SILABS CY28410ZC Clock generator for intelâ®grantsdale chipset Datasheet

CY28410
Clock Generator for Intel®Grantsdale Chipset
Features
• 33 MHz PCI clock
• Low-voltage frequency select input
• Compliant with Intel CK410
• I2C support with readback capabilities
• Supports Intel P4 and Tejas CPU
• Selectable CPU frequencies
• Ideal Lexmark Spread Spectrum profile for maximum
electromagnetic interference (EMI) reduction
• Differential CPU clock pairs
• 3.3V power supply
• 100 MHz differential SRC clocks
• 56-pin SSOP and TSSOP packages
• 96 MHz differential dot clock
• 48 MHz USB clocks
CPU
SRC
PCI
REF
DOT96
USB_48
x2 / x3
x6 / x7
x9
x1
x1
x1
Block Diagram
XIN
XOUT
XTAL
OSC
PLL1
FS_[C:A]
VTT_PWRGD#
IREF
PLL2
SDATA
SCLK
I2C
Logic
VDD_REF
REF
PLL Ref Freq
Divider
Network
VDD_PCI
VSS_PCI
PCI3
VDD_CPU
PCI4
CPUT[0:1], CPUC[0:1],
CPU(T/C)2_ITP]
PCI5
VDD_SRC
VSS_PCI
SRCT[1:6], SRCC[1:6]
VDD_PCI
PCIF0/ITP_EN
PCIF1
PCIF2
VDD_PCI
VDD_48
PCI[0:5]
USB_48
VDD_PCIF
PCIF[0:2]
VSS_48
DOT96T
DOT96C
VDD_48 MHz
FS_B/TEST_MODE
DOT96T
VTT_PWRGD#/PD
DOT96C
FS_A
USB_48
SRCT1
SRCC1
VDD_SRC
SRCT2
SRCC2
SRCT3
SRCC3
SRC4-SATAT
SRC4_SATAC
VDD_SRC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
CY28410
PD
Pin Configuration
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
PCI2
PCI1
PCI0
FS_C/TEST_SEL
REF
VSS_REF
XIN
XOUT
VDD_REF
SDATA
SCLK
VSS_CPU
CPUT0
CPUC0
VDD_CPU
CPUT1
CPUC1
IREF
VSSA
VDDA
CPUT2_ITP/SRCT7
CPUC2_ITP/SRCC7
VDD_SRC
SRCT6
SRCC6
SRCT5
SRCC5
VSS_SRC
56 SSOP/TSSOP
........................ Document #: 38-07593 Rev. *C Page 1 of 17
400 West Cesar Chavez, Austin, TX 78701
1+(512) 416-8500
1+(512) 416-9669
www.silabs.com
CY28410
Pin Definitions
Pin No.
Name
Type
Description
44,43,41,40
CPUT/C
36,35
CPUT2_ITP/SRCT7, O, DIF Selectable Differential CPU or SRC clock output.
CPUC2_ITP/SRCC7
ITP_EN = 0 @ VTT_PWRGD# assertion = SRC7
ITP_EN = 1 @ VTT_PWRGD# assertion = CPU2
O, DIF Differential CPU clock outputs.
14,15
DOT96T, DOT96C
18
FS_A
I
3.3V tolerant input for CPU frequency selection.
Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications.
16
FS_B/TEST_MODE
I
3.3V tolerant input for CPU frequency selection. Selects Ref/N or Hi-Z when
in test mode
0 = Hi-Z,1 = Ref/N
Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications.
53
FS_C/TEST_SEL
I
3.3V tolerant input for CPU frequency selection. Selects test mode if pulled
to VIHFS_C when VTT_PWRGD# is asserted low.
Refer to DC Electrical Specifications table for VILFS_C,VIMFS_C,VIHFS_C specifications.
39
IREF
I
A Precision resistor is attached to this pin, which is connected to the internal
current reference.
54,55,56,3,4,5 PCI
O, DIF Fixed 96-MHz clock output.
O, SE 33-MHz clocks.
9,10
PCIF
O, SE 33-MHz clocks.
8
PCIF0/ITP_EN
I/O, SE 33-MHz clock/CPU2 select (sampled on the VTT_PWRGD# assertion).
1 = CPU2_ITP, 0 = SRC7
52
REF
O, SE Reference clock. 3.3V 14.318 MHz clock output.
46
SCLK
I
47
SDATA
I/O
26,27
SRC4_SATAT,
SRC4_SATAC
SMBus-compatible SCLOCK.
SMBus-compatible SDATA.
O, DIF Differential serial reference clock. recommended output for SATA.
19,20,22,23,2 SRCT/C
4,25,31,30,33,
32
O, DIF Differential serial reference clocks.
12
USB_48
I/O, SE Fixed 48 MHz clock output.
11
VDD_48
PWR
3.3V power supply for outputs.
42
VDD_CPU
PWR
3.3V power supply for outputs.
1,7
VDD_PCI
PWR
3.3V power supply for outputs.
48
VDD_REF
PWR
3.3V power supply for outputs.
21,28,34
VDD_SRC
PWR
3.3V power supply for outputs.
37
VDDA
PWR
3.3V power supply for PLL.
13
VSS_48
GND
Ground for outputs.
45
VSS_CPU
GND
Ground for outputs.
