Freescale MCIMX6S8DVM10AC Applications processors for consumer product Datasheet

Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX6SDLCEC
Rev. 3, 03/2014
MCIMX6SxExxxxxB
MCIMX6SxExxxxxC
MCIMX6UxExxxxxB
MCIMX6UxExxxxxC
MCIMX6SxDxxxxxB
MCIMX6SxDxxxxxC
MCIMX6UxDxxxxxB
MCIMX6UxDxxxxxC
i.MX 6Solo/6DualLite
Applications Processors
for Consumer Products
Package Information
Plastic Package
BGA Case 2240 21 x 21 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 3
1
Introduction
The i.MX 6Solo/6DualLite processors represent
Freescale Semiconductor’s latest achievement in
integrated multimedia-focused products offering high
performance processing with lower cost, as well as
optimization for low power consumption.
The processors feature Freescale’s advanced
implementation of single/dual ARM® Cortex®-A9 core,
which operates at speeds of up to 1 GHz. They include
2D and 3D graphics processors, 1080p video processing,
and integrated power management. Each processor
provides a 32/64-bit DDR3/LVDDR3/LPDDR2-800
memory interface and a number of other interfaces for
connecting peripherals, such as WLAN, Bluetooth®,
GPS, hard drive, displays, and camera sensors.
The i.MX 6Solo/6DualLite processors are specifically
useful for applications such as:
• Web and multimedia tablets
1
2
3
4
5
6
7
© 2012-2014 Freescale Semiconductor, Inc. All rights reserved.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
1.3 Updated Signal Naming Convention . . . . . . . . . . . .8
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.1 Special Signal Considerations . . . . . . . . . . . . . . . .20
3.2 Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .22
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . .22
4.2 Power Supplies Requirements and Restrictions. . .32
4.3 Integrated LDO Voltage Regulator Parameters . . .34
4.4 PLL’s Electrical Characteristics. . . . . . . . . . . . . . . .36
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . .37
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .38
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .43
4.8 Output Buffer Impedance Parameters . . . . . . . . . .47
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . .50
4.10 General-Purpose Media Interface (GPMI) Timing .67
4.11 External Peripheral Interface Parameters. . . . . . . .75
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . .137
5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . . .137
5.2 Boot Device Interface Allocation. . . . . . . . . . . . . .139
Package Information and Contact Assignments . . . . . .140
6.1 Updated Signal Naming Convention . . . . . . . . . .140
6.2 21x21 mm Package Information . . . . . . . . . . . . . .140
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .166
Introduction
•
•
•
•
•
•
•
Web and multimedia tablets
Color eReaders
IPTV
Human Machine Interfaces (HMI)
Portable medical
IP phones
Home energy management systems
The i.MX 6Solo/6DualLite processors have some very exciting features, for example:
• Applications processors—The processors enhance the capabilities of high-tier portable
applications by fulfilling the ever increasing MIPS needs of operating systems and games.
Freescale’s Dynamic Voltage and Frequency Scaling (DVFS) provides significant power
reduction, allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks,
such as audio decode.
• Multilevel memory system—The multilevel memory system of each processor is based on the L1
instruction and data caches, L2 cache, and internal and external memory. The processors support
many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR
Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed
NAND, including eMMC up to rev 4.4/4.41.
• Smart speed technology—The processors have power management throughout the IC that enables
the rich suite of multimedia features and peripherals to consume minimum power in both active
and various low power modes. Smart speed technology enables the designer to deliver a
feature-rich product, requiring levels of power far lower than industry expectations.
• Dynamic voltage and frequency scaling—The processors improve the power efficiency of devices
by scaling the voltage and frequency to optimize performance.
• Multimedia powerhouse—The multimedia performance of each processor is enhanced by a
multilevel cache system, NEON™ MPE (Media Processor Engine) co-processor, a multi-standard
hardware video codec, an image processing unit (IPU), a programmable smart DMA (SDMA)
controller, and an asynchronous sample rate converter.
• Powerful graphics acceleration—Each processor provides two independent, integrated graphics
processing units: an OpenGL® ES 2.0 3D graphics accelerator with a shader and a 2D graphics
accelerator.
• Interface flexibility—Each processor supports connections to a variety of interfaces: LCD
controller for up to two displays (including parallel display, HDMI1.4, MIPI display, and LVDS
display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with
PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host
and other), 10/100/1000 Mbps Gigabit Ethernet controller two CAN ports, ESAI audio interface,
and a variety of other popular interfaces (such as UART, I2C, and I2S serial audio, and PCIe-II).
• Eink Panel Display Controller—The processors integrate EPD controller that supports E-INK
color and monochrome with up to 1650x2332 resolution and 5-bit grayscale (32-levels per color
channel).
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
2
Freescale Semiconductor
Introduction
•
•
1.1
Advanced security—The processors deliver hardware-enabled security features that enable secure
e-commerce, digital rights management (DRM), information encryption, secure boot, and secure
software downloads. The security features are discussed in detail in the i.MX 6Solo/6DualLite
Security Reference Manual (IMX6DQ6SDLSRM).
Integrated power management—The processors integrate linear regulators and internally generate
voltage levels for different domains. This significantly simplifies system power management
structure.
Ordering Information
Table 1 provides examples of orderable part numbers covered by this data sheet. Table 1 does not include
all possible orderable part numbers. The latest part numbers are available on the web page
freescale.com/imx6series. If the desired part number is not listed in Table 1, or there may be any questions
about available parts, see the web page freescale.com/imx6series or contact a Freescale representative.
Table 1. Example Orderable Part Numbers
i.MX6 CPU
Solo/
DualLite
Part Number
Options
Speed
Grade
Temperature
Grade
Package
MCIMX6U8DVM10AB DualLite With VPU, GPU, EPDC, MLB
2x ARM Cortex-A9 64-bit DDR
1 GHz
Commercial 21 mm x 21 mm,
0.8 mm pitch, MAPBGA
MCIMX6U8DVM10AC DualLite With VPU, GPU, EPDC, MLB
2x ARM Cortex-A9 64-bit DDR
1 GHz
Commercial 21 mm x 21 mm,
0.8 mm pitch, MAPBGA
MCIMX6U5DVM10AB DualLite With VPU, GPU, MLB, no EPDC
2x ARM Cortex-A9 64-bit DDR
1 GHz
Commercial 21 mm x 21 mm,
0.8 mm pitch, MAPBGA
MCIMX6U5DVM10AC DualLite With VPU, GPU, MLB, no EPDC
2x ARM Cortex-A9 64-bit DDR
1 GHz
Commercial 21 mm x 21 mm,
0.8 mm pitch, MAPBGA
MCIMX6U5EVM10AB DualLite With VPU, GPU, MLB, no EPDC
2x ARM Cortex-A9 64-bit DDR
1 GHz
Extended 21 mm x 21 mm,
Commercial 0.8 mm pitch, MAPBGA
MCIMX6U5EVM10AC DualLite With VPU, GPU, MLB, no EPDC
2x ARM Cortex-A9 64-bit DDR
1 GHz
Extended 21 mm x 21 mm,
Commercial 0.8 mm pitch, MAPBGA
MCIMX6S8DVM10AB
Solo
With VPU, GPU, MLB, EPDC
1x ARM Cortex-A9 32-bit DDR
1 GHz
Commercial 21 mm x 21 mm,
0.8 mm pitch, MAPBGA
MCIMX6S8DVM10AC
Solo
With VPU, GPU, MLB, EPDC
1x ARM Cortex-A9 32-bit DDR
1 GHz
Commercial 21 mm x 21 mm,
0.8 mm pitch, MAPBGA
MCIMX6S5DVM10AB
Solo
With VPU, GPU, MLB, no EPDC
1x ARM Cortex-A9 32-bit DDR
1 GHz
Commercial 21 mm x 21 mm,
0.8 mm pitch, MAPBGA
MCIMX6S5DVM10AC
Solo
With VPU, GPU, MLB, no EPDC
1x ARM Cortex-A9 32-bit DDR
1 GHz
Commercial 21 mm x 21 mm,
0.8 mm pitch, MAPBGA
MCIMX6S5EVM10AB
Solo
With VPU, GPU, MLB, no EPDC
1x ARM Cortex-A9 32-bit DDR
1 GHz
Extended 21 mm x 21 mm,
Commercial 0.8 mm pitch, MAPBGA
MCIMX6S5EVM10AC
Solo
With VPU, GPU, MLB, no EPDC
1x ARM Cortex-A9 32-bit DDR
1 GHz
Extended 21 mm x 21 mm,
Commercial 0.8 mm pitch, MAPBGA
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
3
Introduction
Figure 1 describes the part number nomenclature so that the users can identify the characteristics of the
specific part number they have (for example, cores, frequency, temperature grade, fuse options, and silicon
revision). The primary characteristic which describes which data sheet applies to a specific part is the
temperature grade (junction) field.
• The i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors data sheet
(IMX6SDLAEC) covers parts listed with an “A (Automotive temp)”
• The i.MX 6Solo/6DualLite Applications Processors for Consumer Products data sheet
(IMX6SDLCEC) covers parts listed with a “D (Commercial temp)” or “E (Extended Commercial
temp)”
• The i.MX 6Solo/6DualLite Applications Processors for Industrial Products data sheet
(IMX6SDLIEC) covers parts listed with “C (Industrial temp)”
Ensure to have the proper data sheet for specific part by verifying the temperature grade (junction) field
and matching it to the proper data sheet. If there will be any questions, visit see the web page
freescale.com/imx6series or contact a Freescale representative for details.
MC
IMX6
X
@
+
VV
$$
%
A
MC
Silicon revision1
Prototype Samples
PC
Rev 1.1
B
Mass Production
MC
Rev 1.2
C
Special
SC
Fusing
%
Qualification level
Part # series
X
i.MX 6DualLite
2x ARM Cortex-A9, 64-bit DDR
U
i.MX 6Solo
1x ARM Cortex-A9, 32-bit DDR
S
Part differentiator
Default settings
A
HDCP enabled
C
Frequency
$$
800 MHz2
08
1 GHz3
10
RoHS
@
Package type
Consumer
VPU
GPU
EPDC
MLB
8
MAPBGA 21 x 21 0.8mm
Industrial
VPU
GPU
–
–
7
Automotive
VPU
GPU
–
MLB
6
Temperature Tj
A
VM
+
Commercial: 0 to + 95C
D

