MACOM MAAP-000079-SMB004 Amplifier, power, 18w 7.5-10.5 ghz Datasheet

Amplifier, Power, 18W
7.5-10.5 GHz
MAAP-000079-PED000
Rev —
Preliminary Datasheet
Features
♦ 18 Watt Saturated Output Power Level
♦ Eutectically Mounted to Heat Spreader
♦ Next level integration is a Silver Epoxy-Based Process
♦ Variable Drain Voltage (8-10V) Operation
♦ MSAG™ Process
Description
The MAAP-000079-PED000 is a 3 stage 18W power amplifier with on-chip bias networks,
eutectically mounted on a 10-mil thick Copper Molybdenum (CuMo) pedestal. This product
is fully matched to 50 ohms on both the input and output. It can be used as a power amplifier stage or as a driver stage in high power applications.
Fabricated using M/A-COM’s repeatable, high performance and highly reliable GaAs
Multifunction Self-Aligned Gate (MSAG™) Process, each device is 100% RF tested at the
die-on-pedestal assembly level to ensure performance compliance.
M/A-COM’s MSAG™ process features robust silicon-like manufacturing processes, planar
processing of ion implanted transistors, multiple implant capability enabling power, lownoise, switch and digital FETs on a single chip, and polyimide scratch protection for ease of
use with automated manufacturing processes. The use of refractory metals and the absence of platinum in the gate metal formulation prevents hydrogen poisoning when employed in hermetic packaging.
Primary Applications
♦ SatCom
♦ Commercial Avionics
♦ Radar
Also Available in:
Description
Ceramic Package
Sample Board (Die)
Sample Board (Pkg)
Mechanical Sample (Die)
Part Number
MAAP-000079-PKG001
MAAP-000079-SMB004
MAAP-000079-SMB001
MAAP-000079-MCH000
Electrical Characteristics: T B = 40°C1, Z0 = 50 Ω, VDD = 10V, IDQ = 4A2, Pin = 18 dBm, Rg = 20 Ω
Parameter
1
1.
2.
Symbol
Typical
Units
Bandwidth
f
7.5-10.5
GHz
Output Power
POUT
42.5
dBm
Output Power, 8-10 GHz
POUT
43
dBm
1-dB Compression Point
P1dB
42
dBm
Small Signal Gain
G
29
dB
Power Added Efficiency
PAE
30
%
Input VSWR
VSWR
2.5:1
Output VSWR
VSWR
2.5:1
Gate Current
IGG
50
mA
Drain Current, under RF Drive
IDD
6
A
Output Third Order Intercept
TOI
48
dBm
Output Third Order Intermod,
Pout = 39 dBm (DCL)
IM3
18.5
dBc
TB = MMIC Base Temperature
Adjust VGG between –2.6 and –1.5V to achieve specified Idq.
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 18W
7.5-10.5 GHz
MAAP-000079-PED000
Rev —
Preliminary Datasheet
Maximum Ratings3
Parameter
Symbol
Absolute Maximum
Units
Input Power
PIN
23
dBm
Drain Supply Voltage
VDD
+12.0
V
Gate Supply Voltage
VGG
-3.0
V
Quiescent Drain Current (No RF)
IDQ
6.5
A
Quiescent DC Power Dissipated (No RF)
PDISS
65
W
Junction Temperature
TJ
170
°C
Storage Temperature
TSTG
-55 to +150
°C
3. Operation beyond these limits may result in permanent damage to the part.
Recommended Operating Conditions4
Characteristic
Symbol
Min
Typ
Max
Unit
Drain Voltage
VDD
4.0
10.0
10.0
V
Gate Voltage
VGG
-2.6
-2.2
-1.5
V
Input Power
PIN
18.0
21.0
dBm
Thermal Resistance
ΘJC
3.0
MMIC Base Temperature
TB
°C/W
Note 5
°C
4. Operation outside of these ranges may reduce product reliability.
5. MMIC Base Temperature = 170°C — ΘJC* VDD * I DQ
Power Derating Curve, Quiescent (No RF)
80
Operating Instructions
1. Apply VGG = -2.7 V, VDD= 0 V.
2. Ramp VDD to desired voltage, typically 10.0 V.
3. Adjust VGG to set IDQ, (approximately @ –2.2 V).
4. Set RF input.
5. Power down sequence in reverse. Turn VGG off last.
70
Peak Power Dissipation [Watts]
This device is static sensitive. Please handle with care. To
operate the device, follow these steps.
