MC10EP11, MC100EP11 3.3V / 5V ECL 1:2 Differential Fanout Buffer Description The MC10/100EP11 is a differential 1:2 fanout buffer. The device is pin and functionally equivalent to the LVEL11 device. With AC performance much faster than the LVEL11 device, the EP11 is ideal for applications requiring the fastest AC performance available. The 100 Series contains temperature compensation. www.onsemi.com 8 8 Features • 220 ps Typical Propagation Delay • Maximum Clock Frequency > 3 GHz Typical • PECL Mode Operating Range: ♦ 1 1 SOIC−8 NB D SUFFIX CASE 751−07 VCC = 3.0 V to 5.5 V with VEE = 0 V TSSOP−8 DT SUFFIX CASE 948R−02 DFN−8 MN SUFFIX CASE 506AA • NECL Mode Operating Range: MARKING DIAGRAMS* 8 8 1 HEP11 ALYW G 1 1 4 8 8 1 HP11 ALYWG G 2Z MG G • • • • VCC = 0 V with VEE = −3.0 V to −5.5 V Open Input Default State Safety Clamp on Inputs Q Outputs Will Default LOW with Inputs Open or at VEE These Devices are Pb-Free, Halogen Free and are RoHS Compliant ♦ KEP11 ALYW G 1 H K 5K 2Z M = MC10 = MC100 = MC10 = MC100 = Date Code KP11 ALYWG G A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information on page 9 of this data sheet. © Semiconductor Components Industries, LLC, 2016 July, 2016 − Rev. 11 1 Publication Order Number: MC10EP11/D MC10EP11, MC100EP11 Q0 Q0 1 8 2 7 Table 1. PIN DESCRIPTION VCC D R1 Q1 R2 3 6 D 5 VEE PIN FUNCTION D*, D** ECL Data Inputs Q0, Q0, Q1, Q1 ECL Data Outputs VCC Positive Supply VEE Negative Supply EP (DFN−8 only) Thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open. R1 Q1 4 * Pins will default LOW when left open. ** Pins will default to high when left open. Figure 1. 8-Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor 37.5 kW ESD Protection Human Body Model Machine Model Charged Device Model > 4 kV > 200 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC−8 NB TSSOP−8 DFN−8 Pb-Free Pkg Level 1 Level 3 Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 73 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. www.onsemi.com 2 MC10EP11, MC100EP11 Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V Iout Output Current Continuous Surge 50 100 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm SOIC−8 NB 190 130 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−8 NB 41 to 44 °C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm TSSOP−8 185 140 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP−8 41 to 44 °C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm DFN−8 129 84 °C/W Tsol Wave Solder (Pb-Free) <2 to 3 sec @ 260°C 265 °C qJC Thermal Resistance (Junction-to-Case) (Note 1) 35 to 40 °C/W VI v VCC VI w VEE DFN−8 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) Table 4. 10EP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1)) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 20 29 37 20 30 39 22 31 40 mA IEE Negative Power Supply Current VOH Output HIGH Voltage (Note 2) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mV VOL Output LOW Voltage (Note 2) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mV VIH Input HIGH Voltage (Single-Ended) 2090 2415 2155 2480 2215 2540 mV VIL Input LOW Voltage (Single-Ended) 1365 1690 1430 1755 1490 1815 mV 2.0 3.3 2.0 3.3 2.0 3.3 V 150 mA VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) IIH Input HIGH Current IIL Input LOW Current D D 150 0.5 −150 150 0.5 −150 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 3 MC10EP11, MC100EP11 Table 5. 