ON NVMFS6B03NLWFT3G Single nâ channel power mosfet Datasheet

NVMFS6B03NL
Advance Information
Power MOSFET
100 V, 4.8 mW, 145 A, Single N−Channel
Features
•
•
•
•
•
•
Small Footprint (5x6 mm) for Compact Design
Low RDS(on) to Minimize Conduction Losses
Low QG and Capacitance to Minimize Driver Losses
NVMFS6B03NLWF − Wettable Flank Option for Enhanced Optical
Inspection
AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
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V(BR)DSS
RDS(ON) MAX
ID MAX
100 V
4.8 mW @ 10 V
145 A
D (5,6)
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain Current RqJC (Notes 1, 2,
3)
Power Dissipation
RqJC (Notes 1, 2)
Continuous Drain Current RqJA (Notes 1, 2,
3)
Power Dissipation
RqJA (Notes 1 & 2)
Pulsed Drain Current
TC = 25°C
Steady
State
Symbol
Value
Unit
VDSS
100
V
VGS
±16
V
ID
145
A
TC = 100°C
TC = 25°C
102
PD
TC = 100°C
TA = 25°C
Steady
State
ID
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (TJ = 25°C, VDD = 50 V, VGS = 10 V,
IL(pk) = 60 A, L = 0.1 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
N−CHANNEL MOSFET
W
198
MARKING
DIAGRAM
A
20
14
PD
TA = 100°C
TA = 25°C, tp = 10 ms
S (1,2,3)
99
TA = 100°C
TA = 25°C
G (4)
D
1
W
3.9
2.0
IDM
520
A
TJ, Tstg
−55 to
+ 175
°C
IS
160
A
EAS
180
mJ
TL
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
A
Y
W
ZZ
S
S
S
G
D
XXXXXX
AYWZZ
D
D
= Assembly Location
= Year
= Work Week
= Lot Traceability
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Junction−to−Case − Steady State
RqJC
0.76
°C/W
Junction−to−Ambient − Steady State (Note 2)
RqJA
38
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
© Semiconductor Components Industries, LLC, 2015
October, 2015 − Rev. P0
1
Publication Order Number:
NVMFS6B03NL/D
NVMFS6B03NL
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)
Parameter
Symbol
Test Condition
Min
Drain−to−Source Breakdown Voltage
V(BR)DSS
VGS = 0 V, ID = 250 mA
100
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V(BR)DSS/
TJ
Typ
Max
Unit
OFF CHARACTERISTICS
Zero Gate Voltage Drain Current
IDSS
Gate−to−Source Leakage Current
V
67.3
VGS = 0 V,
VDS = 80 V
mV/°C
TJ = 25°C
10
TJ = 125°C
100
IGSS
VDS = 0 V, VGS = 16 V
VGS(TH)
VGS = VDS, ID = 250 mA
mA
100
nA
3.0
V
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Negative Threshold Temperature Coefficient
VGS(TH)/TJ
Drain−to−Source On Resistance
RDS(on)
1.0
−8.1
VGS = 10 V
ID = 20 A
3.8
mV/°C
4.8
mW
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
CISS
4200
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
31
Total Gate Charge
QG(TOT)
58
Threshold Gate Charge
QG(TH)
6.2
Gate−to−Source Charge
QGS
Gate−to−Drain Charge
QGD
17
Plateau Voltage
VGP
5.4
V
Gate Resistance
RG
1.0
W
VGS = 0 V, f = 1 MHz, VDS = 50 V
VGS = 10 V, VDS = 80 V; ID = 50 A
TJ = 25°C
760
pF
nC
19
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
td(ON)
tr
td(OFF)
16
VGS = 4.5 V, VDS = 80 V,
ID = 50 A, RG = 1.0 W
tf
46
ns
29
11
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
Reverse Recovery Time
VSD
TJ = 25°C
0.9
TJ = 125°C
0.8
tRR
Charge Time
ta
Discharge Time
tb
Reverse Recovery Charge
VGS = 0 V,
IS = 50 A
1.2
V
67
VGS = 0 V, dIS/dt = 100 A/ms,
IS = 25 A
QRR
35
ns
31
120
nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
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2
NVMFS6B03NL
TYPICAL CHARACTERISTICS
140
120
VDS ≤ 10 V
120
5.5 V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
140
VGS = 6 V to 10 V
100
80
5.0 V
60
40
4.5 V
100
80
60
TJ = 125°C
40
TJ = 25°C
20
20
4.0 V
0
0.5
1.0
2.0
1.5
2.5
3.0
0
4
5
Figure 1. On−Region Characteristics
Figure 2. Transfer Characteristics
ID = 20 A
TJ = 25°C
10
9
8
7
6
5
4
3
4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0
