TI1 LM5109BMA High voltage 1-a peak half-bridge gate driver Datasheet

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LM5109B
SNVS477C – FEBRUARY 2007 – REVISED JANUARY 2016
LM5109B High Voltage 1-A Peak Half-Bridge Gate Driver
1 Features
3 Description
•
The LM5109B device is a cost-effective, high-voltage
gate driver designed to drive both the high-side and
the low-side N-channel MOSFETs in a synchronous
buck or a half-bridge configuration. The floating
high-side driver is capable of working with rail
voltages up to 90 V. The outputs are independently
controlled
with
cost-effective
TTL
and
CMOS-compatible input thresholds. The robust level
shift technology operates at high speed while
consuming low power and providing clean level
transitions from the control input logic to the high-side
gate driver. Undervoltage lockout is provided on both
the low-side and the high-side power rails. The
device is available in the 8-pin SOIC and thermallyenhanced 8-pin WSON packages.
1
•
•
•
•
•
•
•
•
•
Drives Both a High-Side and Low-Side N-Channel
MOSFET
1-A Peak Output Current (1.0-A Sink and 1.0-A
Source)
Inputs Compatible With Independent TTL and
CMOS
Bootstrap Supply Voltage to 108-V DC
Fast Propagation Times (30 ns Typical)
Drives 1000-pF Load With 15-ns Rise and Fall
Times
Excellent Propagation Delay Matching (2 ns
Typical)
Supply Rail Undervoltage Lockout
Low Power Consumption
8-Pin SOIC and Thermally-Enhanced 8-Pin
WSON Package
2 Applications
•
•
•
•
Device Information(1)
PART NUMBER
LM5109B
PACKAGE
BODY SIZE (NOM)
SOIC (8)
4.90 mm × 3.91 mm
WSON (8)
4.00 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Current-Fed, Push-Pull Converters
Half- and Full-Bridge Power Converters
Solid-State Motor Drives
Two-Switch Forward Power Converters
Simplified Application Diagram
DBoot
RBoot
VIN
VCC
HB
VDD
HI
HO
LM5109
LI
HS
LOAD
LO
VSS
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM5109B
SNVS477C – FEBRUARY 2007 – REVISED JANUARY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
5
5
6
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics ..........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 10
7.5 HS Transient Voltages Below Ground .................... 10
8
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application ................................................. 11
9 Power Supply Recommendations...................... 15
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Example .................................................... 16
11 Device and Documentation Support ................. 17
11.1
11.2
11.3
11.4
11.5
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
17
17
17
17
17
12 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (March 2013) to Revision C
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
Changes from Revision A (March 2013) to Revision B
•
2
Page
Page
Changed layout of National Data Sheet to TI format ............................................................................................................. 1
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5 Pin Configuration and Functions
D Package
8-Pin SOIC
Top View
VDD
1
8
HB
HI
2
7
HO
SOIC-8
LI
3
6
HS
VSS
4
5
LO
NGT Package
8-Pin WSON
Top View
VDD
1
HI
2
LI
3
VSS
4
8
HB
7
HO
6
HS
5
LO
WSON-8
Pin Functions
PIN
NO. (1)
DESCRIPTION
NAME
TYPE (2)
1
VDD
P
Positive gate drive supply – Locally decouple to VSS using low ESR and ESL capacitor located
as close to IC as possible.
2
HI
I
High-side control input – The HI input is compatible with TTL and CMOS input thresholds.
Unused HI input must be tied to ground and not left open.
3
LI
I
Low-side control input – The LI input is compatible with TTL and CMOS input thresholds.
Unused LI input must be tied to ground and not left open.
4
VSS
G
Ground – All signals are referenced to this ground.
5
LO
O
Low-side gate driver output – Connect to the gate of the low-side N-MOS device.
6
HS
P
High-side source connection – Connect to the negative terminal of the bootstrap capacitor and
to the source of the high-side N-MOS device.
7
HO
O
High-side gate driver output – Connect to the gate of the high-side N-MOS device.
8
HB
P
High-side gate driver positive supply rail – Connect the positive terminal of the bootstrap
capacitor to HB and the negative terminal of the bootstrap capacitor to HS. The bootstrap
capacitor must be placed as close to IC as possible.
