OKI MSM66579L 16-bit microcontroller Datasheet

PEDL66579-03
1Semiconductor
MSM66579 Family
This version: Nov. 1999
Preliminary
16-Bit Microcontroller
GENERAL DESCRIPTION
The MSM66579 family of highly functional CMOS 16-bit single chip microcontrollers utilizes the nX-8/500S,
Oki’s proprietary CPU core.
Four channels of serial ports, consisting of two channels of synchronous serial ports with 32-byte FIFO registers
and two channels of UART/synchronous serial ports, enable easy interfacing with external peripheral LSI devices
such as an encoder/decoder or servocontroller.
A switching function permits selection of separate address and data lines or multiplexed lines for the bus interface
to correspond to various peripheral LSI devices.
With features such as a clock gear function, dual clock function, programmable pull-up ports in which individual
bits can be programmed, and a small, thin package, the MSM66579 family of microprocessors is optimally suited
for the system control of small-sized low power devices.
The flash ROM versions (MSM66Q577L and MSM66Q579L) programmable with a single 2.7V (minimum)
power supply and flash ROM version (MSM66Q577) programmable with a single 5V power supply are also
included in the family. These versions are easily adaptable to quick specification changes and to new product
revisions.
APPLICATIONS
Digital Audio Control Systems
PC peripheral Control Systems
Office Electronics Control Systems
ORDERING INFORMATION
Order Code or Product Name
Package
Low voltage mask ROM version
(2.4 to 3.6 V)
MSM66577L-TB
MSM66577-TB
MSM66Q577L-TB
MSM66Q577-TB
Remark
5 V mask ROM version
100-pin plastic TQFP
(TQFP 100-P-1414-0.50-K)
MSM66577L flash ROM version
MSM66577 flash ROM version
MSM66579L-TB
Low voltage mask ROM version
(2.4 to 3.6 V)
MSM66Q579L-TB
MSM66579L flash ROM version
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MSM66579 Family
FEATURES
Name
MSM66577L
MSM66577
MSM66579L
Operating temperature
–30°C to +70°C
Power supply voltage/
maximum frequency
VDD = 2.4 to 3.6 V/f = 14 MHz VDD = 4.5 to 5.5 V/f = 30 MHz VDD = 2.4 to 3.6 V/f = 28 MHz
Minimum instruction
execution time
143 ns at 14 MHz
61 µs at 32.768 kHz
67 ns at 30 MHz
61 µs at 32.768 kHz
Internal ROM size
(max. external)
128 KB (1 MB)
Internal RAM size
(max. external)
I/O ports
71 ns at 28 MHz
61 µs at 32.768 kHz
4 KB (1 MB)
12 KB (1 MB)
74 I/O pins (with programmable pull-up resistors) 8 input-only pins
16-bit free running timer × 1ch
Compare out/capture input × 2ch
16-bit timer (auto reload/timer out) × 1ch
8-bit auto reload timer × 2ch (can also be used as 16-bit timer × 1ch)
Timers
8-bit auto reload timer × 1ch
8-bit auto reload timer × 3ch
(also functions as serial communication baud rate generator)
8-bit auto reload timer × 1ch (also functions as watchdog timer)
Watch timer (Real-timer counter) × 1ch
8-bit PWM × 4ch (can also be used as 16-bit PWM × 2ch)
Synchronous, with 32-byte FIFO × 2ch
Serial port
UART/Synchronous × 2ch
A/D converter
10-bit A/D converter × 8ch
D/A converter
8-bit D/A converter × 2ch
Non-maskable × 1ch
Maskable × 8ch
External interrupt
Interrupt priority
3 levels
Separate address and data busses/multiplexed address and data busses
Others
Bus release function
Dual clocks
Flash ROM version
MSM66Q577L
MSM66Q577
MSM66Q579L
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MSM66579 Family
SPECIAL FEATURES
1. High-performance CPU
The family includes the high-performance CPU, powerful bit manipulation instruction set, full symmetrical
addressing mode, and ROM WINDOW function, and also provides the best optimized C compiler support.
2. A variety of power saving modes
Attaching a 32.768-kHz crystal produces a real-time clock signal from the internal clock timer. Use of a single
clock in place of dual clocks is possible. Switching the CPU clock to this clock signal, 1/2 × main clock, or 1/4 ×
main clock, then produces operation in a low power consumption mode. The clock gear function allows a 1/2 × or
1/4 × main clock to be selected for the CPU operating clock.
The family provides a wide range of standby control functions. In addition to the usual STOP mode that stops the
oscillator, there are the quick restart STOP mode that shuts down the CPU and peripherals but leaves the oscillator
running, and the HALT mode that shuts down the CPU but leaves the peripherals running.
3. Variety of multifunctional serial ports
The family includes two channels of built-in synchronous serial ports with 32-byte FIFO implementing an auto
transfer function. The family allows multi-byte 1-frame information which consists of address, command, and data
to be easily and efficiently transmitted to or received from a serial interface type peripheral LSI device. The family
also allows multi-byte character information to be easily and efficiently transmitted to or received from an LCD
module. In addition, the family has two channels of combined UART/synchronous serial ports, and provides four
channels of serial interfaces.
UART/synchronous SIO
UART/synchronous SIO
Synchronous SIO with 32-byte FIFO
Synchronous SIO with 32-byte FIFO
4. MSM66Q577L, MSM66Q577 and MSM66Q579L with flash memory programmable with single power
supply
In addition to the regular mask ROM version, the family includes these versions with 128KB of flash memory that
can be programmed using a single power supply. For the MSM66Q577L and MSM66Q579L, an internal booster
circuit derives the necessary program voltage from the device's low (2.7 V min) power supply, and the program
voltage for the MSM66Q577 is provided with a single 5 V power supply.
5. High-precision A/D and D/A converters
The family includes a high-precision 10-bit analog-to-digital converter with eight channels and 8-bit digital-toanalog converter with two channels.
6. Multifunction PWM
The family supports both 8- and 16-bit PWM operation. Choosing between the time-base counter output or
overflow from an 8-bit auto-reload timer as the PWM counter clock source provides a wide number of possibilities
over a broad frequency range. The 16-bit PWM configuration supports a high-speed synchronization mode that
generates a high-precision output signal with less ripple suitable for digital-to-analog control applications.
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7. Programmable pull-up resistors
Building the pull-up resistors into the chip contributes to overall design compactness. Making them programmable
on a per-bit basis allows complete flexibility in circuit board layout and system design. These programmable
pull-up resistors are available for all I/O pins not already assigned specific functions (such as the oscillator
connection pins).
8. Wide support for external interrupts
There are a total of nine interrupt channels for use in communicating with external devices: eight for maskable
interrupts and one for non-maskable interrupts.
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MSM66579 Family
BLOCK DIAGRAM
CLKOUT
XTOUT
RXD1
TXD1
RXC1
TXC1
TM4OUT
RXD6
TXD6
RXC6
TXC6
16 bit Timer0
8 bit Timer1
Peripheral
Control
ALU
Control
Registers
SIO1
(UART/SYNC)
ALU Control
ACC
8 bit Time4/BRG
SSP
PSW
LRB
PC
DSR TSR
CSR
SIO6
Memory Control
Pointing Registers
Instruction
Decoder
SIO4
(32 byte FIFO SYNC)
RAM
4K/12K
SIO5
(32 byte FIFO SYNC)
8 bit Timer6/WDT
PWMOUT0
PWMOUT2
8 bit PWM0
PWMOUT1
8 bit PWM1
ROM
128K
8 bit Timer9
AO0
AO1
NMI
EXINT0
to
EXINT7
10 bit A/D
Converter
RTC
Port Control
VREF
AGND
AI0 to AI7
TBC
CAP/CMP
16 bit FRC
EA
SELMBUS
PSEN
RD
WR
WAIT
D0 to D7
(AD0 to AD7*)
A0 to A19
(AD8 to AD19*)
PWMOUT3
CPCM0
CPCM1
XT0
XT1
OSC0
OSC1
HOLD
HLDACK
RES
(UART/SYNC)
8 bit Timer5/BRG
SIOI5
SIOO5
SIOCK5
System
8 bit Timer2
8 bit Timer3/BRG
SIOI4
SIOO4
SIOCK4
CPU Core
Bus Port Control
TM0OUT
TM0EVT
TM1OUT
TM1EVT
TM2OUT
TM2EVT
8 bit D/A Converter
Interrupt
P0
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P14
P15
*: Address output/data I/O when
selecting multiplexed bus type.
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MSM66579 Family
80
85
90
75
1
5
70
10
65
15
60
20
55
50
45
40
P1-7/A15
P1-6/A14
P1-5/A13
P1-4/A12
P1-3/A11
P1-2/A10
P1-1/A9
P1-0/A8
P4-7/A7
P4-6/A6
P4-5/A5
P4-4/A4
P4-3/A3
P4-2/A2
P4-1/A1
P4-0/A0
GND
P0-7/D7(AD7*)
P0-6/D6(AD6*)
P0-5/D5(AD5*)
P0-4/D4(AD4*)
P0-3/D3(AD3*)
P0-2/D2(AD2*)
P0-1/D1(AD1*)
P0-0/D0(AD0*)
P6-6/TM2EVT
P6-7/TM2OUT
P5-4/CPCM0
P5-5/CPCM1
P5-6/TM0OUT
P5-7/TM0EVT
RES
NMI
EA
VDD
XT0
XT1
GND
OSC0
OSC1
VDD
P11-0/WAIT
P11-1/HOLD
P11-2/CLKOUT
P11-3/XTOUT
SELMBUS
P3-0/ALE
P3-1/PSEN
P3-2/RD
P3-3/WR
35
25
30
SIOCK4/P10-3
SIOO4/P10-4
SIOI4/P10-5
RXD1/P8-0
TXD1/P8-1
RXC1/P8-2
TXC1/P8-3
TM4OUT/P8-4
PWM2OUT/P8-6
PWM3OUT/P8-7
PWM0OUT/P7-6
PWM1OUT/P7-7
VDD
GND
HLDACK/P9-7
EXINT4/P9-0
EXINT5/P9-1
EXINT6/P9-2
EXINT7/P9-3
EXINT0/P6-0
EXINT1/P6-1
EXINT2/P6-2
EXINT3/P6-3
TM1EVT/P6-4
TM1OUT/P6-5
95
100
TXC6/P15-3
RXC6/P15-2
TXD6/P15-1
RXD6/P15-0
SIOCK5/P14-0
SIOO5/P14-1
SIOI5/14-2
GND
AO0/P14-6
AO1/P14-7
AGND
AI7/P12-7
AI6/P12-6
AI5/P12-5
AI4/P12-4
AI3/P12-3
AI2/P12-2
AI1/P12-1
AI0/P12-0
VREF
VDD
A19/P2-3
A18/P2-2
A17/P2-1
A16/P2-0
PIN CONFIGURATION (TOP VIEW)
100-pin Plastic TQFP
*: Address output/data I/O when selecting multiplexed bus type.
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85
1
80
5
75
10
70
15
65
20
60
25
55
50
45
P2-1/A17
P2-0/A16
P1-7/A15
P1-6/A14
P1-5/A13
P1-4/A12
P1-3/A11
P1-2/A10
P1-1/A9
P1-0/A8
P4-7/A7
P4-6/A6
P4-5/A5
P4-4/A4
P4-3/A3
P4-2/A2
P4-1/A1
P4-0/A0
GND
P0-7/D7(AD7*)
P0-6/D6(AD6*)
P0-5/D5(AD5*)
P0-4/D4(AD4*)
P0-3/D3(AD3*)
P0-2/D2(AD2*)
P0-1/D1(AD1*)
P0-0/D0(AD0*)
P3-3/WR
P3-2/RD
P3-1/PSEN
P5-4/CPCM0
P5-5/CPCM1
P5-6/TM0OUT
P5-7/TM0EVT
RES
NMI
EA
VDD
XT0
XT1
GND
OSC0
OSC1
VDD
P11-0/WAIT
P11-1/HOLD
P11-2/CLKOUT
P11-3/XTOUT
SELMBUS
P3-0/ALE
40
30
35
TXD6/P15-1
RXC6/P15-2
TXC6/P15-3
SIOCK4/P10-3
SIOO4/P10-4
SIOI4/P10-5
RXD1/P8-0
TXD1/P8-1
RXC1/P8-2
TXC1/P8-3
TM4OUT/P8-4
PWM2OUT/P8-6
PWM3OUT/P8-7
PWM0OUT/P7-6
PWM1OUT/P7-7
VDD
GND
HLDACK/P9-7
EXINT4/P9-0
EXINT5/P9-1
EXINT6/P9-2
EXINT7/P9-3
EXINT0/P6-0
EXINT1/P6-1
EXINT2/P6-2
EXINT3/P6-3
TM1EVT/P6-4
TM1OUT/P6-5
TM2EVT/P6-6
TM2OUT/P6-7
90
100
95
RXD6/P15-0
SIOCK5/P14-0
SIOO5/P14-1
SIOI5/P14-2
GND
AO0/P14-6
AO1/P14-7
AGND
AI7/P12-7
AI6/P12-6
AI5/P12-5
AI4/P12-4
AI3/P12-3
AI2/P12-2
AI1/P12-1
AI0/P12-0
VREF
VDD
A19/P2-3
A18/P2-2
MSM66579 Family
100-pin Plastic QFP
*: Address output/data I/O when selecting multiplexed bus type.
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PIN DESCRIPTIONS
In the Type column, “I” indicates an input pin, “O” indicates an output pin, and “I/O” indicates an I/O pin.
Description
Function
Symbol
Type
Port
P0_0/D0 (AD0)
to
P0_7/D7 (AD7)
I/O
Primary function
8-bit I/O port
10 mA sink capability
Pull-up resistors can be
Type
I/O
specified for each individual bit
P1_0/A8
to
P1_7/A15
P2_0/A16
to
P2_3/A19
selecting a multiplexed bus)
O
External memory access
Address output port
I/O
4-bit I/O port
Pull-up resistors can be
specified for each individual bit
O
External memory access
Address output port
4-bit I/O port
10 mA sink capability
Pull-up resistors can be
O
External memory access
Address latch enable signal
output pin
specified for each individual bit
O
I/O
P3_3/WR
P4_0/A0
I/O
P5_4/CPCM0
I/O
External program memory
access
Read strobe output pin
P3_2/RD
P5_5/CPCM1
(Address output/data I/O port when
I/O
P3_1/PSEN
P4_7/A7
External memory access
Data I/O port
8-bit I/O port
Pull-up resistors can be
specified for each individual bit
P3_0/ALE
to
Secondary function
8-bit I/O port
Pull-up resistors can be
specified for each individual bit
4-bit I/O port
Pull-up resistors can be
specified for each individual bit
O
External memory access
Read strobe output pin
O
External memory access
Write strobe output pin
O
External memory access
Address output port
(When selecting a separate bus
type)
I/O
I/O
Capture 0 input / Compare
0 output pin
Capture 1 input / Compare
1 output pin
P5_6/TM0OUT
O
Timer 0 timer output pin
P5_7/TM0EVT
I
Timer 0 external event input pin
I
External interrupt 0 input pin
I
External interrupt 1 input pin
I
External interrupt 2 input pin
I
External interrupt 3 input pin
I
Timer1 external event input pin
P6_5/TM1OUT
O
Timer 1 timer output pin
P6_6/TM2EVT
I
Timer 2 external event pin
P6_7/TM2OUT
O
Timer 2 timer output pin
P6_0/EXINT0
8-bit I/O port
Pull-up resistors can be
specified for each individual bit
P6_1/EXINT1
P6_2/EXINT2
P6_3/EXINT3
P6_4/TM1EVT
I/O
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Description
Function
Symbol
Type
Port
P7_6/PWM0OUT
P7_7/PWM1OUT
I/O
P8_0/RXD1
P8_1/TXD1
P8_2/RXC1
P8_3/TXC1
Primary function
Type
Secondary function
2-bit I/O port
Pull-up resistors can be
specified for each individual bit
O
PWM0 output pin
O
PWM1 output pin
7-bit I/O port
Pull-up resistors can be
specified for each individual bit
I
SIO1 receive data input pin
O
SIO1 transmit data output pin
I/O
I/O
SIO1 receive clock I/O pin
I/O
SIO1 transmit clock I/O pin
P8_4/TM4OUT
O
Timer 4 timer output pin
P8_6/PWM2OUT
O
PWM2 output pin
P8_7/PWM3OUT
O
PWM3 output pin
I
External Interrupt 4 input pin
I
External Interrupt 5 input pin
I
External Interrupt 6 input pin
P9_3/EXINT7
I
External Interrupt 7 input pin
P9_7/HLDACK
O
HOLD mode output pin
P9_0/EXINT4
5-bit I/O port
Pull-up resistors can be
P9_1/EXINT5
P9_2/EXINT6
I/O
P10_3/SIOCK4
P10_4/SIOO4
I/O
P10_5/SIOI4
P11_0/WAIT
P11_1/HOLD
specified for each individual bit
3-bit I/O port
Pull-up resistors can be
specified for each individual bit
4-bit I/O port
10 mA sink capability
I/O
P11_2/CLKOUT
Pull-up resistors can be
specified for each individual bit
P11_3/XTOUT
P12_0/AI0
to
I/O
SIO4 transmit-receive clock I/O pin
I
SIO4 receive data input pin
O
SIO4 transmit data output pin
I
External data memory access
wait input pin
I
HOLD mode request input pin
O
Main clock pulse output pin
O
Sub clock pulse output pin
8-bit input port
A/D converter analog input port
I
I
P12_7/AI7
P14_0/SIOCK5
P14_1/SIOO5
5-bit I/O port
Pull-up resistors can be
specified for each individual bit
I/O
SIO5 transmit-receive clock I/O
pin
O
SIO5 transmit data output pin
I
SIO5 receive data input pin
P14_6/AO0
O
D/A converter analog output port
P14_7/AO1
O
D/A converter analog output port
I
SIO6 receive data input pin
O
SIO6 transmit data output pin
P14_2/SIOI5
I/O
P15_0/RXD6
P15_1/TXD6
P15_2/RXC6
P15_3/TXC6
I/O
4-bit I/O port
Pull-up resistors can be
specified for each individual bit
I/O
SIO6 receive clock I/O pin
I/O
SIO6 transmit clock I/O pin
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Function
Power
supply
Oscillation
MSM66579 Family
Symbol
Type
Description
VDD
I
Power supply pin
Connect all VDD pins to the power supply.*
GND
I
GND pin
Connect all GND pins to GND.*
VREF
I
Analog reference voltage pin
AGND
I
Analog GND pin
XT0
I
Sub clock oscillation input pin
Connect to a crystal oscillator of f = 32.768 kHz.
XT1
O
Sub clock oscillation output pin
Connect to a crystal oscillator of f = 32.768 kHz.
The clock output is opposite in phase to XT0.
OSC0
I
Main clock oscillation input pin
Connect to a crystal or ceramic oscillator. Or, input an external
clock.
OSC1
O
Main clock oscillation output pin
Connect to a crystal or ceramic oscillator.
The clock output is opposite in phase to OSC0.
Leave this pin unconnected when an external clock is used.
Reset
RES
I
Reset input pin
Other
NMI
I
Non-maskable interrupt input pin
EA
I
External program memory access input pin
If the EA pin is enabled (low level), the internal program memory is
masked and the CPU executes the program code in external
program memory through all address space.
SELMBUS
I
SELMBUS = H: Address/data separate bus type
SELMBUS = L: Multiplexed bus type
* Each of the family devices has unique pattern routes for the internal power and ground. Connect the
power supply voltage to all VDD pins and the ground potential to all GND pins. If a device may have one
or more VDD or GND pins to which the power supply voltage or the ground potential is not connected, it
can not be guaranteed for normal operation.
