BU9795AKS2 Datasheet Standard LCD Segment Drivers BU9795Axxx Series MAX 140 segments (SEG35×COM4) ●Features Integrated RAM for display data (DDRAM) : 35 × 4bit (Max 140 Segment) LCD drive output : 4 Common output, Max 35Segment output Integrated Buffer AMP for LCD driving Integrated Oscillator circuit No external components Low power consumption design ●Key Specifications ■ Supply Voltage Range: +2.5V to +5.5V ■ Operating Temperature Range: -40°C to +85°C ■ Max Segments: BU9795AKV 140 Segments BU9795AFV 108 Segments BU9795AGUW 124 Segments BU9795AKS2 140 Segments ■ Display Duty: 1/4 ■ Bias: 1/2, 1/3 selectable ■ Interface: 3wire serial interface ●Applications Telephone FAX Portable equipment (POS, ECR, PDA etc.) DSC DVC Car audio Home electrical appliance Meter equipment etc. W (Typ.) x D (Typ.) x H (Max.) ●Packages VQFP48C 9.00mm x 9.00mm x 1.60mm VBGA048W040 4.00mm x 4.00mm x 0.90mm SSOP-B40 SQFP-T52M 13.60mm x 7.80mm x 2.00mm 12.00mm x 12.00mm x 1.40mm ●Typical Application Circuit VDD COM0 COM1 COM2 COM3 VDD VLCD INHb CSB SD SCL Controller OSCIN TEST VSS ・・・ ・・・・ SEG0 SEG1 Segment LCD SEG34 Using Internal oscillator Figure 1. ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 Typical application circuit ○This product is not designed protection against radioactive rays. 1/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Block Diagrams / Pin Configurations / Pin Descriptions Common driver SEG24 25 SEG25 SEG26 SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 36 LCD voltage generator SEG33 SEG0 … SEG34 COM0 COM0…… COM3 VDD SEG34 BU9795AKV Segment driver 37 ＋ LCD BIAS SELECTOR VLCD INHb SEG17 CSB SEG16 SCL SEG15 SD SEG14 TEST SEG13 INHb Serial inter face SEG12 13 48 CSB SD SEG11 SEG10 SEG9 SEG0 TEST 12 1 IF FILTER VSS SEG8 Power On Reset SEG18 OSCIN SEG7 OSCILLATOR SEG19 VSS SEG6 OSCIN Command Data Decoder SEG20 VDD SEG5 Command register SEG21 VLCD SEG4 － DDRAM SEG22 COM3 SEG3 ＋ Blink timing generator COM2 SEG2 Common counter 24 SEG23 SEG1 － COM1 SCL Figure 2. Block Diagram Figure 3. Pin Configuration (TOP VIEW) Table 1 Pin Description Pin name Pin No. I/O INHb 48 I TEST 47 I OSCIN 43 I SD 46 I serial data input SCL 45 I serial data transfer clock CSB 44 I Chip select VSS 42 GND VDD 41 Power supply VLCD 40 Power supply for LCD driving SEG0 to 34 1 to 35 O SEGMENT output for LCD driving COM0 to 3 36 to 39 O COMMON output for LCD driving www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Function Input terminal for turn off display H : turn on display L : turn off display Test input (ROHM use only) Must be connect to VSS External clock input External clock and Internal clock can be selected by command. Must be connect to VSS when use internal oscillation circuit. : ”L” active 2/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Block Diagrams / Pin Configurations / Pin Descriptions - continued BU9795AFV COM0…… COM3 SEG0 … SEG30 VDD LCD voltage generator Common driver Segment driver COM1 COM0 SEG30 SEG29 SEG28 SEG24 SEG25 SEG26 SEG27 COM2 SEG22 SEG23 VLCD COM3 VDD SEG19 SEG21 VSS SEG18 SEG20 CSB OSCIN SEG17 SEG15 SEG16 SDA SCL SEG14 INHb TEST SEG4 SEG12 SEG13 SEG5 SEG11 Blink timing generator SEG10 － SEG7 Common counter ＋ SEG6 LCD BIAS SELECTOR SEG9 － SEG8 ＋ DDRAM VLCD INHb Command register OSCIN OSCILLATOR Power On Reset Command Data Decoder Serial inter face IF FILTER VSS TEST CSB SD SCL Figure 4. Block Diagram Figure 5. Pin Configuration (TOP VIEW) Table 2 Pin Description Pin name Pin No. I/O INHb 36 I TEST 35 I OSCIN 31 I SD 34 I serial data input SCL 33 I serial data transfer clock CSB 32 I Chip select VSS 30 GND VDD 29 Power supply VLCD 28 I Power supply for LCD driving SEG4 to 30 1 to 23, 37 to 40 O SEGMENT output for LCD driving COM0 to 3 24 to 27 O COMMON output for LCD driving www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Function Input terminal for turn off display H : turn on display L : turn off display Test input (ROHM use only) Must be connect to VSS External clock input Ex clock and Int clock can be changed by command. Must be connect to VSS when use internal oscillation circuit. : ”L” active 3/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Block Diagrams / Pin Configurations / Pin Descriptions - continued BU9795AGUW COM0…… COM3 VDD LCD voltage generator 1 2 3 4 5 6 7 G (NC) SEG13 SEG15 SEG18 SEG20 SEG22 (NC) F SEG11 SEG12 SEG16 SEG17 SEG21 SEG23 SEG24 E SEG9 SEG10 SEG14 SEG19 SEG25 SEG27 SEG26 D SEG7 SEG6 SEG8 SEG5 SEG30 SEG28 SEG29 C SEG4 SEG3 SEG2 CSB COM3 SEG32 SEG31 INHb SD VSS VDD COM1 COM0 TEST2 SCL OSCIN VLCD COM2 (NC) SEG0 … SEG32 Common driver Segment driver ＋ － LCD BIAS SELECTOR Common counter ＋ － Blink timing generator DDRAM VLCD INHb Command register OSCIN OSCILLATOR Command Data Decoder B Power On Reset Serial inter face A IF FILTER (NC) VSS TEST CSB SD SCL Figure 6. Block Diagram Figure 7. Pin Configuration (BOTTOM VIEW) Table 3 Pin Description Pin name I/O Function INHb I TEST I OSCIN I SD I serial data input SCL I serial data transfer clock CSB I Chip select Input terminal for turn off display H : turn on display L : turn off