CYStech Electronics Corp. Spec. No. : C320S6R Issued Date : 2012.08.17 Revised Date : 2013.12.19 Page No. : 1/ 7 N-Channel MOSFET (dual transistors) MTDN138ZS6R Features • Low on-resistance • High ESD capability • High speed switching • Low-voltage drive • Easily designed drive circuits • Easy to use in parallel • Pb-free lead plating and halogen-free package Equivalent Circuit Outline MTDN138ZS6R SOT-363 Tr1 Tr2 Ordering Information Device MTDN138ZS6R-0-T1-G Package SOT-363 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name MTDN138ZS6R CYStek Product Specification Spec. No. : C320S6R Issued Date : 2012.08.17 Revised Date : 2013.12.19 Page No. : 2/ 7 CYStech Electronics Corp. The following characteristics apply to both Tr1 and Tr2 Absolute Maximum Ratings (Ta=25°C) Parameter Drain-Source Voltage Gate-Source Voltage Drain Current Drain Reverse Current Symbol Limits VDSS 60 ±20 200 800 200 800 VGSS ID IDP IDR IDRP Pd Continuous Pulsed Continuous Pulsed Power Dissipation ESD susceptibility V (Note 1) Tj ; Tstg mA (Note 1) 300(total) (Note 2) 1550 Operating Junction and Storage Temperature Range Unit (Note 3) -55~+150 mW V °C Note : 1. Pulse test, pulse width≤300μs, duty≤2% 2. 200mW per element must not be exceeded. 3. Human body model, 1.5kΩ in series with 100pF Electrical Characteristics (Ta=25°C) Symbol BVDSS* VGS(th) IGSS IDSS RDS(ON)* GFS Ciss Coss Crss td(ON) tr td(OFF) tf Qg Qgs Qgd Min. 60 1 100 - Typ. 1.2 3.2 3.2 2 2 1.5 240 30.6 5.5 4 3 5 14 9 1.1 0.1 0.23 Max. 2 ±10 1 5 5 4 4 3 - Unit mS Test Conditions VGS=0, ID=10μA VDS=VGS, ID=250μA VGS=±20V, VDS=0 VDS=60V, VGS=0 ID=1mA, VGS=2.5V ID=10mA, VGS=2.5V ID=10mA, VGS=4V ID=200mA, VGS=4V ID=200mA, VGS=10V VDS=10V, ID=100mA pF VDS=10V, VGS=0, f=1MHz ns VDS=30V, ID=200mA, VGS=10V, RG=6Ω nC VDS=30V, ID=200mA, VGS=10V V μA Ω *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% MTDN138ZS6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C320S6R Issued Date : 2012.08.17 Revised Date : 2013.12.19 Page No. : 3/ 7 Characteristic Curves Typical Output Characteristics 1.4 Typical Transfer Characteristics 1.2 6V 4.5V 1.0 4V 0.8 3.5V 0.6 0.4 3V 0.2 2.5V VGS=2V 2 4 6 8 Drain-Source Voltage -VDS(V) 10 1 0.8 0.6 0.4 0.2 0 0.0 0 VDS=10V 1.2 Drain Current -ID(A) Drain Current - ID(A) 1.4 10V 0 12 2 Static Drain-Source On-State resistance vs Drain Current 4 6 8 10 Gate-Source Voltage-VGS(V) 12 Reverse Drain Current vs Source-Drain Voltage 10 Source-Drain Voltage-VSD(V) Static Drain-Source On-State Resistance-RDS(on)(Ω) 1.2 VGS=2.5V VGS=4.5V 1 Tj=25°C 0.8 Tj=125°C 0.6 0.4 VGS=10V 0.2 1 0.001 0.01 0.1 Drain Current-ID(A) 0 1 7 6 6 Static Drain-Source On-State Resistance-RDS(ON)(Ω) Static Drain-Source On-State Resistance-RDS(ON)(Ω) 7 5 4 3 ID=100mA 4 3 2 1 0 0 MTDN138ZS6R 2 4 6 8 Gate-Source Voltage-VGS(V) 10 VGS=10V, ID=100mA 5 1 0 1 Drain-Source On-State Resistance vs Junction Tempearture Static Drain-Source On-State Resistance vs Gate-Source Voltage 2 0.2 0.4 0.6 0.8 Reverse Drain Current -IDR(A) -60 -20 20 60 100 140 Junction Temperature-Tj(°C) 180 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C320S6R Issued Date : 2012.08.17 Revised Date : 2013.12.19 Page No. : 4/ 7 Characteristic Curves (Cont.) Threshold Voltage vs Junction Tempearture Capacitance vs Drain-to-Source Voltage 1.6 Threshold Voltage-VGS(th)(V) 100 Capacitance---(pF) Ciss 10 C oss Crss ID=250uA 1.4 1.2 1 0.8 1 0.1 1 10 Drain-Source Voltage -VDS(V) 100 -60 -20 20 60 100 140 Junction Temperature-Tj(°C) Power Derating Curve Power Dissipation---PD(mW) 350 300 Dual 250 200 Single 150 100 50 0 0 50 100 150 Ambient Temperature---TA(℃) 200 Recommended Soldering Footprint MTDN138ZS6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C320S6R Issued Date : 2012.08.17 Revised Date : 2013.12.19 Page No. : 5/ 7 Reel Dimension Carrier Tape Dimension MTDN138ZS6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C320S6R Issued Date : 2012.08.17 Revised Date : 2013.12.19 Page No. : 6/ 7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTDN138ZS6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C320S6R Issued Date : 2012.08.17 Revised Date : 2013.12.19 Page No. : 7/ 7 SOT-363 Dimension Marking: 72 Device Code 6-Lead SOT-363 Plastic Surface Mounted Package CYStek Package Code: S6R Style: Pin 1. Source1 (S1) Pin 2. Gate1 (G1) Pin 3. Drain2 (D2) Pin 4. Source2 (S2) Pin 5. Gate2 (G2) Pin 6. Drain1 (D1) Millimeters Min. Max. 0.900 1.100 0.000 0.100 0.900 1.000 0.150 0.350 0.080 0.150 2.000 2.200 1.150 1.350 DIM A A1 A2 b c D E Inches Min. Max. 0.035 0.043 0.000 0.004 0.035 0.039 0.006 0.014 0.003 0.006 0.079 0.087 0.045 0.053 DIM E1 e e1 L L1 θ Millimeters Min. Max. 2.150 2.450 0.650 TYP 1.200 1.400 0.525 REF 0.260 0.460 0° 8° Inches Min. Max. 0.085 0.096 0.026 TYP 0.047 0.055 0.021 REF 0.010 0.018 0° 8° Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTDN138ZS6R CYStek Product Specification