LC709203F Smart LiB Gauge Battery Fuel Gauge LSI for 1-Cell Lithium-ion (Li+) Overview LC709203F is a Fuel Gauge for a single lithium ion battery. It is part of our Smart LiB Gauge family of Fuel Gauges which measure the battery RSOC (Relative State Of Charge) using its unique algorithm called HG-CVR. The HG-CVR algorithm eliminates the use of a sense resistor and provides accurate RSOC information even under unstable conditions (e.g. changes of battery; temperature, loading, aging and selfdischarge). An accurate RSOC contributes to the operating time of portable devices. LC709203F is available in two small packages realizing the industries smallest PCB footprint for the complete solution. It has minimal parameters to be set by the user enabling simple, quick setup and operation. www.onsemi.com WDFN8 3x4, 0.65P Pb-Free, Halogen Free type Features HG-CVR algorithm technology No external sense resistor 2.8% accuracy of RSOC Accurate RSOC of aging battery Automatic convergence of error Adjustment for the parasitic impedance around the battery Simple and Quick Setup Low power consumption 3μA Operational mode Precision Voltage measurement ±7.5mV Precision Timer ±3.5% Alerts for Low RSOC and / or Low Voltage Temperature compensation Sense Thermistor input Via I2C Detect Battery insertion I2C Interface (up to 400 kHz supported) WLCSP9, 1.60x1.76 Pb-Free, Halogen Free type ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 23 of this data sheet Applications Wireless Handsets Smartphones / PDA devices MP3 players Digital cameras Portable Game Players USB-related devices * I2C Bus is a trademark of Philips Corporation. © Semiconductor Components Industries, LLC, 2015 March 2015- Rev. 8 1 Publication Order Number: LC709203F/D LC709203F Application Circuit Example System Vdd 10kΩ 10kΩ Vdd I2C Bus Master TSW TSENSE Battery Pack SDA SCL T ASIC ALARMB VDD VSS TEST LC709203F 10kΩ Interrupt Input 1uF PACK- Vss PACK+ System System Vss Figure 1. Example of an application schematic using LC709203F (Temperature input via I2C.) System Vdd 10kΩ 10kΩ Vdd I2C Bus Master Battery Pack 10KΩ (s a me as thermistor resistance value) T TSW SDA SCL thermistor TSENSE 100Ω 10kΩ ASIC ALARMB VDD VSS TEST LC709203F 10kΩ Interrupt Input 1uF PACK- Vss PACK+ System System Vss Figure 2. Example of an application schematic using LC709203F (The temperature is measured directly by a thermistor.) www.onsemi.com 2 LC709203F Figure 3. Simplified Block Diagram TSW Bottom view TSENSE Top view SDA WLCSP9, 1.60x1.76 “Pb-Free, Halogen Free Type” SCL WDFN8 3x4, 0.65P “Pb-Free, Halogen Free Type” 8 7 6 5 LC709203F VDD 3 4 TSW SCL NC SDA TEST VSS C B A ALARMB 2 VSS TEST 1 TSENSE Figure 4. Pin Assignment www.onsemi.com 3 VDD 3 ALARMB 2 1 LC709203F Table 1. Pin Function Pin Name I/O Description WDFN8 WLP9 1 1B TEST I Connect this pin to VSS. 2 1A VSS - Connect this pin to the battery’s negative () pin. 3 3A VDD - Connect this pin to the battery’s positive (+) pin. This pin indicates alarm by low output(open drain). Pull-up must be done externally. 4 2A ALARMB O Alarm conditions are specified by registers (0x13 or 0x14). Connect this pin to VSS when not in use. Power supply output for thermistor. This pin goes HIGH during temperature read operation. 5 3B TSW O Resistance value of TSW (for thermistor pull-up) must be the same value as the thermistor. (Note 1) I Thermistor sense input. If you connect this pin to thermistor, insert 100 resistance between them 6 3C TSENSE 7 1C SDA I/O I2C Data pin (open drain). Pull-up must be done externally. 