display Test input (ROHM use only) Must be connect to VSS External clock input Ex clock and Int clock can be changed by command. Must be connect to VSS when use internal oscillation circuit. VSS GND VDD Power supply : ”L” active VLCD I Power supply for LCD driving SEG2 to 32 O SEGMENT output for LCD driving COM0 to 3 O COMMON output for LCD driving www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Block Diagrams / Pin Configurations / Pin Descriptions – continued BU9795AKS2 SEG14 SEG13 NC SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 NC SEG21 SEG0 … SEG34 SEG22 SEG23 COM0…… COM3 39 VDD 27 40 LCD voltage generator Common driver Segment driver ＋ － 26 SEG24 SEG12 SEG25 SEG11 SEG26 SEG10 SEG27 SEG9 SEG28 SEG8 SEG29 SEG7 SEG30 SEG6 SEG31 SEG5 SEG32 SEG4 SEG33 SEG3 SEG34 SEG2 COM0 SEG1 LCD BIAS SELECTOR Common counter ＋ － Blink timing generator DDRAM VLCD INHb Command register OSCIN Command Data Decoder COM1 OSCILLATOR Power On Reset Serial inter face SEG0 14 52 13 1 INHB TEST SDA NC CSB SCL VSS OSCIN VLCD VDD NC COM3 COM2 IF FILTER VSS TEST CSB SD SCL Figure 8. ブロック図 Figure 9. 端子配置図 (TOP VIEW) Table 1 端子説明 端子名 端子番号 I/O 機 能 Input terminal for turn off display H : turn on display L : turn off display Test input (ROHM use only) Must be connect to VSS INHb 13 I TEST 12 I OSCIN 7 I External clock input Ex clock and Int clock can be changed by command. Must be connect to VSS when use internal oscillation circuit. SD 10 I serial data input SCL 9 I serial data transfer clock CSB 8 I Chip select VSS 6 GND VDD 5 Power supply VLCD 4 Power supply for LCD driving SEG0-34 COM0-3 14-28, 30-36 38-50 51-52, 1-2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 : ”L” active O SEGMENT output for LCD driving O COMMON output for LCD driving 5/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Absolute Maximum Ratings (VSS=0V) Parameter Symbol Ratings Unit Remark Power supply voltage1 VDD -0.5 to +7.0 V Power supply Power supply voltage2 VLCD -0.5 to VDD V LCD drive voltage 0.6 W 0.7 W 0.27 W 0.85 W Allowable loss Pd Input voltage range VIN -0.5 to VDD+0.5 V Operational temperature range Topr -40 to +85 ℃ Storage temperature range Tstg -55 to +125 ℃ ●Recommended Operating Ratings(Ta=-40°C to +85°C,VSS=0V) Ratings Parameter Symbol Min. Typ. When use more than Ta=25℃, subtract 6mW per degree.(BU9795AKV) (Package only) When use more than Ta=25℃, subtract 7mW per degree (BU9795AFV) (Package only) When use more than Ta=25°C, subtract 2.7mW per degree (BU9795AGUW) (Package only) When use more than Ta=25°C, subtract 8.5mW per degree (BU9795AKS2) (Package only) Max. Unit Remark Power Supply voltage1 VDD 2.5 - 5.5 V Power supply Power Supply voltage2 VLCD 0 - VDD -2.4 V LCD drive voltage * Please use VDD-VLCD≥2.4V condition. ●Electrical Characteristics DC Characteristics (VDD=2.5V to 5.5V, VSS=0V, Ta=-40°C to +85°C, unless otherwise specified) Limits Parameter Symbol Unit Conditions MIN TYP MAX “H” level input voltage VIH 0.7VDD - VDD V “L” level input voltage VIL VSS - 0.3VDD V “H” level input current IIH - - 1 µA “L” level input current IIL -1 - - µA SEG RON - 3.5 - kΩ COM RON - 3.5 - kΩ VLCD 0 - VDD -2.4 V VDD-VLCD≥2.5V Ist - - 5 µA Display off, Oscillator off Power consumption 1 IDD1 - 12.5 30 µA Power consumption 2 IDD2 - 20 40 µA LCD Driver on resistance VLCD supply voltage Standby current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/37 Iload=±10µA VDD=3.3V, Ta=25°C, Power save mode1, FR=70Hz 1/3 bias, Frame inverse VDD=3.3V, Ta=25°C, Normal mode, FR=80Hz 1/3 bias, Line inverse TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Electrical Characteristics - continued Oscillation Characteristics (VDD=2.5V to 5.5V,VSS=0V, Ta=-40°C to +85°C) Limits Parameter Symbol Unit MIN TYP MAX Conditions Frame frequency fCLK 56 80 104 Hz FR = 80Hz setting Frame frequency1 fCLK1 70 80 90 Hz VDD=3.5V, 25°C MPU interface Characteristics(VDD=2.5V to 5.5V,VSS=0V, Ta=-40°C to +85°C) Limits Parameter Symbol Unit MIN TYP MAX Input rise time tr - - 80 ns Input fall time tf - - 80 ns SCL cycle time tSCYC 400 - - ns “H” SCL pulse width tSHW 100 - - ns “L” SCL pulse width tSLW 100 - - ns SD setup time tSDS 20 - - ns SD hold time tSDH 50 - - ns CSB setup time tCSS 50 - - ns CSB hold time tCSH 50 - - ns “H” CSB pulse width tCHW 50 - - ns Conditions tCHW CSB tf tCSS tr tSCYC tCSH tSLW tSHW SCL tSDS tSDH SD Figure 10. Interface Timing ●I/O equivalent circuit VDD VDD VLCD TEST VSS VSS VDD VDD CSB, SD, SCL OSCIN VSS VSS VDD VDD INHb VSS VSS Figure 11. I/O equivalent circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Example of recommended circuit <BU9795AKV/BU9795AKS2> VDD COM0 COM1 COM2 COM3 VDD VLCD INHb CSB SD SCL Controller OSCIN TEST VSS ・・・ ・・・・ SEG0 SEG1 Segment LCD SEG34 Using Internal oscillator VDD VDD VLCD Controller COM0 COM1 COM2 COM3 INHb CSB SD SCL Segment OSCIN TEST VSS LCD ・・・ ・・・ SEG0 SEG1 SEG34 Using external oscillator Figure 12. BU9795AKV/BU9795AKS2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/37 E.g. of recommended circuit TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Example of