2,6
VSS_PCI
GND
Ground for outputs.
51
VSS_REF
GND
Ground for outputs.
29
VSS_SRC
GND
Ground for outputs.
38
VSSA
GND
Ground for PLL.
17
VTT_PWRGD#/PD
I, PU
3.3V LVTTL input is a level sensitive strobe used to latch the USB_48/FS_A,
FS_B, FS_C/TEST_SEL and PCIF0/ITP_EN inputs. After VTT_PWRGD#
(active low) assertion, this pin becomes a realtime input for asserting
power-down (active high)
50
XIN
49
XOUT
I
14.318-MHz Crystal Input
O, SE 14.318-MHz Crystal Output
........................Document #: 38-07593 Rev. *C Page 2 of 17
CY28410
Frequency Select Pins (FS_A, FS_B and FS_C)
Host clock frequency selection is achieved by applying the
appropriate logic levels to FS_A, FS_B, FS_C inputs prior to
VTT_PWRGD# assertion (as seen by the clock synthesizer).
Upon VTT_PWRGD# being sampled low by the clock chip
(indicating processor VTT voltage is stable), the clock chip
samples the FS_A, FS_B and FS_C input values. For all logic
levels of FS_A, FS_B and FS_C, VTT_PWRGD# employs a
one-shot functionality in that once a valid low on
VTT_PWRGD# has been sampled, all further VTT_PWRGD#,
FS_A, FS_B and FS_C transitions will be ignored, except in
test mode.
Table 1. Frequency Select Table FS_A, FS_B and FS_C
FS_C
FS_B
FS_A
CPU
SRC
PCIF/PCI
REF0
DOT96
USB
MID
0
1
100 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
0
0
1
133 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
0
1
0
200 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
0
0
0
266 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
1
0
x
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
1
1
0
REF/2
REF/8
REF/24
REF
REF
REF
1
1
1
REF/2
REF/8
REF/24
REF
REF
REF
Serial Data Interface
Data Protocol
To enhance the flexibility and function of the clock synthesizer,
a two-signal serial interface is provided. Through the Serial
Data Interface, various device functions, such as individual
clock output buffers, can be individually enabled or disabled.
The registers associated with the Serial Data Interface initializes to their default setting upon power-up, and therefore use
of this interface is optional. Clock device register changes are
normally made upon system initialization, if any are required.
The interface cannot be used during system operation for power management functions.
The clock driver serial protocol accepts byte write, byte read,
block write, and block read operations from the controller. For
block write/read operation, the bytes must be accessed in sequential order from lowest to highest byte (most significant bit
first) with the ability to stop after any complete byte has been
transferred. For byte write and byte read operations, the system controller can access individually indexed bytes. The offset of the indexed byte is encoded in the command code, as
described in Table 2.
The block write and block read protocol is outlined in Table 3
while Table 4 outlines the corresponding byte write and byte
read protocol. The slave receiver address is 11010010 (D2h).
Table 2. Command Code Definition
Bit
7
(6:0)
Description
0 = Block read or block write operation, 1 = Byte read or byte write operation
Byte offset for byte read or byte write operation. For block read or block write operations, these bits should be
'0000000'
Table 3. Block Read and Block Write Protocol
Block Write Protocol
Bit
1
8:2
Description
Start
Slave address – 7 bits
Block Read Protocol
Bit
1
8:2
Description
Start
Slave address – 7 bits
9
Write
9
Write
10
Acknowledge from slave
10
Acknowledge from slave
18:11
Command Code – 8 bits
18:11
Command Code – 8 bits
19
Acknowledge from slave
19
Acknowledge from slave
Byte Count – 8 bits
(Skip this step if I2C_EN bit set)
20
Repeat start
27:20
28
36:29
37
45:38
Acknowledge from slave
Data byte 1 – 8 bits
Acknowledge from slave
Data byte 2 – 8 bits
........................Document #: 38-07593 Rev. *C Page 3 of 17
27:21
Slave address – 7 bits
28
Read = 1
29
Acknowledge from slave
37:30
Byte Count from slave – 8 bits
CY28410
Table 3. Block Read and Block Write Protocol (continued)
Block Write Protocol
Bit
46
Block Read Protocol
Description
Bit
Acknowledge from slave
....
Data Byte /Slave Acknowledges
....
Data Byte N –8 bits
....
Acknowledge from slave
....
Stop
38
46:39
47
55:48
Description
Acknowledge
Data byte 1 from slave – 8 bits
Acknowledge
Data byte 2 from slave – 8 bits
56
Acknowledge
....
Data bytes from slave / Acknowledge
....
Data Byte N from slave – 8 bits
....
NOT Acknowledge
....