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MSM66579 Family
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Digital power supply voltage
Condition
VDD
Input voltage
VI
Output voltage
VO
Analog reference voltage
GND = AGND = 0 V
Ta = 25°C
VREF
Analog input voltage
VAI
Power dissipation
PD
TSTG
Storage Temperature
Rating
Unit
–0.3 to +7.0
V
–0.3 to VDD + 0.3
V
–0.3 to VDD + 0.3
V
–0.3 to VDD + 0.3
V
–0.3 to VREF
V
Ta = 70°C 100-pin TQFP
per package 100-pin QFP
650
mW
750
mW
—
–50 to +150
°C
Range
Unit
RECOMMENDED OPERATING CONDITIONS
Parameter
Digital power supply voltage
Analog reference voltage
Symbol
VDD
Condition
MSM66577
fOSC ≤ 30 MHz
4.5 to 5.5
MSM66577L
fOSC ≤ 14 MHz
2.4 to 3.6
MSM66579L
fOSC ≤ 28 MHz
2.4 to 3.6
MSM66Q577
fOSC ≤ 30 MHz
4.5 to 5.5
MSM66Q577L
fOSC ≤ 14 MHz
2.7 to 3.3
MSM66Q579L
fOSC ≤ 28 MHz
2.7 to 3.3
V
VREF
—
VDD –0.3 to VDD
V
Analog input voltage
VAI
—
AGND to VREF
V
Memory hold voltage
VDDH
fOSC = 0 Hz
2.0 to 5.5
V
Operating frequency
Ambient temperature
Fan out
MSM66577
VDD = 4.5 to 5.5 V
2 to 30
MSM66577L
VDD = 2.4 to 3.6 V
2 to 14
MSM66579L
VDD = 2.4 to 3.6 V
2 to 28
MSM66Q577
VDD = 4.5 to 5.5 V
2 to 30
MSM66Q577L
VDD = 2.7 to 3.3 V
2 to 14
MSM66Q579L
VDD = 2.7 to 3.3 V
2 to 28
fXT
—
32.768
kHz
Ta
—
–30 to +70
°C
MOS load
20
—
P0, P3, P11
6
—
P1, P2, P4, P5, P6,
P7, P8, P9, P10,
P14, P15
1
—
fOSC
N
TTL load
MHz
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MSM66579 Family
ALLOWABLE OUTPUT CURRENT VALUES
MSM66577L/577/579L (VDD = 2.4 to 3.6 V/4.5 to 5.5 V, Ta = –30 to +70°C)
MSM66Q577L/Q577/Q579L (VDD = 2.7 to 3.3 V/4.5 to 5.5 V, Ta = –30 to +70°C)
Parameter
“H” output pin (1 pin)
“H” output pins (sum total)
“L” output pin (1 pin)
Pin
Symbol
Min.
Typ.
All output pins
IOH
—
—
–2
Sum total of all output pins
∑IOH
—
—
–40
IOL
—
—
P0, P3, P11
Other ports
Sum total of P0, P3, P11
Max.
10
5
80
Sum total of P1, P2, P4
“L” output pins (sum total)
Sum total of P5, P6, P9
Sum total of P7, P8, P10,
P14, P15
Sum total of all output pins
∑IOL
—
—
Unit
mA
50
140
[Note]
Each of the family devices has unique pattern routes for the internal power and ground. Connect the
power supply voltage to all VDD pins and the ground potential to all GND pins. If a device may have one
or more VDD or GND pins to which the power supply voltage or the ground potential is not connected, it
can not be guaranteed for normal operation.
12/37
PEDL66579-03
1Semiconductor
MSM66579 Family
ELELCTRICAL CHARACTERISTICS
DC Characteristics 1 (VDD = 4.5 to 5.5 V)
(VDD = 4.5 to 5.5 V, Ta = –30 to +70°C)
Parameter
“H” input voltage
*1
“H” input voltage *2,*3,*4,*5,*6,*7
“L” input voltage
*1
“L” input voltage *2,*3,*4,*5,*6,*7
“H” output voltage
Symbol
Condition
VIH
—
VIL
VOH
*2
“L” output voltage
*1, *4
Input leakage current
0.44VDD
—
VDD+0.3
0.80VDD
—
VDD+0.3
–0.3
—
0.16VDD
–0.3
—
0.2VDD
IO = –400 µA
VDD–0.4
—
—
IO = –2.0 mA
VDD–0.6
—
—
IO = –200 µA
VDD–0.4
—
—
IO = –2.0 mA
VDD–0.6
—
—
IO = 3.2 mA
—
—
0.4
Input current
*7
Output leakage current *1, *2, *4
Pull-up resistance
V
—
—
0.8
—
—
0.4
IO = 5.0 mA
—
—
0.8
—
—
1/–1
IIH/IIL
VI = VDD/0 V
—
—
1/–250
—
—
15/–15
ILO
VO = VDD/0 V
—
—
±10
µA
Rpull
VI = 0 V
25
50
100
kΩ
—
5
—
—
7
—
During A/D operation
—
—
4
mA
When A/D is stopped
—
—
10
µA
OSC is stopped,
XT is not used.
VDD = 2 V, Ta = 25°C *8
—
0.2
10
OSC is stopped,
XT is not used. *8
—
1
100
f = 30 MHz, No Load
—
40
60
mA
f = 30 MHz, No Load
—
60
90
mA
f = 32.768 kHz, No Load
—
70
120
µA
*3, *6
*5
Unit
IO = 1.6 mA
*2
Input current
Input capacitance
CI
Output capacitance
CO
Analog reference supply current
IREF
Supply current
(STOP mode)
Max.
IO = 10.0 mA
VOL
“L” output voltage
Typ.
—
*1, *4
“H” output voltage
Min.
IDDS
Supply current
(HALT mode)
IDDH
Supply current
IDD
f = 1 MHz, Ta = 25°C
*1: Applicable to P0
*2: Applicable to P1, P2, P4, P5, P6, P7, P8, P9,
P10, P14, P15
*3: Applicable to P12
*4: Applicable to P3, p11
µA
pF
µA
*5: Applicable to RES
*6: Applicable to SELMBUS, EA, NMI
*7: Applicable to OSC0
*8: Ports used as inputs are at VDD or 0 V.
Other ports are unloaded.
13/37
PEDL66579-03
1Semiconductor
MSM66579 Family
DC Characteristics 2 (VDD = 2.4 to 3.6 V)
MSM66577L/579L (VDD = 2.4 to 3.6 V, Ta = –30 to +70°C)
MSM66Q577L/Q579L (VDD = 2.7 to 3.3 V, Ta = –30 to +70°C)
Parameter
“H” input voltage
*1
“H” input voltage *2,*3,*4,*5,*6,*7
“L” input voltage
*1
“L” input voltage *2,*3,*4,*5,*6,*7
“H” output voltage
Symbol
Condition
VIH
—
VIL
—
IO = –400 µA
*1, *4
VOH
“H” output voltage
*2
“L” output voltage
*1, *4
VOL
“L” output voltage
*2
Input leakage current
*3, *6
Input current
*5
Input current
*7
Output leakage current *1, *2, *4
IIH/IIL
Min.
