Mitsubishi microcomputers Description M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Description The M16C/62M (80-pin version) group (low voltage version) of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high level of instruction efficiency. With 1M bytes of address space, they are capable of executing instructions at high speed. They also feature a built-in multiplier and DMAC, making them ideal for controlling office, communications, industrial equipment, and other high-speed processing applications. The M16C/62M (80-pin version) group (low voltage version) includes a wide range of products with different internal memory types and sizes and various package types. Features • Memory capacity .................................. ROM (See Figure 1.1.3. ROM Expansion) RAM 10K to 20K bytes • Shortest instruction execution time ...... 100ns (f(XIN)=10MHZ, VCC=2.7V to 3.6V) 142.9ns (f(XIN)=7MHZ, VCC=2.2V to 3.6V, with software one-wait) • Supply voltage ..................................... 2.7V to 3.6V (f(XIN)=10MHZ, without software wait) 2.4V to 2.7V (f(XIN)= 7MHZ, without software wait) 2.2V to 2.4V (f(XIN)= 7MHZ, with software one-wait) • Low power consumption ...................... 28.5mW ( f(XIN)=10MHZ, with software one-wait, VCC = 3V) • Interrupts .............................................. 25 internal and 5 external interrupt sources, 4 software interrupt sources; 7 levels (including key input interrupt) • Multifunction 16-bit timer ...................... 5 output timers + 6 input timers (3 for timer function only) • Serial I/O .............................................. 5 channels (2 for UART or clock synchronous, 1 for UART, 2 for clock synchronous) • DMAC .................................................. 2 channels (trigger: 24 sources) • A-D converter ....................................... 10 bits X 8 channels (Expandable up to 10 channels) • D-A converter ....................................... 8 bits X 2 channels • CRC calculation circuit ......................... 1 circuit • Watchdog timer .................................... 1 line • Programmable I/O ............................... 70 lines _______ • Input port .............................................. 1 line (P85 shared with NMI pin) • Clock generating circuit ....................... 2 built-in clock generation circuits (built-in feedback resistor, and external ceramic or quartz oscillator) Note: Memory expansion mode and microprocessor mode are not supported. Applications Audio, cameras, office equipment, communications equipment, portable equipment 1 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Pin Configuration Figures 1.1.1 show the pin configurations (top view). P33 P34 P35 P36 P37 P40 P41 P42 P22 P23 P24 P25 P26 P27 P30 P31 P32 P07 P20 P21 PIN CONFIGURATION (top view) 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 P06 P05 P04 P03 61 40 P43 62 39 P50 63 38 64 37 P02 65 36 P01 P00 P107/AN7/KI3 P106/AN6/KI2 P105/AN5/KI1 P104/AN4/KI0 P103/AN3 P102/AN2 P101/AN1 AVSS P100/AN0 VREF AVcc P97/ADTRG/SIN4 P96/ANEX1/SOUT4 66 35 67 34 68 33 P51 P52 P53 P54 P55 P56 P57/CLKOUT P60/CTS0/RTS0 P61/CLK0 P62/RxD0 P63/TXD0 P64/CTS1/RTS1/CLKS1 P65/CLK1 P66/RxD1 P67/TXD1 32 69 M16C/62M (80-pin version) group (low voltage version) 70 71 72 31 30 29 73 28 74 27 75 26 76 25 77 24 78 23 79 22 80 21 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 P95/ANEX0/CLK4 P94/DA1/TB4IN P93/DA0/TB3IN P92/TB2IN/SOUT3 P90/TB0IN/CLK3 CNVss(BYTE) P87/XCIN P86/XCOUT RESET XOUT VSS XIN VCC P85/NMI P84/INT2 P83/INT1 P82/INT0 P81/TA4IN P80/TA4OUT P77/TA3IN 1 P70/TxD2/SDA/TA0OUT P71/RxD2/SCL/TA0IN/TB5IN P76/TA3OUT Package: 80P6S-A Figure 1.1.1. Pin configuration (top view) 2 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Block Diagram Figure 1.1.2 is a block diagram of the M16C/62M (80-pin version) group (low voltage version). Block diagram of the M16C/62M (80-pin version) group (low voltage version) 8 I/O ports Port P0 Port P2 8 4 Port P3 8 8 Port P4 Port P5 Port P6 UART/clock synchronous SI/O Clock synchronous SI/O (8 bits X 3 channels)(Note 3) CRC arithmetic circuit (CCITT ) (Polynomial : X16+X12+X5+1) M16C/60 series16-bit CPU core Registers (15 bits) Flag register FLG RAM (Note 2) Multiplier 8 SB Stack pointer ISP USP ROM (Note 1) Port P10 D-A converter (8 bits X 2 channels) PC Vector table INTB Memory 7 DMAC (2 channels) Program counter AAAAAA AAAAAA AAAAAA AAAAAA AAAAAA AAAA AAAA Port P9 Watchdog timer R0H R0L R0H R0L R1H R1L R1H R1L R2 R2 R3 R3 A0 A0 A1 A1 FB FB (8 bits X 2 channels) 7 Expandable up to 10 channels) 4 Timer TA0 (16 bits) Timer TA1 (16 bits) Timer TA2 (16 bits) Timer TA3 (16 bits) Timer TA4 (16 bits) Timer TB0 (16 bits) Timer TB1 (16 bits) Timer TB2 (16 bits) Timer TB3 (16 bits) Timer TB4 (16 bits) Timer TB5 (16 bits) System clock