AMIC A23L83161-70 256k x 16 / 512k x 8 bit cmos mask rom Datasheet

A23L8316/A23L83161 Series
Preliminary
256K X 16 / 512K X 8 BIT CMOS MASK ROM
Document Title
256K X 16 / 512K X 8 BIT CMOS MASK ROM
Revision History
Rev. No.
0.0
PRELIMINARY
History
Issue Date
Remark
Initial issue
July 28, 2004
Preliminary
(July, 2004, Version 0.0)
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Preliminary
512K X 16 / 1M X 8 BIT CMOS MASK ROM
Features
All inputs and outputs are directly TTL-compatible
Flash memory pinout compatible with AMD
(A23L83161)
Available in 40-pin SOP, 32-pin PLCC 48-pin TSOP
(forward, reverse type and flash memory’s pinouts
compatible) packages
256K x 16 bit or 512K x 8 bit organization
Supply voltage range: 2.7V~3.6V
Access time: 70ns (max.)/3.0V~3.6V
100ns (max.)/2.7V~3.6V
Current: Operating: 20mA (typ.)/3.3V
Standby:
10µA (typ.)/3.3V
Three-state outputs for wired-OR expansion
Full static operation
Pin Configurations
28
O7
O14
27
26
O6
16
17
25
O13
24
O5
O10
O3
18
23
19
22
O12
O4
O11
20
21
VCC
O1
O9
O2
A18
VCC
NC
A17
1
32
31
30
6
A13
A5
7
27
A8
A4
8
26
A9
A23L8308
A3
9
25
A11
A2
10
24
OE
A1
11
23
A10
A0
12
22
CE
O0
13
21
O7
20
14
15
GND
O15/A-1
BYTE
A6
19
12
13
30
29
A14
28
O6
OE
O0
O8
A16
29
O5
10
11
32
31
5
18
CE
GND
A14
A15
A7
O4
9
A13
17
33
A1
A0
A11
A12
O3
8
A2
A16
35
34
A15
6
7
2
36
A4
A3
3
5
A5
A9
A10
16
38
37
15
3
4
GND
A6
A8
O2
40
39
14
2
O1
1
A7
A23L8316M
A17
A12
PLCC
4
SOP
TSOP (forward type)
BYTE
A16
A15
A14
A13
A12
A11
A10
A9
A8
NC
GND
NC
NC
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE
PRELIMINARY
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
(July, 2004, Version 0.0)
A23L8316V
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
GND
GND
O15/A-1
O7
O14
O6
O13
O5
O12
O4
VCC
VCC
NC
O11
O3
O10
O2
O9
O1
O8
O0
OE
GND
GND
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Pin Configurations (continued)
TSOP (reverse type)
GND
GND
O15/A-1
O7
O14
O6
O13
O5
O12
O4
VCC
VCC
NC
O11
O3
O10
O2
O9
O1
O8
O0
OE
GND
GND
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A23L8316R
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
BYTE
A16
A15
A14
A13
A12
A11
A10
A9
A8
NC
GND
NC
NC
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE
GND
O15/A-1
O7
O14
O6
O13
O5
O12
O4
VCC
O11
O3
O10
O2
O9
O1
O8
O0
OE
GND
CE
A0
TSOP (forward type)
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
NC
NC
NC
NC
NC
NC
A17
A7
A6
A5
A4
A3
A2
A1
PRELIMINARY
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
(July, 2004, Version 0.0)
A23L83161V
2
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Block Diagram
ROW
MEMORY CELL
DECODER
ARRAY
DRIVER
(A-1) A0 - A17
ADDRESS
INPUTS
COLUMN
DECODER
COLUMN SELECTOR CIRCUITRY
DRIVER
O0
O1
CE
OE
BYTE
POWER-DOWN
DOWN OR
OUTPUT
ENABLE
CIRCUITRY
BYTE
CIRCUITRY
O2
O3
O4
O5
O6
O7
(O8)
(O9)
(O10)
(O11)
(O12)
(O13)
(O14)
(O15)
PRELIMINARY
(July, 2004, Version 0.0)
3
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Pin Descriptions
Pin No.
Symbol
Description
32L PLCC
40L SOP
48L TSOP
48L TSOP
(A23L8316)
(A23L8316)
(A23L8316)
(A23L83161)
1-12,
23, 25-30
1-9,
32-40
2-10,
15-23
1-8,
17-25, 48
A0-A17
Address Inputs
13-15,
17-21
13-20,
22-28
28-35,
39-45
29-36,
38-44
O0-O14
Data Outputs
-
29
46
45
O15/A-1
Output 15(WORD mode)
/LSB Address (BYTE mode)
22
10
24
26
CE
Chip Enable Input
24
12
27
28
OE
Output Enable Input
-
31
1
47
BYTE
BYTE or WORD mode Selection
32
21
37-38
37
VCC
Power Supply
16
11, 30
12, 25-26,
47-48
27, 46
GND
Ground
31
-
11, 13-14, 36
9-16
NC
No Connection
Recommended DC Operating Conditions
(TA = 0°C to + 70°C)
Symbol
Parameter
VCC
Supply Voltage
GND
Ground
Min.