recommended circuit - continued <BU9795AFV> VDD VDD VLCD COM0 COM1 COM2 COM3 INHb CSB SD SCL Segment LCD SEG4 SEG5 ･ ･ ･ ･ ･ ･ Controller OSCIN TEST VSS SEG30 Using Internal oscillator VDD VDD VLCD INHb CSB SD SCL SEG4 SEG5 Segment LCD ･ ･ ･ ･ ･ ･ Controller COM0 COM1 COM2 COM3 OSCIN TEST VSS SEG30 Using external oscillator Figure 13. BU9795AFV www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 E.g. of recommended circuit 9/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Example of recommended circuit- continued <BU9795AGUW> VDD VDD VLCD COM0 COM1 COM2 COM3 INHb CSB SD SCL Segment LCD SEG SEG ･ ･ ･ ･ ･ ･ OSCIN TEST VSS ･ ･ ･ ･ ･ ･ Controller SEG32 Using Internal oscillator VDD VDD VLCD INHb CSB SD SCL Segment LCD SEG2 SEG3 ･ ･ ･ ･ ･ ･ OSCIN TEST VSS ･ ･ ･ ･ ･ ･ Controller COM0 COM1 COM2 COM3 SEG32 Using external oscillator Figure14. BU9795AGUW www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 E.g. of recommended circuit 10/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Function Description ○Command and data transfer method ○3-SPI (3wire Serial interface) This device is controlled by 3-wire signal (CSB, SCL, and SD). First, Interface counter is initialized with CSB=“H", and CSB=“L” makes SD and SCL input enable. The protocol of 3-SPI transfer is as follows. Each command starts with Command or Data judgment bit (D/C) as MSB data, and continuously in order of D6 to D0 are followed after CSB =“L”. (Internal data is latched at the rising edge of SCL, it converted to 8bits parallel data at the falling edge of 8th CLK.) Command/Data Command CSB SCL SD D/C D6 D5 D4 D/C = “H” : Command D3 D2 D1 D0 D/C D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D/C = “L” : Data Figure 15. 3-SPI Command/Data transfer format ○Command transfer method After CSB=“H”→”L”, 1st byte is always a command input. MSB of the command input data will be judged that the next byte data is a command or display data (This bit calls “command or data judgment bit”). When set “command or data judge bit”=‘1’, next byte will be (continuously) command. When set “command or data judge bit”=‘0’, next byte data is display data. 1 Command 1 Command Display Data 0 Command 1 Command … Once it becomes display data transfer condition, it will not be back to command input condition even if D/C=1. So if you want to send command data again, please set CSB=“L”→”H”. (CSB “L”→”H” will cancel data transfer condition.) Command transfer is done by 8bits unit, so if CSB=“L”→”H” with less than 8bits data transfer, command will be cancelled. It will be able to transfer command with CSB=“L” again. In Case Of Command Transfer Command Command CSB SCL SD STATUS 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 DISCTL Command Transfer Command Cancelled (Less Than 8bits) DISPON Command Transfer Figure 16. Command transfer format www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ○Write display data and transfer method <BU9795AKV/BU9795AKS2> This LSI has Display Data RAM (DDRAM) of 35×4=140bit. The relationship between data input and display data, DDRAM data and address are as follows. Command 0000000 a b c d e f g h i j k l m n o p … Display Data 8 bit data will be stored in DDRAM. The address to be written is the address specified by ADSET command, and the address is automatically incremented in every 4bit data. Data can be continuously written in DDRAM by transmitting Data continuously. (When RAM data is written successively after writing RAM data to 22h (SEG34), the address is returned to 00h (SEG0) by the auto-increment function. BIT 00h 01h 0 a 1 b 2 c 3 DDRAM address 06h 07h ・・・・・・・ 1Eh 02h 03h 04h 05h 1Fh 20h 21h 22h e i m q u COM0 f j n r v COM1 g k o s x COM2 d h l p t y SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG ・・・・・・・ 0 1 2 3 4 5 6 7 30 31 32 33 34 COM3 As data transfer to DDRAM happens every 4bit data, it will be cancelled if it changes CSB=“L”→”H” before 4bits data transfer. Command RAM write CSB SCL SD Address set D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Internal signal RAM write Address00h Address01h Address02h RAM write (Every 4bit data) Command Write data will be canceled, when CSB='H' Without 4bit data transfer. RAM write CSB SCL SD Address set D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Internal signal RAM write Address00h Address21h Address22h Address00h Return to address "0" by automatically increment. Figure 17. BU9795AKV/BU9795AKS2 Data Transfer Format www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) <BU9795AFV> This LSI has Display Data RAM (DDRAM) of 27×4=108bit. As SEG0, SEG1, SEG2, SEG3, SEG31, SEG32, SEG33, SEG34 are not output, these address will be dummy address. The relationship between data input and display data, DDRAM data and address are as follows. Command 0000000 a b c d e f g h i j k l m n o p q r Dummy data s t u v x y … Display Data 8 bit data will be stored in DDRAM. The address to be written is the address specified by ADSET command, and the address is automatically incremented in every 4bit data. Data can be continuously written in