REJ09B0027-0500
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
16
H8/3687Group
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8 Family/H8/300H Tiny Series
H8/3687N
H8/3687F
H8/3687
H8/3686
H8/3685
H8/3684F
H8/3684
H8/3683
H8/3682
HD64N3687G,
HD64F3687,
HD6433687,
HD6433686,
HD6433685,
HD64F3684,
HD6433684,
HD6433683,
HD6433682,
Rev.5.00
Revision Date: Nov. 02, 2005
HD6483687G,
HD64F3687G,
HD6433687G,
HD6433686G,
HD6433685G,
HD64F3684G,
HD6433684G,
HD6433683G,
HD6433682G
Rev.5.00 Nov. 02, 2005 Page ii of xxxii
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any thirdparty's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
Rev.5.00 Nov. 02, 2005 Page iii of xxxii
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a passthrough current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system’s
operation is not guaranteed if they are accessed.
Rev.5.00 Nov. 02, 2005 Page iv of xxxii
Configuration of This Manual
This manual comprises the following items:
1.
2.
3.
4.
5.
6.
General Precautions on Handling of Product
Configuration of This Manual
Preface
Contents
Overview
Description of Functional Modules
• CPU and System-Control Modules
• On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
7. List of Registers
8. Electrical Characteristics
9. Appendix
10. Main Revisions and Additions in this Edition (only for revised versions)
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
11. Index
Rev.5.00 Nov. 02, 2005 Page v of xxxii
Preface
The H8/3687 Group are single-chip microcomputers made up of the high-speed H8/300H CPU
employing Renesas Technology original architecture as their cores, and the peripheral functions
required to configure a system. The H8/300H CPU has an instruction set that is compatible with
the H8/300 CPU.
Target Users: This manual was written for users who will be using the H8/3687 Group in the
design of application systems. Target users are expected to understand the
fundamentals of electrical circuits, logical circuits, and microcomputers.
Objective:
This manual was written to explain the hardware functions and electrical
characteristics of the H8/3687 Group to the target users.
Refer to the H8/300H Series Software Manual for a detailed description of the
instruction set.
Notes on reading this manual:
• In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions and electrical characteristics.
• In order to understand the details of the CPU's functions
Read the H8/300H Series Software Manual.
• In order to understand the details of a register when its name is known
Read the index that is the final part of the manual to find the page number of the entry on the
register. The addresses, bits, and initial values of the registers are summarized in section 22,
List of Registers.
Example:
Register name:
Bit order:
The following notation is used for cases when the same or a
similar function, e.g. serial communication interface, is
implemented on more than one channel:
XXX_N (XXX is the register name and N is the channel
number)
The MSB is on the left and the LSB is on the right.
Notes:
When using the on-chip emulator (E7, E8) for H8/3687 program development and debugging, the
following restrictions must be noted.
Rev.5.00 Nov. 02, 2005 Page vi of xxxii
1. The NMI pin is reserved for the E7 or E8, and cannot be used.
2. Pins P85, P86, and P87 cannot be used. In order to use these pins, additional hardware must be
provided on the user board.
3. Area H'D000 to H'DFFF is used by the E7 or E8, and is not available to the user.
4. Area H'F780 to H'FB7F must on no account be accessed.
5. When the E7 or E8 is used, address breaks can be set as either available to the user or for use
by the E7 or E8. If address breaks are set as being used by the E7 or E8, the address break
control registers must not be accessed.
6. When the E7 or E8 is used, NMI is an input/output pin (open-drain in output mode), P85 and
P87 are input pins, and P86 is an output pin.
7. Use channel 1 of the SCI3 (P21/RXD, P22/TXD) in on-board programming mode by boot
mode.
Related Manuals:
The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require.
http://www.renesas.com/
H8/3687 Group manuals:
Document Title
Document No.
H8/3687 Group Hardware Manual
This manual
H8/300H Series Software Manual
REJ09B0213
User's manuals for development tools:
Document Title
Document No.
H8S, H8/300 Series C/C++ Compiler, Assembler, Optimizing Linkage Editor
User's Manual
REJ10B0058
Microcomputer Development Environment System H8S, H8/300 Series
Simulator/Debugger User's Manual
ADE-702-282
H8S, H8/300 Series High-Performance Embedded Workshop 3, Tutorial
REJ10B0024
H8S, H8/300 Series High-Performance Embedded Workshop 3, User's
Manual
REJ10B0026
Rev.5.00 Nov. 02, 2005 Page vii of xxxii
Application notes:
Document Title
Document No.
H8S, H8/300 Series C/C++ Compiler Package Application Note
TM
Single Power Supply F-ZTAT On-Board Programming
Rev.5.00 Nov. 02, 2005 Page viii of xxxii
REJ05B0464
ADE-502-055
Rev.5.00 Nov. 02, 2005 Page ix of xxxii
Contents
Section 1 Overview ............................................................................................... 1
1.1
1.2
1.3
1.4
Features.................................................................................................................................. 1
Internal Block Diagram.......................................................................................................... 3
Pin Arrangement .................................................................................................................... 5
Pin Functions ......................................................................................................................... 7
Section 2 CPU ..................................................................................................... 11
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Address Space and Memory Map ........................................................................................ 12
Register Configuration......................................................................................................... 15
2.2.1 General Registers.................................................................................................... 16
2.2.2 Program Counter (PC) ............................................................................................ 17
2.2.3 Condition-Code Register (CCR)............................................................................. 17
Data Formats........................................................................................................................ 19
2.3.1 General Register Data Formats............................................................................... 19
2.3.2 Memory Data Formats ............................................................................................ 21
Instruction Set ...................................................................................................................... 22
2.4.1 Table of Instructions Classified by Function .......................................................... 22
2.4.2 Basic Instruction Formats ....................................................................................... 32
Addressing Modes and Effective Address Calculation........................................................ 33
2.5.1 Addressing Modes .................................................................................................. 33
2.5.2 Effective Address Calculation ................................................................................ 36
Basic Bus Cycle ................................................................................................................... 38
2.6.1 Access to On-Chip Memory (RAM, ROM)............................................................ 38
2.6.2 On-Chip Peripheral Modules .................................................................................. 39
CPU States ........................................................................................................................... 40
Usage Notes ......................................................................................................................... 41
2.8.1 Notes on Data Access to Empty Areas ................................................................... 41
2.8.2 EEPMOV Instruction.............................................................................................. 41
2.8.3 Bit-Manipulation Instruction .................................................................................. 41
Section 3 Exception Handling ............................................................................. 47
3.1
3.2
Exception Sources and Vector Address ............................................................................... 48
Register Descriptions........................................................................................................... 49
3.2.1 Interrupt Edge Select Register 1 (IEGR1) .............................................................. 50
3.2.2 Interrupt Edge Select Register 2 (IEGR2) .............................................................. 51
3.2.3 Interrupt Enable Register 1 (IENR1) ...................................................................... 52
3.2.4 Interrupt Enable Register 2 (IENR2) ...................................................................... 53
Rev.5.00 Nov. 02, 2005 Page x of xxxii
3.3
3.4
3.5
3.2.5 Interrupt Flag Register 1 (IRR1)............................................................................. 53
3.2.6 Interrupt Flag Register 2 (IRR2)............................................................................. 55
3.2.7 Wakeup Interrupt Flag Register (IWPR) ................................................................ 55
Reset Exception Handling.................................................................................................... 57
Interrupt Exception Handling............................................................................................... 57
3.4.1 External Interrupts .................................................................................................. 57
3.4.2 Internal Interrupts ................................................................................................... 59
3.4.3 Interrupt Handling Sequence .................................................................................. 59
3.4.4 Interrupt Response Time......................................................................................... 60
Usage Notes ......................................................................................................................... 62
3.5.1 Interrupts after Reset............................................................................................... 62
3.5.2 Notes on Stack Area Use ........................................................................................ 62
3.5.3 Notes on Rewriting Port Mode Registers ............................................................... 62
Section 4 Address Break......................................................................................63
4.1
4.2
Register Descriptions ........................................................................................................... 63
4.1.1 Address Break Control Register (ABRKCR) ......................................................... 64
4.1.2 Address Break Status Register (ABRKSR) ............................................................ 65
4.1.3 Break Address Registers (BARH, BARL).............................................................. 65
4.1.4 Break Data Registers (BDRH, BDRL) ................................................................... 66
Operation ............................................................................................................................. 66
Section 5 Clock Pulse Generators........................................................................69
5.1
5.2
5.3
5.4
System Clock Generator ...................................................................................................... 70
5.1.1 Connecting Crystal Resonator ................................................................................ 70
5.1.2 Connecting Ceramic Resonator .............................................................................. 71
5.1.3 External Clock Input Method.................................................................................. 71
Subclock Generator.............................................................................................................. 72
5.2.1 Connecting 32.768-kHz Crystal Resonator............................................................. 72
5.2.2 Pin Connection when Not Using Subclock............................................................. 73
Prescalers ............................................................................................................................. 73
5.3.1 Prescaler S .............................................................................................................. 73
5.3.2 Prescaler W............................................................................................................. 73
Usage Notes ......................................................................................................................... 74
5.4.1 Note on Resonators................................................................................................. 74
5.4.2 Notes on Board Design ........................................................................................... 74
Section 6 Power-Down Modes ............................................................................75
6.1
Register Descriptions ........................................................................................................... 75
6.1.1 System Control Register 1 (SYSCR1) .................................................................... 76
Rev.5.00 Nov. 02, 2005 Page xi of xxxii
6.2
6.3
6.4
6.5
6.1.2 System Control Register 2 (SYSCR2) .................................................................... 78
6.1.3 Module Standby Control Register 1 (MSTCR1) .................................................... 79
6.1.4 Module Standby Control Register 2 (MSTCR2) .................................................... 80
Mode Transitions and States of LSI..................................................................................... 80
6.2.1 Sleep Mode ............................................................................................................. 84
6.2.2 Standby Mode......................................................................................................... 84
6.2.3 Subsleep Mode........................................................................................................ 84
6.2.4 Subactive Mode ...................................................................................................... 85
Operating Frequency in Active Mode.................................................................................. 85
Direct Transition .................................................................................................................. 86
6.4.1 Direct Transition from Active Mode to Subactive Mode ....................................... 86
6.4.2 Direct Transition from Subactive Mode to Active Mode ....................................... 86
Module Standby Function.................................................................................................... 87
Section 7 ROM .................................................................................................... 89
7.1
7.2
7.3
7.4
7.5
7.6
7.7
Block Configuration ............................................................................................................ 89
Register Descriptions........................................................................................................... 91
7.2.1 Flash Memory Control Register 1 (FLMCR1) ....................................................... 91
7.2.2 Flash Memory Control Register 2 (FLMCR2) ....................................................... 92
7.2.3 Erase Block Register 1 (EBR1) .............................................................................. 93
7.2.4 Flash Memory Power Control Register (FLPWCR)............................................... 94
7.2.5 Flash Memory Enable Register (FENR)................................................................. 94
On-Board Programming Modes........................................................................................... 95
7.3.1 Boot Mode .............................................................................................................. 95
7.3.2 Programming/Erasing in User Program Mode........................................................ 98
Flash Memory Programming/Erasing................................................................................ 100
7.4.1 Program/Program-Verify ...................................................................................... 100
7.4.2 Erase/Erase-Verify................................................................................................ 102
7.4.3 Interrupt Handling when Programming/Erasing Flash Memory........................... 103
Program/Erase Protection .................................................................................................. 105
7.5.1 Hardware Protection ............................................................................................. 105
7.5.2 Software Protection .............................................................................................. 105
7.5.3 Error Protection .................................................................................................... 105
Programmer Mode ............................................................................................................. 106
Power-Down States for Flash Memory.............................................................................. 106
Section 8 RAM .................................................................................................. 107
Section 9 I/O Ports............................................................................................. 109
9.1
Port 1.................................................................................................................................. 109
Rev.5.00 Nov. 02, 2005 Page xii of xxxii
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.1.1 Port Mode Register 1 (PMR1) .............................................................................. 110
9.1.2 Port Control Register 1 (PCR1) ............................................................................ 111
9.1.3 Port Data Register 1 (PDR1)................................................................................. 111
9.1.4 Port Pull-Up Control Register 1 (PUCR1)............................................................ 112
9.1.5 Pin Functions ........................................................................................................ 112
Port 2.................................................................................................................................. 115
9.2.1 Port Control Register 2 (PCR2) ............................................................................ 115
9.2.2 Port Data Register 2 (PDR2)................................................................................. 116
9.2.3 Port Mode Register 3 (PMR3) .............................................................................. 116
9.2.4 Pin Functions ........................................................................................................ 117
Port 3.................................................................................................................................. 119
9.3.1 Port Control Register 3 (PCR3) ............................................................................ 119
9.3.2 Port Data Register 3 (PDR3)................................................................................. 120
9.3.3 Pin Functions ........................................................................................................ 120
Port 5.................................................................................................................................. 122
9.4.1 Port Mode Register 5 (PMR5) .............................................................................. 123
9.4.2 Port Control Register 5 (PCR5) ............................................................................ 124
9.4.3 Port Data Register 5 (PDR5)................................................................................. 124
9.4.4 Port Pull-Up Control Register 5 (PUCR5)............................................................ 125
9.4.5 Pin Functions ........................................................................................................ 125
Port 6.................................................................................................................................. 128
9.5.1 Port Control Register 6 (PCR6) ............................................................................ 128
9.5.2 Port Data Register 6 (PDR6)................................................................................. 129
9.5.3 Pin Functions ........................................................................................................ 129
Port 7.................................................................................................................................. 134
9.6.1 Port Control Register 7 (PCR7) ............................................................................ 134
9.6.2 Port Data Register 7 (PDR7)................................................................................. 135
9.6.3 Pin Functions ........................................................................................................ 135
Port 8.................................................................................................................................. 137
9.7.1 Port Control Register 8 (PCR8) ............................................................................ 137
9.7.2 Port Data Register 8 (PDR8)................................................................................. 137
9.7.3 Pin Functions ........................................................................................................ 138
Port B ................................................................................................................................. 139
9.8.1 Port Data Register B (PDRB) ............................................................................... 139
Section 10 Realtime Clock (RTC) .....................................................................141
10.1 Features.............................................................................................................................. 141
10.2 Input/Output Pin................................................................................................................. 142
10.3 Register Descriptions ......................................................................................................... 143
10.3.1 Second Data Register/Free Running Counter Data Register (RSECDR) ............. 143
Rev.5.00 Nov. 02, 2005 Page xiii of xxxii
10.3.2 Minute Data Register (RMINDR) ........................................................................ 144
10.3.3 Hour Data Register (RHRDR) .............................................................................. 145
10.3.4 Day-of-Week Data Register (RWKDR) ............................................................... 146
10.3.5 RTC Control Register 1 (RTCCR1) ..................................................................... 147
10.3.6 RTC Control Register 2 (RTCCR2) ..................................................................... 148
10.3.7 Clock Source Select Register (RTCCSR)............................................................. 149
10.4 Operation ........................................................................................................................... 150
10.4.1 Initial Settings of Registers after Power-On ......................................................... 150
10.4.2 Initial Setting Procedure ....................................................................................... 150
10.4.3 Data Reading Procedure ....................................................................................... 151
10.5 Interrupt Source ................................................................................................................. 152
Section 11 Timer B1.......................................................................................... 153
11.1 Features.............................................................................................................................. 153
11.2 Input/Output Pin ................................................................................................................ 154
11.3 Register Descriptions......................................................................................................... 154
11.3.1 Timer Mode Register B1 (TMB1) ........................................................................ 155
11.3.2 Timer Counter B1 (TCB1).................................................................................... 155
11.3.3 Timer Load Register B1 (TLB1) .......................................................................... 156
11.4 Operation ........................................................................................................................... 156
11.4.1 Interval Timer Operation ...................................................................................... 156
11.4.2 Auto-Reload Timer Operation .............................................................................. 156
11.4.3 Event Counter Operation ...................................................................................... 157
11.5 Timer B1 Operating Modes ............................................................................................... 157
Section 12 Timer V ........................................................................................... 159
12.1 Features.............................................................................................................................. 159
12.2 Input/Output Pins............................................................................................................... 161
12.3 Register Descriptions......................................................................................................... 161
12.3.1 Timer Counter V (TCNTV).................................................................................. 161
12.3.2 Time Constant Registers A and B (TCORA, TCORB) ........................................ 161
12.3.3 Timer Control Register V0 (TCRV0) ................................................................... 162
12.3.4 Timer Control/Status Register V (TCSRV) .......................................................... 164
12.3.5 Timer Control Register V1 (TCRV1) ................................................................... 165
12.4 Operation ........................................................................................................................... 166
12.4.1 Timer V Operation................................................................................................ 166
12.5 Timer V Application Examples ......................................................................................... 170
12.5.1 Pulse Output with Arbitrary Duty Cycle............................................................... 170
12.5.2 Pulse Output with Arbitrary Pulse Width and Delay from TRGV Input .............. 171
12.6 Usage Notes ....................................................................................................................... 172
Rev.5.00 Nov. 02, 2005 Page xiv of xxxii
Section 13 Timer Z ............................................................................................175
13.1 Features.............................................................................................................................. 175
13.2 Input/Output Pins ............................................................................................................... 180
13.3 Register Descriptions ......................................................................................................... 181
13.3.1 Timer Start Register (TSTR) ................................................................................ 182
13.3.2 Timer Mode Register (TMDR) ............................................................................. 183
13.3.3 Timer PWM Mode Register (TPMR) ................................................................... 184
13.3.4 Timer Function Control Register (TFCR)............................................................. 185
13.3.5 Timer Output Master Enable Register (TOER) .................................................... 187
13.3.6 Timer Output Control Register (TOCR)............................................................... 188
13.3.7 Timer Counter (TCNT)......................................................................................... 189
13.3.8 General Registers A, B, C, and D (GRA, GRB, GRC, and GRD)........................ 190
13.3.9 Timer Control Register (TCR).............................................................................. 191
13.3.10 Timer I/O Control Register (TIORA and TIORC)................................................ 192
13.3.11 Timer Status Register (TSR)................................................................................. 194
13.3.12 Timer Interrupt Enable Register (TIER) ............................................................... 196
13.3.13 PWM Mode Output Level Control Register (POCR) ........................................... 197
13.3.14 Interface with CPU ............................................................................................... 197
13.4 Operation ........................................................................................................................... 199
13.4.1 Counter Operation................................................................................................. 199
13.4.2 Waveform Output by Compare Match.................................................................. 203
13.4.3 Input Capture Function ......................................................................................... 207
13.4.4 Synchronous Operation......................................................................................... 210
13.4.5 PWM Mode .......................................................................................................... 211
13.4.6 Reset Synchronous PWM Mode ........................................................................... 217
13.4.7 Complementary PWM Mode................................................................................ 221
13.4.8 Buffer Operation ................................................................................................... 230
13.4.9 Timer Z Output Timing ........................................................................................ 237
13.5 Interrupts............................................................................................................................ 240
13.5.1 Status Flag Set Timing.......................................................................................... 240
13.5.2 Status Flag Clearing Timing ................................................................................. 242
13.6 Usage Notes ....................................................................................................................... 242
Section 14 Watchdog Timer ..............................................................................251
14.1 Features.............................................................................................................................. 251
14.2 Register Descriptions ......................................................................................................... 251
14.2.1 Timer Control/Status Register WD (TCSRWD)................................................... 252
14.2.2 Timer Counter WD (TCWD)................................................................................ 253
14.2.3 Timer Mode Register WD (TMWD) .................................................................... 253
14.3 Operation ........................................................................................................................... 254
Rev.5.00 Nov. 02, 2005 Page xv of xxxii
Section 15 14-Bit PWM .................................................................................... 255
15.1 Features.............................................................................................................................. 255
15.2 Input/Output Pin ................................................................................................................ 256
15.3 Register Descriptions......................................................................................................... 256
15.3.1 PWM Control Register (PWCR) .......................................................................... 256
15.3.2 PWM Data Registers U and L (PWDRU, PWDRL)............................................. 257
15.4 Operation ........................................................................................................................... 257
Section 16 Serial Communication Interface 3 (SCI3)....................................... 259
16.1 Features.............................................................................................................................. 259
16.2 Input/Output Pins............................................................................................................... 262
16.3 Register Descriptions......................................................................................................... 262
16.3.1 Receive Shift Register (RSR) ............................................................................... 263
16.3.2 Receive Data Register (RDR)............................................................................... 263
16.3.3 Transmit Shift Register (TSR) .............................................................................. 263
16.3.4 Transmit Data Register (TDR).............................................................................. 263
16.3.5 Serial Mode Register (SMR) ................................................................................ 264
16.3.6 Serial Control Register 3 (SCR3) ......................................................................... 265
16.3.7 Serial Status Register (SSR) ................................................................................. 267
16.3.8 Bit Rate Register (BRR) ....................................................................................... 269
16.4 Operation in Asynchronous Mode ..................................................................................... 276
16.4.1 Clock..................................................................................................................... 276
16.4.2 SCI3 Initialization................................................................................................. 277
16.4.3 Data Transmission ................................................................................................ 278
16.4.4 Serial Data Reception ........................................................................................... 280
16.5 Operation in Clocked Synchronous Mode ......................................................................... 284
16.5.1 Clock..................................................................................................................... 284
16.5.2 SCI3 Initialization................................................................................................. 284
16.5.3 Serial Data Transmission ...................................................................................... 285
16.5.4 Serial Data Reception (Clocked Synchronous Mode) .......................................... 288
16.5.5 Simultaneous Serial Data Transmission and Reception........................................ 290
16.6 Multiprocessor Communication Function.......................................................................... 292
16.6.1 Multiprocessor Serial Data Transmission ............................................................. 294
16.6.2 Multiprocessor Serial Data Reception .................................................................. 295
16.7 Interrupts............................................................................................................................ 299
16.8 Usage Notes ....................................................................................................................... 300
16.8.1 Break Detection and Processing ........................................................................... 300
16.8.2 Mark State and Break Sending ............................................................................. 300
16.8.3 Receive Error Flags and Transmit Operations
(Clocked Synchronous Mode Only) ..................................................................... 300
Rev.5.00 Nov. 02, 2005 Page xvi of xxxii
16.8.4 Receive Data Sampling Timing and Reception
Margin in Asynchronous Mode ............................................................................ 301
Section 17 I2C Bus Interface 2 (IIC2) ................................................................303
17.1 Features.............................................................................................................................. 303
17.2 Input/Output Pins ............................................................................................................... 305
17.3 Register Descriptions ......................................................................................................... 305
17.3.1 I2C Bus Control Register 1 (ICCR1)..................................................................... 306
17.3.2 I2C Bus Control Register 2 (ICCR2)..................................................................... 308
17.3.3 I2C Bus Mode Register (ICMR)............................................................................ 309
17.3.4 I2C Bus Interrupt Enable Register (ICIER) ........................................................... 311
17.3.5 I2C Bus Status Register (ICSR)............................................................................. 313
17.3.6 Slave Address Register (SAR).............................................................................. 316
17.3.7 I2C Bus Transmit Data Register (ICDRT)............................................................. 317
17.3.8 I2C Bus Receive Data Register (ICDRR).............................................................. 317
17.3.9 I2C Bus Shift Register (ICDRS)............................................................................ 317
17.4 Operation ........................................................................................................................... 318
17.4.1 I2C Bus Format...................................................................................................... 318
17.4.2 Master Transmit Operation ................................................................................... 319
17.4.3 Master Receive Operation..................................................................................... 321
17.4.4 Slave Transmit Operation ..................................................................................... 323
17.4.5 Slave Receive Operation....................................................................................... 325
17.4.6 Clocked Synchronous Serial Format..................................................................... 327
17.4.7 Noise Canceler...................................................................................................... 329
17.4.8 Example of Use..................................................................................................... 330
17.5 Interrupt Request................................................................................................................ 334
17.6 Bit Synchronous Circuit..................................................................................................... 335
17.7 Usage Notes ....................................................................................................................... 336
17.7.1 Issue (Retransmission) of Start/Stop Conditions .................................................. 336
17.7.2 WAIT Setting in I2C Bus Mode Register (ICMR) ................................................ 336
Section 18 A/D Converter..................................................................................337
18.1 Features.............................................................................................................................. 337
18.2 Input/Output Pins ............................................................................................................... 339
18.3 Register Descriptions ......................................................................................................... 340
18.3.1 A/D Data Registers A to D (ADDRA to ADDRD) .............................................. 340
18.3.2 A/D Control/Status Register (ADCSR) ................................................................ 341
18.3.3 A/D Control Register (ADCR) ............................................................................. 342
18.4 Operation ........................................................................................................................... 343
18.4.1 Single Mode.......................................................................................................... 343
Rev.5.00 Nov. 02, 2005 Page xvii of xxxii
18.4.2 Scan Mode ............................................................................................................ 343
18.4.3 Input Sampling and A/D Conversion Time .......................................................... 344
18.4.4 External Trigger Input Timing.............................................................................. 345
18.5 A/D Conversion Accuracy Definitions .............................................................................. 346
18.6 Usage Notes ....................................................................................................................... 348
18.6.1 Permissible Signal Source Impedance .................................................................. 348
18.6.2 Influences on Absolute Accuracy ......................................................................... 348
Section 19 EEPROM......................................................................................... 349
19.1 Features.............................................................................................................................. 349
19.2 Input/Output Pins............................................................................................................... 351
19.3 Register Description .......................................................................................................... 351
19.3.1 EEPROM Key Register (EKR)............................................................................. 351
19.4 Operation ........................................................................................................................... 352
19.4.1 EEPROM Interface............................................................................................... 352
19.4.2 Bus Format and Timing ........................................................................................ 352
19.4.3 Start Condition...................................................................................................... 352
19.4.4 Stop Condition ...................................................................................................... 353
19.4.5 Acknowledge ........................................................................................................ 353
19.4.6 Slave Addressing .................................................................................................. 353
19.4.7 Write Operations................................................................................................... 354
19.4.8 Acknowledge Polling............................................................................................ 356
19.4.9 Read Operation ..................................................................................................... 356
19.5 Usage Notes ....................................................................................................................... 359
19.5.1 Data Protection at VCC On/Off............................................................................... 359
19.5.2 Write/Erase Endurance ......................................................................................... 359
19.5.3 Noise Suppression Time ....................................................................................... 359
Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional).. 361
20.1 Features.............................................................................................................................. 361
20.2 Register Descriptions......................................................................................................... 362
20.2.1 Low-Voltage-Detection Control Register (LVDCR)............................................ 362
20.2.2 Low-Voltage-Detection Status Register (LVDSR)............................................... 364
20.3 Operation ........................................................................................................................... 365
20.3.1 Power-On Reset Circuit ........................................................................................ 365
20.3.2 Low-Voltage Detection Circuit............................................................................. 366
Section 21 Power Supply Circuit ...................................................................... 371
21.1 When Using Internal Power Supply Step-Down Circuit ................................................... 371
21.2 When Not Using Internal Power Supply Step-Down Circuit............................................. 372
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Section 22 List of Registers ...............................................................................373
22.1 Register Addresses (Address Order).................................................................................. 374
22.2 Register Bits....................................................................................................................... 381
22.3 Registers States in Each Operating Mode .......................................................................... 386
Section 23 Electrical Characteristics .................................................................391
23.1 Absolute Maximum Ratings .............................................................................................. 391
23.2 Electrical Characteristics
(F-ZTAT™ Version, EEPROM Stacked F-ZTATTM Version).......................................... 391
23.2.1 Power Supply Voltage and Operating Ranges ...................................................... 391
23.2.2 DC Characteristics ................................................................................................ 394
23.2.3 AC Characteristics ................................................................................................ 400
23.2.4 A/D Converter Characteristics .............................................................................. 404
23.2.5 Watchdog Timer Characteristics........................................................................... 405
23.2.6 Flash Memory Characteristics .............................................................................. 406
23.2.7 EEPROM Characteristics...................................................................................... 408
23.2.8 Power-Supply-Voltage Detection Circuit Characteristics (Optional) ................... 409
23.2.9 Power-On Reset Circuit Characteristics (Optional) .............................................. 409
23.3 Electrical Characteristics
(Mask-ROM Version, EEPROM Stacked Mask-ROM Version)....................................... 410
23.3.1 Power Supply Voltage and Operating Ranges ...................................................... 410
23.3.2 DC Characteristics ................................................................................................ 413
23.3.3 AC Characteristics ................................................................................................ 420
23.3.4 A/D Converter Characteristics .............................................................................. 424
23.3.5 Watchdog Timer Characteristics........................................................................... 425
23.3.6 EEPROM Characteristics...................................................................................... 426
23.3.7 Power-Supply-Voltage Detection Circuit Characteristics (Optional) ................... 427
23.3.8 Power-On Reset Circuit Characteristics (Optional) .............................................. 428
23.4 Operation Timing............................................................................................................... 428
23.5 Output Load Condition ...................................................................................................... 431
Appendix A Instruction Set ...............................................................................433
A.1
A.2
A.3
A.4
Instruction List................................................................................................................... 433
Operation Code Map.......................................................................................................... 448
Number of Execution States .............................................................................................. 451
Combinations of Instructions and Addressing Modes ....................................................... 462
Appendix B I/O Port Block Diagrams ...............................................................463
B.1
B.2
I/O Port Block Diagrams.................................................................................................... 463
Port States in Each Operating State ................................................................................... 485
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Appendix C Product Code Lineup .................................................................... 486
Appendix D Package Dimensions ..................................................................... 488
Appendix E EEPROM Stacked-Structure Cross-Sectional View ..................... 490
Main Revisions and Additions in this Edition..................................................... 491
Index .................................................................................................................. 497
Rev.5.00 Nov. 02, 2005 Page xx of xxxii
Figures
Section 1 Overview
Figure 1.1 Internal Block Diagram of H8/3687 Group of F-ZTAT TM
and Mask-ROM Versions.............................................................................................. 3
Figure 1.2 Internal Block Diagram of H8/3687N (EEPROM Stacked Version) ............................ 4
Figure 1.3 Pin Arrangement of H8/3687 Group of F-ZTATTM and Mask-ROM Versions
(FP-64E, FP-64A) ......................................................................................................... 5
Figure 1.4 Pin Arrangement of H8/3687N (EEPROM Stacked Version) (FP-64E)....................... 6
Section 2 CPU
Figure 2.1 Memory Map (1) ......................................................................................................... 12
Figure 2.1 Memory Map (2) ......................................................................................................... 13
Figure 2.1 Memory Map (3) ......................................................................................................... 14
Figure 2.2 CPU Registers ............................................................................................................. 15
Figure 2.3 Usage of General Registers ......................................................................................... 16
Figure 2.4 Relationship between Stack Pointer and Stack Area ................................................... 17
Figure 2.5 General Register Data Formats (1).............................................................................. 19
Figure 2.5 General Register Data Formats (2).............................................................................. 20
Figure 2.6 Memory Data Formats................................................................................................. 21
Figure 2.7 Instruction Formats...................................................................................................... 32
Figure 2.8 Branch Address Specification in Memory Indirect Mode ........................................... 36
Figure 2.9 On-Chip Memory Access Cycle.................................................................................. 38
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access)..................................... 39
Figure 2.11 CPU Operation States................................................................................................ 40
Figure 2.12 State Transitions ........................................................................................................ 41
Figure 2.13 Example of Timer Configuration with Two Registers Allocated
to Same Address........................................................................................................ 42
Section 3
Figure 3.1
Figure 3.2
Figure 3.3
Figure 3.4
Exception Handling
Reset Sequence............................................................................................................ 58
Stack Status after Exception Handling ........................................................................ 60
Interrupt Sequence....................................................................................................... 61
Port Mode Register Setting and Interrupt Request Flag Clearing Procedure .............. 62
Section 4
Figure 4.1
Figure 4.2
Figure 4.2
Address Break
Block Diagram of Address Break................................................................................ 63
Address Break Interrupt Operation Example (1)......................................................... 66
Address Break Interrupt Operation Example (2)......................................................... 67
Rev.5.00 Nov. 02, 2005 Page xxi of xxxii
Section 5 Clock Pulse Generators
Figure 5.1 Block Diagram of Clock Pulse Generators.................................................................. 69
Figure 5.2 Block Diagram of System Clock Generator ................................................................ 70
Figure 5.3 Typical Connection to Crystal Resonator.................................................................... 70
Figure 5.4 Equivalent Circuit of Crystal Resonator...................................................................... 70
Figure 5.5 Typical Connection to Ceramic Resonator.................................................................. 71
Figure 5.6 Example of External Clock Input ................................................................................ 71
Figure 5.7 Block Diagram of Subclock Generator ....................................................................... 72
Figure 5.8 Typical Connection to 32.768-kHz Crystal Resonator................................................ 72
Figure 5.9 Equivalent Circuit of 32.768-kHz Crystal Resonator.................................................. 72
Figure 5.10 Pin Connection when not Using Subclock ................................................................ 73
Figure 5.11 Example of Incorrect Board Design .......................................................................... 74
Section 6 Power-Down Modes
Figure 6.1 Mode Transition Diagram ........................................................................................... 81
Section 7
Figure 7.1
Figure 7.2
Figure 7.3
Figure 7.4
ROM
Flash Memory Block Configuration............................................................................ 90
Programming/Erasing Flowchart Example in User Program Mode............................ 99
Program/Program-Verify Flowchart ......................................................................... 101
Erase/Erase-Verify Flowchart ................................................................................... 104
Section 9
Figure 9.1
Figure 9.2
Figure 9.3
Figure 9.4
Figure 9.5
Figure 9.6
Figure 9.7
Figure 9.8
I/O Ports
Port 1 Pin Configuration............................................................................................ 109
Port 2 Pin Configuration............................................................................................ 115
Port 3 Pin Configuration............................................................................................ 119
Port 5 Pin Configuration............................................................................................ 122
Port 6 Pin Configuration............................................................................................ 128
Port 7 Pin Configuration............................................................................................ 134
Port 8 Pin Configuration............................................................................................ 137
Port B Pin Configuration........................................................................................... 139
Section 10
Figure 10.1
Figure 10.2
Figure 10.3
Figure 10.4
Realtime Clock (RTC)
Block Diagram of RTC ........................................................................................... 142
Definition of Time Expression ................................................................................ 147
Initial Setting Procedure.......................................................................................... 150
Example: Reading of Inaccurate Time Data............................................................ 151
Section 11 Timer B1
Figure 11.1 Block Diagram of Timer B1.................................................................................... 153
Section 12 Timer V
Figure 12.1 Block Diagram of Timer V ..................................................................................... 160
Rev.5.00 Nov. 02, 2005 Page xxii of xxxii
Figure 12.2 Increment Timing with Internal Clock .................................................................... 167
Figure 12.3 Increment Timing with External Clock ................................................................... 167
Figure 12.4 OVF Set Timing ...................................................................................................... 167
Figure 12.5 CMFA and CMFB Set Timing ................................................................................ 168
Figure 12.6 TMOV Output Timing ............................................................................................ 168
Figure 12.7 Clear Timing by Compare Match............................................................................ 168
Figure 12.8 Clear Timing by TMRIV Input ............................................................................... 169
Figure 12.9 Pulse Output Example ............................................................................................. 170
Figure 12.10 Example of Pulse Output Synchronized to TRGV Input....................................... 171
Figure 12.11 Contention between TCNTV Write and Clear ...................................................... 172
Figure 12.12 Contention between TCORA Write and Compare Match ..................................... 173
Figure 12.13 Internal Clock Switching and TCNTV Operation ................................................. 173
Section 13
Figure 13.1
Figure 13.2
Figure 13.3
Figure 13.4
Timer Z
Timer Z Block Diagram .......................................................................................... 177
Timer Z (Channel 0) Block Diagram ...................................................................... 178
Timer Z (Channel 1) Block Diagram ...................................................................... 179
Example of Outputs in Reset Synchronous PWM Mode
and Complementary PWM Mode............................................................................ 186
Figure 13.5 Accessing Operation of 16-Bit Register (between CPU and TCNT (16 bits)) ........ 197
Figure 13.6 Accessing Operation of 8-Bit Register (between CPU and TSTR (8 bits))............. 198
Figure 13.7 Example of Counter Operation Setting Procedure .................................................. 199
Figure 13.8 Free-Running Counter Operation ............................................................................ 200
Figure 13.9 Periodic Counter Operation..................................................................................... 201
Figure 13.10 Count Timing at Internal Clock Operation............................................................ 201
Figure 13.11 Count Timing at External Clock Operation (Both Edges Detected)...................... 202
Figure 13.12 Example of Setting Procedure for Waveform Output by Compare Match............ 203
Figure 13.13 Example of 0 Output/1 Output Operation ............................................................. 204
Figure 13.14 Example of Toggle Output Operation ................................................................... 205
Figure 13.15 Output Compare Timing........................................................................................ 206
Figure 13.16 Example of Input Capture Operation Setting Procedure ....................................... 207
Figure 13.17 Example of Input Capture Operation..................................................................... 208
Figure 13.18 Input Capture Signal Timing ................................................................................. 209
Figure 13.19 Example of Synchronous Operation Setting Procedure ........................................ 210
Figure 13.20 Example of Synchronous Operation...................................................................... 211
Figure 13.21 Example of PWM Mode Setting Procedure .......................................................... 212
Figure 13.22 Example of PWM Mode Operation (1) ................................................................. 213
Figure 13.23 Example of PWM Mode Operation (2) ................................................................. 214
Figure 13.24 Example of PWM Mode Operation (3) ................................................................. 215
Figure 13.25 Example of PWM Mode Operation (4) ................................................................. 216
Figure 13.26 Example of Reset Synchronous PWM Mode Setting Procedure........................... 218
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Figure 13.27 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 1) ...... 219
Figure 13.28 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 0) ...... 220
Figure 13.29 Example of Complementar y PWM Mode Setting Procedure............................... 222
Figure 13.30 Canceling Procedure of Complementary PWM Mode.......................................... 223
Figure 13.31 Example of Complementary PWM Mode Operation (1) ...................................... 224
Figure 13.32 (1) Example of Complementary PWM Mode Operation
(TPSC2 = TPSC1 = TPSC0 = 0) (2) ................................................................ 225
Figure 13.32 (2) Example of Complementary PWM Mode Operation
(TPSC2 = TPSC1 = TPSC0 ≠ 0) (3) ................................................................ 226
Figure 13.33 Timing of Overshooting ........................................................................................ 227
Figure 13.34 Timing of Undershooting ...................................................................................... 227
Figure 13.35 Compare Match Buffer Operation......................................................................... 230
Figure 13.36 Input Capture Buffer Operation............................................................................. 231
Figure 13.37 Example of Buffer Operation Setting Procedure................................................... 231
Figure 13.38 Example of Buffer Operation (1)
(Buffer Operation for Output Compare Register) ................................................. 232
Figure 13.39 Example of Compare Match Timing for Buffer Operation ................................... 233
Figure 13.40 Example of Buffer Operation (2)
(Buffer Operation for Input Capture Register) ...................................................... 234
Figure 13.41 Input Capture Timing of Buffer Operation............................................................ 235
Figure 13.42 Buffer Operation (3) (Buffer Operation in Complementary
PWM Mode CMD1 = CMD0 = 1) ........................................................................ 236
Figure 13.43 Buffer Operation (4) (Buffer Operation in
Complementary PWM Mode CMD1 = CMD0 = 1).............................................. 237
Figure 13.44 Example of Output Disable Timing of Timer Z by Writing to TOER .................. 238
Figure 13.45 Example of Output Disable Timing of Timer Z by External Trigger.................... 238
Figure 13.46 Example of Output Inverse Timing of Timer Z by Writing to TFCR ................... 239
Figure 13.47 Example of Output Inverse Timing of Timer Z by Writing to POCR................... 239
Figure 13.48 IMF Flag Set Timing when Compare Match Occurs ............................................ 240
Figure 13.49 IMF Flag Set Timing at Input Capture .................................................................. 241
Figure 13.50 OVF Flag Set Timing ............................................................................................ 241
Figure 13.51 Status Flag Clearing Timing.................................................................................. 242
Figure 13.52 Contention between TCNT Write and Clear Operations....................................... 242
Figure 13.53 Contention between TCNT Write and Increment Operations ............................... 243
Figure 13.54 Contention between GR Write and Compare Match............................................. 244
Figure 13.55 Contention between TCNT Write and Overflow................................................... 245
Figure 13.56 Contention between GR Read and Input Capture.................................................. 246
Figure 13.57 Contention between Count Clearing and Increment
Operations by Input Capture ................................................................................ 247
Figure 13.58 Contention between GR Write and Input Capture................................................. 248
Rev.5.00 Nov. 02, 2005 Page xxiv of xxxii
Figure 13.59 When Compare Match and Bit Manipulation Instruction to TOCR
Occur at the Same Timing..................................................................................... 250
Section 14 Watchdog Timer
Figure 14.1 Block Diagram of Watchdog Timer ........................................................................ 251
Figure 14.2 Watchdog Timer Operation Example...................................................................... 254
Section 15 14-Bit PWM
Figure 15.1 Block Diagram of 14-Bit PWM .............................................................................. 255
Figure 15.2 Waveform Output by 14-Bit PWM ......................................................................... 258
Section 16
Figure 16.1
Figure 16.2
Figure 16.3
Serial Communication Interface 3 (SCI3)
Block Diagram of SCI3 ........................................................................................... 261
Data Format in Asynchronous Communication ...................................................... 276
Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode) (Example with 8-Bit Data, Parity, Two Stop Bits) ............. 276
Figure 16.4 Sample SCI3 Initialization Flowchart ..................................................................... 277
Figure 16.5 Example of SCI3 Transmission in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit) ........................................................................... 278
Figure 16.6 Sample Serial Transmission Data Flowchart (Asynchronous Mode)...................... 279
Figure 16.7 Example of SCI3 Reception in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit) ........................................................................... 280
Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode) (1)...................... 282
Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode) (2)...................... 283
Figure 16.9 Data Format in Clocked Synchronous Communication .......................................... 284
Figure 16.10 Example of SCI3 Transmission in Clocked Synchronous Mode........................... 286
Figure 16.11 Sample Serial Transmission Flowchart (Clocked Synchronous Mode) ................ 287
Figure 16.12 Example of SCI3 Reception in Clocked Synchronous Mode................................ 288
Figure 16.13 Sample Serial Reception Flowchart (Clocked Synchronous Mode)...................... 289
Figure 16.14 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
(Clocked Synchronous Mode)............................................................................... 291
Figure 16.15 Example of Inter-Processor Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A) .......................................... 293
Figure 16.16 Sample Multiprocessor Serial Transmission Flowchart ........................................ 294
Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (1)........................................ 296
Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (2)........................................ 297
Figure 16.18 Example of SCI3 Reception Using Multiprocessor Format
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit).............................. 298
Figure 16.19 Receive Data Sampling Timing in Asynchronous Mode ...................................... 301
Section 17 I2C Bus Interface 2 (IIC2)
Figure 17.1 Block Diagram of I2C Bus Interface 2..................................................................... 304
Rev.5.00 Nov. 02, 2005 Page xxv of xxxii
Figure 17.2 External Circuit Connections of I/O Pins ................................................................ 305
Figure 17.3 I2C Bus Formats ...................................................................................................... 318
Figure 17.4 I2C Bus Timing........................................................................................................ 318
Figure 17.5 Master Transmit Mode Operation Timing (1)......................................................... 320
Figure 17.6 Master Transmit Mode Operation Timing (2)......................................................... 320
Figure 17.7 Master Receive Mode Operation Timing (1) .......................................................... 322
Figure 17.8 Master Receive Mode Operation Timing (2) .......................................................... 323
Figure 17.9 Slave Transmit Mode Operation Timing (1) ........................................................... 324
Figure 17.10 Slave Transmit Mode Operation Timing (2) ......................................................... 325
Figure 17.11 Slave Receive Mode Operation Timing (1)........................................................... 326
Figure 17.12 Slave Receive Mode Operation Timing (2)........................................................... 326
Figure 17.13 Clocked Synchronous Serial Transfer Format....................................................... 327
Figure 17.14 Transmit Mode Operation Timing......................................................................... 328
Figure 17.15 Receive Mode Operation Timing .......................................................................... 329
Figure 17.16 Block Diagram of Noise Conceler ........................................................................ 329
Figure 17.17 Sample Flowchart for Master Transmit Mode ...................................................... 330
Figure 17.18 Sample Flowchart for Master Receive Mode ........................................................ 331
Figure 17.19 Sample Flowchart for Slave Transmit Mode......................................................... 332
Figure 17.20 Sample Flowchart for Slave Receive Mode .......................................................... 333
Figure 17.21 The Timing of the Bit Synchronous Circuit .......................................................... 335
Section 18
Figure 18.1
Figure 18.2
Figure 18.3
Figure 18.4
Figure 18.5
Figure 18.6
A/D Converter
Block Diagram of A/D Converter ........................................................................... 338
A/D Conversion Timing.......................................................................................... 344
External Trigger Input Timing ................................................................................ 345
A/D Conversion Accuracy Definitions (1).............................................................. 347
A/D Conversion Accuracy Definitions (2).............................................................. 347
Analog Input Circuit Example ................................................................................ 348
Section 19
Figure 19.1
Figure 19.2
Figure 19.3
Figure 19.4
Figure 19.5
Figure 19.6
Figure 19.7
EEPROM
Block Diagram of EEPROM................................................................................... 350
EEPROM Bus Format and Bus Timing .................................................................. 352
Byte Write Operation .............................................................................................. 355
Page Write Operation .............................................................................................. 356
Current Address Read Operation............................................................................. 357
Random Address Read Operation ........................................................................... 358
Sequential Read Operation (when current address read is used)............................. 358
Section 20
Figure 20.1
Figure 20.2
Figure 20.3
Power-On Reset and Low-Voltage Detection Circuits (Optional)
Block Diagram of Power-On Reset Circuit and Low-Voltage Detection Circuit.... 362
Operational Timing of Power-On Reset Circuit...................................................... 366
Operational Timing of LVDR Circuit ..................................................................... 367
Rev.5.00 Nov. 02, 2005 Page xxvi of xxxii
Figure 20.4 Operational Timing of LVDI Circuit....................................................................... 368
Figure 20.5 Timing for Operation/Release of Low-Voltage Detection Circuit .......................... 369
Section 21 Power Supply Circuit
Figure 21.1 Power Supply Connection when Internal Step-Down Circuit is Used .................... 371
Figure 21.2 Power Supply Connection when Internal Step-Down Circuit is Not Used ............. 372
Section 23
Figure 23.1
Figure 23.2
Figure 23.3
Figure 23.4
Figure 23.5
Figure 23.6
Figure 23.7
Figure 23.8
Electrical Characteristics
System Clock Input Timing..................................................................................... 428
RES Low Width Timing.......................................................................................... 429
Input Timing............................................................................................................ 429
I2C Bus Interface Input/Output Timing ................................................................... 429
SCK3 Input Clock Timing....................................................................................... 430
SCI Input/Output Timing in Clocked Synchronous Mode ...................................... 430
EEPROM Bus Timing............................................................................................. 431
Output Load Circuit................................................................................................. 431
Appendix B I/O Port Block Diagrams
Figure B.1 Port 1 Block Diagram (P17) ..................................................................................... 463
Figure B.2 Port 1 Block Diagram (P14, P16) ............................................................................. 464
Figure B.3 Port 1 Block Diagram (P15) ..................................................................................... 465
Figure B.4 Port 1 Block Diagram (P12) ..................................................................................... 466
Figure B.5 Port 2 Block Diagram (P11) ..................................................................................... 467
Figure B.6 Port 1 Block Diagram (P10) ..................................................................................... 468
Figure B.7 Port 2 Block Diagram (P24, P23) ............................................................................. 469
Figure B.8 Port 2 Block Diagram (P22) ..................................................................................... 470
Figure B.9 Port 2 Block Diagram (P21) ..................................................................................... 471
Figure B.10 Port 2 Block Diagram (P20) ................................................................................... 472
Figure B.11 Port 3 Block Diagram (P37 to P30) ........................................................................ 473
Figure B.12 Port 5 Block Diagram (P57, P56) ........................................................................... 474
Figure B.13 Port 5 Block Diagram (P55) ................................................................................... 475
Figure B.14 Port 5 Block Diagram (P54 to P50) ........................................................................ 476
Figure B.15 Port 6 Block Diagram (P67 to P60) ........................................................................ 477
Figure B.16 Port 7 Block Diagram (P76) ................................................................................... 478
Figure B.17 Port 7 Block Diagram (P75) ................................................................................... 479
Figure B.18 Port 7 Block Diagram (P74) ................................................................................... 480
Figure B.19 Port 7 Block Diagram (P72) ................................................................................... 481
Figure B.20 Port 7 Block Diagram (P71) ................................................................................... 482
Figure B.21 Port 7 Block Diagram (P70) ................................................................................... 482
Figure B.22 Port 8 Block Diagram (P87 to P85) ........................................................................ 483
Figure B.23 Port B Block Diagram (PB7 to PB0) ...................................................................... 484
Rev.5.00 Nov. 02, 2005 Page xxvii of xxxii
Appendix D Package Dimensions
Figure D.1 FP-64E Package Dimensions ................................................................................... 488
Figure D.2 FP-64A Package Dimensions ................................................................................... 489
Appendix E EEPROM Stacked-Structure Cross-Sectional View
Figure E.1 EEPROM Stacked-Structure Cross-Sectional View ................................................. 490
Rev.5.00 Nov. 02, 2005 Page xxviii of xxxii
Tables
Section 1 Overview
Table 1.1
Pin Functions ............................................................................................................ 7
Section 2 CPU
Table 2.1
Operation Notation ................................................................................................. 22
Table 2.2
Data Transfer Instructions....................................................................................... 23
Table 2.3
Arithmetic Operations Instructions (1) ................................................................... 24
Table 2.3
Arithmetic Operations Instructions (2) ................................................................... 25
Table 2.4
Logic Operations Instructions................................................................................. 26
Table 2.5
Shift Instructions..................................................................................................... 26
Table 2.6
Bit Manipulation Instructions (1)............................................................................ 27
Table 2.6
Bit Manipulation Instructions (2)............................................................................ 28
Table 2.7
Branch Instructions ................................................................................................. 29
Table 2.8
System Control Instructions.................................................................................... 30
Table 2.9
Block Data Transfer Instructions ............................................................................ 31
Table 2.10
Addressing Modes .................................................................................................. 33
Table 2.11
Absolute Address Access Ranges ........................................................................... 35
Table 2.12
Effective Address Calculation (1)........................................................................... 36
Table 2.12
Effective Address Calculation (2)........................................................................... 37
Section 3 Exception Handling
Table 3.1
Exception Sources and Vector Address .................................................................. 48
Table 3.2
Interrupt Wait States ............................................................................................... 60
Section 4 Address Break
Table 4.1
Access and Data Bus Used ..................................................................................... 65
Section 5 Clock Pulse Generators
Table 5.1
Crystal Resonator Parameters ................................................................................. 71
Section 6 Power-Down Modes
Table 6.1
Operating Frequency and Waiting Time................................................................. 77
Table 6.2
Transition Mode after SLEEP Instruction Execution
and Transition Mode due to Interrupt ..................................................................... 82
Table 6.3
Internal State in Each Operating Mode................................................................... 83
Section 7 ROM
Table 7.1
Setting Programming Modes .................................................................................. 95
Table 7.2
Boot Mode Operation ............................................................................................. 97
Table 7.3
System Clock Frequencies for which Automatic Adjustment
of LSI Bit Rate is Possible ...................................................................................... 98
Rev.5.00 Nov. 02, 2005 Page xxix of xxxii
Table 7.4
Table 7.5
Table 7.6
Table 7.7
Reprogram Data Computation Table .................................................................... 102
Additional-Program Data Computation Table ...................................................... 102
Programming Time ............................................................................................... 102
Flash Memory Operating States............................................................................ 106
Section 10 Realtime Clock (RTC)
Table 10.1
Pin Configuration.................................................................................................. 142
Table 10.2
Interrupt Source .................................................................................................... 152
Section 11 Timer B1
Table 11.1
Pin Configuration.................................................................................................. 154
Table 11.2
Timer B1 Operating Modes .................................................................................. 157
Section 12 Timer V
Table 12.1
Pin Configuration.................................................................................................. 161
Table 12.2
Clock Signals to Input to TCNTV and Counting Conditions ............................... 163
Section 13 Timer Z
Table 13.1
Timer Z Functions ................................................................................................ 176
Table 13.2
Pin Configuration.................................................................................................. 180
Table 13.3
Initial Output Level of FTIOB0 Pin...................................................................... 212
Table 13.4
Output Pins in Reset Synchronous PWM Mode................................................... 217
Table 13.5
Register Settings in Reset Synchronous PWM Mode........................................... 217
Table 13.6
Output Pins in Complementary PWM Mode........................................................ 221
Table 13.7
Register Settings in Complementary PWM Mode................................................ 221
Table 13.8
Register Combinations in Buffer Operation ......................................................... 230
Section 15 14-Bit PWM
Table 15.1
Pin Configuration.................................................................................................. 256
Section 16 Serial Communication Interface 3 (SCI3)
Table 16.1
Channel Configuration.......................................................................................... 260
Table 16.2
Pin Configuration.................................................................................................. 262
Table 16.3
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1) ...... 270
Table 16.3
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2) ...... 271
Table 16.3
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (3) ...... 272
Table 16.4
Maximum Bit Rate for Each Frequency (Asynchronous Mode) .......................... 273
Table 16.5
Examples of BRR Settings for Various Bit Rates
(Clocked Synchronous Mode) (1)......................................................................... 274
Table 16.5
Examples of BRR Settings for Various Bit Rates
(Clocked Synchronous Mode) (2)......................................................................... 275
Table 16.6
SSR Status Flags and Receive Data Handling ...................................................... 281
Table 16.7
SCI3 Interrupt Requests........................................................................................ 299
Rev.5.00 Nov. 02, 2005 Page xxx of xxxii
Section 17 I2C Bus Interface 2 (IIC2)
Table 17.1
I2C Bus Interface Pins........................................................................................... 305
Table 17.2
Transfer Rate ........................................................................................................ 307
Table 17.3
Interrupt Requests ................................................................................................. 334
Table 17.4
Time for Monitoring SCL..................................................................................... 335
Section 18 A/D Converter
Table 18.1
Pin Configuration.................................................................................................. 339
Table 18.2
Analog Input Channels and Corresponding ADDR Registers .............................. 340
Table 18.3
A/D Conversion Time (Single Mode)................................................................... 345
Section 19 EEPROM
Table 19.1
Pin Configuration.................................................................................................. 351
Table 19.2
Slave Addresses .................................................................................................... 354
Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
Table 20.1
LVDCR Settings and Select Functions................................................................. 364
Section 23 Electrical Characteristics
Table 23.1
Absolute Maximum Ratings ................................................................................. 391
Table 23.2
DC Characteristics (1)........................................................................................... 394
Table 23.2
DC Characteristics (2)........................................................................................... 398
Table 23.2
DC Characteristics (3)........................................................................................... 399
Table 23.3
AC Characteristics ................................................................................................ 400
Table 23.4
I2C Bus Interface Timing ...................................................................................... 402
Table 23.5
Serial Communication Interface (SCI) Timing..................................................... 403
Table 23.6
A/D Converter Characteristics .............................................................................. 404
Table 23.7
Watchdog Timer Characteristics........................................................................... 405
Table 23.8
Flash Memory Characteristics .............................................................................. 406
Table 23.9
EEPROM Characteristics...................................................................................... 408
Table 23.10
Power-Supply-Voltage Detection Circuit Characteristics................................. 409
Table 23.11
Power-On Reset Circuit Characteristics............................................................ 409
Table 23.12
DC Characteristics (1)....................................................................................... 413
Table 23.12
DC Characteristics (2)....................................................................................... 418
Table 23.12
DC Characteristics (3)....................................................................................... 419
Table 23.13
AC Characteristics ............................................................................................ 420
Table 23.14
I2C Bus Interface Timing .................................................................................. 422
Table 23.15
Serial Communication Interface (SCI) Timing................................................. 423
Table 23.16
A/D Converter Characteristics .......................................................................... 424
Table 23.17
Watchdog Timer Characteristics....................................................................... 425
Table 23.18
EEPROM Characteristics.................................................................................. 426
Table 23.19
Power-Supply-Voltage Detection Circuit Characteristics................................. 427
Rev.5.00 Nov. 02, 2005 Page xxxi of xxxii
Table 23.20
Appendix A
Table A.1
Table A.2
Table A.2
Table A.2
Table A.3
Table A.4
Table A.5
Power-On Reset Circuit Characteristics ........................................................... 428
Instruction Set
Instruction Set....................................................................................................... 435
Operation Code Map (1) ....................................................................................... 448
Operation Code Map (2) ....................................................................................... 449
Operation Code Map (3) ....................................................................................... 450
Number of Cycles in Each Instruction.................................................................. 452
Number of Cycles in Each Instruction.................................................................. 453
Combinations of Instructions and Addressing Modes .......................................... 462
Rev.5.00 Nov. 02, 2005 Page xxxii of xxxii
Section 1 Overview
Section 1 Overview
1.1
Features
• High-speed H8/300H central processing unit with an internal 16-bit architecture
Upward-compatible with H8/300 CPU on an object level
Sixteen 16-bit general registers
62 basic instructions
• Various peripheral functions
RTC (can be used as a free running counter)
Timer B1 (8-bit timer)
Timer V (8-bit timer)
Timer Z (16-bit timer)
14-bit PWM
Watchdog timer
SCI (Asynchronous or clocked synchronous serial communication interface) × 2 channels
I2C Bus Interface (conforms to the I2C bus interface format that is advocated by Philips
Electronics)
10-bit A/D converter
Rev.5.00 Nov. 02, 2005 Page 1 of 500
REJ09B0027-0500
Section 1 Overview
• On-chip memory
Model
Standard
Version
Product Classification
On-Chip PowerOn Reset and
Low-Voltage
Detecting Circuit
Version
ROM
RAM
HD64F3687G
4 kbytes
Flash memory version
TM
(F-ZTAT version)
H8/3687F HD64F3687
H8/3684F HD64F3684
HD64F3684G
32 kbytes
4 kbytes
Mask-ROM version
H8/3687
HD6433687
HD6433687G
56 kbytes
3 kbytes
H8/3686
HD6433686
HD6433686G
48 kbytes
3 kbytes
H8/3685
HD6433685
HD6433685G
40 kbytes
3 kbytes
H8/3684
HD6433684
HD6433684G
32 kbytes
3 kbytes
H8/3683
HD6433683
HD6433683G
24 kbytes
3 kbytes
H8/3682
HD6433682
HD6433682G
16 kbytes
3 kbytes
H8/3687N
HD64N3687G
56 kbytes
4 kbytes
HD6483687G
56 kbytes
3 kbytes
EEPROM
stacked
version
(512 bytes)
Flash
memory
version
Mask-ROM
version
56 kbytes
Remarks
• General I/O ports
I/O pins: 45 I/O pins (43 I/O pins for H8/3687N), including 8 large current ports (IOL = 20
mA, @VOL = 1.5 V)
Input-only pins: 8 input pins (also used for analog input)
• EEPROM interface (only for H8/3687N)
I2C bus interface (conforms to the I2C bus interface format that is advocated by Philips
Electronics)
• Supports various power-down states
Note: F-ZTATTM is a trademark of Renesas Technology Corp.
• Compact package
Package
Code
LQFP-64
FP-64E
QFP-64
FP-64A
Only LQFP-64 (FP-64E) for H8/3687N package
Rev.5.00 Nov. 02, 2005 Page 2 of 500
REJ09B0027-0500
Body Size
Pin Pitch
10.0 × 10.0 mm
0.5 mm
14.0 × 14.0 mm
0.8 mm
Section 1 Overview
P57/SCL
P56/SDA
P55/WKP5/ADTRG
P54/WKP4
P53/WKP3
P52/WKP2
P51/WKP1
P50/WKP0
NMI
TEST
RES
VSS
VCL
VCC
OSC1
OSC2
CPU
H8/300H
Port 6
P76/TMOV
P75/TMCIV
P74/TMRIV
P72/TXD_2
P71/RXD_2
P70/SCK3_2
Port 1
P67/FTIOD1
P66/FTIOC1
P65/FTIOB1
P64/FTIOA1
P63/FTIOD0
P62/FTIOC0
P61/FTIOB0
P60/FTIOA0
Port 7
Data bus (lower)
RAM
ROM
IIC2
RTC
SCI3
14-bit
PWM
SCI3_2
Timer Z
Watchdog
timer
Timer V
Port 8
P30
P31
P32
P33
P34
P35
P36
P37
System
clock
generator
Port 2
P20/SCK3
P21/RXD
P22/TXD
P23
P24
Subclock
generator
Port 3
P10/TMOW
P11/PWM
P12
P14/IRQ0
P15/IRQ1/TMIB1
P16/IRQ2
P17/IRQ3/TRGV
X1
X2
Internal Block Diagram
Port 5
1.2
Timer B1
P87
P86
P85
A/D converter
Data bus (upper)
Address bus
AVCC
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
Port B
Figure 1.1 Internal Block Diagram of H8/3687 Group of F-ZTAT TM
and Mask-ROM Versions
Rev.5.00 Nov. 02, 2005 Page 3 of 500
REJ09B0027-0500
NMI
TEST
RES
VSS
VCC
VCL
OSC1
OSC2
Port 6
P76/TMOV
P75/TMCIV
P74/TMRIV
P72/TXD_2
P71/RXD_2
P70/SCK3_2
Port 1
P67/FTIOD1
P66/FTIOC1
P65/FTIOB1
P64/FTIOA1
P63/FTIOD0
P62/FTIOC0
P61/FTIOB0
P60/FTIOA0
Port 7
Data bus (lower)
RAM
ROM
Port 2
IIC2
RTC
SCI3
14-bit
PWM
SCI3_2
Timer Z
Watchdog
timer
Timer V
Timer B1
A/D converter
POR/LVD
(optional)
Port 8
P57/SCL
P56/SDA
P55/WKP5/ADTRG
P54/WKP4
P53/WKP3
P52/WKP2
P51/WKP1
P50/WKP0
CPU
H8/300H
P87
P86
P85
I2C bus
P30
P31
P32
P33
P34
P35
P36
P37
System
clock
generator
Port 3
P20/SCK3
P21/RXD
P22/TXD
P23
P24
Subclock
generator
Port 5
P10/TMOW
P11/PWM
P12
P14/IRQ0
P15/IRQ1/TMIB1
P16/IRQ2
P17/IRQ3/TRGV
X1
X2
Section 1 Overview
SDA
SCL
Data bus (upper)
Address bus
EEPROM
AVCC
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
Port B
Note: The HD64N3687G is a stacked-structure product in which an EEPROM chip is mounted on the HD64F3687G (F-ZTATTM version).
The HD6483687G is a stacked-structure product in which an EEPROM chip is mounted on the HD6433687G (mask-ROM version).
Figure 1.2 Internal Block Diagram of H8/3687N (EEPROM Stacked Version)
Rev.5.00 Nov. 02, 2005 Page 4 of 500
REJ09B0027-0500
Section 1 Overview
P62/FTIOC0
P61/FTIOB0
NMI
P60/FTIOA0
P64/FTIOA1
P65/FTIOB1
P66/FTIOC1
P67/FTIOD1
P85
P86
P87
P20/SCK3
P21/RXD
P22/TXD
P23
Pin Arrangement
P70/SCK3_2
1.3
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
P71/RXD_2
49
32
P63/FTIOD0
P72/TXD_2
50
31
P24
P14/IRQ0
51
30
P76/TMOV
P15/IRQ1/TMIB1
52
29
P75/TMCIV
P16/IRQ2
53
28
P74/TMRIV
P17/IRQ3/TRGV
54
27
P57/SCL
P33
55
26
P56/SDA
P32
56
25
P12
P31
57
24
P11/PWM
P30
58
23
P10/TMOW
PB3/AN3
59
22
P55/WKP5/ADTRG
PB2/AN2
60
21
P54/WKP4
PB1/AN1
61
20
P53/WKP3
PB0/AN0
62
19
P52/WKP2
PB4/AN4
63
18
P37
PB5/AN5
64
17
P36
H8/3687 Group
8
9 10 11 12 13 14 15 16
PB7/AN7
AVcc
X2
X1
VCL
RES
TEST
Vss
P35
7
P34
6
P51/WKP1
5
P50/WKP0
4
Vcc
3
OSC1
2
OSC2
1
PB6/AN6
Top View
Figure 1.3 Pin Arrangement of H8/3687 Group of F-ZTATTM and Mask-ROM Versions
(FP-64E, FP-64A)
Rev.5.00 Nov. 02, 2005 Page 5 of 500
REJ09B0027-0500
P62/FTIOC0
P61/FTIOB0
NMI
P60/FTIOA0
P64/FTIOA1
P65/FTIOB1
P66/FTIOC1
P67/FTIOD1
P85
P86
P87
P20/SCK3
P21/RXD
P22/TXD
P23
P70/SCK3_2
Section 1 Overview
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
P71/RXD_2
49
32
P63/FTIOD0
P72/TXD_2
50
31
P24
P14/IRQ0
51
30
P76/TMOV
P15/IRQ1/TMIB1
52
29
P75/TMCIV
P16/IRQ2
53
28
P74/TMRIV
P17/IRQ3/TRGV
54
27
SCL
P33
55
26
SDA
P32
56
25
P12
P31
57
24
P11/PWM
P30
58
23
P10/TMOW
PB3/AN3
59
22
P55/WKP5/ADTRG
PB2/AN2
60
21
P54/WKP4
PB1/AN1
61
20
P53/WKP3
PB0/AN0
62
19
P52/WKP2
PB4/AN4
63
18
P37
PB5/AN5
64
17
P36
H8/3687N
8
9 10 11 12 13 14 15 16
PB7/AN7
AVcc
X2
X1
VCL
RES
TEST
Vss
P35
7
P34
6
P51/WKP1
5
P50/WKP0
4
Vcc
3
OSC1
2
OSC2
1
PB6/AN6
Top View
Figure 1.4 Pin Arrangement of H8/3687N (EEPROM Stacked Version)
(FP-64E)
Rev.5.00 Nov. 02, 2005 Page 6 of 500
REJ09B0027-0500
Section 1 Overview
1.4
Pin Functions
Table 1.1
Pin Functions
Pin No.
Type
FP-64E
FP-64A
I/O
Functions
12
Input
Power supply pin. Connect this pin to the
system power supply.
VSS
9
Input
Ground pin. Connect this pin to the system
power supply (0V).
AVCC
3
Input
Analog power supply pin for the A/D converter.
When the A/D converter is not used, connect
this pin to the system power supply.
VCL
6
Input
Internal step-down power supply pin. Connect a
capacitor of around 0.1 µF between this pin and
the Vss pin for stabilization.
OSC1
11
Input
OSC2
10
Output
These pins connect with crystal or ceramic
resonator for the system clock, or can be used
to input an external clock.
Symbol
Power
VCC
source pins
Clock pins
See section 5, Clock Pulse Generators, for a
typical connection.
X1
5
Input
X2
4
Output
RES
7
Input
Reset pin. The pull-up resistor (typ. 150 kΩ) is
incorporated. When driven low, the chip is reset.
TEST
8
Input
Test pin. Connect this pin to Vss.
NMI
35
Input
Non-maskable interrupt request input pin. Be
sure to pull-up by a pull-up resistor.
IRQ0 to
IRQ3
51 to 54
Input
External interrupt request input pins. Can select
the rising or falling edge.
WKP0 to
WKP5
13, 14,
19 to 22
Input
External interrupt request input pins. Can select
the rising or falling edge.
RTC
TMOW
23
Output
This is an output pin for divided clocks.
Timer B1
TMIB1
52
Input
External event input pin.
System
control
Interrupt
pins
These pins connect with a 32.768 kHz crystal
resonator for the subclock. See section 5, Clock
Pulse Generators, for a typical connection.
Rev.5.00 Nov. 02, 2005 Page 7 of 500
REJ09B0027-0500
Section 1 Overview
Pin No.
Type
Symbol
FP-64E
FP-64A
I/O
Functions
Timer V
TMOV
30
Output
This is an output pin for waveforms generated
by the output compare function.
TMCIV
29
Input
External event input pin.
TMRIV
28
Input
Counter reset input pin.
TRGV
54
Input
Counter start trigger input pin.
FTIOA0
36
I/O
Output compare output/input capture
input/external clock input pin
FTIOB0
34
I/O
Output compare output/input capture
input/PWM output pin
FTIOC0
33
I/O
Output compare output/input capture
input/PWM sync output pin (at a reset,
complementary PWM mode)
FTIOD0
32
I/O
Output compare output/input capture
input/PWM output pin
FTIOA1
37
I/O
Output compare output/input capture
input/PWM output pin (at a reset,
complementary PWM mode)
FTIOB1 to
FTIOD1
38 to 40
I/O
Output compare output/input capture
input/PWM output pin
14-bit PWM PWM
24
Output
14-bit PWM square wave output pin
I2C bus
interface
(IIC)
SDA*1
26
I/O
IIC data I/O pin. Can directly drive a bus by
NMOS open-drain output. When using this pin,
external pull-up resistance is required.
SCL*1
27
I/O
IIC clock I/O pin. Can directly drive a bus by
(EEPROM: NMOS open-drain output. When using this pin,
Input)
external pull-up resistance is required.
TXD,
TXD_2
46, 50
Output
Transmit data output pin
RXD,
RXD_2
45, 49
Input
Receive data input pin
SCK3,
SCK3_2
44, 48
I/O
Clock I/O pin
AN7 to AN0 1, 2,
59 to 64
Input
Analog input pin
ADTRG
Input
A/D converter trigger input pin.
Timer Z
Serial communication
interface
(SCI)
A/D
converter
22
Rev.5.00 Nov. 02, 2005 Page 8 of 500
REJ09B0027-0500
Section 1 Overview
Pin No.
Type
Symbol
I/O ports
FP-64E
FP-64A
I/O
Functions
PB7 to PB0 1, 2,
59 to 64
Input
8-bit input port.
P17 to P14, 51 to 54,
P12 to P10 23 to 25
I/O
7-bit I/O port.
P24 to P20
31, 44 to 47 I/O
5-bit I/O port.
P37 to P30
15 to 18,
55 to 58
I/O
8-bit I/O port
P57 to P50
13, 14,
19 to 22,
2
2
26* , 27*
I/O
8-bit I/O port
P67 to P60
32 to 34,
I/O
36, 37 to 40
8-bit I/O port
P76 to P74, 28 to 30,
P72 to P70 48 to 50
I/O
P87 to P85
I/O
41 to 43
6-bit I/O port
3-bit I/O port.
2
Notes: 1. These pins are only available for the I C bus interface in the H8/3687N. Since the I2C
bus is disabled after canceling a reset, the ICE bit in ICCR1 must be set to 1 by using
the program.
2. The P57 and P56 pins are not available in the H8/3687N.
Rev.5.00 Nov. 02, 2005 Page 9 of 500
REJ09B0027-0500
Section 1 Overview
Rev.5.00 Nov. 02, 2005 Page 10 of 500
REJ09B0027-0500
Section 2 CPU
Section 2 CPU
This LSI has an H8/300H CPU with an internal 32-bit architecture that is upward-compatible with
the H8/300CPU, and supports only normal mode, which has a 64-kbyte address space.
• Upward-compatible with H8/300 CPUs
Can execute H8/300 CPUs object programs
Additional eight 16-bit extended registers
32-bit transfer and arithmetic and logic instructions are added
Signed multiply and divide instructions are added.
• General-register architecture
Sixteen 16-bit general registers also usable as sixteen 8-bit registers and eight 16-bit
registers, or eight 32-bit registers
• Sixty-two basic instructions
8/16/32-bit data transfer and arithmetic and logic instructions
Multiply and divide instructions
Powerful bit-manipulation instructions
• Eight addressing modes
Register direct [Rn]
Register indirect [@ERn]
Register indirect with displacement [@(d:16,ERn) or @(d:24,ERn)]
Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
Absolute address [@aa:8, @aa:16, @aa:24]
Immediate [#xx:8, #xx:16, or #xx:32]
Program-counter relative [@(d:8,PC) or @(d:16,PC)]
Memory indirect [@@aa:8]
• 64-kbyte address space
• High-speed operation
All frequently-used instructions execute in one or two states
8/16/32-bit register-register add/subtract
: 2 state
8 × 8-bit register-register multiply : 14 states
16 ÷ 8-bit register-register divide
: 14 states
16 × 16-bit register-register multiply : 22 states
32 ÷ 16-bit register-register divide : 22 states
• Power-down state
Transition to power-down state by SLEEP instruction
CPU30H2C_000120030300
Rev.5.00 Nov. 02, 2005 Page 11 of 500
REJ09B0027-0500
Section 2 CPU
2.1
Address Space and Memory Map
The address space of this LSI is 64 kbytes, which includes the program area and the data area.
Figures 2.1 show the memory map.
