[ /Title (CD74 HC257 , CD74 HCT25 7) /Subject (High Speed CMOS Logic Quad 2-Input Multiplexer CD54HC257, CD74HC257, CD54HCT257, CD74HCT257 Data sheet acquired from Harris Semiconductor SCHS171D November 1997 - Revised October 2003 High-Speed CMOS Logic Quad 2-Input Multiplexer with Three-State Non-Inverting Outputs Features all other input conditions. • Buffered Inputs Moving data from two groups of registers to four common output buses is a common use of the 257. The state of the Select input determines the particular register from which the data comes. It can also be used as a function generator. • Typical Propagation Delay ( In to Output ) = 12ns at VCC = 5V, CL = 15pF, TA = 25oC • Fanout (Over Temperature Range) Ordering Information - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads PART NUMBER • Wide Operating Temperature Range . . . -55oC to 125oC TEMP. RANGE (oC) PACKAGE • Balanced Propagation Delay and Transition Times CD54HC257F3A -55 to 125 16 Ld CERDIP • Significant Power Reduction Compared to LSTTL Logic ICs CD54HCT257F3A -55 to 125 16 Ld CERDIP CD74HC257E -55 to 125 16 Ld PDIP CD74HC257M -55 to 125 16 Ld SOIC CD74HC257MT -55 to 125 16 Ld SOIC CD74HC257M96 -55 to 125 16 Ld SOIC CD74HCT257E -55 to 125 16 Ld PDIP CD74HCT257M -55 to 125 16 Ld SOIC CD74HCT257MT -55 to 125 16 Ld SOIC CD74HCT257M96 -55 to 125 16 Ld SOIC • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH Description The ’HC257 and ’HCT257 are quad 2-input multiplexers which select four bits of data from two sources under the control of a common Select Input (S). The Output Enable input (OE) is active LOW. When OE is HIGH, all of the outputs (1Y-4Y) are in the high impedance state regardless of NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. Pinout CD54HC257, CD54HCT257 (CERDIP) CD74HC257, CD74HCT257 (PDIP, SOIC) TOP VIEW 16 VCC S 1 1I0 2 15 OE 1I1 3 14 4I0 1Y 4 13 4I1 2I0 5 12 4Y 2I1 6 11 3I0 2Y 7 10 3I1 GND 8 9 3Y CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54HC257, CD74HC257, CD54HCT257, CD74HCT257 Functional Diagram OE 15 1 S 4I1 4I0 13 P 12 4Y N 14 10 3I1 9 11 3I0 6 2I1 3 CIRCUITS IDENTICAL TO CIRCUIT 5 2I0 4 2 1I0 2Y IN ABOVE DASHED ENCLOSURE 3 1I1 7 3Y TRUTH TABLE OUTPUT ENABLE SELECT INPUT OE S I0 I1 Y H X X X Z L L L X L L L H X H L H X L L L H X H H DATA INPUTS OUTPUT H= High Voltage Level L= Low Voltage Level X= Don’t Care Z= High Impedance, OFF State 2 1Y CD54HC257, CD74HC257, CD54HCT257, CD74HCT257 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±70mA Thermal Resistance (Typical, Note 1) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 67 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 73 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) VIH - 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V -6 4.5 3.98 - - 3.84 - 3.7 - V -7.8 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V 6 4.5 - - 0.26 - 0.33 - 0.4 V 7.8 6 - - 0.26 - 0.33 - 0.4 V - 6 - - ±0.1 - ±1 - ±1 µA HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current II VCC or GND - - 3 CD54HC257, CD74HC257, CD54HCT257, CD74HCT257 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) Quiescent Device Current ICC VCC or GND 0 Three-State Leakage Current IOZ VIL or VIH High Level Input Voltage VIH Low Level Input Voltage High Level Output Voltage CMOS Loads PARAMETER 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 6 - - 8 - 80 - 160 µA - 6 - - ±0.5 - ±5 - ±10 µA - - 4.5 to 5.5 2 - - 2 - 2 - V VIL - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V VOH VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V -6 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 6 4.5 - - 0.26 - 0.33 - 0.4 V HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads II VCC to GND 0 5.5 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA Additional Quiescent Device Current Per Input Pin: 1 Unit Load ∆ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA Three-State Leakage Current IOZ VIL or VIH - 5.5 - - ±0.5 - ±5 - ±10 µA Input Leakage Current Quiescent Device Current NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS Data 0.95 S 3 OE 0.6 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC. 