DDRAM by transmitting Data continuously. (When RAM data is written successively after writing RAM data to 22h (SEG34), the address is returned to 00h (SEG0) by the auto-increment function. Dummy data BIT DDRAM address 05h 06h 07h ・・・・・・・ 1Eh Dummy data 00h 01h 02h 03h 04h 0 a e i m q u COM0 1 b f j n r v COM1 2 c g k o s x COM2 3 1Fh 20h 21h 22h d h l p t y COM3 SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG ・・・・・・・ 0 1 2 3 4 5 6 7 30 31 32 33 34 As data transfer to DDRAM happens every 4bit data, it will be cancelled if it changes CSB=“L”→”H” before 4bits data transfer. Command RAM write CSB SCL SD Address set D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Internal signal RAM write Address00h Address01h Address02h RAM write (Every 4bit data) Command Write data will be canceled, when CSB='H' without 4bit data transfer. RAM write CSB SCL SD Address set D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Internal signal RAM write Address00h Figure 18. BU9795AFV www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Address21h Address22h Address00h Return to address "0" by automatically increment. Data Transfer Format 13/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) <BU9795AGUW> This LSI has Display Data RAM (DDRAM) of 31×4=124bit. As SEG0, SEG1, SEG33, SEG34 are not output, these address will be dummy address. The relationship between data input and display data, DDRAM data and address are as follows. Command 0000000 a b c d e f g h i j k l m n Dummy data o p q r s t u v x y … Display Data 8 bit data will be stored in DDRAM. The address to be written is the address specified by ADSET command, and the address is automatically incremented in every 4bit data. Data can be continuously written in DDRAM by transmitting Data continuously. (When RAM data is written successively after writing RAM data to 22h (SEG34), the address is returned to 00h (SEG0) by the auto-increment function. Dummy data Dummy data DDRAM address 00h 01h 02h 03h 04h 05h 06h 07h ・・・・・・・ 1Eh 1Fh 20h 21h 22h BIT 0 a e i m q u COM0 1 b f j n r v COM1 c g k o s x COM2 2 3 d h l p t y COM3 SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG ・・・・・・・ 0 1 2 3 4 5 6 7 30 31 32 33 34 As data transfer to DDRAM happens every 4bit data, it will be cancelled if it changes CSB=“L”→”H” before 4bits data transfer. Command RAM write CSB SCL SD Address set D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Internal signal RAM write Address00h Address01h Address02h RAM write (Every 4bit data) Write data will be canceled, when CSB='H' without 4bit data transfer. RAM write Command CSB SCL SD Address set D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Internal signal RAM write Address00h Figure 19. BU9795AGUW www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/37 Address21h Address22h Address00h Return to address "0" by automatically increment. Data Transfer Format TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ○OSCILLATOR Several kinds of clock for logic and analog circuit are generated from internal oscillation circuit or external clock. This device has internal oscillator circuit. When you use internal oscillation circuit, please connect OSCIN to VSS. *When you use external clock, execute ICSET command and connect OSCIN to external clock. OSCIN BU9795AKV /FV/GUW/KS2 VSS OSCIN BU9795AKV /FV/GUW/KS2 VSS Figure 20. Using internal oscillator circuit Clock input Figure 21. Using external clock ○LCD Driver Bias Circuit This LSI generates LCD driving voltage with on-chip Buffer AMP. And it can drive LCD at low power consumption. *1/3 and 1/2Bias can be set in MODESET command. *Line and frame inversion can be set in DISCTL command. Refer to “LCD driving waveform” about each LCD driving waveform. ○Blink timing generator This device has Blinking function. *This LSI is able to set blink mode with BLKCTL command. Blink frequency varies widely by characteristic of fCLK, when internal oscillation circuit. About the characteristics of fCLK, refer to Oscillation Characteristics. ○Reset (initial) condition Initial condition after execute SOFTWARE RESET is as follows. ・Display is OFF. ・DDRAM address is initialized (DDRAM Data is not initialized). Refer to Command Description about initialize value of register. ●Command / Function List Description List of Command / Function No. Command Function 1 Mode Set (MODESET) Set LCD drive mode 2 Address Set (ADSET) Set LCD display mode 1 3 Display Control (DISCTL) Set LCD display mode 2 4 Set IC Operation (ICSET) Set IC operation 5 Blink Control (BLKCTL) Set blink mode 6 All Pixel Control (APCTL) Set pixel condition www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Detailed Command Description D7 (MSB) is bit for command or data judgment. Refer to Command and data transfer method. C : 0 : Next byte is RAM write data. C : 1 : Next byte is command. ○Mode Set (MODE SET) MSB LSB D7 D6 D5 D4 D3 D2 D1 D0 C 1 0 * P3 P2 * * Set display ON and OFF Setting P3 Reset initialize condition Display OFF(DISPOFF) 0 ○ (* : Don’t care) Display ON(DISPON) 1 Display OFF : Regardless of DDRAM