Dynex MP04TT500-27-W3A Dual thyristor water cooled module advance information Datasheet

MP04TT500
MP04TT500
Dual Thyristor Water Cooled Module
Advance Information
DS5446-1.2 May 2001
FEATURES
■
Dual Device Module
■
Electrically Isolated Package
■
Pressure Contact Construction
■
International Standard Footprint
■
Alumina (Non Toxic) Isolation Medium
■
Integral Water Cooled Heatsink
KEY PARAMETERS
VDRM
IT(AV)(per arm)
ITSM(per arm)
IT(RMS)(per arm)
Visol
5 (G1)
2800V
480A
11200A
753A
3000V
4 (K1)
3 (A)
6 (G2)
APPLICATIONS
■
Motor Control
■
Controlled Rectifier Bridges
■
Heater Control
■
AC Phase Control
7 (K2)
1 (AK)
2 (A)
Fig. 1 TT Circuit diagram
VOLTAGE RATINGS
Type Number
MP04TT500-28
MP04TT500-27
MP04TT500-26
MP04TT500-25
Repetitive Peak
Voltages
VDRM VRRM
V
2800
2700
2600
2500
Conditions
Tvj = 0˚ to 125˚C,
IDRM = IRRM = 50mA
VDSM = VRSM =
Module outline type code:
MP04-W3
Module outline type code:
MP04-W3A
VDRM = VRRM + 100V
respectively
Lower voltage grades available
ORDERING INFORMATION
Order As:
MP04TT500-XX-W2
MP04TT500-XX-W3
MP04TT500-XX-W3A
1/4 - 18 NPT connection
1/4 - 18 NPT connection
1/4 - 18 NPT water connection
thread
XX shown in the part number about represents VDRM/100
selection required, eg. MP04TT500-27-W2
Note: When ordering, please use the complete part number.
Module outline type code: MP04-W2
(See Package Details for further information)
Fig. 2 Module package variants - (not to scale)
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MP04TT500
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Symbol
IT(AV)
IT(RMS
ITSM
I2t
ITSM
I2t
Visol
Parameter
Mean on-state current
RMS value
Test Conditions
Units
Half wave resistive load,
Twater (in) = 25˚C
540
A
4.5 Ltr/min
Twater (in) = 40˚C
480
A
Twater (in) = 25˚C @ 4.5 Ltr/min
845
A
Twater (in) = 40˚C @ 4.5 Ltr/min
753
A
10ms half sine, Tj = 125˚C
11.25
kA
VR = 0
633 x 103
A2s
10ms half sine, Tj = 125˚C
9
kA
VR = 50% VDRM
506 x 103
A2s
3000
V
Surge (non-repetitive) on-current
I2t for fusing
Surge (non-repetitive) on-current
I2t for fusing
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
Isolation voltage
Max.
THERMAL AND MECHANICAL RATINGS
Parameter
Symbol
Rth(j-w)
Min.
Max.
Units
Thermal resistance - junction to water
dc, 4.5 Ltr/min
-
0.102
˚C/kW
(per thyristor)
Half wave, 4.5 Ltr/min
-
0.106
˚C/kW
3 Phase, 4.5 Ltr/min
-
0.112
˚C/kW
Reverse (blocking)
-
125
˚C
–40
125
˚C
6 (53)
-
Nm (lb.ins)
Tvj
Virtual junction temperature
Tstg
Storage temperature range
-
Test Conditions
Screw torque
Mounting - M6
Electrical connections - M10
-
12 (106) Nm (lb.ins)
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MP04TT500
DYNAMIC CHARACTERISTICS
Parameter
Symbol
IRRM/IDRM
Peak reverse and off-state current
Test Conditions
t VRRM/VDRM, Tj = 125˚C
Min.
Max.
Units
-
50
mA
dV/dt
Linear rate of rise of off-state voltage
To 67% VDRM, Tj = 125˚C
-
1000
V/µs
dI/dt
Rate of rise of on-state current
From 67% VDRM to 500A, gate source 10V, 5Ω
-
500
A/µs
tr = 0.5µs, Tj = 125˚C
VT(TO)
rT
Threshold voltage. (See note 1)
At Tvj = 125˚C
-
0.91
V
On-state slope resistance. (See note 1)
At Tvj = 125˚C
-
0.65
mΩ
Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
GATE TRIGGER CHARACTERISTICS AND RATINGS
Parameter
Symbol
Test Conditions
Max.
