LTC2392-16 16-Bit, 500ksps SAR ADC with 94dB SNR Features n n n n n n n n n n n n n n Description 500ksps Throughput Rate ±2LSB INL (Max) Guaranteed 16-Bit No Missing Codes 94dB SNR (Typ) at fIN = 20kHz Guaranteed Operation to 125°C Single 5V Supply 1.8V to 5V I/O Voltages 110mW Power Dissipation ±4.096V Differential Input Range Internal Reference (20ppm/°C Max) No Pipeline Delay, No Cycle Latency Parallel and Serial Interface Internal Conversion Clock 48-Pin 7mm × 7mm LQFP and QFN Packages The LTC®2392-16 is a low noise, high speed 16-bit successive approximation register (SAR) ADC. Operating from a single 5V supply, the LTC2392-16 supports a large ±4.096V fully differential input range, making it ideal for high performance applications which require maximum dynamic range. The LTC2392-16 achieves ±2LSB INL max, no missing codes at 16-bits and 94dB SNR (typ). The LTC2392-16 includes a precision internal reference with a guaranteed 0.5% initial accuracy and a ±20ppm/°C (max) temperature coefficient. Fast 500ksps throughput with no cycle latency in both parallel and serial interface modes makes the LTC2392-16 ideally suited for a wide variety of high speed applications. An internal oscillator sets the conversion time, easing external timing considerations. The LTC2392-16 dissipates only 110mW at 500ksps, while both nap and sleep power-down modes are provided to further reduce power during inactive periods. Applications n n n n n n Medical Imaging High Speed Data Acquisition Digital Signal Processing Industrial Process Control Instrumentation ATE L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. typical application 10µF ANALOG INPUT 0V TO 4.096V LT6350 10µF AVP 249Ω 0.1µF 16k Point FFT fS = 500ksps, fIN = 20kHz 1.8V TO 5V 0 4.7µF DVP OVP IN+ 2200pF 249Ω SINGLE-ENDEDTO-DIFFERENTIAL DRIVER 0.1µF 5V LTC2392-16 IN– VCM REFIN REFOUT CNVST PD RESET GND OGND PARALLEL OR 16 BIT SERIAL INTERFACE SER/PAR BYTESWAP OB/2C CS RD BUSY 239216 TA01 10µF 1µF SAMPLE CLOCK SNR = 94dB THD –103dB SINAD = 93.5dB SFDR = 104dB –20 –40 AMPLITUDE (dBFS) 5V –60 –80 –100 –120 –140 –160 –180 0 50 150 100 FREQUENCY (kHz) 200 250 239216 G08 239216f LTC2392-16 Absolute Maximum Ratings (Notes 1, 2) Supply Voltage (VAVP , VDVP , VOVP)...........................6.0V Analog Input Voltage (Note 3) IN+, IN–, REFIN, CNVST... (GND – 0.3V) to (VAVP + 0.3V) Digital Input Voltage......... (GND – 0.3V) to (VOVP + 0.3V) Digital Output Voltage...... (GND – 0.3V) to (VOVP + 0.3V) Power Dissipation................................................500mW Operating Temperature Range LTC2392C................................................. 0°C to 70°C LTC2392I.............................................. –40°C to 85°C LTC2392H........................................... –40°C to 125°C Storage Temperature Range.................... –65°C to 150°C Pin Configuration TOP VIEW GND 1 AVP 2 DVP 3 SER/PAR 4 GND 5 OB/2C 6 GND 7 BYTESWAP 8 D0 9 D1 10 D2 11 D3 12 36 VCM 35 GND 34 CNVST 33 PD 32 RESET 31 CS 30 RD 29 BUSY 28 D15 27 D14 26 D13 25 D12 GND 1 AVP 2 DVP 3 SER/PAR 4 GND 5 OB/2C 6 GND 7 BYTESWAP 8 D0 9 D1 10 D2 11 D3 12 36 35 34 33 32 31 30 29 28 27 26 25 VCM GND CNVST PD RESET CS RD BUSY D15 D14 D13 D12 D4 13 D5 14 D6 15 D7 16 OGND 17 OVP 18 DVP 19 GND 20 D8 21 D9/SDIN 22 D10/SDOUT 23 D11/SCLK 24 D4 13 D5 14 D6 15 D7 16 OGND 17 OVP 18 DVP 19 GND 20 D8 21 D9/SDIN 22 D10/SDOUT 23 D11/SCLK 24 49 GND 48 47 46 45 44 43 42 41 40 39 38 37 48 GND 47 AVP 46 AVP 45 AVP 44 GND 43 IN+ 42 IN– 41 GND 40 AVP 39 REFSENSE 38 REFIN 37 REFOUT GND AVP AVP AVP GND IN+ IN– GND AVP REFSENSE REFIN REFOUT TOP VIEW UK PACKAGE 48-LEAD (7mm s 7mm) PLASTIC QFN LX PACKAGE 48-LEAD (7mm s 7mm) PLASTIC LQFP TJMAX = 125°C, θJA = 29°C/W EXPOSED PAD (PIN 49) IS GND, MUST BE SOLDERED TO PCB TJMAX = 125°C, θJA = 55°C/W Order Information LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTC2392CUK-16#PBF LTC2392CUK-16#TRPBF LTC2392UK-16 48-Lead 7mm × 7mm Plastic QFN 0°C to 70°C LTC2392IUK-16#PBF LTC2392IUK-16#TRPBF LTC2392UK-16 48-Lead 7mm × 7mm Plastic QFN –40°C to 85°C LEAD FREE FINISH TRAY PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTC2392CLX-16#PBF LTC2392CLX-16#PBF LTC2392LX-16 48-Lead 7mm × 7mm Plastic LQFP 0°C to 70°C LTC2392ILX-16#PBF LTC2392ILX-16#PBF LTC2392LX-16 48-Lead 7mm × 7mm Plastic LQFP –40°C to 85°C LTC2392HLX-16#PBF LTC2392HLX-16#PBF LTC2392LX-16 48-Lead 7mm × 7mm Plastic LQFP –40°C to 125°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. Consult LTC Marketing for information on non-standard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ 239216f LTC2392-16 ANALOG INPUT The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS VIN + Absolute Input Range (IN+) MIN (Note 5) l VIN– Absolute Input Range (IN–) (Note 5) l VIN+ – VIN– Input Differential Voltage Range VIN = VIN+ – VIN– VCM IIN CIN Analog Input Capacitance CMRR Input Common Mode Rejection Ratio TYP MAX UNITS –0.05 AVP V –0.05 AVP V l –VREF VREF V Common Mode Input Range l VREF/2 – 0.05 Analog Input Leakage Current l Sample Mode Hold Mode VREF/2 VREF/2 + 0.05 V ±1 µA 45 5 pF pF 70 dB converter characteristics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS MIN UNITS l 16 Bits No Missing Codes l 16 Bits INL Integral Linearity Error DNL Differential Linearity