data, all SEGMENT and COMMON output will be stopped after 1 frame off data write. Display OFF mode will be finished by Display ON. Display ON : SEGMENT and COMMON output will be active and start to read the display data from DDRAM. (Note) It is not synchronize with display frame, when it will be controlled display ON/OFF with INHb terminal. Set bias level Setting P2 Reset initialize condition 1/3 Bias 0 ○ 1/2 Bias 1 Refer to LCD driving waveform. ○Address set (ADSET) MSB D7 C D6 0 D5 0 LSB D4 P4 D3 P3 D2 P2 D1 P1 D0 P0 Address data is specified in P[4 : 0] and P2 (ICSET command) as follows. MSB LSB Internal register Address [5] Address [4] ・・・ Address [0] Bit of each command ICSET [P2] ADSET [P4] ・・・ ADSET [P0] The address is 00h in reset condition. The valid address is 00h to 22h. Another address is invalid, (otherwise address will be set to 00h.) P2 of ICSET command is only to define either MSB of address is “1” or “0”. Address counter will be set only when ADSET command is executed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) CSB COMMAND ADSET”00010” RAM Write RAM Write RAM Write DISCTL RAM Write ・・・・・ RAM Write RAM Write ・・・ RAM Write Internal Signal ICSET P2 Internal Signal Address 000010 000011 000100 100010 ・・・ 000000 000001 000010 Set address by ADSET command. P2(ICSET command) is refer to set address. Address will be set "000010", because P2(ICSET)="0". When RAM data is continuously transmitted, address will be increment automatically. When write at 22h address, address will be return to 00h automatically. 000011 000100 000101 Because of no setting ADSET command, it will be kept the previous address. It will be start to write RAM data from maintained address. The following address that write at the end is maintained. CSB COMMAND ADSET ”11111” RAM Write RAM Write RAM Write RAM Write ・・・・・ ADSET”00000”RAM Write RAM Write ・・・ RAM Write Internal Signal ICSET P2 Internal Signal Address 011111 100000 100001 100010 000000 000001 000010 000011 000000 Set address by ADSET command. P2(ICSET command) is refer to set address. Address will be set "011111", because P2(ICSET)="0". 000001 000010 000011 New address will be set by ADSET command. When RAM data is continuously transmitted,The following address that write at the end is maintained. address will be increment automatically. When write at 22h address, address will be return to 00h automatically. CSB COMMAND ICSET P2=1 ADSET ”00000” RAM Write RAM Write RAM Write ・・・・・ ADSET”00000” RAM Write RAM Write ・・・ RAM Write Internal Signal ICSET P2 Internal Signal Address 100000 100001 100010 000000 000001 000010 000011 Set address by ADSET command. P2(ICSET command) is refer to set address. Address will be set "100000", because P2(ICSET)="1". It will be set P2="1" by ICSET command. (ICSET command cannot set address) 100000 100001 100010 000000 New address will be set by ADSET command. Address will be set "100000", because P2(ICSET)="1". (P2(ICSET) will maintain the previous address until ICSET command input. When RAM data is continuously transmitted, address will be increment automatically. The following address that write at the end is maintained. When write at 22h address, address will be return to 00h automatically. CSB COMMAND ICSET P2=1 ADSET ”00000” RAM Write RAM Write RAM Write ・・・・・ ICSET P2=0 RAM Write RAM Write ・・・ RAM Write Internal Signal ICSET P2 Internal Signal Address 100000 100001 100010 000000 ・・・・・ 100000 100001 Set address by ADSET command. P2(ICSET command) is refer to set address. 100010 000000 000001 It is written to RAM continuously from the previous address. The address maintain the previous address When RAM data is continuously transmitted, because it doesn't input the ADSET command address will be increment automatically. though ICSET P2="0" setting. When write at 22h address, address will be return to 00h automatically. The following address that write at the end is maintained. Figure 22. Address Set sequence www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ○Display control (DISCTL) MSB D7 D6 D5 D4 C 0 1 P4 Set Frame frequency Setting D3 P3 D2 P2 LSB D0 P0 D1 P1 P4 P3 Reset initialize condition 80Hz 0 0 ○ 71Hz 0 1 64Hz 1 0 53Hz 1 1 * About the characteristics of FR, refer to Oscillation characteristics. Set LCD drive waveform Setting P2 Reset initialize condition Line inversion 0 ○ Frame inversion 1 Set Power save mode Setting P1 P0 Power save mode 1 0 0 Power save mode 2 0 1 Normal mode 1 0 High power mode 1 1 Reset initialize condition ○ *VDD-VLCD≥3.0V is required for High power mode. (Reference current consumption data) Setting Reset initialize condition Power save mode 1 ×0.5 Power save mode 2 ×0.67 Normal mode ×1.0 High power mode ×1.8 *Above current consumption data is reference value. It depends on panel load. (Note) Frame rate FR / LCD drive waveform / Power save mode SR will effect display image. Select the best value in point of current consumption and display image using LCD panel (under real application). Screen flicker Display image / contrast Frame frequency Mode ○ - LCD drive waveform ○ ○ - ○ Power save mode www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ○Set IC Operation (ICSET) MSB D7 D6 D5 D4 C 1 1 0 D3 1 D2 P2 LSB D0 P0 D1 P1 P2 : MSB data of DDRAM address. Please refer to “ADSET” command. Setting P2 Reset initialize condition Address MSB’0’ 0 Address MSB’1’ 1 ○ Set Software Reset condition Setting P1 No operation 0 Software Reset 1 When “Software Reset” is executed, this LSI will be reset to initial condition. If software reset is executed, the value of P2 and P1 will be ignored and they will be set initialized condition. (Refer to “Reset initial condition”) Switch between internal clock and external clock. Setting P0 Reset initialize condition Internal clock 0 ○ External clock input 1 For internal clock : OSCIN is connected to VSS. For external clock input : Input external clock into OSCIN. <external Clock Frame frequency calculation> DISCTL 80Hz select : Frame frequency [Hz] = external clock[Hz] / 512 DISCTL 71Hz select : Frame frequency [Hz] = external clock[Hz] / 576 DISCTL 64Hz select : Frame frequency [Hz] = external clock[Hz] / 648 DISCTL 53Hz select : Frame frequency [Hz] = external clock[Hz] / 768 Command OSCIN_EN (Internal signal) ICSET Internal clock mode External clock mode Internal oscillation (Internal signal) External clock (OSCIN) Figure 23. OSCMODE switching timing www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series ○Blink control (BLKCTL) MSB D7 D6 D5 C 1 1 MAX 140 segments (SEG35×COM4) D4 1 Set blink condition Setting (Hz) D3 0 P1 D2 * Reset initialize condition ○ 0 0 0.5 0 1 1 1 0 2 1 1 ○All pixel control (APCTL) MSB D7 D6 D5 D4 C 1 1 1 D3 1 All display set ON. OFF Setting P1 Normal 0 All pixel ON 1 Setting LSB D0 P0 D1 P1 P0 OFF D2 1 Datasheet LSB D0 P0 D1 P1 Reset initialize condition ○ P0 Reset initialize condition Normal 0 ○ All pixel OFF 1 All pixels ON : All pixels are ON regardless of DDRAM data. All pixels OFF : All pixels are OFF regardless of DDRAM data. (Note) All pixels ON/OFF is effective only at the time of “Display ON” status. The data of DDRAM do not change with this command. If both P1 and P0=‘1’, APOFF is selected. APOFF has higher priority than APON. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●LCD driving waveform (1/3bias) Line inversion Frame inversion SEGn SEGn+1 SEGn+2 SEGn+3 SEGn SEG n+1 SEGn+2 SEGn+3 COM0 stateA COM0 stateA COM1 stateB COM1 stateB COM2 COM2 COM3 COM3 VDD 1frame 1frame VDD COM0 COM0 VLCD VDD VLCD VDD COM1 COM1 VLCD VDD VLCD VDD COM2 COM2 VLCD VDD VLCD VDD COM3 COM3 VLCD VLCD VDD VDD SEGn SEGn VLCD VDD VLCD VDD SEGn+1 SEGn+1 VLCD VDD VLCD VDD SEGn+2 SEGn+2 VLCD VDD VLCD VDD SEGn+3 SEGn+3 VLCD VLCD stateA (COM0-SEGn) stateB (COM1-SEGn) Figure 24. Line inversion waveform(1/3bias) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 stateA (COM0-SEGn) stateB (COM1-SEGn) Figure 25. Frame inversion waveform(1/3bias) 21/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) (1/2bias) Line inversion Frame inversion SEGn SEGn+1 SEGn+2 SEGn+3 SEGn SEGn+1 SEGn+2 SEGn+3 COM0 stateA COM0 stateA COM1 stateB COM1 stateB COM2 COM2 COM3 COM3 VDD 1frame 1frame VDD COM0 COM0 VLCD VLCD VDD VDD COM1 COM1 VLCD VLCD VDD VDD COM2 COM2 VLCD VLCD VDD VDD COM3 COM3 VLCD VLCD VDD VDD SEGn SEGn VLCD VLCD VDD VDD SEGn+1 SEGn+1 VLCD VLCD VDD VDD SEGn+2 SEGn+2 VLCD VLCD VDD VDD SEGn+3 SEGn+3 VLCD VLCD stateA stateA (COM0-SEGn) (COM0-SEGn) stateB stateB (COM1-SEGn) (COM1-SEGn) Figure 26. Line inversion waveform(1/2bias) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 27. Frame inversion waveform(1/2bias) 22/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Example of display data If LCD layout pattern is shown as in Figure ,Figure as in Figure . and DDRAM data is shown as in Table1, display pattern will be shown COM0 COM1 COM2 COM3 Figure 28. E.g. COM line pattern SEG1 SEG3 SEG2 SEG5 SEG7 SEG4 SEG6 SEG8 SEG9 SEG10 Figure 29. E.g. SEG line pattern Figure 30. E.g. Display pattern Table DDRAM Data map S S S E E E G G G 0 1 2 S E G 3 S E G 4 S E G 5 S E G 6 S E G 7 S E G 8 S E G 9 S E G 10 S E G 11 S E G 12 S E G 13 S E G 14 S E G 15 S E G 16 S E G 17 S E G 18 S E G 19 COM0 D0 0 1 1 0 1 1 1 1 0 1 0 0 0 0 0 0 0 0 0 0 COM1 D1 0 0 1 1 1 0 0 1 1 1 1 0 0 0 0 0 0 0 0 0 COM2 D2 0 0 0 1 0 1 0 0 1 0 1 0 0 0 0 0 0 0 0 0 COM3 D3 0 0 1 1 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 Address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Initialize sequence Please follow sequence below after Power-On to set this device to initial condition. Power on ↓ CSB ’H’ …I/F initialize condition ↓ CSB ’L’ …I/F Data transfer start ↓ Execute Software Reset by sending ICSET command * Each register value and DDRAM address, DDRAM data are random condition after power on till initialize sequence is executed. ●Start sequence ○Start sequence example1 No. Input 1 D7 D6 D5 D4 D3 D2 D1 D0 Power on Descriptions VDD=0 to 5V (Tr=0.1ms) ↓ 2 wait 100us Initialize IC ↓ 3 CSB ’H’ Initialize I/F data ’L’ I/F Data transfer start ↓ 4 CSB ↓ 5 ICSET 6 BLKCTL 1 1 1 0 1 * 1 0 Software Reset 1 1 1 1 0 * 0 1 1 0 1 0 0 1 1 0 1 1 1 0 1 0 0 0 RAM