(1)
(2)
For 8-pin WSON package, TI recommends that the exposed pad on the bottom of the package be soldered to ground plane on the PCB
and the ground plane must extend out from underneath the package to improve heat dissipation.
G = Ground, I = Input, O = Output, and P = Power
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
VDD to VSS
–0.3
18
V
HB to HS
–0.3
18
V
LI or HI to VSS
–0.3
VDD + 0.3
V
LO to VSS
–0.3
VDD + 0.3
V
HO to VSS
VHS – 0.3
VHB + 0.3
V
–5
90
V
108
V
HS to VSS (2)
HB to VSS
Junction temperature
–40
150
°C
Storage temperature, Tstg
–55
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
In the application the HS node is clamped by the body diode of the external lower N-MOSFET, therefore the HS voltage will generally
not exceed –1 V. However in some applications, board resistance and inductance may result in the HS node exceeding this stated
voltage transiently. If negative transients occur on HS, the HS voltage must never be more negative than VDD – 15 V. For example, if
VDD = 10 V, the negative transients at HS must not exceed –5 V.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1500
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VDD
HS (1)
HB
MIN
MAX
8
14
V
–1
90
V
VHS + 8
VHS + 14
HS slew rate
Junction temperature
(1)
4
UNIT
–40
V
50
V/ns
125
°C
In the application, the HS node is clamped by the body diode of the external lower N-MOSFET, therefore the HS voltage will generally
not exceed –1 V. However in some applications, board resistance and inductance may result in the HS node exceeding this stated
voltage transiently. If negative transients occur on HS, the HS voltage must never be more negative than VDD – 15 V. For example, if
VDD = 10 V, the negative transients at HS must not exceed –5 V.
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6.4 Thermal Information
LM5109B
THERMAL METRIC (1)
D (SOIC)
NGT (WSON)
8 PINS
8 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
117.6
42.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
64.9
34.0
°C/W
RθJB
Junction-to-board thermal resistance
58.1
19.3
°C/W
ψJT
Junction-to-top characterization parameter
17.4
0.4
°C/W
ψJB
Junction-to-board characterization parameter
57.6
19.5
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
–
8.1
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
TJ = 25°C (unless otherwise specified), VDD = VHB = 12 V, VSS = VHS = 0 V, No Load on LO or HO
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENTS
TJ = 25°C
0.3
IDD
VDD quiescent current
LI = HI = 0 V
IDDO
VDD operating current
f = 500 kHz
IHB
Total HB quiescent current
LI = HI = 0 V
IHBO
Total HB operating current
f = 500 kHz
IHBS
HB to VSS current, quiescent
VHS = VHB = 90 V
IHBSO
HB to VSS current, operating
f = 500 kHz
0.5
TJ = 25°C
1.8
TJ = –40°C to 125°C
0.6
TJ = 25°C
1.8
TJ = –40°C to 125°C
2.9
TJ = 25°C
0.06
TJ = –40°C to 125°C
0.2
TJ = 25°C
1.4
TJ = –40°C to 125°C
2.8
TJ = 25°C
0.1
TJ = –40°C to 125°C
10
mA
mA
mA
mA
µA
mA
INPUT PINS LI AND HI
VIL
Low level input voltage threshold
VIH
High level input voltage threshold
RI
Input pulldown resistance
TJ = –40°C to 125°C
V
0.8
TJ = 25°C
1.8
TJ = –40°C to 125°C
2.2
TJ = 25°C
200