Typ.
Max.
0.44VDD
—
VDD+0.3
0.80VDD
—
VDD+0.3
–0.3
—
0.16VDD
–0.3
—
0.2VDD
VDD–0.4
—
—
IO = –2.0 mA
VDD–0.8
—
—
IO = –200 µA
VDD–0.4
—
—
IO = –1.0 mA
VDD–0.8
—
—
IO = 3.2 mA
—
—
0.5
IO = 5.0 mA
—
—
0.9
IO = 1.6 mA
—
—
0.5
IO = 2.5 mA
—
—
0.9
—
—
1/–1
—
—
1/–250
—
—
15/–15
VI = VDD/0 V
Unit
V
µA
ILO
VO = VDD/0 V
—
—
±10
µA
Pull-up resistance
Rpull
VI = 0 V
40
100
200
kΩ
Input capacitance
CI
—
5
—
Output capacitance
CO
—
7
—
Analog reference supply current
IREF
During A/D operation
—
—
2
mA
When A/D is stopped
—
—
5
µA
OSC is stopped,
XT is not used.
VDD = 2 V, Ta = 25°C *8
—
0.2
10
OSC is stopped,
XT is not used. *8
—
1
100
f = 14 MHz, No Load
—
—
TBD
mA
f = 14 MHz, No Load
—
—
TBD
mA
f = 32.768 kHz, No Load
—
—
TBD
µA
Supply current
(STOP mode)
IDDS
Supply current
(HALT mode)
IDDH
Supply current
IDD
f = 1 MHz, Ta = 25°C
*1: Applicable to P0
*2: Applicable to P1, P2, P4, P5, P6, P7, P8, P9,
P10, P14, P15
*3: Applicable to P12
*4: Applicable to P3, p11
pF
µA
*5: Applicable to RES
*6: Applicable to SELMBUS, EA, NMI
*7: Applicable to OSC0
*8: Ports used as inputs are at VDD or 0 V.
Other ports are unloaded.
14/37
PEDL66579-03
1Semiconductor
MSM66579 Family
AC Characteristics 1 (VDD = 4.5 to 5.5 V)
(1) Separate Bus Type
External program memory control
(VDD = 4.5 to 5.5 V, Ta = –30 to +70°C)
Parameter
Symbol
Condition
Min.
Max.
Cycle time
tcyc
fOSC = 30 MHz
33.3
—
Clock pulse width (HIGH level)
tφWH
13
—
Clock pulse width (LOW level)
tφWL
13
—
PSEN pulse width
tPW
2 tφ – 15
—
PSEN pulse delay time
tPD
—
45
Address setup time
tAS
tφ – 25
—
Address hold time
tAH
0
9
Instruction setup time
tIS
30
—
Instruction hold time
Read data access time
CL = 50 pF
tIH
0
—
tACC
—
3 tφ – 70
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
tφWH
tφWL
PSEN
tPD
A0 to A19
tPW
PC0 to 19
tAH
tAS
D0 to D7
INST0 to 7
tACC
tIS
tIH
Bus timing during no wait cycle time
15/37
PEDL66579-03
1Semiconductor
MSM66579 Family
External data memory control
(VDD = 4.5 to 5.5 V, Ta = –30 to +70°C)
Parameter
Symbol
Condition
Min.
Max.
Cycle time
tcyc
fOSC = 30 MHz
33.3
—
Clock pulse width (HIGH level)
tφWH
13
—
Clock pulse width (LOW level)
tφWL
13
—
RD pulse width
tRW
2 tφ – 15
—
WR pulse width
tWW
2 tφ – 15
—
RD pulse delay time
tRD
—
45
WR pulse delay time
tWD
Address setup time
tAS
Address hold time
—
45
tφ – 25
—
tAH
tφ – 3
tφ +3
Read data setup time
tRS
30
—
Read data hold time
tRH
0
—
Read data access time
tACC
—
3tφ –70
Write data setup time
tWS
2tφ – 30
—
Write data hold time
tWH
tφ – 3
tφ + 3
CL = 50 pF
tcyc
Unit
ns
Note: tφ = tcyc/2
CPUCLK
tφWH
tφWL
RD
tRD
A0 to A19
tRW
RAP0 to 19
tAS
tAH
DIN0 to 7
D0 to D7
tACC
tRS
tRH
WR
tWW
tWD
RAP0 to 19
A0 to A19
tAS
D0 to D7
tAH
DOUT0 to 7
tWS
tWH
Bus timing during no wait cycle time
16/37
PEDL66579-03
1Semiconductor
MSM66579 Family
(2) Multiplexed bus type
External program memory control
(VDD = 4.5 to 5.5 V, Ta = –30 to +70°C)
Parameter
Symbol
Condition
Min.
Max.
Cycle time
tcyc
fOSC = 30 MHz
33.3
—
Clock pulse width (HIGH level)
tφWH
13
—
Clock pulse width (LOW level)
tφWL
13
—
ALE pulse width
TAW
2 tφ – 10
—
PSEN pulse width
tPW
2 tφ – 14
—
PSEN pulse delay time
tPAD
tφ – 10
tφ + 10
Low address setup time
tALS
2tφ – 20
2tφ + 3
Low address hold time
tALH
tφ – 10
tφ + 10
High address setup time
tAHS
3tφ – 30
4tφ + 3
High address hold time
tAHH
0
tφ + 10
Instruction setup time
tIS
24
—
Instruction hold time
tIH
0
tφ – 3
CL = 50 pF
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
tφWH
ALE
tφWL
tAW
PSEN
tPAD
AD0 to AD7
PC0 to 7
tALS
A8 to A19
tPW
INST0 to 7
tALH
tIS
tIH
PC8 to 19
tAHS
tAHH
Bus timing during no wait cycle time
17/37
PEDL66579-03
1Semiconductor
MSM66579 Family
External data memory control
(VDD = 4.5 to 5.5 V, Ta = –30 to +70°C)
Parameter
Symbol
Condition
Min.
Max.