Stop
Table 4. Byte Read and Byte Write Protocol
Byte Write Protocol
Bit
1
8:2
Byte Read Protocol
Description
Bit
Start
1
Slave address – 7 bits
8:2
Description
Start
Slave address – 7 bits
9
Write
9
Write
10
Acknowledge from slave
10
Acknowledge from slave
18:11
Command Code – 8 bits
18:11
Command Code – 8 bits
19
Acknowledge from slave
19
Acknowledge from slave
27:20
Data byte – 8 bits
20
28
Acknowledge from slave
29
Stop
27:21
Repeated start
Slave address – 7 bits
28
Read
29
Acknowledge from slave
37:30
Data from slave – 8 bits
38
NOT Acknowledge
39
Stop
Control Registers
Byte 0:Control Register 0
Bit
@Pup
Name
7
1
CPUT2_ITP/SRCT7
CPUC2_ITP/SRCC7
Description
6
1
SRC[T/C]6
SRC[T/C]6 Output Enable
0 = Disable (Hi-Z), 1 = Enable
5
1
SRC[T/C]5
SRC[T/C]5 Output Enable
0 = Disable (Hi-Z), 1 = Enable
4
1
SRC[T/C]4
SRC[T/C]4 Output Enable
0 = Disable (Hi-Z), 1 = Enable
3
1
SRC[T/C]3
SRC[T/C]3 Output Enable
0 = Disable (Hi-Z), 1 = Enable
2
1
SRC[T/C]2
SRC[T/C]2 Output Enable
0 = Disable (Hi-Z), 1 = Enable
1
1
SRC[T/C]1
SRC[T/C]1 Output Enable
0 = Disable (Hi-Z), 1 = Enable
0
1
Reserved
Reserved, Set = 1
CPU[T/C]2_ITP/SRC[T/C]7 Output Enable
0 = Disable (Hi-Z), 1 = Enable
........................Document #: 38-07593 Rev. *C Page 4 of 17
CY28410
Byte 1: Control Register 1
Bit
@Pup
Name
Description
7
1
PCIF0
6
1
DOT_96T/C
5
1
USB_48
4
1
REF
3
0
Reserved
Reserved
2
1
CPU[T/C]1
CPU[T/C]1 Output Enable
0 = Disable (Hi-Z), 1 = Enabled
1
1
CPU[T/C]0
CPU[T/C]0 Output Enable
0 = Disable (Hi-Z), 1 = Enabled
0
0
CPUT/C
SRCT/C
PCIF
PCI
PCIF0 Output Enable
0 = Disabled, 1 = Enabled
DOT_96 MHz Output Enable
0 = Disable (Hi-Z), 1 = Enabled
USB_48 MHz Output Enable
0 = Disabled, 1 = Enabled
REF Output Enable
0 = Disabled, 1 = Enabled
Spread Spectrum Enable
0 = Spread off, 1 = Spread on
Byte 2: Control Register 2
Bit
@Pup
Name
Description
7
1
PCI5
PCI5 Output Enable
0 = Disabled, 1 = Enabled
6
1
PCI4
PCI4 Output Enable
0 = Disabled, 1 = Enabled
5
1
PCI3
PCI3 Output Enable
0 = Disabled, 1 = Enabled
4
1
PCI2
PCI2 Output Enable
0 = Disabled, 1 = Enabled
3
1
PCI1
PCI1 Output Enable
0 = Disabled, 1 = Enabled
2
1
PCI0
PCI0 Output Enable
0 = Disabled, 1 = Enabled
1
1
PCIF2
PCIF2 Output Enable
0 = Disabled, 1 = Enabled
0
1
PCIF1
PCIF1 Output Enable
0 = Disabled, 1 = Enabled
Byte 3: Control Register 3
Bit
@Pup
Name
Description
7
0
SRC7
Allow control of SRC[T/C]7 with assertion of SW PCI_STP#
0 = Free running, 1 = Stopped with SW PCI_STP#
6
0
SRC6
Allow control of SRC[T/C]6 with assertion of SW PCI_STP#
0 = Free running, 1 = Stopped with SW PCI_STP#
5
0
SRC5
Allow control of SRC[T/C]5 with assertion of SW PCI_STP#
0 = Free running, 1 = Stopped with SW PCI_STP#
4
0
SRC4
Allow control of SRC[T/C]4 with assertion of SW PCI_STP#
0 = Free running, 1 = Stopped with SW PCI_STP#
3
0
SRC3
Allow control of SRC[T/C]3 with assertion of SW PCI_STP#
0 = Free running, 1 = Stopped with SW PCI_STP#
2
0
SRC2
Allow control of SRC[T/C]2 with assertion of SW PCI_STP#
0 = Free running, 1 = Stopped with SW PCI_STP#
........................Document #: 38-07593 Rev. *C Page 5 of 17
CY28410
Byte 3: Control Register 3 (continued)
Bit
@Pup
Name
1
0
SRC1
0
0
Reserved
Description
Allow control of SRC[T/C]1 with assertion of SW PCI_STP#
0 = Free running, 1 = Stopped with SW PCI_STP#
Reserved, Set = 0
Byte 4: Control Register 4
Bit
@Pup
Name
Description
7
0
Reserved
6
0
DOT96[T/C]
5
0
PCIF2
Allow control of PCIF2 with assertion of SW PCI_STP#
0 = Free running, 1 = Stopped with SW PCI_STP#
4
0
PCIF1
Allow control of PCIF1 with assertion of SW PCI_STP#
0 = Free running, 1 = Stopped with SW PCI_STP#
3
0
PCIF0
Allow control of PCIF0 with assertion of SW PCI_STP#
0 = Free running, 1 = Stopped with SW PCI_STP#
2
1
Reserved
Reserved, Set = 1
1
1
Reserved
Reserved, Set = 1
0
1
Reserved
Reserved, Set = 1
Reserved, Set = 0
DOT_PWRDWN Drive Mode
0 = Driven in PWRDWN, 1 = Hi-Z
Byte 5: Control Register 5
Bit
@Pup
Name
Description
7
0
SRC[T/C][7:0]
6
0
Reserved
Reserved, Set = 0
5
0
Reserved
Reserved, Set = 0
4
0
Reserved
Reserved, Set = 0
3
0
SRC[T/C][7:0]
SRC[T/C] PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
2
0
CPU[T/C]2
CPU[T/C]2 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
1
0
CPU[T/C]1
CPU[T/C]1 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
0
0
CPU[T/C]0
CPU[T/C]0 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
SRC[T/C] Stop Drive Mode
0 = Driven when SW PCI_STP# asserted,1 = Hi-Z when PCI_STP#
asserted
Byte 6: Control Register 6
Bit
@Pup
7
0
Name
REF/N or Hi-Z Select
1 = REF/N Clock, 0 = Hi-Z
Description
6
0
Test Clock Mode Entry Control
1 = REF/N or Hi-Z mode, 0 = Normal operation
5
0
Reserved
4
1
REF
3
1
PCIF, SRC, PCI
Reserved, Set = 0
REF Output Drive Strength
0 = Low, 1 = High
SW PCI_STP# Function
0=SW PCI_STP assert, 1 = SW PCI_STP deassert
When this bit is set to 0, all STOPPABLE PCI, PCIF and SRC outputs will
be stopped in a synchronous manner with no short pulses.
