LIGITEK LRGB9Q53-R1-2-TR1 Plcc type rgb led Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PLCC TYPE RGB LED
Pb
Lead-Free Parts
LRGB9Q53/R1-2/TR1
DATA SHEET
DOC. NO
:
QW0905-LRGB9Q53/R1-2/TR1
REV.
:
A
DATE
: 23 - Feb. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LRGB9Q53/R1-2/TR1
Page 1/9
Package Dimensions
5.4
5.0
PIN NO.1
1
6
2
5
3
4
0.8
1.0
0.7
5.0
1.0
0.7
1.0
2.5
1.0
B
1
1.95
G
2
1.0
R
3
6
5
4
1.Cathode Blue
2.Cathode Green
3.Cathode Red
4.Anode Red
5.Anode Green
6.Anode Blue
Note : 1.All dimension are in millimeter tolerance is ± 0.2mm unless otherwise noted.
2.Specifications are subject to change without notice.
Carrier Type Dimensions
4.0±0.2
8.0±0.2
2.0
1.5
0.3
1.75
5.5±0.2
12.0±0.3
5.6
5.2
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
2.15
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Page 2/9
PART NO. LRGB9Q53/R1-2/TR1
Reel Dimensions
180±1.5
6.0±1.0
13.5±1.0
ψ13.0±0.5
17.5± 1.0
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Page 3/9
PART NO. LRGB9Q53/R1-2/TR1
Absolute Maximum Ratings at Ta=25 ℃
Absolute Maximum Ratings
Symbol
Parameter
UNIT
DUR
DGM
DBK
Forward Current
IF
50
30
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
90
100
100
mA
Power Dissipation
PD
120
120
120
mW
Reverse Current @5V
Ir
10
50
50
μA
Electrostatic Discharge
ESD
150
150
150
V
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
AlGaInP
LRGB9Q53/R1-2/TR1
InGaN/GaN Blue
Spectral
halfwidth
△λnm
Water Clear
Forward
voltage
@20mA(V)
Luminous
intensity
@20mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Min. Typ. Max. Min. Typ.
Lens
Red
InGaN/GaN Green
Dominant
wave
length
λDnm
625
20
1.7 ---- 2.6
700 1100
120
525
36
---- 3.5 4.0
350
700
120
470
30
---- 3.5 4.0 120
220
120
Note : 1.The forward voltage data did not including ± 0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
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Page4/9
PART NO. LRGB9Q53/R1-2/TR1
Typical Electro-Optical Characteristics Curve
DUR CHIP
Fig.2 Relative Light Output Power vs. Forward Current
140
120
120
100
100
80
LOP(%)
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
80
60
40
60
40
20
20
0.0
0
0.0
0.5
1.0
1.5
2.0
0.0
3.0
2.5
20
Fig.3 Forward Voltage vs. Temperature
80
100 120
140
Fig.4 Relative Intensity vs. Temperature
0
Relative Intensity@20mA
Normalize @20℃
1.2
-0.05
-0.1
-0.15
-2.0
20
30
40
60
50
70
80
1.0
0.8
0.6
0.4
0.2
0.0
90
20
30
40
50
60
70
80
90
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
1.0
Relative Intensity@20mA
60
Forward Current(mA)
Forward Voltage(V)
Forward Voltage@20mA
Normalize @20℃
40
0°
-30°
0.5
30°
-60°
0.0
500
550
600
Wavelength (nm)
650
700
100% 75% 50%
60 °
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LRGB9Q53/R1-2/TR1
Page 5/9
Typical Electro-Optical Characteristics Curve
DGM CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
2.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
0°
1.0
Relative Intensity@20mA
100
-30°
30 °
-60 °
0.5
0.0
100% 75% 50%
450
500
550
Wavelength (nm)
600
60 °
25%
0
25% 50% 75% 100%
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Page 6/9
PART NO. LRGB9Q53/R1-2/TR1
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1
01
2.5
2.0
1.5
1.0
0.5
0.0
2.0
1.0
3.0
4.0
5.0
1
10
1.2
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
80
100
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
Relative Intensity@20mA
0°
-30 °
1.0
30 °
-60 °
60°
0.5
0.0
100% 75% 50%
400
450
500
Wavelength (nm)
550
25%
0
25% 50% 75% 100%
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Page 7/9
PART NO. LRGB9Q53/R1-2/TR1
Recommended Soldering Conditions
1.
Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp.
(℃)
240
Rising
+5℃/sec
Cooling
-5 ℃/sec
Preheat
150
120
60 ~ 120 sec
Time
5sec
3-2 PB-Free Reflow Solder
1~5° C/sec
Preheat
180~200 ° C
1~5° C/sec
260° C MaX.
10sec.Max
Above 220 ° C
60 sec.Max.
120 sec.Max.
Reflow Soldering should not be done more than two times.
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Page 8/9
PART NO. LRGB9Q53/R1-2/TR1
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%,
they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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Page 9/9
PART NO. LRGB9Q53/R1-2/TR1
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.IR-Reflow In-Board, 2 Times
2.Ta=65 ℃±5 ℃
3.RH=90 %~95%
4.t=1000hrs ±2hrs
MIL-STD-202F:103B
JIS C 7021: B-11
Endurance
Test
Thermal Shock Test
Solderability Test
Environmental
Test
Temperature
Cycling
Solderability Test
1.IR-Reflow In-Board,2 times
2.Ta=105 ℃±5℃&
-40 ℃±5℃
(10min) (10min)
3.total 10 cycles
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
1.T.Sol=235 ℃±5 ℃
2.Immersion time 2 ±0.5sec
3.Immersion rate 25 ±2.5mm/sec
4.Immersion rate 25 ±2.5mm/sec
5.Coverage ≧ 95% of the dipped surface
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
1.105 ℃ ~ 25℃ ~ 55 ℃ ~ 25 ℃
30mins 5mins 30mins 5mins
2.10 Cyeles
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
Ramp-up rate(183 ℃ to Peak) +3 ℃ second max
Temp. maintain at 125( ±25)℃ 120 seconds max
Temp. maintain above 183 ℃ 60-150 seconds
Peak temperature range 235 ℃+5-0 ℃
Time within 5 ℃ of actual Peak Temperature(tp)
10-30 seconds
Ramp-down rate +6 ℃/second max
MIL-STD-750D:2031.2
J-STD-020
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