Max.
Unit
2.7
3.6
V
0
0
V
VIH
Input High Voltage
2.2
VCC+0.3
V
VIL
Input Low Voltage
- 0.3
0.6
V
PRELIMINARY
(July, 2004, Version 0.0)
4
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Absolute Maximum Ratings*
*Comments
Ambient Operating Temperature . . . . . . . . 0°C to + 70°C
Storage Temperature . . . . . . . . . . . . . . -65°C to + 125°C
Output Voltage . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V
Input Voltage . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied or intended. Exposure to the absolute maximum
rating conditions for extended periods may affect device
reliability.
DC Electrical Characteristics
(TA = 0°C to + 70°C, VCC = 2.7V~3.6V, GND = 0V for -100, VCC = 3.0V~3.6V, GND = 0 for -70)
Symbol
Parameter
VOH
Output High Voltage
VOL
Output Low Voltage
VlH
Input High Voltage
VlL
Input Low Voltage
⎢lLI⎥
Min.
Max.
Conditions
Note
V
IOH = -0.4mA (3V)
0.4
V
IOL = 1.6mA (3V)
2.2
VCC + 0.3
V
-0.3
0.6
V
Input Leakage Current
+10
µA
VCC = max.
VIN = VCC to GND
⎢lLO⎥
Output Leakage Current
+10
µA
VCC = max.
VOUT = VCC to GND
1
ICC
Operating Supply Current
30
mA
tCYC = min.
2
ISB
Standby Supply Current (TTL)
1.5
mA
CE = VIH
ISB1
Standby Supply Current (CMOS)
10
µA
CE ≥ VCC - 0.2V
PRELIMINARY
(July, 2004, Version 0.0)
2.4
Unit
5
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Capacitance
Symbol
Parameter
Min.
Max.
Unit
CI
Input Capacitance
10
pF
CO
Output Capacitance
10
pF
AC Characteristics
Symbol
Test Conditions
Note
TA = 25°C
f = 1.0MHz
3
(TA = 0°C to +70°C, VCC = 2.7V~3.6V for -100, VCC = 3.0V~3.6V for -70, GND = 0V)
Parameter
A23L8316/A23L83161 -70
Min.
Max.
70
A23L8316/A23L83161 100
Min.
Unit
Note
Max.
tCYC
Cycle Time
100
tAA
Address Access Time
70
100
ns
tACE
Chip Enable Access Time
70
100
ns
tAOE
Output Enable Access Time
35
50
ns
tOH
Output Hold after Address Change
10
10
ns
tLZ
Output Low Z Delay
10
10
ns
4, 6
tHZ
Output High Z Delay*
ns
5, 6
20
ns
20
* tHZ is specified from either OE or CE going disabled, whichever occurs first.
Notes:
1. OE / CE = VIH (Output is unloaded)
2. VIN = VIH/VIL, OE / CE = VIL (Output is unloaded)
3. This parameter is periodically sampled and is not 100% tested. All pins, except pins under test, are tied to AC ground.
4. Output LOW impedance delay (tLZ) is measured from CE or OE going active.
5. Output HIGH impedance delay (tHZ) is measured from CE or OE going inactive.
6. This parameter is sampled and not 100% tested.
PRELIMINARY
(July, 2004, Version 0.0)
6
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Timing Waveforms
Propagation Delay from Address ( CE = Active, OE = Active)
tCYC
ADDRESS
INPUTS
VALID
tAA
tOH
VALID
DATA OUT
Propagation Delay from Chip Enable or Output Enable (Address Valid)
CHIP
ENABLE
VALID
tACE
OUTPUT
ENABLE
VALID
tLZ
tAOE
tHZ
VALID
DATA OUT
AC Test Conditions
Part No.
Applied Voltage
Input Pulse Levels
Input Rise and Fall Time
Timing Measurement Reference Level
Output Load
PRELIMINARY
(July, 2004, Version 0.0)
A23L8316/A23L83161 -70
A23L8316/A23L83161 -100
3.0V~3.6V
2.7V~3.6V
0.4V to 2.4V
0.4V to 2.4V
10 ns
10 ns
VIN = 1.4V, VOUT = 1.4V
VIN = 1.4V, VOUT = 1.4V
1 TTL gate and CL = 100pF
1 TTL gate and CL = 100pF
7
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Function Table
CE
OE /NC
BYTE
O15/A-1
O0 - O7
O8 - O15
Mode
L
L
H
Data Pin O15
Data Out
Data out
Word
L
L
L
LSB Address A-1
Data Out
Hi - Z
Byte
H
X
X
X
Hi - Z
Hi - Z
Power-down
L
H
X
X
Hi - Z
Hi - Z
Output Disable
Ordering Information
Part No.