8 2C SCL I/O I2C Clock pin (open drain). Pull-up must be done externally. - 2B NC - for ESD. (Note 1) Connect this pin to VSS. Note 1: TSW and TSENSE must be disconnected as figure 1 when not in use. www.onsemi.com 4 LC709203F Table 2. Absolute Maximum Ratings at Ta = 25C, VSS = 0V Specification Parameter Symbol Pin/Remarks Conditions Unit VDD [ V ] Maximum supply VDD max VDD Input voltage VI (1) TSENSE Output voltage Vo (1) TSW Vo (2) ALARMB VIO (1) SDA, SCL Pd max WDFN8 voltage Input/output dissipation Operating ambient max 0.3 +6.5 0.3 VDD +0.3 0.3 VDD +0.3 0.3 V +5.5 Ta = 40 to +85C 480 mW WLP9 210 Topr temperature Storage ambient typ 0.3 voltage Allowable power min 40 +85 55 +125 C Tstg temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 3. Allowable Operating Conditions at Ta = 40 to +85C, VSS = 0V Specification Parameter Symbol Pin/Remarks Conditions VDD [ V ] Operating supply VDD (1) VDD VIH (1) TSENSE VIH (2) ALARMB, SDA, SCL voltage Low level input VIL (1) TSENSE VIL (2) ALARMB, SDA, SCL voltage typ max 2.5 4.5 2.5 to 4.5 0.7VDD VDD 2.5 to 4.5 1.4 2.5 to 4.5 VSS voltage High level input min 2.5 to 4.5 Unit V 0.25VDD 0.5 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 5 LC709203F Table 4. Electrical Characteristics at Ta = 40 to +85C, VSS = 0V Specification Parameter Symbol Pin/Remarks Conditions Unit VDD [V] High level input IIH (1) SDA, SCL current VIN = VDD (including output transistor off min typ max 2.5 to 4.5 1 leakage current) Low level input IIL (1) SDA, SCL current VIN = VSS (including output transistor off A 2.5 to 4.5 1 IOH = 0.4 mA 3.0 to 4.5 VDD0.4 IOH = 0.2 mA 2.5 to 4.5 VDD0.4 IOL = 3.0 mA 3.0 to 4.5 0.4 IOL = 1.3 mA 2.5 to 4.5 0.4 leakage current) High level output VOH (1) TSW voltage VOH (2) Low level output voltage Hysteresis VOL (1) VOL (2) TSW, ALARMB, SDA, SCL VHYS(1) SDA, SCL CP All pins voltage Pin capacitance Ta = 25C VRR 0.1VDD 2.5 to 4.5 10 Pins other than the pin under test VIN = VSS Reset Release 2.5 to 4.5 VDD Voltage(Note 2) Initialization V pF 2.4 V 90 ms +3.5 % TINIT Time after Reset 2.4 to 4.5 release(Note 2) Time Ta = 20C to +70C TME measurement 2.5 to 4.5 3.5 accuracy Consumption IDD (1) current IDD (2) (Note 3) Voltage VME (1) measurement VME (2) accuracy VDD Operational mode Sleep mode VDD 2.5 to 4.5 3 4.5 2.5 to 4.5 1 2 Ta = +25C Ta = 20C to +70C 3.6 7.5 +7.5 2.5 to 4.5 20 +20 A mV/cell Note 2: Once VDD voltage exceeds over the VRR, this LSI will release RESET status. And the LSI goes into Sleep mode TINIT after it. Note 3: Consumption current is a value in the range of 20C to +70C. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 6 LC709203F Table 5. I2C Slave Characteristics at Ta = 40 to +85C, VSS = 0V Specification Parameter Symbol Pin/Remarks Conditions unit VDD [V] min Max Clock frequency TSCL SCL 400 kHz Bus free time between STOP TBUF SCL, SDA See Fig. 5. 1.3 s THD:STA SCL, SDA See Fig. 5. 0.6 s SCL, SDA See Fig. 5. 0.6 s s condition and START condition Hold time (repeated) START condition First clock pulse is generated after this interval Repeated START condition setup time TSU:STA STOP condition setup time TSU:STO SCL, SDA See Fig. 5. 0.6 Data hold time THD:DAT SCL, SDA See Fig. 5. 0 Data setup time TSU:DAT SCL, SDA See Fig. 5. Clock low period TLOW SCL Clock high period THIGH SCL Clock/data fall time TF SCL, SDA 20 + 0.1CB 300 ns Clock/data rise time TR SCL, SDA 20 + 0.1CB 300 ns 400 s Wake up time from Sleep mode SDA low pulse width to wake up Wake up retention time from the falling edge of SDA Wake up retention time from STOP condition TWU TSP TWR1 TWR2 0.9 s 100 ns See Fig. 5. 1.3 s See Fig. 5. 0.6 s 2.5 to 4.5 SDA See Fig. 6. SDA See Fig. 6. 0.6 s SDA See Fig. 6. 500 ms SCL, SDA See Fig. 6. 