Cycle time
tcyc
fOSC = 30 MHz
33.3
—
Clock pulse width (HIGH level)
tφWH
13
—
Clock pulse width (LOW level)
tφWL
13
—
ALE pulse width
tAW
2 tφ – 10
—
RD pulse width
tRW
2 tφ – 14
—
WR pulse width
tWW
2 tφ – 14
—
RD pulse delay time
tRAD
tφ – 10
tφ +10
WR pulse delay time
tWAD
tφ – 10
tφ +10
Low address setup time
tALS
2 tφ – 20
2 tφ +3
CL = 50 pF
Low address hold time
tALH
tφ – 10
tφ +10
High address setup time
tAHS
3 tφ – 30
3 tφ +3
High address hold time
tAHH
tφ – 10
tφ +10
Read data setup time
tRS
24
—
Read data hold time
tRH
0
tφ – 3
Write data setup time
tWS
2tφ – 12
—
Write data hold time
tWH
tφ – 3
tφ + 3
tcyc
Unit
ns
Note: tφ = tcyc/2
CPUCLK
tφWH
ALE
tφWL
tAW
RD
tRAD
tRW
A
AD0 to AD7
DIN0 to 7
RAP0 to 7
tALS
tALH
A8 to A19
tRH
tRS
RAP8 to 19
tAHH
tAHS
WR
tWAD
AD0 to AD7
RAP0 to 7
tALS
tALH
A8 to A19
tWW
DOUT0 to 7
tWS
tWH
RAP8 to 19
tAHS
tAHH
Bus timing during no wait cycle time
18/37
PEDL66579-03
1Semiconductor
MSM66579 Family
(3) Serial port control
Serial ports 1 and 6 (SIO1 and 6)
Master mode (Clock synchronous serial port)
(VDD = 4.5 to 5.5 V, Ta = –30 to +70°C)
Parameter
Cycle time
Symbol
Condition
Min.
Max.
tcyc
fOSC = 30 MHz
33.3
—
Serial clock cycle time
tSCKC
4 tcyc
—
Output data setup time
tSTMXS
2 tφ – 5
—
Output data hold time
tSTMXH
5 tφ – 10
—
Input data setup time
tSRMXS
13
—
Input data hold time
tSRMXH
0
—
CL = 50 pF
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
TXC/RXC
tSCKC
SDOUT
(TXD)
tSTMXH
tSTMXS
SDIN
(RXD)
tSRMXS
tSRMXH
19/37
PEDL66579-03
1Semiconductor
MSM66579 Family
Slave mode (Clock synchronous serial port)
(VDD = 4.5 to 5.5 V, Ta = –30 to +70°C)
Parameter
Cycle time
Symbol
Condition
Min.
Max.
tcyc
fOSC = 30 MHz
33.3
—
Serial clock cycle time
tSCKC
4 tcyc
—
Output data setup time
tSTMXS
2 tφ – 15
—
Output data hold time
tSTMXH
4 tφ – 10
—
Input data setup time
tSRMXS
13
—
Input data hold time
tSRMXH
3
—
CL = 50 pF
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
TXC/RXC
tSCKC
SDOUT
(TXD)
tSTMXH
tSTMXS
SDIN
(RXD)
tSRMXS
tSRMXH
Measurement points for AC timing
V DD
0V
0.8V
0.8V
0.2V
0.2V
20/37
PEDL66579-03
1Semiconductor
MSM66579 Family
Serial ports 4 and 5 (SIO4 and 5)
Master mode (Clock synchronous serial port)
VDD = 4.5 to 5.5 V, Ta = –30 to +70°C)
Parameter
Cycle time
Symbol
Condition
Min.
Max.
tcyc
fOSC = 30 MHz
33.3
—
Serial clock cycle time
tSCKC
6 tcyc
—
Output data setup time
tSTMXS
6 tφ – 5
—
Output data hold time
tSTMXH
4.5 tφ – 10
—
Input data setup time
tSRMXS
13
—
Input data hold time
tSRMXH
0
—
CL = 50 pF
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
SIOCK
tSCKC
SDOUT
(SIOO)
tSTMXH
tSTMXS
SDIN
(SIOI)
tSRMXS
tSRMXH
21/37
PEDL66579-03
1Semiconductor
MSM66579 Family
Slave mode (Clock synchronous serial port)
(VDD = 4.5 to 5.5 V, Ta = –30 to +70°C)
Parameter
Cycle time
Symbol
Condition
Min.
Max.
tcyc
fOSC = 30 MHz
33.3
—
Serial clock cycle time
tSCKC
6 tcyc
—
Output data setup time
tSTMXS
3 tφ – 15
—
Output data hold time
tSTMXH
6 tφ – 10
—
Input data setup time
tSRMXS
13
—
Input data hold time
tSRMXH
3
—
CL = 50 pF
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
SIOCK
tSCKC
SDOUT
(SIOO)
tSTMXH
tSTMXS
SDIN
(SIOI)
tSRMXS
tSRMXH
Measurement points for AC timing
VDD
0V
0.8 V
0.8 V
0.2 V
0.2 V
22/37
PEDL66579-03
1Semiconductor
MSM66579 Family
AC Characteristics 2 (VDD = 2.4 to 3.6 V)
(1) Separate Bus Type
External program memory control
MSM66577L/579L (VDD = 2.4 to 3.6 V, Ta = –30 to +70°C)
MSM66Q577L/Q579L (VDD = 2.7 to 3.3 V, Ta = –30 to +70°C)
Parameter
Symbol
Condition
Min.
Max.
Cycle time
tcyc
fOSC = 14 MHz
71.4
—
Clock pulse width (HIGH level)
tφWH
28
—
Clock pulse width (LOW level)
tφWL
28
—
PSEN pulse width
tPW
2 tφ – 20
—
PSEN pulse delay time
tPD
Address setup time
tAS
Address hold time
Instruction setup time
Instruction hold time
Read data access time
—
75
tφ – 40
—
tAH
0
18
tIS
60
—
tIH
0
—
tACC
—
3 tφ – 120
CL = 50 pF
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
tφWH
tφWL
PSEN
tPD
A0 to A19
tPW
PC0 to 19
tAH
tAS
D0 to D7
INST0 to 7
tACC
tIS
tIH
Bus timing during no wait cycle time
23/37
PEDL66579-03
1Semiconductor
MSM66579 Family
External data memory control
MSM66577L/579L (VDD = 2.4 to 3.6 V, Ta = –30 to +70°C)
MSM66Q577L/Q579L (VDD = 2.7 to 3.3 V, Ta = –30 to +70°C)
Parameter
Symbol
Condition
Min.
Max.
Cycle time
tcyc
fOSC = 14 MHz
71.4
—
Clock pulse width (HIGH level)
tφWH
28
—
Clock pulse width (LOW level)
tφWL
28
—
RD pulse width
tRW
2 tφ – 20
—
WR pulse width
tWW
2 tφ – 20
—
RD pulse delay time
tRD
—
75
WR pulse delay time
tWD
—
75
Address setup time
tAS
tφ – 40
—
CL = 50 pF
Address hold time
tAH
tφ – 6
tφ +6
Read data setup time
tRS
60
—
Read data hold time
tRH
0
—
Read data access time
tACC
—
3tφ –120
Write data setup time
tWS
2tφ – 40
—
Write data hold time
tWH
tφ – 6
tφ + 6
tcyc
Unit
ns
Note: tφ = tcyc/2
CPUCLK
tφWH
tφWL
RD
tRD
tRW
RAP0 to 19
A0 to A19
tAH
tAS
D0 to D7
DIN0 to 7
tACC
tRS
tRH
WR
tWD
tWW
RAP0 to 19
A0 to A19
tAS
D0 to D7
tAH
DOUT0 to 7
tWS
tWH
Bus timing during no wait cycle time
24/37
PEDL66579-03
1Semiconductor
MSM66579 Family
(2) Multiplexed bus type
External program memory control
MSM66577L/579L (VDD = 2.4 to 3.6 V, Ta = –30 to +70°C)
MSM66Q577L/Q579L (VDD = 2.7 to 3.3 V, Ta = –30 to +70°C)
Symbol
Condition
Min.
