Material Content Data Sheet Sales Product Name BGA 7M1N6 E6327 MA# MA001115610 Package PG-TSNP-6-2 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip bumps leadframe inorganic material non noble metal non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal non noble metal non noble metal non noble metal noble metal non noble metal < 10% silicon copper tin zinc chromium copper carbon black epoxy resin silicondioxide tin silver copper titanium tungsten silver tin 7440-21-3 7440-50-8 7440-31-5 7440-66-6 7440-47-3 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-50-8 7440-32-6 7440-33-7 7440-22-4 7440-31-5 encapsulation leadfinish plating ubm solder *deviation 4. August 2015 0.92 mg Weight [mg] Average Mass [%] Sum [%] Average Mass [ppm] Sum [ppm] 0.093 10.15 10.15 101529 101529 0.003 0.33 0.33 3301 3301 0.001 0.10 0.001 0.08 777 0.001 0.12 1165 0.353 38.55 0.002 0.22 971 38.85 385432 0.060 6.49 0.349 38.06 44.77 380571 447730 0.038 4.10 4.10 41034 41034 0.015 1.62 1.62 16192 16192 0.000 0.00 0.000 0.00 0.000 0.00 0.000 0.00 0.002 0.18 64921 34 12 0.00 2. 3. 0.18 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7 53 41 Important Remarks: 1. 388345 2238 1775 1816 1000000