HD64N3687G
HD64F3687
HD64F3687G
(Flash memory version)
H'0000
H'0041
H'0042
Interrupt vector
HD64F3684
HD64F3684G
(Flash memory version)
H'0000
H'0041
H'0042
Interrupt vector
On-chip ROM
(32 kbytes)
HD6433682
HD6433682G
(Mask-ROM version)
H'0000
H'0041
H'0042
Interrupt vector
HD6433683
HD6433683G
(Mask-ROM version)
H'0000
H'0041
H'0042
On-chip ROM
(16 kbytes)
Interrupt vector
On-chip ROM
(24 kbytes)
H'3FFF
H'5FFF
H'7FFF
On-chip ROM
(56 kbytes)
Not used
Not used
Not used
H'DFFF
Not used
H'E800
H'E800
H'E800
On-chip RAM
(2 kbytes)
On-chip RAM
(2 kbytes)
Not used
Not used
H'F700
H'F77F
H'F780
H'FB7F
H'FB80
H'FF7F
H'FF80
Internal I/O register
(1 kbyte work area
for flash memory
programming)
On-chip RAM
(2 kbytes)
(1 kbyte user area)
H'F700
H'F77F
H'F780
H'FB7F
H'FB80
H'FF7F
H'FF80
H'F700
H'F77F
(1 kbyte work area
for flash memory
programming)
On-chip RAM
(2 kbytes)
(1 kbyte user area)
H'EFFF
Internal I/O register
H'FB80
On-chip RAM
(1 kbytes)
H'FF7F
H'FF80
REJ09B0027-0500
Internal I/O register
Not used
H'FB80
On-chip RAM
(1 kbytes)
H'FF7F
H'FF80
Internal I/O register
Internal I/O register
Figure 2.1 Memory Map (1)
Rev.5.00 Nov. 02, 2005 Page 12 of 500
H'F700
H'F77F
Not used
H'FFFF
H'FFFF
Not used
Not used
Internal I/O register
Internal I/O register
H'FFFF
Internal I/O register
On-chip RAM
(2 kbytes)
On-chip RAM
(2 kbytes)
H'EFFF
H'EFFF
H'EFFF
H'E800
H'FFFF
Section 2 CPU
HD6433684
HD6433684G
(Mask-ROM version)
H'0000
H'0041
H'0042
Interrupt vector
H'0000
H'0041
H'0042
On-chip ROM
(32 kbytes)
H'7FFF
Interrupt vector
HD6483687G
HD6433687
HD6433687G
(Mask-ROM version)
HD6433686
HD6433686G
(Mask-ROM version)
HD6433685
HD6433685G
(Mask-ROM version)
H'0000
H'0041
H'0042
On-chip ROM
(40 kbytes)
Interrupt vector
H'0000
H'0041
H'0042
Interrupt vector
On-chip ROM
(48 kbytes)
H'9FFF
On-chip ROM
(56 kbytes)
H'BFFF
Not used
Not used
Not used
H'DFFF
Not used
H'E800
H'E800
On-chip RAM
(2 kbytes)
H'EFFF
H'EFFF
Internal I/O register
Not used
H'FB80
On-chip RAM
(1 kbytes)
H'FF7F
H'FF80
Interrupt vector
H'FB80
H'FF7F
H'FF80
H'F700
H'F77F
Not used
Interrupt vector
H'F700
H'F77F
H'FF7F
H'FF80
Interrupt vector
Not used
Not used
H'FB80
On-chip RAM
(1 kbytes)
H'FF7F
H'FF80
H'FFFF
On-chip RAM
(1 kbytes)
Interrupt vector
Interrupt vector
Interrupt vector
H'FFFF
H'EFFF
H'FB80
On-chip RAM
(1 kbytes)
On-chip RAM
(2 kbytes)
Not used
Not used
Internal I/O register
H'FFFF
H'EFFF
Not used
H'F700
H'F77F
H'E800
On-chip RAM
(2 kbytes)
On-chip RAM
(2 kbytes)
Not used
H'F700
H'F77F
H'E800
H'FFFF
Figure 2.1 Memory Map (2)
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Section 2 CPU
HD64N3687G
HD6483687G
(On-chip EEPROM module)
H'0000
H'01FF
User area
(512 bytes)
Not used
H'FF09
Slave address
register
Not used
Figure 2.1 Memory Map (3)
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Section 2 CPU
2.2
Register Configuration
The H8/300H CPU has the internal registers shown in figure 2.2. There are two types of registers;
general registers and control registers. The control registers are a 24-bit program counter (PC), and
an 8-bit condition-code register (CCR).
General Registers (ERn)
15
0 7
0 7
0
ER0
E0
R0H
R0L
ER1
E1
R1H
R1L
ER2
E2
R2H
R2L
ER3
E3
R3H
R3L
ER4
E4
R4H
R4L
ER5
E5
R5H
R5L
ER6
E6
R6H
R6L
ER7
E7
R7H
R7L
(SP)
Control Registers (CR)
23
0
PC
7 6 5 4 3 2 1 0
CCR I UI H U N Z V C
[Legend]
SP:
PC:
CCR:
I:
UI:
Stack pointer
Program counter
Condition-code register
Interrupt mask bit
User bit
H:
U:
N:
Z:
V:
C:
Half-carry flag
User bit
Negative flag
Zero flag
Overflow flag
Carry flag
Figure 2.2 CPU Registers
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Section 2 CPU
2.2.1
General Registers
The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally
identical and can be used as both address registers and data registers. When a general register is
used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. Figure 2.3 illustrates
the usage of the general registers. When the general registers are used as 32-bit registers or address
registers, they are designated by the letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R
(R0 to R7). These registers are functionally equivalent, providing a maximum of sixteen 16-bit
registers. The E registers (E0 to E7) are also referred to as extended registers.
The R registers divide into 8-bit registers designated by the letters RH (R0H to R7H) and RL (R0L
to R7L). These registers are functionally equivalent, providing a maximum of sixteen 8-bit
registers.
The usage of each register can be selected independently.
• Address registers
• 32-bit registers
• 16-bit registers
• 8-bit registers
E registers (extended registers)
(E0 to E7)
ER registers
(ER0 to ER7)
RH registers
(R0H to R7H)
R registers
(R0 to R7)
RL registers
(R0L to R7L)
Figure 2.3 Usage of General Registers
General register ER7 has the function of stack pointer (SP) in addition to its general-register
function, and is used implicitly in exception handling and subroutine calls. Figure 2.4 shows the
relationship between the stack pointer and the stack area.
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Section 2 CPU
Empty area
SP (ER7)
Stack area
Figure 2.4 Relationship between Stack Pointer and Stack Area
2.2.2
Program Counter (PC)
This 24-bit counter indicates the address of the next instruction the CPU will execute. The length
of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an
instruction is fetched, the least significant PC bit is regarded as 0). The PC is initialized when the
start address is loaded by the vector address generated during reset exception-handling sequence.
2.2.3
Condition-Code Register (CCR)
This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and
half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. The I bit is initialized to 1
by reset exception-handling sequence, but other bits are not initialized.
Some instructions leave flag bits unchanged. Operations can be performed on the CCR bits by the
LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used as branching
conditions for conditional branch (Bcc) instructions.
For the action of each instruction on the flag bits, see appendix A.1, Instruction List.
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Section 2 CPU
Bit
Bit Name
Initial
Value
R/W
Description
7
I
1
R/W
Interrupt Mask Bit
Masks interrupts other than NMI when set to 1. NMI is
accepted regardless of the I bit setting. The I bit is set
to 1 at the start of an exception-handling sequence.
6
UI
Undefined R/W
User Bit
Can be written and read by software using the LDC,
STC, ANDC, ORC, and XORC instructions.
5
H
Undefined R/W
Half-Carry Flag
When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B,
or NEG.B instruction is executed, this flag is set to 1 if
there is a carry or borrow at bit 3, and cleared to 0
otherwise. When the ADD.W, SUB.W, CMP.W, or
NEG.W instruction is executed, the H flag is set to 1 if
there is a carry or borrow at bit 11, and cleared to 0
otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L
instruction is executed, the H flag is set to 1 if there is a
carry or borrow at bit 27, and cleared to 0 otherwise.
4
U
Undefined R/W
User Bit
Can be written and read by software using the LDC,
STC, ANDC, ORC, and XORC instructions.
3
N
Undefined R/W
Negative Flag
Stores the value of the most significant bit of data as a
sign bit.
2
Z
Undefined R/W
Zero Flag
Set to 1 to indicate zero data, and cleared to 0 to
indicate non-zero data.
1
V
Undefined R/W
Overflow Flag
Set to 1 when an arithmetic overflow occurs, and
cleared to 0 at other times.
0
C
Undefined R/W
Carry Flag
Set to 1 when a carry occurs, and cleared to 0
otherwise. Used by:
•
Add instructions, to indicate a carry
•
Subtract instructions, to indicate a borrow
•
Shift and rotate instructions, to indicate a carry
The carry flag is also used as a bit accumulator by bit
manipulation instructions.
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Section 2 CPU
2.3
Data Formats
The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit
(longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2,
…, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two
digits of 4-bit BCD data.
2.3.1
General Register Data Formats
Figure 2.5 shows the data formats in general registers.
Data Type
General Register
Data Format
7
RnH
1-bit data
0
Don't care
7 6 5 4 3 2 1 0
7
1-bit data
RnL
4-bit BCD data
RnH
4-bit BCD data
RnL
Byte data
RnH
Don't care
7
4 3
Upper
0
7 6 5 4 3 2 1 0
0
Lower
Don't care
7
Don't care
7
4 3
Upper
0
Don't care
MSB
LSB
7
Byte data
RnL
0
Lower
0
Don't care
MSB
LSB
Figure 2.5 General Register Data Formats (1)
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Section 2 CPU
Data Type
General
Register
Word data
Rn
Data Format
15
Word data
MSB
En
15
MSB
Longword
data
0
LSB
0
LSB
ERn
31
16 15
MSB
[Legend]
ERn: General register ER
En:
General register E
Rn:
General register R
RnH: General register RH
RnL: General register RL
MSB: Most significant bit
LSB: Least significant bit
Figure 2.5 General Register Data Formats (2)
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0
LSB
Section 2 CPU
2.3.2
Memory Data Formats
Figure 2.6 shows the data formats in memory. The H8/300H CPU can access word data and
longword data in memory, however word or longword data must begin at an even address. If an
attempt is made to access word or longword data at an odd address, an address error does not
occur, however the least significant bit of the address is regarded as 0, so access begins the
preceding address. This also applies to instruction fetches.
When ER7 (SP) is used as an address register to access the stack area, the operand size should be
word or longword.
Data Type
Address
Data Format
7
1-bit data
Address L
7
Byte data
Address L
MSB
Word data
Address 2M
MSB
0
6
5
4
3
2
Address 2N
0
LSB
LSB
Address 2M+1
Longword data
1
MSB
Address 2N+1
Address 2N+2
LSB
Address 2N+3
Figure 2.6 Memory Data Formats
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Section 2 CPU
2.4
Instruction Set
2.4.1
Table of Instructions Classified by Function
The H8/300H CPU has 62 instructions. Tables 2.2 to 2.9 summarize the instructions in each
functional category. The notation used in tables 2.2 to 2.9 is defined below.
Table 2.1
Operation Notation
Symbol
Description
Rd
General register (destination)*
Rs
General register (source)*
Rn
General register*
ERn
General register (32-bit register or address register)
(EAd)
Destination operand
(EAs)
Source operand
CCR
Condition-code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
Logical AND
∨
Logical OR
⊕
Logical XOR
→
Move
¬
NOT (logical complement)
:3/:8/:16/:24
Note:
*
3-, 8-, 16-, or 24-bit length
General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0
to R7, E0 to E7), and 32-bit registers/address register (ER0 to ER7).
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Section 2 CPU
Table 2.2
Data Transfer Instructions
Instruction
Size*
Function
MOV
B/W/L
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
MOVFPE
B
(EAs) → Rd
Cannot be used in this LSI.
MOVTPE
B
Rs → (EAs)
Cannot be used in this LSI.
POP
W/L
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to
MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
PUSH
W/L
Rn → @–SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
Note:
*
Refers to the operand size.
B: Byte
W: Word
L: Longword
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Section 2 CPU
Table 2.3
Arithmetic Operations Instructions (1)
Instruction
Size*
Function
ADD
SUB
B/W/L
Rd ± Rs → Rd, Rd ± #IMM → Rd
Performs addition or subtraction on data in two general registers, or on
immediate data and data in a general register (immediate byte data
cannot be subtracted from byte data in a general register. Use the
SUBX or ADD instruction.)
ADDX
SUBX
B
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry on byte data in two general
registers, or on immediate data and data in a general register.
INC
DEC
B/W/L
Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2. (Byte operands
can be incremented or decremented by 1 only.)
ADDS
SUBS
L
Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register.
DAA
DAS
B
Rd (decimal adjust) → Rd
Decimal-adjusts an addition or subtraction result in a general register by
referring to the CCR to produce 4-bit BCD data.
MULXU
B/W
Rd × Rs → Rd
Performs unsigned multiplication on data in two general registers: either
8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
MULXS
B/W
Rd × Rs → Rd
Performs signed multiplication on data in two general registers: either 8
bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
DIVXU
B/W
Rd ÷ Rs → Rd
Performs unsigned division on data in two general registers: either 16
bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits →
16-bit quotient and 16-bit remainder.
Note:
*
efers to the operand size.
B: Byte
W: Word
L: Longword
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Section 2 CPU
Table 2.3
Arithmetic Operations Instructions (2)
Instruction
Size*
Function
DIVXS
B/W
Rd ÷ Rs → Rd
Performs signed division on data in two general registers: either 16 bits
÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit
quotient and 16-bit remainder.
CMP
B/W/L
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general
register or with immediate data, and sets CCR bits according to the
result.
NEG
B/W/L
0 – Rd → Rd
Takes the two's complement (arithmetic complement) of data in a
general register.
EXTU
W/L
Rd (zero extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by padding with zeros on the
left.
EXTS
W/L
Rd (sign extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by extending the sign bit.
Note:
*
Refers to the operand size.
B: Byte
W: Word
L: Longword
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Section 2 CPU
Table 2.4
Logic Operations Instructions
Instruction
Size*
Function
AND
B/W/L
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and another
general register or immediate data.
OR
B/W/L
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data.
XOR
B/W/L
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and
another general register or immediate data.
NOT
B/W/L
¬ (Rd) → (Rd)
Takes the one's complement (logical complement) of general register
contents.
Note:
*
Refers to the operand size.
B: Byte
W: Word
L: Longword
Table 2.5
Shift Instructions
Instruction
Size*
Function
SHAL
SHAR
B/W/L
Rd (shift) → Rd
Performs an arithmetic shift on general register contents.
SHLL
SHLR
B/W/L
Rd (shift) → Rd
Performs a logical shift on general register contents.
ROTL
ROTR
B/W/L
Rd (rotate) → Rd
Rotates general register contents.
ROTXL
ROTXR
B/W/L
Rd (rotate) → Rd
Rotates general register contents through the carry flag.
Note:
*
Refers to the operand size.
B: Byte
W: Word
L: Longword
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Section 2 CPU
Table 2.6
Bit Manipulation Instructions (1)
Instruction
Size*
Function
BSET
B
1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory operand to 1. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory operand to 0. The
bit number is specified by 3-bit immediate data or the lower three bits of
a general register.
BNOT
B
¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory operand. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BTST
B
¬ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory operand and sets
or clears the Z flag accordingly. The bit number is specified by 3-bit
immediate data or the lower three bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIAND
B
C ∧ ¬ (<bit-No.> of <EAd>) → C
ANDs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIOR
B
C ∨ ¬ (<bit-No.> of <EAd>) → C
ORs the carry flag with the inverse of a specified bit in a general register
or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
Note:
*
Refers to the operand size.
B: Byte
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Section 2 CPU
Table 2.6
Bit Manipulation Instructions (2)
Instruction
Size*
Function
BXOR
B
C ⊕ (<bit-No.> of <EAd>) → C
XORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIXOR
B
C ⊕ ¬ (<bit-No.> of <EAd>) → C
XORs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BLD
B
(<bit-No.> of <EAd>) → C
Transfers a specified bit in a general register or memory operand to the
carry flag.
BILD
B
¬ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general register or memory
operand to the carry flag.
The bit number is specified by 3-bit immediate data.
BST
B
C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a general register or
memory operand.
BIST
B
¬ C → (<bit-No.> of <EAd>)
Transfers the inverse of the carry flag value to a specified bit in a
general register or memory operand.
The bit number is specified by 3-bit immediate data.
Note:
*
Refers to the operand size.
B: Byte
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Section 2 CPU
Table 2.7
Branch Instructions
Instruction
Size
Function
Bcc*
Branches to a specified address if a specified condition is true. The
branching conditions are listed below.
Mnemonic
Description
Condition
BRA(BT)
Always (true)
Always
BRN(BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
BCC(BHS)
Carry clear
(high or same)
C=0
BCS(BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z∨(N ⊕ V) = 0
BLE
Less or equal
Z∨(N ⊕ V) = 1
JMP
Branches unconditionally to a specified address.
BSR
Branches to a subroutine at a specified address.
JSR
Branches to a subroutine at a specified address.
RTS
Returns from a subroutine
Note:
*
Bcc is the general name for conditional branch instructions.
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Section 2 CPU
Table 2.8
System Control Instructions
Instruction
Size*
Function
TRAPA
Starts trap-instruction exception handling.
RTE
Returns from an exception-handling routine.
SLEEP
Causes a transition to a power-down state.
LDC
B/W
(EAs) → CCR
Moves the source operand contents to the CCR. The CCR size is one
byte, but in transfer from memory, data is read by word access.
STC
B/W
CCR → (EAd)
Transfers the CCR contents to a destination location. The condition
code register size is one byte, but in transfer to memory, data is written
by word access.
ANDC
B
CCR ∧ #IMM → CCR
Logically ANDs the CCR with immediate data.
ORC
B
CCR ∨ #IMM → CCR
Logically ORs the CCR with immediate data.
XORC
B
CCR ⊕ #IMM → CCR
Logically XORs the CCR with immediate data.
NOP
PC + 2 → PC
Only increments the program counter.
Note:
*
Refers to the operand size.
B: Byte
W: Word
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Section 2 CPU
Table 2.9
Block Data Transfer Instructions
Instruction
Size
Function
EEPMOV.B
if R4L ≠ 0 then
Repeat @ER5+ → @ER6+,
R4L–1 → R4L
Until R4L = 0
else next;
EEPMOV.W
if R4 ≠ 0 then
Repeat @ER5+ → @ER6+,
R4–1 → R4
Until R4 = 0
else next;
Transfers a data block. Starting from the address set in ER5, transfers
data for the number of bytes set in R4L or R4 to the address location set
in ER6.
Execution of the next instruction begins as soon as the transfer is
completed.
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Section 2 CPU
2.4.2
Basic Instruction Formats
H8/300H CPU instructions consist of 2-byte (1-word) units. An instruction consists of an
operation field (op), a register field (r), an effective address extension (EA), and a condition field
(cc).
Figure 2.7 shows examples of instruction formats.
• Operation Field
Indicates the function of the instruction, the addressing mode, and the operation to be carried
out on the operand. The operation field always includes the first four bits of the instruction.
Some instructions have two operation fields.
• Register Field
Specifies a general register. Address registers are specified by 3 bits, and data registers by 3
bits or 4 bits. Some instructions have two register fields. Some have no register field.
• Effective Address Extension
8, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. A24-bit
address or displacement is treated as a 32-bit data in which the first 8 bits are 0 (H'00).
• Condition Field
Specifies the branching condition of Bcc instructions.
(1) Operation field only
op
NOP, RTS, etc.
(2) Operation field and register fields
op
rm
rn
ADD.B Rn, Rm, etc.
(3) Operation field, register fields, and effective address extension
op
rn
rm
MOV.B @(d:16, Rn), Rm
EA(disp)
(4) Operation field, effective address extension, and condition field
op
cc
EA(disp)
BRA d:8
Figure 2.7 Instruction Formats
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Section 2 CPU
2.5
Addressing Modes and Effective Address Calculation
The following describes the H8/300H CPU. In this LSI, the upper eight bits are ignored in the
generated 24-bit address, so the effective address is 16 bits.
2.5.1
Addressing Modes
The H8/300H CPU supports the eight addressing modes listed in table 2.10. Each instruction uses
a subset of these addressing modes. Addressing modes that can be used differ depending on the
instruction. For details, refer to appendix A.4, Combinations of Instructions and Addressing
Modes.
Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer
instructions can use all addressing modes except program-counter relative and memory indirect.
Bit-manipulation instructions use register direct, register indirect, or the absolute addressing mode
(@aa:8) to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions)
or immediate (3-bit) addressing mode to specify a bit number in the operand.
Table 2.10 Addressing Modes
No.
Addressing Mode
Symbol
1
Register direct
Rn
2
Register indirect
@ERn
3
Register indirect with displacement
@(d:16,ERn)/@(d:24,ERn)
4
Register indirect with post-increment
Register indirect with pre-decrement
@ERn+
@–ERn
5
Absolute address
@aa:8/@aa:16/@aa:24
6
Immediate
#xx:8/#xx:16/#xx:32
7
Program-counter relative
@(d:8,PC)/@(d:16,PC)
8
Memory indirect
@@aa:8
Register DirectRn
The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the
operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7
can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers.
Rev.5.00 Nov. 02, 2005 Page 33 of 500
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Section 2 CPU
Register Indirect@ERn
The register field of the instruction code specifies an address register (ERn), the lower 24 bits of
which contain the address of the operand on memory.
Register Indirect with Displacement@(d:16, ERn) or @(d:24, ERn)
A 16-bit or 24-bit displacement contained in the instruction is added to an address register (ERn)
specified by the register field of the instruction, and the lower 24 bits of the sum the address of a
memory operand. A 16-bit displacement is sign-extended when added.
Register Indirect with Post-Increment or Pre-Decrement@ERn+ or @-ERn
• Register indirect with post-increment@ERn+
The register field of the instruction code specifies an address register (ERn) the lower 24 bits
of which contains the address of a memory operand. After the operand is accessed, 1, 2, or 4 is
added to the address register contents (32 bits) and the sum is stored in the address register.
The value added is 1 for byte access, 2 for word access, or 4 for longword access. For the word
or longword access, the register value should be even.
• Register indirect with pre-decrement@-ERn
The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field
in the instruction code, and the lower 24 bits of the result is the address of a memory operand.
The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for
word access, or 4 for longword access. For the word or longword access, the register value
should be even.
Absolute Address@aa:8, @aa:16, @aa:24
The instruction code contains the absolute address of a memory operand. The absolute address
may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24)
For an 8-bit absolute address, the upper 16 bits are all assumed to be 1 (H'FFFF). For a 16-bit
absolute address the upper 8 bits are a sign extension. A 24-bit absolute address can access the
entire address space.
The access ranges of absolute addresses for the group of this LSI are those shown in table 2.11,
because the upper 8 bits are ignored.
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Section 2 CPU
Table 2.11 Absolute Address Access Ranges
Absolute Address
Access Range
8 bits (@aa:8)
H'FF00 to H'FFFF
16 bits (@aa:16)
H'0000 to H'FFFF
24 bits (@aa:24)
H'0000 to H'FFFF
Immediate#xx:8, #xx:16, or #xx:32
The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an
operand.
The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit
manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit
number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a
vector address.
Program-Counter Relative@(d:8, PC) or @(d:16, PC)
This mode is used in the BSR instruction. An 8-bit or 16-bit displacement contained in the
instruction is sign-extended and added to the 24-bit PC contents to generate a branch address. The
PC value to which the displacement is added is the address of the first byte of the next instruction,
so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768
bytes (–16383 to +16384 words) from the branch instruction. The resulting value should be an
even number.
Memory Indirect@@aa:8
This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit
absolute address specifying a memory operand. This memory operand contains a branch address.
The memory operand is accessed by longword access. The first byte of the memory operand is
ignored, generating a 24-bit branch address. Figure 2.8 shows how to specify branch address for in
memory indirect mode. The upper bits of the absolute address are all assumed to be 0, so the
address range is 0 to 255 (H'0000 to H'00FF).
Note that the first part of the address range is also the exception vector area.
Rev.5.00 Nov. 02, 2005 Page 35 of 500
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Section 2 CPU
Specified
by @aa:8
Dummy
Branch address
Figure 2.8 Branch Address Specification in Memory Indirect Mode
2.5.2
Effective Address Calculation
Table 2.12 indicates how effective addresses are calculated in each addressing mode. In this LSI
the upper 8 bits of the effective address are ignored in order to generate a 16-bit effective address.
Table 2.12 Effective Address Calculation (1)
No
1
Addressing Mode and Instruction Format
op
2
Effective Address Calculation
Effective Address (EA)
Register direct(Rn)
rm
Operand is general register contents.
rn
Register indirect(@ERn)
0
31
23
0
23
0
23
0
23
0
General register contents
op
3
r
Register indirect with displacement
@(d:16,ERn) or @(d:24,ERn)
0
31
General register contents
op
r
disp
0
31
Sign extension
4
Register indirect with post-increment or
pre-decrement
•Register indirect with post-increment @ERn+
op
31
0
General register contents
r
•Register indirect with pre-decrement @-ERn
disp
1, 2, or 4
31
0
General register contents
op
r
1, 2, or 4
The value to be added or subtracted is 1 when the
operand is byte size, 2 for word size, and 4 for
longword size.
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Section 2 CPU
Table 2.12 Effective Address Calculation (2)
No
5
Addressing Mode and Instruction Format
Effective Address Calculation
Effective Address (EA)
Absolute address
@aa:8
8 7
23
op
abs
0
H'FFFF
@aa:16
23
op
abs
16 15
0
Sign extension
@aa:24
op
0
23
abs
6
Immediate
#xx:8/#xx:16/#xx:32
op
7
Operand is immediate data.
IMM
0
23
Program-counter relative
PC contents
@(d:8,PC) @(d:16,PC)
op
disp
23
0
Sign
extension
8
disp
23
0
Memory indirect @@aa:8
8 7
23
op
abs
0
abs
H'0000
15
0
Memory contents
[Legend]
r, rm,rn:
op:
disp:
IMM:
abs:
23
16 15
0
H'00
Register field
Operation field
Displacement
Immediate data
Absolute address
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Section 2 CPU
2.6
Basic Bus Cycle
CPU operation is synchronized by a system clock (φ) or a subclock (φSUB). The period from a rising
edge of φ or φSUB to the next rising edge is called one state. A bus cycle consists of two states or
three states. The cycle differs depending on whether access is to on-chip memory or to on-chip
peripheral modules.
2.6.1
Access to On-Chip Memory (RAM, ROM)
Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access
in byte or word size. Figure 2.9 shows the on-chip memory access cycle.
Bus cycle
T1 state
T2 state
φ or φ SUB
Internal address bus
Address
Internal read signal
Internal data bus
(read access)
Read data
Internal write signal
Internal data bus
(write access)
Write data
Figure 2.9 On-Chip Memory Access Cycle
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Section 2 CPU
2.6.2
On-Chip Peripheral Modules
On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits
or 16 bits depending on the register. For description on the data bus width and number of
accessing states of each register, refer to section 22.1, Register Addresses (Address Order).
Registers with 16-bit data bus width can be accessed by word size only. Registers with 8-bit data
bus width can be accessed by byte or word size. When a register with 8-bit data bus width is
accessed by word size, a bus cycle occurs twice. In two-state access, the operation timing is the
same as that for on-chip memory.
Figure 2.10 shows the operation timing in the case of three-state access to an on-chip peripheral
module.
Bus cycle
T1 state
T2 state
T3 state
φ or φ SUB
Internal
address bus
Address
Internal
read signal
Internal
data bus
(read access)
Read data
Internal
write signal
Internal
data bus
(write access)
Write data
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access)
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Section 2 CPU
2.7
CPU States
There are four CPU states: the reset state, program execution state, program halt state, and
exception-handling state. The program execution state includes active mode and subactive mode.
For the program halt state, there are a sleep mode, standby mode, and sub-sleep mode. These
states are shown in figure 2.11. Figure 2.12 shows the state transitions. For details on program
execution state and program halt state, refer to section 6, Power-Down Modes. For details on
exception processing, refer to section 3, Exception Handling.
CPU state
Reset state
The CPU is initialized
Program
execution state
Active
(high speed) mode
The CPU executes successive program
instructions at high speed,
synchronized by the system clock
Subactive mode
The CPU executes
successive program
instructions at reduced
speed, synchronized
by the subclock
Program halt state
A state in which some
or all of the chip
functions are stopped
to conserve power
Sleep mode
Standby mode
Subsleep mode
Exceptionhandling state
A transient state in which the CPU changes
the processing flow due to a reset or an interrupt
Figure 2.11 CPU Operation States
Rev.5.00 Nov. 02, 2005 Page 40 of 500
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Power-down
modes
Section 2 CPU
Reset cleared
Reset state
Exception-handling state
Reset occurs
Reset
occurs
Reset
occurs
Interrupt
source
Program halt state
Interrupt
source
Exceptionhandling
complete
Program execution state
SLEEP instruction executed
Figure 2.12 State Transitions
2.8
Usage Notes
2.8.1
Notes on Data Access to Empty Areas
The address space of this LSI includes empty areas in addition to the ROM, RAM, and on-chip
I/O registers areas available to the user. When data is transferred from CPU to empty areas, the
transferred data will be lost. This action may also cause the CPU to malfunction. When data is
transferred from an empty area to CPU, the contents of the data cannot be guaranteed.
2.8.2
EEPMOV Instruction
EEPMOV is a block-transfer instruction and transfers the byte size of data indicated by R4L,
which starts from the address indicated by R5, to the address indicated by R6. Set R4L and R6 so
that the end address of the destination address (value of R6 + R4L) does not exceed H'FFFF (the
value of R6 must not change from H'FFFF to H'0000 during execution).
2.8.3
Bit-Manipulation Instruction
The BSET, BCLR, BNOT, BST, and BIST instructions read data from the specified address in
byte units, manipulate the data of the target bit, and write data to the same address again in byte
units. Special care is required when using these instructions in cases where two registers are
assigned to the same address, or when a bit is directly manipulated for a port or a register
containing a write-only bit, because this may rewrite data of a bit other than the bit to be
manipulated.
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Section 2 CPU
Bit manipulation for two registers assigned to the same address
Example 1: Bit manipulation for the timer load register and timer counter
(Applicable for timer B1 in the H8/3687 Group.)
Figure 2.13 shows an example of a timer in which two timer registers are assigned to the same
address. When a bit-manipulation instruction accesses the timer load register and timer counter of
a reloadable timer, since these two registers share the same address, the following operations takes
place.
1. Data is read in byte units.
2. The CPU sets or resets the bit to be manipulated with the bit-manipulation instruction.
3. The written data is written again in byte units to the timer load register.
The timer is counting, so the value read is not necessarily the same as the value in the timer load
register. As a result, bits other than the intended bit in the timer counter may be modified and the
modified value may be written to the timer load register.
Read
Count clock
Timer counter
Reload
Write
Timer load register
Internal data bus
Figure 2.13 Example of Timer Configuration with Two Registers Allocated to Same
Address
Example 2: The BSET instruction is executed for port 5.
P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at
P56. P55 to P50 are output pins and output low-level signals. An example to output a high-level
signal at P50 with a BSET instruction is shown below.
Rev.5.00 Nov. 02, 2005 Page 42 of 500
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Section 2 CPU
• Prior to executing BSET instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
• BSET instruction executed instruction
BSET
#0,
@PDR5
The BSET instruction is executed for port 5.
• After executing BSET instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
0
0
1
1
1
1
1
1
PDR5
0
1
0
0
0
0
0
1
• Description on operation
1. When the BSET instruction is executed, first the CPU reads port 5.
Since P57 and P56 are input pins, the CPU reads the pin states (low-level and high-level
input).
P55 to P50 are output pins, so the CPU reads the value in PDR5. In this example PDR5 has a
value of H'80, but the value read by the CPU is H'40.
2. Next, the CPU sets bit 0 of the read data to 1, changing the PDR5 data to H'41.
3. Finally, the CPU writes H'41 to PDR5, completing execution of BSET instruction.
As a result of the BSET instruction, bit 0 in PDR5 becomes 1, and P50 outputs a high-level
signal. However, bits 7 and 6 of PDR5 end up with different values. To prevent this problem,
store a copy of the PDR5 data in a work area in memory. Perform the bit manipulation on the
data in the work area, then write this data to PDR5.
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Section 2 CPU
• Prior to executing BSET instruction
MOV.B
MOV.B
MOV.B
#80,
R0L,
R0L,
R0L
@RAM0
@PDR5
The PDR5 value (H'80) is written to a work area in
memory (RAM0) as well as to PDR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
RAM0
1
0
0
0
0
0
0
0
• BSET instruction executed
BSET
#0,
@RAM0
The BSET instruction is executed designating the PDR5
work area (RAM0).
• After executing BSET instruction
MOV.B
MOV.B
@RAM0, R0L
R0L, @PDR5
The work area (RAM0) value is written to PDR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
1
RAM0
1
0
0
0
0
0
0
1
Bit Manipulation in a Register Containing a Write-Only Bit
Example 3: BCLR instruction executed designating port 5 control register PCR5
P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at
P56. P55 to P50 are output pins that output low-level signals. An example of setting the P50 pin as
an input pin by the BCLR instruction is shown below. It is assumed that a high-level signal will be
input to this input pin.
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Section 2 CPU
• Prior to executing BCLR instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
• BCLR instruction executed
BCLR
#0,
@PCR5
The BCLR instruction is executed for PCR5.
• After executing BCLR instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Output
Output
Output
Output
Output
Output
Output
Input
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
1
1
1
1
1
1
1
0
PDR5
1
0
0
0
0
0
0
0
• Description on operation
1. When the BCLR instruction is executed, first the CPU reads PCR5. Since PCR5 is a write-only
register, the CPU reads a value of H'FF, even though the PCR5 value is actually H'3F.
2. Next, the CPU clears bit 0 in the read data to 0, changing the data to H'FE.
3. Finally, H'FE is written to PCR5 and BCLR instruction execution ends.
As a result of this operation, bit 0 in PCR5 becomes 0, making P50 an input port. However,
bits 7 and 6 in PCR5 change to 1, so that P57 and P56 change from input pins to output pins.
To prevent this problem, store a copy of the PDR5 data in a work area in memory and
manipulate data of the bit in the work area, then write this data to PDR5.
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Section 2 CPU
• Prior to executing BCLR instruction
MOV.B
MOV.B
MOV.B
#3F,
R0L,
R0L,
R0L
@RAM0
@PCR5
The PCR5 value (H'3F) is written to a work area in
memory (RAM0) as well as to PCR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
1
• BCLR instruction executed
BCLR
#0,
@RAM0
The BCLR instructions executed for the PCR5 work area
(RAM0).
• After executing BCLR instruction
MOV.B
MOV.B
@RAM0, R0L
R0L, @PCR5
The work area (RAM0) value is written to PCR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
0
0
1
1
1
1
1
0
PDR5
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
0
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Section 3 Exception Handling
Section 3 Exception Handling
Exception handling may be caused by a reset, a trap instruction (TRAPA), or interrupts.
• Reset
A reset has the highest exception priority. Exception handling starts as soon as the reset is cleared
by the RES pin. The chip is also reset when the watchdog timer overflows, and exception handling
starts. Exception handling is the same as exception handling by the RES pin.
• Trap Instruction
Exception handling starts when a trap instruction (TRAPA) is executed. The TRAPA instruction
generates a vector address corresponding to a vector number from 0 to 3, as specified in the
instruction code. Exception handling can be executed at all times in the program execution state,
regardless of the setting of the I bit in CCR.
• Interrupts
External interrupts other than NMI and internal interrupts other than address break are masked by
the I bit in CCR, and kept masked while the I bit is set to 1. Exception handling starts when the
current instruction or exception handling ends, if an interrupt request has been issued.
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Section 3 Exception Handling
3.1
Exception Sources and Vector Address
Table 3.1 shows the vector addresses and priority of each exception handling. When more than
one interrupt is requested, handling is performed from the interrupt with the highest priority.
Table 3.1
Exception Sources and Vector Address
Relative Module
Exception Sources
Vector
Number
Vector Address
Priority
RES pin
Watchdog timer
Reset
0
H'0000 to H'0001
High
Reserved for system use
1 to 6
H'0002 to H'000D
External interrupt
pin
NMI
7
H'000E to H'000F
CPU
Trap instruction (#0)
8
H'0010 to H'0011
(#1)
9
H'0012 to H'0013
(#2)
10
H'0014 to H'0015
11
H'0016 to H'0017
Address break
Break conditions satisfied
(#3)
12
H'0018 to H'0019
CPU
Direct transition by executing
the SLEEP instruction
13
H'001A to H'001B
External interrupt
pin
IRQ0
Low-voltage detection
interrupt*
14
H'001C to H'001D
IRQ1
15
H'001E to H'001F
IRQ2
16
H'0020 to H'0021
IRQ3
17
H'0022 to H'0023
WKP
18
H'0024 to H'0025
RTC
Overflow
19
H'0026 to H'0027
Reserved for system use
20
H'0028 to H'0029
Timer V
Timer V compare match A
Timer V compare match B
Timer V overflow
22
H'002C to H'002D
SCI3
SCI3 receive data full
SCI3 transmit data empty
SCI3 transmit end
SCI3 receive error
23
H'002E to H'002F
Rev.5.00 Nov. 02, 2005 Page 48 of 500
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Low
Section 3 Exception Handling
Vector
Number
Vector Address
Priority
Transmit data empty
Transmit end
Receive data full
Arbitration lost/Overrun error
NACK detection
Stop conditions detected
24
H'0030 to H'0031
High
A/D converter
A/D conversion end
25
H'0032 to H'0033
Timer Z
Compare match/input capture
A0 to D0
Timer Z overflow
26
H'0034 to H'0035
Compare match/input capture
A1 to D1
Timer Z overflow
Timer Z underflow
27
H'0036 to H'0037
Timer B1
Timer B1 overflow
29
H'003A to H'003B
SCI3_2
Receive data full
Transmit data empty
Transmit end
Receive error
32
H'0040 to H'0041
Relative Module
Exception Sources
IIC2
Note:
3.2
*
Low
A low-voltage detection interrupt is enabled only in the product with an on-chip poweron reset and low-voltage detection circuit.
Register Descriptions
Interrupts are controlled by the following registers.
•
•
•
•
•
•
•
Interrupt edge select register 1 (IEGR1)
Interrupt edge select register 2 (IEGR2)
Interrupt enable register 1 (IENR1)
Interrupt enable register 2 (IENR2)
Interrupt flag register 1 (IRR1)
Interrupt flag register 2 (IRR2)
Wakeup interrupt flag register (IWPR)
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Section 3 Exception Handling
3.2.1
Interrupt Edge Select Register 1 (IEGR1)
IEGR1 selects the direction of an edge that generates interrupt requests of pins NMI and IRQ3 to
IRQ0.
Bit
Bit Name
Initial
Value
R/W
Description
7
NMIEG
0
R/W
NMI Edge Select
0: Falling edge of NMI pin input is detected
1: Rising edge of NMI pin input is detected
6 to 4
All 1
Reserved
These bits are always read as 1.
3
IEG3
0
R/W
IRQ3 Edge Select
0: Falling edge of IRQ3 pin input is detected
1: Rising edge of IRQ3 pin input is detected
2
IEG2
0
R/W
IRQ2 Edge Select
0: Falling edge of IRQ2 pin input is detected
1: Rising edge of IRQ2 pin input is detected
1
IEG1
0
R/W
IRQ1 Edge Select
0: Falling edge of IRQ1 pin input is detected
1: Rising edge of IRQ1 pin input is detected
0
IEG0
0
R/W
IRQ0 Edge Select
0: Falling edge of IRQ0 pin input is detected
1: Rising edge of IRQ0 pin input is detected
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Section 3 Exception Handling
3.2.2
Interrupt Edge Select Register 2 (IEGR2)
IEGR2 selects the direction of an edge that generates interrupt requests of the pins ADTRG and
WKP5 to WKP0.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
All 1
Reserved
5
WPEG5
0
R/W
WKP5 Edge Select
These bits are always read as 1.
0: Falling edge of WKP5(ADTRG) pin input is detected
1: Rising edge of WKP5(ADTRG) pin input is detected
4
WPEG4
0
R/W
WKP4 Edge Select
0: Falling edge of WKP4 pin input is detected
1: Rising edge of WKP4 pin input is detected
3
WPEG3
0
R/W
WKP3 Edge Select
0: Falling edge of WKP3 pin input is detected
1: Rising edge of WKP3 pin input is detected
2
WPEG2
0
R/W
WKP2 Edge Select
0: Falling edge of WKP2 pin input is detected
1: Rising edge of WKP2 pin input is detected
1
WPEG1
0
R/W
WKP1Edge Select
0: Falling edge of WKP1 pin input is detected
1: Rising edge of WKP1 pin input is detected
0
WPEG0
0
R/W
WKP0 Edge Select
0: Falling edge of WKP0 pin input is detected
1: Rising edge of WKP0 pin input is detected
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Section 3 Exception Handling
3.2.3
Interrupt Enable Register 1 (IENR1)
IENR1 enables direct transition interrupts, RTC interrupts, and external pin interrupts.
Bit
Bit Name
Initial
Value
R/W
Description
7
IENDT
0
R/W
Direct Transfer Interrupt Enable
When this bit is set to 1, direct transition interrupt
requests are enabled.
6
IENTA
0
R/W
RTC Interrupt Enable
When this bit is set to 1, RTC interrupt requests are
enabled.
5
IENWP
0
R/W
Wakeup Interrupt Enable
This bit is an enable bit, which is common to the pins
WKP5 to WKP0. When the bit is set to 1, interrupt
requests are enabled.
4
1
Reserved
This bit is always read as 1.
3
IEN3
0
R/W
IRQ3 Interrupt Enable
When this bit is set to 1, interrupt requests of the IRQ3
pin are enabled.
2
IEN2
0
R/W
IRQ2 Interrupt Enable
When this bit is set to 1, interrupt requests of the IRQ2
pin are enabled.
1
IEN1
0
R/W
IRQ1 Interrupt Enable
When this bit is set to 1, interrupt requests of the IRQ1
pin are enabled.
0
IEN0
0
R/W
IRQ0 Interrupt Enable
When this bit is set to 1, interrupt requests of the IRQ0
pin are enabled.
When disabling interrupts by clearing bits in an interrupt enable register, or when clearing bits in
an interrupt flag register, always do so while interrupts are masked (I = 1). If the above clear
operations are performed while I = 0, and as a result a conflict arises between the clear instruction
and an interrupt request, exception handling for the interrupt will be executed after the clear
instruction has been executed.
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Section 3 Exception Handling
3.2.4
Interrupt Enable Register 2 (IENR2)
IENR2 enables, timer B1 overflow interrupts.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
All 0
Reserved
These bits are always read as 0.
5
IENTB1
0
R/W
Timer B1 Interrupt Enable
When this bit is set to 1, timer B1 overflow interrupt
requests are enabled.
4 to 0
All 1
Reserved
These bits are always read as 1.
When disabling interrupts by clearing bits in an interrupt enable register, or when clearing bits in
an interrupt flag register, always do so while interrupts are masked (I = 1). If the above clear
operations are performed while I = 0, and as a result a conflict arises between the clear instruction
and an interrupt request, exception handling for the interrupt will be executed after the clear
instruction has been executed.
3.2.5
Interrupt Flag Register 1 (IRR1)
IRR1 is a status flag register for direct transition interrupts, RTC interrupts, and IRQ3 to IRQ0
interrupt requests.
Bit
Bit Name
Initial
Value
R/W
Description
7
IRRDT
0
R/W
Direct Transfer Interrupt Request Flag
[Setting condition]
When a direct transfer is made by executing a SLEEP
instruction while DTON in SYSCR2 is set to 1.
[Clearing condition]
When IRRDT is cleared by writing 0
6
IRRTA
0
R/W
RTC Interrupt Request Flag
[Setting condition]
When the RTC counter value overflows
[Clearing condition]
When IRRTA is cleared by writing 0
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Section 3 Exception Handling
Bit
Bit Name
Initial
Value
R/W
Description
5, 4
All 1
Reserved
These bits are always read as 1.
3
IRRI3
0
R/W
IRQ3 Interrupt Request Flag
[Setting condition]
When IRQ3 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI3 is cleared by writing 0
2
IRRI2
0
R/W
IRQ2 Interrupt Request Flag
[Setting condition]
When IRQ2 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI2 is cleared by writing 0
1
IRRI1
0
R/W
IRQ1 Interrupt Request Flag
[Setting condition]
When IRQ1 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI1 is cleared by writing 0
0
IRRl0
0
R/W
IRQ0 Interrupt Request Flag
[Setting condition]
When IRQ0 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI0 is cleared by writing 0
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Section 3 Exception Handling
3.2.6
Interrupt Flag Register 2 (IRR2)
IRR2 is a status flag register for timer B1 overflow interrupts.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
All 0
Reserved
These bits are always read as 0.
5
IRRTB1
0
R/W
Timer B1 Interrupt Request flag
[Setting condition]
When the timer B1 counter value overflows
[Clearing condition]
When IRRTB1 is cleared by writing 0
4 to 0
All 1
Reserved
These bits are always read as 1.
3.2.7
Wakeup Interrupt Flag Register (IWPR)
IWPR is a status flag register for WKP5 to WKP0 interrupt requests.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
All 1
Reserved
5
IWPF5
0
R/W
WKP5 Interrupt Request Flag
These bits are always read as 1.
[Setting condition]
When WKP5 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF5 is cleared by writing 0.
4
IWPF4
0
R/W
WKP4 Interrupt Request Flag
[Setting condition]
When WKP4 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF4 is cleared by writing 0.
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Section 3 Exception Handling
Bit
Bit Name
Initial
Value
R/W
Description
3
IWPF3
0
R/W
WKP3 Interrupt Request Flag
[Setting condition]
When WKP3 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF3 is cleared by writing 0.
2
IWPF2
0
R/W
WKP2 Interrupt Request Flag
[Setting condition]
When WKP2 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF2 is cleared by writing 0.
1
IWPF1
0
R/W
WKP1 Interrupt Request Flag
[Setting condition]
When WKP1 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF1 is cleared by writing 0.
0
IWPF0
0
R/W
WKP0 Interrupt Request Flag
[Setting condition]
When WKP0 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF0 is cleared by writing 0.
Rev.5.00 Nov. 02, 2005 Page 56 of 500
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Section 3 Exception Handling
3.3
Reset Exception Handling
When the RES pin goes low, all processing halts and this LSI enters the reset. The internal state of
the CPU and the registers of the on-chip peripheral modules are initialized by the reset. To ensure
that this LSI is reset at power-up, hold the RES pin low until the clock pulse generator output
stabilizes. To reset the chip during operation, hold the RES pin low for at least 10 system clock
cycles. When the RES pin goes high after being held low for the necessary time, this LSI starts
reset exception handling. The reset exception handling sequence is shown in figure 3.1. However,
for the reset exception handling sequence of the product with on-chip power-on reset circuit, refer
to section 20, Power-On Reset and Low-Voltage Detection Circuits (Optional).
The reset exception handling sequence is as follows:
1. Set the I bit in the condition code register (CCR) to 1.
2. The CPU generates a reset exception handling vector address (from H'0000 to H'0001), the
data in that address is sent to the program counter (PC) as the start address, and program
execution starts from that address.
3.4
Interrupt Exception Handling
3.4.1
External Interrupts
As the external interrupts, there are NMI, IRQ3 to IRQ0, and WKP5 to WKP0 interrupts.
NMI Interrupt
NMI interrupt is requested by input signal edge to pin NMI. This interrupt is detected by either
rising edge sensing or falling edge sensing, depending on the setting of bit NMIEG in IEGR1.
NMI is the highest-priority interrupt, and can always be accepted without depending on the I
bit value in CCR.
IRQ3 to IRQ0 Interrupts
IRQ3 to IRQ0 interrupts are requested by input signals to pins IRQ3 to IRQ0. These four
interrupts are given different vector addresses, and are detected individually by either rising
edge sensing or falling edge sensing, depending on the settings of bits IEG3 to IEG0 in IEGR1.
When pins IRQ3 to IRQ0 are designated for interrupt input in PMR1 and the designated signal
edge is input, the corresponding bit in IRR1 is set to 1, requesting the CPU of an interrupt.
These interrupts can be masked by setting bits IEN3 to IEN0 in IENR1.
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Section 3 Exception Handling
WKP5 to WKP0 Interrupts
WKP5 to WKP0 interrupts are requested by input signals to pins WKP5 to WKP0. These six
interrupts have the same vector addresses, and are detected individually by either rising edge
sensing or falling edge sensing, depending on the settings of bits WPEG5 to WPEG0 in
IEGR2.
When pins WKP5 to WKP0 are designated for interrupt input in PMR5 and the designated
signal edge is input, the corresponding bit in IWPR is set to 1, requesting the CPU of an
interrupt. These interrupts can be masked by setting bit IENWP in IENR1.
Reset cleared
Initial program
instruction prefetch
Vector fetch Internal
processing
RES
φ
Internal
address bus
(1)
(2)
Internal read
signal
Internal write
signal
Internal data
bus (16 bits)
(2)
(1) Reset exception handling vector address (H'0000)
(2) Program start address
(3) Initial program instruction
Figure 3.1 Reset Sequence
Rev.5.00 Nov. 02, 2005 Page 58 of 500
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(3)
Section 3 Exception Handling
3.4.2
Internal Interrupts
Each on-chip peripheral module has a flag to show the interrupt request status and the enable bit to
enable or disable the interrupt. For RTC interrupt requests and direct transfer interrupt requests
generated by execution of a SLEEP instruction, this function is included in IRR1, IRR2, IENR1,
and IENR2.
When an on-chip peripheral module requests an interrupt, the corresponding interrupt request
status flag is set to 1, requesting the CPU of an interrupt. These interrupts can be masked by
writing 0 to clear the corresponding enable bit.
3.4.3
Interrupt Handling Sequence
Interrupts are controlled by an interrupt controller.
Interrupt operation is described as follows.
1. If an interrupt occurs while the NMI or interrupt enable bit is set to 1, an interrupt request
signal is sent to the interrupt controller.
2. When multiple interrupt requests are generated, the interrupt controller requests to the CPU for
the interrupt handling with the highest priority at that time according to table 3.1. Other
interrupt requests are held pending.
3. The CPU accepts the NMI and address break without depending on the I bit value. Other
interrupt requests are accepted, if the I bit is cleared to 0 in CCR; if the I bit is set to 1, the
interrupt request is held pending.
4. If the CPU accepts the interrupt after processing of the current instruction is completed,
interrupt exception handling will begin. First, both PC and CCR are pushed onto the stack. The
state of the stack at this time is shown in figure 3.2. The PC value pushed onto the stack is the
address of the first instruction to be executed upon return from interrupt handling.
5. Then, the I bit of CCR is set to 1, masking further interrupts excluding the NMI and address
break. Upon return from interrupt handling, the values of I bit and other bits in CCR will be
restored and returned to the values prior to the start of interrupt exception handling.
6. Next, the CPU generates the vector address corresponding to the accepted interrupt, and
transfers the address to PC as a start address of the interrupt handling-routine. Then a program
starts executing from the address indicated in PC.
Figure 3.3 shows a typical interrupt sequence where the program area is in the on-chip ROM and
the stack area is in the on-chip RAM.
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REJ09B0027-0500
Section 3 Exception Handling
SP – 4
SP (R7)
CCR
SP – 3
SP + 1
CCR*3
SP – 2
SP + 2
PCH
SP – 1
SP + 3
PCL
SP (R7)
SP + 4
Even address
Stack area
Prior to start of interrupt
exception handling
PC and CCR
saved to stack
After completion of interrupt
exception handling
[Legend]
PCH : Upper 8 bits of program counter (PC)
PCL : Lower 8 bits of program counter (PC)
CCR: Condition code register
SP: Stack pointer
Notes: 1. PC shows the address of the first instruction to be executed upon return from the interrupt
handling routine.
2. Register contents must always be saved and restored by word length, starting from
an even-numbered address.
3. Ignored when returning from the interrupt handling routine.
Figure 3.2 Stack Status after Exception Handling
3.4.4
Interrupt Response Time
Table 3.2 shows the number of wait states after an interrupt request flag is set until the first
instruction of the interrupt handling-routine is executed.
Table 3.2
Interrupt Wait States
Item
States
Total
Waiting time for completion of executing instruction*
1 to 23
15 to 37
Saving of PC and CCR to stack
4
Vector fetch
2
Instruction fetch
4
Internal processing
4
Note:
*
Not including EEPMOV instruction.
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REJ09B0027-0500
(2)
(1)
(4)
Instruction
prefetch
(3)
Internal
processing
(5)
(1)
Stack access
(6)
(7)
(9)
Vector fetch
(8)
(1) Instruction prefetch address (Instruction is not executed. Address is saved as PC contents, becoming return address.)
(2)(4) Instruction code (not executed)
(3) Instruction prefetch address (Instruction is not executed.)
(5) SP – 2
(6) SP – 4
(7) CCR
(8) Vector address
(9) Starting address of interrupt-handling routine (contents of vector)
(10) First instruction of interrupt-handling routine
Internal data bus
(16 bits)
Internal write
signal
Internal read
signal
Internal
address bus
φ
Interrupt
request signal
Interrupt level
decision and wait for
end of instruction
Interrupt is
accepted
(10)
(9)
Prefetch instruction of
Internal
interrupt-handling routine
processing
Section 3 Exception Handling
Figure 3.3 Interrupt Sequence
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REJ09B0027-0500
Section 3 Exception Handling
3.5
Usage Notes
3.5.1
Interrupts after Reset
If an interrupt is accepted after a reset and before the stack pointer (SP) is initialized, the PC and
CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset. Since the first instruction of a program is
always executed immediately after the reset state ends, make sure that this instruction initializes
the stack pointer (example: MOV.W #xx: 16, SP).
3.5.2
Notes on Stack Area Use
When word data is accessed, the least significant bit of the address is regarded as 0. Access to the
stack always takes place in word size, so the stack pointer (SP: R7) should never indicate an odd
address. Use PUSH Rn (MOV.W Rn, @–SP) or POP Rn (MOV.W @SP+, Rn) to save or restore
register values.
3.5.3
Notes on Rewriting Port Mode Registers
When a port mode register is rewritten to switch the functions of external interrupt pins, IRQ3 to
IRQ0, and WKP5 to WKP0, the interrupt request flag may be set to 1.
When switching a pin function, mask the interrupt before setting the bit in the port mode register.
After accessing the port mode register, execute at least one instruction (e.g., NOP), then clear the
interrupt request flag from 1 to 0.
Figure 3.4 shows a port mode register setting and interrupt request flag clearing procedure.
CCR I bit ← 1
Interrupts masked. (Another possibility
is to disable the relevant interrupt in
interrupt enable register 1.)
Set port mode register bit
Execute NOP instruction
After setting the port mode register bit,
first execute at least one instruction
(e.g., NOP), then clear the interrupt
request flag to 0.
Clear interrupt request flag to 0
CCR I bit ← 0
Interrupt mask cleared
Figure 3.4 Port Mode Register Setting and Interrupt Request Flag Clearing Procedure
Rev.5.00 Nov. 02, 2005 Page 62 of 500
REJ09B0027-0500
Section 4 Address Break
Section 4 Address Break
The address break simplifies on-board program debugging. It requests an address break interrupt
when the set break condition is satisfied. The interrupt request is not affected by the I bit of CCR.
Break conditions that can be set include instruction execution at a specific address and a
combination of access and data at a specific address. With the address break function, the
execution start point of a program containing a bug is detected and execution is branched to the
correcting program. Figure 4.1 shows a block diagram of the address break.
Internal address bus
Comparator
BARL
ABRKCR
Interrupt
generation
control circuit
ABRKSR
BDRH
Internal data bus
BARH
BDRL
Comparator
Interrupt
[Legend]
BARH, BARL:
BDRH, BDRL:
ABRKCR:
ABRKSR:
Break address register
Break data register
Address break control register
Address break status register
Figure 4.1 Block Diagram of Address Break
4.1
Register Descriptions
Address break has the following registers.
• Address break control register (ABRKCR)
• Address break status register (ABRKSR)
• Break address register (BARH, BARL)
ABK0001A_000020020200
Rev.5.00 Nov. 02, 2005 Page 63 of 500
REJ09B0027-0500
Section 4 Address Break
• Break address register (BARH, BARL)
• Break data register (BDRH, BDRL)
4.1.1
Address Break Control Register (ABRKCR)
ABRKCR sets address break conditions.
Bit
Bit Name
Initial
Value
R/W
Description
7
RTINTE
1
R/W
RTE Interrupt Enable
When this bit is 0, the interrupt immediately after
executing RTE is masked and then one instruction must
be executed. When this bit is 1, the interrupt is not
masked.
6
CSEL1
0
R/W
Condition Select 1 and 0
5
CSEL0
0
R/W
These bits set address break conditions.
00: Instruction execution cycle
01: CPU data read cycle
10: CPU data write cycle
11: CPU data read/write cycle
4
ACMP2
0
R/W
Address Compare Condition Select 2 to 0
3
ACMP1
0
R/W
2
ACMP0
0
R/W
These bits set the comparison condition between the
address set in BAR and the internal address bus.
000: Compares 16-bit addresses
001: Compares upper 12-bit addresses
010: Compares upper 8-bit addresses
011: Compares upper 4-bit addresses
1XX: Reserved (setting prohibited)
1
DCMP1
0
R/W
Data Compare Condition Select 1 and 0
0
DCMP0
0
R/W
These bits set the comparison condition between the data
set in BDR and the internal data bus.
00: No data comparison
01: Compares lower 8-bit data between BDRL and data
bus
10: Compares upper 8-bit data between BDRH and data
bus
11: Compares 16-bit data between BDR and data bus
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 64 of 500
REJ09B0027-0500
Section 4 Address Break
When an address break is set in the data read cycle or data write cycle, the data bus used will
depend on the combination of the byte/word access and address. Table 4.1 shows the access and
data bus used. When an I/O register space with an 8-bit data bus width is accessed in word size, a
byte access is generated twice. For details on data widths of each register, see section 22.1,
Register Addresses (Address Order).
Table 4.1
Access and Data Bus Used
Word Access
Byte Access
Even Address Odd Address
Even Address
Odd Address
ROM space
Upper 8 bits
Lower 8 bits
Upper 8 bits
Upper 8 bits
RAM space
Upper 8 bits
Lower 8 bits
Upper 8 bits
Upper 8 bits
I/O register with 8-bit data
bus width
Upper 8 bits
Upper 8 bits
Upper 8 bits
Upper 8 bits
I/O register with 16-bit data
bus width
Upper 8 bits
Lower 8 bits
4.1.2
Address Break Status Register (ABRKSR)
ABRKSR consists of the address break interrupt flag and the address break interrupt enable bit.
Bit
Bit Name
Initial
Value
R/W
Description
7
ABIF
0
R/W
Address Break Interrupt Flag
[Setting condition]
When the condition set in ABRKCR is satisfied
[Clearing condition]
When 0 is written after ABIF=1 is read
6
ABIE
0
R/W
Address Break Interrupt Enable
When this bit is 1, an address break interrupt request is
enabled.
5 to 0
All 1
Reserved
These bits are always read as 1.
4.1.3
Break Address Registers (BARH, BARL)
BARH and BARL are 16-bit read/write registers that set the address for generating an address
break interrupt. When setting the address break condition to the instruction execution cycle, set
the first byte address of the instruction. The initial value of this register is H'FFFF.
Rev.5.00 Nov. 02, 2005 Page 65 of 500
REJ09B0027-0500
Section 4 Address Break
4.1.4
Break Data Registers (BDRH, BDRL)
BDRH and BDRL are 16-bit read/write registers that set the data for generating an address break
interrupt. BDRH is compared with the upper 8-bit data bus. BDRL is compared with the lower 8bit data bus. When memory or registers are accessed by byte, the upper 8-bit data bus is used for
even and odd addresses in the data transmission. Therefore, comparison data must be set in
BDRH for byte access. For word access, the data bus used depends on the address. See section
4.1.1, Address Break Control Register (ABRKCR), for details. The initial value of this register is
undefined.
4.2
Operation
When the ABIF and ABIE bits in ABRKSR are set to 1, the address break function generates an
interrupt request to the CPU. The ABIF bit in ABRKSR is set to 1 by the combination of the
address set in BAR, the data set in BDR, and the conditions set in ABRKCR. When the interrupt
request is accepted, interrupt exception handling starts after the instruction being executed ends.
The address break interrupt is not masked by the I bit in CCR of the CPU.
Figures 4.2 show the operation examples of the address break interrupt setting.
When the address break is specified in instruction execution cycle
Register setting
• ABRKCR = H'80
• BAR = H'025A
Program
0258
* 025A
025C
0260
0262
:
NOP
NOP
MOV.W @H'025A,R0
NOP
NOP
:
Underline indicates the address
to be stacked.
NOP
NOP
MOV
MOV
instruc- instruc- instruc- instruction
tion
tion 1
tion 2
Internal
prefetch prefetch prefetch prefetch processing
Stack save
φ
Address
bus
0258
025A
025C
025E
SP-2
SP-4
Interrupt
request
Interrupt acceptance
Figure 4.2 Address Break Interrupt Operation Example (1)
Rev.5.00 Nov. 02, 2005 Page 66 of 500
REJ09B0027-0500
Section 4 Address Break
When the address break is specified in the data read cycle
Register setting
• ABRKCR = H'A0
• BAR = H'025A
Program
0258
025A
* 025C
0260
0262
:
NOP
NOP
MOV.W @H'025A,R0
NOP
Underline indicates the address
NOP
to be stacked.
:
MOV
MOV
NOP
MOV
NOP
Next
instruc- instruc- instruc- instruc- instruc- instrution 1
tion 2
tion
tion
tion
ction
Internal Stack
prefetch prefetch prefetch execution prefetch prefetch processing save
φ
Address
bus
025C
025E
0260
025A
0262
0264
SP-2
Interrupt
request
Interrupt acceptance
Figure 4.2 Address Break Interrupt Operation Example (2)
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Section 4 Address Break
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REJ09B0027-0500
Section 5 Clock Pulse Generators
Section 5 Clock Pulse Generators
Clock oscillator circuitry (CPG: clock pulse generator) is provided on-chip, including both a
system clock pulse generator and a subclock pulse generator. The system clock pulse generator
consists of a system clock oscillator, a duty correction circuit, and system clock dividers. The
subclock pulse generator consists of a subclock oscillator circuit and a subclock divider.
Figure 5.1 shows a block diagram of the clock pulse generators.
OSC1
OSC2
System
clock
oscillator
φOSC
(fOSC)
Duty
correction
circuit
φOSC
(fOSC)
System
clock
divider
φOSC
φOSC/8
φOSC/16
φOSC/32
φOSC/64
System clock pulse generator
X1
X2
Subclock
oscillator
φ
Prescaler S
(13 bits)
φ/2
to
φ/8192
φW/2
φW
(fW)
Subclock
divider
φW/4
φSUB
φW/8
Prescaler W
(5 bits)
φW/8
to
φW/128
Subclock pulse generator
Figure 5.1 Block Diagram of Clock Pulse Generators
The basic clock signals that drive the CPU and on-chip peripheral modules are φ and φ SUB. The
system clock is divided by prescaler S to become a clock signal from φ/8192 to φ/2, and the
subclock is divided by prescaler W to become a clock signal from φw/128 to φw/8. Both the
system clock and subclock signals are provided to the on-chip peripheral modules.
CPG0200A_000020020200
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Section 5 Clock Pulse Generators
5.1
System Clock Generator
Clock pulses can be supplied to the system clock divider either by connecting a crystal or ceramic
resonator, or by providing external clock input. Figure 5.2 shows a block diagram of the system
clock generator.
OSC 2
LPM
OSC 1
LPM: Low-power mode (standby mode, subactive mode, subsleep mode)
Figure 5.2 Block Diagram of System Clock Generator
5.1.1
Connecting Crystal Resonator
Figure 5.3 shows a typical method of connecting a crystal resonator. An AT-cut parallel-resonance
crystal resonator should be used. Figure 5.4 shows the equivalent circuit of a crystal resonator. A
resonator having the characteristics given in table 5.1 should be used.
C1
OSC 1
C2
OSC 2
C1 = C 2 = 10 to 22 pF
Figure 5.3 Typical Connection to Crystal Resonator
LS
RS
CS
OSC 1
OSC 2
C0
Figure 5.4 Equivalent Circuit of Crystal Resonator
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Section 5 Clock Pulse Generators
Table 5.1
Crystal Resonator Parameters
Frequency (MHz)
2
4
8
10
16
20
RS (max)
500 Ω
120 Ω
80 Ω
60 Ω
50 Ω
40 Ω
C0 (max)
7 pF
7 pF
7 pF
7 pF
7 pF
7 pF
5.1.2
Connecting Ceramic Resonator
Figure 5.5 shows a typical method of connecting a ceramic resonator.
C1
OSC1
C2
OSC2
C1 = 5 to 30 pF
C2 = 5 to 30 pF
Figure 5.5 Typical Connection to Ceramic Resonator
5.1.3
External Clock Input Method
Connect an external clock signal to pin OSC1, and leave pin OSC2 open. Figure 5.6 shows a typical
connection. The duty cycle of the external clock signal must be 45 to 55%.
OSC1
OSC 2
External clock input
Open
Figure 5.6 Example of External Clock Input
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Section 5 Clock Pulse Generators
5.2
Subclock Generator
Figure 5.7 shows a block diagram of the subclock generator.
X2
8MΩ
X1
Note : Registance is a reference value.
Figure 5.7 Block Diagram of Subclock Generator
5.2.1
Connecting 32.768-kHz Crystal Resonator
Clock pulses can be supplied to the subclock divider by connecting a 32.768-kHz crystal
resonator, as shown in figure 5.8. Figure 5.9 shows the equivalent circuit of the 32.768-kHz crystal
resonator.
C1
X1
C2
X2
C1 = C 2 = 15 pF (typ.)
Figure 5.8 Typical Connection to 32.768-kHz Crystal Resonator
LS
CS
RS
X1
X2
CO
CO = 1.5 pF (typ.)
RS = 14 kΩ (typ.)
fW = 32.768 kHz
Note: Constants are reference values.
Figure 5.9 Equivalent Circuit of 32.768-kHz Crystal Resonator
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Section 5 Clock Pulse Generators
5.2.2
Pin Connection when Not Using Subclock
When the subclock is not used, connect pin X1 to VCL or VSS and leave pin X2 open, as shown in
figure 5.10.
VCL or VSS
X1
X2
Open
Figure 5.10 Pin Connection when not Using Subclock
5.3
Prescalers
5.3.1
Prescaler S
Prescaler S is a 13-bit counter using the system clock (ø) as its input clock. It is incremented once
per clock period. Prescaler S is initialized to H'0000 by a reset, and starts counting on exit from
the reset state. In standby mode, subactive mode, and subsleep mode, the system clock pulse
generator stops. Prescaler S also stops and is initialized to H'0000. The CPU cannot read or write
prescaler S. The output from prescaler S is shared by the on-chip peripheral modules. The divider
ratio can be set separately for each on-chip peripheral function. In active mode and sleep mode,
the clock input to prescaler S is determined by the division factor designated by MA2 to MA0 in
SYSCR2.
5.3.2
Prescaler W
Prescaler W is a 5-bit counter using a 32.768 kHz signal divided by 4 (øW/4) as its input clock. The
divided output is used for clock time base operation of timer A. Prescaler W is initialized to H'00
by a reset, and starts counting on exit from the reset state. Even in standby mode, subactive mode,
or subsleep mode, prescaler W continues functioning so long as clock signals are supplied to pins
X1 and X2.
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Section 5 Clock Pulse Generators
5.4
Usage Notes
5.4.1
Note on Resonators
Resonator characteristics are closely related to board design and should be carefully evaluated by
the user, referring to the examples shown in this section. Resonator circuit constants will differ
depending on the resonator element, stray capacitance in its interconnecting circuit, and other
factors. Suitable constants should be determined in consultation with the resonator element
manufacturer. Design the circuit so that the resonator element never receives voltages exceeding
its maximum rating.
5.4.2
Notes on Board Design
When using a crystal resonator (ceramic resonator), place the resonator and its load capacitors as
close as possible to the OSC1 and OSC2 pins. Other signal lines should be routed away from the
resonator circuit to prevent induction from interfering with correct oscillation (see figure 5.11).
Signal A
Avoid
Signal B
C1
OSC1
C2
OSC2
Figure 5.11 Example of Incorrect Board Design
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Section 6 Power-Down Modes
Section 6 Power-Down Modes
This LSI has six modes of operation after a reset. These include a normal active mode and four
power-down modes, in which power consumption is significantly reduced. Module standby mode
reduces power consumption by selectively halting on-chip module functions.
• Active mode
The CPU and all on-chip peripheral modules are operable on the system clock. The system
clock frequency can be selected from φosc, φosc/8, φosc/16, φosc/32, and φosc/64.
• Subactive mode
The CPU and all on-chip peripheral modules are operable on the subclock. The subclock
frequency can be selected from φw/2, φw/4, and φw/8.
• Sleep mode
The CPU halts. On-chip peripheral modules are operable on the system clock.
• Subsleep mode
The CPU halts. On-chip peripheral modules are operable on the subclock.
• Standby mode
The CPU and all on-chip peripheral modules halt. When the clock time-base function is
selected, the RTC is operable.
• Module standby mode
Independent of the above modes, power consumption can be reduced by halting on-chip
peripheral modules that are not used in module units.
6.1
Register Descriptions
The registers related to power-down modes are listed below.
•
•
•
•
System control register 1 (SYSCR1)
System control register 2 (SYSCR2)
Module standby control register 1 (MSTCR1)
Module standby control register 2 (MSTCR2)
LPW3002A_000120030300
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Section 6 Power-Down Modes
6.1.1
System Control Register 1 (SYSCR1)
SYSCR1 controls the power-down modes, as well as SYSCR2.
Bit
Bit Name
Initial
Value
R/W
Description
7
SSBY
0
R/W
Software Standby
This bit selects the mode to transit after the execution of
the SLEEP instruction.
0: Enters sleep mode or subsleep mode.
1: Enters standby mode.
For details, see table 6.2.
6
STS2
0
R/W
Standby Timer Select 2 to 0
5
STS1
0
R/W
4
STS0
0
R/W
These bits designate the time the CPU and peripheral
modules wait for stable clock operation after exiting from
standby mode, subactive mode, or subsleep mode to
active mode or sleep mode due to an interrupt. The
designation should be made according to the clock
frequency so that the waiting time is at least 6.5 ms. The
relationship between the specified value and the number
of wait states is shown in table 6.1. When an external
clock is to be used, the minimum value (STS2 = STS1 =
STS0 =1) is recommended.
3
NESEL
0
R/W
Noise Elimination Sampling Frequency Select
The subclock pulse generator generates the watch clock
signal (φW) and the system clock pulse generator
generates the oscillator clock (φOSC). This bit selects the
sampling frequency of the oscillator clock when the watch
clock signal (φW) is sampled. When φOSC = 4 to 20 MHz,
clear NESEL to 0.
0: Sampling rate is φOSC/16
1: Sampling rate is φOSC/4
2 to 0
All 0
Reserved
These bits are always read as 0.
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Section 6 Power-Down Modes
Table 6.1
Operating Frequency and Waiting Time
Bit Name
Operating Frequency
STS2 STS1 STS0 Waiting Time
0
0
1
1
0
1
20 MHz 16 MHz
10 MHz 8 MHz 4 MHz 2 MHz 1 MHz 0.5 MHz
0
8,192 states
0.4
0.5
0.8
1.0
2.0
4.1
8.1
16.4
1
16,384 states
0.8
1.0
1.6
2.0
4.1
8.2
16.4
32.8
0
32,768 states
1.6
2.0
3.3
4.1
8.2
16.4
32.8
65.5
1
65,536 states
3.3
4.1
6.6
8.2
16.4
32.8
65.5
131.1
0
131,072 states
6.6
8.2
13.1
16.4
32.8
65.5
131.1 262.1
1
1,024 states
0.05
0.06
0.10
0.13
0.26
0.51
1.02
2.05
0
128 states
0.00
0.00
0.01
0.02
0.03
0.06
0.13
0.26
1
16 states
0.00
0.00
0.00
0.00
0.00
0.01
0.02
0.03
Note: Time unit is ms.
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Section 6 Power-Down Modes
6.1.2
System Control Register 2 (SYSCR2)
SYSCR2 controls the power-down modes, as well as SYSCR1.
Bit
Bit Name
Initial
Value
R/W
Description
7
SMSEL
0
R/W
Sleep Mode Selection
6
LSON
0
R/W
Low Speed on Flag
5
DTON
0
R/W
Direct Transfer on Flag
These bits select the mode to enter after the execution of
a SLEEP instruction, as well as bit SSBY of SYSCR1.
For details, see table 6.2.
4
MA2
0
R/W
Active Mode Clock Select 2 to 0
3
MA1
0
R/W
2
MA0
0
R/W
These bits select the operating clock frequency in active
and sleep modes. The operating clock frequency
changes to the set frequency after the SLEEP instruction
is executed.
0XX: φOSC
100: φOSC/8
101: φOSC/16
110: φOSC/32
111: φOSC/64
1
SA1
0
R/W
Subactive Mode Clock Select 1 and 0
0
SA0
0
R/W
These bits select the operating clock frequency in
subactive and subsleep modes. The operating clock
frequency changes to the set frequency after the SLEEP
instruction is executed.
00: φW/8
01: φW/4
1X: φW/2
Legend: Don't care.
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Section 6 Power-Down Modes
6.1.3
Module Standby Control Register 1 (MSTCR1)
MSTCR1 allows the on-chip peripheral modules to enter a standby state in module units.
