ON MBRS410LT3 Surface mount schottky power rectifier Datasheet

MBRS410LT3
Preferred Device
Surface Mount
Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Typical applications are AC−DC and DC−DC converters, reverse
battery protection, and “ORing” of multiple supply voltages and any
other application where performance and size are critical.
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SCHOTTKY BARRIER
RECTIFIERS
4.0 AMPERES, 10 VOLTS
Features
•
•
•
•
•
•
•
•
•
Ultra Low VF
1st in the Market Place with a 10 VR Schottky Rectifier
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
Excellent Ability to Withstand Reverse Avalanche Energy Transients
Guard−Ring for Stress Protection
Pb−Free Package is Available
SMC
CASE 403
PLASTIC
MARKING DIAGRAM
Mechanical Characteristics
AYWW
B4L1G
G
• Case: Epoxy, Molded
• Weight: 217 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
B4L1
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
• Lead and Mounting Surface Temperature for Soldering Purposes:
•
•
260°C Max. for 10 Seconds
Polarity: Notch in Plastic Body Indicates Cathode Lead
ESD Ratings:
Machine Model = C
Human Body Model = 3B
ORDERING INFORMATION
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
10
V
Average Rectified Forward Current
(@ TL = 110°C)
IO
4.0
A
IFSM
150
A
TJ
−65 to +125
°C
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature
Device
Package
Shipping †
MBRS410LT3
SMC
2500/Tape & Reel
MBRS410LT3G
SMC
(Pb−Free)
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 2
1
Publication Order Number:
MBRS410LT3/D
MBRS410LT3
THERMAL CHARACTERISTICS
Characteristic
Symbol
Min Pad (Note 2)
1 Inch Pad
Unit
°C/W
Thermal Resistance,
Junction−to−Lead
Thermal Resistance,
Junction−to−Ambient
RqJL
12
7.0
RqJA
109
59
VF
TJ = 25°C
TJ = 100°C
0.31
0.33
0.35
0.200
0.225
0.250
TJ = 25°C
TJ = 100°C
2.0
5.0
100
200
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1)
(IF = 2.0 A)
(IF = 4.0 A)
(IF = 8.0 A)
Maximum Instantaneous Reverse Current (Note 1)
IR
(Rated dc Voltage, VR = 5.0 V)
(Rated dc Voltage, VR = 10 V)
V
mA
1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
2. Mounted with Minimum Recommended Pad Size, PC Board FR4.
100
IF, FORWARD CURRENT (A)
IF, FORWARD CURRENT (A)
100
VF @ 125°C
10
100°C
1
75°C
25°C
−40°C
10
VF @ 125°C
100°C
1
75°C
0.1
25°C
0.1
0
0.1
0.2
0.3
0.4
0.5
0
VF, INSTANTANEOUS VOLTAGE (V)
0.1
0.2
0.3
0.4
0.5
VF, INSTANTANEOUS VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
10000
1.00E+00
f = 1 Mhz
C, CAPACITANCE (pF)
IR, REVERSE CURRENT (A)
IR @ 125°C
1.00E−01
100°C
75°C
1.00E−02
1.00E−03
25°C
25°C
1000
1.00E−04
0
2
4
6
8
10
0
2
4
6
8
VR, REVERSE VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
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2
10
MBRS410LT3
PFO, AVERAGE POWER DISSIPATION (W)
9
IF, AVERAGE FORWARD
CURRENT (A)
8
7
dc
6
5
4
SQUARE WAVE
3
2
1
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
0
100
105
110
115
120
125
130
2
1.8
dc
1.6
1.4
1.2
1
0.8
SQUARE WAVE
0.6
0.4
0.2
0
0
1
2
3
4
5
6
7
8
TL, LEAD TEMPERATURE (°C)
IO, AVERAGE FORWARD CURRENT (A)
Figure 5. Current Derating (Junction−to−Lead)
Figure 6. Forward Power Dissipation
9
100
D = 0.5
0.2
0.1
10
0.05
0.02
0.01
1
SINGLE PULSE
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
100
1000
t, TIME (S)
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
Figure 7. Thermal Response, Junction−to−Ambient (min pad)
100
D = 0.5
0.2
10
0.1
0.05
0.02
1
0.01
SINGLE PULSE
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
t, TIME (S)
Figure 8. Thermal Response, Junction−to−Ambient (1 inch pad)
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3
MBRS410LT3
PACKAGE DIMENSIONS
SMC
PLASTIC PACKAGE
CASE 403−03
ISSUE E
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
MIN
1.90
0.05
2.92
0.15
5.59
6.60
7.75
0.76
MILLIMETERS
NOM
MAX
2.13
2.41
0.10
0.15
3.00
3.07
0.23
0.30
5.84
6.10
6.86
7.11
7.94
8.13
1.02
1.27
0.51 REF
MIN
0.075
0.002
0.115
0.006
0.220
0.260
0.305
0.030
INCHES
NOM
0.084
0.004
0.118
0.009
0.230
0.270
0.313
0.040
0.020 REF
MAX
0.095
0.006
0.121
0.012
0.240
0.280
0.320
0.050
A
L
L1
c
A1
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
SCALE 4:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MBRS410LT3/D
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