.
3.6
Unit
Operating voltage
1.71
V
S1
I2S_MCLK cycle time1
40
S2
I2S_MCLK pulse width high/low
45%
55%
MCLK period
S3
I2S_TX_BCLK cycle time (output)1
80
—
ns
I2S_RX_BCLK cycle time (output)1
160
—
S4
I2S_TX_BCLK pulse width high/low
45%
55%
BCLK period
S5
I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/
I2S_RX_FS output valid
—
15
ns
S6
I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/
I2S_RX_FS output invalid
0
—
ns
S7
I2S_TX_BCLK to I2S_TXD valid
—
15
ns
S8
I2S_TX_BCLK to I2S_TXD invalid
0
—
ns
S9
I2S_RXD/I2S_RX_FS input setup before
I2S_RX_BCLK
25
—
ns
ns
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
66
Preliminary
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 46. I2S/SAI master mode timing (continued)
Num.
Characteristic
Min.
Max.
Unit
S10
I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK
0
—
ns
S11
I2S_TX_FS input assertion to I2S_TXD output valid2
—
21
ns
1. This parameter is limited in VLPx modes.
2. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear
S1
S2
S2
I2S_MCLK (output)
S3
I2S_TX_BCLK/
I2S_RX_BCLK (output)
S4
S4
S6
S5
I2S_TX_FS/
I2S_RX_FS (output)
S10
S9
I2S_TX_FS/
I2S_RX_FS (input)
S7
S8
S7
S8
I2S_TXD
S9
S10
I2S_RXD
Figure 31. I2S/SAI timing — master modes
Table 47. I2S/SAI slave mode timing
Num.
Characteristic
Min.
Max.
Unit
Operating voltage
1.71
3.6
V
I2S_RX_BCLK cycle time (input)
80
—
ns
I2S_TX_BCLK cycle time (input)
160
—
S12
I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low
(input)
45%
55%
MCLK period
S13
I2S_TX_FS/I2S_RX_FS input setup before
I2S_TX_BCLK/I2S_RX_BCLK
10
—
ns
S14
I2S_TX_FS/I2S_RX_FS input hold after
I2S_TX_BCLK/I2S_RX_BCLK
2
—
ns
S15
I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid
—
29
ns
S16
I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid
0
—
ns
S17
I2S_RXD setup before I2S_RX_BCLK
10
—
ns
S18
I2S_RXD hold after I2S_RX_BCLK
2
—
ns
S19
I2S_TX_FS input assertion to I2S_TXD output valid1
—
21
ns
S11
1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
67
Peripheral operating requirements and behaviors
S11
S12
I2S_TX_BCLK/
I2S_RX_BCLK (input)
S12
S15
S16
I2S_TX_FS/
I2S_RX_FS (output)
S13
S14
I2S_TX_FS/
I2S_RX_FS (input)
S15
S16
S15
S16
I2S_TXD
S17
S18
I2S_RXD
Figure 32. I2S/SAI timing — slave modes
6.9 Human-machine interfaces (HMI)
6.9.1 TSI electrical specifications
Table 48. TSI electrical specifications
Symbol
Description
Min.
Typ.
Max.
Unit
VDDTSI
Operating voltage
1.71
—
3.6
V
Target electrode capacitance range
1
20
500
pF
1
fREFmax
Reference oscillator frequency
—
8
TBD
MHz
2
fELEmax
Electrode oscillator frequency
—
0.5
TBD
MHz
2
Internal reference capacitor
TBD
1
TBD
pF
Oscillator delta voltage
TBD
600
TBD
mV
2
—
1.133
1.5
μA
2, 3
—
36
50
—
1.133
1.5
μA
2, 4
—
36
50
CELE
CREF
VDELTA
IREF
IELE
Reference oscillator current source base current
• 1uA setting (REFCHRG=0)
• 32uA setting (REFCHRG=31)
Electrode oscillator current source base current
• 1uA setting (EXTCHRG=0)
• 32uA setting (EXTCHRG=31)
Notes
Pres5
Electrode capacitance measurement precision
—
8.3333
38.4
pF/count
5
Pres20
Electrode capacitance measurement precision
—
8.3333
38.4
pF/count
6
Pres100
Electrode capacitance measurement precision
—
8.3333
38.4
pF/count
7
MaxSens
Maximum sensitivity
0.003
12.5
—
fF/count
8
—
—
16
bits
Res
Resolution
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
68
Preliminary
Freescale Semiconductor, Inc.
Dimensions
Table 48. TSI electrical specifications (continued)
Symbol
Description
TCon20
ITSI_RUN
ITSI_LP
Min.
Typ.
Max.
Unit
Notes
Response time @ 20 pF
8
15
25
μs
9
Current added in run mode
—
55
—
μA
Low power mode current adder
—
1.3
TBD
μA
10
1.
2.
3.
4.
5.
6.
7.
8.
The TSI module is functional with capacitance values outside this range. However, optimal performance is not guaranteed.
Fixed external capacitance of 20 pF.
The programmable current source value is generated by multiplying the SCANC[REFCHRG] value and the base current.
The programmable current source value is generated by multiplying the SCANC[EXTCHRG] value and the base current.