Consumer
VPU
GPU
–
MLB
5
Extended commercial: -20 to + 105 C
E
Automotive
–
GPU
–
MLB
4
Industrial: -40 to +105C
C
Automotive
–
–
–
MLB
1
Automotive: -40 to + 125C
A
1. See the freescale.com\imx6series Web page for latest information on the available silicon revision.
2. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 792 MHz.
3. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 996 MHz.
Figure 1. Part Number Nomenclature—i.MX 6Solo and 6DualLite
1.2
Features
The i.MX 6Solo/6DualLite processors are based on ARM Cortex-A9 MPCore™ Platform, which has the
following features:
• The i.MX 6Solo supports single ARM Cortex-A9 MPCore (with TrustZone)
• The i.MX 6DualLite supports dual ARM Cortex-A9 MPCore (with TrustZone)
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
4
Freescale Semiconductor
Introduction
•
The core configuration is symmetric, where each core includes:
— 32 KByte L1 Instruction Cache
— 32 KByte L1 Data Cache
— Private Timer and Watchdog
— Cortex-A9 NEON MPE (Media Processing Engine) Co-processor
The ARM Cortex-A9 MPCore™ complex includes:
• General Interrupt Controller (GIC) with 128 interrupt support
• Global Timer
• Snoop Control Unit (SCU)
• 512 KB unified I/D L2 cache:
— Used by one core in i.MX 6Solo
— Shared by two cores in i.MX 6DualLite
• Two Master AXI bus interfaces output of L2 cache
• Frequency of the core (including NEON and L1 cache), as per Table 9.
• NEON MPE coprocessor
— SIMD Media Processing Architecture
— NEON register file with 32x64-bit general-purpose registers
— NEON Integer execute pipeline (ALU, Shift, MAC)
— NEON dual, single-precision floating point execute pipeline (FADD, FMUL)
— NEON load/store and permute pipeline
The SoC-level memory system consists of the following additional components:
— Boot ROM, including HAB (96 KB)
— Internal multimedia / shared, fast access RAM (OCRAM, 128 KB)
— Secure/non-secure RAM (16 KB)
• External memory interfaces: The i.MX 6Solo/6DualLite processors support latest, high volume,
cost effective handheld DRAM, NOR, and NAND Flash memory standards.
— 16/32-bit LP-DDR2-800, 16/32-bit DDR3-800 and LV-DDR3-800 in i.MX 6Solo; 16/32/64-bit
LP-DDR2-800, 16/32/64-bit DDR3-800 and LV-DDR3-800, supporting DDR interleaving
mode for 2x32 LPDDR2-800 in i.MX 6DualLite
— 8-bit NAND-Flash, including support for Raw MLC/SLC, 2 KB, 4 KB, and 8 KB page size,
BA-NAND, PBA-NAND, LBA-NAND, OneNAND™ and others. BCH ECC up to 40 bit.
— 16/32-bit NOR Flash. All WEIMv2 pins are muxed on other interfaces.
— 16/32-bit PSRAM, Cellular RAM
Each i.MX 6Solo/6DualLite processor enables the following interfaces to external devices (some of them
are muxed and not available simultaneously):
• Displays—Total five interfaces available. Total raw pixel rate of all interfaces is up to 450
Mpixels/sec, 24 bpp. Up to two interfaces may be active in parallel (excluding EPDC).
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
5
Introduction
•
•
•
•
•
— One Parallel 24-bit display port, up to 225 Mpixels/sec (for example, WUXGA at 60 Hz or dual
HD1080 and WXGA at 60 Hz)
— LVDS serial ports—One port up to 165 Mpixels/sec or two ports up to 85 MP/sec (for example,
WUXGA at 60 Hz) each
— HDMI 1.4 port
— MIPI/DSI, two lanes at 1 Gbps
— EPDC, Color, and monochrome E-INK, up to 1650x2332 resolution and 5-bit grayscale
Camera sensors:
— Two parallel Camera ports (up to 20 bit and up to 240 MHz peak)
— MIPI CSI-2 Serial port, supporting from 80 Mbps to 1 Gbps speed per data lane. The CSI-2
Receiver core can manage one clock lane and up to two data lanes. Each i.MX 6Solo/6DualLite
processor has two lanes.
Expansion cards:
— Four MMC/SD/SDIO card ports all supporting:
– 1-bit or 4-bit transfer mode specifications for SD and SDIO cards up to UHS-I SDR-104
mode (104 MB/s max)
– 1-bit, 4-bit, or 8-bit transfer mode specifications for MMC cards up to 52 MHz in both SDR
and DDR modes (104 MB/s max)
USB:
— One high speed (HS) USB 2.0 OTG (Up to 480 Mbps), with integrated HS USB Phy
— Three USB 2.0 (480 Mbps) hosts:
– One HS host with integrated High Speed Phy
– Two HS hosts with integrated HS-IC USB (High Speed Inter-Chip USB) Phy
Expansion PCI Express port (PCIe) v2.0 one lane
— PCI Express (Gen 2.0) dual mode complex, supporting Root complex operations and Endpoint
operations. Uses x1 PHY configuration.
Miscellaneous IPs and interfaces:
— SSI block is capable of supporting audio sample frequencies up to 192 kHz stereo inputs and
outputs with I2S mode
— ESAI is capable of supporting audio sample frequencies up to 260 kHz in I2S mode with 7.1
multi channel outputs
— Five UARTs, up to 4.0 Mbps each:
– Providing RS232 interface
– Supporting 9-bit RS485 multidrop mode
– One of the five UARTs (UART1) supports 8-wire while others four supports 4-wire. This is
due to the SoC IOMUX limitation, since all UART IPs are identical.
— Four eCSPI (Enhanced CSPI)
— Four I2C, supporting 400 kbps
— Gigabit Ethernet Controller (IEEE1588 compliant), 10/100/10001 Mbps
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
6
Freescale Semiconductor
Introduction
—
—
—
—
—
—
—
—
—
Four Pulse Width Modulators (PWM)
System JTAG Controller (SJC)
GPIO with interrupt capabilities
8x8 Key Pad Port (KPP)
Sony Philips Digital Interconnect Format (SPDIF), Rx and Tx
Two Controller Area Network (FlexCAN), 1 Mbps each
Two Watchdog timers (WDOG)
Audio MUX (AUDMUX)
MLB (MediaLB) provides interface to MOST Networks (MOST25, MOST50, MOST150)
with the option of DTCP cipher accelerator
The i.MX 6Solo/6DualLite processors integrate advanced power management unit and controllers:
• Provide PMU, including LDO supplies, for on-chip resources
• Use Temperature Sensor for monitoring the die temperature
• Support DVFS techniques for low power modes
• Use SW State Retention and Power Gating for ARM and MPE
• Support various levels of system power modes
• Use flexible clock gating control scheme
The i.MX 6Solo/6DualLite processors use dedicated hardware accelerators to meet the targeted
multimedia performance. The use of hardware accelerators is a key factor in obtaining high performance
at low power consumption numbers, while having the CPU core relatively free for performing other tasks.
The i.MX 6Solo/6DualLite processors incorporate the following hardware accelerators:
• VPU—Video Processing Unit
• IPUv3H—Image Processing Unit version 3H
• GPU3Dv5—3D Graphics Processing Unit (OpenGL ES 2.0) version 5
• GPU2Dv2—2D Graphics Processing Unit (BitBlt)
• PXP—PiXel Processing Pipeline. Off loading key pixel processing operations are required to
support the EPD display applications.
• ASRC—Asynchronous Sample Rate Converter
Security functions are enabled and accelerated by the following hardware:
• ARM TrustZone including the TZ architecture (separation of interrupts, memory mapping, etc.)
• SJC—System JTAG Controller. Protecting JTAG from debug port attacks by regulating or
blocking the access to the system debug features.
• CAAM—Cryptographic Acceleration and Assurance Module, containing cryptographic and hash
engines, 16 KB secure RAM, and True and Pseudo Random Number Generator (NIST certified).
• SNVS—Secure Non-Volatile Storage, including Secure Real Time Clock
1. The theoretical maximum performance of 1 Gbps ENET is limited to 470 Mbps (total for Tx and Rx) due to internal bus
throughput limitations. The actual measured performance in optimized environment is up to 400 Mbps. For details, see the
ERR004512 erratum in the i.MX 6Solo/6DualLite errata document (IMX6SDLCE).
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
7
Architectural Overview
•
•
CSU—Central Security Unit. Enhancement for the IC Identification Module (IIM). Will be
configured during boot and by eFUSEs and will determine the security level operation mode as
well as the TZ policy.
A-HAB—Advanced High Assurance Boot—HABv4 with the new embedded enhancements:
SHA-256, 2048-bit RSA key, version control mechanism, warm boot, CSU, and TZ initialization.
NOTE
The actual feature set depends on the part numbers as described in Table 1,
"Example Orderable Part Numbers," on page 3. Functions, such as video
hardware acceleration, and 2D and 3D hardware graphics acceleration may
not be enabled for specific part numbers.
1.3
Updated Signal Naming Convention
The signal names of the i.MX6 series of products have been standardized to better align the signal names
within the family and across the documentation. Some of the benefits of these changes are as follows:
• The names are unique within the scope of an SoC and within the series of products
• Searches will return all occurrences of the named signal
• The names are consistent between i.MX 6 series products implementing the same modules
• The module instance is incorporated into the signal name
This change applies only to signal names. The original ball names have been preserved to prevent the need
to change schematics, BSDL models, IBIS models, etc.
Throughout this document, the updated signal names are used except where referenced as a ball name
(such as the Functional Contact Assignments table, Ball Map table, and so on). A master list of the signal
name changes is in the document, IMX 6 Series Signal Name Mapping (EB792). This list can be used to
map the signal names used in older documentation to the new standardized naming conventions.
2
Architectural Overview
The following subsections provide an architectural overview of the i.MX 6Solo/6DualLite processor
system.
2.1
Block Diagram
Figure 2 shows the functional modules in the i.MX 6Solo/6DualLite processor system.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
8
Freescale Semiconductor
Architectural Overview
Digital
Audio
LPDDR2/DDR3
400 MHz (DDR800)
NOR Flash
PSRAM
Battery Ctrl
2x Camera
Device
Parallel/MIPI
External
Memory I/F
GPMI
MMDC
WEIM
Application Processor
Domain (AP)
Internal
RAM
1
(144 KB)
Smart DMA
(SDMA)
CTIs
SJC
Shared Peripherals
eCSPI (4)
SSI (3)
Audio,
Power
Mngmnt.
5xFast-UART
ESAI
SPDIF Rx/Tx
ASRC
Security
CAAM
(16KB Ram)
SNVS
(SRTC)
512K L2 cache
SCU, Timer
PTM’s CTI’s
EPDC
AP Peripherals
E-INK
Display
MMC/SD
eMMC/eSD
uSDHC (4)
AUDMUX
2
MMC/SD
SDXC
I C(4)
Video
Proc. Unit
(VPU + Cache)
PWM (4)
OCOTP_CTRL
Modem IC
IOMUXC
3D Graphics
Proc. Unit
(GPU3D)
Fuse Box
Unit (LDOs)
DSI/MIPI
1x/2x A9-Core
L1 I/D Cache
Timer, WDOG
CSU
Power Management
HDMI
PxP
TPIU
SPBA
LDB
MIPI
Display
HDMI 1.4
Display
ARM Cortex A9
MPCore Platform
Debug
DAP
PCIe Bus
CSI2/MIPI
1 / 2 LCD
Displays
Image Processing
Subsystem
IPUv3H
Boot
ROM
(96 KB)
2xCAN i/f
GPS
1 / 2 LVDS
(WUXGA+)
AXI and AHB Switch Fabric
Raw / ONFI 2.2
NAND Flash
KPP
GPIO
CAN(2)
Clock and Reset
Timers/Control
PLL (8)
CCM
GPC
SRC
Crystals
& Clock sources
WDOG (2)
GPT
XTALOSC
OSC32K
Bluetooth
1
2
2D Graphics
Proc. Unit
(GPU2D)
DTCP
HSI/MIPI
Temp Monitor
USB OTG +
3 HS Ports
Host PHY2
WLAN
MLB 150
EPIT (2)
OTG PHY1
JTAG
(IEEE1149.6)
2xHSIC
PHY
USB OTG
(dev/host)
Keypad
1-Gbps ENET
Ethernet
10/100/1000
Mbps
MLB/Most
Network
144 KB RAM including 16 KB RAM inside the CAAM.
For i.MX 6Solo, there is only one A9-core platform in the chip; for i.MX 6DualLite, there are two A9-core platforms.
Figure 2. i.MX 6Solo/6DualLite System Block Diagram
NOTE
The numbers in brackets indicate number of module instances. For example,
PWM (4) indicates four separate PWM peripherals.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
9
Modules List
3
Modules List
The i.MX 6Solo/6DualLite processors contain a variety of digital and analog modules. Table 3 describes
these modules in alphabetical order.
Table 3. i.MX 6Solo/6DualLite Modules List
Block Mnemonic
Block Name
Subsystem
Brief Description
ARM
ARM Platform
ARM
The ARM Core Platform includes 1x (Solo) Cortex-A9
core for i.MX 6Solo and 2x (Dual) Cortex-A9 cores for
i.MX 6DualLite. It also includes associated sub-blocks,
such as the Level 2 Cache Controller, SCU (Snoop
Control Unit), GIC (General Interrupt Controller), private
timers, watchdog, and CoreSight debug modules.
APBH-DMA
NAND Flash and BCH
ECC DMA controller
System Control
Peripherals
ASRC
Asynchronous Sample
Rate Converter
Multimedia
Peripherals
The Asynchronous Sample Rate Converter (ASRC)
converts the sampling rate of a signal associated to an
input clock into a signal associated to a different output
clock. The ASRC supports concurrent sample rate
conversion of up to 10 channels of about -120dB
THD+N. The sample rate conversion of each channel is
associated to a pair of incoming and outgoing sampling
rates. The ASRC supports up to three sampling rate
pairs.
AUDMUX
Digital Audio Mux
Multimedia
Peripherals
The AUDMUX is a programmable interconnect for voice,
audio, and synchronous data routing between host
serial interfaces (for example, SSI1, SSI2, and SSI3)
and peripheral serial interfaces (audio and voice
codecs). The AUDMUX has seven ports with identical
functionality and programming models. A desired
connectivity is achieved by configuring two or more
AUDMUX ports.
BCH40
Binary-BCH ECC
Processor
System Control
Peripherals
The BCH40 module provides up to 40-bit ECC
encryption/decryption for NAND Flash controller (GPMI)
CAAM
Cryptographic
accelerator and
assurance module
Security
CAAM is a cryptographic accelerator and assurance
module. CAAM implements several encryption and
hashing functions, a run-time integrity checker, and a
Pseudo Random Number Generator (PRNG). The
pseudo random number generator is certified by
Cryptographic Algorithm Validation Program (CAVP) of
National Institute of Standards and Technology (NIST).
Its DRBG validation number is 94 and its SHS validation
number is 1455.
CAAM also implements a Secure Memory mechanism.
In i.MX 6Solo/6DualLite processors, the security
memory provided is 16 KB.
CCM
GPC
SRC
Clock Control Module,
General Power Controller,
System Reset Controller
Clocks, Resets, and
Power Control
These modules are responsible for clock and reset
distribution in the system, and also for the system power
management.
CSI
MIPI CSI-2 i/f
Multimedia
Peripherals
DMA controller used for GPMI2 operation
The CSI IP provides MIPI CSI-2 standard camera
interface port. The CSI-2 interface supports from 80
Mbps to 1 Gbps speed per data lane.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
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Freescale Semiconductor
Modules List
Table 3. i.MX 6Solo/6DualLite Modules List (continued)
Block Mnemonic
Block Name
Subsystem
Brief Description
CSU
Central Security Unit
Security
The Central Security Unit (CSU) is responsible for
setting comprehensive security policy within the i.MX
6Solo/6DualLite platform.
CTI-0
CTI-1
CTI-2
CTI-3
CTI-4
Cross Trigger Interfaces
Debug / Trace
Cross Trigger Interfaces allows cross-triggering based
on inputs from masters attached to CTIs. The CTI
module is internal to the Cortex-A9 Core Platform.
CTM
Cross Trigger Matrix
Debug / Trace
Cross Trigger Matrix IP is used to route triggering events
between CTIs. The CTM module is internal to the
Cortex-A9 Core Platform.
DAP
Debug Access Port
System Control
Peripherals
The DAP provides real-time access for the debugger
without halting the core to:
• System memory and peripheral registers
• All debug configuration registers
The DAP also provides debugger access to JTAG scan
chains. The DAP module is internal to the Cortex-A9
Core Platform.
DCIC-0
DCIC-1
Display Content Integrity
Checker
Automotive IP
The DCIC provides integrity check on portion(s) of the
display. Each i.MX 6Solo/6DualLite processor has two
such modules.
DSI
MIPI DSI i/f
Multimedia
Peripherals
The MIPI DSI IP provides DSI standard display port
interface. The DSI interface support 80 Mbps to 1 Gbps
speed per data lane.
DTCP
DTCP
Multimedia
Peripherals
Provides encryption function according to Digital
Transmission Content Protection standard for traffic
over MLB150.
eCSPI1-4
Configurable SPI
Connectivity
Peripherals
Full-duplex enhanced Synchronous Serial Interface,
with data rate up to 52 Mbit/s. It is configurable to
support Master/Slave modes, four chip selects to
support multiple peripherals.
ENET
Ethernet Controller
Connectivity
Peripherals
The Ethernet Media Access Controller (MAC) is
designed to support 10/100/1000 Mbps Ethernet/IEEE
802.3 networks. An external transceiver interface and
transceiver function are required to complete the
interface to the media. The module has dedicated
hardware to support the IEEE 1588 standard. See the
ENET chapter of the reference manual for details.
Note: The theoretical maximum performance of 1 Gbps
ENET is limited to 470 Mbps (total for Tx and Rx) due to
internal bus throughput limitations. The actual
measured performance in optimized environment is up
to 400 Mbps. For details, see the ERR004512 erratum
in the i.MX 6Solo/6DualLite errata document
(IMX6SDLCE).
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
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11
Modules List
Table 3. i.MX 6Solo/6DualLite Modules List (continued)
Block Mnemonic
Block Name
Subsystem
Brief Description
EPDC
Electrophoretic Display
Controller
Peripherals
The EPDC is a feature-rich, low power, and
high-performance direct-drive, active matrix EPD
controller. It is specifically designed to drive E-INK™
EPD panels, supporting a wide variety of TFT
backplanes. It is available in both i.MX 6DualLite and
i.MX 6Solo.
EPIT-1
EPIT-2
Enhanced Periodic
Interrupt Timer
Timer Peripherals
Each EPIT is a 32-bit “set and forget” timer that starts
counting after the EPIT is enabled by software. It is
capable of providing precise interrupts at regular
intervals with minimal processor intervention. It has a
12-bit prescaler for division of input clock frequency to
get the required time setting for the interrupts to occur,
and counter value can be programmed on the fly.
ESAI
Enhanced Serial Audio
Interface
Connectivity
Peripherals
The Enhanced Serial Audio Interface (ESAI) provides a
full-duplex serial port for serial communication with a
variety of serial devices, including industry-standard
codecs, SPDIF transceivers, and other processors.
The ESAI consists of independent transmitter and
receiver sections, each section with its own clock
generator. All serial transfers are synchronized to a
clock. Additional synchronization signals are used to
delineate the word frames. The normal mode of
operation is used to transfer data at a periodic rate, one
word per period. The network mode is also intended for
periodic transfers; however, it supports up to 32 words
(time slots) per period. This mode can be used to build
time division multiplexed (TDM) networks. In contrast,
the on-demand mode is intended for non-periodic
transfers of data and to transfer data serially at high
speed when the data becomes available.
The ESAI has 12 pins for data and clocking connection
to external devices.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
12
Freescale Semiconductor
Modules List
Table 3. i.MX 6Solo/6DualLite Modules List (continued)
Block Mnemonic
Block Name
Subsystem
Brief Description
uSDHC-1
uSDHC-2
uSDHC-3
uSDHC-4
SD/MMC and SDXC
Enhanced Multi-Media
Card / Secure Digital Host
Controller
Connectivity
Peripherals
i.MX 6Solo/6DualLite specific SoC characteristics:
All four MMC/SD/SDIO controller IPs are identical and
are based on the uSDHC IP. They are:
• Fully compliant with MMC command/response sets
and Physical Layer as defined in the Multimedia Card
System Specification, v4.2/4.3/4.4/4.41 including
high-capacity (size > 2 GB) cards HC MMC.
• Fully compliant with SD command/response sets and
Physical Layer as defined in the SD Memory Card
Specifications, v3.0 including high-capacity SDHC
cards up to 32 GB and SDXC cards up to 2 TB.
• Fully compliant with SDIO command/response sets
and interrupt/read-wait mode as defined in the SDIO
Card Specification, Part E1, v3.0
All four ports support:
• 1-bit or 4-bit transfer mode specifications for SD and
SDIO cards up to UHS-I SDR104 mode (104 MB/s
max)
• 1-bit, 4-bit, or 8-bit transfer mode specifications for
MMC cards up to 52 MHz in both SDR and DDR
modes (104 MB/s max)
However, the SoC level integration and I/O muxing logic
restrict the functionality to the following:
• Instances #1 and #2 are primarily intended to serve
as external slots or interfaces to on-board SDIO
devices. These ports are equipped with “Card
detection” and “Write Protection” pads and do not
support hardware reset.
• Instances #3 and #4 are primarily intended to serve
interfaces to embedded MMC memory or interfaces
to on-board SDIO devices. These ports do not have
“Card detection” and “Write Protection” pads and do
support hardware reset.
• All ports can work with 1.8 V and 3.3 V cards. There
are two completely independent I/O power domains
for Ports #1 and #2 in four bit configuration (SD
interface). Port #3 is placed in his own independent
power domain and port #4 shares power domain with
some other interfaces.
FlexCAN-1
FlexCAN-2
Flexible Controller Area
Network
Connectivity
Peripherals
The CAN protocol was primarily, but not only, designed
to be used as a vehicle serial data bus, meeting the
specific requirements of this field: real-time processing,
reliable operation in the Electromagnetic interference
(EMI) environment of a vehicle, cost-effectiveness and
required bandwidth. The FlexCAN module is a full
implementation of the CAN protocol specification,
Version 2.0 B, which supports both standard and
extended message frames.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
13
Modules List
Table 3. i.MX 6Solo/6DualLite Modules List (continued)
Block Mnemonic
Block Name
Subsystem
Brief Description
512x8 Fuse Box
Electrical Fuse Array
Security
Electrical Fuse Array. Enables to setup Boot Modes,
Security Levels, Security Keys, and many other system
parameters.
The i.MX 6Solo/6DualLite processors consist of
512x8-bit fuse fox accessible through OCOTP_CTRL
interface
GPIO-1
GPIO-2
GPIO-3
GPIO-4
GPIO-5
GPIO-6
GPIO-7
General Purpose I/O
Modules
System Control
Peripherals
Used for general purpose input/output to external ICs.
Each GPIO module supports 32 bits of I/O.
GPMI
General Purpose
Media Interface
Connectivity
Peripherals
The GPMI module supports up to 8x NAND devices.
40-bit ECC encryption/decryption for NAND Flash
controller (GPMI2). The GPMI supports separate DMA
channels per NAND device.
GPT
General Purpose Timer
Timer Peripherals
Each GPT is a 32-bit “free-running” or “set and forget”
mode timer with programmable prescaler and compare
and capture register. A timer counter value can be
captured using an external event and can be configured
to trigger a capture event on either the leading or trailing
edges of an input pulse. When the timer is configured to
operate in “set and forget” mode, it is capable of
providing precise interrupts at regular intervals with
minimal processor intervention. The counter has output
compare logic to provide the status and interrupt at
comparison. This timer can be configured to run either
on an external clock or on an internal clock.
GPU3Dv5
Graphics Processing
Unit, ver.5
Multimedia
Peripherals
The GPU3Dv5 provides hardware acceleration for 3D
graphics algorithms with sufficient processor power to
run desktop quality interactive graphics applications on
displays up to HD1080 resolution. The GPU3D provides
OpenGL ES 2.0, including extensions, OpenGL ES 1.1,
and OpenVG 1.1
GPU2Dv2
Graphics Processing
Unit-2D, ver 2
Multimedia
Peripherals
The GPU2Dv2 provides hardware acceleration for 2D
graphics algorithms, such as Bit BLT, stretch BLT, and
many other 2D functions.
HDMI Tx
HDMI Tx i/f
Multimedia
Peripherals
The HDMI module provides HDMI standard i/f port to an
HDMI 1.4 compliant display.
HSI
MIPI HSI i/f
Connectivity
Peripherals
The MIPI HSI provides a standard MIPI interface to the
applications processor.
I2C-1
I2C-2
I2C-3
I2C-4
I2C Interface
Connectivity
Peripherals
I2C provide serial interface for external devices. Data
rates of up to 400 kbps are supported.
IOMUXC
IOMUX Control
System Control
Peripherals
This module enables flexible IO multiplexing. Each IO
pad has default and several alternate functions. The
alternate functions are software configurable.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
14
Freescale Semiconductor
Modules List
Table 3. i.MX 6Solo/6DualLite Modules List (continued)
Block Mnemonic
Block Name
Subsystem
Brief Description
IPUv3H
Image Processing Unit,
ver.3H
Multimedia
Peripherals
IPUv3H enables connectivity to displays and video
sources, relevant processing and synchronization and
control capabilities, allowing autonomous operation.
The IPUv3H supports concurrent output to two display
ports and concurrent input from two camera ports,
through the following interfaces:
• Parallel Interfaces for both display and camera
• Single/dual channel LVDS display interface
• HDMI transmitter
• MIPI/DSI transmitter
• MIPI/CSI-2 receiver
The processing includes:
• Image conversions: resizing, rotation, inversion, and
color space conversion
• A high-quality de-interlacing filter
• Video/graphics combining
• Image enhancement: color adjustment and gamut
mapping, gamma correction, and contrast
enhancement
• Support for display backlight reduction
KPP
Key Pad Port
Connectivity
Peripherals
KPP Supports 8x8 external key pad matrix. KPP
features are:
• Open drain design
• Glitch suppression circuit design
• Multiple keys detection
• Standby key press detection
LDB
LVDS Display Bridge
Connectivity
Peripherals
LVDS Display Bridge is used to connect the IPU (Image
Processing Unit) to External LVDS Display Interface.
LDB supports two channels; each channel has following
signals:
• One clock pair
• Four data pairs
Each signal pair contains LVDS special differential pad
(PadP, PadM).
MLB150
MediaLB
Connectivity /
Multimedia
Peripherals
The MLB interface module provides a link to a MOST®
data network, using the standardized MediaLB protocol
(up to 6144 fs).
The module is backward compatible to MLB-50.
MMDC
Multi-Mode DDR
Controller
Connectivity
Peripherals
DDR Controller has the following features:
• Supports 16/32-bit DDR3-800 (LV) or LPDDR2-800
in i.MX 6Solo
• Supports 16/32/64-bit DDR3-800 (LV) or
LPDDR2-800 in i.MX 6DualLite
• Supports 2x32 LPDDR2-800 in i.MX 6DualLite
• Supports up to 4 GByte DDR memory space
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
15
Modules List
Table 3. i.MX 6Solo/6DualLite Modules List (continued)
Block Mnemonic
Block Name
Subsystem
Brief Description
OCOTP_CTRL
OTP Controller
Security
The On-Chip OTP controller (OCOTP_CTRL) provides
an interface for reading, programming, and/or overriding
identification and control information stored in on-chip
fuse elements. The module supports
electrically-programmable poly fuses (eFUSEs). The
OCOTP_CTRL also provides a set of volatile
software-accessible signals that can be used for
software control of hardware elements, not requiring
non-volatility. The OCOTP_CTRL provides the primary
user-visible mechanism for interfacing with on-chip fuse
elements. Among the uses for the fuses are unique chip
identifiers, mask revision numbers, cryptographic keys,
JTAG secure mode, boot characteristics, and various
control signals, requiring permanent non-volatility.
OCRAM
On-Chip Memory
controller
Data Path
The On-Chip Memory controller (OCRAM) module is
designed as an interface between system’s AXI bus and
internal (on-chip) SRAM memory module.
In i.MX 6Solo/6DualLite processors, the OCRAM is
used for controlling the 128 KB multimedia RAM through
a 64-bit AXI bus.
OSC32KHz
OSC32KHz
Clocking
Generates 32.768 KHz clock from external crystal.
PCIe
PCI Express 2.0
Connectivity
Peripherals
PMU
Power-Management
functions
Data Path
PWM-1
PWM-2
PWM-3
PWM-4
Pulse Width Modulation
Connectivity
Peripherals
The pulse-width modulator (PWM) has a 16-bit counter
and is optimized to generate sound from stored sample
audio images and it can also generate tones. It uses
16-bit resolution and a 4x16 data FIFO to generate
sound.
PXP
PiXel Processing Pipeline
Display Peripherals
A high-performance pixel processor capable of 1
pixel/clock performance for combined operations, such
as color-space conversion, alpha blending,
gamma-mapping, and rotation. The PXP is enhanced
with features specifically for gray scale applications. In
addition, the PXP supports traditional pixel/frame
processing paths for still-image and video processing
applications, allowing it to interface with the integrated
EPD.
RAM
128 KB
Internal RAM
Internal Memory
Internal RAM, which is accessed through OCRAM
memory controller.
RAM
16 KB
Secure/non-secure RAM
Secured Internal
Memory
Secure/non-secure Internal RAM, interfaced through
the CAAM.
ROM
96KB
Boot ROM
Internal Memory
Supports secure and regular Boot Modes. Includes read
protection on 4K region for content protection.
ROMCP
ROM Controller with
Patch
Data Path
The PCIe IP provides PCI Express Gen 2.0 functionality.
Integrated power management unit. Used to provide
power to various SoC domains.
ROM Controller with ROM Patch support
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
16
Freescale Semiconductor
Modules List
Table 3. i.MX 6Solo/6DualLite Modules List (continued)
Block Mnemonic
Block Name
Subsystem
Brief Description
SDMA
Smart Direct Memory
Access
System Control
Peripherals
The SDMA is multi-channel flexible DMA engine. It
helps in maximizing system performance by off-loading
the various cores in dynamic data routing. It has the
following features:
• Powered by a 16-bit Instruction-Set micro-RISC
engine
• Multi-channel DMA supporting up to 32 time-division
multiplexed DMA channels
• 48 events with total flexibility to trigger any
combination of channels
• Memory accesses including linear, FIFO, and 2D
addressing
• Shared peripherals between ARM and SDMA
• Very fast Context-Switching with 2-level priority
based preemptive multi-tasking
• DMA units with auto-flush and prefetch capability
• Flexible address management for DMA transfers
(increment, decrement, and no address changes on
source and destination address)
• DMA ports can handle unit-directional and
bi-directional flows (copy mode)
• Up to 8-word buffer for configurable burst transfers
• Support of byte-swapping and CRC calculations
• Library of Scripts and API is available
SJC
System JTAG Controller
System Control
Peripherals
The SJC provides JTAG interface, which complies with
JTAG TAP standards, to internal logic. The i.MX
6Solo/6DualLite processors use JTAG port for
production, testing, and system debugging. In addition,
the SJC provides BSR (Boundary Scan Register)
standard support, which complies with IEEE1149.1 and
IEEE1149.6 standards.
The JTAG port must be accessible during platform initial
laboratory bring-up, for manufacturing tests and
troubleshooting, as well as for software debugging by
authorized entities. The i.MX 6Solo/6DualLite SJC
incorporates three security modes for protecting against
unauthorized accesses. Modes are selected through
eFUSE configuration.
SPDIF
Sony Philips Digital
Interconnect Format
Multimedia
Peripherals
A standard audio file transfer format, developed jointly
by the Sony and Phillips corporations. Has Transmitter
and Receiver functionality.
SNVS
Secure Non-Volatile
Storage
Security
Secure Non-Volatile Storage, including Secure Real
Time Clock, Security State Machine, Master Key
Control, and Violation/Tamper Detection and reporting.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
17
Modules List
Table 3. i.MX 6Solo/6DualLite Modules List (continued)
Block Mnemonic
Block Name
Subsystem
Brief Description
SSI-1
SSI-2
SSI-3
I2S/SSI/AC97 Interface
Connectivity
Peripherals
The SSI is a full-duplex synchronous interface, which is
used on the AP to provide connectivity with off-chip
audio peripherals. The SSI supports a wide variety of
protocols (SSI normal, SSI network, I2S, and AC-97), bit
depths (up to 24 bits per word), and clock / frame sync
options.
The SSI has two pairs of 8x24 FIFOs and hardware
support for an external DMA controller in order to
minimize its impact on system performance. The
second pair of FIFOs provides hardware interleaving of
a second audio stream that reduces CPU overhead in
use cases where two time slots are being used
simultaneously.
TEMPMON
Temperature Monitor
System Control
Peripherals
The Temperature sensor IP is used for detecting die
temperature. The temperature read out does not reflect
case or ambient temperature. It reflects the temperature
in proximity of the sensor location on the die.
Temperature distribution may not be uniformly
distributed, therefore the read out value may not be the
reflection of the temperature value of the entire die.
TZASC
Trust-Zone Address
Space Controller
Security
The TZASC (TZC-380 by ARM) provides security
address region control functions required for intended
application. It is used on the path to the DRAM
controller.
UART-1
UART-2
UART-3
UART-4
UART-5
UART Interface
Connectivity
Peripherals
Each of the UARTv2 modules support the following
serial data transmit/receive protocols and
configurations:
• 7- or 8-bit data words, 1 or 2 stop bits, programmable
parity (even, odd or none)
• Programmable baud rates up to 5 MHz.
• 32-byte FIFO on Tx and 32 half-word FIFO on Rx
supporting auto-baud
• IrDA 1.0 support (up to SIR speed of 115200 bps)
• Option to operate as 8-pins full UART, DCE, or DTE
USBOH3
USB 2.0 High Speed
OTG and 3x HS Hosts
Connectivity
Peripherals
USBOH3 contains:
• One high-speed OTG module with integrated HS
USB PHY
• One high-speed Host module with integrated HS
USB PHY
• Two identical high-speed Host modules connected to
HSIC USB ports.
VDOA
VDOA
Multimedia
Peripherals
Video Data Order Adapter (VDOA): used to re-order
video data from the “tiled” order used by the VPU to the
conventional raster-scan order needed by the IPU.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
18
Freescale Semiconductor
Modules List
Table 3. i.MX 6Solo/6DualLite Modules List (continued)
Block Mnemonic
Block Name
Subsystem
Brief Description
VPU
Video Processing Unit
Multimedia
Peripherals
A high-performing video processing unit (VPU), which
covers many SD-level and HD-level video decoders and
SD-level encoders as a multi-standard video codec
engine as well as several important video processing,
such as rotation and mirroring.
See the i.MX 6Solo/6DualLite Reference Manual
(IMX6SDLRM) for complete list of VPU’s
decoding/encoding capabilities.
WDOG-1
Watch Dog
Timer Peripherals
The Watch Dog Timer supports two comparison points
during each counting period. Each of the comparison
points is configurable to evoke an interrupt to the ARM
core, and a second point evokes an external event on
the WDOG line.
WDOG-2
(TZ)
Watch Dog (TrustZone)
Timer Peripherals
The TrustZone Watchdog (TZ WDOG) timer module
protects against TrustZone starvation by providing a
method of escaping normal mode and forcing a switch
to the TZ mode. TZ starvation is a situation where the
normal OS prevents switching to the TZ mode. Such
situation is undesirable as it can compromise the
system’s security. Once the TZ WDOG module is
activated, it must be serviced by TZ software on a
periodic basis. If servicing does not take place, the timer
times out. Upon a time-out, the TZ WDOG asserts a TZ
mapped interrupt that forces switching to the TZ mode.
If it is still not served, the TZ WDOG asserts a security
violation signal to the CSU. The TZ WDOG module
cannot be programmed or deactivated by a normal
mode SW.
WEIM
NOR-Flash /PSRAM
interface
Connectivity
Peripherals
The WEIM NOR-FLASH / PSRAM provides:
• Support 16-bit (in muxed IO mode only) PSRAM
memories (sync and async operating modes), at slow
frequency
• Support 16-bit (in muxed IO mode only) NOR-Flash
memories, at slow frequency
• Multiple chip selects
XTALOSC
Crystal Oscillator I/F
Clocks, Resets, and
Power Control
The XTALOSC module enables connectivity to external
crystal oscillator device. In a typical application
use-case, it is used for 24 MHz oscillator to provide USB
required frequency.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
19
Modules List
3.1
Special Signal Considerations
Table 4 lists special signal considerations for the i.MX 6Solo/6DualLite processors. The signal names are
listed in alphabetical order.
The package contact assignments can be found in Section 6, “Package Information and Contact
Assignments.” Signal descriptions are provided in the i.MX 6Solo/6DualLite Reference Manual
(IMX6SDLRM).
Table 4. Special Signal Considerations
Signal Name
Remarks
CLK1_P/CLK1_N
CLK2_P/CLK2_N
Two general purpose differential high speed clock Input/outputs are provided.
Any or both of them could be used:
• To feed external reference clock to the PLLs and further to the modules inside SoC, for example
as alternate reference clock for PCIe, Video/Audio interfaces, etc.
• To output internal SoC clock to be used outside the SoC as either reference clock or as a
functional clock for peripherals, for example it could be used as an output of the PCIe master
clock (root complex use)
See the i.MX 6Solo/6DualLite reference manual for details on the respective clock trees.
The clock inputs/outputs are LVDS differential pairs compatible with TIA/EIA-644 standard, the
maximum frequency range supported is 0...600 MHz.
Alternatively one may use single ended signal to drive CLKx_P input. In this case corresponding
CLKx_N input should be tied to the constant voltage level equal 1/2 of the input signal swing.
Termination should be provided in case of high frequency signals.
See LVDS pad electrical specification for further details.
After initialization, the CLKx inputs/outputs could be disabled (if not used). If unused any or both of
the CLKx_N/P pairs may be left floating.
XTALOSC_RTC_XTALI/
RTC_XTALO
If the user wishes to configure XTALOSC_RTC_XTALI and RTC_XTALO as an RTC oscillator, a
32.768 kHz crystal, (100 k ESR, 10 pF load) should be connected between
XTALOSC_RTC_XTALI and RTC_XTALO. Remember that the capacitors implemented on either
side of the crystal are about twice the crystal load capacitor. To hit the exact oscillation frequency,
the board capacitors need to be reduced to account for board and chip parasitics. The integrated
oscillation amplifier is self biasing, but relatively weak. Care must be taken to limit parasitic leakage
from XTALOSC_RTC_XTALI and RTC_XTALO to either power or ground (>100 M). This will
debias the amplifier and cause a reduction of startup margin. Typically XTALOSC_RTC_XTALI and
RTC_XTALO should bias to approximately 0.5 V.
If it is desired to feed an external low frequency clock into XTALOSC_RTC_XTALI the RTC_XTALO
pin should be left floating or driven with a complimentary signal. The logic level of this forcing clock
should not exceed VDD_SNVS_CAP level and the frequency should be <100 kHz under typical
conditions.
XTALI/XTALO
A 24.0 MHz crystal should be connected between XTALI and XTALO. level and the frequency
should be <32 MHz under typical conditions.
The crystal must be rated for a maximum drive level of 250 W. An ESR (equivalent series
resistance) of typical 80  is recommended. Freescale BSP (board support package) software
requires 24 MHz on XTALI/XTALO.
The crystal can be eliminated if an external 24 MHz oscillator is available in the system. In this
case, XTALI must be directly driven by the external oscillator and XTALO is floated. The XTALI
signal level must swing from ~0.8 x NVCC_PLL_OUT to ~0.2 V.
If this clock is used as a reference for USB and PCIe, then there are strict frequency tolerance and
jitter requirements. See OSC24M chapter and relevant interface specifications chapters for details.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
20
Freescale Semiconductor
Modules List
Table 4. Special Signal Considerations (continued)
Signal Name
Remarks
DRAM_VREF
When using DDR_VREF with DDR I/O, the nominal reference voltage must be half of the
NVCC_DRAM supply. The user must tie DDR_VREF to a precision external resistor divider. Use a
1 k 0.5% resistor to GND and a 1 k 0.5% resistor to NVCC_DRAM. Shunt each resistor with a
closely-mounted 0.1 µF capacitor.
To reduce supply current, a pair of 1.5 k 0.1% resistors can be used. Using resistors with
recommended tolerances ensures the ± 2% DDR_VREF tolerance (per the DDR3 specification) is
maintained when four DDR3 ICs plus the i.MX 6Solo/6DualLite are drawing current on the resistor
divider.
It is recommended to use regulated power supply for “big” memory configurations (more that eight
devices)
DRAM calibration resistor 240  1% used as reference during DRAM output buffer driver
calibration should be connected between this pad and GND.
ZQPAD
NVCC_LVDS_2P5
The DDR pre-drivers share the NVCC_LVDS_2P5 ball with the LVDS interface. This ball can be
shorted to VDD_HIGH_CAP on the circuit board.
VDD_FA
FA_ANA
These signals are reserved for Freescale manufacturing use only. User must tie both connections
to GND.
GPANAIO
This signal is reserved for Freescale manufacturing use only. User must leave this connection
floating.
JTAG_nnnn
The JTAG interface is summarized in Table 5. Use of external resistors is unnecessary. However,
if external resistors are used, the user must ensure that the on-chip pull-up/down configuration is
followed. For example, do not use an external pull down on an input that has on-chip pull-up.
JTAG_TDO is configured with a keeper circuit such that the floating condition is eliminated if an
external pull resistor is not present. An external pull resistor on JTAG_TDO is detrimental and
should be avoided.
JTAG_MOD is referenced as SJC_MOD in the i.MX 6Solo/6DualLite reference manual. Both
names refer to the same signal. JTAG_MOD must be externally connected to GND for normal
operation. Termination to GND through an external pull-down resistor (such as 1 k) is allowed.
JTAG_MOD set to hi configures the JTAG interface to mode compliant with IEEE1149.1 standard.
JTAG_MOD set to low configures the JTAG interface for common SW debug adding all the system
TAPs to the chain.
NC
These signals are No Connect (NC) and should be floated by the user.
SRC_POR_B
This cold reset negative logic input resets all modules and logic in the IC.
May be used in addition to internally generated power on reset signal (logical AND, both internal
and external signals are considered active low).
ONOFF
In normal mode may be connected to ON/OFF button (De-bouncing provided at this input).
Internally this pad is pulled up. Short connection to GND in OFF mode causes internal power
management state machine to change state to ON. In ON mode short connection to GND
generates interrupt (intended to SW controllable power down). Long above ~5s connection to GND
causes “forced” OFF.
TEST_MODE
TEST_MODE is for Freescale factory use. This signal is internally connected to an on-chip
pull-down device. The user must either float this signal or tie it to GND.
PCIE_REXT
The impedance calibration process requires connection of reference resistor 200  1% precision
resistor on PCIE_REXT pad to ground.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
21
Electrical Characteristics
Table 4. Special Signal Considerations (continued)
Signal Name
Remarks
CSI_REXT
MIPI CSI PHY reference resistor. Use 6.04 K 1% resistor connected between this pad and GND
DSI_REXT
MIPI DSI PHY reference resistor. Use 6.04 K 1% resistor connected between this pad and GND
Table 5. JTAG Controller Interface Summary
3.2
JTAG
I/O Type
On-chip Termination
JTAG_TCK
Input
47 kpull-up
JTAG_TMS
Input
47 kpull-up
JTAG_TDI
Input
47 kpull-up
JTAG_TDO
3-state output
Keeper
JTAG_TRSTB
Input
47 kpull-up
JTAG_MOD
Input
100 kpull-up
Recommended Connections for Unused Analog Interfaces
The recommended connections for unused analog interfaces can be found in the section, “Unused analog
interfaces,” of the Hardware Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of
Applications Processors (IMX6DQ6SDLHDG).
4
Electrical Characteristics
This section provides the device and module-level electrical characteristics for the i.MX 6Solo/6DualLite
processors.
4.1
Chip-Level Conditions
This section provides the device-level electrical characteristics for the IC. See Table 6 for a quick reference
to the individual tables and sections.
Table 6. i.MX 6Solo/6DualLite Chip-Level Conditions
For these characteristics, …
Topic appears …
Absolute Maximum Ratings
on page 23
BGA Case 2240 Package Thermal Resistance
on page 24
Operating Ranges
on page 25
External Clock Sources
on page 27
Maximum Supply Currents
on page 28
Low Power Mode Supply Currents
on page 29
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
22
Freescale Semiconductor
Electrical Characteristics
Table 6. i.MX 6Solo/6DualLite Chip-Level Conditions (continued)
For these characteristics, …
Topic appears …
USB PHY Current Consumption
on page 31
PCIe 2.0 Power Consumption
on page 31
4.1.1
Absolute Maximum Ratings
Table 7. Absolute Maximum Ratings
Parameter Description
Symbol
Min
Max
Unit
VDD_ARM_IN
VDD_SOC_IN
-0.3
1.5
V
VDD_ARM_CAP
VDD_SOC_CAP
VDD_PU_CAP
-0.3
1.3
V
GPIO supply voltage
Supplies denoted as I/O supply
-0.5
3.6
V
DDR I/O supply voltage
Supplies denoted as I/O supply
-0.4
1.975
V
MLB I/O supply voltage
Supplies denoted as I/O supply
-0.3
2.8
V
LVDS I/O supply voltage
Supplies denoted as I/O supply
-0.3
2.8
V
VDD_SNVS_IN supply voltage
VDD_SNVS_IN
-0.3
3.3
V
VDD_HIGH_IN supply voltage
VDD_HIGH_IN
-0.3
3.6
V
USB VBUS
USB_H1_VBUS
USB_OTG_VBUS
—
5.25
V
Input voltage on USB_OTG_DP, USB_OTG_DN,
USB_H1_DP, USB_H1_DN pins
USB_DP/USB_DN
-0.3
3.63
V
Vin/Vout
-0.5
OVDD1+0.3
V
—
—
2000
500
V
-40
150
oC
Core supply voltages
Internal supply voltages
Input/output voltage range
ESD damage immunity:
Vesd
• Human Body Model (HBM)
• Charge Device Model (CDM)
Storage temperature range
1
TSTORAGE
OVDD is the I/O supply voltage.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
23
Electrical Characteristics
4.1.2
4.1.2.1
Thermal Resistance
BGA Case 2240 Package Thermal Resistance
Table 8 displays the thermal resistance data.
Table 8. Thermal Resistance Data
Rating
Test Conditions
Junction to Ambient1
Symbol
Value
Unit
Single-layer board (1s); natural convection2
Four-layer board (2s2p); natural convection2
RJA
RJA
38
23
o
Single-layer board (1s); airflow 200 ft/min2,3
Four-layer board (2s2p); airflow 200 ft/min2,3
RJA
RJA
30
20
o
Junction to Board1,4
RJB
14
o
Junction to Case1,5
RJC
6
oC/W
JT
2
oC/W
Junction to Ambient1
Junction to Package Top1,6
1
2
3
4
5
6
Natural Convection
C/W
C/W
o
C/W
C/W
o
C/W
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. Thermal test board meets JEDEC specification for the specified
package.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
24
Freescale Semiconductor
Electrical Characteristics
4.1.3
Operating Ranges
Table 9 provides the operating ranges of the i.MX 6Solo/6DualLite processors. For details on the chip's
power structure, see the “Power Management Unit (PMU)” chapter of the i.MX 6Solo/6DualLite Reference
Manual (IMX6SDLRM).
Table 9. Operating Ranges
Parameter
Description
Run mode: LDO
enabled
Run mode: LDO
bypassed
Symbol
Min
Typ
Max1
Unit
Comment2
VDD_ARM_IN
1.3503
—
1.5
V
LDO Output Set Point (VDD_ARM_CAP) =
1.225 V minimum for operation up to 996MHz.
1.2753
—
1.5
V
LDO Output Set Point (VDD_ARM_CAP) =
1.150 V minimum for operation up to 792MHz.
1.1753
—
1.5
V
LDO Output Set Point (VDD_ARM_CAP) =
1.05 V minimum for operation up to 396MHz.
VDD_SOC_IN
1.2753,4
—
1.5
V
VPU  328 MHz, VDD_SOC and VDD_PU
LDO outputs (VDD_SOC_CAP and
VDD_PU_CAP) = 1.225 V maximum and 1.15
V minimum.
VDD_ARM_IN
1.250
—
1.3
V
LDO bypassed for operation up to 996 MHz
1.150
—
1.3
V
LDO bypassed for operation up to 792 MHz
1.05
—
1.3
V
LDO bypassed for operation up to 396 MHz
VDD_SOC_IN
1.155
—
1.2256
V
LDO bypassed for operation VPU  328 MHz
VDD_ARM_IN
0.9
—
1.3
V
Refer to Table 12, "Stop Mode Current and
Power Consumption," on page 29.
VDD_SOC_IN
0.9
—
1.2256
V
VDD_HIGH_IN
2.8
—
3.3
V
Must match the range of voltages that the
rechargeable backup battery supports.
Backup battery supply
range
VDD_SNVS_IN7
2.9
—
3.3
V
Should be supplied from the same supply as
VDD_HIGH_IN if the system does not require
keeping real time and other data on OFF
state.
USB supply voltages
USB_OTG_VBUS
4.4
—
5.25
V
—
Standby/DSM mode
VDD_HIGH internal
regulator
—
USB_H1_VBUS
4.4
—
5.25
V
NVCC_DRAM
1.14
1.2
1.3
V
LPDDR2
1.425
1.5
1.575
V
DDR3
1.283
1.35
1.45
V
DDR3_L
1.15
—
2.625
V
1.15 V – 1.30 V in HSIC 1.2 V mode
1.43 V – 1.58 V in RMGII 1.5 V mode
1.70 V – 1.90 V in RMGII 1.8 V mode
2.25 V – 2.625 V in RMGII 2.5 V mode
DDR I/O supply
voltage
NVCC_RGMII
Supply for RGMII I/O
power group8
—
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
25
Electrical Characteristics
Table 9. Operating Ranges (continued)
Parameter
Description
GPIO supply
voltages8
HDMI supply voltages
PCIe supply voltages
Symbol
Min
Typ
Max1
Unit
Comment2
NVCC_CSI,
NVCC_EIM,
NVCC_ENET,
NVCC_GPIO,
NVCC_LCD,
NVCC_NANDF,
NVCC_SD1,
NVCC_SD2,
NVCC_SD3,
NVCC_JTAG
1.65
1.8,
2.8,
3.3
3.6
V
—
NVCC_LVDS_2P59
NVCC_MIPI
2.25
2.5
2.75
V
—
HDMI_VP
0.99
1.1
1.3
V
—
HDMI_VPH
2.25
2.5
2.75
V
—
PCIE_VP
1.023
1.1
1.225
V
—
PCIE_VPH
2.325
2.5
2.75
V
—
PCIE_VPTX
1.023
1.1
1.225
V
—
See i.MX 6Solo/6DualLite Product Lifetime
Usage Estimates Application Note, AN4725,
for information on product lifetime for this
processor.
See i.MX 6Solo/6DualLite Product Lifetime
Usage Estimates Application Note, AN4725,
for information on product lifetime for this
processor.
Junction temperature
Extended commercial
T
J
-20
—
105
oC
Junction temperature
Standard commercial
T
J
0
—
95
oC
1
2
3
4
5
6
7
8
9
Applying the maximum voltage results in maximum power consumption and heat generation. Freescale recommends a voltage
set point = (Vmin + the supply tolerance). This results in an optimized power/speed ratio.
See the Hardware Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors
(IMX6DQ6SDLHDG) for bypass capacitors requirements for each of the *_CAP supply outputs.
VDD_ARM_IN and VDD_SOC_IN must be 125 mV higher than the LDO Output Set Point for correct regulator supply voltage.
In LDO enabled mode, the internal LDO output set points must be configured such that the:
VDD_ARM LDO output set point does not exceed the VDD_SOC LDO output set point by more than 100 mV.
VDD_SOC LDO output set point is equal to the VDD_PU LDO output set point.
The VDD_ARM LDO output set point can be lower than the VDD_SOC LDO output set point, however, the minimum output set
points shown in this table must be maintained.
In LDO bypassed mode, the external power supply must ensure that VDD_ARM_IN does not exceed VDD_SOC_IN by more
than 100 mV. The VDD_ARM_IN supply voltage can be lower than the VDD_SOC_IN supply voltage. The minimum voltages
shown in this table must be maintained.
When VDD_SOC_IN does not supply PCIE_VP and PCIE_VPTX, or when the PCIe PHY is not used, then this maximum can be
1.3 V.
While setting VDD_SNVS_IN voltage with respect to Charging Currents and RTC, refer to Hardware Development Guide for i.MX
6Dual, 6Quad, 6Solo, 6DualLite Families of Applications Processors (IMX6DQ6SDLHDG).
All digital I/O supplies (NVCC_xxxx) must be powered under normal conditions whether the associated I/O pins are in use or not
and associated IO pins need to have a Pull-up or Pull-down resistor applied to limit any floating gate current.
This supply also powers the pre-drivers of the DDR IO pins, hence, it must be always provided, even when LVDS is not used.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
26
Freescale Semiconductor
Electrical Characteristics
4.1.4
External Clock Sources
Each i.MX 6Solo/6DualLite processor has two external input system clocks: a low frequency
(RTC_XTALI) and a high frequency (XTALI).
The RTC_XTALI is used for low-frequency functions. It supplies the clock for wake-up circuit,
power-down real time clock operation, and slow system and watch-dog counters. The clock input can be
connected to either external oscillator or a crystal using internal oscillator amplifier. Additionally, there is
an internal ring oscillator, which can be used instead of the RTC_XTALI if accuracy is not important.
NOTE
The internal RTC oscillator does not provide an accurate frequency and is
affected by process, voltage and temperature variations. Freescale strongly
recommends using an external crystal as the RTC_XTALI reference. If the
internal oscillator is used instead, careful consideration should be given to
the timing implications on all of the SoC modules dependent on this clock.
The system clock input XTALI is used to generate the main system clock. It supplies the PLLs and other
peripherals. The system clock input can be connected to either external oscillator or a crystal using internal
oscillator amplifier.
Table 10 shows the interface frequency requirements.
Table 10. External Input Clock Frequency
Parameter Description
Symbol
Min
Typ
Max
Unit
RTC_XTALI Oscillator1,2
fckil
—
32.7683/32.0
—
kHz
XTALI Oscillator2,4
fxtal
—
24
—
MHz
1
External oscillator or a crystal with internal oscillator amplifier.
The required frequency stability of this clock source is application dependent. For recommendations, see the Hardware
Development Guide for i.MX 6Dual, 6Quad, 6Solo, 6DualLite Families of Applications Processors (IMX6DQ6SDLHDG).
3 Recommended nominal frequency 32.768 kHz.
4 External oscillator or a fundamental frequency crystal with internal oscillator amplifier.
2
The typical values shown in Table 10 are required for use with Freescale BSPs to ensure precise time
keeping and USB operation. For XTALOSC_RTC_XTALI operation, two clock sources are available.
• On-chip 40 kHz ring oscillator—this clock source has the following characteristics:
— Approximately 25 µA more Idd than crystal oscillator
— Approximately ±50% tolerance
— No external component required
— Starts up quicker than 32 kHz crystal oscillator
• External crystal oscillator with on-chip support circuit:
— At power up, ring oscillator is utilized. After crystal oscillator is stable, the clock circuit
switches over to the crystal oscillator automatically.
— Higher accuracy than ring oscillator
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
27
Electrical Characteristics
— If no external crystal is present, then the ring oscillator is used
The decision of choosing a clock source should be taken based on real-time clock use and precision
timeout.
4.1.5
Maximum Supply Currents
The Power Virus numbers shown in Table 11 represent a use case designed specifically to show the
maximum current consumption possible. All cores are running at the defined maximum frequency and are
limited to L1 cache accesses only to ensure no pipeline stalls. Although a valid condition, it would have a
very limited practical use case, if at all, and be limited to an extremely low duty cycle unless the intention
was to specifically show the worst case power consumption.
The Freescale power management IC, MMPF0100xxxx, which is targeted for the i.MX 6 series processor
family, supports the power consumption shown in Table 11, however a robust thermal design is required
for the increased system power dissipation.
See the i.MX 6Solo/6DualLite Power Consumption Measurement Application Note (AN4576) for more
details on typical power consumption under various use case definitions.
Table 11. Maximum Supply Currents
Power Line
Conditions
Max Current
Unit
VDD_ARM_IN
996 MHz ARM clock
based on Power Virus
operation
2200
mA
VDD_SOC_IN
996 MHz ARM clock
1260
mA
VDD_HIGH_IN
—
1251
mA
VDD_SNVS_IN
—
2752
A
USB_OTG_VBUS/USB_H1_VBUS (LDO 3P0)
—
253
mA
Primary Interface (IO) Supplies
NVCC_DRAM
—
—4
—
NVCC_ENET
N=10
Use maximum IO equation5
—
NVCC_LCD
N=29
Use maximum IO equation5
—
NVCC_GPIO
N=24
Use maximum IO equation5
—
NVCC_CSI
N=20
Use maximum IO equation5
—
NVCC_EIM
N=53
Use maximum IO equation5
—
NVCC_JTAG
N=6
Use maximum IO equation5
—
NVCC_RGMII
N=6
Use maximum IO equation5
—
NVCC_SD1
N=6
Use maximum IO equation5
—
NVCC_SD2
N=6
Use maximum IO equation5
—
NVCC_SD3
N=11
Use maximum IO equation5
—
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
28
Freescale Semiconductor
Electrical Characteristics
Table 11. Maximum Supply Currents (continued)
Power Line
NVCC_NANDF
Conditions
Max Current
Unit
N=26
Use maximum IO equation5
—
—
NVCC_LVDS2P5 is
connected to
VDD_HIGH_CAP at the
board level. VDD_HIGH_CAP
is capable of handing the
current required by
NVCC_LVDS2P5.
—
—
1
mA
NVCC_LVDS2P5
MISC
DDR_VREF
1
The actual maximum current drawn from VDD_HIGH_IN will be as shown plus any additional current drawn from the
VDD_HIGH_CAP outputs, depending upon actual application configuration (for example, NVCC_LVDS_2P5, NVCC_MIPI, or
HDMI and PCIe VPH supplies).
2 Under normal operating conditions, the maximum current on VDD_SNVS_IN is shown in Table 11. The maximum
VDD_SNVS_IN current may be higher depending on specific operating configurations, such as BOOT_MODE[1:0] not equal
to 00, or use of the Tamper feature. During initial power on, VDD_SNVS_IN can draw up to 1 mA if the supply is capable of
sourcing that current. If less than 1 mA is available, the VDD_SNVS_CAP charge time will increase.
3 This is the maximum current per active USB physical interface.
4 The DRAM power consumption is dependent on several factors, such as external signal termination. DRAM power calculators
are typically available from the memory vendors. They take in account factors, such as signal termination. See the i.MX
6Solo/DualLite Power Consumption Measurement Application Note (AN4576) for examples of DRAM power consumption
during specific use case scenarios.
5 General equation for estimated, maximum power consumption of an IO power supply:
Imax = N x C x V x (0.5 x F)
Where:
N—Number of IO pins supplied by the power line
C—Equivalent external capacitive load
V—IO voltage
(0.5 xF)—Data change rate. Up to 0.5 of the clock rate (F)
In this equation, Imax is in Amps, C in Farads, V in Volts, and F in Hertz.
4.1.6
Low Power Mode Supply Currents
Table 12 shows the current core consumption (not including I/O) of i.MX 6Solo/6DualLite processors in
selected low power modes.
Table 12. Stop Mode Current and Power Consumption
Mode
Test Conditions
WAIT
• ARM, SoC, and PU LDOs are set to 1.225
• HIGH LDO set to 2.5 V
• Clocks are gated.
• DDR is in self refresh.
• PLLs are active in bypass (24MHz)
• Supply Voltages remain ON
Supply
Typical1
VDD_ARM_IN (1.4V)
4.5
VDD_SOC_IN (1.4V)
23
VDD_HIGH_IN (3.0V)
13.5
Total
79
Units
mA
mW
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
29
Electrical Characteristics
Table 12. Stop Mode Current and Power Consumption (continued)
Mode
STOP_ON
STOP_OFF
STANDBY
Deep Sleep Mode
(DSM)
SNVS only
1
Test Conditions
• ARM LDO set to 0.9V
• SoC and PU LDOs set to 1.225 V
• HIGH LDO set to 2.5 V
• PLLs disabled
• DDR is in self refresh.
Typical1
Supply
VDD_ARM_IN (1.4V)
4
VDD_SOC_IN (1.4V)
22
VDD_HIGH_IN (3.0V)
8.5
Total
61.9
• ARM LDO set to 0.9V
• SoC LDO set to: 1.225 V
• PU LDO is power gated
• HIGH LDO set to 2.5 V
• PLLs disabled
• DDR is in self refresh
VDD_ARM_IN (1.4V)
4
VDD_SOC_IN (1.4V)
13.5
VDD_HIGH_IN (3.0V)
7.5
Total
47
• ARM and PU LDOs are power gated
• SoC LDO is in bypass
• HIGH LDO is set to 2.5V
• PLLs are disabled
• Low Voltage
• Well Bias ON
• Crystal oscillator is enabled
VDD_ARM_IN (0.9V)
0.1
VDD_SOC_IN (0.9V)
5
VDD_HIGH_IN (3.0V)
5
Total
19.6
• ARM and PU LDOs are power gated
• SoC LDO is in bypass
• HIGH LDO is set to 2.5V
• PLLs are disabled
• Low Voltage
• Well Bias ON
• Crystal oscillator and bandgap are disabled
VDD_ARM_IN (0.9V)
0.1
• VDD_SNVS_IN powered
• All other supplies off
• SRTC running
VDDSoC_IN (0.9V)
Units
mA
mW
mA
mW
2
mA
mW
mA
VDD_HIGH_IN (3.0V)
0.5
Total
3.4
mW
VDD_SNVS_IN (2.8V)
41
A
Total
115
mW
The typical values shown here are for information only and are not guaranteed. These values are average values measured
on a typical wafer at 25°C.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
30
Freescale Semiconductor
Electrical Characteristics
4.1.7
4.1.7.1
USB PHY Current Consumption
Power Down Mode
In power down mode, everything is powered down, including the USB_VBUS valid detectors in typical
condition. Table 13 shows the USB interface current consumption in power down mode.
Table 13. USB PHY Current Consumption in Power Down Mode
Current
VDD_USB_CAP (3.0 V)
VDD_HIGH_CAP (2.5 V)
NVCC_PLL_OUT (1.1 V)
5.1 A
1.7 A
<0.5 A
NOTE
The currents on the VDD_HIGH_CAP and VDD_USB_CAP were
identified to be the voltage divider circuits in the USB-specific level
shifters.
4.1.8
PCIe 2.0 Power Consumption
Table 14 provides PCIe PHY currents under certain Tx operating modes.
Table 14. PCIe PHY Current Drain
Mode
P0: Normal Operation
Test Conditions
Supply
Max Current
Unit
5G Operations
PCIE_VP (1.1 V)
40
mA
PCIE_VPTX (1.1 V)
20
PCIE_VPH (2.5 V)
21
PCIE_VP (1.1 V)
27
PCIE_VPTX (1.1 V)
20
PCIE_VPH (2.5 V)
20
PCIE_VP (1.1 V)
30
PCIE_VPTX (1.1 V)
2.4
PCIE_VPH (2.5 V)
18
PCIE_VP (1.1 V)
20
PCIE_VPTX (1.1 V)
2.4
PCIE_VPH (2.5 V)
18
PCIE_VP (1.1 V)
12
PCIE_VPTX (1.1 V)
2.4
PCIE_VPH (2.5 V)
12
2.5G Operations
P0s: Low Recovery Time
Latency, Power Saving State
5G Operations
2.5G Operations
P1: Longer Recovery Time
Latency, Lower Power State
—
mA
mA
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Electrical Characteristics
Table 14. PCIe PHY Current Drain (continued)
Mode
Test Conditions
Supply
Max Current
Unit
—
PCIE_VP (1.1 V)
1.3
mA
PCIE_VPTX (1.1 V)
0.18
PCIE_VPH (2.5 V)
0.36
Power Down
4.1.9
HDMI Power Consumption
Table 15 provides HDMI PHY currents for both Active 3D Tx with LFSR15 data and power-down modes.
Table 15. HDMI PHY Current Drain
Mode
Test Conditions
Supply
Max Current
Unit
Active
Bit rate 251.75 Mbps
HDMI_VPH
14
mA
HDMI_VP
4.1
mA
HDMI_VPH
14
mA
HDMI_VP
4.2
mA
HDMI_VPH
17
mA
HDMI_VP
7.5
mA
HDMI_VPH
17
mA
HDMI_VP
12
mA
HDMI_VPH
16
mA
HDMI_VP
17
mA
HDMI_VPH
19
mA
HDMI_VP
22
mA
HDMI_VPH
49
A
HDMI_VP
1100
A
Bit rate 279.27 Mbps
Bit rate 742.5 Mbps
Bit rate 1.485 Gbps
Bit rate 2.275 Gbps
Bit rate 2.97 Gbps
Power-down
4.2
—
Power Supplies Requirements and Restrictions
The system design must comply with power-up sequence, power-down sequence, and steady state
guidelines as described in this section to guarantee the reliable operation of the device. Any deviation
from these sequences may result in the following situations:
• Excessive current during power-up phase
• Prevention of the device from booting
• Irreversible damage to the processor (worst-case scenario)
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Electrical Characteristics
4.2.1
Power-Up Sequence
The below restrictions must be followed:
• VDD_SNVS_IN supply must be turned on before any other power supply or be connected
(shorted) with VDD_HIGH_IN supply.
• If a coin cell is used to power VDD_SNVS_IN, then ensure that it is connected before any other
supply is switched on.
• If the external SRC_POR_B signal is used to control the processor POR, then SRC_POR_B must
be immediately asserted at power-up and remain asserted until the VDD_ARM_CAP,
VDD_SOC_CAP, and VDD_PU_CAP supplies are stable. VDD_ARM_IN and VDD_SOC_IN
may be applied in either order with no restrictions. In the absence of an external reset feeding the
SRC_POR_B input, the internal POR module takes control. See the i.MX 6Solo/6DualLite
reference manual (IMX6SDLRM) for further details and to ensure that all necessary requirements
are being met.
• If the external SRC_POR_B signal is used to control the processor POR, SRC_POR_B must
remain low (asserted) until the VDD_ARM_CAP and VDD_SOC_CAP supplies are stable.
VDD_ARM_IN and VDD_SOC_IN may be applied in either order with no restrictions.
• If the external SRC_POR_B signal is not used (always held high or left unconnected), the
processor defaults to the internal POR function (where the PMU controls generation of the POR
based on the power supplies). If the internal POR function is used, the following power supply
requirements must be met:
— VDD_ARM_IN and VDD_SOC_IN may be supplied from the same source, or
— VDD_SOC_IN can be supplied before VDD_ARM_IN with a maximum delay of 1 ms.
— VDD_ARM_CAP must not exceed VDD_SOC_CAP by more than +100 mV.
NOTE
Need to ensure that there is no back voltage (leakage) from any supply on
the board towards the 3.3 V supply (for example, from the external
components that use both the 1.8 V and 3.3 V supplies).
NOTE
USB_OTG_VBUS and USB_H1_VBUS are not part of the power supply
sequence and may be powered at any time.
4.2.2
Power-Down Sequence
No special restrictions for i.MX 6Solo/6DualLite IC.
4.2.3
Power Supplies Usage
All I/O pins should not be externally driven while the I/O power supply for the pin (NVCC_xxx) is OFF.
This can cause internal latch-up and malfunctions due to reverse current flows. For information about I/O
power supply of each pin, see “Power Rail” columns in pin list tables of Section 6, “Package Information
and Contact Assignments.”
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Electrical Characteristics
4.3
Integrated LDO Voltage Regulator Parameters
Various internal supplies can be powered ON from internal LDO voltage regulators. All the supply pins
named *_CAP must be connected to external capacitors. The onboard LDOs are intended for internal use
only and should not be used to power any external circuitry. See the i.MX 6Solo/6DualLite Reference
Manual (IMX6SDLRM) for details on the power tree scheme.
NOTE
The *_CAP signals should not be powered externally. These signals are
intended for internal LDO or LDO bypass operation only.
4.3.1
Digital Regulators (LDO_ARM, LDO_PU, LDO_SOC)
There are three digital LDO regulators (“Digital”, because of the logic loads that they drive, not because
of their construction). The advantages of the regulators are to reduce the input supply variation because of
their input supply ripple rejection and their on-die trimming. This translates into more stable voltage for
the on-chip logics.
These regulators have three basic modes:
• Bypass. The regulation FET is switched fully on passing the external voltage, to the load unaltered.
The analog part of the regulator is powered down in this state, removing any loss other than the IR
drop through the power grid and FET.
• Power Gate. The regulation FET is switched fully off limiting the current draw from the supply.
The analog part of the regulator is powered down here limiting the power consumption.
• Analog regulation mode. The regulation FET is controlled such that the output voltage of the
regulator equals the programmed target voltage. The target voltage is fully programmable in 25 mV
steps.
For additional information, see the i.MX 6Solo/6DualLite reference manual.
4.3.2
4.3.2.1
Regulators for Analog Modules
LDO_1P1
The LDO_1P1 regulator implements a programmable linear-regulator function from VDD_HIGH_IN (see
Table 9 for minimum and maximum input requirements). Typical Programming Operating Range is 1.0 V
to 1.2 V with the nominal default setting as 1.1 V. The LDO_1P1 supplies the USB Phy, LVDS Phy, HDMI
Phy, MIPI Phy, and PLLs. A programmable brown-out detector is included in the regulator that can be used
by the system to determine when the load capability of the regulator is being exceeded to take the
necessary steps. Current-limiting can be enabled to allow for in-rush current requirements during start-up,
if needed. Active-pull-down can also be enabled for systems requiring this feature.
For information on external capacitor requirements for this regulator, see the Hardware Development
Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors
(IMX6DQ6SDLHDG).
For additional information, see the i.MX 6Solo/6DualLite reference manual.
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Electrical Characteristics
4.3.2.2
LDO_2P5
The LDO_2P5 module implements a programmable linear-regulator function from VDD_HIGH_IN (see
Table 9 for minimum and maximum input requirements). Typical Programming Operating Range is
2.25 V to 2.75 V with the nominal default setting as 2.5 V. LDO_2P5 supplies the USB Phy, LVDS Phy,
HDMI Phy, MIPI Phy, E-fuse module, and PLLs. A programmable brown-out detector is included in the
regulator that can be used by the system to determine when the load capability of the regulator is being
exceeded, to take the necessary steps. Current-limiting can be enabled to allow for in-rush current
requirements during start-up, if needed. Active-pull-down can also be enabled for systems requiring this
feature. An alternate self-biased low-precision weak-regulator is included that can be enabled for
applications needing to keep the output voltage alive during low-power modes where the main regulator
driver and its associated global bandgap reference module are disabled. The output of the weak-regulator
is not programmable and is a function of the input supply as well as the load current. Typically, with a 3 V
input supply the weak-regulator output is 2.525 V and its output impedance is approximately 40 .
For information on external capacitor requirements for this regulator, see the Hardware Development
Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors
(IMX6DQ6SDLHDG).
For additional information, see the i.MX 6Solo/6DualLite reference manual.
4.3.2.3
LDO_USB
The LDO_USB module implements a programmable linear-regulator function from the
USB_OTG_VBUS and USB_H1_VBUS voltages (4.4 V–5.25 V) to produce a nominal 3.0 V output
voltage. A programmable brown-out detector is included in the regulator that can be used by the system
to determine when the load capability of the regulator is being exceeded, to take the necessary steps. This
regulator has a built in power-mux that allows the user to select to run the regulator from either
USB_VBUS supply, when both are present. If only one of the USB_VBUS voltages is present, then, the
regulator automatically selects this supply. Current limit is also included to help the system meet in-rush
current targets.
For information on external capacitor requirements for this regulator, see the Hardware Development
Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors
(IMX6DQ6SDLHDG).
For additional information, see the i.MX 6Solo/6DualLite reference manual.
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Electrical Characteristics
4.4
4.4.1
PLL’s Electrical Characteristics
Audio/Video PLL’s Electrical Parameters
Table 16. Audio/Video PLL’s Electrical Parameters
4.4.2
Parameter
Value
Clock output range
650 MHz ~1.3 GHz
Reference clock
24 MHz
Lock time
<11250 reference cycles
528 MHz PLL
Table 17. 528 MHz PLL’s Electrical Parameters
4.4.3
Parameter
Value
Clock output range
528 MHz PLL output
Reference clock
24 MHz
Lock time
<11250 reference cycles
Ethernet PLL
Table 18. Ethernet PLL’s Electrical Parameters
4.4.4
Parameter
Value
Clock output range
500 MHz
Reference clock
24 MHz
Lock time
<11250 reference cycles
480 MHz PLL
Table 19. 480 MHz PLL’s Electrical Parameters
Parameter
Value
Clock output range
480 MHz PLL output
Reference clock
24 MHz
Lock time
<383 reference cycles
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Freescale Semiconductor
Electrical Characteristics
4.4.5
MLB PLL
The MediaLB PLL is necessary in the MediaLB 6-Pin implementation to phase align the internal and
external clock edges, effectively tuning out the delay of the differential clock receiver and is also
responsible for generating the higher speed internal clock, when the internal-to-external clock ratio is
not 1:1.
Table 20. MLB PLL’s Electrical Parameters
4.4.6
Parameter
Value
Lock time
<1 ms
ARM PLL
Table 21. ARM PLL’s Electrical Parameters
4.5
4.5.1
Parameter
Value
Clock output range
650 MHz ~ 1.3 GHz
Reference clock
24 MHz
Lock time
<2250 reference cycles
On-Chip Oscillators
OSC24M
This block implements an amplifier that when combined with a suitable quartz crystal and external load
capacitors implements an oscillator. The oscillator is powered from NVCC_PLL_OUT.
The system crystal oscillator consists of a Pierce-type structure running off the digital supply. A straight
forward biased-inverter implementation is used.
4.5.2
OSC32K
This block implements an amplifier that when combined with a suitable quartz crystal and external load
capacitors implements a low power oscillator. It also implements a power mux such that it can be powered
from either a ~3 V backup battery (VDD_SNVS_IN) or VDD_HIGH_IN such as the oscillator consumes
power from VDD_HIGH_IN when that supply is available and transitions to the back up battery when
VDD_HIGH_IN is lost.
In addition, if the clock monitor determines that the OSC32K is not present, then the source of the 32 kHz
clock will automatically switch to the internal ring oscillator.
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Electrical Characteristics
CAUTION
The internal RTC oscillator does not provide an accurate frequency and is
affected by process, voltage, and temperature variations. Freescale strongly
recommends using an external crystal as the RTC_XTALI reference. If the
internal oscillator is used instead, careful consideration must be given to the
timing implications on all of the SoC modules dependent on this clock.
The OSC32k runs from VDD_SNVS_CAP supply, which comes from the
VDD_HIGH_IN/VDD_SNVS_IN. The target battery is a ~3 V coin cell. Proper choice of coin cell type
is necessary for chosen VDD_HIGH_IN range. Appropriate series resistor (Rs) must be used when
connecting the coin cell. Rs depends on the charge current limit that depends on the chosen coin cell. For
example, for Panasonic ML621:
• Average Discharge Voltage is 2.5 V
• Maximum Charge Current is 0.6 mA
For a charge voltage of 3.2 V, Rs = (3.2-2.5)/0.6 m = 1.17 k.
Table 22. OSC32K Main Characteristics
Characteristic
Min
Typ
Max
Comments
Fosc
—
32.768 KHz
—
This frequency is nominal and determined mainly by the crystal selected.
32.0 K would work as well.
Current consumption
—
4 A
—
The 4 A is the consumption of the oscillator alone (OSC32k). Total supply
consumption will depend on what the digital portion of the RTC consumes.
The ring oscillator consumes 1 A when ring oscillator is inactive, 20 A
when the ring oscillator is running. Another 1.5 A is drawn from vdd_rtc
in the power_detect block. So, the total current is 6.5 A on vdd_rtc when
the ring oscillator is not running.
Bias resistor
—
14 M
—
This the integrated bias resistor that sets the amplifier into a high gain
state. Any leakage through the ESD network, external board leakage, or
even a scope probe that is significant relative to this value will debias the
amp. The debiasing will result in low gain, and will impact the circuit's ability
to start up and maintain oscillations.
Crystal Properties
4.6
Cload
—
10 pF
ESR
—
50 k
—
Usually crystals can be purchased tuned for different Cloads. This Cload
value is typically 1/2 of the capacitances realized on the PCB on either side
of the quartz. A higher Cload will decrease oscillation margin, but
increases current oscillating through the crystal.
100 k Equivalent series resistance of the crystal. Choosing a crystal with a higher
value will decrease the oscillating margin.
I/O DC Parameters
This section includes the DC parameters of the following I/O types:
• General Purpose I/O (GPIO)
• Double Data Rate I/O (DDR) for LPDDR2 and DDR3 modes
• LVDS I/O
• MLB I/O
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Electrical Characteristics
NOTE
The term ‘OVDD’ in this section refers to the associated supply rail of an
input or output.
ovdd
pmos (Rpu)
1
or
0
pdat
Voh min
Vol max
pad
Predriver
nmos (Rpd)
ovss
Figure 3. Circuit for Parameters Voh and Vol for I/O Cells
4.6.1
XTALI and RTC_XTALI (Clock Inputs) DC Parameters
Table 23 shows the DC parameters for the clock inputs.
Table 23. XTALI and RTC_XTALI DC Parameters
Parameter
Symbol
Test Conditions
Min
Max
Unit
XTALI high-level DC input voltage
Vih
—
0.8 x NVCC_PLL_OUT
NVCC_PLL_ OUT
V
XTALI low-level DC input voltage
Vil
—
0
0.2V
V
RTC_XTALI high-level DC input voltage
Vih
—
0.8
1.1
V
RTC_XTALI low-level DC input voltage
Vil
—
0
0.2V
V
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Electrical Characteristics
4.6.2
General Purpose I/O (GPIO) DC Parameters
Table 24 shows DC parameters for GPIO pads. The parameters in Table 24 are guaranteed per the
operating ranges in Table 9, unless otherwise noted.
Table 24. GPIO DC Parameters
Parameter
Symbol
Max
Units
High-level output voltage1
VOH
Ioh= -0.1mA (ipp_dse=001,010) OVDD-0.15
Ioh= -1mA
(ipp_dse=011,100,101,110,111)
—
V
Low-level output voltage1
VOL
Iol= 0.1mA (ipp_dse=001,010)
Iol= 1mA
(ipp_dse=011,100,101,110,111)
—
0.15
V
High-Level input voltage1,2
VIH
1,2
—
0.7*OVDD
OVDD
V
VIL
—
0
0.3*OVDD
V
Input Hysteresis (OVDD= 1.8V)
VHYS_LowVDD
OVDD=1.8V
250
—
mV
Input Hysteresis (OVDD=3.3V
VHYS_HighVDD
OVDD=3.3V
250
—
mV
Schmitt trigger VT+2,3
VTH+
—
0.5*OVDD
—
mV
VT-2,3
VTH-
—
—
0.5*OVDD
mV
Pull-up resistor (22_k PU)
RPU_22K
Vin=0V
—
212
uA
Pull-up resistor (22_k PU)
RPU_22K
Vin=OVDD
—
1
uA
Pull-up resistor (47_k PU)
RPU_47K
Vin=0V
—
100
uA
Pull-up resistor (47_k PU)
RPU_47K
Vin=OVDD
—
1
uA
Pull-up resistor (100_k PU)
RPU_100K
Vin=0V
—
48
uA
Pull-up resistor (100_k PU)
RPU_100K
Vin=OVDD
—
1
uA
Pull-down resistor (100_k PD)
RPD_100K
Vin=OVDD
—
48
uA
Pull-down resistor (100_k PD)
RPD_100K
Vin=0V
—
1
uA
Input current (no PU/PD)
IIN
VI = 0, VI = OVDD
-1
1
uA
Keeper Circuit Resistance
R_Keeper
VI =0.3*OVDD, VI = 0.7* OVDD
105
175
k
Low-Level input voltage
Schmitt trigger
Test Conditions
Min
1
Overshoot and undershoot conditions (transitions above OVDD and below GND) on switching pads must be held below 0.6 V,
and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/ undershoot must be
controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other methods.
Non-compliance to this specification may affect device reliability or cause permanent damage to the device.
2 To maintain a valid level, the transition edge of the input must sustain a constant slew rate (monotonic) from the current DC
level through to the target DC level, Vil or Vih. Monotonic input transition time is from 0.1 ns to 1 s.
3 Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled.
4.6.3
DDR I/O DC Parameters
The DDR I/O pads support LPDDR2 and DDR3/DDR3L operational modes.
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Electrical Characteristics
4.6.3.1
LPDDR2 Mode I/O DC Parameters
The LPDDR2 interface mode fully complies with JESD209-2B LPDDR2 JEDEC standard release June,
2009.
Table 25. LPDDR2 I/O DC Electrical Parameters1
Parameters
Symbol
Test Conditions
Min
Max
Unit
High-level output voltage
VOH
Ioh= -0.1mA
0.9*OVDD
—
V
Low-level output voltage
VOL
Iol= 0.1mA
—
0.1*OVDD
V
Input Reference Voltage
Vref
—
0.49*OVDD
0.51*OVDD
V
DC High-Level input voltage
Vih_DC
—
Vref+0.13
OVDD
V
DC Low-Level input voltage
Vil_DC
—
OVSS
Vref-0.13
V
Differential Input Logic High
Vih_diff
—
0.26
Note2
Differential Input Logic Low
Vil_diff
—
Note3
-0.26
Pull-up/Pull-down Impedance Mismatch
Mmpupd
—
-15
15
%
240  unit calibration resolution
Rres
—
—
10