Units
VGT
Gate trigger voltage
VDRM = 5V, Tcase = 25oC
3.5
V
IGT
Gate trigger current
VDRM = 5V, Tcase = 25oC
200
mA
VGD
Gate non-trigger voltage
At VDRM Tcase = 125oC
0.25
V
VFGM
Peak forward gate voltage
Anode positive with respect to cathode
30
V
VFGN
Peak forward gate voltage
Anode negative with respect to cathode
0.25
V
VRGM
Peak reverse gate voltage
5
V
IFGM
Peak forward gate current
Anode positive with respect to cathode
10
A
PGM
Peak gate power
See table fig. 5
150
W
PG(AV)
Mean gate power
10
W
-
-
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MP04TT500
25
2500
I2t = Î2 x t
2
1: Tj = 125˚C Min
2: Tj = 125˚C Max
Measured under pulse
conditions
1
2
20
Instantaneous on-state current, IT - (A)
1500
1000
500
0
0.5
1.0
1.5
2.0
Instantaneous on-state voltage, VT - (V)
2.5
15
400
10
350
I2t
5
0
1
t 99
0.1
0.001
10
250
20 30 50
Cycles at 50Hz
Duration
0.1
0.08
%
0.06
1
Lo
lim
wer
0.01
it 99
%
Tj = 25˚C
Tj = -40˚C
0.04
Tj = 125˚C
VGD
2 3 45
0.12
Thermal resistance, Junction to water, Rth(j-w) - (°C/W)
Gate trigger voltage VGT - (V)
imi
0W
10
W
50
W
20
W
10
5W
U
rl
ppe
1
Fig. 4 Surge (non-repetitive) on-state current vs time
(with 50% VRSM at Tcase = 125˚C)
Pulse width Frequency Hz Table gives pulse power PGM in Watts
µs
50 100 400
100
150 150 150
200
150 150 125
500
150 150 100
1ms
150 100 25
10ms
20 - -
10
10
ms
Fig. 3 Maximum (limit) on-state characteristics
100
300
I2t value - (A2s x 103)
Peak half sine wave on-state current - (kA)
2000
Region of certain
0.1
triggering
0.02
1
Gate trigger current, IGT - (A)
Fig. 5 Gate characteristics
10
IFGM
0
0.001
0.01
0.1
1
10
Time (Seconds)
100
1000
Fig. 6 Transient thermal impedance - dc
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MP04TT500
2200
2200
30°
60°
90°
120°
180°
2000
1800
Power dissipation (Watts, per arm)
Power dissipation (Watts, per arm)
1800
2000
1600
1400
1200
1000
800
600
1600
1400
1200
1000
800
600
400
400
200
200
0
0
0
100 200 300 400 500 600 700 800 900 1000
0
Sine wave current (Average, per arm)
Fig. 7 On-state power loss per arm vs on-state current at
specified conduction angles, sine wave 50/60Hz
1400
Fig. 8 On-state power loss per arm vs on-state current at
specified conduction angles, square wave 50/60Hz
80
70
60
50
40
30
20
10
30°
60°
90°
120°
180°
DC
90
Maximum permissible water inlet temperature - (°C)
30°
60°
90°
120°
180°
90
0
0
200
400
600
800
1000
1200
Square wave current (Average, per arm)
100
100
Maximum permissble inlet water temperature - (°C)
30°
60°
90°
120°
180°
DC
80
70
60
50
40
30
20
10
0
100
200
300
400
500
600
Sine wave current (Average, per arm)
Fig. 9 Maximum permissible water inlet temperature vs onstate current at specified conduction angles,
sine wave 50/60Hz
0
100
200
300
400
500
600
700
Square wave current (Average, per arm)
800
Fig. 10 Maximum permissible water inlet temperature vs onstate current at specified conduction angles,
square wave 50/60Hz
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MP04TT500
4000
90
3500
80
6000
2500
60
2000
50
1500
40
1000
500
0
400
30
Power resistive load
Power inductive load
Temp resistive load
Temp inductive load
500
90
Total device power loss - (W)
70
4000
80
70
3000
60
50
2000
40
30
1000
20
20
10
600 700 800 900 1000 1100 1200
DC bridge output current - (A)
Fig. 11 50/60Hz single phase bridge DC output current vs
power loss and maximum permissible water inlet
0
600
700
800
Max permissible water inlet temp. - (˚C)
3000
Max permissible water inlet temp. - (˚C)
Total device power loss - (W)
5000
Power resistive or inductive load 10
Temp resistive or inductive load
0
900 1000 1100 1200 1300 1400 1500
DC bridge output current - (A)
Fig. 12 50/60Hz three phase bridge DC output current vs
power loss and maximum permissible water inlet
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MP04TT500
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2060g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W2
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MP04TT500
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2060g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W3
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MP04TT500
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2530g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W3A
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MP04TT500
POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD
design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the
voltage and current capability of Dynex semiconductors.
An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5446-1 Issue No. 1.2 May 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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