ams AS1367-BTDT-12 150ma, adaptive low drop-out linear regulator Datasheet

Datasheet
AS1367
150mA, Adaptive Low Drop-Out Linear Regulator
1 General Description
2 Key Features
The AS1367 is a precise, low noise, high speed, low
dropout regulator with adaptive operation. Features
included are high ripple rejection and low dropout voltage, a reference voltage source, an error amplifier and a
current limiter.
!
Low Dropout Voltage: 110mV @ 150mA load
!
Operating Input Voltage Range: 2.0V to 5.5V
!
Output Voltage Range: 1.2V to 5.0V (50mV steps)
!
Max. Output Current: 150mA
The AS1367 provides high speed operation, low power
consumption and high efficiency by automatically
switching between a light load and a heavy load mode
depending upon the output current level.
!
Low Shutdown Current: 100nA
!
High PSRR: 60dB @ 10kHz
!
Integrated Overtemperature/Overcurrent Protection
!
Under-Voltage Lockout Feature
!
Chip Enable Input
!
Power-OK
!
Low Quiescent Current: 10µA
!
Low Output Noise: 15µV @ 100kHz Bandwidth
!
Operating Temperature Range: -40°C to +85°C
!
8-pin TDFN 2x2 Package
The EN function enables the output to be turned off,
while the electric charge at the output capacitor is
discharged via the internal auto-discharge resistance,
and as a result the VOUT pin quickly returns to the GND
level.
Furthermore a Bypass Pin is included to reduce noise.
The device features integrate short-circuit and over
current protection. Under-Voltage lockout prevents
erratic operation when the input voltage is slowly
decaying. Thermal Protection shuts down the device
when die temperature reaches 160°C. This is a useful
protection when the device is under sustained short
circuit conditions.
3 Applications
The AS1367 is ideal for cellular phones, cordless
phones, wireless communication equipment, portable
games, cameras, video recorders, portable audio-video
equipment and personal digital assistants.
The device is available in a 8-pin TDFN 2x2 package.
Figure 1. AS1367 - Typical Application Diagram
Input
2V to 5.5V
CIN
1µF
Output
1.2V to 5.0V
OUT
IN
AS1367
IN
COUT
3.3µF
RPU
100kΩ
POK
CBYP
10nF
ON /
OFF
www.austriamicrosystems.com
EN
BYP
GND
SET
Revision 1.02
1 - 14
AS1367
Datasheet - P i n A s s i g n m e n t s
4 Pin Assignments
Figure 2. Pin Assignments (Top View)
OUT 1
BYP 2
8 IN
AS1367
SET 3
EN 4
7 IN
6 POK
Exposed
Pad
5 GND
Pin Descriptions
Table 1. Pin Descriptions
Pin Name
OUT
BYP
SET
EN
GND
POK
IN
GND
Pin Number
Description
Regulated Output Voltage. The current flowing out of this pin is equivalent
to a DC load current. Fixed 1.2, 1.5, 1.8, 3.0, 3.3 and 4.5V output, as well as
1
versions from 1.2V up to 5.0V can be ordered.
Bypass this pin with 3.3µF to GND.
2
Bypass. This pin should be connected via a 10nF capacitor to pin OUT.
Set Input. Connect to GND for preset output. Connect to a resistive voltage3
divider between OUT and GND to set the output voltage between 1.2V and
5.0V.
Active-High Enable Input. A logic low reduces the supply current to < 1µA.
4
Connect this pin to pin IN for normal operation.
Ground. This pin also functions as a heat sink. Solder it to a large pad or to
5
the circuit-board ground plane to maximize power dissipation.
Power-OK Output. Active-low, open-drain output indicates an out-of6
regulation condition. Connect a 100kΩ pull-up resistor to pin OUT for logic
levels. Leave this pin unconnected if the Power-OK feature is not used.
Input Voltage. These pins should be connected to the positive terminal of
7, 8
the input capacitor. Bypass this pin with 1µF to GND. Input voltage can
range from 2.0V to 5.5V.