When this bit is set to 1, all STOPPED PCI, PCIF and SRC outputs will
resume in a synchronous manner with no short pulses.
........................Document #: 38-07593 Rev. *C Page 6 of 17
CY28410
Byte 6: Control Register 6 (continued)
Bit
@Pup
Name
Description
2
Externally
selected
CPUT/C
FS_C. Reflects the value of the FS_C pin sampled on power-up
0 = FS_C was low during VTT_PWRGD# assertion
1
Externally
selected
CPUT/C
FS_B. Reflects the value of the FS_B pin sampled on power-up
0 = FS_B was low during VTT_PWRGD# assertion
0
Externally
selected
CPUT/C
FS_A. Reflects the value of the FS_A pin sampled on power-up
0 = FS_A was low during VTT_PWRGD# assertion
Byte 7: Vendor ID
Bit
@Pup
7
0
Revision Code Bit 3
Name
Revision Code Bit 3
Description
6
0
Revision Code Bit 2
Revision Code Bit 2
5
1
Revision Code Bit 1
Revision Code Bit 1
4
0
Revision Code Bit 0
Revision Code Bit 0
3
1
Vendor ID Bit 3
Vendor ID Bit 3
2
0
Vendor ID Bit 2
Vendor ID Bit 2
1
0
Vendor ID Bit 1
Vendor ID Bit 1
0
0
Vendor ID Bit 0
Vendor ID Bit 0
Crystal Recommendations
Crystal Loading
The CY28410 requires a Parallel Resonance Crystal. Substituting a series resonance crystal will cause the CY28410 to
operate at the wrong frequency and \violate the ppm specification. For most applications there is a 300ppm frequency shift
between series and parallel crystals due to incorrect loading.
Crystal loading plays a critical role in achieving low ppm performance. To realize low ppm performance, the total capacitance
the crystal will see must be considered to calculate the appropriate capacitive loading (CL).
The following diagram shows a typical crystal configuration
using the two trim capacitors. An important clarification for the
following discussion is that the trim capacitors are in series
with the crystal not parallel. It’s a common misconception that
load capacitors are in parallel with the crystal and should be
approximately equal to the load capacitance of the crystal.
This is not true.
Table 5. Crystal Recommendations
Frequency
(Fund)
Cut
Loading Load Cap
Drive
(max.)
Shunt Cap
(max.)
Motional
(max.)
Tolerance
(max.)
Stability
(max.)
Aging
(max.)
14.31818 MHz
AT
Parallel
0.1 mW
5 pF
0.016 pF
35 ppm
30 ppm
5 ppm
20 pF
........................Document #: 38-07593 Rev. *C Page 7 of 17
CY28410
Figure 1. Crystal Capacitive Clarification
Calculating Load Capacitors
In addition to the standard external trim capacitors, trace
capacitance and pin capacitance must also be considered to
correctly calculate crystal loading. As mentioned previously,
the capacitance on each side of the crystal is in series with the
crystal. This means the total capacitance on each side of the
crystal must be twice the specified crystal load capacitance
(CL). While the capacitance on each side of the crystal is in
series with the crystal, trim capacitors (Ce1,Ce2) should be
calculated to provide equal capacitive loading on both sides.
Clock Chip
Ci2
Ci1
Pin
3 to 6p
X2
X1
Cs1
Cs2
Trace
2.8pF
XTAL
Ce1
Ce2
Trim
33pF
Figure 2. Crystal Loading Example
As mentioned previously, the capacitance on each side of the
crystal is in series with the crystal. This mean the total capacitance on each side of the crystal must be twice the specified
load capacitance (CL). While the capacitance on each side of
the crystal is in series with the crystal, trim capacitors(Ce1,Ce2) should be calculated to provide equal capacitance loading on both sides.
Use the following formulas to calculate the trim capacitor
values fro Ce1 and Ce2.
