TI1 MC1458DRE4 Dual general-purpose operational amplifier Datasheet

MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C − FEBRUARY 1971 − REVISED AUGUST 2010
D Short-Circuit Protection
D Wide Common-Mode and Differential
(TOP VIEW)
Voltage Ranges
No Frequency Compensation Required
Low Power Consumption
No Latch-Up
Designed to Be Interchangeable With
Motorola MC1558/MC1458 and Signetics
S5558/N5558
1OUT
1IN−
1IN+
VCC−
1
8
2
7
3
6
4
5
VCC+
2OUT
2IN−
2IN+
MC1558 . . . FK PACKAGE
(TOP VIEW)
NC
1OUT
NC
V CC+
NC
D
D
D
D
MC1458 . . . D, P, OR PS PACKAGE
MC1558 . . . JG PACKAGE
description/ordering information
The MC1458 and MC1558 are dual
general-purpose operational amplifiers, with each
half electrically similar to the μA741, except that
offset null capability is not provided.
NC
1IN−
NC
1IN+
NC
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
NC
2OUT
NC
2IN−
NC
NC
V CC−
NC
2IN+
NC
The high-common-mode input voltage range and
the absence of latch-up make these amplifiers
ideal for voltage-follower applications. The
devices are short-circuit protected and the
internal frequency compensation ensures stability
without external components.
4
NC − No internal connection
ORDERING INFORMATION
TA
VIOmax
AT 25°C
PDIP (P)
0°C to 70°C
−55°C
55 C to 125
125°C
C
†
6 mV
5 mV
ORDERABLE
PART NUMBER
PACKAGE†
TOP-SIDE
MARKING
Tube
MC1458P
Tube
MC1458D
Tape and reel
MC1458DR
SOP (PS)
Tape and reel
MC1458PSR
M1458
CDIP (JG)
Tube
MC1558JG
MC1558JG
CDIP (JGB)
Tube
MC1558JGB
MC1558JGB
LCCC (FK)
Tube
MC1558FK
MC1558FK
SOIC (D)
MC1458P
MC1458
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Copyright © 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
1
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C − FEBRUARY 1971 − REVISED AUGUST 2010
symbol (each amplifier)
IN+
+
IN−
−
OUT
schematic (each amplifier)
VCC +
IN −
OUT
IN +
VCC −
2
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C − FEBRUARY 1971 − REVISED AUGUST 2010
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC+ (see Note 1):
MC1458 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
MC1558 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 V
Supply voltage, VCC− (see Note 1): MC1458 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 V
MC1558 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −22 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V
Input voltage, VI (either input, see Notes 1 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15 V
Duration of output short circuit (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Package thermal impedance, θJA (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
Package thermal impedance, θJC (see Notes 7 and 8): FK package . . . . . . . . . . . . . . . . . . . . . . . . . 5.61°C/W
JG package . . . . . . . . . . . . . . . . . . . . . . . . . 14.5°C/W
Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: JG package . . . . . . . . . . . . . . . . . . . . 300°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, P, or PS package . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC− .
2. Differential voltages are at IN+ with respect to IN −.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
4. The output can be shorted to ground or either power supply. For the MC1558 only, the unlimited duration of the short circuit applies
at (or below) 125°C case temperature or 70°C free-air temperature.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
7. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) − TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