Error Bipolar Zero Error 0.3 (Note 6) (Note 7) l –2 l –1 l –7 Bipolar Zero Error Drift FSE MAX Resolution Transition Noise BZE TYP Bipolar Full-Scale Error ±1 LSBRMS 2 LSB 1 LSB 7 1 External Reference Internal Reference (Note 7) LSB ppm/°C 0.13 0.1 l Bipolar Full-Scale Error Drift ±10 % % ppm/°C dynamic accuracy The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. AIN = –1dBFS (Notes 4, 8) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS SINAD Signal-to-(Noise + Distortion) Ratio fIN = 20kHz l 91 93.5 dB SNR Signal-to-Noise Ratio fIN = 20kHz l 92 94 dB THD Total Harmonic Distortion fIN = 20kHz, First 5 Harmonics l SFDR Spurious-Free Dynamic Range fIN = 20kHz –103 –95 dB 104 dB –3dB Input Bandwidth 50 MHz Aperture Delay 0.5 Aperture Jitter 7 psRMS 60 ns Transient Response Full-Scale Step ns 239216f LTC2392-16 INTERNAL REFERENCE CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) PARAMETER CONDITIONS MIN TYP MAX UNITS VREF Output Voltage IOUT = 0 4.076 4.096 4.116 V VREF Output Tempco IOUT = 0 (I-, H-Grades) (Note 11) ±10 ±20 VREF Output Impedance –0.1mA ≤ IOUT ≤ 0.1mA l ppm/°C 2.6 External Reference Voltage 2.5 REFIN Input Impedance 4.096 kΩ AVP – 0.5 V 85 kΩ VREF Line Regulation AVP = 4.75V to 5.25V 0.3 mV/V VCM Output Voltage IOUT = 0 2.08 V DIGITAL INPUTS AND DIGITAL OUTPUTS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER VIH High Level Input Voltage CONDITIONS l VIL Low Level Input Voltage l IIN Digital Input Current CIN Digital Input Capacitance VOH High Level Output Voltage IO = –500µA l VOL Low Level Output Voltage IO = 500µA l IOZ Hi-Z Output Leakage Current VOUT = 0V to OVP l ISOURCE Output Source Current VOUT = 0V –10 mA ISINK Output Sink Current VOUT = OVP 10 mA VIN = 0V to OVP MIN l TYP MAX 0.8 • OVP UNITS V –10 0.5 V 10 µA 5 pF OVP – 0.2 V –10 0.2 V 10 µA power requirements The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS VAVP , VDVP Supply Voltage VOVP Supply Voltage IDD Supply Current Power Down Mode 500ksps Sample Rate with Nap Mode Conversion Done and All Digital Inputs Tied to OVP PD Power Dissipation Power Down Mode 500ksps Sample Rate with Nap Mode Conversion Done and All Digital Inputs Tied to OVP l MIN TYP MAX UNITS 4.75 5 5.25 V 5.25 V 22 35 27 250 mA µA 110 175 135 1250 mW µW 1.71 l l 239216f LTC2392-16 timing characteristics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER MAX UNITS fSMPL Sampling Frequency CONDITIONS l MIN 500 ksps tCONV Conversion Time l 1300 ns 685 ns tACQ Acquisition Time l t4 CNVST Low Time l 20 l 250 t5 CNVST High Time t6 CNVST↓ to BUSY Delay t7 RESET Pulse Width CL = 15pF ns ns 15 l (Note 9) TYP ns l 5 ns t8 SCLK Period l 12.5 ns t9 SCLK High Time l 4 ns t10 SCLK Low Time l 4 ns tr , tf SCLK Rise and Fall Times t11 SDIN Setup Time l 2 t12 SDIN Hold Time l 1 l 2 (Note 10) 1 CL = 15pF t13 SDOUT Delay After SCLK↑ t14 SDOUT Delay After CS↓ l t15 CS↓ to SCLK Setup Time l µs ns ns 8 ns 8 ns 20 ns t16 Data Valid to BUSY↓ l 1 ns t17 Data Access Time after RD↓ or BYTESWAP↑ l 10 ns t18 Bus Relinquish Time l Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All voltage values are with respect to ground. Note 3: When these pin voltages are taken below ground or above AVP, DVP or OVP, they will be clamped by internal diodes. This product can handle input currents up to 100mA below ground or above AVP, DVP or OVP without latchup. Note 4: AVP = DVP = OVP = 5V, fSMPL = 500ksps, external reference equal to 4.096V unless otherwise noted. Note 5: Recommended operating conditions. Note 6: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual endpoints of the transfer curve. The deviation is measured from the center of the quantization band. tWIDTH 0.5V 4V 0.5V ns Note 7: Bipolar zero error is the offset voltage measured from –0.5LSB when the output code flickers between 0000 0000 0000 0000 and 1111 1111 1111 1111. Bipolar full-scale error is the worst-case of –FS or +FS untrimmed deviation from ideal first and last code transitions and includes the effect of offset error. Note 8: All specifications in dB are referred to a full-scale ±4.096V input with a 4.096V reference voltage. Note 9: t13 of 8ns maximum allows a shift clock frequency up to 2 • (t13 + tSETUP) for falling edge capture with 50% duty cycle and up to 80MHz for rising capture. tSETUP is the set-up time of the receiving logic. Note 10: Guaranteed by design. Note 11: Temperature coefficient is calculated by dividing the maximum change in output voltage by the specified temperature range. 