........................Document #: 38-07593 Rev. *C Page 8 of 17
Load Capacitance (each side)
Ce = 2 * CL – (Cs + Ci)
Total Capacitance (as seen by the crystal)
CLe
=
1
1
( Ce1 + Cs1
+ Ci1 +
1
Ce2 + Cs2 + Ci2
)
CY28410
CL ................................................... Crystal load capacitance
CLe .........................................Actual loading seen by crystal
using standard value trim capacitors
Ce .....................................................External trim capacitors
Cs ............................................. Stray capacitance (terraced)
Ci .......................................................... Internal capacitance
(lead frame, bond wires etc.)
PD (Power-down) Clarification
The VTT_PWRGD# /PD pin is a dual function pin. During initial
power-up, the pin functions as VTT_PWRGD#. Once
VTT_PWRGD# has been sampled low by the clock chip, the
pin assumes PD functionality. The PD pin is an asynchronous
active high input used to shut off all clocks cleanly prior to
shutting off power to the device. This signal is synchronized
internal to the device prior to powering down the clock synthesizer. PD is also an asynchronous input for powering up the
system. When PD is asserted high, all clocks are driven to a
low value and held prior to turning off the VCOs and the crystal
oscillator.
PD (Power-down) – Assertion
When PD is sampled high by two consecutive rising edges of
CPUC, all single-ended outputs will be held low on their next
high to low transition and differential clocks must be held high
or Hi-Z (depending on the state of the control register drive
mode bit) on the next diff clock# high to low transition within 4
clock periods. When the SMBus PD drive mode bit corresponding to the differential (CPU, SRC, and DOT) clock output
of interest is programmed to ‘0’, the clock output must be held
with “Diff clock” pin driven high at 2 x Iref, and “Diff clock#”
tristate. If the control register PD drive mode bit corresponding
to the output of interest is programmed to “1”, then both the
“Diff clock” and the “Diff clock#” are Hi-Z. Note the example
below shows CPUT = 133 MHz and PD drive mode = ‘1’ for all
differential outputs. This diagram and description is applicable
to valid CPU frequencies 100,133,166,200,266,333, and 400
MHz. In the event that PD mode is desired as the initial
power-on state, PD must be asserted high in less than 10 uS
after asserting VTT_PWRGD#.
PD Deassertion
The power-up latency is less than 1.8 ms. This is the time from
the deassertion of the PD pin or the ramping of the power
supply until the time that stable clocks are output from the
clock chip. All differential outputs stopped in a three-state
condition resulting from power-down must be driven high in
less than 300 s of PD deassertion to a voltage greater than
200 mV. After the clock chip’s internal PLL is powered up and
locked, all outputs are enabled within a few clock cycles of
each other. Below is an example showing the relationship of
clocks coming up.
PD
CPUT, 133MHz
CPUC, 133MHz
SRCT 100MHz
SRCC 100MHz
USB, 48MHz
DOT96T
DOT96C
PCI, 33 MHz
REF
Figure 3. Power-down Assertion Timing Waveform
........................Document #: 38-07593 Rev. *C Page 9 of 17
CY28410
Tstable
<1.8nS
PD
CPUT, 133MHz
CPUC, 133MHz
SRCT 100MHz
SRCC 100MHz
USB, 48MHz
DOT96T
DOT96C
PCI, 33MHz
Tdrive_PW RDN#
<300S, >200mV
REF
Figure 4. Power-down Deassertion Timing Waveform
FS_A, FS_B,FS_C
VTT_PW RGD#
PW RGD_VRM
0.2-0.3mS
Delay
VDD Clock Gen
Clock State
Clock Outputs
Clock VCO
State 0
W ait for
VTT_PW RGD#
State 1
Dev ice is not affected,
VTT_PW RGD# is ignored
Sam ple Sels
State 2
Off
State 3
On
On
Off
Figure 5. VTT_PWRGD# Timing Diagram
S2
S1
D elay
>0.25m S
VTT_PW R G D# = Low
S am ple
Inputs straps
VDD _A = 2.0V
W ait for <1.8m s
S0
P ow er O ff
S3
VD D_A = off
N orm al
O peration
Enable O utputs
VTT_PW RG D # = toggle
Figure 6. Clock Generator Power-up/Run State Diagram
......................Document #: 38-07593 Rev. *C Page 10 of 17
CY28410
Absolute Maximum Conditions
Parameter
Description
Condition
Min.
Max.
Unit
VDD
Core Supply Voltage
–0.5
4.6
V
VDD_A
Analog Supply Voltage
–0.5
4.6
V
VIN
Input Voltage
Relative to VSS
–0.5
VDD + 0.5
VDC
TS
Temperature, Storage
Non-functional
–65
150
°C
TA
Temperature, Operating Ambient
Functional
0
70
°C
TJ
Temperature, Junction
Functional
–
150
°C
ØJC
Dissipation, Junction to Case
(Mil-Spec 883E Method 1012.1)
SSOP
39.56
TSSOP
20.62
Dissipation, Junction to Ambient
JEDEC (JESD 51)
SSOP
45.29
TSSOP
62.26
ØJA
ESDHBM
ESD Protection (Human Body Model)
MIL-STD-883, Method 3015
UL-94
Flammability Rating
At 1/8 in.
MSL
Moisture Sensitivity Level
2000
°C/W
°C/W
–
V
V–0
1
Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing
is NOT required.
DC Electrical Specifications
Parameter
Description
Condition
Min.
Max.
Unit
3.135
3.465
V
–
1.0
V
2.2
–
V
VSS – 0.3
0.35
V
3.3V Operating Voltage
VDD_A,
VDD_REF,
VDD_PCI,
VDD_3V66,
VDD_48,
VDD_CPU
3.3 ± 5%
VILI2C
Input Low Voltage
SDATA, SCLK
VIHI2C
Input High Voltage
SDATA, SCLK
VIL_FS
FS_A/FS_B Input Low Voltage
VIH_FS
FS_A/FS_B Input High Voltage
0.7
VDD + 0.5
V
VILFS_C
FS_C Low Range
0
0.35
V
VIMFS_C
FS_C Mid Range
0.7
1.7
V
VIH FS_C
FS_C High Range
2.1
VDD
V
VIL
Input Low Voltage
VSS – 0.5
0.8
V
VIH
Input High Voltage
2.0
VDD + 0.5
V
5
A
IIL
Input Low Leakage Current
except internal pull-up resistors, 0 < VIN < VDD
IIH
Input High Leakage Current
except internal pull-down resistors, 0 < VIN < VDD
VOL
Output Low Voltage
IOL = 1 mA
VOH
Output High Voltage
IOH = –1 mA
IOZ
High-impedance Output Current
CIN
Input Pin Capacitance
COUT
LIN
A
–5
–
0.4
V
2.4
–
V
–10
10
A
2
5
pF
Output Pin Capacitance
3
6
pF
Pin Inductance
–
7
nH
VXIH
Xin High Voltage
0.7VDD
VDD
V
VXIL
Xin Low Voltage
0
0.3VDD
V
IDD3.3V
Dynamic Supply Current
At max load and freq per Figure 8
–
550
mA
IPD3.3V
Power-down Supply Current
PD asserted, Outputs driven
–
70
mA
...................... Document #: 38-07593 Rev. *C Page 11 of 17
CY28410
DC Electrical Specifications (continued)
Parameter
IPD3.3V
Description
Power-down Supply Current
Condition
Min.
Max.
Unit
–
2
mA
Condition
Min.
Max.
Unit
The device will operate reliably with input
duty cycles up to 30/70 but the REF clock
duty cycle will not be within specification
47.5
52.5
%
69.841
71.0
ns
ns
PD asserted, Outputs Hi-Z
AC Electrical Specifications
Parameter
Description
Crystal
TDC
XIN Duty Cycle
TPERIOD
XIN Period
When XIN is driven from an external clock
source
TR / TF
XIN Rise and Fall Times
Measured between 0.3VDD and 0.7VDD
–
10.0
TCCJ
XIN Cycle to Cycle Jitter
As an average over 1-s duration
–
500
ps
LACC
Long-term Accuracy
Over 150 ms
–
300
ppm
CPU at 0.7V
TDC
CPUT and CPUC Duty Cycle
Measured at crossing point VOX
43
57
TPERIOD
100-MHz CPUT and CPUC Period
Measured at crossing point VOX
9.997001 10.00300
ns
TPERIOD
133-MHz CPUT and CPUC Period
Measured at crossing point VOX
7.497751 7.502251
ns
TPERIOD
200-MHz CPUT and CPUC Period
Measured at crossing point VOX
4.998500 5.001500
ns
TPERIOD
266-MHz CPUT and CPUC Period
Measured at crossing point VOX
3.748875 3.751125
ns
TPERIODSS
100-MHz CPUT and CPUC Period,
SSC
Measured at crossing point VOX
9.997001 10.05327
ns
TPERIODSS
133-MHz CPUT and CPUC Period,
SSC
Measured at crossing point VOX
7.497751 7.539950
ns
TPERIODSS
200-MHz CPUT and CPUC Period,
SSC
Measured at crossing point VOX
4.998500 5.026634
ns
TPERIODSS
266-MHz CPUT and CPUC Period,
SSC
Measured at crossing point VOX
3.748875 3.769975
ns
TPERIODAbs
100-MHz CPUT and CPUC Absolute Measured at crossing point VOX
period
9.912001 10.08800
ns
TPERIODAbs
133-MHz CPUT and CPUC Absolute Measured at crossing point VOX
period
7.412751 7.587251
ns
TPERIODSSAbs 100-MHz CPUT and CPUC Absolute Measured at crossing point VOX
period, SSC
9.912001 10.13827
ns
TPERIODSSAbs 133-MHz CPUT and CPUC Absolute Measured at crossing point VOX
period, SSC
7.412751 7.624950
ns
TPERIODSSAbs 200-MHz CPUT and CPUC Absolute Measured at crossing point VOX
period, SSC
4.913500 5.111634
ns
TPERIODSSAbs 266-MHz CPUT and CPUC Absolute Measured at crossing point VOX
period, SSC
3.663875 3.854975
ns
TPERIODSSAbs 400-MHz CPUT and CPUC Absolute Measured at crossing point VOX
period, SSC
2.414250 2.598317
ns
%
TSKEW
Any CPUT/C to CPUT/C Clock Skew, Measured at crossing point VOX
SSC
–
100
ps
TCCJ2
CPU2_ITP Cycle to Cycle Jitter
Measured at crossing point VOX
–
125
ps
TCCJ
CPUT/C Cycle to Cycle Jitter
Measured at crossing point VOX
–
115
ps
TSKEW2
CPU2_ITP to CPU0 Clock Skew
Measured at crossing point VOX
–
150
ps
T R / TF
CPUT and CPUC Rise and Fall Times Measured from VOL = 0.175 to VOH =
0.525V
175
1100
ps
......................Document #: 38-07593 Rev. *C Page 12 of 17
CY28410
AC Electrical Specifications (continued)
Parameter
Description
Condition
Min.