Measured with a 5 pF electrode, reference oscillator frequency of 10 MHz, PS = 128, NSCN = 8; Iext = 16.
Measured with a 20 pF electrode, reference oscillator frequency of 10 MHz, PS = 128, NSCN = 2; Iext = 16.
Measured with a 20 pF electrode, reference oscillator frequency of 10 MHz, PS = 16, NSCN = 3; Iext = 16.
Sensitivity defines the minimum capacitance change when a single count from the TSI module changes, it is equal to (Cref
* Iext)/( Iref * PS * NSCN). Sensitivity depends on the configuration used. The typical value listed is based on the following
configuration: Iext = 5 μA, EXTCHRG = 4, PS = 128, NSCN = 2, Iref = 16 μA, REFCHRG = 15, Cref = 1.0 pF. The minimum
sensitivity describes the smallest possible capacitance that can be measured by a single count (this is the best sensitivity
but is described as a minimum because it’s the smallest number). The minimum sensitivity parameter is based on the
following configuration: Iext = 1 μA, EXTCHRG = 0, PS = 128, NSCN = 32, Iref = 32 μA, REFCHRG = 31, Cref= 0.5 pF
9. Time to do one complete measurement of the electrode. Sensitivity resolution of 0.0133 pF, PS = 0, NSCN = 0, 1
electrode, EXTCHRG = 15.
10. REFCHRG=0, EXTCHRG=4, PS=7, NSCN=0F, LPSCNITV=F, LPO is selected (1 kHz), and fixed external capacitance of
20 pF. Data is captured with an average of 7 periods window.
7 Dimensions
7.1 Obtaining package dimensions
Package dimensions are provided in package drawings.
To find a package drawing, go to http://www.freescale.com and perform a keyword
search for the drawing’s document number:
If you want the drawing for this package
Then use this document number
144-pin LQFP
98ASS23177W
144-pin MAPBGA
98ASA00222D
8 Pinout
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
69
Pinout
8.1 K20 Signal Multiplexing and Pin Assignments
The following table shows the signals available on each pin and the locations of these
pins on the devices supported by this document. The Port Control Module is responsible
for selecting which ALT functionality is available on each pin.
144 144
LQF MAP
P BGA
Pin Name
Default
ALT0
ALT1
ALT2
ALT3
ALT4
ALT5
ALT6
ALT7
—
L5
RTC_WAKE RTC_WAKE RTC_WAKE
UP_B
UP_B
UP_B
—
M5
NC
NC
NC
—
A10 NC
NC
NC
—
B10 NC
NC
NC
—
C10 NC
NC
NC
1
D3
PTE0
ADC1_SE4
a
ADC1_SE4
a
PTE0
SPI1_PCS1 UART1_TX
SDHC0_D1
I2C1_SDA
RTC_CLKO
UT
2
D2
PTE1/
LLWU_P0
ADC1_SE5
a
ADC1_SE5
a
PTE1/
LLWU_P0
SPI1_SOUT UART1_RX
SDHC0_D0
I2C1_SCL
SPI1_SIN
3
D1
PTE2/
LLWU_P1
ADC1_SE6
a
ADC1_SE6
a
PTE2/
LLWU_P1
SPI1_SCK
UART1_CT
S_b
SDHC0_DC
LK
4
E4
PTE3
ADC1_SE7
a
ADC1_SE7
a
PTE3
SPI1_SIN
UART1_RT
S_b
SDHC0_CM
D
5
E5
VDD
VDD
VDD
6
F6
VSS
VSS
VSS
7
E3
PTE4/
LLWU_P2
DISABLED
PTE4/
LLWU_P2
SPI1_PCS0 UART3_TX
SDHC0_D3
8
E2
PTE5
DISABLED
PTE5
SPI1_PCS2 UART3_RX
SDHC0_D2
FTM3_CH0
9
E1
PTE6
DISABLED
PTE6
SPI1_PCS3 UART3_CT
S_b
I2S0_MCLK
FTM3_CH1
10
F4
PTE7
DISABLED
PTE7
UART3_RT
S_b
I2S0_RXD0
FTM3_CH2
11
F3
PTE8
ADC2_SE1
6
ADC2_SE1
6
PTE8
I2S0_RXD1 UART5_TX
I2S0_RX_F
S
FTM3_CH3
12
F2
PTE9
ADC2_SE1
7
ADC2_SE1
7
PTE9
I2S0_TXD1
UART5_RX
I2S0_RX_B
CLK
FTM3_CH4
13
F1
PTE10
DISABLED
PTE10
UART5_CT
S_b
I2S0_TXD0
FTM3_CH5
14
G4
PTE11
ADC3_SE1
6
ADC3_SE1
6
PTE11
UART5_RT
S_b
I2S0_TX_F
S
FTM3_CH6
15
G3
PTE12
ADC3_SE1
7
ADC3_SE1
7
PTE12
I2S0_TX_B
CLK
FTM3_CH7
16
E6
VDD
VDD
VDD
17
F7
VSS
VSS
VSS
18
H3
VSS
VSS
VSS
19
H1
USB0_DP
USB0_DP
USB0_DP
20
H2
USB0_DM
USB0_DM
USB0_DM
21
G1
VOUT33
VOUT33
VOUT33
EzPort
SPI1_SOUT
USB_SOF_
OUT
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
70
Preliminary
Freescale Semiconductor, Inc.