Keeper Circuit Resistance
Rkeep
—
110
175
k
Input current (no pull-up/down)
Iin
VI = 0, VI = OVDD
-2.5
2.5
A
1
Note that the JEDEC LPDDR2 specification (JESD209_2B) supersedes any specification in this document.
The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as
the limitations for overshoot and undershoot.
3 The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as
the limitations for overshoot and undershoot.
2
4.6.3.2
DDR3/DDR3L Mode I/O DC Parameters
The DDR3/DDR3L interface mode fully complies with JESD79-3D DDR3 JEDEC standard release April,
2008. The parameters in Table 26 are guaranteed per the operating ranges in Table 9, unless otherwise
noted.
Table 26. DDR3/DDR3L I/O DC Electrical Characteristics
Parameters
Symbol
Test Conditions
Min
Max
Unit
High-level output voltage
VOH
Ioh= -0.1mA
Voh (for ipp_dse=001)
0.8*OVDD1
—
V
Low-level output voltage
VOL
Iol= 0.1mA
Vol (for ipp_dse=001)
—
0.2*OVDD
V
High-level output voltage
VOH
Ioh= -1mA
Voh (for all except ipp_dse=001)
0.8*OVDD
—
V
Low-level output voltage
VOL
Iol= 1mA
Vol (for all except ipp_dse=001)
—
0.2*OVDD
V
Input Reference Voltage
Vref
—
0.49*ovdd
0.51*ovdd
V
DC High-Level input voltage
Vih_DC
—
Vref2+0.1
OVDD
V
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Electrical Characteristics
Table 26. DDR3/DDR3L I/O DC Electrical Characteristics (continued)
Parameters
Symbol
Test Conditions
Min
Max
Unit
DC Low-Level input voltage
Vil_DC
—
OVSS
Vref-0.1
V
Differential Input Logic High
Vih_diff
—
0.2
See Note3
V
3
Differential Input Logic Low
Vil_diff
—
See Note
-0.2
V
Termination Voltage
Vtt
Vtt tracking OVDD/2
0.49*OVDD
0.51*OVDD
V
—
-10
10
%
Pull-up/Pull-down Impedance Mismatch Mmpupd
240 unit calibration resolution
Rres
—
—
10

Keeper Circuit Resistance
Rkeep
—
105
165
k
Input current (no pull-up/down)
Iin
VI = 0,VI = OVDD
-2.9
2.9
A
1
OVDD – I/O power supply (1.425 V–1.575 V for DDR3 and 1.283 V–1.45 V for DDR3L)
Vref – DDR3/DDR3L external reference voltage
3 The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as
the limitations for overshoot and undershoot.
2
4.6.4
LVDS I/O DC Parameters
The LVDS interface complies with TIA/EIA 644-A standard. See TIA/EIA STANDARD 644-A,
“Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits” for details.
Table 27 shows the Low Voltage Differential Signaling (LVDS) I/O DC parameters.
Table 27. LVDS I/O DC Characteristics
4.6.5
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Output Differential Voltage
VOD
Rload-100  Diff
250
350
450
mV
Output High Voltage
VOH
IOH = 0 mA
1.25
1.375
1.6
V
Output Low Voltage
VOL
IOL = 0 mA
0.9
1.025
1.25
V
Offset Voltage
VOS
—
1.125
1.2
1.375
V
MLB I/O DC Parameters
The MLB interface complies with Analog Interface of 6-pin differential Media Local Bus specification
version 4.1. See 6-pin differential MLB specification v4.1, “MediaLB 6-pin interface Electrical
Characteristics” for details.
NOTE
The MLB 6-pin interface does not support speed mode 8192 fs.
Table 28 shows the Media Local Bus (MLB) I/O DC parameters.
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Table 28. MLB I/O DC Characteristics
4.7
Parameter
Symbol
Test Conditions
Min
Max
Unit
Output Differential Voltage
VOD
Rload-50 Diff
300
500
mV
Output High Voltage
VOH
Rload-50 Diff
1.25
1.75
V
Output Low Voltage
VOL
Rload-50 Diff
0.75
1.25
V
Common-mode output voltage
((Vpadp*+Vpadn*)/2)
Vocm
Rload-50 Diff
1
1.5
V
Differential output impedance
Zo
—
1.6
—
k
I/O AC Parameters
This section includes the AC parameters of the following I/O types:
• General Purpose I/O (GPIO)
• Double Data Rate I/O (DDR) for LPDDR2 and DDR3/DDR3L modes
• LVDS I/O
• MLB I/O
The GPIO and DDR I/O load circuit and output transition time waveforms are shown in Figure 4 and
Figure 5.
From Output
Under Test
Test Point
CL
CL includes package, probe and fixture capacitance
Figure 4. Load Circuit for Output
OVDD
80%
80%
Output (at pad)
20%
0V
20%
tr
tf
Figure 5. Output Transition Time Waveform
4.7.1
General Purpose I/O AC Parameters
The I/O AC parameters for GPIO in slow and fast modes are presented in the Table 29 and Table 30,
respectively. Note that the fast or slow I/O behavior is determined by the appropriate control bits in the
IOMUXC control registers.
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Electrical Characteristics
Table 29. General Purpose I/O AC Parameters 1.8 V Mode
Parameter
Symbol
Test Condition
Min
Typ
Max
Output Pad Transition Times, rise/fall
(Max Drive, ipp_dse=111)
tr, tf
15 pF Cload, slow slew rate
15 pF Cload, fast slew rate
—
—
2.72/2.79
1.51/1.54
Output Pad Transition Times, rise/fall
(High Drive, ipp_dse=101)
tr, tf
15 pF Cload, slow slew rate
15 pF Cload, fast slew rate
—
—
3.20/3.36
1.96/2.07
Output Pad Transition Times, rise/fall
(Medium Drive, ipp_dse=100)
tr, tf
15 pF Cload, slow slew rate
15 pF Cload, fast slew rate
—
—
3.64/3.88
2.27/2.53
Output Pad Transition Times, rise/fall
(Low Drive. ipp_dse=011)
tr, tf
15 pF Cload, slow slew rate
15 pF Cload, fast slew rate
—
—
4.32/4.50
3.16/3.17
Input Transition Times1
trm
—
—
—
25
ns
Unit
1
Unit
ns
Hysteresis mode is recommended for inputs with transition times greater than 25 ns.
Table 30. General Purpose I/O AC Parameters 3.3 V Mode
Parameter
Symbol
Test Condition
Min
Typ
Max
Output Pad Transition Times, rise/fall
(Max Drive, ipp_dse=101)
tr, tf
15 pF Cload, slow slew rate
15 pF Cload, fast slew rate
—
—
1.70/1.79
1.06/1.15
Output Pad Transition Times, rise/fall
(High Drive, ipp_dse=011)
tr, tf
15 pF Cload, slow slew rate
15 pF Cload, fast slew rate
—
—
2.35/2.43
1.74/1.77
Output Pad Transition Times, rise/fall
(Medium Drive, ipp_dse=010)
tr, tf
15 pF Cload, slow slew rate
15 pF Cload, fast slew rate
—
—
3.13/3.29
2.46/2.60
Output Pad Transition Times, rise/fall
(Low Drive. ipp_dse=001)
tr, tf
15 pF Cload, slow slew rate
15 pF Cload, fast slew rate
—
—
5.14/5.57
4.77/5.15
Input Transition Times1
trm
—
—
—
25
1
ns
ns
Hysteresis mode is recommended for inputs with transition times greater than 25 ns.
4.7.2
DDR I/O AC Parameters
The LPDDR2 interface mode fully complies with JESD209-2B LPDDR2 JEDEC standard release June,
2009. The DDR3/DDR3L interface mode fully complies with JESD79-3D DDR3 JEDEC standard release
April, 2008.
Table 31 shows the AC parameters for DDR I/O operating in LPDDR2 mode.
Table 31. DDR I/O LPDDR2 Mode AC Parameters1
Parameter
AC input logic high
AC input logic low
AC differential input high
voltage2
AC differential input low voltage
Input AC differential cross point
voltage3
Symbol
Test Condition
Min
Max
Unit
Vih(ac)
—
Vref + 0.22
OVDD
V
Vil(ac)
—
0
Vref - 0.22
V
Vidh(ac)
—
0.44
—
V
Vidl(ac)
—
—
0.44
V
Vix(ac)
Relative to Vref
-0.12
0.12
V
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Electrical Characteristics
Table 31. DDR I/O LPDDR2 Mode AC Parameters1 (continued)
Parameter
Symbol
Test Condition
Min
Max
Unit
Over/undershoot peak
Vpeak
—
—
0.35
V
Over/undershoot area (above OVDD
or below OVSS)
Varea
400 MHz
—
0.3
V-ns
tsr
50 to Vref.
5 pF load.
Drive impedance = 40 
± 30%
1.5
3.5
V/ns
50 to Vref.
5pF load.Drive
impedance = 60 ±
30%
1
2.5
clk = 400 MHz
—
0.1
Single output slew rate, measured between
Vol(ac) and Voh(ac)
Skew between pad rise/fall asymmetry + skew
caused by SSN
tSKD
ns
1
Note that the JEDEC LPDDR2 specification (JESD209_2B) supersedes any specification in this document.
Vid(ac) specifies the input differential voltage | Vtr - Vcp | required for switching, where Vtr is the “true” input signal and Vcp
is the “complementary” input signal. The Minimum value is equal to Vih(ac) - Vil(ac).
3 The typical value of Vix(ac) is expected to be about 0.5 x OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)
indicates the voltage at which differential input signal must cross.
2
Table 32 shows the AC parameters for DDR I/O operating in DDR3/DDR3L mode.
Table 32. DDR I/O DDR3/DDR3L Mode AC Parameters1
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Vih(ac)
—
Vref + 0.175
—
OVDD
V
Vil(ac)
—
0
—
Vref - 0.175
V
AC differential input voltage
Vid(ac)
—
0.35
—
—
V
Input AC differential cross point voltage3
Vix(ac)
Relative to Vref
Vref - 0.15
—
Vref + 0.15
V
Over/undershoot peak
Vpeak
—
—
—
0.4
V
Over/undershoot area (above OVDD
or below OVSS)
Varea
400 MHz
—
—
0.5
V-ns
tsr
Driver impedance = 34 
2.5
—
5
V/ns
tSKD
clk = 400 MHz
—
—
0.1
ns
AC input logic high
AC input logic low
2
Single output slew rate, measured between
Vol(ac) and Voh(ac)
Skew between pad rise/fall asymmetry + skew
caused by SSN
1
Note that the JEDEC JESD79_3C specification supersedes any specification in this document.
Vid(ac) specifies the input differential voltage | Vtr-Vcp | required for switching, where Vtr is the “true” input signal and Vcp is
the “complementary” input signal. The Minimum value is equal to Vih(ac) - Vil(ac).
3
The typical value of Vix(ac) is expected to be about 0.5 x OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)
indicates the voltage at which differential input signal must cross.
2
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Electrical Characteristics
4.7.3
LVDS I/O AC Parameters
The differential output transition time waveform is shown in Figure 6.
padp
VOH
0V
0V (Differential)
padn
VOL
80%
80%
0V
0V
VDIFF
20%
VDIFF = {padp} - {padn}
20%
tTHL
tTLH
Figure 6. Differential LVDS Driver Transition Time Waveform
Table 33 shows the AC parameters for LVDS I/O.
Table 33. I/O AC Parameters of LVDS Pad
Parameter
Symbol
Differential pulse skew1
tSKD
Time2
tTLH
Transition High to Low Time2
tTHL
Transition Low to High
Operating Frequency
Offset voltage imbalance
Test Condition
Rload = 100 ,
Cload = 2 pF
Min
Typ
Max
—
—
0.25
—
—
0.5
—
—
0.5
Unit
ns
f
—
—
600
800
MHz
Vos
—
—
—
150
mV
1
tSKD = | tPHLD - tPLHD |, is the magnitude difference in differential propagation delay time between the positive going edge and
the negative going edge of the same channel.
2 Measurement levels are 20-80% from output voltage.
4.7.4
MLB I/O AC Parameters
The differential output transition time waveform is shown in Figure 7.
padp
0V
0V (Differential)
padn
VOH
VOL
80%
80%
0V
VDIFF
20%
VDIFF = {padp} - {padn}
tTLH
0V
20%
tTHL
Figure 7. Differential MLB Driver Transition Time Waveform
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Freescale Semiconductor
Electrical Characteristics
A 4-stage pipeline is utilized in the MLB 6-pin implementation in order to facilitate design, maximize
throughput, and allow for reasonable PCB trace lengths. Each cycle is one ipp_clk_in* (internal clock
from MLB PLL) clock period. Cycles 2, 3, and 4 are MLB PHY related. Cycle 2 includes clock-to-output
delay of Signal/Data sampling flip-flop and Transmitter, Cycle 3 includes clock-to-output delay of
Signal/Data clocked receiver, Cycle 4 includes clock-to-output delay of Signal/Data sampling flip-flop.
MLB 6-pin pipeline diagram is shown in Figure 8.
Figure 8. MLB 6-Pin Pipeline Diagram
Table 34 shows the AC parameters for MLB I/O.
Table 34. I/O AC Parameters of MLB PHY
Parameter
Symbol Test Condition
Differential pulse skew1
tSKD
Transition Low to High Time2
tTLH
Transition High to Low Time
tTHL
Min
Typ
Max
Rload = 50 
between padp
and padn
—
—
0.1
—
—
1
—
—
1
Unit
ns
MLB external clock Operating Frequency
fclk_ext
—
—
—
102.4
MHz
MLB PLL clock Operating Frequency
fclk_pll
—
—
—
307.2
MHz
1
tSKD = | tPHLD - tPLHD |, is the magnitude difference in differential propagation delay time between the positive going edge and
the negative going edge of the same channel.
2 Measurement levels are 20-80% from output voltage.
4.8
Output Buffer Impedance Parameters
This section defines the I/O impedance parameters of the i.MX 6Solo/6DualLite processors for the
following I/O types:
• General Purpose I/O (GPIO)
• Double Data Rate I/O (DDR) for LPDDR2, and DDR3/DDR3L modes
• LVDS I/O
• MLB I/O
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Electrical Characteristics
NOTE
GPIO and DDR I/O output driver impedance is measured with “long”
transmission line of impedance Ztl attached to I/O pad and incident wave
launched into transmission line. Rpu/Rpd and Ztl form a voltage divider that
defines specific voltage of incident wave relative to OVDD. Output driver
impedance is calculated from this voltage divider (see Figure 9).
OVDD
PMOS (Rpu)
Ztl , L = 20 inches
ipp_do
pad
predriver
Cload = 1p
NMOS (Rpd)
OVSS
U,(V)
Vin (do)
VDD
t,(ns)
0
U,(V)
Vout (pad)
OVDD
Vref2
Vref1
Vref
t,(ns)
0
Vovdd – Vref1
Rpu =
 Ztl
Vref1
Rpd =
Vref2
 Ztl
Vovdd – Vref2
Figure 9. Impedance Matching Load for Measurement
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Electrical Characteristics
4.8.1
GPIO Output Buffer Impedance
Table 35 shows the GPIO output buffer impedance (OVDD 1.8 V).
Table 35. GPIO Output Buffer Average Impedance (OVDD 1.8 V)
Parameter
Output Driver
Impedance
Symbol
Drive Strength (DSE)
Typ Value
Unit
001
010
011
100
101
110
111
260
130
90
60
50
40
33

Rdrv
Table 36 shows the GPIO output buffer impedance (OVDD 3.3 V).
Table 36. GPIO Output Buffer Average Impedance (OVDD 3.3 V)
Parameter
Output Driver
Impedance
4.8.2
Symbol
Drive Strength (DSE)
Typ Value
Unit
001
010
011
100
101
110
111
150
75
50
37
30
25
20

Rdrv
DDR I/O Output Buffer Impedance
The LPDDR2 interface fully complies with JESD209-2B LPDDR2 JEDEC standard release June, 2009.
The DDR3 interface fully complies with JESD79-3D DDR3 JEDEC standard release April, 2008.
Table 37 shows DDR I/O output buffer impedance of i.MX 6Solo/6DualLite processors.
Table 37. DDR I/O Output Buffer Impedance
Typical
Parameter
Output Driver
Impedance
Symbol
Test Conditions DSE
(Drive Strength)
Rdrv
000
001
010
011
100
101
110
111
NVCC_DRAM=1.5 V
(DDR3)
DDR_SEL=11
NVCC_DRAM=1.2 V
(LPDDR2)
DDR_SEL=10
Hi-Z
240
120
80
60
48
40
34
Hi-Z
240
120
80
60
48
40
34
Unit

Note:
1. Output driver impedance is controlled across PVTs using ZQ calibration procedure.
2. Calibration is done against 240  external reference resistor.
3. Output driver impedance deviation (calibration accuracy) is ±5% (max/min impedance) across PVTs.
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Electrical Characteristics
4.8.3
LVDS I/O Output Buffer Impedance
The LVDS interface complies with TIA/EIA 644-A standard. See, TIA/EIA STANDARD 644-A,
“Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits” for details.
4.8.4
MLB I/O Differential Output Impedance
Table 38 shows MLB I/O differential output impedance of the i.MX 6Solo/6DualLite processors.
Table 38. MLB I/O Differential Output Impedance
Parameter
Differential Output Impedance
4.9
Symbol
Test Conditions
Min
Typ
Max
Unit
Zo
—
1.6 K
—
—