Max.
Unit
Determined as a fraction of 2*(TR – TF)/(TR
+ TF)
–
20
%
–
125
ps
–
125
ps
660
850
mV
TRFM
Rise/Fall Matching
TR
Rise Time Variation
TF
Fall Time Variation
VHIGH
Voltage High
Math averages Figure 8
Math averages Figure 8
–150
–
mV
250
550
mV
–
VHIGH +
0.3
V
–0.3
–
V
–
0.2
V
45
55
VLOW
Voltage Low
VOX
Crossing Point Voltage at 0.7V Swing
VOVS
Maximum Overshoot Voltage
VUDS
Minimum Undershoot Voltage
VRB
Ring Back Voltage
See Figure 8. Measure SE
SRC
TDC
SRCT and SRCC Duty Cycle
Measured at crossing point VOX
TPERIOD
100-MHz SRCT and SRCC Period
Measured at crossing point VOX
9.997001 10.00300
ns
TPERIODSS
100-MHz SRCT and SRCC Period,
SSC
Measured at crossing point VOX
9.997001 10.05327
ns
TPERIODAbs
100-MHz SRCT and SRCC Absolute Measured at crossing point VOX
Period
10.12800 9.872001
ns
TPERIODSSAbs 100-MHz SRCT and SRCC Absolute Measured at crossing point VOX
Period, SSC
9.872001 10.17827
ns
%
TSKEW
SRC Skew
Measured at crossing point VOX
–
250
ps
TCCJ
SRCT/C Cycle to Cycle Jitter
Measured at crossing point VOX
–
125
ps
LACC
SRCT/C Long Term Accuracy
Measured at crossing point VOX
–
300
ppm
T R / TF
SRCT and SRCC Rise and Fall Times Measured from VOL = 0.175 to VOH =
0.525V
175
1100
ps
TRFM
Rise/Fall Matching
–
20
%
TR
Rise Time Variation
–
125
ps
TF
Fall Time Variation
–
125
ps
VHIGH
Voltage High
Math averages Figure 8
660
850
mV
Math averages Figure 8
–150
–
mV
250
550
mV
–
VHIGH +
0.3
V
–0.3
–
V
–
0.2
V
45
55
Determined as a fraction of 2*(TR – TF)/(TR
+ TF)
VLOW
Voltage Low
VOX
Crossing Point Voltage at 0.7V Swing
VOVS
Maximum Overshoot Voltage
VUDS
Minimum Undershoot Voltage
VRB
Ring Back Voltage
PCI/PCIF
TDC
PCI Duty Cycle
Measurement at 1.5V
TPERIOD
Spread Disabled PCIF/PCI Period
Measurement at 1.5V
TPERIODSS
Spread Enabled PCIF/PCI Period,
SSC
Measurement at 1.5V
TPERIODAbs
See Figure 8. Measure SE
%
29.99100 30.00900
ns
29.9910
30.15980
ns
29.49100 30.50900
ns
29.49100 30.65980
ns
Spread Disabled PCIF/PCI Period
Measurement at 1.5V
TPERIODSSAbs Spread Enabled PCIF/PCI Period,
SSC
Measurement at 1.5V
THIGH
PCIF and PCI high time
Measurement at 2.4V
11.5
TLOW
PCIF and PCI low time
Measurement at 0.4V
11.5
–
ns
T R / TF
PCIF and PCI rise and fall times
Measured between 0.8V and 2.0V
0.5
2.0
ns
......................Document #: 38-07593 Rev. *C Page 13 of 17
–
ns
CY28410
AC Electrical Specifications (continued)
Min.
Max.