8.5 9.0 9.5 10
VGS, GATE VOLTAGE (V)
6
8.0
7.5
TJ = 25°C
7.0
6.5
VGS = 6.0 V
6.0
5.5
5.0
4.5
VGS = 10 V
4.0
3.5
3.0
10
15
20
25
35
30
40
45
50
ID, DRAIN CURRENT (A)
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
100K
2.2
ID = 20 A
VGS = 10 V
TJ = 150°C
10K
1.8
IDSS, LEAKAGE (nA)
RDS(on), NORMALIZED DRAIN−TO−
SOURCE RESISTANCE
3
2
VGS, GATE−TO−SOURCE VOLTAGE (V)
11
2.0
1
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW)
0
RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW)
TJ = −55°C
0
1.6
1.4
1.2
1.0
0.8
TJ = 125°C
1K
100
TJ = 25°C
10
0.6
0.4
−50 −25
1
0
25
50
75
100
125
150
175
10
20
30
40
50
60
70
80
90
100
TJ, JUNCTION TEMPERATURE (°C)
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
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3
NVMFS6B03NL
10,000
VGS, GATE−TO−SOURCE VOLTAGE (V)
TYPICAL CHARACTERISTICS
Ciss
C, CAPACITANCE (pF)
Coss
1000
Crss
100
VGS = 0 V
TJ = 25°C
f = 1 MHz
10
1
1
10
QT
10
8
Qgd
Qgs
6
4
TJ = 25°C
VDS = 50 V
ID = 50 A
2
0
0
100
5
10
15
20
25
30 35
40
45
50
55 60
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Qg, TOTAL GATE CHARGE (nC)
Figure 7. Capacitance Variation
Figure 8. Gate−to−Source and
Drain−to−Source Voltage vs. Total Charge
200
1000
VDS = 50 V
ID = 50 A
VGS = 10 V
180
IS, SOURCE CURRENT (A)
td(off)
td(on)
100
tr
10
tf
TJ = 25°C
160
140
120
100
80
60
40
20
1
1
10
0
100
0.3 0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
RG, GATE RESISTANCE (W)
VSD, SOURCE−TO−DRAIN VOLTAGE (V)
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
Figure 10. Diode Forward Voltage vs. Current
1000
ID, DRAIN CURRENT (A)
t, TIME (ns)
12
100
VGS ≤ 10 V
Single Pulse
TC = 25°C
500 ms
10
1 ms
1
10 ms
RDS(on) Limit
Thermal Limit
Package Limit
0.1
0.01
0.1
1
10
100
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
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4
NVMFS6B03NL
TYPICAL CHARACTERISTICS
100
120
IPEAK, DRAIN CURRENT (A)
GFS, SMALL−SIGNAL FORWARD
TRANSFER CONDUCTANCE (S)
140
100
80
60
40
20
0
25°C
10
100°C
1
0
40
20
60
80
100
120
140
100E−6
1E−3
10E−3
ID, DRAIN CURRENT (A)
TAV, TIME IN AVALANCHE (sec)
Figure 12. GFS vs. ID
Figure 13. IPEAK vs. TAV
100
50% Duty Cycle
R(t) (°C/W)
10
1
20%
10%
5%
2%
1%
0.1
NTMFS6B03NL, 650 mm2, 2 oz, Cu Single Layer
Pad
0.01 Single Pulse
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
Figure 14. Thermal Response
DEVICE ORDERING INFORMATION
Marking
Package
Shipping†
NVMFS6B03NLT1G
6B03NL
DFN5
(Pb−Free)
1500 / Tape & Reel
NVMFS6B03NLWFT1G
6B03WF
DFN5
(Pb−Free, Wettable Flanks)
1500 / Tape & Reel
6B03
DFN5
(Pb−Free)
5000 / Tape & Reel
6B03WF
DFN5
(Pb−Free, Wettable Flanks)
5000 / Tape & Reel
Device
NVMFS6B03NLT3G
NVMFS6B03NLWFT3G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NVMFS6B03NL
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE M
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
0.20 C
D
A
2
B
D1
2X
0.20 C
4X
E1
2
q
E
c
1
2
3
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
A1
4
TOP VIEW
C
SEATING
PLANE
DETAIL A
0.10 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.10 C
SIDE VIEW
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.15
5.00
5.30
4.70
4.90
5.10
3.80
4.00
4.20
6.00
6.15
6.30
5.70
5.90
6.10
3.45
3.65
3.85
1.27 BSC
0.51
0.575
0.71
1.20
1.35
1.50
0.51
0.575
0.71
0.125 REF
3.00
3.40
3.80
0_
−−−
12 _
STYLE 1:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
2X
DETAIL A
0.495
4.560
2X
0.10
8X b
C A B
0.05
c
1.530
e/2
e
L
1
3.200
4
4.530
K
1.330
2X
E2
PIN 5
(EXPOSED PAD)
L1
0.905
M
1
0.965
4X
G
D2
1.000
4X 0.750
BOTTOM VIEW
1.270
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
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NVMFS6B03NL/D