Bit
Bit Name
Initial
Value
R/W
Description
7
0
Reserved
This bit is always read as 0.
6
MSTIIC
0
R/W
IIC2 Module Standby
IIC2 enters standby mode when this bit is set to 1
5
MSTS3
0
R/W
SCI3 Module Standby
4
MSTAD
0
R/W
A/D Converter Module Standby
SCI3 enters standby mode when this bit is set to 1
A/D converter enters standby mode when this bit is set to
1
3
MSTWD
0
R/W
Watchdog Timer Module Standby
Watchdog timer enters standby mode when this bit is set
to 1.When the internal oscillator is selected for the
watchdog timer clock, the watchdog timer operates
regardless of the setting of this bit
2
0
Reserved
This bit is always read as 0.
1
MSTTV
0
R/W
Timer V Module Standby
Timer V enters standby mode when this bit is set to 1
0
MSTTA
0
R/W
RTC Module Standby
RTC enters standby mode when this bit is set to 1
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Section 6 Power-Down Modes
6.1.4
Module Standby Control Register 2 (MSTCR2)
MSTCR2 allows the on-chip peripheral modules to enter a standby state in module units.
Bit
Bit Name
Initial
Value
R/W
Description
7
MSTS3_2
0
R/W
SCI3_2 Module Standby
SCI3_2 enters standby mode when this bit is set to1
6, 5
All 0
Reserved
These bits are always read as 0.
4
MSTTB1
0
R/W
Timer B1 Module Standby
3, 2
All 0
Reserved
Timer B1 enters standby mode when this bit is set to1
These bits are always read as 0.
1
MSTTZ
0
R/W
Timer Z Module Standby
Timer Z enters standby mode when this bit is set to1
0
MSTPWM 0
R/W
PWM Module Standby
PWM enters standby mode when this bit is set to1
6.2
Mode Transitions and States of LSI
Figure 6.1 shows the possible transitions among these operating modes. A transition is made from
the program execution state to the program halt state by executing a SLEEP instruction. Interrupts
allow for returning from the program halt state to the program execution state. A direct transition
between active mode and subactive mode, which are both program execution states, can be made
without halting the program. The operating frequency can also be changed in the same modes by
making a transition directly from active mode to active mode, and from subactive mode to
subactive mode. RES input enables transitions from a mode to the reset state. Table 6.2 shows the
transition conditions of each mode after the SLEEP instruction is executed and a mode to return
by an interrupt. Table 6.3 shows the internal states of the LSI in each mode.
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Section 6 Power-Down Modes
Reset state
Program halt state
Program execution state
SLEEP
instruction
Direct transition
interrupt
SLEEP
instruction
Sleep mode
Active mode
Standby mode
Program halt state
Interrupt
Interrupt
SLEEP
instruction
Direct
transition
interrupt
Direct
transition
interrupt
Interrupt
SLEEP
instruction
SLEEP
instruction
Interrupt
SLEEP
instruction
Subactive
mode
Subsleep mode
Interrupt
Direct transition
interrupt
Notes: 1. To make a transition to another mode by an interrupt, make sure interrupt handling is after the interrupt
is accepted.
2. Details on the mode transition conditions are given in table 6.2.
Figure 6.1 Mode Transition Diagram
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Section 6 Power-Down Modes
Table 6.2
Transition Mode after SLEEP Instruction Execution and Transition Mode due
to Interrupt
DTON
SSBY
SMSEL
LSON
Transition Mode after
SLEEP Instruction
Execution
0
0
0
0
Sleep mode
1
1
0
Legend:
*
Active mode
Subactive mode
Subsleep mode
1
1
Transition Mode due to
Interrupt
Active mode
Subactive mode
1
X
X
Standby mode
Active mode
X
0*
0
Active mode
(direct transition)
X
X
1
Subactive mode
(direct transition)
X: Don’t care.
When a state transition is performed while SMSEL is 1, timer V, SCI3, SCI3_2 and the
A/D converter are reset, and all registers are set to their initial values. To use these
functions after entering active mode, reset the registers.
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Section 6 Power-Down Modes
Table 6.3
Internal State in Each Operating Mode
Function
Active Mode
Sleep Mode
Subactive
Mode
Subsleep
Mode
Standby
Mode
System clock oscillator
Functioning
Functioning
Halted
Halted
Halted
Subclock oscillator
Functioning
Functioning
Functioning
Functioning
Functioning
CPU
operations
Instructions
Functioning
Halted
Functioning
Halted
Halted
Registers
Functioning
Retained
Functioning
Retained
Retained
RAM
Functioning
Retained
Functioning
Retained
Retained
IO ports
Functioning
Retained
Functioning
Retained
Register
contents are
retained, but
output is the
highimpedance
state.
IRQ3 to IRQ0
Functioning
Functioning
Functioning
Functioning
Functioning
WKP5 to
WKP0
Functioning
Functioning
Functioning
Functioning
Functioning
RTC
Functioning
Functioning
Functioning if the timekeeping time-base
function is selected, and retained if not selected
Timer V
Functioning
Functioning
Reset
Watchdog
timer
Functioning
Functioning
Retained (functioning if the internal oscillator is
selected as a count clock*)
SCI3, SCI3_2
Functioning
Functioning
Reset
External
interrupts
Peripheral
functions
Note:
*
Reset
Reset
Reset
Reset
IIC2
Functioning
Functioning
Retained*
Retained
Retained
Timer B1
Functioning
Functioning
Retained*
Retained
Retained
Timer Z
Functioning
Functioning
Retained (the counter increments according to
subclocks if the internal clock (φ) is selected as
a count clock*)
A/D converter
Functioning
Functioning
Reset
Reset
Reset
Registers can be read or written in subactive mode.
Rev.5.00 Nov. 02, 2005 Page 83 of 500
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Section 6 Power-Down Modes
6.2.1
Sleep Mode
In sleep mode, CPU operation is halted but the on-chip peripheral modules function at the clock
frequency set by the MA2, MA1, and MA0 bits in SYSCR2. CPU register contents are retained.
When an interrupt is requested, sleep mode is cleared and interrupt exception handling starts.
Sleep mode is not cleared if the I bit of the condition code register (CCR) is set to 1 or the
requested interrupt is disabled in the interrupt enable register. After sleep mode is cleared, a
transition is made to active mode when the LSON bit in SYSCR2 is 0, and a transition is made to
subactive mode when the bit is 1.
When the RES pin goes low, the CPU goes into the reset state and sleep mode is cleared.
6.2.2
Standby Mode
In standby mode, the clock pulse generator stops, so the CPU and on-chip peripheral modules stop
functioning. However, as long as the rated voltage is supplied, the contents of CPU registers, onchip RAM, and some on-chip peripheral module registers are retained. On-chip RAM contents
will be retained as long as the voltage set by the RAM data retention voltage is provided. The I/O
ports go to the high-impedance state.
Standby mode is cleared by an interrupt. When an interrupt is requested, the system clock pulse
generator starts. After the time set in bits STS2 to STS0 in SYSCR1 has elapsed, and interrupt
exception handling starts. Standby mode is not cleared if the I bit of CCR is set to 1 or the
requested interrupt is disabled in the interrupt enable register.
When the RES pin goes low, the system clock pulse generator starts. Since system clock signals
are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the
RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator
output has stabilized, the CPU starts reset exception handling if the RES pin is driven high.
6.2.3
Subsleep Mode
In subsleep mode, operation of the CPU and on-chip peripheral modules other than RTC is halted.
As long as a required voltage is applied, the contents of CPU registers, the on-chip RAM, and
some registers of the on-chip peripheral modules are retained. I/O ports keep the same states as
before the transition.
Subsleep mode is cleared by an interrupt. When an interrupt is requested, subsleep mode is cleared
and interrupt exception handling starts. Subsleep mode is not cleared if the I bit of CCR is set to 1
or the requested interrupt is disabled in the interrupt enable register. After subsleep mode is
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Section 6 Power-Down Modes
cleared, a transition is made to active mode when the LSON bit in SYSCR2 is 0, and a transition is
made to subactive mode when the bit is 1. After the time set in bits STS2 to STS0 in SYSCR1 has
elapsed, a transition is made to active mode.
When the RES pin goes low, the system clock pulse generator starts. Since system clock signals
are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the
RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator
output has stabilized, the CPU starts reset exception handling if the RES pin is driven high.
6.2.4
Subactive Mode
The operating frequency of subactive mode is selected from φW/2, φW/4, and φW/8 by the SA1 and
SA0 bits in SYSCR2. After the SLEEP instruction is executed, the operating frequency changes to
the frequency which is set before the execution. When the SLEEP instruction is executed in
subactive mode, a transition to sleep mode, subsleep mode, standby mode, active mode, or
subactive mode is made, depending on the combination of SYSCR1 and SYSCR2. When the RES
pin goes low, the system clock pulse generator starts. Since system clock signals are supplied to
the entire chip as soon as the system clock pulse generator starts functioning, the RES pin must be
kept low until the pulse generator output stabilizes. After the pulse generator output has stabilized,
the CPU starts reset exception handling if the RES pin is driven high.
6.3
Operating Frequency in Active Mode
Operation in active mode is clocked at the frequency designated by the MA2, MA1, and MA0 bits
in SYSCR2. The operating frequency changes to the set frequency after SLEEP instruction
execution.
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Section 6 Power-Down Modes
6.4
Direct Transition
The CPU can execute programs in two modes: active and subactive modes. A direct transition is a
transition between these two modes without stopping program execution. A direct transition can
be made by executing a SLEEP instruction while the DTON bit in SYSCR2 is set to 1. The direct
transition also enables operating frequency modification in active or subactive mode. After the
mode transition, direct transition interrupt exception handling starts.
If the direct transition interrupt is disabled in interrupt enable register 1, a transition is made
instead to sleep or subsleep mode. Note that if a direct transition is attempted while the I bit in
CCR is set to 1, sleep or subsleep mode will be entered, and the resulting mode cannot be cleared
by means of an interrupt.
6.4.1
Direct Transition from Active Mode to Subactive Mode
The time from the start of SLEEP instruction execution to the end of interrupt exception handling
(the direct transition time) is calculated by equation (1).
Direct transition time = {(number of SLEEP instruction execution states) + (number of internal
processing states)}× (tcyc before transition) + (number of interrupt exception handling states) ×
(tsubcyc after transition) (1)
Example
Direct transition time = (2 + 1) × tosc + 14 × 8tw = 3tosc + 112tw
(when the CPU operating clock of φosc → φw/8 is selected)
Legend
tosc: OSC clock cycle time
tw: Watch clock cycle time
tcyc: System clock (φ) cycle time
tsubcyc: Subclock (φSUB) cycle time
6.4.2
Direct Transition from Subactive Mode to Active Mode
The time from the start of SLEEP instruction execution to the end of interrupt exception handling
(the direct transition time) is calculated by equation (2).
Direct transition time = {(number of SLEEP instruction execution states) + (number of internal
processing states)} × (tsubcyc before transition) + {(waiting time set in bits STS2 to STS0) +
(number of interrupt exception handling states)} × (tcyc after transition)
(2)
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Section 6 Power-Down Modes
Example
Direct transition time = (2 + 1) × 8tw + (8192 + 14) × tosc = 24tw + 8206tosc
(when the CPU operating clock of φw/8 → φosc and a waiting time of 8192 states are selected)
Legend
tosc: OSC clock cycle time
tw: Watch clock cycle time
tcyc: System clock (φ) cycle time
tsubcyc: Subclock (φSUB) cycle time
6.5
Module Standby Function
The module-standby function can be set to any peripheral module. In module standby mode, the
clock supply to modules stops to enter the power-down mode. Module standby mode enables each
on-chip peripheral module to enter the standby state by setting a bit that corresponds to each
module to 1 and cancels the mode by clearing the bit to 0.
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Section 6 Power-Down Modes
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Section 7 ROM
Section 7 ROM
The features of the 56-kbyte or 32-kbyte flash memories built into the flash memory (F-ZTAT)
version are summarized below.
• Programming/erase methods
The flash memory is programmed 128 bytes at a time. Erase is performed in single-block
units. The flash memory is configured as follows: 1 kbyte × 4 blocks, 28 kbytes × 1 block,
16 kbytes × 1 block, and 8 kbytes × 1 block for H8/3687F and 1 kbyte × 4 blocks and 28
kbytes × 1 block for H8/3684F. To erase the entire flash memory, each block must be
erased in turn.
• Reprogramming capability
The flash memory can be reprogrammed up to 1,000 times.
• On-board programming
On-board programming/erasing can be done in boot mode, in which the boot program built
into the chip is started to erase or program of the entire flash memory. In normal user
program mode, individual blocks can be erased or programmed.
• Programmer mode
Flash memory can be programmed/erased in programmer mode using a PROM
programmer, as well as in on-board programming mode.
• Automatic bit rate adjustment
For data transfer in boot mode, this LSI's bit rate can be automatically adjusted to match
the transfer bit rate of the host.
• Programming/erasing protection
Sets software protection against flash memory programming/erasing.
• Power-down mode
Operation of the power supply circuit can be partly halted in subactive mode. As a result,
flash memory can be read with low power consumption.
7.1
Block Configuration
Figure 7.1 shows the block configuration of flash memory. The thick lines indicate erasing units,
the narrow lines indicate programming units, and the values are addresses. The 56-kbyte flash
memory is divided into 1 kbyte × 4 blocks, 28 kbytes × 1 block, 16 kbytes × 1 block, and 8 kbytes
× 1 block. The 32-kbyte flash memory is divided into 1 kbyte × 4 blocks and 28 kbytes × 1 blocks.
Erasing is performed in these units. Programming is performed in 128-byte units starting from an
address with lower eight bits H'00 or H'80.
ROM3560A_000120030300
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Erase unit
H'0000
H'0001
H'0002
H'0080
H'0081
H'0082
H'0380
H'0381
H'0382
H'0400
H'0401
H'0402
H'0480
H'0481
H'0481
H'0780
H'0781
H'0782
H'0800
H'0801
H'0802
H'0880
H'0881
H'0882
H'0B80
H'0B81
H'0B82
H'0C00
H'0C01
H'0C02
H'0C80
H'0C81
H'0C82
H'0F80
H'0F81
H'0F82
H'1000
H'1001
H'1002
H'1080
H'1081
H'1082
H'7F80
H'7F81
H'7F82
H'8000
H'8001
H'8002
H'8080
H'8081
H'8082
Programming unit: 128 bytes
H'007F
H'00FF
1 kbyte
Erase unit
H'03FF
Programming unit: 128 bytes
H'047F
H'04FF
1 kbyte
Erase unit
H'07FF
Programming unit: 128 bytes
H'087F
H'08FF
1 kbyte
Erase unit
H'0BFF
Programming unit: 128 bytes
H'0C7F
H'0CFF
1 kbyte
Erase unit
H'0FFF
Programming unit: 128 bytes
H'107F
H'10FF
28 kbytes
Erase unit
H'7FFF
Programming unit: 128 bytes
H'807F
H'80FF
16 kbytes
Erase unit
H'BF80
H'BF81
H'BF82
H'C000
H'C001
H'C002
H'C080
H'C081
H'C082
H'C0FF
HDF80
H'DF81
H'DF82
H'DFFF
H'BFFF
Programming unit: 128 bytes
H'C07F
8 kbytes
Figure 7.1 Flash Memory Block Configuration
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7.2
Register Descriptions
The flash memory has the following registers.
•
•
•
•
•
Flash memory control register 1 (FLMCR1)
Flash memory control register 2 (FLMCR2)
Erase block register 1 (EBR1)
Flash memory power control register (FLPWCR)
Flash memory enable register (FENR)
7.2.1
Flash Memory Control Register 1 (FLMCR1)
FLMCR1 is a register that makes the flash memory change to program mode, program-verify
mode, erase mode, or erase-verify mode. For details on register setting, refer to section 7.4, Flash
Memory Programming/Erasing.
Bit
Bit Name
Initial
Value
R/W
Description
7
0
Reserved
This bit is always read as 0.
6
SWE
0
R/W
Software Write Enable
When this bit is set to 1, flash memory
programming/erasing is enabled. When this bit is cleared
to 0, other FLMCR1 register bits and all EBR1 bits cannot
be set.
5
ESU
0
R/W
Erase Setup
When this bit is set to 1, the flash memory changes to the
erase setup state. When it is cleared to 0, the erase
setup state is cancelled. Set this bit to 1 before setting the
E bit to 1 in FLMCR1.
4
PSU
0
R/W
Program Setup
When this bit is set to 1, the flash memory changes to the
program setup state. When it is cleared to 0, the program
setup state is cancelled. Set this bit to 1 before setting
the P bit in FLMCR1.
3
EV
0
R/W
Erase-Verify
When this bit is set to 1, the flash memory changes to
erase-verify mode. When it is cleared to 0, erase-verify
mode is cancelled.
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Bit
Bit Name
Initial
Value
R/W
Description
2
PV
0
R/W
Program-Verify
When this bit is set to 1, the flash memory changes to
program-verify mode. When it is cleared to 0, programverify mode is cancelled.
1
E
0
R/W
Erase
When this bit is set to 1 while SWE=1 and ESU=1, the
flash memory changes to erase mode. When it is cleared
to 0, erase mode is cancelled.
0
P
0
R/W
Program
When this bit is set to 1 while SWE=1 and PSU=1, the
flash memory changes to program mode. When it is
cleared to 0, program mode is cancelled.
7.2.2
Flash Memory Control Register 2 (FLMCR2)
FLMCR2 is a register that displays the state of flash memory programming/erasing. FLMCR2 is a
read-only register, and should not be written to.
Bit
Bit Name
Initial
Value
R/W
Description
7
FLER
0
R
Flash Memory Error
Indicates that an error has occurred during an operation
on flash memory (programming or erasing). When FLER
is set to 1, flash memory goes to the error-protection
state.
See section 7.5.3, Error Protection, for details.
6 to 0
All 0
Reserved
These bits are always read as 0.
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7.2.3
Erase Block Register 1 (EBR1)
EBR1 specifies the flash memory erase area block. EBR1 is initialized to H'00 when the SWE bit
in FLMCR1 is 0. Do not set more than one bit at a time, as this will cause all the bits in EBR1 to
be automatically cleared to 0.
Bit
Bit Name
Initial
Value
R/W
Description
7
0
Reserved
This bit is always read as 0.
6
EB6
0
R/W
When this bit is set to 1, 8 bytes of H'C000 to H'DFFF will
be erased.
5
EB5
0
R/W
When this bit is set to 1, 16 bytes of H'8000 to H'BFFF
will be erased.
4
EB4
0
R/W
When this bit is set to 1, 28 kbytes of H'1000 to H'7FFF
will be erased.
3
EB3
0
R/W
When this bit is set to 1, 1 kbyte of H'0C00 to H'0FFF will
be erased.
2
EB2
0
R/W
When this bit is set to 1, 1 kbyte of H'0800 to H'0BFF will
be erased.
1
EB1
0
R/W
When this bit is set to 1, 1 kbyte of H'0400 to H'07FF will
be erased.
0
EB0
0
R/W
When this bit is set to 1, 1 kbyte of H'0000 to H'03FF will
be erased.
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7.2.4
Flash Memory Power Control Register (FLPWCR)
FLPWCR enables or disables a transition to the flash memory power-down mode when the LSI
switches to subactive mode. There are two modes: mode in which operation of the power supply
circuit of flash memory is partly halted in power-down mode and flash memory can be read, and
mode in which even if a transition is made to subactive mode, operation of the power supply
circuit of flash memory is retained and flash memory can be read.
Bit
Bit Name
Initial
Value
R/W
Description
7
PDWND
0
R/W
Power-Down Disable
When this bit is 0 and a transition is made to subactive
mode, the flash memory enters the power-down mode.
When this bit is 1, the flash memory remains in the
normal mode even after a transition is made to subactive
mode.
6 to 0
All 0
Reserved
These bits are always read as 0.
7.2.5
Flash Memory Enable Register (FENR)
Bit 7 (FLSHE) in FENR enables or disables the CPU access to the flash memory control registers,
FLMCR1, FLMCR2, EBR1, and FLPWCR.
Bit
Bit Name
Initial
Value
R/W
Description
7
FLSHE
0
R/W
Flash Memory Control Register Enable
Flash memory control registers can be accessed when
this bit is set to 1. Flash memory control registers cannot
be accessed when this bit is set to 0.
6 to 0
All 0
Reserved
These bits are always read as 0.
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7.3
On-Board Programming Modes
There are two modes for programming/erasing of the flash memory; boot mode, which enables onboard programming/erasing, and programmer mode, in which programming/erasing is performed
with a PROM programmer. On-board programming/erasing can also be performed in user
program mode. At reset-start in reset mode, this LSI changes to a mode depending on the TEST
pin settings, NMI pin settings, and input level of each port, as shown in table 7.1. The input level
of each pin must be defined four states before the reset ends.
When changing to boot mode, the boot program built into this LSI is initiated. The boot program
transfers the programming control program from the externally-connected host to on-chip RAM
via SCI3. After erasing the entire flash memory, the programming control program is executed.
This can be used for programming initial values in the on-board state or for a forcible return when
programming/erasing can no longer be done in user program mode. In user program mode,
individual blocks can be erased and programmed by branching to the user program/erase control
program prepared by the user.
Table 7.1
Setting Programming Modes
TEST
NMI
P85
PB0
PB1
PB2
LSI State after Reset End
0
1
X
X
X
X
User Mode
0
0
1
X
X
X
Boot Mode
1
X
X
0
0
0
Programmer Mode
Legend: X : Don’t care.
7.3.1
Boot Mode
Table 7.2 shows the boot mode operations between reset end and branching to the programming
control program.
1. When boot mode is used, the flash memory programming control program must be prepared in
the host beforehand. Prepare a programming control program in accordance with the
description in section 7.4, Flash Memory Programming/Erasing.
2. SCI3 should be set to asynchronous mode, and the transfer format as follows: 8-bit data, 1 stop
bit, and no parity.
3. When the boot program is initiated, the chip measures the low-level period of asynchronous
SCI communication data (H'00) transmitted continuously from the host. The chip then
calculates the bit rate of transmission from the host, and adjusts the SCI3 bit rate to match that
of the host. The reset should end with the RxD pin high. The RxD and TxD pins should be
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Section 7 ROM
4.
5.
6.
7.
8.
pulled up on the board if necessary. After the reset is complete, it takes approximately 100
states before the chip is ready to measure the low-level period.
After matching the bit rates, the chip transmits one H'00 byte to the host to indicate the
completion of bit rate adjustment. The host should confirm that this adjustment end indication
(H'00) has been received normally, and transmit one H'55 byte to the chip. If reception could
not be performed normally, initiate boot mode again by a reset. Depending on the host's
transfer bit rate and system clock frequency of this LSI, there will be a discrepancy between
the bit rates of the host and the chip. To operate the SCI properly, set the host's transfer bit
rate and system clock frequency of this LSI within the ranges listed in table 7.3.
In boot mode, a part of the on-chip RAM area is used by the boot program. The area H'F780 to
H'FEEF is the area to which the programming control program is transferred from the host.
The boot program area cannot be used until the execution state in boot mode switches to the
programming control program.
Before branching to the programming control program, the chip terminates transfer operations
by SCI3 (by clearing the RE and TE bits in SCR to 0), however the adjusted bit rate value
remains set in BRR. Therefore, the programming control program can still use it for transfer
of program data or verify data with the host. The TxD pin is high (PCR22 = 1, P22 = 1). The
contents of the CPU general registers are undefined immediately after branching to the
programming control program. These registers must be initialized at the beginning of the
programming control program, as the stack pointer (SP), in particular, is used implicitly in
subroutine calls, etc.
Boot mode can be cleared by a reset. End the reset after driving the reset pin low, waiting at
least 20 states, and then setting the NMI pin. Boot mode is also cleared when a WDT overflow
occurs.
Do not change the TEST pin and NMI pin input levels in boot mode.
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Boot Mode Operation
Host Operation
Communication Contents
Processing Contents
Transfer of number of bytes of
programming control program
Flash memory erase
Bit rate adjustment
Boot mode initiation
Item
Table 7.2
LSI Operation
Processing Contents
Branches to boot program at reset-start.
Boot program initiation
Continuously transmits data H'00
at specified bit rate.
Transmits data H'55 when data H'00
is received error-free.
H'00, H'00 . . . H'00
H'00
H'55
Boot program
erase error
H'AA reception
Transmits number of bytes (N) of
programming control program to be
transferred as 2-byte data
(low-order byte following high-order
byte)
Transmits 1-byte of programming
control program (repeated for N times)
H'AA reception
H'FF
H'AA
Upper bytes, lower bytes
Echoback
H'XX
Echoback
H'AA
• Measures low-level period of receive data
H'00.
• Calculates bit rate and sets BRR in SCI3.
• Transmits data H'00 to host as adjustment
end indication.
H'55 reception.
Checks flash memory data, erases all flash
memory blocks in case of written data
existing, and transmits data H'AA to host.
(If erase could not be done, transmits data
H'FF to host and aborts operation.)
Echobacks the 2-byte data
received to host.
Echobacks received data to host and also
transfers it to RAM.
(repeated for N times)
Transmits data H'AA to host.
Branches to programming control program
transferred to on-chip RAM and starts
execution.
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Table 7.3
System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is
Possible
Host Bit Rate
System Clock Frequency Range of LSI
19,200 bps
16 to 20 MHz
9,600 bps
8 to 16 MHz
4,800 bps
4 to 16 MHz
2,400 bps
2 to 16 MHz
7.3.2
Programming/Erasing in User Program Mode
On-board programming/erasing of an individual flash memory block can also be performed in user
program mode by branching to a user program/erase control program. The user must set branching
conditions and provide on-board means of supplying programming data. The flash memory must
contain the user program/erase control program or a program that provides the user program/erase
control program from external memory. As the flash memory itself cannot be read during
programming/erasing, transfer the user program/erase control program to on-chip RAM, as in boot
mode. Figure 7.2 shows a sample procedure for programming/erasing in user program mode.
Prepare a user program/erase control program in accordance with the description in section 7.4,
Flash Memory Programming/Erasing.
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Reset-start
No
Program/erase?
Yes
Transfer user program/erase control
program to RAM
Branch to flash memory application
program
Branch to user program/erase control
program in RAM
Execute user program/erase control
program (flash memory rewrite)
Branch to flash memory application
program
Figure 7.2 Programming/Erasing Flowchart Example in User Program Mode
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7.4
Flash Memory Programming/Erasing
A software method using the CPU is employed to program and erase flash memory in the onboard programming modes. Depending on the FLMCR1 setting, the flash memory operates in one
of the following four modes: Program mode, program-verify mode, erase mode, and erase-verify
mode. The programming control program in boot mode and the user program/erase control
program in user program mode use these operating modes in combination to perform
programming/erasing. Flash memory programming and erasing should be performed in
accordance with the descriptions in section 7.4.1, Program/Program-Verify and section 7.4.2,
Erase/Erase-Verify, respectively.
7.4.1
Program/Program-Verify
When writing data or programs to the flash memory, the program/program-verify flowchart shown
in figure 7.3 should be followed. Performing programming operations according to this flowchart
will enable data or programs to be written to the flash memory without subjecting the chip to
voltage stress or sacrificing program data reliability.
1. Programming must be done to an empty address. Do not reprogram an address to which
programming has already been performed.
2. Programming should be carried out 128 bytes at a time. A 128-byte data transfer must be
performed even if writing fewer than 128 bytes. In this case, H'FF data must be written to the
extra addresses.
3. Prepare the following data storage areas in RAM: A 128-byte programming data area, a 128byte reprogramming data area, and a 128-byte additional-programming data area. Perform
reprogramming data computation according to table 7.4, and additional programming data
computation according to table 7.5.
4. Consecutively transfer 128 bytes of data in byte units from the reprogramming data area or
additional-programming data area to the flash memory. The program address and 128-byte
data are latched in the flash memory. The lower 8 bits of the start address in the flash memory
destination area must be H'00 or H'80.
5. The time during which the P bit is set to 1 is the programming time. Table 7.6 shows the
allowable programming times.
6. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc.
An overflow cycle of approximately 6.6 ms is allowed.
7. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 2 bits
are B'00. Verify data can be read in words or in longwords from the address to which a
dummy write was performed.
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8.
The maximum number of repetitions of the program/program-verify sequence of the same bit
is 1,000.
Write pulse application subroutine
START
Apply Write Pulse
Set SWE bit in FLMCR1
WDT enable
Wait 1 µs
Set PSU bit in FLMCR1
Store 128-byte program data in program
data area and reprogram data area
*
Wait 50 µs
n= 1
Set P bit in FLMCR1
m= 0
Wait (Wait time=programming time)
Write 128-byte data in RAM reprogram
data area consecutively to flash memory
Clear P bit in FLMCR1
Wait 5 µs
Apply Write pulse
Clear PSU bit in FLMCR1
Set PV bit in FLMCR1
Wait 4 µs
Wait 5 µs
Disable WDT
Set block start address as
verify address
End Sub
H'FF dummy write to verify address
n←n+1
Wait 2 µs
*
Read verify data
Increment address
No
Verify data =
write data?
m=1
Yes
n≤6?
No
Yes
Additional-programming data computation
Reprogram data computation
No
128-byte
data verification completed?
Yes
Clear PV bit in FLMCR1
Wait 2 µs
n ≤ 6?
No
Yes
Successively write 128-byte data from additionalprogramming data area in RAM to flash memory
Sub-Routine-Call
Apply Write Pulse
m= 0 ?
Yes
Clear SWE bit in FLMCR1
No
n ≤ 1000 ?
Yes
No
Clear SWE bit in FLMCR1
Wait 100 µs
Wait 100 µs
End of programming
Programming failure
Notes: * The RTS instruction must not be used during the following 1. and 2. periods.
1. A period between 128-byte data programming to flash memory and the P bit clearing
2. A period between dummy writing of H'FF to a verify address and verify data reading
Figure 7.3 Program/Program-Verify Flowchart
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Table 7.4
Reprogram Data Computation Table
Program Data
Verify Data
Reprogram Data
Comments
0
0
1
Programming completed
0
1
0
Reprogram bit
1
0
1
1
1
1
Remains in erased state
Table 7.5
Additional-Program Data Computation Table
Reprogram Data
Verify Data
Additional-Program
Data
Comments
0
0
0
Additional-program bit
0
1
1
No additional programming
1
0
1
No additional programming
1
1
1
No additional programming
Comments
Table 7.6
Programming Time
n
(Number of Writes)
Programming
Time
In Additional
Programming
1 to 6
30
10
7 to 1,000
200
Note: Time shown in µs.
7.4.2
Erase/Erase-Verify
When erasing flash memory, the erase/erase-verify flowchart shown in figure 7.4 should be
followed.
1. Prewriting (setting erase block data to all 0s) is not necessary.
2. Erasing is performed in block units. Make only a single-bit specification in the erase block
register (EBR1). To erase multiple blocks, each block must be erased in turn.
3. The time during which the E bit is set to 1 is the flash memory erase time.
4. The watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. An
overflow cycle of approximately 19.8 ms is allowed.
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5. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower two
bits are B'00. Verify data can be read in longwords from the address to which a dummy write
was performed.
6. If the read data is not erased successfully, set erase mode again, and repeat the erase/eraseverify sequence as before. The maximum number of repetitions of the erase/erase-verify
sequence is 100.
7.4.3
Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including the NMI interrupt, are disabled while flash memory is being programmed
or erased, or while the boot program is executing, for the following three reasons:
1. Interrupt during programming/erasing may cause a violation of the programming or erasing
algorithm, with the result that normal operation cannot be assured.
2. If interrupt exception handling starts before the vector address is written or during
programming/erasing, a correct vector cannot be fetched and the CPU malfunctions.
3. If an interrupt occurs during boot program execution, normal boot mode sequence cannot be
carried out.
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Erase start
SWE bit ← 1
Wait 1 µs
n←1
Set EBR1
Enable WDT
ESU bit ← 1
Wait 100 µs
E bit ← 1
Wait 10 ms
E bit ← 0
Wait 10 µs
ESU bit ← 10
10 µs
Disable WDT
EV bit ← 1
Wait 20 µs
Set block start address as verify address
H'FF dummy write to verify address
Wait 2 µs
*
n←n+1
Read verify data
No
Verify data + all 1s ?
Increment address
Yes
No
Last address of block ?
Yes
No
EV bit ← 0
EV bit ← 0
Wait 4 µs
Wait 4µs
All erase block erased ?
n ≤100 ?
Yes
Yes
No
Yes
SWE bit ← 0
SWE bit ← 0
Wait 100 µs
Wait 100 µs
End of erasing
Erase failure
Note: *The RTS instruction must not be used during a period between dummy writing of H'FF to a verify address and verify data reading.
Figure 7.4 Erase/Erase-Verify Flowchart
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7.5
Program/Erase Protection
There are three kinds of flash memory program/erase protection; hardware protection, software
protection, and error protection.
7.5.1
Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted because of a transition to reset, subactive mode, subsleep mode, or standby
mode. Flash memory control register 1 (FLMCR1), flash memory control register 2 (FLMCR2),
and erase block register 1 (EBR1) are initialized. In a reset via the RES pin, the reset state is not
entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of
a reset during operation, hold the RES pin low for the RES pulse width specified in the AC
Characteristics section.
7.5.2
Software Protection
Software protection can be implemented against programming/erasing of all flash memory blocks
by clearing the SWE bit in FLMCR1. When software protection is in effect, setting the P or E bit
in FLMCR1 does not cause a transition to program mode or erase mode. By setting the erase
block register 1 (EBR1), erase protection can be set for individual blocks. When EBR1 is set to
H'00, erase protection is set for all blocks.
7.5.3
Error Protection
In error protection, an error is detected when CPU runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is forcibly aborted. Aborting the program/erase
operation prevents damage to the flash memory due to overprogramming or overerasing.
When the following errors are detected during programming/erasing of flash memory, the FLER
bit in FLMCR2 is set to 1, and the error protection state is entered.
When the flash memory of the relevant address area is read during programming/erasing
(including vector read and instruction fetch)
Immediately after exception handling excluding a reset during programming/erasing
When a SLEEP instruction is executed during programming/erasing
The FLMCR1, FLMCR2, and EBR1 settings are retained, however program mode or erase mode
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entered by re-setting the P or E bit. However, PV and EV bit settings are retained, and a transition
can be made to verify mode. Error protection can be cleared only by a reset.
7.6
Programmer Mode
In programmer mode, a PROM programmer can be used to perform programming/erasing via a
socket adapter, just as a discrete flash memory. Use a PROM programmer that supports the MCU
device type with the on-chip 64-kbyte flash memory (FZTAT64V5).
7.7
Power-Down States for Flash Memory
In user mode, the flash memory will operate in either of the following states:
• Normal operating mode
The flash memory can be read and written to at high speed.
• Power-down operating mode
The power supply circuit of flash memory can be partly halted. As a result, flash memory can
be read with low power consumption.
• Standby mode
All flash memory circuits are halted.
Table 7.7 shows the correspondence between the operating modes of this LSI and the flash
memory. In subactive mode, the flash memory can be set to operate in power-down mode with the
PDWND bit in FLPWCR. When the flash memory returns to its normal operating state from
power-down mode or standby mode, a period to stabilize operation of the power supply circuits
that were stopped is needed. When the flash memory returns to its normal operating state, bits
STS2 to STS0 in SYSCR1 must be set to provide a wait time of at least 20 µs, even when the
external clock is being used.
Table 7.7
Flash Memory Operating States
Flash Memory Operating State
LSI Operating State
PDWND = 0 (Initial Value)
PDWND = 1
Active mode
Normal operating mode
Normal operating mode
Subactive mode
Power-down mode
Normal operating mode
Sleep mode
Normal operating mode
Normal operating mode
Subsleep mode
Standby mode
Standby mode
Standby mode
Standby mode
Standby mode
Rev.5.00 Nov. 02, 2005 Page 106 of 500
REJ09B0027-0500
Section 8 RAM
Section 8 RAM
This LSI has an on-chip high-speed static RAM. The RAM is connected to the CPU by a 16-bit
data bus, enabling two-state access by the CPU to both byte data and word data.
Product Classification
Flash memory version
RAM Size RAM Address
H8/3687F
4 kbytes
H'E800 to H'EFFF, H'F780 to H'FF7F*
(F-ZTAT version)
H8/3684F
4 kbytes
H'E800 to H'EFFF, H'F780 to H'FF7F*
Mask-ROM version
H8/3687
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3686
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3685
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3684
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3683
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3682
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3687N
4 kbytes
H'E800 to H'EFFF, H'F780 to H'FF7F*
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
TM
EEPROM
stacked
version
Flash
memory
version
Mask-ROM
version
Note:
*
When the E7 or E8 is used, area H'F780 to H'FB7F must not be accessed.
RAM0500A_000120030300
Rev.5.00 Nov. 02, 2005 Page 107 of 500
REJ09B0027-0500
Section 8 RAM
Rev.5.00 Nov. 02, 2005 Page 108 of 500
REJ09B0027-0500
Section 9 I/O Ports
Section 9 I/O Ports
The group of this LSI has forty-five general I/O ports (forty-three general I/O ports in the
H8/3687N) and eight general input-only ports. Port 6 is a large current port, which can drive 20
mA (@VOL = 1.5 V) when a low level signal is output. Any of these ports can become an input
port immediately after a reset. They can also be used as I/O pins of the on-chip peripheral modules
or external interrupt input pins, and these functions can be switched depending on the register
settings. The registers for selecting these functions can be divided into two types: those included
in I/O ports and those included in each on-chip peripheral module. General I/O ports are
comprised of the port control register for controlling inputs/outputs and the port data register for
storing output data and can select inputs/outputs in bit units.
For functions in each port, see appendix B.1, I/O Port Block Diagrams. For the execution of bitmanipulation instructions to the port control register and port data register, see section 2.8.3, Bit
Manipulation Instruction.
9.1
Port 1
Port 1 is a general I/O port also functioning as IRQ interrupt input pins, an RTC output pin, a 14bit PWM output pin, a timer B1 input pin, and a timer V input pin. Figure 9.1 shows its pin
configuration.
P17/IRQ3/TRGV
P16/IRQ2
P15/IRQ1/TMIB1
Port 1
P14/IRQ0
P12
P11/PWM
P10/TMOW
Figure 9.1 Port 1 Pin Configuration
Port 1 has the following registers.
•
•
•
•
Port mode register 1 (PMR1)
Port control register 1 (PCR1)
Port data register 1 (PDR1)
Port pull-up control register 1 (PUCR1)
Rev.5.00 Nov. 02, 2005 Page 109 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.1.1
Port Mode Register 1 (PMR1)
PMR1 switches the functions of pins in port 1 and port 2.
Bit
Bit Name
Initial
Value
R/W
Description
7
IRQ3
0
R/W
This bit selects the function of pin P17/IRQ3/TRGV.
0: General I/O port
1: IRQ3/TRGV input pin
6
IRQ2
0
R/W
This bit selects the function of pin P16/IRQ2.
0: General I/O port
1: IRQ2 input pin
5
IRQ1
0
R/W
This bit selects the function of pin P15/IRQ1/TMIB1.
0: General I/O port
1: IRQ1/TMIB1 input pin
4
IRQ0
0
R/W
This bit selects the function of pin P14/IRQ0.
0: General I/O port
1: IRQ0 input pin
3
TXD2
0
R/W
This bit selects the function of pin P72/TXD_2.
0: General I/O port
1: TXD_2 output pin
2
PWM
0
R/W
This bit selects the function of pin P11/PWM.
0: General I/O port
1: PWM output pin
1
TXD
0
R/W
This bit selects the function of pin P22/TXD.
0: General I/O port
1: TXD output pin
0
TMOW
0
R/W
This bit selects the function of pin P10/TMOW.
0: General I/O port
1: TMOW output pin
Rev.5.00 Nov. 02, 2005 Page 110 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.1.2
Port Control Register 1 (PCR1)
PCR1 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 1.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR17
0
W
6
PCR16
0
W
5
PCR15
0
W
When the corresponding pin is designated in PMR1 as a
general I/O pin, setting a PCR1 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
4
PCR14
0
W
Bit 3 is a reserved bit.
3
2
PCR12
0
W
1
PCR11
0
W
0
PCR10
0
W
9.1.3
Port Data Register 1 (PDR1)
PDR1 is a general I/O port data register of port 1.
Bit
Bit Name
Initial
Value
R/W
Description
7
P17
0
R/W
PDR1 stores output data for port 1 pins.
6
P16
0
R/W
5
P15
0
R/W
4
P14
0
R/W
If PDR1 is read while PCR1 bits are set to 1, the value
stored in PDR1 are read. If PDR1 is read while PCR1 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR1.
3
1
Bit 3 is a reserved bit. This bit is always read as 1.
2
P12
0
R/W
1
P11
0
R/W
0
P10
0
R/W
Rev.5.00 Nov. 02, 2005 Page 111 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.1.4
Port Pull-Up Control Register 1 (PUCR1)
PUCR1 controls the pull-up MOS in bit units of the pins set as the input ports.
Bit
Bit Name
Initial
Value
R/W
Description
7
PUCR17
0
R/W
6
PUCR16
0
R/W
5
PUCR15
0
R/W
Only bits for which PCR1 is cleared are valid. The pull-up
MOS of P17 to P14 and P12 to P10 pins enter the onstate when these bits are set to 1, while they enter the
off-state when these bits are cleared to 0.
4
PUCR14
0
R/W
Bit 3 is a reserved bit. This bit is always read as 1.
3
1
2
PUCR12
0
R/W
1
PUCR11
0
R/W
0
PUCR10
0
R/W
9.1.5
Pin Functions
The correspondence between the register specification and the port functions is shown below.
P17/IRQ3/TRGV pin
Register
PMR1
PCR1
Bit Name
IRQ3
PCR17
Pin Function
Setting value
0
0
P17 input pin
1
P17 output pin
X
IRQ3 input/TRGV input pin
1
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 112 of 500
REJ09B0027-0500
Section 9 I/O Ports
P16/IRQ2 pin
Register
PMR1
PCR1
Bit Name
IRQ2
PCR16
Pin Function
Setting value
0
0
P16 input pin
1
P16 output pin
X
IRQ2 input pin
1
Legend: X: Don't care.
P15/IRQ1/TMIB1 pin
Register
PMR1
PCR1
Bit Name
IRQ1
PCR15
Pin Function
Setting value
0
0
P15 input pin
1
P15 output pin
X
IRQ1 input/TMIB1 input pin
1
Legend: X: Don't care.
P14/IRQ0 pin
Register
PMR1
PCR1
Bit Name
IRQ0
PCR14
Pin Function
Setting value
0
0
P14 input pin
1
P14 output pin
X
IRQ0 input pin
1
Legend: X: Don't care.
P12 pin
Register
PCR1
Bit Name
PCR12
Pin Function
Setting value
0
P12 input pin
1
P12 output pin
Rev.5.00 Nov. 02, 2005 Page 113 of 500
REJ09B0027-0500
Section 9 I/O Ports
P11/PWM pin
Register
PMR1
PCR1
Bit Name
PWM
PCR11
Pin Function
Setting value
0
0
P11 input pin
1
P11 output pin
X
PWM output pin
1
Legend: X: Don't care.
P10/TMOW pin
Register
PMR1
PCR1
Bit Name
TMOW
PCR10
Pin Function
Setting value
0
0
P10 input pin
1
P10 output pin
X
TMOW output pin
1
Legend:
X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 114 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.2
Port 2
Port 2 is a general I/O port also functioning as SCI3 I/O pins. Each pin of the port 2 is shown in
figure 9.2. The register settings of PMR1and SCI3 have priority for functions of the pins for both
uses.
P24
P23
Port 2
P22/TXD
P21/RXD
P20/SCK3
Figure 9.2 Port 2 Pin Configuration
Port 2 has the following registers.
• Port control register 2 (PCR2)
• Port data register 2 (PDR2)
• Port mode register 3 (PMR3)
9.2.1
Port Control Register 2 (PCR2)
PCR2 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 2.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 5
Reserved
4
PCR24
0
W
3
PCR23
0
W
2
PCR22
0
W
When each of the port 2 pins P24 to P20 functions as a
general I/O port, setting a PCR2 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
1
PCR21
0
W
0
PCR20
0
W
Rev.5.00 Nov. 02, 2005 Page 115 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.2.2
Port Data Register 2 (PDR2)
PDR2 is a general I/O port data register of port 2.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 5
All 1
Reserved
These bits are always read as 1.
4
P24
0
R/W
PDR2 stores output data for port 2 pins.
3
P23
0
R/W
2
P22
0
R/W
1
P21
0
R/W
If PDR2 is read while PCR2 bits are set to 1, the value
stored in PDR2 is read. If PDR2 is read while PCR2 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR2.
0
P20
0
R/W
9.2.3
Port Mode Register 3 (PMR3)
PMR3 selects the CMOS output or NMOS open-drain output for port 2.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 5
All 0
Reserved
These bits are always read as 0.
4
POF24
0
R/W
3
POF23
0
R/W
When the bit is set to 1, the corresponding pin is cut off
by PMOS and it functions as the NMOS open-drain
output. When cleared to 0, the pin functions as the CMOS
output.
2 to 0
All 1
Reserved
These bits are always read as 1.
Rev.5.00 Nov. 02, 2005 Page 116 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.2.4
Pin Functions
The correspondence between the register specification and the port functions is shown below.
P24 pin
Register
PCR2
Bit Name
PCR24
Pin Function
Setting Value
0
P24 input pin
1
P24 output pin
P23 pin
Register
PCR2
Bit Name
PCR23
Pin Function
Setting Value
0
P23 input pin
1
P23 output pin
Register
PMR1
PCR2
Bit Name
TXD
PCR22
Pin Function
Setting Value
0
0
P22 input pin
1
P22 output pin
X
TXD output pin
P22/TXD pin
1
Legend: X: Don't care.
P21/RXD pin
Register
SCR3
PCR2
Bit Name
RE
PCR21
Pin Function
Setting Value
0
0
P21 input pin
1
P21 output pin
X
RXD input pin
1
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 117 of 500
REJ09B0027-0500
Section 9 I/O Ports
P20/SCK3 pin
Register
SCR3
Bit Name
CKE1
Setting Value
0
SMR
PCR2
CKE0
COM
PCR20
Pin Function
0
0
0
P20 input pin
1
P20 output pin
0
0
1
X
SCK3 output pin
0
1
X
X
SCK3 output pin
1
X
X
X
SCK3 input pin
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 118 of 500
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Section 9 I/O Ports
9.3
Port 3
Port 3 is a general I/O port. Each pin of the port 3 is shown in figure 9.3.
P37
P36
P35
P34
Port 3
P33
P32
P31
P30
Figure 9.3 Port 3 Pin Configuration
Port 3 has the following registers.
• Port control register 3 (PCR3)
• Port data register 3 (PDR3)
9.3.1
Port Control Register 3 (PCR3)
PCR3 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 3.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR37
0
W
6
PCR36
0
W
5
PCR35
0
W
Setting a PCR3 bit to 1 makes the corresponding pin an
output port, while clearing the bit to 0 makes the pin an
input port.
4
PCR34
0
W
3
PCR33
0
W
2
PCR32
0
W
1
PCR31
0
W
0
PCR30
0
W
Rev.5.00 Nov. 02, 2005 Page 119 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.3.2
Port Data Register 3 (PDR3)
PDR3 is a general I/O port data register of port 3.
Bit
Bit Name
Initial
Value
R/W
Description
7
P37
0
R/W
PDR3 stores output data for port 3 pins.
6
P36
0
R/W
5
P35
0
R/W
4
P34
0
R/W
If PDR3 is read while PCR3 bits are set to 1, the value
stored in PDR3 is read. If PDR3 is read while PCR3 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR3.
3
P33
0
R/W
2
P32
0
R/W
1
P31
0
R/W
0
P30
0
R/W
9.3.3
Pin Functions
The correspondence between the register specification and the port functions is shown below.
P37 pin
Register
PCR3
Bit Name
PCR37
Pin Function
Setting Value
0
P37 input pin
1
P37 output pin
P36 pin
Register
PCR3
Bit Name
PCR36
Pin Function
Setting Value
0
P36 input pin
1
P36 output pin
Rev.5.00 Nov. 02, 2005 Page 120 of 500
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Section 9 I/O Ports
P35 pin
Register
PCR3
Bit Name
PCR35
Pin Function
Setting Value
0
P35 input pin
1
P35 output pin
P34 pin
Register
PCR3
Bit Name
PCR34
Pin Function
Setting Value
0
P34 input pin
1
P34 output pin
P33 pin
Register
PCR3
Bit Name
PCR33
Pin Function
Setting Value
0
P33 input pin
1
P33 output pin
P32 pin
Register
PCR3
Bit Name
PCR32
Pin Function
Setting Value
0
P32 input pin
1
P32 output pin
P31 pin
Register
PCR3
Bit Name
PCR31
Pin Function
Setting Value
0
P31 input pin
1
P31 output pin
Rev.5.00 Nov. 02, 2005 Page 121 of 500
REJ09B0027-0500
Section 9 I/O Ports
P30 pin
Register
PCR3
Bit Name
PCR30
Pin Function
Setting Value
0
P30 input pin
1
P30 output pin
9.4
Port 5
Port 5 is a general I/O port also functioning as an I2C bus interface I/O pin, an A/D trigger input
pin, and wakeup interrupt input pin. Each pin of the port 5 is shown in figure 9.4. The register
setting of the I2C bus interface register has priority for functions of the pins P57/SCL and
P56/SDA. Since the output buffer for pins P56 and P57 has the NMOS push-pull structure, it
differs from an output buffer with the CMOS structure in the high-level output characteristics (see
section 23, Electrical Characteristics).
H8/3687
Port 5
H8/3687N
P57/SCL
SCL
P56/SDA
SDA
P55/WKP5/ADTRG
P55/WKP5/ADTRG
P54/WKP4
Port 5
P53/WKP3
P52/WKP2
P52/WKP2
P51/WKP1
P51/WKP1
P50/WKP0
P50/WKP0
Figure 9.4 Port 5 Pin Configuration
Port 5 has the following registers.
•
•
•
•
Port mode register 5 (PMR5)
Port control register 5 (PCR5)
Port data register 5 (PDR5)
Port pull-up control register 5 (PUCR5)
Rev.5.00 Nov. 02, 2005 Page 122 of 500
REJ09B0027-0500
P54/WKP4
P53/WKP3
Section 9 I/O Ports
9.4.1
Port Mode Register 5 (PMR5)
PMR5 switches the functions of pins in port 5.
Bit
Bit Name
Initial
Value
R/W
Description
7
POF57
0
R/W
6
POF56
0
R/W
When the bit is set to 1, the corresponding pin is cut off
by PMOS and it functions as the NMOS open-drain
output. When cleared to 0, the pin functions as the CMOS
output.
5
WKP5
0
R/W
This bit selects the function of pin P55/WKP5/ADTRG.
0: General I/O port
1: WKP5/ADTRG input pin
4
WKP4
0
R/W
This bit selects the function of pin P54/WKP4.
0: General I/O port
1: WKP4 input pin
3
WKP3
0
R/W
This bit selects the function of pin P53/WKP3.
0: General I/O port
1: WKP3 input pin
2
WKP2
0
R/W
This bit selects the function of pin P52/WKP2.
0: General I/O port
1: WKP2 input pin
1
WKP1
0
R/W
This bit selects the function of pin P51/WKP1.
0: General I/O port
1: WKP1 input pin
0
WKP0
0
R/W
This bit selects the function of pin P50/WKP0.
0: General I/O port
1: WKP0 input pin
Rev.5.00 Nov. 02, 2005 Page 123 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.4.2
Port Control Register 5 (PCR5)
PCR5 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 5.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR57
0
W
6
PCR56
0
W
5
PCR55
0
W
When each of the port 5 pins P57 to P50 functions as a
general I/O port, setting a PCR5 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
4
PCR54
0
W
3
PCR53
0
W
2
PCR52
0
W
1
PCR51
0
W
0
PCR50
0
W
9.4.3
Port Data Register 5 (PDR5)
Note: The PCR57 and PCR56 bits should not be set to 1
in the H8/3687N.
PDR5 is a general I/O port data register of port 5.
Bit
Bit Name
Initial
Value
R/W
Description
7
P57
0
R/W
Stores output data for port 5 pins.
6
P56
0
R/W
5
P55
0
R/W
4
P54
0
R/W
If PDR5 is read while PCR5 bits are set to 1, the value
stored in PDR5 are read. If PDR5 is read while PCR5 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR5.
3
P53
0
R/W
2
P52
0
R/W
1
P51
0
R/W
0
P50
0
R/W
Rev.5.00 Nov. 02, 2005 Page 124 of 500
REJ09B0027-0500
Note: The P57 and P56 bits should not be set to 1 in the
H8/3687N.
Section 9 I/O Ports
9.4.4
Port Pull-Up Control Register 5 (PUCR5)
PUCR5 controls the pull-up MOS in bit units of the pins set as the input ports.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
All 0
Reserved
These bits are always read as 0.
5
PUCR55
0
R/W
4
PUCR54
0
R/W
3
PUCR53
0
R/W
2
PUCR52
0
R/W
1
PUCR51
0
R/W
0
PUCR50
0
R/W
9.4.5
Pin Functions
Only bits for which PCR5 is cleared are valid. The pull-up
MOS of the corresponding pins enter the on-state when
these bits are set to 1, while they enter the off-state when
these bits are cleared to 0.
The correspondence between the register specification and the port functions is shown below.
P57/SCL pin
Register
ICCR1
PCR5
Bit Name
ICE
PCR57
Pin Function
Setting Value
0
0
P57 input pin
1
P57 output pin
X
SCL I/O pin
1
Legend: X: Don't care.
SCL performs the NMOS open-drain output, that enables a direct bus drive.
Rev.5.00 Nov. 02, 2005 Page 125 of 500
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Section 9 I/O Ports
P56/SDA pin
Register
ICCR1
PCR5
Bit Name
ICE
PCR56
Pin Function
Setting Value
0
0
P56 input pin
1
P56 output pin
X
SDA I/O pin
1
Legend: X: Don't care.
SDA performs the NMOS open-drain output, that enables a direct bus drive.
P55/WKP5/ADTRG pin
Register
PMR5
PCR5
Bit Name
WKP5
PCR55
Pin Function
Setting Value
0
0
P55 input pin
1
P55 output pin
X
WKP5/ADTRG input pin
1
Legend: X: Don't care.
P54/WKP4 pin
Register
PMR5
PCR5
Bit Name
WKP4
PCR54
Pin Function
Setting Value
0
0
P54 input pin
1
P54 output pin
X
WKP4 input pin
1
Legend: X: Don't care.
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Section 9 I/O Ports
P53/WKP3 pin
Register
PMR5
PCR5
Bit Name
WKP3
PCR53
Pin Function
Setting Value
0
0
P53 input pin
1
P53 output pin
X
WKP3 input pin
1
Legend: X: Don't care.
P52/WKP2 pin
Register
PMR5
PCR5
Bit Name
WKP2
PCR52
Pin Function
Setting Value
0
0
P52 input pin
1
P52 output pin
X
WKP2 input pin
1
Legend: X: Don't care.
P51/WKP1 pin
Register
PMR5
PCR5
Bit Name
WKP1
PCR51
Pin Function
Setting Value
0
0
P51 input pin
1
P51 output pin
X
WKP1 input pin
1
Legend: X: Don't care.
P50/WKP0 pin
Register
PMR5
PCR5
Bit Name
WKP0
PCR50
Pin Function
Setting Value
0
0
P50 input pin
1
P50 output pin
X
WKP0 input pin
1
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 127 of 500
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Section 9 I/O Ports
9.5
Port 6
Port 6 is a general I/O port also functioning as a timer Z I/O pin. Each pin of the port 6 is shown in
figure 9.5. The register setting of the timer Z has priority for functions of the pins for both uses.
P67/FTIOD1
P66/FTIOC1
P65/FTIOB1
P64/FTIOA1
Port 6
P63/FTIOD0
P62/FTIOC0
P61/FTIOB0
P60/FTIOA0
Figure 9.5 Port 6 Pin Configuration
Port 6 has the following registers.
• Port control register 6 (PCR6)
• Port data register 6 (PDR6)
9.5.1
Port Control Register 6 (PCR6)
PCR6 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 6.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR67
0
W
6
PCR66
0
W
5
PCR65
0
W
When each of the port 6 pins P67 to P60 functions as a
general I/O port, setting a PCR6 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
4
PCR64
0
W
3
PCR63
0
W
2
PCR62
0
W
1
PCR61
0
W
0
PCR60
0
W
Rev.5.00 Nov. 02, 2005 Page 128 of 500
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Section 9 I/O Ports
9.5.2
Port Data Register 6 (PDR6)
PDR6 is a general I/O port data register of port 6.
Bit
Bit Name
Initial
Value
R/W
Description
7
P67
0
R/W
Stores output data for port 6 pins.
6
P66
0
R/W
5
P65
0
R/W
4
P64
0
R/W
If PDR6 is read while PCR6 bits are set to 1, the value
stored in PDR6 are read. If PDR6 is read while PCR6 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR6.
3
P63
0
R/W
2
P62
0
R/W
1
P61
0
R/W
0
P60
0
R/W
9.5.3
Pin Functions
The correspondence between the register specification and the port functions is shown below.
P67/FTIOD1 pin
Register
TOER
TFCR
Bit Name
ED1
CMD1 and
IOD2 to
CMD0
PWMD1 IOD0
PCR67
Pin Function
00
0
P67 input/FTIOD1 input pin
1
P67 output pin
X
FTIOD1 output pin
Setting Value 1
0
00
TPMR
0
TIORC1
000 or
1XX
0
001 or
01X
1
XXX
Other than X
00
XXX
PCR6
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 129 of 500
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Section 9 I/O Ports
P66/FTIOC1 pin
Register
TOER
TFCR
Bit Name
EC1
CMD1 and
IOC2 to
CMD0
PWMC1 IOC0
PCR66
Pin Function
00
0
P66 input/FTIOC1 input pin
1
P66 output pin
X
FTIOC1 output pin
Setting Value 1
0
00
TPMR
0
TIORC1
000 or
1XX
0
001 or
01X
1
XXX
Other than X
00
XXX
TIORA1
PCR6
Legend: X: Don't care.
P65/FTIOB1 pin
Register
TOER
TFCR
TPMR
Bit Name
EB1
CMD1 to
CMD0
IOB2 to
PWMB1 IOB0
PCR65
Pin Function
00
0
0
P65 input/FTIOB1 input pin
1
P65 output pin
X
FTIOB1 output pin
Setting Value 1
0
00
0
001 or
01X
1
XXX
Other than X
00
XXX
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 130 of 500
REJ09B0027-0500
000 or
1XX
PCR6
Section 9 I/O Ports
P64/FTIOA1 pin
Register
TOER
TFCR
TIORA1 PCR6
Bit Name
EB1
CMD1 to
CMD0
IOA2 to
IOA0
PCR64
Pin Function
XX
000 or
0
P64 input/FTIOA1 input pin
1XX
1
P64 output pin
00
001 or
01X
X
FTIOA1 output pin
TIORC0
PCR6
Setting Value 1
0
Legend: X: Don't care.
P63/FTIOD0 pin
Register
TOER
TFCR
TPMR
Bit Name
ED0
CMD1 to
CMD0
IOD2 to
PWMD0 IOD0
PCR63
Pin Function
00
0
0
P63 input/FTIOD0 input pin
1
P63 output pin
X
FTIOD0 output pin
Setting Value 1
0
00
000 or
1XX
0
001 or
01X
1
XXX
Other than X
00
XXX
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 131 of 500
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Section 9 I/O Ports
P62/FTIOC0 pin
Register
TOER
TFCR
TPMR
Bit Name
EC0
CMD1 to
CMD0
IOC2 to
PWMC0 IOC0
PCR62
Pin Function
00
0
0
P62 input/FTIOC0 input pin
1
P62 output pin
X
FTIOC0 output pin
Setting Value 1
0
00
TIORC0
000 or
1XX
0
001 or
01X
1
XXX
Other than X
00
XXX
TIORA0
PCR6
Legend: X: Don't care.
P61/FTIOB0 pin
Register
TOER
TFCR
TPMR
Bit Name
EB0
CMD1 to
CMD0
IOB2 to
PWMB0 IOB0
PCR61
Pin Function
00
0
0
P61 input/FTIOB0 input pin
1
P61 output pin
X
FTIOB0 output pin
Setting Value 1
0
00
0
001 or
01X
1
XXX
Other than X
00
XXX
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 132 of 500
REJ09B0027-0500
000 or
1XX
PCR6
Section 9 I/O Ports
P60/FTIOA0 pin
Register
TOER
TFCR
TFCR
TIORA0
PCR6
Bit Name
EA0
CMD1 to
CMD0
STCLK
IOA2 to
IOA0
PCR60
Pin Function
XX
X
000 or
0
P60 input/FTIOA0 input pin
1XX
1
P60 output pin
001 or
01X
X
FTIOA0 output pin
Setting Value 1
0
00
0
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 133 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.6
Port 7
Port 7 is a general I/O port also functioning as a timer V I/O pin and SCI3_2 I/O pin. Each pin of
the port 7 is shown in figure 9.6. The register settings of the timer V and SCI3_2 have priority for
functions of the pins for both uses.
P76/TMOV
P75/TMCIV
P74/TMRIV
Port 7
P72/TXD_2
P71/RXD_2
P70/SCK3_2
Figure 9.6 Port 7 Pin Configuration
Port 7 has the following registers.
• Port control register 7 (PCR7)
• Port data register 7 (PDR7)
9.6.1
Port Control Register 7 (PCR7)
PCR7 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 7.
Bit
Bit Name
Initial
Value
R/W
Description
7
6
PCR76
0
W
5
PCR75
0
W
When each of the port 7 pins P76 to P74 and P72 to P70
functions as a general I/O port, setting a PCR7 bit to 1
makes the corresponding pin an output port, while
clearing the bit to 0 makes the pin an input port.
4
PCR74
0
W
Bits 7 and 3 are reserved bits.
3
2
PCR72
0
W
1
PCR71
0
W
0
PCR70
0
W
Rev.5.00 Nov. 02, 2005 Page 134 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.6.2
Port Data Register 7 (PDR7)
PDR7 is a general I/O port data register of port 7.
Bit
Bit Name
Initial
Value
R/W
Description
7
1
Stores output data for port 7 pins.
6
P76
0
R/W
5
P75
0
R/W
4
P74
0
R/W
If PDR7 is read while PCR7 bits are set to 1, the value
stored in PDR7 are read. If PDR7 is read while PCR7 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR7.
3
1
2
P72
0
R/W
1
P71
0
R/W
0
P70
0
R/W
9.6.3
Pin Functions
Bits 7 and 3 are reserved bits. These bits are always read
as 1.
The correspondence between the register specification and the port functions is shown below.
P76/TMOV pin
Register
TCSRV
Bit Name
OS3 to OS0 PCR76
Pin Function
Setting Value
0000
0
P76 input pin
1
P76 output pin
X
TMOV output pin
Other than
the above
values
PCR7
Legend: X: Don't care.
P75/TMCIV pin
Register
PCR7
Bit Name
PCR75
Pin Function
Setting Value
0
P75 input/TMCIV input pin
1
P75 output/TMCIV input pin
Rev.5.00 Nov. 02, 2005 Page 135 of 500
REJ09B0027-0500
Section 9 I/O Ports
P74/TMRIV pin
Register
PCR7
Bit Name
PCR74
Pin Function
Setting Value
0
P74 input/TMRIV input pin
1
P74 output/TMRIV input pin
P72/TXD_2 pin
Register
PMR1
PCR7
Bit Name
TXD2
PCR72
Pin Function
Setting Value
0
0
P72 input pin
1
P72 output pin
X
TXD_2 output pin
1
Legend: X: Don't care.
P71/RXD_2 pin
Register
SCR3_2
PCR7
Bit Name
RE
PCR71
Pin Function
Setting Value
0
0
P71 input pin
1
P71 output pin
X
RXD_2 input pin
1
Legend: X: Don't care.
P70/SCK3_2 pin
Register
SCR3_2
Bit Name
CKE1
Setting Value
0
SMR2
PCR7
CKE0
COM
PCR70 Pin Function
0
0
0
P70 input pin
1
P70 output pin
0
0
1
X
SCK3_2 output pin
0
1
X
X
SCK3_2 output pin
1
X
X
X
SCK3_2 input pin
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 136 of 500
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Section 9 I/O Ports
9.7
Port 8
Port 8 is a general I/O port. Each pin of the port 8 is shown in figure 9.7.
P87
Port 8
P86
P85
Figure 9.7 Port 8 Pin Configuration
Port 8 has the following registers.
• Port control register 8 (PCR8)
• Port data register 8 (PDR8)
9.7.1
Port Control Register 8 (PCR8)
PCR8 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 8.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR87
0
W
6
PCR86
0
W
5
PCR85
0
W
When each of the port 8 pins P87 to P85 functions as a
general I/O port, setting a PCR8 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
4 to 0
9.7.2
Port Data Register 8 (PDR8)
Reserved
PDR8 is a general I/O port data register of port 8.
Bit
Bit Name
Initial
Value
R/W
Description
7
P87
0
R/W
PDR8 stores output data for port 8 pins.
6
P86
0
R/W
5
P85
0
R/W
If PDR8 is read while PCR8 bits are set to 1, the value
stored in PDR8 is read. If PDR8 is read while PCR8 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR8.
4 to 0
All 1
Reserved
These bits are always read as 1.
Rev.5.00 Nov. 02, 2005 Page 137 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.7.3
Pin Functions
The correspondence between the register specification and the port functions is shown below.
P87 pin
Register
PCR8
Bit Name
PCR87
Pin Function
Setting Value
0
P87 input pin
1
P87 output pin
P86 pin
Register
PCR8
Bit Name
PCR86
Pin Function
Setting Value
0
P86 input pin
1
P86 output pin
P85 pin
Register
PCR8
Bit Name
PCR85
Pin Function
Setting Value
0
P85 input pin
1
P85 output pin
Rev.5.00 Nov. 02, 2005 Page 138 of 500
REJ09B0027-0500
Section 9 I/O Ports
9.8
Port B
Port B is an input port also functioning as an A/D converter analog input pin. Each pin of the port
B is shown in figure 9.8.
PB7/AN7
PB6/AN6
PB5/AN5
Port B
PB4/AN4
PB3/AN3
PB2/AN2
PB1/AN1
PB0/AN0
Figure 9.8 Port B Pin Configuration
Port B has the following register.
• Port data register B (PDRB)
9.8.1
Port Data Register B (PDRB)
PDRB is a general input-only port data register of port B.
Bit
Bit Name
Initial
Value
R/W
Description
7
PB7
R
6
PB6
R
The input value of each pin is read by reading this
register.
5
PB5
R
4
PB4
R
3
PB3
R
2
PB2
R
1
PB1
R
0
PB0
R
However, if a port B pin is designated as an analog input
channel by ADCSR in A/D converter, 0 is read.
Rev.5.00 Nov. 02, 2005 Page 139 of 500
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Section 9 I/O Ports
Rev.5.00 Nov. 02, 2005 Page 140 of 500
REJ09B0027-0500
Section 10 Realtime Clock (RTC)
Section 10 Realtime Clock (RTC)
The realtime clock (RTC) is a timer used to count time ranging from a second to a week. Figure
10.1 shows the block diagram of the RTC.
10.1
•
•
•
•
•
•
•
Features
Counts seconds, minutes, hours, and day-of-week
Start/stop function
Reset function
Readable/writable counter of seconds, minutes, hours, and day-of-week with BCD codes
Periodic (seconds, minutes, hours, days, and weeks) interrupts
8-bit free running counter
Selection of clock source
RTC3000A_000120030300
Rev.5.00 Nov. 02, 2005 Page 141 of 500
REJ09B0027-0500
Section 10 Realtime Clock (RTC)
RTCCSR
PSS
RSECDR
1/4
RMINDR
RHRDR
TMOW
Clock count
control circuit
RWKDR
Internal data bus
32-kHz
oscillator
circuit
RTCCR1
RTCCR2
Interrupt
control circuit
[Legend]
RTCCSR:
RSECDR:
RMINDR:
RHRDR:
RWKDR:
RTCCR1:
RTCCR2:
PSS:
Clock source select register
Second date register/free running counter data register
Minute date register
Hour date register
Day-of-week date register
RTC control register 1
RTC control register 2
Prescaler S
Figure 10.1 Block Diagram of RTC
10.2
Input/Output Pin
Table 10.1 shows the RTC input/output pin.
Table 10.1 Pin Configuration
Name
Abbreviation I/O
Function
Clock output
TMOW
RTC divided clock output
Output
Rev.5.00 Nov. 02, 2005 Page 142 of 500
REJ09B0027-0500
Interrupt
Section 10 Realtime Clock (RTC)
10.3
Register Descriptions
The RTC has the following registers.
•
•
•
•
•
•
•
Second data register/free running counter data register (RSECDR)
Minute data register (RMINDR)
Hour data register (RHRDR)
Day-of-week data register (RWKDR)
RTC control register 1 (RTCCR1)
RTC control register 2 (RTCCR2)
Clock source select register (RTCCSR)
10.3.1
Second Data Register/Free Running Counter Data Register (RSECDR)
RSECDR counts the BCD-coded second value. The setting range is decimal 00 to 59. It is an 8-bit
read register used as a counter, when it operates as a free running counter. For more information
on reading seconds, minutes, hours, and day-of-week, see section 10.4.3, Data Reading Procedure.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC busy
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
SC12
—
R/W
Counting ten’s position of seconds
5
SC11
—
R/W
Counts on 0 to 5 for 60-second counting.
4
SC10
—
R/W
3
SC03
—
R/W
Counting one’s position of seconds
2
SC02
—
R/W
1
SC01
—
R/W
Counts on 0 to 9 once per second. When a carry is
generated, 1 is added to the ten’s position.
0
SC00
—
R/W
Rev.5.00 Nov. 02, 2005 Page 143 of 500
REJ09B0027-0500
Section 10 Realtime Clock (RTC)
10.3.2
Minute Data Register (RMINDR)
RMINDR counts the BCD-coded minute value on the carry generated once per minute by the
RSECDR counting. The setting range is decimal 00 to 59.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC busy
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
MN12
—
R/W
Counting ten’s position of minutes
5
MN11
—
R/W
Counts on 0 to 5 for 60-minute counting.
4
MN10
—
R/W
3
MN03
—
R/W
Counting one’s position of minutes
2
MN02
—
R/W
1
MN01
—
R/W
Counts on 0 to 9 once per minute. When a carry is
generated, 1 is added to the ten’s position.
0
MN00
—
R/W
Rev.5.00 Nov. 02, 2005 Page 144 of 500
REJ09B0027-0500
Section 10 Realtime Clock (RTC)
10.3.3
Hour Data Register (RHRDR)
RHRDR counts the BCD-coded hour value on the carry generated once per hour by RMINDR.
The setting range is either decimal 00 to 11 or 00 to 23 by the selection of the 12/24 bit in
RTCCR1.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC busy
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
—
0
—
Reserved
This bit is always read as 0.
5
HR11
—
R/W
Counting ten’s position of hours
4
HR10
—
R/W
Counts on 0 to 2 for ten’s position of hours.
3
HR03
—
R/W
Counting one’s position of hours
2
HR02
—
R/W
1
HR01
—
R/W
Counts on 0 to 9 once per hour. When a carry is
generated, 1 is added to the ten’s position.
0
HR00
—
R/W
Rev.5.00 Nov. 02, 2005 Page 145 of 500
REJ09B0027-0500
Section 10 Realtime Clock (RTC)
10.3.4
Day-of-Week Data Register (RWKDR)
RWKDR counts the BCD-coded day-of-week value on the carry generated once per day by
RHRDR. The setting range is decimal 0 to 6 using bits WK2 to WK0.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC busy
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6 to 3
—
All 0
—
Reserved
These bits are always read as 0.
2
WK2
—
R/W
Day-of-week counting
1
WK1
—
R/W
Day-of-week is indicated with a binary code
0
WK0
—
R/W
000: Sunday
001: Monday
010: Tuesday
011: Wednesday
100: Thursday
101: Friday
110: Saturday
111: Reserved (setting prohibited)
Rev.5.00 Nov. 02, 2005 Page 146 of 500
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Section 10 Realtime Clock (RTC)
10.3.5
RTC Control Register 1 (RTCCR1)
RTCCR1 controls start/stop and reset of the clock timer. For the definition of time expression, see
figure 10.2.
Bit
Bit Name
Initial
Value
R/W
Description
7
RUN
—
R/W
RTC operation start
0: Stops RTC operation
1: Starts RTC operation
6
12/24
—
R/W
Operating mode
0: RTC operates in 12-hour mode. RHRDR counts on 0
to 11.
1: RTC operates in 24-hour mode. RHRDR counts on 0
to 23.
5
PM
—
R/W
A.m./p.m.
0: Indicates a.m. when RTC is in the 12-hour mode.
1: Indicates p.m. when RTC is in the 12-hour mode.
4
RST
0
R/W
Reset
0: Normal operation
1: Resets registers and control circuits except RTCCSR
and this bit. Clear this bit to 0 after having been set to
1.
3 to 0
—
All 0
—
Reserved
These bits are always read as 0.