Exposed Pad. This pin also functions as a heat sink. Solder it to a large pad
Exposed Pad or to the circuit-board ground plane to maximize power dissipation. Internally
it is connected GND.
www.austriamicrosystems.com
Revision 1.02
2 - 14
AS1367
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
IN, POK to GND
-0.3
+7
V
OUT to GND
-0.3
VIN + 0.3
V
BYP to GND
-0.3
VOUT + 0.3
V
Output Short-Circuit Duration
Indefinite
300
mW
+85
ºC
+150
ºC
+140
ºC/W
+150
ºC
Continuous Power Dissipation
Operating Temperature Range
-40
Junction Temperature TJ
Thermal Resistance ΘJA
Storage Temperature Range
Package Body Temperature
www.austriamicrosystems.com
-65
Typ
Units
Comments
V
+260
Revision 1.02
ºC
Derate 7.1mW/ºC above +70ºC
Internally limited
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD020D “Moisture/Reflow Sensitivity
Classification for non-hermetic Solid
State Surface Mount Devices”
3 - 14
AS1367
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
VIN = VOUT(NOM) + 0.5V or VIN = 2V (whichever is greater) , EN = IN, CIN = 1µF, COUT = 3.3µF, CBYP = 10nF, TAMB = 40°C to +85ºC (unless otherwise specified). Typical values are at TAMB = +25ºC.
Table 3. Electrical Characteristics
Symbol
VIN
VOUT
ΔVOUT
IOUT
ILIM
VSET
ISET
IQ
Parameter
Input Voltage
Output Voltage
Trimmable in 50mV steps
TAMB = +25ºC, IOUT = 1mA, VOUT > 2V
IOUT = 100µA to 150mA, VOUT > 2V
Output Voltage Accuracy
TAMB = +25ºC, IOUT = 1mA, VOUT ≤ 2V
IOUT = 100µA to 150mA, VOUT ≤ 2V
Maximum Output Current
VOUT forced to GND
Current Limit
VOUT up to VIN, IOUT = 1mA
SET Threshold
SET
= 0V
SET Input Bias Current
IOUT = 0mA
IOUT = 100µA
Quiescent Current
IOUT = 150mA
VIN -VOUT
Dropout Voltage
ΔVLNR
ΔVLDR
PSRR
Shutdown
tON
IOFF
VIH
VIL
Conditions
1
Line Regulation
3.0V < VOUT, IOUT = 150mA
Typ
180
100
Max
5.5
5.0
1
2.5
20
50
10
10
15
150
100
16
20
30
110
200
Unit
V
V
%
mV
mA
mA
mV
nA
µA
mV
2 %/V
0.06
0.001 0.01 % / mA
VIN = (VOUT(NOM) + 0.5V) to 5.5V, IOUT = 1mA
0.02
IOUT = 100µA to 150mA
VIN = (VOUT(NOM) + 0.5V) to 5.5V within 10µs,
Dynamic Line Transient
IOUT = 1mA
Dynamic Load Transient IOUT = 1mA to 150mA within 10µs
Output Noise Voltage IOUT = 10mA, f = 100Hz to 100kHz
IOUT = 10mA, f = 1kHz
Output Voltage Power- IOUT = 10mA, f = 10kHz
Supply Rejection Ratio
IOUT = 10mA, f = 100kHz
17
12
15
75
60
52
mV
50
mV
µVRMS
dB
3
4
EN Exit Delay
Shutdown Supply
Current
IOUT = 0mA
EN = 0V
0.1
EN = 0V, IOUT = 0mA
IOUT = 0mA, VOUTRISING
IOUT = 0mA, VOUTFALLING
POK Output Low Voltage POK sinking 1mA, EN = 0V
POK Leakage Current VOUT in regulation
www.austriamicrosystems.com
µs
1
µA
0.4
Power-OK Voltage
Threshold
SET Threshold Voltage
Set Input Bias Current
500
1.4
Enable Input Threshold
Autodischarge
Resistance
Power-OK Output
VOL
IPOK
SET
VSET
ISET
50
-100
Load Regulation
RSHDN
VPOK
Min
2.0
1.2
-1
-2.5
-20
-50
150
VOUT to VIN
SET = 0V
94
3
1
50
-100
Revision 1.02
Ω
740
90
100
V
97.5
%
VOUT
0.3
100
V
nA
150
100
mV
nA
4 - 14
AS1367
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 3. Electrical Characteristics (Continued)
Symbol
Parameter
Thermal Protection
Thermal Shutdown
TSHDN
Temperature
Thermal
Shutdown
ΔTSHDN
Hysteresis
Conditions
Min
Typ
Max
Unit
160
ºC
20
ºC
1. Dropout voltage = VIN - VOUT when VOUT is 100mV < VOUT for VIN = VOUT(NOM) + 0.5V (applies only to nominal
output voltages ≥ 2.5V).