60
50
40
30
20
10
0
-40
-20
0
20
40
60
80
100
120
140
160
180
Maximum Allowable Base Temperature [°C]
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 18W
7.5-10.5 GHz
MAAP-000079-PED000
Rev —
Preliminary Datasheet
50
50
48
46
48
46
42
46
44
38
42
34
40
30
38
26
POUT
PAE
Output Power (dBm)
50
PAE (%)
POUT (dBm)
All Data is at 40ºC MMIC base temperature, CW stimulus, unless otherwise noted.
44
42
40
22
34
18
34
32
14
32
10
11.0
30
30
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
VDS=10V
38
36
VDS=8V
36
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
Frequency (GHz)
Frequency (GHz)
Figure 2. 1dB Compression Point vs. Drain Voltage
Figure 1. Output Power and Power Added Efficiency vs. Frequency
at V DD = 10V and P in = 18 dBm
50
45
40
48
42
37
46
39
34
44
36
31
4.5
42
33
28
4.0
40
30
25
3.5
38
27
22
3.0
36
24
19
2.5
21
16
2.0
32
18
13
1.5
30
15
11.0
10
6.0
5.5
Gain @ 10V
PO UT : VDS=10V
34
7.5
8.0
8.5
PAE : VDS=8V
9.0
9.5
10.0
10.5
5.0
Output VSWR
1.0
7
7.5
8
8.5
6.8
41
6.6
39
6.4
37
6.2
35
6.0
33
5.8
31
5.6
Pout
SSG
PAE
IDS
10.5
11
45
40
35
30
7.5 GHz
8.5 GHz
9.5 GHz
10.5 GHz
5.4
25
5.2
25
40
10
50
Output Power (dBm)
7.0
43
Current (A)
Pout (dBm), Gain (dB), PAE (%)
45
30
9.5
Figure 4. Small Signal Gain and Input and Output VSWR vs. Frequency.
Figure 3. Saturated Output Power and Power Added Efficiency vs. Frequency
and Drain Voltage
27
9
Frequency (GHz)
Frequency (GHz)
29
VSWR
Relative Gain (dB)
POUT : VDS=8V
PAE : VDS=10V
7.0
PAE (%)
POUT (dBm)
Input VSWR
50
60
70
80
90
100
110
120
130
140
5.0
150
Junction Temperature (ºC)
Fig 5. Output Power, Power Added Efficiency, and Drain Current vs. Junction
Temperature at VD=10V, f=9GHz, and Pin =18dBm.
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
20
2
4
6
8
10
12
14
16
18
20
22
Input Power (dBm)
Figure 6. Output Power vs. Input Power
at VDD = 10V
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 18W
7.5-10.5 GHz
MAAP-000079-PED000
Rev —
Preliminary Datasheet
All Data is at 40ºC MMIC base temperature, CW stimulus, unless otherwise noted.
40
8
7.5 GHz
8.5 GHz
9.5 GHz
10.5 GHz
35
30
7
6
5
IDS (A)
PAE (%)
25
20
15
4
3
10
10.5 GHz
1
0
-2
0
2
4
6
8
10
12
14
16
18
20
22
0
24
2
Input Power (dBm)
4
6
8
10
12
14
16
18
20
41
43
22
Input Power (dBm)
Figure 8. Drain Current vs. Input Power
at V DD = 10V
Fig 7. Power Added Efficiency vs. Input Power at VD =10V.