Noon
24-hour count 0
12-hour count 0
PM
1
1
2
2
3
3
4
4
5 6 7
5 6 7
0 (Morning)
8
8
9 10 11 12 13 14 15 16 17
9 10 11 0 1 2 3 4 5
1 (Afternoon)
24-hour count 18 19 20 21 22 23 0
12-hour count 6 7 8 9 10 11 0
1 (Afternoon)
0
PM
Figure 10.2 Definition of Time Expression
Rev.5.00 Nov. 02, 2005 Page 147 of 500
REJ09B0027-0500
Section 10 Realtime Clock (RTC)
10.3.6
RTC Control Register 2 (RTCCR2)
RTCCR2 controls RTC periodic interrupts of weeks, days, hours, minutes, and seconds. Enabling
interrupts of weeks, days, hours, minutes, and seconds sets the IRRTA flag to 1 in the interrupt
flag register 1 (IRR1) when an interrupt occurs. It also controls an overflow interrupt of a free
running counter when RTC operates as a free running counter.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
—
All 0
—
Reserved
These bits are always read as 0.
5
FOIE
—
R/W
Free Running Counter Overflow Interrupt Enable
0: Disables an overflow interrupt
1: Enables an overflow interrupt
4
WKIE
—
R/W
Week Periodic Interrupt Enable
0: Disables a week periodic interrupt
1: Enables a week periodic interrupt
3
DYIE
—
R/W
Day Periodic Interrupt Enable
0: Disables a day periodic interrupt
1: Enables a day periodic interrupt
2
HRIE
—
R/W
Hour Periodic Interrupt Enable
0: Disables an hour periodic interrupt
1: Enables an hour periodic interrupt
1
MNIE
—
R/W
Minute Periodic Interrupt Enable
0: Disables a minute periodic interrupt
1: Enables a minute periodic interrupt
0
SEIE
—
R/W
Second Periodic Interrupt Enable
0: Disables a second periodic interrupt
1: Enables a second periodic interrupt
Rev.5.00 Nov. 02, 2005 Page 148 of 500
REJ09B0027-0500
Section 10 Realtime Clock (RTC)
10.3.7
Clock Source Select Register (RTCCSR)
RTCCSR selects clock source. A free running counter controls start/stop of counter operation by
the RUN bit in RTCCR1. When a clock other than 32.768 kHz is selected, the RTC is disabled
and operates as an 8-bit free running counter. When the RTC operates as an 8-bit free running
counter, RSECDR enables counter values to be read. An interrupt can be generated by setting 1 to
the FOIE bit in RTCCR2 and enabling an overflow interrupt of the free running counter. A clock
in which the system clock is divided by 32, 16, 8, or 4 is output in active or sleep mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
—
0
—
Reserved
6
RCS6
0
R/W
Clock output selection
5
RCS5
0
R/W
Selects a clock output from the TMOW pin when setting
TMOW in PMR1 to 1.
This bit is always read as 0.
00: φ/4
01: φ/8
10: φ/16
11: φ/32
4
—
0
—
Reserved
3
RCS3
1
R/W
Clock source selection
2
RCS2
0
R/W
0000: φ/8⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
1
RCS1
0
R/W
0001: φ/32⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0
RCS0
0
R/W
0010: φ/128⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
This bit is always read as 0.
0011: φ/256⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0100: φ/512⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0101: φ/2048⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0110: φ/4096⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0111: φ/8192⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
1XXX: 32.768 kHz⋅⋅⋅⋅⋅RTC operation
Legend: X: Don't care.
Rev.5.00 Nov. 02, 2005 Page 149 of 500
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Section 10 Realtime Clock (RTC)
10.4
Operation
10.4.1
Initial Settings of Registers after Power-On
The RTC registers that store second, minute, hour, and day-of week data are not reset by a RES
input. Therefore, all registers must be set to their initial values after power-on. Once the register
setting are made, the RTC provides an accurate time as long as power is supplied regardless of a
RES input.
10.4.2
Initial Setting Procedure
Figure 10.3 shows the procedure for the initial setting of the RTC. To set the RTC again, also
follow this procedure.
RUN in RTCCR1 = 0
RTC operation is stopped.
RST in RTCCR1 = 1
RST in RTCCR1 = 0
Set RTCCSR, RSECDR,
RMINDR, RHRDR,
RWKDR, 12/24 in
RTCCR1, and PM
RUN in RTCCR1 = 1
RTC registers and clock count
controller are reset.
Clock output and clock source are
selected and second, minute, hour,
day-of-week, operating mode, and
a.m/p.m are set.
RTC operation is started.
Figure 10.3 Initial Setting Procedure
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Section 10 Realtime Clock (RTC)
10.4.3
Data Reading Procedure
When the seconds, minutes, hours, or day-of-week datum is updated while time data is being read,
the data obtained may not be correct, and so the time data must be read again. Figure 10.4 shows
an example in which correct data is not obtained. In this example, since only RSECDR is read
after data update, about 1-minute inconsistency occurs.
To avoid reading in this timing, the following processing must be performed.
1. Check the setting of the BSY bit, and when the BSY bit changes from 1 to 0, read from the
second, minute, hour, and day-of-week registers. When about 62.5 ms is passed after the BSY
bit is set to 1, the registers are updated, and the BSY bit is cleared to 0.
2. Making use of interrupts, read from the second, minute, hour, and day-of week registers after
the IRRTA flag in IRR1 is set to 1 and the BSY bit is confirmed to be 0.
3. Read from the second, minute, hour, and day-of week registers twice in a row, and if there is
no change in the read data, the read data is used.
Before update
RWKDR = H'03, RHDDR = H'13, RMINDR = H'46, RSECDR = H'59
Processing flow
BSY bit = 0
(1) Day-of-week data register read
H'03
(2) Hour data register read
H'13
(3) Minute data register read
H'46
BSY bit -> 1 (under data update)
After update
RWKDR = H'03, RHDDR = H'13, RMINDR = H'47, RSECDR = H'00
BSY bit -> 0
(4) Second data register read
H'00
Figure 10.4 Example: Reading of Inaccurate Time Data
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Section 10 Realtime Clock (RTC)
10.5
Interrupt Source
There are five kinds of RTC interrupts: week interrupts, day interrupts, hour interrupts, minute
interrupts, and second interrupts.
When using an interrupt, initiate the RTC last after other registers are set. Do not set multiple
interrupt enable bits in RTCCR2 simultaneously to 1.
When an interrupt request of the RTC occurs, the IRRTA flag in IRR1 is set to 1. When clearing
the flag, write 0.
Table 10.2 Interrupt Source
Interrupt Name
Interrupt Source
Interrupt Enable Bit
Overflow interrupt
Occurs when the free running counter is
overflown.
FOIE
Week periodic interrupt
Occurs every week when the day-of-week date WKIE
register value becomes 0.
Day periodic interrupt
Occurs every day when the day-of-week date
register is counted.
Hour periodic interrupt
Occurs every hour when the hour date register HRIE
is counted.
Minute periodic interrupt
Occurs every minute when the minute date
register is counted.
MNIE
Second periodic interrupt
Occurs every second when the second date
register is counted.
SCIE
Rev.5.00 Nov. 02, 2005 Page 152 of 500
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DYIE
Section 11 Timer B1
Section 11 Timer B1
Timer B1 is an 8-bit timer that increments each time a clock pulse is input. This timer has two
operating modes, interval and auto reload. Figure 11.1 shows a block diagram of timer B1.
11.1
Features
• Selection of seven internal clock sources (φ/8192, φ/2048, φ/512, φ/256, φ/64, φ/16, and φ/4) or
an external clock (can be used to count external events).
• An interrupt is generated when the counter overflows.
φ
PSS
TCB1
TMIB1
Internal data bus
TMB1
TLB1
[Legend]
TMB1:
TCB1:
TLB1:
IRRTB1:
PSS:
TMIB1:
Timer mode register B1
Timer counter B1
Timer load register B1
Timer B1 interrupt request flag
Prescaler S
Timer B1 event input
IRRTB1
Figure 11.1 Block Diagram of Timer B1
TIM08B0A_000020020200
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REJ09B0027-0500
Section 11 Timer B1
11.2
Input/Output Pin
Table 11.1 shows the timer B1 pin configuration.
Table 11.1 Pin Configuration
Name
Abbreviation
I/O
Function
Timer B1 event input
TMIB1
Input
Event input to TCB1
11.3
Register Descriptions
The timer B1 has the following registers.
• Timer mode register B1 (TMB1)
• Timer counter B1 (TCB1)
• Timer load register B1 (TLB1)
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Section 11 Timer B1
11.3.1
Timer Mode Register B1 (TMB1)
TMB1 selects the auto-reload function and input clock.
Bit
Bit Name
Initial
Value
R/W
Description
7
TMB17
0
R/W
Auto-reload function select
0: Interval timer function selected
1: Auto-reload function selected
6 to 3
All 1
Reserved
These bits are always read as 1.
2
TMB12
0
R/W
Clock select
1
TMB11
0
R/W
000: Internal clock: φ/8192
0
TMB10
0
R/W
001: Internal clock: φ/2048
010: Internal clock: φ/512
011: Internal clock: φ/256
100: Internal clock: φ/64
101: Internal clock: φ/16
110: Internal clock: φ/4
111: External event (TMIB1): rising or falling edge*
Note: * The edge of the external event signal is selected
by bit IEG1 in the interrupt edge select register 1
(IEGR1). See section 3.2.1, Interrupt Edge
Select Register 1 (IEGR1), for details. Before
setting TMB12 to TMB10 to 1, IRQ1 in the port
mode register 1 (PMR1) should be set to 1.
11.3.2
Timer Counter B1 (TCB1)
TCB1 is an 8-bit read-only up-counter, which is incremented by internal clock input. The clock
source for input to this counter is selected by bits TMB12 to TMB10 in TMB1. TCB1 values can
be read by the CPU at any time. When TCB1 overflows from H'FF to H'00 or to the value set in
TLB1, the IRRTB1 flag in IRR2 is set to 1. TCB1 is allocated to the same address as TLB1. TCB1
is initialized to H'00.
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Section 11 Timer B1
11.3.3
Timer Load Register B1 (TLB1)
TLB1 is an 8-bit write-only register for setting the reload value of TCB1. When a reload value is
set in TLB1, the same value is loaded into TCB1 as well, and TCB1 starts counting up from that
value. When TCB1 overflows during operation in auto-reload mode, the TLB1 value is loaded
into TCB1. Accordingly, overflow periods can be set within the range of 1 to 256 input clocks.
TLB1 is allocated to the same address as TCB1. TLB1 is initialized to H'00.
11.4
Operation
11.4.1
Interval Timer Operation
When bit TMB17 in TMB1 is cleared to 0, timer B1 functions as an 8-bit interval timer. Upon
reset, TCB1 is cleared to H'00 and bit TMB17 is cleared to 0, so up-counting and interval timing
resume immediately. The operating clock of timer B1 is selected from seven internal clock signals
output by prescaler S, or an external clock input at pin TMB1. The selection is made by bits
TMB12 to TMB10 in TMB1.
After the count value in TMB1 reaches H'FF, the next clock signal input causes timer B1 to
overflow, setting flag IRRTB1 in IRR2 to 1. If IENTB1 in IENR2 is 1, an interrupt is requested to
the CPU.
At overflow, TCB1 returns to H'00 and starts counting up again. During interval timer operation
(TMB17 = 0), when a value is set in TLB1, the same value is set in TCB1.
11.4.2
Auto-Reload Timer Operation
Setting bit TMB17 in TMB1 to 1 causes timer B1 to function as an 8-bit auto-reload timer. When
a reload value is set in TLB1, the same value is loaded into TCB1, becoming the value from which
TCB1 starts its count. After the count value in TCB1 reaches H'FF, the next clock signal input
causes timer B1 to overflow. The TLB1 value is then loaded into TCB1, and the count continues
from that value. The overflow period can be set within a range from 1 to 256 input clocks,
depending on the TLB1 value.
The clock sources and interrupts in auto-reload mode are the same as in interval mode. In autoreload mode (TMB17 = 1), when a new value is set in TLB1, the TLB1 value is also loaded into
TCB1.
Rev.5.00 Nov. 02, 2005 Page 156 of 500
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Section 11 Timer B1
11.4.3
Event Counter Operation
Timer B1 can operate as an event counter in which TMIB1 is set to an event input pin. External
event counting is selected by setting bits TMB12 to TMB10 in TMB1 to 1. TCB1 counts up at
rising or falling edge of an external event signal input at pin TMB1.
When timer B1 is used to count external event input, bit IRQ1 in PMR1 should be set to 1 and
IEN1 in IENR1 should be cleared to 0 to disable IRQ1 interrupt requests.
11.5
Timer B1 Operating Modes
Table 11.2 shows the timer B1 operating modes.
Table 11.2 Timer B1 Operating Modes
Operating Mode
Reset
Active
Interval
TCB1
TMB1
Sleep
Subactive
Subsleep
Standby
Reset
Functions
Functions
Halted
Halted
Halted
Auto-reload Reset
Functions
Functions
Halted
Halted
Halted
Reset
Functions
Retained
Retained
Retained
Retained
Rev.5.00 Nov. 02, 2005 Page 157 of 500
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Section 11 Timer B1
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REJ09B0027-0500
Section 12 Timer V
Section 12 Timer V
Timer V is an 8-bit timer based on an 8-bit counter. Timer V counts external events. Comparematch signals with two registers can also be used to reset the counter, request an interrupt, or
output a pulse signal with an arbitrary duty cycle. Counting can be initiated by a trigger input at
the TRGV pin, enabling pulse output control to be synchronized to the trigger, with an arbitrary
delay from the trigger input. Figure 12.1 shows a block diagram of timer V.
12.1
Features
• Choice of seven clock signals is available.
Choice of six internal clock sources (φ/128, φ/64, φ/32, φ/16, φ/8, φ/4) or an external clock.
• Counter can be cleared by compare match A or B, or by an external reset signal. If the count
stop function is selected, the counter can be halted when cleared.
• Timer output is controlled by two independent compare match signals, enabling pulse output
with an arbitrary duty cycle, PWM output, and other applications.
• Three interrupt sources: compare match A, compare match B, timer overflow
• Counting can be initiated by trigger input at the TRGV pin. The rising edge, falling edge, or
both edges of the TRGV input can be selected.
TIM08V0A_000120030300
Rev.5.00 Nov. 02, 2005 Page 159 of 500
REJ09B0027-0500
Section 12 Timer V
TCRV1
TCORB
Trigger
control
TRGV
Comparator
TCNTV
Internal data bus
Clock select
TMCIV
Comparator
φ
PSS
TCORA
TMRIV
Clear
control
TCRV0
Interrupt
request
control
TMOV
[Legend]
TCORA:
TCORB:
TCNTV:
TCSRV:
TCRV0:
TCRV1:
PSS:
CMIA:
CMIB:
OVI:
Output
control
TCSRV
Time constant register A
Time constant register B
Timer counter V
Timer control/status register V
Timer control register V0
Timer control register V1
Prescaler S
Compare-match interrupt A
Compare-match interrupt B
Overflow interupt
Figure 12.1 Block Diagram of Timer V
Rev.5.00 Nov. 02, 2005 Page 160 of 500
REJ09B0027-0500
CMIA
CMIB
OVI
Section 12 Timer V
12.2
Input/Output Pins
Table 12.1 shows the timer V pin configuration.
Table 12.1 Pin Configuration
Name
Abbreviation I/O
Function
Timer V output
TMOV
Output
Timer V waveform output
Timer V clock input
TMCIV
Input
Clock input to TCNTV
Timer V reset input
TMRIV
Input
External input to reset TCNTV
Trigger input
TRGV
Input
Trigger input to initiate counting
12.3
Register Descriptions
Time V has the following registers.
•
•
•
•
•
•
Timer counter V (TCNTV)
Timer constant register A (TCORA)
Timer constant register B (TCORB)
Timer control register V0 (TCRV0)
Timer control/status register V (TCSRV)
Timer control register V1 (TCRV1)
12.3.1
Timer Counter V (TCNTV)
TCNTV is an 8-bit up-counter. The clock source is selected by bits CKS2 to CKS0 in timer
control register V0 (TCRV0). The TCNTV value can be read and written by the CPU at any time.
TCNTV can be cleared by an external reset input signal, or by compare match A or B. The
clearing signal is selected by bits CCLR1 and CCLR0 in TCRV0.
When TCNTV overflows, OVF is set to 1 in timer control/status register V (TCSRV).
TCNTV is initialized to H'00.
12.3.2
Time Constant Registers A and B (TCORA, TCORB)
TCORA and TCORB have the same function.
TCORA and TCORB are 8-bit read/write registers.
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Section 12 Timer V
TCORA and TCNTV are compared at all times. When the TCORA and TCNTV contents match,
CMFA is set to 1 in TCSRV. If CMIEA is also set to 1 in TCRV0, a CPU interrupt is requested.
Note that they must not be compared during the T3 state of a TCORA write cycle.
Timer output from the TMOV pin can be controlled by the identifying signal (compare match A)
and the settings of bits OS3 to OS0 in TCSRV.
TCORA and TCORB are initialized to H'FF.
12.3.3
Timer Control Register V0 (TCRV0)
TCRV0 selects the input clock signals of TCNTV, specifies the clearing conditions of TCNTV,
and controls each interrupt request.
Bit
Bit Name
Initial
Value
R/W
Description
7
CMIEB
0
R/W
Compare Match Interrupt Enable B
When this bit is set to 1, interrupt request from the CMFB
bit in TCSRV is enabled.
6
CMIEA
0
R/W
Compare Match Interrupt Enable A
When this bit is set to 1, interrupt request from the CMFA
bit in TCSRV is enabled.
5
OVIE
0
R/W
Timer Overflow Interrupt Enable
When this bit is set to 1, interrupt request from the OVF
bit in TCSRV is enabled.
4
CCLR1
0
R/W
Counter Clear 1 and 0
3
CCLR0
0
R/W
These bits specify the clearing conditions of TCNTV.
00: Clearing is disabled
01: Cleared by compare match A
10: Cleared by compare match B
11: Cleared on the rising edge of the TMRIV pin. The
operation of TCNTV after clearing depends on TRGE
in TCRV1.
2
CKS2
0
R/W
Clock Select 2 to 0
1
CKS1
0
R/W
0
CKS0
0
R/W
These bits select clock signals to input to TCNTV and the
counting condition in combination with ICKS0 in TCRV1.
Refer to table 12.2.
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Section 12 Timer V
Table 12.2 Clock Signals to Input to TCNTV and Counting Conditions
TCRV0
TCRV1
Bit 2
Bit 1
Bit 0
Bit 0
CKS2
CKS1
CKS0
ICKS0
Description
0
0
0
Clock input prohibited
1
0
Internal clock: counts on φ/4, falling edge
1
Internal clock: counts on φ/8, falling edge
0
Internal clock: counts on φ/16, falling edge
1
Internal clock: counts on φ/32, falling edge
0
Internal clock: counts on φ/64, falling edge
1
Internal clock: counts on φ/128, falling edge
1
0
1
1
0
0
Clock input prohibited
1
External clock: counts on rising edge
1
0
External clock: counts on falling edge
1
External clock: counts on rising and falling
edge
Rev.5.00 Nov. 02, 2005 Page 163 of 500
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Section 12 Timer V
12.3.4
Timer Control/Status Register V (TCSRV)
TCSRV indicates the status flag and controls outputs by using a compare match.
Bit
Bit Name
Initial
Value
R/W
Description
7
CMFB
0
R/W
Compare Match Flag B
Setting condition:
When the TCNTV value matches the TCORB value
Clearing condition:
After reading CMFB = 1, cleared by writing 0 to CMFB
6
CMFA
0
R/W
Compare Match Flag A
Setting condition:
When the TCNTV value matches the TCORA value
Clearing condition:
After reading CMFA = 1, cleared by writing 0 to CMFA
5
OVF
0
R/W
Timer Overflow Flag
Setting condition:
When TCNTV overflows from H'FF to H'00
Clearing condition:
After reading OVF = 1, cleared by writing 0 to OVF
4
1
3
OS3
0
R/W
Output Select 3 and 2
2
OS2
0
R/W
These bits select an output method for the TMOV pin by
the compare match of TCORB and TCNTV.
Reserved
This bit is always read as 1.
00: No change
01: 0 output
10: 1 output
11: Output toggles
1
OS1
0
R/W
Output Select 1 and 0
0
OS0
0
R/W
These bits select an output method for the TMOV pin by
the compare match of TCORA and TCNTV.
00: No change
01: 0 output
10: 1 output
11: Output toggles
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Section 12 Timer V
OS3 and OS2 select the output level for compare match B. OS1 and OS0 select the output level
for compare match A. The two output levels can be controlled independently. After a reset, the
timer output is 0 until the first compare match.
12.3.5
Timer Control Register V1 (TCRV1)
TCRV1 selects the edge at the TRGV pin, enables TRGV input, and selects the clock input to
TCNTV.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 5
All 1
Reserved
These bits are always read as 1.
4
TVEG1
0
R/W
TRGV Input Edge Select
3
TVEG0
0
R/W
These bits select the TRGV input edge.
00: TRGV trigger input is prohibited
01: Rising edge is selected
10: Falling edge is selected
11: Rising and falling edges are both selected
2
TRGE
0
R/W
TCNT starts counting up by the input of the edge which is
selected by TVEG1 and TVEG0.
0: Disables starting counting-up TCNTV by the input of
the TRGV pin and halting counting-up TCNTV when
TCNTV is cleared by a compare match.
1: Enables starting counting-up TCNTV by the input of
the TRGV pin and halting counting-up TCNTV when
TCNTV is cleared by a compare match.
1
1
Reserved
This bit is always read as 1.
0
ICKS0
0
R/W
Internal Clock Select 0
This bit selects clock signals to input to TCNTV in
combination with CKS2 to CKS0 in TCRV0.
Refer to table 12.2.
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Section 12 Timer V
12.4
Operation
12.4.1
Timer V Operation
1. According to table 12.2, six internal/external clock signals output by prescaler S can be
selected as the timer V operating clock signals. When the operating clock signal is selected,
TCNTV starts counting-up. Figure 12.2 shows the count timing with an internal clock signal
selected, and figure 12.3 shows the count timing with both edges of an external clock signal
selected.
2. When TCNTV overflows (changes from H'FF to H'00), the overflow flag (OVF) in TCRV0
will be set. The timing at this time is shown in figure 12.4. An interrupt request is sent to the
CPU when OVIE in TCRV0 is 1.
3. TCNTV is constantly compared with TCORA and TCORB. Compare match flag A or B
(CMFA or CMFB) is set to 1 when TCNTV matches TCORA or TCORB, respectively. The
compare-match signal is generated in the last state in which the values match. Figure 12.5
shows the timing. An interrupt request is generated for the CPU when CMIEA or CMIEB in
TCRV0 is 1.
4. When a compare match A or B is generated, the TMOV responds with the output value
selected by bits OS3 to OS0 in TCSRV. Figure 12.6 shows the timing when the output is
toggled by compare match A.
5. When CCLR1 or CCLR0 in TCRV0 is 01 or 10, TCNTV can be cleared by the corresponding
compare match. Figure 12.7 shows the timing.
6. When CCLR1 or CCLR0 in TCRV0 is 11, TCNTV can be cleared by the rising edge of the
input of TMRIV pin. A TMRIV input pulse-width of at least 1.5 system clocks is necessary.
Figure 12.8 shows the timing.
7. When a counter-clearing source is generated with TRGE in TCRV1 set to 1, the counting-up is
halted as soon as TCNTV is cleared. TCNTV resumes counting-up when the edge selected by
TVEG1 or TVEG0 in TCRV1 is input from the TGRV pin.
Rev.5.00 Nov. 02, 2005 Page 166 of 500
REJ09B0027-0500
Section 12 Timer V
φ
Internal clock
TCNTV input
clock
TCNTV
N–1
N
N+1
Figure 12.2 Increment Timing with Internal Clock
φ
TMCIV
(External clock
input pin)
TCNTV input
clock
TCNTV
N–1
N
N+1
Figure 12.3 Increment Timing with External Clock
φ
TCNTV
H'FF
H'00
Overflow signal
OVF
Figure 12.4 OVF Set Timing
Rev.5.00 Nov. 02, 2005 Page 167 of 500
REJ09B0027-0500
Section 12 Timer V
φ
TCNTV
N
TCORA or
TCORB
N
N+1
Compare match
signal
CMFA or
CMFB
Figure 12.5 CMFA and CMFB Set Timing
φ
Compare match
A signal
Timer V output
pin
Figure 12.6 TMOV Output Timing
φ
Compare match
A signal
TCNTV
N
H'00
Figure 12.7 Clear Timing by Compare Match
Rev.5.00 Nov. 02, 2005 Page 168 of 500
REJ09B0027-0500
Section 12 Timer V
φ
TMRIV (External
counter reset
input pin)
TCNTV reset
signal
TCNTV
N–1
N
H'00
Figure 12.8 Clear Timing by TMRIV Input
Rev.5.00 Nov. 02, 2005 Page 169 of 500
REJ09B0027-0500
Section 12 Timer V
12.5
Timer V Application Examples
12.5.1
Pulse Output with Arbitrary Duty Cycle
Figure 12.9 shows an example of output of pulses with an arbitrary duty cycle.
1. Set bits CCLR1 and CCLR0 in TCRV0 so that TCNTV will be cleared by compare match with
TCORA.
2. Set bits OS3 to OS0 in TCSRV so that the output will go to 1 at compare match with TCORA
and to 0 at compare match with TCORB.
3. Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source.
4. With these settings, a waveform is output without further software intervention, with a period
determined by TCORA and a pulse width determined by TCORB.
TCNTV value
H'FF
Counter cleared
TCORA
TCORB
H'00
Time
TMOV
Figure 12.9 Pulse Output Example
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REJ09B0027-0500
Section 12 Timer V
12.5.2
Pulse Output with Arbitrary Pulse Width and Delay from TRGV Input
The trigger function can be used to output a pulse with an arbitrary pulse width at an arbitrary
delay from the TRGV input, as shown in figure 12.10. To set up this output:
1. Set bits CCLR1 and CCLR0 in TCRV0 so that TCNTV will be cleared by compare match with
TCORB.
2. Set bits OS3 to OS0 in TCSRV so that the output will go to 1 at compare match with TCORA
and to 0 at compare match with TCORB.
3. Set bits TVEG1 and TVEG0 in TCRV1 and set TRGE to select the falling edge of the TRGV
input.
4. Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source.
5. After these settings, a pulse waveform will be output without further software intervention,
with a delay determined by TCORA from the TRGV input, and a pulse width determined by
(TCORB – TCORA).
TCNTV value
H'FF
Counter cleared
TCORB
TCORA
H'00
Time
TRGV
TMOV
Compare match A
Compare match B
clears TCNTV and
halts count-up
Compare match A
Compare match B
clears TCNTV and
halts count-up
Figure 12.10 Example of Pulse Output Synchronized to TRGV Input
Rev.5.00 Nov. 02, 2005 Page 171 of 500
REJ09B0027-0500
Section 12 Timer V
12.6
Usage Notes
The following types of contention or operation can occur in timer V operation.
1.
2.
3.
4.
Writing to registers is performed in the T3 state of a TCNTV write cycle. If a TCNTV clear
signal is generated in the T3 state of a TCNTV write cycle, as shown in figure 12.11, clearing
takes precedence and the write to the counter is not carried out. If counting-up is generated in
the T3 state of a TCNTV write cycle, writing takes precedence.
If a compare match is generated in the T3 state of a TCORA or TCORB write cycle, the write
to TCORA or TCORB takes precedence and the compare match signal is inhibited. Figure
12.12 shows the timing.
If compare matches A and B occur simultaneously, any conflict between the output selections
for compare match A and compare match B is resolved by the following priority: toggle
output > output 1 > output 0.
Depending on the timing, TCNTV may be incremented by a switch between different internal
clock sources. When TCNTV is internally clocked, an increment pulse is generated from the
falling edge of an internal clock signal, that is divided system clock (φ). Therefore, as shown
in figure 12.3 the switch is from a high clock signal to a low clock signal, the switchover is
seen as a falling edge, causing TCNTV to increment. TCNTV can also be incremented by a
switch between internal and external clocks.
TCNTV write cycle by CPU
T2
T1
T3
φ
Address
TCNTV address
Internal write signal
Counter clear signal
TCNTV
N
H'00
Figure 12.11 Contention between TCNTV Write and Clear
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Section 12 Timer V
TCORA write cycle by CPU
T2
T1
T3
φ
Address
TCORA address
Internal write signal
TCNTV
N
N+1
TCORA
N
M
TCORA write data
Compare match signal
Inhibited
Figure 12.12 Contention between TCORA Write and Compare Match
Clock before
switching
Clock after
switching
Count clock
TCNTV
N
N+1
N+2
Write to CKS1 and CKS0
Figure 12.13 Internal Clock Switching and TCNTV Operation
Rev.5.00 Nov. 02, 2005 Page 173 of 500
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Section 12 Timer V
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Section 13 Timer Z
Section 13 Timer Z
The timer Z has a 16-bit timer with two channels. Figures 13.1, 13.2, and 13.3 show the block
diagrams of entire timer Z, its channel 0, and its channel 1, respectively. For details on the timer Z
functions, refer to table 13.1.
13.1
Features
• Capability to process up to eight inputs/outputs
• Eight general registers (GR): four registers for each channel
Independently assignable output compare or input capture functions
• Selection of five counter clock sources: four internal clocks (φ, φ/2, φ/4, and φ/8) and an
external clock
• Seven selectable operating modes
Output compare function
Selection of 0 output, 1 output, or toggle output
Input capture function
Rising edge, falling edge, or both edges
Synchronous operation
Timer counters_0 and _1 (TCNT_0 and TCNT_1) can be written simultaneously.
Simultaneous clearing by compare match or input capture is possible.
PWM mode
Up to six-phase PWM output can be provided with desired duty ratio.
Reset synchronous PWM mode
Three-phase PWM output for normal and counter phases
Complementary PWM mode
Three-phase PWM output for non-overlapped normal and counter phases
The A/D conversion start trigger can be set for PWM cycles.
Buffer operation
The input capture register can be consisted of double buffers.
The output compare register can automatically be modified.
• High-speed access by the internal 16-bit bus
16-bit TCNT and GR registers can be accessed in high speed by a 16-bit bus interface
• Any initial timer output value can be set
• Output of the timer is disabled by external trigger
TIM08Z0A_000120030300
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Section 13 Timer Z
• Eleven interrupt sources
Four compare match/input capture interrupts and an overflow interrupt are available for
each channel. An underflow interrupt can be set for channel 1.
Table 13.1 Timer Z Functions
Item
Channel 0
Channel 1
Count clock
Internal clocks: φ, φ/2, φ/4, φ/8
External clock: FTIOA0 (TCLK)
General registers
(output compare/input
capture registers)
GRA_0, GRB_0, GRC_0, GRD_0 GRA_1, GRB_1, GRC_1, GRD_1
Buffer register
GRC_0, GRD_0
GRC_1, GRD_1
I/O pins
FTIOA0, FTIOB0, FTIOC0,
FTIOD0
FTIOA1, FTIOB1, FTIOC1,
FTIOD1
Counter clearing function
Compare match/input capture of
GRA_0, GRB_0, GRC_0, or
GRD_0
Compare match/input capture of
GRA_1, GRB_1, GRC_1, or
GRD_1
Compare
match output
0 output
Yes
Yes
1 output
Yes
Yes
output
Yes
Yes
Input capture function
Yes
Yes
Synchronous operation
Yes
Yes
PWM mode
Yes
Yes
Reset synchronous PWM
mode
Yes
Yes
Complementary PWM
mode
Yes
Yes
Buffer function
Yes
Yes
Interrupt sources
Compare match/input capture A0
to D0
Overflow
Compare match/input capture A1
to D1
Overflow
Underflow
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Section 13 Timer Z
ITMZ0
FTIOA0
ITMZ1
FTIOB0
FTIOC0
FTIOD0
Control logic
FTIOA1
FTIOB1
FTIOC1
FTIOD1
φ, φ/2,
φ/4, φ/8
ADTRG
Channel 0
timer
Channel 1
timer
TSTR
TMDR
TPMR
TFCR
TOER
TOCR
Module data bus
[Legend]
TSTR :
Timer start register (8 bits)
TMDR : Timer mode register (8 bits)
TPMR : Timer PWM mode register (8 bits)
TFCR :
Timer function control register (8 bits)
TOER :
Timer output master enable register (8 bits)
TOCR : Timer output control register (8 bits)
ADTRG : A/D conversion start trigger output signal
ITMZ0 : Channel 0 interrupt
ITMZ1 : Channel 1 interrupt
Figure 13.1 Timer Z Block Diagram
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Section 13 Timer Z
FTIOA0
FTIOB0
φ, φ/2,
φ/4, φ/8
FTIOC0
Clock select
FTIOD0
Control logic
ITMZ0
Module data bus
[Legend]
TCNT_0 :
GRA_0, GRB_0:
GRC_0, GRD_0 :
TCR_0 :
TIORA_0 :
TIORC_0 :
TSR_0 :
TIER_0 :
POCR_0 :
ITMZ0 :
Timer counter_0 (16 bits)
General registers A_0, B_0, C_0, and D_0 (input capture/output compare registers:
16 bits × 4)
Timer control register_0 (8 bits)
Timer I/O control register A_0 (8 bits)
Timer I/O control register C_0 (8 bits)
Timer status register_0 (8 bits)
Timer interrupt enable register_0 (8 bits)
PWM mode output level control register_0 (8 bits)
Channel 0 interrupt
Figure 13.2 Timer Z (Channel 0) Block Diagram
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REJ09B0027-0500
POCR_0
TIER_0
TSR_0
TIORC_0
TIORA_0
TCR_0
GRD_0
GRC_0
GRB_0
GRA_0
TCNT_0
Comparator
Section 13 Timer Z
FTIOA1
FTIOB1
φ, φ/2,
φ/4, φ/8
FTIOC1
Clock select
FTIOD1
Control logic
ITMZ1
POCR_1
TIER_1
TSR_1
TIORC_1
TIORA_1
TCR_1
GRD_1
GRC_1
GRB_1
GRA_1
TCNT_1
Comparator
Module data bus
[Legend]
TCNT_1 :
GRA_1, GRB_1:
GRC_1, GRD_1 :
TCR_1 :
TIORA_1 :
TIORC_1 :
TSR_1 :
TIER_1 :
POCR_1 :
ITMZ1 :
Timer counter_1 (16 bits)
General registers A_1, B_1, C_1, and D_1 (input capture/output compare registers:
16 bits × 4)
Timer control register_1 (8 bits)
Timer I/O control register A_1 (8 bits)
Timer I/O control register C_1 (8 bits)
Timer status register_1 (8 bits)
Timer interrupt enable register_1 (8 bits)
PWM mode output level control register_1 (8 bits)
Channel 1 interrupt
Figure 13.3 Timer Z (Channel 1) Block Diagram
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Section 13 Timer Z
13.2
Input/Output Pins
Table 13.2 summarizes the timer Z pins.
Table 13.2 Pin Configuration
Name
Abbreviation
Input/Output
Function
Input capture/output
compare A0
FTIOA0
Input/output
GRA_0 output compare output, GRA_0
input capture input, or external clock
input (TCLK)
Input capture/output
compare B0
FTIOB0
Input/output
GRB_0 output compare output, GRB_0
input capture input, or PWM output
Input capture/output
compare C0
FTIOC0
Input/output
GRC_0 output compare output, GRC_0
input capture input, or PWM
synchronous output (in reset
synchronous PWM and complementary
PWM modes)
Input capture/output
compare D0
FTIOD0
Input/output
GRD_0 output compare output, GRD_0
input capture input, or PWM output
Input capture/output
compare A1
FTIOA1
Input/output
GRA_1 output compare output, GRA_1
input capture input, or PWM output (in
reset synchronous PWM and
complementary PWM modes)
Input capture/output
compare B1
FTIOB1
Input/output
GRB_1 output compare output, GRB_1
input capture input, or PWM output
Input capture/output
compare C1
FTIOC1
Input/output
GRC_1 output compare output, GRC_1
input capture input, or PWM output
Input capture/output
compare D1
FTIOD1
Input/output
GRD_1 output compare output, GRD_1
input capture input, or PWM output
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Section 13 Timer Z
13.3
Register Descriptions
The timer Z has the following registers.
Common
•
•
•
•
•
•
Timer start register (TSTR)
Timer mode register (TMDR)
Timer PWM mode register (TPMR)
Timer function control register (TFCR)
Timer output master enable register (TOER)
Timer output control register (TOCR)
Channel 0
•
•
•
•
•
•
•
•
•
•
•
Timer control register_0 (TCR_0)
Timer I/O control register A_0 (TIORA_0)
Timer I/O control register C_0 (TIORC_0)
Timer status register_0 (TSR_0)
Timer interrupt enable register_0 (TIER_0)
PWM mode output level control register_0 (POCR_0)
Timer counter_0 (TCNT_0)
General register A_0 (GRA_0)
General register B_0 (GRB_0)
General register C_0 (GRC_0)
General register D_0 (GRD_0)
Channel 1
•
•
•
•
•
•
•
•
•
Timer control register_1 (TCR_1)
Timer I/O control register A_1 (TIORA_1)
Timer I/O control register C_1 (TIORC_1)
Timer status register_1 (TSR_1)
Timer interrupt enable register_1 (TIER_1)
PWM mode output level control register_1 (POCR_1)
Timer counter_1 (TCNT_1)
General register A_1 (GRA_1)
General register B_1 (GRB_1)
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Section 13 Timer Z
• General register C_1 (GRC_1)
• General register D_1 (GRD_1)
13.3.1
Timer Start Register (TSTR)
TSTR selects the operation/stop for the TCNT counter.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 2
All 1
Reserved
These bits are always read as 1, and cannot be modified.
1
STR1
0
R/W
Channel 1 Counter Start
0: TCNT_1 halts counting
1: TCNT_1 starts counting
0
STR0
0
R/W
Channel 0 Counter Start
0: TCNT_0 halts counting
1: TCNT_0 starts counting
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Section 13 Timer Z
13.3.2
Timer Mode Register (TMDR)
TMDR selects buffer operation settings and synchronized operation.
Bit
Bit Name
Initial
Value
R/W
Description
7
BFD1
0
R/W
Buffer Operation D1
0: GRD_1 operates normally
1: GRB_1 and GRD_1 are used together for buffer
operation
6
BFC1
0
R/W
Buffer Operation C1
0: GRC_1 operates normally
1: GRA_1 and GRD_1 are used together for buffer
operation
5
BFD0
0
R/W
Buffer Operation D0
0: GRD_0 operates normally
1: GRB_0 and GRD_0 are used together for buffer
operation
4
BFC0
0
R/W
Buffer Operation C0
0: GRC_0 operates normally
1: GRA_0 and GRC_0 are used together for buffer
operation
3 to 1
All 1
Reserved
These bits are always read as 1, and cannot be modified.
0
SYNC
0
R/W
Timer Synchronization
0: TCNT_1 and TCNT_0 operate as a different timer
1: TCNT_1 and TCNT_0 are synchronized
TCNT_1 and TCNT_0 can be pre-set or cleared
synchronously
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Section 13 Timer Z
13.3.3
Timer PWM Mode Register (TPMR)
TPMR sets the pin to enter PWM mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
1
Reserved
This bit is always read as 1, and cannot be modified.
6
PWMD1
0
R/W
PWM Mode D1
0: FTIOD1 operates normally
1: FTIOD1 operates in PWM mode
5
PWMC1
0
R/W
PWM Mode C1
0: FTIOC1 operates normally
1: FTIOC1 operates in PWM mode
4
PWMB1
0
R/W
PWM Mode B1
0: FTIOB1 operates normally
1: FTIOB1 operates in PWM mode
3
1
Reserved
This bit is always read as 1, and cannot be modified.
2
PWMD0
0
R/W
PWM Mode D0
0: FTIOD0 operates normally
1: FTIOD0 operates in PWM mode
1
PWMC0
0
R/W
PWM Mode C0
0: FTIOC0 operates normally
1: FTIOC0 operates in PWM mode
0
PWMB0
0
R/W
PWM Mode B0
0: FTIOB0 operates normally
1: FTIOB0 operates in PWM mode
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Section 13 Timer Z
13.3.4
Timer Function Control Register (TFCR)
TFCR selects the settings and output levels for each operating mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
1
Reserved
This bit is always read as 1.
6
STCLK
0
R/W
External Clock Input Select
0: External clock input is disabled
1: External clock input is enabled
5
ADEG
0
R/W
A/D Trigger Edge Select
A/D module should be set to start an A/D conversion by
the external trigger
0: A/D trigger at the crest in complementary PWM mode
1: A/D trigger at the trough in complementary PWM mode
4
ADTRG
0
R/W
External Trigger Disable
0: A/D trigger for PWM cycles is disabled in
complementary PWM mode
1: A/D trigger for PWM cycles is enabled in
complementary PWM mode
3
OLS1
0
R/W
Output Level Select 1
Selects the counter-phase output levels in reset
synchronous PWM mode or complementary PWM mode.
0: Initial output is high and the active level is low.
1: Initial output is low and the active level is high.
2
OLS0
0
R/W
Output Level Select 0
Selects the normal-phase output levels in reset
synchronous PWM mode or complementary PWM mode.
0: Initial output is high and the active level is low.
1: Initial output is low and the active level is high.
Figure 13.4 shows an example of outputs in reset
synchronous PWM mode and complementary PWM
mode when OLS1 = 0 and OLS0 = 0.
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Section 13 Timer Z
Bit
Bit Name
Initial
Value
R/W
Description
1
CMD1
0
R/W
Combination Mode 1 and 0
0
CMD0
0
R/W
00: Channel 0 and channel 1 operate normally
01: Channel 0 and channel 1 are used together to
operate in reset synchronous PWM mode
10: Channel 0 and channel 1 are used together to
operate in complementary PWM mode (transferred at
the trough)
11: Channel 0 and channel 1 are used together to
operate in complementary PWM mode (transferred at
the crest)
Note: When reset synchronous PWM mode or
complementary PWM mode is selected by these
bits, this setting has the priority to the settings for
PWM mode by each bit in TPMR. Stop TCNT_0
and TCNT_1 before making settings for reset
synchronous PWM mode or complementary PWM
mode.
TCNT_0
TCNT_1
Normal phase
Normal phase
Active level
Active level
Counter phase
Counter phase
Initial
output
Active level
Reset synchronous PWM mode
Initial
output
Active level
Complementary PWM mode
Note: Write H'00 to TOCR to start initial outputs after stopping the counter.
Figure 13.4 Example of Outputs in Reset Synchronous PWM Mode
and Complementary PWM Mode
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Section 13 Timer Z
13.3.5
Timer Output Master Enable Register (TOER)
TOER enables/disables the outputs for channel 0 and channel 1. When WKP4 is selected for
inputs, if a low level signal is input to WKP4, the bits in TOER are set to 1 to disable the output
for timer Z.
Bit
Bit Name
Initial
Value
R/W
Description
7
ED1
1
R/W
Master Enable D1
0: FTIOD1 pin output is enabled according to the TPMR,
TFCR, and TIORC_1 settings
1: FTIOD1 pin output is disabled regardless of the TPMR,
TFCR, and TIORC_1 settings (FTIOD1 pin is operated
as an I/O port).
6
EC1
1
R/W
Master Enable C1
0: FTIOC1 pin output is enabled according to the TPMR,
TFCR, and TIORC_1 settings
1: FTIOC1 pin output is disabled regardless of the TPMR,
TFCR, and TIORC_1 settings (FTIOC1 pin is operated
as an I/O port).
5
EB1
1
R/W
Master Enable B1
0: FTIOB1 pin output is enabled according to the TPMR,
TFCR, and TIORA_1 settings
1: FTIOB1 pin output is disabled regardless of the TPMR,
TFCR, and TIORA_1 settings (FTIOB1 pin is operated
as an I/O port).
4
EA1
1
R/W
Master Enable A1
0: FTIOA1 pin output is enabled according to the TPMR,
TFCR, and TIORA_1 settings
1: FTIOA1 pin output is disabled regardless of the TPMR,
TFCR, and TIORA_1 settings (FTIOA1 pin is operated
as an I/O port).
3
ED0
1
R/W
Master Enable D0
0: FTIOD0 pin output is enabled according to the TPMR,
TFCR, and TIORC_0 settings
1: FTIOD0 pin output is disabled regardless of the TPMR,
TFCR, and TIORC_0 settings (FTIOD0 pin is operated
as an I/O port).
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Section 13 Timer Z
Bit
Bit Name
Initial
Value
R/W
Description
2
EC0
1
R/W
Master Enable C0
0: FTIOC0 pin output is enabled according to the TPMR,
TFCR, and TIORC_0 settings
1: FTIOC0 pin output is disabled regardless of the TPMR,
TFCR, and TIORC_0 settings (FTIOC0 pin is operated
as an I/O port).
1
EB0
1
R/W
Master Enable B0
0: FTIOB0 pin output is enabled according to the TPMR,
TFCR, and TIORA_0 settings
1: FTIOB0 pin output is disabled regardless of the TPMR,
TFCR, and TIORA_0 settings (FTIOB0 pin is operated
as an I/O port).
0
EA0
1
R/W
Master Enable A0
0: FTIOA0 pin output is enabled according to the TPMR,
TFCR, and TIORA_0 settings
1: FTIOA0 pin output is disabled regardless of the TPMR,
TFCR, and TIORA_0 settings (FTIOA0 pin is operated
as an I/O port).
13.3.6
Timer Output Control Register (TOCR)
TOCR selects the initial outputs before the first occurrence of a compare match. Note that bits
OLS1 and OLS0 in TFCR set these initial outputs in reset synchronous PWM mode and
complementary PWM mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
TOD1
0
R/W
Output Level Select D1
0: 0 output at the FTIOD1 pin*
1: 1 output at the FTIOD1 pin*
6
TOC1
0
R/W
Output Level Select C1
0: 0 output at the FTIOC1 pin*
1: 1 output at the FTIOC1 pin*
5
TOB1
0
R/W
Output Level Select B1
0: 0 output at the FTIOB1 pin*
1: 1 output at the FTIOB1 pin*
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Section 13 Timer Z
Bit
Bit Name
Initial
Value
R/W
Description
4
TOA1
0
R/W
Output Level Select A1
0: 0 output at the FTIOA1 pin*
1: 1 output at the FTIOA1 pin*
3
TOD0
0
R/W
Output Level Select D0
0: 0 output at the FTIOD0 pin*
1: 1 output at the FTIOD0 pin*
2
TOC0
0
R/W
Output Level Select C0
0: 0 output at the FTIOC0 pin*
1: 1 output at the FTIOC0 pin*
1
TOB0
0
R/W
Output Level Select B0
0: 0 output at the FTIOB0 pin*
1: 1 output at the FTIOB0 pin*
0
TOA0
0
R/W
Output Level Select A0
0: 0 output at the FTIOA0 pin*
1: 1 output at the FTIOA0 pin*
Note:
13.3.7
*
The change of the setting is immediately reflected in the output value.
Timer Counter (TCNT)
The timer Z has two TCNT counters (TCNT_0 and TCNT_1), one for each channel. The TCNT
counters are 16-bit readable/writable registers that increment/decrement according to input clocks.
Input clocks can be selected by bits TPSC2 to TPSC0 in TCR. TCNT0 and TCNT 1
increment/decrement in complementary PWM mode, while they only increment in other modes.
The TCNT counters are initialized to H'0000 by compare matches with corresponding GRA, GRB,
GRC, or GRD, or input captures to GRA, GRB, GRC, or GRD (counter clearing function). When
the TCNT counters overflow, an OVF flag in TSR for the corresponding channel is set to 1. When
TCNT_1 underflows, an UDF flag in TSR is set to 1. The TCNT counters cannot be accessed in 8bit units; they must always be accessed as a 16-bit unit.
Rev.5.00 Nov. 02, 2005 Page 189 of 500
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Section 13 Timer Z
13.3.8
General Registers A, B, C, and D (GRA, GRB, GRC, and GRD)
GR are 16-bit registers. Timer Z has eight general registers (GR), four for each channel. The GR
registers are dual function 16-bit readable/writable registers, functioning as either output compare
or input capture registers. Functions can be switched by TIORA and TIORC.
The values in GR and TCNT are constantly compared with each other when the GR registers are
used as output compare registers. When the both values match, the IMFA to IMFD flags in TSR
are set to 1. Compare match outputs can be selected by TIORA and TIORC.
When the GR registers are used as input capture registers, the TCNT value is stored after detecting
external signals. At this point, IMFA to IMFD flags in the corresponding TSR are set to 1.
Detection edges for input capture signals can be selected by TIORA and TIORC.
When PWM mode, complementary PWM mode, or reset synchronous PWM mode is selected, the
values in TIORA and TIORC are ignored. Upon reset, the GR registers are set as output compare
registers (no output) and initialized to H'FFFF. The GR registers cannot be accessed in 8-bit units;
they must always be accessed as a 16-bit unit.
Rev.5.00 Nov. 02, 2005 Page 190 of 500
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Section 13 Timer Z
13.3.9
Timer Control Register (TCR)
The TCR registers select a TCNT counter clock, an edge when an external clock is selected, and
counter clearing sources. Timer Z has a total of two TCR registers, one for each channel.
Bit
Bit Name
Initial
value
R/W
Description
7
CCLR2
0
R/W
Counter Clear 2 to 0
6
CCLR1
0
R/W
000: Disables TCNT clearing
5
CCLR0
0
R/W
001: Clears TCNT by GRA compare match/input
1
capture*
010: Clears TCNT by GRB compare match/input
capture*1
011: Synchronization clear; Clears TCNT in synchronous
2
with counter clearing of the other channel’s timer*
100: Disables TCNT clearing
101: Clears TCNT by GRC compare match/input
1
capture*
110: Clears TCNT by GRD compare match/input
capture*1
111: Synchronization clear; Clears TCNT in synchronous
2
with counter clearing of the other channel’s timer*
4
CKEG1
0
R/W
Clock Edge 1 and 0
3
CKEG0
0
R/W
00: Count at rising edge
01: Count at falling edge
1X: Count at both edges
2
TPSC2
0
R/W
Time Prescaler 2 to 0
1
TPSC1
0
R/W
000: Internal clock: count by φ
0
TPSC0
0
R/W
001: Internal clock: count by φ/2
010: Internal clock: count by φ/4
011: Internal clock: count by φ/8
1XX: External clock: count by FTIOA0 (TCLK) pin input
Notes: 1. When GR functions as an output compare register, TCNT is cleared by compare match.
When GR functions as input capture, TCNT is cleared by input capture.
2. Synchronous operation is set by TMDR.
3. X: Don’t care
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Section 13 Timer Z
13.3.10 Timer I/O Control Register (TIORA and TIORC)
The TIOR registers control the general registers (GR). Timer Z has four TIOR registers
(TIORA_0, TIORA_1, TIORC_0, and TIORC_1), two for each channel. In PWM mode including
complementary PWM mode and reset synchronous PWM mode, the settings of TIOR are invalid.
TIORA: TIORA selects whether GRA or GRB is used as an output compare register or an input
capture register. When an output compare register is selected, the output setting is selected. When
an input capture register is selected, an input edge of an input capture signal is selected. TIORA
also selects the function of FTIOA or FTIOB pin.
Bit
Bit Name
Initial
value
R/W
Description
7
1
Reserved
This bit is always read as 1.
6
IOB2
0
R/W
I/O Control B2 to B0
5
IOB1
0
R/W
GRB is an output compare register:
4
IOB0
0
R/W
000: Disables pin output by compare match
001: 0 output by GRB compare match
010: 1 output by GRB compare match
011: Toggle output by GRB compare match
GRB is an input capture register:
100: Input capture to GRB at the rising edge
101: Input capture to GRB at the falling edge
11X: Input capture to GRB at both rising and falling edges
3
1
Reserved
This bit is always read as 1.
2
IOA2
0
R/W
I/O Control A2 to A0
1
IOA1
0
R/W
GRA is an output compare register:
0
IOA0
0
R/W
000: Disables pin output by compare match
001: 0 output by GRA compare match
010: 1 output by GRA compare match
011: Toggle output by GRA compare match
GRA is an input capture register:
100: Input capture to GRA at the rising edge
101: Input capture to GRA at the falling edge
11X: Input capture to GRA at both rising and falling edges
Legend: X: Don't care
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Section 13 Timer Z
TIORC: TIORC selects whether GRC or GRD is used as an output compare register or an input
capture register. When an output compare register is selected, the output setting is selected. When
an input capture register is selected, an input edge of an input capture signal is selected. TIORC
also selects the function of FTIOC or FTIOD pin.
Bit
Bit Name
Initial
value
R/W
Description
7
1
Reserved
This bit is always read as 1.
6
IOD2
0
R/W
I/O Control D2 to D0
5
IOD1
0
R/W
GRD is an output compare register:
4
IOD0
0
R/W
000: Disables pin output by compare match
001: 0 output by GRD compare match
010: 1 output by GRD compare match
011: Toggle output by GRD compare match
GRD is an input capture register:
100: Input capture to GRD at the rising edge
101: Input capture to GRD at the falling edge
11X: Input capture to GRD at both rising and falling
edges
3
1
Reserved
This bit is always read as 1.
2
IOC2
0
R/W
I/O Control C2 to C0
1
IOC1
0
R/W
GRC is an output compare register:
0
IOC0
0
R/W
000: Disables pin output by compare match
001: 0 output by GRC compare match
010: 1 output by GRC compare match
011: Toggle Output by GRC compare match
GRC is an input capture register:
100: Input capture to GRC at the rising edge
101: Input capture to GRC at the falling edge
11X: Input capture to GRC at both rising and falling
edges
Legend: X: Don't care
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Section 13 Timer Z
13.3.11 Timer Status Register (TSR)
TSR indicates generation of an overflow/underflow of TCNT and a compare match/input capture
of GRA, GRB, GRC, and GRD. These flags are interrupt sources. If an interrupt is enabled by a
corresponding bit in TIER, TSR requests an interrupt for the CPU. Timer Z has two TSR registers,
one for each channel.
Bit
Bit Name
Initial
value
R/W
Description
7, 6
All 1
Reserved
5
UDF*
0
R/W
These bits are always read as 1.
Underflow Flag
[Setting condition]
•
When TCNT_1 underflows
[Clearing condition]
•
4
OVF
0
R/W
When 0 is written to UDF after reading UDF = 1
Overflow Flag
[Setting condition]
•
When the TCNT value underflows
[Clearing condition]
•
3
IMFD
0
R/W
When 0 is written to OVF after reading OVF = 1
Input Capture/Compare Match Flag D
[Setting conditions]
•
When TCNT = GRD and GRD is functioning as output
compare register
•
When TCNT value is transferred to GRD by input
capture signal and GRD is functioning as input
capture register
[Clearing condition]
•
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When 0 is written to IMFD after reading IMFD = 1
Section 13 Timer Z
Bit
Bit Name
Initial
value
R/W
Description
2
IMFC
0
R/W
Input Capture/Compare Match Flag C
[Setting conditions]
•
When TCNT = GRC and GRC is functioning as output
compare register
•
When TCNT value is transferred to GRC by input
capture signal and GRC is functioning as input
capture register
[Clearing condition]
•
1
IMFB
0
R/W
When 0 is written to IMFC after reading IMFC = 1
Input Capture/Compare Match Flag B
[Setting conditions]
•
When TCNT = GRB and GRB is functioning as output
compare register
•
When TCNT value is transferred to GRB by input
capture signal and GRB is functioning as input
capture register
[Clearing condition]
•
0
IMFA
0
R/W
When 0 is written to IMFB after reading IMFB = 1
Input Capture/Compare Match Flag A
[Setting conditions]
•
When TCNT = GRA and GRA is functioning as output
compare register
•
When TCNT value is transferred to GRA by input
capture signal and GRA is functioning as input
capture register
[Clearing condition]
•
When 0 is written to IMFA after reading IMFA = 1
Note: Bit 5 is not the UDF flag in TSR_0. It is a reserved bit. It is always read as 1.
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Section 13 Timer Z
13.3.12 Timer Interrupt Enable Register (TIER)
TIER enables or disables interrupt requests for overflow or GR compare match/input capture.
Timer Z has two TIER registers, one for each channel.
Bit
Bit Name
Initial
value
R/W
Description
7 to 5
All 1
Reserved
4
OVIE
0
R/W
Overflow Interrupt Enable
These bits are always read as 1.
0: Interrupt requests (OVI) by OVF or UDF flag are
disabled
1: Interrupt requests (OVI) by OVF or UDF flag are
enabled
3
IMIED
0
R/W
Input Capture/Compare Match Interrupt Enable D
0: Interrupt requests (IMID) by IMFD flag are disabled
1: Interrupt requests (IMID) by IMFD flag are enabled
2
IMIEC
0
R/W
Input Capture/Compare Match Interrupt Enable C
0: Interrupt requests (IMIC) by IMFC flag are disabled
1: Interrupt requests (IMIC) by IMFC flag are enabled
1
IMIEB
0
R/W
Input Capture/Compare Match Interrupt Enable B
0: Interrupt requests (IMIB) by IMFB flag are disabled
1: Interrupt requests (IMIB) by IMFB flag are enabled
0
IMIEA
0
R/W
Input Capture/Compare Match Interrupt Enable A
0: Interrupt requests (IMIA) by IMFA flag are disabled
1: Interrupt requests (IMIA) by IMFA flag are enabled
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Section 13 Timer Z
13.3.13
PWM Mode Output Level Control Register (POCR)
POCR control the active level in PWM mode. Timer Z has two POCR registers, one for each
channel.
Bit
Bit Name
Initial
value
R/W
Description
7 to 3
All 1
Reserved
2
POLD
0
R/W
These bits are always read as 1.
PWM Mode Output Level Control D
0: The output level of FTIOD is low-active
1: The output level of FTIOD is high-active
1
POLC
0
R/W
PWM Mode Output Level Control C
0: The output level of FTIOC is low-active
1: The output level of FTIOC is high-active
0
POLB
0
R/W
PWM Mode Output Level Control B
0: The output level of FTIOB is low-active
1: The output level of FTIOB is high-active
13.3.14 Interface with CPU
1. 16-bit register
TCNT and GR are 16-bit registers. Reading/writing in a 16-bit unit is enabled but disabled in
an 8-bit unit since the data bus with the CPU is 16-bit width. These registers must always be
accessed in a 16-bit unit. Figure 13.5 shows an example of accessing the 16-bit registers.
Internal data bus
H
C
P
L
Module data bus
Bus interface
U
TCNTH
TCNTL
Figure 13.5 Accessing Operation of 16-Bit Register (between CPU and TCNT (16 bits))
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Section 13 Timer Z
2. 8-bit register
Registers other than TCNT and GR are 8-bit registers that are connected internally with the
CPU in an 8-bit width. Figure 13.6 shows an example of accessing the 8-bit registers.
Internal data bus
H
C
P
L
Module data bus
Bus interface
U
TSTR
Figure 13.6 Accessing Operation of 8-Bit Register (between CPU and TSTR (8 bits))
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Section 13 Timer Z
13.4
Operation
13.4.1
Counter Operation
When one of bits STR0 and STR1 in TSTR is set to 1, the TCNT counter for the corresponding
channel begins counting. TCNT can operate as a free-running counter, periodic counter, for
example. Figure 13.7 shows an example of the counter operation setting procedure.
Operation selection
Select counter clock
[1]
Periodic counter
Free-running counter
Select counter clearing source
[2]
Select output compare register
[3]
Set period
Start count operation
[4]
[5]
[1] Select the counter
clock with bits
TPSC2 to TPSC0 in
TCR. When an external
clock is selected, select
the external clock edge
with bits CKEG1
and CKEG0 in TCR.
[2] For periodic counter
operation, select the
TCNT clearing
source with bits
CCLR2 to CCLR0 in
TCR.
[3] Designate the general
register selected in [2]
as an output compare
register by means of
TIOR.
[4] Set the periodic counter
cycle in the general
register selected
in [2].
[5] Set the STR bit in TSTR
to 1 to start the counter
operation.
Figure 13.7 Example of Counter Operation Setting Procedure
1. Free-running count operation and periodic count operation
Immediately after a reset, the TCNT counters for channels 0 and 1 are all designated as freerunning counters. When the relevant bit in TSTR is set to 1, the corresponding TCNT counter
starts an increment operation as a free-running counter. When TCNT overflows, the OVF flag
in TSR is set to 1. If the value of the OVIE bit in the corresponding TIER is 1 at this point,
timer Z requests an interrupt. After overflow, TCNT starts an increment operation again from
H'0000.
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Section 13 Timer Z
Figure 13.8 illustrates free-running counter operation.
TCNT value
H'FFFF
H'0000
Time
STR0,
STR1
OVF
Figure 13.8 Free-Running Counter Operation
When compare match is selected as the TCNT clearing source, the TCNT counter for the relevant
channel performs periodic count operation. The GR registers for setting the period are designated
as output compare registers, and counter clearing by compare match is selected by means of bits
CCLR1 and CCLR0 in TCR. After the settings have been made, TCNT starts an increment
operation as a periodic counter when the corresponding bit in TSTR is set to 1. When the count
value matches the value in GR, the IMFA, IMFB, IMFC, or IMFD flag in TSR is set to 1 and
TCNT is cleared to H'0000.
If the value of the corresponding IMIEA, IMIEB, IMIEC, or IMIED bit in TIER is 1 at this point,
the timer Z requests an interrupt. After a compare match, TCNT starts an increment operation
again from H'0000.
Figure 13.9 illustrates periodic counter operation.
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Section 13 Timer Z
TCNT value
Counter cleared by GR compare match
GR value
H'0000
Time
STR
IMF
Figure 13.9 Periodic Counter Operation
2. TCNT count timing
A. Internal clock operation
A system clock (φ) or three types of clocks (φ/2, φ/4, or φ/8) that divides the system clock
can be selected by bits TPSC2 to TPSC0 in TCR.
Figure 13.10 illustrates this timing.
φ
Internal clock
TCNT input
TCNT
N-1
N
N+1
Figure 13.10 Count Timing at Internal Clock Operation
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Section 13 Timer Z
B. External clock operation
An external clock input pin (TCLK) can be selected by bits TPSC2 to TPSC0 in TCR, and
a detection edge can be selected by bits CKEG1 and CKEG0. To detect an external clock,
the rising edge, falling edge, or both edges can be selected. The pulse width of the external
clock needs two or more system clocks. Note that an external clock does not operate
correctly with the lower pulse width.
Figure 13.11 illustrates the detection timing of the rising and falling edges.
φ
External clock input pin
TCNT input
TCNT
N-1
N
N+1
Figure 13.11 Count Timing at External Clock Operation (Both Edges Detected)
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Section 13 Timer Z
13.4.2
Waveform Output by Compare Match
Timer Z can perform 0, 1, or toggle output from the corresponding FTIOA, FTIOB, FTIOC, or
FTIOD output pin using compare match A, B, C, or D.
Figure 13.12 shows an example of the setting procedure for waveform output by compare match.
Output selection
Select waveform output mode
[1]
Set output timing
[2]
Enable waveform output
[3]
Start count operation
[4]
[1] Select 0 output, 1 output, or toggle
output as a compare much output, by
means of TIOR. The initial values set in
TOCR are output unit the first compare
match occurs.
[2] Set the timing for compare match
generation in GRA/GRB/GRC/GRD.
[3] Enable or disable the timer output by
TOER.
[4] Set the STR bit in TSTR to 1 to start the
TCNT count operation.
<Waveform output>
Figure 13.12 Example of Setting Procedure for Waveform Output by Compare Match
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Section 13 Timer Z
1. Examples of waveform output operation
Figure 13.13 shows an example of 0 output/1 output.
In this example, TCNT has been designated as a free-running counter, and settings have been
made such that 0 is output by compare match A, and 1 is output by compare match B. When
the set level and the pin level coincide, the pin level does not change.
TCNT value
H'FFFF
Time
H'0000
FTIOB
No change
FTIOA
No change
No change
No change
Figure 13.13 Example of 0 Output/1 Output Operation
Figure 13.14 shows an example of toggle output.
In this example, TCNT has been designated as a periodic counter (with counter clearing on
compare match B), and settings have been made such that the output is toggled by both
compare match A and compare match B.
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Section 13 Timer Z
TCNT value
GRB
GRA
Time
H'0000
Toggle output
FTIOB
FTIOA
Toggle output
Figure 13.14 Example of Toggle Output Operation
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Section 13 Timer Z
2. Output compare timing
The compare match signal is generated in the last state in which TCNT and GR match (when
TCNT changes from the matching value to the next value). When the compare match signal is
generated, the output value selected in TIOR is output at the compare match output pin
(FTIOA, FTIOB, FTIOC, or FTIOD). When TCNT matches GR, the compare match signal is
generated only after the next TCNT input clock pulse is input.
Figure 13.15 shows an example of the output compare timing.
φ
TCNT input
TCNT
N
GR
N
N+1
Compare match
signal
FTIOA to FTIOD
Figure 13.15 Output Compare Timing
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Section 13 Timer Z
13.4.3
Input Capture Function
The TCNT value can be transferred to GR on detection of the input edge of the input
capture/output compare pin (FTIOA, FTIOB, FTIOC, or FTIOD). Rising edge, falling edge, or
both edges can be selected as the detected edge. When the input capture function is used, the pulse
width or period can be measured.
Figure 13.16 shows an example of the input capture operation setting procedure.
Input selection
Select input edge of
input capture
[1]
Start counter operation
[2]
[1] Designate GR as an input capture
register by means of TIOR, and select
rising edge, falling edge, or both edges
as the input edge of the input capture
signal.
[2] Set the STR bit in TSTR to 1 to start the
TCNT counter operation.
<Input capture operation>
Figure 13.16 Example of Input Capture Operation Setting Procedure
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Section 13 Timer Z
1. Example of input capture operation
Figure 13.17 shows an example of input capture operation.
In this example, both rising and falling edges have been selected as the FTIOA pin input
capture input edge, the falling edge has been selected as the FTIOB pin input capture input
edge, and counter clearing by GRB input capture has been designated for TCNT.
Counter cleared by FTIOB input (falling edge)
TCNT value
H'0180
H'0160
H'0005
H'0000
Time
FTIOB
FTIOA
GRA
H'0005
GRB
H'0160
H'0180
Figure 13.17 Example of Input Capture Operation
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Section 13 Timer Z
2. Input capture signal timing
Input capture on the rising edge, falling edge, or both edges can be selected through settings in
TIOR. Figure 13.18 shows the timing when the rising edge is selected. The pulse width of the
input capture signal must be at least two system clock (φ) cycles.
φ
Input capture input
Input capture signal
TCNT
GR
N
N
Figure 13.18 Input Capture Signal Timing
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Section 13 Timer Z
13.4.4
Synchronous Operation
In synchronous operation, the values in a number of TCNT counters can be rewritten
simultaneously (synchronous presetting). Also, a number of TCNT counters can be cleared
simultaneously by making the appropriate setting in TCR (synchronous clearing). Synchronous
operation enables GR to be increased with respect to a single time base.
Figure 13.19 shows an example of the synchronous operation setting procedure.
Synchronous operation
selection
Set synchronous
operation
[1]
Synchronous presetting
Set TCNT
Synchronous clearing
[2]
Clearing
source generation
channel?
No
Yes
<Synchronous presetting>
Select counter
clearing source
[3]
Select counter
clearing source
[4]
Start counter operation
[5]
Start counter operation
[5]
<Counter clearing>
<Synchronous clearing>
[1] Set the SYNC bits in TMDR to 1.
[2] When a value is written to either of the TCNT counters, the same value is simultaneously written to the
other TCNT counter.
[3] Set bits CCLR1 and CCLR0 in TCR to specify counter clearing by compare match/input capture.
[4] Set bits CCLR1 and CCLR0 in TCR to designate synchronous clearing for the counter clearing source.
[5] Set the STR bit in TSTR to 1 to start the count operation.
Figure 13.19 Example of Synchronous Operation Setting Procedure
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Section 13 Timer Z
Figure 13.20 shows an example of synchronous operation. In this example, synchronous operation
has been selected, FTIOB0 and FTIOB1 have been designated for PWM mode, GRA_0 compare
match has been set as the channel 0 counter clearing source, and synchronous clearing has been set
for the channel 1 counter clearing source. In addition, the same input clock has been set as the
counter input clock for channel 0 and channel 1. Two-phase PWM waveforms are output from
pins FTIOB0 and FTIOB1. At this time, synchronous presetting and synchronous operation by
GRA_0 compare match are performed by TCNT counters.
For details on PWM mode, see section 13.4.5, PWM Mode.
TCNT values
Synchronous clearing by GRA_0 compare match
GRA_0
GRA_1
GRB_0
GRB_1
H'0000
Time
FTIOB0
FTIOB1
Figure 13.20 Example of Synchronous Operation
13.4.5
PWM Mode
In PWM mode, PWM waveforms are output from the FTIOB, FTIOC, and FTIOD output pins
with GRA as a cycle register and GRB, GRC, and GRD as duty registers. The initial output level
of the corresponding pin depends on the setting values of TOCR and POCR. Table 13.3 shows an
example of the initial output level of the FTIOB0 pin.
The output level is determined by the POLB to POLD bits corresponding to POCR. When POLB
is 0, the FTIOB output pin is set to 0 by compare match B and set to 1 by compare match A.
When POLB is 1, the FTIOB output pin is set to 1 by compare match B and cleared to 0 by
compare match A. In PWM mode, maximum 6-phase PWM outputs are possible.
Figure 13.21 shows an example of the PWM mode setting procedure.
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Section 13 Timer Z
Table 13.3 Initial Output Level of FTIOB0 Pin
TOB0
POLB
Initial Output Level
0
0
1
0
1
0
1
0
0
1
1
1
PWM mode
Select counter clock
[1]
Select counter clearing source
[2]
Set PWM mode
[3]
Set initial output level
[4]
Select output level
[5]
Set GR
[6]
Enable waveform output
[7]
Start counter operation
[8]
[1] Select the counter clock with bits TPSC2
to TOSC0 in TCR. When an external
clock is selected, select the external
clock edge with bits CKEG1 and CKEG0
in TCR.
[2] Use bits CCLR1 and CCLR0 in TCR to
select the counter clearing source.
[3] Select the PWM mode with bits PWMB0
to PWMD0 and PWMB1 to PWMD1 in
TPMR.
[4] Set the initial output value with bits
TOB0 to TOD0 and TOB1 to TOD1 in
TOCR.
[5] Set the output level with bits POLB to
POLD in POCR.
[6] Set the cycle in GRA, and set the duty in
the other GR.
[7] Enable or disable the timer output by
TOER.
[8] Set the STR bit in TSTR to 1 and start
the counter operation.
<PWM mode>
Figure 13.21 Example of PWM Mode Setting Procedure
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Section 13 Timer Z
Figure 13.22 shows an example of operation in PWM mode. The output signals go to 1 and TCNT
is reset at compare match A, and the output signals go to 0 at compare match B, C, and D (TOB,
TOC, and TOD = 1, POLB, POLC, and POLD = 0).
Counter cleared by GRA compare match
TCNT value
GRA
GRB
GRC
GRD
H'0000
Time
FTIOB
FTIOC
FTIOD
Figure 13.22 Example of PWM Mode Operation (1)
Figure 13.23 shows another example of operation in PWM mode. The output signals go to 0 and
TCNT is reset at compare match A, and the output signals go to 1 at compare match B, C, and D
(TOB, TOC, and TOD = 0, POLB, POLC, and POLD = 1).
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Section 13 Timer Z
Counter cleared by GRA compare match
TCNT value
GRA
GRB
GRC
GRD
H'0000
Time
FTIOB
FTIOC
FTIOD
Figure 13.23 Example of PWM Mode Operation (2)
Figures 13.24 (when TOB, TOC, and TOD = 1, POLB, POLC, and POLD = 0) and 13.25 (when
TOB, TOC, and TOD = 0, POLB, POLC, and POLD = 1) show examples of the output of PWM
waveforms with duty cycles of 0% and 100% in PWM mode.
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Section 13 Timer Z
TCNT value
GRB rewritten
GRA
GRB
GRB rewritten
Time
H'0000
0% duty
FTIOB
TCNT value
GRB rewritten
When cycle register and duty register compare matches
occur simultaneously, duty register compare match has
priority.
GRA
GRB rewritten
GRB rewritten
GRB
H'0000
Time
FTIOB
100% duty
TCNT value
GRB rewritten
When cycle register and duty register compare matches
occur simultaneously, duty register compare match has
priority.
GRB rewritten
GRA
GRB rewritten
GRB
H'0000
FTIOB
Time
100% duty
0% duty
Figure 13.24 Example of PWM Mode Operation (3)
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Section 13 Timer Z
TCNT value
GRB rewritten
GRA
GRB
GRB rewritten
H'0000
Time
FTIOB
0% duty
TCNT value
GRB rewritten
When cycle register and duty register compare matches
occur simultaneously, duty register compare match has
priority.
GRA
GRB rewritten
GRB rewritten
GRB
Time
H'0000
100% duty
FTIOB
When cycle register and duty register compare matches
occur simultaneously, duty register compare match has
priority.
TCNT value
GRB rewritten
GRB rewritten
GRA
GRB rewritten
GRB
Time
H'0000
100% duty
FTIOB
0% duty
Figure 13.25 Example of PWM Mode Operation (4)
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Section 13 Timer Z
13.4.6
Reset Synchronous PWM Mode
Three normal- and counter-phase PWM waveforms are output by combining channels 0 and 1 that
one of changing points of waveforms will be common.
