4 Pad Ceramic Package, 5 mm x 7 mm Product Features: ILCX04 Series Applications: Small SMD Package AT Cut Perfomance Compatible with Leadfree Processing Supplied in Tape and Reel Fibre Channel Server & Storage USB 802.11 / Wifi PC’s 7.0 4 3 1 2 5.0 Frequency 6 MHz to 150 MHz 1.30 Max. ESR (Equivalent Series Resistance) 6.0 MHz – 7.9 MHz 8.0 MHz – 9.9 MHz 10.0 MHz – 13.9 MHz 14.0 MHz – 19.9 MHz 20.0 MHz – 40.0 MHz rd 30.0 MHz – 150.0 MHz (3 O.T.) 1.2 100 Max. 60 Max. 50 Max. 40 Max. 30 Max. 80 Max. 1 2 4 3 1.0 2.54 5.08 Connection Diagram Shunt Capacitance (C0) 7 pF Max. Frequency Tolerance @ 25 C 30 ppm Standard (see Part Number Guide for options) Frequency Stability over Temperature 50 ppm Standard (see Part Number Guide for options) Crystal Cut AT Cut Load Capacitance 18 pF Standard (see Part Number Guide for more options) Drive Level 100 uW Max. Aging 5 ppm Max. / Year Standard 4 3 1 2 Recommended pad layout 2.2 1.4 2.54 6.4 Temperature Dimension Units: mm Operating 0 C to +70 C Standard (see Part Number Guide for more options) Storage -40 C to +85 C Standard Part Number Guide Package ILCX04 - Sample Part Number: ILCX04 - FB1F18 - 20.000 Tolerance (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range Mode (overtone) B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = Fundamental F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C 3 = 3rd overtone G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C I = ±15 ppm I = ±15 ppm** 5 = -40°C to +85°C J = ±10 ppm* J = ±10 ppm** Load Capacitance (pF) 18 pF Standard Or Specify 9 = -10°C to +50°C D = -10°C to +105°C* E = -40°C to +105°C* * Not available at all frequencies. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 04/10/12_D Specifications subject to change without notice Page 1 Frequency - 20.000 MHz 4 Pad Ceramic Package, 5 mm x 7 mm ILCX04 Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Frequency, Date Code ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 04/10/12_D Specifications subject to change without notice Page 2