4 CD54HC257, CD74HC257, CD54HCT257, CD74HCT257 Switching Specifications PARAMETER Input tr, tf = 6ns SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) TYP MAX MAX MAX UNITS 2 - 150 190 225 ns 4.5 - 30 38 45 ns CL = 15pF 5 12 - - - ns CL = 50pF 6 - 26 33 38 ns CL = 50pF 2 - 175 220 265 ns 4.5 - 35 44 53 ns CL = 15pF 5 14 - - - ns CL = 50pF 6 - 30 37 45 ns CL = 50pF 2 - 150 190 225 ns CL = 50pF 4.5 - 30 38 45 ns CL = 15pF 5 12 - - - ns CL = 50pF 6 - 26 33 38 ns CL = 50pF 2 - 60 75 90 ns 4.5 - 12 15 18 ns 6 - 10 13 15 ns HC TYPES Propagation Delay In to Y Propagation Delay S to Y Propagation Delay OE to Y Output Transition Times tPLH, tPHL tPLZ, tPHZ, tPZL, tPZH tTLH, tTHL Input Capacitance CI - - - 10 10 10 pF Three-State Output Capacitance CO - - - 20 20 20 pF Power Dissipation Capacitance (Notes 3, 4) CPD - 5 45 - - - pF CL = 50pF 4.5 - 33 41 50 ns CL = 15pF 5 13 - - - ns CL = 50pF 4.5 - 38 48 57 ns CL = 15pF 5 12 - - - ns CL = 50pF 4.5 - 30 38 45 ns CL = 15pF 5 16 - - - ns CL = 50pF 4.5 - 12 15 18 ns HCT TYPES Propagation Delay In to Y tPLH, tPHL Propagation Delay S to Y tPZL, tPZH Propagation Delay OE to Y tPLZ, tPHZ Output Transition Times tTLH, tTHL Input Capacitance CI - - - 10 10 10 pF Three-State Output Capacitance CO - - - 20 20 20 pF Power Dissipation Capacitance (Notes 3, 4) CPD - 5 45 - - - pF NOTES: 3. CPD is used to determine the dynamic power consumption, per multiplexer. 4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. 5 CD54HC257, CD74HC257, CD54HCT257, CD74HCT257 Test Circuits and Waveforms tr = 6ns tf = 6ns 90% 50% 10% INPUT GND tTLH tPHL 6ns 10% 2.7 1.3 OUTPUT LOW TO OFF 90% OUTPUT HIGH TO OFF 50% OUTPUTS DISABLED FIGURE 3. HC THREE-STATE PROPAGATION DELAY WAVEFORM OTHER INPUTS TIED HIGH OR LOW OUTPUT DISABLE IC WITH THREESTATE OUTPUT GND 1.3V tPZH 90% OUTPUTS ENABLED OUTPUTS ENABLED 0.3 10% tPHZ tPZH 3V tPZL tPLZ 50% OUTPUTS ENABLED 6ns GND 10% tPHZ tf OUTPUT DISABLE tPZL tPLZ OUTPUT HIGH TO OFF 6ns tr VCC 90% tPLH FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 6ns OUTPUT LOW TO OFF 1.3V 10% INVERTING OUTPUT FIGURE 1. HC TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 50% tTLH 90% tPLH tPHL GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL OUTPUT DISABLE tf = 6ns tr = 6ns VCC 1.3V OUTPUTS DISABLED OUTPUTS ENABLED FIGURE 4. HCT THREE-STATE PROPAGATION DELAY WAVEFORM OUTPUT RL = 1kΩ CL 50pF VCC FOR tPLZ AND tPZL GND FOR tPHZ AND tPZH NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1kΩ to VCC, CL = 50pF. FIGURE 5. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT 6 PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-8970501EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8970501EA CD54HCT257F3A CD54HC257F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8512401EA CD54HC257F3A CD54HCT257F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8970501EA CD54HCT257F3A CD74HC257E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC257E CD74HC257M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC257M CD74HC257M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC257M CD74HCT257E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT257E CD74HCT257EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT257E CD74HCT257M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT257M CD74HCT257M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT257M CD74HCT257M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT257M CD74HCT257MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT257M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2014 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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OTHER QUALIFIED VERSIONS OF CD54HC257, CD54HCT257, CD74HC257, CD74HCT257 : • Catalog: CD74HC257, CD74HCT257 • Military: CD54HC257, CD54HCT257 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC257M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74HCT257M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC257M96 SOIC D 16 2500 333.2 345.9 28.6 CD74HCT257M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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