generator XIN-XOUT XCIN-XCOUT A-D converter Port P85 (10 bits X 8 channels Port P8 Timer Port P7 Internal peripheral functions 8 Note 1: ROM size depends on MCU type. Note 2: RAM size depends on MCU type. Note 3: One of three channels is used for UART and IIC mode only. Figure 1.1.2. Block diagram of M16C/62M (80-pin version) group (low voltage version) 3 Mitsubishi microcomputers Description M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Performance Outline Table 1.1.1 is a performance outline of M16C/62M (80-pin version) group (low voltage version). Table 1.1.1. Performance outline of M16C/62M (80-pin version) group (low voltage version) Item Performance Number of basic instructions 91 instructions Shortest instruction execution time 100ns(f(XIN)=10MHZ, VCC=2.7V to 3.6V) 142.9ns (f(XIN)=7MHZ, VCC=2.2V to 3.6V, with software onewait) Memory ROM (See the figure 1.1.3. ROM Expansion) capacity RAM 10K to 20K bytes I/O port P0 to P10 (except P85) 8 bits x 6, 7 bits x 2, 4 bits x 2 Input port P85 1 bit x 1 Multifunction TA0, TA3, TA4 16 bits x 3 (timer mode, internal/external event count, timer one-shot timer mode and pulse width measurement mode) TB0, TB2, TB3, TB4, TB5 16 bits x 5 (timer mode, internal/external event count and pulse period/pulse width measurement mode) TA1, TA2 16 bits x 2 (timer mode, internal event count and a trigger through one-shot timer mode occurs.) TB1 16 bits x 1 (timer mode and internal event count) Serial I/O UART0, UART1, UART2 (UART or clock synchronous) x 2, UART x 1(UART2) SI/O3, SI/O4 (Clock synchronous) x 2 (SI/O3 is output only) A-D converter 10 bits x (8 + 2) channels D-A converter 8 bits x 2 DMAC 2 channels (trigger: 24 sources) CRC calculation circuit CRC-CCITT Watchdog timer 15 bits x 1 (with prescaler) Interrupt 25 internal and 5 external sources, 4 software sources, 7 levels Clock generating circuit 2 built-in clock generation circuits (built-in feedback resistor, and external ceramic or quartz oscillator) Supply voltage 2.7V to 3.6V (f(XIN)=10MHZ, without software wait) 2.4V to 2.7V (f(XIN)= 7MHZ, without software wait) 2.2V to 2.4V (f(XIN)= 7MHZ, with software one-wait) Power consumption 28.5mW (f(XIN) = 10MHZ, VCC=3V with software one-wait) I/O I/O withstand voltage 3V characteristics Output current 1mA Device configuration CMOS high performance silicon gate Package 80-pin plastic mold QFP Note : M16C/62M (80-pin version) group (low voltage version) does not support memory expansion or microprocessor mode. 4 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Mitsubishi plans to release the following products in the M16C/62M (80-pin version) group (low voltage version): (1) Support for mask ROM version and flash memory version (2) ROM capacity (3) Package 80P6S-A : Plastic molded QFP (mask ROM and flash memory versions) ROM Size (Byte) External ROM 256K M30625MGM-XXXGP M30625FGMGP 128K M30621MCM-XXXGP M30621FCMGP 96K 80K 64K 32K Mask ROM version Flash memory version Figure 1.1.3. ROM expansion The M16C/62M (80-pin version) group (low voltage version) products currently supported are listed in Table 1.1.2. Table 1.1.2. M16C/62M (80-pin version) group (low voltage version) As of April 2002 Type No ROM capacity RAM capacity Package type M30621MCM-XXXGP 128 Kbytes 10 Kbytes 80P6S-A M30625MGM-XXXGP 256 Kbytes 20 Kbytes 80P6S-A M30621FCMGP 128 Kbytes 10 Kbytes 80P6S-A M30625FGMGP 256 Kbytes 20 Kbytes 80P6S-A Remarks mask ROM version Flash memory 3V version 5 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) Description Type No. SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER M30623 M C M– XXX GP Package type: GP : Package 80P6S-A ROM No. Omitted for flash memory version ROM capacity: C : 128K bytes G: 256K bytes Memory type: M : Mask ROM version F : Flash memory version Shows RAM capacity, pin count, etc (The value itself has no specific meaning) M16C/62 Group M16C Family Figure 1.1.4. Type No., memory size, and package 6 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER About the M16C/62M (80-pin version) group (low voltage version) The M16C/62M (80-pin version) group (low voltage version) is packaged in a 80-pin plastic mold package. The number of pins in comparison with the 100-pin package products is decreased. So be careful about the following. (a) The M16C/62M (80-pin version) group (low voltage version) supports single chip mode alone. It supports neither memory expansion mode nor microprocessor mode. (b) The input/output ports given below are absent from the M16C/62M (80-pin version) group (low voltage version). To stabilize the internal state, set to output mode the direction register of each input/output port. Failing in setting to output mode involves an increase in current consumption. <Pins absent from the 80-pin version> P10 to P17, P44 to