500 ms tR tF t LOW t HD:STA SCL t HD:STA t HD:DAT t HIGH t SU:DAT t SU:STA t SU:STO SDA t BUF P S S Figure 5. I2C Timing Diagram www.onsemi.com 7 P LC709203F I2C Communication Protocol 2 Communication protocol type : I C Frequency : Supported up to 400kHz IC address [Slave Address] : 0x16 (It becomes "0001011X" when you write a binary, because the slave address is 7 bits. [X]=Rd/Wr.) Bus Protocols S : Start Condition Sr : Repeated Start Condition Rd : Read (bit value of 1) Wr : Write (bit value of 0) A : ACK (bit value of 0) N : NACK (bit value of 1) P : Stop Condition CRC-8 : Slave Address to Last Data (CRC-8-ATM : ex.3778mV : 0x16, 0x09, 0x17, 0xC2, 0x0E 0x86) : Master-to-Slave : Slave-to-Master : Continuation of protocol … Read Word Protocol S Slave Address Wr A Command Code A Sr Slave Address Rd A Data Byte Low A A CRC-8 N P … Data Byte High … * When you do not read CRC-8, there is not the reliability of data. CRC-8-ATM ex : (5 bytes) 0x16, 0x09, 0x17, 0xC2, 0x0E 0x86 Write Word Protocol S Slave Address Data Byte Low Wr A A Command Code Data Byte High A A CRC-8 * When you do not add CRC-8, the Written data (Data byte Low/High) become invalid. CRC-8-ATM ex : (4 bytes) 0x16, 0x09, 0x55, 0xAA 0x3B www.onsemi.com 8 … A P LC709203F Wake up from Sleep mode Sleep mode 2 Disable I C communication Enable I2C communication 2 Disable I C communication TSP SDA TWU TWR1 (Not to scale) Sleep mode 2 Enable I C communication SCL Disable I2C communication TWR2 SDA (Not to scale) STOP condition Figure 6. I2C Wake up Timing Diagram To wake up from Sleep mode, and to start I2C communication, Host side must set SDA low prior to the I2C communication. The Fuel Gauge LSI enables I2C communication after the TWU time period which is measured from the falling edge of SDA, as above timing chart. This “Wake up condition” is invalid for the following two cases. 1) After TWR1 timing following the falling edge of SDA, the Fuel Gauge LSI “Wake up condition” goes into autonomous disable. Once I2C communication is started, the operation doesn’t go into disable until the TWR2 timing has elapsed after STOP condition (below case). 2) After TWR2 timing following I2C Bus STOP condition, the Fuel gauge LSI “Wake up condition” goes into autonomous disable. If the “Wake up condition” goes into disable, set SDA low to once again wake up from the Sleep mode prior to the I2C communication. If Operational mode is set, it is possible to start I2C communication without this “Wake up operation”. Notice for I2C communication shared with another device When the I2C Bus (on which the Fuel Gauge LSI is connected) is shared with another device the Fuel Gauge LSI must be in its operation mode before the other Device starts I2C communication. www.onsemi.com 9 LC709203F Table 6. Function of Registers Command Code Register Name R/W Range Unit Executes RSOC initialization with sampled maximum voltage when 0xAA55 is set. Sets B-constant of the 1K thermistor to be measured. 0x04 Before RSOC W 0xAA55: Initialize RSOC 0x06 Thermistor B R/W 0x0000 to 0xFFFF 0x07 Initial RSOC W 0xAA55: Initialize RSOC R 0x0000 to 0xFFFF 0x08 Cell Temperature W 0x09E4 to 0x0D04 2 (I C mode) 0.1K (0.0℃ = 0x0AAC) 0x09 Cell Voltage R 0x0000 to 0xFFFF 1mV 0x0A Current Direction R/W 0x0000: Auto mode 0x0001: Charge mode 0xFFFF: Discharge mode R/W 0x0000 to 0x00FF R/W 0x0000 to 0xFFFF 0x0B 0x0C APA (Adjustment Pack Application) APT (Adjustment Pack Thermistor) Initial Value Description Executes RSOC initialization when 0xAA55 is set. Displays Cell Temperature. 2 Sets Cell Temperature in I C mode. Displays Cell Voltage. Selects Auto/Charge/Discharge mode. 1m Sets Parasitic impedance. Sets a value to adjust temperature measurement delay timing. 