Max.
Cycle time
Parameter
tcyc
fOSC = 14 MHz
71.4
—
Clock pulse width (HIGH level)
tφWH
28
—
Clock pulse width (LOW level)
tφWL
28
—
ALE pulse width
tAW
2 tφ – 15
—
PSEN pulse width
tPW
2 tφ – 18
—
PSEN pulse delay time
tPAD
tφ – 6
tφ + 6
Low address setup time
tALS
2tφ – 40
2tφ + 6
CL = 50 pF
Low address hold time
tALH
tφ – 15
tφ + 15
High address setup time
tAHS
3tφ – 50
4tφ + 6
High address hold time
tAHH
0
tφ + 15
Instruction setup time
tIS
58
—
Instruction hold time
tIH
0
tφ – 6
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
tφWH
ALE
tφWL
tAW
PSEN
tPAD
AD0 to AD7
PC0 to 7
tALS
A8 to A19
tPW
INST0 to 7
tALH
tIS
tIH
PC8 to 19
tAHS
tAHH
Bus timing during no wait cycle time
25/37
PEDL66579-03
1Semiconductor
MSM66579 Family
External data memory control
MSM66577L/579L (VDD = 2.4 to 3.6 V, Ta = –30 to +70°C)
MSM66Q577L/Q579L (VDD = 2.7 to 3.3 V, Ta = –30 to +70°C)
Parameter
Symbol
Condition
Min.
Max.
Cycle time
tcyc
fOSC = 30 MHz
71.4
—
Clock pulse width (HIGH level)
tφWH
28
—
Clock pulse width (LOW level)
tφWL
28
—
ALE pulse width
tAW
2 tφ – 18
—
RD pulse width
tRW
2 tφ – 18
—
WR pulse width
tWW
2 tφ – 18
—
RD pulse delay time
tRAD
tφ – 6
tφ +6
WR pulse delay time
tWAD
tφ – 6
tφ +6
Low address setup time
tALS
2 tφ – 12
2 tφ
Low address hold time
tALH
tφ – 6
tφ +6
High address setup time
tAHS
3 tφ – 12
3 tφ +12
High address hold time
tAHH
tφ – 6
tφ +6
Read data setup time
tRS
48
—
CL = 50 pF
Read data hold time
tRH
0
tφ – 6
Write data setup time
tWS
2tφ – 24
—
Write data hold time
tWH
tφ – 6
tφ + 6
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
tφWH
ALE
tφWL
tAW
RD
tRAD
tRW
A
AD0 to AD7
DIN0 to 7
RAP0 to 7
tALS
tALH
A8 to A19
tRH
tRS
RAP8 to 19
tAHH
tAHS
WR
tWAD
AD0 to AD7
RAP0 to 7
tALS
tALH
A8 to A19
tWW
DOUT0 to 7
tWS
tWH
RAP8 to 19
tAHS
tAHH
Bus timing during no wait cycle time
26/37
PEDL66579-03
1Semiconductor
MSM66579 Family
(3) Serial port control
Serial ports 1 and 6 (SIO1 and 6)
Master mode (Clock synchronous serial port)
MSM66577L/579L (VDD = 2.4 to 3.6 V, Ta = –30 to +70°C)
MSM66Q577L/Q579L (VDD = 2.7 to 3.3 V, Ta = –30 to +70°C)
Parameter
Cycle time
Symbol
Condition
Min.
Max.
tcyc
fOSC = 14 MHz
71.4
—
Serial clock cycle time
tSCKC
4 tcyc
—
Output data setup time
tSTMXS
2 tφ – 10
—
Output data hold time
tSTMXH
5 tφ – 20
—
Input data setup time
tSRMXS
21
—
Input data hold time
tSRMXH
0
—
CL = 50 pF
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
TXC/RXC
tSCKC
SDOUT
(TXD)
tSTMXH
tSTMXS
SDIN
(RXD)
tSRMXS
tSRMXH
27/37
PEDL66579-03
1Semiconductor
MSM66579 Family
Slave mode (Clock synchronous serial port)
MSM66577L/579L (VDD = 2.4 to 3.6 V, Ta = –30 to +70°C)
MSM66Q577L/Q579L (VDD = 2.7 to 3.3 V, Ta = –30 to +70°C)
Parameter
Cycle time
Symbol
tcyc
Condition
fOSC = 14 MHz
Min.
71.4
Max.
—
Serial clock cycle time
tSCKC
4 tcyc
—
Output data setup time
tSTMXS
2 tφ – 30
—
Output data hold time
tSTMXH
4 tφ – 20
—
CL = 50 pF
Input data setup time
tSRMXS
21
—
Input data hold time
tSRMXH
7
—
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
TXC/RXC
tSCKC
SDOUT
(TXD)
tSTMXH
tSTMXS
SDIN
(RXD)
tSRMXS
tSRMXH
Measurement points for AC timing
VDD
0V
0.8 V
0.8 V
0.2 V
0.2 V
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PEDL66579-03
1Semiconductor
MSM66579 Family
Serial ports 4 and 5 (SIO4 and 5)
Master mode (Clock synchronous serial port)
MSM66577L/ 579L (VDD = 2.4 to 3.6 V, Ta = –30 to +70°C)
MSM66Q577L/Q579L (VDD = 2.7 to 3.3 V, Ta = –30 to +70°C)
Parameter
Cycle time
Symbol
Condition
Min.
Max.
tcyc
fOSC = 14 MHz
71.4
—
Serial clock cycle time
tSCKC
5.6 tcyc
—
Output data setup time
tSTMXS
5.6 tφ – 10
—
Output data hold time
tSTMXH
4.2 tφ – 20
—
Input data setup time
tSRMXS
21
—
Input data hold time
tSRMXH
0
—
CL = 50 pF
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
SIOCK
tSCKC
SDOUT
(SIOO)
tSTMXH
tSTMXS
SDIN
(SIOI)
tSRMXS
tSRMXH
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PEDL66579-03
1Semiconductor
MSM66579 Family
Slave mode (Clock synchronous serial port)
MSM66577L/579L (VDD = 2.4 to 3.6 V, Ta = –30 to +70°C)
MSM66Q577L/Q579L (VDD = 2.7 to 3.3 V, Ta = –30 to +70°C)
Parameter
Cycle time
Symbol
Condition
Min.