35
35
33
33
31
31
29
29
Relative Gain (dB)
Relative Gain (dB)
8.5 GHz
9.5 GHz
2
5
27
25
23
21
27
25
23
21
19
7.5 GHz
19
7.5 GHz
17
9.0 GHz
10.5 GHz
17
9.0 GHz
10.5 GHz
15
15
25
27
29
31
33
35
37
39
41
43
45
25
27
29
31
Output Power (dBm)
33
35
37
39
45
Output Power (dBm)
Figure 9. Relative Gain vs. Output Pow er by Frequency at VD =8V and 25% IDSS
Figure 10. Relative Gain vs. Output Power by Frequency at VD=10V and 25%
IDSS
60
100
58
8 GHz
90
8 GHz
56
9 GHz
10 GHz
80
9 GHz
10 GHz
54
70
52
60
IMD3 (dBc)
TOI (dBm)
7.5 GHz
50
48
50
40
46
30
44
20
42
10
40
0
12
14
16
18
20
22
24
26
28
30
32
34
36
38
12
14
16
18
20
22
24
26
28
30
32
34
36
Fundamental Output Power, Single Tone (dBm)
Fundamental Output Power per Tone (dBm)
Figure 11. Third Order Intercept vs. Output Power and Frequency at 8V.
Figure 12. Third Order Intermod vs. Output Power and Frequency at 8V.
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
38
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 18W
7.5-10.5 GHz
MAAP-000079-PED000
Rev —
Preliminary Datasheet
All Data is at 40ºC MMIC base temperature, CW stimulus, unless otherwise noted.
100
60
56
8 GHz
9 GHz
10 GHz
80
54
70
52
60
IMD3 (dBc)
TOI (dBm)
90
8 GHz
9 GHz
10 GHz
58
50
48
50
40
46
30
44
20
42
10
40
0
12
14
16
18
20
22
24
26
28
30
32
34
36
38
12
14
16
Fundamental Output Power, Single Tone (dBm)
22
24
26
28
30
32
34
36
38
Figure 14. Third Order Intermod vs. Output Power and Frequency at 10V.
60
60
55
58
8 GHz
9 GHz
10 GHz
56
8 GHz
9 GHz
10 GHz
50
54
45
52
40
IMD3 (dBc)
TOI (dBm)
20
Fundamental Output Power per Tone (dBm)
Figure 13. Third Order Intercept vs. Output Power and Frequency at 10V.
50
48
35
30
46
25
44
20
42
15
10
40
-30 -25 -20 -15 -10 -5
0
5
-30 -25 -20 -15 -10 -5
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
0
5
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
MMIC Base Temperature (ºC)
MMIC Base Temperature (ºC)
Figure 15. Third Order Intercept vs. Temperature and Frequency
at 10V and Pout = 39 dBm DCL.
Figure 16. Third Order Intermod vs. Temperature and Frequency
at 10V and Pout = 39 dBm DCL.
60
100
58
90
10% IDSS
25% IDSS
56
10% IDSS
25% IDSS
80
54
70
52
60
IMD3 (dBc)
TOI (dBm)
18
50
48
50
40
46
30
44
20
42
10
40
0
12
14
16
18
20
22
24
26
28
30
32
34
36
38
12
14
16
18
20
22
24
26
28
30
32
34
36
38
Fundamental Output Power, Single Tone (dBm)
Fundamental Output Power per Tone (dBm)
Figure 17. Third Order Intercept vs. Output Power and %IDSS at 10V and 9GHz.
Figure 18. Third Order Intermod vs. Output Power and %IDSS at 10V and 9GHz.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 18W
7.5-10.5 GHz
MAAP-000079-PED000
Rev —
Preliminary Datasheet
Figure 19. Fixture used to characterize
MAAPGM0079-DIE under CW stimulus.
6
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 18W
7.5-10.5 GHz
MAAP-000079-PED000
Rev —
Preliminary Datasheet
Mechanical Information
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Figure 20. Die Layout
Bond Pad Dimensions
Pad
Pad No.