2. Guaranteed by design.
3. The rise and fall time of the shutdown signal must not exceed 1ms.
4. The delay time is defined as time required to set VOUT to 95% of its final nominal value.
Note: All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or
SQC (Statistical Quality Control) methods.
www.austriamicrosystems.com
Revision 1.02
5 - 14
AS1367
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
VOUT = 3.3V, IOUT = 10mA, TAMB = +25°C (unless otherwise specified);
Figure 4. Output Voltage vs. Input Voltage
3.38
3.5
3.36
3
3.34
Output Voltage (V)
Output Voltage (V)
Figure 3. Output Voltage vs. Output Current
3.32
3.3
3.28
3.26
2.5
2
1.5
1
0.5
3.24
0
3.22
0.1
1
10
100
1.5
1000
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Output Current (mA)
Figure 5. Output Voltage vs. Temperature
Figure 6. No Load Battery Current vs. Input Voltage
50
3.38
Battery Current (µA)
Output Voltage (V)
3.36
3.34
3.32
3.3
3.28
3.26
40
30
20
10
3.24
3.22
-40
0
-20
0
20
40
60
1.5
80
2
2.5
Temperature (°C)
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Figure 7. Quiescent Current vs. Output Current
Figure 8. Quiescent Current vs. Input Voltage
16
100
no l oad
l oad = 150mA
Quiescent Current (µA)
Quiescent Current (µA)
14
12
10
8
6
4
80
60
40
20
2
0
0
0.1
1
10
100
1000
Output Current (mA)
www.austriamicrosystems.com
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Revision 1.02
6 - 14
AS1367
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
Figure 9. PSRR vs. Frequency
100
90
PSRR (dB)
80
70
60
50
40
Iout = 100µA
Iout = 1mA
30
Iout = 10mA
20
100
1000
10000
100000
Frequency (Hz)
20mV/DIV
VIN
VOUT
20mV/DIV
VIN
500mV/Div
Figure 13. Line Transient Response;
VIN = 3.8V to 4.1V, IOUT = 100mA
200mV/Div
Figure 12. Line Transient Response;
VIN = 3.8V to 4.1V, IOUT = 100mA
VOUT
1V/DIV
EN
VOUT
EN
VOUT
1V/DIV
20µs/Div
100µs/Div
1ms/Div
www.austriamicrosystems.com
1V/Div
Figure 11. Startup; VIN = 3.8V, IOUT = 100mA
1V/Div
Figure 10. Startup; VIN = 3.8V, IOUT = 100mA
200µs/Div
Revision 1.02
7 - 14
AS1367
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
100mA/DIV
VOUT
IOUT
VOUT
IOUT
100mA/DIV
10µs/Div
200µs/Div
www.austriamicrosystems.com
20mV/Div
Figure 15. Load Transient Response;
VIN = 3.8V, IOUT = 1mA to 100mA
10mV/Div
Figure 14. Load Transient Response;
VIN = 3.8V, IOUT = 1mA to 100mA
Revision 1.02
8 - 14
AS1367
Datasheet - D e t a i l e d D e s c r i p t i o n
8 Detailed Description
The AS1367 is low-dropout, low-quiescent-current linear regulator intended for LDO regulator applications where
output current load requirements range from no load to 150mA. All devices come standard with adjustable output
voltages of 1.2V to 5.0V and fixed output voltages (see Ordering Information on page 13).
The AS1367 also features a Power-OK output to indicate when the output is within 6% of final value, and also an
Enable pin. Shutdown current for the whole regulator is typically 10nA. The device features integrated short-circuit and
over current protection. Under-Voltage lockout prevents erratic operation when the input voltage is slowly decaying
(e.g. in a battery powered application). Thermal Protection shuts down the device when die temperature reaches
160°C. This is a useful protection when the device is under sustained short circuit conditions.
As illustrated in Figure 16, the devices comprise a reference, error amplifier, P-channel MOSFET pass transistor,
Power-OK detect logic, internal voltage divider, current limiter, reverse-battery protection, thermal sensor and
shutdown logic.
The bandgap reference is connected to the inverting input of the error amplifier. The error amplifier compares this
reference with the feedback voltage and amplifies the difference. If the feedback voltage is lower than the reference
voltage, the P-channel MOSFET gate is pulled lower, allowing more current to pass to the output, and increases the
output voltage. If the feedback voltage is too high, the pass-transistor gate is pulled up, allowing less current to pass to
the output. The output voltage feeds back through an internal resistor voltage divider connected to pin OUT.
