A23L8316/A23L83161 Series Preliminary 256K X 16 / 512K X 8 BIT CMOS MASK ROM Document Title 256K X 16 / 512K X 8 BIT CMOS MASK ROM Revision History Rev. No. 0.0 PRELIMINARY History Issue Date Remark Initial issue July 28, 2004 Preliminary (July, 2004, Version 0.0) AMIC Technology, Corp. A23L8316/A23L83161 Series Preliminary 512K X 16 / 1M X 8 BIT CMOS MASK ROM Features All inputs and outputs are directly TTL-compatible Flash memory pinout compatible with AMD (A23L83161) Available in 40-pin SOP, 32-pin PLCC 48-pin TSOP (forward, reverse type and flash memory’s pinouts compatible) packages 256K x 16 bit or 512K x 8 bit organization Supply voltage range: 2.7V~3.6V Access time: 70ns (max.)/3.0V~3.6V 100ns (max.)/2.7V~3.6V Current: Operating: 20mA (typ.)/3.3V Standby: 10µA (typ.)/3.3V Three-state outputs for wired-OR expansion Full static operation Pin Configurations 28 O7 O14 27 26 O6 16 17 25 O13 24 O5 O10 O3 18 23 19 22 O12 O4 O11 20 21 VCC O1 O9 O2 A18 VCC NC A17 1 32 31 30 6 A13 A5 7 27 A8 A4 8 26 A9 A23L8308 A3 9 25 A11 A2 10 24 OE A1 11 23 A10 A0 12 22 CE O0 13 21 O7 20 14 15 GND O15/A-1 BYTE A6 19 12 13 30 29 A14 28 O6 OE O0 O8 A16 29 O5 10 11 32 31 5 18 CE GND A14 A15 A7 O4 9 A13 17 33 A1 A0 A11 A12 O3 8 A2 A16 35 34 A15 6 7 2 36 A4 A3 3 5 A5 A9 A10 16 38 37 15 3 4 GND A6 A8 O2 40 39 14 2 O1 1 A7 A23L8316M A17 A12 PLCC 4 SOP TSOP (forward type) BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 NC GND NC NC A17 A7 A6 A5 A4 A3 A2 A1 A0 CE PRELIMINARY 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 (July, 2004, Version 0.0) A23L8316V 1 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 GND GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC VCC NC O11 O3 O10 O2 O9 O1 O8 O0 OE GND GND AMIC Technology, Corp. A23L8316/A23L83161 Series Pin Configurations (continued) TSOP (reverse type) GND GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC VCC NC O11 O3 O10 O2 O9 O1 O8 O0 OE GND GND 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A23L8316R 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 NC GND NC NC A17 A7 A6 A5 A4 A3 A2 A1 A0 CE 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC O11 O3 O10 O2 O9 O1 O8 O0 OE GND CE A0 TSOP (forward type) A15 A14 A13 A12 A11 A10 A9 A8 NC NC NC NC NC NC NC NC A17 A7 A6 A5 A4 A3 A2 A1 PRELIMINARY 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 (July, 2004, Version 0.0) A23L83161V 2 AMIC Technology, Corp. A23L8316/A23L83161 Series Block Diagram ROW MEMORY CELL DECODER ARRAY DRIVER (A-1) A0 - A17 ADDRESS INPUTS COLUMN DECODER COLUMN SELECTOR CIRCUITRY DRIVER O0 O1 CE OE BYTE POWER-DOWN DOWN OR OUTPUT ENABLE CIRCUITRY BYTE CIRCUITRY O2 O3 O4 O5 O6 O7 (O8) (O9) (O10) (O11) (O12) (O13) (O14) (O15) PRELIMINARY (July, 2004, Version 0.0) 3 AMIC Technology, Corp. A23L8316/A23L83161 Series Pin Descriptions Pin No. Symbol Description 32L PLCC 40L SOP 48L TSOP 48L TSOP (A23L8316) (A23L8316) (A23L8316) (A23L83161) 1-12, 23, 25-30 1-9, 32-40 2-10, 15-23 1-8, 17-25, 48 A0-A17 Address Inputs 13-15, 17-21 13-20, 22-28 28-35, 39-45 29-36, 38-44 O0-O14 Data Outputs - 29 46 45 O15/A-1 Output 15(WORD mode) /LSB Address (BYTE mode) 22 10 24 26 CE Chip Enable Input 24 12 27 28 OE Output Enable Input - 31 1 47 