P47, P72 to P75, P91 (c) INT3 to INT5 allocated to P15 to P17 cannot be used. Keep the INT3 interrupt control register disabled for interrupts. The INT4 interrupt control register and the INT5 interrupt control register are shared with SI/O3 and SI/O4. When the user don’t use them as SI/O3 and SI/4, set them disabled for interrupts. (d) The output pins of timers A1 and A2 - TA1IN, TA1OUT, TA2IN and TA2OUT - allocated to P72 to P75 cannot be used. In connection with this, the gate function and pulse outputting function of timers A1 and A2 cannot be used. Use timer mode and internal event count, or use as trigger signal generation in one-shot timer mode. ______ ______ (e) The UART2 input/output pins - CLK2 and CTS/RTS - allocated to P72 and P73 cannot be used. In connection with this, UART2 solely as UART of the internal clock can be used. (f) The input pin TB1IN of timer B1 allocated to P91 cannot be used. With timer B1 under this state, use only timer mode or the internal event count. (g) The input pin SIN3 of serial I/O3 allocated to P91 cannot be used. In connection with this, use serial I/O3 as a serial I/O exclusive to transmission. (h) The output pins for three-phase motor control allocated to P72 to P75 cannot be used. So set to 0 (ordinary mode) the mode select bit (bit 2) of three-phase PWM control register 0. 7 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) Electrical characteristics (Vcc = 3V) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Table 1.20.1. Absolute maximum ratings Parameter Symbol Vcc AVcc VI VO Pd Topr Tstg Supply voltage Analog supply voltage RESET, CNVSS (BYTE) Input P00 to P07, P20 to P27, voltage P30 to P37, P40 to P43, P50 to P57, P60 to P67, P76 to P77, P80 to P87, P90, P92 to P97, P100 to P107, VREF, XIN P70, P71 Output P00 to P07, P20 to P27, voltage P30 to P37,P40 to P43, P50 to P57, P60 to P67,P76 to P77, P80 to P84, P86, P87, P90, P92 to P97, P100 to P107, XOUT P70, P71 Power dissipation Operating ambient temperature Storage temperature Note: Specify a product of -40 to 85°C to use it. 8 Condition Rated value VCC=AVCC VCC=AVCC -0.3 to 4.6 Unit V -0.3 to 4.6 V -0.3 to Vcc+0.3 V -0.3 to 4.6 V -0.3 to Vcc+0.3 V -0.3 to 4.6 V 300 -20 to 85 / -40 to 85(Note) -65 to 150 mW C C Ta=25 C Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) Electrical characteristics (Vcc = 3V) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Table 1.20.2. Recommended operating conditions (referenced to VCC = 2.2V to 3.6V at Ta = – 20oC to 85oC / – 40oC to 85oC(Note3) unless otherwise specified) Symbol Parameter Min. 2.2 Vcc AVcc Vss Supply voltage Analog supply voltage Supply voltage AVss Analog supply voltage P00 to P07, P20 to P27, HIGH input P30 to P37, P40 to P43, P50 to P57, P60 to P67, voltage P76, P77, P80 to P87,P90, P92 to P97, P100 to P107, XIN, RESET, CNVSS (BYTE) VIH P70 , P71 I OH (peak) I OH (avg) I OL (peak) I OL (avg) f (XIN) P00 to P07, P20 to P27, P30 to P37, P40 to P43, P50 to P57, P60 to P67, P70, P71,P76, P77, P80 to P87, P90, P92 to P97, P100 to P107, XIN, RESET, CNVSS (BYTE) P00 to P07, P20 to P27,P30 to P37, HIGH peak output current P40 to P43, P50 to P57, P60 to P67, P76, P77, P80 to P84, P86, P87, P90, P92 to P97, P100 to P107 HIGH average output P00 to P07, P20 to P27, P30 to P37, current P40 to P43, P50 to P57, P60 to P67, P76, P77, P80 to P84, P86, P87, P90, P92 to P97, P100 to P107 P00 to P07, P20 to P27,P30 to P37, LOW peak output current P40 to P43, P50 to P57, P60 to P67, P70, P71, P76, P77 P80 to P84, P86, P87, P90, P92 to P97, P100 to P107 P00 to P07, P20 to P27,P30 to P37, LOW average output current P40 to P43, P50 to P57, P60 to P67, P70, P71, P76, P77 P80 to P84, P86, P87, P90, P92 to P97, P100 to P107 Main clock input oscillation frequency (Note 5) f (XcIN) Unit V V V V 0.8Vcc Vcc V 0.8Vcc 4.6 V 0 0.2Vcc V –10.0 mA –5.0 mA 10.0 mA 5.0 mA Vcc=2.7V to 3.6V 0 Vcc=2.4V to 2.7V 0 10 MHz 10 X Vcc MHz –17 17.5 X Vcc MHz –35 No wait with wait Max. 3.6 0 LOW input voltage VIL Standard Typ. 3.0 Vcc 0 Vcc=2.2V to 2.4V 0 Vcc=2.7V to 3.6V 0 Vcc=2.2V to 2.7V 0 Subclock oscillation frequency 32.768 10 6 X Vcc –6.2 MHz 50 kHz MHz Note 1: The mean output current is the mean value within 100ms. Note 2: The total IOL (peak) for all ports must be 80mA max. The total IOH (peak) for all ports must be 80mA max. Note 3: Specify a product of –40°C to 85°C to use it. Note 4: Relationship between main clock oscillation frequency and supply voltage. 