TJ = –40°C to 125°C
100
500
V
kΩ
UNDERVOLTAGE PROTECTION
VDDR
VDD rising threshold
VDDH
VDD threshold hysteresis
VHBR
HB rising threshold
VHBH
HB threshold hysteresis
VDDR = VDD – VSS
TJ = 25°C
6.7
TJ = –40°C to 125°C
6.0
7.4
0.5
VHBR = VHB – VHS
TJ = 25°C
V
6.6
TJ = –40°C to 125°C
5.7
V
7.1
0.4
V
V
LO GATE DRIVER
TJ = 25°C
0.38
VOLL
Low-level output voltage
ILO = 100 mA, VOHL = VLO – VSS
VOHL
High-level output voltage
ILO = −100 mA, VOHL = VDD – VLO
IOHL
Peak pullup current
VLO = 0 V
1
A
IOLL
Peak pulldown current
VLO = 12 V
1
A
TJ = –40°C to 125°C
TJ = 25°C
0.65
0.72
TJ = –40°C to 125°C
1.2
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V
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Electrical Characteristics (continued)
TJ = 25°C (unless otherwise specified), VDD = VHB = 12 V, VSS = VHS = 0 V, No Load on LO or HO
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
HO GATE DRIVER
TJ = 25°C
0.38
VOLH
Low-level output voltage
IHO = 100 mA, VOLH = VHO – VHS
VOHH
High-level output voltage
IHO = −100 mA, VOHH = VHB – VHO
IOHH
Peak pullup current
VHO = 0 V
1
A
IOLH
Peak pulldown current
VHO = 12 V
1
A
TJ = –40°C to 125°C
V
0.65
TJ = 25°C
0.72
TJ = –40°C to 125°C
V
1.2
6.6 Switching Characteristics
TJ = 25°C (unless otherwise specified), VDD = VHB = 12 V, VSS = VHS = 0 V, No Load on LO or HO
PARAMETER
TEST CONDITIONS
tLPHL
Lower turnoff propagation delay
(LI falling to LO falling)
TJ = 25°C
tHPHL
Upper turnoff propagation delay
(HI falling to HO falling)
TJ = 25°C
tLPLH
Lower turnon propagation delay
(LI rising to LO rising)
TJ = 25°C
tHPLH
Upper turnon propagation delay
(HI rising to HO rising)
TJ = 25°C
tMON
Delay matching: Lower turnon and upper
turnoff
TJ = 25°C
tMOFF
Delay matching: Lower turnoff and upper
turnon
TJ = 25°C
tRC, tFC
Either output rise and fall time
CL = 1000 pF
tPW
Minimum input pulse width that changes
the output
MIN
TYP
MAX
30
TJ = –40°C to 125°C
56
30
TJ = –40°C to 125°C
56
32
TJ = –40°C to 125°C
56
32
TJ = –40°C to 125°C
56
2
TJ = –40°C to 125°C
15
2
TJ = –40°C to 125°C
15
UNIT
ns
ns
ns
ns
ns
ns
15
ns
50
ns
LI
LI
HI
HI
tHPLH
tLPLH
tHPHL
tHPLH
LO
LO
HO
HO
tMON
tMOFF
Figure 1. Typical Test Timing Diagram
6
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6.7 Typical Characteristics
100
100
VDD = VHB = 12V
CL = 1000 pF
VSS = VHS = 0V
10
CL = 1000 pF
10
IHBO (mA)
IDDO (mA)
CL = 2200 pF
CL = 4400 pF
CL = 2200 pF
CL = 4400 pF
1
1
CL = 0 pF
0.1
CL = 0 pF
CL = 470 pF
CL = 470 pF
0.1
0.01
1
10
100
1000
1
10
FREQUENCY (kHz)
100
1000
FREQUENCY (kHz)
VDD = VHB = 12 V
VSS = VHS = 0 V
Figure 3. HB Operating Current vs Frequency
Figure 2. VDD Operating Current vs Frequency
0.45
2.2
0.40
IDDO
0.35
CL = 0 pF
f = 500 kHz
1.8
IDD, IHB (mA)
IDDO, IHBO (mA)
2.0
VDD = VHB = 12V
1.6
VSS = VHS = 0V
1.4
IHBO
IDDO
0.30
0.25 LI = HI = 0V
VDD = VHB = 12V
0.20
VSS = VHS = 0V
0.15
0.10
IHBO
1.2
0.05
0.00
-40 -25 -10 5 20 35 50 65 80 95 110 125
1.0
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
TEMPERATURE (oC)
Figure 4. Operating Current vs Temperature
Figure 5. Quiescent Current vs Temperature
600
44
CL = 0 pF
VDD = VHB
VDD = VHB = 12V
CURRENT (PA)
VSS= VHS = 0V
PROPAGATION DELAY (ns)
500