System Modules Timing
This section contains the timing and electrical parameters for the modules in each i.MX 6Solo/6DualLite
processor.
4.9.1
Reset Timings Parameters
Figure 10 shows the reset timing and Table 39 lists the timing parameters.
SRC_POR_B
(Input)
CC1
Figure 10. Reset Timing Diagram
Table 39. Reset Timing Parameters
ID
CC1
1
Parameter
Min
Max
Unit
1
—
XTALOSC_RTC_XTALI cycle
Duration of SRC_POR_B to be qualified as valid.1
SRC_POR_B rise and fall times must be 5 ns or less.
4.9.2
WDOG Reset Timing Parameters
Figure 11 shows the WDOG reset timing and Table 40 lists the timing parameters.
WDOG1_B
(Output)
CC3
Figure 11. WDOG1_B Timing Diagram
Table 40. WDOG1_B Timing Parameters
ID
CC3
Parameter
Duration of WDOG1_B Assertion
Min
Max
Unit
1
—
XTALOSC_RTC_XTALI cycle
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Electrical Characteristics
NOTE
XTALOSC_RTC_XTALI is approximately 32 kHz.
XTALOSC_RTC_XTALI cycle is one period or approximately 30 s.
NOTE
WDOG1_B output signals (for each one of the Watchdog modules) do not
have dedicated pins, but are muxed out through the IOMUX. See the IOMUX
manual for detailed information.
4.9.3
External Interface Module (EIM)
The following subsections provide information on the EIM. Maximum operating frequency for EIM data
transfer is 104 MHz. Timing parameters in this section that are given as a function of register settings or
clock periods are valid for the entire range of allowed frequencies (0–104 MHz).
4.9.3.1
EIM Interface Pads Allocation
EIM supports 32-bit, 16-bit and 8-bit devices operating in address/data separate or multiplexed modes.
Table 41 provides EIM interface pads allocation in different modes.
Table 41. EIM Internal Module Multiplexing1
Multiplexed
Address/Data mode
Non Multiplexed Address/Data Mode
Setup
8 Bit
16 Bit
32 Bit
16 Bit
32 Bit
MUM = 0, MUM = 0, MUM = 0, MUM = 0, MUM = 0, MUM = 0, MUM = 0, MUM = 1, MUM = 1,
DSZ = 100 DSZ = 101 DSZ = 110 DSZ = 111 DSZ = 001 DSZ = 010 DSZ = 011 DSZ = 001 DSZ = 011
EIM_ADDR
EIM_AD
EIM_AD
EIM_AD
EIM_AD
EIM_AD
EIM_AD
EIM_AD
EIM_AD
EIM_AD
[15:00]
[15:00]
[15:00]
[15:00]
[15:00]
[15:00]
[15:00]
[15:00]
[15:00]
[15:00]
EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_DATA
[25:16]
[25:16]
[25:16]
[25:16]
[25:16]
[25:16]
[25:16]
[25:16]
[25:16]
[09:00]
EIM_DATA EIM_DATA
—
—
—
EIM_DATA
—
EIM_DATA EIM_AD
EIM_AD
[07:00],
[07:00]
[07:00]
[07:00]
[07:00]
[07:00]
EIM_EB0_B
EIM_DATA
—
EIM_DATA
—
—
EIM_DATA
—
EIM_DATA EIM_AD
EIM_AD
[15:08],
[15:08]
[15:08]
[15:08]
[15:08]
[15:08]
EIM_EB1_B
EIM_DATA
—
—
EIM_DATA
—
—
EIM_DATA EIM_DATA
—
EIM_DATA
[07:00]
[23:16],
[23:16]
[23:16]
[23:16]
EIM_EB2_B
EIM_DATA
—
—
—
EIM_DATA
—
EIM_DATA EIM_DATA
—
EIM_DATA
[31:24],
[31:24]
[31:24]
[31:24]
[15:08]
EIM_EB3_B
1
For more information on configuration ports mentioned in this table, see the i.MX 6Solo/6DualLite reference manual.
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Electrical Characteristics
4.9.3.2
General EIM Timing-Synchronous Mode
Figure 12, Figure 13, and Table 42 specify the timings related to the EIM module. All EIM output control
signals may be asserted and deasserted by an internal clock synchronized to the EIM_BCLK rising edge
according to corresponding assertion/negation control fields.
,
WE2
...
EIM_BCLK
WE4
WE3
WE1
WE5
EIM_ADDRxx
EIM_CSx_B
EIM_WE_B
WE6
WE7
WE8
WE9
WE10
WE11
WE12
WE13
WE14
WE15
WE16
WE17
EIM_OE_B
EIM_EBx_B
EIM_LBA_B
Output Data
Figure 12. EIM Outputs Timing Diagram
EIM_BCLK
WE18
Input Data
WE19
WE20
EIM_WAIT_B
WE21
Figure 13. EIM Inputs Timing Diagram
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Electrical Characteristics
4.9.3.3
Examples of EIM Synchronous Accesses
Table 42. EIM Bus Timing Parameters 1
BCD = 0
ID
BCD = 1
BCD = 2
BCD = 3
Parameter
Min
Max
Min
Max
Min
Max
Min
Max
t
—
2xt
—
3xt
—
4xt
—
WE2 EIM_BCLK Low
Level Width
0.4 x t
—
0.8 x t
—
1.2 x t
—
1.6 x t
—
WE3 EIM_BCLK High
Level Width
0.4 x t
—
0.8 x t
—
1.2 x t
—
1.6 x t
—
-t + 1.75
-1.5 x t 1.25
-1.5 x t
+1.75
-2 x t 1.25
-2 x t + 1.75
t - 1.25
t + 1.75
1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
1.25
-0.5 x t + 1.75 -t - 1.25
- t + 1.75
WE1 EIM_BCLK Cycle
time2
WE4 Clock rise to
address valid3
WE5 Clock rise to
address invalid
WE6 Clock rise to
EIM_CSx_B valid
-0.5 x t 1.25
-0.5 x t + 1.75 -t - 1.25
0.5 x t - 1.25 0.5 x t + 1.75
-0.5 x t 1.25
WE7 Clock rise to
0.5 x t - 1.25 0.5 x t + 1.75
EIM_CSx_B invalid
WE8 Clock rise to
EIM_WE_B Valid
-0.5 x t 1.25
t - 1.25
t + 1.75
-0.5 x t + 1.75 -t - 1.25
- t + 1.75
WE9 Clock rise to
0.5 x t - 1.25 0.5 x t + 1.75
EIM_WE_B Invalid
WE10 Clock rise to
EIM_OE_B Valid
WE11 Clock rise to
EIM_OE_B Invalid
WE12 Clock rise to
EIM_EBx_B Valid
-0.5 x t 1.25
t - 1.25
t + 1.75
-0.5 x t + 1.75 -t - 1.25
- t + 1.75
0.5 x t - 1.25 0.5 x t + 1.75
-0.5 x t 1.25
t - 1.25
t + 1.75
-0.5 x t + 1.75 -t - 1.25
- t + 1.75
WE13 Clock rise to
0.5 x t - 1.25 0.5 x t + 1.75
EIM_EBx_B Invalid
WE14 Clock rise to
EIM_LBA_B Valid
-0.5 x t 1.25
t - 1.25
t + 1.75
-0.5 x t + 1.75 -t - 1.25
- t + 1.75
WE15 Clock rise to
0.5 x t - 1.25 0.5 x t + 1.75
EIM_LBA_B Invalid
WE16 Clock rise to Output
Data Valid
-0.5 x t 1.25
t - 1.25
t + 1.75
-0.5 x t + 1.75 -t - 1.25
- t + 1.75
WE17 Clock rise to Output 0.5 x t - 1.25 0.5 x t + 1.75
Data Invalid
t - 1.25
t + 1.75
-1.5 x t 1.25
-1.5 x t
+1.75
-2 x t 1.25
-2 x t + 1.75
1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
1.25
-1.5 x t 1.25
-1.5 x t
+1.75
-2 x t 1.25
-2 x t + 1.75
1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
1.25
-1.5 x t 1.25
-1.5 x t
+1.75
-2 x t 1.25
-2 x t + 1.75
1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
1.25
-1.5 x t 1.25
-1.5 x t
+1.75
-2 x t 1.25
-2 x t + 1.75
1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
1.25
-1.5 x t 1.25
-1.5 x t
+1.75
-2 x t 1.25
-2 x t + 1.75
1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
1.25
-1.5 x t 1.25
-1.5 x t
+1.75
-2 x t 1.25
-2 x t + 1.75
1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
1.25
WE18 Input Data setup
time to Clock rise
2
—
4
—
—
—
—
—
WE19 Input Data hold time
from Clock rise
2
—
2
—
—
—
—
—
WE20 EIM_WAIT_B setup
time to Clock rise
2
—
4
—
—
—
—
—
WE21 EIM_WAIT_B hold
time from Clock rise
2
—
2
—
—
—
—
—
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1
t is the maximum EIM logic (axi_clk) cycle time. The maximum allowed axi_clk frequency depends on the fixed/non-fixed
latency configuration, whereas the maximum allowed EIM_BCLK frequency is:
—Fixed latency for both read and write is 104 MHz.
—Variable latency for read only is 104 MHz.
—Variable latency for write only is 52 MHz.
In variable latency configuration for write, if BCD = 0 & WBCDD = 1 or BCD = 1, axi_clk must be 104 MHz.Write BCD = 1 and
104 MHz axi_clk, will result in a EIM_BCLK of 52 MHz. When the clock branch to EIM is decreased to 104 MHz, other buses
are impacted which are clocked from this source. See the CCM chapter of the i.MX 6Solo/6DualLite Reference Manual
(IMX6SDLRM) for a detailed clock tree description.
2
EIM_BCLK parameters are being measured from the 50% point, that is, high is defined as 50% of signal value and low is
defined as 50% as signal value.
3
For signal measurements, “High” is defined as 80% of signal value and “Low” is defined as 20% of signal value.
Figure 14 to Figure 17 provide few examples of basic EIM accesses to external memory devices with the
timing parameters mentioned previously for specific control parameters settings.
EIM_BCLK
EIM_ADDRxx
EIM_CSx_B
WE4
WE5
Address v1
Last Valid Address
WE6
WE7
EIM_WE_B
EIM_LBA_B
EIM_OE_B
EIM_EBx_B
EIM_DATAxx
WE14
WE15
WE10
WE11
WE12
WE13
WE18
D(v1)
WE19
Figure 14. Synchronous Memory Read Access, WSC=1
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EIM_BCLK
EIM_ADDRxx Last Valid Address
EIM_CSx_B
EIM_WE_B
WE5
WE4
Address V1
WE6
WE7
WE8
WE9
WE14
EIM_LBA_B
WE15
EIM_OE_B
WE13
WE12
EIM_EBx_B
WE16
EIM_DATAxx
WE17
D(V1)
Figure 15. Synchronous Memory, Write Access, WSC=1, WBEA=0 and WADVN=0
EIM_BCLK
EIM_ADDRxx/
EIM_ADxx
EIM_CSx_B
EIM_WE_B
WE4
Last Valid Address
WE5
WE17
WE16
Write Data
Address V1
WE6
WE7
WE8
WE9
WE14
WE15
EIM_LBA_B
EIM_OE_B
WE10
WE11
EIM_EBx_B
Figure 16. Muxed Address/Data (A/D) Mode, Synchronous Write Access, WSC=6,ADVA=0, ADVN=1, and
ADH=1
NOTE
In 32-bit muxed address/data (A/D) mode the 16 MSBs are driven on the
data bus.
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Electrical Characteristics
EIM_BCLK
EIM_ADDRxx/
EIM_ADxx
WE4
WE5
Last Valid Address Address V1
WE6
WE19
Data
WE18
EIM_CSx_B
WE7
EIM_WE_B
WE15
WE14
EIM_LBA_B
WE10
WE11
EIM_OE_B
WE12
WE13
EIM_EBx_B
Figure 17. 16-Bit Muxed A/D Mode, Synchronous Read Access, WSC=7, RADVN=1, ADH=1, OEA=0
4.9.3.4
General EIM Timing-Asynchronous Mode
Figure 18 through Figure 22, and Table 43 help you determine timing parameters relative to the chip
select (CS) state for asynchronous and DTACK EIM accesses with corresponding EIM bit fields and the
timing parameters mentioned above.
Asynchronous read & write access length in cycles may vary from what is shown in Figure 18 through
Figure 21 as RWSC, OEN and CSN is configured differently. See the i.MX 6Solo/6DualLite Reference
Manual (IMX6SDLRM) for the EIM programming model.
end of
access
start of
access
INT_CLK
MAXCSO
EIM_CSx_B
EIM_ADDRxx/
WE31
EIM_ADxx
Last Valid Address
WE32
Next Address
Address V1
EIM_WE_B
EIM_LBA_B
WE39
WE40
EIM_OE_B
WE35
WE36
EIM_EBx_B
WE37
WE38
EIM_DATAxx[7:0]
WE44
MAXCO
D(V1)
WE43
MAXDI
Figure 18. Asynchronous Memory Read Access (RWSC = 5)
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end of
access
start of
access
INT_CLK
MAXCSO
EIM_CSx_B
EIM_ADDRxx/
EIM_ADxx
MAXDI
WE31
D(V1)
Addr. V1
WE32A
WE44
EIM_WE_B
WE39
EIM_LBA_B
WE40A
WE35A
WE36
EIM_OE_B
WE37
WE38
EIM_EBx_B
MAXCO
Figure 19. Asynchronous A/D Muxed Read Access (RWSC = 5)
EIM_CSx_B
WE31
EIM_ADDRxx Last Valid Address
WE33
EIM_WE_B
WE39
EIM_LBA_B
WE32
Address V1
Next Address
WE34
WE40
EIM_OE_B
WE45
WE46
EIM_EBx_B
EIM_DATAxx
WE42
WE41
D(V1)
Figure 20. Asynchronous Memory Write Access
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EIM_CSx_B
EIM_ADDRxx/
WE41
WE31
D(V1)
Addr. V1
EIM_DATAxx
WE32A
WE33
WE34
WE42
EIM_WE_B
WE39
EIM_LBA_B
WE40A
EIM_OE_B
WE45
WE46
EIM_EBx_B
WE42
Figure 21. Asynchronous A/D Muxed Write Access
EIM_CSx_B
EIM_ADDRxx
WE31
Last Valid Address
WE32
Next Address
Address V1
EIM_WE_B
WE39
WE40
WE35
WE36
WE37
WE38
EIM_LBA_B
EIM_OE_B
EIM_EBx_B
EIM_DATAxx[7:0]
WE44
D(V1)
WE43
WE48
EIM_DTACK_B
WE47
Figure 22. DTACK Mode Read Access (DAP=0)
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EIM_CSx_B
WE31
EIM_ADDRxx Last Valid Address
WE32
Next Address
Address V1
EIM_WE_B
WE33
WE34
EIM_LBA_B
WE39
WE40
WE45
WE46
EIM_OE_B
EIM_EBx_B
WE42
EIM_DATAxx
D(V1)
WE41
WE48
EIM_DTACK_B
WE47
Figure 23. DTACK Mode Write Access (DAP=0)
Table 43. EIM Asynchronous Timing Parameters Table Relative Chip to Select
Ref No.
Parameter
Determination by
Synchronous measured
parameters1
Min
Max
Unit
WE31
EIM_CSx_B valid to Address
Valid
WE4 - WE6 - CSA2
—
3 - CSA
ns
WE32
Address Invalid to EIM_CSx_B
invalid
WE7 - WE5 - CSN3
—
3 - CSN
ns
t4 + WE4 - WE7 + (ADVN5 +
ADVA6 + 1 - CSA)
-3 + (ADVN +
ADVA + 1 - CSA)
—
ns
WE32A(m EIM_CSx_B valid to Address
uxed A/D Invalid
WE33
EIM_CSx_B Valid to
EIM_WE_B Valid
WE8 - WE6 + (WEA - WCSA)
—
3 + (WEA - WCSA)
ns
WE34
EIM_WE_B Invalid to
EIM_CSx_B Invalid
WE7 - WE9 + (WEN - WCSN)
—
3 - (WEN_WCSN)
ns
WE35
EIM_CSx_B Valid to
EIM_OE_B Valid
WE10 - WE6 + (OEA - RCSA)
—
3 + (OEA - RCSA)
ns
WE35A
(muxed
A/D)
EIM_CSx_B Valid to
EIM_OE_B Valid
WE10 - WE6 + (OEA + RADVN
-3 + (OEA +
3 + (OEA +
+ RADVA + ADH + 1 - RCSA) RADVN+RADVA+ RADVN+RADVA+AD
ADH+1-RCSA)
H+1-RCSA)
ns
WE36
EIM_OE_B Invalid to
EIM_CSx_B Invalid
WE7 - WE11 + (OEN - RCSN)
—
3 - (OEN - RCSN)
ns
WE37
EIM_CSx_B Valid to
EIM_EBx_B Valid (Read
access)
WE12 - WE6 + (RBEA - RCSA)
—
3 + (RBEA - RCSA)
ns
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Table 43. EIM Asynchronous Timing Parameters Table Relative Chip to Select (continued)
Ref No.
Parameter
WE38
EIM_EBx_B Invalid to
EIM_CSx_B Invalid (Read
access)
WE39
EIM_CSx_B Valid to
EIM_LBA_B Valid
WE40
EIM_LBA_B Invalid to
EIM_CSx_B Invalid (ADVL is
asserted)
WE40A
(muxed
A/D)
EIM_CSx_B Valid to
EIM_LBA_B Invalid
Determination by
Synchronous measured
parameters1
Min
Max
Unit
WE7 - WE13 + (RBEN - RCSN)
—
3 - (RBEN- RCSN)
ns
WE14 - WE6 + (ADVA - CSA)
—
3 + (ADVA - CSA)
ns
WE7 - WE15 - CSN
—
3 - CSN
ns
WE14 - WE6 + (ADVN + ADVA
+ 1 - CSA)
-3 + (ADVN +
ADVA + 1 - CSA)
3 + (ADVN + ADVA +
1 - CSA)
ns
WE41
EIM_CSx_B Valid to Output
Data Valid
WE16 - WE6 - WCSA
—
3 - WCSA
ns
WE41A
(muxed
A/D)
EIM_CSx_B Valid to Output
Data Valid
WE16 - WE6 + (WADVN +
WADVA + ADH + 1 - WCSA)
—
3 + (WADVN +
WADVA + ADH + 1 WCSA)
ns
WE17 - WE7 - CSN
—
3 - CSN
ns
10
—
—
ns
10
—
—
ns
WE42
MAXCO
Output Data Invalid to
EIM_CSx_B Invalid
Output maximum delay from
internal driving
EIM_ADDRxx/control FFs to
chip outputs
MAXCSO Output maximum delay from
CSx internal driving FFs to CSx
out
MAXDI
EIM_DATAxx maximum delay
from chip input data to its
internal FF
5
—
—
ns
WE43
Input Data Valid to EIM_CSx_B
Invalid
MAXCO - MAXCSO + MAXDI
MAXCO MAXCSO +
MAXDI
—
ns
WE44
EIM_CSx_B Invalid to Input
Data invalid
0
0
—
ns
WE45
EIM_CSx_B Valid to
EIM_EBx_B Valid (Write
access)
WE12 - WE6 + (WBEA WCSA)
—
3 + (WBEA - WCSA)
ns
WE46
EIM_EBx_B Invalid to
EIM_CSx_B Invalid (Write
access)
WE7 - WE13 + (WBEN WCSN)
—
-3 + (WBEN - WCSN)
ns
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Table 43. EIM Asynchronous Timing Parameters Table Relative Chip to Select (continued)
Ref No.
MAXDTI
1
2
3
4
5
6
Parameter
MAXIMUM delay from
EIM_DTACK_B to its internal
FF + 2 cycles for
synchronization
WE47
EIM_DTACK_B Active to
EIM_CSx_B Invalid
WE48
EIM_CSx_B Invalid to
EIM_DTACK_B Invalid
Determination by
Synchronous measured
parameters1
Min
Max
Unit
10
—
—
—
MAXCO - MAXCSO + MAXDTI
MAXCO MAXCSO +
MAXDTI
—
ns
0
0
—
ns
For more information on configuration parameters mentioned in this table, see the i.MX 6Solo/6DualLite reference manual.
In this table, CSA means WCSA when write operation or RCSA when read operation.
In this table, CSN means WCSN when write operation or RCSN when read operation.
t is axi_clk cycle time.
In this table, ADVN means WADVN when write operation or RADVN when read operation.
In this table, ADVA means WADVA when write operation or RADVA when read operation.
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4.9.4
DDR SDRAM Specific Parameters (DDR3/DDR3L and LPDDR2)
4.9.4.1
DDR3/DDR3L Parameters
Figure 24 shows the basic timing parameters. The timing parameters for this diagram appear in Table 44.
DRAM_SDCLKx_N
DDR1
DRAM_SDCLKx_P
DDR2
DDR4
DRAM_CSx_B
DDR5
DRAM_RAS_B
DDR5
DDR4
DRAM_CAS_B
DDR4
DDR5
DDR5
DRAM_SDWE_B
DRAM_ODTx/
DRAM_SDCKEx
DDR4
DDR6
DDR7
DRAM_ADDRxx
ROW/BA
COL/BA
Figure 24. DDR3 Command and Address Timing Parameters
Table 44. DDR3/DDR3L Timing Parameter Table
CK = 400 MHz
ID
1
2
Parameter
Symbol
Unit
Min
Max
DDR1
DRAM_SDCLKx_P clock high-level width
tCH
0.47
0.53
tCK
DDR2
DRAM_SDCLKx_P clock low-level width
tCL
0.47
0.53
tCK
DDR4
DRAM_CSx_B, DRAM_RAS_B,
DRAM_CAS_B, DRAM_SDCKEx,
DRAM_SDWE_B, DRAM_ODTx setup time
tIS
800
—
ps
DDR5
DRAM_CSx_B, DRAM_RAS_B,
DRAM_CAS_B, DRAM_SDCKEx,
DRAM_SDWE_B, DRAM_ODTx hold time
tIH
580
—
ps
DDR6
Address output setup time
tIS
800
—
ps
DDR7
Address output hold time
tIH
580
—
ps
All measurements are in reference to Vref level.
Measurements were done using balanced load and 25  resistor from outputs to DRAM_VREF.
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Figure 25shows the DDR3/DDR3L write timing parameters. The timing parameters for this diagram
appear in Table 45.
DRAM_SDCLKx_P
DRAM_SDCLKx_N
DDR21
DDR22
DRAM_SDQSx_P (output)
DRAM_DATAxx (output)
DDR18
DDR17
DDR23
DDR17
DDR18
Data
Data
Data
Data
Data
Data
Data
Data
DM
DM
DM
DM
DM
DM
DM
DM
DRAM_DQMx (output)
DDR17
DDR18
DDR17
DDR18
Figure 25. DDR3/DDR3L Write Cycle
Table 45. DDR3/DDR3L Write Cycle
CK = 400 MHz
ID
Parameter
Symbol
Unit
Min
Max
DDR17
DRAM_DATAxx and DRAM_DQMx setup time to DRAM_SDQSx_P
(differential strobe)
tDS
420
—
ps
DDR18
DRAM_DATAxx and DRAM_DQMx hold time to DRAM_SDQSx_P
(differential strobe)
tDH
345
—
ps
DDR21
DRAM_SDQSx_P latching rising transitions to associated clock edges
tDQSS
-0.25
+0.25
tCK
DDR22
DRAM_SDQSx_P high level width
tDQSH
0.45
0.55
tCK
DDR23
DRAM_SDQSx_P low level width
tDQSL
0.45
0.55
tCK
1
To receive the reported setup and hold values, write calibration should be performed in order to locate the DRAM_SDQSx_P
in the middle of DRAM_DATAxx window.
2 All measurements are in reference to Vref level.
3 Measurements were done using balanced load and 25  resistor from outputs to DRAM_VREF.
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Figure 26 shows the read DDR3/DDR3L timing parameters. The timing parameters for this diagram
appear in Table 46.
DRAM_SDCLKx_P
DRAM_SDCLKx_N
DRAM_SDQSx_P (input)
DRAM_DATAxx (input)
DATA
DATA
DATA
DATA
DATA
DATA
DATA
DATA
DDR26
Figure 26. DDR3/DDR3L Read Cycle
Table 46. DDR3/DDR3L Read Cycle
CK = 400 MHz
ID
DDR26
Parameter
Minimum required DRAM_DATAxx valid window width
Symbol
—
Unit
Min
Max
450
—
ps
1
To receive the reported setup and hold values, read calibration should be performed in order to locate the DRAM_SDQSx_P
in the middle of DRAM_DATAxx window.
2 All measurements are in reference to Vref level.
3 Measurements were done using balanced load and 25  resistor from outputs to DRAM_VREF.
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4.9.4.2
LPDDR2 Parameters
Figure 27 shows the basic timing parameters. The timing parameters for this diagram appear in Table 47.
DRAM_SDCLKx_P
LP1
LP4
DRAM_CSx_B
LP2
LP6
LP3
LP5
DRAM_SDCKEx
LP3
LP4
DRAM_ADDRxx
LP4
LP3
Figure 27. LPDDR2 Command and Address Timing Parameters
Table 47. LPDDR2 Timing Parameter
CK = 400 MHz
ID
1
2
Parameter
Symbol
Unit
Min
Max
LP1
DRAM_SDCLKx_P clock high-level width
tCH
0.45
0.55
tCK
LP2
DRAM_SDCLKx_P clock low-level width
tCL
0.45
0.55
tCK
LP3
DRAM_ADDRxx, DRAM_CSx_B setup time
tIS
380
—
ps
LP4
DRAM_ADDRxx, DRAM_CSx_B hold time
tIH
380
—
ps
LP5
DRAM_SDCKEx setup time
tISCKE
770
—
tck
LP6
DRAM_SDCKEx hold time
tIHCKE
770
—
tck
All measurements are in reference to Vref level.
Measurements were done using balanced load and 25  resistor from outputs to DRAM_VREF.
Figure 28 shows the write timing parameters. The timing parameters for this diagram appear in Table 48.
DRAM_SDCLKx_P
DRAM_SDCLKx_N
LP21
LP22
LP23
DRAM_SDQSx_P (output)
DRAM_DATAxx(output)
LP18
LP17
DRAM_DQMx (output)
LP17
LP17
LP18
Data
Data
Data
Data
Data
Data
Data
Data
DM
DM
DM
DM
DM
DM
DM
DM
LP18
LP17
LP18
Figure 28. LPDDR2 Write Cycle
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Table 48. LPDDR2 Write Cycle
CK = 400 MHz
ID
Parameter
Symbol
Unit
Min
Max
LP17
DRAM_DATAxx and DRAM_DQMx setup time to DRAM_SDQSx_P
(differential strobe)
tDS
375
—
ps
LP18
DRAM_DATAxx and DRAM_DQMx hold time to DRAM_SDQSx_P
(differential strobe)
tDH
375
—
ps
LP21
DRAM_SDQSx_P latching rising transitions to associated clock edges
tDQSS
-0.25
+0.25
tCK
LP22
DRAM_SDQSx_P high level width
tDQSH
0.4
—
tCK
LP23
DRAM_SDQSx_P low level width
tDQSL
0.4
—
tCK
1
To receive the reported setup and hold values, write calibration should be performed in order to locate the DRAM_SDQSx_P
in the middle of DRAM_DATAxx window.
2 All measurements are in reference to Vref level.
3 Measurements were done using balanced load and 25  resistor from outputs to DRAM_VREF.
Figure 29 shows the read timing parameters. The timing parameters for this diagram appear in Table 49.
DRAM_SDCLKx_P
DRAM_SDCLKx_N
DRAM_SDQSx_P (input)
DRAM_DATAxx (input)
DATA
DATA
DATA
DATA
DATA
DATA
DATA
DATA
LP26
Figure 29. LPDDR2 Read Cycle
Table 49. LPDDR2 Read Cycle
CK = 400 MHz
ID
LP26
Parameter
Minimum required DRAM_DATAxx valid window width
for LPDDR2
Symbol
—
Unit
Min
Max
270
—
ps
1
To receive the reported setup and hold values, read calibration should be performed in order to locate the DRAM_SDQSx_P
in the middle of DRAM_DATAxx window.
2
All measurements are in reference to Vref level.
3 Measurements were done using balanced load and 25  resistor from outputs to DRAM_VREF.
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4.10
General-Purpose Media Interface (GPMI) Timing
The i.MX 6Solo/6DualLite GPMI controller is a flexible interface NAND Flash controller with 8-bit data
width, up to 200 MB/s I/O speed and individual chip select.
It supports Asynchronous timing mode, Source Synchronous timing mode and Samsung Toggle timing
mode separately described in the following subsections.
4.10.1
Asynchronous Mode AC Timing (ONFI 1.0 Compatible)
Asynchronous mode AC timings are provided as multiplications of the clock cycle and fixed delay. The
maximum I/O speed of GPMI in asynchronous mode is about 50 MB/s. Figure 30 through Figure 33
depicts the relative timing between GPMI signals at the module level for different operations under
asynchronous mode. Table 50 describes the timing parameters (NF1–NF17) that are shown in the figures.
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Figure 31. Address Latch Cycle Timing Diagram
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Electrical Characteristics
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Figure 33. Read Data Latch Cycle Timing Diagram (Non-EDO Mode)
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Table 50. Asynchronous Mode Timing Parameters1
ID
Parameter
Timing
T = GPMI Clock Cycle
Symbol
Min.
Unit
Max.
NF1
NAND_CLE setup time
tCLS
(AS + DS)  T - 0.12 [see 2,3]
ns
NF2
NAND_CLE hold time
tCLH
DH  T - 0.72 [see 2]
ns
NF3
NAND_CE0_B setup time
tCS
(AS + DS + 1)  T [see 3,2]
ns
NF4
NAND_CE0_B hold time
tCH
(DH+1)  T - 1 [see 2]
ns
NF5
NAND_WE_B pulse width
tWP
DS  T [see 2]
ns
NF6
NAND_ALE setup time
tALS
(AS + DS)  T - 0.49 [see 3,2]
ns
NF7
NAND_ALE hold time
tALH
(DH  T - 0.42 [see 2]
ns
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Electrical Characteristics
Table 50. Asynchronous Mode Timing Parameters1 (continued)
ID
Parameter
Timing
T = GPMI Clock Cycle
Symbol
Min.
2
3
4
5
6
Max.
NF8
Data setup time
tDS
DS  T - 0.26 [see ]
ns
NF9
Data hold time
tDH
DH  T - 1.37 [see 2]
ns
NF10
Write cycle time
tWC
(DS + DH)  T [see 2]
ns
DH  T [see ]
ns
2
2
NF11
NAND_WE_B hold time
tWH
NF12
Ready to NAND_RE_B low
tRR4
NF13
NAND_RE_B pulse width
tRP
DS  T [see 2]
tRC
(DS + DH)  T [see ]
ns
DH  T [see 2]
ns
NF14
READ cycle time
NF15
NAND_RE_B high hold time
tREH
NF16
Data setup on read
tDSR
NF17
1
Unit
Data hold on read
tDHR
(AS + 2)  T [see 3,2]
—
ns
2
—
0.82/11.83 [see
5,6]
ns
(DS  T -0.67)/18.38 [see 5,6]
ns
—
ns
GPMI’s Async Mode output timing can be controlled by the module’s internal registers
HW_GPMI_TIMING0_ADDRESS_SETUP, HW_GPMI_TIMING0_DATA_SETUP, and HW_GPMI_TIMING0_DATA_HOLD.
This AC timing depends on these registers settings. In the table, AS/DS/DH represents each of these settings.
AS minimum value can be 0, while DS/DH minimum value is 1.
T = GPMI clock period -0.075ns (half of maximum p-p jitter).
NF12 is guaranteed by the design.
Non-EDO mode.
EDO mode, GPMI clock  100 MHz
(AS=DS=DH=1, GPMI_CTL1 [RDN_DELAY] = 8, GPMI_CTL1 [HALF_PERIOD] = 0).
In EDO mode (Figure 33), NF16/NF17 are different from the definition in non-EDO mode (Figure 32).
They are called tREA/tRHOH (RE# access time/RE# HIGH to output hold). The typical value for them
are 16 ns (max for tREA)/15 ns (min for tRHOH) at 50 MB/s EDO mode. In EDO mode, GPMI will
sample NAND_DATAxx at rising edge of delayed NAND_RE_B provided by an internal DPLL. The
delay value can be controlled by GPMI_CTRL1.RDN_DELAY (see the GPMI chapter of the i.MX
6Solo/6DualLite reference manual). The typical value of this control register is 0x8 at 50 MT/s EDO
mode. But if the board delay is big enough and cannot be ignored, the delay value should be made larger
to compensate the board delay.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
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69
Electrical Characteristics
4.10.2
Source Synchronous Mode AC Timing (ONFI 2.x Compatible)
Figure 35 to Figure 37 show the write and read timing of Source Synchronous Mode.
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Freescale Semiconductor
Electrical Characteristics
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Figure 37. Source Synchronous Mode Data Read Timing Diagram
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
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71
Electrical Characteristics
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Figure 38. NAND_DQS/NAND_DQ Read Valid Window
Table 51. Source Synchronous Mode Timing Parameters1
ID
Parameter
Symbol
Timing
T = GPMI Clock Cycle
Min.
Unit
Max.
NF18 NAND_CE0_B access time
tCE
CE_DELAY  T - 0.79 [see 2]
ns
NF19 NAND_CE0_B hold time
tCH
0.5  tCK - 0.63 [see 2]
ns
NF20 Command/address NAND_DATAxx setup time
tCAS
0.5  tCK - 0.05
ns
NF21 Command/address NAND_DATAxx hold time
tCAH
0.5  tCK - 1.23
ns
tCK
—
ns
NF23 preamble delay
tPRE
PRE_DELAY  T - 0.29 [see 2]
ns
NF24 postamble delay
tPOST
POST_DELAY  T - 0.78 [see 2]
ns
NF25 NAND_CLE and NAND_ALE setup time
tCALS
0.5  tCK - 0.86
ns
NF26 NAND_CLE and NAND_ALE hold time
tCALH
0.5  tCK - 0.37
ns
NF27 NAND_CLK to first NAND_DQS latching transition
tDQSS
T - 0.41 [see 2]
ns
NF28 Data write setup
—
0.25  tCK - 0.35
NF29 Data write hold
—
0.25  tCK - 0.85
NF30 NAND_DQS/NAND_DQ read setup skew
—
—
2.06
NF31 NAND_DQS/NAND_DQ read hold skew
—
—
1.95
NF22 clock period
1
GPMI’s source synchronous mode output timing can be controlled by the module’s internal registers
GPMI_TIMING2_CE_DELAY, GPMI_TIMING_PREAMBLE_DELAY, GPMI_TIMING2_POST_DELAY. This AC timing depends
on these registers settings. In the table, CE_DELAY/PRE_DELAY/POST_DELAY represents each of these settings.
2
T = tCK(GPMI clock period) -0.075ns (half of maximum p-p jitter).
For DDR Source sync mode, Figure 38 shows the timing diagram of NAND_DQS/NAND_DATAxx read
valid window. The typical value of tDQSQ is 0.85ns (max) and 1ns (max) for tQHS at 200MB/s. GPMI
will sample NAND_DATA[7:0] at both rising and falling edge of an delayed NAND_DQS signal, which
can be provided by an internal DPLL. The delay value can be controlled by GPMI register
GPMI_READ_DDR_DLL_CTRL.SLV_DLY_TARGET (see the GPMI chapter of the i.MX
6Solo/6DualLite reference manual). Generally, the typical delay value of this register is equal to 0x7 which
means 1/4 clock cycle delay expected. But if the board delay is big enough and cannot be ignored, the delay
value should be made larger to compensate the board delay.
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Electrical Characteristics
4.10.3
4.10.3.1
Samsung Toggle Mode AC Timing
Command and Address Timing
NOTE
Samsung Toggle Mode command and address timing is the same as ONFI
1.0 compatible Async mode AC timing. See Section 4.10.1, “Asynchronous
Mode AC Timing (ONFI 1.0 Compatible),” for details.
4.10.3.2
Read and Write Timing
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Figure 39. Samsung Toggle Mode Data Write Timing
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73
Electrical Characteristics
DEV?CLK
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Figure 40. Samsung Toggle Mode Data Read Timing
Table 52. Samsung Toggle Mode Timing Parameters1
ID
Parameter
Symbol
Timing
T = GPMI Clock Cycle
Unit
Min
Max
(AS + DS)  T - 0.12 [see
2,3]
NF1
NAND_CLE setup time
tCLS
NF2
NAND_CLE hold time
tCLH
DH  T - 0.72 [see 2]
NF3
NAND_CE0_B setup time
tCS
(AS + DS)  T - 0.58 [see 3,2]
NF4
NAND_CE0_B hold time
tCH
DH  T - 1 [see 2]
NF5
NAND_WE_B pulse width
tWP
DS  T [see 2]
NF6
NAND_ALE setup time
tALS
(AS + DS)  T - 0.49 [see 3,2]
NF7
NAND_ALE hold time
tALH
DH  T - 0.42 [see 2]
NF8
Command/address NAND_DATAxx setup time
tCAS
DS  T - 0.26 [see 2]
NF9
Command/address NAND_DATAxx hold time
tCAH
DH  T - 1.37 [see 2]
NF18 NAND_CEx_B access time
tCE
CE_DELAY  T [see 4,2]
—
ns
NF22 clock period
tCK
—
—
ns
—
ns
—
ns
NF23 preamble delay
NF24 postamble delay
tPRE
tPOST
PRE_DELAY  T [see
5,2]
POST_DELAY  T +0.43 [see ]
2
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Electrical Characteristics
Table 52. Samsung Toggle Mode Timing Parameters1 (continued)
ID
1
2
3
4
5
6
7
Parameter
Symbol
Timing
T = GPMI Clock Cycle
Unit
Min
Max
NF28 Data write setup
6
tDS
0.25  tCK - 0.32
—
ns
NF29 Data write hold
tDH6
0.25  tCK - 0.79
—
ns
NF30 NAND_DQS/NAND_DQ read setup skew
tDQSQ7
—
3.18
NF31 NAND_DQS/NAND_DQ read hold skew
tQHS7
—
3.27
The GPMI toggle mode output timing can be controlled by the module’s internal registers
HW_GPMI_TIMING0_ADDRESS_SETUP, HW_GPMI_TIMING0_DATA_SETUP, and HW_GPMI_TIMING0_DATA_HOLD.
This AC timing depends on these registers settings. In the table, AS/DS/DH represents each of these settings.
AS minimum value can be 0, while DS/DH minimum value is 1.
T = tCK (GPMI clock period) -0.075ns (half of maximum p-p jitter).
CE_DELAY represents HW_GPMI_TIMING2[CE_DELAY]. NF18 is guaranteed by the design. Read/Write operation is started
with enough time of ALE/CLE assertion to low level.
PRE_DELAY+1)  (AS+DS)
Shown in Figure 39, Samsung Toggle Mode Data Write Timing diagram.
Shown in Figure 38, NAND_DQS/NAND_DQ Read Valid Window.
For DDR Toggle mode, Figure 38 shows the timing diagram of NAND_DQS/NAND_DATAxx read valid
window. The typical value of tDQSQ is 1.4 ns (max) and 1.4 ns (max) for tQHS at 133 MB/s. GPMI will
sample NAND_DATA[7:0] at both rising and falling edge of an delayed NAND_DQS signal, which is
provided by an internal DPLL. The delay value of this register can be controlled by GPMI register
GPMI_READ_DDR_DLL_CTRL.SLV_DLY_TARGET (see the GPMI chapter of the i.MX
6Solo/6DualLite reference manual). Generally, the typical delay value is equal to 0x7 which means 1/4
clock cycle delay expected. But if the board delay is big enough and cannot be ignored, the delay value
should be made larger to compensate the board delay.
4.11
External Peripheral Interface Parameters
The following subsections provide information on external peripheral interfaces.
4.11.1
AUDMUX Timing Parameters
The AUDMUX provides a programmable interconnect logic for voice, audio, and data routing between
internal serial interfaces (SSIs) and external serial interfaces (audio and voice codecs). The AC timing of
AUDMUX external pins is governed by the SSI module. For more information, see the respective SSI
electrical specifications found within this document.
4.11.2
ECSPI Timing Parameters
This section describes the timing parameters of the ECSPI blocks. The ECSPI have separate timing
parameters for master and slave modes.
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Electrical Characteristics
4.11.2.1
ECSPI Master Mode Timing
Figure 41 depicts the timing of ECSPI in master mode. Table 53 lists the ECSPI master mode timing
characteristics.
ECSPIx_RDY_B
ECSPIx_SS_B
CS10
CS1
CS2
CS3
CS5
CS6
CS4
ECSPIx_SCLK
CS7 CS3
CS2
ECSPIx_MOSI
CS8
CS9
ECSPIx_MISO
Figure 41. ECSPI Master Mode Timing Diagram
Table 53. ECSPI Master Mode Timing Parameters
ID
Parameter
Symbol
Min
Max
Unit
CS1
ECSPIx_SCLK Cycle Time–Read
ECSPIx_SCLK Cycle Time–Write
tclk
43
15
—
ns
CS2
ECSPIx_SCLK High or Low Time–Read
ECSPIx_SCLK High or Low Time–Write
tSW
21.5
7
—
ns
CS3
ECSPIx_SCLK Rise or Fall1
tRISE/FALL
—
—
ns
CS4
ECSPIx_SS_B pulse width
tCSLH
Half ECSPIx_SCLK period
—
ns
CS5
ECSPIx_SS_B Lead Time (CS setup time)
tSCS
Half ECSPIx_SCLK period - 4
—
ns
CS6
ECSPIx_SS_B Lag Time (CS hold time)
tHCS
Half ECSPIx_SCLK period - 2
—
ns
CS7
ECSPIx_MOSI Propagation Delay (CLOAD = 20 pF)
tPDmosi
-1
1
ns
CS8
ECSPIx_MISO Setup Time
•
tSmiso
18
—
ns
CS9
ECSPIx_MISO Hold Time
tHmiso
0
—
ns
tSDRY
5
—
ns
CS10 RDY to ECSPIx_SS_B Time2
1
2
See specific I/O AC parameters Section 4.7, “I/O AC Parameters.”
SPI_RDY is sampled internally by ipg_clk and is asynchronous to all other CSPI signals.
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Electrical Characteristics
4.11.2.2
ECSPI Slave Mode Timing
Figure 42 depicts the timing of ECSPI in slave mode. Table 54 lists the ECSPI slave mode timing
characteristics.
ECSPIx_SS_B
CS5
CS6
CS2
CS1
CS4
ECSPIx_SCLK
CS2
CS9
ECSPIx_MISO
CS8
CS7
ECSPIx_MOSI
Figure 42. ECSPI Slave Mode Timing Diagram
Table 54. ECSPI Slave Mode Timing Parameters
ID
Parameter
Symbol
Min
Max
Unit
CS1 ECSPIx_SCLK Cycle Time–Read
ECSPIx_SCLK Cycle Time–Write
tclk
43
15
—
ns
CS2 ECSPIx_SCLK High or Low Time–Read
ECSPIx_SCLK High or Low Time–Write
tSW
21.5
7
—
ns
CS4 ECSPIx_SS_B pulse width
tCSLH
Half ECSPIx_SCLK period
—
ns
CS5 ECSPIx_SS_B Lead Time (CS setup time)
tSCS
5
—
ns
CS6 ECSPIx_SS_B Lag Time (CS hold time)
tHCS
5
—
ns
CS7 ECSPIx_MOSI Setup Time
tSmosi
4
—
ns
CS8 ECSPIx_MOSI Hold Time
tHmosi
4
—
ns
CS9 ECSPIx_MISO Propagation Delay (CLOAD = 20 pF)
tPDmiso
4
19
ns
4.11.3
Enhanced Serial Audio Interface (ESAI) Timing Parameters
The ESAI consists of independent transmitter and receiver sections, each section with its own clock
generator. Table 55 shows the interface timing values. The number field in the table refers to timing
signals found in Figure 43 and Figure 44.
Table 55. Enhanced Serial Audio Interface (ESAI) Timing
Characteristics1,2
No.
62
Clock cycle4
63
Clock high period:
• For internal clock
• For external clock
Symbol
Expression2
Min
Max
Condition3 Unit
tSSICC
4  Tc
4  Tc
30.0
30.0
—
—
i ck
i ck
—
—
2  Tc 9.0
2  Tc
6
15
—
—
—
—
ns
ns
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Electrical Characteristics
Table 55. Enhanced Serial Audio Interface (ESAI) Timing (continued)
No.
64
Characteristics1,2
Clock low period:
• For internal clock
• For external clock
Symbol
Expression2
Min
Max
Condition3 Unit
—
—
2  Tc 9.0
2  Tc
6
15
—
—
—
—
ns
65
ESAI_RX_CLK rising edge to ESAI_RX_FS out (bl) high
—
—
—
—
—
—
17.0
7.0
x ck
i ck a
ns
66
ESAI_RX_CLK rising edge to ESAI_RX_FS out (bl) low
—
—
—
—
—
—
17.0
7.0
x ck
i ck a
ns
67
ESAI_RX_CLK rising edge to ESAI_RX_FS out (wr)
high5
—
—
—
—
—
—
19.0
9.0
x ck
i ck a
ns
68
ESAI_RX_CLK rising edge to ESAI_RX_FS out (wr) low5
—
—
—
—
—
—
19.0
9.0
x ck
i ck a
ns
69
ESAI_RX_CLK rising edge to ESAI_RX_FS out (wl) high
—
—
—
—
—
—
16.0
6.0
x ck
i ck a
ns
70
ESAI_RX_CLK rising edge to ESAI_RX_FS out (wl) low
—
—
—
—
—
—
17.0
7.0
x ck
i ck a
ns
71
Data in setup time before ESAI_RX_CLK (SCK in
synchronous mode) falling edge
—
—
—
—
12.0
19.0
—
—
x ck
i ck
ns
72
Data in hold time after ESAI_RX_CLK falling edge
—
—
—
—
3.5
9.0
—
—
x ck
i ck
ns
73
ESAI_RX_FS input (bl, wr) high before ESAI_RX_CLK
falling edge5
—
—
—
—
2.0
12.0
—
—
x ck
i ck a
ns
74
ESAI_RX_FS input (wl) high before ESAI_RX_CLK
falling edge
—
—
—
—
2.0
12.0
—
—
x ck
i ck a
ns
75
ESAI_RX_FS input hold time after ESAI_RX_CLK falling
edge
—
—
—
—
2.5
8.5
—
—
x ck
i ck a
ns
78
ESAI_TX_CLK rising edge to ESAI_TX_FS out (bl) high
—
—
—
—
—
—
18.0
8.0
x ck
i ck
ns
79
ESAI_TX_CLK rising edge to ESAI_TX_FS out (bl) low
—
—
—
—
—
—
20.0
10.0
x ck
i ck
ns
80
ESAI_TX_CLK rising edge to ESAI_TX_FS out (wr)
high5
—
—
—
—
—
—
20.0
10.0
x ck
i ck
ns
81
ESAI_TX_CLK rising edge to ESAI_TX_FS out (wr) low5
—
—
—
—
—
—
22.0
12.0
x ck
i ck
ns
82
ESAI_TX_CLK rising edge to ESAI_TX_FS out (wl) high
—
—
—
—
—
—
19.0
9.0
x ck
i ck
ns
83
ESAI_TX_CLK rising edge to ESAI_TX_FS out (wl) low
—
—
—
—
—
—
20.0
10.0
x ck
i ck
ns
84
ESAI_TX_CLK rising edge to data out enable from high
impedance
—
—
—
—
—
—
22.0
17.0
x ck
i ck
ns
86
ESAI_TX_CLK rising edge to data out valid
—
—
—
—
—
—
18.0
13.0
x ck
i ck
ns
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Electrical Characteristics
Table 55. Enhanced Serial Audio Interface (ESAI) Timing (continued)
1
2
3
4
5
6
No.
Characteristics1,2
Symbol
Expression2
Min
Max
Condition3 Unit
87
ESAI_TX_CLK rising edge to data out high impedance 67
—
—
—
—
—
—
21.0
16.0
x ck
i ck
ns
89
ESAI_TX_FS input (bl, wr) setup time before
ESAI_TX_CLK falling edge5
—
—
—
—
2.0
18.0
—
—
x ck
i ck
ns
90
ESAI_TX_FS input (wl) setup time before ESAI_TX_CLK
falling edge
—
—
—
—
2.0
18.0
—
—
x ck
i ck
ns
91
ESAI_TX_FS input hold time after ESAI_TX_CLK falling
edge
—
—
—
—
4.0
5.0
—
—
x ck
i ck
ns
95
ESAI_RX_HF_CLK/ESAI_TX_HF_CLK clock cycle
—
2 x TC
15
—
—
ns
96
ESAI_TX_HF_CLK input rising edge to ESAI_TX_CLK
output
—
—
—
18.0
—
ns
97
ESAI_RX_HF_CLK input rising edge to ESAI_RX_CLK
output
—
—
—
18.0
—
ns
i ck = internal clock
x ck = external clock
i ck a = internal clock, asynchronous mode
(asynchronous implies that ESAI_TX_CLK and ESAI_RX_CLK are two different clocks)
i ck s = internal clock, synchronous mode
(synchronous implies that ESAI_TX_CLK and ESAI_RX_CLK are the same clock)
bl = bit length
wl = word length
wr = word length relative
ESAI_TX_CLK(SCKT pin) = transmit clock
ESAI_RX_CLK(SCKR pin) = receive clock
ESAI_TX_FS(FST pin) = transmit frame sync
ESAI_RX_FS(FSR pin) = receive frame sync
ESAI_TX_HF_CLK(HCKT pin) = transmit high frequency clock
ESAI_RX_HF_CLK(HCKR pin) = receive high frequency clock
For the internal clock, the external clock cycle is defined by Icyc and the ESAI control register.
The word-relative frame sync signal waveform relative to the clock operates in the same manner as the bit-length frame sync
signal waveform, but it spreads from one serial clock before the first bit clock (like the bit length frame sync signal), until the
second-to-last bit clock of the first word in the frame.
Periodically sampled and not 100% tested.
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Electrical Characteristics
62
63
64
ESAI_TX_CLK
(Input/Output)
78
ESAI_TX_FS
(Bit)
Out
79
82
ESAI_TX_FS
(Word)
Out
83
86
86
84
87
First Bit
Data Out
Last Bit
89
91
ESAI_TX_FS
(Bit) In
90
91
ESAI_TX_FS
(Word) In
Figure 43. ESAI Transmitter Timing
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Freescale Semiconductor
Electrical Characteristics
62
63
64
ESAI_RX_CLK
(Input/Output)
65
ESAI_RX_FS
(Bit)
Out
66
69
70
ESAI_RX_FS
(Word)
Out
72
71
Data In
ESAI_RX_FS
(Bit)
In
ESAI_RX_FS
(Word)
In
First Bit
Last Bit
75
73
74
75
Figure 44. ESAI Receiver Timing
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Electrical Characteristics
Ultra High Speed SD/SDIO/MMC Host Interface (uSDHC) AC
4.11.4
Timing
This section describes the electrical information of the uSDHC, which includes SD/eMMC4.3 (Single
Data Rate) timing, eMMC4.4/4.41 (Dual Date Rate) timing and SDR104/50(SD3.0) timing.
4.11.4.1
SD/eMMC4.3 (Single Data Rate) AC Timing
Figure 45 depicts the timing of SD/eMMC4.3, and Table 56 lists the SD/eMMC4.3 timing characteristics.
SD4
SD2
SD1
SD5
SDx_CLK
SD3
SD6
Output from uSDHC to card
SDx_DATA[7:0]
SD7
SD8
Input from card to uSDHC
SDx_DATA[7:0]
Figure 45. SD/eMMC4.3 Timing
Table 56. SD/eMMC4.3 Interface Timing Specification
ID
Parameter
Symbols
Min
Max
Unit
Clock Frequency (Low Speed)
fPP1
0
400
kHz
Clock Frequency (SD/SDIO Full Speed/High Speed)
fPP2
0
25/50
MHz
Clock Frequency (MMC Full Speed/High Speed)
fPP3
0
20/52
MHz
Clock Frequency (Identification Mode)
fOD
100
400
kHz
SD2
Clock Low Time
tWL
7
—
ns
SD3
Clock High Time
tWH
7
—
ns
SD4
Clock Rise Time
tTLH
—
3
ns
SD5
Clock Fall Time
tTHL
—
3
ns
3.6
ns
Card Input Clock
SD1
uSDHC Output/Card Inputs SDx_CMD, SDx_DATAx (Reference to CLK)
SD6
uSDHC Output Delay
tOD
-6.6
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Table 56. SD/eMMC4.3 Interface Timing Specification (continued)
ID
Parameter
Symbols
Min
Max
Unit
uSDHC Input/Card Outputs SDx_CMD, SDx_DATAx (Reference to CLK)
SD7
uSDHC Input Setup Time
SD8
4
uSDHC Input Hold Time
tISU
2.5
—
ns
tIH
1.5
—
ns
1
In low speed mode, card clock must be lower than 400 kHz, voltage ranges from 2.7 to 3.6 V.
In normal (full) speed mode for SD/SDIO card, clock frequency can be any value between 0–25 MHz. In high-speed mode,
clock frequency can be any value between 0–50 MHz.
3
In normal (full) speed mode for MMC card, clock frequency can be any value between 0–20 MHz. In high-speed mode, clock
frequency can be any value between 0–52 MHz.
4
To satisfy hold timing, the delay difference between clock input and cmd/data input must not exceed 2 ns.
2
4.11.4.2
eMMC4.4/4.41 (Dual Data Rate) AC Timing
Figure 46 depicts the timing of eMMC4.4/4.41. Table 57 lists the eMMC4.4/4.41 timing characteristics.
Be aware that only DATA is sampled on both edges of the clock (not applicable to CMD).
SD1
SDx_CLK
SD2
SD2
Output from eSDHCv3 to card
SDx_DATA[7:0]
......
SD3
SD4
Input from card to eSDHCv3
SDx_DATA[7:0]
......
Figure 46. eMMC4.4/4.41 Timing
Table 57. eMMC4.4/4.41 Interface Timing Specification
ID
Parameter
Symbols
Min
Max
Unit
Card Input Clock
SD1
Clock Frequency (eMMC4.4/4.41 DDR)
fPP
0
52
MHz
SD1
Clock Frequency (SD3.0 DDR)
fPP
0
50
MHz
uSDHC Output / Card Inputs SDx_CMD, SDx_DATAx (Reference to CLK)
SD2
uSDHC Output Delay
tOD
2.5
7.1
ns
uSDHC Input / Card Outputs SDx_CMD, SDx_DATAx (Reference to CLK)
SD3
uSDHC Input Setup Time
tISU
2.6
—
ns
SD4
uSDHC Input Hold Time
tIH
1.5
—
ns
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Electrical Characteristics
4.11.4.3
SDR50/SDR104 AC Timing
Figure 47 depicts the timing of SDR50/SDR104, and Table 58 lists the SDR50/SDR104 timing
characteristics.
3$
3$
3$
3#+
3$
3$
/UTPUT &ROM U3$(# TO #ARD
3$
3$
)NPUT FROM #ARD TO U3$(#
3$
Figure 47. SDR50/SDR104 Timing
Table 58. SDR50/SDR104 Interface Timing Specification
ID
Parameter
Symbols
Min
Max
Unit
Card Input Clock
SD1
Clock Frequency Period
tCLK
4.8
—
ns
SD2
Clock Low Time
tCL
0.3*tCLK
0.7*tCLK
ns
SD2
Clock High Time
tCH
0.3*tCLK
0.7*tCLK
ns
uSDHC Output/Card Inputs SDx_CMD, SDx_DATAx in SDR50 (Reference to CLK)
SD4
uSDHC Output Delay
tOD
–3
1
ns
uSDHC Output/Card Inputs SDx_CMD, SDx_DATAx in SDR104 (Reference to CLK)
SD5
uSDHC Output Delay
tOD
–1.6
1
ns
uSDHC Input/Card Outputs SDx_CMD, SDx_DATAx in SDR50 (Reference to CLK)
SD6
uSDHC Input Setup Time
tISU
2.5
—
ns
SD7
uSDHC Input Hold Time
tIH
1.5
—
ns
uSDHC Input/Card Outputs SDx_CMD, SDx_DATAx in SDR104 (Reference to CLK)1
SD8
1
Card Output Data Window
tODW
0.5*tCLK
—
ns
Data window in SDR100 mode is variable.
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4.11.4.4
Bus Operation Condition for 3.3 V and 1.8 V Signaling
Signaling level of SD/eMMC4.3 and eMMC4.4/4.41 modes is 3.3 V. Signaling level of
SDR104/SDR50 mode is 1.8 V. The DC parameters for the NVCC_SD1, NVCC_SD2 and
NVCC_SD3 supplies are identical to those shown in Table 24, "GPIO DC Parameters," on
page 40.Ethernet Controller (ENET) AC Electrical Specifications
4.11.5
The following timing specs are defined at the chip I/O pin and must be translated appropriately to arrive
at timing specs/constraints for the physical interface.
4.11.5.1
ENET MII Mode Timing
This subsection describes MII receive, transmit, asynchronous inputs, and serial management signal
timings.
4.11.5.1.1
MII Receive Signal Timing (ENET_RX_DATA3,2,1,0, ENET_RX_EN,
ENET_RX_ER, and ENET_RX_CLK)
The receiver functions correctly up to an ENET_RX_CLK maximum frequency of 25 MHz + 1%. There
is no minimum frequency requirement. Additionally, the processor clock frequency must exceed twice the
ENET_RX_CLK frequency.
Figure 48 shows MII receive signal timings. Table 59 describes the timing parameters (M1–M4) shown in
the figure.
M3
ENET_RX_CLK (input)
M4
ENET_RX_DATA3,2,1,0
(inputs)
ENET_RX_EN
ENET_RX_ER
M1
M2
Figure 48. MII Receive Signal Timing Diagram
Table 59. MII Receive Signal Timing
Characteristic1
ID
Min.
Max.
Unit
M1
ENET_RX_DATA3,2,1,0, ENET_RX_EN, ENET_RX_ER to
ENET_RX_CLK setup
5
—
ns
M2
ENET_RX_CLK to ENET_RX_DATA3,2,1,0, ENET_RX_EN,
ENET_RX_ER hold
5
—
ns
M3
ENET_RX_CLK pulse width high
35%
65%
ENET_RX_CLK period
M4
ENET_RX_CLK pulse width low
35%
65%
ENET_RX_CLK period
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Electrical Characteristics
1
ENET_RX_EN, ENET_RX_CLK, and ENET0_RXD0 have the same timing in 10 Mbps 7-wire interface mode.
4.11.5.1.2
MII Transmit Signal Timing (ENET_TX_DATA3,2,1,0, ENET_TX_EN,
ENET_TX_ER, and ENET_TX_CLK)
The transmitter functions correctly up to an ENET_TX_CLK maximum frequency of 25 MHz + 1%.
There is no minimum frequency requirement. Additionally, the processor clock frequency must exceed
twice the ENET_TX_CLK frequency.
Figure 49 shows MII transmit signal timings. Table 60 describes the timing parameters (M5–M8) shown
in the figure.
M7
ENET_TX_CLK (input)
M5
M8
ENET_TX_DATA3,2,1,0
(outputs)
ENET_TX_EN
ENET_TX_ER
M6
Figure 49. MII Transmit Signal Timing Diagram
Table 60. MII Transmit Signal Timing
Characteristic1
ID
Min.
Max.
Unit
M5
ENET_TX_CLK to ENET_TX_DATA3,2,1,0, ENET_TX_EN,
ENET_TX_ER invalid
5
—
ns
M6
ENET_TX_CLK to ENET_TX_DATA3,2,1,0, ENET_TX_EN,
ENET_TX_ER valid
—
20
ns
M7
ENET_TX_CLK pulse width high
35%
65%
ENET_TX_CLK period
M8
ENET_TX_CLK pulse width low
35%
65%
ENET_TX_CLK period
1
ENET_TX_EN, ENET_TX_CLK, and ENET0_TXD0 have the same timing in 10-Mbps 7-wire interface mode.
4.11.5.1.3
MII Asynchronous Inputs Signal Timing (ENET_CRS and ENET_COL)
Figure 50 shows MII asynchronous input timings. Table 61 describes the timing parameter (M9) shown in
the figure.
ENET_CRS, ENET_COL
M9
Figure 50. MII Async Inputs Timing Diagram
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Electrical Characteristics
Table 61. MII Asynchronous Inputs Signal Timing
ID
1
M9
1
Characteristic
ENET_CRS to ENET_COL minimum pulse width
Min.
Max.
Unit
1.5
—
ENET_TX_CLK period
ENET_COL has the same timing in 10-Mbit 7-wire interface mode.
4.11.5.1.4
MII Serial Management Channel Timing (ENET_MDIO and ENET_MDC)
The MDC frequency is designed to be equal to or less than 2.5 MHz to be compatible with the IEEE 802.3
MII specification. However the ENET can function correctly with a maximum MDC frequency of
15 MHz.
Figure 51 shows MII asynchronous input timings. Table 62 describes the timing parameters (M10–M15)
shown in the figure.
M14
M15
ENET_MDC (output)
M10
ENET_MDIO (output)
M11
ENET_MDIO (input)
M12
M13
Figure 51. MII Serial Management Channel Timing Diagram
Table 62. MII Serial Management Channel Timing
ID
Characteristic
Min.
Max.
Unit
M10
ENET_MDC falling edge to ENET_MDIO output invalid (min.
propagation delay)
0
—
ns
M11
ENET_MDC falling edge to ENET_MDIO output valid (max.
propagation delay)
—
5
ns
M12
ENET_MDIO (input) to ENET_MDC rising edge setup
18
—
ns
M13
ENET_MDIO (input) to ENET_MDC rising edge hold
0
—
ns
M14
ENET_MDC pulse width high
40%
60%
ENET_MDC period
M15
ENET_MDC pulse width low
40%
60%
ENET_MDC period
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Electrical Characteristics
4.11.5.2
RMII Mode Timing
In RMII mode, ENET_CLK is used as the REF_CLK, which is a 50 MHz ± 50 ppm continuous reference
clock. ENET_RX_EN is used as the ENET_RX_EN in RMII. Other signals under RMII mode include
ENET_TX_EN, ENET_TX_DATA[1:0], ENET_RX_DATA[1:0] and ENET_RX_ER.
Figure 52 shows RMII mode timings. Table 63 describes the timing parameters (M16–M21) shown in the
figure.
M16
M17
ENET_CLK (input)
M18
ENET_TX_DATA (output)
ENET_TX_EN
M19
ENET_RX_EN (input)
ENET_RX_DATA[1:0]
ENET_RX_ER
M20
M21
Figure 52. RMII Mode Signal Timing Diagram
Table 63. RMII Signal Timing
ID
Characteristic
Min.
Max.
Unit
M16
ENET_CLK pulse width high
35%
65%
ENET_CLK period
M17
ENET_CLK pulse width low
35%
65%
ENET_CLK period
M18
ENET_CLK to ENET0_TXD[1:0], ENET_TX_DATA invalid
4
—
ns
M19
ENET_CLK to ENET0_TXD[1:0], ENET_TX_DATA valid
—
15
ns
M20
ENET_RX_DATAD[1:0], ENET_RX_EN(ENET_RX_EN), ENET_RX_ER to
ENET_CLK setup
4
—
ns
M21
ENET_CLK to ENET_RX_DATAD[1:0], ENET_RX_EN, ENET_RX_ER hold
2
—
ns
4.11.5.3
Signal Switching Specifications
The following timing specifications meet the requirements for RGMII interfaces for a range of transceiver
devices.
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Electrical Characteristics
Table 64. RGMII Signal Switching Specifications1
Symbol
Tcyc
2
Description
Clock cycle duration
Min
Max
Unit
7.2
8.8
ns
-500
500
ps
TskewT3
Data to clock output skew at transmitter
TskewR3
Data to clock input skew at receiver
1
2.6
ns
Duty_G4
Duty cycle for Gigabit
45
55
%
Duty_T4
Duty cycle for 10/100T
40
60
%
Tr/Tf
Rise/fall time (20–80%)
—
0.75
ns
1
The timings assume the following configuration:
DDR_SEL = (11)b
DSE (drive-strength) = (111)b
2
For 10 Mbps and 100 Mbps, Tcyc will scale to 400 ns ±40 ns and 40 ns ±4 ns respectively.
3 For all versions of RGMII prior to 2.0; This implies that PC board design will require clocks to be routed such that an additional
trace delay of greater than 1.5 ns and less than 2.0 ns will be added to the associated clock signal. For 10/100, the Max value
is unspecified.
4 Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domain as long
as minimum duty cycle is not violated and stretching occurs for no more than three Tcyc of the lowest speed transitioned
between.
2'-))?48# AT TRANSMITTER
4SKEW4
2'-))?48$N N TO 2'-))?48?#4,
48%.
48%22
4SKEW2
2'-))?48# AT RECEIVER
Figure 53. RGMII Transmit Signal Timing Diagram Original
2'-))?28# AT TRANSMITTER
4SKEW4
2'-))?28$N N TO 2'-))?28?#4,
28$6
28%22
4SKEW2
2'-))?28# AT RECEIVER
Figure 54. RGMII Receive Signal Timing Diagram Original
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Electrical Characteristics
2'-))?28# SOURCE OF DATA
)NTERNAL DELAY
4SETUP 4
4 HOLD 4
4 SETUP 2
4 HOLD 2
2'-))?28$N N TO 2'-))?28?#4,
28$6
28%22
2'-))?28# AT RECEIVER
Figure 55. RGMII Receive Signal Timing Diagram with Internal Delay
4.11.6
Flexible Controller Area Network (FLEXCAN) AC Electrical
Specifications
The Flexible Controller Area Network (FlexCAN) module is a communication controller implementing
the CAN protocol according to the CAN 2.0B protocol specification. The processor has two CAN modules
available for systems design. Tx and Rx ports for both modules are multiplexed with other I/O pins. See
the IOMUXC chapter of the i.MX 6Solo/6DualLite Reference Manual (IMX6SDLRM) to see which pins
expose Tx and Rx pins; these ports are named FLEXCAN_TX and FLEXCAN_RX, respectively.
4.11.7
4.11.7.1
HDMI Module Timing Parameters
Latencies and Timing Information
Power-up time (time between TX_PWRON assertion and TX_READY assertion) for the HDMI 3D Tx
PHY while operating with the slowest input reference clock supported (13.5 MHz) is 3.35 ms.
Power-up time for the HDMI 3D Tx PHY while operating with the fastest input reference clock supported
(340 MHz) is 133 s.
4.11.7.2
Electrical Characteristics
The table below provides electrical characteristics for the HDMI 3D Tx PHY. The following three figures
illustrate various definitions and measurement conditions specified in the table below.
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Electrical Characteristics
Figure 56. Driver Measuring Conditions
Figure 57. Driver Definitions
2 4%2-
($-)?48?$!4!;=?0
($-)?48?#,+?0
2 4%2-
($-)?48?$!4!;=?.
($-)?48?#,+?.
Figure 58. Source Termination
Table 65. Electrical Characteristics
Symbol
Parameter
Condition
Min
Typ
Max
Unit
—
3.15
3.3
3.45
V
—
45
50
55

Operating conditions for HDMI
avddtmds Termination supply voltage
RT
Termination resistance
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Electrical Characteristics
Table 65. Electrical Characteristics (continued)
Symbol
Parameter
Condition
Min
Typ
Max
Unit
TMDS drivers DC specifications
VOFF
VSWING
VH
Single-ended standby voltage RT = 50 
For measurement conditions
Single-ended output swing
and definitions, see the first
voltage
two figures above.
Compliance point TP1 as
defined in the HDMI
specification, version 1.3a,
section 4.2.4.
Single-ended output high
If attached sink supports
voltage
TMDSCLK < or = 165 MHz
For definition, see the second
If attached sink supports
figure above
TMDSCLK > 165 MHz
VL
Single-ended output low
If attached sink supports
voltage
TMDSCLK < or = 165 MHz
For definition, see the second
If attached sink supports
figure above
TMDSCLK > 165 MHz
RTERM
Differential source termination
load (inside HDMI 3D Tx PHY)
Although the HDMI 3D Tx
PHY includes differential
source termination, the
user-defined value is set for
each single line (for
illustration, see the third figure
above).
Note: RTERM can also be
configured to be open and not
present on TMDS channels.
avddtmds ± 10 mV
400
—
mV
600
avddtmds ± 10 mV
mV
mV
avddtmds
- 200 mV
—
avddtmds
+ 10 mV
mV
avddtmds
- 600 mV
—
avddtmds
- 400mV
mV
avddtmds
- 700 mV
—
avddtmds
- 400 mV
mV
50
—
200

—
Hot plug detect specifications
HPDVH
Hot plug detect high range
—
2.0
—
5.3
V
VHPD
VL
Hot plug detect low range
—
0
—
0.8
V
Z
Hot plug detect input
impedance
—
10
—
—
k
Hot plug detect time delay
—
—
—
100
µs
HPD
HPD
t
4.11.8
Switching Characteristics
Table 66 describes switching characteristics for the HDMI 3D Tx PHY. Figure 59 to Figure 63 illustrate
various parameters specified in table.
NOTE
All dynamic parameters related to the TMDS line drivers’ performance
imply the use of assembly guidelines.
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Electrical Characteristics
0PHDMI_TX_CLK
T#0,
T#0(
Figure 59. TMDS Clock Signal Definitions
Figure 60. Eye Diagram Mask Definition for HDMI Driver Signal Specification at TP1
4-$3$!4!0
AVDDTMDS
637).' TYP
4-$3$!4!.
T 3+ P
)NTRA PAIR SKEW
Figure 61. Intra-Pair Skew Definition
0REVIOUS CYCLE ;N =
4-$3$!4!;=
4-$3$!4!;=
4-$3$!4!;=
B;N =
B;N =
B;N =
T 3+ PP
B;N =
B;N =
B;N =
B;N =
B;N =
B;N =
#URRENT CYCLE ;N=
B;N=
B;N=
B;N=
B;N=
B;N=
B;N=
)NTER PAIR SKEW
Figure 62. Inter-Pair Skew Definition
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Electrical Characteristics
Figure 63. TMDS Output Signals Rise and Fall Time Definition
Table 66. Switching Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TMDS Drivers Specifications
—
Maximum serial data rate
—
—
—
3.4
Gbps
F
TMDSCLK
TMDSCLK frequency
On TMDSCLKP/N outputs
25
—
340
MHz
P
TMDSCLK
TMDSCLK period
RL = 50 
See Figure 59.
2.94
—
40
ns
40
50
60
%
t
1
2
t
=t
/P
CDC
TMDSCLK duty cycle
t
CPH
TMDSCLK high time
RL = 50 
See Figure 59.
4
5
6
UI1
t
CPL
TMDSCLK low time
RL = 50 
See Figure 59.
4
5
6
UI1
—
TMDSCLK jitter2
RL = 50 
—
—
0.25
UI1
t
SK(p)
Intra-pair (pulse) skew
RL = 50 
See Figure 61.
—
—
0.15
UI1
t
SK(pp)
Inter-pair skew
RL = 50 
See Figure 62.
—
—
1
UI1
tR
Differential output signal rise
time
20–80%
RL = 50 
See Figure 63.
75
—
0.4 UI
ps
tF
Differential output signal fall time
20–80%
RL = 50 
See Figure 63.
75
—
0.4 UI
ps
—
Differential signal overshoot
Referred to 2x VSWING
—
—
15
%
—
Differential signal undershoot
Referred to 2x VSWING
—
—
25
%
CDC
CPH
TMDSCLK
RL = 50 
See Figure 59.
UI means TMDS clock unit.
Relative to ideal recovery clock, as specified in the HDMI specification, version 1.4a, section 4.2.3.
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4.11.9
I2C Module Timing Parameters
This section describes the timing parameters of the I2C module. Figure 64 depicts the timing of I2C
module, and Table 67 lists the I2C module timing characteristics.
IC11
IC10
I2Cx_SDA
I2Cx_SCL IC2
START
IC7
IC4
IC8
IC10
IC11
IC6
IC9
IC3
STOP
START
START
IC5
IC1
Figure 64. I2C Bus Timing
Table 67. I2C Module Timing Parameters
Standard Mode
ID
Fast Mode
Parameter
Unit
Min
Max
Min
Max
IC1
I2Cx_SCL cycle time
10
—
2.5
—
µs
IC2
Hold time (repeated) START condition
4.0
—
0.6
—
µs
IC3
Set-up time for STOP condition
4.0
—
0.6
—
µs
IC4
Data hold time
01
3.452
01
0.92
µs
IC5
HIGH Period of I2Cx_SCL Clock
4.0
—
0.6
—
µs
IC6
LOW Period of the I2Cx_SCL Clock
4.7
—
1.3
—
µs
IC7
Set-up time for a repeated START condition
4.7
—
0.6
—
µs
IC8
Data set-up time
250
—
1003
—
ns
IC9
Bus free time between a STOP and START condition
4.7
—
1.3
—
µs
IC10
Rise time of both I2Cx_SDA and I2Cx_SCL signals
—
1000
20 + 0.1Cb4
300
ns
IC11
Fall time of both I2Cx_SDA and I2Cx_SCL signals
—
300
20 + 0.1Cb4
300
ns
IC12
Capacitive load for each bus line (Cb)
—
400
—
400
pF
1
A device must internally provide a hold time of at least 300 ns for I2Cx_SDA signal to bridge the undefined region of the falling
edge of I2Cx_SCL.
2 The maximum hold time has only to be met if the device does not stretch the LOW period (ID no IC5) of the I2Cx_SCL signal.
3 A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement of Set-up time (ID No IC7)
of 250 ns must be met. This automatically is the case if the device does not stretch the LOW period of the I2Cx_SCL signal.
If such a device does stretch the LOW period of the I2Cx_SCL signal, it must output the next data bit to the I2Cx_SDA line
max_rise_time (IC9) + data_setup_time (IC7) = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification)
before the I2Cx_SCL line is released.
4
Cb = total capacitance of one bus line in pF.
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4.11.10 Image Processing Unit (IPU) Module Parameters
The purpose of the IPU is to provide comprehensive support for the flow of data from an image sensor
and/or to a display device. This support covers all aspects of these activities:
• Connectivity to relevant devices—cameras, displays, graphics accelerators, and TV encoders.
• Related image processing and manipulation: sensor image signal processing, display processing,
image conversions, and other related functions.
• Synchronization and control capabilities, such as avoidance of tearing artifacts.
4.11.10.1 IPU Sensor Interface Signal Mapping
The IPU supports a number of sensor input formats. Table 68 defines the mapping of the Sensor Interface
Pins used for various supported interface formats.
Table 68. Camera Input Signal Cross Reference, Format, and Bits Per Cycle
RGB565
8 bits
2 cycles
RGB5652
8 bits
3 cycles
RGB6663
8 bits
3 cycles
RGB888
8 bits
3 cycles
YCbCr4
8 bits
2 cycles
RGB5655
16 bits
2 cycles
YCbCr6
16 bits
1 cycle
YCbCr7
16 bits
1 cycle
YCbCr8
20 bits
1 cycle
IPUx_CSIx_
DATA00
—
—
—
—
—
—
—
0
C[0]
IPUx_CSIx_
DATA01
—
—
—
—
—
—
—
0
C[1]
IPUx_CSIx_
DATA02
—
—
—
—
—
—
—
C[0]
C[2]
IPUx_CSIx_
DATA03
—
—
—
—
—
—
—
C[1]
C[3]
IPUx_CSIx_
DATA04
—
—
—
—
—
B[0]
C[0]
C[2]
C[4]
IPUx_CSIx_
DATA05
—
—
—
—
—
B[1]
C[1]
C[3]
C[5]
IPUx_CSIx_
DATA06
—
—
—
—
—
B[2]
C[2]
C[4]
C[6]
IPUx_CSIx_
DATA07
—
—
—
—
—
B[3]
C[3]
C[5]
C[7]
IPUx_CSIx_
DATA08
—
—
—
—
—
B[4]
C[4]
C[6]
C[8]
IPUx_CSIx_
DATA09
—
—
—
—
—
G[0]
C[5]
C[7]
C[9]
IPUx_CSIx_
DATA10
—
—
—
—
—
G[1]
C[6]
0
Y[0]
IPUx_CSIx_
DATA11
—
—
—
—
—
G[2]
C[7]
0
Y[1]
IPUx_CSIx_
DATA12
B[0], G[3]
R[2],G[4],B[2]
R/G/B[4]
R/G/B[0]
Y/C[0]
G[3]
Y[0]
Y[0]
Y[2]
Signal
Name1
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Table 68. Camera Input Signal Cross Reference, Format, and Bits Per Cycle (continued)
RGB565
8 bits
2 cycles
RGB5652
8 bits
3 cycles
RGB6663
8 bits
3 cycles
RGB888
8 bits
3 cycles
YCbCr4
8 bits
2 cycles
RGB5655
16 bits
2 cycles
YCbCr6
16 bits
1 cycle
YCbCr7
16 bits
1 cycle
YCbCr8
20 bits
1 cycle
IPUx_CSIx_
DATA13
B[1], G[4]
R[3],G[5],B[3]
R/G/B[5]
R/G/B[1]
Y/C[1]
G[4]
Y[1]
Y[1]
Y[3]
IPUx_CSIx_
DATA14
B[2], G[5]
R[4],G[0],B[4]
R/G/B[0]
R/G/B[2]
Y/C[2]
G[5]
Y[2]
Y[2]
Y[4]
IPUx_CSIx_
DATA15
B[3], R[0]
R[0],G[1],B[0]
R/G/B[1]
R/G/B[3]
Y/C[3]
R[0]
Y[3]
Y[3]
Y[5]
IPUx_CSIx_
DATA16
B[4], R[1]
R[1],G[2],B[1]
R/G/B[2]
R/G/B[4]
Y/C[4]
R[1]
Y[4]
Y[4]
Y[6]
IPUx_CSIx_
DATA17
G[0], R[2]
R[2],G[3],B[2]
R/G/B[3]
R/G/B[5]
Y/C[5]
R[2]
Y[5]
Y[5]
Y[7]
IPUx_CSIx_
DATA18
G[1], R[3]
R[3],G[4],B[3]
R/G/B[4]
R/G/B[6]
Y/C[6]
R[3]
Y[6]
Y[6]
Y[8]
IPUx_CSIx_
DATA19
G[2], R[4]
R[4],G[5],B[4]
R/G/B[5]
R/G/B[7]
Y/C[7]
R[4]
Y[7]
Y[7]
Y[9]
Signal
Name1
1
2
3
4
5
6
7
8
IPUx_CSIx stands for IPUx_CSI0 or IPUx_CSI1
The MSB bits are duplicated on LSB bits implementing color extension
The two MSB bits are duplicated on LSB bits implementing color extension
YCbCr, 8 bits—Supported within the BT.656 protocol (sync embedded within the data stream).
RGB 16 bits— Supported in two ways: (1) As a “generic data” input, with no on-the-fly processing; (2) With on-the-fly
processing, but only under some restrictions on the control protocol.
YCbCr 16 bits— Supported as a “generic-data” input, with no on-the-fly processing.
YCbCr 16 bits— Supported as a sub-case of the YCbCr, 20 bits, under the same conditions (BT.1120 protocol).
YCbCr, 20 bits, supported only within the BT.1120 protocol (syncs embedded within the data stream).
4.11.10.2 Sensor Interface Timings
There are three camera timing modes supported by the IPU.
4.11.10.2.1 BT.656 and BT.1120 Video Mode
Smart camera sensors, which include imaging processing, usually support video mode transfer. They use
an embedded timing syntax to replace the IPUx_CSIx_VSYNC and IPUx_CSIx_HSYNC signals. The
timing syntax is defined by the BT.656/BT.1120 standards.
This operation mode follows the recommendations of ITU BT.656/ ITU BT.1120 specifications. The only
control signal used is IPUx_CSIx_PIX_CLK. Start-of-frame and active-line signals are embedded in the
data stream. An active line starts with a SAV code and ends with a EAV code. In some cases, digital
blanking is inserted in between EAV and SAV code. The CSI decodes and filters out the timing-coding
from the data stream, thus recovering IPUx_CSIx_VSYNC and IPUx_CSIx_HSYNC signals for internal
use. On BT.656 one component per cycle is received over the IPUx_CSIx_DATA_EN bus. On BT.1120
two components per cycle are received over the IPUx_CSIx_DATA_EN bus.
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4.11.10.2.2 Gated Clock Mode
The IPUx_CSIx_VSYNC, IPUx_CSIx_HSYNC, and IPUx_CSIx_PIX_CLK signals are used in this
mode. See Figure 65.
3TART OF &RAME
NTH FRAME
N TH FRAME
!CTIVE ,INE
)05X?#3)X??639.#
)05X?#3)X??(39.#
)05X?#3)X??0)8?#,+
)05X?#3)X??$!4!XX
INVALID
INVALID
ST BYTE
ST BYTE
Figure 65. Gated Clock Mode Timing Diagram
A frame starts with a rising edge on IPUx_CSIx_VSYNC (all the timings correspond to straight polarity
of the corresponding signals). Then IPUx_CSIx_HSYNC goes to high and hold for the entire line. Pixel
clock is valid as long as IPUx_CSIx_HSYNC is high. Data is latched at the rising edge of the valid pixel
clocks. IPUx_CSIx_HSYNC goes to low at the end of line. Pixel clocks then become invalid and the CSI
stops receiving data from the stream. For the next line, the IPUx_CSIx_HSYNC timing repeats. For the
next frame, the IPUx_CSIx_VSYNC timing repeats.
4.11.10.2.3 Non-Gated Clock Mode
The timing is the same as the gated-clock mode (described in Section 4.11.10.2.2, “Gated Clock Mode,”)
except for the IPUx_CSIx_HSYNC signal, which is not used (see Figure 66). All incoming pixel clocks
are valid and cause data to be latched into the input FIFO. The IPUx_CSIx_PIX_CLK signal is inactive
(states low) until valid data is going to be transmitted over the bus.
Start of Frame
nth frame
n+1th frame
IPUx_CSIx_VSYNC
IPUx_CSIx_PIX_CLK
IPUx_CSIx_DATA_EN[19:0]
invalid
invalid
1st byte
1st byte
Figure 66. Non-Gated Clock Mode Timing Diagram
The timing described in Figure 66 is that of a typical sensor. Some other sensors may have a slightly
different timing. The CSI can be programmed to support rising/falling-edge triggered
IPUx_CSIx_VSYNC; active-high/low IPUx_CSIx_HSYNC; and rising/falling-edge triggered
IPUx_CSIx_PIX_CLK.
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4.11.10.3 Electrical Characteristics
Figure 67 depicts the sensor interface timing. IPUx_CSIx_PIX_CLK signal described here is not
generated by the IPU. Table 69 lists the sensor interface timing characteristics.
IPUx_CSIx_PIX_CLK
(Sensor Output)
IP3
1/IP1
IP2
IPUx_CSIx_DATA_EN,
IPUx_CSIx_VSYNC,
IPUx_CSIx_HSYNC
Figure 67. Sensor Interface Timing Diagram
Table 69. Sensor Interface Timing Characteristics
ID
Parameter
Symbol
Min
Max
Unit
IP1
Sensor output (pixel) clock frequency
Fpck
0.01
180
MHz
IP2
Data and control setup time
Tsu
2
—
ns
IP3
Data and control holdup time
Thd
1
—
ns
4.11.10.4 IPU Display Interface Signal Mapping
The IPU supports a number of display output video formats. Table 70 defines the mapping of the Display
Interface Pins used during various supported video interface formats.
Table 70. Video Signal Cross-Reference
i.MX 6Solo/6DualLite
LCD
Port Name
(x=0, 1)
RGB/TV Signal Allocation (Example)
RGB,
Signal
16-bit 20-bit
16-bit 18-bit 24 Bit
8-bit
Name
3
(General) RGB RGB RGB YCrCb YCrCb YCrCb
Comment1,2
IPUx_DISPx_DAT00
DAT[0]
B[0]
B[0]
B[0]
Y/C[0]
C[0]
C[0]
—
IPUx_DISPx_DAT01
DAT[1]
B[1]
B[1]
B[1]
Y/C[1]
C[1]
C[1]
—
IPUx_DISPx_DAT02
DAT[2]
B[2]
B[2]
B[2]
Y/C[2]
C[2]
C[2]
—
IPUx_DISPx_DAT03
DAT[3]
B[3]
B[3]
B[3]
Y/C[3]
C[3]
C[3]
—
IPUx_DISPx_DAT04
DAT[4]
B[4]
B[4]
B[4]
Y/C[4]
C[4]
C[4]
—
IPUx_DISPx_DAT05
DAT[5]
G[0]
B[5]
B[5]
Y/C[5]
C[5]
C[5]
—
IPUx_DISPx_DAT06
DAT[6]
G[1]
G[0]
B[6]
Y/C[6]
C[6]
C[6]
—
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Table 70. Video Signal Cross-Reference (continued)
i.MX 6Solo/6DualLite
LCD
Port Name
(x=0, 1)
RGB/TV Signal Allocation (Example)
RGB,
Signal
16-bit 18-bit 24 Bit
8-bit
16-bit 20-bit
Name
3
(General) RGB RGB RGB YCrCb YCrCb YCrCb
Comment1,2
IPUx_DISPx_DAT07
DAT[7]
G[2]
G[1]
B[7]
Y/C[7]
C[7]
C[7]
—
IPUx_DISPx_DAT08
DAT[8]
G[3]
G[2]
G[0]
—
Y[0]
C[8]
—
IPUx_DISPx_DAT09
DAT[9]
G[4]
G[3]
G[1]
—
Y[1]
C[9]
—
IPUx_DISPx_DAT10
DAT[10]
G[5]
G[4]
G[2]
—
Y[2]
Y[0]
—
IPUx_DISPx_DAT11
DAT[11]
R[0]
G[5]
G[3]
—
Y[3]
Y[1]
—
IPUx_DISPx_DAT12
DAT[12]
R[1]
R[0]
G[4]
—
Y[4]
Y[2]
—
IPUx_DISPx_DAT13
DAT[13]
R[2]
R[1]
G[5]
—
Y[5]
Y[3]
—
IPUx_DISPx_DAT14
DAT[14]
R[3]
R[2]
G[6]
—
Y[6]
Y[4]
—
IPUx_DISPx_DAT15
DAT[15]
R[4]
R[3]
G[7]
—
Y[7]
Y[5]
—
IPUx_DISPx_DAT16
DAT[16]
—
R[4]
R[0]
—
—
Y[6]
—
IPUx_DISPx_DAT17
DAT[17]
—
R[5]
R[1]
—
—
Y[7]
—
IPUx_DISPx_DAT18
DAT[18]
—
—
R[2]
—
—
Y[8]
—
IPUx_DISPx_DAT19
DAT[19]
—
—
R[3]
—
—
Y[9]
—
IPUx_DISPx_DAT20
DAT[20]
—
—
R[4]
—
—
—
—
IPUx_DISPx_DAT21
DAT[21]
—
—
R[5]
—
—
—
—
IPUx_DISPx_DAT22
DAT[22]
—
—
R[6]
—
—
—
—
IPUx_DISPx_DAT23
DAT[23]
—
—
R[7]
—
—
—
—
DIx_DISP_CLK
PixCLK
—
DIx_PIN1
—
May be required for anti-tearing
DIx_PIN2
HSYNC
—
DIx_PIN3
VSYNC
VSYNC out
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Table 70. Video Signal Cross-Reference (continued)
i.MX 6Solo/6DualLite
LCD
Comment1,2
Port Name
(x=0, 1)
RGB/TV Signal Allocation (Example)
RGB,
Signal
16-bit 18-bit 24 Bit
8-bit
16-bit 20-bit
Name
3
(General) RGB RGB RGB YCrCb YCrCb YCrCb
DIx_PIN4
—
DIx_PIN5
—
Additional frame/row synchronous
signals with programmable timing
DIx_PIN6
—
DIx_PIN7
—
DIx_PIN8
—
DIx_D0_CS
—
—
DIx_D1_CS
—
Alternate mode of PWM output for
contrast or brightness control
DIx_PIN11
—
—
DIx_PIN12
—
—
DIx_PIN13
—
Register select signal
DIx_PIN14
—
Optional RS2
DIx_PIN15
DRDY/DV
DIx_PIN16
—
DIx_PIN17
Q
Data validation/blank, data enable
Additional data synchronous
signals with programmable
features/timing
1
Signal mapping (both data and control/synchronization) is flexible. The table provides examples.
Restrictions for ports IPUx_DISPx_DAT00 through IPUx_DISPx_DAT23 are as follows:
• A maximum of three continuous groups of bits can be independently mapped to the external bus. Groups must not overlap.
• The bit order is expressed in each of the bit groups, for example, B[0] = least significant blue pixel bit.
3 This mode works in compliance with recommendation ITU-R BT.656. The timing reference signals (frame start, frame end, line
start, and line end) are embedded in the 8-bit data bus. Only video data is supported, transmission of non-video related data
during blanking intervals is not supported.
2
NOTE
Table 70 provides information for both the DISP0 and DISP1 ports.
However, DISP1 port has reduced pinout depending on IOMUXC
configuration and therefore may not support all the above configurations.
See the IOMUXC table for details.
4.11.10.5 IPU Display Interface Timing
The IPU Display Interface supports two kinds of display accesses: synchronous and asynchronous. There
are two groups of external interface pins to provide synchronous and asynchronous controls accordantly.
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4.11.10.5.1 Synchronous Controls
The synchronous control changes its value as a function of a system or of an external clock. This control
has a permanent period and a permanent wave form.
There are special physical outputs to provide synchronous controls:
• The IPP_DISP_CLK is a dedicated base synchronous signal that is used to generate a base display
(component, pixel) clock for a display.
• The IPUx_DIx_PIN01—IPUx_DIx_PIN07 are general purpose synchronous pins, that can be used
to provide HSYNC, VSYNC, DRDY or any other independent signal to a display.
The IPU has a system of internal binding counters for internal events (such as, HSYNC/VSYNC)
calculation. The internal event (local start point) is synchronized with internal DI_CLK. A suitable control
starts from the local start point with predefined UP and DOWN values to calculate control’s changing
points with half DI_CLK resolution. A full description of the counters system can be found in the IPU
chapter of the i.MX 6Solo/6DualLite Reference Manual (IMX6SDLRM).
4.11.10.5.2 Asynchronous Controls
The asynchronous control is a data-oriented signal that changes its value with an output data according to
additional internal flags coming with the data.
There are special physical outputs to provide asynchronous controls, as follows:
• The IPUx_DIx_D0_CS and IPUx_DIx_D1_CS pins are dedicated to provide chip select signals to
two displays.
• The IPUx_DIx_PIN11—IPUx_DIx_PIN17 are general purpose asynchronous pins, that can be
used to provide WR. RD, RS or any other data oriented signal to display.
NOTE
The IPU has independent signal generators for asynchronous signals
toggling. When a DI decides to put a new asynchronous data in the bus, a
new internal start (local start point) is generated. The signals generators
calculate predefined UP and DOWN values to change pins states with half
DI_CLK resolution.
4.11.10.6 Synchronous Interfaces to Standard Active Matrix TFT LCD Panels
4.11.10.6.1 IPU Display Operating Signals
The IPU uses four control signals and data to operate a standard synchronous interface:
• IPP_DISP_CLK—Clock to display
• HSYNC—Horizontal synchronization
• VSYNC—Vertical synchronization
• DRDY—Active data
All synchronous display controls are generated on the base of an internally generated “local start point”.
The synchronous display controls can be placed on time axis with DI’s offset, up and down parameters.
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The display access can be whole number of DI clock (Tdiclk) only. The IPP_DATA can not be moved
relative to the local start point. The data bus of the synchronous interface is output direction only.
4.11.10.6.2 LCD Interface Functional Description
Figure 68 depicts the LCD interface timing for a generic active matrix color TFT panel. In this figure,
signals are shown with negative polarity. The sequence of events for active matrix interface timing is:
• DI_CLK internal DI clock is used for calculation of other controls.
• IPP_DISP_CLK latches data into the panel on its negative edge (when positive polarity is
selected). In active mode, IPP_DISP_CLK runs continuously.
• HSYNC causes the panel to start a new line. (Usually IPUx_DIx_PIN02 is used as HSYNC.)
• VSYNC causes the panel to start a new frame. It always encompasses at least one HSYNC pulse.
(Usually IPUx_DIx_PIN03 is used as VSYNC.)
• DRDY acts like an output enable signal to the CRT display. This output enables the data to be
shifted onto the display. When disabled, the data is invalid and the trace is off.
(DRDY can be used either synchronous or asynchronous generic purpose pin as well.)
VSYNC
HSYNC
LINE 1
LINE 2
LINE 3
LINE 4
LINE n-1
LINE n
HSYNC
DRDY
1
IPP_DISP_CLK
2
3
m-1
m
IPP_DATA
Figure 68. Interface Timing Diagram for TFT (Active Matrix) Panels
4.11.10.6.3 TFT Panel Sync Pulse Timing Diagrams
Figure 69 depicts the horizontal timing (timing of one line), including both the horizontal sync pulse and
the data. All the parameters shown in the figure are programmable. All controls are started by
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corresponding internal events—local start points. The timing diagrams correspond to inverse polarity of
the IPP_DISP_CLK signal and active-low polarity of the HSYNC, VSYNC, and DRDY signals.
IP13o
IP7
IP5o
IP8o
IP5
IP8
DI clock
IPP_DISP_ CLK
VSYNC
HSYNC
DRDY
IPP_DATA
D0
IP10
IP6
local start point
local start point
Dn
IP9o
IP9
local start point
D1
Figure 69. TFT Panels Timing Diagram—Horizontal Sync Pulse
Figure 70 depicts the vertical timing (timing of one frame). All parameters shown in the figure are
programmable.
Start of frame
IP13
End of frame
VSYNC
HSYNC
DRDY
IP11
IP15
IP14
IP12
Figure 70. TFT Panels Timing Diagram—Vertical Sync Pulse
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Table 71 shows timing characteristics of signals presented in Figure 69 and Figure 70.
Table 71. Synchronous Display Interface Timing Characteristics (Pixel Level)
ID
Parameter
Symbol
Value
1
IP5
Display interface clock period
Tdicp
( )
IP6
Display pixel clock period
Tdpcp
IP7
Screen width time
Tsw
(SCREEN_WIDTH)
 Tdicp
IP8
HSYNC width time
Thsw
(HSYNC_WIDTH)
IP9
Horizontal blank interval 1
Thbi1
BGXP  Tdicp
IP10
Horizontal blank interval 2
Thbi2
IP12
Screen height
IP13
Description
Display interface clock. IPP_DISP_CLK
DISP_CLK_PER_PIXEL Time of translation of one pixel to display,
 Tdicp
DISP_CLK_PER_PIXEL—number of pixel
components in one pixel (1.n). The
DISP_CLK_PER_PIXEL is virtual
parameter to define Display pixel clock
period.
The DISP_CLK_PER_PIXEL is received by
DC/DI one access division to n
components.
Unit
ns
ns
SCREEN_WIDTH—screen width in,
interface clocks. horizontal blanking
included.
The SCREEN_WIDTH should be built by
suitable DI’s counter2.
ns
HSYNC_WIDTH—Hsync width in DI_CLK
with 0.5 DI_CLK resolution. Defined by DI’s
counter.
ns
BGXP—width of a horizontal blanking
before a first active data in a line (in
interface clocks). The BGXP should be built
by suitable DI’s counter.
ns
(SCREEN_WIDTH BGXP - FW)  Tdicp
Width a horizontal blanking after a last
active data in a line (in interface clocks)
FW—with of active line in interface clocks.
The FW should be built by suitable DI’s
counter.
ns
Tsh
(SCREEN_HEIGHT)
 Tsw
SCREEN_HEIGHT— screen height in lines
with blanking.
The SCREEN_HEIGHT is a distance
between 2 VSYNCs.
The SCREEN_HEIGHT should be built by
suitable DI’s counter.
ns
VSYNC width
Tvsw
VSYNC_WIDTH
VSYNC_WIDTH—Vsync width in DI_CLK
with 0.5 DI_CLK resolution. Defined by DI’s
counter
ns
IP14
Vertical blank interval 1
Tvbi1
BGYP  Tsw
BGYP—width of first Vertical
blanking interval in line. The BGYP should
be built by suitable DI’s counter.
ns
IP15
Vertical blank interval 2
Tvbi2
(SCREEN_HEIGHT BGYP - FH)  Tsw
Width of second Vertical
blanking interval in line. The FH should be
built by suitable DI’s counter.
ns
IP5o
Offset of IPP_DISP_CLK
Todicp
DISP_CLK_OFFSET
Tdiclk
DISP_CLK_OFFSET—offset of
IPP_DISP_CLK edges from local start
point, in DI_CLK2
(0.5 DI_CLK Resolution).
Defined by DISP_CLK counter
ns
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Electrical Characteristics
Table 71. Synchronous Display Interface Timing Characteristics (Pixel Level) (continued)
ID
Symbol
Value
Description
Unit
IP13o Offset of VSYNC
Tovs
VSYNC_OFFSET
Tdiclk
VSYNC_OFFSET—offset of Vsync edges
from a local start point, when a Vsync
should be active, in DI_CLK2
(0.5 DI_CLK Resolution). The
VSYNC_OFFSET should be built by
suitable DI’s counter.
ns
IP8o
Offset of HSYNC
Tohs
HSYNC_OFFSET
 Tdiclk
HSYNC_OFFSET—offset of Hsync edges
from a local start point, when a Hsync
should be active, in DI_CLK2
(0.5 DI_CLK Resolution). The
HSYNC_OFFSET should be built by
suitable DI’s counter.
ns
IP9o
Offset of DRDY
Todrdy
DRDY_OFFSET
 Tdiclk
DRDY_OFFSET—offset of DRDY edges
from a suitable local start point, when a
corresponding data has been set on the
bus, in DI_CLK2
(0.5 DI_CLK Resolution).
The DRDY_OFFSET should be built by
suitable DI’s counter.
ns
1
Parameter
Display interface clock period immediate value.
DISP_CLK_PERIOD—number of DI_CLK per one Tdicp. Resolution 1/16 of DI_CLK.
DI_CLK_PERIOD—relation of between programing clock frequency and current system clock frequency
Display interface clock period average value.
DISP_CLK_PERIOD
Tdicp = T diclk  ---------------------------------------------------DI_CLK_PERIOD
2
DI’s counter can define offset, period and UP/DOWN characteristic of output signal according to programed parameters of the
counter. Same of parameters in the table are not defined by DI’s registers directly (by name), but can be generated by
corresponding DI’s counter. The SCREEN_WIDTH is an input value for DI’s HSYNC generation counter. The distance
between HSYNCs is a SCREEN_WIDTH.
The maximum accuracy of UP/DOWN edge of controls is:
Accuracy =  0.5  T diclk   0.62ns
The maximum accuracy of UP/DOWN edge of IPP_DATA is:
Accuracy = T diclk  0.62ns
The DISP_CLK_PERIOD, DI_CLK_PERIOD parameters are programmed through the registers.
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Figure 71 depicts the synchronous display interface timing for access level. The DISP_CLK_DOWN and
DISP_CLK_UP parameters are set through the Register. Table 72 lists the synchronous display interface
timing characteristics.
IP20o IP20
DRDY
VSYNC
HSYNC
other controls
IPP_DISP_CLK
Tdicu
Tdicd
IPP_DATA
IP16
IP17
IP19
IP18
local start point
Figure 71. Synchronous Display Interface Timing Diagram—Access Level
Table 72. Synchronous Display Interface Timing Characteristics (Access Level)
ID
Parameter
Symbol
Typ1
Min
Max
Unit
IP16
Display interface clock low Tckl
time
Tdicd-Tdicu-1.24
Tdicd2-Tdicu3
IP17
Display interface clock
high time
Tckh
Tdicp-Tdicd+Tdicu-1.24
Tdicp-Tdicd+Tdicu Tdicp-Tdicd+Tdicu+1.2
ns
IP18
Data setup time
Tdsu
Tdicd-1.24
Tdicu
—
ns
IP19
Data holdup time
Tdhd
Tdicp-Tdicd-1.24
Tdicp-Tdicu
—
ns
IP20o
Control signals offset
Tocsu
times (defines for each pin)
Tocsu-1.24
Tocsu
IP20
Control signals setup time Tcsu
to display interface clock
(defines for each pin)
Tdicd-1.24-Tocsu%Tdicp Tdicu
Tdicd-Tdicu+1.24
Tocsu+1.24
—
ns
ns
ns
1
The exact conditions have not been finalized, but will likely match the current customer requirement for their specific display.
These conditions may be chip specific.
2 Display interface clock down time
2  DISP_CLK_DOWN
Tdicd = 1---  T diclk  ceil ----------------------------------------------------------- 

DI_CLK_PERIOD
2
3
Display interface clock up time where CEIL(X) rounds the elements of X to the nearest integers towards infinity.
2  DISP_CLK_UP
Tdicu = 1---  T diclk  ceil ------------------------------------------------ 
DI_CLK_PERIOD
2
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Electrical Characteristics
4.11.11 LVDS Display Bridge (LDB) Module Parameters
The LVDS interface complies with TIA/EIA 644-A standard. For more details, see TIA/EIA STANDARD
644-A, “Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits”.
Table 73. LVDS Display Bridge (LDB) Electrical Specification
Parameter
Symbol
Differential Voltage Output Voltage
VOD
Output Voltage High
Test Condition
Min
Max
Units
100  Differential load
250
450
mV
Voh
100  differential load (0 V Diff—Output High
Voltage static)
1.25
1.6
mV
Output Voltage Low
Vol
100  differential load (0 V Diff—Output Low
Voltage static)
0.9
1.25
mV
Offset Static Voltage
VOS
Two 49.9  resistors in series between N-P
terminal, with output in either Zero or One state, the
voltage measured between the 2 resistors.
1.15
1.375
V
VOS Differential
VOSDIFF Difference in VOS between a One and a Zero state
-50
50
mV
Output short circuited to GND
ISA ISB With the output common shorted to GND
-24
24
mA
VT Full Load Test
VTLoad 100  Differential load with a 3.74 k load between
GND and IO Supply Voltage
247
454
mV
4.11.12 MIPI D-PHY Timing Parameters
This section describes MIPI D-PHY electrical specifications, compliant with MIPI CSI-2 version 1.0,
D-PHY specification Rev. 1.0 (for MIPI sensor port x2 lanes) and MIPI DSI Version 1.01, and D-PHY
specification Rev. 1.0 (and also DPI version 2.0, DBI version 2.0, DSC version 1.0a at protocol layer) (for
MIPI display port x2 lanes).
4.11.12.1 Electrical and Timing Information
Table 74. Electrical and Timing Information
Symbol
Parameters
Test Conditions
Min
Typ
Max
Unit
Input DC Specifications - Apply to DSI_CLK_P/DSI_CLK_N and DSI_DATA_P/DSI_DATA_N inputs
VI
Input signal voltage range
Transient voltage range is
limited from -300 mV to
1600 mV
-50
—
1350
mV
VLEAK
Input leakage current
VGNDSH(min) = VI =
VGNDSH(max) +
VOH(absmax)
Lane module in LP Receive
Mode
-10
—
10
mA
VGNDSH
Ground Shift
—
-50
—
50
mV
VOH(absmax)
Maximum transient output
voltage level
—
—
—
1.45
V
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Electrical Characteristics
Table 74. Electrical and Timing Information (continued)
Symbol
tvoh(absmax)
Parameters
Maximum transient time
above VOH(absmax)
Test Conditions
Min
Typ
Max
Unit
—
—
—
20
ns
HS Line Drivers DC Specifications
|VOD|
HS Transmit Differential
output voltage magnitude
80 = RL< = 125 
140
200
270
mV
|VOD|
Change in Differential output
voltage magnitude between
logic states
80 = RL< = 125 
—
—
10
mV
VCMTX
Steady-state common-mode
output voltage.
80 = RL< = 125 
150
200
250
mV
VCMTX(1,0)
Changes in steady-state
common-mode output voltage
between logic states
80 = RL< = 125 
—
—
5
mV
VOHHS
HS output high voltage
80 = RL< = 125 
—
—
360
mV
ZOS
Single-ended output
impedance.
—
40
50
62.5

ZOS
Single-ended output
impedance mismatch.
—
—
—
10
%
50
mV
LP Line Drivers DC Specifications
VOL
Output low-level SE voltage
—
-50
VOH
Output high-level SE voltage
—
1.1
1.2
1.3
V
ZOLP
Single-ended output
impedance.
—
110
—
—

ZOLP(01-10)
Single-ended output
impedance mismatch driving
opposite level
—
—
—
20
%
ZOLP(0-11)
Single-ended output
impedance mismatch driving
same level
—
—
—
5
%
70
mV
HS Line Receiver DC Specifications
VIDTH
Differential input high voltage
threshold
—
—
—
VIDTL
Differential input low voltage
threshold
—
-70
—
VIHHS
Single ended input high
voltage
—
VILHS
Single ended input low
voltage
—
-40
—
VCMRXDC
Input common mode voltage
—
70
—
—
mV
460
mV
mV
330
mV
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Electrical Characteristics
Table 74. Electrical and Timing Information (continued)
Symbol
ZID
Parameters
Test Conditions
Min
Typ
Max
Unit
—
80
—
125

550
mV
Differential input impedance
LP Line Receiver DC Specifications
VIL
Input low voltage
—
—
—
VIH
Input high voltage
—
920
—
mV
VHYST
Input hysteresis
—
25
—
mV
Contention Line Receiver DC Specifications
Input low fault threshold
VILF
—
200
—
450
mV
4.11.12.2 MIPI D-PHY Signaling Levels
The signal levels are different for differential HS mode and single-ended LP mode. Figure 72 shows both
the HS and LP signal levels on the left and right sides, respectively. The HS signaling levels are below
the LP low-level input threshold such that LP receiver always detects low on HS signals.
VOH,MAX
LP
VOL
VOH,MIN
LP
VIH
VIH
LP Threshold
Region
VIL
Max VOD
HS Vout
Range
VOHHS
VCMTX,MAX
HS Vcm
Range
Min VOD
HS Differential Signaling
LP VIL
VGNDSH,MA
VCMTX,MIN
VOLHS
LP VOL
X
GND
VGNDSH,MIN
LP Single-ended Signaling
Figure 72. D-PHY Signaling Levels
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Electrical Characteristics
4.11.12.3 MIPI HS Line Driver Characteristics
Ideal Single-Ended High Speed Signals
VDN
VCMTX = (VDP + VDN)/2
VOD(0)
VOD(1)
VDP
Ideal Differential High Speed Signals
VOD(1)
0V
(Differential)
VOD(0)
VOD = VDP - VDN
Figure 73. Ideal Single-ended and Resulting Differential HS Signals
4.11.12.4
Possible VCMTX and VOD Distortions of the Single-ended HS Signals
VOD (SE HS Signals)
VOD/2
V OD (1)
VD N
VCM TX
VOD(0)
VD P
V OD /2
Static V CMT X (SE HS Signals)
VD N
VC MTX
VOD(0)
V DP
DynamicVCMT X (SE HS Signals)
VDN
VCM TX
VD P
Figure 74. Possible VCMTX and VOD Distortions of the Single-ended HS Signals
4.11.12.5 MIPI D-PHY Switching Characteristics
Table 75. Electrical and Timing Information
Symbol
Parameters
Test Conditions
Min
Typ
Max
Unit
80
—
1000
Mbps
HS Line Drivers AC Specifications
—
Maximum serial data rate (forward
direction)
On DATAP/N outputs.
80  <= RL <= 125 
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111
Electrical Characteristics
Table 75. Electrical and Timing Information (continued)
Symbol
Parameters
Test Conditions
Min
Typ
Max
Unit
FDDRCLK
DDR CLK frequency
On DATAP/N outputs.
40
—
500
MHz
PDDRCLK
DDR CLK period
80 = RL< = 125 
2
—
25
ns
tCDC
DDR CLK duty cycle
tCDCtCPHPDDRCLK
—
50
—
%
tCPH
DDR CLK high time
—
—
1
—
UI
tCPL
DDR CLK low time
—
—
1
—
UI
DDR CLK / DATA Jitter
—
—
75
—
ps pk–pk
tSKEW[PN]
Intra-Pair (Pulse) skew
—
—
0.075
—
UI
tSKEW[TX]
Data to Clock Skew
—
0.350
—
0.650
UI
tSETUP[RX]
Data to Clock Receiver Setup time
—
0.15
—
—
UI
tHOLD[RX]
Clock to Data Receiver Hold time
—
0.15
—
—
UI
tr
Differential output signal rise time
20% to 80%, RL = 50 
150
—
0.3UI
ps
tf
Differential output signal fall time
20% to 80%, RL = 50 
150
—
0.3UI
ps
VCMTX(HF)
Common level variation above 450 MHz 80 <= RL< = 125 
—
—
15
mVrms
VCMTX(LF)
Common level variation between 50
MHz and 450 MHz.
80 <= RL< = 125 
—
—
25
mVp
15% to 85%, CL<70 pF
—
—
25
ns
30% to 85%, CL<70 pF
—
—
35
ns
15% to 85%, CL<70 pF
—
—
120
mV/ns
0
—
70
pF
—
200
mVpp
—
50
mVpp
—
60
pF
—
300
Vps
—
LP Line Drivers AC Specifications
trlp,tflp
Single ended output rise/fall time
treo
V/tSR
Signal slew rate
CL
Load capacitance
—
HS Line Receiver AC Specifications
VCMRX(HF)
Common mode interference beyond 450
MHz
—
VCMRX(LF)
Common mode interference between 50
MHz and 450 MHz.
—
CCM
Common mode termination
—
-50
LP Line Receiver AC Specifications
eSPIKE
Input pulse rejection
—
TMIN
Minimum pulse response
—
VINT
Pk-to-Pk interference voltage
—
fINT
Interference frequency
—
50
450
—
ns
—
400
mV
—
—
MHz
Model Parameters used for Driver Load switching performance evaluation
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Freescale Semiconductor
Electrical Characteristics
Table 75. Electrical and Timing Information (continued)
Symbol
Parameters
Test Conditions
Min
Typ
Max
Unit
CPAD
Equivalent Single ended I/O PAD
capacitance.
—
—
—
1
pF
CPIN
Equivalent Single ended Package +
PCB capacitance.
—
—
—
2
pF
LS
Equivalent wire bond series inductance
—
—
—
1.5
nH
RS
Equivalent wire bond series resistance
—
—
—
0.15