10.0 7.0 AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA 10 X VCC –17MHZ 17.5 X VCC –35MHZ 3.5 0.0 2.2 2.4 2.7 Supply voltage[V] (BCLK: no division) 3.6 Main clock input oscillation frequency (With wait) Operating maximum frequency [MHZ] Operating maximum frequency [MHZ] Main clock input oscillation frequency (No wait) 10.0 7.0 0.0 AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA 6 X VCC –6.2MHZ 2.2 2.4 2.7 Flash memory version program voltage and read operation voltage characteristics Flash program voltage Flash read operation voltage VCC=2.7V to 3.6V VCC=2.4V to 3.6V VCC=2.7V to 3.4V VCC=2.2V to 2.4V 3.6 Supply voltage[V] (BCLK: no division) Note 5: Execute case without wait, program / erase of flash memory by VCC=2.7V to 3.6V and f(BCLK) ≤ 6.25 MHz. Execute case with wait, program / erase of flash memory by VCC=2.7V to 3.6V and f(BCLK) ≤ 10.0 MHz. 9 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) Electrical characteristics (Vcc = 3V) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V Table 1.20.3. A-D conversion characteristics (referenced to VCC = AVCC = VREF = 2.4V to 3.6V, VSS = AVSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC(Note2), f(XIN) = 10MHz unless otherwise specified) Symbol Parameter Resolution Absolute accuracy, sample & hold function not available (8 bit) VREF = VCC 10 10 ±2 40 9.8 VCC µs 0.3 2.4 VCC µs V 0 VREF V Ladder resistance VREF = VCC tCONV Conversion time(8bit), sample & hold function not available Sampling time Reference voltage Analog input voltage VREF = VCC = 3V, φAD = f(XIN) =fAD/2 = 5MHz VREF VIA Unit VREF = VCC = 3V, φAD = f(X IN)/2 R LADDER tSAMP Standard Min. Typ. Max Measuring condition Bits LSB kΩ Note 1: Connect AV CC pin to V CC pin and apply the same electric potential. Note 2: Specify a product of -40°C to 85°C to use it. Table 1.20.4. D-A conversion characteristics (referenced to VCC = 2.4V to 3.6V, VSS = AVSS = 0V, VREF = 3V, at Ta = – 20oC to 85oC / – 40oC to 85oC(Note2), f(XIN) = 10MHz unless otherwise specified) Symbol tsu RO IVREF Parameter Measuring condition Resolution Absolute accuracy Setup time Output resistance Reference power supply input current Min. 4 Standard Typ. Max. 10 (Note ) 8 1.0 3 20 1.5 Unit Bits % µs kΩ mA Note 1: This applies when using one D-A converter, with the D-A register for the unused D-A converter set to “0016”. The A-D converter's ladder resistance is not included. Also, when DA register contents are not “00”, the current I VREF always flows even though Vref may have been set to be unconnected by the A-D control register. Note 2: Specify a product of -40°C to 85°C to use it. Table 1.20.5. Flash memory version electrical characteristics (referenced to VCC = 2.7V to 3.6V, at Ta =0oC to 60oC unless otherwise specified) Parameter Min. Page program time Block erase time Erase all unlocked blocks time Lock bit program time Standard Typ. Max Unit 6 120 ms 50 600 ms 50 X n (Note) 600 X n (Note) ms 120 ms 6 Note : n denotes the number of block erases. Table 1.20.6. Flash memory version program voltage and read operation voltage characteristics (Ta =0oC to 60oC) 10 Flash program voltage Flash read operation voltage VCC=2.7V to 3.6V VCC=2.4V to 3.6V VCC=2.7V to 3.4V VCC=2.2V to 2.4V Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) Electrical characteristics (Vcc = 3V) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V Table 1.20.7. Electrical characteristics (referenced to VCC = 2.7V to 3.6V, VSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC(Note 1), f(XIN) = 10MHz without wait unless otherwise specified) Symbol VOH VOH Parameter Measuring condition P00 to P07, P20 to P27, P30 to P37, HIGH output P40 to P43, P50 to P57, P60 to P67, voltage P76, P77, P80 to P84, P86, P87, P90, P92 to P97, P100 to P107 HIGH output XOUT voltage HIGH output XCOUT voltage IOH=–1mA 2 .5 HIGHPOWER IOH=–0.1mA 2 .5 LOWPOWER IOH=–50µA 2 .5 HIGHPOWER LOWPOWER VOL P00 to P07, P20 to P27, P30 to P37, LOW output P40 to P43, P50 to P57, P60 to P67, P70, P71, P76, P77, P80 to P84, P86, voltage P87, P90, P92 to P97, P100 to P107 VOL LOW output XOUT voltage LOW output XCOUT voltage V 3 .0 1.6 V HIGHPOWER IOL=0.1mA 0 .5 LOWPOWER IOL=50µA 0 .5 HIGHPOWER With no load applied 0 LOWPOWER With no load applied 0 TA0IN, TA3IN, TA4IN, TB0IN, TB2IN to TB5IN, INT0 to INT2, ADTRG,CTS0,CTS1 CLK0,CLK1,CLK3, CLK4, TA3OUT, TA4OUT, NMI, KI0 to KI3, SIN4, RXD0 to RXD2 VT+-VT- Hysteresis RESET HIGH input current P00 to P07, P20 to P27, P30 to P37, P40 to P43, P50 to P57, P60 to P67, P70, P71, P76, P77, P80 to P87, P90, P92 to P97, P100 to P107, XIN, RESET, CNVss (BYTE) I IL Pull-up RPULLUP resistance Unit V 0 .5 Hysteresis LOW input current With no load applied With no load applied Standard Typ. Max. IOL=1mA VT+-VT- II H Min. V V V 0 .2 0 .8 V 0 .2 1 .8 V VI=3V 4 .0 µA P00 to P07, P20 to P27, P30 to P37, P40 to P43, P50 to P57, P60 to P67, P70, P71, P76, P77, P80 to P87, P90, P92 to P97, P100 to P107, XIN, RESET, CNVss (BYTE) VI=0V –4.0 µA P00 to P07, P20 to P27, P30 to P37, P40 to P43, P50 to P57, P60 to P67, P76, P77, P80 to P84, P86,P87, P90, P92 to P97, P100 to P107 VI=0V 20 75 300 KΩ RfXIN Feedback resistance XIN 3.0 MΩ RfXCIN Feedback resistance XCIN 10.0 MΩ VRAM RAM retention voltage Icc When clock is stopped The output pins Mask ROM version are open and other pins are Flash memory 3V VSS version f(XIN)=10MHz Mask ROM version Flash memory 3V version f(XCIN)=32kHz Flash memory 3V version Program f(XIN)=10MHz Flash memory 3V version Erase f(XIN)=10MHz Mask ROM version Flash memory 3V version f(XCIN)=32kHz Power supply current V 2 .0 Square wave, no division f(XIN)=10MHz Square wave, no division Square wave Square wave, division by 2 Square wave, division by 2 When a WAIT instruction is executed. Oscillation capacity High (Note2) 9.5 21.25 mA 12.0 21.25 mA 45.0 µA 14.0 mA 17.0 mA 2.8 µA 0.9 µA f(XCIN)=32kHz When a WAIT instruction is executed. Oscillation capacity Low (Note2) Ta=25°C when clock is stopped 1 .0 Ta=85°C when clock is stopped 20.0 µA Note 1: Specify a product of -40°C to 85°C to use it. Note 2: With one timer operated using fC32. 11 Mitsubishi microcomputers Electrical characteristics (Vcc = 3V) M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V Timing requirements (referenced to VCC = 3V, VSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC (*) unless otherwise specified) * : Specify a product of -40°C to 85°C to use it. Table 1.20.8. External clock input Symbol 12 Parameter tc External clock input cycle time tw(H) Standard Min. Max. Unit 100 ns External clock input HIGH pulse width 40 ns tw(L) External clock input LOW pulse width 40 ns tr External clock rise time 18 ns tf External clock fall time 18 ns Mitsubishi microcomputers Electrical characteristics (Vcc = 3V) M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V Timing requirements (referenced to VCC = 3V, VSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC (*) unless otherwise specified) * : Specify a product of -40°C to 85°C to use it. Table 1.20.9. Timer A input (counter input in event counter mode) Symbol Parameter Standard Min. Max. 150 Unit tc(TA) TAiIN input cycle time tw(TAH) TAiIN input HIGH pulse width 60 ns ns tw(TAL) TAiIN input LOW pulse width 60 ns Table 1.20.10. Timer A input (gating input in timer mode) Symbol Parameter Standard Min. Max. Unit tc(TA) TAiIN input cycle time 600 ns tw(TAH) TAiIN input HIGH pulse width 300 ns tw(TAL) TAiIN input LOW pulse width 300 ns Table 1.20.11. Timer A input (external trigger input in one-shot timer mode) Symbol Parameter Standard Min. Max. Unit tc(TA) TAiIN input cycle time 300 ns tw(TAH) TAiIN input HIGH pulse width 150 ns tw(TAL) TAiIN input LOW pulse width 150 ns Table 1.20.12. Timer A input (external trigger input in pulse width modulation mode) Symbol Parameter Standard Min. Max. Unit tw(TAH) TAiIN input HIGH pulse width 150 ns tw(TAL) TAiIN input LOW pulse width 150 ns Table 1.20.13. Timer A input (up/down input in event counter mode) tc(UP) TAiOUT input cycle time Standard Min. Max. 3000 tw(UPH) TAiOUT input HIGH pulse width 1500 tw(UPL) TAiOUT input LOW pulse width 1500 ns tsu(UP-TIN) TAiOUT input setup time 600 ns th(TIN-UP) TAiOUT input hold time 600 ns Symbol Parameter Unit ns ns 13 Mitsubishi microcomputers Electrical characteristics (Vcc = 3V) M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V Timing requirements (referenced to VCC = 3V, VSS = 0V at Ta = – 20oC to 85oC / – 40oC to 85oC (*) unless otherwise specified) * : Specify a product of -40°C to 85°C to use it. Table 1.20.14. Timer B input (counter input in event counter mode) Symbol Parameter Standard Min. Max. Unit tc(TB) TBiIN input cycle time (counted on one edge) tw(TBH) TBiIN input HIGH pulse width (counted on one edge) 60 ns ns tw(TBL) TBiIN input LOW pulse width (counted on one edge) 60 ns 150 tc(TB) TBiIN input cycle time (counted on both edges) 300 ns tw(TBH) TBiIN input HIGH pulse width (counted on both edges) 160 ns tw(TBL) TBiIN input LOW pulse width (counted on both edges) 160 ns Table 1.20.15. Timer B input (pulse period measurement mode) Symbol Parameter Standard Max. Unit tc(TB) TBiIN input cycle time Min. 600 tw(TBH) TBiIN input HIGH pulse width 300 ns tw(TBL) TBiIN input LOW pulse width 300 ns Standard Min. Max. Unit ns Table 1.20.16. Timer B input (pulse width measurement mode) Symbol Parameter tc(TB) TBiIN input cycle time 600 ns tw(TBH) TBiIN input HIGH pulse width 300 ns tw(TBL) TBiIN input LOW pulse width 300 ns Table 1.20.17. A-D trigger input Symbol Parameter tc(AD) ADTRG input cycle time (trigger able minimum) tw(ADL) ADTRG input LOW pulse width Standard Min. Max. Unit 1500 ns 200 ns Table 1.20.18. Serial I/O Symbol Parameter Standard Min. 300 tc(CK) CLKi input cycle time tw(CKH) CLKi input HIGH pulse width 150 tw(CKL) CLKi input LOW pulse width 150 td(C-Q) TxDi output delay time th(C-Q) TxDi hold time tsu(D-C) th(C-D) Max. Unit ns ns ns 160 ns 0 ns RxDi input setup time 50 ns RxDi input hold time 90 ns _______ Table 1.20.19. External interrupt INTi inputs Symbol 14 Parameter Standard tw(INH) INTi input HIGH pulse width Min. 380 tw(INL) INTi input LOW pulse width 380 Max. Unit ns ns Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) Electrical characteristics (Vcc = 3V) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V tc(TA) tw(TAH) TAiIN input tw(TAL) tc(UP) tw(UPH) TAiOUT input tw(UPL) TAiOUT input (Up/down input) During event counter mode TAiIN input th(TIN–UP) (When count on falling edge is selected) tsu(UP–TIN) TAiIN input (When count on rising edge is selected) tc(TB) tw(TBH) TBiIN input tw(TBL) tc(AD) tw(ADL) ADTRG input tc(CK) tw(CKH) CLKi tw(CKL) th(C–Q) TxDi td(C–Q) tsu(D–C) th(C–D) RxDi tw(INL) INTi input tw(INH) Figure 1.20.2. Vcc=3V timing diagram 15 Mitsubishi microcomputers Usage precaution M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Usage Precaution Timer A (timer mode) (1) Reading the timer Ai register while a count is in progress allows reading, with arbitrary timing, the value of the counter. Reading the timer Ai register with the reload timing gets “FFFF16”. Reading the timer Ai register after setting a value in the timer Ai register with a count halted but before the counter starts counting gets a proper value. Timer A (event counter mode) (1) Reading the timer Ai register while a count is in progress allows reading, with arbitrary timing, the value of the counter. Reading the timer Ai register with the reload timing gets “FFFF16” by underflow or “000016” by overflow. Reading the timer Ai register after setting a value in the timer Ai register with a count halted but before the counter starts counting gets a proper value. (2) When stop counting in free run type, set timer again. Timer A (one-shot timer mode) (1) Setting the count start flag to “0” while a count is in progress causes as follows: • The counter stops counting and a content of reload register is reloaded. • The TAiOUT pin outputs “L” level. • The interrupt request generated and the timer Ai interrupt request bit goes to “1”. (2) The timer Ai interrupt request bit goes to “1” if the timer's operation mode is set using any of the following procedures: • Selecting one-shot timer mode after reset. • Changing operation mode from timer mode to one-shot timer mode. • Changing operation mode from event counter mode to one-shot timer mode. Therefore, to use timer Ai interrupt (interrupt request bit), set timer Ai interrupt request bit to “0” after the above listed changes have been made. Timer A (pulse width modulation mode) (1) The timer Ai interrupt request bit becomes “1” if setting operation mode of the timer in compliance with any of the following procedures: • Selecting PWM mode after reset. • Changing operation mode from timer mode to PWM mode. • Changing operation mode from event counter mode to PWM mode. Therefore, to use timer Ai interrupt (interrupt request bit), set timer Ai interrupt request bit to “0” after the above listed changes have been made. (2) Setting the count start flag to “0” while PWM pulses are being output causes the counter to stop counting. If the TAiOUT pin is outputting an “H” level in this instance, the output level goes to “L”, and the timer Ai interrupt request bit goes to “1”. If the TAiOUT pin is outputting an “L” level in this instance, the level does not change, and the timer Ai interrupt request bit does not becomes “1”. Timer B (timer mode, event counter mode) (1) Reading the timer Bi register while a count is in progress allows reading , with arbitrary timing, the value of the counter. Reading the timer Bi register with the reload timing gets “FFFF16”. Reading the timer Bi register after setting a value in the timer Bi register with a count halted but before the counter starts counting gets a proper value. 16 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) Usage precaution SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Timer B (pulse period/pulse width measurement mode) (1) If changing the measurement mode select bit is set after a count is started, the timer Bi interrupt request bit goes to “1”. (2) When the first effective edge is input after a count is started, an indeterminate value is transferred to the reload register. At this time, timer Bi interrupt request is not generated. A-D Converter (1) Write to each bit (except bit 6) of A-D control register 0, to each bit of A-D control register 1, and to bit 0 of A-D control register 2 when A-D conversion is stopped (before a trigger occurs). In particular, when the Vref connection bit is changed from “0” to “1”, start A-D conversion after an elapse of 1 µs or longer. (2) When changing A-D operation mode, select analog input pin again. (3) Using one-shot mode or single sweep mode Read the