HSMF-C146 Side View SMT ChipLED Data Sheet Feature: LED with AlInGaP and InGaN die Bicolor right angle chipLED Compatible with reflow soldering Tape in 8mm carrier tape on a 7 inch diameter reel Application: Backlighting Status indicator Front panel indicator Office automation, home appliances, industrial equipment Package Dimension Note: All dimensions are in mm. Tolerance ±0.1mm unless otherwise specified. Caution: LEDs are class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Absolute Maximum Value at TA = 25°C Parameter AlInGaP Red InGaN Blue Unit Forward current 30 20 mA Power dissipation 72 78 mW 1 Operating temperature -30 to 85 °C Storage temperature -40 to 85 °C Note: 1. Derate as shown in Figure 5. Optical Characteristics at TA = 25°C, IF = 20mA Luminous Intensity (mcd)1 Peak Wavelength (nm) Dominant Wavelength (nm)2 Viewing Angle (°)3 Min Typ Typ Typ Typ Red 18.0 79.0 644 632 110 Blue 28.5 75.0 459 464 110 Color Note: 1. 2. 3. The luminous intensity is measured at the mechanical axis of the lamp package which may not be aligned with the peak of the spatial radiation pattern. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. Θ1/2 is the off axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics at TA = 25°C Color Forward Voltage (V)1 Reverse Voltage (V)2 at 100μA Thermal Resistance Rθj-p (°C/W) Min Max Min Typ Red 1.6 2.9 5 400 Blue 2.9 3.9 5 300 Note: 1. 2. Forward voltage tolerance is ±0.1V. Reverse voltage Indicates product final testing, long terms reverse bias is not recommended. Luminous Intensity Bin Bin M N P Q R Tolerance for each bin limit is 15% Min (mcd) 18.0 28.5 45.0 71.5 112.5 Max (mcd) 28.5 45.0 71.5 112.5 180.0 Red Color Bin Bin Min (nm) 620 Tolerance for each bin limit is ± 1nm Max (nm) 635 Blue Color Bin Bin Min (nm) A 460 B 465 C 470 D 475 Tolerance for each bin limit is ± 0.5nm Max (nm) 465 470 475 480 30 1.0 0.9 RELATIVE INTENSITY FORWARD CURRENT - mA 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 25 20 15 10 5 0 380 480 580 680 WAVELENGTH - nm Figure 1. Spectrum 780 0 1 2 3 FORWARD VOLTAGE - V Figure 2. Forward current vs Forward voltage 4 1.0 1.4 0.9 NORMALIZED INTENSITY RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.6 1.2 1.0 0.8 0.6 0.4 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.2 0.1 0.0 0.0 0 5 10 15 20 25 FORWARD CURRENT - mA 30 -90 -60 -30 0 Figure 4. Radiation pattern 35 Forward Current-mA 30 25 20 15 10 5 0 10 20 30 40 50 60 70 80 90 Ambient Temperature-°C Figure 5. Derating curve Figure 7. Reel orientation 60 ANGULAR DISPLACEMENT - DEGREES Figure 3. Relative intensity vs Forward current 0 30 Figure 6. Recommended solder pad 90 Figure 8. Reel dimension Figure 9. Tape dimension Soldering Recommended reflow soldering condition: (a) Reflow soldering must not be done more than 2 times. Do observe necessary precautions of handling moisture sensitive device as stated in below section. (b) Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. (c) It is preferred to use reflow soldering to solder the LED. But if unavoidable (such as rework), manual hand soldering can be used but must be strictly controlled to condition below: Soldering iron tip temperature = 310°C max Soldering duration = 2sec max Number of cycle = 1 only Power of soldering iron = 50W max (d) Do not touch the LED package body with the soldering iron except for the soldering terminals as it may cause damage to the LED. (e) User is advised to confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. PRECAUTIONARY NOTES 1. Handling of moisture sensitive device This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. (a) Before use - An unopened moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity Indicator Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is recommended that the MBB not be opened prior to assembly (e.g. for IQC). (b) Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C / 60%RH at all times and all high temperature related processes including soldering, curing or rework need to be completed within 672 hours. (c) Control for unfinished reel - Unused LEDs must be stored in a sealed MBB with desiccant or desiccator at <5%RH. (d) Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure that all LEDs have not exceeded their floor life of 672 hours. (e) Baking is required if: - The HIC indicator is not blue at 10% and is pink at 5%. - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LED floor life exceeded 672hrs. The recommended baking condition is: 60±5ºC for 20hrs Baking should only be done once. Disclaimer Avago’s products are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved.