TI CD74HC221NSRE4 High-speed cmos logic dual monostable multivibrator with reset Datasheet

[ /Title
(CD74
HC221
,
CD74
HCT22
1)
/Subject
(High
Speed
CMOS
Logic
Dual
Monos
table
Multi-
CD54HC221, CD74HC221,
CD74HCT221
Data sheet acquired from Harris Semiconductor
SCHS166F
High-Speed CMOS Logic
Dual Monostable Multivibrator with Reset
November 1997 - Revised October 2003
Features
Description
• Overriding RESET Terminates Output Pulse
The ’HC221 and CD74HCT221 are dual monostable
multivibrators with reset. An external resistor (RX) and an
external capacitor (CX) control the timing and the accuracy
for the circuit. Adjustment of RX and CX provides a wide
range of output pulse widths from the Q and Q terminals.
Pulse triggering on the B input occurs at a particular voltage
level and is not related to the rise and fall time of the trigger
pulse.
• Triggering from the Leading or Trailing Edge
• Q and Q Buffered Outputs
• Separate Resets
• Wide Range of Output-Pulse Widths
• Schmitt Trigger on B Inputs
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Once triggered, the outputs are independent of further trigger
inputs on A and B. The output pulse can be terminated by a
LOW level on the Reset (R) pin. Trailing Edge triggering (A)
and leading-edge-triggering (B) inputs are provided for
triggering from either edge of the input pulse. On power up,
the IC is reset. If either Mono is not used each input (on the
unused device) must be terminated either high or low.
• Wide Operating Temperature Range . . . -55oC to 125oC
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
The minimum value of external resistance, RX, is typically 500Ω.
The minimum value of external capacitance, CX, is 0pF. The
calculation for the pulse width is tW = 0.7 RXCX at VCC = 4.5V.
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
Ordering Information
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
PART NUMBER
CD54HC221F3A
Pinout
CD54HC221
(CERDIP)
CD74HC221
(PDIP, SOIC, SOP, TSSOP)
CD74HCT221
(PDIP, SOIC)
TOP VIEW
1A 1
16 VCC
1B 2
15 1CXRX
1R 3
14 1CX
1Q 4
13 1Q
2Q 5
12 2Q
2CX 6
11 2R
2CXRX 7
10 2B
GND 8
9 2A
TEMP. RANGE (oC)
© 2003, Texas Instruments Incorporated
16 Ld CERDIP
CD74HC221E
-55 to 125
16 Ld PDIP
CD74HC221M
-55 to 125
16 Ld SOIC
CD74HC221MT
-55 to 125
16 Ld SOIC
CD74HC221M96
-55 to 125
16 Ld SOIC
CD74HC221NSR
-55 to 125
16 Ld SOP
CD74HC221PW
-55 to 125
16 Ld TSSOP
CD74HC221PWR
-55 to 125
16 Ld TSSOP
CD74HC221PWT
-55 to 125
16 Ld TSSOP
CD74HCT221E
-55 to 125
16 Ld PDIP
CD74HCT221M
-55 to 125
16 Ld SOIC
CD74HCT221MT
-55 to 125
16 Ld SOIC
CD74HCT221M96
-55 to 125
16 Ld SOIC
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
-55 to 125
PACKAGE
1
CD54HC221, CD74HC221, CD74HCT221
Functional Diagram
1CX
1RX
VCC
14
15
1CX
1CXRX
13
1Q
1A
1
MONO 1
4
1B
1Q
2
1R
2R
3
11
5
9
2Q
2A
MONO 2
10
12
2B
2Q
2CX
2CXRX
6
7
VCC
2CX
2RX
TRUTH TABLE
INPUTS
OUTPUTS
A
B
R
Q
Q
H
X
H
L
H
X
L
H
L
H
L
↑
H
↓
H
H
X
X
L
L
H
L
H
↑
(Note 3)
(Note 3)
H = High Voltage Level, L = Low Voltage Level, X = Irrelevant, ↑ = Transition from
Low to High Level, ↓ = Transition from High to Low Level,
= One High Level
Pulse,
= One Low Level Pulse
NOTE:
1. For this combination the reset input must be low and the following sequence
must be used: pin 1 (or 9) must be set high or pin 2 (or 10) set low; then pin 1
(or 9) must be low and pin 2 (or 10) set high. Now the reset input goes from lowto-high and the device will be triggered.