8. The package thermal impedance is calculated in accordance with MIL-STD-883.
recommended operating conditions
VCC±
Supply voltage
TA
Operating free-air
free air temperature range
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
MIN
MAX
±5
± 15
MC1458
0
70
MC1558
−55
125
UNIT
V
°C
3
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C − FEBRUARY 1971 − REVISED AUGUST 2010
electrical characteristics at specified free-air temperature, VCC ± = ±15 V
VIO
Input offset voltage
VO = 0
IIO
Input offset current
VO = 0
IIB
Input bias current
VO = 0
VICR
Common mode input
Common-mode
voltage range
VOM
Maximum peak output
voltage swing
MC1458
TEST CONDITIONS†
PARAMETER
MIN
25°C
TYP
1
Full range
25°C
20
80
Full range
25°C
± 12
± 12
RL = 10 kΩ
25°C
± 12
RL ≥ 10 kΩ
Full range
± 12
RL = 2 kΩ
25°C
± 10
RL ≥ 2 kΩ
Full range
± 10
25°C
20
Full range
15
VO = ±10 V
BOM
Maximum-output-swing
bandwidth
(closed loop)
RL = 2 kΩ,
AVD = 1,
VO ≥ ±10 V,
THD ≥ 5%
B1
Unity-gain bandwidth
φm
Phase margin
AVD = 1
MAX
1
5
6
200
20
500
± 13
200
500
80
800
Full range
RL ≥ 2 kΩ,
6
TYP
300
25°C
Large signal differential
Large-signal
voltage amplification
MIN
7.5
Full range
AVD
MC1558
MAX
500
1500
± 12
± 13
± 12
± 10
nA
nA
± 14
± 11
± 13
mV
V
± 12
± 14
UNIT
V
± 13
± 10
200
50
200
V/mV
25
25°C
14
14
kHz
25°C
1
1
MHz
deg
25°C
65
65
Gain margin
25°C
11
11
dB
ri
Input resistance
25°C
2
MΩ
ro
Output resistance
Ci
Input capacitance
zic
Common-mode input
impedance
f = 20 Hz
CMRR
Common mode
Common-mode
rejection ratio
VIC = VICR min,
VO = 0
kSVS
Supply-voltage
sensitivity
(ΔVIO/ΔVCC)
VCC = ±9 V to ±15 V,
VO = 0
Vn
Equivalent input noise
voltage (closed loop)
AVD = 100,
f = 1 kHz,
IOS
Short-circuit output
current
ICC
Supply current
(both amplifiers)
VO = 0,
0
No load
PD
Total power dissipation
(both amplifiers)
VO = 0,
0
No load
VO1/VO2
Crosstalk attenuation
VO = 0,
See Note 9
0.3
2
25°C
75
75
Ω
25°C
1.4
1.4
pF
25°C
200
200
MΩ
25°C
70
Full range
70
25°C
90
70
90
30
150
30
150
45
25°C
± 25
± 40
± 25
25°C
3.4
5.6
3.4
Full range
25°C
45
6.6
100
Full range
170
100
± 40
5
150
200
120
μV/V
V/V
nV/√Hz
6.6
200
120
150
150
25°C
25°C
dB
70
Full range
RS = 0,
BW = 1 Hz
0.3*
mA
mA
mW
dB
*On products compliant to MIL-PRF-38535, this parameter is not production tested.
† All characteristics are specified under open-loop operating conditions with zero common-mode input voltage, unless otherwise specified. Full
range for MC1458 is 0°C to 70°C and for MC1558 is − 55°C to 125°C.
NOTE 9: This typical value applies only at frequencies above a few hundred hertz because of the effect of drift and thermal feedback.
4
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
MC1458, MC1558
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS069C − FEBRUARY 1971 − REVISED AUGUST 2010
operating characteristics, VCC ± = ±15 V, CL = 100 pF, TA = 25°C (see Figure 1)
PARAMETER
TYP
MC1558
MAX
MIN
TYP
MAX
UNIT
Rise time
VI = 20 mV,
RL = 2 kΩ,
0.3
0.3
μs
Overshoot factor
VI = 20 mV,
RL = 2 kΩ
5
5
%
Slew rate at unity gain
VI = 10 V,
RL = 2 kΩ
0.5
0.5
V/μs
PARAMETER MEASUREMENT INFORMATION
VI
Output
+
SR
MIN
−
tr
MC1458
TEST CONDITIONS
Input
0V
Input Voltage
Waveform
CL = 100 pF
RL = 2 kΩ
Test Circuit
Figure 1. Rise-Time, Overshoot, and Slew-Rate Waveform and Test Circuit
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
5
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-9760301Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629760301Q2A
MC1558FKB
5962-9760301QPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
9760301QPA
MC1558
MC1458D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MC1458
MC1458DE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MC1458
MC1458DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MC1458
MC1458DRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MC1458
MC1458DRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MC1458
MC1458P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
MC1458P
MC1458PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
MC1458P
MC1458PSR
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
M1458
MC1558FKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629760301Q2A
MC1558FKB
MC1558JG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
MC1558JG
MC1558JGB
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
9760301QPA
MC1558
MC1558P
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
-55 to 125
SN98212P
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MC1558, MC1558M :
• Catalog: MC1558
• Military: MC1558M
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
MC1458DR
SOIC
MC1458DR
MC1458PSR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.0
12.0
Q1
D
8
2500
330.0
12.4
6.4
5.2
2.1
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MC1458DR
SOIC
D
8
2500
367.0
367.0
35.0
MC1458DR
SOIC
D
8
2500
340.5
338.1
20.6
MC1458PSR
SO
PS
8
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
Similar pages