0x0D RSOC R 0x0000 to 0x0064 0x0F ITE (Indicator to Empty) R 0x0000 to 0x03E8 0x11 IC Version R 0x0000 to 0xFFFF Displays RSOC value based on a 0-100 scale Displays RSOC value based on 0.1% a 0-1000 scale Displays an ID number of an IC. 0x12 Change Of The Parameter R/W 0x0000 or 0x0001 Selects a battery profile. 0x13 Alarm Low RSOC R/W 0x14 Alarm Low Cell Voltage R/W 0x15 IC Power Mode R/W 0x16 Status Bit R/W 0x1A Number of The Parameter R 1% 0x0000: Disable 0x0001to0x0064: Threshold 0x0000: Disable 0x0001to0xFFFF: Threshold 0x0001: Operational mode 0x0002: Sleep mode 2 0x0000: I C mode 0x0001: Thermistor mode 0x0301 or 0x0504 1% 1mV Sets RSOC threshold to generate Alarm signal. Sets Voltage threshold to generate Alarm signal. 0x0BA6 (25℃) 0x0000 0x001E 0x0000 0x0008 0x0000 (Note4) Selects Temperature obtaining method. 0x0000 Displays Battery profile code. Note 4: See Table 7. Table 7. Initial Power Mode Package Initial Power mode (0x15) LC709203FQH-0xTWG WDFN8 3x4, 0.65P 0x0001: Operational mode LC709203FXE-0xMH WLCSP9, 1.60x1.76 0x0002: Sleep mode www.onsemi.com 10 0x0D34 Selects Power mode. 0xXXXX=Hexadecimal notation Device - - LC709203F Before RSOC (0x04) This LSI obtains Open Circuit Voltage (OCV) reading 10 ms after Power-on reset to initialize RSOC (See figure 7). Or the LSI can be forced to initialize RSOC by sending the Before RSOC Command (004 = AA55) or the Initial RSOC Command (007 = AA55). The accuracy of the Initialization requires the OCV reading to be taken with minimal load or charge, under 0.025C, on the battery. (i.e. less than 75mA for 3000mAh design capacity battery.). The LSI initializes RSOC by the maximum voltage between initialize after Power-on reset and setting the command when the Before RSOC command is written. (See figure 8). Thermistor B (0x06) Sets B-constant of the thermistor to be measured. Refer to the specification sheet of the thermistor for the set value to use. Initial RSOC (0x07) The LSI can be forced to initialize RSOC by sending the Before RSOC Command (004 = AA55) or the Initial RSOC Command (007 = AA55). The LSI initializes RSOC by the measured voltage at that time when the Initial RSOC command is written. (See figure 9). The maximum time to initialize RSOC after the command is written is 1.5 ms. Cell Temperature (0x08) This register contains the cell temperature from 20C (009E4) to +60C (00D04) measured in 0.1C units. In the Thermistor mode (016 = 01) the LSI measures the attached thermistor and loads the temperature into the Cell Temperature register. In the Thermistor mode, the thermistor shall be connected to the LSI as shown in figure 2. The temperature is measured by having TSW pin to provide power into the thermistor and TSENSE pin to sense the output voltage from the thermistor. Temperature measurement timing is controlled by the LSI, and the power to the thermistor is not supplied for other reasons except to measure the temperature. In the I2C mode (016 = 00) the temperature is provided by the host processor. During discharge/charge the register should be updates when the temperature changes more than 1C Cell Voltage (0x09) This register contains the voltage on VDD 1mV units. Current Direction (0x0A) This register is used to control the reporting of RSOC. In Auto mode the RSOC is reported as it increases or decreases. In Charge mode the RSOC is not permitted to decrease. In Discharge mode the RSOC is not permitted to increase. With consideration of capacity influence by temperature, we recommend operating in Auto because RSOC is affected by the cell temperature. A warm cell has more capacity than a cold cell. Be sure not to charge in the Discharge mode and discharge in the Charge mode; it will create an error. An example of RSOC reporting is shown in Figures 10 and 11. Figure 7. RSOC automatic initialization Figure 8. Before RSOC command Figure 9. Initial RSOC command www.onsemi.com 11 LC709203F Figure 10. Discharge Mode (An example with increasing in temperature. A warm cell has more capacity than a cold cell. Therefore RSOC increases without charging in Auto mode.) Figure 11. Charge mode (An example with decreasing in temperature. A cold cell has less capacity than a warm cell. Therefore RSOC decreases without discharging in Auto mode.) Adjustment Pack Application (0x0B) IC Version (0x11) This register contains the adjustment value to remove the influence of a parasitic resistance in user’s application on RSOC precision. The LSI measures RSOC by using battery impedance and the voltage. Therefore, the parasitic resistance which exists in VDD/VSS Lines between measured Battery or Battery Pack to the LSI can become an error factor. But the resistance of Lines which is not connected other than the LSI is not included (Please see figure 12.). The measured values of resistances are counted up to decide the value to be set. Table 8 shows the example of the value to set this register. The factors of the value are the total resistance and the design capacity of the battery. The lower resistance may improve the RSOC precision. Please see LC709203F Application note for information about layout method of VDD/VSS Lines to reduce it. Please contact ON Semiconductor if you don’t satisfy the RSOC precision. The deeper adjustment of APA may improve it. This is an ID number of an LSI. Change of the Parameter (0x12) The LSI contains a data file comprised of two battery profiles. This register is used to select the battery profile to be used. See Table 9. Register Number of the Parameter (0x1A) contains identity of the data file. The Data file is loaded during final test depending on the part number ordered. Most of the time, battery nominal/rated voltage or charging voltage values are used to determine which profile data shall be used. Please contact ON Semi if you cannot identify which profile to select. Alarm Low RSOC (0x13) The ALARMB pin will be set low when the RSOC value falls below this value, will be released from low when RSOC value rises than this value. Set to Zero to disable. Figure 14. Adjustment Pack Thermistor (0x0C) This is used to compensate for the delay of the thermistor measurement caused by a capacitor across the thermistor. The default value has been found to meet most of circuits where a capacitor like showing in figure13 is not put. Please contact ON Semiconductor if you have an unusual circuit implementation. Alarm Low Cell Voltage (0x14) The ALARMB pin will be set low if VDD falls below this value, will be released from low if VDD rises than this value. Set to Zero to disable. Figure 15. RSOC (0x0D) RSOC is reported in 1% units over the range 0% to 100%. Indicator to Empty (0x0F) This is the same as RSOC with a resolution of 0.1% over the range 0.0% to 100.0%. www.onsemi.com 12 LC709203F Figure 12. An example of parasitic resistance Figure 13. An example of a capacitor across the thermistor Table 8. APA table Design capacity of battery 2000mAh 3000mAh Total parasitic resistance APA(0x0B) 0mΩ 0x2D 10mΩ 0x32 20mΩ 0x37 0mΩ 0x2D 10mΩ 0x35 20mΩ 0x3C www.onsemi.com 13 LC709203F Figure 14. Alarm Low RSOC Figure 15. Alarm Low Cell Voltage IC Power Mode (0x15) Status Bit (0x16) The LSI has two power modes. Sleep (0x15 = 02) or Operational mode (0x15 = 