Access Time (ns)
Package
A23L8316M-70
70
40L SOP
A23L8316M-100
100
40L SOP
A23L8316V-70
70
48L TSOP (Forward)
A23L8316V-100
100
48L TSOP (Forward)
A23L8316R-70
70
48L TSOP (Reverse)
A23L8316R-100
100
48L TSOP (Reverse)
A23L83161V-70
70
48L TSOP AMD (Flash Compatible)
A23L83161V-100
100
48L TSOP AMD (Flash Compatible)
PRELIMINARY
(July, 2004, Version 0.0)
8
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Package Information
unit: inches/mm
PLCC 32L Outline Dimension
HD
D
13
5
E
1
HE
4
14
32
20
30
29
c
L
A1
b
e
A
A2
21
D
b1
GD
GE
y
θ
Dimensions in inches
Symbol
Dimensions in mm
Min
Nom
Max
Min
Nom
Max
A
-
-
0.134
-
-
3.40
A1
0.0185
-
-
0.47
-
-
A2
0.105
0.110
0.115
2.67
2.80
2.93
b1
0.026
0.028
0.032
0.66
0.71
0.81
0.54
b
0.016
0.018
0.021
0.41
0.46
C
0.008
0.010
0.014
0.20
0.254
0.35
D
0.547
0.550
0.553
13.89
13.97
14.05
E
0.447
0.450
0.453
11.35
11.43
11.51
e
0.044
0.050
0.056
1.12
1.27
1.42
GD
0.490
0.510
0.530
12.45
12.95
13.46
GE
0.390
0.410
0.430
9.91
10.41
10.92
HD
0.585
0.590
0.595
14.86
14.99
15.11
12.57
HE
0.485
0.490
0.495
12.32
12.45
L
0.075
0.090
0.095
1.91
2.29
2.41
y
-
-
0.003
-
-
0.075
θ
0°
-
10°
0°
-
10°
Notes:
1. Dimensions D and E do not include resin fins.
2. Dimensions GD & GE are for PC Board surface mount pad pitch
design reference only.
PRELIMINARY
(July, 2004, Version 0.0)
9
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Package Information
unit: inches/mm
SOP 40L Outline Dimensions
21
Gauge Plane
HE
E
40
θ
L
0.010"
1
b
20
Detail F
e
y
A
L1
A1
S
D
A2
C
D
Seating Plane
See Detail F
Symbol
A
Dimensions in inches
Dimensions in mm
Min
Nom
Max
Min
Nom
Max
-
-
0.118
-
-
3.00
A1
0.004
-
-
0.10
-
-
A2
0.101
0.106
0.111
2.57
2.69
2.82
b
0.014
0.016
0.020
0.36
0.41
0.51
C
0.006
0.008
0.012
0.15
0.20
0.31
D
1.021
1.026
1.031
25.93
26.06
26.19
E
0.440
0.445
0.450
11.18
11.30
11.43
e
-
0.050
-
-
1.27
-
HE
0.546
0.556
0.566
13.87
14.12
14.38
L
0.024
0.032
0.040
0.61
0.80
1.02
L1
0.047
0.055
0.063
1.19
1.40
1.60
S
-
0.038
0.046
-
0.97
1.17
y
-
-
0.004
-
-
0.10
θ
0°
-
8°
0°
-
8°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(July, 2004, Version 0.0)
10
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Package Information
unit: inches/mm
TSOP 48L (Type I) Outline Dimensions
1
48
24
25
y
D1
A1
A2 A
D
0.25
c
S
e
E
b
D
Detail "A"
L
θ
Detail "A"
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
Max
Min
Nom
Max
A
-
-
0.047
-
-
1.20
A1
0.002
-
0.006
0.05
-
0.15
A2
0.037
0.039
0.042
0.94
1.00
1.06
b
0.007
0.009
0.011
0.18
0.22
0.27
c
0.004
-
0.008
0.12
-
0.20
D
0.779
0.787
0.795
19.80
20.00
20.20
D1
0.720
0.724
0.728
18.30
18.40
18.50
E
-
0.472
0.476
-
12.00
12.10
0.020 BASIC
e
L
0.016
S
0.020
0.50 BASIC
0.024
0.40
0.011 Typ.
0.50
0.60
0.28 Typ.
y
-
-
0.004
-
-
0.10
θ
0°
-
8°
0°
-
8°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(July, 2004, Version 0.0)
11
AMIC Technology, Corp.
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