MC74HC174A Hex D Flip-Flop with Common Clock and Reset High−Performance Silicon−Gate CMOS The MC74HC174A is identical in pinout to the LS174. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device consists of six D flip−flops with common Clock and Reset inputs. Each flip−flop is loaded with a low−to−high transition of the Clock input. Reset is asynchronous and active−low. • • • MARKING DIAGRAMS 16 PDIP−16 N SUFFIX CASE 648 16 Features • • • • • http://onsemi.com Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 mA In Compliance with the Requirements Defined by JEDEC Standard No. 7 A Chip Complexity: 162 FETs or 40.5 Equivalent Gates NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1 MC74HC174AN AWLYYWWG 1 16 SOIC−16 D SUFFIX CASE 751B 16 1 HC174AG AWLYWW 1 16 HC 174A ALYWG G TSSOP−16 DT SUFFIX CASE 948F 16 1 1 A L, WL Y, YY W, WW G or G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2012 July, 2012 − Rev. 12 1 Publication Order Number: MC74HC174A/D MC74HC174A 3 2 4 5 D2 D3 6 7 11 10 13 12 14 15 D0 RESET 1 16 VCC Q0 2 15 Q5 D0 3 14 D5 D1 4 13 D4 D4 D5 Q1 5 12 Q4 D2 6 11 D3 Q2 7 10 Q3 GND 8 9 D1 DATA INPUTS CLOCK CLOCK 9 RESET 1 Figure 1. Pin Assignment Q0 Q1 Q2 Q3 NONINVERTING OUTPUTS Q4 Q5 PIN 16 = VCC PIN 8 = GND Figure 2. Logic Diagram FUNCTION TABLE DESIGN/VALUE TABLE Inputs Output Design Criteria Value Units Reset Clock D Q Internal Gate Count* 40.5 ea. L X X L Internal Gate Propagation Delay 1.5 ns H H H Internal Gate Power Dissipation 5.0 mW H L L Speed Power Product 0.0075 pJ X No Change X No Change H L H *Equivalent to a two−input NAND gate. ORDERING INFORMATION Package Shipping† MC74HC174ANG PDIP−16 (Pb−Free) 500 Units / Rail MC74HC174ADG SOIC−16 (Pb−Free) 48 Units / Rail MC74HC174ADR2G SOIC−16 (Pb−Free) 2500 / Tape & Reel MC74HC174ADTR2G TSSOP−16 (Pb−Free) 2500 / Tape & Reel NLV74HC174ADG* SOIC−16 (Pb−Free) 55 Units / Rail NLV74HC174ADR2G* SOIC−16 (Pb−Free) 2500 / Tape & Reel NLV74HC174ADTR2G* TSSOP−16 (Pb−Free) 2500 / Tape & Reel NLV74HC174ANG* PDIP−16 (Pb−Free) 25 Units / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable http://onsemi.com 2 MC74HC174A MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) *0.5 to )7.0 V VIN DC Input Voltage (Referenced to GND) *1.5 to VCC )1.5 V (Referenced to GND) (Note 1) *0.5 to VCC )0.5 V VOUT IIN DC Output Voltage DC Input Current, per Pin $20 mA IOUT DC Output Current, per Pin $25 mA ICC DC Supply Current, VCC and GND Pins $50 mA *65 to )150 _C 260 _C )150 _C TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PDIP SOIC TSSOP 78 112 148 _C/W PD Power Dissipation in Still Air at 85_C PDIP SOIC TSSOP 750 500 450 mW MSL Moisture Sensitivity FR Flammability Rating VESD ILATCHUP Level 1 Oxygen Index: 30% − 35% ESD Withstand Voltage Latchup Performance PDIP, SOIC, TSSOP UL 94 V−0 @ 0.125 in. Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) u2000 u100 u500 V Above VCC and Below GND at 85_C (Note 5) $300 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol Parameter VCC DC Supply Voltage VIN, VOUT DC Input Voltage, Output Voltage TA Operating Temperature, All Package Types tr, tf CLOCK Input Rise and Fall Time (Figure 4) Min Max Unit 2.0 6.0 V 0 VCC V *55 )125 _C 0 0 0 0 1000 700 500 400 ns (Referenced to GND) (Referenced to GND) (Note 6) VCC = 2.0 V VCC = 3.3 V VCC = 4.5 V VCC = 6.0 V 6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 3 MC74HC174A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Guaranteed Limit ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol Parameter Test Conditions V *55_C to 25_C v85_C v125_C Unit VIH Minimum High−Level Input Voltage VOUT = 0.1 V or VCC – 0.1 V |IOUT| v 20 mA 2.0 4.5 6.0 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 