RL
Load resistance
—
80
100
125

4.11.12.6 High-Speed Clock Timing
#,+P
#,+N
$ATA "IT 4IME 5)
5) ).34 $ATA "IT 4IME 5)
5) ).34 $$2 #LOCK 0ERIOD 5) ).34 5) ).34 Figure 75. DDR Clock Definition
4.11.12.7 Forward High-Speed Data Transmission Timing
The timing relationship of the DDR Clock differential signal to the Data differential signal is shown in
Figure 76:
2EFERENCE 4IME
4 3%450
4 (/,$
#,+P
#,+N
5) ).34
43+%7
5) ).34
4#,+P
Figure 76. Data to Clock Timing Definitions
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113
Electrical Characteristics
4.11.12.8 Reverse High-Speed Data Transmission Timing
44$
.2: $ATA
#,+?.
#,+?0
#LOCK TO $ATA
3KEW
5)
5)
Figure 77. Reverse High-Speed Data Transmission Timing at Slave Side
4.11.12.9 Low-Power Receiver Timing
2*TLPX
eSPIKE
2*TLPX
Input
TMIN-RX
TMIN-RX
eSPIKE
VIH
VIL
Output
Figure 78. Input Glitch Rejection of Low-Power Receivers
4.11.13 HSI Host Controller Timing Parameters
This section describes the timing parameters of the HSI Host Controller which are compliant with
High-speed Synchronous Serial Interface (HSI) Physical Layer specification version1.01.
4.11.13.1 Synchronous Data Flow
&IRST BIT OF
FRAME
,AST BIT OF
FRAME
T .OM"IT
,AST BIT OF
FRAME
&IRST BIT OF
FRAME
(3)?$!4!
(3)?&,!'
. BITS &RAME
. BITS &RAME
(3)?2%!$9
2ECEIVER HAS
DETECTED THE START
OF THE &RAME
2ECEIVER HAS CAPTURED
AND STORED A COMPLETE &RAME
Figure 79. Synchronized Data Flow READY Signal Timing (Frame and Stream Transmission)
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Freescale Semiconductor
Electrical Characteristics
4.11.13.2 Pipelined Data Flow
&IRST BIT OF
FRAME
,AST BIT OF &IRST BIT OF
FRAME
FRAME
,AST BIT OF
FRAME
,AST BIT OF
FRAME
T .OM"IT
$!4!
&,!'
. BITS &RAME
. BITS &RAME
2%!$9
" 2EADY SHALL NOT
CHANGE TO ZERO
! 2EADY CAN CHANGE
$ 2EADY SHALL
MAINTAIN ZERO IF
RECEIVER DOES NOT
HAVE FREE SPACE
# 2EADY CAN CHANGE
% 2EADY &2EADY
CAN
SHALL
CHANGE MAINTAIN
ITS VALUE
'2EADY
CAN CHANGE
Figure 80. Pipelined Data Flow Ready Signal Timing (Frame Transmission Mode)
4.11.13.3 Receiver Real-Time Data Flow
&IRST BIT OF
FRAME
,AST BIT OF
FRAME
&IRST BIT OF
FRAME
,AST BIT OF
FRAME
T .OM"IT
$!4!
&,!'
. BITS &RAME
. BITS &RAME
2%!$9
2ECEIVER HAS CAPTURED A
COMPLETE &RAME
2ECEIVER HAS DETECTED THE
START OF THE &RAME
Figure 81. Receiver Real-Time Data Flow READY Signal Timing
4.11.13.4 Synchronized Data Flow Transmission with Wake
48 STATE
!
"
#
0(9 &RAME
$
!
0(9 &RAME
$!4!
&,!'
&IRST BIT
RECEIVED
2%!$9
7!+%
!
28 STATE
! 3LEEP STATE
NON OPERATIONAL
2ECEIVED
FRAME STORED
2ECEIVER IN ACTIVE
START STATE
"
4RANSMITTER HAS
DATA TO TRANSMIT
" 7AKE UP STATE
2ECEIVER CAN NO
LONGER RECEIVE DATE
TRANSMITTER HAS
NO MORE DATA TO
TRANSMIT
#
# !CTIVE STATE
FULL OPERATIONAL
$
!
$ $ISABLE 3TATE
.O COMMUNICATION ABILITY
Figure 82. Synchronized Data Flow Transmission with WAKE
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Freescale Semiconductor
115
Electrical Characteristics
4.11.13.5 Stream Transmission Mode Frame Transfer
#HANNEL
$ESCRIPTION
BITS
0AYLOAD $ATA "ITS
$!4!
&,!'
#OMPLETE . BITS &RAME
#OMPLETE . BITS &RAME
2%!$9
Figure 83. Stream Transmission Mode Frame Transfer (Synchronized Data Flow)
4.11.13.6 Frame Transmission Mode (Synchronized Data Flow)
&RAME
START BIT
#HANNEL
$ESCRIPTION
BITS
0AYLOAD $ATA "ITS
$!4!
&,!'
#OMPLETE . BITS &RAME
#OMPLETE . BITS &RAME
2%!$9
Figure 84. Frame Transmission Mode Transfer of Two Frames (Synchronized Data Flow)
4.11.13.7 Frame Transmission Mode (Pipelined Data Flow)
&RAME
START BIT
#HANNEL
$ESCRIPTION
BITS
0AYLOAD
$ATA "ITS
$!4!
&,!'
#OMPLETE . BITS &RAME
#OMPLETE . BITS &RAME
2%!$9
Figure 85. Frame Transmission Mode Transfer of Two Frames (Pipelined Data Flow)
4.11.13.8 DATA and FLAG Signal Timing Requirement for a 15 pF Load
Table 76. DATA and FLAG Timing
Parameter
tBit, nom
tRise, min and
tFall, min
tTxToRxSkew, maxfq
Description
1 Mbit/s
100 Mbit/s
200 Mbit/s
Nominal bit time
1000 ns
10.0 ns
5.00 ns
Minimum allowed rise and fall time
2.00 ns
2.00 ns
1.00 ns
Maximum skew between transmitter and receiver package pins
50.0 ns
0.5.0 ns
0.25 ns
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Freescale Semiconductor
Electrical Characteristics
Table 76. DATA and FLAG Timing (continued)
Parameter
Description
1 Mbit/s
100 Mbit/s
200 Mbit/s
tEageSepTx, min
Minimum allowed separation of signal transitions at transmitter
package pins, including all timing defects, for example, jitter
and skew, inside the transmitter.
400 ns
4.00 ns
2.00 ns
tEageSepRx, min
Minimum separation of signal transitions, measured at the
receiver package pins, including all timing defects, for example,
jitter and skew, inside the receiver.
350 ns
3.5 ns
1.75 ns
T %DGE3EP4X
$!4!
48
T 2ISE
.OTE &,!'
48
T"IT
T &ALL
T %DGE3EP2X
T 4X4O2X3KEW
$!4!
28
.OTE .OTE .OTE &,!'
28
Figure 86. DATA and FLAG Signal Timing
Note:
1
This case shows that the DATA signal has slowed down more compared to the FLAG signal
2
This case shows that the FLAG signal has slowed down more compared to the DATA signal.
4.11.14 MediaLB (MLB) Characteristics
4.11.14.1 MediaLB (MLB) DC Characteristics
Table 77 lists the MediaLB 3-pin interface electrical characteristics.
Table 77. MediaLB 3-Pin Interface Electrical DC Specifications
Parameter
Symbol
Test Conditions
Min
Max
Unit
Maximum input voltage
—
—
—
3.6
V
Low level input threshold
VIL
—
—
0.7
V
High level input threshold
VIH
See Note1
1.8
—
V
Low level output threshold
VOL
IOL = 6 mA
—
0.4
V
High level output threshold
VOH
IOH = -6 mA
2.0
—
V
IL
0 < Vin < VDD
—
±10
A
Input leakage current
1
Higher VIH thresholds can be used; however, the risks associated with less noise margin in the system must be
evaluated and assumed by the customer.
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117
Electrical Characteristics
Table 78 lists the MediaLB 6-pin interface electrical characteristics.
Table 78. MediaLB 6-Pin Interface Electrical DC Specifications
Parameter
Symbol
Test Conditions
Min
Max
Unit
Driver Characteristics
Differential output voltage
(steady-state):
I VO+ - VO- I
VOD
See Note1
300
500
mV
Difference in differential output
voltage between (high/low)
steady-states:
I VOD, high - VOD, low I
VOD
—
-50
50
mV
Common-mode output voltage:
(VO+ - VO-) / 2
VOCM
—
1.0
1.5
V
Difference in common-mode
output between (high/low)
steady-states:
I VOCM, high - VOCM, low I
VOCM
—
-50
50
mV
Variations on common-mode
output during a logic state
transitions
VCMV
See Note2
—
150
mVpp
Short circuit current
|IOS|
See Note3
—
43
mA
ZO
—
1.6
—
k
—
50
-25
-50
—
25
mV
mV
mV
—
50
-50
—
mV
mV
0.5
0.5
2.0
2.0
V
V
Differential output impedance
Receiver Characteristics
See Note4
Differential clock input:
• logic low steady-state
• logic high steady-state
• hysteresis
VILC
VIHC
VHSC
Differential signal/data input:
• logic low steady-state
• logic high steady-state
VILS
VIHS
Signal-ended input voltage
(steady-state):
• MLB_SIG_P, MLB_DATA_P
• MLB_SIG_N, MLB_DATA_N
—
—
VIN+
VIN-
1
The signal-ended output voltage of a driver is defined as VO+ on MLB_CLK_P, MLB_SIG_P, and MLB_DATA_P. The
signal-ended output voltage of a driver is defined as VO- on MLB_CLK_N, MLB_SIG_N, and MLB_DATA_N.
2 Variations in the common-mode voltage can occur between logic states (for example, during state transitions) as a result of
differences in the transition rate of VO+ and VO-.
3 Short circuit current is applicable when V
O+ and VO- are shorted together and/or shorted to ground.
4 The logic state of the receiver is undefined when -50 mV < V < 50 mV.
ID
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118
Freescale Semiconductor
Electrical Characteristics
4.11.14.2 MediaLB (MLB) Controller AC Timing Electrical Specifications
This section describes the timing electrical information of the MediaLB module. Figure 87 show the
timing of MediaLB 3-pin interface, and Table 79 and Table 80 lists the MediaLB 3-pin interface timing
characteristics.
-,"?3)'
-,"?$!4!
VALID
RECEIVER
T PROP
T DHMCF
T DSMCF
T MCKR
-,"?#,+
T MCKF
T MCKH
TMCKL
T DELAY
TMCFDZ
-,"?3)'
-,"?$!4!
TRANSMITTER
VALID
T MDZH
-,"?3)'
-,"?$!4!
BUS STATE
VALID
Figure 87. MediaLB 3-Pin Timing
Ground = 0.0 V; Load Capacitance = 60 pF; MediaLB speed = 256/512 Fs; Fs = 48 kHz; all timing
parameters specified from the valid voltage threshold as listed below; unless otherwise noted.
Table 79. MLB 256/512 Fs Timing Parameters
Parameter
MLB_CLK operating frequency1
Symbol
Min
fmck
11.264
Max
Unit
Comment
MHz
256xFs at 44.0 kHz
512xFs at 50.0 kHz
25.6
MLB_CLK rise time
tmckr
—
3
ns
VIL TO VIH
MLB_CLK fall time
tmckf
—
3
ns
VIH TO VIL
time2
tmckl
30
14
—
ns
256xFs
512xFs
MLB_CLK high time
tmckh
30
14
—
ns
256xFs
512xFs
MLB_SIG/MLB_DATA receiver
input valid to MLB_CLK falling
tdsmcf
1
—
ns
—
MLB_SIG/MLB_DATA receiver
input hold from MLB_CLK low
tdhmcf
tmdzh
—
ns
—
MLB_SIG/MLB_DATA output high
impedance from MLB_CLK low
tmcfdz
0
tmckl
ns
3
Bus Hold from MLB_CLK low
tmdzh
4
—
ns
—
MLB_CLK low
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
119
Electrical Characteristics
Table 79. MLB 256/512 Fs Timing Parameters (continued)
Parameter
Symbol
Min
Max
Unit
Comment
MLB_SIG/MLB_DATA output valid
from transition of MLB_CLK (low to
high)
tdelay
—
10
ns
—
Transmitter MLBSIG (MLBDAT)
output valid from transition of
MLBCLK (low-to-high)
tdelay
—
10.75
ns
—
1
The controller can shut off MLB_CLK to place MediaLB in a low-power state. Depending on the time the clock is shut off, a runt
pulse can occur on MLB_CLK.
2
MLB_CLK low/high time includes the pulse width variation.
3
The MediaLB driver can release the MLB_DATA/MLB_SIG line as soon as MLB_CLK is low; however, the logic state of the final
driven bit on the line must remain on the bus for tmdzh. Therefore, coupling must be minimized while meeting the maximum load
capacitance listed.
Ground = 0.0 V; load capacitance = 40 pF; MediaLB speed = 1024 Fs; Fs = 48 kHz; all timing
parameters specified from the valid voltage threshold as listed in Table 80; unless otherwise noted.
Table 80. MLB 1024 Fs Timing Parameters
Parameter
Symbol
Min
Max
Unit
Comment
MLB_CLK Operating Frequency1
fmck
45.056
51.2
MHz
1024xfs at 44.0 kHz
1024xfs at 50.0 kHz
MLB_CLK rise time
tmckr
—
1
ns
VIL TO VIH
MLB_CLK fall time
tmckf
—
1
ns
VIH TO VIL
MLB_CLK low time
tmckl
6.1
—
ns
2
MLB_CLK high time
tmckh
9.3
—
ns
—
MLB_SIG/MLB_DATA receiver
input valid to MLB_CLK falling
tdsmcf
1
—
ns
—
MLB_SIG/MLB_DATA receiver
input hold from MLB_CLK low
tdhmcf
tmdzh
—
ns
—
MLB_SIG/MLB_DATA output high
impedance from MLB_CLK low
tmcfdz
0
tmckl
ns
3
Bus Hold from MLB_CLK low
tmdzh
2
—
ns
—
MLB_SIG/MLB_DATA output valid
from transition of MLB_CLK (low to
high)
tdelay
—
7
ns
—
Transmitter MLBSIG (MLBDAT)
output valid from transition of
MLBCLK (low-to-high)
tdelay
—
6
ns
—
1
The controller can shut off MLB_CLK to place MediaLB in a low-power state. Depending on the time the clock is shut off, a runt
pulse can occur on MLB_CLK.
2
MLB_CLK low/high time includes the pulse width variation.
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120
Freescale Semiconductor
Electrical Characteristics
3
The MediaLB driver can release the MLB_DATA/MLB_SIG line as soon as MLB_CLK is low; however, the logic state of the final
driven bit on the line must remain on the bus for tmdzh. Therefore, coupling must be minimized while meeting the maximum load
capacitance listed.
Table 81 lists the MediaLB 6-pin interface timing characteristics, and Figure 88 shows the MLB 6-pin
delay, setup, and hold times.
Table 81. MLB 6-Pin Interface Timing Parameters
Parameter
Symbol
Min
Max Unit
Comment
Cycle-to-cycle system jitter
tjitter
—
600
ps
—
Transmitter MLB_SIG_P/_N (MLB_DATA_P/_N) output valid
from transition of MLB_CLK_P/_N (low-to-high)1
tdelay
0.6
1.3
ns
—
Disable turnaround time from transition of MLB_CLK_P/_N
(low-to-high)
tphz
0.6
3.5
ns
—
Enable turnaround time from transition of MLB_CLK_P/_N
(low-to-high)
tplz
0.6
5.6
ns
—
MLB_SIG_P/_N (MLB_DATA_P/_N) valid to transition of
MLB_CLK_P/_N (low-to-high)
tsu
0.05
—
ns
—
MLB_SIG_P/_N (MLB_DATA_P/_N) hold from transition of
MLB_CLK_P/_N (low-to-high)2
thd
0.6
—
1
tdelay, tphz, tplz, tsu, and thd may also be referenced from a low-to-high transition of the recovered clock for 2:1 and 4:1 recovered-to-external clock ratios.
2
The transmitting device must ensure valid data on MLB_SIG_P/_N (MLB_DATA_P/_N) for at least thd(min) following the rising
edge of MLB_CLK_P/N; receivers must latch MLB_SIG_P/_N (MLB_DATA_P/_N) data within thd(min) of the rising edge of
MLB_CLK_P/_N.
0HYSICAL #HANNEL
BOUNDARY
-,"?#,+?0.
2ECOVERED
CLOCK X4
X4
X4
T DELAY
-,"?3)'?0.
TRANSMITTER
#!;=
#ONTROLLER #HANNEL!DDRESS
TRANSMITTER ENABLED
$ATA NOT VALID
-,"?3)'?0.
RECEIVER
#!;=
#ONTROLLER #HANNEL!DDRESS
#MD
;=
TPROP
4 T DELAY
#MD
;=
TPROP
T DELAY
#MD
;=
TPROP
T DELAY
T DELAY
#MD
;=
#MD
;=
#MD
;=
TPROP 4X $EVICE #OMMAND
TSU THD
TSU THD
TSU THD
TSU THD
#MD
;=
#MD
;=
#MD
;=
#MD
;=
#MD
;=
#MD
;=
4X $EVICE #OMMAND
Figure 88. MLB 6-Pin Delay, Setup, and Hold Times
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
121
Electrical Characteristics
4.11.15 PCIe PHY Parameters
The PCIe interface complies with PCIe specification Gen2 x1 lane and supports the PCI Express 1.1/2.0
standard.
4.11.15.1 PCIE_REXT Reference Resistor Connection
The impedance calibration process requires connection of reference resistor 200  1% precision resistor
on PCIE_REXT pads to ground. It is used for termination impedance calibration.
4.11.16 Pulse Width Modulator (PWM) Timing Parameters
This section describes the electrical information of the PWM. The PWM can be programmed to select one
of three clock signals as its source frequency. The selected clock signal is passed through a prescaler before
being input to the counter. The output is available at the pulse-width modulator output (PWMO) external
pin.
Figure 89 depicts the timing of the PWM, and Table 82 lists the PWM timing parameters.
0
0
07-N?/54
Figure 89. PWM Timing
Table 82. PWM Output Timing Parameters
ID
Parameter
Min
Max
Unit
PWM Module Clock Frequency
0
ipg_clk
MHz
P1
PWM output pulse width high
15
ns
P2
PWM output pulse width low
15
ns
4.11.17 SCAN JTAG Controller (SJC) Timing Parameters
Figure 90 depicts the SJC test clock input timing. Figure 91 depicts the SJC boundary scan timing.
Figure 92 depicts the SJC test access port. Signal parameters are listed in Table 83.
SJ1
SJ2
JTAG_TCK
(Input)
VIH
SJ3
VM
SJ2
VM
VIL
SJ3
Figure 90. Test Clock Input Timing Diagram
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Freescale Semiconductor
Electrical Characteristics
JTAG_TCK
(Input)
VIH
VIL
SJ5
SJ4
Data
Inputs
Input Data Valid
SJ6
Data
Outputs
Output Data Valid
SJ7
Data
Outputs
SJ6
Data
Outputs
Output Data Valid
Figure 91. Boundary Scan (JTAG) Timing Diagram
JTAG_TCK
(Input)
VIH
VIL
SJ8
JTAG_TDI
JTAG_TMS
(Input)
SJ9
Input Data Valid
SJ10
JTAG_TDO
(Output)
Output Data Valid
SJ11
JTAG_TDO
(Output)
SJ10
JTAG_TDO
(Output)
Output Data Valid
Figure 92. Test Access Port Timing Diagram
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Freescale Semiconductor
123
Electrical Characteristics
JTAG_TCK
(Input)
SJ13
JTAG_TRST_B
(Input)
SJ12
Figure 93. JTAG_TRST_B Timing Diagram
Table 83. JTAG Timing
All Frequencies
Parameter1,2
ID
1
2
Unit
Min
Max
0.001
22
MHz
45
—
ns
22.5
—
ns
SJ0
JTAG_TCK frequency of operation 1/(3•TDC)1
SJ1
JTAG_TCK cycle time in crystal mode
SJ2
JTAG_TCK clock pulse width measured at VM2
SJ3
JTAG_TCK rise and fall times
—
3
ns
SJ4
Boundary scan input data set-up time
5
—
ns
SJ5
Boundary scan input data hold time
24
—
ns
SJ6
JTAG_TCK low to output data valid
—
40
ns
SJ7
JTAG_TCK low to output high impedance
—
40
ns
SJ8
JTAG_TMS, JTAG_TDI data set-up time
5
—
ns
SJ9
JTAG_TMS, JTAG_TDI data hold time
25
—
ns
SJ10
JTAG_TCK low to JTAG_TDO data valid
—
44
ns
SJ11
JTAG_TCK low to JTAG_TDO high impedance
—
44
ns
SJ12
JTAG_TRST_B assert time
100
—
ns
SJ13
JTAG_TRST_B set-up time to JTAG_TCK low
40
—
ns
TDC = target frequency of SJC
VM = mid-point voltage
4.11.18 SPDIF Timing Parameters
The Sony/Philips Digital Interconnect Format (SPDIF) data is sent using the bi-phase marking code. When
encoding, the SPDIF data signal is modulated by a clock that is twice the bit rate of the data signal.
Table 84 and Figure 94 and Figure 95 show SPDIF timing parameters for the Sony/Philips Digital
Interconnect Format (SPDIF), including the timing of the modulating Rx clock (SPDIF_SR_CLK) for
SPDIF in Rx mode and the timing of the modulating Tx clock (SPDIF_ST_CLK) for SPDIF in Tx mode.
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Freescale Semiconductor
Electrical Characteristics
Table 84. SPDIF Timing Parameters
Timing Parameter Range
Characteristics
Symbol
Unit
Min
Max
SPDIF_IN Skew: asynchronous inputs, no specs apply
—
—
0.7
SPDIF_OUT output (Load = 50pf)
• Skew
• Transition rising
• Transition falling
—
—
—
—
—
—
1.5
24.2
31.3
SPDIF_OUT output (Load = 30pf)
• Skew
• Transition rising
• Transition falling
—
—
—
—
—
—
1.5
13.6
18.0
ns
Modulating Rx clock (SPDIF_SR_CLK) period
srckp
40.0
—
ns
SPDIF_SR_CLK high period
srckph
16.0
—
ns
SPDIF_SR_CLK low period
srckpl
16.0
—
ns
Modulating Tx clock (SPDIF_ST_CLK) period
stclkp
40.0
—
ns
SPDIF_ST_CLK high period
stclkph
16.0
—
ns
SPDIF_ST_CLK low period
stclkpl
16.0
—
ns
ns
ns
srckp
srckpl
SPDIF_SR_CLK
srckph
VM
VM
(Output)
Figure 94. SPDIF_SR_CLK Timing Diagram
stclkp
stclkpl
SPDIF_ST_CLK
VM
stclkph
VM
(Input)
Figure 95. SPDIF_ST_CLK Timing Diagram
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
125
Electrical Characteristics
4.11.19 SSI Timing Parameters
This section describes the timing parameters of the SSI module. The connectivity of the serial
synchronous interfaces are summarized in Table 85.
Table 85. AUDMUX Port Allocation
Port
Signal Nomenclature
Type and Access
AUDMUX port 1
SSI 1
Internal
AUDMUX port 2
SSI 2
Internal
AUDMUX port 3
AUD3
External— AUD3 I/O
AUDMUX port 4
AUD4
External— EIM or CSPI1 I/O through IOMUXC
AUDMUX port 5
AUD5
External— EIM or SD1 I/O through IOMUXC
AUDMUX port 6
AUD6
External— EIM or DISP2 through IOMUXC
AUDMUX port 7
SSI 3
Internal
NOTE
The terms WL and BL used in the timing diagrams and tables see Word
Length (WL) and Bit Length (BL).
4.11.19.1 SSI Transmitter Timing with Internal Clock
Figure 96 depicts the SSI transmitter internal clock timing and Table 86 lists the timing parameters for
the SSI transmitter internal clock.
.
SS1
SS3
SS5
SS2
SS4
AUDx_TXC
(Output)
SS6
SS8
AUDx_TXFS (bl)
(Output)
SS10
SS12
AUDx_TXFS (wl)
(Output)
SS14
SS15
SS16
AUDx_TXD
(Output)
SS43
SS42
SS18
SS17
SS19
AUDx_RXD
(Input)
Note: AUDx_RXD input in synchronous mode only
Figure 96. SSI Transmitter Internal Clock Timing Diagram
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
126
Freescale Semiconductor
Electrical Characteristics
Table 86. SSI Transmitter Timing with Internal Clock
ID
Parameter
Min
Max
Unit
Internal Clock Operation
SS1
AUDx_TXC/AUDxRXC clock period
81.4
—
ns
SS2
AUDx_TXC/AUDxRXC clock high period
36.0
—
ns
SS4
AUDx_TXC/AUDxRXC clock low period
36.0
—
ns
SS6
AUDx_TXC high to AUDx_TXFS (bl) high
—
15.0
ns
SS8
AUDx_TXC high to AUDx_TXFS (bl) low
—
15.0
ns
SS10
AUDx_TXC high to AUDx_TXFS (wl) high
—
15.0
ns
SS12
AUDx_TXC high to AUDx_TXFS (wl) low
—
15.0
ns
SS14
AUDx_TXC/AUDxRXC Internal AUDx_TXFS rise time
—
6.0
ns
SS15
AUDx_TXC/AUDxRXC Internal AUDx_TXFS fall time
—
6.0
ns
SS16
AUDx_TXC high to AUDx_TXD valid from high impedance
—
15.0
ns
SS17
AUDx_TXC high to AUDx_TXD high/low
—
15.0
ns
SS18
AUDx_TXC high to AUDx_TXD high impedance
—
15.0
ns
Synchronous Internal Clock Operation
SS42
AUDx_RXD setup before AUDx_TXC falling
10.0
—
ns
SS43
AUDx_RXD hold after AUDx_TXC falling
0.0
—
ns
•
•
•
•
NOTE
All the timings for the SSI are given for a non-inverted serial clock
polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have
been inverted, all the timing remains valid by inverting the clock signal
AUDx_TXC/AUDx_RXC and/or the frame sync
AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.
All timings are on Audiomux Pads when SSI is being used for data
transfer.
The terms, WL and BL, refer to Word Length (WL) and Bit Length(BL).
For internal Frame Sync operation using external clock, the frame sync
timing is same as that of transmit data (for example, during AC97 mode
of operation).
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
127
Electrical Characteristics
4.11.19.2 SSI Receiver Timing with Internal Clock
Figure 97 depicts the SSI receiver internal clock timing and Table 87 lists the timing parameters for the
receiver timing with the internal clock.
SS1
SS3
SS5
SS2
SS4
AUDx_TXC
(Output)
SS9
SS7
AUDx_TXFS (bl)
(Output)
SS11
SS13
AUDx_TXFS (wl)
(Output)
SS20
SS21
AUDx_RXD
(Input)
SS47
SS48
SS51
SS49
SS50
AUDx_RXC
(Output)
Figure 97. SSI Receiver Internal Clock Timing Diagram
Table 87. SSI Receiver Timing with Internal Clock
ID
Parameter
Min
Max
Unit
Internal Clock Operation
SS1
AUDx_TXC/AUDx_RXC clock period
81.4
—
ns
SS2
AUDx_TXC/AUDx_RXC clock high period
36.0
—
ns
SS3
AUDx_TXC/AUDx_RXC clock rise time
—
6.0
ns
SS4
AUDx_TXC/AUDx_RXC clock low period
36.0
—
ns
SS5
AUDx_TXC/AUDx_RXC clock fall time
—
6.0
ns
SS7
AUDx_RXC high to AUDx_TXFS (bl) high
—
15.0
ns
SS9
AUDx_RXC high to AUDx_TXFS (bl) low
—
15.0
ns
SS11
AUDx_RXC high to AUDx_TXFS (wl) high
—
15.0
ns
SS13
AUDx_RXC high to AUDx_TXFS (wl) low
—
15.0
ns
SS20
AUDx_RXD setup time before AUDx_RXC low
10.0
—
ns
SS21
AUDx_RXD hold time after AUDx_RXC low
0.0
—
ns
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
128
Freescale Semiconductor
Electrical Characteristics
Table 87. SSI Receiver Timing with Internal Clock (continued)
ID
Parameter
Min
Max
Unit
15.04
—
ns
Oversampling Clock Operation
SS47
Oversampling clock period
SS48
Oversampling clock high period
6.0
—
ns
SS49
Oversampling clock rise time
—
3.0
ns
SS50
Oversampling clock low period
6.0
—
ns
SS51
Oversampling clock fall time
—
3.0
ns
•
•
•
•
NOTE
All the timings for the SSI are given for a non-inverted serial clock
polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have
been inverted, all the timing remains valid by inverting the clock signal
AUDx_TXC/AUDx_RXC and/or the frame sync
AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.
All timings are on Audiomux Pads when SSI is being used for data
transfer.
The terms, WL and BL, refer to Word Length (WL) and Bit Length(BL).
For internal Frame Sync operation using external clock, the frame sync
timing is same as that of transmit data (for example, during AC97 mode
of operation).
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
129
Electrical Characteristics
4.11.19.3 SSI Transmitter Timing with External Clock
Figure 98 depicts the SSI transmitter external clock timing and Table 88 lists the timing parameters for
the transmitter timing with the external clock.
SS22
SS23
SS25
SS26
SS24
AUDx_TXC
(Input)
SS27
SS29
AUDx_TXFS (bl)
(Input)
SS33
SS31
AUDx_TXFS (wl)
(Input)
SS39
SS37
SS38
AUDx_TXD
(Output)
SS45
SS44
AUDx_RXD
(Input)
SS46
Note: AUDx_RXD Input in Synchronous mode only
Figure 98. SSI Transmitter External Clock Timing Diagram
Table 88. SSI Transmitter Timing with External Clock
ID
Parameter
Min
Max
Unit
External Clock Operation
SS22
AUDx_TXC/AUDx_RXC clock period
81.4
—
ns
SS23
AUDx_TXC/AUDx_RXC clock high period
36.0
—
ns
SS24
AUDx_TXC/AUDx_RXC clock rise time
—
6.0
ns
SS25
AUDx_TXC/AUDx_RXC clock low period
36.0
—
ns
SS26
AUDx_TXC/AUDx_RXC clock fall time
—
6.0
ns
SS27
AUDx_TXC high to AUDx_TXFS (bl) high
-10.0
15.0
ns
SS29
AUDx_TXC high to AUDx_TXFS (bl) low
10.0
—
ns
SS31
AUDx_TXC high to AUDx_TXFS (wl) high
-10.0
15.0
ns
SS33
AUDx_TXC high to AUDx_TXFS (wl) low
10.0
—
ns
SS37
AUDx_TXC high to AUDx_TXD valid from high impedance
—
15.0
ns
SS38
AUDx_TXC high to AUDx_TXD high/low
—
15.0
ns
SS39
AUDx_TXC high to AUDx_TXD high impedance
—
15.0
ns
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130
Freescale Semiconductor
Electrical Characteristics
Table 88. SSI Transmitter Timing with External Clock (continued)
ID
Parameter
Min
Max
Unit
Synchronous External Clock Operation
SS44
AUDx_RXD setup before AUDx_TXC falling
10.0
—
ns
SS45
AUDx_RXD hold after AUDx_TXC falling
2.0
—
ns
SS46
AUDx_RXD rise/fall time
—
6.0
ns
•
•
•
•
NOTE
All the timings for the SSI are given for a non-inverted serial clock
polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have
been inverted, all the timing remains valid by inverting the clock signal
AUDx_TXC/AUDx_RXC and/or the frame sync
AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.
All timings are on Audiomux Pads when SSI is being used for data
transfer.
The terms WL and BL refer to Word Length (WL) and Bit Length (BL).
For internal Frame Sync operation using external clock, the frame sync
timing is same as that of transmit data (for example, during AC97 mode
of operation).
4.11.19.4 SSI Receiver Timing with External Clock
Figure 99 depicts the SSI receiver external clock timing and Table 89 lists the timing parameters for the
receiver timing with the external clock.
SS22
SS26
SS24
SS25
SS23
AUDx_TXC
(Input)
SS28
AUDx_TXFS (bl)
(Input)
AUDx_TXFS (wl)
(Input)
SS30
SS32
SS34
SS35
SS41
SS40
SS36
AUDx_RXD
(Input)
Figure 99. SSI Receiver External Clock Timing Diagram
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Table 89. SSI Receiver Timing with External Clock
ID
Parameter
Min
Max
Unit
81.4
—
ns
External Clock Operation
SS22
AUDx_TXC/AUDx_RXC clock period
SS23
AUDx_TXC/AUDx_RXC clock high period
36
—
ns
SS24
AUDx_TXC/AUDx_RXC clock rise time
—
6.0
ns
SS25
AUDx_TXC/AUDx_RXC clock low period
36
—
ns
SS26
AUDx_TXC/AUDx_RXC clock fall time
—
6.0
ns
SS28
AUDx_RXC high to AUDx_TXFS (bl) high
-10
15.0
ns
SS30
AUDx_RXC high to AUDx_TXFS (bl) low
10
—
ns
SS32
AUDx_RXC high to AUDx_TXFS (wl) high
-10
15.0
ns
SS34
AUDx_RXC high to AUDx_TXFS (wl) low
10
—
ns
SS35
AUDx_TXC/AUDx_RXC External AUDx_TXFS rise time
—
6.0
ns
SS36
AUDx_TXC/AUDx_RXC External AUDx_TXFS fall time
—
6.0
ns
SS40
AUDx_RXD setup time before AUDx_RXC low
10
—
ns
SS41
AUDx_RXD hold time after AUDx_RXC low
2
—
ns
•
•
•
•
NOTE
All the timings for the SSI are given for a non-inverted serial clock
polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have
been inverted, all the timing remains valid by inverting the clock signal
AUDx_TXC/AUDx_RXC and/or the frame sync
AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.
All timings are on Audiomux Pads when SSI is being used for data
transfer.
The terms, WL and BL, refer to Word Length (WL) and Bit Length(BL).
For internal Frame Sync operation using external clock, the frame sync
timing is same as that of transmit data (for example, during AC97 mode
of operation).
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4.11.20 UART I/O Configuration and Timing Parameters
4.11.20.1 UART RS-232 I/O Configuration in Different Modes
The i.MX 6Solo/6DualLite UART interfaces can serve both as DTE or DCE device. This can be
configured by the DCEDTE control bit (default 0—DCE mode). Table 90 shows the UART I/O
configuration based on the enabled mode.
Table 90. UART I/O Configuration vs. Mode
DTE Mode
DCE Mode
Port
Direction
Description
Direction
Description
UARTx_RTS_B
Output
RTS from DTE to DCE
Input
RTS from DTE to DCE
UARTx_CTS_B
Input
CTS from DCE to DTE
Output
CTS from DCE to DTE
UARTx_DTR_B
Output
DTR from DTE to DCE
Input
DTR from DTE to DCE
UARTx_DSR_B
Input
DSR from DCE to DTE
Output
DSR from DCE to DTE
UARTx_DCD_ B
Input
DCD from DCE to DTE
Output
DCD from DCE to DTE
UARTx_RI_B
Input
RING from DCE to DTE
Output
RING from DCE to DTE
UARTx_TX_DATA
Input
Serial data from DCE to DTE
Output
Serial data from DCE to DTE
UARTx_RX_DATA
Output
Serial data from DTE to DCE
Input
Serial data from DTE to DCE
4.11.20.2 UART RS-232 Serial Mode Timing
The following sections describe the electrical information of the UART module in the RS-232 mode.
4.11.20.2.1 UART Transmitter
Figure 100 depicts the transmit timing of UART in the RS-232 serial mode, with 8 data bit/1 stop bit
format. Table 91 lists the UART RS-232 serial mode transmit timing characteristics.
UA1
UARTx_TX_DATA
(output)
Possible
Parity
Bit
UA1
Start
Bit
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Par Bit STOP
BIT
Next
Start
Bit
UA1
UA1
Figure 100. UART RS-232 Serial Mode Transmit Timing Diagram
Table 91. RS-232 Serial Mode Transmit Timing Parameters
ID
UA1
1
2
Parameter
Transmit Bit Time
Symbol
Min
Max
Unit
tTbit
1/Fbaud_rate1 - Tref_clk2
1/Fbaud_rate + Tref_clk
—
Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.
Tref_clk: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).
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4.11.20.2.2 UART Receiver
Figure 101 depicts the RS-232 serial mode receive timing with 8 data bit/1 stop bit format. Table 92 lists
serial mode receive timing characteristics.
UA2
UARTx_RX_DATA
(input)
Possible
Parity
Bit
UA2
Start
Bit
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Next
Start
Bit
Par Bit STOP
BIT
UA2
UA2
Figure 101. UART RS-232 Serial Mode Receive Timing Diagram
Table 92. RS-232 Serial Mode Receive Timing Parameters
ID
Parameter
Symbol
Min
Max
Unit
UA2
Receive Bit Time1
tRbit
1/Fbaud_rate2 - 1/(16
x Fbaud_rate)
1/Fbaud_rate +
1/(16 x Fbaud_rate)
—
1
The UART receiver can tolerate 1/(16 x Fbaud_rate) tolerance in each bit. But accumulation tolerance in one frame must not
exceed 3/(16 x Fbaud_rate).
2 F
baud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.
4.11.20.2.3 UART IrDA Mode Timing
The following subsections give the UART transmit and receive timings in IrDA mode.
UART IrDA Mode Transmitter
Figure 102 depicts the UART IrDA mode transmit timing, with 8 data bit/1 stop bit format. Table 93 lists
the transmit timing characteristics.
UA3
UA4
UA3
UA3
UA3
UARTx_TX_DATA
(output)
Start
Bit
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Possible
Parity
Bit
STOP
BIT
Figure 102. UART IrDA Mode Transmit Timing Diagram
Table 93. IrDA Mode Transmit Timing Parameters
1
ID
Parameter
Symbol
Min
Max
Unit
UA3
Transmit Bit Time in IrDA mode
tTIRbit
1/Fbaud_rate1 Tref_clk2
1/Fbaud_rate + Tref_clk
—
UA4
Transmit IR Pulse Duration
tTIRpulse
(3/16) x (1/Fbaud_rate) (3/16) x (1/Fbaud_rate)
- Tref_clk
+ Tref_clk
—
Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.
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2
Tref_clk: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).
UART IrDA Mode Receiver
Figure 103 depicts the UART IrDA mode receive timing, with 8 data bit/1 stop bit format. Table 94 lists
the receive timing characteristics.
UA5
UA6
UA5
UA5
UA5
UARTx_RX_DATA
(input)
Start
Bit
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Possible
Parity
Bit
Bit 7
STOP
BIT
Figure 103. UART IrDA Mode Receive Timing Diagram
Table 94. IrDA Mode Receive Timing Parameters
ID
Parameter
UA5
Receive Bit Time1 in IrDA mode
UA6
Receive IR Pulse Duration
Symbol
Min
Max
Unit
tRIRbit
1/Fbaud_rate2 - 1/(16
x Fbaud_rate)
1/Fbaud_rate + 1/(16 x
Fbaud_rate)
—
tRIRpulse
1.41 s
(5/16) x (1/Fbaud_rate)
—
1
The UART receiver can tolerate 1/(16 x Fbaud_rate) tolerance in each bit. But accumulation tolerance in one frame must not
exceed 3/(16 x Fbaud_rate).
2 F
baud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.
4.11.21 USB HSIC Timings
This section describes the electrical information of the USB HSIC port.
NOTE
HSIC is DDR signal, following timing spec is for both rising and falling
edge.
4.11.21.1 Transmit Timing
Tstrobe
USB_H_STROBE
Todelay
Todelay
USB_H_DATA
Figure 104. USB HSIC Transmit Waveform
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Table 95. USB HSIC Transmit Parameters
Name
Parameter
Min
Max
Unit
Comment
4.166
4.167
ns
—
Measured at 50% point
Tstrobe
strobe period
Todelay
data output delay time
550
1350
ps
strobe/data rising/falling time
0.7
2
V/ns
Tslew
Averaged from 30% – 70% points
4.11.21.2 Receive Timing
Tstrobe
USB_H_STROBE
Thold
USB_H_DATA
Tsetup
Figure 105. USB HSIC Receive Waveform
Table 96. USB HSIC Receive Parameters1
Name
1
Parameter
Min
Max
Unit
Comment
4.167
ns
—
Tstrobe
strobe period
4.166
Thold
data hold time
300
ps
Measured at 50% point
Tsetup
data setup time
365
ps
Measured at 50% point
Tslew
strobe/data rising/falling time
0.7
2
V/ns
Averaged from 30% – 70% points
The timings in the table are guaranteed when:
—AC I/O voltage is between 0.9x to 1x of the I/O supply
—DDR_SEL configuration bits of the I/O are set to (10)b
4.11.22 USB PHY Parameters
This section describes the USB-OTG PHY and the USB Host port PHY parameters.
The USB PHY meets the electrical compliance requirements defined in the Universal Serial Bus Revision
2.0 OTG, USB Host with the amendments below (On-The-Go and Embedded Host Supplement to the USB
Revision 2.0 Specification is not applicable to Host port).
•
•
•
•
USB ENGINEERING CHANGE NOTICE
— Title: 5V Short Circuit Withstand Requirement Change
— Applies to: Universal Serial Bus Specification, Revision 2.0
Errata for USB Revision 2.0 April 27, 2000 as of 12/7/2000
USB ENGINEERING CHANGE NOTICE
— Title: Pull-up/Pull-down resistors
— Applies to: Universal Serial Bus Specification, Revision 2.0
USB ENGINEERING CHANGE NOTICE
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•
•
•
5
— Title: Suspend Current Limit Changes
— Applies to: Universal Serial Bus Specification, Revision 2.0
USB ENGINEERING CHANGE NOTICE
— Title: USB 2.0 Phase Locked SOFs
— Applies to: Universal Serial Bus Specification, Revision 2.0
On-The-Go and Embedded Host Supplement to the USB Revision 2.0 Specification
— Revision 2.0 plus errata and ecn June 4, 2010
Battery Charging Specification (available from USB-IF)
— Revision 1.2, December 7, 2010
— Portable device only
Boot Mode Configuration
This section provides information on boot mode configuration pins allocation and boot devices interfaces
allocation.
5.1
Boot Mode Configuration Pins
Table 97 provides boot options, functionality, fuse values, and associated pins. Several input pins are also
sampled at reset and can be used to override fuse values, depending on the value of BT_FUSE_SEL fuse.
The boot option pins are in effect when BT_FUSE_SEL fuse is ‘0’ (cleared, which is the case for an
unblown fuse). For detailed boot mode options configured by the boot mode pins, see the i.MX
6Solo/6DualLite Fuse Map document and the System Boot chapter in i.MX 6Solo/6DualLite Reference
Manual (IMX6SDLRM).
Table 97. Fuses and Associated Pins Used for Boot
Pin
Direction at Reset
eFuse Name
Boot Mode Selection
BOOT_MODE1
Input
N/A
BOOT_MODE0
Input
N/A
Boot Options1
EIM_DA0
Input
BOOT_CFG1[0]
EIM_DA1
Input
BOOT_CFG1[1]
EIM_DA2
Input
BOOT_CFG1[2]
EIM_DA3
Input
BOOT_CFG1[3]
EIM_DA4
Input
BOOT_CFG1[4]
EIM_DA5
Input
BOOT_CFG1[5]
EIM_DA6
Input
BOOT_CFG1[6]
EIM_DA7
Input
BOOT_CFG1[7]
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Table 97. Fuses and Associated Pins Used for Boot (continued)
1
Pin
Direction at Reset
eFuse Name
EIM_DA8
Input
BOOT_CFG2[0]
EIM_DA9
Input
BOOT_CFG2[1]
EIM_DA10
Input
BOOT_CFG2[2]
EIM_DA11
Input
BOOT_CFG2[3]
EIM_DA12
Input
BOOT_CFG2[4]
EIM_DA13
Input
BOOT_CFG2[5]
EIM_DA14
Input
BOOT_CFG2[6]
EIM_DA15
Input
BOOT_CFG2[7]
EIM_A16
Input
BOOT_CFG3[0]
EIM_A17
Input
BOOT_CFG3[1]
EIM_A18
Input
BOOT_CFG3[2]
EIM_A19
Input
BOOT_CFG3[3]
EIM_A20
Input
BOOT_CFG3[4]
EIM_A21
Input
BOOT_CFG3[5]
EIM_A22
Input
BOOT_CFG3[6]
EIM_A23
Input
BOOT_CFG3[7]
EIM_A24
Input
BOOT_CFG4[0]
EIM_WAIT
Input
BOOT_CFG4[1]
EIM_LBA
Input
BOOT_CFG4[2]
EIM_EB0
Input
BOOT_CFG4[3]
EIM_EB1
Input
BOOT_CFG4[4]
EIM_RW
Input
BOOT_CFG4[5]
EIM_EB2
Input
BOOT_CFG4[6]
EIM_EB3
Input
BOOT_CFG4[7]
Pin value overrides fuse settings for BT_FUSE_SEL = ‘0’. Signal Configuration as Fuse Override Input at Power
Up. These are special I/O lines that control the boot up configuration during product development. In production,
the boot configuration can be controlled by fuses.
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5.2
Boot Device Interface Allocation
Table 98 lists the interfaces that can be used by the boot process in accordance with the specific boot
mode configuration. The table also describes the interface’s specific modes and IOMUXC allocation,
which are configured during boot when appropriate.
Table 98. Interface Allocation During Boot
Interface
IP Instance
Allocated Pads During Boot
Comment
SPI
ECSPI-1
EIM_D17, EIM_D18, EIM_D16, EIM_EB2, EIM_D19,
EIM_D24, EIM_D25
—
SPI
ECSPI-2
CSI0_DAT10, CSI0_DAT9, CSI0_DAT8, CSI0_DAT11,
EIM_LBA, EIM_D24, EIM_D25
—
SPI
ECSPI-3
DISP0_DAT2, DISP0_DAT1, DISP0_DAT0,
DISP0_DAT3, DISP0_DAT4, DISP0_DAT5, DISP0_DAT6
—
SPI
ECSPI-4
EIM_D22, EIM_D28, EIM_D21, EIM_D20, EIM_A25,
EIM_D24, EIM_D25
—
EIM
EIM
NAND Flash
GPMI
SD/MMC
EIM_DA[15:0], EIM_D[31:16], CSI0_DAT[19:4],
CSI0_DATA_EN, CSI0_VSYNC
Used for NOR, OneNAND boot
Only CS0 is supported
NANDF_CLE, NANDF_ALE, NANDF_WP_B,
SD4_CMD, SD4_CLK, NANDF_RB0, SD4_DAT0,
NANDF_CS0, NANDF_CS1, NANDF_CS2,
NANDF_CS3, NANDF_D[7:0]
8 bit
Only CS0 is supported
USDHC-1
SD1_CLK, SD1_CMD, SD1_DAT0, SD1_DAT1,
SD1_DAT2, SD1_DAT3, GPIO_1, NANDF_D0,
NANDF_D1, NANDF_D2, NANDF_D3, KEY_COL1
1, 4, or 8 bit
SD/MMC
USDHC-2
SD2_CLK, SD2_CMD, SD2_DAT0, SD2_DAT1,
SD2_DAT2, SD2_DAT3, GPIO_4, NANDF_D4,
NANDF_D5, NANDF_D6, NANDF_D7, KEY_ROW1
1, 4, or 8 bit
SD/MMC
USDHC-3
SD3_CLK, SD3_CMD, SD3_DAT0, SD3_DAT1,
SD3_DAT2, SD3_DAT3, SD3_DAT4, SD3_DAT5,
SD3_DAT6, SD3_DAT7, SD3_RST, GPIO_18
1, 4, or 8 bit
SD/MMC
USDHC-4
SD4_CLK, SD4_CMD, SD4_DAT0, SD4_DAT1,
SD4_DAT2, SD4_DAT3, SD4_DAT4, SD4_DAT5,
SD4_DAT6, SD4_DAT7, NANDF_ALE, NANDF_CS1
1, 4, or 8 bit
I2C
I2C-1
EIM_D28, EIM_D21
—
I2C
I2C-2
EIM_D16, EIM_EB2
—
I2C
I2C-3
EIM_D18, EIM_D17
—
USB
USB-OTG
PHY
USB_OTG_DP
USB_OTG_DN
USB_OTG_VBUS
—
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6
Package Information and Contact Assignments
This section includes the contact assignment information and mechanical package drawing.
6.1
Updated Signal Naming Convention
The signal names of the i.MX6 series of products have been standardized to better align the signal names
within the family and across the documentation. Some of the benefits of these changes are as follows:
• The names are unique within the scope of an SoC and within the series of products
• Searches will return all occurrences of the named signal
• The names are consistent between i.MX 6 series products implementing the same modules
• The module instance is incorporated into the signal name
This change applies only to signal names. The original ball names have been preserved to prevent the need
to change schematics, BSDL models, IBIS models, etc.
Throughout this document, the updated signal names are used except where referenced as a ball name
(such as the Functional Contact Assignments table, Ball Map table, and so on). A master list of the signal
name changes is in the document, IMX 6 Series Signal Name Mapping (EB792). This list can be used to
map the signal names used in older documentation to the new standardized naming conventions.
6.2
6.2.1
21x21 mm Package Information
Case 2240, 21 x 21 mm, 0.8 mm Pitch, 25 x 25 Ball Matrix
Figure 106 shows the top, bottom, and side views of the 21×21 mm BGA package.
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Figure 106. 21 x 21 mm BGA, Case 2240 Package Top, Bottom, and Side Views
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Package Information and Contact Assignments
Table 99 shows the 21  21 mm BGA package details.
Table 99. 21 x 21, 0.8 mm BGA Package Details
Common Dimensions
Parameter
Symbol
Minimum
Normal
Maximum
Total Thickness
A
—
—
1.5
Stand Off
A1
0.36
—
0.46
Substrate Thickness
A2
0.26 REF
Mold Thickness
A3
0.7 REF
Body Size
D
21 BSC
E
21 BSC
Ball Diameter
—
0.5
Ball Opening
—
0.4
Ball Width
b
Ball Pitch
e
0.8 BSC
Ball Count
n
624
Edge Ball Center to Center
D1
19.2 BSC
E1
19.2 BSC
SD
—
SE
—
Package Edge Tolerance
aaa
0.1
Mold Flatness
bbb
0.2
Coplanarity
ddd
0.15
Ball Offset (Package)
eee
0.15
Ball Offset (Ball)
fff
0.08
Body Center to Contact Ball
0.44
—
0.64
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6.2.2
21 x 21 mm Supplies Contact Assignments and Functional Contact
Assignments
Table 100 shows supplies contact assignments for the 21 x 21 mm package.
Table 100. 21 x 21 mm Supplies Contact Assignments
Supply Rail Name
CSI_REXT
Ball(s) Position(s)
Remark
D4
—
DRAM_VREF
AC2
—
DSI_REXT
G4
—
A4, A8, A13, A25, B4, C1, C4, C6, C10, D3, D6, D8, E5,
E6, E7, F5, F6, F7, F8, G3, G10, G19, H8, H12, H15,
H18, J2, J8, J12, J15, J18, K8, K10, K12, K15, K18, L2,
L5, L8, L10, L12, L15, L18, M8, M10, M12, M15, M18,
N8, N10, N15, N18, P8, P10, P12, P15, P18, R8, R12,
R15, R17, T8, T11, T12, T15, T17, T19, U8, U11, U12,
U15, U17, U19, V8, V19, W3, W7, W8, W9, W10, W11,
W12, W13, W15, W16, W17, W18, W19, Y5, Y24, AA7,
AA10, AA13, AA16, AA19, AA22, AB3, AB24, AD4,
AD7, AD10, AD13, AD16, AD19, AD22, AE1, AE25
—
HDMI_REF
J1
—
HDMI_VP
L7
—
HDMI_VPH
M7
—
NVCC_CSI
N7
GND
NVCC_DRAM
NVCC_EIM
Supply of the camera sensor interface
R18, T18, U18, V9, V10, V11, V12, V13, V14, V15, V16, Supply of the DDR interface
V17, V18
K19, L19, M19
Supply of the EIM interface
NVCC_ENET
R19
Supply of the ENET interface
NVCC_GPIO
P7
Supply of the GPIO interface
NVCC_JTAG
J7
Supply of the JTAG tap controller interface
NVCC_LCD
P19
Supply of the LCD interface
NVCC_LVDS2P5
V7
Supply of the LVDS display interface and DDR
pre-drivers
NVCC_MIPI
K7
Supply of the MIPI interface
G15
Supply of the raw NAND Flash memories
interface
NVCC_NANDF
NVCC_PLL_OUT
E8
—
NVCC_RGMII
G18
Supply of the ENET interface
NVCC_SD1
G16
Supply of the SD card interface
NVCC_SD2
G17
Supply of the SD card interface
NVCC_SD3
G14
Supply of the SD card interface
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Table 100. 21 x 21 mm Supplies Contact Assignments (continued)
Supply Rail Name
Ball(s) Position(s)
Remark
PCIE_REXT
A2
—
PCIE_VP
H7
—
PCIE_VPH
G7
PCI PHY supply
PCIE_VPTX
G8
PCI PHY supply
VDD_SNVS_CAP
G9
Secondary supply for the SNVS (internal
regulator output—requires capacitor if internal
regulator is used)
VDD_SNVS_IN
G11
Primary supply for the SNVS regulator
VDDARM_CAP
H11, H13, J11, J13, K11, K13, L11, L13, M11, M13,
N11, N13, P11, P13, R11, R13
Secondary supply for core (internal regulator
output—requires capacitor if internal regulator
is used)
VDDARM_IN
H14, J14, K9, K14, L9, L14, M9, M14, N9, N14, P9,
P14, R9, R14, T9, U9
Primary supply for the ARM core’s regulator
H10, J10
Secondary supply for the 2.5 V domain
(internal regulator output—requires capacitor
if internal regulator is used)
VDDHIGH_IN
H9, J9
Primary supply for the 2.5 V regulator
VDDPU_CAP
H17, J17, K17, L17, M17, N17, P17
Secondary supply for VPU and GPUs
(internal regulator output—requires capacitor
if internal regulator is used)
VDDSOC_CAP
R10, T10, T13, T14, U10, U13, U14
Secondary supply for SoC and PU regulators
(internal regulator output—requires capacitor
if internal regulator is used)
H16, J16, K16, L16, M16, N16, P16, R16, T16, U16
Primary supply for SoC and PU regulators
VDDUSB_CAP
F9
Secondary supply for the 3 V Domain (internal
regulator output—requires capacitor if internal
regulator is used)
USB_H1_VBUS
D10
Primary supply for the 3 V regulator
USB_OTG_VBUS
E9
Primary supply for the 3 V regulator
HDMI_DDCCEC
K2
Analog Ground (Ground reference for the Hot
Plug Detect signal)
FA_ANA
A5
—
GPANAIO
C8
—
VDD_FA
B5
—
VDDHIGH_CAP
VDDSOC_IN
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
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Freescale Semiconductor
Package Information and Contact Assignments
Table 100. 21 x 21 mm Supplies Contact Assignments (continued)
Supply Rail Name
ZQPAD
NC
Ball(s) Position(s)
Remark
AE17
—
For i.MX 6DualLite:
A1, A12, A14, B12, B14, C14, E1, E2, F1, F2, G12,
G13, N12
—
For i.MX 6Solo:
A1, A12, A14, B12, B14, C14, E1, E2, F1, F2, G12,
G13, N12, W25, Y17, Y18, Y19, Y20, Y21, Y22, Y23,
Y25, AA17, AA18, AA20, AA21, AA23, AA24, AA25,
AB18, AB19, AB20, AB21, AB22, AB23, AB25, AC18,
AC19, AC20, AC21, AC22, AC23, AC24, AC25, AD18,
AD20, AD21, AD23, AD24, AD25, AE18, AE19, AE20,
AE21, AE22, AE23, AE24
Table 101 shows an alpha-sorted list of functional contact assignments for the 21 x 21 mm package.
Table 101. 21 x 21 mm Functional Contact Assignments
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
BOOT_MODE0
C12
VDD_SNVS_IN
GPIO
ALT0
SRC_BOOT_MODE0
Input
100 k pull-down
BOOT_MODE1
F12
VDD_SNVS_IN
GPIO
ALT0
SRC_BOOT_MODE1
Input
100 k pull-down
CLK1_N
C7
VDDHIGH_CAP
—
—
CLK1_N
—
—
CLK1_P
D7
VDDHIGH_CAP
—
—
CLK1_P
—
—
CLK2_N
C5
VDDHIGH_CAP
—
—
CLK2_N
—
—
CLK2_P
D5
VDDHIGH_CAP
—
—
CLK2_P
—
—
CSI_CLK0M
F4
NVCC_MIPI
ANALOG
—
CSI_CLK_N
—
—
CSI_CLK0P
F3
NVCC_MIPI
ANALOG
—
CSI_CLK_P
—
—
CSI_D0M
E4
NVCC_MIPI
ANALOG
—
CSI_DATA0_N
—
—
CSI_D0P
E3
NVCC_MIPI
ANALOG
—
CSI_DATA0_P
—
—
CSI_D1M
D1
NVCC_MIPI
ANALOG
—
CSI_DATA1_N
—
—
CSI_D1P
D2
NVCC_MIPI
ANALOG
—
CSI_DATA1_P
—
—
CSI0_DAT10
M1
NVCC_CSI
GPIO
ALT5
GPIO5_IO28
Input
100 k pull-up
CSI0_DAT11
M3
NVCC_CSI
GPIO
ALT5
GPIO5_IO29
Input
100 k pull-up
CSI0_DAT12
M2
NVCC_CSI
GPIO
ALT5
GPIO5_IO30
Input
100 k pull-up
CSI0_DAT13
L1
NVCC_CSI
GPIO
ALT5
GPIO5_IO31
Input
100 k pull-up
CSI0_DAT14
M4
NVCC_CSI
GPIO
ALT5
GPIO6_IO00
Input
100 k pull-up
CSI0_DAT15
M5
NVCC_CSI
GPIO
ALT5
GPIO6_IO01
Input
100 k pull-up
CSI0_DAT16
L4
NVCC_CSI
GPIO
ALT5
GPIO6_IO02
Input
100 k pull-up
CSI0_DAT17
L3
NVCC_CSI
GPIO
ALT5
GPIO6_IO03
Input
100 k pull-up
CSI0_DAT18
M6
NVCC_CSI
GPIO
ALT5
GPIO6_IO04
Input
100 k pull-up
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
145
Package Information and Contact Assignments
Table 101. 21 x 21 mm Functional Contact Assignments (continued)
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
CSI0_DAT19
L6
NVCC_CSI
GPIO
ALT5
GPIO6_IO05
Input
100 k pull-up
CSI0_DAT4
N1
NVCC_CSI
GPIO
ALT5
GPIO5_IO22
Input
100 k pull-up
CSI0_DAT5
P2
NVCC_CSI
GPIO
ALT5
GPIO5_IO23
Input
100 k pull-up
CSI0_DAT6
N4
NVCC_CSI
GPIO
ALT5
GPIO5_IO24
Input
100 k pull-up
CSI0_DAT7
N3
NVCC_CSI
GPIO
ALT5
GPIO5_IO25
Input
100 k pull-up
CSI0_DAT8
N6
NVCC_CSI
GPIO
ALT5
GPIO5_IO26
Input
100 k pull-up
CSI0_DAT9
N5
NVCC_CSI
GPIO
ALT5
GPIO5_IO27
Input
100 k pull-up
CSI0_DATA_EN
P3
NVCC_CSI
GPIO
ALT5
GPIO5_IO20
Input
100 k pull-up
CSI0_MCLK
P4
NVCC_CSI
GPIO
ALT5
GPIO5_IO19
Input
100 k pull-up
CSI0_PIXCLK
P1
NVCC_CSI
GPIO
ALT5
GPIO5_IO18
Input
100 k pull-up
CSI0_VSYNC
N2
NVCC_CSI
GPIO
ALT5
GPIO5_IO21
Input
100 k pull-up
DI0_DISP_CLK
N19
NVCC_LCD
GPIO
ALT5
GPIO4_IO16
Input
100 k pull-up
DI0_PIN15
N21
NVCC_LCD
GPIO
ALT5
GPIO4_IO17
Input
100 k pull-up
DI0_PIN2
N25
NVCC_LCD
GPIO
ALT5
GPIO4_IO18
Input
100 k pull-up
DI0_PIN3
N20
NVCC_LCD
GPIO
ALT5
GPIO4_IO19
Input
100 k pull-up
DI0_PIN4
P25
NVCC_LCD
GPIO
ALT5
GPIO4_IO20
Input
100 k pull-up
DISP0_DAT0
P24
NVCC_LCD
GPIO
ALT5
GPIO4_IO21
Input
100 k pull-up
DISP0_DAT1
P22
NVCC_LCD
GPIO
ALT5
GPIO4_IO22
Input
100 k pull-up
DISP0_DAT10
R21
NVCC_LCD
GPIO
ALT5
GPIO4_IO31
Input
100 k pull-up
DISP0_DAT11
T23
NVCC_LCD
GPIO
ALT5
GPIO5_IO05
Input
100 k pull-up
DISP0_DAT12
T24
NVCC_LCD
GPIO
ALT5
GPIO5_IO06
Input
100 k pull-up
DISP0_DAT13
R20
NVCC_LCD
GPIO
ALT5
GPIO5_IO07
Input
100 k pull-up
DISP0_DAT14
U25
NVCC_LCD
GPIO
ALT5
GPIO5_IO08
Input
100 k pull-up
DISP0_DAT15
T22
NVCC_LCD
GPIO
ALT5
GPIO5_IO09
Input
100 k pull-up
DISP0_DAT16
T21
NVCC_LCD
GPIO
ALT5
GPIO5_IO10
Input
100 k pull-up
DISP0_DAT17
U24
NVCC_LCD
GPIO
ALT5
GPIO5_IO11
Input
100 k pull-up
DISP0_DAT18
V25
NVCC_LCD
GPIO
ALT5
GPIO5_IO12
Input
100 k pull-up
DISP0_DAT19
U23
NVCC_LCD
GPIO
ALT5
GPIO5_IO13
Input
100 k pull-up
DISP0_DAT2
P23
NVCC_LCD
GPIO
ALT5
GPIO4_IO23
Input
100 k pull-up
DISP0_DAT20
U22
NVCC_LCD
GPIO
ALT5
GPIO5_IO14
Input
100 k pull-up
DISP0_DAT21
T20
NVCC_LCD
GPIO
ALT5
GPIO5_IO15
Input
100 k pull-up
DISP0_DAT22
V24
NVCC_LCD
GPIO
ALT5
GPIO5_IO16
Input
100 k pull-up
DISP0_DAT23
W24
NVCC_LCD
GPIO
ALT5
GPIO5_IO17
Input
100 k pull-up
DISP0_DAT3
P21
NVCC_LCD
GPIO
ALT5
GPIO4_IO24
Input
100 k pull-up
DISP0_DAT4
P20
NVCC_LCD
GPIO
ALT5
GPIO4_IO25
Input
100 k pull-up
DISP0_DAT5
R25
NVCC_LCD
GPIO
ALT5
GPIO4_IO26
Input
100 k pull-up
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
146
Freescale Semiconductor
Package Information and Contact Assignments
Table 101. 21 x 21 mm Functional Contact Assignments (continued)
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
DISP0_DAT6
R23
NVCC_LCD
GPIO
ALT5
GPIO4_IO27
Input
100 k pull-up
DISP0_DAT7
R24
NVCC_LCD
GPIO
ALT5
GPIO4_IO28
Input
100 k pull-up
DISP0_DAT8
R22
NVCC_LCD
GPIO
ALT5
GPIO4_IO29
Input
100 k pull-up
DISP0_DAT9
T25
NVCC_LCD
GPIO
ALT5
GPIO4_IO30
Input
100 k pull-up
DRAM_A0
AC14
NVCC_DRAM
DDR
ALT0
DRAM_ADDR00
Output
Low
DRAM_A1
AB14
NVCC_DRAM
DDR
ALT0
DRAM_ADDR01
Output
Low
DRAM_A10
AA15
NVCC_DRAM
DDR
ALT0
DRAM_ADDR10
Output
Low
DRAM_A11
AC12
NVCC_DRAM
DDR
ALT0
DRAM_ADDR11
Output
Low
DRAM_A12
AD12
NVCC_DRAM
DDR
ALT0
DRAM_ADDR12
Output
Low
DRAM_A13
AC17
NVCC_DRAM
DDR
ALT0
DRAM_ADDR13
Output
Low
DRAM_A14
AA12
NVCC_DRAM
DDR
ALT0
DRAM_ADDR14
Output
Low
DRAM_A15
Y12
NVCC_DRAM
DDR
ALT0
DRAM_ADDR15
Output
Low
DRAM_A2
AA14
NVCC_DRAM
DDR
ALT0
DRAM_ADDR02
Output
Low
DRAM_A3
Y14
NVCC_DRAM
DDR
ALT0
DRAM_ADDR03
Output
Low
DRAM_A4
W14
NVCC_DRAM
DDR
ALT0
DRAM_ADDR04
Output
Low
DRAM_A5
AE13
NVCC_DRAM
DDR
ALT0
DRAM_ADDR05
Output
Low
DRAM_A6
AC13
NVCC_DRAM
DDR
ALT0
DRAM_ADDR06
Output
Low
DRAM_A7
Y13
NVCC_DRAM
DDR
ALT0
DRAM_ADDR07
Output
Low
DRAM_A8
AB13
NVCC_DRAM
DDR
ALT0
DRAM_ADDR08
Output
Low
DRAM_A9
AE12
NVCC_DRAM
DDR
ALT0
DRAM_ADDR09
Output
Low
DRAM_CAS
AE16
NVCC_DRAM
DDR
ALT0
DRAM_CAS
Output
Low
DRAM_CS0
Y16
NVCC_DRAM
DDR
ALT0
DRAM_CS0
Output
Low
DRAM_CS1
AD17
NVCC_DRAM
DDR
ALT0
DRAM_CS1
Output
Low
DRAM_D0
AD2
NVCC_DRAM
DDR
ALT0
DRAM_DATA00
Input
100 k pull-up
DRAM_D1
AE2
NVCC_DRAM
DDR
ALT0
DRAM_DATA01
Input
100 k pull-up
DRAM_D10
AA6
NVCC_DRAM
DDR
ALT0
DRAM_DATA10
Input
100 k pull-up
DRAM_D11
AE7
NVCC_DRAM
DDR
ALT0
DRAM_DATA11
Input
100 k pull-up
DRAM_D12
AB5
NVCC_DRAM
DDR
ALT0
DRAM_DATA12
Input
100 k pull-up
DRAM_D13
AC5
NVCC_DRAM
DDR
ALT0
DRAM_DATA13
Input
100 k pull-up
DRAM_D14
AB6
NVCC_DRAM
DDR
ALT0
DRAM_DATA14
Input
100 k pull-up
DRAM_D15
AC7
NVCC_DRAM
DDR
ALT0
DRAM_DATA15
Input
100 k pull-up
DRAM_D16
AB7
NVCC_DRAM
DDR
ALT0
DRAM_DATA16
Input
100 k pull-up
DRAM_D17
AA8
NVCC_DRAM
DDR
ALT0
DRAM_DATA17
Input
100 k pull-up
DRAM_D18
AB9
NVCC_DRAM
DDR
ALT0
DRAM_DATA18
Input
100 k pull-up
DRAM_D19
Y9
NVCC_DRAM
DDR
ALT0
DRAM_DATA19
Input
100 k pull-up
DRAM_D2
AC4
NVCC_DRAM
DDR
ALT0
DRAM_DATA02
Input
100 k pull-up
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
147
Package Information and Contact Assignments
Table 101. 21 x 21 mm Functional Contact Assignments (continued)
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
DRAM_D20
Y7
NVCC_DRAM
DDR
ALT0
DRAM_DATA20
Input
100 k pull-up
DRAM_D21
Y8
NVCC_DRAM
DDR
ALT0
DRAM_DATA21
Input
100 k pull-up
DRAM_D22
AC8
NVCC_DRAM
DDR
ALT0
DRAM_DATA22
Input
100 k pull-up
DRAM_D23
AA9
NVCC_DRAM
DDR
ALT0
DRAM_DATA23
Input
100 k pull-up
DRAM_D24
AE9
NVCC_DRAM
DDR
ALT0
DRAM_DATA24
Input
100 k pull-up
DRAM_D25
Y10
NVCC_DRAM
DDR
ALT0
DRAM_DATA25
Input
100 k pull-up
DRAM_D26
AE11
NVCC_DRAM
DDR
ALT0
DRAM_DATA26
Input
100 k pull-up
DRAM_D27
AB11
NVCC_DRAM
DDR
ALT0
DRAM_DATA27
Input
100 k pull-up
DRAM_D28
AC9
NVCC_DRAM
DDR
ALT0
DRAM_DATA28
Input
100 k pull-up
DRAM_D29
AD9
NVCC_DRAM
DDR
ALT0
DRAM_DATA29
Input
100 k pull-up
DRAM_D3
AA5
NVCC_DRAM
DDR
ALT0
DRAM_DATA03
Input
100 k pull-up
DRAM_D30
AD11
NVCC_DRAM
DDR
ALT0
DRAM_DATA30
Input
100 k pull-up
DRAM_D31
AC11
NVCC_DRAM
DDR
ALT0
DRAM_DATA31
Input
100 k pull-up
Note: DRAM_D32 to DRAM_D63 are only available for i.MX 6DualLite chip; for i.MX 6Solo chip, these pins are NC.
DRAM_D32
AA17
NVCC_DRAM
DDR
ALT0
DRAM_DATA32
Input
100 k pull-up
DRAM_D33
AA18
NVCC_DRAM
DDR
ALT0
DRAM_DATA33
Input
100 k pull-up
DRAM_D34
AC18
NVCC_DRAM
DDR
ALT0
DRAM_DATA34
Input
100 k pull-up
DRAM_D35
AE19
NVCC_DRAM
DDR
ALT0
DRAM_DATA35
Input
100 k pull-up
DRAM_D36
Y17
NVCC_DRAM
DDR
ALT0
DRAM_DATA36
Input
100 k pull-up
DRAM_D37
Y18
NVCC_DRAM
DDR
ALT0
DRAM_DATA37
Input
100 k pull-up
DRAM_D38
AB19
NVCC_DRAM
DDR
ALT0
DRAM_DATA38
Input
100 k pull-up
DRAM_D39
AC19
NVCC_DRAM
DDR
ALT0
DRAM_DATA39
Input
100 k pull-up
DRAM_D4
AC1
NVCC_DRAM
DDR
ALT0
DRAM_DATA04
Input
100 k pull-up
DRAM_D40
Y19
NVCC_DRAM
DDR
ALT0
DRAM_DATA40
Input
100 k pull-up
DRAM_D41
AB20
NVCC_DRAM
DDR
ALT0
DRAM_DATA41
Input
100 k pull-up
DRAM_D42
AB21
NVCC_DRAM
DDR
ALT0
DRAM_DATA42
Input
100 k pull-up
DRAM_D43
AD21
NVCC_DRAM
DDR
ALT0
DRAM_DATA43
Input
100 k pull-up
DRAM_D44
Y20
NVCC_DRAM
DDR
ALT0
DRAM_DATA44
Input
100 k pull-up
DRAM_D45
AA20
NVCC_DRAM
DDR
ALT0
DRAM_DATA45
Input
100 k pull-up
DRAM_D46
AE21
NVCC_DRAM
DDR
ALT0
DRAM_DATA46
Input
100 k pull-up
DRAM_D47
AC21
NVCC_DRAM
DDR
ALT0
DRAM_DATA47
Input
100 k pull-up
DRAM_D48
AC22
NVCC_DRAM
DDR
ALT0
DRAM_DATA48
Input
100 k pull-up
DRAM_D49
AE22
NVCC_DRAM
DDR
ALT0
DRAM_DATA49
Input
100 k pull-up
DRAM_D5
AD1
NVCC_DRAM
DDR
ALT0
DRAM_DATA05
Input
100 k pull-up
DRAM_D50
AE24
NVCC_DRAM
DDR
ALT0
DRAM_DATA50
Input
100 k pull-up
DRAM_D51
AC24
NVCC_DRAM
DDR
ALT0
DRAM_DATA51
Input
100 k pull-up
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
148
Freescale Semiconductor
Package Information and Contact Assignments
Table 101. 21 x 21 mm Functional Contact Assignments (continued)
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
DRAM_D52
AB22
NVCC_DRAM
DDR
ALT0
DRAM_DATA52
Input
100 k pull-up
DRAM_D53
AC23
NVCC_DRAM
DDR
ALT0
DRAM_DATA53
Input
100 k pull-up
DRAM_D54
AD25
NVCC_DRAM
DDR
ALT0
DRAM_DATA54
Input
100 k pull-up
DRAM_D55
AC25
NVCC_DRAM
DDR
ALT0
DRAM_DATA55
Input
100 k pull-up
DRAM_D56
AB25
NVCC_DRAM
DDR
ALT0
DRAM_DATA56
Input
100 k pull-up
DRAM_D57
AA21
NVCC_DRAM
DDR
ALT0
DRAM_DATA57
Input
100 k pull-up
DRAM_D58
Y25
NVCC_DRAM
DDR
ALT0
DRAM_DATA58
Input
100 k pull-up
DRAM_D59
Y22
NVCC_DRAM
DDR
ALT0
DRAM_DATA59
Input
100 k pull-up
DRAM_D6
AB4
NVCC_DRAM
DDR
ALT0
DRAM_DATA06
Input
100 k pull-up
DRAM_D60
AB23
NVCC_DRAM
DDR
ALT0
DRAM_DATA60
Input
100 k pull-up
DRAM_D61
AA23
NVCC_DRAM
DDR
ALT0
DRAM_DATA61
Input
100 k pull-up
DRAM_D62
Y23
NVCC_DRAM
DDR
ALT0
DRAM_DATA62
Input
100 k pull-up
DRAM_D63
W25
NVCC_DRAM
DDR
ALT0
DRAM_DATA63
Input
100 k pull-up
DRAM_D7
AE4
NVCC_DRAM
DDR
ALT0
DRAM_DATA07
Input
100 k pull-up
DRAM_D8
AD5
NVCC_DRAM
DDR
ALT0
DRAM_DATA08
Input
100 k pull-up
DRAM_D9
AE5
NVCC_DRAM
DDR
ALT0
DRAM_DATA09
Input
100 k pull-up
DRAM_DQM0
AC3
NVCC_DRAM
DDR
ALT0
DRAM_DQM0
Output
Low
DRAM_DQM1
AC6
NVCC_DRAM
DDR
ALT0
DRAM_DQM1
Output
Low
DRAM_DQM2
AB8
NVCC_DRAM
DDR
ALT0
DRAM_DQM2
Output
Low
DRAM_DQM3
AE10
NVCC_DRAM
DDR
ALT0
DRAM_DQM3
Output
Low
DRAM_DQM4
AB18
NVCC_DRAM
DDR
ALT0
DRAM_DQM4
Output
Low
DRAM_DQM5
AC20
NVCC_DRAM
DDR
ALT0
DRAM_DQM5
Output
Low
DRAM_DQM6
AD24
NVCC_DRAM
DDR
ALT0
DRAM_DQM6
Output
Low
DRAM_DQM7
Y21
NVCC_DRAM
DDR
ALT0
DRAM_DQM7
Output
Low
DRAM_RAS
AB15
NVCC_DRAM
DDR
ALT0
DRAM_RAS
Output
Low
DRAM_RESET
Y6
NVCC_DRAM
DDR
ALT0
DRAM_RESET
Output
Low
DRAM_SDBA0
AC15
NVCC_DRAM
DDR
ALT0
DRAM_SDBA0
Output
Low
DRAM_SDBA1
Y15
NVCC_DRAM
DDR
ALT0
DRAM_SDBA1
Output
Low
DRAM_SDBA2
AB12
NVCC_DRAM
DDR
ALT0
DRAM_SDBA2
Output
Low
DRAM_SDCKE0
Y11
NVCC_DRAM
DDR
ALT0
DRAM_SDCKE0
Output
Low
DRAM_SDCKE1
AA11
NVCC_DRAM
DDR
ALT0
DRAM_SDCKE1
Output
Low
DRAM_SDCLK_0
AD15
NVCC_DRAM
DDRCLK
ALT0
DRAM_SDCLK0_P
Output
Low
DRAM_SDCLK_0_B AE15
NVCC_DRAM
—
—
DRAM_SDCLK0_N
—
—
AD14
NVCC_DRAM
DDRCLK
ALT0
DRAM_SDCLK1_P
Output
Low
DRAM_SDCLK_1_B AE14
NVCC_DRAM
—
—
DRAM_SDCLK1_N
—
—
NVCC_DRAM
DDR
ALT0
DRAM_ODT0
Output
Low
DRAM_SDCLK_1
DRAM_SDODT0
AC16
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
149
Package Information and Contact Assignments
Table 101. 21 x 21 mm Functional Contact Assignments (continued)
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
DRAM_SDODT1
AB17
NVCC_DRAM
DDR
ALT0
DRAM_ODT1
Output
Low
DRAM_SDQS0
AE3
NVCC_DRAM
DDRCLK
ALT0
DRAM_SDQS0_P
Input
Hi-Z
DRAM_SDQS0_B
AD3
NVCC_DRAM
—
—
DRAM_SDQS0_N
—
—
DRAM_SDQS1
AD6
NVCC_DRAM
DDRCLK
ALT0
DRAM_SDQS1_P
Input
Hi-Z
DRAM_SDQS1_B
AE6
NVCC_DRAM
—
—
DRAM_SDQS1_N
—
—
DRAM_SDQS2
AD8
NVCC_DRAM
DDRCLK
ALT0
DRAM_SDQS2_P
Input
Hi-Z
DRAM_SDQS2_B
AE8
NVCC_DRAM
—
—
DRAM_SDQS2_N
—
—
DRAM_SDQS3
AC10
NVCC_DRAM
DDRCLK
ALT0
DRAM_SDQS3_P
Input
Hi-Z
DRAM_SDQS3_B
AB10
NVCC_DRAM
—
—
DRAM_SDQS3_N
—
—
DRAM_SDQS4
AD18
NVCC_DRAM
DDRCLK
ALT0
DRAM_SDQS4_P
Input
Hi-Z
DRAM_SDQS4_B
AE18
NVCC_DRAM
—
—
DRAM_SDQS4_N
—
—
DRAM_SDQS5
AD20
NVCC_DRAM
DDRCLK
ALT0
DRAM_SDQS5_P
Input
Hi-Z
DRAM_SDQS5_B
AE20
NVCC_DRAM
—
—
DRAM_SDQS5_N
—
—
DRAM_SDQS6
AD23
NVCC_DRAM
DDRCLK
ALT0
DRAM_SDQS6_P
Input
Hi-Z
DRAM_SDQS6_B
AE23
NVCC_DRAM
—
—
DRAM_SDQS6_N
—
—
DRAM_SDQS7
AA25
NVCC_DRAM
DDRCLK
ALT0
DRAM_SDQS7_P
Input
Hi-Z
DRAM_SDQS7_B
AA24
NVCC_DRAM
—
—
DRAM_SDQS7_N
—
—
DRAM_SDWE
AB16
NVCC_DRAM
DDR
ALT0
DRAM_SDWE
Output
Low
DSI_CLK0M
H3
NVCC_MIPI
ANALOG
—
DSI_CLK_N
—
—
DSI_CLK0P
H4
NVCC_MIPI
ANALOG
—
DSI_CLK_P
—
—
DSI_D0M
G2
NVCC_MIPI
ANALOG
—
DSI_DATA0_N
—
—
DSI_D0P
G1
NVCC_MIPI
ANALOG
—
DSI_DATA0_P
—
—
DSI_D1M
H2
NVCC_MIPI
ANALOG
—
DSI_DATA1_N
—
—
DSI_D1P
H1
NVCC_MIPI
ANALOG
—
DSI_DATA1_P
—
—
EIM_A16
H25
NVCC_EIM
GPIO
ALT0
EIM_ADDR16
Output
Low
EIM_A17
G24
NVCC_EIM
GPIO
ALT0
EIM_ADDR17
Output
Low
EIM_A18
J22
NVCC_EIM
GPIO
ALT0
EIM_ADDR18
Output
Low
EIM_A19
G25
NVCC_EIM
GPIO
ALT0
EIM_ADDR19
Output
Low
EIM_A20
H22
NVCC_EIM
GPIO
ALT0
EIM_ADDR20
Output
Low
EIM_A21
H23
NVCC_EIM
GPIO
ALT0
EIM_ADDR21
Output
Low
EIM_A22
F24
NVCC_EIM
GPIO
ALT0
EIM_ADDR22
Output
Low
EIM_A23
J21
NVCC_EIM
GPIO
ALT0
EIM_ADDR23
Output
Low
EIM_A24
F25
NVCC_EIM
GPIO
ALT0
EIM_ADDR24
Output
Low
EIM_A25
H19
NVCC_EIM
GPIO
ALT0
EIM_ADDR25
Output
Low
EIM_BCLK
N22
NVCC_EIM
GPIO
ALT0
EIM_BCLK
Output
Low
EIM_CS0
H24
NVCC_EIM
GPIO
ALT0
EIM_CS0
Output
High
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
150
Freescale Semiconductor
Package Information and Contact Assignments
Table 101. 21 x 21 mm Functional Contact Assignments (continued)
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
EIM_CS1
J23
NVCC_EIM
GPIO
ALT0
EIM_CS1
Output
High
EIM_D16
C25
NVCC_EIM
GPIO
ALT5
GPIO3_IO16
Input
100 k pull-up
EIM_D17
F21
NVCC_EIM
GPIO
ALT5
GPIO3_IO17
Input
100 k pull-up
EIM_D18
D24
NVCC_EIM
GPIO
ALT5
GPIO3_IO18
Input
100 k pull-up
EIM_D19
G21
NVCC_EIM
GPIO
ALT5
GPIO3_IO19
Input
100 k pull-up
EIM_D20
G20
NVCC_EIM
GPIO
ALT5
GPIO3_IO20
Input
100 k pull-up
EIM_D21
H20
NVCC_EIM
GPIO
ALT5
GPIO3_IO21
Input
100 k pull-up
EIM_D22
E23
NVCC_EIM
GPIO
ALT5
GPIO3_IO22
Input
100 k pull-down
EIM_D23
D25
NVCC_EIM
GPIO
ALT5
GPIO3_IO23
Input
100 k pull-up
EIM_D24
F22
NVCC_EIM
GPIO
ALT5
GPIO3_IO24
Input
100 k pull-up
EIM_D25
G22
NVCC_EIM
GPIO
ALT5
GPIO3_IO25
Input
100 k pull-up
EIM_D26
E24
NVCC_EIM
GPIO
ALT5
GPIO3_IO26
Input
100 k pull-up
EIM_D27
E25
NVCC_EIM
GPIO
ALT5
GPIO3_IO27
Input
100 k pull-up
EIM_D28
G23
NVCC_EIM
GPIO
ALT5
GPIO3_IO28
Input
100 k pull-up
EIM_D29
J19
NVCC_EIM
GPIO
ALT5
GPIO3_IO29
Input
100 k pull-up
EIM_D30
J20
NVCC_EIM
GPIO
ALT5
GPIO3_IO30
Input
100 k pull-up
EIM_D31
H21
NVCC_EIM
GPIO
ALT5
GPIO3_IO31
Input
100 k pull-down
EIM_DA0
L20
NVCC_EIM
GPIO
ALT0
EIM_AD00
Input
100 k pull-up
EIM_DA1
J25
NVCC_EIM
GPIO
ALT0
EIM_AD01
Input
100 k pull-up
EIM_DA10
M22
NVCC_EIM
GPIO
ALT0
EIM_AD10
Input
100 k pull-up
EIM_DA11
M20
NVCC_EIM
GPIO
ALT0
EIM_AD11
Input
100 k pull-up
EIM_DA12
M24
NVCC_EIM
GPIO
ALT0
EIM_AD12
Input
100 k pull-up
EIM_DA13
M23
NVCC_EIM
GPIO
ALT0
EIM_AD13
Input
100 k pull-up
EIM_DA14
N23
NVCC_EIM
GPIO
ALT0
EIM_AD14
Input
100 k pull-up
EIM_DA15
N24
NVCC_EIM
GPIO
ALT0
EIM_AD15
Input
100 k pull-up
EIM_DA2
L21
NVCC_EIM
GPIO
ALT0
EIM_AD02
Input
100 k pull-up
EIM_DA3
K24
NVCC_EIM
GPIO
ALT0
EIM_AD03
Input
100 k pull-up
EIM_DA4
L22
NVCC_EIM
GPIO
ALT0
EIM_AD04
Input
100 k pull-up
EIM_DA5
L23
NVCC_EIM
GPIO
ALT0
EIM_AD05
Input
100 k pull-up
EIM_DA6
K25
NVCC_EIM
GPIO
ALT0
EIM_AD06
Input
100 k pull-up
EIM_DA7
L25
NVCC_EIM
GPIO
ALT0
EIM_AD07
Input
100 k pull-up
EIM_DA8
L24
NVCC_EIM
GPIO
ALT0
EIM_AD08
Input
100 k pull-up
EIM_DA9
M21
NVCC_EIM
GPIO
ALT0
EIM_AD09
Input
100 k pull-up
EIM_EB0
K21
NVCC_EIM
GPIO
ALT0
EIM_EB0
Output
High
EIM_EB1
K23
NVCC_EIM
GPIO
ALT0
EIM_EB1
Output
High
EIM_EB2
E22
NVCC_EIM
GPIO
ALT5
GPIO2_IO30
Input
100 k pull-up
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
151
Package Information and Contact Assignments
Table 101. 21 x 21 mm Functional Contact Assignments (continued)
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
EIM_EB3
F23
NVCC_EIM
GPIO
ALT5
GPIO2_IO31
Input
100 k pull-up
EIM_LBA
K22
NVCC_EIM
GPIO
ALT0
EIM_LBA
Output
High
EIM_OE
J24
NVCC_EIM
GPIO
ALT0
EIM_OE
Output
High
EIM_RW
K20
NVCC_EIM
GPIO
ALT0
EIM_RW
Output
High
EIM_WAIT
M25
NVCC_EIM
GPIO
ALT0
EIM_WAIT
Input
100 k pull-up
ENET_CRS_DV
U21
NVCC_ENET
GPIO
ALT5
GPIO1_IO25
Input
100 k pull-up
ENET_MDC
V20
NVCC_ENET
GPIO
ALT5
GPIO1_IO31
Input
100 k pull-up
ENET_MDIO
V23
NVCC_ENET
GPIO
ALT5
GPIO1_IO22
Input
100 k pull-up
ENET_REF_CLK3
V22
NVCC_ENET
GPIO
ALT5
GPIO1_IO23
Input
100 k pull-up
ENET_RX_ER
W23
NVCC_ENET
GPIO
ALT5
GPIO1_IO24
Input
100 k pull-up
ENET_RXD0
W21
NVCC_ENET
GPIO
ALT5
GPIO1_IO27
Input
100 k pull-up
ENET_RXD1
W22
NVCC_ENET
GPIO
ALT5
GPIO1_IO26
Input
100 k pull-up
ENET_TX_EN
V21
NVCC_ENET
GPIO
ALT5
GPIO1_IO28
Input
100 k pull-up
ENET_TXD0
U20
NVCC_ENET
GPIO
ALT5
GPIO1_IO30
Input
100 k pull-up
ENET_TXD1
W20
NVCC_ENET
GPIO
ALT5
GPIO1_IO29
Input
100 k pull-up
GPIO_0
T5
NVCC_GPIO
GPIO
ALT5
GPIO1_IO00
Input
100 k pull-down
GPIO_1
T4
NVCC_GPIO
GPIO
ALT5
GPIO1_IO01
Input
100 k pull-up
GPIO_16
R2
NVCC_GPIO
GPIO
ALT5
GPIO7_IO11
Input
100 k pull-up
GPIO_17
R1
NVCC_GPIO
GPIO
ALT5
GPIO7_IO12
Input
100 k pull-up
GPIO_18
P6
NVCC_GPIO
GPIO
ALT5
GPIO7_IO13
Input
100 k pull-up
GPIO_19
P5
NVCC_GPIO
GPIO
ALT5
GPIO4_IO05
Input
100 k pull-up
GPIO_2
T1
NVCC_GPIO
GPIO
ALT5
GPIO1_IO02
Input
100 k pull-up
GPIO_3
R7
NVCC_GPIO
GPIO
ALT5
GPIO1_IO03
Input
100 k pull-up
GPIO_4
R6
NVCC_GPIO
GPIO
ALT5
GPIO1_IO04
Input
100 k pull-up
GPIO_5
R4
NVCC_GPIO
GPIO
ALT5
GPIO1_IO05
Input
100 k pull-up
GPIO_6
T3
NVCC_GPIO
GPIO
ALT5
GPIO1_IO06
Input
100 k pull-up
GPIO_7
R3
NVCC_GPIO
GPIO
ALT5
GPIO1_IO07
Input
100 k pull-up
GPIO_8
R5
NVCC_GPIO
GPIO
ALT5
GPIO1_IO08
Input
100 k pull-up
GPIO_9
T2
NVCC_GPIO
GPIO
ALT5
GPIO1_IO09
Input
100 k pull-up
HDMI_CLKM
J5
HDMI
—
—
HDMI_TX_CLK_N
—
—
HDMI_CLKP
J6
HDMI
—
—
HDMI_TX_CLK_P
—
—
HDMI_D0M
K5
HDMI
—
—
HDMI_TX_DATA0_N
—
—
HDMI_D0P
K6
HDMI
—
—
HDMI_TX_DATA0_P
—
—
HDMI_D1M
J3
HDMI
—
—
HDMI_TX_DATA1_N
—
—
HDMI_D1P
J4
HDMI
—
—
HDMI_TX_DATA1_P
—
—
HDMI_D2M
K3
HDMI
—
—
HDMI_TX_DATA2_N
—
—
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
152
Freescale Semiconductor
Package Information and Contact Assignments
Table 101. 21 x 21 mm Functional Contact Assignments (continued)
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
HDMI_D2P
K4
HDMI
—
—
HDMI_TX_DATA2_P
—
—
HDMI_HPD
K1
HDMI
—
—
HDMI_TX_HPD
—
—
JTAG_MOD
H6
NVCC_JTAG
GPIO
ALT0
JTAG_MODE
Input
100 k pull-up
JTAG_TCK
H5
NVCC_JTAG
GPIO
ALT0
JTAG_TCK
Input
47 k pull-up
JTAG_TDI
G5
NVCC_JTAG
GPIO
ALT0
JTAG_TDI
Input
47 k pull-up
JTAG_TDO
G6
NVCC_JTAG
GPIO
ALT0
JTAG_TDO
Output
Low
JTAG_TMS
C3
NVCC_JTAG
GPIO
ALT0
JTAG_TMS
Input
47 k pull-up
JTAG_TRSTB
C2
NVCC_JTAG
GPIO
ALT0
JTAG_TRSTB
Input
47 k pull-up
KEY_COL0
W5
NVCC_GPIO
GPIO
ALT5
GPIO4_IO06
Input
100 k pull-up
KEY_COL1
U7
NVCC_GPIO
GPIO
ALT5
GPIO4_IO08
Input
100 k pull-up
KEY_COL2
W6
NVCC_GPIO
GPIO
ALT5
GPIO4_IO10
Input
100 k pull-up
KEY_COL3
U5
NVCC_GPIO
GPIO
ALT5
GPIO4_IO12
Input
100 k pull-up
KEY_COL4
T6
NVCC_GPIO
GPIO
ALT5
GPIO4_IO14
Input
100 k pull-up
KEY_ROW0
V6
NVCC_GPIO
GPIO
ALT5
GPIO4_IO07
Input
100 k pull-up
KEY_ROW1
U6
NVCC_GPIO
GPIO
ALT5
GPIO4_IO09
Input
100 k pull-up
KEY_ROW2
W4
NVCC_GPIO
GPIO
ALT5
GPIO4_IO11
Input
100 k pull-up
KEY_ROW3
T7
NVCC_GPIO
GPIO
ALT5
GPIO4_IO13
Input
100 k pull-up
KEY_ROW4
V5
NVCC_GPIO
GPIO
ALT5
GPIO4_IO15
Input
100 k pull-down
LVDS0_CLK_N
V4
NVCC_LVDS2P5
—
—
LVDS0_CLK_N
—
—
LVDS0_CLK_P
V3
NVCC_LVDS2P5
—
ALT0
LVDS0_CLK_P
Input
Keeper
LVDS0_TX0_N
U2
NVCC_LVDS2P5
—
—
LVDS0_TX0_N
—
—
LVDS0_TX0_P
U1
NVCC_LVDS2P5
—
ALT0
LVDS0_TX0_P
Input
Keeper
LVDS0_TX1_N
U4
NVCC_LVDS2P5
—
—
LVDS0_TX1_N
—
—
LVDS0_TX1_P
U3
NVCC_LVDS2P5
—
ALT0
LVDS0_TX1_P
Input
Keeper
LVDS0_TX2_N
V2
NVCC_LVDS2P5
—
—
LVDS0_TX2_N
—
—
LVDS0_TX2_P
V1
NVCC_LVDS2P5
—
ALT0
LVDS0_TX2_P
Input
Keeper
LVDS0_TX3_N
W2
NVCC_LVDS2P5
—
—
LVDS0_TX3_N
—
—
LVDS0_TX3_P
W1
NVCC_LVDS2P5
—
ALT0
LVDS0_TX3_P
Input
Keeper
LVDS1_CLK_N
Y3
NVCC_LVDS2P5
—
—
LVDS1_CLK_N
—
—
LVDS1_CLK_P
Y4
NVCC_LVDS2P5
—
ALT0
LVDS1_CLK_P
Input
Keeper
LVDS1_TX0_N
Y1
NVCC_LVDS2P5
—
—
LVDS1_TX0_N
—
—
LVDS1_TX0_P
Y2
NVCC_LVDS2P5
—
ALT0
LVDS1_TX0_P
Input
Keeper
LVDS1_TX1_N
AA2
NVCC_LVDS2P5
—
—
LVDS1_TX1_N
—
—
LVDS1_TX1_P
AA1
NVCC_LVDS2P5
—
ALT0
LVDS1_TX1_P
Input
Keeper
LVDS1_TX2_N
AB1
NVCC_LVDS2P5
—
—
LVDS1_TX2_N
—
—
LVDS1_TX2_P
AB2
NVCC_LVDS2P5
—
ALT0
LVDS1_TX2_P
Input
Keeper
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
153
Package Information and Contact Assignments
Table 101. 21 x 21 mm Functional Contact Assignments (continued)
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
LVDS1_TX3_N
AA3
NVCC_LVDS2P5
—
—
LVDS1_TX3_N
—
—
LVDS1_TX3_P
AA4
NVCC_LVDS2P5
—
ALT0
LVDS1_TX3_P
Input
Keeper
MLB_CN
A11
VDDHIGH_CAP
MLB_CLK_N
MLB_CP
B11
VDDHIGH_CAP
MLB_CLK_P
MLB_DN
B10
VDDHIGH_CAP
MLB_DATA_N
MLB_DP
A10
VDDHIGH_CAP
MLB_DATA_P
MLB_SN
A9
VDDHIGH_CAP
MLB_SIG_N
MLB_SP
B9
VDDHIGH_CAP
NANDF_ALE
A16
NVCC_NANDF
GPIO
ALT5
GPIO6_IO08
MLB_SIG_P
Input
100 k pull-up
NANDF_CLE
C15
NVCC_NANDF
GPIO
ALT5
GPIO6_IO07
Input
100 k pull-up
NANDF_CS0
F15
NVCC_NANDF
GPIO
ALT5
GPIO6_IO11
Input
100 k pull-up
NANDF_CS1
C16
NVCC_NANDF
GPIO
ALT5
GPIO6_IO14
Input
100 k pull-up
NANDF_CS2
A17
NVCC_NANDF
GPIO
ALT5
GPIO6_IO15
Input
100 k pull-up
NANDF_CS3
D16
NVCC_NANDF
GPIO
ALT5
GPIO6_IO16
Input
100 k pull-up
NANDF_D0
A18
NVCC_NANDF
GPIO
ALT5
GPIO2_IO00
Input
100 k pull-up
NANDF_D1
C17
NVCC_NANDF
GPIO
ALT5
GPIO2_IO01
Input
100 k pull-up
NANDF_D2
F16
NVCC_NANDF
GPIO
ALT5
GPIO2_IO02
Input
100 k pull-up
NANDF_D3
D17
NVCC_NANDF
GPIO
ALT5
GPIO2_IO03
Input
100 k pull-up
NANDF_D4
A19
NVCC_NANDF
GPIO
ALT5
GPIO2_IO04
Input
100 k pull-up
NANDF_D5
B18
NVCC_NANDF
GPIO
ALT5
GPIO2_IO05
Input
100 k pull-up
NANDF_D6
E17
NVCC_NANDF
GPIO
ALT5
GPIO2_IO06
Input
100 k pull-up
NANDF_D7
C18
NVCC_NANDF
GPIO
ALT5
GPIO2_IO07
Input
100 k pull-up
NANDF_RB0
B16
NVCC_NANDF
GPIO
ALT5
GPIO6_IO10
Input
100 k pull-up
NANDF_WP_B
E15
NVCC_NANDF
GPIO
ALT5
GPIO6_IO09
Input
100 k pull-up
ONOFF
D12
VDD_SNVS_IN
GPIO
ALT0
SRC_ONOFF
Input
100 k pull-up
PCIE_RXM
B1
PCIE_VPH
—
—
PCIE_RX_N
—
—
PCIE_RXP
B2
PCIE_VPH
—
—
PCIE_RX_P
—
—
PCIE_TXM
A3
PCIE_VPH
—
—
PCIE_TX_N
—
—
PCIE_TXP
B3
PCIE_VPH
—
—
PCIE_TX_P
—
—
PMIC_ON_REQ
D11
VDD_SNVS_IN
GPIO
ALT0
SNVS_PMIC_ON_REQ Output
PMIC_STBY_REQ
F11
VDD_SNVS_IN
GPIO
ALT0
CCM_PMIC_STBY_REQ Output
POR_B
C11
VDD_SNVS_IN
GPIO
ALT0
SRC_POR_B
Input
100 k pull-up
RGMII_RD0
C24
NVCC_RGMII
DDR
ALT5
GPIO6_IO25
Input
100 k pull-up
RGMII_RD1
B23
NVCC_RGMII
DDR
ALT5
GPIO6_IO27
Input
100 k pull-up
RGMII_RD2
B24
NVCC_RGMII
DDR
ALT5
GPIO6_IO28
Input
100 k pull-up
Open drain with
PU(100K) enable
Low
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
154
Freescale Semiconductor
Package Information and Contact Assignments
Table 101. 21 x 21 mm Functional Contact Assignments (continued)
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
RGMII_RD3
D23
NVCC_RGMII
DDR
ALT5
GPIO6_IO29
Input
100 k pull-up
RGMII_RX_CTL
D22
NVCC_RGMII
DDR
ALT5
GPIO6_IO24
Input
100 k pull-down
RGMII_RXC
B25
NVCC_RGMII
DDR
ALT5
GPIO6_IO30
Input
100 k pull-down
RGMII_TD0
C22
NVCC_RGMII
DDR
ALT5
GPIO6_IO20
Input
100 k pull-up
RGMII_TD1
F20
NVCC_RGMII
DDR
ALT5
GPIO6_IO21
Input
100 k pull-up
RGMII_TD2
E21
NVCC_RGMII
DDR
ALT5
GPIO6_IO22
Input
100 k pull-up
RGMII_TD3
A24
NVCC_RGMII
DDR
ALT5
GPIO6_IO23
Input
100 k pull-up
RGMII_TX_CTL
C23
NVCC_RGMII
DDR
ALT5
GPIO6_IO26
Input
100 k pull-down
RGMII_TXC
D21
NVCC_RGMII
DDR
ALT5
GPIO6_IO19
Input
100 k pull-down
RTC_XTALI
D9
VDD_SNVS_CAP
—
—
RTC_XTALI
—
—
RTC_XTALO
C9
VDD_SNVS_CAP
—
—
RTC_XTALO
—
—
SD1_CLK
D20
NVCC_SD1
GPIO
ALT5
GPIO1_IO20
Input
100 k pull-up
SD1_CMD
B21
NVCC_SD1
GPIO
ALT5
GPIO1_IO18
Input
100 k pull-up
SD1_DAT0
A21
NVCC_SD1
GPIO
ALT5
GPIO1_IO16
Input
100 k pull-up
SD1_DAT1
C20
NVCC_SD1
GPIO
ALT5
GPIO1_IO17
Input
100 k pull-up
SD1_DAT2
E19
NVCC_SD1
GPIO
ALT5
GPIO1_IO19
Input
100 k pull-up
SD1_DAT3
F18
NVCC_SD1
GPIO
ALT5
GPIO1_IO21
Input
100 k pull-up
SD2_CLK
C21
NVCC_SD2
GPIO
ALT5
GPIO1_IO10
Input
100 k pull-up
SD2_CMD
F19
NVCC_SD2
GPIO
ALT5
GPIO1_IO11
Input
100 k pull-up
SD2_DAT0
A22
NVCC_SD2
GPIO
ALT5
GPIO1_IO15
Input
100 k pull-up
SD2_DAT1
E20
NVCC_SD2
GPIO
ALT5
GPIO1_IO14
Input
100 k pull-up
SD2_DAT2
A23
NVCC_SD2
GPIO
ALT5
GPIO1_IO13
Input
100 k pull-up
SD2_DAT3
B22
NVCC_SD2
GPIO
ALT5
GPIO1_IO12
Input
100 k pull-up
SD3_CLK
D14
NVCC_SD3
GPIO
ALT5
GPIO7_IO03
Input
100 k pull-up
SD3_CMD
B13
NVCC_SD3
GPIO
ALT5
GPIO7_IO02
Input
100 k pull-up
SD3_DAT0
E14
NVCC_SD3
GPIO
ALT5
GPIO7_IO04
Input
100 k pull-up
SD3_DAT1
F14
NVCC_SD3
GPIO
ALT5
GPIO7_IO05
Input
100 k pull-up
SD3_DAT2
A15
NVCC_SD3
GPIO
ALT5
GPIO7_IO06
Input
100 k pull-up
SD3_DAT3
B15
NVCC_SD3
GPIO
ALT5
GPIO7_IO07
Input
100 k pull-up
SD3_DAT4
D13
NVCC_SD3
GPIO
ALT5
GPIO7_IO01
Input
100 k pull-up
SD3_DAT5
C13
NVCC_SD3
GPIO
ALT5
GPIO7_IO00
Input
100 k pull-up
SD3_DAT6
E13
NVCC_SD3
GPIO
ALT5
GPIO6_IO18
Input
100 k pull-up
SD3_DAT7
F13
NVCC_SD3
GPIO
ALT5
GPIO6_IO17
Input
100 k pull-up
SD3_RST
D15
NVCC_SD3
GPIO
ALT5
GPIO7_IO08
Input
100 k pull-up
SD4_CLK
E16
NVCC_NANDF
GPIO
ALT5
GPIO7_IO10
Input
100 k pull-up
SD4_CMD
B17
NVCC_NANDF
GPIO
ALT5
GPIO7_IO09
Input
100 k pull-up
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
155
Package Information and Contact Assignments
Table 101. 21 x 21 mm Functional Contact Assignments (continued)
Out of Reset Condition1
Ball Name
Ball
Power Group
Ball Type
Default
Mode
(Reset
Mode)
Default Function
Input/
Output
Value2
SD4_DAT0
D18
NVCC_NANDF
GPIO
ALT5
GPIO2_IO08
Input
100 k pull-up
SD4_DAT1
B19
NVCC_NANDF
GPIO
ALT5
GPIO2_IO09
Input
100 k pull-up
SD4_DAT2
F17
NVCC_NANDF
GPIO
ALT5
GPIO2_IO10
Input
100 k pull-up
SD4_DAT3
A20
NVCC_NANDF
GPIO
ALT5
GPIO2_IO11
Input
100 k pull-up
SD4_DAT4
E18
NVCC_NANDF
GPIO
ALT5
GPIO2_IO12
Input
100 k pull-up
SD4_DAT5
C19
NVCC_NANDF
GPIO
ALT5
GPIO2_IO13
Input
100 k pull-up
SD4_DAT6
B20
NVCC_NANDF
GPIO
ALT5
GPIO2_IO14
Input
100 k pull-up
SD4_DAT7
D19
NVCC_NANDF
GPIO
ALT5
GPIO2_IO15
Input
100 k pull-up
TAMPER
E11
VDD_SNVS_IN
GPIO
ALT0
SNVS_TAMPER
Input
100 k pull-down
TEST_MODE
E12
VDD_SNVS_IN
GPIO
ALT0
TCU_TEST_MODE
Input
100 k pull-down
USB_H1_DN
F10
VDDUSB_CAP
—
—
USB_H1_DN
—
—
USB_H1_DP
E10
VDDUSB_CAP
—
—
USB_H1_DP
—
—
USB_OTG_CHD_B
B8
VDDUSB_CAP
—
—
USB_OTG_CHD_B
—
—
USB_OTG_DN
B6
VDDUSB_CAP
—
—
USB_OTG_DN
—
—
USB_OTG_DP
A6
VDDUSB_CAP
—
—
USB_OTG_DP
—
—
XTALI
A7
NVCC_PLL_OUT
—
—
XTALI
—
—
XTALO
B7
NVCC_PLL_OUT
—
—
XTALO
—
—
1
The state immediately after reset and before ROM firmware or software has executed.
Variance of the pull-up and pull-down strengths are shown in the tables as follows:
• Table 24, "GPIO DC Parameters," on page 40
• Table 25, "LPDDR2 I/O DC Electrical Parameters," on page 41
• Table 26, "DDR3/DDR3L I/O DC Electrical Characteristics," on page 41
3 ENET_REF_CLK is used as a clock source for MII and RGMII modes only. RMGII mode uses either GPIO_16 or
RGMII_TX_CTL as a clock source. For more information on these clocks, see the device Reference Manual and the Hardware
Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors (IMX6DQ6SDLHDG).
2
Table 102. Signals with Differing Before Reset and After Reset States
Before Reset State
Ball Name
Input/Output
Value
EIM_A16
Input
PD (100K)
EIM_A17
Input
PD (100K)
EIM_A18
Input
PD (100K)
EIM_A19
Input
PD (100K)
EIM_A20
Input
PD (100K)
EIM_A21
Input
PD (100K)
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
156
Freescale Semiconductor
Package Information and Contact Assignments
Table 102. Signals with Differing Before Reset and After Reset States (continued)
Before Reset State
Ball Name
Input/Output
Value
EIM_A22
Input
PD (100K)
EIM_A23
Input
PD (100K)
EIM_A24
Input
PD (100K)
EIM_A25
Input
PD (100K)
EIM_DA0
Input
PD (100K)
EIM_DA1
Input
PD (100K)
EIM_DA2
Input
PD (100K)
EIM_DA3
Input
PD (100K)
EIM_DA4
Input
PD (100K)
EIM_DA5
Input
PD (100K)
EIM_DA6
Input
PD (100K)
EIM_DA7
Input
PD (100K)
EIM_DA8
Input
PD (100K)
EIM_DA9
Input
PD (100K)
EIM_DA10
Input
PD (100K)
EIM_DA11
Input
PD (100K)
EIM_DA12
Input
PD (100K)
EIM_DA13
Input
PD (100K)
EIM_DA14
Input
PD (100K)
EIM_DA15
Input
PD (100K)
EIM_EB0
Input
PD (100K)
EIM_EB1
Input
PD (100K)
EIM_EB2
Input
PD (100K)
EIM_EB3
Input
PD (100K)
EIM_LBA
Input
PD (100K)
EIM_RW
Input
PD (100K)
EIM_WAIT
Input
PD (100K)
GPIO_17
Output
Drive state unknown (x)
GPIO_19
Output
Drive state unknown (x)
KEY_COL0
Output
Drive state unknown (x)
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
157
158
CLK2_N
GND
CLK1_N
GPANAIO
RTC_XTALO
GND
POR_B
BOOT_MODE0
SD3_DAT5
NC
NANDF_CLE
NANDF_CS1
NANDF_D1
NANDF_D7
SD4_DAT5
SD1_DAT1
SD2_CLK
RGMII_TD0
RGMII_TX_CTL
RGMII_RD0
EIM_D16
C
GND
CLK1_P
GND
RTC_XTALI
USB_H1_VBUS
PMIC_ON_REQ
ONOFF
SD3_DAT4
SD3_CLK
SD3_RST
NANDF_CS3
NANDF_D3
SD4_DAT0
SD4_DAT7
SD1_CLK
RGMII_TXC
RGMII_RX_CTL
RGMII_RD3
EIM_D18
EIM_D23
D
GND
GND
NVCC_PLL_OUT
USB_OTG_VBUS
USB_H1_DP
TAMPER
TEST_MODE
SD3_DAT6
SD3_DAT0
NANDF_WP_B
SD4_CLK
NANDF_D6
SD4_DAT4
SD1_DAT2
SD2_DAT1
RGMII_TD2
EIM_EB2
EIM_D22
EIM_D26
EIM_D27
E
GND
GND
GND
VDDUSB_CAP
USB_H1_DN
PMIC_STBY_REQ
BOOT_MODE1
SD3_DAT7
SD3_DAT1
NANDF_CS0
NANDF_D2
SD4_DAT2
SD1_DAT3
SD2_CMD
RGMII_TD1
EIM_D17
EIM_D24
EIM_EB3
EIM_A22
EIM_A24
F
JTAG_TDO
PCIE_VPH
PCIE_VPTX
VDD_SNVS_CAP
GND
VDD_SNVS_IN
NC
NC
NVCC_SD3
NVCC_NANDF
NVCC_SD1
NVCC_SD2
NVCC_RGMII
GND
EIM_D20
EIM_D19
EIM_D25
EIM_D28
EIM_A17
EIM_A19
G
GND
CSI_REXT
CSI_D0M
CSI_CLK0M
DSI_REXT
CLK2_P
JTAG_TMS
GND
CSI_D0P
CSI_CLK0P
GND
GND
JTAG_TRSTB
CSI_D1P
NC
NC
DSI_D0M
GND
GND
CSI_D1M
NC
NC
DSI_D0P
B
RGMII_RXC
RGMII_RD2
RGMII_RD1
SD2_DAT3
SD1_CMD
SD4_DAT6
SD4_DAT1
NANDF_D5
SD4_CMD
NANDF_RB0
SD3_DAT3
NC
SD3_CMD
NC
MLB_CP
MLB_DN
MLB_SP
USB_OTG_CHD_B
XTALO
USB_OTG_DN
VDD_FA
GND
PCIE_TXP
PCIE_RXP
PCIE_RXM
B
5
4
3
2
1
15
14
13
12
11
10
9
8
7
A
GND
RGMII_TD3
SD2_DAT2
SD2_DAT0
SD1_DAT0
SD4_DAT3
NANDF_D4
NANDF_D0
25
24
23
22
21
20
19
18
NANDF_CS2 17
NANDF_ALE 16
SD3_DAT2
NC
GND
NC
MLB_CN
MLB_DP
MLB_SN
GND
XTALI
USB_OTG_DP 6
FA_ANA
GND
PCIE_TXM
PCIE_REXT
NC
A
6.2.3
JTAG_TDI
C
D
E
F
G
Package Information and Contact Assignments
21 x 21 mm, 0.8 mm Pitch Ball Map
Table 103 shows the 21 x 21 mm, 0.8 mm pitch ball map for the i.MX 6Solo.
Table 103. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
Freescale Semiconductor
CSI0_DAT19
HDMI_VP
GND
VDDARM_IN
GND
CSI0_DAT18
HDMI_VPH
GND
VDDARM_IN
GND
CSI0_DAT8
NVCC_CSI
GND
VDDARM_IN
GND
GPIO_18
NVCC_GPIO
GND
VDDARM_IN
GND
GPIO_4
GPIO_3
GND
VDDARM_IN
VDDSOC_CAP
GND
VDDARM_IN
GND
NVCC_MIPI
HDMI_D0P
HDMI_D0M
HDMI_D2P
HDMI_D2M
HDMI_DDCCEC
HDMI_HPD
K
6
7
8
9
PCIE_VP
GND
VDDHIGH_IN
4
DSI_CLK0P
JTAG_MOD
3
DSI_CLK0M
5
2
DSI_D1M
JTAG_TCK
1
DSI_D1P
H
VDDHIGH_CAP VDDHIGH_CAP 10
VDDHIGH_IN
GND
NVCC_JTAG
HDMI_CLKP
HDMI_CLKM
HDMI_D1P
HDMI_D1M
GND
HDMI_REF
J
GND
NC
GND
GND
GND
GND
GND
12
NVCC_EIM
NVCC_EIM
DI0_DISP_CLK
NVCC_LCD
DISP0_DAT4
DISP0_DAT3
DISP0_DAT1
DISP0_DAT2
DISP0_DAT0
DI0_PIN4
NVCC_ENET
DISP0_DAT13
DISP0_DAT10
DISP0_DAT8
DISP0_DAT6
DISP0_DAT7
DISP0_DAT5
P
GND
GND
GND
GND
NVCC_DRAM
R
VDDPU_CAP
VDDPU_CAP
VDDPU_CAP
VDDPU_CAP
GND
N
DI0_PIN2
EIM_DA15
EIM_DA14
EIM_BCLK
DI0_PIN15
M
EIM_WAIT
EIM_DA12
EIM_DA13
EIM_DA10
EIM_DA9
EIM_EB1
EIM_DA3
EIM_DA6
EIM_DA5
EIM_DA8
EIM_DA7
K
EIM_LBA
EIM_DA4
L
EIM_EB0
EIM_RW
NVCC_EIM
GND
VDDPU_CAP
VDDSOC_IN
GND
VDDARM_IN
EIM_DA2
EIM_DA0
VDDSOC_IN
VDDSOC_IN
VDDSOC_IN
VDDSOC_IN
VDDSOC_IN
EIM_DA11
GND
GND
GND
GND
GND
DI0_PIN3
VDDARM_IN
VDDARM_IN
VDDARM_IN
VDDARM_IN
VDDARM_IN
J
EIM_DA1
EIM_OE
EIM_CS1
EIM_A18
EIM_A23
EIM_D30
EIM_D29
GND
VDDPU_CAP
VDDSOC_IN
GND
VDDARM_IN
16
17
18
19
VDDSOC_IN
VDDPU_CAP
GND
EIM_A25
H
EIM_A16
EIM_CS0
EIM_A21
EIM_A20
EIM_D31
25
24
23
22
21
20
15
GND
EIM_D21
14
VDDARM_IN
VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP 13
GND
VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP 11
GND
CSI0_DAT16
CSI0_DAT14
CSI0_DAT6
CSI0_MCLK
GPIO_5
CSI0_DAT15
CSI0_DAT17
CSI0_DAT11
CSI0_DAT7
CSI0_DATA_EN
GPIO_7
CSI0_DAT9
GND
CSI0_DAT12
CSI0_VSYNC
CSI0_DAT5
GPIO_16
GPIO_19
CSI0_DAT13
CSI0_DAT10
CSI0_DAT4
CSI0_PIXCLK
GPIO_17
GPIO_8
L
M
N
P
R
Package Information and Contact Assignments
Table 103. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo (continued)
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
159
160
GND
GND
GND
DRAM_D21
DRAM_D19
DRAM_D25
DRAM_D17
DRAM_D23
GND
DRAM_DQM2
DRAM_D18
DRAM_D22
DRAM_D28
DRAM_A4
GND
GND
GND
GND
GND
ENET_TXD1
ENET_RXD0
ENET_RXD1 ENET_REF_CLK DISP0_DAT20
DISP0_DAT19
GND
ENET_RX_ER
DISP0_DAT23
NC
W
DRAM_A7
DRAM_A3
DRAM_SDBA1
DRAM_CS0
NC
NC
NC
NC
NC
NC
NC
GND
NC
Y
GND
DRAM_A2
DRAM_A10
GND
NC
NC
GND
NC
NC
GND
NC
NC
NC
AA
DRAM_A8
DRAM_A1
DRAM_RAS
DRAM_SDWE
DRAM_SDODT1
NC
NC
NC
NC
NC
NC
GND
NC
AB
DRAM_A6
DRAM_A0
DRAM_SDBA0
DRAM_SDODT0
DRAM_A13
NC
NC
NC
NC
NC
NC
NC
NC
AC
V
DISP0_DAT18
DISP0_DAT22
ENET_MDIO
ENET_TX_EN
ENET_MDC
GND
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
9
8
7
6
5
4
3
2
1
GND
GND
12
11
15
17
19
DISP0_DAT21 20
GND
NVCC_DRAM 18
GND
VDDSOC_IN 16
GND
U
DISP0_DAT14
DISP0_DAT17
T
DISP0_DAT9 25
DISP0_DAT12 24
DISP0_DAT11 23
DISP0_DAT15 22
ENET_CRS_DV DISP0_DAT16 21
ENET_TXD0
GND
NVCC_DRAM
GND
VDDSOC_IN
GND
VDDSOC_CAP VDDSOC_CAP 14
VDDSOC_CAP VDDSOC_CAP 13
GND
GND
DRAM_A15
DRAM_A14
DRAM_SDBA2
GND
DRAM_A11
NVCC_DRAM
VDDARM_IN
GND
KEY_ROW3
KEY_COL4
GPIO_0
GPIO_1
GPIO_6
GPIO_9
GPIO_2
T
VDDSOC_CAP VDDSOC_CAP 10
VDDARM_IN
GND
KEY_COL1
KEY_ROW1
KEY_COL3
DRAM_D27
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
GND
NVCC_LVDS2P5
KEY_ROW0
KEY_ROW4
LVDS0_TX1_N
LVDS0_TX1_P
LVDS0_TX0_N
LVDS0_TX0_P
U
DRAM_D31
GND
GND
DRAM_D20
GND
DRAM_D16
DRAM_D15
DRAM_SDCKE1 DRAM_SDCKE0
KEY_COL2
DRAM_RESET
DRAM_D10
DRAM_D14
DRAM_DQM1
DRAM_SDQS3 DRAM_SDQS3_B
KEY_COL0
GND
DRAM_D3
KEY_ROW2
LVDS1_CLK_P
LVDS1_TX3_P
DRAM_D6
DRAM_D2
DRAM_D12
LVDS0_CLK_P
GND
LVDS1_CLK_N
LVDS1_TX3_N
GND
DRAM_DQM0
DRAM_D13
LVDS0_TX2_N
LVDS1_TX0_P LVDS0_TX3_N
LVDS1_TX1_N
LVDS1_TX2_P
DRAM_VREF
LVDS0_CLK_N
LVDS0_TX2_P
LVDS1_TX0_N LVDS0_TX3_P
LVDS1_TX1_P
V
LVDS1_TX2_N
W
DRAM_D4
Y
AA
AB
AC
Package Information and Contact Assignments
Table 103. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo (continued)
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
20
21
22
23
24
25
NC
NC
GND
NC
NC
NC
How to Reach Us:
Information in this document is provided solely to enable system and software
Home Page:
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implementers to use Freescale products. There are no express or implied copyright
Web Support:
freescale.com/support
information in this document.
licenses granted hereunder to design or fabricate any integrated circuits based on the
Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
specifications can and do vary in different applications, and actual performance may
vary over time. All operating parameters, including “typicals,” must be validated for each
customer application by customer’s technical experts. Freescale does not convey any
license under its patent rights nor the rights of others. Freescale sells products pursuant
to standard terms and conditions of sale, which can be found at the following address:
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Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,
Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their
respective owners. ARM, the ARM logo, and Cortex are registered trademarks of ARM
Limited. MPCore and NEON are trademarks of ARM Limited.
© 2012-2014 Freescale Semiconductor, Inc. All rights reserved.
Document Number: IMX6SDLCEC
Rev. 3
03/2014
AD
19
13
GND
GND
12
DRAM_A12
18
11
DRAM_D30
NC
10
GND
17
9
DRAM_D29
DRAM_CS1
8
DRAM_SDQS2
16
7
GND
GND
6
DRAM_SDQS1
DRAM_SDCLK_0 15
5
DRAM_D8
DRAM_SDCLK_1 14
4
GND
2
DRAM_D0
DRAM_SDQS0_B 3
1
DRAM_D5
AD
Table 103. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo (continued)
162
GND
CLK1_N
GPANAIO
RTC_XTALO
GND
POR_B
BOOT_MODE0
SD3_DAT5
NC
NANDF_CLE
NANDF_CS1
NANDF_D1
NANDF_D7
SD4_DAT5
SD1_DAT1
SD2_CLK
RGMII_TD0
RGMII_TX_CTL
RGMII_RD0
EIM_D16
C
GND
CLK1_P
GND
RTC_XTALI
USB_H1_VBUS
PMIC_ON_REQ
ONOFF
SD3_DAT4
SD3_CLK
SD3_RST
NANDF_CS3
NANDF_D3
SD4_DAT0
SD4_DAT7
SD1_CLK
RGMII_TXC
RGMII_RX_CTL
RGMII_RD3
EIM_D18
EIM_D23
D
GND
GND
NVCC_PLL_OUT
USB_OTG_VBUS
USB_H1_DP
TAMPER
TEST_MODE
SD3_DAT6
SD3_DAT0
NANDF_WP_B
SD4_CLK
NANDF_D6
SD4_DAT4
SD1_DAT2
SD2_DAT1
RGMII_TD2
EIM_EB2
EIM_D22
EIM_D26
EIM_D27
E
GND
CSI_REXT
CSI_D0M
CLK2_N
JTAG_TMS
GND
CSI_D0P
CLK2_P
JTAG_TRSTB
CSI_D1P
NC
GND
GND
CSI_D1M
NC
C
D
E
B
RGMII_RXC
RGMII_RD2
RGMII_RD1
SD2_DAT3
SD1_CMD
SD4_DAT6
SD4_DAT1
NANDF_D5
SD4_CMD
NANDF_RB0
SD3_DAT3
NC
SD3_CMD
NC
MLB_CP
MLB_DN
MLB_SP
USB_OTG_CHD_B
XTALO
USB_OTG_DN
VDD_FA
GND
PCIE_TXP
PCIE_RXP
PCIE_RXM
B
5
4
3
2
1
A
GND
RGMII_TD3
SD2_DAT2
SD2_DAT0
SD1_DAT0
SD4_DAT3
NANDF_D4
NANDF_D0
NANDF_CS2
NANDF_ALE
SD3_DAT2
NC
GND
NC
MLB_CN
MLB_DP
MLB_SN
GND
XTALI
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
USB_OTG_DP 6
FA_ANA
GND
PCIE_TXM
PCIE_REXT
NC
A
4
5
DRAM_D7
DRAM_D9
4
5
DRAM_A5
DRAM_A9
DRAM_D26
DRAM_DQM3
DRAM_D24
DRAM_SDQS2_B
DRAM_
13
12
11
10
9
8
7
25
24
23
22
21
20
19
18
17
16
AE
GND
NC
NC
NC
NC
NC
NC
NC
ZQPAD
DRAM_CAS
25
24
23
22
21
20
19
18
17
16
15 DRAM_SDCLK_0_B 15
14 DRAM_SDCLK_1_B 14
13
12
11
10
9
8
7
6
3
DRAM_SDQS0
3
DRAM_SDQS1_B
2
DRAM_D1
2
6
1
GND
1
AE
Package Information and Contact Assignments
Table 103. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo (continued)
Table 104 shows the 21 x 21 mm, 0.8 mm pitch ball map for the i.MX 6DualLite.
Table 104. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
Freescale Semiconductor
NVCC_JTAG
GND
VDDHIGH_IN
NVCC_MIPI
GND
VDDARM_IN
GND
HDMI_VP
GND
VDDARM_IN
GND
HDMI_VPH
GND
VDDARM_IN
GND
NVCC_CSI
GND
VDDARM_IN
GND
GND
GND
GND
VDDPU_CAP
GND
EIM_D29
EIM_D30
EIM_A23
VDDPU_CAP
GND
NVCC_EIM
EIM_RW
EIM_EB0
VDDPU_CAP
GND
NVCC_EIM
EIM_DA0
EIM_DA2
VDDPU_CAP
GND
NVCC_EIM
EIM_DA11
EIM_DA9
EIM_DA10
EIM_DA13
EIM_DA12
EIM_WAIT
VDDPU_CAP
GND
DI0_DISP_CLK
DI0_PIN3
DI0_PIN15
EIM_BCLK
EIM_DA14
EIM_DA15
DI0_PIN2
M
VDDSOC_IN
VDDSOC_IN
VDDSOC_IN
VDDSOC_IN
VDDSOC_IN
N
GND
GND
GND
GND
GND
L
EIM_DA7
EIM_DA8
EIM_DA5
K
EIM_DA6
EIM_DA3
EIM_EB1
EIM_A16
EIM_DA1
H
EIM_CS0
EIM_OE
J
EIM_A21
EIM_A20
EIM_D31
EIM_D21
EIM_A25
GND
VDDPU_CAP
VDDSOC_IN
GND
VDDARM_IN
EIM_CS1
EIM_A18
VDDARM_IN
VDDARM_IN
VDDARM_IN
EIM_LBA
GND
VDDARM_CAP VDDARM_CAP
GND
VDDARM_IN
EIM_DA4
VDDHIGH_IN
GND
PCIE_VP
JTAG_MOD
VDDARM_CAP VDDARM_CAP
VDDARM_IN
VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP
NC
VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP
HDMI_CLKP
HDMI_D0P
CSI0_DAT19
CSI0_DAT18
CSI0_DAT8
JTAG_TCK
DSI_CLK0P
DSI_CLK0M
DSI_D1M
DSI_D1P
H
VDDHIGH_CAP VDDHIGH_CAP
HDMI_CLKM
HDMI_D1P
HDMI_D2P
CSI0_DAT16
CSI0_DAT14
CSI0_DAT6
HDMI_D0M
HDMI_D1M
HDMI_D2M
CSI0_DAT17
CSI0_DAT11
CSI0_DAT7
GND
GND
HDMI_DDCCEC
GND
CSI0_DAT12
CSI0_VSYNC
CSI0_DAT15
HDMI_REF
HDMI_HPD
CSI0_DAT13
CSI0_DAT10
CSI0_DAT4
CSI0_DAT9
J
K
L
M
N
G
EIM_A19
EIM_A17
EIM_D28
EIM_D25
EIM_D19
EIM_D20
GND
NVCC_RGMII
NVCC_SD2
NVCC_SD1
NVCC_NANDF
NVCC_SD3
NC
NC
VDD_SNVS_IN
GND
VDD_SNVS_CAP
PCIE_VPTX
PCIE_VPH
JTAG_TDO
JTAG_TDI
DSI_REXT
GND
DSI_D0M
DSI_D0P
G
10
9
8
7
6
5
4
3
2
1
F
EIM_A24
EIM_A22
EIM_EB3
EIM_D24
EIM_D17
RGMII_TD1
SD2_CMD
SD1_DAT3
SD4_DAT2
NANDF_D2
NANDF_CS0
SD3_DAT1
SD3_DAT7
BOOT_MODE1
25
24
23
22
21
20
19
18
17
16
15
14
13
12
PMIC_STBY_REQ 11
USB_H1_DN
VDDUSB_CAP
GND
GND
GND
GND
CSI_CLK0M
CSI_CLK0P
NC
NC
F
Package Information and Contact Assignments
Table 104. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite (continued)
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
163
164
DISP0_DAT9
T
KEY_COL1
GND
VDDARM_IN
GND
GND
GND
VDDSOC_IN
GND
NVCC_DRAM
GND
ENET_TXD0
DISP0_DAT20
DISP0_DAT19
DISP0_DAT17
DISP0_DAT14
U
NVCC_LVDS2P5
GND
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
NVCC_DRAM
GND
ENET_MDC
ENET_TX_EN
ENET_REF_CLK
ENET_MDIO
DISP0_DAT22
DISP0_DAT18
V
GND
GND
GND
GND
GND
GND
GND
DRAM_A4
GND
GND
GND
GND
GND
ENET_TXD1
ENET_RXD0
ENET_RXD1
ENET_RX_ER
DISP0_DAT23
DRAM_D63
W
DRAM_D20
DRAM_D21
DRAM_D19
DRAM_D25
DRAM_SDCKE0
DRAM_A15
DRAM_A7
DRAM_A3
DRAM_SDBA1
DRAM_CS0
DRAM_D36
DRAM_D37
DRAM_D40
DRAM_D44
DRAM_DQM7
DRAM_D59
DRAM_D62
GND
DRAM_D58
Y
GND
DRAM_D17
DRAM_D23
GND
DRAM_SDCKE1
DRAM_A14
GND
DRAM_A2
DRAM_A10
GND
DRAM_D32
DRAM_D33
GND
DRAM_D45
DRAM_D57
GND
DRAM_D61
DRAM_SDQS7_B
DRAM_SDQS7
AA
VDDARM_IN
GND
GPIO_3
GPIO_4
GPIO_8
GPIO_5
GPIO_7
GPIO_16
GPIO_17
R
2
1
10
9
8
7
6
5
4
GND
GND
12
VDDARM_CAP VDDARM_CAP 11
GND
VDDARM_IN
GND
NVCC_GPIO
GPIO_18
GPIO_19
CSI0_MCLK
CSI0_DATA_EN 3
CSI0_DAT5
CSI0_PIXCLK
P
DISP0_DAT12
DISP0_DAT11
DISP0_DAT15
ENET_CRS_DV DISP0_DAT16
DISP0_DAT21
GND
NVCC_DRAM
GND
VDDSOC_IN
GND
VDDSOC_CAP VDDSOC_CAP
R
DISP0_DAT5
DISP0_DAT7
DISP0_DAT6
DISP0_DAT8
DISP0_DAT10
DISP0_DAT13
NVCC_ENET
NVCC_DRAM
GND
VDDSOC_IN
GND
VDDARM_IN
P
DI0_PIN4
DISP0_DAT0
DISP0_DAT2
DISP0_DAT1
DISP0_DAT3
DISP0_DAT4
NVCC_LCD
GND
VDDPU_CAP
VDDSOC_IN
GND
VDDARM_IN
25
24
23
22
21
20
19
18
17
16
15
14
VDDSOC_CAP VDDSOC_CAP VDDARM_CAP VDDARM_CAP 13
GND
GND
VDDSOC_CAP VDDSOC_CAP VDDSOC_CAP
VDDARM_IN
GND
KEY_ROW3
KEY_COL4
KEY_ROW1
KEY_ROW0
KEY_COL2
DRAM_RESET
DRAM_D10
GPIO_0
GPIO_1
KEY_COL3
LVDS0_TX1_N
LVDS0_CLK_N
KEY_ROW2
LVDS1_CLK_P
LVDS1_TX3_P
GPIO_6
KEY_ROW4
LVDS0_TX1_P
LVDS0_CLK_P
GND
LVDS1_CLK_N
LVDS1_TX3_N
GPIO_9
KEY_COL0
LVDS0_TX0_N
LVDS0_TX2_N
LVDS0_TX3_N
LVDS1_TX0_P
LVDS1_TX1_N
GPIO_2
GND
LVDS0_TX0_P
LVDS0_TX2_P
LVDS0_TX3_P
LVDS1_TX0_N
LVDS1_TX1_P
T
DRAM_D3
U
V
W
Y
AA
Package Information and Contact Assignments
Table 104. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite (continued)
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
Freescale Semiconductor
6
7
8
9
11
12
13
14
15
16
DRAM_D14
DRAM_D16
DRAM_DQM2
DRAM_D18
DRAM_D27
DRAM_SDBA2
DRAM_A8
DRAM_A1
DRAM_RAS
DRAM_SDWE
DRAM_DQM1
DRAM_D15
DRAM_D22
DRAM_D28
DRAM_SDQS3
DRAM_D31
DRAM_A11
DRAM_A6
DRAM_A0
DRAM_SDBA0
DRAM_SDQS1
GND
DRAM_SDQS2
DRAM_D29
GND
DRAM_D30
DRAM_A12
GND
DRAM_SDQS1_B
DRAM_D11
DRAM_SDQS2_B
DRAM_D24
DRAM_DQM3
DRAM_D26
DRAM_A9
DRAM_A5
6
7
8
9
10
11
12
13
14 DRAM_SDCLK_1_B DRAM_SDCLK_1
15 DRAM_SDCLK_0_B DRAM_SDCLK_0
21
22
23
24
25
DRAM_D42
DRAM_D52
DRAM_D60
GND
DRAM_D56
DRAM_DQM5
DRAM_D47
DRAM_D48
DRAM_D53
DRAM_D51
DRAM_D55
DRAM_SDQS5
DRAM_D43
GND
DRAM_SDQS6
DRAM_DQM6
DRAM_D54
DRAM_SDQS5_B
DRAM_D46
DRAM_D49
DRAM_SDQS6_B
DRAM_D50
GND
20
21
22
23
24
25
AC
20
DRAM_D41
DRAM_D39
GND
DRAM_D35
19
AD
19
DRAM_D38
DRAM_D34
DRAM_SDQS4
DRAM_SDQS4_B
18
AE
18
DRAM_DQM4
DRAM_A13
DRAM_CS1
ZQPAD
17
AB
DRAM_SDODT1 17
DRAM_SDODT0
GND
DRAM_CAS
16
DRAM_SDQS3_B 10
5
DRAM_D12
DRAM_D6
DRAM_D2
GND
DRAM_D7
4
DRAM_D13
4
GND
DRAM_DQM0
DRAM_SDQS0_B
DRAM_SDQS0
3
DRAM_D8
3
LVDS1_TX2_P
DRAM_VREF
DRAM_D0
DRAM_D1
2
DRAM_D9
2
LVDS1_TX2_N
DRAM_D4
DRAM_D5
GND
1
5
1
AB
AC
AD
AE
Package Information and Contact Assignments
Table 104. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite (continued)
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
165
Revision History
7
Revision History
Table 105 provides a revision history for this data sheet.
Table 105. i.MX 6Solo/6DualLite Data Sheet Document Revision History
Rev.
Number
Rev. 3
Date
Substantive Changes
02/2014 • Updates throughout for Silicon revision C, including:
- Figure 1 Part number nomenclature diagram
- Table 1 Example Orderable Part Numbers
• Feature descriptions updated for:
- Camera sensors: updated from one to two ports at up to 240 MHz peak.
- Miscellaneous IPs and interfaces; SSI and ESAI.
• Table 3, Modules List, uSDHC 1–4 description change: including SDXC cards up to 2 TB.
• Table 3, Modules List, UART 1–5 description change: programmable baud rate up to 5 MHz.
• Table 4, Special Signal Considerations: XTALOSC_RTC_XTALI/RTC_XTALO: ending paragraph
removed. Was: “In case when high accuracy real time clock are not required system may use internal
low frequency ring oscillator. It is recommended to connect XTALOSC_RTC_XTALI to GND and keep
RTC_XTALO floating.”
• Table 9, Operating Ranges for Run mode LDO bypassed: Added footnote regarding alternate maximum
voltage on VDD_SOC_IN … this maximum can be 1.3V.
• Table 9, Operating Ranges Standby/DSM mode: Added footnote regarding alternate maximum voltage
on VDD_SOC_IN … this maximum can be 1.3V.
• Table 9, Operating Ranges GPIO supply voltages: Corrected supply name to NVCC_NANDF
• Table 9, Operating ranges: updated table footnotes for clarity.
• Removed table “On-Chip LDOs and their On-Chip Loads.”
• Section 4.1.4, External Clock Sources; added Note, “The internal RTC oscillator does not ...”.
• Section 4.1.5, Maximum Supply Currents: Reworded second paragraph about the power management
IC to explain that a robust thermal design is required for the increased system power dissipation.
• Table 11, Maximum Supply Currents: NVCC_RGMII Condition value corrected to N=6.
• Table 11, Maximum Supply Currents: Corrected supply name NVCC_NANDF.
• Table 11, Maximum Supply currents: Added row NVCC_LVDS2P5
• Section 4.2.1, Power-Up Sequence: Clarified wording of third bulleted item regarding POR control.
• Section 4.2.1, Power-Up Sequence: Removed Note.
• Section 4.2.1, Power-Up Sequence: Corrected bullet regarding VDD_ARM_CAP / VDD_SOC_CAP
difference from 50 mV to 100 mV.
• Section 4.5.2, OSC32K, second paragraph reworded to describe OSC32K automatic switching.
• Section 4.5.2, OSC32K, added Note following second paragraph to caution use of internal oscillator.
• Table 23, XTALI and RTC_XTALI DC parameters; changed RTC_XTALI Vih minimum value to 0.8.
• Table 23, XTALI and RTC_XTALI DC parameters; changed RTC_XTALI Vih maximum value to 1.1.
• Table 39, Reset Timing Parameters; removed rise/fall time requirement
• Section 4.9.3, External Interface Module; enhanced wording to first paragraph to describe operating
frequency for data transfers, and to explain register settings are valid for entire range of frequencies.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
166
Freescale Semiconductor
Revision History
Table 105. i.MX 6Solo/6DualLite Data Sheet Document Revision History (continued)
Rev.
Number
Date
Substantive Changes
Rev. 3
continued
2/2014
•
•
•
•
•
•
•
•
•
•
Rev. 2.2
8/2013
• 21x21 functional contact table: changed from NAND to NANDF
• System Timing Parameters Table 39, Reset timing parameter, CC1 description, change from:
"Duration of SRC_POR_B to be qualified as valid ( <= 5 ns)" to:
"Duration of SRC_POR_B to be qualified as valid"
and added a footnote to the parameter with the following text:
"SRC_POR_B rise and fall times must be 5 ns or less."
Rev. 2.1
5/2013 Substantive changes throughout this document are as follows:
• Incorporated standardized signal names. This change is extensive throughout.
• Added reference to EB792, i.MX Signal Name Mapping.
• Figures updated to align to standardized signal names.
• Updated references to eMMC standard to include 4.41.
• Added MediaLB (MLB) feature and DTCP module to the commercial temperature grade version.
• Figure 1 Part Number Nomenclature: Updates to Part differentiator section to align with Table 1.
• Table 1 “Orderable Part Numbers,” added ARM core information to the Options column:
2x “ARM Cortex-A9” 64-bit to 6DualLite
1x “ARM Cortex -A9” 32-bit to 6Solo
• Table 3 Changed reference to Global Power Controller to read General Power Controller.
• Table 9 “Operating Ranges,” added reference for information on product lifetime: i.MX 6Dual/6Quad
Product Usage Lifetime Estimates Application Note, AN4725.
• Table 11 “Maximum Supply Currents,” updated footnote 2.
• Table 12 Stop Mode Current and Power Consumption: Added SNVS Only mode
• Table 64 RGMII parameter TskewT minimum and maximum values corrected.
• Table 64 RGMII parameter TskewR units corrected.
• Table 101 Clarification of ENET_REF_CLK naming.
• Added Table 102, "Signals with Differing Before Reset and After Reset States," on page 156.
• Removed section, EIM Signal Cross Reference. Signal names are now aligned with reference manual.
• Removed table from Section 3.2, “Recommended Connections for Unused Analog Interfaces and
referenced the Hardware Development Guide.
• Section 1.2, “Features added bulleted item regarding the SOC-level memory system.
• Section 1.2, “Features Camera sensors: Changed Camera port to be up to 180 MHz peak.
• Added Section 1.3, “Updated Signal Naming Convention
• Section 4.2.1, “Power-Up Sequence” updated wording.
• Section 4.3.2, “Regulators for Analog Modules” section updates.
• Added Section 4.6.1, “XTALI and RTC_XTALI (Clock Inputs) DC Parameters.”
• Section 4.10, “General-Purpose Media Interface (GPMI) Timing” figures replaced, tables revised.
Rev. 2
Table 42, EIM Bus Timing Parameters; reworded footnotes for clarity.
Table 42, EIM Asynchronous Timing Parameters; removed comment from the Max heading cell.
Figure 65, Gated Clock Mode Timing Diagram: Corrected HSYNC trace behavior
Table 70, Video Signal Cross-Reference: Corrected naming of HSYNC and VSYNC
Section 4.11.22, USB PHY Parameters: Updated Battery Charging Specification bullet
Table 99, BGA Package Details: Corrected to read “21 x 21, 0.8 mm”.
Table 100, Supplies Contact Assignments: Corrected supply name NVCC_NANDF
Table 100, Supplies Contact Assignments: Updated NC rows to show i.MX 6DualLite vs. i.MX 6Solo
Table 101, Functional Contact Assignments: ALT5 Default function signal names corrected
Table 101, Functional Contact Assignments: PMIC_ON_REQ Out of Reset value corrected to “Open
Drain with PU (100K) enabled”
• Table 101, Functional Contact Assignments: TEST_MODE row included
• Table 101, Functional Contact Assignments: VDD_ARM_IN and ZQPAD row removed
05/2013 • Revision 2 was not published.
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 3
Freescale Semiconductor
167
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Information in this document is provided solely to enable system and software
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implementers to use Freescale products. There are no express or implied copyright
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freescale.com/support
information in this document.
licenses granted hereunder to design or fabricate any integrated circuits based on the
Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
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Document Number: IMX6SDLCEC
Rev. 3
03/2014