Production specification SILICON BRIDGE RECTIFIERS MB05S--MB10S FEATURES Pb z Glass：passivated chip junctions z High surge overload rating: 30A peak z Saves space on printed circuit boards z This series is UL recognized under Component Index, file number E239431 z Plastic material has U/L flammability classification94V-O z High temperature soldering guaranteed: 260°C/10 seconds at 5 lbs. (2.3kg) tension Lead-free MECHANICAL DATA z Case: Molded plastic body over passivated junctions z Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Maximum Ratings (@TA = 25°C unless otherwise specified) Characteristic Symbol MB05S MB1S MB2S MB4S MB6S MB8S MB10S UNITS Peak Repetitive Reverse Voltage VRRM 50 100 200 400 600 800 1000 V RMS Reverse Voltage VRMS 35 70 140 280 420 560 700 V DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward Output current @TA=25℃ IF(AV) 0.5 1) 0.8 2) A Peak forward surge current 8.3ms single half-sine-wave 30 IFSM A superimposed on rated load Thermal Characteristics Characteristic Symbol Typical junction capacitance per leg (NOTE 3) MB05S MB1S MB2S MB4S MB6S MB8S MB10S UNITS CJ 13 pF Current squared time t < 8.3ms , Ta = 25℃ 2 It 3.74 As Typical thermal resistance per leg (NOTE 1) R ΘJA 85 (NOTE 2) RθJL 20 TJ - 55 ---- + 150 ℃ TSTG - 55 ---- + 150 ℃ Operating junction temperature range Storage temperature range 2 ℃/W Electrical Characteristics (@TA = 25°C unless otherwise specified) Characteristic Maximum instantaneous forward voltage at 0.4 A Maximum reverse current @TA=25℃ at rated DC blocking voltage @TA=125℃ Symbol MB05S MB1S MB2S VF IR MB4S 1.0 5.0 100 MB6S MB8S MB10S UNITS V μA NOTES: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads (2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad (3) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts Document Number: MBS701AA www.gmicroelec.com 1 Production specification SILICON BRIDGE RECTIFIERS MB05S--MB10S PACKAGE OUTLINE DIMENSIONS MBS A + ~ ~ B - I D Dim Min Max A 4.40 4.80 B 3.40 3.80 C 2.35 2.65 D 6.50 7.00 E 0.15 0.35 F 0.90 1.50 F G K E H C G 0.20MAX H 2.50 2.80 I 0.50 0.80 K 2.30 2.70 All Dimensions in mm SOLDERING FOOTPRINT Unit ：mm PACKAGE INFORMATION Device Package Shipping MB05S--MB10S MBS 3000/Tape&Reel Document Number: MBS701AA www.gmicroelec.com 2 Production specification SILICON BRIDGE RECTIFIERS Document Number: MBS701AA MB05S--MB10S www.gmicroelec.com 3