In reset synchronous PWM mode, the FTIOB0 to FTIOD0 and FTIOA1 to FTIOD1 pins become
PWM-output pins automatically. TCNT_0 performs an increment operation. Tables 13.4 and
13.5 show the PWM-output pins used and the register settings, respectively.
Figure 13.26 shows the example of reset synchronous PWM mode setting procedure.
Table 13.4 Output Pins in Reset Synchronous PWM Mode
Channel
Pin Name
Input/Output
Pin Function
0
FTIOC0
Output
Toggle output in synchronous with PWM cycle
0
FTIOB0
Output
PWM output 1
0
FTIOD0
Output
PWM output 1 (counter-phase waveform of PWM
output 1)
1
FTIOA1
Output
PWM output 2
1
FTIOC1
Output
PWM output 2 (counter-phase waveform of PWM
output 2)
1
FTIOB1
Output
PWM output 3
1
FTIOD1
Output
PWM output 3 (counter-phase waveform of PWM
output 3)
Table 13.5 Register Settings in Reset Synchronous PWM Mode
Register
Description
TCNT_0
Initial setting of H'0000
TCNT_1
Not used (independently operates)
GRA_0
Sets counter cycle of TCNT_0
GRB_0
Set a changing point of the PWM waveform output from pins FTIOB0 and
FTIOD0.
GRA_1
Set a changing point of the PWM waveform output from pins FTIOA1 and
FTIOC1.
GRB_1
Set a changing point of the PWM waveform output from pins FTIOB1 and
FTIOD1.
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Section 13 Timer Z
Reset synchronous PWM mode
Stop counter operation
[1]
Select counter clock
[2]
Select counter clearing source
[3]
Set reset synchronous PWM mode
[4]
Initialize the output pin
[5]
Set TCNT
[6]
Set GR
[7]
Enable waveform output
[8]
Start counter operation
[9]
[1] Clear bit STR0 in TSTR to 0 and stop the
counter operation of TCNT_0. Set reset
synchronous PWM mode after TCNT_0
stops.
[2] Select the counter clock with bits TPSC2
to TOSC0 in TCR. When an external
clock is selected, select the external clock
edge with bits CKEG1 and CKEG0 in
TCR.
[3] Use bits CCLR1 and CCLR0 in TCR to
select counter clearing source GRA_0.
[4] Select the reset synchronous PWM mode
with bits CMD1 and CMD0 in TFCR.
FTIOB0 to FTIOD0 and FTIOA1 to
FTIOD1 become PWM output pins
automatically.
[5] Set H'00 to TOCR.
[6] Set TCNT_0 as H'0000. TCNT1 does not
need to be set.
[7] GRA_0 is a cycle register. Set a cycle for
GRA_0. Set the changing point timing of
the PWM output waveform for GRB_0,
GRA_1, and GRB_1.
[8] Enable or disable the timer output by
TOER.
[9] Set the STR bit in TSTR to 1 and start the
counter operation.
<Reset synchronous PWM mode>
Figure 13.26 Example of Reset Synchronous PWM Mode Setting Procedure
Rev.5.00 Nov. 02, 2005 Page 218 of 500
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Section 13 Timer Z
Figures 13.27 and 13.28 show examples of operation in reset synchronous PWM mode.
Counter cleared by GRA compare match
TCNT value
GRA_0
GRB_0
GRA_1
GRB_1
H'0000
Time
FTIOB0
FTIOD0
FTIOA1
FTIOC1
FTIOB1
FTIOD1
FTIOC0
Figure 13.27 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 1)
Rev.5.00 Nov. 02, 2005 Page 219 of 500
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Section 13 Timer Z
Counter cleared by GRA compare match
TCNT value
GRA_0
GRB_0
GRA_1
GRB_1
H'0000
Time
FTIOB0
FTIOD0
FTIOA1
FTIOC1
FTIOB1
FTIOD1
FTIOC0
Figure 13.28 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 0)
In reset synchronous PWM mode, TCNT_0 and TCNT_1 perform increment and independent
operations, respectively. However, GRA_1 and GRB_1 are separated from TCNT_1. When a
compare match occurs between TCNT_0 and GRA_0, a counter is cleared and an increment
operation is restarted from H'0000.
The PWM pin outputs 0 or 1 whenever a compare match between GRB_0, GRA_1, GRB_1 and
TCNT_0 or counter clearing occur.
For details on operations when reset synchronous PWM mode and buffer operation are
simultaneously set, refer to section 13.4.8, Buffer Operation.
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Section 13 Timer Z
13.4.7
Complementary PWM Mode
Three PWM waveforms for non-overlapped normal and counter phases are output by combining
channels 0 and 1.
In complementary PWM mode, the FTIOB0 to FTIOD0 and FTIOA1 to FTIOD1 pins become
PWM-output pins automatically. TCNT_0 and TCNT_1 perform an increment or decrement
operation. Tables 13.6 and 13.7 show the output pins and register settings in complementary PWM
mode, respectively.
Figure 13.29 shows the example of complementary PWM mode setting procedure.
Table 13.6 Output Pins in Complementary PWM Mode
Channel
Pin Name
Input/Output
Pin Function
0
FTIOC0
Output
Toggle output in synchronous with PWM cycle
0
FTIOB0
Output
PWM output 1
0
FTIOD0
Output
PWM output 1 (counter-phase waveform nonoverlapped with PWM output 1)
1
FTIOA1
Output
PWM output 2
1
FTIOC1
Output
PWM output 2 (counter-phase waveform nonoverlapped with PWM output 2)
1
FTIOB1
Output
PWM output 3
1
FTIOD1
Output
PWM output 3 (counter-phase waveform nonoverlapped with PWM output 3)
Table 13.7 Register Settings in Complementary PWM Mode
Register
Description
TCNT_0
Initial setting of non-overlapped periods (non-overlapped periods are differences
with TCNT_1)
TCNT_1
Initial setting of H'0000
GRA_0
Sets (upper limit value – 1) of TCNT_0
GRB_0
Set a changing point of the PWM waveform output from pins FTIOB0 and
FTIOD0.
GRA_1
Set a changing point of the PWM waveform output from pins FTIOA1 and
FTIOC1.
GRB_1
Set a changing point of the PWM waveform output from pins FTIOB1 and
FTIOD1.
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Section 13 Timer Z
Complementary PWM mode
Stop counter operation
[1]
Initialize output pin
[2]
Select counter clock
[3]
Set complementary
PWM mode
[4]
Initialize output pin
[5]
Set TCNT
[6]
Set GR
[7]
Enable waveform output
[8]
Start counter operation
[9]
[1] Clear bits STR0 and STR1 in TSTR to 0,
and stop the counter operation of
TCNT_0. Stop TCNT_0 and TCNT_1 and
set complementary PWM mode.
[2] Write H'00 to TOCR.
[3] Use bits TPSC2 to TPSC0 in TCR to
select the same counter clock for channels
0 and 1. When an external clock is
selected, select the edge of the external
clock by bits CKEG1 and CKEG0 in TCR.
Do not use bits CCLR1 and CCLR0 in
TCR to clear the counter.
[4] Use bits CMD1 and CMD0 in TFCR to set
complementary PWM mode. FTIOB0 to
FTIOD0 and FTIOA1 to FTIOD1
automatically become PWM output pins.
[5] Set H'00 to TOCR.
[6] TCNT_1 must be H'0000. Set a nonoverlapped period to TCNT_0.
[7] GRA_0 is a cycle register. Set the cycle to
GRA_0. Set the timing to change the
PWM output waveform to GRB_0, GRA_1,
and GRB_1. Note that the timing must be
set within the range of compare match
carried out for TCNT_0 and TCNT_1.
For GR settings, see 3. Setting GR Value
in Complementary PWM Mode in section
13.4.7.
[8] Use TOER to enable or disable the timer
output.
[9] Set the STR0 and STR1 bits in TSTR to 1
to start the count operation.
<Complementary PWM mode>
Note: To re-enter complementary PWM mode, first, enter a mode other than the complementary
PWM mode. After that, repeat the setting procedures from step [1].
For settings of waveform outputs with a duty cycle of 0% and 100%, see the settings shown
in 2. Examples of Complementary PWM Mode Operation and 3. Setting GR Value in
Complementary PWM Mode in section 13.4.7.
Figure 13.29 Example of Complementar y PWM Mode Setting Procedure
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Section 13 Timer Z
1.
Canceling Procedure of Complementary PWM Mode: Figure 13.30 shows the complementary
PWM mode canceling procedure.
Complementary PWM mode
Stop counter operation
[1]
Cancel complementary
PWM mode
[2]
[1] Clear bit CMD1 in TFCR to 0, and set
channels 0 and 1 to normal operation.
[2] After setting channels 0 and 1 to normal
operation, clear bits STR0 and STR1 in
TSTR to 0 and stop TCNT0 and TCNT1.
<Normal operation>
Figure 13.30 Canceling Procedure of Complementary PWM Mode
2. Examples of Complementary PWM Mode Operation: Figure 13.31 shows an example of
complementary PWM mode operation. In complementary PWM mode, TCNT_0 and TCNT_1
perform an increment or decrement operation. When TCNT_0 and GRA_0 are compared and
their contents match, the counter is decremented, and when TCNT_1 underflows, the counter
is incremented. In GRA_0, GRA_1, and GRB_1, compare match is carried out in the order of
TCNT_0 → TCNT_1 → TCNT_1 → TCNT_0 and PWM waveform is output, during one
cycle of a up/down counter. In this mode, the initial setting will be TCNT_0 > TCNT_1.
Rev.5.00 Nov. 02, 2005 Page 223 of 500
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Section 13 Timer Z
TCNT_0 and GRA_0 are compared and their contents match
TCNT values
GRA_0
GRB_0
GRA_1
GRB_1
H'0000
Time
FTIOB0
FTIOD0
FTIOA1
FTIOC1
FTIOB1
FTIOD1
FTIOC0
Figure 13.31 Example of Complementary PWM Mode Operation (1)
Figure 13.32 (1) and (2) show examples of PWM waveform output with 0% duty and 100% duty
in complementary PWM mode (for one phase).
• TPSC2 = TPSC1 = TPSC0 = 0
Set GRB_0 to H'0000 or a value equal to or more than GRA_0. The waveform with a duty
cycle of 0% and 100% can be output. When buffer operation is used together, the duty cycles
can easily be changed, including the above settings, during operation. For details on buffer
operation, refer to section 13.4.8, Buffer Operation.
• Other than TPSC2 = TPSC1 = TPSC0 = 0
Set GRB_0 to satisfy the following expression: GRA_0 + 1 < GRB_0 < H'FFFF. The
waveform with a duty cycle of 0% and 100% can be output. For details on 0%- and 100%-duty
cycle waveform output, see 3. C., Outputting a waveform with a duty cycle of 0% and 100% in
section 13.4.7.
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Section 13 Timer Z
TCNT values
GRA0
GRB0
H'0000
Time
FTIOB0
FTIOD0
0% duty
(a) When duty is 0%
TCNT values
GRA0
GRB0
H'0000
Time
FTIOB0
FTIOD0
100% duty
(b) When duty is 100%
Figure 13.32 (1) Example of Complementary PWM Mode Operation
(TPSC2 = TPSC1 = TPSC0 = 0) (2)
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Section 13 Timer Z
TCNT values
GRA0
GRB0
H'0000
Time
FTIOB0
FTIOD0
0% duty
(a) When duty is 0%
TCNT values
GRA0
GRB0
H'0000
Time
FTIOB0
FTIOD0
100% duty
(b) When duty is 100%
Figure 13.32 (2) Example of Complementary PWM Mode Operation
(TPSC2 = TPSC1 = TPSC0 ≠ 0) (3)
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Section 13 Timer Z
In complementary PWM mode, when the counter switches from up-counter to down-counter or
vice versa, TCNT_0 and TCNT_1 overshoots or undershoots, respectively. In this case, the
conditions to set the IMFA flag in channel 0 and the UDF flag in channel 1 differ from usual
settings. Also, the transfer conditions in buffer operation differ from usual settings. Such timings
are shown in figures 13.33 and 13.34.
TCNT
N-1
N
N
N+1
N-1
N
GRA_0
IMFA
Set to 1
Flag is not set
Buffer transfer signal
GR
Transferred
to buffer
Not transferred
to buffer
Figure 13.33 Timing of Overshooting
TCNT
H'0001
H'0000
H'FFFF
H'0000
H'0001
Flag is not set
UDF
Set to 1
Buffer transfer signal
GR
Transferred
to buffer
Not transferred
to buffer
Figure 13.34 Timing of Undershooting
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Section 13 Timer Z
When the counter is incremented or decremented, the IMFA flag of channel 0 is set to 1, and when
the register is underflowed, the UDF flag of channel 0 is set to 1. After buffer operation has been
designated for BR, BR is transferred to GR when the counter is incremented by compare match
A0 or when TCNT_1 is underflowed. If the φ or φ/2 clock is selected by TPSC2 to TPSC0 bits,
the OVF flag is not set to 1 at the timing that the counter value changes from H'FFFF to H'0000. If
the φ/4 or φ/8 clock is selected by TPSC2 to TPSC0 bits, the OVF flag is set to 1.
3. Setting GR Value in Complementary PWM Mode: To set the general register (GR) or modify
GR during operation in complementary PWM mode, refer to the following notes.
A. Initial value
a. When other than TPSC2 = TPSC1 = TPSC0 = 0, the GRA_0 value must be equal to
H'FFFC or less. When TPSC2 = TPSC1 = TPSC0 = 0, the GRA_0 value can be set to
H'FFFF or less.
b. H'0000 to T – 1 (T: Initial value of TCNT0) must not be set for the initial value.
c. GRA_0 – (T – 1) or more must not be set for the initial value.
d. When using buffer operation, the same values must be set in the buffer registers and
corresponding general registers.
B. Modifying the setting value
a. Writing to GR directly must be performed while the TCNT_1 and TCNT_0 values
should satisfy the following expression: H'0000 ≤ TCNT_1 < previous GR value, and
previous GR value < TCNT_0 ≤ GRA_0. Otherwise, a waveform is not output
correctly. For details on outputting a waveform with a duty cycle of 0% and 100%, see
C., Outputting a waveform with a duty cycle of 0% and 100%.
b. Do not write the following values to GR directly. When writing the values, a waveform
is not output correctly.
H'0000 ≤ GR ≤ T − 1 and GRA_0 − (T − 1) ≤ GR < GRA_0 when TPSC2 = TPSC1 =
TPSC0 = 0
H'0000 < GR ≤ T − 1 and GRA_0 − (T − 1) ≤ GR < GRA_0 + 1 when TPSC2 = TPSC1
= TPSC0 = 0
c. Do not change settings of GRA_0 during operation.
C. Outputting a waveform with a duty cycle of 0% and 100%
a. Buffer operation is not used and TPSC2 = TPSC1 = TPSC0 = 0
Write H'0000 or a value equal to or more than the GRA_0 value to GR directly at the
timing shown below.
• To output a 0%-duty cycle waveform, write a value equal to or more than the GRA_0
value while H'0000 ≤ TCNT_1 < previous GR value
• To output a 100%-duty cycle waveform, write H'0000 while previous GR value<
TCNT_0 ≤ GRA_0
Rev.5.00 Nov. 02, 2005 Page 228 of 500
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Section 13 Timer Z
•
•
b.
•
•
c.
•
•
To change duty cycles while a waveform with a duty cycle of 0% or 100% is being
output, make sure the following procedure.
To change duty cycles while a 0%-duty cycle waveform is being output, write to GR
while H'0000 ≤ TCNT_1 < previous GR value
To change duty cycles while a 100%-duty cycle waveform is being output, write to GR
while previous GR value< TCNT_0 ≤ GRA_0
Note that changing from a 0%-duty cycle waveform to a 100%-duty cycle waveform
and vice versa is not possible.
Buffer operation is used and TPSC2 = TPSC1 = TPSC0 = 0
Write H'0000 or a value equal to or more than the GRA_0 value to the buffer register.
To output a 0%-duty cycle waveform, write a value equal to or more than the GRA_0
value to the buffer register
To output a 100%-duty cycle waveform, write H'0000 to the buffer register
For details on buffer operation, see section 13.4.8, Buffer Operation.
Buffer operation is not used and other than TPSC2 = TPSC1 = TPSC0 = 0
Write a value which satisfies GRA_0 + 1 < GR < H'FFFF to GR directly at the timing
shown below.
To output a 0%-duty cycle waveform, write the value while H'0000 ≤ TCNT_1 <
previous GR value
To output a 100%-duty cycle waveform, write the value while previous GR value<
TCNT_0 ≤ GRA_0
To change duty cycles while a waveform with a duty cycle of 0% and 100% is being
output, the following procedure must be followed.
• To change duty cycles while a 0%-duty cycle waveform is being output, write to GR
while H'0000 ≤ TCNT_1 < previous GR value
• To change duty cycles while a 100%-duty cycle waveform is being output, write to GR
while previous GR value< TCNT_0 ≤ GRA_0
Note that changing from a 0%-duty cycle waveform to a 100%-duty cycle waveform
and vice versa is not possible.
d. Buffer operation is used and other than TPSC2 = TPSC1 = TPSC0 = 0
Write a value which satisfies GRA_0 + 1 < GR < H'FFFF to the buffer register. A
waveform with a duty cycle of 0% can be output. However, a waveform with a duty
cycle of 100% cannot be output using the buffer operation. Also, the buffer operation
cannot be used to change duty cycles while a waveform with a duty cycle of 100% is
being output. For details on buffer operation, see section 13.4.8, Buffer Operation.
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Section 13 Timer Z
13.4.8
Buffer Operation
Buffer operation differs depending on whether GR has been designated for an input capture
register or an output compare register, or in reset synchronous PWM mode or complementary
PWM mode.
Table 13.8 shows the register combinations used in buffer operation.
Table 13.8 Register Combinations in Buffer Operation
General Register
Buffer Register
GRA
GRC
GRB
GRD
1. When GR is an output compare register
When a compare match occurs, the value in the buffer register of the corresponding channel is
transferred to the general register.
This operation is illustrated in figure 13.35.
Compare match signal
General
register
Buffer register
Comparator
TCNT
Figure 13.35 Compare Match Buffer Operation
2. When GR is an input capture register
When an input capture occurs, the value in TCNT is transferred to the general register and the
value previously stored in the general register is transferred to the buffer register.
This operation is illustrated in figure 13.36.
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Section 13 Timer Z
Input capture
signal
General
register
Buffer register
TCNT
Figure 13.36 Input Capture Buffer Operation
3. Complementary PWM Mode
When the counter switches from counting up to counting down or vice versa, the value of the
buffer register is transferred to the general register. Here, the value of the buffer register is
transferred to the general register in the following timing:
A. When TCNT_0 and GRA_0 are compared and their contents match
B. When TCNT_1 underflows
4. Reset Synchronous PWM Mode
The value of the buffer register is transferred from compare match A0 to the general register.
5. Example of Buffer Operation Setting Procedure
Figure 13.37 shows an example of the buffer operation setting procedure.
Buffer operation
Select GR function
[1]
Set buffer operation
[2]
Start count operation
[3]
[1] Designate GR as an input capture register
or output compare register by means of
TIOR.
[2] Designate GR for buffer operation with bits
BFD1, BFC1, BFD0, or BFC0 in TMDR.
[3] Set the STR bit in TSTR to 1 to start the
count operation of TCNT.
<Buffer operation>
Figure 13.37 Example of Buffer Operation Setting Procedure
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Section 13 Timer Z
6. Examples of Buffer Operation
Figure 13.38 shows an operation example in which GRA has been designated as an output
compare register, and buffer operation has been designated for GRA and GRC.
This is an example of TCNT operating as a periodic counter cleared by compare match B.
Pins FTIOA and FTIOB are set for toggle output by compare match A and B.
As buffer operation has been set, when compare match A occurs, the FTIOA pin performs
toggle outputs and the value in buffer register is simultaneously transferred to the general
register. This operation is repeated each time that compare match A occurs.
The timing to transfer data is shown in figure 13.39.
Counter is cleared by GBR compare match
TCNT value
GRB
H'0250
H'0200
H'0100
Time
H'0000
GRC
H'0200
H'0100
GRA
H'0250
H'0200
H'0200
H'0100
H'0200
FTIOB
FTIOA
Compare match A
Figure 13.38 Example of Buffer Operation (1)
(Buffer Operation for Output Compare Register)
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Section 13 Timer Z
φ
n
TCNT
n+1
Compare match
signal
Buffer transfer
signal
GRC
GRA
N
n
N
Figure 13.39 Example of Compare Match Timing for Buffer Operation
Figure 13.40 shows an operation example in which GRA has been designated as an input capture
register, and buffer operation has been designated for GRA and GRC.
Counter clearing by input capture B has been set for TCNT, and falling edges have been selected
as the FIOCB pin input capture input edge. And both rising and falling edges have been selected
as the FIOCA pin input capture input edge.
As buffer operation has been set, when the TCNT value is stored in GRA upon the occurrence of
input capture A, the value previously stored in GRA is simultaneously transferred to GRC. The
transfer timing is shown in figure 13.41.
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Section 13 Timer Z
Counter is cleared by the input capture B
TCNT value
H'0180
H'0160
H'0005
H'0000
Time
FTIOB
FTIOA
GRA
H'0005
H'0160
GRC
H'0005
GRB
H'0160
H'0180
Input capture A
Figure 13.40 Example of Buffer Operation (2)
(Buffer Operation for Input Capture Register)
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Section 13 Timer Z
φ
FTIO pin
Input capture
signal
TCNT
n
n+1
N
N+1
GRA
M
n
n
N
GRC
m
M
M
n
Figure 13.41 Input Capture Timing of Buffer Operation
Figures 13.42 and 13.43 show the operation examples when buffer operation has been designated
for GRB_0 and GRD_0 in complementary PWM mode. These are examples when a PWM
waveform of 0% duty is created by using the buffer operation and performing GRD_0 ≥ GRA_0.
Data is transferred from GRD_0 to GRB_0 according to the settings of CMD_0 and CMD_1 when
TCNT_0 and GRA_0 are compared and their contents match or when TCNT_1 underflows.
However, when GRD_0 ≥ GRA_0, data is transferred from GRD_0 to GRB_0 when TCNT_1
underflows regardless of the setting of CMD_0 and CMD_1. When GRD_0 = H'0000, data is
transferred from GRD_0 to GRB_0 when TCNT_0 and GRA_0 are compared and their contents
match regardless of the settings of CMD_0 and CMD_1.
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Section 13 Timer Z
TCNT values
GRB_0 (When restored, data will be transferred
to the saved location regardless of the
CMD1 and CMD0 values)
TCNT_0
GRA_0
TCNT_1
H'0999
H'0000
Time
GRD_0
H'0999
GRB_0
H'0999
H'1FFF
H'0999
H'1FFF
H'0999
H'0999
FTIOB0
FTIOD0
Figure 13.42 Buffer Operation (3)
(Buffer Operation in Complementary PWM Mode CMD1 = CMD0 = 1)
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Section 13 Timer Z
GRB_0 (When restored, data will be transferred
to the saved location regardless of the
CMD1 and CMD0 values)
TCNT values
TCNT_0
GRA_0
TCNT_1
H'0999
H'0000
Time
GRB_0
GRD_0
H'0999
GRB_0
H'0999
H'0000
H'0999
H'0000
H'0999
FTIOC0
FTIOD0
Figure 13.43 Buffer Operation (4)
(Buffer Operation in Complementary PWM Mode CMD1 = CMD0 = 1)
13.4.9
Timer Z Output Timing
The outputs of channels 0 and 1 can be disabled or inverted by the settings of TOER and TOCR
and the external level.
1. Output Disable/Enable Timing of Timer Z by TOER: Setting the master enable bit in TOER to
1 disables the output of timer Z. By setting the PCR and PDR of the corresponding I/O port
beforehand, any value can be output. Figure 13.44 shows the timing to enable or disable the
output of timer Z by TOER.
Rev.5.00 Nov. 02, 2005 Page 237 of 500
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Section 13 Timer Z
T1
T2
φ
Address bus
TOER address
TOER
Timer Z
output pin
I/O port
Timer output
Timer Z output
I/O port
Figure 13.44 Example of Output Disable Timing of Timer Z by Writing to TOER
2.
Output Disable Timing of Timer Z by External Trigger: When P54/WKP4 is set as a WKP4
input pin, and low level is input to WKP4, the master enable bit in TOER is set to 1 and the
output of timer Z will be disabled.
φ
WKP4
TOER
Timer Z
output pin
N
H'FF
I/O port
Timer Z output
Timer Z output
I/O port
Figure 13.45 Example of Output Disable Timing of Timer Z by External Trigger
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Section 13 Timer Z
3.
Output Inverse Timing by TFCR: The output level can be inverted by inverting the OLS1 and
OLS0 bits in TFCR in reset synchronous PWM mode or complementary PWM mode. Figure
13.46 shows the timing.
T1
T2
φ
Address bus
TOER address
TFCR
Timer Z
output pin
Inverted
Figure 13.46 Example of Output Inverse Timing of Timer Z by Writing to TFCR
4.
Output Inverse Timing by POCR: The output level can be inverted by inverting the POLD,
POLC, and POLB bits in POCR in PWM mode. Figure 13.47 shows the timing.
T1
T2
φ
Address bus
POCR address
TFCR
Timer Z
output pin
Inverted
Figure 13.47 Example of Output Inverse Timing of Timer Z by Writing to POCR
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Section 13 Timer Z
13.5
Interrupts
There are three kinds of timer Z interrupt sources; input capture/compare match, overflow, and
underflow. An interrupt is requested when the corresponding interrupt request flag is set to 1 while
the corresponding interrupt enable bit is set to 1.
13.5.1
1.
Status Flag Set Timing
IMF Flag Set Timing: The IMF flag is set to 1 by the compare match signal that is generated
when the GR matches with the TCNT. The compare match signal is generated at the last state
of matching (timing to update the counter value when the GR and TCNT match). Therefore,
when the TCNT and GR matches, the compare match signal will not be generated until the
TCNT input clock is generated. Figure 13.48 shows the timing to set the IMF flag.
φ
TCNT input clock
TCNT
N
N+1
N
GR
Compare match
signal
IMF
ITMZ
Figure 13.48 IMF Flag Set Timing when Compare Match Occurs
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Section 13 Timer Z
2. IMF Flag Set Timing at Input Capture: When an input capture signal is generated, the IMF flag
is set to 1 and the value of TCNT is simultaneously transferred to corresponding GR. Figure
13.49 shows the timing.
φ
Input capture
signal
IMF
TCNT
N
GR
N
ITMZ
Figure 13.49 IMF Flag Set Timing at Input Capture
3. Overflow Flag (OVF) Set Timing: The overflow flag is set to 1 when the TCNT overflows.
Figure 13.50 shows the timing.
φ
TCNT
H'FFFF
H'0000
Overflow
signal
OVF
ITMZ
Figure 13.50 OVF Flag Set Timing
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Section 13 Timer Z
13.5.2
Status Flag Clearing Timing
The status flag can be cleared by writing 0 after reading 1 from the CPU. Figure 13.51 shows the
timing in this case.
φ
Address
TSR address
WTSR
(internal write signal)
IMF, OVF
ITMZ
Figure 13.51 Status Flag Clearing Timing
13.6
Usage Notes
1. Contention between TCNT Write and Clear Operations: If a counter clear signal is generated
in the T2 state of a TCNT write cycle, TCNT clearing has priority and the TCNT write is not
performed. Figure 13.52 shows the timing in this case.
TCNT write cycle
T1
T2
φ
TCNT address
WTCNT
(internal write signal)
Counter clear signal
TCNT
N
H'0000
Clearing has priority.
Figure 13.52 Contention between TCNT Write and Clear Operations
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Section 13 Timer Z
2. Contention between TCNT Write and Increment Operations: If incrementation is done in T2
state of a TCNT write cycle, TCNT writing has priority. Figure 13.53 shows the timing in this
case.
TCNT write cycle
T1
T2
φ
TCNT address
WTCNT
(internal write signal)
TCNT input clock
TCNT
N
M
TCNT write data
Figure 13.53 Contention between TCNT Write and Increment Operations
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Section 13 Timer Z
3. Contention between GR Write and Compare Match: If a compare match occurs in the T2 state
of a GR write cycle, GR write has priority and the compare match signal is disabled. Figure
13.54 shows the timing in this case.
GR write cycle
T1
T2
φ
GR address
WGR
(internal write signal)
TCNT
N
GR
N
N+1
M
GR write data
Compare match
signal
Disabled
Figure 13.54 Contention between GR Write and Compare Match
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Section 13 Timer Z
4. Contention between TCNT Write and Overflow/Underflow: If overflow/underflow occurs in
the T2 state of a TCNT write cycle, TCNT write has priority without an increment operation.
At this time, the OVF flag is set to 1. Figure 13.55 shows the timing in this case.
TCNT write cycle
T1
T2
φ
TCNT address
WTCNT
(internal write signal)
TCNT input clock
Overflow signal
TCNT
H'FFFF
M
TCNT write data
OVF
Figure 13.55 Contention between TCNT Write and Overflow
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Section 13 Timer Z
5. Contention between GR Read and Input Capture: If an input capture signal is generated in the
T1 state of a GR read cycle, the data that is read will be transferred before input capture
transfer. Figure 13.56 shows the timing in this case.
GR read cycle
T1
T2
φ
GR address
Internal read
signal
Input capture
signal
GR
X
Internal data
bus
M
X
Figure 13.56 Contention between GR Read and Input Capture
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Section 13 Timer Z
6. Contention between Count Clearing and Increment Operations by Input Capture: If an input
capture and increment signals are simultaneously generated, count clearing by the input
capture operation has priority without an increment operation. The TCNT contents before
clearing counter are transferred to GR. Figure 13.57 shows the timing in this case.
φ
Input capture signal
Counter clear signal
TCNT input clock
TCNT
GR
N
H'0000
N
Clearing has priority.
Figure 13.57 Contention between Count Clearing and Increment Operations
by Input Capture
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Section 13 Timer Z
7. Contention between GR Write and Input Capture: If an input capture signal is generated in the
T2 state of a GR write cycle, the input capture operation has priority and the write to GR is not
performed. Figure 13.58 shows the timing in this case.
GR write cycle
T1
T2
φ
Address bus
GR address
WGR
(internal write signal)
Input capture
signal
TCNT
N
GR
M
GR write data
Figure 13.58 Contention between GR Write and Input Capture
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Section 13 Timer Z
8. Notes on Setting Reset Synchronous PWM Mode/Complementary PWM Mode: When bits
CMD1 and CMD0 in TFCR are set, note the following:
A. Write bits CMD1 and CMD0 while TCNT_1 and TCNT_0 are halted.
B. Changing the settings of reset synchronous PWM mode to complementary PWM mode or
vice versa is disabled. Set reset synchronous PWM mode or complementary PWM mode
after the normal operation (bits CMD1 and CMD0 are cleared to 0) has been set.
9.
Note on Clearing TSR Flag: When a specific flag in TSR is cleared, a combination of the
BCLR or MOV instructions is used to read 1 from the flag and then write 0 to the flag.
However, if another bit is set during this processing, the bit may also be cleared
simultaneously. To avoid this, the following processing that does not use the BCLR
instruction must be executed. Note that this note is only applied to the F-ZTAT version. This
problem has already been solved in the mask ROM version.
Example: When clearing bit 4 (OVF) in TSR
MOV.B @TSR,R0L
MOV.B #B'11101111, R0L
Only the bit to be cleared is 0 and
the other bits are all set to 1.
MOV.B R0L,@TSR
10. Note on Writing to the TOA0 to TOD0 Bits and the TOA1 to TOD1 Bits in TOCR:
The TOA0 to TOD0 bits and the TOA1 to TOD1 bits in TOCR decide the value of the FTIO
pin, which is output until the first compare match occurs. Once a compare match occurs and
this compare match changes the values of FTIOA0 to FTIOD0 and FTIOA1 to FTIOD1
output, the values of the FTIOA0 to FTIOD0 and FTIOA1 to FTIOD1 pin output and the
values read from the TOA0 to TOD0 and TOA1 to TOD1 bits may differ. Moreover, when the
writing to TOCR and the generation of the compare match A0 to D0 and A1 to D1 occur at the
same timing, the writing to TOCR has the priority. Thus, output change due to the compare
match is not reflected to the FTIOA0 to FTIOD0 and FTIOA1 to FTIOD1 pins. Therefore,
when bit manipulation instruction is used to write to TOCR, the values of the FTIOA0 to
FTIOD0 and FTIOA1 to FTIOD1 pin output may result in an unexpected result. When TOCR
is to be written to while compare match is operating, stop the counter once before accessing to
TOCR, read the port 6 state to reflect the values of FTIOA0 to FTIOD0 and FTIOA1 to
FTIOD1 output, to TOA0 to TOD0 and TOA1 to TOD1, and then restart the counter. Figure
13.59 shows an example when the compare match and the bit manipulation instruction to
TOCR occur at the same timing.
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Section 13 Timer Z
TOCR has been set to H'06. Compare match B0 and compare match C0 are used. The FTIOB0 pin is in the 1 output state,
and is set to the toggle output or the 0 output by compare match B0.
When BCLR#2, @TOCR is executed to clear the TOC0 bit (the FTIOC0 signal is low) and compare match B0 occurs
at the same timing as shown below, the H'02 writing to TOCR has priority and compare match B0 does not drive the FTIOB0 signal low;
the FTIOB0 signal remains high.
7
6
5
4
3
2
1
0
TOD1
0
TOC1
0
TOB1
0
TOA1
0
TOD0
0
TOC0
1
TOB0
1
TOA0
0
Bit
TOCR
Set value
BCLR#2, @TOCR
(1) TOCR read operation: Read H'06
(2) Modify operation: Modify H'06 to H'02
(3) Write operation to TOCR: Write H'02
φ
TOCR
write signal
Compare match
signal B0
FTIOB0 pin
Expected output
Remains high because the 1 writing to TOB has priority
Figure 13.59 When Compare Match and Bit Manipulation Instruction to TOCR
Occur at the Same Timing
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Section 14 Watchdog Timer
Section 14 Watchdog Timer
The watchdog timer is an 8-bit timer that can generate an internal reset signal for this LSI if a
system crash prevents the CPU from writing to the timer counter, thus allowing it to overflow.
The block diagram of the watchdog timer is shown in figure 14.1.
φ
CLK
TCSRWD
PSS
TCWD
Internal data bus
Internal
oscillator
TMWD
[Legend]
TCSRWD:
TCWD:
PSS:
TMWD:
Timer control/status register WD
Timer counter WD
Prescaler S
Timer mode register WD
Internal reset
signal
Figure 14.1 Block Diagram of Watchdog Timer
14.1
Features
• Selectable from nine counter input clocks.
Eight clock sources (φ/64, φ/128, φ/256, φ/512, φ/1024, φ/2048, φ/4096, and φ/8192) or the
internal oscillator can be selected as the timer-counter clock. When the internal oscillator is
selected, it can operate as the watchdog timer in any operating mode.
• Reset signal generated on counter overflow
An overflow period of 1 to 256 times the selected clock can be set.
14.2
Register Descriptions
The watchdog timer has the following registers.
• Timer control/status register WD (TCSRWD)
• Timer counter WD (TCWD)
• Timer mode register WD (TMWD)
WDT0110A_000020020200
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Section 14 Watchdog Timer
14.2.1
Timer Control/Status Register WD (TCSRWD)
TCSRWD performs the TCSRWD and TCWD write control. TCSRWD also controls the
watchdog timer operation and indicates the operating state. TCSRWD must be rewritten by using
the MOV instruction. The bit manipulation instruction cannot be used to change the setting value.
Bit
Bit Name
Initial
Value
R/W
Description
7
B6WI
1
R/W
Bit 6 Write Inhibit
The TCWE bit can be written only when the write value of
the B6WI bit is 0.
6
TCWE
0
R/W
Timer Counter WD Write Enable
TCWD can be written when the TCWE bit is set to 1.
When writing data to this bit, the value for bit 7 must be 0.
5
B4WI
1
R/W
Bit 4 Write Inhibit
The TCSRWE bit can be written only when the write
value of the B4WI bit is 0. This bit is always read as 1.
4
TCSRWE
0
R/W
Timer Control/Status Register WD Write Enable
The WDON and WRST bits can be written when the
TCSRWE bit is set to 1.
3
B2WI
1
R/W
Bit 2 Write Inhibit
This bit can be written to the WDON bit only when the
write value of the B2WI bit is 0.
This bit is always read as 1.
2
WDON
0
R/W
Watchdog Timer On
TCWD starts counting up when WDON is set to 1 and
halts when WDON is cleared to 0.
[Setting condition]
When 1 is written to the WDON bit while writing 0 to the
B2WI bit when the TCSRWE bit=1
[Clearing conditions]
This bit is always read as 1.
When writing data to this bit, the value for bit 5 must be 0.
1
B0WI
1
R/W
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•
Reset by RES pin
•
When 0 is written to the WDON bit while writing 0 to
the B2WI when the TCSRWE bit=1
Bit 0 Write Inhibit
This bit can be written to the WRST bit only when the
write value of the B0WI bit is 0. This bit is always read as
1.
Section 14 Watchdog Timer
Bit
Bit
Name
0
WRST 0
Initial Value R/W
R/W
Description
Watchdog Timer Reset
[Setting condition]
When TCWD overflows and an internal reset signal is
generated
[Clearing conditions]
14.2.2
•
Reset by RES pin
•
When 0 is written to the WRST bit while writing 0 to the
B0WI bit when the TCSRWE bit=1
Timer Counter WD (TCWD)
TCWD is an 8-bit readable/writable up-counter. When TCWD overflows from H'FF to H'00, the
internal reset signal is generated and the WRST bit in TCSRWD is set to 1. TCWD is initialized to
H'00.
14.2.3
Timer Mode Register WD (TMWD)
TMWD selects the input clock.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 4
All 1
Reserved
These bits are always read as 1.
3
CKS3
1
R/W
Clock Select 3 to 0
2
CKS2
1
R/W
Select the clock to be input to TCWD.
1
CKS1
1
R/W
1000: Internal clock: counts on φ/64
0
CKS0
1
R/W
1001: Internal clock: counts on φ/128
1010: Internal clock: counts on φ/256
1011: Internal clock: counts on φ/512
1100: Internal clock: counts on φ/1024
1101: Internal clock: counts on φ/2048
1110: Internal clock: counts on φ/4096
1111: Internal clock: counts on φ8192
0XXX: Internal oscillator
For the internal oscillator overflow periods, see section
23, Electrical Characteristics.
Legend: X: Don't care.
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Section 14 Watchdog Timer
14.3
Operation
The watchdog timer is provided with an 8-bit counter. If 1 is written to WDON while writing 0 to
B2WI when the TCSRWE bit in TCSRWD is set to 1, TCWD begins counting up. (To operate
the watchdog timer, two write accesses to TCSRWD are required.) When a clock pulse is input
after the TCWD count value has reached H'FF, the watchdog timer overflows and an internal reset
signal is generated. The internal reset signal is output for a period of 256 φosc clock cycles. TCWD
is a writable counter, and when a value is set in TCWD, the count-up starts from that value. An
overflow period in the range of 1 to 256 input clock cycles can therefore be set, according to the
TCWD set value.
Figure 14.2 shows an example of watchdog timer operation.
Example:
With 30ms overflow period when φ = 4 MHz
4 × 106
8192
× 30 × 10–3 = 14.6
Therefore, 256 – 15 = 241 (H'F1) is set in TCW.
TCWD overflow
H'FF
H'F1
TCWD
count value
H'00
Start
H'F1 written
to TCWD
H'F1 written to TCWD
Reset generated
Internal reset
signal
256 φosc clock cycles
Figure 14.2 Watchdog Timer Operation Example
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Section 15 14-Bit PWM
Section 15 14-Bit PWM
The 14-bit PWM is a pulse division type PWM that can be used for electronic tuner control, etc.
Figure 15.1 shows a block diagram of the 14-bit PWM.
15.1
Features
• Choice of two conversion periods
A conversion period of 32768/φ with a minimum modulation width of 2/φ, or a conversion
period of 16384/φ with a minimum modulation width of 1/φ, can be selected.
• Pulse division method for less ripple
PWDRL
PWDRU
φ/4
PWM waveform
generator
φ/2
Internal data bus
PWCR
PWM
[Legend]
PWCR:
PWDRL:
PWDRU:
PWM:
PWM control register
PWM data register L
PWM data register U
PWM output pin
Figure 15.1 Block Diagram of 14-Bit PWM
PWM1400A_000120030300
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Section 15 14-Bit PWM
15.2
Input/Output Pin
Table 15.1 shows the 14-bit PWM pin configuration.
Table 15.1 Pin Configuration
Name
Abbreviation I/O
Function
14-bit PWM square-wave output
PWM
14-bit PWM square-wave output pin
15.3
Output
Register Descriptions
The 14-bit PWM has the following registers.
• PWM control register (PWCR)
• PWM data register U (PWDRU)
• PWM data register L (PWDRL)
15.3.1
PWM Control Register (PWCR)
PWCR selects the conversion period.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 1
All 1
Reserved
These bits are always read as 1, and cannot be modified.
0
PWCR0
0
R/W
Clock Select
0: The input clock is φ/2 (tφ = 2/φ)
The conversion period is 16384/φ, with a minimum
modulation width of 1/φ
1: The input clock is φ/4 (tφ = 4/φ)
The conversion period is 32768/φ, with a minimum
modulation width of 2/φ
Legend: tφ: Period of PWM clock input
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Section 15 14-Bit PWM
15.3.2
PWM Data Registers U and L (PWDRU, PWDRL)
PWDRU and PWDRL indicate high level width in one PWM waveform cycle. PWDRU and
PWDRL are 14-bit write-only registers, with the upper 6 bits assigned to PWDRU and the lower 8
bits to PWDRL. When read, all bits are always read as 1.
Both PWDRU and PWDRL are accessible only in bytes. Note that the operation is not guaranteed
if word access is performed. When 14-bit data is written in PWDRU and PWDRL, the contents
are latched in the PWM waveform generator and the PWM waveform generation data is updated.
When writing the 14-bit data, the order is as follows: PWDRL to PWDRU.
PWDRU and PWDRL are initialized to H'C000.
15.4
Operation
When using the 14-bit PWM, set the registers in this sequence:
1. Set the PWM bit in the port mode register 1 (PMR1) to set the P11/PWM pin to function as a
PWM output pin.
2. Set the PWCR0 bit in PWCR to select a conversion period of either.
3. Set the output waveform data in PWDRU and PWDRL. Be sure to write byte data first to
PWDRL and then to PWDRU. When the data is written in PWDRU, the contents of these
registers are latched in the PWM waveform generator, and the PWM waveform generation
data is updated in synchronization with internal signals.
One conversion period consists of 64 pulses, as shown in figure 15.2. The total high-level width
during this period (TH) corresponds to the data in PWDRU and PWDRL. This relation can be
expressed as follows:
TH = (data value in PWDRU and PWDRL + 64) × tφ/2
where tφ is the period of PWM clock input: 2/φ (bit PWCR0 = 0) or 4/φ (bit PWCR0 = 1).
If the data value in PWDRU and PWDRL is from H'FFC0 to H'FFFF, the PWM output stays high.
When the data value is H'C000, TH is calculated as follows:
TH = 64 × tφ/2 = 32 tφ
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Section 15 14-Bit PWM
Conversion period
t f1
t H1
t f2
t H2
t f63
t H3
t H63
t f64
t H64
T H = t H1 + t H2 + t H3 + ... + t H64
t f1 = t f2 = t f3 = ... = t f64
Figure 15.2 Waveform Output by 14-Bit PWM
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Section 16 Serial Communication Interface 3 (SCI3)
Section 16 Serial Communication Interface 3 (SCI3)
This LSI includes a serial communication interface 3 (SCI3), which has independent two channels.
The SCI3 can handle both asynchronous and clocked synchronous serial communication. In
asynchronous mode, serial data communication can be carried out using standard asynchronous
communication chips such as a Universal Asynchronous Receiver/Transmitter (UART) or an
Asynchronous Communication Interface Adapter (ACIA). A function is also provided for serial
communication between processors (multiprocessor communication function).
Table 16.1 shows the SCI3 channel configuration and figure 16.1 shows a block diagram of the
SCI3. Since pin functions are identical for each of the two channels (SCI3 and SCI3_2), separate
explanations are not given in this section.
16.1
Features
• Choice of asynchronous or clocked synchronous serial communication mode
• Full-duplex communication capability
The transmitter and receiver are mutually independent, enabling transmission and reception to
be executed simultaneously.
Double-buffering is used in both the transmitter and the receiver, enabling continuous
transmission and continuous reception of serial data.
• On-chip baud rate generator allows any bit rate to be selected
• External clock or on-chip baud rate generator can be selected as a transfer clock source.
• Six interrupt sources
Transmit-end, transmit-data-empty, receive-data-full, overrun error, framing error, and parity
error.
Asynchronous mode
•
•
•
•
•
Data length: 7 or 8 bits
Stop bit length: 1 or 2 bits
Parity: Even, odd, or none
Receive error detection: Parity, overrun, and framing errors
Break detection: Break can be detected by reading the RxD pin level directly in the case of a
framing error
SCI0011A_000020020200
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Section 16 Serial Communication Interface 3 (SCI3)
Clocked synchronous mode
• Data length: 8 bits
• Receive error detection: Overrun errors
Table 16.1 Channel Configuration
Channel
Abbreviation
Pin
Register
Register Address
Channel 1
SCI3*
SCK3
RXD
TXD
SMR
H'FFA8
BRR
H'FFA9
SCR3
H'FFAA
TDR
H'FFAB
SSR
H'FFAC
RDR
H'FFAD
RSR
TSR
SMR_2
H'F740
BRR_2
H'F741
SCR3_2
H'F742
TDR_2
H'F743
SSR_2
H'F744
RDR_2
H'F745
RSR_2
TSR_2
Channel 2
Note:
*
SCI3_2
SCK3_2
RXD_2
TXD_2
The channel 1 of the SCI3 is used in on-board programming mode by boot mode.
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Section 16 Serial Communication Interface 3 (SCI3)
SCK3
External
clock
Internal clock (φ/64, φ/16, φ/4, φ)
Baud rate generator
BRC
BRR
Clock
Transmit/receive
control circuit
Internal data bus
SMR
SCR3
SSR
TXD
TSR
TDR
RXD
RSR
RDR
Interrupt request
(TEI, TXI, RXI, ERI)
[Legend]
Receive shift register
RSR:
Receive data register
RDR:
Transmit shift register
TSR:
Transmit data register
TDR:
Serial mode register
SMR:
SCR3: Serial control register 3
Serial status register
SSR:
Bit rate register
BRR:
Bit rate counter
BRC:
Figure 16.1 Block Diagram of SCI3
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Section 16 Serial Communication Interface 3 (SCI3)
16.2
Input/Output Pins
Table 16.2 shows the SCI3 pin configuration.
Table 16.2 Pin Configuration
Pin Name
Abbreviation
I/O
Function
SCI3 clock
SCK3
I/O
SCI3 clock input/output
SCI3 receive data input
RXD
Input
SCI3 receive data input
SCI3 transmit data output
TXD
Output
SCI3 transmit data output
16.3
Register Descriptions
The SCI3 has the following registers for each channel.
•
•
•
•
•
•
•
•
Receive Shift Register (RSR)
Receive Data Register (RDR)
Transmit Shift Register (TSR)
Transmit Data Register (TDR)
Serial Mode Register (SMR)
Serial Control Register 3 (SCR3)
Serial Status Register (SSR)
Bit Rate Register (BRR)
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Section 16 Serial Communication Interface 3 (SCI3)
16.3.1
Receive Shift Register (RSR)
RSR is a shift register that is used to receive serial data input from the RxD pin and convert it into
parallel data. When one frame of data has been received, it is transferred to RDR automatically.
RSR cannot be directly accessed by the CPU.
16.3.2
Receive Data Register (RDR)
RDR is an 8-bit register that stores received data. When the SCI3 has received one frame of serial
data, it transfers the received serial data from RSR to RDR, where it is stored. After this, RSR is
receive-enabled. As RSR and RDR function as a double buffer in this way, continuous receive
operations are possible. After confirming that the RDRF bit in SSR is set to 1, read RDR only
once. RDR cannot be written to by the CPU. RDR is initialized to H'00.
16.3.3
Transmit Shift Register (TSR)
TSR is a shift register that transmits serial data. To perform serial data transmission, the SCI3 first
transfers transmit data from TDR to TSR automatically, then sends the data that starts from the
LSB to the TXD pin. TSR cannot be directly accessed by the CPU.
16.3.4
Transmit Data Register (TDR)
TDR is an 8-bit register that stores data for transmission. When the SCI3 detects that TSR is
empty, it transfers the transmit data written in TDR to TSR and starts transmission. The doublebuffered structure of TDR and TSR enables continuous serial transmission. If the next transmit
data has already been written to TDR during transmission of one-frame data, the SCI3 transfers
the written data to TSR to continue transmission. To achieve reliable serial transmission, write
transmit data to TDR only once after confirming that the TDRE bit in SSR is set to 1. TDR is
initialized to H'FF.
Rev.5.00 Nov. 02, 2005 Page 263 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
16.3.5
Serial Mode Register (SMR)
SMR is used to set the SCI3’s serial transfer format and select the baud rate generator clock
source.
Bit
Bit Name
Initial
Value
R/W
Description
7
COM
0
R/W
Communication Mode
0: Asynchronous mode
1: Clocked synchronous mode
6
CHR
0
R/W
Character Length (enabled only in asynchronous mode)
0: Selects 8 bits as the data length.
1: Selects 7 bits as the data length.
5
PE
0
R/W
Parity Enable (enabled only in asynchronous mode)
When this bit is set to 1, the parity bit is added to transmit
data before transmission, and the parity bit is checked in
reception.
4
PM
0
R/W
Parity Mode (enabled only when the PE bit is 1 in
asynchronous mode)
0: Selects even parity.
1: Selects odd parity.
3
STOP
0
R/W
Stop Bit Length (enabled only in asynchronous mode)
Selects the stop bit length in transmission.
0: 1 stop bit
1: 2 stop bits
For reception, only the first stop bit is checked, regardless
of the value in the bit. If the second stop bit is 0, it is
treated as the start bit of the next transmit character.
2
MP
0
R/W
Multiprocessor Mode
When this bit is set to 1, the multiprocessor
communication function is enabled. The PE bit and PM
bit settings are invalid in multiprocessor mode. In clocked
synchronous mode, clear this bit to 0.
Rev.5.00 Nov. 02, 2005 Page 264 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
Bit
Bit Name
Initial
Value
R/W
Description
1
CKS1
0
R/W
Clock Select 0 and 1
0
CKS0
0
R/W
These bits select the clock source for the baud rate
generator.
00: φ clock (n = 0)
01: φ/4 clock (n = 1)
10: φ/16 clock (n = 2)
11: φ/64 clock (n = 3)
For the relationship between the bit rate register setting
and the baud rate, see section 16.3.8, Bit Rate Register
(BRR). n is the decimal representation of the value of n in
BRR (see section 16.3.8, Bit Rate Register (BRR)).
16.3.6
Serial Control Register 3 (SCR3)
SCR3 is a register that enables or disables SCI3 transfer operations and interrupt requests, and is
also used to select the transfer clock source. For details on interrupt requests, refer to section 16.7,
Interrupts.
Bit
Bit Name
Initial
Value
R/W
Description
7
TIE
0
R/W
Transmit Interrupt Enable
When this bit is set to 1, the TXI interrupt request is
enabled.
6
RIE
0
R/W
Receive Interrupt Enable
When this bit is set to 1, RXI and ERI interrupt requests
are enabled.
5
TE
0
R/W
Transmit Enable
4
RE
0
R/W
Receive Enable
When this bit s set to 1, transmission is enabled.
When this bit is set to 1, reception is enabled.
Rev.5.00 Nov. 02, 2005 Page 265 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
Bit
Bit Name
Initial
Value
R/W
Description
3
MPIE
0
R/W
Multiprocessor Interrupt Enable (enabled only when the
MP bit in SMR is 1 in asynchronous mode)
When this bit is set to 1, receive data in which the
multiprocessor bit is 0 is skipped, and setting of the
RDRF, FER, and OER status flags in SSR is disabled.
On receiving data in which the multiprocessor bit is 1, this
bit is automatically cleared and normal reception is
resumed. For details, refer to section 16.6, Multiprocessor
Communication Function.
2
TEIE
0
R/W
Transmit End Interrupt Enable
When this bit is set to 1, TEI interrupt request is enabled.
1
CKE1
0
R/W
Clock Enable 0 and 1
0
CKE0
0
R/W
Selects the clock source.
•
Asynchronous mode
00: On-chip baud rate generator
01: On-chip baud rate generator
Outputs a clock of the same frequency as the bit rate
from the SCK3 pin.
10: External clock
Inputs a clock with a frequency 16 times the bit rate
from the SCK3 pin.
11: Reserved
•
Clocked synchronous mode
00: On-chip clock (SCK3 pin functions as clock output)
01: Reserved
10: External clock (SCK3 pin functions as clock input)
11: Reserved
Rev.5.00 Nov. 02, 2005 Page 266 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
16.3.7
Serial Status Register (SSR)
SSR is a register containing status flags of the SCI3 and multiprocessor bits for transfer. 1 cannot
be written to flags TDRE, RDRF, OER, PER, and FER; they can only be cleared.
Bit
Bit Name
Initial
Value
R/W
Description
7
TDRE
1
R/W
Transmit Data Register Empty
Indicates whether TDR contains transmit data.
[Setting conditions]
•
When the TE bit in SCR3 is 0
•
When data is transferred from TDR to TSR
[Clearing conditions]
6
RDRF
0
R/W
•
When 0 is written to TDRE after reading TDRE = 1
•
When the transmit data is written to TDR
Receive Data Register Full
Indicates that the received data is stored in RDR.
[Setting condition]
•
When serial reception ends normally and receive data
is transferred from RSR to RDR
[Clearing conditions]
5
OER
0
R/W
•
When 0 is written to RDRF after reading RDRF = 1
•
When data is read from RDR
Overrun Error
[Setting condition]
•
When an overrun error occurs in reception
[Clearing condition]
•
4
FER
0
R/W
When 0 is written to OER after reading OER = 1
Framing Error
[Setting condition]
•
When a framing error occurs in reception
[Clearing condition]
•
When 0 is written to FER after reading FER = 1
Rev.5.00 Nov. 02, 2005 Page 267 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
Bit
Bit Name
Initial
Value
R/W
Description
3
PER
0
R/W
Parity Error
[Setting condition]
•
When a parity error is detected during reception
[Clearing condition]
•
2
TEND
1
R
When 0 is written to PER after reading PER = 1
Transmit End
[Setting conditions]
•
When the TE bit in SCR3 is 0
•
When TDRE = 1 at transmission of the last bit of a 1frame serial transmit character
[Clearing conditions]
1
MPBR
0
R
•
When 0 is written to TDRE after reading TDRE = 1
•
When the transmit data is written to TDR
Multiprocessor Bit Receive
MPBR stores the multiprocessor bit in the receive
character data. When the RE bit in SCR3 is cleared to 0,
its state is retained.
0
MPBT
0
R/W
Multiprocessor Bit Transfer
MPBT stores the multiprocessor bit to be added to the
transmit character data.
Rev.5.00 Nov. 02, 2005 Page 268 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
16.3.8
Bit Rate Register (BRR)
BRR is an 8-bit register that adjusts the bit rate. The initial value of BRR is H'FF. Table 16.3
shows the relationship between the N setting in BRR and the n setting in bits CKS1 and CKS0 of
SMR in asynchronous mode. Table 16.4 shows the maximum bit rate for each frequency in
asynchronous mode. The values shown in both tables 16.3 and 16.4 are values in active (highspeed) mode. Table 16.5 shows the relationship between the N setting in BRR and the n setting in
bits CKS1 and CKS0 of SMR in clocked synchronous mode. The values shown in table 16.5 are
values in active (high-speed) mode. The N setting in BRR and error for other operating
frequencies and bit rates can be obtained by the following formulas:
[Asynchronous Mode]
N=
φ
64 ×
22n–1
×B
× 106 – 1
φ × 106
– 1 × 100
(N + 1) × B × 64 × 22n–1
Error (%) =
[Clocked Synchronous Mode]
N=
φ
× 106 – 1
8 × 22n–1 × B
Legend B: Bit rate (bit/s)
N: BRR setting for baud rate generator (0 ≤ N ≤ 255)
φ: Operating frequency (MHz)
n: CSK1 and CSK0 settings in SMR (0 ≤ n ≤ 3)
Rev.5.00 Nov. 02, 2005 Page 269 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1)
Operating Frequency φ (MHz)
2
2.097152
2.4576
3
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
1
141
0.03
1
148
–0.04
1
174
–0.26
1
212
0.03
150
1
103
0.16
1
108
0.21
1
127
0.00
1
155
0.16
300
0
207
0.16
0
217
0.21
0
255
0.00
1
77
0.16
600
0
103
0.16
0
108
0.21
0
127
0.00
0
155
0.16
1200
0
51
0.16
0
54
–0.70
0
63
0.00
0
77
0.16
2400
0
25
0.16
0
26
1.14
0
31
0.00
0
38
0.16
4800
0
12
0.16
0
13
–2.48
0
15
0.00
0
19
–2.34
9600
0
6
–6.99
0
6
–2.48
0
7
0.00
0
9
–2.34
19200
0
2
8.51
0
2
13.78
0
3
0.00
0
4
–2.34
31250
0
1
0.00
0
1
4.86
0
1
22.88
0
2
0.00
38400
0
1
–18.62
0
1
–14.67
0
1
0.00
—
—
—
Operating Frequency φ (MHz)
3.6864
Error
(%)
4
Bit Rate
(bits/s)
n
N
110
2
64
0.70
150
1
191
0.00
300
1
95
0.00
1
4.9152
N
Error
(%)
2
70
0.03
1
207 0.16
103 0.16
1
n
5
N
Error
(%)
n
N
Error
(%)
2
86
0.31
2
88
–0.25
1
255
0.00
2
64
0.16
127
0.00
1
129
0.16
n
600
0
191
0.00
0
207 0.16
0
255
0.00
1
64
0.16
1200
0
95
0.00
0
103 0.16
0
127
0.00
0
129
0.16
2400
0
47
0.00
0
51
0.16
0
63
0.00
0
64
0.16
4800
0
23
0.00
0
25
0.16
0
31
0.00
0
32
–1.36
9600
0
11
0.00
0
12
0.16
0
15
0.00
0
15
1.73
19200
0
5
0.00
0
6
–6.99
0
7
0.00
0
7
1.73
31250
—
—
—
0
3
0.00
0
4
–1.70
0
4
0.00
38400
0
2
0.00
0
2
8.51
0
3
0.00
0
3
1.73
Legend:
: A setting is available but error occurs
Rev.5.00 Nov. 02, 2005 Page 270 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2)
Operating Frequency φ (MHz)
6
6.144
7.3728
Bit Rate
(bit/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
106
–0.44
2
108
0.08
2
130
–0.07
150
2
77
0.16
2
79
0.00
2
95
0.00
300
1
155
0.16
1
159
0.00
1
191
0.00
600
1
77
0.16
1
79
0.00
1
95
0.00
1200
0
155
0.16
0
159
0.00
0
191
0.00
2400
0
77
0.16
0
79
0.00
0
95
0.00
4800
0
38
0.16
0
39
0.00
0
47
0.00
9600
0
19
–2.34
0
19
0.00
0
23
0.00
19200
0
9
–2.34
0
9
0.00
0
11
0.00
31250
0
5
0.00
0
5
2.40
0
6
5.33
38400
0
4
–2.34
0
4
0.00
0
5
0.00
Operating Frequency φ (MHz)
8
9.8304
10
12
Bit Rate
(bit/s)
n
N
Error
(%)
n
N
Error
(%)
110
2
141
0.03
2
174
–0.26
2
177
–0.25
2
212
0.03
150
2
103
0.16
2
127
0.00
2
129
0.16
2
155
0.16
300
1
207
0.16
1
255
0.00
2
64
0.16
2
77
0.16
n
N
Error
(%)
n
N
Error
(%)
600
1
103
0.16
1
127
0.00
1
129
0.16
1
155
0.16
1200
0
207
0.16
0
255
0.00
1
64
0.16
1
77
0.16
2400
0
103
0.16
0
127
0.00
0
129
0.16
0
155
0.16
4800
0
51
0.16
0
63
0.00
0
64
0.16
0
77
0.16
9600
0
25
0.16
0
31
0.00
0
32
–1.36
0
38
0.16
19200
0
12
0.16
0
15
0.00
0
15
1.73
0
19
–2.34
31250
0
7
0.00
0
9
–1.70
0
9
0.00
0
11
0.00
38400
0
6
-6.99
0
7
0.00
0
7
1.73
0
9
–2.34
Legend:
: A setting is available but error occurs.
Rev.5.00 Nov. 02, 2005 Page 271 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (3)
Operating Frequency φ (MHz)
12.888
14
14.7456
16
Bit Rate
(bit/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
217
0.08
2
248
–0.17
3
64
0.70
3
70
0.03
150
2
159
0.00
2
181
0.16
2
191
0.00
2
207
0.16
300
2
79
0.00
2
90
0.16
2
95
0.00
2
103
0.16
600
1
159
0.00
1
181
0.16
1
191
0.00
1
207
0.16
1200
1
79
0.00
1
90
0.16
1
95
0.00
1
103
0.16
2400
0
159
0.00
0
181
0.16
0
191
0.00
0
207
0.16
4800
0
79
0.00
0
90
0.16
0
95
0.00
0
103
0.16
9600
0
39
0.00
0
45
–0.93
0
47
0.00
0
51
0.16
19200
0
19
0.00
0
22
–0.93
0
23
0.00
0
25
0.16
31250
0
11
2.40
0
13
0.00
0
14
–1.70
0
15
0.00
38400
0
9
0.00
—
—
—
0
11
0.00
0
12
0.16
Operating Frequency φ (MHz)
18
20
Bit Rate
(bit/s)
n
N
Error
(%)
n
N
Error
(%)
110
3
79
–0.12
3
88
–0.25
150
2
233
0.16
3
64
0.16
300
2
116
0.16
2
129
0.16
600
1
233
0.16
2
64
0.16
1200
1
116
0.16
1
129
0.16
2400
0
233
0.16
1
64
0.16
4800
0
116
0.16
0
129
0.16
9600
0
58
–0.96
0
64
0.16
19200
0
28
1.02
0
32
–1.36
31250
0
17
0.00
0
19
0.00
38400
0
14
–2.34
0
15
1.73
Legend:
—: A setting is available but error occurs.
Rev.5.00 Nov. 02, 2005 Page 272 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
Table 16.4 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
φ (MHz)
Maximum Bit
Rate (bit/s)
n
N
φ (MHz)
Maximum Bit
Rate (bit/s)
n
N
2
62500
0
0
8
250000
0
0
2.097152
65536
0
0
9.8304
307200
0
0
2.4576
76800
0
0
10
312500
0
0
3
93750
0
0
12
375000
0
0
3.6864
115200
0
0
12.288
384000
0
0
4
125000
0
0
14
437500
0
0
4.9152
153600
0
0
14.7456
460800
0
0
5
156250
0
0
16
500000
0
0
6
187500
0
0
17.2032
537600
0
0
6.144
192000
0
0
18
562500
0
0
7.3728
230400
0
0
20
625000
0
0
Rev.5.00 Nov. 02, 2005 Page 273 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
Table 16.5 Examples of BRR Settings for Various Bit Rates (Clocked Synchronous Mode)
(1)
Operating Frequency φ (MHz)
2
4
8
10
Bit Rate
(bit/s)
n
N
n
N
n
N
n
N
110
3
70
—
—
—
—
—
—
250
2
124
2
249
3
124
—
16
n
N
—
3
249
500
1
249
2
124
2
249
—
—
3
124
1k
1
124
1
249
2
124
—
—
2
249
2.5k
0
199
1
99
1
199
1
249
2
99
5k
0
99
0
199
1
99
1
124
1
199
10k
0
49
0
99
0
199
0
249
1
99
25k
0
19
0
39
0
79
0
99
0
159
50k
0
9
0
19
0
39
0
49
0
79
100k
0
4
0
9
0
19
0
24
0
39
250k
0
1
0
3
0
7
0
9
0
15
500k
0
0*
0
1
0
3
0
4
0
7
0
0*
0
1
—
—
0
3
0
0*
—
—
0
1
0
0*
—
—
0
0*
1M
2M
2.5M
4M
Legend:
Blank : No setting is available.
—
: A setting is available but error occurs.
*
: Continuous transfer is not possible.
Rev.5.00 Nov. 02, 2005 Page 274 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
Table 16.5 Examples of BRR Settings for Various Bit Rates (Clocked Synchronous Mode)
(2)
Operating Frequency φ (MHz)
18
20
Bit Rate
(bit/s)
n
N
n
N
110
—
—
—
—
250
—
—
—
—
500
3
140
3
155
1k
3
69
3
77
2.5k
2
112
2
124
5k
1
224
1
249
10k
1
112
1
124
25k
0
179
0
199
50k
0
89
0
99
100k
0
44
0
49
250k
0
17
0
19
500k
0
8
0
9
1M
0
4
0
4
2M
—
—
—
—
2.5M
—
—
0
1
4M
—
—
—
—
Legend:
Blank : No setting is available.
—
: A setting is available but error occurs.
*
: Continuous transfer is not possible.
Rev.5.00 Nov. 02, 2005 Page 275 of 500
REJ09B0027-0500
Section 16 Serial Communication Interface 3 (SCI3)
16.4
Operation in Asynchronous Mode
Figure 16.2 shows the general format for asynchronous serial communication. One character (or
frame) consists of a start bit (low level), followed by data (in LSB-first order), a parity bit (high or
low level), and finally stop bits (high level). Inside the SCI3, the transmitter and receiver are
independent units, enabling full-duplex. Both the transmitter and the receiver also have a doublebuffered structure, so data can be read or written during transmission or reception, enabling
continuous data transfer.
LSB
MSB
Serial Start
data
bit
Transmit/receive data
7 or 8 bits
1 bit
1
Parity
bit
Stop bit
Mark state
1 or
2 bits
1 bit,
or none
One unit of transfer data (character or frame)
Figure 16.2 Data Format in Asynchronous Communication
16.4.1
Clock
Either an internal clock generated by the on-chip baud rate generator or an external clock input at
the SCK3 pin can be selected as the SCI3’s serial clock, according to the setting of the COM bit in
SMR and the CKE0 and CKE1 bits in SCR3. When an external clock is input at the SCK3 pin, the
clock frequency should be 16 times the bit rate used.
When the SCI3 is operated on an internal clock, the clock can be output from the SCK3 pin. The
frequency of the clock output in this case is equal to the bit rate, and the phase is such that the
rising edge of the clock is in the middle of the transmit data, as shown in figure 16.3.
Clock
Serial data
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 character (frame)
Figure 16.3 Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode) (Example with 8-Bit Data, Parity, Two Stop Bits)
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Section 16 Serial Communication Interface 3 (SCI3)
16.4.2
SCI3 Initialization
Before transmitting and receiving data, you should first clear the TE and RE bits in SCR3 to 0,
then initialize the SCI3 as described below. When the operating mode, or transfer format, is
changed for example, the TE and RE bits must be cleared to 0 before making the change using the
following procedure. When the TE bit is cleared to 0, the TDRE flag is set to 1. Note that clearing
the RE bit to 0 does not initialize the contents of the RDRF, PER, FER, and OER flags, or the
contents of RDR. When the external clock is used in asynchronous mode, the clock must be
supplied even during initialization.
[1]
Start initialization
When the clock output is selected in
asynchronous mode, clock is output
immediately after CKE1 and CKE0
settings are made. When the clock
output is selected at reception in clocked
synchronous mode, clock is output
immediately after CKE1, CKE0, and RE
are set to 1.
Clear TE and RE bits in SCR3 to 0
[1]
Set CKE1 and CKE0 bits in SCR3
Set data transfer format in SMR
[2]
Set value in BRR
[3]
Wait
[2]
Set the data transfer format in SMR.
[3]
Write a value corresponding to the bit
rate to BRR. Not necessary if an
external clock is used.
[4]
Wait at least one bit interval, then set the
TE bit or RE bit in SCR3 to 1. RE
settings enable the RXD pin to be used.
For transmission, set the TXD bit in
PMR1 to 1 to enable the TXD output pin
to be used. Also set the RIE, TIE, TEIE,
and MPIE bits, depending on whether
interrupts are required. In asynchronous
mode, the bits are marked at
transmission and idled at reception to
wait for the start bit.
No
1-bit interval elapsed?
Yes
Set TE and RE bits in
SCR3 to 1, and set RIE, TIE, TEIE,
and MPIE bits. For transmit (TE=1),
also set the TxD bit in PMR1.
<Initialization completion>
[4]
Set the clock selection in SCR3.
Be sure to clear bits RIE, TIE, TEIE, and
MPIE, and bits TE and RE, to 0.
Figure 16.4 Sample SCI3 Initialization Flowchart
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Section 16 Serial Communication Interface 3 (SCI3)
16.4.3
Data Transmission
Figure 16.5 shows an example of operation for transmission in asynchronous mode. In
transmission, the SCI3 operates as described below.
1. The SCI3 monitors the TDRE flag in SSR. If the flag is cleared to 0, the SCI3 recognizes that
data has been written to TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI3 sets the TDRE flag to 1 and starts
transmission. If the TIE bit is set to 1 at this time, a TXI interrupt request is generated.
Continuous transmission is possible because the TXI interrupt routine writes next transmit data
to TDR before transmission of the current transmit data has been completed.
3. The SCI3 checks the TDRE flag at the timing for sending the stop bit.
4. If the TDRE flag is 0, the data is transferred from TDR to TSR, the stop bit is sent, and then
serial transmission of the next frame is started.
5. If the TDRE flag is 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the “mark
state” is entered, in which 1 is output. If the TEIE bit in SCR3 is set to 1 at this time, a TEI
interrupt request is generated.
6. Figure 16.6 shows a sample flowchart for transmission in asynchronous mode.
Start
bit
Serial
data
1
0
Transmit
data
D0
D1
D7
1 frame
Parity Stop Start
bit
bit bit
0/1
1
0
Transmit
data
D0
D1
D7
Parity Stop
bit
bit
0/1
Mark
state
1
1
1 frame
TDRE
TEND
LSI
TXI interrupt
operation request
generated
User
processing
TDRE flag
cleared to 0
TXI interrupt request generated
TEI interrupt request
generated
Data written
to TDR
Figure 16.5 Example of SCI3 Transmission in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit)
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Section 16 Serial Communication Interface 3 (SCI3)
Start transmission
[1]
Read TDRE flag in SSR
No
TDRE = 1
Yes
Write transmit data to TDR
[2]
Yes
All data transmitted?
[1] Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR. When data is
written to TDR, the TDRE flag is
automaticaly cleared to 0.
[2] To continue serial transmission,
read 1 from the TDRE flag to
confirm that writing is possible,
then write data to TDR. When data
is written to TDR, the TDRE flag is
automaticaly cleared to 0.
[3] To output a break in serial
transmission, after setting PCR to 1
and PDR to 0, clear TxD in PMR1
to 0, then clear the TE bit in SCR3
to 0.
No
Read TEND flag in SSR
No
TEND = 1
Yes
[3]
No
Break output?
Yes
Clear PDR to 0 and
set PCR to 1
Clear TE bit in SCR3 to 0
<End>
Figure 16.6 Sample Serial Transmission Data Flowchart (Asynchronous Mode)
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Section 16 Serial Communication Interface 3 (SCI3)
16.4.4
Serial Data Reception
Figure 16.7 shows an example of operation for reception in asynchronous mode. In serial
reception, the SCI3 operates as described below.
1. The SCI3 monitors the communication line. If a start bit is detected, the SCI3 performs
internal synchronization, receives receive data in RSR, and checks the parity bit and stop bit.
2. If an overrun error occurs (when reception of the next data is completed while the RDRF flag
is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR3 is set to 1 at this time, an
ERI interrupt request is generated. Receive data is not transferred to RDR.
3. If a parity error is detected, the PER bit in SSR is set to 1 and receive data is transferred to
RDR. If the RIE bit in SCR3 is set to 1 at this time, an ERI interrupt request is generated.
4. If a framing error is detected (when the stop bit is 0), the FER bit in SSR is set to 1 and receive
data is transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an ERI interrupt
request is generated.
5. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an RXI interrupt request is
generated. Continuous reception is possible because the RXI interrupt routine reads the receive
data transferred to RDR before reception of the next receive data has been completed.
Start
bit
Serial
data
1
0
Receive
data
D0
D1
D7
Parity Stop Start
bit
bit bit
0/1
1
0
1 frame
Receive
data
D0
D1
Parity Stop
bit
bit
D7
0/1
0
Mark state
(idle state)
1
1 frame
RDRF
FER
LSI
operation
RXI request
RDRF
cleared to 0
0 stop bit
detected
RDR data read
User
processing
ERI request in
response to
framing error
Framing error
processing
Figure 16.7 Example of SCI3 Reception in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit)
Table 16.6 shows the states of the SSR status flags and receive data handling when a receive error
is detected. If a receive error is detected, the RDRF flag retains its state before receiving data.
Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the OER,
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Section 16 Serial Communication Interface 3 (SCI3)
FER, PER, and RDRF bits to 0 before resuming reception. Figure 16.8 shows a sample flow chart
for serial data reception.
Table 16.6 SSR Status Flags and Receive Data Handling
SSR Status Flag
RDRF*
OER
FER
PER
Receive Data
1
1
0
0
Lost
Overrun error
0
0
1
0
Transferred to RDR
Framing error
0
0
0
1
Transferred to RDR
Parity error
1
1
1
0
Lost
Overrun error + framing error
1
1
0
1
Lost
Overrun error + parity error
0
0
1
1
Transferred to RDR
Framing error + parity error
1
1
1
1
Lost
Overrun error + framing error +
parity error
Note:
*
Receive Error Type
The RDRF flag retains the state it had before data reception.
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Section 16 Serial Communication Interface 3 (SCI3)
Start reception
Read OER, PER, and
FER flags in SSR
[1]
Yes
OER+PER+FER = 1
[4]
No
Error processing
(Continued on next page)
Read RDRF flag in SSR
[2]
No
RDRF = 1
Yes
Read receive data in RDR
[1] Read the OER, PER, and FER flags in
SSR to identify the error. If a receive
error occurs, performs the appropriate
error processing.
[2] Read SSR and check that RDRF = 1,
then read the receive data in RDR.
The RDRF flag is cleared automatically.
[3] To continue serial reception, before the
stop bit for the current frame is
received, read the RDRF flag and read
RDR.
The RDRF flag is cleared automatically.
[4] If a receive error occurs, read the OER,
PER, and FER flags in SSR to identify
the error. After performing the
appropriate error processing, ensure
that the OER, PER, and FER flags are
all cleared to 0. Reception cannot be
resumed if any of these flags are set to
1. In the case of a framing error, a
break can be detected by reading the
value of the input port corresponding to
the RxD pin.
Yes
All data received?
[3]
No
(A)
Clear RE bit in SCR3 to 0
<End>
Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode) (1)
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Section 16 Serial Communication Interface 3 (SCI3)
[4]
Error processing
No
OER = 1
Yes
Overrun error processing
No
FER = 1
Yes
Yes
Break?
No
Framing error processing
No
PER = 1
Yes
Parity error processing
(A)
Clear OER, PER, and
FER flags in SSR to 0
<End>
Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode) (2)
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Section 16 Serial Communication Interface 3 (SCI3)
16.5
Operation in Clocked Synchronous Mode
Figure 16.9 shows the general format for clocked synchronous communication. In clocked
synchronous mode, data is transmitted or received synchronous with clock pulses. A single
character in the transmit data consists of the 8-bit data starting from the LSB. In clocked
synchronous serial communication, data on the transmission line is output from one falling edge of
the synchronization clock to the next. In clocked synchronous mode, the SCI3 receives data in
synchronous with the rising edge of the synchronization clock. After 8-bit data is output, the
transmission line holds the MSB state. In clocked synchronous mode, no parity or multiprocessor
bit is added. Inside the SCI3, the transmitter and receiver are independent units, enabling fullduplex communication through the use of a common clock. Both the transmitter and the receiver
also have a double-buffered structure, so data can be read or written during transmission or
reception, enabling continuous data transfer.
8-bit
One unit of transfer data (character or frame)
*
*
Synchronization
clock
LSB
Bit 0
Serial data
MSB
Bit 1
Don’t care
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Don’t care
Note: * High except in continuous transfer
Figure 16.9 Data Format in Clocked Synchronous Communication
16.5.1
Clock
Either an internal clock generated by the on-chip baud rate generator or an external
synchronization clock input at the SCK3 pin can be selected, according to the setting of the COM
bit in SMR and CKE0 and CKE1 bits in SCR3. When the SCI3 is operated on an internal clock,
the synchronization clock is output from the SCK3 pin. Eight synchronization clock pulses are
output in the transfer of one character, and when no transfer is performed the clock is fixed high.
16.5.2
SCI3 Initialization
Before transmitting and receiving data, the SCI3 should be initialized as described in a sample
flowchart in figure 16.4.
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Section 16 Serial Communication Interface 3 (SCI3)
16.5.3
Serial Data Transmission
Figure 16.10 shows an example of SCI3 operation for transmission in clocked synchronous mode.
In serial transmission, the SCI3 operates as described below.
1. The SCI3 monitors the TDRE flag in SSR, and if the flag is 0, the SCI3 recognizes that data
has been written to TDR, and transfers the data from TDR to TSR.
2. The SCI3 sets the TDRE flag to 1 and starts transmission. If the TIE bit in SCR3 is set to 1 at
this time, a transmit data empty interrupt (TXI) is generated.
3. 8-bit data is sent from the TxD pin synchronized with the output clock when output clock
mode has been specified, and synchronized with the input clock when use of an external clock
has been specified. Serial data is transmitted sequentially from the LSB (bit 0), from the TxD
pin.
4. The SCI3 checks the TDRE flag at the timing for sending the MSB (bit 7).
5. If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission
of the next frame is started.
6. If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, and the TDRE flag maintains the
output state of the last bit. If the TEIE bit in SCR3 is set to 1 at this time, a TEI interrupt
request is generated.
7. The SCK3 pin is fixed high at the end of transmission.
Figure 16.11 shows a sample flow chart for serial data transmission. Even if the TDRE flag is
cleared to 0, transmission will not start while a receive error flag (OER, FER, or PER) is set to 1.
Make sure that the receive error flags are cleared to 0 before starting transmission.
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Section 16 Serial Communication Interface 3 (SCI3)
Serial
clock
Serial
data
Bit 0
Bit 1
1 frame
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
1 frame
TDRE
TEND
LSI
TXI interrupt
operation request
generated
TDRE flag
cleared
to 0
User
processing
Data written
to TDR
TXI interrupt request generated
TEI interrupt request
generated
Figure 16.10 Example of SCI3 Transmission in Clocked Synchronous Mode
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Section 16 Serial Communication Interface 3 (SCI3)
Start transmission
[1]
[1]
Read TDRE flag in SSR
No
TDRE = 1
Yes
[2]
Read SSR and check that the TDRE flag is
set to 1, then write transmit data to TDR.
When data is written to TDR, the TDRE flag
is automatically cleared to 0 and clocks are
output to start the data transmission.
To continue serial transmission, be sure to
read 1 from the TDRE flag to confirm that
writing is possible, then write data to TDR.
When data is written to TDR, the TDRE flag
is automatically cleared to 0.
Write transmit data to TDR
[2]
All data transmitted?
Yes
No
Read TEND flag in SSR
No
TEND = 1
Yes
Clear TE bit in SCR3 to 0
<End>
Figure 16.11 Sample Serial Transmission Flowchart (Clocked Synchronous Mode)
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Section 16 Serial Communication Interface 3 (SCI3)
16.5.4
Serial Data Reception (Clocked Synchronous Mode)
Figure 16.12 shows an example of SCI3 operation for reception in clocked synchronous mode. In
serial reception, the SCI3 operates as described below.
1. The SCI3 performs internal initialization synchronous with a synchronization clock input or
output, starts receiving data.
2. The SCI3 stores the receive data in RSR.
3. If an overrun error occurs (when reception of the next data is completed while the RDRF flag
in SSR is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR3 is set to 1 at this
time, an ERI interrupt request is generated, receive data is not transferred to RDR, and the
RDRF flag remains to be set to 1.
4. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an RXI interrupt request is
generated.
Serial
clock
Serial
data
Bit 7
Bit 0
Bit 7
1 frame
Bit 0
Bit 1
Bit 6
Bit 7
1 frame
RDRF
OER
LSI
operation
RXI interrupt
request
generated
User
processing
RDRF flag
cleared
to 0
RDR data read
RXI interrupt request generated
RDR data has
not been read
(RDRF = 1)
ERI interrupt request
generated by
overrun error
Overrun error
processing
Figure 16.12 Example of SCI3 Reception in Clocked Synchronous Mode
Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the OER,
FER, PER, and RDRF bits to 0 before resuming reception. Figure 16.13 shows a sample flow
chart for serial data reception.
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Section 16 Serial Communication Interface 3 (SCI3)
Start reception
[1]
[1]
Read OER flag in SSR
[2]
Yes
OER = 1
[4]
No
Error processing
[3]
(Continued below)
Read RDRF flag in SSR
[2]
[4]
No
RDRF = 1
Yes
Read the OER flag in SSR to determine if
there is an error. If an overrun error has
occurred, execute overrun error processing.
Read SSR and check that the RDRF flag is
set to 1, then read the receive data in RDR.
When data is read from RDR, the RDRF
flag is automatically cleared to 0.
To continue serial reception, before the
MSB (bit 7) of the current frame is received,
reading the RDRF flag and reading RDR
should be finished. When data is read from
RDR, the RDRF flag is automatically
cleared to 0.
If an overrun error occurs, read the OER
flag in SSR, and after performing the
appropriate error processing, clear the OER
flag to 0. Reception cannot be resumed if
the OER flag is set to 1.
Read receive data in RDR
Yes
All data received?
[3]
No
Clear RE bit in SCR3 to 0
<End>
[4]
Error processing
Overrun error processing
Clear OER flag in SSR to 0
<End>
Figure 16.13 Sample Serial Reception Flowchart (Clocked Synchronous Mode)
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Section 16 Serial Communication Interface 3 (SCI3)
16.5.5
Simultaneous Serial Data Transmission and Reception
Figure 16.14 shows a sample flowchart for simultaneous serial transmit and receive operations.
The following procedure should be used for simultaneous serial data transmit and receive
operations. To switch from transmit mode to simultaneous transmit and receive mode, after
checking that the SCI3 has finished transmission and the TDRE and TEND flags are set to 1, clear
TE to 0. Then simultaneously set TE and RE to 1 with a single instruction. To switch from receive
mode to simultaneous transmit and receive mode, after checking that the SCI3 has finished
reception, clear RE to 0. Then after checking that the RDRF and receive error flags (OER, FER,
and PER) are cleared to 0, simultaneously set TE and RE to 1 with a single instruction.
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Section 16 Serial Communication Interface 3 (SCI3)
Start transmission/reception
Read TDRE flag in SSR
[1]
[1]
No
TDRE = 1
Yes
Write transmit data to TDR
Read OER flag in SSR
OER = 1
No
Read RDRF flag in SSR
Yes
[4]
Error processing
[2]
No
RDRF = 1
Yes
Read receive data in RDR
Read SSR and check that the TDRE
flag is set to 1, then write transmit
data to TDR.
When data is written to TDR, the
TDRE flag is automatically cleared to
0.
[2] Read SSR and check that the RDRF
flag is set to 1, then read the receive
data in RDR.
When data is read from RDR, the
RDRF flag is automatically cleared to
0.
[3] To continue serial transmission/
reception, before the MSB (bit 7) of
the current frame is received, finish
reading the RDRF flag, reading RDR.
Also, before the MSB (bit 7) of the
current frame is transmitted, read 1
from the TDRE flag to confirm that
writing is possible. Then write data to
TDR.
When data is written to TDR, the
TDRE flag is automatically cleared to
0. When data is read from RDR, the
RDRF flag is automatically cleared to
0.
[4] If an overrun error occurs, read the
OER flag in SSR, and after
performing the appropriate error
processing, clear the OER flag to 0.
Transmission/reception cannot be
resumed if the OER flag is set to 1.
For overrun error processing, see
figure 16.13.
Yes
All data received?
[3]
No
Clear TE and RE bits in SCR to 0
<End>
Figure 16.14 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
(Clocked Synchronous Mode)
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Section 16 Serial Communication Interface 3 (SCI3)
16.6
Multiprocessor Communication Function
Use of the multiprocessor communication function enables data transfer between a number of
processors sharing communication lines by asynchronous serial communication using the
multiprocessor format, in which a multiprocessor bit is added to the transfer data. When
multiprocessor communication is performed, each receiving station is addressed by a unique ID
code. The serial communication cycle consists of two component cycles; an ID transmission cycle
that specifies the receiving station, and a data transmission cycle. The multiprocessor bit is used to
differentiate between the ID transmission cycle and the data transmission cycle. If the
multiprocessor bit is 1, the cycle is an ID transmission cycle; if the multiprocessor bit is 0, the
cycle is a data transmission cycle. Figure 16.15 shows an example of inter-processor
communication using the multiprocessor format. The transmitting station first sends the ID code
of the receiving station with which it wants to perform serial communication as data with a 1
multiprocessor bit added. It then sends transmit data as data with a 0 multiprocessor bit added.
When data with a 1 multiprocessor bit is received, the receiving station compares that data with its
own ID. The station whose ID matches then receives the data sent next. Stations whose IDs do not
match continue to skip data until data with a 1 multiprocessor bit is again received.
The SCI3 uses the MPIE bit in SCR3 to implement this function. When the MPIE bit is set to 1,
transfer of receive data from RSR to RDR, error flag detection, and setting the SSR status flags,
RDRF, FER, and OER, to 1, are inhibited until data with a 1 multiprocessor bit is received. On
reception of a receive character with a 1 multiprocessor bit, the MPBR bit in SSR is set to 1 and
the MPIE bit is automatically cleared, thus normal reception is resumed. If the RIE bit in SCR3 is
set to 1 at this time, an RXI interrupt is generated.
When the multiprocessor format is selected, the parity bit setting is rendered invalid. All other bit
settings are the same as those in normal asynchronous mode. The clock used for multiprocessor
communication is the same as that in normal asynchronous mode.
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Section 16 Serial Communication Interface 3 (SCI3)
Transmitting
station
Serial transmission line
Receiving
station A
Receiving
station B
Receiving
station C
Receiving
station D
(ID = 01)
(ID = 02)
(ID = 03)
(ID = 04)
Serial
data
H'01
H'AA
(MPB = 1)
(MPB = 0)
ID transmission cycle = Data transmission cycle =
receiving station
Data transmission to
specification
receiving station specified by ID
[Legend]
MPB: Multiprocessor bit
Figure 16.15 Example of Inter-Processor Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A)
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Section 16 Serial Communication Interface 3 (SCI3)
16.6.1
Multiprocessor Serial Data Transmission
Figure 16.16 shows a sample flowchart for multiprocessor serial data transmission. For an ID
transmission cycle, set the MPBT bit in SSR to 1 before transmission. For a data transmission
cycle, clear the MPBT bit in SSR to 0 before transmission. All other SCI3 operations are the same
as those in asynchronous mode.
Start transmission
[1]
[1]
Read TDRE flag in SSR
No
TDRE = 1
[2]
Yes
Set MPBT bit in SSR
[3]
Write transmit data to TDR
Yes
[2]
Read SSR and check that the TDRE
flag is set to 1, set the MPBT bit in
SSR to 0 or 1, then write transmit
data to TDR. When data is written to
TDR, the TDRE flag is automatically
cleared to 0.
To continue serial transmission, be
sure to read 1 from the TDRE flag to
confirm that writing is possible, then
write data to TDR. When data is
written to TDR, the TDRE flag is
automatically cleared to 0.
To output a break in serial
transmission, set the port PCR to 1,
clear PDR to 0, then clear the TE bit
in SCR3 to 0.
All data transmitted?
No
Read TEND flag in SSR
No
TEND = 1
Yes
No
Break output?
[3]
Yes
Clear PDR to 0 and set PCR to 1
Clear TE bit in SCR3 to 0
<End>
Figure 16.16 Sample Multiprocessor Serial Transmission Flowchart
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Section 16 Serial Communication Interface 3 (SCI3)
16.6.2
Multiprocessor Serial Data Reception
Figure 16.17 shows a sample flowchart for multiprocessor serial data reception. If the MPIE bit in
SCR3 is set to 1, data is skipped until data with a 1 multiprocessor bit is sent. On receiving data
with a 1 multiprocessor bit, the receive data is transferred to RDR. An RXI interrupt request is
generated at this time. All other SCI3 operations are the same as those in asynchronous mode.
Figure 16.18 shows an example of SCI3 operation for multiprocessor format reception.
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Section 16 Serial Communication Interface 3 (SCI3)
[1]
[2]
Start reception
Set MPIE bit in SCR3 to 1
[1]
Read OER and FER flags in SSR
[2]
[3]
Yes
FER+OER = 1
No
Read RDRF flag in SSR
[3]
No
[4]
[5]
RDRF = 1
Yes
Read receive data in RDR
No
This station’s ID?
Set the MPIE bit in SCR3 to 1.
Read OER and FER in SSR to check for
errors. Receive error processing is performed
in cases where a receive error occurs.
Read SSR and check that the RDRF flag is
set to 1, then read the receive data in RDR
and compare it with this station’s ID.
If the data is not this station’s ID, set the MPIE
bit to 1 again.
When data is read from RDR, the RDRF flag
is automatically cleared to 0.
Read SSR and check that the RDRF flag is
set to 1, then read the data in RDR.
If a receive error occurs, read the OER and
FER flags in SSR to identify the error. After
performing the appropriate error processing,
ensure that the OER and FER flags are all
cleared to 0.
Reception cannot be resumed if either of
these flags is set to 1.
In the case of a framing error, a break can be
detected by reading the RxD pin value.
Yes
Read OER and FER flags in SSR
Yes
FER+OER = 1
No
Read RDRF flag in SSR
[4]
No
RDRF = 1
[5]
Error processing
Yes
Read receive data in RDR
(Continued on
next page)
Yes
All data received?
No
[A]
Clear RE bit in SCR3 to 0
<End>
Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (1)
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Section 16 Serial Communication Interface 3 (SCI3)
[5]
Error processing
No
OER = 1
Yes
Overrun error processing
No
FER = 1
Yes
Yes
Break?
No
[A]
Framing error processing
Clear OER, and
FER flags in SSR to 0
<End>
Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (2)
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Section 16 Serial Communication Interface 3 (SCI3)
Start
bit
Serial
data
1
0
Receive
data (ID1)
D0
D1
D7
MPB
1
Stop Start
bit bit
1
0
Receive data
(Data1)
D0
1 frame
D1
D7
MPB
Stop
bit
Mark state
(idle state)
0
1
1
1 frame
MPIE
RDRF
RDR
value
ID1
LSI
operation
User
processing
RXI interrupt request
is not generated, and
RDR retains its state
RDRF flag
cleared
to 0
RXI interrupt
request
MPIE cleared
to 0
RDR data read
When data is not
this station's ID,
MPIE is set to 1
again
(a) When data does not match this receiver's ID
Start
bit
Serial
data
1
0
Receive
data (ID2)
D0
D1
D7
MPB
1
Stop Start
bit bit
1
0
Receive data
(Data2)
D0
1 frame
D1
D7
MPB
Stop
bit
Mark state
(idle state)
0
1
1
1 frame
MPIE
RDRF
RDR
value
ID1
LSI
operation
User
processing
ID2
RXI interrupt
request
MPIE cleared
to 0
RDRF flag
cleared
to 0
RDR data read
Data2
RXI interrupt
request
When data is
this station's
ID, reception
is continued
RDRF flag
cleared
to 0
RDR data read
MPIE set to 1
again
(b) When data matches this receiver's ID
Figure 16.18 Example of SCI3 Reception Using Multiprocessor Format
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
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Section 16 Serial Communication Interface 3 (SCI3)
16.7
Interrupts
SCI3 creates the following six interrupt requests: transmission end, transmit data empty, receive
data full, and receive errors (overrun error, framing error, and parity error). Table 16.7 shows the
interrupt sources.
Table 16.7 SCI3 Interrupt Requests
Interrupt Requests
Abbreviation
Interrupt Sources
Receive Data Full
RXI
Setting RDRF in SSR
Transmit Data Empty
TXI
Setting TDRE in SSR
Transmission End
TEI
Setting TEND in SSR
Receive Error
ERI
Setting OER, FER, and PER in SSR
The initial value of the TDRE flag in SSR is 1. Thus, when the TIE bit in SCR3 is set to 1 before
transferring the transmit data to TDR, a TXI interrupt request is generated even if the transmit data
is not ready. The initial value of the TEND flag in SSR is 1. Thus, when the TEIE bit in SCR3 is
set to 1 before transferring the transmit data to TDR, a TEI interrupt request is generated even if
the transmit data has not been sent. It is possible to make use of the most of these interrupt
requests efficiently by transferring the transmit data to TDR in the interrupt routine. To prevent the
generation of these interrupt requests (TXI and TEI), set the enable bits (TIE and TEIE) that
correspond to these interrupt requests to 1, after transferring the transmit data to TDR.
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Section 16 Serial Communication Interface 3 (SCI3)
16.8
Usage Notes
16.8.1
Break Detection and Processing
When framing error detection is performed, a break can be detected by reading the RxD pin value
directly. In a break, the input from the RxD pin becomes all 0s, setting the FER flag, and possibly
the PER flag. Note that as the SCI3 continues the receive operation after receiving a break, even if
the FER flag is cleared to 0, it will be set to 1 again.
16.8.2
Mark State and Break Sending
When TE is 0, the TxD pin is used as an I/O port whose direction (input or output) and level are
determined by PCR and PDR. This can be used to set the TxD pin to mark state (high level) or
send a break during serial data transmission. To maintain the communication line at mark state
until TE is set to 1, set both PCR and PDR to 1. As TE is cleared to 0 at this point, the TxD pin
becomes an I/O port, and 1 is output from the TxD pin. To send a break during serial transmission,
first set PCR to 1 and clear PDR to 0, and then clear TE to 0. When TE is cleared to 0, the
transmitter is initialized regardless of the current transmission state, the TxD pin becomes an I/O
port, and 0 is output from the TxD pin.
16.8.3
Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only)
Transmission cannot be started when a receive error flag (OER, PER, or FER) is set to 1, even if
the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting
transmission. Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared
to 0.
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Section 16 Serial Communication Interface 3 (SCI3)
16.8.4
Receive Data Sampling Timing and Reception Margin in Asynchronous Mode
In asynchronous mode, the SCI3 operates on a basic clock with a frequency of 16 times the
transfer rate. In reception, the SCI3 samples the falling edge of the start bit using the basic clock,
and performs internal synchronization. Receive data is latched internally at the rising edge of the
8th pulse of the basic clock as shown in figure 16.19. Thus, the reception margin in asynchronous
mode is given by formula (1) below.
1
D – 0.5
M = (0.5 –
)–
– (L – 0.5) F × 100(%)
2N
N
... Formula (1)
Legend N
D
L
F
: Ratio of bit rate to clock (N = 16)
: Clock duty (D = 0.5 to 1.0)
: Frame length (L = 9 to 12)
: Absolute value of clock rate deviation
Assuming values of F (absolute value of clock rate deviation) = 0 and D (clock duty) = 0.5 in
formula (1), the reception margin can be given by the formula.
M = {0.5 – 1/(2 × 16)} × 100 [%] = 46.875%
However, this is only the computed value, and a margin of 20% to 30% should be allowed for in
system design.
16 clocks
8 clocks
0
7
15 0
7
15 0
Internal basic
clock
Receive data
(RxD)
Start bit
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 16.19 Receive Data Sampling Timing in Asynchronous Mode
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Section 16 Serial Communication Interface 3 (SCI3)
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2
Section 17 I C Bus Interface 2 (IIC2)
Section 17 I2C Bus Interface 2 (IIC2)
The I2C bus interface 2 conforms to and provides a subset of the Philips I2C bus (inter-IC bus)
interface functions. The register configuration that controls the I2C bus differs partly from the
Philips configuration, however.
Figure 17.1 shows a block diagram of the I2C bus interface 2.
Figure 17.2 shows an example of I/O pin connections to external circuits.
17.1
Features
• Selection of I2C format or clocked synchronous serial format
• Continuous transmission/reception
Since the shift register, transmit data register, and receive data register are independent from
each other, the continuous transmission/reception can be performed.
I2C bus format
• Start and stop conditions generated automatically in master mode
• Selection of acknowledge output levels when receiving
• Automatic loading of acknowledge bit when transmitting
• Bit synchronization/wait function
In master mode, the state of SCL is monitored per bit, and the timing is synchronized
automatically.
If transmission/reception is not yet possible, set the SCL to low until preparations are
completed.
• Six interrupt sources
Transmit data empty (including slave-address match), transmit end, receive data full (including
slave-address match), arbitration lost, NACK detection, and stop condition detection
• Direct bus drive
Two pins, SCL and SDA pins, function as NMOS open-drain outputs when the bus drive
function is selected.
Clocked synchronous format
• Four interrupt sources
Transmit-data-empty, transmit-end, receive-data-full, and overrun error
IFIIC10A_000020020200
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2
Section 17 I C Bus Interface 2 (IIC2)
Transfer clock
generation
circuit
SCL
Transmission/
reception
control circuit
Output
control
ICCR1
ICCR2
ICMR
Internal data bus
Noise canceler
ICDRT
SDA
Output
control
ICDRS
SAR
Address
comparator
Noise canceler
ICDRR
Bus state
decision circuit
Arbitration
decision circuit
ICSR
ICIER
Interrupt
generator
[Legend]
2
ICCR1 : I C bus control register 1
ICCR2 : I2C bus control register 2
ICMR : I2C bus mode register
ICSR : I2C bus status register
ICIER : I2C bus interrupt enable register
ICDRT : I2C bus transmit data register
ICDRR : I2C bus receive data register
ICDRS : I2C bus shift register
SAR : Slave address register
Figure 17.1 Block Diagram of I2C Bus Interface 2
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Interrupt request
2
Section 17 I C Bus Interface 2 (IIC2)
Vcc
SCL in
Vcc
SCL
SCL
SDA
SDA
SCL out
SDA in
SCL in
SCL out
SCL
SDA
(Master)
SCL
SDA
SDA out
SCL in
SCL out
SDA in
SDA in
SDA out
SDA out
(Slave 1)
(Slave 2)
Figure 17.2 External Circuit Connections of I/O Pins
17.2
Input/Output Pins
Table 17.1 summarizes the input/output pins used by the I2C bus interface 2.
Table 17.1 I2C Bus Interface Pins
Name
Abbreviation
I/O
Function
Serial clock
SCL
I/O
IIC serial clock input/output
Serial data
SDA
I/O
IIC serial data input/output
17.3
Register Descriptions
The I2C bus interface 2 has the following registers:
•
•
•
•
•
•
•
I2C bus control register 1 (ICCR1)
I2C bus control register 2 (ICCR2)
I2C bus mode register (ICMR)
I2C bus interrupt enable register (ICIER)
I2C bus status register (ICSR)
I2C bus slave address register (SAR)
I2C bus transmit data register (ICDRT)
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Section 17 I C Bus Interface 2 (IIC2)
• I2C bus receive data register (ICDRR)
• I2C bus shift register (ICDRS)
17.3.1
I2C Bus Control Register 1 (ICCR1)
ICCR1 enables or disables the I2C bus interface 2, controls transmission or reception, and selects
master or slave mode, transmission or reception, and transfer clock frequency in master mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
ICE
0
R/W
I C Bus Interface Enable
2
0: This module is halted. (SCL and SDA pins are set to
port function.)
1: This bit is enabled for transfer operations. (SCL and
SDA pins are bus drive state.)
6
RCVD
0
R/W
Reception Disable
This bit enables or disables the next operation when TRS
is 0 and ICDRR is read.
0: Enables next reception
1: Disables next reception
5
MST
0
R/W
Master/Slave Select
4
TRS
0
R/W
Transmit/Receive Select
In master mode with the I2C bus format, when arbitration
is lost, MST and TRS are both reset by hardware,
causing a transition to slave receive mode. Modification
of the TRS bit should be made between transfer frames.
After data receive has been started in slave receive
mode, when the first seven bits of the receive data agree
with the slave address that is set to SAR and the eighth
bit is 1, TRS is automatically set to 1. If an overrun error
occurs in master mode with the clock synchronous serial
format, MST is cleared to 0 and slave receive mode is
entered.
Operating modes are described below according to MST
and TRS combination. When clocked synchronous serial
format is selected and MST is 1, clock is output.
00: Slave receive mode
01: Slave transmit mode
10: Master receive mode
11: Master transmit mode
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Section 17 I C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
Description
3
CKS3
0
R/W
Transfer Clock Select 3 to 0
2
CKS2
0
R/W
1
CKS1
0
R/W
0
CKS0
0
R/W
These bits should be set according to the necessary
transfer rate (see table 17.2) in master mode. In slave
mode, these bits are used for reservation of the setup
time in transmit mode. The time is 10 tcyc when CKS3 = 0
and 20 tcyc when CKS3 = 1.
Table 17.2 Transfer Rate
Bit 3
Bit 2
Bit 1
Bit 0
Transfer Rate
φ = 5 MHz
φ = 8 MHz
φ = 10 MHz φ = 16 MHz φ = 20 MHz
0
φ/28
179 kHz
286 kHz
357 kHz
571 kHz
714 kHz
1
φ/40
125 kHz
200 kHz
250 kHz
400 kHz
500 kHz
0
φ/48
104 kHz
167 kHz
208 kHz
333 kHz
417 kHz
1
φ/64
78.1 kHz
125 kHz
156 kHz
250 kHz
313 kHz
0
φ/80
62.5 kHz
100 kHz
125 kHz
200 kHz
250 kHz
1
φ/100
50.0 kHz
80.0 kHz
100 kHz
160 kHz
200 kHz
0
φ/112
44.6 kHz
71.4 kHz
89.3 kHz
143 kHz
179 kHz
1
φ/128
39.1 kHz
62.5 kHz
78.1 kHz
125 kHz
156 kHz
0
0
φ/56
89.3 kHz
143 kHz
179 kHz
286 kHz
357 kHz
1
φ/80
62.5 kHz
100 kHz
125 kHz
200 kHz
250 kHz
1
0
φ/96
52.1 kHz
83.3 kHz
104 kHz
167 kHz
208 kHz
1
φ/128
39.1 kHz
62.5 kHz
78.1 kHz
125 kHz
156 kHz
0
0
φ/160
31.3 kHz
50.0 kHz
62.5 kHz
100 kHz
125 kHz
1
φ/200
25.0 kHz
40.0 kHz
50.0 kHz
80.0 kHz
100 kHz
1
0
φ/224
22.3 kHz
35.7 kHz
44.6 kHz
71.4 kHz
89.3 kHz
1
φ/256
19.5 kHz
31.3 kHz
39.1 kHz
62.5 kHz
78.1 kHz
CKS3 CKS2 CKS1 CKS0 Clock
0
0
0
1
1
0
1
1
0
1
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Section 17 I C Bus Interface 2 (IIC2)
17.3.2
I2C Bus Control Register 2 (ICCR2)
ICCR1 issues start/stop conditions, manipulates the SDA pin, monitors the SCL pin, and controls
reset in the control part of the I2C bus interface 2.
Bit
Bit Name
Initial
Value
R/W
Description
7
BBSY
0
R/W
Bus Busy
2
This bit enables to confirm whether the I C bus is
occupied or released and to issue start/stop conditions in
master mode. With the clocked synchronous serial
2
format, this bit has no meaning. With the I C bus format,
this bit is set to 1 when the SDA level changes from high
to low under the condition of SCL = high, assuming that
the start condition has been issued. This bit is cleared to
0 when the SDA level changes from low to high under the
condition of SCL = high, assuming that the stop condition
has been issued. Write 1 to BBSY and 0 to SCP to issue
a start condition. Follow this procedure when also retransmitting a start condition. Write 0 in BBSY and 0 in
SCP to issue a stop condition. To issue start/stop
conditions, use the MOV instruction.
6
SCP
1
W
Start/Stop Issue Condition Disable
The SCP bit controls the issue of start/stop conditions in
master mode.
To issue a start condition, write 1 in BBSY and 0 in SCP.
A retransmit start condition is issued in the same way. To
issue a stop condition, write 0 in BBSY and 0 in SCP.
This bit is always read as 1. If 1 is written, the data is not
stored.
5
SDAO
1
R/W
SDA Output Value Control
This bit is used with SDAOP when modifying output level
of SDA. This bit should not be manipulated during
transfer.
0: When reading, SDA pin outputs low.
When writing, SDA pin is changed to output low.
1: When reading, SDA pin outputs high.
When writing, SDA pin is changed to output Hi-Z
(outputs high by external pull-up resistance).
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Section 17 I C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
4
SDAOP
1
R/W
Description
SDAO Write Protect
This bit controls change of output level of the SDA pin by
modifying the SDAO bit. To change the output level, clear
SDAO and SDAOP to 0 or set SDAO to 1 and clear
SDAOP to 0 by the MOV instruction. This bit is always
read as 1.
3
SCLO
1
R
This bit monitors SCL output level. When SCLO is 1, SCL
pin outputs high. When SCLO is 0, SCL pin outputs low.
2
1
Reserved
1
IICRST
0
R/W
IIC Control Part Reset
This bit is always read as 1, and cannot be modified.
This bit resets the control part except for I2C registers. If
this bit is set to 1 when hang-up occurs because of
2
2
communication failure during I C operation, I C control
part can be reset without setting ports and initializing
registers.
0
1
Reserved
This bit is always read as 1, and cannot be modified.
17.3.3
I2C Bus Mode Register (ICMR)
ICMR selects whether the MSB or LSB is transferred first, performs master mode wait control,
and selects the transfer bit count.
Bit
Bit Name
Initial
Value
R/W
Description
7
MLS
0
R/W
MSB-First/LSB-First Select
0: MSB-first
1: LSB-first
Set this bit to 0 when the I2C bus format is used.
6
WAIT
0
R/W
Wait Insertion Bit
In master mode with the I2C bus format, this bit selects
whether to insert a wait after data transfer except the
acknowledge bit. When WAIT is set to 1, after the fall of
the clock for the final data bit, low period is extended for
two transfer clocks. If WAIT is cleared to 0, data and
acknowledge bits are transferred consecutively with no
wait inserted.
2
The setting of this bit is invalid in slave mode with the I C
bus format or with the clocked synchronous serial format.
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Section 17 I C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
Description
5, 4
All 1
Reserved
3
BCWP
1
R/W
These bits are always read as 1, and cannot be modified.
BC Write Protect
This bit controls the BC2 to BC0 modifications. When
modifying BC2 to BC0, this bit should be cleared to 0 and
use the MOV instruction. In clock synchronous serial
mode, BC should not be modified.
0: When writing, values of BC2 to BC0 are set.
1: When reading, 1 is always read.
When writing, settings of BC2 to BC0 are invalid.
2
BC2
0
R/W
Bit Counter 2 to 0
1
BC1
0
R/W
0
BC0
0
R/W
These bits specify the number of bits to be transferred
next. When read, the remaining number of transfer bits is
indicated. With the I2C bus format, the data is transferred
with one addition acknowledge bit. Bit BC2 to BC0
settings should be made during an interval between
transfer frames. If bits BC2 to BC0 are set to a value
other than 000, the setting should be made while the SCL
pin is low. The value returns to 000 at the end of a data
transfer, including the acknowledge bit. With the clock
synchronous serial format, these bits should not be
modified.
2
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I C Bus Format
Clock Synchronous Serial Format
000: 9 bits
000: 8 bits
001: 2 bits
001: 1 bits
010: 3 bits
010: 2 bits
011: 4 bits
011: 3 bits
100: 5 bits
100: 4 bits
101: 6 bits
101: 5 bits
110: 7 bits
110: 6 bits
111: 8 bits
111: 7 bits
2
Section 17 I C Bus Interface 2 (IIC2)
17.3.4
I2C Bus Interrupt Enable Register (ICIER)
ICIER enables or disables interrupt sources and acknowledge bits, sets acknowledge bits to be
transferred, and confirms acknowledge bits to be received.
Bit
Bit Name
Initial
Value
R/W
Description
7
TIE
0
R/W
Transmit Interrupt Enable
When the TDRE bit in ICSR is set to 1, this bit enables or
disables the transmit data empty interrupt (TXI).
0: Transmit data empty interrupt request (TXI) is disabled.
1: Transmit data empty interrupt request (TXI) is enabled.
6
TEIE
0
R/W
Transmit End Interrupt Enable
This bit enables or disables the transmit end interrupt
(TEI) at the rising of the ninth clock while the TDRE bit in
ICSR is 1. TEI can be canceled by clearing the TEND bit
or the TEIE bit to 0.
0: Transmit end interrupt request (TEI) is disabled.
1: Transmit end interrupt request (TEI) is enabled.
5
RIE
0
R/W
Receive Interrupt Enable
This bit enables or disables the receive data full interrupt
request (RXI) and the overrun error interrupt request
(ERI) with the clocked synchronous format, when a
receive data is transferred from ICDRS to ICDRR and the
RDRF bit in ICSR is set to 1. RXI can be canceled by
clearing the RDRF or RIE bit to 0.
0: Receive data full interrupt request (RXI) and overrun
error interrupt request (ERI) with the clocked
synchronous format are disabled.
1: Receive data full interrupt request (RXI) and overrun
error interrupt request (ERI) with the clocked
synchronous format are enabled.
4
NAKIE
0
R/W
NACK Receive Interrupt Enable
This bit enables or disables the NACK receive interrupt
request (NAKI) and the overrun error (setting of the OVE
bit in ICSR) interrupt request (ERI) with the clocked
synchronous format, when the NACKF and AL bits in
ICSR are set to 1. NAKI can be canceled by clearing the
NACKF, OVE, or NAKIE bit to 0.
0: NACK receive interrupt request (NAKI) is disabled.
1: NACK receive interrupt request (NAKI) is enabled.
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Section 17 I C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
Description
3
STIE
0
R/W
Stop Condition Detection Interrupt Enable
0: Stop condition detection interrupt request (STPI) is
disabled.
1: Stop condition detection interrupt request (STPI) is
enabled.
2
ACKE
0
R/W
Acknowledge Bit Judgement Select
0: The value of the receive acknowledge bit is ignored,
and continuous transfer is performed.
1: If the receive acknowledge bit is 1, continuous transfer
is halted.
1
ACKBR
0
R
Receive Acknowledge
In transmit mode, this bit stores the acknowledge data
that are returned by the receive device. This bit cannot be
modified.
0: Receive acknowledge = 0
1: Receive acknowledge = 1
0
ACKBT
0
R/W
Transmit Acknowledge
In receive mode, this bit specifies the bit to be sent at the
acknowledge timing.
0: 0 is sent at the acknowledge timing.
1: 1 is sent at the acknowledge timing.
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Section 17 I C Bus Interface 2 (IIC2)
17.3.5
I2C Bus Status Register (ICSR)
ICSR performs confirmation of interrupt request flags and status.
Bit
Bit Name
Initial
Value
R/W
7
TDRE
0
R/W
Description
Transmit Data Register Empty
[Setting conditions]
•
When data is transferred from ICDRT to ICDRS and
ICDRT becomes empty
•
When TRS is set
•
When a start condition (including re-transfer) has
been issued
•
When transmit mode is entered from receive mode in
slave mode
[Clearing conditions]
6
TEND
0
R/W
•
When 0 is written in TDRE after reading TDRE = 1
•
When data is written to ICDRT with an instruction
Transmit End
[Setting conditions]
•
When the ninth clock of SCL rises with the I C bus
format while the TDRE flag is 1
•
When the final bit of transmit frame is sent with the
clock synchronous serial format
2
[Clearing conditions]
5
RDRF
0
R/W
•
When 0 is written in TEND after reading TEND = 1
•
When data is written to ICDRT with an instruction
Receive Data Register Full
[Setting condition]
•
When a receive data is transferred from ICDRS to
ICDRR
[Clearing conditions]
•
When 0 is written in RDRF after reading RDRF = 1
•
When ICDRR is read with an instruction
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Section 17 I C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
Description
4
NACKF
0
R/W
No Acknowledge Detection Flag
[Setting condition]
•
When no acknowledge is detected from the receive
device in transmission while the ACKE bit in ICIER is
1
[Clearing condition]
•
3
STOP
0
R/W
When 0 is written in NACKF after reading NACKF = 1
Stop Condition Detection Flag
[Setting Conditions]
•
In master mode, when a stop condition is detected
after frame transfer
•
In slave mode, when a stop condition is detected after
the general call address or the first byte slave
address, next to detection of start condition, accords
with the address set in SAR
[Clearing Condition]
•
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2
Section 17 I C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
Description
2
AL/OVE
0
R/W
Arbitration Lost Flag/Overrun Error Flag
This flag indicates that arbitration was lost in master
2
mode with the I C bus format and that the final bit has
been received while RDRF = 1 with the clocked
synchronous format.
When two or more master devices attempt to seize the
2
bus at nearly the same time, if the I C bus interface
detects data differing from the data it sent, it sets AL to 1
to indicate that the bus has been taken by another
master.
[Setting conditions]
•
If the internal SDA and SDA pin disagree at the rise of
SCL in master transmit mode
•
When the SDA pin outputs high in master mode while
a start condition is detected
•
When the final bit is received with the clocked
synchronous format while RDRF = 1
[Clearing condition]
•
1
AAS
0
R/W
When 0 is written in AL/OVE after reading AL/OVE=1
Slave Address Recognition Flag
In slave receive mode, this flag is set to 1 if the first frame
following a start condition matches bits SVA6 to SVA0 in
SAR.
[Setting conditions]
•
When the slave address is detected in slave receive
mode
•
When the general call address is detected in slave
receive mode.
[Clearing condition]
•
When 0 is written in AAS after reading AAS=1
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Section 17 I C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
Description
0
ADZ
0
R/W
General Call Address Recognition Flag
2
This bit is valid in I C bus format slave receive mode.
[Setting condition]
•
When the general call address is detected in slave
receive mode
[Clearing condition]
•
17.3.6
When 0 is written in ADZ after reading ADZ=1
Slave Address Register (SAR)
SAR selects the communication format and sets the slave address. When the chip is in slave mode
with the I2C bus format, if the upper 7 bits of SAR match the upper 7 bits of the first frame
received after a start condition, the chip operates as the slave device.
Initial
Value
R/W
Description
SVA6 to
SVA0
All 0
R/W
Slave Address 6 to 0
FS
0
Bit
Bit Name
7 to 1
0
These bits set a unique address in bits SVA6 to SVA0,
differing form the addresses of other slave devices
2
connected to the I C bus.
R/W
Format Select
2
0: I C bus format is selected.
1: Clocked synchronous serial format is selected.
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Section 17 I C Bus Interface 2 (IIC2)
17.3.7
I2C Bus Transmit Data Register (ICDRT)
ICDRT is an 8-bit readable/writable register that stores the transmit data. When ICDRT detects the
space in the shift register (ICDRS), it transfers the transmit data which is written in ICDRT to
ICDRS and starts transferring data. If the next transfer data is written to ICDRT during
transferring data of ICDRS, continuous transfer is possible. If the MLS bit of ICMR is set to 1
and when the data is written to ICDRT, the MSB/LSB inverted data is read. The initial value of
ICDRT is H’FF.
17.3.8
I2C Bus Receive Data Register (ICDRR)
ICDRR is an 8-bit register that stores the receive data. When data of one byte is received, ICDRR
transfers the receive data from ICDRS to ICDRR and the next data can be received. ICDRR is a
receive-only register, therefore the CPU cannot write to this register. The initial value of ICDRR
is H’FF.
17.3.9
I2C Bus Shift Register (ICDRS)
ICDRS is a register that is used to transfer/receive data. In transmission, data is transferred from
ICDRT to ICDRS and the data is sent from the SDA pin. In reception, data is transferred from
ICDRS to ICDRR after data of one byte is received. This register cannot be read directly from the
CPU.
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Section 17 I C Bus Interface 2 (IIC2)
17.4
Operation
The I2C bus interface can communicate either in I2C bus mode or clocked synchronous serial mode
by setting FS in SAR.
17.4.1
I2C Bus Format
Figure 17.3 shows the I2C bus formats. Figure 17.4 shows the I2C bus timing. The first frame
following a start condition always consists of 8 bits.
(a) I2C bus format (FS = 0)
S
SLA
R/W
A
DATA
A
A/A
P
1
7
1
1
n
1
1
1
1
n: Transfer bit count
(n = 1 to 8)
m: Transfer frame count
(m ≥ 1)
m
(b) I2C bus format (Start condition retransmission, FS = 0)
S
SLA
R/W
A
DATA
A/A
S
SLA
R/W
A
DATA
A/A
P
1
7
1
1
n1
1
1
7
1
1
n2
1
1
1
m1
1
m2
n1 and n2: Transfer bit count (n1 and n2 = 1 to 8)
m1 and m2: Transfer frame count (m1 and m2 ≥ 1)
Figure 17.3 I2C Bus Formats
SDA
SCL
S
1-7
8
9
SLA
R/W
A
1-7
DATA
8
9
A
1-7
DATA
8
9
A
P
Figure 17.4 I2C Bus Timing
Legend
S:
SLA:
Start condition. The master device drives SDA from high to low while SCL is high.
Slave address
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Section 17 I C Bus Interface 2 (IIC2)
R/W:
Indicates the direction of data transfer: from the slave device to the master device when
R/W is 1, or from the master device to the slave device when R/W is 0.
A:
Acknowledge. The receive device drives SDA to low.
DATA: Transfer data
P:
Stop condition. The master device drives SDA from low to high while SCL is high.
17.4.2
Master Transmit Operation
In master transmit mode, the master device outputs the transmit clock and transmit data, and the
slave device returns an acknowledge signal. For master transmit mode operation timing, refer to
figures 17.5 and 17.6. The transmission procedure and operations in master transmit mode are
described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting)
2. Read the BBSY flag in ICCR2 to confirm that the bus is free. Set the MST and TRS bits in
ICCR1 to select master transmit mode. Then, write 1 to BBSY and 0 to SCP using MOV
instruction. (Start condition issued) This generates the start condition.
3. After confirming that TDRE in ICSR has been set, write the transmit data (the first byte data
show the slave address and R/W) to ICDRT. At this time, TDRE is automatically cleared to 0,
and data is transferred from ICDRT to ICDRS. TDRE is set again.
4. When transmission of one byte data is completed while TDRE is 1, TEND in ICSR is set to 1
at the rise of the 9th transmit clock pulse. Read the ACKBR bit in ICIER, and confirm that the
slave device has been selected. Then, write second byte data to ICDRT. When ACKBR is 1,
the slave device has not been acknowledged, so issue the stop condition. To issue the stop
condition, write 0 to BBSY and SCP using MOV instruction. SCL is fixed low until the
transmit data is prepared or the stop condition is issued.
5. The transmit data after the second byte is written to ICDRT every time TDRE is set.
6. Write the number of bytes to be transmitted to ICDRT. Wait until TEND is set (the end of last
byte data transmission) while TDRE is 1, or wait for NACK (NACKF in ICSR = 1) from the
receive device while ACKE in ICIER is 1. Then, issue the stop condition to clear TEND or
NACKF.
7. When the STOP bit in ICSR is set to 1, the operation returns to the slave receive mode.
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Section 17 I C Bus Interface 2 (IIC2)
SCL
(Master output)
1
2
3
4
5
6
SDA
(Master output)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
7
8
Bit 1
Slave address
9
1
Bit 0
Bit 7
2
Bit 6
R/W
SDA
(Slave output)
A
TDRE
TEND
Address + R/W
ICDRT
ICDRS
User
processing
Data 1
Address + R/W
[2] Instruction of start
condition issuance
Data 2
Data 1
[4] Write data to ICDRT (second byte)
[5] Write data to ICDRT (third byte)
[3] Write data to ICDRT (first byte)
Figure 17.5 Master Transmit Mode Operation Timing (1)
SCL
(Master output)
9
SDA
(Master output)
SDA
(Slave output)
1
2
3
4
5
6
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
A
7
Bit 1
8
9
Bit 0
A/A
TDRE
TEND
Data n
ICDRT
ICDRS
Data n
User
[5] Write data to ICDRT
processing
[6] Issue stop condition. Clear TEND.
[7] Set slave receive mode
Figure 17.6 Master Transmit Mode Operation Timing (2)
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Section 17 I C Bus Interface 2 (IIC2)
17.4.3
Master Receive Operation
In master receive mode, the master device outputs the receive clock, receives data from the slave
device, and returns an acknowledge signal. For master receive mode operation timing, refer to
figures 17.7 and 17.8. The reception procedure and operations in master receive mode are shown
below.
1. Clear the TEND bit in ICSR to 0, then clear the TRS bit in ICCR1 to 0 to switch from master
transmit mode to master receive mode. Then, clear the TDRE bit to 0.
2. When ICDRR is read (dummy data read), reception is started, and the receive clock is output,
and data received, in synchronization with the internal clock. The master device outputs the
level specified by ACKBT in ICIER to SDA, at the 9th receive clock pulse.
3. After the reception of first frame data is completed, the RDRF bit in ICST is set to 1 at the rise
of 9th receive clock pulse. At this time, the receive data is read by reading ICDRR, and RDRF
is cleared to 0.
4. The continuous reception is performed by reading ICDRR every time RDRF is set. If 8th
receive clock pulse falls after reading ICDRR by the other processing while RDRF is 1, SCL is
fixed low until ICDRR is read.
5. If next frame is the last receive data, set the RCVD bit in ICCR1 to 1 before reading ICDRR.
This enables the issuance of the stop condition after the next reception.
6. When the RDRF bit is set to 1 at rise of the 9th receive clock pulse, issue the stage condition.
7. When the STOP bit in ICSR is set to 1, read ICDRR. Then clear the RCVD bit to 0.
8. The operation returns to the slave receive mode.
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Section 17 I C Bus Interface 2 (IIC2)
Master transmit mode
SCL
(Master output)
Master receive mode
9
1
2
3
4
5
6
7
8
SDA
(Master output)
9
1
A
SDA
(Slave output)
A
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
TDRE
TEND
TRS
RDRF
ICDRS
Data 1
ICDRR
User
processing
Data 1
[3] Read ICDRR
[1] Clear TDRE after clearing
TEND and TRS
[2] Read ICDRR (dummy read)
Figure 17.7 Master Receive Mode Operation Timing (1)
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Section 17 I C Bus Interface 2 (IIC2)
SCL
(Master output)
9
SDA
(Master output)
A
SDA
(Slave output)
1
2
3
4
5
6
7
8
9
A/A
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RDRF
RCVD
ICDRS
Data n
Data n-1
ICDRR
Data n
Data n-1
User
processing
[5] Read ICDRR after setting RCVD
[7] Read ICDRR,
and clear RCVD
[6] Issue stop
condition [8] Set slave
receive mode
Figure 17.8 Master Receive Mode Operation Timing (2)
17.4.4
Slave Transmit Operation
In slave transmit mode, the slave device outputs the transmit data, while the master device outputs
the receive clock and returns an acknowledge signal. For slave transmit mode operation timing,
refer to figures 17.9 and 17.10.
The transmission procedure and operations in slave transmit mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive
mode, and wait until the slave address matches.
2. When the slave address matches in the first frame following detection of the start condition,
the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th
clock pulse. At this time, if the 8th bit data (R/W) is 1, the TRS and ICSR bits in ICCR1 are
set to 1, and the mode changes to slave transmit mode automatically. The continuous
transmission is performed by writing transmit data to ICDRT every time TDRE is set.
3. If TDRE is set after writing last transmit data to ICDRT, wait until TEND in ICSR is set to 1,
with TDRE = 1. When TEND is set, clear TEND.
4. Clear TRS for the end processing, and read ICDRR (dummy read). SCL is free.
5. Clear TDRE.
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Section 17 I C Bus Interface 2 (IIC2)
Slave receive mode
Slave transmit mode
SCL
(Master output)
9
1
2
3
4
5
6
7
8
9
SDA
(Master output)
1
A
SCL
(Slave output)
SDA
(Slave output)
A
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
TDRE
TEND
TRS
Data 1
ICDRT
ICDRS
Data 2
Data 1
Data 3
Data 2
ICDRR
User
processing
[2] Write data to ICDRT (data 1)
[2] Write data to ICDRT (data 2)
[2] Write data to ICDRT (data 3)
Figure 17.9 Slave Transmit Mode Operation Timing (1)
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Section 17 I C Bus Interface 2 (IIC2)
Slave receive
mode
Slave transmit mode
SCL
(Master output)
9
SDA
(Master output)
A
1
2
3
4
5
6
7
8
9
A
SCL
(Slave output)
SDA
(Slave output)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TDRE
TEND
TRS
ICDRT
ICDRS
Data n
ICDRR
User
processing
[3] Clear TEND
[4] Read ICDRR (dummy read)
after clearing TRS
[5] Clear TDRE
Figure 17.10 Slave Transmit Mode Operation Timing (2)
17.4.5
Slave Receive Operation
In slave receive mode, the master device outputs the transmit clock and transmit data, and the
slave device returns an acknowledge signal. For slave receive mode operation timing, refer to
figures 17.11 and 17.12. The reception procedure and operations in slave receive mode are
described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive
mode, and wait until the slave address matches.
2. When the slave address matches in the first frame following detection of the start condition,
the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th
clock pulse. At the same time, RDRF in ICSR is set to read ICDRR (dummy read). (Since the
read data show the slave address and R/W, it is not used.)
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Section 17 I C Bus Interface 2 (IIC2)
3. Read ICDRR every time RDRF is set. If 8th receive clock pulse falls while RDRF is 1, SCL is
fixed low until ICDRR is read. The change of the acknowledge before reading ICDRR, to be
returned to the master device, is reflected to the next transmit frame.
4. The last byte data is read by reading ICDRR.
SCL
(Master output)
9
SDA
(Master output)
1
2
3
4
5
6
7
8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
9
1
Bit 7
SCL
(Slave output)
SDA
(Slave output)
A
A
RDRF
ICDRS
Data 1
Data 2
ICDRR
User
processing
Data 1
[2] Read ICDRR
[2] Read ICDRR (dummy read)
Figure 17.11 Slave Receive Mode Operation Timing (1)
SCL
(Master output)
9
SDA
(Master output)
1
2
3
4
5
6
7
8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
9
SCL
(Slave output)
SDA
(Slave output)
A
A
RDRF
ICDRS
Data 2
Data 1
ICDRR
Data 1
User
processing
[3] Set ACKBT
[3] Read ICDRR [4] Read ICDRR
Figure 17.12 Slave Receive Mode Operation Timing (2)
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Section 17 I C Bus Interface 2 (IIC2)
17.4.6
Clocked Synchronous Serial Format
This module can be operated with the clocked synchronous serial format, by setting the FS bit in
SAR to 1. When the MST bit in ICCR1 is 1, the transfer clock output from SCL is selected. When
MST is 0, the external clock input is selected.
Data Transfer Format
Figure 17.13 shows the clocked synchronous serial transfer format.
The transfer data is output from the rise to the fall of the SCL clock, and the data at the rising edge
of the SCL clock is guaranteed. The MLS bit in ICMR sets the order of data transfer, in either the
MSB first or LSB first. The output level of SDA can be changed during the transfer wait, by the
SDAO bit in ICCR2.
SCL
SDA
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5 Bit 6
Bit 7
Figure 17.13 Clocked Synchronous Serial Transfer Format
Transmit Operation
In transmit mode, transmit data is output from SDA, in synchronization with the fall of the transfer
clock. The transfer clock is output when MST in ICCR1 is 1, and is input when MST is 0. For
transmit mode operation timing, refer to figure 17.14. The transmission procedure and operations
in transmit mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial
setting)
2. Set the TRS bit in ICCR1 to select the transmit mode. Then, TDRE in ICSR is set.
3. Confirm that TDRE has been set. Then, write the transmit data to ICDRT. The data is
transferred from ICDRT to ICDRS, and TDRE is set automatically. The continuous
transmission is performed by writing data to ICDRT every time TDRE is set. When changing
from transmit mode to receive mode, clear TRS while TDRE is 1.
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Section 17 I C Bus Interface 2 (IIC2)
SCL
1
2
7
8
1
7
8
1
SDA
(Output)
Bit 0
Bit 1
Bit 6
Bit 7
Bit 0
Bit 6
Bit 7
Bit 0
TRS
TDRE
Data 1
ICDRT
Data 1
ICDRS
User
processing
Data 2
[3] Write data [3] Write data
to ICDRT
to ICDRT
[2] Set TRS
Data 3
Data 2
Data 3
[3] Write data
to ICDRT
[3] Write data
to ICDRT
Figure 17.14 Transmit Mode Operation Timing
Receive Operation
In receive mode, data is latched at the rise of the transfer clock. The transfer clock is output when
MST in ICCR1 is 1, and is input when MST is 0. For receive mode operation timing, refer to
figure 17.15. The reception procedure and operations in receive mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial
setting)
2. When the transfer clock is output, set MST to 1 to start outputting the receive clock.
3. When the receive operation is completed, data is transferred from ICDRS to ICDRR and
RDRF in ICSR is set. When MST = 1, the next byte can be received, so the clock is
continually output. The continuous reception is performed by reading ICDRR every time
RDRF is set. When the 8th clock is risen while RDRF is 1, the overrun is detected and
AL/OVE in ICSR is set. At this time, the previous reception data is retained in ICDRR.
4. To stop receiving when MST = 1, set RCVD in ICCR1 to 1, then read ICDRR. Then, SCL is
fixed high after receiving the next byte data.
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Section 17 I C Bus Interface 2 (IIC2)
SCL
1
2
7
8
1
7
8
SDA
(Input)
Bit 0
Bit 1
Bit 6
Bit 7
Bit 0
Bit 6
Bit 7
1
2
Bit 0
MST
TRS
RDRF
Data 2
Data 1
ICDRS
Data 3
Data 1
ICDRR
User
processing
[2] Set MST
(when outputting the clock)
[3] Read ICDRR
Data 2
[3] Read ICDRR
Figure 17.15 Receive Mode Operation Timing
17.4.7
Noise Canceler
The logic levels at the SCL and SDA pins are routed through noise cancelers before being latched
internally. Figure 17.16 shows a block diagram of the noise canceler circuit.
The noise canceler consists of two cascaded latches and a match detector. The SCL (or SDA)
input signal is sampled on the system clock, but is not passed forward to the next circuit unless the
outputs of both latches agree. If they do not agree, the previous value is held.
Sampling clock
C
SCL or SDA
input signal
D
C
Q
Latch
Q
D
Latch
March detector
Internal
SCL or SDA
signal
System clock
period
Sampling
clock
Figure 17.16 Block Diagram of Noise Conceler
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Section 17 I C Bus Interface 2 (IIC2)
17.4.8
Example of Use
Flowcharts in respective modes that use the I2C bus interface are shown in figures 17.17 to 17.20.
Start
Initialize
[1]
Test the status of the SCL and SDA lines.
[2]
Set master transmit mode.
[3]
Issue the start candition.
[2]
[4]
Set the first byte (slave address + R/W) of transmit data.
Write 1 to BBSY
and 0 to SCP.
[3]
[5]
Wait for 1 byte to be transmitted.
Write transmit data
in ICDRT
[4]
[6]
Test the acknowledge transferred from the specified slave device.
[7]
Set the second and subsequent bytes (except for the final byte) of transmit data.
[8]
Wait for ICDRT empty.
[9]
Set the last byte of transmit data.
Read BBSY in ICCR2
[1]
No
BBSY=0 ?
Yes
Set MST and TRS
in ICCR1 to 1.
Read TEND in ICSR
[5]
No
TEND=1 ?
Yes
Read ACKBR in ICIER
[6]
ACKBR=0 ?
[10] Wait for last byte to be transmitted.
No
[11] Clear the TEND flag.
Yes
Transmit
mode?
Yes
No
Write transmit data in ICDRT
Mater receive mode
[7]
[13] Issue the stop condition.
Read TDRE in ICSR
No
[8]
TDRE=1 ?
Yes
No
[12] Clear the STOP flag.
[14] Wait for the creation of stop condition.
[15] Set slave receive mode. Clear TDRE.
Last byte?
[9]
Yes
Write transmit data in ICDRT
Read TEND in ICSR
No
[10]
TEND=1 ?
Yes
Clear TEND in ICSR
[11]
Clear STOP in ICSR
[12]
Write 0 to BBSY
and SCP
[13]
Read STOP in ICSR
[14]
No
STOP=1 ?
Yes
Set MST to 1 and TRS
to 0 in ICCR1
[15]
Clear TDRE in ICSR
End
Figure 17.17 Sample Flowchart for Master Transmit Mode
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Section 17 I C Bus Interface 2 (IIC2)
Mater receive mode
[1]
Clear TEND, select master receive mode, and then clear TDRE.*
[2]
Set acknowledge to the transmit device.*
[3]
Dummy-read ICDDR.*
[4]
Wait for 1 byte to be received
[5]
Check whether it is the (last receive - 1).
[6]
Read the receive data last.
[7]
Set acknowledge of the final byte. Disable continuous reception (RCVD = 1).
[8]
Read the (final byte - 1) of receive data.
[9]
Wait for the last byte to be receive.
Clear TEND in ICSR
Clear TRS in ICCR1 to 0
[1]
Clear TDRE in ICSR
Clear ACKBT in ICIER to 0
[2]
Dummy-read ICDRR
[3]
Read RDRF in ICSR
No
[4]
RDRF=1 ?
Yes
Last receive
- 1?
No
Read ICDRR
Yes
[5]
[10] Clear the STOP flag.
[6]
[11] Issue the stop condition.
[12] Wait for the creation of stop condition.
Set ACKBT in ICIER to 1
[7]
Set RCVD in ICCR1 to 1
Read ICDRR
[13] Read the last byte of receive data.
[14] Clear RCVD.
[8]
[15] Set slave receive mode.
Read RDRF in ICSR
No
RDRF=1 ?
[9]
Yes
Clear STOP in ICSR.
Write 0 to BBSY
and SCP
[10]
[11]
Read STOP in ICSR
No
[12]
STOP=1 ?
Yes
Read ICDRR
[13]
Clear RCVD in ICCR1 to 0
[14]
Clear MST in ICCR1 to 0
[15]
End
Note: Do not activate an interrupt during the execution of steps [1] to [3].
Supplementary explanation: When one byte is received, steps [2] to [6] are
skipped after step [1], before jumping to step [7].
The step [8] is dummy-read in ICDRR.
Figure 17.18 Sample Flowchart for Master Receive Mode
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Section 17 I C Bus Interface 2 (IIC2)
[1] Clear the AAS flag.
Slave transmit mode
Clear AAS in ICSR
[1]
Write transmit data
in ICDRT
[2]
[3] Wait for ICDRT empty.
[4] Set the last byte of transmit data.
Read TDRE in ICSR
[5] Wait for the last byte to be transmitted.
[3]
No
TDRE=1 ?
Yes
Yes
[6] Clear the TEND flag .
[7] Set slave receive mode.
Last
byte?
No
[2] Set transmit data for ICDRT (except for the last data).
[8] Dummy-read ICDRR to release the SCL line.
[4]
[9] Clear the TDRE flag.
Write transmit data
in ICDRT
Read TEND in ICSR
[5]
No
TEND=1 ?
Yes
Clear TEND in ICSR
[6]
Clear TRS in ICCR1 to 0
[7]
Dummy read ICDRR
[8]
Clear TDRE in ICSR
[9]
End
Figure 17.19 Sample Flowchart for Slave Transmit Mode
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Section 17 I C Bus Interface 2 (IIC2)
Slave receive mode
[1] Clear the AAS flag.
Clear AAS in ICSR
[1]
Clear ACKBT in ICIER to 0
[2]
Dummy-read ICDRR
[3]
[2] Set acknowledge to the transmit device.
[3] Dummy-read ICDRR.
[5] Check whether it is the (last receive - 1).
Read RDRF in ICSR
No
[4]
RDRF=1 ?
[6] Read the receive data.
[7] Set acknowledge of the last byte.
Yes
Last receive
- 1?
[4] Wait for 1 byte to be received.
Yes
No
Read ICDRR
[5]
[8] Read the (last byte - 1) of receive data.
[9] Wait the last byte to be received.
[6]
[10] Read for the last byte of receive data.
Set ACKBT in ICIER to 1
[7]
Read ICDRR
[8]
Read RDRF in ICSR
No
[9]
RDRF=1 ?
Yes
Read ICDRR
[10]
End
Supplementary explanation: When one byte is received, steps [2] to [6] are skipped after step [1],
before jumping to step [7]. The step [8] is dummy-read in ICDRR.
Figure 17.20 Sample Flowchart for Slave Receive Mode
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Section 17 I C Bus Interface 2 (IIC2)
17.5
Interrupt Request
There are six interrupt requests in this module; transmit data empty, transmit end, receive data full,
NACK receive, STOP recognition, and arbitration lost/overrun error. Table 17.3 shows the
contents of each interrupt request.
Table 17.3 Interrupt Requests
Interrupt Request
Abbreviation Interrupt Condition
I2C Mode
Clocked
Synchronous Mode
Transmit Data Empty TXI
(TDRE=1) • (TIE=1)
{
{
Transmit End
TEI
(TEND=1) • (TEIE=1)
{
{
Receive Data Full
RXI
(RDRF=1) • (RIE=1)
{
{
STOP Recognition
STPI
(STOP=1) • (STIE=1)
{
×
NACK Receive
NAKI
{(NACKF=1)+(AL=1)} •
(NAKIE=1)
{
×
{
{
Arbitration
Lost/Overrun Error
When interrupt conditions described in table 17.3 are 1 and the I bit in CCR is 0, the CPU
executes an interrupt exception processing. Interrupt sources should be cleared in the exception
processing. TDRE and TEND are automatically cleared to 0 by writing the transmit data to
ICDRT. RDRF are automatically cleared to 0 by reading ICDRR. TDRE is set to 1 again at the
same time when transmit data is written to ICDRT. When TDRE is cleared to 0, then an excessive
data of one byte may be transmitted.
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Section 17 I C Bus Interface 2 (IIC2)
17.6
Bit Synchronous Circuit
In master mode, this module has a possibility that high level period may be short in the two states
described below.
• When SCL is driven to low by the slave device
• When the rising speed of SCL is lowered by the load of the SCL line (load capacitance or pullup resistance)
Therefore, it monitors SCL and communicates by bit with synchronization.
Figure 17.21 shows the timing of the bit synchronous circuit and table 17.4 shows the time when
SCL output changes from low to Hi-Z then SCL is monitored.
SCL monitor
timing reference
clock
VIH
SCL
Internal SCL
Figure 17.21 The Timing of the Bit Synchronous Circuit
Table 17.4 Time for Monitoring SCL
CKS3
CKS2
Time for Monitoring SCL
0
0
7.5 tcyc
1
19.5 tcyc
0
17.5 tcyc
1
41.5 tcyc
1
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Section 17 I C Bus Interface 2 (IIC2)
17.7
Usage Notes
17.7.1
Issue (Retransmission) of Start/Stop Conditions
In master mode, when the start/stop conditions are issued (retransmitted) at the specific timing
under the following condition 1 or 2, such conditions may not be output successfully. To avoid
this, issue (retransmit) the start/stop conditions after the fall of the ninth clock is confirmed. Check
the SCLO bit in the I2C control register 2 (IICR2) to confirm the fall of the ninth clock.
1. When the rising of SCL falls behind the time specified in section 17.6, Bit Synchronous
Circuit, by the load of the SCL bus (load capacitance or pull-up resistance)
2. When the bit synchronous circuit is activated by extending the low period of eighth and ninth
clocks, that is driven by the slave device
17.7.2
WAIT Setting in I2C Bus Mode Register (ICMR)
If the WAIT bit is set to 1, and the SCL signal is driven low for two or more transfer clocks by the
slave device at the eighth and ninth clocks, the high period of ninth clock may be shortened. To
avoid this, set the WAIT bit in ICMR to 0.
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Section 18 A/D Converter
Section 18 A/D Converter
This LSI includes a successive approximation type 10-bit A/D converter that allows up to eight
analog input channels to be selected. The block diagram of the A/D converter is shown in figure
18.1.
18.1
•
•
•
•
•
•
•
•
Features
10-bit resolution
Eight input channels
Conversion time: at least 3.5 µs per channel (at 20-MHz operation)
Two operating modes
Single mode: Single-channel A/D conversion
Scan mode: Continuous A/D conversion on 1 to 4 channels
Four data registers
Conversion results are held in a data register for each channel
Sample-and-hold function
Two conversion start methods
Software
External trigger signal
Interrupt request
An A/D conversion end interrupt request (ADI) can be generated
ADCMS32A_000020020200
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Section 18 A/D Converter
Module data bus
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
Analog multiplexer
10-bit D/A
Bus interface
Successive approximations
register
AVCC
Internal data bus
A
D
D
R
A
A
D
D
R
B
A
D
D
R
C
A
D
D
R
D
A
D
C
S
R
A
D
C
R
+
φ/4
Control circuit
Comparator
Sample-andhold circuit
ADTRG
[Legend]
ADCR:
ADCSR:
ADDRA:
ADDRB:
ADDRC:
ADDRD:
A/D control register
A/D control/status register
A/D data register A
A/D data register B
A/D data register C
A/D data register D
Figure 18.1 Block Diagram of A/D Converter
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φ/8
ADI
interrupt
Section 18 A/D Converter
18.2
Input/Output Pins
Table 18.1 summarizes the input pins used by the A/D converter. The 8 analog input pins are
divided into two groups; analog input pins 0 to 3 (AN0 to AN3) comprising group 0, analog input
pins 4 to 7 (AN4 to AN7) comprising group 1. The AVcc pin is the power supply pin for the
analog block in the A/D converter.
Table 18.1 Pin Configuration
Pin Name
Abbreviation
I/O
Function
Analog power supply pin
AVCC
Input
Analog block power supply
Analog input pin 0
AN0
Input
Group 0 analog input
Analog input pin 1
AN1
Input
Analog input pin 2
AN2
Input
Analog input pin 3
AN3
Input
Analog input pin 4
AN4
Input
Analog input pin 5
AN5
Input
Analog input pin 6
AN6
Input
Analog input pin 7
AN7
Input
A/D external trigger input pin
ADTRG
Input
Group 1 analog input
External trigger input for starting
A/D conversion
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Section 18 A/D Converter
18.3
Register Descriptions
The A/D converter has the following registers.
•
•
•
•
•
•
A/D data register A (ADDRA)
A/D data register B (ADDRB)
A/D data register C (ADDRC)
A/D data register D (ADDRD)
A/D control/status register (ADCSR)
A/D control register (ADCR)
18.3.1
A/D Data Registers A to D (ADDRA to ADDRD)
There are four 16-bit read-only ADDR registers; ADDRA to ADDRD, used to store the results of
A/D conversion. The ADDR registers, which store a conversion result for each analog input
channel, are shown in table 18.2.
The converted 10-bit data is stored in bits 15 to 6. The lower 6 bits are always read as 0.
The data bus width between the CPU and the A/D converter is 8 bits. The upper byte can be read
directly from the CPU, however the lower byte should be read via a temporary register. The
temporary register contents are transferred from the ADDR when the upper byte data is read.
Therefore byte access to ADDR should be done by reading the upper byte first then the lower one.
Word access is also possible. ADDR is initialized to H'0000.
Table 18.2 Analog Input Channels and Corresponding ADDR Registers
Analog Input Channel
Group 0
Group 1
A/D Data Register to Be Stored Results of A/D Conversion
AN0
AN4
ADDRA
AN1
AN5
ADDRB
AN2
AN6
ADDRC
AN3
AN7
ADDRD
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Section 18 A/D Converter
18.3.2
A/D Control/Status Register (ADCSR)
ADCSR consists of the control bits and conversion end status bits of the A/D converter.
Bit
Bit Name
Initial
Value
R/W
Description
7
ADF
0
R/W
A/D End Flag
[Setting conditions]
•
When A/D conversion ends in single mode
•
When A/D conversion ends once on all the channels
selected in scan mode
[Clearing condition]
•
6
ADIE
0
R/W
When 0 is written after reading ADF = 1
A/D Interrupt Enable
A/D conversion end interrupt request (ADI) is enabled by
ADF when this bit is set to 1
5
ADST
0
R/W
A/D Start
Setting this bit to 1 starts A/D conversion. In single mode,
this bit is cleared to 0 automatically when conversion on
the specified channel is complete. In scan mode,
conversion continues sequentially on the specified
channels until this bit is cleared to 0 by software, a reset,
or a transition to standby mode.
4
SCAN
0
R/W
Scan Mode
Selects single mode or scan mode as the A/D conversion
operating mode.
0: Single mode
1: Scan mode
3
CKS
0
R/W
Clock Select
Selects the A/D conversions time.
0: Conversion time = 134 states (max.)
1: Conversion time = 70 states (max.)
Clear the ADST bit to 0 before switching the conversion
time.
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Section 18 A/D Converter
Bit
Bit Name
Initial
Value
R/W
Description
2
CH2
0
R/W
Channel Select 2 to 0
1
CH1
0
R/W
Select analog input channels.
0
CH0
0
R/W
When SCAN = 0
When SCAN = 1
000: AN0
000: AN0
001: AN1
001: AN0 and AN1
010: AN2
010: AN0 to AN2
011: AN3
011: AN0 to AN3
100: AN4
100: AN4
101: AN5
101: AN4 and AN5
110: AN6
110: AN4 to AN6
111: AN7
111: AN4 to AN7
18.3.3
A/D Control Register (ADCR)
ADCR enables A/D conversion started by an external trigger signal.
Bit
Bit Name
Initial
Value
R/W
Description
7
TRGE
0
R/W
Trigger Enable
A/D conversion is started at the falling edge and the rising
edge of the external trigger signal (ADTRG) when this bit
is set to 1.
The selection between the falling edge and rising edge of
the external trigger pin (ADTRG) conforms to the WPEG5
bit in the interrupt edge select register 2 (IEGR2)
6 to 1
—
All 1
—
Reserved
These bits are always read as 1.