correspondence A-D register after confirming A-D conversion is finished. (It is known by AD conversion interrupt request bit.) (4) Using repeat mode, repeat sweep mode 0 or repeat sweep mode 1 Use the undivided main clock as the internal CPU clock. Stop Mode and Wait Mode ____________ (1) When returning from stop mode by hardware reset, RESET pin must be set to “L” level until main clock oscillation is stabilized. (2) When switching to either wait mode or stop mode, instructions occupying four bytes either from the WAIT instruction or from the instruction that sets the every-clock stop bit to “1” within the instruction queue are prefetched and then the program stops. So put at least four NOPs in succession either to the WAIT instruction or to the instruction that sets the every-clock stop bit to “1”. Interrupts (1) Reading address 0000016 • When maskable interrupt is occurred, CPU read the interrupt information (the interrupt number and interrupt request level) in the interrupt sequence. The interrupt request bit of the certain interrupt written in address 0000016 will then be set to “0”. Reading address 0000016 by software sets enabled highest priority interrupt source request bit to “0”. Though the interrupt is generated, the interrupt routine may not be executed. Do not read address 0000016 by software. (2) Setting the stack pointer • The value of the stack pointer immediately after reset is initialized to 000016. Accepting an interrupt before setting a value in the stack pointer may become a factor of runaway. Be sure to set a value in the stack pointer before accepting an interrupt. _______ When using the NMI interrupt, initialize the stack point at the beginning of a program. Concerning _______ the first instruction immediately after reset, generating any interrupts including the NMI interrupt is prohibited. _______ (3) The NMI interrupt _______ _______ • The NMI interrupt can not be disabled. Be sure to connect NMI pin to Vcc via a pull-up resistor if unused. _______ • Do not get either into stop mode with the NMI pin set to “L”. 17 Mitsubishi microcomputers Usage precaution M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER (4) External interrupt _______ ________ • When the polarity of the INT0 to INT2 pins is changed, the interrupt request bit is sometimes set to "1". After changing the polarity, set the interrupt request bit to "0". (5) Rewrite the interrupt control register • To rewrite the interrupt control register, do so at a point that does not generate the interrupt request for that register. If there is possibility of the interrupt request occur, rewrite the interrupt control register after the interrupt is disabled. The program examples are described as follow: Example 1: INT_SWITCH1: FCLR I ; Disable interrupts. AND.B #00h, 0055h ; Clear TA0IC int. priority level and int. request bit. NOP NOP FSET I ; Enable interrupts. Example 2: INT_SWITCH2: FCLR I AND.B #00h, 0055h MOV.W MEM, R0 FSET I ; Disable interrupts. ; Clear TA0IC int. priority level and int. request bit. ; Dummy read. ; Enable interrupts. Example 3: INT_SWITCH3: PUSHC FLG FCLR I AND.B #00h, 0055h POPC FLG ; Push Flag register onto stack ; Disable interrupts. ; Clear TA0IC int. priority level and int. request bit. ; Enable interrupts. The reason why two NOP instructions or dummy read are inserted before FSET I in Examples 1 and 2 is to prevent the interrupt enable flag I from being set before the interrupt control register is rewritten due to effects of the instruction queue. • When a instruction to rewrite the interrupt control register is executed but the interrupt is disabled, the interrupt request bit is not set sometimes even if the interrupt request for that register has been generated. This will depend on the instruction. If this creates problems, use the below instructions to change the register. Instructions : AND, OR, BCLR, BSET Noise (1) Insert bypass capacitor between VCC and VSS pin for noise and latch up countermeasure. • Insert bypass capacitor (about 0.1 µF) and connect short and wide line between VCC and VSS lines. 