01). In the Sleep mode only I2C communication functions. In the Operational mode all functions operate with full calculation and tracking of RSOC during charge and discharge. If the battery is significantly charged or discharged during sleep mode, the RSOC will not be accurate. Moved charge is counted continuously to measure the RSOC in Operational mode. If battery is discharged or charged in the Sleep mode, the count breaks off. When it is switched from Sleep mode to Operational mode, RSOC calculation is continued by using the data which was measured in the previous Operational mode. This selects the Thermistor mode. Thermistor mode (0x16 = 01) the LSI measures the attached thermistor and loads the temperature into the Cell Temperature register. I2C mode (0x16 = 00) the temperature is provided by the host processor. Number of the Parameter (0x1A) The LSI contains a data file comprised of two battery profiles. This register contains identity of the data file. Please see register Change of the Parameter (0x12) to select the battery profile to be used. See Table 9. The Data file is loaded during final test depending on the part number ordered. This file can be loaded in the field if required. Please contact ON Semi if you cannot identify which profile to select. Table 9. Battery profile vs register IC Type LC709203Fxx-01xx LC709203Fxx-04xx Battery Type Nominal/Rated Voltage Charging Voltage 03 3.8 V 4.35V 3.7V 4.2V 01 05 ICR18650-26H (SAMSUNG) 04 UR18650ZY (Panasonic) www.onsemi.com 14 Number Of The Parameter(0x1A) 0x0301 0x0504 Change Of The Parameter(0x12) 0x0000 0x0001 0x0000 0x0001 LC709203F HG-CVRTM Hybrid Gauging by Current-Voltage tracking with internal Resistance HG-CVRTM is ON Semiconductor’s unique method which is used to calculate accurate RSOC. HG-CVRTM first measures battery voltage and temperature. Precise reference voltage is essential for accurate voltage measurement. LC709203F has accurate internal reference voltage circuit with little temperature dependency. It also uses the measured battery voltage and internal impedance and Open Circuit Voltage (OCV) of a battery for the current measurement. OCV is battery voltage without load current. The measured battery voltage is separated into OCV and varied voltage by load current. The varied voltage is the product of load current and internal impedance. Then the current is determined by the following formulas. Automatic Convergence of the Error A problem of coulomb counting method is the fact that the error is accumulated over time - This error must be corrected. The general gauges using coulomb counting method must find an opportunity to correct it. This LSI with HG-CVRTM has the feature that the error of RSOC converges, doesn’t emit without such an opportunity. The error constantly converges in the value estimated from the Open Circuit Voltage. Figure 24 shows the convergent characteristic from the initialize error. Also, coulomb counting method cannot detect accurate residual change because the amount of the current from self-discharge is too small but HG-CVRTM is capable to deal with such detection by using the voltage information. V(VARIED) = V(MEASURED)OCV (1) I= Simple and Quick Setup V(VARIED) R(INTERNAL) (2) Where V(VARIED) is varied voltage by load current, V(MEASURED) is measured voltage, R(INTERNAL) is internal impedance of a battery. Detailed information about the internal impedance and OCV is installed in the LSI. The internal impedance is affected by remaining capacity, load-current, temperature, and more. Then the LSI has the information as look up table. HG-CVRTM accumulates battery coulomb using the information