4V tDELAY 10 tDELAY 50% 50% 4V 0.5V 239216 F01 Figure 1. Voltage Levels for Timing Specifications 239216f LTC2392-16 Typical Performance Characteristics TA = 25°C, fSMPL = 500ksps, unless otherwise noted. Integral Nonlinearity vs Output Code Differential Nonlinearity vs Output Code DC Histogram (External Reference) 2000000 1.5 2.0 1.5 1800000 1.0 1600000 0.5 0 –0.5 1400000 0.5 COUNTS DNL ERROR (LSB) INL ERROR (LSB) 1.0 0 –0.5 –2.0 200000 0 16384 32768 49152 65536 –1.5 0 16384 32768 49152 OUTPUT CODE DC Histogram (Internal Reference) 4.0970 1600000 4.0965 1200000 1000000 800000 600000 400000 32768 CODE 32770 32772 200000 Offset Error vs Temperature 1.0 TC = 4ppm/°C 0.8 OFFSET ERROR (LSB) 1800000 REFERENCE OUTPUT (V) 4.0975 1400000 32766 32764 239216 G03 Internal Reference Output vs Temperature 2000000 0 0 65536 239216 G02 239216 G01 COUNTS 800000 400000 –1.0 OUTPUT CODE 4.0960 4.0955 4.0950 4.0945 4.0940 4.0935 0.6 0.4 0.2 4.0930 32764 32766 32768 CODE 32770 4.0925 –55 –35 –15 32772 10 0 8 –20 6 –4 16k Point FFT fS = 500ksps, fIN = 100kHz 0 SNR = 94dB THD –103dB SINAD = 93.5dB SFDR = 104dB –60 –80 –100 –120 –40 –60 –80 –100 –120 –6 –140 –140 –8 –160 –160 –10 –55 –35 –15 5 25 45 65 85 105 125 TEMPERATURE (°C) 239216 G07 –180 0 50 150 100 FREQUENCY (kHz) 200 250 239216 G08 SNR = 94dB THD –97.3dB SINAD = 92.3dB SFDR = 101.7dB –20 AMPLITUDE (dBFS) AMPLITUDE (dBFS) 0 –2 239216 G06 16k Point FFT fS = 500ksps, fIN = 20kHz –40 2 5 25 45 65 85 105 125 TEMPERATURE (°C) 239216 G05 Full-Scale Error vs Temperature 4 0 –55 –35 –15 5 25 45 65 85 105 125 TEMPERATURE (°C) 239216 G04 FULL-SCALE ERROR (LSB) 1000000 600000 –1.0 –1.5 1200000 –180 0 50 150 100 FREQUENCY (kHz) 200 250 239216 G09 239216f LTC2392-16 Typical Performance Characteristics TA = 25°C, fSMPL = 500ksps, unless otherwise noted. THD, Harmonics vs Input Frequency SNR, SINAD vs Input Frequency 96 SINAD 90 88 86 84 –80 95 –85 SNR, SINAD (dBFS) 92 –75 HARMONICS, THD (dBFS) SNR, SINAD (dBFS) 96 –70 SNR 94 –90 –95 THD –100 –105 3RD 2ND 94 SINAD –115 0 25 –120 50 75 100 125 150 175 200 INPUT FREQUENCY (kHz) 0 25 239216 G12 Supply Current vs Sampling Frequency SNR, SINAD vs Input Level 30 95.0 –95 SNR, SINAD (dBFS) 94.5 –105 2ND 3RD –110 POWER SUPPLY CURRENT (mA) SNR –100 THD SINAD 94.0 93.5 –115 5 25 45 65 85 105 125 TEMPERATURE (°C) 5 25 45 65 85 105 125 TEMPERATURE (°C) 239216 G11 THD, Harmonics at fIN = 20kHz vs Temperature 93.0 –40 –30 –20 –10 0 25 20 15 10 5 0 0.1 1 10 100 SAMPLING FREQUENCY (kHz) INPUT LEVEL (dB) 1000 239216 G15 239216 G14 239216 G13 Power-Down Current vs Temperature Supply Current vs Temperature 90 25 20 POWER-DOWN CURRENT (µA) 80 POWER SUPPLY CURRENT (mA) –120 –55 –35 –15 92 –55 –35 –15 50 75 100 125 150 175 200 INPUT FREQUENCY (kHz) 239216 G10 HARMONICS, THD (dBFS) SNR 93 –110 82 80 SNR, SINAD at fIN = 20kHz vs Temperature AVP 15 10 5 0 –55 –35 –15 DVP 70 60 50 40 20 10 OVP 5 25 45 65 85 105 125 TEMPERATURE (°C) 239216 G16 DVP 30 0 –55 –35 –15 AVP OVP 5 25 45 65 85 105 125 TEMPERATURE (°C) 239216 G17 239216f LTC2392-16 Pin Functions GND (Pins 1, 5, 7, 20, 35, 41, 44, 48, Exposed Pad Pin 49): Ground. All GND pins must be connected to a solid ground plane. Exposed pad must be soldered directly to the ground plane. D6 (Pin 15): Data Bit 6. When SER/PAR = 0 this pin is Bit 6 of the parallel port data output bus. AVP (Pins 2, 40, 45, 46, 47): 5V Analog Power Supply. The range of AVP is 4.75V to 5.25V. Bypass AVP to GND with a good quality 0.1µF and a 10µF ceramic capacitor in parallel. OGND (Pin 17): Digital Ground for the Input/Output Interface. DVP (Pins 3, 19): 5V Digital Power Supply. The range of DVP is 4.75V to 5.25V. Bypass DVP to GND with a good quality 0.1µF and a 10µF ceramic capacitor in parallel. SER/PAR (Pin 4): Serial/Parallel Selection Input. This pin controls the digital interface. A logic high on this pin selects the serial interface and a logic low selects the parallel interface. In the serial mode the non-active digital outputs are high impedance. OB/2C (Pin 6): Offset Binary/Two’s Complement Input. When OB/2C is high, the digital output is offset binary. When low, the MSB is inverted resulting in two’s complement output. BYTESWAP (Pin 8): BYTESWAP Input. With BYTESWAP low, data will be output with Pin 28 (D15) being the MSB and Pin 9 (D0) being the LSB. With BYTESWAP high, the upper eight bits and the lower eight bits will be switched. The MSB is output on Pin 16 and Bit 8 is output on Pin 9. Bit 7 is output on Pin 28 and the LSB is output on Pin 21. D0 (Pin 9): Data Bit 0. When SER/PAR = 0 this pin is Bit 0 of the parallel port data output bus. D1 (Pin 10): Data Bit 1. When SER/PAR = 0 this pin is Bit 1 of the parallel port data output bus. D2 (Pin 11): Data Bit 2. When SER/PAR = 0 this pin is Bit 2 of the parallel port data output bus. D3 (Pin 12): Data Bit 3. When SER/PAR = 0 this pin is Bit 3 of the parallel port data output bus. D4 (Pin 13): Data Bit 4. When SER/PAR = 0 this pin is Bit 4 of the parallel port data output bus. D5 (Pin 14): Data Bit 5. When SER/PAR = 0 this pin is Bit 5 of the parallel port data output bus. D7 (Pin 16): Data Bit 7. When SER/PAR = 0 this pin is Bit 7 of the parallel port data output bus. OVP (Pin 18): Digital Power Supply for the Input/Output Interface. The range for OVP is 1.8V to 5V. Bypass OVP to OGND with a good quality 4.7µF ceramic capacitor close to the pin. D8 (Pin 21): Data Bit 8. When SER/PAR = 0 this pin is Bit 8 of the parallel port data output bus. D9/SDIN (Pin 22): Data Bit 9/Serial Data Input. When SER/PAR = 0 this pin is Bit 9 of the parallel port data output bus. When SER/PAR = 1, (serial mode) this is the serial data input. SDIN can be used as a data input to daisy-chain two or more conversion results into a single SDOUT line. The digital data level on SDIN is output on SDOUT with a delay of 16 SCLK periods after the start of the read sequence. D10/SDOUT (Pin 23): Data Bit 10/Serial Data Ouput. When SER/PAR = 0 this pin is Bit 10 of the parallel port data output bus. When SER/PAR = 1, (serial mode) this