Pinout
144 144
LQF MAP
P BGA
Pin Name
Default
ALT0
22
G2
VREGIN
VREGIN
VREGIN
23
J1
PGA2_DP/
ADC2_DP0/
ADC3_DP3/
ADC0_DP1
PGA2_DP/
ADC2_DP0/
ADC3_DP3/
ADC0_DP1
PGA2_DP/
ADC2_DP0/
ADC3_DP3/
ADC0_DP1
24
J2
PGA2_DM/
ADC2_DM0/
ADC3_DM3/
ADC0_DM1
PGA2_DM/
ADC2_DM0/
ADC3_DM3/
ADC0_DM1
PGA2_DM/
ADC2_DM0/
ADC3_DM3/
ADC0_DM1
25
K1
PGA3_DP/
ADC3_DP0/
ADC2_DP3/
ADC1_DP1
PGA3_DP/
ADC3_DP0/
ADC2_DP3/
ADC1_DP1
PGA3_DP/
ADC3_DP0/
ADC2_DP3/
ADC1_DP1
26
K2
PGA3_DM/
ADC3_DM0/
ADC2_DM3/
ADC1_DM1
PGA3_DM/
ADC3_DM0/
ADC2_DM3/
ADC1_DM1
PGA3_DM/
ADC3_DM0/
ADC2_DM3/
ADC1_DM1
27
L1
PGA0_DP/ PGA0_DP/ PGA0_DP/
ADC0_DP0/ ADC0_DP0/ ADC0_DP0/
ADC1_DP3 ADC1_DP3 ADC1_DP3
28
L2
PGA0_DM/ PGA0_DM/ PGA0_DM/
ADC0_DM0/ ADC0_DM0/ ADC0_DM0/
ADC1_DM3 ADC1_DM3 ADC1_DM3
29
M1
PGA1_DP/ PGA1_DP/ PGA1_DP/
ADC1_DP0/ ADC1_DP0/ ADC1_DP0/
ADC0_DP3 ADC0_DP3 ADC0_DP3
30
M2
PGA1_DM/ PGA1_DM/ PGA1_DM/
ADC1_DM0/ ADC1_DM0/ ADC1_DM0/
ADC0_DM3 ADC0_DM3 ADC0_DM3
31
H5
VDDA
VDDA
VDDA
32
G5
VREFH
VREFH
VREFH
33
G6
VREFL
VREFL
VREFL
34
H6
VSSA
VSSA
VSSA
35
K3
ADC1_SE1
6/
CMP2_IN2/
ADC0_SE2
2
ADC1_SE1
6/
CMP2_IN2/
ADC0_SE2
2
ADC1_SE1
6/
CMP2_IN2/
ADC0_SE2
2
36
J3
ADC0_SE1
6/
CMP1_IN2/
ADC0_SE2
1
ADC0_SE1
6/
CMP1_IN2/
ADC0_SE2
1
ADC0_SE1
6/
CMP1_IN2/
ADC0_SE2
1
37
M3
VREF_OUT/
CMP1_IN5/
CMP0_IN5/
ADC1_SE1
8
VREF_OUT/
CMP1_IN5/
CMP0_IN5/
ADC1_SE1
8
VREF_OUT/
CMP1_IN5/
CMP0_IN5/
ADC1_SE1
8
38
L3
DAC0_OUT/ DAC0_OUT/ DAC0_OUT/
CMP1_IN3/ CMP1_IN3/ CMP1_IN3/
ALT1
ALT2
ALT3
ALT4
ALT5
ALT6
ALT7
EzPort
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
71
Pinout
144 144
LQF MAP
P BGA
Pin Name
Default
ALT0
ADC0_SE2
3
ADC0_SE2
3
ADC0_SE2
3
ALT1
ALT2
ALT3
ALT4
ALT5
ALT6
ALT7
EzPort
39
L4
DAC1_OUT/
CMP0_IN4/
CMP2_IN3/
ADC1_SE2
3
DAC1_OUT/
CMP0_IN4/
CMP2_IN3/
ADC1_SE2
3
DAC1_OUT/
CMP0_IN4/
CMP2_IN3/
ADC1_SE2
3
40
M7
XTAL32
XTAL32
XTAL32
41
M6
EXTAL32
EXTAL32
EXTAL32
42
L6
VBAT
VBAT
VBAT
43
—
VDD
VDD
VDD
44
—
VSS
VSS
VSS
45
M4
PTE24
ADC0_SE1
7/EXTAL1
ADC0_SE1
7/EXTAL1
PTE24
CAN1_TX
UART4_TX
I2S1_TX_F
S
EWM_OUT
_b
I2S1_RXD1
46
K5
PTE25
ADC0_SE1
8/XTAL1
ADC0_SE1
8/XTAL1
PTE25
CAN1_RX
UART4_RX
I2S1_TX_B
CLK
EWM_IN
I2S1_TXD1
47
K4
PTE26
ADC3_SE5
b
ADC3_SE5
b
PTE26
UART4_CT
S_b
I2S1_TXD0
RTC_CLKO USB_CLKIN
UT
48
J4
PTE27
ADC3_SE4
b
ADC3_SE4
b
PTE27
UART4_RT
S_b
I2S1_MCLK
49
H4
PTE28