BYTE BYTE or WORD mode Selection 32 21 37-38 37 VCC Power Supply 16 11, 30 12, 25-26, 47-48 27, 46 GND Ground 31 - 11, 13-14, 36 9-16 NC No Connection Recommended DC Operating Conditions (TA = 0°C to + 70°C) Symbol Parameter VCC Supply Voltage GND Ground Min. Max. Unit 2.7 3.6 V 0 0 V VIH Input High Voltage 2.2 VCC+0.3 V VIL Input Low Voltage - 0.3 0.6 V PRELIMINARY (July, 2004, Version 0.0) 4 AMIC Technology, Corp. A23L8316/A23L83161 Series Absolute Maximum Ratings* *Comments Ambient Operating Temperature . . . . . . . . 0°C to + 70°C Storage Temperature . . . . . . . . . . . . . . -65°C to + 125°C Output Voltage . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Input Voltage . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics (TA = 0°C to + 70°C, VCC = 2.7V~3.6V, GND = 0V for -100, VCC = 3.0V~3.6V, GND = 0 for -70) Symbol Parameter VOH Output High Voltage VOL Output Low Voltage VlH Input High Voltage VlL Input Low Voltage ⎢lLI⎥ Min. Max. Conditions Note V IOH = -0.4mA (3V) 0.4 V IOL = 1.6mA (3V) 2.2 VCC + 0.3 V -0.3 0.6 V Input Leakage Current +10 µA VCC = max. VIN = VCC to GND ⎢lLO⎥ Output Leakage Current +10 µA VCC = max. VOUT = VCC to GND 1 ICC Operating Supply Current 30 mA tCYC = min. 2 ISB Standby Supply Current (TTL) 1.5 mA CE = VIH ISB1 Standby Supply Current (CMOS) 10 µA CE ≥ VCC - 0.2V PRELIMINARY (July, 2004, Version 0.0) 2.4 Unit 5 AMIC Technology, Corp. A23L8316/A23L83161 Series Capacitance Symbol Parameter Min. Max. Unit CI Input Capacitance 10 pF CO Output Capacitance 10 pF AC Characteristics Symbol Test Conditions Note TA = 25°C f = 1.0MHz 3 (TA = 0°C to +70°C, VCC = 2.7V~3.6V for -100, VCC = 3.0V~3.6V for -70, GND = 0V) Parameter A23L8316/A23L83161 -70 Min. Max. 70 A23L8316/A23L83161 100 Min. Unit Note Max. tCYC Cycle Time 100 tAA Address Access Time 70 100 ns tACE Chip Enable Access Time 70 100 ns tAOE Output Enable Access Time 35 50 ns tOH Output Hold after Address Change 10 10 ns tLZ Output Low Z Delay 10 10 ns 4, 6 tHZ Output High Z Delay* ns 5, 6 20 ns 20 * tHZ is specified from either OE or CE going disabled, whichever occurs first. Notes: 1. OE / CE = VIH (Output is unloaded) 2. VIN = VIH/VIL, OE / CE = VIL (Output is unloaded) 3. This parameter is periodically sampled and is not 100% tested. All pins, except pins under test, are tied to AC ground. 4. Output LOW impedance delay (tLZ) is measured from CE or OE going active. 5. Output HIGH impedance delay (tHZ) is measured from CE or OE going inactive. 6. This parameter is sampled and not 100% tested. PRELIMINARY (July, 2004, Version 0.0) 6 AMIC Technology, Corp. A23L8316/A23L83161 Series Timing Waveforms Propagation Delay from Address ( CE = Active, OE = Active) tCYC ADDRESS INPUTS VALID tAA tOH VALID DATA OUT Propagation Delay from Chip Enable or Output Enable (Address Valid) CHIP ENABLE VALID tACE OUTPUT ENABLE VALID tLZ tAOE tHZ VALID DATA OUT AC Test Conditions Part No. Applied Voltage Input Pulse Levels Input Rise and Fall Time Timing Measurement Reference Level Output Load PRELIMINARY (July, 2004, Version 0.0) A23L8316/A23L83161 -70 A23L8316/A23L83161 -100 3.0V~3.6V 2.7V~3.6V 0.4V to 2.4V 0.4V to 2.4V 10 ns 10 ns VIN = 1.4V, VOUT = 1.4V VIN = 1.4V, VOUT = 1.4V 1 TTL