is the serial data output. The conversion result can be clocked out serially on this pin synchronized to SCLK. The data is clocked out MSB first on the rising edge of SCLK and is valid on the falling edge of SCLK. The data format is determined by the logic level of OB/2C. D11/SCLK (Pin 24): Data Bit 11/Serial Clock Input. When SER/PAR = 0 this pin is Bit 11 of the parallel port data output bus. When SER/PAR = 1, (serial mode) this is the serial clock input. D12 (Pin 25): Data Bit 12. When SER/PAR = 0 this pin is Bit 12 of the parallel port data output bus. D13 (Pin 26): Data Bit 13. When SER/PAR = 0 this pin is Bit 13 of the parallel port data output bus. D14 (Pin 27): Data Bit 14. When SER/PAR = 0 this pin is Bit 14 of the parallel port data output bus. 239216f LTC2392-16 Pin Functions D15 (Pin 28): Data Bit 15. When SER/PAR = 0 this pin is Bit 15 of the parallel port data output bus. The data format is determined by the logic level of OB/2C. VCM (Pin 36): Common Mode Analog Output. Typically the output voltage is 2.048V. Bypass to GND with a 10µF capacitor. BUSY (Pin 29): Busy Output. A low-to-high transition occurs when a conversion is started. It stays high until the conversion is complete. The falling edge of BUSY can be used as the data-ready clock signal. REFOUT (Pin 37): Internal Reference Output. Nominal output voltage is 4.096V. Connect this pin to REFIN if using the internal reference. If an external reference is used connect REFOUT to ground. RD (Pin 30): Read Data Input. When CS and RD are both low, the parallel and serial output bus is enabled. REFIN (Pin 38): Reference Input. An external reference can be applied to REFIN if a more accurate reference is required. If an external reference is used tie REFOUT to ground. CS (Pin 31): Chip Select. When CS and RD are both low, the parallel and serial output bus is enabled. CS is also used to gate the external shift clock. RESET (Pin 32): Reset Input. When high the LTC2392-16 is reset, and if this occurs during a conversion, the conversion is halted and the data bus is put into Hi-Z mode. PD (Pin 33): Power-Down Input. When high, the LTC2392-16 is powered down and subsequent conversion requests are ignored. Before entering power shutdown, the digital output data should be read. REFSENSE (Pin 39): Reference Input Sense. Leave REFSENSE open when using the internal reference. If an external reference is used connect REFSENSE to the ground pin of the external reference. IN–, IN+ (Pin 42, Pin 43): Differential Analog Inputs. IN+ – (IN–) can range up to ±VREF . CNVST (Pin 34): Conversion Start Input. A falling edge on CNVST puts the internal sample-and-hold into the hold mode and starts a conversion. CNVST is independent of CS. 239216f LTC2392-16 FUNCTIONAL Block Diagram AVP DVP OVP LTC2392-16 16-BIT OR TWO BYTE SDIN IN+ 16-BIT SAMPLING ADC IN– 16-BIT SDOUT PARALLEL/ SERIAL INTERFACE SCLK CS 1x BUFFER RD REFIN SER/PAR BYTESWAP REFOUT VCM OB/2C 4.096V REFERENCE BUSY CONTROL LOGIC REFSENSE CNVST PD RESET GND OGND 239216BD TIMING DiagramS Conversion Timing Using the Parallel Interface CS, RD = 0 CNVST ACQUIRE BUSY CONVERT D[15:0] PREVIOUS CONVERSION CURRENT CONVERSION 239216 TD01 Conversion Timing Using the Serial Interface CS, RD = 0 CNVST ACQUIRE BUSY CONVERT SCLK D14 D12 D10 D8 D6 D4 D2 D0 SDOUT 239216 TD02 D15 D13 D11 D9 D7 D5 D3 D1 239216f 10 LTC2392-16 OVERVIEW The LTC2392-16 is a low noise, high speed 16-bit successive approximation register (SAR) ADC. Operating from a single 5V supply, the LTC2392-16 supports a large ±4.096V fully differential input range, making it ideal for high performance applications which require a wide dynamic range. The LTC2392-16 achieves ±2LSB INL max, no missing codes at 16 bits and 94dB SNR (typ). The LTC2392-16 includes a precision internal reference with a guaranteed 0.5% initial accuracy and a ±20ppm/°C (max) temperature coefficient. Fast 500ksps throughput with no cycle latency in both parallel and serial interface modes makes the LTC2392-16 ideally suited for a wide variety of high speed applications. An internal oscillator sets the conversion time, easing external timing considerations. The LTC2392-16 dissipates only 110mW at 500ksps, while both nap and sleep power-down modes are provided to further reduce power during inactive periods. CONVERTER OPERATION The LTC2392-16 operates in two phases. During the acquisition phase, the charge redistribution capacitor D/A converter (CDAC) is connected to the IN+ and IN– pins to sample the differential analog input voltage. A falling edge on the CNVST pin initiates a conversion. During the conversion phase, the 16-bit CDAC is sequenced through a successive approximation algorithm, effectively comparing the sampled input with binary-weighted fractions of the reference voltage (e.g., VREF/2, VREF/4 … VREF/65536) using the differential comparator. At the end of conversion, the CDAC output approximates the sampled analog input. The ADC control logic then prepares the 16-bit digital output code for parallel or serial transfer. OUTPUT CODE (TWO’S COMPLEMENT) Applications Information 011...111 000...001 000...000 111...111 111...110 100...001 FSR = +FS – –FS 1LSB = FSR/65536 100...000 –FSR/2 –1 0V 1 FSR/2 – 1LSB LSB LSB INPUT VOLTAGE (V) 239216 