of the current and a steady period by a high accuracy internal timer. The remaining capacity of a battery is calculated with the accumulated coulomb. In general, it is necessary to obtain multiple parameters for a fuel gauge and it takes a lot of resource and additional development time of the users. One of the unique features of LC709203F is very small number of parameters to be prepared by the beginning of battery measurement – the minimum amount of parameter which users may make is one because Adjustment pack application register has to have one. Such simple and quick start-up is realized by having multiple profile data in the LSI to support various types of batteries. Please contact your local sales office to learn more information on how to measure a battery that cannot use already-prepared profile data. Low Power Consumption How to identify Aging By repeating discharge/charge, internal impedance of a battery will gradually increase, and the Full Charge Capacity (FCC) will decrease. In coulomb counting method RSOC is generally calculated using the FCC and the Remaining Capacity (RM). RSOC = RM FCC 100% Low power consumption of 3A is realized in the Operation mode. This LSI monitors charge/discharge condition of a battery and changes the sampling rate according to its change of current. Power consumption reduction without deteriorating its RSOC accuracy was enabled by utilizing this method. Power-on Reset / Battery Insertion Detection (3) Then the decreased FCC must be preliminarily measured with learning cycle. But HG-CVRTM can measure the RSOC of deteriorated battery without learning cycle. The internal battery impedance that HG-CVRTM uses to calculate the current correlates highly with FCC. The correlation is based on battery chemistry. The RSOC that this LSI reports using the correlation is not affected by aging. Figure 21-23 show RSOC measurement result of a battery with decreased FCC due to its aging. The shown RSOC is based on the decreased FCC even with a battery with 80% FCC after executing 300 times of discharge/charge. When this LSI detects battery insertion, it starts Power-on reset automatically. Once the battery voltage exceeds over the VRR, it will release RESET status and will complete LSI initialization within TINIT to enter into Sleep mode or Operational mode (See table 7). All registers are initialized after Power-on reset. Please see figure 16. This LSI will also execute system reset automatically if a battery voltage exceeds under the VRR during operation. Measurement Starting Flow After Reset release, users can start battery measurement by writing appropriate value into the registers by following the flow shown in Figure 17-18. Please refer to Register function section for more information about each register. www.onsemi.com 15 LC709203F Timing diagram at power on Reset VDD Initialization TINIT Sleep Mode VRR Figure 16. Power on Timing Diagram (Not to scale) Starting flow Set 0xAA55 Power On Initial RSOC to register 0x04 or 0x07 (Note 6) Input SDA pulse (Note 5) Set 0x0001 to register 0x15 (Note 5) Wake up from Sleep mode Set Thermistor mode Set Operational mode Set B-constant of thermistor Set 0x0001 to register 0x16 Set 0xZZZZ to register 0x06 Set 0xZZZZ to register 0x0B Set APA Initialization End Note 5 : It's unnecessary if initial power mode is Set 0x000Z Operational mode. to register 0x12 SDA pulse can be substituded in some Set Battery profile kind of commands. Ex: Input "Set Operational mode" twice. Note 6 : It's unnecessary if OCV can be get at automatic initialization. Figure 17. Starting flow at Thermistor mode www.onsemi.com 16 LC709203F Set 0xAA55 