gate and CL = 100pF 1 TTL gate and CL = 100pF 7 AMIC Technology, Corp. A23L8316/A23L83161 Series Function Table CE OE /NC BYTE O15/A-1 O0 - O7 O8 - O15 Mode L L H Data Pin O15 Data Out Data out Word L L L LSB Address A-1 Data Out Hi - Z Byte H X X X Hi - Z Hi - Z Power-down L H X X Hi - Z Hi - Z Output Disable Ordering Information Part No. Access Time (ns) Package A23L8316M-70 70 40L SOP A23L8316M-100 100 40L SOP A23L8316V-70 70 48L TSOP (Forward) A23L8316V-100 100 48L TSOP (Forward) A23L8316R-70 70 48L TSOP (Reverse) A23L8316R-100 100 48L TSOP (Reverse) A23L83161V-70 70 48L TSOP AMD (Flash Compatible) A23L83161V-100 100 48L TSOP AMD (Flash Compatible) PRELIMINARY (July, 2004, Version 0.0) 8 AMIC Technology, Corp. A23L8316/A23L83161 Series Package Information unit: inches/mm PLCC 32L Outline Dimension HD D 13 5 E 1 HE 4 14 32 20 30 29 c L A1 b e A A2 21 D b1 GD GE y θ Dimensions in inches Symbol Dimensions in mm Min Nom Max Min Nom Max A - - 0.134 - - 3.40 A1 0.0185 - - 0.47 - - A2 0.105 0.110 0.115 2.67 2.80 2.93 b1 0.026 0.028 0.032 0.66 0.71 0.81 0.54 b 0.016 0.018 0.021 0.41 0.46 C 0.008 0.010 0.014 0.20 0.254 0.35 D 0.547 0.550 0.553 13.89 13.97 14.05 E 0.447 0.450 0.453 11.35 11.43 11.51 e 0.044 0.050 0.056 1.12 1.27 1.42 GD 0.490 0.510 0.530 12.45 12.95 13.46 GE 0.390 0.410 0.430 9.91 10.41 10.92 HD 0.585 0.590 0.595 14.86 14.99 15.11 12.57 HE 0.485 0.490 0.495 12.32 12.45 L 0.075 0.090 0.095 1.91 2.29 2.41 y - - 0.003 - - 0.075 θ 0° - 10° 0° - 10° Notes: 1. Dimensions D and E do not include resin fins. 2. Dimensions GD & GE are for PC Board surface mount pad pitch design reference only. PRELIMINARY (July, 2004, Version 0.0) 9 AMIC Technology, Corp. A23L8316/A23L83161 Series Package Information unit: inches/mm SOP 40L Outline Dimensions 21 Gauge Plane HE E 40 θ L 0.010" 1 b 20 Detail F e y A L1 A1 S D A2 C D Seating Plane See Detail F Symbol A Dimensions in inches Dimensions in mm Min Nom Max Min Nom Max - - 0.118 - - 3.00 A1 0.004 - - 0.10 - - A2 0.101 0.106 0.111 2.57 2.69 2.82 b 0.014 0.016 0.020 0.36 0.41 0.51 C 0.006 0.008 0.012 0.15 0.20 0.31 D 1.021 1.026 1.031 25.93 26.06 26.19 E 0.440 0.445 0.450 11.18 11.30 11.43 e - 0.050 - - 1.27 - HE 0.546 0.556 0.566 13.87 14.12 14.38 L 0.024 0.032 0.040 0.61 0.80 1.02 L1 0.047 0.055 0.063 1.19 1.40 1.60 S - 0.038 0.046 - 0.97 1.17 y - - 0.004 - - 0.10 θ 0° - 8° 0° - 8° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. PRELIMINARY (July, 2004, Version 0.0) 10 AMIC Technology, Corp. A23L8316/A23L83161 Series Package Information unit: inches/mm TSOP 48L (Type I) Outline Dimensions 1 48 24 25 y D1 A1 A2 A D 0.25 c S e E b D Detail "A" L θ Detail "A" Dimensions in inches Dimensions in mm Symbol Min Nom Max Min Nom Max A - - 0.047 - - 1.20 A1 0.002 - 0.006 0.05 - 0.15 A2 0.037 0.039 0.042 0.94 1.00 1.06 b 0.007 0.009 0.011 0.18 0.22 0.27 c 0.004 - 0.008 0.12 - 0.20 D 0.779 0.787 0.795 19.80 20.00 20.20 D1 0.720 0.724 0.728 18.30 18.40 18.50 E - 0.472 0.476 - 12.00 12.10 0.020 BASIC e L 0.016 S 0.020 0.50 BASIC 0.024 0.40 0.011 Typ. 0.50 0.60 0.28 Typ. y - - 0.004 - - 0.10 θ 0° - 8° 0° - 8° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. PRELIMINARY (July, 2004, Version 0.0) 11 AMIC Technology, Corp.