F02 Figure 2. LTC2392-16 Two’s Complement Transfer Function ANALOG INPUT The analog inputs of the LTC2392-16 are fully differential in order to maximize the signal swing that can be digitized. The analog inputs can be modeled by the equivalent circuit shown in Figure 3. The diodes at the input provide ESD protection. The analog inputs should not exceed the supply or go below ground. In the acquisition phase, each input sees approximately 40pF (CIN) from the sampling CDAC in series with 50Ω (RIN) from the on-resistance of the sampling switch. Any unwanted signal that is common to both inputs will be reduced by the common mode rejection of the ADC. The inputs draw only one small current spike while charging the CIN capacitors during acquisition. During conversion, the analog inputs draw only a small leakage current. AVP RIN IN+ CIN BIAS VOLTAGE AVP TRANSFER FUNCTION The LTC2392-16 digitizes the full-scale voltage of 2 • VREF into 216 levels, resulting in an LSB size of 125µV when VREF = 4.096V. The ideal transfer function for two’s complement is shown in Figure 2. The OB/2C pin selects either offset binary or two’s complement format. BIPOLAR ZERO 011...110 IN– RIN CIN 239216 F03 Figure 3. The Equivalent Circuit for the Differential Analog Input of the LTC2392-16 239216f 11 LTC2392-16 Applications Information INPUT DRIVE CIRCUITS A low impedance source can directly drive the high impedance inputs of the LTC2392-16 without gain error. A high impedance source should be buffered to minimize settling time during acquisition and to optimize the distortion performance of the ADC. For best performance, a buffer amplifier should be used to drive the analog inputs of the LTC2392-16. The amplifier provides low output impedance to allow for fast settling of the analog signal during the acquisition phase. It also provides isolation between the signal source and the ADC inputs which draw a small current spike during acquisition. Input Filtering The noise and distortion of the buffer amplifier and other circuitry must be considered since they add to the ADC noise and distortion. Noisy input circuitry should be filtered prior to the analog inputs to minimize noise. A simple 1‑pole RC filter is sufficient for many applications. Large filter RC time constants slow down the settling at the analog inputs. It is important that the overall RC time constants be short enough to allow the analog inputs to completely settle to 16-bit resolution within the acquisition time (tACQ). High quality capacitors and resistors should be used in the RC filter since these components can add distortion. NPO and silver mica type dielectric capacitors have excellent linearity. Carbon surface mount resistors can generate distortion from self heating and from damage that may occur during soldering. Metal film surface mount resistors are much less susceptible to both problems. Single-to-Differential Conversion For single-ended input signals, a single-ended-to-differential conversion circuit must be used to produce a differential signal at the ADC inputs. The LT®6350 ADC driver is recommended for performing a single-endedto-differential conversion, as shown in Figure 4a. Its low noise and good DC linearity allows the LTC2392-16 to meet full data sheet specifications. An alternative solution using two op amps is shown in Figure 4b. Using two LT1806 op amps, the circuit achieves 94dB signal-to-noise ratio (SNR). For a 20kHz input signal, the input of the LTC2392-16 has been bandwidth limited to about 25kHz. ADC REFERENCE A low noise, low temperature drift reference is critical to achieving the full datasheet performance of the ADC. The LTC2392-16 provides an excellent internal reference with a ±20ppm/°C (max) temperature coefficient. For better accuracy, an external reference can be used. The high speed, low noise internal reference buffer is used for both internal and external reference applications. It cannot be bypassed. ANALOG INPUT 0V TO 4.096V + LT1806 – 249Ω 301Ω 249Ω ANALOG INPUT 0V TO 4.096V IN+ 2200pF LT6350 249Ω 301Ω LTC2392-16 Figure 4a. Recommended Single-Ended-to-Differential Conversion Circuit Using the LT6350 ADC Driver 0.013µF LTC2392-16 IN– 239216 F04b – IN– SINGLE-ENDEDTO-DIFFERENTIAL DRIVER 249Ω IN+ 239216 F04a COMMON MODE VOLTAGE LT1806 + Figure 4b. Alternative Single-Ended-to-Differential Conversion Circuit Using Two LT1806 Op Amps 239216f 12 LTC2392-16 Applications Information Internal Reference DYNAMIC PERFORMANCE To use the internal reference, simply tie the REFOUT and REFIN pins together. This connects the 4.096V output of the internal reference to the input of the internal reference buffer. The output impedance of the internal reference is approximately 2.6kΩ and the input impedance of the internal reference buffer is about 85kΩ. It is recommended that this node be bypassed to ground with a 1µF or larger capacitor to filter the output noise of the internal reference. The REFSENSE pin should be left floating when using the internal reference. Fast fourier transform (FFT) techniques are used to test the ADC’s frequency response, distortion and noise at the rated throughput. By applying a low distortion sine wave and analyzing the digital output using an FFT algorithm, the ADC’s spectral content can be examined for frequencies outside the fundamental. The LTC2392-16 provides guaranteed tested limits for both AC distortion and noise measurements. External Reference An external reference can be used with the LTC2392‑16 when even higher performance is required. The LT1790‑4.096 offers 0.05% (max) initial accuracy and 10ppm/°C (max) temperature coefficient. When using an external reference, connect the reference output to the REFIN pin and connect the REFOUT pin to ground. The REFSENSE pin should be connected to the ground of the external reference. 