2
CD54HC221, CD74HC221, CD74HCT221
Logic Diagram
VCC
16
C
P
RX
N
A
B
1 (9)
R
3 (11)
2 (10)
P
VCC
R
D
RESET
FF
S
C
Q
R
P
OP
AMP
R2
RXCX
C
VCC
MIRROR VOLTAGE
QM
15 (7)
+
QM
R3
PP
CX
R
MASK
FF
S
Q
MAIN
FF
R1
R4
Q
N
VCC
14 (6)
PULLDOWN
FF
D
CX
Q
N
8
C
4 (12)
C
(13) 5
Q
GND
R
Q
Q
+
OP AMP
3
CD54HC221, CD74HC221, CD74HCT221
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, IO
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Package Thermal Impedance, θJA (see Note 2):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time, tr, tf on Inputs A and R
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Input Rise and Fall Time, tr, tf on Input B
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
SYMBOL
VI (V)
IO (mA)
High Level Input
Voltage
VIH
-
-
Low Level Input
Voltage
VIL
High Level Output
Voltage
CMOS Loads
VOH
PARAMETER
VCC
(V)
25oC
-40oC TO 85oC -55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
HC TYPES
-
VIH or VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
Low Level Output
Voltage
TTL Loads
VOL
VIH or VIL
-
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
4
CD54HC221, CD74HC221, CD74HCT221
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
II
VCC or
GND
-
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
High Level Input
Voltage
VIH
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input
Voltage
VIL
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
High Level Output
Voltage
CMOS Loads
VOH
VIH or VIL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
±0.1
-
±1
-
±1
µA
PARAMETER
Input Leakage
Current
Quiescent Device
Current
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
II
VCC and
GND
0
5.5
-
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
(Note 3)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTE:
3. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
All Inputs
0.3
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.,
360µA max at 25oC.
Prerequisite For Switching Function
25oC
PARAMETER
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tWL
2
70
-
-
90
-
105
-
ns
4.5
14
-
-
18
-
21
-
ns
6
12
-
-
15
-
18
-
ns
HC TYPES
Input Pulse Width
A
Input Pulse Width
B
tWH
2
70
-
-
90
-
105
-
ns
4.5
14
-
-
18
-
21
-
ns
6
12
-
-
15
-
18
-
ns
5
CD54HC221, CD74HC221, CD74HCT221
Prerequisite For Switching Function
(Continued)
25oC
PARAMETER
Input Pulse Width
Reset
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tWL
2
70
-
-
90
-
105
-
ns
4.5
14
-
-
18
-
21
-
ns
6
12
-
-
15
-
18
-
ns
2
0
-
-
0
-
0
-
ns
4.5
0
-
-
0
-
0
-
ns
Recovery Time
R to A or B
tSU
6
0
-
-
0
-
0
-
ns
Output Pulse Width Q or Q
CX = 0.1µF RX = 10kΩ
tW
5
630
-
770
602
798
595
805
µs
Output Pulse Width Q or Q
CX = 28pF, RX = 2kΩ
tW
4.5
-
140
-
-
-
-
-
ns
CX = 1000pF, RX = 2kΩ
tW
4.5
-
1.5
-
-
-
-
-
µs
CX = 1000pF, RX = 10kΩ
tW
4.5
-
7
-
-
-
-
-
µs
Input Pulse Width
A
tWL
4.5
14
-
-
18
-
21
-
ns
Input Pulse Width
B
tWH
4.5
14
-
-
18
-
21
-
ns
Input Pulse Width
Reset
tWL
4.5
18
-
-
23
-
27
-
ns
Recovery Time
R to A or B
tSU
4.5
0
-
-
0
-
0
-
ns
Output Pulse Width Q or Q
CX = 0.1µF RX = 10kΩ
tW
5
630
-
770
602
798
595
805
µs
Output Pulse Width Q or Q
CX = 28pF, RX = 2kΩ
tW
4.5
-
140
-
-
-
-
-
ns
CX = 1000pF, RX = 2kΩ
tW
4.5
-
1.5
-
-
-
-
-
µs
CX = 1000pF, RX = 10kΩ
tW
4.5
-
7
-
-
-
-
-
µs
HCT TYPES
Switching Specifications Input tr, tf = 6ns
PARAMETER
-40oC TO
85oC
25oC
-55oC TO
125oC
SYMBOL
TEST
CONDITIONS
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tPLH
CL = 50pF
2
-
-
210
-
265
-
315
ns
CL = 50pF
4.5
-
-
42
-
53
-
63
ns
CL = 50pF
6
-
-
36
-
45
-
54
ns
CL = 15pF
5
-
18
-
-
-
-
-
ns
CL = 50pF
2
-
-
170
-
215
-
255
ns
CL = 50pF
4.5
-
-
34
-
43
-
51
ns
CL = 50pF
6
-
-
29
-
37
-
43
ns
CL = 15pF
5
-
14
-
-
-
-
-
ns
HC TYPES
Propagation Delay,
Trigger A, B, R to Q
Propagation Delay,
Trigger A, B, R to Q
tPHL
6
CD54HC221, CD74HC221, CD74HCT221
Switching Specifications Input tr, tf = 6ns
(Continued)
-40oC TO
85oC
25oC
-55oC TO
125oC
SYMBOL
TEST
CONDITIONS
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tPLH
CL = 50pF
2
-
-
160
-
200
-
240
ns
4.5
-
-
32
-
40
-
48
ns
6
-
-
27
-
34
-
41
ns
2
-
-
180
-
225
-
270
ns
4.5
-
-
36
-
45
-
54
ns
6
-
-
31
-
38
-
46
ns
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
-
-
-
-
10
-
10
-
10
pF
-
4.5 to
5.5
-
±2
-
-
-
-
-
%
CPD
-
5
-
166
-
-
-
-
-
pF
Propagation Delay,