Figure 16. AS1367 - Block Diagram
IN
EN
AS1367
ReverseBattery
Protection
Thermal
Overload
Protection
Shutdown/
Power-On
Control Logic
Error
Amplifier
OUT
+
Bandgap Voltage
&
Current Reference
Trimmable
Reference
Voltage
POK
Power-OK
Compare
Logic
NMOS
GND
Output Voltages
Standard products are factory-set with output voltages from 1.2V to 5.0V. A two-digit suffix of the part number identifies
the nominal output (see Ordering Information on page 13). Non-standard devices are available. For more information
contact: http://www.austriamicrosystems.com/contact-us
www.austriamicrosystems.com
Revision 1.02
9 - 14
AS1367
Datasheet - D e t a i l e d D e s c r i p t i o n
Power-OK
The AS1367’s power-ok is built around an N-channel MOSFET. The circuitry monitors the voltage on pin SET and if the
voltage goes out of regulation (e.g. during dropout, current limit, or thermal shutdown) the pin POK goes low. If the pin
SET is connected to GND an internal resistive-divider is activated and connected to the output. Therefore, the PowerOK functionality can be realised with no additional external components.
The Power-OK feature is not active during shutdown and provides a power-on-reset function that can operate down to
VIN = 2.0V. A capacitor to GND may be added to generate a power-on-reset delay. To obtain a logic-level output,
connect a pull-up resistor from pin POK to pin OUT. Larger values for this resistor will help to minimize current
consumption; a 100kΩ resistor is perfect for most applications (see Figure 1 on page 1).
Current Limiting
The AS1367 include current limiting circuitry to protect against short-circuit conditions. The circuitry monitors and
controls the gate voltage of the P-channel MOSFET, typically limiting the output current to 180mA. The P-channel
MOSFET output can be shorted to ground for an indefinite period of time without damaging the device.
Thermal-Overload Protection
The devices are protected against thermal runaway conditions by the integrated thermal sensor circuitry. Thermal
shutdown is an effective tool to prevent die overheating since the power transistor is the principle heat source in the
device.
If the junction temperature exceeds 160ºC with 20ºC hysteresis, the thermal sensor starts the shutdown logic, at which
point the P-channel MOSFET is switched off. After the device temperature has dropped by approximately 20ºC, the
thermal sensor will turn the P-channel MOSFET on again. Note that this will be exhibited as a pulsed output under
continuous thermal-overload conditions.
Note: The absolute maximum junction-temperature of +150ºC should not be exceeding during continual operation.
Operating Region and Power Dissipation
Maximum power dissipation is determined by the thermal resistance of the package and circuit board, the temperature
difference between the die junction and the ambient air and the rate of the air flow. The power dissipation of the device
is calculated by:
P = I OUT × ( V IN – V OUT )
(EQ 1)
T J – T AMB
P MAX = ------------------------θ JA
(EQ 2)
Maximum power dissipation is calculated by:
Where:
TJ - TAMB is the temperature difference between the device die junction and the surrounding air.
θJA is the thermal resistance through the circuit board, copper traces, and other materials to the surrounding.
Note: Pin GND is a multi-function pin providing a connection to the system ground and acting as a heat sink. This pin
should be connected to the system ground using a large pad or a ground plane.
www.austriamicrosystems.com
Revision 1.02
10 - 14
AS1367
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9 Application Information
Capacitor Selection and Regulator Stability
Ceramic capacitors are highly recommended as they offer distinct advantages over their tantalum and aluminum
electrolytic components. For stable operation with load currents up to the maximum over the entire device temperature
range, use a 3.3µF (min) ceramic output capacitor with an ESR <0.2Ω. Use large output capacitor values (10µF max)
to reduce noise and improve load transient-response, stability and power-supply rejection.
Note: Some ceramic capacitors exhibit large capacitance and ESR variations with variations in temperature. Z5U
and Y5V capacitors may be required to ensure stability at temperatures below TAMB = -10ºC. With X7R or X5R
capacitors, a 3.3µF capacitor should be sufficient at all operating temperatures.
Power Supply Rejection Ratio
The AS1367 are designed to deliver low dropout voltages and low quiescent currents. Power-supply rejection is
typically 60dB at 10kHz. To improve power supply-noise rejection and transient response, increase the values of the
input and output bypass capacitors.
The Electrical Characteristics on page 4 show also the device line- and load-transient responses. For further details
see the Power-Supply Rejection Ratio vs. Frequency graph in the Figure 9 on page 7.
Dropout Voltage
For standard products with output voltage greater than the minimum VIN (1.2V), the minimum input-output voltage
differential (dropout voltage) determines the lowest usable supply voltage. This determines the useful end-of-life
battery voltage in battery-powered systems. The dropout voltage is a function of the P-MOSFET drain-to-source onresistance multiplied by the load current, and it is calculated by:
V DROPOUT = V IN – V OUT = R DS ( ON ) × I OUT
(EQ 3)
Where:
RDS(ON) is the drain-to-source on-resistance.