0 The signal-to-noise and distortion ratio (SINAD) is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components at the A/D output. The output is band-limited to frequencies from above DC and below half the sampling frequency. Figure 5 shows that the LTC2392-16 achieves a typical SINAD of 93.5dB at a 500kHz sampling rate with a 20kHz input. SNR = 94dB THD –103dB SINAD = 93.5dB SFDR = 104dB –20 –40 AMPLITUDE (dBFS) Signal-to-Noise and Distortion Ratio (SINAD) –60 –80 –100 –120 –140 –160 –180 0 50 150 100 FREQUENCY (kHz) 200 250 239216 G08 Figure 5. 16k Point FFT of the LTC2392-16, fS = 500ksps, fIN = 20kHz 239216f 13 LTC2392-16 Applications Information Signal-to-Noise Ratio (SNR) Power Supply Sequencing The signal-to-noise ratio (SNR) is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components except the first five harmonics and DC. Figure 5 shows that the LTC2392-16 achieves a typical SNR of 94dB at a 500kHz sampling rate with a 20kHz input. The LTC2392-16 does not have any specific power supply sequencing requirements. Care should be taken to observe the maximum voltage relationships described in the Absolute Maximum Ratings section. The LTC2392‑16 has a power-on-reset (POR) circuit. With the POR, the result of the first conversion is valid after power has been applied to the ADC. The LTC2392-16 will reset itself if the power supply voltage drops below 2.5V. Once the supply voltage is brought back to its nominal value, the POR will reinitialize the ADC and it will be ready to start a new conversion. Total Harmonic Distortion (THD) Total harmonic distortion (THD) is the ratio of the RMS sum of all harmonics of the input signal to the fundamental itself. The out-of-band harmonics alias into the frequency band between DC and half the sampling frequency (fSMPL/2). THD is expressed as: THD = 20 log V22 + V32 + V42...VN2 V1 where V1 is the RMS amplitude of the fundamental frequency and V2 through VN are the amplitudes of the second through Nth harmonics. POWER CONSIDERATIONS The LTC2392-16 provides three sets of power supply pins: the analog 5V power supply (AVP), the digital 5V power supply (DVP) and the digital input/output interface power supply (OVP). The flexible OVP supply allows the LTC2392‑16 to communicate with any digital logic operating between 1.8V and 5V, including 2.5V and 3.3V systems. Nap Mode The LTC2392-16 can be put into the nap mode after a conversion has been completed to reduce the power consumption between conversions. In this mode some of the circuitry on the device is turned off. Nap mode is enabled by keeping CNVST low between conversions. When the next conversion is requested, bring CNVST high and hold for at least 250ns, then start the next conversion by bringing CNVST low. See Figure 6. Power Shutdown Mode When PD is tied high, the LTC2392-16 enters power shutdown and subsequent requests for conversion are ignored. Before entering power shutdown, the digital output data needs to be read. However, if a request for power shutdown (PD = high) occurs during a conversion, the conversion t5 CNVST tCONV tACQ BUSY NAP NAP MODE 239216 F06 Figure 6. Nap Mode Timing for the LTC2392-16 239216f 14 LTC2392-16 Applications Information will finish and then the device will power down. The data from that conversion can be read after PD = low is applied. In this mode power consumption drops to a typical value of 175µW from 110mW. This mode can be used if the LTC2392-16 is inactive for a long period of time and the user wants to minimize the power dissipation. Recovery from Power Shutdown Mode Once the PD pin is returned to a low level, ending the power shutdown request, the internal circuitry will begin to power up. If the internal reference is used, the 2.6kΩ output impedance with the 1µF bypass capacitor on the REFIN/REFOUT pins will be the main time constant for the power-on recovery time. If an external reference is used, typically allow 5ms for recovery before initiating a new conversion. Power Dissipation vs Sampling Frequency The power dissipation of the LTC2392-16 will decrease as the sampling frequency is reduced when nap mode is activated. See Figure 7. In nap mode, a portion of the circuitry on the LTC2392-16 is turned off after a conversion has been completed. Increasing the time allowed between conversions lowers the average power. POWER SUPPLY CURRENT (mA) 30 25 20 The LTC2392-16 conversion is controlled by CNVST. A falling edge on CNVST will start a conversion. CS and RD control the digital interface on the LTC2392-16. When either CS or RD is high, the digital outputs are high impedance. CNVST Timing The LTC2392-16 conversion is controlled by CNVST. A falling edge on CNVST will start a conversion. Once