Marktech MT4363-HR-A 2.9mm round led lamp Datasheet

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SPECIFICATION
PART NO. : MT4363-HR-A
2.9mm ROUND LED LAMP
ATTENTION
OBSERVE PRECAUTION
FOR HANDLING
ELECTRO STATIC
SENSITIVE
DEVICES
2.9mm ROUND LED LAMP
MT4363-HR-A
Description
This Hi-Effect red lamp is made with GaAsP/GaP chip and water clear
epoxy resin.
A
K
Notes:
1. All dimensions are in mm.
2. Tolerance is ± 0.25mm unless otherwise noted.
Description
LED Chip
Part
No.
MT4363-HR-A
Material
Emitting Color
GaAsP/GaP
Hi-Effect Red
VER.: 01
Lens Color
Water clear
Date: 2007/10/31
Page: 1/5
MT4363-HR-A
2.9mm ROUND LED LAMP
Absolute Maximum Ratings at Ta=25℃
Parameter
Symbol
Rating
Unit
Power Dissipation
PD
78
mW
Reverse Voltage
VR
5
V
D.C. Forward Current
If
30
mA
Reverse (Leakage) Current
Ir
100
μA
If(Peak)
100
mA
Operating Temperature Range
Topr.
-40 to +95
℃
Storage Temperature Range
Tstg.
-40 to +100
℃
Soldering Temperature(1.6mm from body)
Tsol
Peak Current(1/10Duty Cycle,0.1ms Pulse Width.)
Dip Soldering : 260℃ for 5 sec.
Hand Soldering : 350℃ for 3 sec.
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Luminous Intensity
IV
If=20mA
19.0
40.0
72.8
mcd
Forward Voltage
Vf
If=20mA
2.1
2.6
V
Peak Wavelength
λp
If=20mA
642
Dominant Wavelength
λd
If=20mA
Reverse (Leakage) Current
Ir
Vr=5V
2θ1/2
If=20mA
55
deg
∆λ
If=20mA
35
nm
Viewing Angle
Spectrum Line Halfwidth
624
629
nm
636
nm
100
µA
Notes:1. The datas tested by IS tester.
2. Customer’s special requirements are also welcome.
VER.: 01
Date: 2007/10/31
Page: 2/5
2.9mm ROUND LED LAMP
MT4363-HR-A
Typical Electrical / Optical Characteristics Curves :
50.0
Relative Luminous Intensity
Forward Current IF(mA)
50
40
30
20
10
1.2
1.6
2.0
2.4
2.8
40.0
30.0
20.0
10.0
0
3.2
2.0
1.0
0.0
3.0
Forward Current (mA)
Applied Voltage (V)
FORWARD CURRENT VS.APPLIED VOLTAGE
FORWARD CURRENT VS. LUMINOUS INTENSITY
0°
20°
10°
Forward Current IF(mA)
50
30°
40
40°
30
1.0
50°
0.9
20
60°
0.8
70°
80°
90°
10
0.7
0
20
40
60
Temperature (℃)
80
100
0.5
0.3
0.1
0.2
0.4
0.6
RADIATION DIAGRAM
FORWARD CURRENT VS. AMBIENT TEMPERATURE
VER.: 01
Date: 2007/10/31
Page: 3/5
MT4363-HR-A
2.9mm ROUND LED LAMP
Specifications for Bin Grading:
Iv(mcd)
BIN
MIN.
MAX.
F
19.0
26.6
G
26.6
37.2
H
37.2
52.0
J
52.0
72.8
Specifications for Vf Group:
Vf(V)
Group
MIN.
MAX.
V1
1.6
1.8
V2
1.8
2.0
V3
2.0
2.2
V4
2.2
2.4
V5
2.4
2.6
*Majority VF bins are highlighted in Yellow.
Specifications for Wavelength Group:
λD(nm) @20mA
Group
MIN.
MAX.
X3
624
627
X4
627
630
X5
630
633
X6
633
636
VER.: 01
Date: 2007/10/31
Page: 4/5
MT4363-HR-A
2.9mm ROUND LED LAMP
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1.
Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130℃.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1)
Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
(2)
Solder dip: Preheat: 90℃ max. (Backside of PCB), Within 60 seconds
Solder bath: 260±5℃ (Solder temperature), Within 5 seconds
(3)
Soldering iron : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120℃ max.
Baking time: Within 60 seconds
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
VER.: 01
Date: 2007/10/31
Page: 5/5
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