Max.
tcyc
fOSC = 14 MHz
71.4
—
Serial clock cycle time
tSCKC
5.6 tcyc
—
Output data setup time
tSTMXS
2.8 tφ – 30
—
Output data hold time
tSTMXH
5.6 tφ – 20
—
Input data setup time
tSRMXS
21
—
Input data hold time
tSRMXH
7
—
CL = 50 pF
Unit
ns
Note: tφ = tcyc/2
tcyc
CPUCLK
SIOCK
tSCKC
SDOUT
(SIOO)
tSTMXH
tSTMXS
SDIN
(SIOI)
tSRMXS
tSRMXH
Measurement points for AC timing
VDD
0V
0.8 V
0.8 V
0.2 V
0.2 V
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PEDL66579-03
1Semiconductor
MSM66579 Family
A/D Converter Characteristics 1 (VDD = 4.5 to 5.5 V)
(Ta = –30 to 70°C, VDD = VREF = 4.5 to 5.5 V, AGND = GND = 0 V)
Parameter
Resolution
Symbol
Condition
Min.
Typ.
Max.
Unit
n
Refer to measurement
circuit 1
—
10
—
Bit
—
—
±3
Analog input source
impedance
—
—
±2
—
—
+3
—
—
–3
—
—
±1
10.7
—
—
Linearity error
EL
Differential linearity error
ED
Zero scale error
EZS
Full-scale error
EFS
tconv = 10.7 µs
Cross talk
ECT
Refer to measurement
circuit 2
Conversion time
tCONV
RI ≤ 5 kΩ
Set according to
ADTM set data
LSB
µs/ch
A/D Converter Characteristics 2 (VDD = 2.4 to 3.6 V)
(Ta = –30 to 70°C, VDD = VREF = 2.7 to 3.6 V, AGND = GND = 0 V)
Parameter
Symbol
Condition
Min.
Typ.
Resolution
n
EL
Refer to measurement
circuit 1
—
Linearity error
—
Differential linearity error
ED
Zero scale error
EZS
Analog input source
impedance
Full-scale error
EFS
tconv = 10.7 µs
Cross talk
ECT
Refer to measurement
circuit 2
Conversion time
tCONV
RI ≤ 5 kΩ
Set according to
ADTM set data
Max.
Unit
10
—
Bit
—
±3
—
—
±2
—
—
+3
—
—
–3
—
—
±1
27.4
—
—
LSB
µs/ch
[Note] The A/D conversion time should be set according to ADTV set data. Set the number of
conversion clock cycles according to frequencies of operation so that the A/D conversion time is
32 µs or more.
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PEDL66579-03
1Semiconductor
MSM66579 Family
Reference
voltage
VREF
0.1
µF
–
47
µF
+
+
0.1
µF
RI
AI0 to AI7
AGND
+
+5 V
VDD
GND
47
µF
0V
Analog input
CI
RI (impedance of analog input source) ≤5 kΩ
CI ≅ 0.1 µF
Measurement Circuit 1
32/37
PEDL66579-03
1Semiconductor
–
MSM66579 Family
5 kΩ
AI0
+
AI1
Analog input
0.1 µF
to
Cross talk is the difference
between the A/D conversion
results when the same
analog input is applied to AI0
through AI7 and the A/D
conversion results of the
circuit to the left.
AI7
VREF or AGND
Measurement Circuit 2
Definition of Terminology
1. Resolution
Resolution is the value of minimum discernible analog input.
With 10 bits, since 210 = 1024, resolution of (VREF – AGND) ÷ 1024 is possible.
2. Linearity error
Linearity error is the difference between ideal conversion characteristics and actual conversion
characteristics of a 10-bit A/D converter (not including quantization error).
Ideal conversion characteristics can be obtained by dividing the voltage between VREF and AGND into 1024
equal steps.
3. Differential linearity error
Differential linearity error indicates the smoothness of conversion characteristics. Ideally, the range of analog
input voltage that corresponds to 1 converted bit of digital output is 1LSB = (VREF – AGND) ÷ 1024.
Differential error is the difference between this ideal bit size and bit size of an arbitrary point in the conversion
range.
4. Zero scale error
Zero scale error is the difference between ideal conversion characteristics and actual conversion characteristics
at the point where the digital output changes from 000H to 001H.
5. Full-scale error
Full-scale error is the difference between ideal conversion characteristics and actual conversion characteristics
at the point where the digital output changes from 3FEH to 3FFH.
33/37
PEDL66579-03
1Semiconductor
MSM66579 Family
D/A Converter Characteristics
(VDD = 2.4 to 3.6 V/4.5 to 5.5 V, Ta = –30 to +70°C)
Parameter
Symbol
Resolution
n
Linearity error
EL
Absolute precision
—
Conversion time
Analog output impedance
Condition
—
Min.
Typ.
Max.
Unit
—
—
8
Bit
—
—
1
—
—
2
LSB
tCONV
CL = 50 pF
—
20
50
µs
—
—
—
20
—
kΩ
Definition of Terminology
1. Resolution
Resolution is the value of minimum discernible analog output.
With 8 bits, since 28 = 256, resolution of (VDD – GND) ÷ 256 is possible.
2. Linearity error
Linearity error is the difference between ideal conversion characteristics and actual conversion characteristics of
an 8-bit D/A converter.
Ideal conversion characteristics can be obtained by dividing the voltage between VDD and GND into 256 equal
steps.
3. Differential linearity error
Differential linearity error indicates the smoothness of conversion characteristics. Ideally, the range of analog
input voltage that corresponds to 1 converted bit of digital input is 1LSB = (VDD – GND) ÷ 256. Differential error
is the difference between this ideal bit size and bit size of an arbitrary point in the conversion range.
4. Absolute precision
Absolute precision is a gross error including a linearity error and the effect of noise.
34/37
PEDL66579-03
1Semiconductor
MSM66579 Family
PACKAGE DIMENSIONS
TQFP100-P-1414-0.50-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 m or more
0.55 TYP.
Notes for Mounting the Surface Mount Type Packages
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales
person on the product name, package name, pin number, package code and desired mounting
conditions (reflow method, temperature and times).
35/37
PEDL66579-03
1Semiconductor
MSM66579 Family
(Unit:mm)
QFP100-P-1420-0.65-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 m or more
1.29 TYP.
Notes for Mounting the Surface Mount Type Packages
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales
person on the product name, package name, pin number, package code and desired mounting
conditions (reflow method, temperature and times).
36/37
PEDL66579-03
1Semiconductor
MSM66579 Family
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained herein.
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6.
The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not authorized for use in any system or application that requires special
or enhanced quality and reliability characteristics nor in any system or application where the failure of such
system or application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7.
Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 1999 Oki Electric Industry Co., Ltd.
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