18 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER GZZ-SH13-96B<02A0> Mask ROM number Date : Receipt MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30621MCM-XXXGP MASK ROM CONFIRMATION FORM Section head signature Supervisor signature Company name ❈ Customer Date issued TEL ( Issuance signature Note : Please complete all items marked ❈ . ) Date : Submitted by Supervisor ❈1. Check sheet Mitsubishi processes the mask files generated by the mask file generation utilities out of those held on the floppy disks you give in to us, and forms them into masks. Hence, we assume liability provided that there is any discrepancy between the contents of these mask files and the ROM data to be burned into products we produce. Check thoroughly the contents of the mask files you give in. Prepare 3.5 inches 2HD (IBM format) floppy disks. And store only one mask file in a floppy disk. Microcomputer type No. : M30621MCM-XXXGP File code : (hex) Mask file name : .MSK (alpha-numeric 8-digit) ❈2. Mark specification The mark specification differs according to the type of package. After entering the mark specification on the separate mark specification sheet (for each package), attach that sheet to this masking check sheet for submission to Mitsubishi. For the M30621MCM-XXXGP, submit the 80P6S mark specification sheet. ❈3. Usage Conditions For our reference when of testing our products, please reply to the following questions about the usage of the products you ordered. (1) Which kind of XIN-XOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(XIN) = MHZ 19 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER GZZ-SH13-96B<02A0> Mask ROM number MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30621MCM-XXXGP MASK ROM CONFIRMATION FORM (2) Which kind of XCIN-XCOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(XCIN) = kHZ (3) Which operating supply voltage do you use? (Circle the operating voltage range of use) 2.2 2.4 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 (V) (4) Which operating ambient temperature do you use? (Circle the operating temperature range of use) -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 (°C) (5) Do you use I2C (Inter IC) bus function? Not use Use (6) Do you use IE (Inter Equipment) bus function? Not use Use Thank you cooperation. ❈4. Special item (Indicate none if there is not specified item) 20 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER GZZ-SH13-49B<98A1> Mask ROM number Date : Receipt MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30625MGM-XXXGP MASK ROM CONFIRMATION FORM Section head signature Supervisor signature Company name ❈ Customer Date issued TEL ( Issuance signature Note : Please complete all items marked ❈ . ) Date : Submitted by Supervisor ❈1. Check sheet Mitsubishi processes the mask files generated by the mask file generation utilities out of those held on the floppy disks you give in to us, and forms them into masks. Hence, we assume liability provided that there is any discrepancy between the contents of these mask files and the ROM data to be burned into products we produce. Check thoroughly the contents of the mask files you give in. Prepare 3.5 inches 2HD (IBM format) floppy disks. And store only one mask file in a floppy disk. Microcomputer type No. : M30625MGM-XXXGP File code : (hex) Mask file name : .MSK (alpha-numeric 8-digit) ❈2. Mark specification The mark specification differs according to the type of package. After entering the mark specification on the separate mark specification sheet (for each package), attach that sheet to this masking check sheet for submission to Mitsubishi. For the M30625MGM-XXXGP, submit the 80P6S mark specification sheet. ❈3. Usage Conditions For our reference when of testing our products, please reply to the following questions about the usage of the products you ordered. (1) Which kind of XIN-XOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(XIN) = MHZ 21 Mitsubishi microcomputers M16C / 62M (80-pin version) Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER GZZ-SH13-49B<98A1> Mask ROM number MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30625MGM-XXXGP MASK ROM CONFIRMATION FORM (2) Which kind of XCIN-XCOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(XCIN) = kHZ (3) Which operating supply voltage do you use? (Circle the operating voltage range of use) 2.2 2.4 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 (V) (4) Which operating ambient temperature do you use? (Circle the operating temperature range of use) -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 (°C) (5) Do you use I2C (Inter IC) bus function? Not use Use (6) Do you use IE (Inter Equipment) bus function? Not use Use Thank you cooperation. ❈4. Special item (Indicate none if there is not specified item) 22 REVISION HISTORY Rev. M16C/62M(80-PIN VERSION) GROUP DATA SHEET Date Description Summary Page A1 02/04/02 5 Figure 1.1.3 is revised. Table 1.1.2 is revised. (1/1) HEAD OFFICE: 2-2-3, MARUNOUCHI, CHIYODA-KU, TOKYO 100-8310, JAPAN Keep safety first in your circuit designs! • Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. • These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer’s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.mitsubishichips.com). When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein. Notes regarding these materials • • • • • • • © 2002 MITSUBISHI ELECTRIC CORP. Printed in Japan (ROD) II New publication, effective Apr. 2002. Specifications subject to change without notice.