a conversion has been initiated, it cannot be restarted until the conversion is complete. For optimum performance CNVST should be a clean low jitter signal. Converter status is indicated by the BUSY output which remains high while the conversion is in progress. To ensure no errors occur in the digitized results return the rising edge either within 40ns from the start of the conversion or wait until after the conversion has been completed. The CNVST timing needed to take advantage of the reduced power mode of operation is described in the Nap Mode section. Internal Conversion Clock The LTC2392-16 has an internal clock that is trimmed to achieve a maximum conversion time of 1300ns. No external adjustments are required and with a maximum acquisition time of 685ns, a throughput performance of 500ksps is guaranteed. DIGITAL INTERFACE 15 The LTC2392-16 allows both parallel and serial digital interfaces. The flexible OVP supply allows the LTC2392-16 to communicate with any digital logic operating between 1.8V and 5V, including 2.5V and 3.3V systems. 10 5 0 0.1 TIMING AND CONTROL 1 10 100 SAMPLING FREQUENCY (kHz) 1000 239216 G15 Figure 7. Power Dissipation of the LTC2392-16 Decreases with Decreasing Sampling Frequency 239216f 15 LTC2392-16 Applications Information Parallel Modes The parallel output data interface is active when the SER/PAR pin is tied low and when both CS and RD are low. The output data can be read as a 16-bit word as shown in Figures 8, 9 and 10 or it can be read as two 8-bit bytes by using the BYTESWAP pin. As shown in Figure 11, with the BYTESWAP pin low, the first eight MSBs are output on the D15 to D8 pins and the eight LSBs are output on the D7 to DO pins. When BYTESWAP is taken high, the eight LSBs now are output on the D15 to D8 pins and the eight MSBs are output on the D7 to D0 pins. Serial Modes The serial output data interface is active when the SER/PAR pin is tied high and when both CS and RD are low. The serial output data will be clocked out on the SDOUT pin when an external clock is applied to the SCLK pin. Clocking out the data after the conversion will yield the best performance. With a shift clock frequency of at least 25MHz, a 500ksps throughput is achieved. The serial output data changes state on the rising edge of SCLK and can be captured on the falling edge of SCLK. D15 remains valid till the first rising edge of shift clock after the first falling edge of shift clock. The non-active digital outputs are high impedance when operating in the serial mode. CS = RD = 0 The SDIN input pin is used to daisy-chain multiple converters. This is useful for applications where hardware constraints may limit the number of lines needed to interface to a large number of converters. For example, if two devices are cascaded, the MSB of the first device will appear at the output after 17 SCLK cycles. The first MSB is clocked in on the falling edge of the first SCLK. See Figure 12. Data Format When OB/2C is high, the digital output is offset binary. When low, the MSB is inverted resulting in two’s complement output. This pin is active in both the parallel and serial modes of operation. Reset When the RESET pin is high, the LTC2392-16 is reset, and if this occurs during a conversion, the conversion is halted and the data bus is put into Hi-Z mode. In reset, requests for new conversions are ignored. Once RESET returns low, the LTC2392-16 is ready to start a new conversion after the acquisition time has been met. See Figure 13. t4 CNVST BUSY tCONV t6 DATA BUS D[15:0] PREVIOUS CONVERSION t16 NEW 239216 F08 Figure 8. Read the Parallel Data Continuously. The Data Bus is Always Driven and Can’t Be Shared 239216f 16 LTC2392-16 Applications Information CS RD BUSY Hi-Z DATA BUS D[15:0] Hi-Z CURRENT CONVERSION 239216 F09 t18 t17 Figure 9. Read the Parallel Data After the Conversion CS = 0 t4 CNVST, RD BUSY tCONV t6 DATA BUS D[15:0] Hi-Z Hi-Z PREVIOUS CONVERSION 239216 F09 t17 t18 Figure 10. Read the Parallel Data During the Conversion 8-BIT INTERFACE CS, RD BYTESWAP D[15:8] Hi-Z HIGH BYTE t17 Hi-Z LOW BYTE t17 239216 F11 t18 Figure 11. 8-Bit Parallel Interface Using the BYTESWAP Pin 239216f 17 LTC2392-16 Applications Information RD = 0 SCLK STARTS LOW t15 CS BUSY t8 t9 SCLK t10 1 2 4 3 15 16 17 18 t13 SDOUT (ADC 2) Hi-Z D14 D15 t14 SDIN (ADC 2) D13 D1 D0 X15 X14 t12 t11 X15 X14 X13 RD = 0 X1 X0 SCLK STARTS HIGH CS BUSY t10 SCLK t8 1 t9 2 3 4 15 16 17 18 t13 SDOUT (ADC 2) Hi-Z D15 t14 SDIN (ADC 2) D14 D13 D1 D0 X15 X14 t12 t11 X15 X14 X13 X1 X0 CNVST IN CS IN RD IN SCLK IN LTC2392-16 LTC2392-16 CNVST CS RD SCLK SDIN SDOUT CNVST CS RD SCLK SDIN SDOUT ADC 1 ADC 2 DATA OUT 239216 F12 Figure 12. Serial Interface with External Clock. Read After the Conversion. Daisy-Chain Multiple Converters 239216f 18 LTC2392-16 Applications Information t7 RESET tACQ CVNST DATA BUS D[15:0] Hi-Z 239216 F13 Figure 13. RESET Pin Timing 239216f 19 LTC2392-16 Applications Information BOARD LAYOUT Recommended Layout To obtain the best performance from the LTC2392-16, a printed circuit board (PCB) is recommended. Layout for the printed circuit board should ensure the digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital clocks or signals alongside analog signals or underneath the ADC. The