Unit
TSKEW
Parameter
Any PCI clock to Any PCI clock Skew Measurement at 1.5V
Description
Condition
–
500
ps
TCCJ
PCIF and PCI Cycle to Cycle Jitter
Measurement at 1.5V
–
500
ps
DOT
TDC
DOT96T and DOT96C Duty Cycle
Measured at crossing point VOX
45
55
%
TPERIOD
DOT96T and DOT96C Period
Measured at crossing point VOX
10.41354 10.41979
ns
TPERIODAbs
DOT96T and DOT96C Absolute
Period
Measured at crossing point VOX
10.16354 10.66979
ns
TCCJ
DOT96T/C Cycle to Cycle Jitter
Measured at crossing point VOX
–
250
ps
LACC
DOT96T/C Long Term Accuracy
Measured at crossing point VOX
–
100
ppm
T R / TF
DOT96T and DOT96C Rise and Fall
Times
Measured from VOL = 0.175 to VOH =
0.525V
175
1100
ps
TRFM
Rise/Fall Matching
Determined as a fraction of 2*(TR – TF)/(TR
+ TF)
–
20
%
TR
Rise Time Variation
–
125
ps
TF
Fall Time Variation
–
125
ps
VHIGH
Voltage High
Math averages Figure 8
660
850
mV
Math averages Figure 8
–150
–
mV
250
550
mV
–
VHIGH +
0.3
V
–0.3
–
V
–
0.2
V
45
55
VLOW
Voltage Low
VOX
Crossing Point Voltage at 0.7V Swing
VOVS
Maximum Overshoot Voltage
VUDS
Minimum Undershoot Voltage
VRB
Ring Back Voltage
See Figure 8. Measure SE
USB
TDC
Duty Cycle
Measurement at 1.5V
TPERIOD
Period
Measurement at 1.5V
20.83125 20.83542
TPERIODAbs
Absolute Period
Measurement at 1.5V
20.48125 21.18542
THIGH
USB high time
Measurement at 2.4V
8.094
10.036
TLOW
USB low time
Measurement at 0.4V
7.694
9.836
ns
T R / TF
Rise and Fall Times
Measured between 0.8V and 2.0V
0.475
1.4
ns
TCCJ
Cycle to Cycle Jitter
Measurement at 1.5V
–
350
ps
LACC
USB Long Term Accuracy
–
100
ppm
REF
TDC
REF Duty Cycle
45
55
%
TPERIOD
REF Period
Measurement at 1.5V
69.8203
69.8622
ns
TPERIODAbs
REF Absolute Period
Measurement at 1.5V
68.82033 70.86224
ns
T R / TF
REF Rise and Fall Times
Measured between 0.8V and 2.0V
TCCJ
REF Cycle to Cycle Jitter
Measurement at 1.5V
Measurement at 1.5V
ENABLE/DISABLE and SET-UP
TSTABLE
Clock Stabilization from Power-up
TSS
Stopclock Set-up Time
TSH
Stopclock Hold Time
......................Document #: 38-07593 Rev. *C Page 14 of 17
%
ns
ns
ns
0.35
2.0
V/ns
–
1000
ps
–
1.8
ms
10.0
–
ns
0
–
ns
CY28410
Test and Measurement Set-up
For PCI Single-ended Signals and Reference
The following diagram shows the test load configurations for
the single-ended PCI, USB, and REF output signals.
PCI/
USB
Measurement
Point


5pF
Measurement
Point


5pF




Measurement
Point
5pF
Measurement
Point
REF
5pF
Measurement
Point


5pF
Figure 7. Single-ended Load Configuration
For Differential CPU, SRC and DOT96 Output Signals
The following diagram shows the test load configuration for the
differential CPU and SRC outputs.
CPUT
SRCT
D O T96T
CPUC
SRCC
D O T96C
IR E F
M e a s u re m e n t
P o in t

   
2pF
    D if f e r e n t ia l
M e a s u re m e n t
P o in t

   
2pF

Figure 8. 0.7V Single-ended Load Configuration
3 .3 V s ig n a l s
T DC
-
-
3 .3 V
2 .4 V
1 .5 V
0 .4 V
0V
TR
TF
Figure 9. Single-ended Output Signals (for AC Parameters Measurement)
......................Document #: 38-07593 Rev. *C Page 15 of 17
CY28410
Ordering Information
Part Number
Package Type
Product Flow
Standard
56-pin SSOP
Commercial, 0 to 70C
CY28410OCT
56-pin SSOP – Tape and Reel
Commercial, 0 to 70C
CY28410ZC
56-pin TSSOP
Commercial, 0 to 70C
CY28410ZCT
56-pin TSSOP – Tape and Reel
Commercial, 0 to 70C
CY28410OC
Lead-free (Planned)
CY28410OXC
56-pin SSOP
Commercial, 0 to 70C
CY28410OXCT
56-pin SSOP – Tape and Reel
Commercial, 0 to 70C
CY28410ZXC
56-pin TSSOP
Commercial, 0 to 70C
CY28410ZXCT
56-pin TSSOP – Tape and Reel
Commercial, 0 to 70C
......................Document #: 38-07593 Rev. *C Page 16 of 17
CY28410
Package Drawing and Dimensions
56-lead Shrunk Small Outline Package O56
0.249[0.009]
56-Lead Thin Shrunk Small Outline Package, Type II (6 mm x 12 mm) Z56
28
1
DIMENSIONS IN MM[INCHES] MIN.
MAX.
REFERENCE JEDEC MO-153
7.950[0.313]
8.255[0.325]
PACKAGE WEIGHT 0.42gms
5.994[0.236]
6.198[0.244]
PART #
Z5624 STANDARD PKG.
ZZ5624 LEAD FREE PKG.
29
56
13.894[0.547]
14.097[0.555]
1.100[0.043]
MAX.
GAUGE PLANE
0.25[0.010]
0.20[0.008]
0.851[0.033]
0.950[0.037]
0.500[0.020]
BSC
0.170[0.006]
0.279[0.011]
0.051[0.002]
0.152[0.006]
0°-8°
0.508[0.020]
0.762[0.030]
0.100[0.003]
0.200[0.008]
SEATING
PLANE
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the
use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or
parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to
support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.
......................Document #: 38-07593 Rev. *C Page 17 of 17
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