LI = HI = 0V
IDD
400
300
200
IHB
100
0
8
10
12
14
16
18
40
tLPHL
tHPHL
VSS = VHS = 0V
36
turn off
32
tHPLH
28
24
tLPLH
turn on
20
-40 -25 -10 5 20 35 50 65 80 95 110 125
VDD, VHB (V)
TEMPERATURE (oC)
Figure 6. Quiescent Current vs Voltage
Figure 7. Propagation Delay vs Temperature
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Typical Characteristics (continued)
0.6
1.6
Output Current : -100 mA
1.4
VSS = VHS = 0V
0.5
1.2
VDD = VHB = 8V
VDD = VHB = 8V
1.0
VOL (V)
VOH (V)
Output Current : -100 mA
VSS = VHS = 0V
0.8
0.4
VDD = VHB = 12V
0.6
VDD = VHB = 12V
0.4
0.2
0.3
VDD = VHB = 16V
VDD = VHB = 16V
0
-40 -25 -10 5 20 35 50 65 80 95 110 125
0.2
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 8. LO and HO High Level Output Voltage
vs Temperature
THRESHOLD (V)
6.9
0.50
VDDR = VDD - VSS
0.48
VHBR = VHB - VHS
0.46
HYSTERESIS (V)
7.0
Figure 9. LO and HO Low Level Output Voltage
vs Temperature
6.8
VDDR
6.7
VHBR
6.6
VDDH
0.44
0.42
0.40
0.38
VHBH
0.36
6.5
0.34
6.4
0.32
6.3
0.30
-40 -25 -10 5 20 35 50 65 80 95 110 125
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (oC)
TEMPERATURE (oC)
Figure 10. Undervoltage Rising Thresholds
vs Temperature
Figure 11. Undervoltage Hysteresis vs Temperature
1.92
VDD = 12V
1.95
INPUT THRESHOLD VOLTAGE (V)
INPUT THRESHOLD VOLTAGE (V)
2.00
VSS = 0V
Rising
1.90
1.85
Falling
1.80
1.75
1.91
Rising
1.90
1.89
1.88
1.87
1.86
1.85
Falling
1.84
1.83
1.82
1.81
1.70
1.80
-40 -25 -10 5 20 35 50 65 80 95 110 125
8
TEMPERATURE ( C)
Figure 12. Input Thresholds vs Temperature
8
9
10
11
12
13
14
15
16
VDD (V)
o
Figure 13. Input Thresholds vs Supply Voltage
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7 Detailed Description
7.1 Overview
The LM5109B is a cost-effective, high-voltage gate driver designed to drive both the high-side and the low-side
N-channel FETs in a synchronous buck or a half-bridge configuration. The outputs are independently controlled
with TTL and CMOS-compatible input thresholds. The floating high-side driver is capable of working with HB
voltage up to 108 V. An external high-voltage diode must be provided to charge high-side gate drive bootstrap
capacitor. A robust level shifter operates at high speed while consuming low power and providing clean level
transitions from the control logic to the high-side gate driver. Undervoltage lockout (UVLO) is provided on both
the low-side and the high-side power rails.
7.2 Functional Block Diagram
VDD
HV
HB
UVLO
Level
Shift
Driver
HO
HS
HI
VDD
UVLO
Driver
LO
LI
VSS
7.3 Feature Description
7.3.1 Start-Up and UVLO
Both top and bottom drivers include UVLO protection circuitry which monitors the supply voltage (VDD) and
bootstrap capacitor voltage (VHB–HS) independently. The UVLO circuit inhibits each output until sufficient supply
voltage is available to turn on the external MOSFETs, and the built-in UVLO hysteresis prevents chattering
during supply voltage variations. When the supply voltage is applied to the VDD pin of the LM5109B, the top and
bottom gates are held low until VDD exceeds the UVLO threshold, typically about 6.7 V. Any UVLO condition on
the bootstrap capacitor (VHB–HS) will only disable the high-side output (HO).