V VIL Maximum Low−Level Input Voltage VOUT = 0.1 V or VCC – 0.1 V |IOUT| v 20 mA 2.0 4.5 6.0 0.5 1.35 1.8 0.5 1.35 1.8 0.5 1.35 1.8 V VOH Minimum High−Level Output Voltage VIN = VIH or VIL |IOUT| v 20 mA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V VIN = VIH or VIL |IOUT| v 4.0 mA |IOUT| v 5.2 mA 4.5 6.0 3.98 5.48 3.84 5.34 3.7 5.2 VIN = VIH or VIL |IOUT| v 20 mA 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 VIN = VIH or VIL |IOUT| v 4.0 mA |IOUT| v 5.2 mA 4.5 6.0 0.26 0.26 0.33 0.33 0.4 0.4 VOL Maximum Low−Level Output Voltage V IIN Maximum Input Leakage Current VIN = VCC or GND 6.0 $0.1 $1.0 $1.0 mA ICC Maximum Quiescent Supply Current (per Package) VIN = VCC or GND IOUT = 0 mA 6.0 4.0 40 160 mA AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns) VCC Guaranteed Limit ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol V *55_C to 25_C v85_C v125_C Unit fmax Maximum Clock Frequency (50% Duty Cycle) (Figures 4 and 7) Parameter 2.0 4.5 6.0 6.0 30 35 4.8 24 28 4.0 20 24 MHz tPLH tPHL Maximum Propagation Delay, Clock to Q (Figures 5 and 7) 2.0 4.5 6.0 110 22 19 140 28 24 165 33 28 ns tPLH tPHL Maximum Propagation Delay, Reset to Q (Figures 2 and 7) 2.0 4.5 6.0 110 21 19 140 28 24 160 32 27 ns tTLH tTHL Maximum Output Transition Time, Any Output (Figures 4 and 7) 2.0 4.5 6.0 75 15 13 95 19 16 110 22 19 ns Cin Maximum Input Capacitance 10 10 10 pF Typical @ 25_C, VCC = 5.0 V CPD Power Dissipation Capacitance, per Enabled Output (Note 7) 7. Used to determine the no−load dynamic power consumption: P D = CPD VCC 2 f + ICC VCC . http://onsemi.com 4 62 pF MC74HC174A TIMING REQUIREMENTS (CL = 50 pF, Input tr = tf = 6.0 ns) Guaranteed Limit VCC *55_C to 25_C v85_C v125_C ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol Parameter Figure V Min Max Min Max Min Max Unit tsu Minimum Setup Time, Data to Clock 6 2.0 4.5 6.0 50 10 9.0 65 13 11 75 15 13 ns th Minimum Hold Time, Clock to Data 6 2.0 4.5 6.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 ns trec Minimum Recovery Time, Reset Inactive to Clock 5 2.0 4.5 6.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 ns tw Minimum Pulse Width, Clock 4 2.0 4.5 6.0 75 15 13 95 19 16 110 22 19 ns tw Minimum Pulse Width, Reset 5 2.0 4.5 6.0 75 15 13 95 19 16 110 22 19 ns Maximum Input Rise and Fall Times 4 2.0 4.5 6.0 tr, tf CLOCK 9 D0 3 RESET 1 D1 4 D2 6 D3 11 1000 500 400 C D Q D4 D5 Q Q Q D Q D Q R Figure 3. Expanded Logic Diagram http://onsemi.com 5 Q2 10 Q3 12 Q4 R C 14 7 R C 13 Q1 R C D 5 R C D Q0 R C D 2 1000 500 400 15 Q5 1000 500 400 ns MC74HC174A tr CLOCK tf VCC 90% 50% 10% tw GND GND tPHL tPLH tPHL Q 90% 50% 10% trec tTLH 50% CLOCK tTHL Figure 4. Switching Waveform Figure 5. Switching Waveform TEST POINT VALID VCC DATA VCC 50% 1/fmax Q tw RESET OUTPUT 50% tsu th DEVICE UNDER TEST GND CL * VCC CLOCK 50% GND *Includes all probe and jig capacitance Figure 6. Switching Waveform Figure 7. Test Circuit http://onsemi.com 6 VCC GND MC74HC174A PACKAGE DIMENSIONS PDIP−16 CASE 648−08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− 16 9 1 8 B F C L S −T− H SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M http://onsemi.com 7 DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MC74HC174A PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT* 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74HC174A PACKAGE DIMENSIONS TSSOP−16 CASE 948F−01 ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S K S ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. N 8 1 0.25 (0.010) M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74HC174A ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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