ADC3_SE7
a
ADC3_SE7
a
PTE28
50
J5
PTA0
JTAG_TCL
K/
SWD_CLK/
EZP_CLK
TSI0_CH1
PTA0
UART0_CT FTM0_CH5
S_b/
UART0_CO
L_b
JTAG_TCL
K/
SWD_CLK
EZP_CLK
51
J6
PTA1
JTAG_TDI/
EZP_DI
TSI0_CH2
PTA1
UART0_RX
FTM0_CH6
JTAG_TDI
EZP_DI
52
K6
PTA2
JTAG_TDO/ TSI0_CH3
TRACE_SW
O/EZP_DO
PTA2
UART0_TX
FTM0_CH7
JTAG_TDO/ EZP_DO
TRACE_SW
O
53
K7
PTA3
JTAG_TMS/ TSI0_CH4
SWD_DIO
PTA3
UART0_RT
S_b
FTM0_CH0
JTAG_TMS/
SWD_DIO
54
L7
PTA4/
LLWU_P3
NMI_b/
EZP_CS_b
PTA4/
LLWU_P3
FTM0_CH1
NMI_b
55
M8
PTA5
DISABLED
56
E7
VDD
VDD
VDD
57
G7
VSS
VSS
VSS
58
J7
PTA6
ADC3_SE6
a
59
J8
PTA7
60
K8
61
L8
TSI0_CH5
PTA5
USB_CLKIN FTM0_CH2
CMP2_OUT I2S0_TX_B
CLK
ADC3_SE6
a
PTA6
ULPI_CLK
FTM0_CH3
I2S1_RXD0 CLKOUT
TRACE_CL
KOUT
ADC0_SE1
0
ADC0_SE1
0
PTA7
ULPI_DIR
FTM0_CH4
I2S1_RX_B
CLK
TRACE_D3
PTA8
ADC0_SE1
1
ADC0_SE1
1
PTA8
ULPI_NXT
FTM1_CH0
I2S1_RX_F
S
PTA9
ADC3_SE5
a
ADC3_SE5
a
PTA9
ULPI_STP
FTM1_CH1
EZP_CS_b
JTAG_TRS
T_b
FTM1_QD_
PHA
TRACE_D2
FTM1_QD_
PHB
TRACE_D1
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
72
Preliminary
Freescale Semiconductor, Inc.
Pinout
144 144
LQF MAP
P BGA
Pin Name
Default
ALT0
ALT1
ALT2
ALT3
ALT4
ALT5
ALT6
ALT7
TRACE_D0
62
M9
PTA10
ADC3_SE4
a
ADC3_SE4
a
PTA10
ULPI_DATA FTM2_CH0
0
FTM2_QD_
PHA
63
L9
PTA11
ADC3_SE1
5
ADC3_SE1
5
PTA11
ULPI_DATA FTM2_CH1
1
FTM2_QD_
PHB
64
K9
PTA12
CMP2_IN0
CMP2_IN0
PTA12
CAN0_TX
FTM1_CH0
I2S0_TXD0
FTM1_QD_
PHA
65
J9
PTA13/
LLWU_P4
CMP2_IN1
CMP2_IN1
PTA13/
LLWU_P4
CAN0_RX
FTM1_CH1
I2S0_TX_F
S
FTM1_QD_
PHB
66
L10 PTA14
CMP3_IN0
CMP3_IN0
PTA14
SPI0_PCS0 UART0_TX
I2S0_RX_B
CLK
I2S0_TXD1
67
L11 PTA15
CMP3_IN1
CMP3_IN1
PTA15
SPI0_SCK
UART0_RX
I2S0_RXD0
68
K10 PTA16
CMP3_IN2
CMP3_IN2
PTA16
SPI0_SOUT UART0_CT
S_b/
UART0_CO
L_b
I2S0_RX_F
S
69
K11 PTA17
ADC1_SE1
7
ADC1_SE1
7
PTA17
SPI0_SIN
I2S0_MCLK
70
E8
VDD
VDD
VDD
71
G8
VSS
VSS
VSS
72
M12 PTA18
EXTAL0
EXTAL0
PTA18
FTM0_FLT2 FTM_CLKIN
0
73
M11 PTA19
XTAL0
XTAL0
PTA19
FTM1_FLT0 FTM_CLKIN
1
74
L12 RESET_b
RESET_b
RESET_b
75
K12 PTA24
CMP3_IN4
CMP3_IN4
PTA24
ULPI_DATA
2
FB_A29
76
J12
PTA25
CMP3_IN5
CMP3_IN5
PTA25
ULPI_DATA
3
FB_A28
77
J11
PTA26
ADC2_SE1
5
ADC2_SE1
5
PTA26
ULPI_DATA
4
FB_A27
78
J10
PTA27
ADC2_SE1
4
ADC2_SE1
4
PTA27
ULPI_DATA
5
FB_A26
79
H12 PTA28
ADC2_SE1
3
ADC2_SE1
3
PTA28
ULPI_DATA
6
FB_A25
80
H11 PTA29
ADC2_SE1
2
ADC2_SE1
2
PTA29
ULPI_DATA
7
FB_A24
81
H10 PTB0/
LLWU_P5
ADC0_SE8/
ADC1_SE8/
ADC2_SE8/
ADC3_SE8/
TSI0_CH0
ADC0_SE8/ PTB0/
ADC1_SE8/ LLWU_P5
ADC2_SE8/
ADC3_SE8/
TSI0_CH0
I2C0_SCL
FTM1_CH0
FTM1_QD_
PHA
82
H9
ADC0_SE9/
ADC1_SE9/
ADC2_SE9/
ADC3_SE9/
TSI0_CH6
ADC0_SE9/ PTB1
ADC1_SE9/
ADC2_SE9/
ADC3_SE9/
TSI0_CH6
I2C0_SDA
FTM1_CH1
FTM1_QD_
PHB
83
G12 PTB2
ADC0_SE1 ADC0_SE1 PTB2
2/TSI0_CH7 2/TSI0_CH7
I2C0_SCL
UART0_RT
S_b
FTM0_FLT3
PTB1
UART0_RT
S_b
EzPort
I2S0_RXD1
LPTMR0_A
LT1
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
73
Pinout
144 144
LQF MAP
P BGA
Pin Name
Default
ALT0
ALT1
ALT2
ALT4
ALT5
UART0_CT
S_b/
UART0_CO
L_b
ALT6
84
G11 PTB3
ADC0_SE1 ADC0_SE1 PTB3
3/TSI0_CH8 3/TSI0_CH8
85
G10 PTB4
ADC1_SE1
0
ADC1_SE1
0
PTB4
FTM1_FLT0
86
G9
PTB5
ADC1_SE1
1
ADC1_SE1
1
PTB5
FTM2_FLT0
87
F12 PTB6
ADC1_SE1
2
ADC1_SE1
2
PTB6
FB_AD23
88
F11 PTB7
ADC1_SE1
3
ADC1_SE1
3
PTB7
FB_AD22
89
F10 PTB8
DISABLED
PTB8
UART3_RT
S_b
FB_AD21
90
F9
DISABLED
PTB9
SPI1_PCS1 UART3_CT
S_b
FB_AD20
91
E12 PTB10
ADC1_SE1
4
ADC1_SE1
4
PTB10
SPI1_PCS0 UART3_RX
I2S1_TX_B
CLK
FB_AD19
FTM0_FLT1
92
E11 PTB11
ADC1_SE1
5
ADC1_SE1
5
PTB11
SPI1_SCK
UART3_TX
I2S1_TX_F
S
FB_AD18
FTM0_FLT2
93
H7
VSS
VSS
VSS
94
F5
VDD
VDD
VDD
95
E10 PTB16
TSI0_CH9
TSI0_CH9
PTB16
SPI1_SOUT UART0_RX
I2S1_TXD0
FB_AD17
EWM_IN
96
E9
PTB17
TSI0_CH10
TSI0_CH10
PTB17
SPI1_SIN
UART0_TX
I2S1_TXD1
FB_AD16
EWM_OUT
_b
97
D12 PTB18
TSI0_CH11
TSI0_CH11
PTB18
CAN0_TX
FTM2_CH0
I2S0_TX_B
CLK
FB_AD15
FTM2_QD_
PHA
98
D11 PTB19
TSI0_CH12
TSI0_CH12
PTB19
CAN0_RX
FTM2_CH1
I2S0_TX_F
S
FB_OE_b
FTM2_QD_
PHB
99
D10 PTB20
ADC2_SE4
a
ADC2_SE4
a
PTB20
SPI2_PCS0
FB_AD31/ CMP0_OUT
NFC_DATA
15
100
D9
PTB21
ADC2_SE5
a
ADC2_SE5
a
PTB21
SPI2_SCK
FB_AD30/ CMP1_OUT
NFC_DATA
14
101
C12 PTB22
DISABLED
PTB22
SPI2_SOUT
FB_AD29/ CMP2_OUT
NFC_DATA
13
102
C11 PTB23
DISABLED
PTB23
SPI2_SIN
SPI0_PCS5
FB_AD28/ CMP3_OUT
NFC_DATA
12
103
B12 PTC0
ADC0_SE1
4/
TSI0_CH13
ADC0_SE1
4/
TSI0_CH13
PTC0
SPI0_PCS4 PDB0_EXT
RG
FB_AD14/ I2S0_TXD1
NFC_DATA
11
104
B11 PTC1/
LLWU_P6
ADC0_SE1
5/
TSI0_CH14
ADC0_SE1
5/
TSI0_CH14
PTC1/
LLWU_P6
SPI0_PCS3 UART1_RT
S_b
PTB9
I2C0_SDA
ALT3
ALT7
EzPort
FTM0_FLT0
FTM0_CH0
FB_AD13/ I2S0_TXD0
NFC_DATA
10
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
74
Preliminary
Freescale Semiconductor, Inc.
Pinout
144 144
LQF MAP
P BGA
Pin Name
Default
ALT0
ALT1
ALT2
ALT3
ALT4
ALT5
ALT6
ALT7
105
A12 PTC2
ADC0_SE4
b/
CMP1_IN0/
TSI0_CH15
ADC0_SE4
b/
CMP1_IN0/
TSI0_CH15
PTC2
SPI0_PCS2 UART1_CT
S_b
FTM0_CH1
FB_AD12/ I2S0_TX_F
NFC_DATA S
9
106
A11 PTC3/
LLWU_P7
CMP1_IN1
CMP1_IN1
PTC3/
LLWU_P7
SPI0_PCS1 UART1_RX
FTM0_CH2
CLKOUT
107
H8
VSS
VSS
VSS
108
—
VDD
VDD
VDD
109
A9
PTC4/
LLWU_P8
DISABLED
PTC4/
LLWU_P8
SPI0_PCS0 UART1_TX
FTM0_CH3
FB_AD11/ CMP1_OUT I2S1_TX_B
NFC_DATA
CLK
8
110
D8
PTC5/
LLWU_P9
DISABLED
PTC5/
LLWU_P9
SPI0_SCK
I2S0_RXD0 FB_AD10/ CMP0_OUT I2S1_TX_F
NFC_DATA
S
7
111
C8
PTC6/
LLWU_P10
CMP0_IN0
CMP0_IN0
PTC6/
LLWU_P10
SPI0_SOUT PDB0_EXT
RG
I2S0_RX_B
CLK
FB_AD9/
I2S0_MCLK
NFC_DATA
6
112
B8
PTC7
CMP0_IN1
CMP0_IN1
PTC7
SPI0_SIN
USB_SOF_
OUT
I2S0_RX_F
S
FB_AD8/
NFC_DATA
5
113
A8
PTC8
ADC1_SE4
b/
CMP0_IN2
ADC1_SE4
b/
CMP0_IN2
PTC8
FTM3_CH4
I2S0_MCLK FB_AD7/
NFC_DATA
4
114
D7
PTC9
ADC1_SE5
b/
CMP0_IN3
ADC1_SE5
b/
CMP0_IN3
PTC9
FTM3_CH5
I2S0_RX_B
CLK
FB_AD6/
FTM2_FLT0
NFC_DATA
3
115
C7
PTC10
ADC1_SE6
b
ADC1_SE6
b
PTC10
I2C1_SCL
FTM3_CH6
I2S0_RX_F
S
FB_AD5/
I2S1_MCLK
NFC_DATA
2
116
B7
PTC11/
LLWU_P11
ADC1_SE7
b
ADC1_SE7
b
PTC11/
LLWU_P11
I2C1_SDA
FTM3_CH7
I2S0_RXD1 FB_RW_b/
NFC_WE
117
A7
PTC12
DISABLED
PTC12
UART4_RT
S_b
FB_AD27
118
D6
PTC13
DISABLED
PTC13
UART4_CT
S_b
FB_AD26
119
C6
PTC14
DISABLED
PTC14
UART4_RX
FB_AD25
120
B6
PTC15
DISABLED
PTC15
UART4_TX
FB_AD24
121
—
VSS
VSS
VSS
122
—
VDD
VDD
VDD
123
A6
PTC16
DISABLED
PTC16
CAN1_RX
UART3_RX
FB_CS5_b/ NFC_RB
FB_TSIZ1/
FB_BE23_1
6_b
124
D5
PTC17
DISABLED
PTC17
CAN1_TX
UART3_TX
FB_CS4_b/ NFC_CE0_
FB_TSIZ0/ b
FB_BE31_2
4_b
LPTMR0_A
LT2
EzPort
I2S0_TX_B
CLK
FTM3_FLT0
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
75
Pinout
144 144
LQF MAP
P BGA
Pin Name
Default
ALT0
ALT1
ALT2
ALT3
ALT4
ALT5
ALT6
125
C5
PTC18
DISABLED
PTC18
UART3_RT
S_b
FB_TBST_b NFC_CE1_
/FB_CS2_b/ b
FB_BE15_8
_b
126
B5
PTC19
DISABLED
PTC19
UART3_CT
S_b
FB_CS3_b/ FB_TA_b
FB_BE7_0_
b
127
A5
PTD0/
LLWU_P12
DISABLED
PTD0/
LLWU_P12
SPI0_PCS0 UART2_RT
S_b
FTM3_CH0
FB_ALE/
FB_CS1_b/
FB_TS_b
I2S1_RXD1
128
D4
PTD1
ADC0_SE5
b
PTD1
SPI0_SCK
UART2_CT
S_b
FTM3_CH1
FB_CS0_b
I2S1_RXD0
129
C4
PTD2/
LLWU_P13
DISABLED
PTD2/
LLWU_P13
SPI0_SOUT UART2_RX
FTM3_CH2
FB_AD4
I2S1_RX_F
S
130
B4
PTD3
DISABLED
PTD3
SPI0_SIN
UART2_TX
FTM3_CH3
FB_AD3
I2S1_RX_B
CLK
131
A4
PTD4/
LLWU_P14
DISABLED
PTD4/
LLWU_P14
SPI0_PCS1 UART0_RT
S_b
FTM0_CH4
FB_AD2/
EWM_IN
NFC_DATA
1
132
A3
PTD5
ADC0_SE6
b
ADC0_SE6
b
PTD5
SPI0_PCS2 UART0_CT FTM0_CH5
S_b/
UART0_CO
L_b
FB_AD1/
EWM_OUT
NFC_DATA _b
0
133
A2
PTD6/
LLWU_P15
ADC0_SE7
b
ADC0_SE7
b
PTD6/
LLWU_P15
SPI0_PCS3 UART0_RX
FTM0_CH6
FB_AD0
134
M10 VSS
VSS
VSS
135
F8
VDD
VDD
VDD
136
A1
PTD7
DISABLED
PTD7
CMT_IRO
UART0_TX
FTM0_CH7
137
C9
PTD8
DISABLED
PTD8
I2C0_SCL
UART5_RX
FB_A16/
NFC_CLE
138
B9
PTD9
DISABLED
PTD9
I2C0_SDA
UART5_TX
FB_A17/
NFC_ALE
139
B3
PTD10
DISABLED
PTD10
UART5_RT
S_b
FB_A18/
NFC_RE
140
B2
PTD11
DISABLED
PTD11
SPI2_PCS0 UART5_CT
S_b
141
B1
PTD12
DISABLED
PTD12
SPI2_SCK
142
C3
PTD13
DISABLED
PTD13
143
C2
PTD14
DISABLED
144
C1
PTD15
DISABLED
ADC0_SE5
b
ALT7
EzPort
FTM0_FLT0
FTM0_FLT1
SDHC0_CL
KIN
FB_A19
FTM3_FLT0 SDHC0_D4
FB_A20
SPI2_SOUT
SDHC0_D5
FB_A21
PTD14
SPI2_SIN
SDHC0_D6
FB_A22
PTD15
SPI2_PCS1
SDHC0_D7
FB_A23
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
76
Preliminary
Freescale Semiconductor, Inc.
Pinout
8.2 K20 Pinouts
PTD15
PTD14
PTD13
PTD12
PTD11
PTD10
PTD9
PTD8
PTD7
VDD
VSS
PTD6/LLWU_P15
PTD5
PTD4/LLWU_P14
PTD3
PTD2/LLWU_P13
PTD1
PTD0/LLWU_P12
PTC19
PTC18
PTC17
PTC16
VDD
VSS
PTC15
PTC14
PTC13
PTC12
PTC11/LLWU_P11
PTC10
PTC9
PTC8
PTC7
PTC6/LLWU_P10
PTC5/LLWU_P9
PTC4/LLWU_P8
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
The below figure shows the pinout diagram for the devices supported by this document.
Many signals may be multiplexed onto a single pin. To determine what signals can be
used on which pin, see the previous section.
PTE0
1
108
VDD
PTE1/LLWU_P0
2
107
VSS
PTE2/LLWU_P1
3
106
PTC3/LLWU_P7
PTE3
4
105
PTC2
VDD
5
104
PTC1/LLWU_P6
VSS
6
103
PTC0
PTE4/LLWU_P2
7
102
PTB23
PTE5
8
101
PTB22
PTE6
9
100
PTB21
PTE7
10
99
PTB20
RESET_b
ADC0_SE16/CMP1_IN2/ADC0_SE21
36
73
PTA19
72
74
PTA18
35
71
PTA24
ADC1_SE16/CMP2_IN2/ADC0_SE22
VSS
75
70
34
VDD
PTA25
VSSA
69
PTA26
76
PTA17
77
33
68
32
VREFL
PTA16
VREFH
67
PTA27
PTA15
78
66
31
PTA14
PTA28
VDDA
65
79
PTA13/LLWU_P4
30
64
PTA29
PGA1_DM/ADC1_DM0/ADC0_DM3
PTA12
80
63
29
PTA11
PTB0/LLWU_P5
PGA1_DP/ADC1_DP0/ADC0_DP3
62
81
PTA10
28
61
PTB1
PGA0_DM/ADC0_DM0/ADC1_DM3
PTA9
82
60
27
PTA8
PTB2
PGA0_DP/ADC0_DP0/ADC1_DP3
59
83
PTA7
26
58
PTB3
PGA3_DM/ADC3_DM0/ADC2_DM3/ADC1_DM1
PTA6
84
57
25
VSS
PTB4
PGA3_DP/ADC3_DP0/ADC2_DP3/ADC1_DP1
56
85
VDD
24
55
PTB5
PGA2_DM/ADC2_DM0/ADC3_DM3/ADC0_DM1
PTA5
86
54
23
PTA4/LLWU_P3
PTB6
PGA2_DP/ADC2_DP0/ADC3_DP3/ADC0_DP1
53
87
PTA3
22
52
PTB7
VREGIN
PTA2
88
51
21
PTA1
PTB8
VOUT33
50
89
PTA0
20
49
PTB9
USB0_DM
PTE28
90
48
19
PTE27
PTB10
USB0_DP
47
91
PTE26
18
46
PTB11
VSS
PTE25
92
45
17
PTE24
VSS
VSS
44
93
VSS
16
43
VDD
VDD
VDD
94
42
15
VBAT
PTB16
PTE12
41
95
EXTAL32
14
40
PTB17
PTE11
XTAL32
96
39
13
DAC1_OUT/CMP0_IN4/CMP2_IN3/ADC1_SE23
PTB18
PTE10
38
PTB19
97
37
98
12
DAC0_OUT/CMP1_IN3/ADC0_SE23
11
VREF_OUT/CMP1_IN5/CMP0_IN5/ADC1_SE18
PTE8
PTE9
Figure 33. K20 144 LQFP Pinout Diagram
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
77
Revision History
1
2
3
4
5
6
7
8
9
10
11
12
A
PTD7
PTD6/
LLWU_P15
PTD5
PTD4/
LLWU_P14
PTD0/
LLWU_P12
PTC16
PTC12
PTC8
PTC4/
LLWU_P8
NC
PTC3/
LLWU_P7
PTC2
A
B
PTD12
PTD11
PTD10
PTD3
PTC19
PTC15
PTC11/
LLWU_P11
PTC7
PTD9
NC
PTC1/
LLWU_P6
PTC0
B
C
PTD15
PTD14
PTD13
PTD2/
LLWU_P13
PTC18
PTC14
PTC10
PTC6/
LLWU_P10
PTD8
NC
PTB23
PTB22
C
D
PTE2/
LLWU_P1
PTE1/
LLWU_P0
PTE0
PTD1
PTC17
PTC13
PTC9
PTC5/
LLWU_P9
PTB21
PTB20
PTB19
PTB18
D
E
PTE6
PTE5
PTE4/
LLWU_P2
PTE3
VDD
VDD
VDD
VDD
PTB17
PTB16
PTB11
PTB10
E
F
PTE10
PTE9
PTE8
PTE7
VDD
VSS
VSS
VDD
PTB9
PTB8
PTB7
PTB6
F
G
VOUT33
VREGIN
PTE12
PTE11
VREFH
