MBR2H100 100V 2.0A Surface Mount Schottky Power Rectifier FEATURES • • • • • • • SOD-123FL Guardring for Stress Protection Low Forward Voltage 175°C Operating Junction Temperature Epoxy Meets UL 94 V−0 Package Designed for Optimal Automated Board Assembly ESD Ratings: Machine Model, C Human Body Model, 3B This is a Pb−Free Device MECHANICAL DATA • • • • • • • • Reel Options: MBR2H100SFT3G = 10,000 per 13 in reel/8 mm tape Device Marking: L2H Polarity Designator: Cathode Band Weight: 11.7 mg (approximately) Case: Epoxy, Molded Lead Finish: 100% Matte Sn (Tin) Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL 1 Requirements MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (TL = 146°C) Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage and Operating Junction Temperature Range (Note 1) Symbol Value Unit VRRM VRWM VR 100 V IO 2.0 A IFSM 50 A Tstg, TJ −65 to +175 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. THERMAL CHARACTERISTICS Symbol Value Unit Thermal Resistance, Junction−to−Lead (Note 2) Characteristic YJCL 23 °C/W Thermal Resistance, Junction−to−Ambient (Note 2) RqJA 85 °C/W Thermal Resistance, Junction−to−Ambient (Note 3) RqJA 330 °C/W 2. Mounted with 700 mm2 copper pad size (Approximately 1 in2) 1 oz FR4 Board. 3. Mounted with pad size approximately 20 mm2 copper, 1 oz FR4 Board. 4. Pulse Test: Pulse Width ≤ 380 ms, Duty Cycle ≤ 2.0%. E-mail: [email protected] 1 of 3 Web Site: www.taychipst.com MBR2H100 100V 2.0A Surface Mount Schottky Power Rectifier RATINGS AND CHARACTERISTIC CURVES 100 IF, FORWARD CURRENT (A) IF, FORWARD CURRENT (A) 100 150°C 125°C 25°C 10 1 0.1 0 0.2 0.4 0.6 1.0 0.8 1.2 150°C 125°C 25°C 10 1 0.1 1.4 0.8 1.0 1.2 1.4 1.6 10 IR, REVERSE CURRENT (mA) 150°C 125°C 0.001 0.0001 10 20 30 40 50 60 0.1 125°C 0.01 25°C 0.001 0.0001 25°C 0 150°C 1 70 80 90 0.00001 0 100 10 20 30 40 50 60 70 80 90 100 VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current 4.0 RqJL = 23°C/W dc 3.0 Square Wave 2.0 1.5 1.0 0.5 0 120 125 130 135 140 145 150 155 160 165 170 175 PFO, AVERAGE POWER DISSIPATION (W) IR, REVERSE CURRENT (mA) 0.6 Figure 2. Maximum Forward Voltage 0.01 2.5 0.4 VF, INSTANTANEOUS FORWARD VOLTAGE (V) 0.1 3.5 0.2 Figure 1. Typical Forward Voltage 1 0.00001 0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) 10 IF(AV), AVERAGE FORWARD CURRENT (A) MBR2H100 3 2.8 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 TJ = 175°C Square Wave dc 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (A) Figure 5. Current Derating Figure 6. Forward Power Dissipation E-mail: [email protected] 2 of 3 Web Site: www.taychipst.com MBR2H100 100V 2.0A Surface Mount Schottky Power Rectifier RATINGS AND CHARACTERISTIC CURVES MBR2H100 TYPICAL CHARACTERISTICS 140 TJ = 25°C C, CAPACITANCE (pF) 120 100 80 60 40 20 0 0 10 20 30 40 50 60 70 80 90 100 VR, REVERSE VOLTAGE (V) Figure 7. Capacitance 1000 R(t) (C/W) 100 10 50% (DUTY CYCLE) 25% 10% 5.0% 2.0% 1.0% 1.0 0.1 SINGLE PULSE 0.01 0.000001 0.0001 0.00001 0.001 0.01 0.1 1.0 10 100 1000 10 100 1000 PULSE TIME (s) Figure 8. Thermal Response, Junction−to−Ambient (20 mm2 pad) 100 50% (DUTY CYCLE) 25% R(t) (C/W) 10 10% 5.0% 2.0% 1.0 1.0% 0.1 SINGLE PULSE 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 PULSE TIME (s) Figure 9. Thermal Response, Junction−to−Ambient (1 in2 pad) E-mail: [email protected] 3 of 3 Web Site: www.taychipst.com