address MSB set 0 0 0 0 0 0 0 0 RAM address set ↓ ↓ 7 DISCTL ↓ 8 ICSET 9 ADSET 10 Display Data * * * * * * * * address 00h to 01h Display Data * * * * * * * * address 02h to 03h * * * * * * * * address ↓ ↓ … … Display Data 22h to 00h ↓ 11 CSB ‘H’ 12 CSB ‘L’ I/F Data transfer stop ↓ I/F Data transfer start ↓ 13 MODESET 1 1 0 * 1 0 * * Display ON ↓ 14 CSB ‘H’ www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 I/F Data transfer stop 24/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ○Start sequence example2 Initialize Initialize Sequence DISPON DISPON Sequence RAM write RAM write Sequence DISPOFF DISPOFF Sequence This LSI is initialized with Initialize Sequence. And start to display with DISPON Sequence. This LSI will update display data with RAM write Sequence. And stop the display with DISPOFF sequence. If you want to restart to display, This LSI will restart to display with DISPON Sequence. Initialize sequence Input Power on wait 100us CSB 'H' CSB 'L' ICSET MODESET ADSET Display Data … CSB 'H' DATA Description D7 D6 D5 D4 D3 D2 D1 D0 IC initialized I/F initialized 1 1 1 0 1 0 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 * * * * * * * * Software Reset Display OFF RAM address set Display data Dispon sequence Input CSB 'L' DISCTL BLKCTL APCTL MODESET CSB 'H' DATA Description D7 D6 D5 D4 D3 D2 D1 D0 1 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 1 1 0 0 1 1 0 0 1 0 0 0 Display Control BLKCTL APCTL Display ON RAM write sequence Input CSB 'L' DISCTL BLKCTL APCTL MODESET ADSET Display Data … DATA Description D7 D6 D5 D4 D3 D2 D1 D0 1 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 1 1 0 0 1 1 0 0 1 0 0 0 0 0 0 0 0 0 0 0 * * * * * * * * Display Control BLKCTL APCTL Display ON RAM address set Display data CSB 'H' Dispoff sequence Input CSB 'L' MODESET CSB 'H' www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 DATA D7 D6 D5 D4 D3 D2 D1 D0 1 1 0 0 0 0 0 0 25/37 Description Display OFF TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Example of start sequence START Reduce operating current or enhance display quality Display quality Please select Frame rate from 80Hz,71Hz,64Hz,53Hz according to LCD panel characteristic. Line inversion. Power save mode= High Power mode DISCTL setup value "101**011" Operating current Operating current decreases in order of 80Hz>71Hz>64Hz>53Hz. Frame inversion. Power save mode= Power save mode1 Screen Flicker? DISCTL setup value "101**100" OK Please select Frame rate from 80Hz,71Hz,64Hz,53Hz according to LCD panel characteristic. Frame inversion. Power save mode= Power save mode1 DISCTL setup value "101**100" NG Operating current decreases in order of 80Hz>71Hz>64Hz>53Hz. Frame inversion. Power save mode= Power save mode2 Screen Flicker? DISCTL setup value "101**101" OK Please select Frame rate from 80Hz,71Hz,64Hz,53Hz according to LCD panel characteristic. Frame inversion. Power save mode= Power save mode2 DISCTL setup value "101**101" NG Operating current decreases in order of 80Hz>71Hz>64Hz>53Hz. Frame inversion. Power save mode= Normal mode Screen Flicker? DISCTL setup value "101**110" OK Please select Frame rate from 80Hz,71Hz,64Hz,53Hz according to LCD panel characteristic. Frame inversion. Power save mode= Normal mode DISCTL setup value "101**110" NG Operating current decreases in order of 80Hz>71Hz>64Hz>53Hz. Frame inversion. Power save mode= High Power mode www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 DISCTL setup value "101**111" 26/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Cautions of Power-On condition This LSI has “P.O.R” (Power-On Reset) circuit and Software Reset function. Please keep the following recommended Power-On conditions in order to power up properly. Please set power up conditions to meet the recommended tR, tF, tOFF, and Vbot spec below in order to ensure P.O.R operation. VDD tF tR tOFF Recommended condition of tR,tF,tOFF,Vbot tR Less than 1ms Vbot tF Less than 1ms tOFF More than 150ms Vbot Less than 0.1V Figure 31. Power on-off waveform If it is difficult to meet above conditions, execute the following sequence after Power-On. Because it doesn’t accept the command in power off, it is necessary to care that correspondence by software reset doesn’t become alternative to POR function completely. (1) CSB=“L”→”H” condition VDD CSB Figure 32. CSB Timing (2) After CSB”H”→”L”, execute Software Reset (ICSET command). www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 27/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Cautions on application In case, BU9795AKV/BU9795AFV/BU9795AGUW/BU9795AKS2 used at VLCD≠VSS, voltage gap occur between SEG line to COM1–3 line at Display off state. Because of this voltage gap, there is possibility to display LCD for a moment. To avoid this phenomenon, please decide VDD and VLCD level to satisfy Voff voltage lower than OFF level (OFF level = 1V at the example explained below). condition ： VDD=5.0V VLCD=2.0V 1/3bias DDRAM data ALL "H" Frame inversion In case, VLCD voltage different from VSS level（VLCD≠VSS) In this case, volatage gap occur, between SEG line to COM 1-3 line. Because of this gap, there is possibility to display LCD for a moment. 