VREFL
VSS
VSS
PTB5
PTB4
PTB3
PTB2
G
H
USB0_DP
USB0_DM
VSS
PTE28
VDDA
VSSA
VSS
VSS
PTB1
PTB0/
LLWU_P5
PTA29
PTA28
H
J
PGA2_DP/
ADC2_DP0/
ADC3_DP3/
ADC0_DP1
PGA2_DM/
ADC0_SE16/
ADC2_DM0/
CMP1_IN2/
ADC3_DM3/
ADC0_SE21
ADC0_DM1
PTE27
PTA0
PTA1
PTA6
PTA7
PTA13/
LLWU_P4
PTA27
PTA26
PTA25
J
K
PGA3_DP/
ADC3_DP0/
ADC2_DP3/
ADC1_DP1
PGA3_DM/
ADC1_SE16/
ADC3_DM0/
CMP2_IN2/
ADC2_DM3/
ADC0_SE22
ADC1_DM1
PTE26
PTE25
PTA2
PTA3
PTA8
PTA12
PTA16
PTA17
PTA24
K
L
PGA0_DP/
ADC0_DP0/
ADC1_DP3
PGA0_DM/
ADC0_DM0/
ADC1_DM3
DAC0_OUT/
CMP1_IN3/
ADC0_SE23
DAC1_OUT/
CMP0_IN4/
CMP2_IN3/
ADC1_SE23
RTC_
WAKEUP_B
VBAT
PTA4/
LLWU_P3
PTA9
PTA11
PTA14
PTA15
RESET_b
L
PGA1_DP/
M ADC1_DP0/
ADC0_DP3
PGA1_DM/
ADC1_DM0/
ADC0_DM3
VREF_OUT/
CMP1_IN5/
CMP0_IN5/
ADC1_SE18
PTE24
NC
EXTAL32
XTAL32
PTA5
PTA10
VSS
PTA19
PTA18
M
2
3
4
5
6
7
8
9
10
11
12
1
Figure 34. K20 144 MAPBGA Pinout Diagram
9 Revision History
The following table provides a revision history for this document.
Table 49. Revision History
Rev. No.
Date
1
6/2011
Substantial Changes
Initial public revision. Corrected USB conditions.
Table continues on the next page...
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
78
Preliminary
Freescale Semiconductor, Inc.
Revision History
Table 49. Revision History (continued)
Rev. No.
Date
2
11/2011
Substantial Changes
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Added AC electrical specifications.
Updated Part identification section for 120 MHz CPU frequency.
Updated Voltage and current operating ratings section.
Updated Voltage and current operating requirements section.
Updated LVD and POR operating requirements section.
Updated Voltage and current operating behaviors section.
Updated Power mode transition operating behaviors section.
Updated Power consumption operating behaviors section.
In Run mode supply current vs. core frequency section, added Run and VLPR modes
supply current vs. core frequency diagrams.
In Device clock specifications section, updated flash clock frequency and DDR clock
frequency.
Updated Thermal attributes.
In MCG specifications section, updated total deviation of trimmed average DCO output
Frequency, PLL reference frequency range, and lock detector detection time.
In Oscillator frequency specifications section, updated crystal startup time — 32 kHz.
Updated NFC specifications section.
In DSPI switching specifications section, updated master and slave modes frequency
of operation for limited voltage and full voltage ranges.
In I2S/SAI Switching Specifications section, updated cycle time for master and slave
modes.
In USB DCD electrical specifications section, updated data detect voltage.
In TSI electrical specifications, updated reference oscillator frequency.
Updated Pinouts.
Updated Pinouts.
K20 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
79
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Rev. 3, 2/2012
Preliminary
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