Power On Initial RSOC to register 0x04 or 0x07 (Note 6) Input SDA pulse (Note 5) Set 0x0001 to register 0x15 (Note 5) Wake up from Sleep mode Set 0x0000 Set Via I2C mode Set Operational mode to register 0x16 Set 0xZZZZ Set Temperature to register 0x08 Set 0xZZZZ to register 0x0B Set APA Initialization End Note 5 : It's unnecessary if initial power mode is Set 0x000Z to register 0x12 Operational mode. SDA pulse can be substituded in some Set Battery profile kind of commands. Ex: Input "Set Operational mode" twice. Note 6 : It's unnecessary if OCV can be get at automatic initialization. Figure 18. Starting flow at I2C mode www.onsemi.com 17 LC709203F TYPICAL CHARACTERISTICS Figure 19. Discharge Characteristics by Temperature Change Figure 20. Discharge Characteristics by Load Change www.onsemi.com 18 LC709203F TYPICAL CHARACTERISTICS Figure 21. Discharge/Charge cycle Figure 22. Battery capacity deterioration Figure 23. 1 Discharge characteristics of deterioration battery www.onsemi.com 19 LC709203F TYPICAL CHARACTERISTICS Figure 24. Convergent characteristic from the initialize error www.onsemi.com 20 LC709203F PACKAGE DIMENSIONS unit : mm WDFN8 3x4, 0.65P CASE 509AF ISSUE C L A B D L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM THE TERMINAL TIP. 4. PROFILE TOLERANCE APPLIES TO THE EXPOSED PAD AS WELL AS THE LEADS. L1 DETAIL A ALTERNATE CONSTRUCTIONS DIM A A1 A3 b D D2 E E2 e L L1 E PIN ONE REFERENCE 2X EXPOSED Cu MOLD CMPD 0.10 C DETAIL B 0.10 C 2X ALTERNATE CONSTRUCTIONS TOP VIEW A (A3) DETAIL B 0.10 C SIDE VIEW A1 C XXXXX XXXXX AYWW SEATING PLANE 0.10 C A B A = Assembly Location Y = Year WW = Work Week = Pb-Free Package (Note: Microdot may be in either location) D2 DETAIL A 1 4 0.10 C A B 8X 0.00 0.05 0.20 REF 0.20 0.30 3.00 BSC 1.70 1.90 4.00 BSC 2.30 2.50 0.65 BSC 0.45 0.55 GENERIC MARKING DIAGRAM* 0.08 C NOTE 4 MILLIMETERS MIN MAX L *This information is generic. Please refer to device data sheet for actual part marking. E2 may or may not be present. 8 5 e/2 e 8X RECOMMENDED SOLDERING FOOTPRINT* b 1.96 0.10 C A B 0.05 C 8X 0.70 NOTE 3 BOTTOM VIEW 2.56 4.30 1 0.65 PITCH 8X 0.35 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 21 LC709203F PACKAGE DIMENSIONS unit : mm WLCSP9, 1.60x1.76 CASE 567JH ISSUE B E A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO THE SPHERICAL CROWNS OF THE SOLDER BALLS. PIN A1 REFERENCE D DIM A A1 b D E e 0.05 C 2X 0.05 C 2X TOP VIEW BACKCOAT 0.10 C MILLIMETERS MIN MAX 0.51 −−− 0.09 0.19 0.20 0.30 1.60 BSC 1.76 BSC 0.50 BSC A RECOMMENDED SOLDERING FOOTPRINT* 0.08 C A1 A1 NOTE 3 C SIDE VIEW PACKAGE OUTLINE SEATING PLANE e 9X b 0.05 C A B e 0.50 PITCH C 0.03 C B 9X 0.25 0.50 PITCH DIMENSIONS: MILLIMETERS A 1 2 3 BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 22 LC709203F ORDERING INFORMATION Device Package Shipping (Qty / Packing) LC709203FQH-01TWG WDFN8 3x4, 0.65P (Pb-Free / Halogen Free) 2000 / Tape & Reel LC709203FQH-02TWG WDFN8 3x4, 0.65P (Pb-Free / Halogen Free) 2000 / Tape & Reel LC709203FQH-03TWG WDFN8 3x4, 0.65P (Pb-Free / Halogen Free) 2000 / Tape & Reel LC709203FQH-04TWG WDFN8 3x4, 0.65P (Pb-Free / Halogen Free) 2000 / Tape & Reel LC709203FXE-01MH WLCSP9, 1.60x1.76 (Pb-Free / Halogen Free) 5000 / Tape & Reel LC709203FXE-02MH WLCSP9, 1.60x1.76 (Pb-Free / Halogen Free) 5000 / Tape & Reel LC709203FXE-03MH WLCSP9, 1.60x1.76 (Pb-Free / Halogen Free) 5000 / Tape & Reel LC709203FXE-04MH WLCSP9, 1.60x1.76 (Pb-Free / Halogen Free) 5000 / Tape & Reel † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF (Note) IC performance may vary depend on the types of battery to be in use. 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