following is an example of a recommended PCB layout. A single solid ground plane is used. Bypass capacitors to the supplies are placed as close as possible to the supply pins. Low impedance common returns for these bypass capacitors are essential to the low noise operation of the ADC. The analog input traces are screened by ground. For more details and information refer to DC1500A, the evaluation kit for the LTC2392-16 Partial Schematic of Demoboard CNVST 34 39 CNVST R2 249Ω 1% 43 C54 OPT REFIN LTC2392-16 44 C55 OPT IN– VCM OB/2C 36 C53 10µF GND SER/PAR RESET PD 5 6 C31 0.1µF C30 10µF 5V 47 46 37 REFOUT BUSY D15 D14 D13 D12 D11/SCLK D10/SDOUT D9/SDIN D8 D7 D6 D5 D4 D3 D2 D1 D0 BYTESWAP GND IN+ C2 2200pF 1206 NPO R3 249Ω 1% 38 REFSENSE C36 1µF 45 40 4 32 C29 0.1µF R24 1.0Ω BUSY D15 D14 D13 D12 D11/SCLK D10/SDOUT D9/SDIN D8 D7 D6 D5 D4 D3 D2 D1 D0 CS RD 31 30 C28 10µF 3.3V 2 AVP/AVL AVP AVP AVP AVP 33 29 28 27 26 25 24 23 22 21 16 15 14 13 12 11 10 9 8 7 19 3 C40 4.7µF 18 DVP DVP/DVL OVP LTC2392-16 GND GND GND GND GND GND OGND 48 44 41 35 20 1 17 239216 TA01 239216f 20 LTC2392-16 Applications Information Partial Top Silkscreen Partial Layer 1 Component Side Partial Layer 2 Ground Plane 239216f 21 LTC2392-16 Package Description UK Package 48-Lead Plastic QFN (7mm × 7mm) (Reference LTC DWG # 05-08-1704) 0.70 p0.05 5.15 p 0.05 5.50 REF 6.10 p0.05 7.50 p0.05 (4 SIDES) 5.15 p 0.05 PACKAGE OUTLINE 0.25 p0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 7.00 p 0.10 (4 SIDES) 0.75 p 0.05 R = 0.10 TYP R = 0.115 TYP 47 48 0.40 p 0.10 PIN 1 TOP MARK (SEE NOTE 6) 1 2 PIN 1 CHAMFER C = 0.35 5.50 REF (4-SIDES) 5.15 p 0.10 5.15 p 0.10 0.200 REF 0.00 – 0.05 NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WKKD-2) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE (UK48) QFN 0406 REV C 0.25 p 0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD 239216f 22 LTC2392-16 Package Description LX Package 48-Lead Plastic LQFP (7mm × 7mm) (Reference LTC DWG # 05-08-1760 Rev Ø) 7.15 – 7.25 9.00 BSC 5.50 REF 7.00 BSC 48 0.50 BSC 1 2 48 SEE NOTE: 4 1 2 9.00 BSC 5.50 REF 7.00 BSC 7.15 – 7.25 0.20 – 0.30 A A PACKAGE OUTLINE C0.30 – 0.50 1.30 MIN RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 1.60 1.35 – 1.45 MAX 11° – 13° R0.08 – 0.20 GAUGE PLANE 0.25 0° – 7° 11° – 13° 0.09 – 0.20 1.00 REF 0.50 BSC 0.17 – 0.27 0.05 – 0.15 LX48 LQFP 0907 REVØ 0.45 – 0.75 SECTION A – A NOTE: 1. PACKAGE DIMENSIONS CONFORM TO JEDEC #MS-026 PACKAGE OUTLINE 2. DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT 4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER 5. DRAWING IS NOT TO SCALE 239216f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 23 LTC2392-16 Typical Application ADC Driver: Single-Ended Input to Differential Output 5V 249Ω 0.1µF VIN 0V to 4V + – +IN1 SHDN + – V+ 5V OUT2 AIN– LT6350 +IN2 – IN1 – + 2200pF AIN+ V– OUT1 249Ω 0.1µF 499Ω 2V LTC2392-16 239216 TA03 0.1µF –5V Related Parts PART NUMBER LTC1411 DESCRIPTION 14-Bit 2.5Msps Parallel ADC LTC1609 16-Bit 200ksps Serial ADC LTC1864 LTC1864L LTC1865 LTC1865L LTC1867 16-Bit 250ksps Serial ADC 16-Bit 150ksps Serial ADC 16-Bit 250ksps Serial ADC 16-Bit 150ksps Serial ADC 16-Bit, 200ksps 8-Channel ADC LTC2355-14/LTC2356-14 LTC2391-16 14-Bit, 3.5Msps Serial ADCs 16-Bit, 250ksps Parallel/Serial ADC LTC2393-16 16-Bit, 1Msps Parallel/Serial ADC DACs LTC2641 LTC2630 References LT1236 LTC6655 Amplifiers LT1469 LT1806/LT1807 LTC6200/LTC6200-5/ LTC6200-10 LT6350 COMMENTS 5V Supply, 1-Channel, 80dB SNR, ±1.8V Input Range, SSOP-36 Package 5V Supply, 1-Channel, 87dB SNR, Resistor-Selectable Inputs: ±10V, ±5V, ±3.3V, 0V to 4V, 0V to 5V, 0V to 10V 5V Supply, 1-Channel, 4.3mW, MSOP-8 Package 3V Supply, 1-Channel, 1.3mW, MSOP-8 Package 5V Supply, 2-Channel, 4.3mW, MSOP-8 Package 3V Supply, 2-Channel, 1.3mW, MSOP-8 Package 5V Supply, 6.5mW, SSOP-16 Package, Pin Compatible with LTC1863, LTC1867L 3.3V Supply, 1-Channel, 18mW, MSOP-10 Package 5V Supply, Differential Input, 94dB SNR, ±4.096V Input Range, Pin Compatible with the LTC2393-16, LTC2392-16 5V Supply, Differential Input, 94dB SNR, ±4.096V Input Range, Pin Compatible with the LTC2392-16, LTC2391-16 16-Bit Single Serial VOUT DACs 12-/10-/8-Bit Single VOUT DACs ±1LSB INL, ±1LSB DNL, MSOP-8 Package, 0V to 5V Output SC70 6-Pin Package, Internal Reference, ±1LSB INL (12 Bits) Precision Reference in SO-8 Package 0.25ppmP-P Noise, Low Drift Precision Reference 5V, 10V; 0.05% Initial Accuracy (Max); 5ppm Tempco (Max) 0.025% Initial Accuracy (Max), 2ppm Tempco (Max), 0.25ppmP-P Noise (0.1Hz to 10Hz) in MSOP-8 Package Dual 90MHz, 22V/µs Dual Op Amps in 4mm × 4mm DFN-12 Package 325MHz, Single/Dual Precision Op Amps in TSOT23-6, MSOP-8 Packages 165MHz/800MHz/1.6GHz Op Amps with Unity Gain/AV = 5/AV = 10 Low Noise Single-Ended-to-Differential ADC Driver 125mV (Max) Input Offset Voltage, Low Distortion: –96.5dB at 100kHz, 10VP-P , Settling Time: 900ns Rail-to-Rail Input and Output, Low Distortion, –80dBc at 5MHz, Low Voltage Noise: 3.5nV/√Hz Low Noise Voltage: 0.95nV/√Hz (100kHz), Low Distortion: –80dB at 1MHz, TSOT23-6 Package Rail-to-Rail Input and Outputs, 240ns 0.01% Settling Time 239216f 24 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LT 0210 • PRINTED IN USA LINEAR TECHNOLOGY CORPORATION 2010