IOUT is the output current.
Figure 17. Application Diagrams
External Voltage Level Detection
Internal Voltage Level Detection
(Input Monitoring)
(Output Monitoring)
Input
2V to 5.5V
Output
1.2V to 5.0V
OUT
IN
CIN
1µF
AS1367
IN
ON /
OFF
RADJ
RPU
100kΩ
COUT
3.3µF
Input
2V to 5.5V
Output
1.2V to 5.0V
OUT
IN
CIN
1µF
AS1367
POK
IN
EN
BYP
GND
SET
COUT
3.3µF
POK
CBYP
10nF
ON /
OFF
RPU
100kΩ
CBYP
10nF
EN
BYP
GND
SET
270kΩ
www.austriamicrosystems.com
Revision 1.02
11 - 14
AS1367
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
The device is available in a 8-pin TDFN package.
Figure 18. 8-pin TDFN 2x2 Package Diagram
D
A
e
b
L
B
bbb
C A B
PIN#1 ID
INDEX AREA
2x
TOP VIEW
k
(D/2xE/2)
aaa C
INDEX AREA
aaa C
2x
E
E2
(D/2xE/2)
D2
A1
A
A3
BOTTOM VIEW
ccc C
C
SEATING
PLANE
0.08 C
SIDE VIEW
Table 4. 8-pin TDFN 2x2 package Dimensions
Symbol
Min
Typ
A
0.51
0.55
A1
0.00
0.02
A3
0.15 REF
0.18
0.25
b
0.50
e
aaa
0.15
bbb
0.10
ccc
0.10
Max
0.60
0.05
0.30
Symbol
D BSC
E BSC
D2
E2
L
k
ND
N
Min
1.45
0.75
0.225
0.20
Typ
2.00
2.00
1.60
0.90
0.325
Max
1.70
1.00
0.425
4
8
Note:
1.
2.
3.
4.
5.
Figure 18 is shown for illustration only.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
All dimensions are in millimeters, angle is in degrees (°).
N is the total number of terminals.
The location of the terminal #1 identifier and terminal numbering convention conforms to JEDEC publication 95
SPP-002.
6. ND and NE refer to the number of terminals on each D and E side respectively.
7. Dimension b applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal
tip. If the terminal has the optional radius on the other end of the terminal, the dimension B should not be measured in that radius area.
8. Coplanarity applies to the terminals and all other bottom surface metallization.
www.austriamicrosystems.com
Revision 1.02
12 - 14
AS1367
Datasheet - O r d e r i n g I n f o r m a t i o n
11 Ordering Information
The device is available as the standard products listed in Table 5.
Table 5. Ordering Information
Ordering Code
AS1367-BTDT-12
Marking
AB
AS1367-BTDT-18
AC
AS1367-BTDT-30
AS1367-BTDT-33
AS1367-BTDT-45
Output
1.2V
Description
150mA, Adaptive LDO
Delivery Form
Tape and Reel
Package
8-pin TDFN 2x2
1.8V
150mA, Adaptive LDO
Tape and Reel
8-pin TDFN 2x2
AD
3.0V
150mA, Adaptive LDO
Tape and Reel
8-pin TDFN 2x2
AE
3.3V
150mA, Adaptive LDO
Tape and Reel
8-pin TDFN 2x2
AF
4.5V
150mA, Adaptive LDO
Tape and Reel
8-pin TDFN 2x2
Non-standard devices from 1.2V to 5.0V are available in 50mV steps. For more information and inquiries contact
http://www.austriamicrosystems.com/contact
Note: All products are RoHS compliant and Pb-free.
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect
For further information and requests, please contact us mailto:[email protected]
or find your local distributor at http://www.austriamicrosystems.com/distributor
www.austriamicrosystems.com
Revision 1.02
13 - 14
AS1367
Datasheet
Copyrights
Copyright © 1997-2009, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe.
Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing
in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding
the information set forth herein or regarding the freedom of the described devices from patent infringement.
austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice.
Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for
current information. This product is intended for use in normal commercial applications. Applications requiring
extended temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional processing by
austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show
deviations from the standard production flow, such as test flow or test location.
The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,
austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to
personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the
technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of
austriamicrosystems AG rendering of technical or other services.
Contact Information
Headquarters
austriamicrosystems AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten, Austria
Tel: +43 (0) 3136 500 0
Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
http://www.austriamicrosystems.com/contact
www.austriamicrosystems.com
Revision 1.02
14 - 14