HSMC HM5401 Npn epitaxial planar transistor Datasheet

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 1/4
HM5401
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HM5401 is designed for general purpose applications requiring
high breakdown voltages.
Features
SOT-89
• High current-emitter breakdown voltage.VCEO=150V(@IC=1mA)
• Complements to NPN type HM5551
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 °C
Junction Temperature .................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ....................................................................................... 1 W
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ...................................................................................... -160 V
VCES Collector to Emitter Voltage ................................................................................... -150 V
VEBO Emitter to Base Voltage ............................................................................................. -5 V
IC Collector Current ...................................................................................................... -600 mA
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)1
*VCE(sat)2
*VBE(sat)1
*VBE(sat)2
*hFE1
*hFE2
*hFE3
fT
Cob
Min.
-160
-150
-5
50
60
50
100
-
Max.
-50
-50
-0.2
-0.5
-1
-1
240
6
Unit
V
V
V
nA
nA
V
V
V
V
MHz
pF
Test Conditions
IC=-100uA
IC=-1mA
IE=-10uA
VCB=-120V
VEB=-5V
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
VCE=-5V, IC=-1mA
VCE=-5V, IC=-10mA
VCE=-5V, IC=-50mA
VCE=-10V, IC=-10mA, f=100MHz
VCB=-10V, f=1MHz
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
HM5401
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 2/4
MICROELECTRONICS CORP.
Characteristics Curve
Saturation Voltage & Collector Current
Current Gain & Collector Current
1000
100000
VCE(sat) @ IC=10IB
o
Saturation Voltage (mV)
125 C
o
100
25 C
o
hFE
75 C
10
10000
1000
o
75 C
o
125 C
o
25 C
100
hFE @ VCE=5V
1
10
1
10
100
1000
0.1
1
Collector Current-IC (mA)
10
100
1000
Collector Current-IC (mA)
Capacitance & Reverse-Biased Voltage
Saturation Voltage & Collector Current
100
1000
o
Capacitance (pF)
Saturation Voltage (mV)
25 C
o
75 C
o
125 C
10
VBE(sat) @ IC=10IB
Cob
100
1
0.1
1
10
100
1000
0.1
1
Collector Current-IC (mA)
10
100
Reverse Biased Voltage (V)
Cutoff Frequency & Collector Current
Safe Operating Area
10000
1000
Collector Current-IC (mA)
Cutoff Frequency (MHz)...
PT=1ms
VCE=10V
100
PT=100ms
PT=1s
100
10
1
10
1
10
100
Collector Current (mA)
HM5401
1000
1000
1
10
100
Forward Biased Voltage-VCE (V)
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 3/4
MICROELECTRONICS CORP.
PD - Ta
1.2
5
1
PD(W) , Power Dissipation
PD(W) , Power Dissipation
PD - Tc
6
4
3
2
1
0.8
0.6
0.4
0.2
0
0
0
50
100
150
o
Temperature-TC( C )
HM5401
200
0
50
100
150
200
o
Temperature-Ta ( C )
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 4/4
MICROELECTRONICS CORP.
SOT-89 Dimension
Marking:
C
H
Date Code
HM
5 4 0 1
Laser Marking
D
B
1
2
3
Style: Pin 1.Base 2.Collector 3.Emitter
I
E
F
G
A
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code: M
*: Typical
Inches
Min.
Max.
0.1732 0.1811
0.1594 0.1673
0.0591 0.0663
0.0945 0.1024
0.0141 0.0201
DIM
A
B
C
D
E
Millimeters
Min.
Max.
4.40
4.60
4.05
4.25
1.50
1.70
2.40
2.60
0.36
0.51
DIM
F
G
H
I
Inches
Min.
Max.
0.0583 0.0598
0.1165 0.1197
0.0551 0.0630
0.0138 0.0161
Millimeters
Min.
Max.
1.48
1.52
2.96
3.04
1.40
1.60
0.35
0.41
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM5401
HSMC Product Specification
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