10EP DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1)) −40°C 25°C 85°C Characteristic Negative Power Supply Current Min Typ Max Min Typ Max Min Typ Max 20 29 37 20 30 39 22 31 40 Unit mA VOH Output HIGH Voltage (Note 2) 3865 3990 4115 3930 4055 4180 3990 4115 4240 mV VOL Output LOW Voltage (Note 2) 3065 3190 3315 3130 3255 3380 3190 3315 3440 mV VIH Input HIGH Voltage (Single-Ended) 3790 4115 3855 4180 3915 4240 mV VIL Input LOW Voltage (Single-Ended) 3065 3390 3130 3455 3190 3515 mV 2.0 5.0 2.0 5.0 2.0 5.0 V 150 mA Symbol IEE VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) IIH Input HIGH Current IIL Input LOW Current D D 150 0.5 −150 150 0.5 −150 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 6. 10EP DC CHARACTERISTICS, NECL (VCC = 0 V; VEE = −5.5 V to −3.0 V (Note 1)) −40°C Symbol IEE Characteristic Negative Power Supply Current 25°C 85°C Min Typ Max Min Typ Max Min Typ Max 20 29 37 20 30 39 22 31 40 Unit mA VOH Output HIGH Voltage (Note 2) −1135 −1010 −885 −1070 −945 −820 −1010 −885 −760 mV VOL Output LOW Voltage (Note 2) −1935 −1810 −1685 −1870 −1745 −1620 −1810 −1685 −1560 mV VIH Input HIGH Voltage (Single-Ended) −1210 −885 −1145 −820 −1085 −760 mV VIL Input LOW Voltage (Single-Ended) −1935 −1610 −1870 −1545 −1810 −1485 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) 0.0 V 150 mA IIH Input HIGH Current IIL Input LOW Current D D VEE + 2.0 0.0 VEE + 2.0 150 0.5 −150 0.0 VEE + 2.0 150 0.5 −150 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 4 MC10EP11, MC100EP11 Table 7. 100EP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1)) −40°C 25°C 85°C Characteristic Negative Power Supply Current Min Typ Max Min Typ Max Min Typ Max 26 35 44 26 35 44 26 35 46 Unit mA VOH Output HIGH Voltage (Note 2) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV VOL Output LOW Voltage (Note 2) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV VIH Input HIGH Voltage (Single-Ended) 2075 2420 2075 2420 2075 2420 mV VIL Input LOW Voltage (Single-Ended) 1355 1675 1355 1675 1355 1675 mV 2.0 3.3 2.0 3.3 2.0 3.3 V 150 mA Symbol IEE VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration)(Note 3) IIH Input HIGH Current IIL Input LOW Current D D 150 0.5 −150 150 0.5 −150 mA 0.5 −150 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 8. 100EP DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1)) −40°C 25°C 85°C Characteristic Negative Power Supply Current Min Typ Max Min Typ Max Min Typ Max 26 35 44 26 35 44 26 35 46 Unit mA VOH Output HIGH Voltage (Note 2) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mV VOL Output LOW Voltage (Note 2) 3055 3180 3305 3055 3180 3305 3055 3180 3305 mV VIH Input HIGH Voltage (Single-Ended) 3775 4120 3775 4120 3775 4120 mV VIL Input LOW Voltage (Single-Ended) 3055 3375 3055 3375 3055 3375 mV 2.0 5.0 2.0 5.0 2.0 5.0 V 150 mA Symbol IEE VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) IIH Input HIGH Current IIL Input LOW Current D D 150 0.5 −150 150 0.5 −150 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 5 MC10EP11, MC100EP11 Table 9. 100EP DC CHARACTERISTICS, NECL (VCC = 0 V; VEE = −5.5 V to −3.0 V (Note 1)) −40°C Symbol IEE Characteristic Negative Power Supply Current 25°C 85°C Min Typ Max Min Typ Max Min Typ Max 26 35 44 26 35 44 26 35 46 Unit mA VOH Output HIGH Voltage (Note 2) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV VOL Output LOW Voltage (Note 2) −1945 −1820 −1695 −1945 −1820 −1695 −1945 −1820 −1695 mV VIH Input HIGH Voltage (Single-Ended) −1225 −880 −1225 −880 −1225 −880 mV VIL Input LOW Voltage (Single-Ended) −1945 −1625 −1945 −1625 −1945 −1625 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) 0.0 V 150 mA IIH Input HIGH Current IIL Input LOW Current D D VEE + 2.0 0.0 VEE + 2.0 150 0.5 −150 0.0 VEE + 2.0 150 0.5 −150 mA 0.5 −150 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. 