1Frame Send "Display off" command VDD (5V) Output VLCD level at display off （All SEG terminal） SEG0 Output VLCD (2V) VLCD-VSS=2V VSS COM0 Output VDD (5V) Output VLCD level at display off （Only COM0 terminal） VLCD (2V) VLCD-VSS=2V VSS COM1 Output VDD (5V) VLCD (2V) Output VSS level at display off (at COM 1-3 terminal) VLCD-VSS=2V VSS Display on Voltage gap of COM0-SEG0 Display off 3V 2V the volatage between COM0 to SEG0 is 0V at display off. 1V 0V -1V -2V -3V Display off Display on Voltage gap of COM1-SEG0 3V 2V ON level the volatage between COM1 to SEG0 is -2V at display off. 1V OFF level 0V -1V Voff -2V -3V Voltage gap occur between COM1 to SEG0 at display off. So, there is possibility to display LCD. （Only at COM 1-3 line） www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 28/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series MAX 140 segments (SEG35×COM4) Datasheet ●Operational Notes (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, or the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 29/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series MAX 140 segments (SEG35×COM4) Datasheet ●Operational Notes - continued (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) No Connecting input terminals In terms of extremely high impedance of CMOS gate, to open the input terminals causes unstable state. And unstable state brings the inside gate voltage of p-channel or n-channel transistor into active. As a result, battery current may increase. And unstable state can also causes unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connected to the power supply or GND line. (13) Rush current When power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current may flow instantaneously. Therefore, give special condition to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 30/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Ordering Information B U 9 7 9 5 Part Number A x x - Package KV FV GUW KS2 ●Lineup Segment output x Common output : VQFP48C : SSOP-B40 : VBGA048W040 : SQFP-T52M xx Packaging and forming specification E2: Embossed tape and reel (VQFP48C/ SSOP-B40/ VBGA048W040/ SQFP-T52M) Package Orderable Part Number 35 VQFP48C Reel of 1500 BU9795AKV-E2 27 SSOP-B40 Reel of 2000 BU9795AFV-E2 VBGA048W040 Reel of 2500 BU9795AGUW-E2 Reel of 1000 BU9795AKS2-E2 Tray of 1000 BU9795AKS2 31 4 35 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SQFP-T52M 31/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series MAX 140 segments (SEG35×COM4) Datasheet ●Physical Dimension Tape and Reel Information Package Name VQFP48C 1PIN MARK <Tape and Reel information> Tape Embossed carrier tape Quantity 1500pcs Direction of feed E2 direction is the 1pin of product is at the upper left when you hold ( The ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ∗ Order quantity needs to be multiple of the minimum quantity. 32/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Physical Dimension, Tape and Reel Information – continued Package Name SSOP-B40 (Max 13.95 (include. BURR) <Tape and Reel information> Tape Embossed carrier tape Quantity 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 33/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Physical Dimension, Tape and Reel Information – continued Package Name VBGA048W040 <Tape and Reel information> Tape Embossed carrier tape (with dry pack) Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 34/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series MAX 140 segments (SEG35×COM4) Datasheet ●Physical Dimension, Tape and Reel Information – continued Package Name SQFP-T52M <Tape and Reel information> Container Tray (with dry pack) Quantity 1000pcs Direction of feed Direction of product is fixed in a tray 1pin ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Tape Embossed carrier tape Quantity 1000pcs Direction of feed E2 direction is the 1pin of product is at the upper left when you hold ( The ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 35/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series Datasheet MAX 140 segments (SEG35×COM4) ●Marking Diagrams SSOP-B40 (TOP VIEW) VQFP48C (TOP VIEW) Part Number Marking Part Number Marking BU9795A BU9795AFV LOT Number 1PIN MARK 1PIN MARK VBGA048W040 (TOP VIEW) 1PIN MARK SQFP-T52M (TOP VIEW) Part Number Marking Part Number Marking 9795A LOT Number BU9795AKS2 LOT Number LOT Number 1PIN MARK Part Number Package Part Number Marking BU9795AKV VQFP48C BU9795A BU9795AFV SSOP-B40 BU9795AFV BU9795AGUW VBGA048W040 9795A BU9795AKS2 SQFP-T52M BU9795AKS2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 36/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 BU9795Axxx Series MAX 140 segments (SEG35×COM4) Datasheet ●Revision History Date Revision 1.Jun.2012 12.July.2012 001 002 Changes New Release Add BU9795AKS2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 37/37 TSZ02201-0A0A2D300020-1-2 12.July.2012 Rev.002 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.