Table 1. VDD UVLO Feature Logic Operation
CONDITION (VHB-HS > VHBR)
HI
LI
HO
LO
VDD-VSS < VDDR during device start-up
H
L
L
L
VDD-VSS < VDDR during device start-up
L
H
L
L
VDD-VSS < VDDR during device start-up
H
H
L
L
VDD-VSS < VDDR during device start-up
L
L
L
L
VDD-VSS < VDDR – VDDH after device start-up
H
L
L
L
VDD-VSS < VDDR – VDDH after device start-up
L
H
L
L
VDD-VSS < VDDR – VDDH after device start-up
H
H
L
L
VDD-VSS < VDDR – VDDH after device start-up
L
L
L
L
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Table 2. VHB-HS UVLO Feature Logic Operation
CONDITION (VDD > VDDR)
HI
LI
HO
LO
VHB-HS < VHBR during device start-up
H
L
L
L
VHB-HS < VHBR during device start-up
L
H
L
H
VHB-HS < VHBR during device start-up
H
H
L
H
VHB-HS < VHBR during device start-up
L
L
L
L
VHB-HS < VHBR – VHBH after device start-up
H
L
L
L
VHB-HS < VHBR – VHBH after device start-up
L
H
L
H
VHB-HS < VHBR – VHBH after device start-up
H
H
L
H
VHB-HS < VHBR – VHBH after device start-up
L
L
L
L
7.3.2 Level Shift
The level shift circuit is the interface from the high-side input to the high-side driver stage which is referenced to
the switch node (HS). The level shift allows control of the HO output which is referenced to the HS pin and
provides excellent delay matching with the low-side driver.
7.3.3 Output Stages
The output stages are the interface to the power MOSFETs in the power train. High slew rate, low resistance,
and high-peak current capability of both outputs allow for efficient switching of the power MOSFETs. The lowside output stage is referenced to VSS and the high-side is referenced to HS.
7.4 Device Functional Modes
The device operates in normal mode and UVLO mode. See Start-Up and UVLO for more information on UVLO
operation mode. In normal mode when the VDD and VHB–HS are above UVLO threshold, the output stage is
dependent on the states of the HI and LI pins. The output HO and LO will be low if input state is floating.
Table 3. INPUT and OUTPUT Logic Table
LI
HO (1)
L
L
L
L
L
H
L
H
H
L
H
L
H
H
H
H
Floating
Floating
L
L
HI
(1)
(2)
LO (2)
HO is measured with respect to the HS.
LO is measured with respect to the VSS.
7.5 HS Transient Voltages Below Ground
The HS node will always be clamped by the body diode of the lower external FET. In some situations, board
resistances and inductances can cause the HS node to transiently swing several volts below ground. The HS
node can swing below ground provided:
1. HS must always be at a lower potential than HO. Pulling HO more than –0.3 V below HS can activate
parasitic transistors resulting in excessive current flow from the HB supply, possibly resulting in damage to
the IC. The same relationship is true with LO and VSS. If necessary, a Schottky diode can be placed
externally between HO and HS or LO and GND to protect the IC from this type of transient. The diode must
be placed as close to the IC pins as possible to be effective.
2. HB to HS operating voltage must be 15 V or less. Hence, if the HS pin transient voltage is –5 V, VDD must
be ideally limited to 10 V to keep HB to HS below 15 V.
3. Low-ESR bypass capacitors from HB to HS and from VDD to VSS are essential for proper operation. The
capacitor must be located at the leads of the IC to minimize series inductance. The peak currents from LO
and HO can be quite large. Any series inductances with the bypass capacitor will cause voltage ringing at the
leads of the IC which must be avoided for reliable operation.
10
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
To operate power MOSFETs at high switching frequencies and to reduce associated switching losses, a powerful
gate driver is employed between the PWM output of controller and the gates of the power semiconductor
devices. Also, gate drivers are indispensable when it is impossible for the PWM controller to directly drive the
gates of the switching devices. With the advent of digital power, this situation is often encountered because the
PWM signal from the digital controller is often a 3.3-V logic signal which cannot effectively turn on a power
switch. Level shift circuit is needed to boost the 3.3-V signal to the gate-drive voltage (such as 12 V) to fully turn
on the power device and minimize conduction losses. Traditional buffer drive circuits based on NPN and PNP
bipolar transistors in totem-pole arrangement prove inadequate with digital power because they lack level-shifting
capability. Gate drivers effectively combine both the level-shifting and buffer-drive functions. Gate drivers also
find other needs such as minimizing the effect of high-frequency switching noise (by placing the high-current
driver IC physically close to the power switch), driving gate-drive transformers and controlling floating powerdevice gates, reducing power dissipation and thermal stress in controllers by moving gate charge power losses
from the controller into the driver.