2. All loading with 50 W to VCC − 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 10. AC CHARACTERISTICS (VCC = 0 V; VEE = −3.0 V to −5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 1)) −40°C Symbol Min Characteristic fmax Maximum Frequency (Figure 2) tPLH, tPHL Propagation Delay to Output Differential CLK to Q, Q tSKEW Typ 25°C Max >3 250 Within Device Skew Q0, Q1 (Note 2) Device-to-Device Skew 10 tJITTER Random Clock Jitter (RMS) (Figure 2) VINPP Input Voltage Swing Sensitivity (Differential Configuration) Output Rise/Fall Times (20% − 80%) @ 1.0 GHz Q, Q 140 Typ Max Min >3 200 tr tf Min 85°C 160 Typ Max >3 220 270 15 110 15 0.2 <1 150 800 1200 70 120 170 180 Unit GHz 240 300 ps 20 110 20 25 120 0.2 <1 0.2 <1 ps 150 800 1200 150 800 1200 mV 80 130 180 90 150 200 ps ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V. 2. Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point of the outputs. www.onsemi.com 6 900 9 800 8 700 7 600 6 500 5 400 4 300 3 ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉ ÉÉ 200 2 100 1 0 0 1000 2000 JITTEROUT ps (RMS) OUTPUT VOLTAGE AMPLITUDE (mV) MC10EP11, MC100EP11 3000 INPUT FREQUENCY (MHz) Figure 2. Output Voltage Amplitude (VOUTPP) RMS Jitter vs. Input Clock Frequency at Ambient Temperature D VINPP = VIH(CLK) − VIL(CLK) D Q VOUTPP = VOH(Q) − VOL(Q) Q tPHL tPLH Figure 3. AC Reference Measurement www.onsemi.com 7 MC10EP11, MC100EP11 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 4. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices www.onsemi.com 8 MC10EP11, MC100EP11 ORDERING INFORMATION Package Shipping† MC10EP11DG SOIC−8 NB (Pb-Free) 98 Units / Rail MC10EP11DR2G SOIC−8 NB (Pb-Free) 2500 / Tape & Reel MC10EP11DTG TSSOP−8 (Pb-Free) 100 Units / Rail MC10EP11DTR2G TSSOP−8 (Pb-Free) 2500 / Tape & Reel MC100EP11DG SOIC−8 NB (Pb-Free) 98 Units / Rail MC100EP11DR2G SOIC−8 NB (Pb-Free) 2500 / Tape & Reel MC100EP11DTG TSSOP−8 (Pb-Free) 100 Units / Rail MC100EP11DTR2G TSSOP−8 (Pb-Free) 2500 / Tape & Reel MC100EP11MNR4G DFN−8 (Pb-Free) 1000 / Tape & Reel MC100EP11MNTAG DFN−8 (Pb-Free) 1000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 9 MC10EP11, MC100EP11 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 10 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC10EP11, MC100EP11 PACKAGE DIMENSIONS TSSOP−8 CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF M T U V S 0.25 (0.010) B −U− 4 M A −V− S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E www.onsemi.com 11 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ MC10EP11, MC100EP11 PACKAGE DIMENSIONS DFN−8 2x2, 0.5P CASE 506AA ISSUE F D PIN ONE REFERENCE 2X 0.10 C 2X A B L1 ÇÇ ÇÇ ÇÇ 0.10 C DETAIL A E OPTIONAL CONSTRUCTIONS ÉÉ ÉÉ ÇÇ EXPOSED Cu TOP VIEW A DETAIL B 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L DIM A A1 A3 b D D2 E E2 e K L L1 ÉÉ ÉÉ ÇÇ A3 MOLD CMPD A1 DETAIL B 0.08 C (A3) NOTE 4 SIDE VIEW DETAIL A ALTERNATE CONSTRUCTIONS A1 D2 1 4 C 8X SEATING PLANE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.30 REF 0.25 0.35 −−− 0.10 RECOMMENDED SOLDERING FOOTPRINT* L 1.30 PACKAGE OUTLINE 8X 0.50 E2 0.90 K 8 5 e/2 e 8X b 1 0.10 C A B 0.05 C 2.30 8X NOTE 3 0.30 BOTTOM VIEW 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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