LSP1000 thru LSP1012 ENHANCED PERFORMANCE SURFACE MOUNT "EPSM" PACKAGED DEVICES MICROWAVE PRODUCTS DIVISION PRODUCT PREVIEW Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistency of performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high performance wireless applications including VCO's, limiters, pin switches and pin attenuators. Select PIN diodes for switching, attenuation or limiting through 6 GHz. They are available in multiple chip configuration as well as outlines which directly replace SOT23 and SOD-323 devices. Other devices and values are always available contact our applications engineering department for more details. !"Frequencies from VHF to 6 GHz !"Lower Parasitics !"Mil Grade Ceramic/Epoxy Amalgam Construction !"Dense SiO2 Junction Passivation !"Superior Consistency/Repeatability !"Footprints Available for SOT-23/SOD-323/SOD-123 !"Priced for Commercial Products !"Tape & Reel for Volume Pick & Place IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com PIN DIODE DEVICES FOR WIRELESS ATTENUATORS, SWITCHES AND LIMITERS ABSOLUTE MAXIMUM RATINGS AT 25°°C Forward Current (IF): µs Pulse) 1 Amp (1µ Power Dissipation (PD): 500 mW (Derate to 0 at max TJ) Peak Inverse Volts (PIV): Same as VB Junction Temp. (Operating): Storage Temp. (Non-Operating): Leakage: !"High performance wireless surface mounting including: !"GSM !"TAGS !"WANS !"PCS !"AMPS !"DECT !"CELLULAR % <50 nA @ 80% VB@ 25°°C TABLE 1 MODEL VB CT @ VR MAX. LSP1000 > 35 .28 @ 5V RS @ IF MAX. 2.5Ω Ω@ 5 mA LSP1002 > 100 .32 @ 50V LSP1004 > 35 LSP1011 LSP1012 TL TYP. APPLIC -TION 80nS SWITCH 4Ω Ω@ 100 mA 1500nS ATTENUATOR .75 @ 20V 0.6Ω Ω@ 10 mA 150nS SWITCH > 200V .35 @ 50V 2Ω Ω@ 100 mA 2000nS ATTENUATOR > 20V .35pF @ 10V 1.8Ω Ω@ 10 mA 5nS LIMITER Microsemi Microwave Products Division 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 1 LSP1000 thru LSP1012 Copyright 2000 MSC1618.PDF 2000-11-06 APPLICATIONS/BENEFITS APPLICATIONS/BENEFIT S -65°°C to + 125°°C -65°°C to + 125°°C TEST CONDITIONS: RS @ 100 MHz VB @ 10 µA TL @ IF = 10 mA CT @ 1 MHz IR = 6 mA W W W . Microsemi .COM KEY FEATURES DESCRIPTION LSP1000 thru LSP1012 ENHANCED PERFORMANCE SURFACE MOUNT "EPSM" PACKAGED DEVICES MICROWAVE PRODUCTS DIVISION PRODUCT PREVIEW Figure 1 Outline Style 150(X) Figure 2 Outline Style 154 Figure 3 Outline Style 250(X) Figure 4 Outline Style 254 Figure 5 Outline Style 350(X) Figure 6 Outline Style 252A W W W . Microsemi .COM EPSM AVAILABLE CONFIGURATIONS PACKAGE DATA Copyright 2000 MSC1618.PDF 2000-11-06 Microsemi Microwave Products Division 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 2 LSP1000 thru LSP1012 MICROWAVE PRODUCTS DIVISION ENHANCED PERFORMANCE SURFACE MOUNT "EPSM" PACKAGED DEVICES PRODUCT PREVIEW W W W . Microsemi .COM NOTES Copyright 2000 MSC1618.PDF 2000-11-06 Microsemi Microwave Products Division 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 3