The LM5109B is the high-voltage gate drivers designed to drive both the high-side and low-side N-channel
MOSFETs in a half-bridge configuration, full-bridge configuration, or in a synchronous buck circuit. The floating
high-side driver is capable of operating with supply voltages up to 90 V. This allows for N-channel MOSFETs
control in half-bridge, full-bridge, push-pull, two-switch forward and active clamp topologies. The outputs are
independently controlled. Each channel is controlled by its respective input pins (HI and LI), allowing full and
independent flexibility to control ON and OFF-time of the output.
8.2 Typical Application
VIN
VCC
RBOOT
Anti-parallel Diode
(Optional)
DBOOT
HB
VDD
VDD
Secondary
Side Circuit
RGATE
HO
CBOOT
0.1 µF
PWM
Controller
OUT1
HI
HS
T1
LM5109
RGATE
LI
OUT2
LO
1.0 µF
VSS
Figure 14. LM5109B Driving MOSFETs in a Half-Bridge Converter
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Typical Application (continued)
8.2.1 Design Requirements
Table 4 lists the design parameters of the LM5109B.
Table 4. Design Example
PARAMETER
VALUE
Gate Driver
LM5109B
MOSFET
CSD19534KCS
VDD
10 V
QG
17 nC
fSW
500 kHz
8.2.2 Detailed Design Procedure
8.2.2.1 Select Bootstrap and VDD Capacitor
The bootstrap capacitor must maintain the VHB-HS voltage above the UVLO threshold for normal operation.
Calculate the maximum allowable drop across the bootstrap capacitor with Equation 1.
'VHB VDD VDH VHBL 10 V 1 V 6.7 V 2.3 V
where
•
•
•
VDD = Supply voltage of the gate drive IC
VDH = Bootstrap diode forward voltage drop
VHBL = VHBRmax – VHBH, HB falling threshold
(1)
Then, the total charge needed per switching cycle is estimated by Equation 2.
D
IHB
0.95
0.2 mA
QTotal QG IHBS u Max
17 nC 10 PA u
17.5 nC
¦SW ¦SW
500 kHz 500 kHz
where
•
•
•
•
QG = Total MOSFET gate charge
IHBS = HB to VSS Leakage current
DMax = Converter maximum duty cycle
IHB = HB Quiescent current
Therefore, the minimum CBoot must be:
QTotal 17.5 nC
CBoot
7.6 nF
'VHB
2.3 V
(2)
(3)
In practice, the value of the CBoot capacitor must be greater than calculated to allow for situations where the
power stage may skip pulse due to load transients. TI recommends having enough margins and place the
bootstrap capacitor as close to the HB and HS pins as possible.
CBoot = 100 nF
(4)
As a general rule the local VDD bypass capacitor must be 10 times greater than the value of CBoot, as shown in
Equation 5.
CVDD = 1 µF
(5)
The bootstrap and bias capacitors must be ceramic types with X7R dielectric. The voltage rating must be twice
that of the maximum VDD considering capacitance tolerances once the devices have a DC bias voltage across
them and to ensure long-term reliability.
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8.2.2.2 Select External Bootstrap Diode and Its Series Resistor
The bootstrap capacitor is charged by the VDD through the external bootstrap diode every cycle when low-side
MOSFET turns on. The charging of the capacitor involves high peak currents, and therefore transient power
dissipation in the bootstrap diode may be significant and the conduction loss also depends on its forward voltage
drop. Both the diode conduction losses and reverse recovery losses contribute to the total losses in the gate
driver circuit.
For the selection of external bootstrap diodes, refer to AN-1317 Selection of External Bootstrap Diode for
LM510X Devices, SNVA083. Bootstrap resistor RBOOT is selected to reduce the inrush current in DBOOT and limit
the ramp up slew rate of voltage of VHB-HS during each switching cycle, especially when HS pin have excessive
negative transient voltage. RBOOT recommended value is between 2 Ω and 10 Ω depending on diode selection. A
current limiting resistor of 2.2 Ω is selected to limit inrush current of bootstrap diode, and the estimated peak
current on the DBoot is shown in Equation 6.
VDD VDH 10 V 1 V
IDBoot(pk)
|4A
RBoot
2.2 :
where
•
VDH is the bootstrap diode forward voltage drop
(6)
8.2.2.3 Selecting External Gate Driver Resistor
The external gate driver resistor, RGATE, is sized to reduce ringing caused by parasitic inductances and
capacitances and also to limit the current coming out of the gate driver.
Peak HO pullup current are calculated in Equation 7.
VDD VDH
10 V 1 V
IOHH
RHOH RGate RGFET_Int 1.2 V / 100 mA 4.7 : 2.2 :
0.48 A
where
•
•
•
•
•
IOHH = Peak pullup current
VDH = Bootstrap diode forward voltage drop
RHOH = Gate driver internal HO pullup resistance, provide by driver data sheet directly or estimated from the
testing conditions, that is RHOH = VOHH / IHO
RGate = External gate drive resistance
RGFET_Int = MOSFET internal gate resistance, provided by transistor data sheet
(7)
Similarly, Peak HO pulldown current is shown in Equation 8.
VDD VDH
IOLH
RHOL RGate RGFET_Int
where
•
RHOL is the HO pulldown resistance
(8)
Peak LO pullup current is shown in Equation 9.
VDD
IOHL
RLOH RGate RGFET_Int
where
•
RLOH is the LO pullup resistance
(9)
Peak LO pulldown current is shown in Equation 10.
VDD
IOLL
RLOL RGate RFET_Int
where
•
RLOL is the LO pulldown resistance
(10)
For some scenarios, if the applications require fast turnoff, an anti-paralleled diode on RGate could be used to
bypass the external gate drive resistor and speed up turnoff transition.
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8.2.2.4 Estimate the Driver Power Loss
The total driver IC power dissipation can be estimated through the following components.
1. Static power losses, PQC, due to quiescent current – IDD and IHB
PQC = VDD × IDD + (VDD – VDH) × IHB
(11)
2. Level-shifter losses, PIHBS, due high-side leakage current – IHBS
PIHBS = VHB × IHBS × D
where
•
D is the high-side switch duty cycle
(12)
3. Dynamic losses, PQG1&2, due to the FETs gate charge – QG
RGD_R
PQG1&2 2 u VDD u QG u ¦SW u
RGD_R RGate RGFET_Int
where
•
•
•
•
•
QG = Total FETs gate charge
fSW = Switching frequency
RGD_R = Average value of pullup and pulldown resistor
RGate = External gate drive resistor
RGFET_Int = Internal FETs gate resistor
(13)
4. Level-shifter dynamic losses, PLS, during high-side switching due to required level-shifter charge on each
switching cycle – QP
PLS = VHB × QP × fSW
(14)
In this example, the estimated gate driver loss in LM5109B is shown in Equation 15.
PLM5109B
10 V u 0.6 mA 9 V u 0.2 mA 72 V u 10 PA u 0.95 2 u 10 u 17 nC u 500 kHz u
12 :
72 V u 0.5 nC u 500 kHz
12 : 4.7 : 2.2 :
0.134 W
(15)
For a given ambient temperature, the maximum allowable power loss of the IC can be defined as shown in
Equation 16.
TJ TA
PLM5109B
RTJA
where
•
•
•
•
PLM5109B = The total power dissipation of the driver
TJ = Junction temperature
TA = Ambient temperature
RθJA = Junction-to-ambient thermal resistance
(16)
The thermal metrics for the driver package is summarized in the Thermal Information table of the data sheet. For
detailed information regarding the thermal information table, please refer to the Texas Instruments application
note entitled Semiconductor and IC Package Thermal Metrics (SPRA953).
14
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8.2.3 Application Curves
Figure 15 and Figure 16 shows the rising and falling time as well as turnon and turnoff propagation delay testing
waveform in room temperature, and waveform measurement data (see the bottom part of the waveform). Each
channel (HI, LI, HO, and LO) is labeled and displayed on the left hand of the waveforms.
The testing condition: load capacitance is 1 nF, VDD = 12 V, fSW = 500 kHz.
HI and LI share one same input from function generator, therefore, besides the propagation delay and rising and
falling time, the difference of the propagation delay between HO and LO gives the propagation delay matching
data.
CL = 1 nF
VDD = 12 V
fSW = 500 kHz
Figure 15. Rising Time and Turnon Propagation Delay
CL = 1 nF
VDD = 12 V
fSW = 500 kHz
Figure 16. Falling Time and Turnoff Propagation Delay
9 Power Supply Recommendations
The recommended bias supply voltage range for LM5109B is from 8 V to 14 V. The lower end of this range is
governed by the internal undervoltage lockout (UVLO) protection feature of the VDD supply circuit blocks. The
upper end of this range is driven by the 18-V absolute maximum voltage rating of the VDD. TI recommends
keeping a 4-V margin to allow for transient voltage spikes.
The UVLO protection feature also involves a hysteresis function. This means that once the device is operating in
normal mode, if the VDD voltage drops, the device continues to operate in normal mode as long as the voltage
drop does not exceed the hysteresis specification, VDDH. If the voltage drop is more than hysteresis specification,
the device shuts down. Therefore, while operating at or near the 8-V range, the voltage ripple on the auxiliary
power supply output must be smaller than the hysteresis specification of LM5109B to avoid triggering deviceshutdown.
A local bypass capacitor must be placed between the VDD and GND pins. And this capacitor must be located as
close to the device as possible. A low-ESR, ceramic surface mount capacitor is recommended. TI recommends
using 2 capacitors across VDD and GND: a 100-nF, ceramic surface-mount capacitor for high-frequency filtering
placed very close to VDD and GND pin, and another surface-mount capacitor, 220-nF to 10-µF, for IC bias
requirements. In a similar manner, the current pulses delivered by the HO pin are sourced from the HB pin.
Therefore a 22-nF to 220-nF local decoupling capacitor is recommended between the HB and HS pins.
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10 Layout
10.1 Layout Guidelines
Optimum performance of high-side and low-side gate drivers cannot be achieved without taking due
considerations during circuit board layout. The following points are emphasized:
1. Low-ESR and low-ESL capacitors must be connected close to the IC between VDD and VSS pins and
between HB and HS pins to support high peak currents being drawn from VDD and HB during the turnon of
the external MOSFETs.
2. To prevent large voltage transients at the drain of the top MOSFET, a low-ESR electrolytic capacitor and a
good-quality ceramic capacitor must be connected between the MOSFET drain and ground (VSS).
3. To avoid large negative transients on the switch node (HS) pin, the parasitic inductances between the source
of the top MOSFET and the drain of the bottom MOSFET (synchronous rectifier) must be minimized.
4. Grounding considerations:
– The first priority in designing grounding connections is to confine the high peak currents that charge and
discharge the MOSFET gates to a minimal physical area. This will decrease the loop inductance and
minimize noise issues on the gate terminals of the MOSFETs. The gate driver must be placed as close as
possible to the MOSFETs.
– The second consideration is the high current path that includes the bootstrap capacitor, the bootstrap
diode, the local ground referenced bypass capacitor, and the low-side MOSFET body diode. The
bootstrap capacitor is recharged on a cycle-by-cycle basis through the bootstrap diode from the ground
referenced VDD bypass capacitor. The recharging occurs in a short time interval and involves high peak
current. Minimizing this loop length and area on the circuit board is important to ensure reliable operation.
10.2 Layout Example
Figure 17. Layout Example
16
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
• AN-1317 Selection of External Bootstrap Diode for LM510X Devices, SNVA083
• Semiconductor and IC Packaging Thermal Metrics, SPRA953
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM5109BMA
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
L5109
BMA
LM5109BMA/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L5109
BMA
LM5109BMAX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L5109
BMA
LM5109BSD/NOPB
ACTIVE
WSON
NGT
8
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
5109BSD
LM5109BSDX/NOPB
ACTIVE
WSON
NGT
8
4500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
5109BSD
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM5109BMAX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5109BSD/NOPB
WSON
NGT
8
1000
180.0
12.4
4.3
4.3
1.1
8.0
12.0
Q1
LM5109BSDX/NOPB
WSON
NGT
8
4500
330.0
12.4
4.3
4.3
1.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM5109BMAX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM5109BSD/NOPB
WSON
NGT
8
1000
203.0
203.0
35.0
LM5109BSDX/NOPB
WSON
NGT
8
4500
346.0
346.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NGT0008A
SDC08A (Rev A)
www.ti.com
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