Trigger A, B, R to Q
tPLH
CL = 50pF
4.5
-
-
42
-
-
-
63
ns
CL = 15pF
5
-
18
-
-
-
-
-
ns
Propagation Delay,
Trigger A, B, R to Q
tPHL
CL = 50pF
4.5
-
-
34
-
43
-
51
ns
CL = 15pF
5
-
14
-
-
-
-
-
ns
Propagation Delay,
R to Q
tPLH
CL = 50pF
4.5
-
-
38
-
-
-
57
ns
Propagation Delay,
R to Q
tPHL
CL = 50pF
4.5
-
-
37
-
-
-
56
ns
tTLH, tTHL
CL = 50pF
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
-
-
-
-
10
-
10
-
10
pF
-
4.5 to
5.5
-
±2
-
-
-
-
-
%
-
5
-
166
-
-
-
-
-
pF
PARAMETER
Propagation Delay,
R to Q
Propagation Delay,
R to Q
Output Transition Time
Input Capacitance
tPHL
tTLH, tTHL
CIN
Pulse Width Match Between
Circuits in the Same Package
CX = 1000pF, RX = 10kΩ
Power Dissipation Capacitance
(Notes 4, 5)
CL = 50pF
CL = 50pF
HCT TYPES
Output Transition Time
Input Capacitance
CIN
Pulse Width Match Between
Circuits in the Same Package
CX = 1000pF, RX = 10kΩ
Power Dissipation Capacitance
(Notes 4, 5)
CPD
NOTES:
4. CPD is used to determine the dynamic power consumption, per multivibrator.
5. PD = (CPD + CL) VCC2 fi + Σ where fi = input frequency, fo = output frequency, CL = output load capacitance, VCC = supply voltage.
7
CD54HC221, CD74HC221, CD74HCT221
Test Circuits and Waveforms
tfCL
trCL
CLOCK
tWL + tWH =
90%
10%
I
fCL
CLOCK
50%
50%
1.3V
0.3V
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
tf = 6ns
tf = 6ns
tr = 6ns
VCC
90%
50%
10%
GND
tTLH
GND
tTHL
90%
50%
10%
INVERTING
OUTPUT
3V
2.7V
1.3V
0.3V
INPUT
tTHL
GND
tWH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
tr = 6ns
1.3V
1.3V
tWL
tWH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
tPHL
2.7V
0.3V
GND
tWL
INPUT
tfCL = 6ns
I
fCL
3V
VCC
50%
10%
tWL + tWH =
trCL = 6ns
tTLH
90%
1.3V
10%
INVERTING
OUTPUT
tPHL
tPLH
FIGURE 3. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
8
CD54HC221, CD74HC221, CD74HCT221
Typical Performance Curves
RX = 10K
RX = 10K
VCC = 5V
TA = 25oC
680
0.9
K FACTOR
tW, PULSE WIDTH (µs)
685
CX = 1µF
675
670
HCT
0.8
0.7
665
-75
-50
-25
0
25
50
75
100
125
150
0.6
175
0
2
4
6
VCC, SUPPLY VOLTAGE (V)
TA, AMBIENT TEMPERATURE (oC)
FIGURE 5. HC/HCT221 OUTPUT PULSE WIDTH vs
TEMPERATURE
10
FIGURE 6. HC/HCT221 K FACTOR vs SUPPLY VOLTAGE
106
106
VCC = 4.5V
VCC = 2V
105
tW, PULSE WIDTH (µs)
105
tW, PULSE WIDTH (µs)
8
104
103
RX = 100K
102
RX = 50K
10
RX = 10K
RX = 2K
1
104
103
102
RX = 100K
10
RX = 10K
RX = 50K
RX = 2K
1
0.1
0.1
10
102
103
104
105
106
107
108
10
CX, TIMING CAPACITANCE (pF)
102
103
104
105
106
107
CX, TIMING CAPACITANCE (pF)
FIGURE 7. HC221 OUTPUT PULSE WIDTH vs CX
FIGURE 8. HC/HCT221 OUTPUT PULSE WIDTH vs CX
9
108
CD54HC221, CD74HC221, CD74HCT221
10
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-8780501EA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC221F
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC221F3A
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC221E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC221EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC221M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC221PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT221E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT221EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT221M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT221M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74HCT221M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT221M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT221ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT221MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT221MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT221MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT221MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
30-Apr-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74HC221M96
D
16
FMX
0
16
6.5
10.3
12.1
2
16
Q1
CD74HC221NSR
NS
16
MLA
330
16
8.2
10.5
2.5
12
16
Q1
CD74HC221PWR
PW
16
MLA
330
12
7.0
5.6
1.6
8
12
Q1
CD74HCT221M96
D
16
FMX
0
16
6.5
10.3
12.1
2
16
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
CD74HC221M96
D
16
FMX
333.2
333.2
28.58
CD74HC221NSR
NS
16
MLA
333.2
333.2
28.58
CD74HC221PWR
PW
16
MLA
338.1
340.5
20.64
CD74HCT221M96
D
16
FMX
333.2
333.2
28.58
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
Pack Materials-Page 3
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated