TI1 LM185H-1.2/883 Micropower voltage reference diode Datasheet

LM185-1.2QML
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SNVS384B – OCTOBER 2005 – REVISED JANUARY 2014
LM185-1.2QML Micropower Voltage Reference Diode
Check for Samples: LM185-1.2QML
FEATURES
DESCRIPTION
•
•
•
•
The LM185-1.2 is a micropower 2-terminal band-gap
voltage regulator diodes. Operating over a 10μA to
20mA current range, it features exceptionally low
dynamic impedance and good temperature stability.
On-chip trimming is used to provide tight voltage
tolerance. Since the LM185-1.2 band-gap reference
uses only transistors and resistors, low noise and
good long term stability result.
1
2
Operating Current of 10μA to 20mA
1Ω Maximum Dynamic Impedance (Typical)
Low Temperature Coefficient
Radiation Qualified Option
– 100 krad
– Low Dose Rate Tested at 10 mrad/s
Careful design of the LM185-1.2 has made the device
exceptionally tolerant of capacitive loading, making it
easy to use in almost any reference application. The
wide dynamic operating range allows its use with
widely varying supplies with excellent regulation.
The extremely low power drain of the LM185-1.2
makes it useful for micropower circuitry. This voltage
reference can be used to make portable meters,
regulators or general purpose analog circuitry with
battery life approaching shelf life.
Further, the wide operating current allows it to
replace older references with a tighter tolerance part.
Connection Diagrams
Figure 1. LCCC Package
See Package Number NAJ0020A
Figure 2. TO Package – Bottom View
See Package Number NDU0002A
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2014, Texas Instruments Incorporated
LM185-1.2QML
SNVS384B – OCTOBER 2005 – REVISED JANUARY 2014
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1
10
2
9
3
8
4
7
5
6
NC
+VREF
NC
NC
NC
NC
NC
V-
NC
NC
Figure 3. CLGA Package
See Package Number NAC0010A
Schematic Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings (1)
Reverse Current
30mA
Forward Current
10mA
−55°C ≤ TA ≤ +125°C
Operating Temperature Range
Maximum Junction Temperature (TJmax) (2)
+150°C
−55°C ≤ TA ≤ +150°C
Storage Temperature
Lead Temperature (Soldering 10
Seconds)
CLGA
260°C
TO package
300°C
20LD LCCC package
θJA
Thermal Resistance
θJC
Package Weight (Typical)
300°C
TO (Still Air)
300°C/W
TO (500LF / Min Air Flow)
139°C/W
20LD LCCC (Still Air)
100°C/W
20LD LCCC (500LF / Min Air
Flow)
73°C/W
CLGA (Still Air)
194°C/W
CLGA (500LF / Min Air Flow)
128°C/W
TO
57°C/W
20LD LCCC
25°C/W
CLGA
23°C/W
TO
TBD
20LD LCCC
TBD
CLGA
210mg
ESD Tolerance (3)
(1)
(2)
(3)
4KV
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional. For specifications and test conditions, see the Electrical Characteristics. The specifications apply only for
the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
Human body model, 1.5KΩ in series with 100pF.
Quality Conformance Inspection
Table 1. Mil-Std-883, Method 5005 - Group A
Subgroup
Description
1
Static tests at
Temp °C
25
2
Static tests at
125
3
Static tests at
-55
4
Dynamic tests at
25
5
Dynamic tests at
125
6
Dynamic tests at
-55
7
Functional tests at
25
8A
Functional tests at
125
8B
Functional tests at
-55
9
Switching tests at
25
10
Switching tests at
125
11
Switching tests at
-55
12
Settling time at
25
13
Settling time at
125
14
Settling time at
-55
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SNVS384B – OCTOBER 2005 – REVISED JANUARY 2014
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LM185–1.2 Electrical Characteristics DC Parameters
Symbol
VRef
Parameter
Reverse Breakdown Voltage
Conditions
Notes
Max
Units
IR = 10µA
1.223
1.247
V
1
IR = 20µA
1.205
1.26
V
2, 3
IR = 1mA
1.223
1.247
V
1
1.205
1.26
V
2, 3
1.223
1.247
V
1
2, 3
IR = 20mA
ΔVRef / ΔIR Reverse Breakdown Voltage
Change with Current
VF
Forward Bias Voltage
Subgroups
Min
1.205
1.26
V
10µA ≤ IR ≤ 1mA
-1.0
1.0
mV
1
20µA ≤ IR ≤ 1mA
-1.5
1.5
mV
2, 3
1mA ≤ IR ≤ 20mA
-10.0
10.0
mV
1
-20.0
20.0
mV
2, 3
-1.0
-0.4
V
1
IF = 2mA
LM185–1.2 Electrical Characteristics DC Drift Parameters
Delta calculations performed on QMLV devices at group B, subgroup 5, unless otherwise specified on the IPI.
Symbol
VR
Parameter
Reverse Breakdown Voltage
Min
Max
Units
Subgroups
IR = 10µA
-0.01
0.01
V
1
IR = 20mA
-0.01
0.01
V
1
Min
Max
Units
Subgroups
IR = 10µA
1.223
1.247
V
1
IR = 20µA
1.205
1.26
V
2, 3
IR = 1mA
1.223
1.247
V
1
1.205
1.26
V
2, 3
1.223
1.247
V
1
2, 3
Conditions
Notes
LM185BY–1.2 Electrical Characteristics DC Parameters
Symbol
VRef
Parameter
Reverse Breakdown Voltage
Conditions
Notes
IR = 20mA
ΔVRef / ΔIR
Reverse Breakdown Voltage
Change with Current
VF
Forward Bias Voltage
TC
Temperature Coefficient
(1)
4
1.205
1.26
V
10µA ≤ IR ≤ 1mA
-1.0
1.0
mV
1
20µA ≤ IR ≤ 1mA
-1.5
1.5
mV
2, 3
1mA ≤ IR ≤ 20mA
-10.0
10.0
mV
1
-20.0
20.0
mV
2, 3
-1.0
-0.4
V
1
50
PPM/°C
2, 3
IF = 2mA
(1)
The average temperature coefficient is defined as the maximum deviation of reference voltage, at all measured temperatures between
the operating TMin & TMax, divided by (TMax − TMin). The measured temperatures (TMeasured) are −55°C, 25°C, & 125°C or ΔVRef / (TMax −
TMin)
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LM185-1.2RLQV SMD 5962R8759461 Post 100 krad Electrical Characteristics DC Parameters (1) (2)
Symbol
ΔVRef
Parameter
Change in Reverse Breakdown
Voltage
Conditions
Notes
Min
Max
Units
Subgroups
IR = 10µA
(3)
-3
3
%
1
IR = 1mA
(3)
-3
3
%
1
IR = 20mA
(3)
-2.5
2.5
%
1
ΔVRef / ΔIR Reverse Breakdown Voltage
Change with Current
10µA ≤ IR ≤ 1mA
-15
15
mV
1
1mA ≤ IR ≤ 20mA
-25
25
mV
1
VF
IF = 2mA
-1.0
-0.4
V
1
(1)
(2)
(3)
Forward Bias Voltage
Radiation hardness assured (RHA) products are those with an "RLQV" suffix in the Texas Instruments' part number or those with an "R"
in the SMD number, following "5962".
Testing and qualification for RHA products is done on a wafer level according to MIL-STD-883, Test Method 1019. Testing is performed
with a 1.5X overtest. To be rated at 100 krad(Si) units are tested to 150 krad(Si) with all parameters remaining inside the post 100 krad
Electrical DC test limits in this table. Interim test points are taken at 50, 75 and 100 krad(Si).
Change from the 0 rad reading.
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Typical Performance Characteristics
6
Reverse Characteristics
Reverse Characteristics
Figure 4.
Figure 5.
Forward Characteristics
Temperature Drift of 3
Representative Units
Figure 6.
Figure 7.
Reverse Dynamic Impedance
Reverse Dynamic Impedance
Figure 8.
Figure 9.
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Typical Performance Characteristics (continued)
Noise Voltage
Filtered Output Noise
Figure 10.
Figure 11.
Response Time
1.25
Reference Voltage (V)
Low Dose Rate Biased
1.24
Low Dose Rate Unbiased
1.23
1.22
1.21
1.20
0
50
100
Radiation Level (krad)
Figure 12.
150
C001
Figure 13. VRef Radiation Drift at IR = 10 µA
Reference Voltage (V)
1.25
1.24
1.23
1.22
Low Dose Rate Biased
1.21
Low Dose Rate Unbiased
1.20
0
50
100
Radiation Level (krad)
150
C002
Figure 14. VRef Radiation Drift at IR = 20 mA
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Typical Applications
Figure 15. Wide Input Range Reference
Figure 16. Micropower Reference from 9V Battery
Figure 17. Reference from 1.5V Battery
*IQ ≃ 30μA
Figure 18. Micropower* 5V Regulator
8
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*IQ ≃20μA standby current
Figure 19. Micropower* 10V Reference
Figure 20. Precision 1μA to 1mA Current Sources
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METER THERMOMETERS
Calibration
1. Short LM385-1.2, adjust R3 for IOUT= temp at 1μA/°K
2. Remove short, adjust R2 for correct reading in centigrade
†IQ at 1.3V≃500μA
IQ at 1.6V≃2.4mA
Figure 21. 0°C−100°C Thermometer
*2N3638 or 2N2907 select for inverse HFE ≃ 5
†Select for operation at 1.3V
‡IQ ≃ 600μA to 900μA
Figure 22. Lower Power Thermometer
Calibration
1. Short LM385-1.2, adjust R3 for IOUT= temp at 1.8μA/°K
2. Remove short, adjust R2 for correct reading in °F
Figure 23. 0°F−50°F Thermometer
10
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Calibration
1. Adjust R1 so that V1 = temp at 1mV/°K
2. Adjust V2 to 273.2mV
†IQ for 1.3V to 1.6V battery voltage = 50μA to 150μA
Typical supply current 50μA
Figure 24. Centigrade Thermometer
Adjustment Procedure
1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck
coefficient.
2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2.
Figure 25. Micropower Thermocouple Cold Junction Compensator
Thermocouple
Type
Seebeck
Coefficient
(μV/°C)
R1
(Ω)
R2
(Ω)
Voltage
Across R1
@ 25°C (mV)
Voltage
Across R2
(mV)
J
52.3
523
1.24k
15.60
14.32
T
42.8
432
1k
12.77
11.78
K
40.8
412
953
12.17
11.17
S
6.4
63.4
150
1.908
1.766
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REVISION HISTORY SECTION
Released
12
Revision
Section
10/07/05
A
New Release, Corporate format
03/27/13
A
All
01/07/14
B
Features, Electrical Characteristics,
Typical Performance Characteristics
Originator
L. Lytle
Changes
2 MDS data sheets converted into one Corp.
data sheet format. MNLM185-1.2-X Rev 2A3
and MNLM185BY-1.2-X Rev 0B0 data sheets
will be archived.
Changed layout of National Data Sheet to TI
format
K. Kruckmeyer Added post irradiation test limits and typical
radiation drift plots for radiation qualified option.
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PACKAGE OPTION ADDENDUM
www.ti.com
28-Jul-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-8759401VXA
LIFEBUY
TO
NDU
2
20
TBD
Call TI
Call TI
-55 to 125
8759401VXA Q
5962-8759401VYA
LIFEBUY
CFP
NAC
10
54
TBD
Call TI
Call TI
-55 to 125
LM185WG
-1.2-QV Q
5962-87594
01VYA ACO
01VYA >T
5962-8759401XA
ACTIVE
TO
NDU
2
20
TBD
Call TI
Call TI
-55 to 125
8759401XA Q
5962-8759401YA
ACTIVE
CFP
NAC
10
54
TBD
Call TI
Call TI
-55 to 125
LM185WG
-1.2/883 Q
5962-87594
01YA ACO
01YA >T
5962-8759405XA
ACTIVE
TO
NDU
2
20
TBD
Call TI
Call TI
-55 to 125
8759405XA Q
5962R8759461VXA
ACTIVE
TO
NDU
2
20
TBD
Call TI
Call TI
-55 to 125
R8759461VXA Q
LM185BYH1.2-SMD
ACTIVE
TO
NDU
2
20
TBD
Call TI
Call TI
-55 to 125
8759405XA Q
LM185H-1.2-QV
LIFEBUY
TO
NDU
2
20
TBD
Call TI
Call TI
-55 to 125
8759401VXA Q
LM185H-1.2-SMD
ACTIVE
TO
NDU
2
20
TBD
Call TI
Call TI
-55 to 125
8759401XA Q
LM185H-1.2/883
ACTIVE
TO
NDU
2
20
TBD
Call TI
Call TI
-55 to 125
LM185-1.2 Q
LM185H-1.2RLQV
ACTIVE
TO
NDU
2
20
TBD
Call TI
Call TI
-55 to 125
R8759461VXA Q
LM185WG-1.2-QV
LIFEBUY
CFP
NAC
10
54
TBD
Call TI
Call TI
-55 to 125
LM185WG
-1.2-QV Q
5962-87594
01VYA ACO
01VYA >T
LM185WG-1.2/883
ACTIVE
CFP
NAC
10
54
TBD
Call TI
Call TI
-55 to 125
LM185WG
-1.2/883 Q
5962-87594
01YA ACO
01YA >T
LM185WG-1.2RLQV
PREVIEW
CFP
NAC
10
54
TBD
Call TI
Call TI
-55 to 125
LM185WG
-1.2RLQV Q
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
28-Jul-2016
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
(5962-87594 ~
5962R87594)
(01VYA ACO ~ 61VYA
ACO)
01VYA >T
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
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28-Jul-2016
OTHER QUALIFIED VERSIONS OF LM185-1.2QML, LM185-1.2QML-SP :
• Military: LM185-1.2QML
• Space: LM185-1.2QML-SP
NOTE: Qualified Version Definitions:
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 3
MECHANICAL DATA
NAC0010A
WG10A (Rev H)
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MECHANICAL DATA
NDU0002A
H02A (Rev F)
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