Size (μm)
Size (mils)
RF In and Out
1
100 x 200
4x8
DC Drain Supply Voltage VD1,2
2
200 x 150
8x6
DC Drain Supply Voltage VD3
3
500 x 200
20 x 8
DC Gate Supply Voltage VG1,2
4
150 x 150
6x6
DC Gate Supply Voltage VG3
5
150 x 125
6x5
7
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 18W
7.5-10.5 GHz
MAAP-000079-PED000
Rev —
Preliminary Datasheet
Recommended Layout and Wire Bonding Configuration
GND
In implementing the DC/ RF crossover shown, the following rules must applied.
1.
2.
3.
4.
the DC crossovers should approach and cross the RF trace at a 90 degree angle;
the printed DC traces that approach the RF line should be stopped 2 substrate heights from the RF line edge;
the rated current capability of the DC crossovers should be greater than the maximum current of the device; and
the wires or ribbons used to make the DC crossovers should clear the RF trace by ~ 1 substrate height.
Power Supply Sequencing:
Must apply negative bias to VGG before applying positive bias to VDD to prevent damage to amplifier.
Die Handling:
Refer to Application Note AN3016. All Application Notes may be accessed by going to http://www.macom.com/
Application%20Notes/index.htm.
8
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 18W
7.5-10.5 GHz
MAAP-000079-PED000
Rev —
Preliminary Datasheet
Next Level Assembly Instructions:
Pedestal Die Attach: The following paragraphs detail recommendations and instructions for the integration of the die
on pedestal (IC assembly) and mating substrates to the next level assembly. These recommendations are summarized pictorially in Figure 20.
50O Transmission Line
IC
Pedestal
5-10 mils
15 mil
Alumina
Housing/Carrier
<1.5 mil High Thermal
Conductivity Ag Epoxy
Standard Attach Ag Epoxy
Figure 20. Cross-section of die-on-pedestal
integration at next level assembly
To attach the die/pedestal assembly to the next level assembly, use a high thermal conductivity silver loaded epoxy.
Two epoxies are recommended for this purpose, Diemat (www.diemat.com) PNs DM6030HK and DM4030LD with
bulk thermal conductivities of 60 and 15 W/m-ºC, respectively. Silver-filled epoxies with conductivities < 10 W/m-ºC
are not recommended for use in attaching these IC assemblies.
DM6030HK is recommended for use when the coefficient of thermal expansion (CTE) of the material to which the IC
assembly is to be attached is similar to that of CuMo (CTE ~ 7ppm). A next level assembly attach material with a CTE
range of 4-10ppm would be acceptable. DM4030LD is recommended when the CTE of the next level assembly material is significantly greater than CuMo, e.g, Copper and Aluminum with CTEs of 14 and 23 ppm, respectively.
Bondline thickness, the as-cured thickness of the silver epoxy layer between the IC assembly and next level assembly
attach surface, is a critical parameter in terms of device performance and reliability. Bondline thickness should be
maintained between 1 and 1.5 mils. A bondline thickness of < 1 mil reduces the sheer strength of the mechanical attach. Bondline thicknesses > 1.5 mils impacts in an incremental fashion the junction temperature of the IC and
thereby the MTTF.
The pedestal thickness used in the IC assembly is set at 10 mils such that the final IC assembly thickness is ~ 14 mils
making it approximately planar with a mating substrate of 15 mil alumina, a thickness commonly used through X-band.
This surface planarity was an objective because it results in shorter RF bond wire lengths between the IC assembly
RF I/O and the mating substrate transmission line. Long bond wires can shift the load impedance required for ideal
power transfer. Shorter RF bond wires result in improved RF performance.
In any nominal microelectronic manufacturing environment, the process of silver epoxy attach of substrates and IC
assemblies to the next level assembly can result in variable epoxy squeeze-out or run-out at the substrate or IC assembly peripheries. This variability, if not compensated for in the design of the overall assembly, can result in a high
number of assembly failures due to epoxy wicking. This wicking process can occur when a mating substrate and IC
assembly are placed too close to each other. To avoid this occurrence, a designed-in 5-10 mil spacing between the IC
assembly and mating substrates is recommended.
9
Wirebonding: Bond @ 160°C using standard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although
ball bonds are also acceptable.
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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