0
—
0
R/W
Reserved
Do not set this bit to 1, though the bit is readable/writable.
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Section 18 A/D Converter
18.4
Operation
The A/D converter operates by successive approximation with 10-bit resolution. It has two
operating modes; single mode and scan mode. When changing the operating mode or analog input
channel, in order to prevent incorrect operation, first clear the bit ADST in ADCSR to 0. The
ADST bit can be set at the same time as the operating mode or analog input channel is changed.
18.4.1
Single Mode
In single mode, A/D conversion is performed once for the analog input of the specified single
channel as follows:
1. A/D conversion is started when the ADST bit in ADCSR is set to 1, according to software or
external trigger input.
2. When A/D conversion is completed, the result is transferred to the corresponding A/D data
register of the channel.
3. On completion of conversion, the ADF bit in ADCSR is set to 1. If the ADIE bit is set to 1 at
this time, an ADI interrupt request is generated.
4. The ADST bit remains set to 1 during A/D conversion. When A/D conversion ends, the ADST
bit is automatically cleared to 0 and the A/D converter enters the wait state.
18.4.2
Scan Mode
In scan mode, A/D conversion is performed sequentially for the analog input of the specified
channels (four channels maximum) as follows:
1. When the ADST bit in ADCSR is set to 1 by software or external trigger input, A/D
conversion starts on the first channel in the group (AN0 when CH2 = 0, AN4 when CH2 = 1).
2. When A/D conversion for each channel is completed, the result is sequentially transferred to
the A/D data register corresponding to each channel.
3. When conversion of all the selected channels is completed, the ADF flag in ADCSR is set to 1.
If the ADIE bit is set to 1 at this time, an ADI interrupt requested is generated. A/D conversion
starts again on the first channel in the group.
4. The ADST bit is not automatically cleared to 0. Steps [2] and [3] are repeated as long as the
ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D conversion stops.
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Section 18 A/D Converter
18.4.3
Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog
input when the A/D conversion start delay time (tD) has passed after the ADST bit is set to 1, then
starts conversion. Figure 18.2 shows the A/D conversion timing. Table 18.3 shows the A/D
conversion time.
As indicated in figure 18.2, the A/D conversion time includes tD and the input sampling time. The
length of tD varies depending on the timing of the write access to ADCSR. The total conversion
time therefore varies within the ranges indicated in table 18.3.
In scan mode, the values given in table 18.3 apply to the first conversion time. In the second and
subsequent conversions, the conversion time is 128 states (fixed) when CKS = 0 and 66 states
(fixed) when CKS = 1.
(1)
φ
Address
(2)
Write signal
Input sampling
timing
ADF
tD
tSPL
tCONV
[Legend]
ADCSR write cycle
(1) :
ADCSR address
(2) :
A/D conversion start delay time
tD :
tSPL : Input sampling time
tCONV : A/D conversion time
Figure 18.2 A/D Conversion Timing
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Section 18 A/D Converter
Table 18.3 A/D Conversion Time (Single Mode)
CKS = 0
Item
Symbol
Min
A/D conversion start delay time
tD
Input sampling time
tSPL
A/D conversion time
tCONV
CKS = 1
Typ
Max
Min
Typ
Max
6
—
9
—
31
—
4
—
5
—
15
—
131
—
134
69
—
70
Note: All values represent the number of states.
18.4.4
External Trigger Input Timing
A/D conversion can also be started by an external trigger input. When the TRGE bit in ADCR is
set to 1, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG input
pin sets the ADST bit in ADCSR to 1, starting A/D conversion. Other operations, in both single
and scan modes, are the same as when the bit ADST has been set to 1 by software. Figure 18.3
shows the timing.
φ
ADTRG
Internal trigger signal
ADST
A/D conversion
Figure 18.3 External Trigger Input Timing
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Section 18 A/D Converter
18.5
A/D Conversion Accuracy Definitions
This LSI's A/D conversion accuracy definitions are given below.
• Resolution
The number of A/D converter digital output codes
• Quantization error
The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 18.4).
• Offset error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from the minimum voltage value 0000000000 to 0000000001
(see figure 18.5).
• Full-scale error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from 1111111110 to 1111111111 (see figure 18.5).
• Nonlinearity error
The deviation from the ideal A/D conversion characteristic as the voltage changes from zero to
full scale. This does not include the offset error, full-scale error, or quantization error.
• Absolute accuracy
The deviation between the digital value and the analog input value. Includes offset error, fullscale error, quantization error, and nonlinearity error.
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Section 18 A/D Converter
Digital output
Ideal A/D conversion
characteristic
111
110
101
100
011
010
Quantization error
001
000
1
8
2
8
3
8
4
8
5
8
6
8
7 FS
8
Analog
input voltage
Figure 18.4 A/D Conversion Accuracy Definitions (1)
Full-scale error
Digital output
Ideal A/D conversion
characteristic
Nonlinearity
error
Actual A/D conversion
characteristic
Offset error
FS
Analog
input voltage
Figure 18.5 A/D Conversion Accuracy Definitions (2)
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Section 18 A/D Converter
18.6
Usage Notes
18.6.1
Permissible Signal Source Impedance
This LSI's analog input is designed such that conversion accuracy is guaranteed for an input signal
for which the signal source impedance is 5 kΩ or less. This specification is provided to enable the
A/D converter's sample-and-hold circuit input capacitance to be charged within the sampling time;
if the sensor output impedance exceeds 5 kΩ, charging may be insufficient and it may not be
possible to guarantee A/D conversion accuracy. However, for A/D conversion in single mode with
a large capacitance provided externally, the input load will essentially comprise only the internal
input resistance of 10 kΩ, and the signal source impedance is ignored. However, as a low-pass
filter effect is obtained in this case, it may not be possible to follow an analog signal with a large
differential coefficient (e.g., 5 mV/µs or greater) (see figure 18.6). When converting a high-speed
analog signal or converting in scan mode, a low-impedance buffer should be inserted.
18.6.2
Influences on Absolute Accuracy
Adding capacitance results in coupling with GND, and therefore noise in GND may adversely
affect absolute accuracy. Be sure to make the connection to an electrically stable GND.
Care is also required to ensure that filter circuits do not interfere with digital signals or act as
antennas on the mounting board.
This LSI
Sensor output
impedance
up to 5 kΩ
A/D converter
equivalent circuit
10 kΩ
Sensor input
Low-pass
filter
C to 0.1 µF
Cin =
15 pF
Figure 18.6 Analog Input Circuit Example
Rev.5.00 Nov. 02, 2005 Page 348 of 500
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20 pF
Section 19 EEPROM
Section 19 EEPROM
The H8/3687N has an on-chip 512-byte EEPROM. The block diagram of the EEPROM is shown
in figure 19.1.
19.1
Features
• Two writing methods:
1-byte write
Page write: Page size 8 bytes
• Three reading methods:
Current address read
Random address read
Sequential read
• Acknowledge polling possible
• Write cycle time:
10 ms (power supply voltage Vcc = 2.7 V or more)
• Write/Erase endurance:
104 cycles/byte (byte write mode), 105 cycles/page (page write mode)
• Data retention:
10 years after the write cycle of 104 cycles (page write mode)
• Interface with the CPU
I2C bus interface (complies with the standard of Philips Corporation)
Device code 1010
Sleep address code can be changed (initial value: 000)
The I2C bus is open to the outside, so the EEPROM can be directly accessed from the outside.
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Section 19 EEPROM
EEPROM Data bus
Y decoder
H'FF10
SDA
SCL
I2C bus interface
control circuit
Y-select/
Sense amp.
Memory
array
User area
(512 bytes)
X decoder
Key control circuit
Address bus
EEPROM Key
register (EKR)
Slave address
register
ESAR
Power-on reset
Booster circuit
EEPROM module
[Legend]
ESAR: Register for referring the slave address
(specifies the slave address of the memory array)
Figure 19.1 Block Diagram of EEPROM
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H'0000
H'01FF
H'FF09
Section 19 EEPROM
19.2
Input/Output Pins
Pins used in the EEPROM are listed in table 19.1.
Table 19.1 Pin Configuration
Pin name
Symbol
Input/Output Function
Serial clock pin
SCL
Input
The SCL pin is used to control serial input/output data
timing. The data is input at the rising edge of the
clock and output at the falling edge of the clock. The
SCL pin needs to be pulled up by resistor as that pin
2
is open-drain driven structure of the I C pin. Use
proper resistor value for your system by considering
VOL, IOL, and the CIN pin capacitance in section 23.2.2,
DC Characteristics and in section 23.2.3, AC
Characteristics. Maximum clock frequency is 400
kHz.
Serial data pin
SDA
Input/Output
The SDA pin is bidirectional for serial data transfer.
The SDA pin needs to be pulled up by resistor as that
pin is open-drain driven structure. Use proper resistor
value for your system by considering VOL, IOL, and the
CIN pin capacitance in section 23.2.2, DC
Characteristics and in section 23.2.3, AC
Characteristics. Except for a start condition and a
stop condition which will be discussed later, the highto-low and low-to-high change of SDA input should be
done during SCL low periods.
19.3
Register Description
The EEPROM has a following register.
• EEPROM key register (EKR)
19.3.1
EEPROM Key Register (EKR)
EKR is an 8-bit readable/writable register, which changes the slave address code written in the
EEPROM. The slave address code is changed by writing H'5F in EKR and then writing either of
H'00 to H'07 as an address code to the H'FF09 address in the EEPROM by the byte write method.
EKR is initialized to H'FF.
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Section 19 EEPROM
19.4
Operation
19.4.1
EEPROM Interface
The HD64N3687G has a multi-chip structure with two internal chips of the HD64F3687G (FZTAT™ version) and 512-byte EEPROM. The HD6483687G has a multi-chip structure with two
internal chips of the HD6433687G (mask-ROM version) and 512-byte EEPROM.
The EEPROM interface is the I2C bus interface. This I2C bus is open to the outside, so the
communication with the external devices connected to the I2C bus can be made.
19.4.2
Bus Format and Timing
The I2C bus format and the I2C bus timing follow section 17.4.1, I2C Bus Format. The bus formats
specific for the EEPROM are the following two.
1. The EEPROM address is configured of two bytes, the write data is transferred in the order of
upper address and lower address from each MSB side.
2. The write data is transmitted from the MSB side.
The bus format and bus timing of the EEPROM are shown in figure 19.2.
Stop
conditon
Start
condition
Slave address
SCL
1
2
3
4
5
R/W ACK
6
7
8
SDA
9
Upper memory
lower memory
ACK
ACK
address
address
1
8
A15
A8
9
1
8
A7
A0
9
Data
Data
ACK
1
8
D7
D0
9
ACK
1
8
D7
D0
9
[Legend]
R/W: R/W code (0 is for a write and 1 is for a read),
ACK: acknowledge
Figure 19.2 EEPROM Bus Format and Bus Timing
19.4.3
Start Condition
A high-to-low transition of the SDA input with the SCL input high is needed to generate the start
condition for starting read, write operation.
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Section 19 EEPROM
19.4.4
Stop Condition
A low-to-high transition of the SDA input with the SCL input high is needed to generate the stop
condition for stopping read, write operation.
The standby operation starts after a read sequence by a stop condition. In the case of write
operation, a stop condition terminates the write data inputs and place the device in an internallytimed write cycle to the memories. After the internally-timed write cycle (tWC) which is specified
as tWC, the device enters a standby mode.
19.4.5
Acknowledge
All address data and serial data such as read data and write data are transmitted to and from in 8bit unit. The acknowledgement is the signal that indicates that this 8-bit data is normally
transmitted to and from.
In the write operation, EEPROM sends "0" to acknowledge in the ninth cycle after receiving the
data. In the read operation, EEPROM sends a read data following the acknowledgement after
receiving the data. After sending read data, the EEPROM enters the bus open state. If the
EEPROM receives "0" as an acknowledgement, it sends read data of the next address. If the
EEPROM does not receive acknowledgement "0" and receives a following stop condition, it stops
the read operation and enters a standby mode. If the EEPROM receives neither acknowledgement
"0" nor a stop condition, the EEPROM keeps bus open without sending read data.
19.4.6
Slave Addressing
The EEPROM device receives a 7-bit slave address and a 1-bit R/W code following the generation
of the start conditions. The EEPROM enables the chip for a read or a write operation with this
operation.
The slave address consists of a former 4-bit device code and latter 3-bit slave address as shown in
table 19.2. The device code is used to distinguish device type and this LSI uses "1010" fixed code
in the same manner as in a general-purpose EEPROM. The slave address code selects one device
out of all devices with device code 1010 (8 devices in maximum) which are connected to the I2C
bus. This means that the device is selected if the inputted slave address code received in the order
of A2, A1, A0 is equal to the corresponding slave address reference register (ESAR).
The slave address code is stored in the address H'FF09 in the EEPROM. It is transferred to ESAR
from the slave address register in the memory array during 10 ms after the reset is released. An
access to the EEPROM is not allowed during transfer.
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Section 19 EEPROM
The initial value of the slave address code written in the EEPROM is H'00. It can be written in the
range of H'00 to H'07. Be sure to write the data by the byte write method.
The next one bit of the slave address is the R/W code. 0 is for a write and 1 is for a read.
The EEPROM turns to a standby state if the device code is not "1010" or slave address code
doesn’t coincide.
Table 19.2 Slave Addresses
Bit
Bit name
Initial Value Setting Value Remarks
7
Device code D3
1
6
Device code D2
0
5
Device code D1
1
4
Device code D0
0
3
Slave address code A2
0
A2
The initial value can be changed
2
Slave address code A1
0
A1
The initial value can be changed
1
Slave address code A0
0
A0
The initial value can be changed
19.4.7
Write Operations
There are two types write operations; byte write operation and page write operation. To initiate
the write operation, input 0 to R/W code following the slave address.
1. Byte Write
A write operation requires an 8-bit data of a 7-bit slave address with R/W code = "0". Then
the EEPROM sends acknowledgement "0" at the ninth bit. This enters the write mode. Then,
two bytes of the memory address are received from the MSB side in the order of upper and
lower. Upon receipt of one-byte memory address, the EEPROM sends acknowledgement "0"
and receives a following a one-byte write data. After receipt of write data, the EEPROM sends
acknowledgement "0". If the EEPROM receives a stop condition, the EEPROM enters an
internally controlled write cycle and terminates receipt of SCL and SDA inputs until
completion of the write cycle. The EEPROM returns to a standby mode after completion of
the write cycle.
The byte write operation is shown in figure 19.3.
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Section 19 EEPROM
SCL
1
2
3
4
5
6
7
8
9
SDA
R/W ACK
Slave address
1
8
A15
A8
Upper memory
address
9
ACK
1
8
A7
A0
lower memory
address
9
ACK
1
8
D7
D0
Write Data
9
ACK
Stop
conditon
Start
condition
[Legend]
R/W: R/W code (0 is for a write and 1 is for a read)
ACK: acknowledge
Figure 19.3 Byte Write Operation
2. Page Write
This LSI is capable of the page write operation which allows any number of bytes up to 8 bytes
to be written in a single write cycle. The write data is input in the same sequence as the byte
write in the order of a start condition, slave address + R/W code, memory address (n), and
write data (Dn) with every ninth bit acknowledgement "0" output. The EEPROM enters the
page write operation if the EEPROM receives more write data (Dn+1) is input instead of
receiving a stop condition after receiving the write data (Dn). LSB 3 bits (A2 to A0) in the
EEPROM address are automatically incremented to be the (n+1) address upon receiving write
data (Dn+1). Thus the write data can be received sequentially.
Addresses in the page are incremented at each receipt of the write data and the write data can
be input up to 8 bytes. If the LSB 3 bits (A2 to A0) in the EEPROM address reach the last
address of the page, the address will roll over to the first address of the same page. When the
address is rolled over, write data is received twice or more to the same address, however, the
last received data is valid. At the receipt of the stop condition, write data reception is
terminated and the write operation is entered.
The page write operation is shown in figure 19.4.
Rev.5.00 Nov. 02, 2005 Page 355 of 500
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Section 19 EEPROM
SCL
1
2
3
4
5
6
7
8
9
SDA
Slave address
R/W ACK
1
8
A15
A8
9
1
8
A7
A0
9
1
8
D7
D0
Upper memory
lower memory
ACK
ACK Write Data
address
address
9
D7
ACK
D0
Write Data ACK
Stop
conditon
Start
condition
[Legend]
R/W: R/W code (0 is for a write and 1 is for a read),
ACK: acknowledge
Figure 19.4 Page Write Operation
19.4.8
Acknowledge Polling
Acknowledge polling feature is used to show if the EEPROM is in an internally-timed write cycle
or not. This feature is initiated by the input of the 8-bit slave address + R/W code following the
start condition during an internally-timed write cycle. Acknowledge polling will operate R/W
code = "0". The ninth acknowledgement judges if the EEPROM is an internally-timed write cycle
or not. Acknowledgement "1" shows the EEPROM is in a internally-timed write cycle and
acknowledgement "0" shows the internally-timed write cycle has been completed. The
acknowledge polling starts to function after a write data is input, i.e., when the stop condition is
input.
19.4.9
Read Operation
There are three read operations; current address read, random address read, and sequential read.
Read operations are initiated in the same way as write operations with the exception of R/W = 1.
1. Current Address Read
The internal address counter maintains the (n+1) address that is made by the last address (n)
accessed during the last read or write operation, with incremented by one. Current address
read accesses the (n+1) address kept by the internal address counter.
After receiving in the order of a start condition and the slave address + R/W code (R/W = 1),
the EEPROM outputs the 1-byte data of the (n+1) address from the most significant bit
following acknowledgement "0". If the EEPROM receives in the order of acknowledgement
"1" and a following stop condition, the EEPROM stops the read operation and is turned to a
standby state.
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Section 19 EEPROM
In case the EEPROM has accessed the last address H'01FF at previous read operation, the
current address will roll over and returns to zero address. In case the EEPROM has accessed
the last address of the page at previous write operation, the current address will roll over within
page addressing and returns to the first address in the same page.
The current address is valid while power is on. The current address after power on will be
undefined. After power is turned on, define the address by the random address read operation
described below is necessary.
The current address read operation is shown in figure 19.5.
SCL
1
2
3
4
5
6
7
8
9
SDA
Slave address
R/W ACK
1
8
D7
D0
Read Data
9
ACK
Stop
conditon
Start
condition
[Legend]
R/W: R/W code (0 is for a write and 1 is for a read)
ACK: acknowledge
Figure 19.5 Current Address Read Operation
2. Random Address Read
This is a read operation with defined read address. A random address read requires a dummy
write to set read address. The EEPROM receives a start condition, slave address + R/W code
(R/W = 0), memory address (upper) and memory address (lower) sequentially. The EEPROM
outputs acknowledgement "0" after receiving memory address (lower) then enters a current
address read with receiving a start condition again. The EEPROM outputs the read data of the
address which was defined in the dummy write operation. After receiving acknowledgement
"1" and a following stop condition, the EEPROM stops the random read operation and returns
to a standby state.
The random address read operation is shown in figure 19.6.
Rev.5.00 Nov. 02, 2005 Page 357 of 500
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Section 19 EEPROM
SCL
1
2
3
4
5
6
7
8
9
SDA
Slave address
R/W ACK
1
8
A15
A8
9
1
8
A7
A0
9
1
Upper memory
lower memory
ACK
ACK
address
address
Start
condition
2
3
4
5
6
7
8
Slave address
9
R ACK
1
8
D7
D0
9
Read Data ACK
Start
condition
Stop
conditon
[Legend]
R/W: R/W code (0 is for a write and 1 is for a read),
ACK: acknowledge
Figure 19.6 Random Address Read Operation
3. Sequential Read
This is a mode to read the data sequentially. Data is sequential read by either a current address
read or a random address read. If the EEPROM receives acknowledgement "0" after 1-byte
read data is output, the read address is incremented and the next 1-byte read data are coming
out. Data is output sequentially by incrementing addresses as long as the EEPROM receives
acknowledgement "0" after the data is output. The address will roll over and returns address
zero if it reaches the last address H'01FF. The sequential read can be continued after roll over.
The sequential read is terminated if the EEPROM receives acknowledgement "1" and a
following stop condition as the same manner as in the random address read.
The condition of a sequential read when the current address read is used is shown in figure
19.7.
SCL
1
2
3
4
5
6
7
8
9
SDA
Slave address
R/W ACK
1
8
D7
D0
9
Read Data ACK
· · · ·
1
8
D7
D0
Read Data
9
ACK
Start
condition
[Legend]
R/W: R/W code (0 is for a write and 1 is for a read)
ACK: acknowledge
Figure 19.7 Sequential Read Operation (when current address read is used)
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Stop
conditon
Section 19 EEPROM
19.5
Usage Notes
19.5.1
Data Protection at VCC On/Off
When VCC is turned on or off, the data might be destroyed by malfunction. Be careful of the
notices described below to prevent the data to be destroyed.
1. SCL and SDA should be fixed to VCC or VSS during VCC on/off.
2. VCC should be turned off after the EEPROM is placed in a standby state.
3. When VCC is turned on from the intermediate level, malfunction is caused, so VCC should be
turned on from the ground level (VSS).
4. VCC turn on speed should be longer than 10 us.
19.5.2
Write/Erase Endurance
The endurance is 105 cycles/page (1% cumulative failure rate) in case of page programming and
104 cycles/byte in case of byte programming. The data retention time is more than 10 years when a
device is page-programmed less than 104 cycles.
19.5.3
Noise Suppression Time
This EEPROM has a noise suppression function at SCL and SDA inputs, that cuts noise of width
less than 50 ns. Be careful not to allow noise of width more than 50 ns because the noise of with
more than 50 ms is recognized as an active pulse.
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Section 19 EEPROM
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Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
Section 20 Power-On Reset and Low-Voltage Detection
Circuits (Optional)
This LSI can include a power-on reset circuit and low-voltage detection circuit as optional circuits.
The low-voltage detection circuit consists of two circuits: LVDI (interrupt by low voltage detect)
and LVDR (reset by low voltage detect) circuits.
This circuit is used to prevent abnormal operation (runaway execution) from occurring due to the
power supply voltage fall and to recreate the state before the power supply voltage fall when the
power supply voltage rises again.
Even if the power supply voltage falls, the unstable state when the power supply voltage falls
below the guaranteed operating voltage can be removed by entering standby mode when
exceeding the guaranteed operating voltage and during normal operation. Thus, system stability
can be improved. If the power supply voltage falls more, the reset state is automatically entered. If
the power supply voltage rises again, the reset state is held for a specified period, then active mode
is automatically entered.
Figure 20.1 is a block diagram of the power-on reset circuit and the low-voltage detection circuit.
20.1
Features
• Power-on reset circuit
Uses an external capacitor to generate an internal reset signal when power is first supplied.
• Low-voltage detection circuit
LVDR: Monitors the power-supply voltage, and generates an internal reset signal when the
voltage falls below a specified value.
LVDI: Monitors the power-supply voltage, and generates an interrupt when the voltage falls
below or rises above respective specified values.
Two pairs of detection levels for reset generation voltage are available: when only the LVDR
circuit is used, or when the LVDI and LVDR circuits are both used.
LVI0000A_000020030300
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Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
φ
CK
R
OVF
PSS
R
RES
Internal reset
signal
Q
Noise canceler
S
CRES
Power-on reset circuit
Noise canceler
Ladder
resistor
Vcc
Internal data bus
LVDCR
Vreset
+
−
Vint
LVDRES
+
−
LVDINT
Interrupt
control
circuit
LVDSR
Reference
voltage
generator
Interrupt
request
Low-voltage detection circuit
[Legend]
PSS:
LVDCR:
LVDSR:
LVDRES:
LVDINT:
Vreset:
Vint:
Prescaler S
Low-voltage-detection control register
Low-voltage-detection status register
Low-voltage-detection reset signal
Low-voltage-detection interrupt signal
Reset detection voltage
Power-supply fall/rise detection voltage
Figure 20.1 Block Diagram of Power-On Reset Circuit and Low-Voltage Detection Circuit
20.2
Register Descriptions
The low-voltage detection circuit has the following registers.
• Low-voltage-detection control register (LVDCR)
• Low-voltage-detection status register (LVDSR)
20.2.1
Low-Voltage-Detection Control Register (LVDCR)
LVDCR is used to enable or disable the low-voltage detection circuit, set the detection levels for
the LVDR function, enable or disable the LVDR function, and enable or disable generation of an
interrupt when the power-supply voltage rises above or falls below the respective levels.
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Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
Table 20.1 shows the relationship between the LVDCR settings and select functions. LVDCR
should be set according to table 20.1.
Bit
Bit Name
Initial
Value
R/W
Description
7
LVDE
0*
R/W
LVD Enable
0: The low-voltage detection circuit is not used (In
standby mode)
1: The low-voltage detection circuit is used
6 to 4
All 1
Reserved
These bits are always read as 1, and cannot be modified.
3
LVDSEL
0*
R/W
LVDR Detection Level Select
0: Reset detection voltage is 2.3 V (typ.)
1: Reset detection voltage is 3.6 V (typ.)
When the falling or rising voltage detection interrupt is
used, reset detection voltage of 2.3 V (typ.) should be
used. When only a reset detection interrupt is used, reset
detection voltage of 3.6 V (typ.) should be used.
2
LVDRE
0*
R/W
LVDR Enable
0: Disables the LVDR function
1: Enables the LVDR function
1
LVDDE
0
R/W
Voltage-Fall-Interrupt Enable
0: Interrupt on the power-supply voltage falling below the
selected detection level disabled
1: Interrupt on the power-supply voltage falling below the
selected detection level enabled
0
LVDUE
0
R/W
Voltage-Rise-Interrupt Enable
0: Interrupt on the power-supply voltage rising above the
selected detection level disabled
1: Interrupt on the power-supply voltage rising above the
selected detection level enabled
Note:
*
Not initialized by LVDR but initialized by a power-on reset or WDT reset.
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Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
Table 20.1 LVDCR Settings and Select Functions
LVDCR Settings
Select Functions
LVDE
LVDSEL
LVDRE
LVDDE
LVDUE
Power-On
Reset
LVDR
Low-VoltageDetection
Falling
Interrupt
0
*
*
*
*
O
1
1
1
0
0
O
O
1
0
0
1
0
O
O
1
0
0
1
1
O
O
O
1
0
1
1
1
O
O
O
O
Legend:
*: means invalid.
20.2.2
Low-Voltage-Detection Status Register (LVDSR)
Low-VoltageDetection
Rising
Interrupt
LVDSR indicates whether the power-supply voltage falls below or rises above the respective
specified values.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 2
All 1
Reserved
These bits are always read as 1, and cannot be modified.
1
LVDDF
0*
R/W
LVD Power-Supply Voltage Fall Flag
[Setting condition]
When the power-supply voltage falls below Vint (D) (typ.
= 3.7 V)
[Clearing condition]
Writing 0 to this bit after reading it as 1
0
LVDUF
0*
R/W
LVD Power-Supply Voltage Rise Flag
[Setting condition]
When the power supply voltage falls below Vint (D) while
the LVDUE bit in LVDCR is set to 1, then rises above Vint
(U) (typ. = 4.0 V) before falling below Vreset1 (typ. = 2.3
V)
[Clearing condition]
Writing 0 to this bit after reading it as 1
Note:
*
Initialized by LVDR.
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Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
20.3
Operation
20.3.1
Power-On Reset Circuit
Figure 20.2 shows the timing of the operation of the power-on reset circuit. As the power-supply
voltage rises, the capacitor which is externally connected to the RES pin is gradually charged via
the on-chip pull-up resistor (typ. 150 kΩ). Since the state of the RES pin is transmitted within the
chip, the prescaler S and the entire chip are in their reset states. When the level on the RES pin
reaches the specified value, the prescaler S is released from its reset state and it starts counting.
The OVF signal is generated to release the internal reset signal after the prescaler S has counted
131,072 clock (φ) cycles. The noise cancellation circuit of approximately 100 ns is incorporated to
prevent the incorrect operation of the chip by noise on the RES pin.
To achieve stable operation of this LSI, the power supply needs to rise to its full level and settles
within the specified time. The maximum time required for the power supply to rise and settle after
power has been supplied (tPWON) is determined by the oscillation frequency (fOSC) and capacitance
which is connected to RES pin (CRES). If tPWON means the time required to reach 90 % of power
supply voltage, the power supply circuit should be designed to satisfy the following formula.
tPWON (ms) ≤ 90 × CRES (µF) + 162/fOSC (MHz)
(tPWON ≤ 3000 ms, CRES ≥ 0.22 µF, and fOSC = 10 in 2-MHz to 10-MHz operation)
Note that the power supply voltage (Vcc) must fall below Vpor = 100 mV and rise after charge on
the RES pin is removed. To remove charge on the RES pin, it is recommended that the diode
should be placed near Vcc. If the power supply voltage (Vcc) rises from the point above Vpor, a
power-on reset may not occur.
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Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
tPWON
Vcc
Vpor
Vss
RES
Vss
PSS-reset
signal
OVF
Internal reset
signal
131,072 cycles
PSS counter starts
Reset released
Figure 20.2 Operational Timing of Power-On Reset Circuit
20.3.2
Low-Voltage Detection Circuit
LVDR (Reset by Low Voltage Detect) Circuit:
Figure 20.3 shows the timing of the LVDR function. The LVDR enters the module-standby state
after a power-on reset is canceled. To operate the LVDR, set the LVDE bit in LVDCR to 1, wait
for 50 µs (tLVDON) until the reference voltage and the low-voltage-detection power supply have
stabilized by a software timer, etc., then set the LVDRE bit in LVDCR to 1. After that, the output
settings of ports must be made. To cancel the low-voltage detection circuit, first the LVDRE bit
should be cleared to 0 and then the LVDE bit should be cleared to 0. The LVDE and LVDRE bits
must not be cleared to 0 simultaneously because incorrect operation may occur.
When the power-supply voltage falls below the Vreset voltage (typ. = 2.3 V or 3.6 V), the LVDR
clears the LVDRES signal to 0, and resets the prescaler S. The low-voltage detection reset state
remains in place until a power-on reset is generated. When the power-supply voltage rises above
the Vreset voltage again, the prescaler S starts counting. It counts 131,072 clock (φ) cycles, and
then releases the internal reset signal. In this case, the LVDE, LVDSEL, and LVDRE bits in
LVDCR are not initialized.
Note that if the power supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises from that
point, the low-voltage detection reset may not occur.
If the power supply voltage (Vcc) falls below Vpor = 100 mV, a power-on reset occurs.
Rev.5.00 Nov. 02, 2005 Page 366 of 500
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Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
VCC
Vreset
VLVDRmin
VSS
LVDRES
PSS-reset
signal
OVF
Internal reset
signal
131,072 cycles
PSS counter starts
Reset released
Figure 20.3 Operational Timing of LVDR Circuit
LVDI (Interrupt by Low Voltage Detect) Circuit:
Figure 20.4 shows the timing of LVDI functions. The LVDI enters the module-standby state after
a power-on reset is canceled. To operate the LVDI, set the LVDE bit in LVDCR to 1, wait for 50
µs (tLVDON) until the reference voltage and the low-voltage-detection power supply have stabilized
by a software timer, etc., then set the LVDDE and LVDUE bits in LVDCR to 1. After that, the
output settings of ports must be made. To cancel the low-voltage detection circuit, first the
LVDDE and LVDUE bits should all be cleared to 0 and then the LVDE bit should be cleared to 0.
The LVDE bit must not be cleared to 0 at the same timing as the LVDDE and LVDUE bits
because incorrect operation may occur.
When the power-supply voltage falls below Vint (D) (typ. = 3.7 V) voltage, the LVDI clears the
LVDINT signal to 0 and the LVDDF bit in LVDSR is set to 1. If the LVDDE bit is 1 at this time,
an IRQ0 interrupt request is simultaneously generated. In this case, the necessary data must be
saved in the external EEPROM, etc, and a transition must be made to standby mode or subsleep
mode. Until this processing is completed, the power supply voltage must be higher than the lower
limit of the guaranteed operating voltage.
When the power-supply voltage does not fall below Vreset1 (typ. = 2.3 V) voltage but rises above
Vint (U) (typ. = 4.0 V) voltage, the LVDI sets the LVDINT signal to 1. If the LVDUE bit is 1 at
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Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
this time, the LVDUF bit in LVDSR is set to 1 and an IRQ0 interrupt request is simultaneously
generated.
If the power supply voltage (Vcc) falls below Vreset1 (typ. = 2.3 V) voltage, the LVDR function
is performed.
Vint (U)
Vint (D)
Vcc
Vreset1
VSS
LVDINT
LVDDE
LVDDF
LVDUE
LVDUF
IRQ0 interrupt generated IRQ0 interrupt generated
Figure 20.4 Operational Timing of LVDI Circuit
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Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
Procedures for Clearing Settings when Using LVDR and LVDI:
To operate or release the low-voltage detection circuit normally, follow the procedure described
below. Figure 20.5 shows the timing for the operation and release of the low-voltage detection
circuit.
1. To operate the low-voltage detection circuit, set the LVDE bit in LVDCR to 1.
2. Wait for 50 µs (tLVDON) until the reference voltage and the low-voltage-detection power supply
have stabilized by a software timer, etc. Then, clear the LVDDF and LVDUF bits in LVDSR
to 0 and set the LVDRE, LVDDE, and LVDUE bits in LVDCR to 1, as required.
3. To release the low-voltage detection circuit, start by clearing all of the LVDRE, LVDDE, and
LVDUE bits to 0. Then clear the LVDE bit to 0. The LVDE bit must not be cleared to 0 at the
same timing as the LVDRE, LVDDE, and LVDUE bits because incorrect operation may occur.
LVDE
LVDRE
LVDDE
LVDUE
tLVDON
Figure 20.5 Timing for Operation/Release of Low-Voltage Detection Circuit
Rev.5.00 Nov. 02, 2005 Page 369 of 500
REJ09B0027-0500
Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
Rev.5.00 Nov. 02, 2005 Page 370 of 500
REJ09B0027-0500
Section 21 Power Supply Circuit
Section 21 Power Supply Circuit
This LSI incorporates an internal power supply step-down circuit. Use of this circuit enables the
internal power supply to be fixed at a constant level of approximately 3.0 V, independently of the
voltage of the power supply connected to the external VCC pin. As a result, the current consumed
when an external power supply is used at 3.0 V or above can be held down to virtually the same
low level as when used at approximately 3.0 V. If the external power supply is 3.0 V or below, the
internal voltage will be practically the same as the external voltage. It is, of course, also possible to
use the same level of external power supply voltage and internal power supply voltage without
using the internal power supply step-down circuit.
21.1
When Using Internal Power Supply Step-Down Circuit
Connect the external power supply to the VCC pin, and connect a capacitance of approximately 0.1
µF between VCL and VSS, as shown in figure 21.1. The internal step-down circuit is made effective
simply by adding this external circuit. In the external circuit interface, the external power supply
voltage connected to VCC and the GND potential connected to VSS are the reference levels. For
example, for port input/output levels, the VCC level is the reference for the high level, and the VSS
level is that for the low level. The A/D converter analog power supply is not affected by the
internal step-down circuit.
VCC
Step-down circuit
Internal
logic
VCC = 3.0 to 5.5 V
VCL
Stabilization
capacitance
(approx. 0.1 µF)
Internal
power
supply
VSS
Figure 21.1 Power Supply Connection when Internal Step-Down Circuit is Used
PSCKT00A_000020020200
Rev.5.00 Nov. 02, 2005 Page 371 of 500
REJ09B0027-0500
Section 21 Power Supply Circuit
21.2
When Not Using Internal Power Supply Step-Down Circuit
When the internal power supply step-down circuit is not used, connect the external power supply
to the VCL pin and VCC pin, as shown in figure 21.2. The external power supply is then input directly
to the internal power supply. The permissible range for the power supply voltage is 3.0 V to 3.6 V.
Operation cannot be guaranteed if a voltage outside this range (less than 3.0 V or more than 3.6 V)
is input.
VCC
Step-down circuit
Internal
logic
VCC = 3.0 to 3.6 V
VCL
Internal
power
supply
VSS
Figure 21.2 Power Supply Connection when Internal Step-Down Circuit is Not Used
Rev.5.00 Nov. 02, 2005 Page 372 of 500
REJ09B0027-0500
Section 22 List of Registers
Section 22 List of Registers
The register list gives information on the on-chip I/O register addresses, how the register bits are
configured, and the register states in each operating mode. The information is given as shown
below.
1. Register addresses (address order)
• Registers are listed from the lower allocation addresses.
• The symbol in the register-name column represents a reserved address or range of reserved
addresses.
Do not attempt to access reserved addresses.
• When the address is 16-bit wide, the address of the upper byte is given in the list.
• Registers are classified by functional modules.
• The data bus width is indicated.
• The number of access states is indicated.
2.
•
•
•
Register bits
Bit configurations of the registers are described in the same order as the register addresses.
Reserved bits are indicated by in the bit name column.
When registers consist of 16 bits, bits are described from the MSB side.
3. Register states in each operating mode
• Register states are described in the same order as the register addresses.
• The register states described here are for the basic operating modes. If there is a specific reset
for an on-chip peripheral module, refer to the section on that on-chip peripheral module.
Rev.5.00 Nov. 02, 2005 Page 373 of 500
REJ09B0027-0500
Section 22 List of Registers
22.1
Register Addresses (Address Order)
The data-bus width column indicates the number of bits. The access-state column shows the
number of states of the selected basic clock that is required for access to the register.
Note: Access to undefined or reserved addresses should not take place. Correct operation of the
access itself or later operations is not guaranteed when such a register is accessed.
Register
Abbreviation
Bit No
—
—
—
Data
Bus
Width
Access
State
—
—
—
Module
Address Name
H'F000
to
H'F6FF
Timer control register_0
TCR_0
8
H'F700
Timer Z
8
2
Timer I/O control register A_0
TIORA_0 8
H'F701
Timer Z
8
2
Timer I/O control register C_0
TIORC_0 8
H'F702
Timer Z
8
2
Timer status register_0
TSR_0
8
H'F703
Timer Z
8
2
Timer interrupt enable register_0
TIER_0
8
H'F704
Timer Z
8
2
PWM mode output level control
register_0
POCR_0 8
H'F705
Timer Z
8
2
Timer counter_0
TCNT_0 16
H'F706
Timer Z
16
2
General register A_0
GRA_0
16
H'F708
Timer Z
16
2
General register B_0
GRB_0
16
H'F70A
Timer Z
16
2
General register C_0
GRC_0
16
H'F70C
Timer Z
16
2
General register D_0
GRD_0
16
H'F70E
Timer Z
16
2
Timer control register_1
TCR_1
8
H'F710
Timer Z
8
2
Timer I/O control register A_1
TIORA_1 8
H'F711
Timer Z
8
2
Timer I/O control register C_1
TIORC_1 8
H'F712
Timer Z
8
2
Timer status register_1
TSR_1
8
H'F713
Timer Z
8
2
Timer interrupt enable register_1
TIER_1
8
H'F714
Timer Z
8
2
PWM mode output level control
register_1
POCR_1 8
H'F715
Timer Z
8
2
Timer counter_1
TCNT_1 16
H'F716
Timer Z
16
2
General register A_1
GRA_1
16
H'F718
Timer Z
16
2
General register B_1
GRB_1
16
H'F71A
Timer Z
16
2
Rev.5.00 Nov. 02, 2005 Page 374 of 500
REJ09B0027-0500
Section 22 List of Registers
Bit No
Module
Address Name
Data
Bus
Width
Access
State
GRC_1
16
H'F71C
Timer Z
16
2
General register D_1
GRD_1
16
H'F71E
Timer Z
16
2
Timer start register
TSTR
8
H'F720
Timer Z
8
2
Timer mode register
TMDR
8
H'F721
Timer Z
8
2
Timer PWM mode register
TPMR
8
H'F722
Timer Z
8
2
Timer Z, for common use
TFCR
8
H'F723
Timer Z
8
2
Timer output master enable register TOER
8
H'F724
Timer Z
8
2
Timer output control register
TOCR
8
H'F725
Timer Z
8
2
—
—
—
H'F726,
H'F727
Timer Z
—
—
Second data register/free running
counter data register
RSECDR 8
H'F728
RTC
8
2
Minute data register
RMINDR 8
H'F729
RTC
8
2
Hour data register
RHRDR
8
H'F72A
RTC
8
2
Day-of-week data register
RWKDR 8
H'F72B
RTC
8
2
RTC control register 1
RTCCR1 8
H'F72C
RTC
8
2
Register
Abbreviation
General register C_1
RTC control register 2
RTCCR2 8
H'F72D
RTC
8
2
—
—
H'F72E
RTC
—
—
Clock source select register
RTCCSR 8
H'F72F
RTC
—
8
2
1
Low-voltage-detection control
register
LVDCR
8
H'F730
LVDC*
8
2
Low-voltage-detection status
register
LVDSR
8
H'F731
LVDC*1
8
2
—
—
—
H'F732
to
H'F73F
—
—
—
Serial mode register_2
SMR_2
8
H'F740
SCI3_2
8
3
Bit rate register_2
BRR_2
8
H'F741
SCI3_2
8
3
Serial control register 3_2
SCR3_2 8
H'F742
SCI3_2
8
3
Transmit data register_2
TDR_2
8
H'F743
SCI3_2
8
3
Serial status register_2
SSR_2
8
H'F744
SCI3_2
8
3
Rev.5.00 Nov. 02, 2005 Page 375 of 500
REJ09B0027-0500
Section 22 List of Registers
Bit No
Module
Address Name
Data
Bus
Width
Access
State
RDR_2
8
H'F745
SCI3_2
8
3
—
—
—
H'F746,
H'F747
SCI3_2
—
—
I2C bus control register 1
ICCR1
8
H'F748
IIC2
8
2
I2C bus control register 2
ICCR2
8
H'F749
IIC2
8
2
I2C bus mode register
ICMR
8
H'F74A
IIC2
8
2
I2C bus interrupt enable register
ICIER
8
H'F74B
IIC2
8
2
I2C status register
ICSR
8
H'F74C
IIC2
8
2
Slave address register
SAR
8
H'F74D
IIC2
8
2
Register
Abbreviation
Receive data register_2
I2C bus transmit data register
ICDRT
8
H'F74E
IIC2
8
2
I2C bus receive data register
ICDRR
8
H'F74F
IIC2
8
2
—
—
—
H'F750
to
H'F75F
—
—
—
Timer mode register B1
TMB1
8
H'F760
Timer B1
8
2
Timer counter B1
TCB1
8
H'F761
Timer B1
8
2
—
—
—
H'F762
to
—
—
—
H'FF8F
Flash memory control register 1
FLMCR1 8
H'FF90
ROM
8
2
Flash memory control register 2
FLMCR2 8
H'FF91
ROM
8
2
Flash memory power control
register
FLPWCR 8
H'FF92
ROM
8
2
Erase block register 1
EBR1
8
H'FF93
ROM
8
2
—
—
—
H'FF94
to
H'FF9A
ROM
—
—
Flash memory enable register
FENR
8
H'FF9B
ROM
8
2
—
—
—
H'FF9C
to
ROM
—
—
H'FF9F
Timer control register V0
TCRV0
8
H'FFA0
Timer V
8
3
Timer control/status register V
TCSRV
8
H'FFA1
Timer V
8
3
Rev.5.00 Nov. 02, 2005 Page 376 of 500
REJ09B0027-0500
Section 22 List of Registers
Bit No
Module
Address Name
Data
Bus
Width
Access
State
TCORA
8
H'FFA2
Timer V
8
3
TCORB
8
H'FFA3
Timer V
8
3
Register
Abbreviation
Time constant register A
Time constant register B
Timer counter V
TCNTV
8
H'FFA4
Timer V
8
3
Timer control register V1
TCRV1
8
H'FFA5
Timer V
8
3
—
—
—
H'FFA6, —
H'FFA7
—
—
Serial mode register
SMR
8
H'FFA8
SCI3
8
3
Bit rate register
BRR
8
H'FFA9
SCI3
8
3
Serial control register 3
SCR3
8
H'FFAA
SCI3
8
3
Transmit data register
TDR
8
H'FFAB
SCI3
8
3
Serial status register
SSR
8
H'FFAC
SCI3
8
3
Receive data register
RDR
8
H'FFAD
SCI3
8
3
—
—
—
H'FFAE, SCI3
H'FFAF
—
—
A/D data register
ADDRA
16
H'FFB0
A/D
converter
8
3
A/D data register
ADDRB
16
H'FFB2
A/D
converter
8
3
A/D data register
ADDRC
16
H'FFB4
A/D
converter
8
3
A/D data register
ADDRD
16
H'FFB6
A/D
converter
8
3
A/D control/status register
ADCSR
8
H'FFB8
A/D
converter
8
3
A/D control register
ADCR
8
H'FFB9
A/D
converter
8
3
—
—
—
H'FFBA, —
H'FFBB
—
—
PWM data register L
PWDRL
8
H'FFBC
14-bit PWM 8
2
PWM data register U
PWDRU 8
H'FFBD
14-bit PWM 8
2
PWM control register
PWCR
8
H'FFBE
14-bit PWM 8
2
—
—
—
H'FFBF
14-bit PWM —
—
Rev.5.00 Nov. 02, 2005 Page 377 of 500
REJ09B0027-0500
Section 22 List of Registers
Register
Abbreviation
Bit No
Module
Address Name
Data
Bus
Width
Access
State
Timer control/status register WD
TCSRW
D
8
H'FFC0
WDT*2
8
2
Timer counter WD
TCWD
8
H'FFC1
WDT*2
8
2
H'FFC2
2
8
2
2
Timer mode register WD
TMWD
8
WDT*
—
—
—
H'FFC3
WDT*
—
—
—
—
—
H'FFC4
to
H'FFC7
—
—
—
Address break control register
ABRKCR 8
H'FFC8
Address
break
8
2
Address break status register
ABRKSR 8
H'FFC9
Address
break
8
2
Break address register H
BARH
8
H'FFCA
Address
break
8
2
Break address register L
BARL
8
H'FFCB
Address
break
8
2
Break data register H
BDRH
8
H'FFCC
Address
break
8
2
Break data register L
BDRL
8
H'FFCD
Address
break
8
2
Port pull-up control register 1
PUCR1
8
H'FFD0
I/O port
8
2
Port pull-up control register 5
PUCR5
8
H'FFD1
I/O port
8
2
—
—
—
H'FFD2, I/O port
H'FFD3
—
—
Port data register 1
PDR1
8
H'FFD4
I/O port
8
2
Port data register 2
PDR2
8
H'FFD5
I/O port
8
2
Port data register 3
PDR3
8
H'FFD6
I/O port
8
2
—
—
—
H'FFD7
I/O port
—
—
Port data register 5
PDR5
8
H'FFD8
I/O port
8
2
Port data register 6
PDR6
8
H'FFD9
I/O port
8
2
Port data register 7
PDR7
8
H'FFDA
I/O port
8
2
Port data register 8
PDR8
8
H'FFDB
I/O port
8
2
—
—
—
H'FFDC
I/O port
—
—
Rev.5.00 Nov. 02, 2005 Page 378 of 500
REJ09B0027-0500
Section 22 List of Registers
Bit No
Module
Address Name
Data
Bus
Width
Access
State
PDRB
8
H'FFDD
8
2
—
—
—
H'FFDE, I/O port
H'FFDF
—
—
Port mode register 1
PMR1
8
H'FFE0
I/O port
8
2
Port mode register 5
PMR5
8
H'FFE1
I/O port
8
2
Port mode register 3
PMR3
8
H'FFE2
I/O port
8
2
—
—
—
H'FFD3
I/O port
—
—
Port control register 1
PCR1
8
H'FFE4
I/O port
8
2
Port control register 2
PCR2
8
H'FFE5
I/O port
8
2
Port control register 3
PCR3
8
H'FFE6
I/O port
8
2
—
—
—
H'FFE7
I/O port
—
—
Port control register 5
PCR5
8
H'FFE8
I/O port
8
2
Port control register 6
PCR6
8
H'FFE9
I/O port
8
2
Port control register 7
PCR7
8
H'FFEA
I/O port
8
2
Port control register 8
PCR8
8
H'FFEB
I/O port
8
2
—
—
—
H'FFEC
to
H'FFEF
I/O port
—
—
System control register 1
SYSCR1 8
H'FFF0
Low power 8
2
System control register 2
SYSCR2 8
H'FFF1
Low power 8
2
Interrupt edge select register 1
IEGR1
8
H'FFF2
Interrupt
8
2
Interrupt edge select register 2
IEGR2
8
H'FFF3
Interrupt
8
2
Interrupt enable register 1
IENR1
8
H'FFF4
Interrupt
8
2
Register
Abbreviation
Port data register B
I/O port
Interrupt enable register 2
IENR2
8
H'FFF5
Interrupt
8
2
Interrupt flag register 1
IRR1
8
H'FFF6
Interrupt
8
2
Interrupt flag register 2
IRR2
8
H'FFF7
Interrupt
8
2
Wakeup interrupt flag register
IWPR
8
H'FFF8
Interrupt
8
2
Module standby control register 1
MSTCR1 8
H'FFF9
Low power 8
2
Module standby control register 2
MSTCR2 8
H'FFFA
Low power 8
2
—
—
H'FFEB
Low power —
—
—
Rev.5.00 Nov. 02, 2005 Page 379 of 500
REJ09B0027-0500
Section 22 List of Registers
Register
Abbreviation
Bit No
—
—
—
Module
Address Name
H'FFFC
to
H'FFFF
—
Data
Bus
Width
Access
State
—
—
• EEPROM
Data
Bus
Width
Register Name
Abbreviation
Bit No Address
Module
Name
EEPROM slave address register
—
8
H'FF09
EEPROM —
—
EEPROM key register
EKR
8
H'FF10
EEPROM 8
2
Notes: 1. LVDC: Low-voltage detection circuits (optional)
2. WDT: Watchdog timer
Rev.5.00 Nov. 02, 2005 Page 380 of 500
REJ09B0027-0500
Access
State
Section 22 List of Registers
22.2
Register Bits
The addresses and bit names of the registers in the on-chip peripheral modules are listed below.
The 16-bit register is indicated in two rows, 8 bits for each row.
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
—
—
—
—
—
—
—
—
—
—
TCR_0
CCLR2
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
Timer Z
TIORA_0
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
TIORC_0
—
IOD2
IOD1
IOD0
—
IOC2
IOC1
IOC0
TSR_0
—
—
—
OVF
IMFD
IMFC
IMFB
IMFA
TIER_0
—
—
—
OVIE
IMIED
IMIEC
IMIEB
IMIEA
POCR_0
—
—
—
—
—
POLD
POLC
POLB
TCNT_0
TCNT0H7 TCNT0H6 TCNT0H5 TCNT0H4 TCNT0H3 TCNT0H2 TCNT0H1 TCNT0H0
TCNT0L7
TCNT0L6
TCNT0L5
TCNT0L4
TCNT0L3
TCNT0L2
TCNT0L1
TCNT0L0
GRA_0
GRA0H7
GRA0H6
GRA0H5
GRA0H4
GRA0H3
GRA0H2
GRA0H1
GRA0H0
GRA0L7
GRA0L6
GRA0L5
GRA0L4
GRA0L3
GRA0L2
GRA0L1
GRA0L0
GRB_0
GRB0H7
GRB0H6
GRB0H5
GRB0H4
GRB0H3
GRB0H2
GRB0H1
GRB0H0
GRB0L7
GRB0L6
GRB0L5
GRB0L4
GRB0L3
GRB0L2
GRB0L1
GRB0L0
GRC0H7
GRC0H6
GRC0H5
GRC0H4
GRC0H3
GRC0H2
GRC0H1
GRC0H0
GRC0L7
GRC0L6
GRC0L5
GRC0L4
GRC0L3
GRC0L2
GRC0L1
GRC0L0
GRD0H7
GRD0H6
GRD0H5
GRD0H4
GRD0H3
GRD0H2
GRD0H1
GRD0H0
GRD0L7
GRD0L6
GRD0L5
GRD0L4
GRD0L3
GRD0L2
GRD0L1
GRD0L0
TCR_1
CCLR2
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
TIORA_1
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
TIORC_1
—
IOD2
IOD1
IOD0
—
IOC2
IOC1
IOC0
TSR_1
—
—
UDF
OVF
IMFD
IMFC
IMFB
IMFA
TIER_1
—
—
—
OVIE
IMIED
IMIEC
IMIEB
IMIEA
POCR_1
—
—
—
—
—
POLD
POLC
POLB
TCNT_1
TCNT1H7 TCNT1H6 TCNT1H5 TCNT1H4 TCNT1H3 TCNT1H2 TCNT1H1 TCNT1H0
GRC_0
GRD_0
GRA_1
TCNT1L7
TCNT1L6
TCNT1L5
TCNT1L4
TCNT1L3
TCNT1L2
TCNT1L1
TCNT1L0
GRA1H7
GRA1H6
GRA1H5
GRA1H4
GRA1H3
GRA1H2
GRA1H1
GRA1H0
GRA1L7
GRA1L6
GRA1L5
GRA1L4
GRA1L3
GRA1L2
GRA1L1
GRA1L0
Rev.5.00 Nov. 02, 2005 Page 381 of 500
REJ09B0027-0500
Section 22 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
GRB_1
GRB1H7
GRB1H6
GRB1H5
GRB1H4
GRB1H3
GRB1H2
GRB1H1
GRB1H0
Timer Z
GRB1L7
GRB1L6
GRB1L5
GRB1L4
GRB1L3
GRB1L2
GRB1L1
GRB1L0
GRC1H7
GRC1H6
GRC1H5
GRC1H4
GRC1H3
GRC1H2
GRC1H1
GRC1H0
GRC1L7
GRC1L6
GRC1L5
GRC1L4
GRC1L3
GRC1L2
GRC1L1
GRC1L0
GRD1H7
GRD1H6
GRD1H5
GRD1H4
GRD1H3
GRD1H2
GRD1H1
GRD1H0
GRD1L7
GRD1L6
GRD1L5
GRD1L4
GRD1L3
GRD1L2
GRD1L1
GRD1L0
TSTR
—
—
—
—
—
—
STR1
STR0
TMDR
BFD1
BFC1
BFD0
BFC0
—
—
—
SYNC
TPMR
—
PWMD1
PWMC1
PWMB1
—
PWMD0
PWMC0
PWMB0
TFCR
—
STCLK
ADEG
ADTRG
OLS1
OLS0
CMD1
CMD0
TOER
ED1
EC1
EB1
EA1
ED0
EC0
EB0
EA0
TOCR
TOD1
TOC1
TOB1
TOA1
TOD0
TOC0
TOB0
TOA0
RSECDR
BSY
SC12
SC11
SC10
SC03
SC02
SC01
SC00
RMINDR
BSY
MN12
MN11
MN10
MN03
MN02
MN01
MN00
RHRDR
BSY
—
HR11
HR10
HR03
HR02
HR01
HR00
RWKDR
BSY
—
—
—
—
WK2
WK1
WK0
RTCCR1
RUN
12/24
PM
RST
—
—
—
—
RTCCR2
—
—
FOIE
WKIE
DYIE
HRIE
MNIE
SEIE
RTCCSR
—
RCS6
RCS5
—
RCS3
RCS2
RCS1
RCS0
LVDCR
LVDE
—
—
—
LVDSEL
LVDRE
LVDDE
LVDUE
LVDC
LVDSR
—
—
—
—
—
—
LVDDF
LVDUF
(optional)*
—
—
—
—
—
—
—
—
—
—
SMR_2
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
SCI3_2
BRR_2
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
SCR3_2
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDR_2
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
SSR_2
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
RDR_2
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
ICCR1
ICE
RCVD
MST
TRS
CKS3
CKS2
CKS1
CKS0
ICCR2
BBSY
SCP
SDAO
SDAOP
SCLO
—
IICRST
—
ICMR
MLS
WAIT
—
—
BCWP
BC2
BC1
BC0
GRC_1
GRD_1
Rev.5.00 Nov. 02, 2005 Page 382 of 500
REJ09B0027-0500
RTC
1
IIC2
Section 22 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
ICIER
TIE
TEIE
RIE
NAKIE
STIE
ACKE
ACKBR
ACKBT
IIC2
ICSR
TDRE
TEND
RDRF
NACKF
STOP
AL/OVE
AAS
ADZ
SAR
SVA6
SVA5
SVA4
SVA3
SVA2
SVA1
SVA0
FS
ICDRT
ICDRT7
ICDRT6
ICDRT5
ICDRT4
ICDRT3
ICDRT2
ICDRT1
ICDRT0
ICDRR
ICDRR7
ICDRR6
ICDRR5
ICDRR4
ICDRR3
ICDRR2
ICDRR1
ICDRR0
—
—
—
—
—
—
—
—
—
—
TMB1
TMB17
—
—
—
—
TMB12
TMB11
TMB10
Timer B1
TCB1
TCB17
TCB16
TCB15
TCB14
TCB13
TCB12
TCB11
TCB10
—
—
—
—
—
—
—
—
—
—
FLMCR1
—
SWE
ESU
PSU
EV
PV
E
P
ROM
FLMCR2
FLER
—
—
—
—
—
—
—
FLPWCR
PDWND
—
—
—
—
—
—
—
EBR1
—
EB6
EB5
EB4
EB3
EB2
EB1
EB0
FENR
FLSHE
—
—
—
—
—
—
—
TCRV0
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
TCSRV
CMFB
CMFA
OVF
—
OS3
OS2
OS1
OS0
TCORA
TCORA7
TCORA6
TCORA5
TCORA4
TCORA3
TCORA2
TCORA1
TCORA0
TCORB
TCORB7
TCORB6
TCORB5
TCORB4
TCORB3
TCORB2
TCORB1
TCORB0
TCNTV
TCNTV7
TCNTV6
TCNTV5
TCNTV4
TCNTV3
TCNTV2
TCNTV1
TCNTV0
TCRV1
—
—
—
TVEG1
TVEG0
TRGE
—
ICKS0
—
—
—
—
—
—
—
—
—
—
SMR
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
SCI3
BRR
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
SCR3
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDR
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
SSR
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
RDR
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
ADDRA
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
A/D
AD1
AD0
—
—
—
—
—
—
converter
Timer V
Rev.5.00 Nov. 02, 2005 Page 383 of 500
REJ09B0027-0500
Section 22 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
ADDRB
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
A/D
AD1
AD0
—
—
—
—
—
—
converter
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
—
—
—
—
—
—
ADDRC
ADDRD
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
—
—
—
—
—
—
ADCSR
ADF
ADIE
ADST
SCAN
CKS
CH2
CH1
CH0
ADCR
TRGE
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
PWDRL
PWDRL7
PWDRL6
PWDRL5
PWDRL4
PWDRL3
PWDRL2
PWDRL1
PWDRL0
14-bit PWM
PWDRU
—
—
PWDRU5
PWDRU4
PWDRU3
PWDRU2
PWDRU1
PWDRU0
PWCR
—
—
—
—
—
—
—
PWCR0
TCSRWD
B6WI
TCWE
B4WI
TCSRWE
B2WI
WDON
B0WI
WRST
TCWD
TCWD7
TCWD6
TCWD5
TCWD4
TCWD3
TCWD2
TCWD1
TCWD0
TMWD
—
—
—
—
CKS3
CKS2
CKS1
CKS0
—
—
—
—
—
—
—
—
—
ABRKCR
RTINTE
CSEL1
CSEL0
ACMP2
ACMP1
ACMP0
DCMP1
DCMP0
Address
ABRKSR
ABIF
ABIE
—
—
—
—
—
—
break
BARH
BARH7
BARH6
BARH5
BARH4
BARH3
BARH2
BARH1
BARH0
BARL
BARL7
BARL6
BARL5
BARL4
BARL3
BARL2
BARL1
BARL0
WDT*2
—
BDRH
BDRH7
BDRH6
BDRH5
BDRH4
BDRH3
BDRH2
BDRH1
BDRH0
BDRL
BDRL7
BDRL6
BDRL5
BDRL4
BDRL3
BDRL2
BDRL1
BDRL0
—
—
—
—
—
—
—
—
—
—
PUCR1
PUCR17
PUCR16
PUCR15
PUCR14
—
PUCR12
PUCR11
PUCR10
I/O port
PUCR5
—
—
PUCR55
PUCR54
PUCR53
PUCR52
PUCR51
PUCR50
PDR1
P17
P16
P15
P14
—
P12
P11
P10
PDR2
—
—
—
P24
P23
P22
P21
P20
PDR3
P37
P35
P34
P33
P32
P31
P30
P36
3
3
PDR5
P57*
P56*
P55
P54
P53
P52
P51
P50
PDR6
P67
P66
P65
P64
P63
P62
P61
P60
PDR7
—
P76
P75
P74
—
P72
P71
P70
Rev.5.00 Nov. 02, 2005 Page 384 of 500
REJ09B0027-0500
Section 22 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
PDR8
P87
P86
P85
—
—
—
—
—
I/O port
PDRB
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
PMR1
IRQ3
IRQ2
IRQ1
IRQ0
TXD2
PWM
TXD
TMOW
PMR5
POF57
POF56
WKP5
WKP4
WKP3
WKP2
WKP1
WKP0
PMR3
—
—
—
POF24
POF23
—
—
—
PCR1
PCR17
PCR16
PCR15
PCR14
—
PCR12
PCR11
PCR10
PCR2
—
—
—
PCR24
PCR23
PCR22
PCR21
PCR20
PCR3
PCR37
PCR35
PCR34
PCR33
PCR32
PCR31
PCR30
PCR36
3
3
PCR5
PCR57*
PCR56*
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
PCR6
PCR67
PCR66
PCR65
PCR64
PCR63
PCR62
PCR61
PCR60
PCR7
—
PCR76
PCR75
PCR74
—
PCR72
PCR71
PCR70
PCR8
PCR87
PCR86
PCR85
—
—
—
—
—
SYSCR1
SSBY
STS2
STS1
STS0
NESEL
—
—
—
SYSCR2
SMSEL
LSON
DTON
MA2
MA1
MA0
SA1
SA0
IEGR1
NMIEG
—
—
—
IEG3
IEG2
IEG1
IEG0
IEGR2
—
—
WPEG5
WPEG4
WPEG3
WPEG2
WPEG1
WPEG0
IENR1
IENDT
IENTA
IENWP
—
IEN3
IEN2
IEN1
IEN0
IENR2
—
—
IENTB1
—
—
—
—
—
IRR1
IRRDT
IRRTA
—
—
IRRI3
IRRI2
IRRI1
IRRI0
IRR2
—
—
IRRTB1
—
—
—
—
—
IWPR
—
—
IWPF5
IWPF4
IWPF3
IWPF2
IWPF1
IWPF0
Interrupt
MSTCR1
—
MSTIIC
MSTS3
MSTAD
MSTWD
—
MSTTV
MSTTA
Low power
MSTCR2
MSTS3_2
—
—
MSTTB1
—
—
MSTTZ
MSTPWM
—
—
—
—
—
—
—
—
—
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Low power
Interrupt
—
• EEPROM
Register
Name
Bit 7
EKR
Module
Name
EEPROM
Notes: 1. LVDC: Low-voltage detection circuits (optional)
2. WDT: Watchdog timer
TM
3. These bits are reserved in the EEPROM stacked F-ZTAT and mask-ROM versions.
Rev.5.00 Nov. 02, 2005 Page 385 of 500
REJ09B0027-0500
Section 22 List of Registers
22.3
Registers States in Each Operating Mode
Register
Name
Reset
Active
Sleep
Subactive
Subsleep Standby
Module
TCR_0
Initialized
—
—
—
—
—
Timer Z
TIORA_0
Initialized
—
—
—
—
—
TIORC_0
Initialized
—
—
—
—
—
TSR_0
Initialized
—
—
—
—
—
TIER_0
Initialized
—
—
—
—
—
POCR_0
Initialized
—
—
—
—
—
TCNT_0
Initialized
—
—
—
—
—
GRA_0
Initialized
—
—
—
—
—
GRB_0
Initialized
—
—
—
—
—
GRC_0
Initialized
—
—
—
—
—
GRD_0
Initialized
—
—
—
—
—
TCR_1
Initialized
—
—
—
—
—
TIORA_1
Initialized
—
—
—
—
—
TIORC_1
Initialized
—
—
—
—
—
TSR_1
Initialized
—
—
—
—
—
TIER_1
Initialized
—
—
—
—
—
POCR_1
Initialized
—
—
—
—
—
TCNT_1
Initialized
—
—
—
—
—
GRA_1
Initialized
—
—
—
—
—
GRB_1
Initialized
—
—
—
—
—
GRC_1
Initialized
—
—
—
—
—
GRD_1
Initialized
—
—
—
—
—
TSTR
Initialized
—
—
—
—
—
TMDR
Initialized
—
—
—
—
—
TPMR
Initialized
—
—
—
—
—
TFCR
Initialized
—
—
—
—
—
TOER
Initialized
—
—
—
—
—
TOCR
Initialized
—
—
—
—
—
RSECDR
—
—
—
—
—
—
Rev.5.00 Nov. 02, 2005 Page 386 of 500
REJ09B0027-0500
RTC
Section 22 List of Registers
Register
Name
Reset
Active
Sleep
Subactive
Subsleep Standby
Module
RMINDR
—
—
—
—
—
—
RTC
RHRDR
—
—
—
—
—
—
RWKDR
—
—
—
—
—
—
RTCCR1
—
—
—
—
—
—
RTCCR2
—
—
—
—
—
—
RTCCSR
Initialized
—
—
—
—
—
LVDCR
Initialized
—
—
—
—
—
LVDC
LVDSR
Initialized
—
—
—
—
—
(optional)*1
SMR_2
Initialized
—
—
Initialized
Initialized
Initialized
SCI3_2
BRR_2
Initialized
—
—
Initialized
Initialized
Initialized
SCR3_2
Initialized
—
—
Initialized
Initialized
Initialized
TDR_2
Initialized
—
—
Initialized
Initialized
Initialized
SSR_2
Initialized
—
—
Initialized
Initialized
Initialized
RDR_2
Initialized
—
—
Initialized
Initialized
Initialized
ICCR1
Initialized
—
—
—
—
—
ICCR2
Initialized
—
—
—
—
—
ICMR
Initialized
—
—
—
—
—
ICIER
Initialized
—
—
—
—
—
ICSR
Initialized
—
—
—
—
—
SAR
Initialized
—
—
—
—
—
ICDRT
Initialized
—
—
—
—
—
ICDRR
Initialized
—
—
—
—
—
TMB1
Initialized
—
—
—
—
—
TCB1
Initialized
—
—
—
—
—
FLMCR1
Initialized
—
—
Initialized
Initialized
Initialized
FLMCR2
Initialized
—
—
—
—
—
FLPWCR
Initialized
—
—
—
—
—
EBR1
Initialized
—
—
Initialized
Initialized
Initialized
FENR
Initialized
—
—
—
—
—
TCRV0
Initialized
—
—
Initialized
Initialized
Initialized
TCSRV
Initialized
—
—
Initialized
Initialized
Initialized
IIC2
Timer B1
ROM
Timer V
Rev.5.00 Nov. 02, 2005 Page 387 of 500
REJ09B0027-0500
Section 22 List of Registers
Register
Name
Reset
Active
Sleep
Subactive
Subsleep Standby
Module
TCORA
Initialized
—
—
Initialized
Initialized
Initialized
Timer V
TCORB
Initialized
—
—
Initialized
Initialized
Initialized
TCNTV
Initialized
—
—
Initialized
Initialized
Initialized
TCRV1
Initialized
—
—
Initialized
Initialized
Initialized
SMR
Initialized
—
—
Initialized
Initialized
Initialized
BRR
Initialized
—
—
Initialized
Initialized
Initialized
SCR3
Initialized
—
—
Initialized
Initialized
Initialized
TDR
Initialized
—
—
Initialized
Initialized
Initialized
SSR
Initialized
—
—
Initialized
Initialized
Initialized
RDR
Initialized
—
—
Initialized
Initialized
Initialized
ADDRA
Initialized
—
—
Initialized
Initialized
Initialized
ADDRB
Initialized
—
—
Initialized
Initialized
Initialized
ADDRC
Initialized
—
—
Initialized
Initialized
Initialized
ADDRD
Initialized
—
—
Initialized
Initialized
Initialized
ADCSR
Initialized
—
—
Initialized
Initialized
Initialized
ADCR
Initialized
—
—
Initialized
Initialized
Initialized
PWDRL
Initialized
—
—
—
—
—
PWDRU
Initialized
—
—
—
—
—
PWCR
Initialized
—
—
—
—
—
TCSRWD
Initialized
—
—
—
—
—
TCWD
Initialized
—
—
—
—
—
TMWD
Initialized
—
—
—
—
—
ABRKCR
Initialized
—
—
—
—
—
ABRKSR
Initialized
—
—
—
—
—
BARH
Initialized
—
—
—
—
—
BARL
Initialized
—
—
—
—
—
BDRH
Initialized
—
—
—
—
—
BDRL
Initialized
—
—
—
—
—
PUCR1
Initialized
—
—
—
—
—
PUCR5
Initialized
—
—
—
—
—
PDR1
Initialized
—
—
—
—
—
Rev.5.00 Nov. 02, 2005 Page 388 of 500
REJ09B0027-0500
SCI3
A/D converter
14bit PWM
WDT*2
Address break
I/O port
Section 22 List of Registers
Register
Name
Reset
Active
Sleep
Subactive
Subsleep Standby
Module
PDR2
Initialized
—
—
—
—
—
I/O port
PDR3
Initialized
—
—
—
—
—
PDR5
Initialized
—
—
—
—
—
PDR6
Initialized
—
—
—
—
—
PDR7
Initialized
—
—
—
—
—
PDR8
Initialized
—
—
—
—
—
PDRB
Initialized
—
—
—
—
—
PMR1
Initialized
—
—
—
—
—
PMR5
Initialized
—
—
—
—
—
PMR3
Initialized
—
—
—
—
—
PCR1
Initialized
—
—
—
—
—
PCR2
Initialized
—
—
—
—
—
PCR3
Initialized
—
—
—
—
—
PCR5
Initialized
—
—
—
—
—
PCR6
Initialized
—
—
—
—
—
PCR7
Initialized
—
—
—
—
—
PCR8
Initialized
—
—
—
—
—
SYSCR1
Initialized
—
—
—
—
—
SYSCR2
Initialized
—
—
—
—
—
IEGR1
Initialized
—
—
—
—
—
IEGR2
Initialized
—
—
—
—
—
IENR1
Initialized
—
—
—
—
—
IENR2
Initialized
—
—
—
—
—
IRR1
Initialized
—
—
—
—
—
IRR2
Initialized
—
—
—
—
—
IWPR
Initialized
—
—
—
—
—
MSTCR1
Initialized
—
—
—
—
—
MSTCR2
Initialized
—
—
—
—
—
Low power
Interrupt
Low power
Rev.5.00 Nov. 02, 2005 Page 389 of 500
REJ09B0027-0500
Section 22 List of Registers
• EEPROM
Register
Name
Reset
EKR
—
Active
Sleep
Subactive Subsleep Standby
Module
—
—
—
EEPROM
Notes: is not initialized
1. LVDC: Low-voltage detection circuits (optional)
2. WDT: Watchdog timer
Rev.5.00 Nov. 02, 2005 Page 390 of 500
REJ09B0027-0500
—
—
Section 23 Electrical Characteristics
Section 23 Electrical Characteristics
23.1
Absolute Maximum Ratings
Table 23.1 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Note
Power supply voltage
VCC
–0.3 to +7.0
V
*
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Input voltage
VIN
–0.3 to VCC +0.3
V
Port B
–0.3 to AVCC +0.3
V
X1
–0.3 to 4.3
V
Ports other than ports B
and X1
Operating temperature
Topr
–20 to +75
°C
Storage temperature
Tstg
–55 to +125
°C
Note:
*
Permanent damage may result if maximum ratings are exceeded. Normal operation
should be under the conditions specified in Electrical Characteristics. Exceeding these
values can result in incorrect operation and reduced reliability.
23.2
Electrical Characteristics (F-ZTAT™ Version, EEPROM Stacked
F-ZTATTM Version)
23.2.1
Power Supply Voltage and Operating Ranges
Power Supply Voltage and Oscillation Frequency Range
φOSC (MHz)
φW (kHz)
20.0
32.768
10.0
2.0
3.0
4.0
• AVCC = 3.3 to 5.5 V
• Active mode
• Sleep mode
5.5
VCC (V)
3.0
4.0
5.5
VCC (V)
• AVCC = 3.3 to 5.5 V
• All operating modes
Rev.5.00 Nov. 02, 2005 Page 391 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Power Supply Voltage and Operating Frequency Range
φ (MHz)
φSUB (kHz)
20.0
16.384
10.0
8.192
4.096
1.0
3.0
4.0
5.5
VCC (V)
• AVCC = 3.3 to 5.5 V
• Active mode
• Sleep mode
(When MA2 in SYSCR2 = 0 )
φ (kHz)
2500
1250
78.125
3.0
4.0
5.5
VCC (V)
• AVCC = 3.3 to 5.5 V
• Active mode
• Sleep mode
(When MA2 in SYSCR2 = 1 )
Rev.5.00 Nov. 02, 2005 Page 392 of 500
REJ09B0027-0500
3.0
4.0
• AVCC = 3.3 to 5.5 V
• Subactive mode
• Subsleep mode
5.5
VCC (V)
Section 23 Electrical Characteristics
Analog Power Supply Voltage and A/D Converter Accuracy Guarantee Range
φ (MHz)
20.0
10.0
2.0
3.3
4.0
AVCC (V)
5.5
• VCC = 3.0 to 5.5 V
• Active mode
• Sleep mode
Range of Power Supply Voltage and Oscillation Frequency when Low-Voltage Detection
Circuit is Used
φosc (MHz)
20.0
16.0
2.0
Vcc(V)
3.0
4.5
5.5
Operation guarantee range
Operation guarantee range except
A/D conversion accuracy
Rev.5.00 Nov. 02, 2005 Page 393 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
23.2.2
DC Characteristics
Table 23.2 DC Characteristics (1)
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Input high VIH
voltage
Applicable Pins
Test Condition
Min
Typ
Max
Unit
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG, TMIB1,
TMRIV,
TMCIV, FTIOA0
to FTIOD0,
FTIOA1 to
FTIOD1,SCK3,
SCK3_2, TRGV
VCC = 4.0 to 5.5 V
VCC × 0.8
—
VCC + 0.3
V
VCC × 0.9
—
VCC + 0.3
RXD, RXD_2,
SCL, SDA,
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P60 to P67,
P70 to P72
P74 to P76,
P85 to P87
VCC = 4.0 to 5.5 V
VCC × 0.7
—
VCC + 0.3
VCC × 0.8
—
VCC + 0.3
PB0 to PB7
VCC = 4.0 to 5.5 V
VCC × 0.7
—
AVCC + 0.3 V
VCC × 0.8
—
AVCC + 0.3
VCC – 0.5
—
VCC + 0.3
VCC – 0.3
—
VCC + 0.3
–0.3
—
VCC × 0.2
–0.3
—
VCC × 0.1
OSC1
Input low
voltage
VIL
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG, TMIB1,
TMRIV,
TMCIV, FTIOA0
to FTIOD0,
FTIOA1 to
FTIOD1, SCK3,
SCK3_2, TRGV
Note: Connect the TEST pin to Vss.
Rev.5.00 Nov. 02, 2005 Page 394 of 500
REJ09B0027-0500
VCC = 4.0 to 5.5 V
VCC = 4.0 to 5.5 V
V
V
V
Notes
Section 23 Electrical Characteristics
Values
Item
Symbol
Applicable Pins
Test Condition
Min
Typ
Max
Unit
Input low
voltage
VIL
RXD, RXD_2,
SCL, SDA,
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87,
PB0 to PB7
VCC = 4.0 to 5.5 V
–0.3
—
VCC × 0.3
V
–0.3
—
VCC × 0.2
V
OSC1
VCC = 4.0 to 5.5 V
V
Output
high
voltage
Output
low
voltage
VOH
VOL
–0.3
—
0.5
–0.3
—
0.3
VCC – 1.0
—
—
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P55,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87,
VCC = 4.0 to 5.5 V
–IOH = 0.1 mA
VCC – 0.5
—
—
P56, P57
VCC = 4.0 to 5.5 V
–IOH = 0.1 mA
VCC – 2.5
—
—
VCC = 3.0 to 4.0 V
–IOH = 0.1 mA
VCC – 2.0
—
—
VCC = 4.0 to 5.5 V
IOL = 1.6 mA
—
—
0.6
IOL = 0.4 mA
—
—
0.4
VCC = 4.0 to 5.5 V
IOL = 20.0 mA
—
—
1.5
VCC = 4.0 to 5.5 V
IOL = 10.0 mA
—
—
1.0
VCC = 4.0 to 5.5 V
IOL = 1.6 mA
—
—
0.4
IOL = 0.4 mA
—
—
0.4
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P70 to P72,
P74 to P76,
P85 to P87
P60 to P67
Notes
V
–IOH = 1.5 mA
V
V
V
Rev.5.00 Nov. 02, 2005 Page 395 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Values
Item
Symbol
Applicable Pins
Test Condition
Output
low
voltage
VOL
SCL, SDA
Input/
output
leakage
current
| IIL |
Typ
Max
Unit Notes
VCC = 4.0 to 5.5 V —
IOL = 6.0 mA
—
0.6
V
IOL = 3.0 mA
—
—
0.4
OSC1, TMIB1,
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG, TRGV,
TMRIV, TMCIV,
FTIOA0 to
FTIOD0, FTIOA1
to FTIOD1 RXD,
SCK3, RXD_2,
SCK3_2, SCL,
SDA
VIN = 0.5 V to
(VCC – 0.5 V)
—
—
1.0
µA
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87,
VIN = 0.5 V to
(VCC – 0.5 V)
—
—
1.0
µA
PB0 to PB7
VIN = 0.5 V to
(AVCC – 0.5 V)
—
—
1.0
µA
P10 to P12,
P14 to P17,
P50 to P55
VCC = 5.0 V,
VIN = 0.0 V
50.0
—
300.0
µA
VCC = 3.0 V,
VIN = 0.0 V
—
60.0
—
All input pins
except power
supply pins
f = 1 MHz,
VIN = 0.0 V,
Ta = 25°C
—
—
15.0
pF
IOPE1
Active
mode
current
consumption
VCC
Active mode 1
VCC = 5.0 V,
fOSC = 20 MHz
—
21.0
30.0
mA
Active mode 1
VCC = 3.0 V,
fOSC = 10 MHz
—
9.0
—
IOPE2
VCC
Active mode 2
VCC = 5.0 V,
fOSC = 20 MHz
—
1.8
3.0
Active mode 2
VCC = 3.0 V,
fOSC = 10 MHz
—
1.2
—
Pull-up
MOS
current
–Ip
Input
capacitance
Cin
Rev.5.00 Nov. 02, 2005 Page 396 of 500
REJ09B0027-0500
Min
Reference
value
*
*
Reference
value
mA
*
*
Reference
value
Section 23 Electrical Characteristics
Values
Item
Symbol
Applicable Pins
Test Condition
Min
Typ
Max
Unit
Notes
ISLEEP1
Sleep
mode
current
consumption
VCC
Sleep mode 1
VCC = 5.0 V,
fOSC = 20 MHz
—
17.5
22.5
mA
*
Sleep mode 1
VCC = 3.0 V,
fOSC = 10 MHz
—
7.5
—
ISLEEP2
VCC
Sleep mode 2
VCC = 5.0 V,
fOSC = 20 MHz
—
1.7
2.7
Sleep mode 2
VCC = 3.0 V,
fOSC = 10 MHz
—
1.1
—
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/2)
—
35.0
70.0
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/8)
—
25.0
—
*
Reference
value
mA
*
*
Reference
value
µA
Subactive ISUB
mode
current
consumption
VCC
Subsleep ISUBSP
mode
current
consumption
VCC
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/2)
—
25.0
50.0
µA
*
ISTBY
Standby
mode
current
consumption
VCC
32-kHz crystal
resonator not
used
—
—
5.0
µA
*
RAM data VRAM
retaining
voltage
VCC
2.0
—
—
V
Note:
*
*
*
Reference
value
Pin states during current consumption measurement are given below (excluding current
in the pull-up MOS transistors and output buffers).
Rev.5.00 Nov. 02, 2005 Page 397 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Mode
RES Pin
Internal State
Other Pins Oscillator Pins
Active mode 1
VCC
Operates
VCC
Active mode 2
Main clock:
ceramic or crystal resonator
Operates
(φOSC/64)
Sleep mode 1
VCC
Sleep mode 2
Subclock:
Pin X1 = VSS
Only timers operate
VCC
Only timers operate
(φOSC/64)
Subactive mode
VCC
Operates
VCC
Main clock:
ceramic or crystal resonator
Subsleep mode
VCC
Only timers operate
VCC
Subclock:
crystal resonator
Standby mode
VCC
CPU and timers
both stop
VCC
Main clock:
ceramic or crystal resonator
Subclock:
Pin X1 = VSS
Table 23.2 DC Characteristics (2)
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise indicated.
Values
Item
Symbol
Applicable Pins
Test Condition
Min
Typ
Max
Unit
Notes
EEPROM
current
consumption
IEEW
VCC
VCC = 5.0 V, tSCL = 2.5
µs (when writing)
—
—
2.0
mA
*
IEER
VCC
VCC = 5.0 V, tSCL = 2.5
µs (when reading)
—
—
0.3
mA
IEESTBY
VCC
VCC = 5.0 V, tSCL = 2.5
µs (at standby)
—
—
3.0
µA
Note:
*
The current consumption of the EEPROM chip is shown.
For the current consumption of H8/3687N, add the above current values to the current
consumption of H8/3687F.
Rev.5.00 Nov. 02, 2005 Page 398 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Table 23.2 DC Characteristics (3)
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Applicable Pins
Test Condition
Min
Typ
Max
Unit
Allowable output low
current (per pin)
IOL
Output pins except
port 6, SCL, and
SDA
VCC = 4.0 to 5.5 V
—
—
2.0
mA
Port 6
—
—
20.0
Output pins except
port 6, SCL, and
SDA
—
—
0.5
Port 6
—
—
10.0
SCL, SDA
—
—
6.0
—
—
40.0
Port 6,
SCL, and SDA
—
—
80.0
Output pins except
port 6, SCL, and
SDA
—
—
20.0
Port 6,
SCL, and SDA
—
—
40.0
—
—
2.0
—
—
0.2
—
—
30.0
—
—
8.0
Allowable output low
current (total)
∑IOL
Output pins except
port 6, SCL, and
SDA
VCC = 4.0 to 5.5 V
Allowable output high –IOH
current (per pin)
All output pins
VCC = 4.0 to 5.5 V
Allowable output high –∑IOH
current (total)
All output pins
VCC = 4.0 to 5.5 V
mA
mA
mA
Rev.5.00 Nov. 02, 2005 Page 399 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
23.2.3
AC Characteristics
Table 23.3 AC Characteristics
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Applicable
Pins
Item
Symbol
System clock
oscillation
frequency
fOSC
System clock (φ)
cycle time
tcyc
Subclock
oscillation
frequency
fW
X1, X2
Watch clock (φW)
cycle time
tW
X1, X2
Subclock (φSUB)
cycle time
tsubcyc
OSC1,
OSC2
Values
Test Condition
Min
Typ
Max
Unit
Reference
Figure
VCC = 4.0 to 5.5 V
2.0
—
20.0
MHz
*
2.0
—
10.0
1
—
64
tOSC
*
—
—
12.8
—
32.768 —
kHz
—
30.5
—
µs
2
—
8
tW
2
—
—
tcyc
tsubcyc
Instruction cycle
time
OSC1,
OSC2
—
—
10.0
ms
trc
Oscillation
stabilization time
(ceramic resonator)
OSC1,
OSC2
—
—
5.0
ms
Oscillation
stabilization time
trcx
X1, X2
—
—
2.0
s
External clock
high width
tCPH
OSC1
20.0
—
—
ns
40.0
—
—
External clock
low width
tCPL
20.0
—
—
40.0
—
—
External clock
rise time
tCPr
OSC1
VCC = 4.0 to 5.5 V
—
—
10.0
—
—
15.0
External clock
fall time
tCPf
OSC1
VCC = 4.0 to 5.5 V
—
—
10.0
—
—
15.0
OSC1
Rev.5.00 Nov. 02, 2005 Page 400 of 500
REJ09B0027-0500
VCC = 4.0 to 5.5 V
VCC = 4.0 to 5.5 V
2
µs
trc
Oscillation
stabilization time
(crystal resonator)
1
ns
ns
ns
2
*
Figure 23.1
Section 23 Electrical Characteristics
Item
Symbol
Applicable
Pins
RES pin low
width
tREL
RES
Values
Typ
Max
Unit
Reference
Figure
At power-on and in trc
modes other than
those below
—
—
ms
Figure 23.2
In active mode and 200
sleep mode
operation
—
—
ns
Test Condition
Min
Input pin high
width
tIH
NMI, TMIB1,
IRQ0 to
IRQ3,
WKP0 to
WKP5,
TMCIV,
TMRIV,
TRGV,
ADTRG,
FTIOA0 to
FTIOD0,
FTIOA1 to
FTIOD1
2
—
—
tcyc
tsubcyc
Input pin low
width
tIL
NMI, TMIB1,
IRQ0 to
IRQ3,
WKP0 to
WKP5,
TMCIV,
TMRIV,
TRGV,
ADTRG,
FTIOA0 to
FTIOD0,
FTIOA1 to
FTIOD1
2
—
—
tcyc
tsubcyc
Figure 23.3
Notes: 1. When an external clock is input, the minimum system clock oscillation frequency is
1.0 MHz.
2. Determined by MA2, MA1, MA0, SA1, and SA0 of system control register 2 (SYSCR2).
Rev.5.00 Nov. 02, 2005 Page 401 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Table 23.4 I2C Bus Interface Timing
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Max
Unit
Reference
Figure
12tcyc + 600 —
—
ns
Figure 23.4
tSCLH
3tcyc + 300
—
—
ns
tSCLL
5tcyc + 300
—
—
ns
SCL and SDA input
fall time
tSf
—
—
300
ns
SCL and SDA input
spike pulse removal
time
tSP
—
—
1tcyc
ns
SDA input bus-free
time
tBUF
5tcyc
—
—
ns
Start condition input
hold time
tSTAH
3tcyc
—
—
ns
Retransmission start
condition input setup
time
tSTAS
3tcyc
—
—
ns
Setup time for stop
condition input
tSTOS
3tcyc
—
—
ns
Item
Symbol
SCL input cycle time
tSCL
SCL input high width
SCL input low width
Test
Condition
Min
Typ
Data-input setup time tSDAS
1tcyc+20
—
—
ns
Data-input hold time
tSDAH
0
—
—
ns
Capacitive load of
SCL and SDA
cb
0
—
400
pF
SCL and SDA output
fall time
tSf
VCC = 4.0 to —
5.5 V
—
250
ns
—
—
300
Rev.5.00 Nov. 02, 2005 Page 402 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Table 23.5 Serial Communication Interface (SCI) Timing
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Input
clock
cycle
Asynchronous
Symbol
Applicable
Pins
tScyc
SCK3
Values
Test Condition
Clocked
synchronous
Input clock pulse
width
tSCKW
SCK3
Transmit data delay
time (clocked
synchronous)
tTXD
TXD
Receive data setup
time (clocked
synchronous)
tRXS
Receive data hold
time (clocked
synchronous)
tRXH
RXD
RXD
VCC = 4.0 to 5.5 V
VCC = 4.0 to 5.5 V
VCC = 4.0 to 5.5 V
Min
Typ Max Unit
Reference
Figure
4
—
—
Figure 23.5
6
—
—
0.4
—
0.6
tScyc
—
—
1
tcyc
—
—
1
50.0
—
—
100.0
—
—
50.0
—
—
100.0
—
—
tcyc
Figure 23.6
ns
ns
Rev.5.00 Nov. 02, 2005 Page 403 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
23.2.4
A/D Converter Characteristics
Table 23.6 A/D Converter Characteristics
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Test
Condition
Values
Min
Typ Max
Unit
Reference
Figure
V
*
Analog power supply AVCC
voltage
AVCC
3.3
VCC
5.5
Analog input voltage AVIN
AN0 to
AN7
VSS – 0.3
—
AVCC + 0.3 V
Analog power supply AIOPE
current
AVCC
—
2.0
mA
AVCC = 5.0 V —
1
fOSC =
20 MHz
2
AISTOP1
AVCC
—
50
—
µA
*
Reference
value
AISTOP2
AVCC
—
—
5.0
µA
*
Analog input
capacitance
CAIN
AN0 to
AN7
—
—
30.0
pF
Allowable signal
source impedance
RAIN
AN0 to
AN7
—
—
5.0
kΩ
10
10
10
bit
—
—
tcyc
Resolution (data
length)
Conversion time
(single mode)
AVCC = 3.3 to 134
5.5 V
Nonlinearity error
—
—
±7.5
LSB
Offset error
—
—
±7.5
LSB
Full-scale error
—
—
±7.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±8.0
LSB
AVCC = 4.0 to 70
5.5 V
—
—
tcyc
Nonlinearity error
—
—
±7.5
LSB
Offset error
—
—
±7.5
LSB
Full-scale error
—
—
±7.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±8.0
LSB
Conversion time
(single mode)
Rev.5.00 Nov. 02, 2005 Page 404 of 500
REJ09B0027-0500
3
Section 23 Electrical Characteristics
Item
Symbol
Applicable
Pins
Conversion time
(single mode)
Test
Condition
Values
Min
AVCC = 4.0 to 134
5.5 V
Typ
Max
Unit
—
—
tcyc
Nonlinearity error
—
—
±3.5
LSB
Offset error
—
—
±3.5
LSB
Full-scale error
—
—
±3.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±4.0
LSB
Referenc
e Figure
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, subactive, and subsleep modes while the
A/D converter is idle.
23.2.5
Watchdog Timer Characteristics
Table 23.7 Watchdog Timer Characteristics
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Symbol
On-chip
oscillator
overflow
time
tOVF
Note:
*
Applicable
Pins
Test
Condition
Values
Min
Typ
Max
Unit
Reference
Figure
0.2
0.4
—
s
*
Shows the time to count from 0 to 255, at which point an internal reset is generated,
when the internal oscillator is selected.
Rev.5.00 Nov. 02, 2005 Page 405 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
23.2.6
Flash Memory Characteristics
Table 23.8 Flash Memory Characteristics
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
1 2 4
Programming time (per 128 bytes)* * *
Test Condition Min
Typ
Max
Unit
tP
—
7
200
ms
Erase time (per block) * * *
tE
—
100
1200
ms
Reprogramming count
NWEC
1000
10000
—
Times
Programming
Wait time after SWE
1
bit setting*
x
1
—
—
µs
Wait time after PSU
1
bit setting*
y
50
—
—
µs
Wait time after P bit setting
z1
1≤n≤6
28
30
32
µs
z2
7 ≤ n ≤ 1000
198
200
202
µs
z3
Additionalprogramming
8
10
12
µs
1 3 6
1 4
**
Wait time after P bit clear*
α
5
—
—
µs
Wait time after PSU
1
bit clear*
β
5
—
—
µs
Wait time after PV
1
bit setting*
γ
4
—
—
µs
Wait time after
1
dummy write*
ε
2
—
—
µs
Wait time after PV bit clear*
η
2
—
—
µs
Wait time after SWE
1
bit clear*
θ
100
—
—
µs
Maximum programming
1 4 5
count * * *
N
—
—
1000
Times
1
1
Rev.5.00 Nov. 02, 2005 Page 406 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Values
Item
Erasing
Symbol
Test Condition Min
Typ
Max
Unit
Wait time after SWE
1
bit setting*
x
1
—
—
µs
Wait time after ESU
1
bit setting*
y
100
—
—
µs
Wait time after E bit
1 6
setting* *
z
10
—
100
ms
Wait time after E bit clear*
α
10
—
—
µs
Wait time after ESU
1
bit clear*
β
10
—
—
µs
Wait time after EV
1
bit setting*
γ
20
—
—
µs
Wait time after
1
dummy write*
ε
2
—
—
µs
Wait time after EV bit clear*
η
4
—
—
µs
Wait time after SWE
1
bit clear*
θ
100
—
—
µs
N
—
—
120
Times
1
1
1 6 7
Maximum erase count * * *
Notes: 1. Make the time settings in accordance with the program/erase algorithms.
2. The programming time for 128 bytes. (Indicates the total time for which the P bit in flash
memory control register 1 (FLMCR1) is set. The program-verify time is not included.)
3. The time required to erase one block. (Indicates the time for which the E bit in flash
memory control register 1 (FLMCR1) is set. The erase-verify time is not included.)
4. Programming time maximum value (tP(max.)) = wait time after P bit setting (z) ×
maximum programming count (N)
5. Set the maximum programming count (N) according to the actual set values of z1, z2,
and z3, so that it does not exceed the programming time maximum value (tP(max.)).
The wait time after P bit setting (z1, z2) should be changed as follows according to the
value of the programming count (n).
Programming count (n)
1≤n≤6
z1 = 30 µs
7 ≤ n ≤ 1000 z2 = 200 µs
6. Erase time maximum value (tE(max.)) = wait time after E bit setting (z) × maximum
erase count (N)
7. Set the maximum erase count (N) according to the actual set value of (z), so that it
does not exceed the erase time maximum value (tE(max.)).
Rev.5.00 Nov. 02, 2005 Page 407 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
23.2.7
EEPROM Characteristics
Table 23.9 EEPROM Characteristics
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item
Test
Symbol Condition
Min
Typ
SCL input cycle time
tSCL
2500
SCL input high pulse width
tSCLH
600
µs
SCL input low pulse width
tSCLL
1200
ns
SCL, SDA input spike pulse
removal time
tSP
50
ns
SDA input bus-free time
tBUF
1200
ns
Start condition input hold time
tSTAH
600
ns
Retransmit start condition input
setup time
tSTAS
600
ns
Stop condition input setup time
tSTOS
600
ns
Data input setup time
tSDAS
160
ns
Data input hold time
tSDAH
0
ns
SCL, SDA input fall time
tSf
300
ns
SDA input rise time
tSr
300
ns
Data output hold time
tDH
50
ns
SCL, SDA capacitive load
Cb
0
400
pF
Access time
tAA
100
900
ns
Cycle time at writing*
tWC
10
ms
Reset release time
tRES
13
ms
Note:
*
Max
Unit
Reference
Figure
ns
Figure 23.7
Cycle time at writing is a time from the stop condition to write completion (internal
control).
Rev.5.00 Nov. 02, 2005 Page 408 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
23.2.8
Power-Supply-Voltage Detection Circuit Characteristics (Optional)
Table 23.10 Power-Supply-Voltage Detection Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Test Condition Min
Typ
Max
Unit
Power-supply falling detection
voltage
Power-supply rising detection
voltage
Reset detection voltage 1*1
Reset detection voltage 2*2
Lower-limit voltage of LVDR
operation*3
Vint (D)
LVDSEL = 0
3.3
3.7
—
V
Vint (U)
LVDSEL = 0
—
4.0
4.5
V
Vreset1
LVDSEL = 0
—
2.3
2.7
V
Vreset2
LVDSEL = 1
3.0
3.6
4.2
V
VLVDRmin
1.0
—
—
V
tLVDON
50
—
—
µs
LVDE = 1,
Vcc = 5.0 V,
When a 32-kHz
crystal resonator
is not used
—
350
µA
LVD stabilization time
Current consumption in standby
mode
ISTBY
Notes: 1. This voltage should be used when the falling and rising voltage detection function is
used.
2. Select the low-voltage reset 2 when only the low-voltage detection reset is used.
3. When the power-supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises, a reset
may not occur. Therefore sufficient evaluation is required.
23.2.9
Power-On Reset Circuit Characteristics (Optional)
Table 23.11 Power-On Reset Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Pull-up resistance of RES pin
Power-on reset start voltage*
Note:
*
Test Condition Min
Typ
Max
Unit
RRES
100
150
—
kΩ
Vpor
—
—
100
mV
The power-supply voltage (Vcc) must fall below Vpor = 100 mV and then rise after
charge of the RES pin is removed completely. In order to remove charge of the RES
pin, it is recommended that the diode be placed in the Vcc side. If the power-supply
voltage (Vcc) rises from the point over 100 mV, a power-on reset may not occur.
Rev.5.00 Nov. 02, 2005 Page 409 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
23.3
Electrical Characteristics (Mask-ROM Version, EEPROM Stacked
Mask-ROM Version)
23.3.1
Power Supply Voltage and Operating Ranges
Power Supply Voltage and Oscillation Frequency Range
φOSC (MHz)
φW (kHz)
20.0
32.768
10.0
2.0
2.7
4.0
5.5
VCC (V)
• AVCC = 3.3 to 5.5 V
• Active mode
• Sleep mode
Power Supply Voltage and Operating Frequency Range
Rev.5.00 Nov. 02, 2005 Page 410 of 500
REJ09B0027-0500
2.7
4.0
• AVCC = 3.3 to 5.5 V
• All operating modes
5.5
VCC (V)
Section 23 Electrical Characteristics
φ (MHz)
φSUB (kHz)
20.0
16.384
10.0
8.192
4.096
1.0
2.7
φ (kHz)
4.0
5.5
VCC (V)
2.7
• AVCC = 3.3 to 5.5 V
• Active mode
• Sleep mode
(When MA2 in SYSCR2 = 0)
4.0
5.5
VCC (V)
• AVCC = 3.3 to 5.5 V
• Subactive mode
• Subsleep mode
2500
1250
78.125
2.7
4.0
5.5 VCC (V)
• AVCC = 3.3 to 5.5 V
• Active mode
• Sleep mode
(When MA2 in SYSCR2 = 1)
Analog Power Supply Voltage and A/D Converter Accuracy Guarantee Range
φ (MHz)
20.0
10.0
2.0
3.3
4.0
5.5
AVCC (V)
• VCC = 2.7 to 5.5 V
• Active mode
• Sleep mode
Range of Power Supply Voltage and Oscillation Frequency when Low-Voltage Detection
Circuit is Used
Rev.5.00 Nov. 02, 2005 Page 411 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
φosc (MHz)
20.0
16.0
2.0
Vcc(V)
3.0
4.5
5.5
Operation guarantee range
Operation guarantee range except
A/D conversion accuracy
Rev.5.00 Nov. 02, 2005 Page 412 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
23.3.2
DC Characteristics
Table 23.12 DC Characteristics (1)
VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Input high VIH
voltage
Applicable Pins
Test Condition
Min
Typ
Max
Unit
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG,TMIB1,
TMRIV,
TMCIV, FTIOA0
to FTIOD0,
FTIOA1 to
FTIOD1, SCK3,
SCK3_2, TRGV
VCC = 4.0 to 5.5 V
VCC × 0.8
—
VCC + 0.3
V
VCC × 0.9
—
VCC + 0.3
RXD, RXD_2
SCL, SDA,
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37
P50 to P57,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87
VCC = 4.0 to 5.5 V
VCC × 0.7
—
VCC + 0.3
VCC × 0.8
—
VCC + 0.3
PB0 to PB7
VCC = 4.0 to 5.5 V
OSC1
VCC = 4.0 to 5.5 V
Notes
V
VCC × 0.7
—
AVCC + 0.3 V
VCC × 0.8
—
AVCC + 0.3
VCC – 0.5
—
VCC + 0.3
VCC – 0.3
—
VCC + 0.3
V
Note: Connect the TEST pin to Vss.
Rev.5.00 Nov. 02, 2005 Page 413 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Values
Item
Symbol
Applicable Pins
Test Condition
Min
Typ
Max
Unit
Input low
voltage
VIL
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG, TMIB1,
TMRIV,
TMCIV, FTIOA0
to FTIOD0,
FTIOA1 to
FTIOD1, SCK3,
SCK3_2, TRGV
VCC = 4.0 to 5.5 V
–0.3
—
VCC × 0.2
V
–0.3
—
VCC × 0.1
RXD, RXD_2,
SCL, SDA,
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P60 to P67,.
P70 to P72,
P74 to P76,
P85 to P87,
PB0 to PB7
VCC = 4.0 to 5.5 V
–0.3
—
VCC × 0.3
–0.3
—
VCC × 0.2
OSC1
VCC = 4.0 to 5.5 V
Output
high
voltage
VOH
VCC = 4.0 to 5.5 V
–0.3
—
0.5
–0.3
—
0.3
VCC – 1.0
—
—
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P55,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87
–IOH = 0.1 mA
VCC – 0.5
—
—
P56, P57
VCC = 4.0 to 5.5 V
VCC – 2.5
—
—
VCC – 2.0
—
—
VCC =2.7 to 4.0 V
–IOH = 0.1 mA
REJ09B0027-0500
V
V
–IOH = 1.5 mA
–IOH = 0.1 mA
Rev.5.00 Nov. 02, 2005 Page 414 of 500
V
V
Notes
Section 23 Electrical Characteristics
Values
Item
Symbol
Applicable Pins
Test Condition
Min
Typ
Max
Unit
Output
low
voltage
VOL
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P70 to P72,
P74 to P76,
P85 to P87
VCC = 4.0 to 5.5 V —
—
0.6
V
—
—
0.4
P60 to P67
VCC = 4.0 to 5.5 V —
—
1.5
—
1.0
—
0.4
—
—
0.4
VCC = 4.0 to 5.5 V —
—
0.6
Notes
IOL = 1.6 mA
IOL = 0.4 mA
V
IOL = 20.0 mA
VCC = 4.0 to 5.5 V —
IOL = 10.0 mA
VCC = 4.0 to 5.5 V —
IOL = 1.6 mA
IOL = 0.4 mA
SCL, SDA
V
IOL = 6.0 mA
Input/
output
leakage
current
| IIL |
IOL = 3.0 mA
—
—
0.4
OSC1, TMIB1,
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG, TRGV,
TMRIV, TMCIV,
FTIOA0 to
FTIOD0, FTIOA1
to FTIOD1, RXD,
SCK3, RXD_2,
SCK3_2, SCL,
SDA
VIN = 0.5 V to
(VCC – 0.5 V)
—
—
1.0
µA
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87,
VIN = 0.5 V to
(VCC – 0.5 V)
—
—
1.0
µA
PB0 to PB7
VIN = 0.5 V to
(AVCC – 0.5 V)
—
—
1.0
µA
Rev.5.00 Nov. 02, 2005 Page 415 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Values
Item
Symbol
Applicable Pins
Test Condition
Min
Typ
Max
Unit
Pull-up
MOS
current
–Ip
P10 to P12,
P14 to P17,
P50 to P55
VCC = 5.0 V,
VIN = 0.0 V
50.0
—
300.0
µA
VCC = 3.0 V,
VIN = 0.0 V
—
60.0
—
Input
capacitance
Cin
Reference
value
All input pins
except power
supply pins
f = 1 MHz,
VIN = 0.0 V,
Ta = 25°C
—
—
15.0
pF
IOPE1
Active
mode
current
consumption
VCC
Active mode 1
VCC = 5.0 V,
fOSC = 20 MHz
—
21.0
30.0
mA
Active mode 1
VCC = 3.0 V,
fOSC = 10 MHz
—
9.0
—
IOPE2
VCC
Active mode 2
VCC = 5.0 V,
fOSC = 20 MHz
—
1.8
3.0
Active mode 2
VCC = 3.0 V,
fOSC = 10 MHz
—
1.2
—
Sleep mode 1
VCC = 5.0 V,
fOSC = 20 MHz
—
17.5
22.5
Sleep mode 1
VCC = 3.0 V,
fOSC = 10 MHz
—
7.5
—
Sleep mode 2
VCC = 5.0 V,
fOSC = 20 MHz
—
1.7
2.7
Sleep mode 2
VCC = 3.0 V,
fOSC = 10 MHz
—
1.1
—
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/2)
—
35.0
70.0
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/8)
—
25.0
—
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/2)
—
25.0
50.0
Sleep
ISLEEP1
mode
current
consumption
VCC
ISLEEP2
VCC
Subactive ISUB
mode
current
consumption
VCC
Subsleep ISUBSP
mode
current
consumption
VCC
Rev.5.00 Nov. 02, 2005 Page 416 of 500
REJ09B0027-0500
Notes
*
*
Reference
value
mA
*
*
Reference
value
mA
*
*
Reference
value
mA
*
*
Reference
value
µA
*
*
Reference
value
µA
*
Section 23 Electrical Characteristics
Values
Item
Applicable Pins
Test Condition
Min
Typ
Max
Unit
Notes
ISTBY
Standby
mode
current
consumption
VCC
32-kHz crystal
resonator not
used
—
—
5.0
µA
*
RAM data VRAM
retaining
voltage
VCC
2.0
—
—
V
Note:
Symbol
*
Pin states during current consumption measurement are given below (excluding current
in the pull-up MOS transistors and output buffers).
Mode
RES Pin
Internal State
Other Pins
Oscillator Pins
Active mode 1
VCC
Operates
VCC
Main clock:
ceramic or crystal
resonator
Active mode 2
Sleep mode 1
Operates
(φOSC/64)
VCC
Sleep mode 2
Only timers operate
Subclock:
Pin X1 = VSS
VCC
Only timers operate
(φOSC/64)
Subactive mode
VCC
Operates
VCC
Main clock:
ceramic or crystal
resonator
Subsleep mode
VCC
Only timers operate
VCC
Subclock resonator:
crystal
Standby mode
VCC
CPU and timers
both stop
VCC
Main clock:
ceramic or crystal
resonator
Subclock:
Pin X1 = VSS
Rev.5.00 Nov. 02, 2005 Page 417 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Table 23.12 DC Characteristics (2)
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise indicated.
Values
Item
Symbol
Applicable Pins
Test Condition
Min
Typ
Max
Unit
Notes
EEPROM
current
consumption
IEEW
VCC
VCC = 5.0 V, tSCL = 2.5
µs (when writing)
—
—
2.0
mA
*
IEER
VCC
VCC = 5.0 V, tSCL = 2.5
µs (when reading)
—
—
0.3
mA
IEESTBY
VCC
VCC = 5.0 V, tSCL = 2.5
µs (at standby)
—
—
3.0
µA
Note:
*
The current consumption of the EEPROM chip is shown.
For the current consumption of H8/3687N, add the above current values to the current
consumption of H8/3687.
Rev.5.00 Nov. 02, 2005 Page 418 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Table 23.12 DC Characteristics (3)
VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Applicable Pins Test Condition
Allowable output low
current (per pin)
IOL
Output pins
except port 6,
SCL, and SDA
Allowable output low
current (total)
∑IOL
Allowable output high –IOH
Min
Typ
Max
Unit
—
—
2.0
mA
Port 6
—
—
20.0
Output pins
except port 6,
SCL, and SDA
—
—
0.5
Port 6
—
—
10.0
SCL, SDA
—
—
6.0
—
—
40.0
Port 6,
SCL, and SDA
—
—
80.0
Output pins
except port 6,
SCL, and SDA
—
—
20.0
Port 6,
SCL, and SDA
—
—
40.0
—
—
2.0
—
—
0.2
—
—
30.0
—
—
8.0
Output pins
except port 6,
SCL, and SDA
VCC = 4.0 to 5.5 V
VCC = 4.0 to 5.5 V
All output pins
VCC = 4.0 to 5.5 V
All output pins
VCC = 4.0 to 5.5 V
current (per pin)
Allowable output high –∑IOH
current (total)
mA
mA
mA
Rev.5.00 Nov. 02, 2005 Page 419 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
23.3.3
AC Characteristics
Table 23.13 AC Characteristics
VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Symbol
System clock
oscillation
frequency
fOSC
System clock (φ)
tcyc
Applicable
Pins
Test Condition
OSC1,
OSC2
VCC = 4.0 to 5.5 V
Values
Min
Typ
Max
Unit
Reference
Figure
2.0
—
20.0
MHz
*
*
2.0
cycle time
10.0
1
—
64
tOSC
—
—
12.8
µs
Subclock
oscillation
frequency
fW
X1, X2
—
32.768 —
kHz
Watch clock (φW)
cycle time
tW
X1, X2
—
30.5
—
µs
Subclock (φSUB)
cycle time
tsubcyc
2
—
8
tW
2
—
—
tcyc
tsubcyc
Instruction cycle
time
trc
OSC1,
OSC2
—
—
10.0
ms
trc
Oscillation
stabilization time
(ceramic resonator)
OSC1,
OSC2
—
—
5.0
ms
Oscillation
stabilization time
trcx
X1, X2
—
—
2.0
s
External clock
tCPH
OSC1
20.0
—
—
ns
40.0
—
—
Oscillation
stabilization time
(crystal resonator)
VCC = 4.0 to 5.5 V
high width
External clock
tCPL
OSC1
VCC = 4.0 to 5.5 V
low width
External clock
External clock
—
—
—
—
—
10.0
OSC1
VCC = 4.0 to 5.5 V
—
—
—
15.0
tCPf
OSC1
VCC = 4.0 to 5.5 V
—
—
10.0
—
—
15.0
fall time
Rev.5.00 Nov. 02, 2005 Page 420 of 500
REJ09B0027-0500
20.0
40.0
tCPr
rise time
1
ns
ns
ns
2
2
*
Figure 23.1
Section 23 Electrical Characteristics
Item
Symbol
Applicable
Pins
RES pin low
width
tREL
RES
Values
Typ
Max
Unit
Reference
Figure
At power-on and in trc
modes other than
those below
—
—
ms
Figure 23.2
In active mode and 200
sleep mode
operation
—
—
ns
Test Condition
Min
Input pin high
width
tIH
NMI, TMIB1,
IRQ0 to
IRQ3,
WKP0 to
WKP5,
TMCIV,
TMRIV,
TRGV,
ADTRG,
FTIOA0 to
FTIOD0,
FTIOA1 to
FTIOD1
2
—
—
tcyc
tsubcyc
Input pin low
width
tIL
NMI, TMIB1,
IRQ0 to
IRQ3,
WKP0 to
WKP5,
TMCIV,
TMRIV,
TRGV,
ADTRG,
FTIOA0 to
FTIOD0,
FTIOA1 to
FTIOD1
2
—
—
tcyc
tsubcyc
Figure 23.3
Notes: 1. When an external clock is input, the minimum system clock oscillation frequency is
1.0 MHz.
2. Determined by MA2, MA1, MA0, SA1, and SA0 of system control register 2 (SYSCR2).
Rev.5.00 Nov. 02, 2005 Page 421 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Table 23.14 I2C Bus Interface Timing
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Max
Unit
Reference
Figure
12tcyc + 600 —
—
ns
Figure 23.4
tSCLH
3tcyc + 300
—
—
ns
tSCLL
5tcyc + 300
—
—
ns
SCL and SDA input
fall time
tSf
—
—
300
ns
SCL and SDA input
spike pulse removal
time
tSP
—
—
1tcyc
ns
SDA input bus-free
time
tBUF
5tcyc
—
—
ns
Start condition input
hold time
tSTAH
3tcyc
—
—
ns
Retransmission start
condition input setup
time
tSTAS
3tcyc
—
—
ns
Setup time for stop
condition input
tSTOS
3tcyc
—
—
ns
Item
Symbol
SCL input cycle time
tSCL
SCL input high width
SCL input low width
Test
Condition
Min
Typ
Data-input setup time tSDAS
1tcyc+20
—
—
ns
Data-input hold time
tSDAH
0
—
—
ns
Capacitive load of
SCL and SDA
cb
0
—
400
pF
SCL and SDA output
fall time
tSf
—
—
250
ns
—
—
300
VCC = 4.0
to 5.5 V
Rev.5.00 Nov. 02, 2005 Page 422 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Table 23.15 Serial Communication Interface (SCI) Timing
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Input
clock
Asynchronous
cycle
Clocked
synchronous
Symbol
Min
Typ
Max Unit
Reference
Figure
tScyc
SCK3
4
—
—
Figure 23.5
6
—
—
0.4
—
0.6
tScyc
—
—
1
tcyc
—
—
1
50.0
—
—
100.0
—
—
50.0
—
—
100.0
—
—
Input clock pulse
width
tSCKW
SCK3
Transmit data delay
tTXD
TXD
VCC = 4.0 to 5.5 V
time (clocked
synchronous)
Receive data setup
tRXS
RXD
VCC = 4.0 to 5.5 V
time (clocked
synchronous)
Receive data hold
time (clocked
synchronous)
Values
Applicable
Pins
Test Condition
tRXH
RXD
VCC = 4.0 to 5.5 V
tcyc
Figure 23.6
ns
ns
Rev.5.00 Nov. 02, 2005 Page 423 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
23.3.4
A/D Converter Characteristics
Table 23.16 A/D Converter Characteristics
VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Test
Condition
Values
Min
Typ
Max
Unit
Reference
Figure
V
*
Analog power supply AVCC
voltage
AVCC
3.3
VCC
5.5
Analog input voltage AVIN
AN0 to
AN7
VSS –
0.3
—
AVCC + 0.3 V
Analog power supply AIOPE
current
AVCC
—
—
2.0
mA
AVCC = 5.0 V
1
fOSC =
20 MHz
2
AISTOP1
AVCC
—
50
—
µA
*
Reference
value
AISTOP2
AVCC
—
—
5.0
µA
*
Analog input
capacitance
CAIN
AN0 to
AN7
—
—
30.0
pF
Allowable signal
source impedance
RAIN
AN0 to
AN7
—
—
5.0
kΩ
10
10
10
bit
134
—
—
tcyc
Nonlinearity error
—
—
±7.5
LSB
Offset error
—
—
±7.5
LSB
Resolution (data
length)
Conversion time
(single mode)
AVCC = 3.3 to
5.5 V
Full-scale error
—
—
±7.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±8.0
LSB
70
—
—
tcyc
Nonlinearity error
—
—
±7.5
LSB
Offset error
—
—
±7.5
LSB
Full-scale error
—
—
±7.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±8.0
LSB
Conversion time
(single mode)
Rev.5.00 Nov. 02, 2005 Page 424 of 500
REJ09B0027-0500
AVCC = 4.0 to
5.5 V
3
Section 23 Electrical Characteristics
Item
Symbol
Applicable
Pins
Test Condition
Conversion time
(single mode)
Values
Min
AVCC = 4.0 to 5.5 V 134
Typ
Max
Unit
—
—
tcyc
Nonlinearity error
—
—
±3.5
LSB
Offset error
—
—
±3.5
LSB
Full-scale error
—
—
±3.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±4.0
LSB
Reference
Figure
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, subactive, and subsleep modes while the
A/D converter is idle.
23.3.5
Watchdog Timer Characteristics
Table 23.17 Watchdog Timer Characteristics
VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Symbol
On-chip
oscillator
overflow
time
tOVF
Note:
*
Applicable
Pins
Test
Condition
Values
Min
Typ
Max
Unit
Reference
Figure
0.2
0.4
—
s
*
Shows the time to count from 0 to 255, at which point an internal reset is generated,
when the internal oscillator is selected.
Rev.5.00 Nov. 02, 2005 Page 425 of 500
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Section 23 Electrical Characteristics
23.3.6
EEPROM Characteristics
Table 23.18 EEPROM Characteristics
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise indicated.
Values
Test
Reference
Condition Min
Typ Max Unit Figure
Item
Symbol
SCL input cycle time
tSCL
2500
SCL input high pulse width
tSCLH
600
µs
SCL input low pulse width
tSCLL
1200
ns
SCL, SDA input spike pulse
removal time
tSP
50
ns
SDA input bus-free time
tBUF
1200
ns
Start condition input hold time
tSTAH
600
ns
Retransmit start condition input
setup time
tSTAS
600
ns
Stop condition input setup time
tSTOS
600
ns
Data input setup time
tSDAS
160
ns
Data input hold time
tSDAH
0
ns
SCL, SDA input fall time
tSf
300
ns
SDA input rise time
tSr
300
ns
Data output hold time
tDH
50
ns
SCL, SDA capacitive load
Cb
0
400
pF
Access time
tAA
100
900
ns
Cycle time at writing*
tWC
10
ms
Reset release time
tRES
13
ms
Note:
*
ns
Figure 23.7
Cycle time at writing is a time from the stop condition to write completion (internal
control).
Rev.5.00 Nov. 02, 2005 Page 426 of 500
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Section 23 Electrical Characteristics
23.3.7
Power-Supply-Voltage Detection Circuit Characteristics (Optional)
Table 23.19 Power-Supply-Voltage Detection Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Test
Condition
Power-supply falling detection
voltage
Vint (D)
LVDSEL = 0
3.3
3.7
—
V
Power-supply rising detection
voltage
Vint (U)
LVDSEL = 0
—
4.0
4.5
V
Reset detection voltage 1*1
Vreset1
LVDSEL = 0
—
2.3
2.7
V
Reset detection voltage 2*
2
Vreset2
LVDSEL = 1
3.0
3.6
4.2
V
Lower-limit voltage of LVDR
3
operation*
VLVDRmin
1.0
—
—
V
LVD stabilization time
tLVDON
50
—
—
µs
Current consumption in standby
mode
ISTBY
—
—
350
µA
LVDE = 1,
Vcc = 5.0 V,
When a 32kHz crystal
resonator is
not used
Min
Typ
Max
Unit
Notes: 1. This voltage should be used when the falling and rising voltage detection function is
used.
2. Select the low-voltage reset 2 when only the low-voltage detection reset is used.
3. When the power-supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises, a reset
may not occur. Therefore sufficient evaluation is required.
Rev.5.00 Nov. 02, 2005 Page 427 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
23.3.8
Power-On Reset Circuit Characteristics (Optional)
Table 23.20 Power-On Reset Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Typ
Max
Unit
RRES
100
150
—
kΩ
Vpor
—
—
100
mV
Symbol
Pull-up resistance of RES pin
Power-on reset start voltage*
23.4
*
Values
Min
Item
Note:
Test
Condition
The power-supply voltage (Vcc) must fall below Vpor = 100 mV and then rise after
charge of the RES pin is removed completely. In order to remove charge of the RES
pin, it is recommended that the diode be placed in the Vcc side. If the power-supply
voltage (Vcc) rises from the point over 100 mV, a power-on reset may not occur.
Operation Timing
t OSC
VIH
OSC1
VIL
t CPH
t CPL
t CPf
t CPr
Figure 23.1 System Clock Input Timing
Rev.5.00 Nov. 02, 2005 Page 428 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
VCC × 0.7
VCC
OSC1
tREL
RES
VIL
VIL
tREL
Figure 23.2 RES Low Width Timing
NMI
IRQ0 to IRQ3
WKP0 to WKP5
ADTRG
FTIOA0 to FTIOD0,
FTIOA1 to FTIOD1,
TMCIV, TMRIV
TRGV
VIH
VIL
t IL
t IH
Figure 23.3 Input Timing
VIH
SDA
VIL
tBUF
tSTAH
tSCLH
tSTAS
tSP
tSTOS
SCL
P*
S*
tSf
Sr*
tSCLL
P*
tSDAS
tSCL
tSDAH
Note: * S, P, and Sr represent the following:
S: Start condition
P: Stop condition
Sr: Retransmission start condition
Figure 23.4 I2C Bus Interface Input/Output Timing
Rev.5.00 Nov. 02, 2005 Page 429 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
t SCKW
SCK3
t Scyc
Figure 23.5 SCK3 Input Clock Timing
t Scyc
SCK3
VIH or VOH *
VIL or VOL *
t TXD
*
TXD
(transmit data)
VOH
VOL
*
t RXS
t RXH
RXD
(receive data)
Note:
* Output timing reference levels
Output high:
V OH= 2.0 V
Output low:
V OL= 0.8 V
Load conditions are shown in figure 23.8.
Figure 23.6 SCI Input/Output Timing in Clocked Synchronous Mode
Rev.5.00 Nov. 02, 2005 Page 430 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
1/fSCL
tSf
tSCLH
tSP
tSCLL
SCL
tSTAS
tSDAH
tSTAH
tSTOS
tSDAS
tSr
SDA
(in)
tBUF
tAA
tDH
SDA
(out)
Figure 23.7 EEPROM Bus Timing
23.5
Output Load Condition
VCC
2.4 kΩ
LSI output pin
30 pF
12 k Ω
Figure 23.8 Output Load Circuit
Rev.5.00 Nov. 02, 2005 Page 431 of 500
REJ09B0027-0500
Section 23 Electrical Characteristics
Rev.5.00 Nov. 02, 2005 Page 432 of 500
REJ09B0027-0500
Appendix
Appendix A Instruction Set
A.1
Instruction List
Condition Code
Symbol
Description
Rd
General destination register
Rs
General source register
Rn
General register
ERd
General destination register (address register or 32-bit register)
ERs
General source register (address register or 32-bit register)
ERn
General register (32-bit register)
(EAd)
Destination operand
(EAs)
Source operand
PC
Program counter
SP
Stack pointer
CCR
Condition-code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
disp
Displacement
→
Transfer from the operand on the left to the operand on the right, or transition from
the state on the left to the state on the right
+
Addition of the operands on both sides
–
Subtraction of the operand on the right from the operand on the left
×
Multiplication of the operands on both sides
÷
Division of the operand on the left by the operand on the right
∧
Logical AND of the operands on both sides
∨
Logical OR of the operands on both sides
⊕
Logical exclusive OR of the operands on both sides
¬
NOT (logical complement)
( ), < >
Contents of operand
Rev.5.00 Nov. 02, 2005 Page 433 of 500
REJ09B0027-0500
Appendix
Note: General registers include 8-bit registers (R0H to R7H and R0L to R7L) and 16-bit registers
(R0 to R7 and E0 to E7).
Symbol
Description
↔
Condition Code Notation (cont)
Changed according to execution result
*
Undetermined (no guaranteed value)
0
Cleared to 0
1
Set to 1
—
Not affected by execution of the instruction
∆
Varies depending on conditions, described in notes
Rev.5.00 Nov. 02, 2005 Page 434 of 500
REJ09B0027-0500
Appendix
Table A.1
Instruction Set
1. Data Transfer Instructions
Condition Code
— —
MOV.B @(d:16, ERs), Rd
B
4
@(d:16, ERs) → Rd8
— —
MOV.B @(d:24, ERs), Rd
B
8
@(d:24, ERs) → Rd8
— —
MOV.B @ERs+, Rd
B
@ERs → Rd8
ERs32+1 → ERs32
— —
MOV.B @aa:8, Rd
B
2
@aa:8 → Rd8
— —
MOV.B @aa:16, Rd
B
4
@aa:16 → Rd8
— —
MOV.B @aa:24, Rd
B
6
@aa:24 → Rd8
— —
MOV.B Rs, @ERd
B
Rs8 → @ERd
— —
MOV.B Rs, @(d:16, ERd)
B
4
Rs8 → @(d:16, ERd)
— —
MOV.B Rs, @(d:24, ERd)
B
8
Rs8 → @(d:24, ERd)
— —
MOV.B Rs, @–ERd
B
ERd32–1 → ERd32
Rs8 → @ERd
— —
MOV.B Rs, @aa:8
B
2
Rs8 → @aa:8
— —
MOV.B Rs, @aa:16
B
4
Rs8 → @aa:16
— —
MOV.B Rs, @aa:24
B
6
Rs8 → @aa:24
— —
MOV.W #xx:16, Rd
W 4
#xx:16 → Rd16
— —
MOV.W Rs, Rd
W
Rs16 → Rd16
— —
MOV.W @ERs, Rd
W
@ERs → Rd16
— —
2
2
2
2
2
2
MOV.W @(d:16, ERs), Rd W
4
@(d:16, ERs) → Rd16
— —
MOV.W @(d:24, ERs), Rd W
8
@(d:24, ERs) → Rd16
— —
@ERs → Rd16
ERs32+2 → @ERd32
— —
MOV.W @ERs+, Rd
W
MOV.W @aa:16, Rd
W
4
@aa:16 → Rd16
— —
MOV.W @aa:24, Rd
W
6
@aa:24 → Rd16
— —
MOV.W Rs, @ERd
W
Rs16 → @ERd
— —
2
2
MOV.W Rs, @(d:16, ERd) W
4
Rs16 → @(d:16, ERd)
— —
MOV.W Rs, @(d:24, ERd) W
8
Rs16 → @(d:24, ERd)
— —
0 —
0 —
0 —
0 —
Advanced
@ERs → Rd8
B
↔ ↔ ↔ ↔ ↔ ↔
— —
MOV.B @ERs, Rd
2
↔ ↔ ↔ ↔ ↔ ↔
— —
Rs8 → Rd8
B
C
↔ ↔ ↔ ↔ ↔ ↔ ↔
#xx:8 → Rd8
MOV.B Rs, Rd
V
↔ ↔ ↔ ↔ ↔ ↔ ↔
Z
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
N
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
H
↔ ↔ ↔ ↔ ↔
I
Normal
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
2
Rn
B
No. of
States*1
↔ ↔ ↔ ↔ ↔
MOV MOV.B #xx:8, Rd
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
0 —
2
0 —
4
0 —
6
0 —
10
0 —
6
4
0 —
6
0 —
8
0 —
4
0 —
6
0 —
10
0 —
6
4
0 —
6
0 —
8
0 —
4
0 —
2
0 —
4
0 —
6
0 —
10
0 —
6
6
0 —
8
0 —
4
0 —
6
0 —
10
Rev.5.00 Nov. 02, 2005 Page 435 of 500
REJ09B0027-0500
Appendix
No. of
States*1
Condition Code
— —
@(d:24, ERs) → ERd32
— —
@ERs → ERd32
ERs32+4 → ERs32
— —
6
@aa:16 → ERd32
— —
8
@aa:24 → ERd32
— —
ERs32 → @ERd
— —
ERs32 → @(d:16, ERd)
— —
ERs32 → @(d:24, ERd)
— —
ERd32–4 → ERd32
ERs32 → @ERd
— —
6
ERs32 → @aa:16
— —
8
ERs32 → @aa:24
— —
0 —
0 —
POP POP.W Rn
W
2 @SP → Rn16
SP+2 → SP
— —
POP.L ERn
L
4 @SP → ERn32
SP+4 → SP
— —
0 —
PUSH PUSH.W Rn
W
2 SP–2 → SP
Rn16 → @SP
— —
0 —
PUSH.L ERn
L
4 SP–4 → SP
ERn32 → @SP
— —
0 —
MOVFPE
MOVFPE @aa:16, Rd
B
4
Cannot be used in
this LSI
Cannot be used in
this LSI
MOVTPE
MOVTPE Rs, @aa:16
B
4
Cannot be used in
this LSI
Cannot be used in
this LSI
W
MOV.W Rs, @aa:16
W
MOV.W Rs, @aa:24
W
MOV.L #xx:32, Rd
L
MOV.L ERs, ERd
L
MOV.L @ERs, ERd
L
MOV.L @(d:16, ERs), ERd
L
6
MOV.L @(d:24, ERs), ERd
L
10
MOV.L @ERs+, ERd
L
MOV.L @aa:16, ERd
L
MOV.L @aa:24, ERd
L
MOV.L ERs, @ERd
L
MOV.L ERs, @(d:16, ERd)
L
6
MOV.L ERs, @(d:24, ERd)
L
10
MOV.L ERs, @–ERd
L
MOV.L ERs, @aa:16
L
MOV.L ERs, @aa:24
L
2
6
2
4
4
4
Rev.5.00 Nov. 02, 2005 Page 436 of 500
REJ09B0027-0500
4
Advanced
@(d:16, ERs) → ERd32
↔
— —
↔
@ERs → ERd32
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
— —
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
ERs32 → ERd32
↔ ↔ ↔ ↔ ↔ ↔
— —
↔ ↔ ↔ ↔ ↔ ↔
#xx:32 → Rd32
0 —
↔ ↔ ↔
— —
↔ ↔ ↔
— —
Rs16 → @aa:24
↔
Rs16 → @aa:16
6
C
↔
4
V
↔
Z
↔
I
↔
N
— —
↔
H
ERd32–2 → ERd32
Rs16 → @ERd
0 —
MOV MOV.W Rs, @–ERd
Normal
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
6
6
0 —
8
0 —
6
0 —
2
0 —
8
0 —
10
0 —
14
0 —
10
10
0 —
12
0 —
8
0 —
10
0 —
14
0 —
10
10
0 —
12
0 —
6
10
6
10
Appendix
2. Arithmetic Instructions
No. of
States*1
Condition Code
Z
V
C
↔ ↔
— (2)
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
ERd32+ERs32 →
ERd32
— (2)
↔
↔
(3)
↔ ↔
Rd16+Rs16 → Rd16
— (1)
ERd32+#xx:32 →
ERd32
2
Rd8+#xx:8 +C → Rd8
—
2
B
2
Rd8+Rs8 +C → Rd8
—
ADDS ADDS.L #1, ERd
L
2
ERd32+1 → ERd32
— — — — — —
2
ADDS.L #2, ERd
L
2
ERd32+2 → ERd32
— — — — — —
2
ADDS.L #4, ERd
L
2
ERd32+4 → ERd32
— — — — — —
2
INC.B Rd
B
2
Rd8+1 → Rd8
— —
INC.W #1, Rd
W
2
Rd16+1 → Rd16
— —
INC.W #2, Rd
W
2
Rd16+2 → Rd16
— —
INC.L #1, ERd
L
2
ERd32+1 → ERd32
— —
INC.L #2, ERd
L
2
ERd32+2 → ERd32
— —
DAA
DAA Rd
B
2
Rd8 decimal adjust
→ Rd8
— *
SUB
SUB.B Rs, Rd
B
2
SUB.W #xx:16, Rd
W 4
SUB.W Rs, Rd
W
SUB.L #xx:32, ERd
L
SUB.L ERs, ERd
L
ADD.W Rs, Rd
W
ADD.L #xx:32, ERd
L
ADD.L ERs, ERd
L
ADDX ADDX.B #xx:8, Rd
ADDX.B Rs, Rd
6
2
2
Rd8–Rs8 → Rd8
—
Rd16–#xx:16 → Rd16
— (1)
Rd16–Rs16 → Rd16
— (1)
(3)
2
4
2
6
2
—
2
—
2
—
2
—
2
—
2
* —
2
Rd8–Rs8–C → Rd8
—
SUBS SUBS.L #1, ERd
L
2
ERd32–1 → ERd32
— — — — — —
2
SUBS.L #2, ERd
L
2
ERd32–2 → ERd32
— — — — — —
2
SUBS.L #4, ERd
L
2
ERd32–4 → ERd32
— — — — — —
2
B
2
Rd8–1 → Rd8
— —
DEC.W #1, Rd
W
2
Rd16–1 → Rd16
— —
DEC.W #2, Rd
W
2
Rd16–2 → Rd16
— —
Rd8–#xx:8–C → Rd8
—
↔ ↔
2
ERd32–ERs32 → ERd32 — (2)
(3)
(3)
↔ ↔ ↔
DEC DEC.B Rd
2
↔ ↔ ↔
SUBX.B Rs, Rd
B
ERd32–#xx:32 → ERd32 — (2)
6
↔ ↔ ↔
2
SUBX SUBX.B #xx:8, Rd
2
↔ ↔ ↔ ↔ ↔ ↔ ↔
2
B
↔ ↔ ↔ ↔ ↔ ↔ ↔
INC
B
2
↔ ↔ ↔ ↔ ↔
W 4
↔ ↔ ↔ ↔ ↔ ↔
ADD.W #xx:16, Rd
2
↔ ↔ ↔ ↔ ↔
B
↔ ↔ ↔ ↔ ↔ ↔ ↔
ADD.B Rs, Rd
↔
ADD ADD.B #xx:8, Rd
↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
— (1)
↔ ↔ ↔ ↔ ↔
Rd16+#xx:16 → Rd16
2
↔
—
↔ ↔
Rd8+Rs8 → Rd8
↔
—
Advanced
N
↔ ↔
I
Rd8+#xx:8 → Rd8
Normal
H
↔ ↔
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
2
@ERn
B
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
4
2
6
2
2
2
—
2
—
2
—
2
Rev.5.00 Nov. 02, 2005 Page 437 of 500
REJ09B0027-0500
Appendix
No. of
States*1
Condition Code
Advanced
V
C
ERd32–1 → ERd32
— —
L
2
ERd32–2 → ERd32
— —
↔ ↔
—
2
DAS.Rd
B
2
Rd8 decimal adjust
→ Rd8
— *
↔ ↔ ↔
2
DEC.L #2, ERd
↔ ↔ ↔
—
* —
2
B
2
Rd8 × Rs8 → Rd16
(unsigned multiplication)
— — — — — —
14
W
2
Rd16 × Rs16 → ERd32
(unsigned multiplication)
— — — — — —
22
B
4
Rd8 × Rs8 → Rd16
(signed multiplication)
— —
↔
W
4
Rd16 × Rs16 → ERd32
(signed multiplication)
— —
B
2
W
DIVXU DIVXU. B Rs, Rd
DIVXU. W Rs, ERd
DIVXS DIVXS. B Rs, Rd
DIVXS. W Rs, ERd
CMP CMP.B #xx:8, Rd
16
— —
24
Rd16 ÷ Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
(unsigned division)
— — (6) (7) — —
14
2
ERd32 ÷ Rs16 → ERd32
(Ed: remainder,
Rd: quotient)
(unsigned division)
— — (6) (7) — —
22
B
4
Rd16 ÷ Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
(signed division)
— — (8) (7) — —
16
W
4
ERd32 ÷ Rs16 → ERd32
(Ed: remainder,
Rd: quotient)
(signed division)
— — (8) (7) — —
24
Rd8–#xx:8
—
Rd8–Rs8
—
Rd16–#xx:16
— (1)
Rd16–Rs16
— (1)
ERd32–#xx:32
— (2)
ERd32–ERs32
— (2)
B
2
CMP.B Rs, Rd
B
CMP.W #xx:16, Rd
W 4
CMP.W Rs, Rd
W
CMP.L #xx:32, ERd
L
CMP.L ERs, ERd
L
2
2
6
2
Rev.5.00 Nov. 02, 2005 Page 438 of 500
REJ09B0027-0500
↔ ↔ ↔ ↔ ↔ ↔
MULXS. W Rs, ERd
— —
↔ ↔ ↔ ↔ ↔ ↔
MULXS MULXS. B Rs, Rd
↔ ↔ ↔ ↔ ↔ ↔
MULXU. W Rs, ERd
↔ ↔
MULXU MULXU. B Rs, Rd
↔ ↔ ↔ ↔ ↔ ↔
DAS
I
Normal
Z
2
↔
N
L
↔
H
DEC DEC.L #1, ERd
↔
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
2
4
2
4
2
Appendix
No. of
States*1
Condition Code
W
2
0–Rd16 → Rd16
—
NEG.L ERd
L
2
0–ERd32 → ERd32
—
EXTU EXTU.W Rd
W
2
0 → (<bits 15 to 8>
of Rd16)
— — 0
EXTU.L ERd
L
2
0 → (<bits 31 to 16>
of ERd32)
— — 0
EXTS EXTS.W Rd
W
2
(<bit 7> of Rd16) →
(<bits 15 to 8> of Rd16)
— —
EXTS.L ERd
L
2
(<bit 15> of ERd32) →
(<bits 31 to 16> of
ERd32)
— —
Advanced
↔ ↔ ↔
NEG.W Rd
Normal
C
↔ ↔ ↔
—
↔ ↔ ↔
V
↔ ↔ ↔ ↔
0–Rd8 → Rd8
2
0 —
2
↔
2
0 —
2
↔
H
B
0 —
2
↔
Z
↔
I
NEG NEG.B Rd
↔ ↔ ↔
N
↔
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
0 —
2
2
2
Rev.5.00 Nov. 02, 2005 Page 439 of 500
REJ09B0027-0500
Appendix
3. Logic Instructions
AND.B Rs, Rd
B
AND.W #xx:16, Rd
W 4
AND.W Rs, Rd
W
AND.L #xx:32, ERd
L
AND.L ERs, ERd
L
OR.B #xx:8, Rd
B
OR.B Rs, Rd
B
OR.W #xx:16, Rd
W 4
OR.W Rs, Rd
W
OR.L #xx:32, ERd
L
OR.L ERs, ERd
L
XOR.B #xx:8, Rd
B
XOR.B Rs, Rd
B
XOR.W #xx:16, Rd
W 4
XOR.W Rs, Rd
W
XOR.L #xx:32, ERd
L
XOR.L ERs, ERd
L
4
ERd32⊕ERs32 → ERd32 — —
NOT.B Rd
B
2
¬ Rd8 → Rd8
— —
NOT.W Rd
W
2
¬ Rd16 → Rd16
— —
NOT.L ERd
L
2
¬ Rd32 → Rd32
— —
Z
Rd8∧Rs8 → Rd8
— —
Rd16∧#xx:16 → Rd16
— —
Rd16∧Rs16 → Rd16
— —
4
2
2
2
6
4
2
2
2
ERd32∧ERs32 → ERd32 — —
Rd8⁄#xx:8 → Rd8
— —
Rd8⁄Rs8 → Rd8
— —
Rd16⁄#xx:16 → Rd16
— —
Rd16⁄Rs16 → Rd16
— —
ERd32⁄#xx:32 → ERd32
— —
ERd32⁄ERs32 → ERd32
— —
Rd8⊕#xx:8 → Rd8
— —
Rd8⊕Rs8 → Rd8
— —
Rd16⊕#xx:16 → Rd16
— —
Rd16⊕Rs16 → Rd16
— —
ERd32⊕#xx:32 → ERd32 — —
6
V
C
Advanced
I
Normal
—
@@aa
@(d, PC)
@aa
N
— —
ERd32∧#xx:32 → ERd32 — —
6
Rev.5.00 Nov. 02, 2005 Page 440 of 500
REJ09B0027-0500
H
Rd8∧#xx:8 → Rd8
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
2
Operation
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
NOT
2
@(d, ERn)
2
@ERn
B
Rn
#xx
XOR
Condition Code
Operand Size
OR
No. of
States*1
AND.B #xx:8, Rd
Mnemonic
AND
@–ERn/@ERn+
Addressing Mode and
Instruction Length (bytes)
0 —
2
0 —
2
0 —
4
0 —
2
0 —
6
0 —
4
0 —
2
0 —
2
0 —
4
0 —
2
0 —
6
0 —
4
0 —
2
0 —
2
0 —
4
0 —
2
0 —
6
0 —
4
0 —
2
0 —
2
0 —
2
Appendix
4. Shift Instructions
W
2
SHAL.L ERd
L
2
SHAR SHAR.B Rd
B
2
SHAR.W Rd
W
2
SHAR.L ERd
L
2
SHLL SHLL.B Rd
B
2
SHLL.W Rd
W
2
SHLL.L ERd
L
2
SHLR SHLR.B Rd
B
2
SHLR.W Rd
W
2
SHLR.L ERd
L
2
ROTXL ROTXL.B Rd
B
2
ROTXL.W Rd
W
2
ROTXL.L ERd
L
2
B
2
ROTXR.W Rd
W
2
ROTXR.L ERd
L
2
ROTL ROTL.B Rd
B
2
ROTL.W Rd
W
2
ROTL.L ERd
L
2
ROTR ROTR.B Rd
B
2
ROTR.W Rd
W
2
ROTR.L ERd
L
2
ROTXR ROTXR.B Rd
0
MSB
LSB
V
C
— —
— —
— —
C
MSB
— —
LSB
— —
— —
0
C
MSB
LSB
— —
— —
— —
0
C
MSB
LSB
— —
— —
— —
C
— —
MSB
LSB
— —
— —
C
MSB
LSB
— —
— —
— —
C
— —
MSB
LSB
— —
— —
C
MSB
LSB
— —
— —
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Advanced
Z
Normal
—
@@aa
@(d, PC)
@aa
@–ERn/@ERn+
@(d, ERn)
I
C
N
↔ ↔ ↔
SHAL.W Rd
H
— —
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
2
Condition Code
Operation
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
B
No. of
States*1
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
SHAL SHAL.B Rd
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Rev.5.00 Nov. 02, 2005 Page 441 of 500
REJ09B0027-0500
Appendix
5. Bit-Manipulation Instructions
B
BSET #xx:3, @aa:8
B
BSET Rn, Rd
B
BSET Rn, @ERd
B
BSET Rn, @aa:8
B
B
BCLR #xx:3, @ERd
B
BCLR #xx:3, @aa:8
B
BCLR Rn, Rd
B
BCLR Rn, @ERd
B
BCLR Rn, @aa:8
B
BNOT BNOT #xx:3, Rd
B
BNOT #xx:3, @ERd
B
BNOT #xx:3, @aa:8
B
BNOT Rn, Rd
B
BNOT Rn, @ERd
B
BNOT Rn, @aa:8
B
BTST BTST #xx:3, Rd
B
BTST #xx:3, @ERd
B
BTST #xx:3, @aa:8
B
BTST Rn, Rd
B
BTST Rn, @ERd
B
BTST Rn, @aa:8
B
BLD #xx:3, Rd
B
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
H
N
Z
V
C
Advanced
I
Normal
—
@@aa
@(d, PC)
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
2
Rev.5.00 Nov. 02, 2005 Page 442 of 500
REJ09B0027-0500
Condition Code
Operation
(#xx:3 of Rd8) ← 1
— — — — — —
2
(#xx:3 of @ERd) ← 1
— — — — — —
8
(#xx:3 of @aa:8) ← 1
— — — — — —
8
(Rn8 of Rd8) ← 1
— — — — — —
2
(Rn8 of @ERd) ← 1
— — — — — —
8
(Rn8 of @aa:8) ← 1
— — — — — —
8
(#xx:3 of Rd8) ← 0
— — — — — —
2
(#xx:3 of @ERd) ← 0
— — — — — —
8
(#xx:3 of @aa:8) ← 0
— — — — — —
8
(Rn8 of Rd8) ← 0
— — — — — —
2
(Rn8 of @ERd) ← 0
— — — — — —
8
(Rn8 of @aa:8) ← 0
— — — — — —
8
(#xx:3 of Rd8) ←
¬ (#xx:3 of Rd8)
— — — — — —
2
(#xx:3 of @ERd) ←
¬ (#xx:3 of @ERd)
— — — — — —
8
(#xx:3 of @aa:8) ←
¬ (#xx:3 of @aa:8)
— — — — — —
8
(Rn8 of Rd8) ←
¬ (Rn8 of Rd8)
— — — — — —
2
(Rn8 of @ERd) ←
¬ (Rn8 of @ERd)
— — — — — —
8
(Rn8 of @aa:8) ←
¬ (Rn8 of @aa:8)
— — — — — —
8
¬ (#xx:3 of Rd8) → Z
— — —
¬ (#xx:3 of @ERd) → Z
— — —
¬ (#xx:3 of @aa:8) → Z
— — —
¬ (Rn8 of @Rd8) → Z
— — —
¬ (Rn8 of @ERd) → Z
— — —
¬ (Rn8 of @aa:8) → Z
— — —
(#xx:3 of Rd8) → C
— — — — —
— —
2
— —
6
— —
6
— —
2
— —
6
— —
6
↔
BSET #xx:3, @ERd
BCLR BCLR #xx:3, Rd
BLD
B
No. of
States*1
↔ ↔ ↔ ↔ ↔ ↔
BSET BSET #xx:3, Rd
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
Appendix
B
BLD #xx:3, @aa:8
B
BILD BILD #xx:3, Rd
BST
BILD #xx:3, @ERd
B
BILD #xx:3, @aa:8
B
BST #xx:3, Rd
B
BST #xx:3, @ERd
B
BST #xx:3, @aa:8
B
BIST BIST #xx:3, Rd
B
BIST #xx:3, @ERd
B
BIST #xx:3, @aa:8
B
BAND BAND #xx:3, Rd
B
BAND #xx:3, @ERd
B
BAND #xx:3, @aa:8
B
BIAND BIAND #xx:3, Rd
BOR
B
B
BIAND #xx:3, @ERd
B
BIAND #xx:3, @aa:8
B
BOR #xx:3, Rd
B
BOR #xx:3, @ERd
B
BOR #xx:3, @aa:8
B
BIOR BIOR #xx:3, Rd
B
BIOR #xx:3, @ERd
B
BIOR #xx:3, @aa:8
B
BXOR BXOR #xx:3, Rd
B
BXOR #xx:3, @ERd
B
BXOR #xx:3, @aa:8
B
BIXOR BIXOR #xx:3, Rd
B
BIXOR #xx:3, @ERd
B
BIXOR #xx:3, @aa:8
B
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
H
N
Z
V
C
(#xx:3 of @ERd) → C
— — — — —
6
(#xx:3 of @aa:8) → C
— — — — —
¬ (#xx:3 of Rd8) → C
— — — — —
¬ (#xx:3 of @ERd) → C
— — — — —
¬ (#xx:3 of @aa:8) → C
— — — — —
C → (#xx:3 of Rd8)
— — — — — —
2
C → (#xx:3 of @ERd24)
— — — — — —
8
C → (#xx:3 of @aa:8)
— — — — — —
8
¬ C → (#xx:3 of Rd8)
— — — — — —
2
¬ C → (#xx:3 of @ERd24)
— — — — — —
8
¬ C → (#xx:3 of @aa:8)
— — — — — —
8
C∧(#xx:3 of Rd8) → C
— — — — —
2
C∧(#xx:3 of @ERd24) → C
— — — — —
C∧(#xx:3 of @aa:8) → C
— — — — —
C∧ ¬ (#xx:3 of Rd8) → C
— — — — —
C∧ ¬ (#xx:3 of @ERd24) → C
— — — — —
C∧ ¬ (#xx:3 of @aa:8) → C
— — — — —
C∨(#xx:3 of Rd8) → C
— — — — —
C∨(#xx:3 of @ERd24) → C
— — — — —
C∨(#xx:3 of @aa:8) → C
— — — — —
C∨ ¬ (#xx:3 of Rd8) → C
— — — — —
C∨ ¬ (#xx:3 of @ERd24) → C
— — — — —
C∨ ¬ (#xx:3 of @aa:8) → C
— — — — —
C⊕(#xx:3 of Rd8) → C
— — — — —
C⊕(#xx:3 of @ERd24) → C
— — — — —
C⊕(#xx:3 of @aa:8) → C
— — — — —
C⊕ ¬ (#xx:3 of Rd8) → C
— — — — —
C⊕ ¬ (#xx:3 of @ERd24) → C — — — — —
4
4
Advanced
I
Normal
—
@@aa
@(d, PC)
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
Condition Code
Operation
↔ ↔ ↔ ↔ ↔
BLD #xx:3, @ERd
No. of
States*1
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
BLD
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
C⊕ ¬ (#xx:3 of @aa:8) → C
— — — — —
6
2
6
6
6
6
2
6
6
2
6
6
2
6
6
2
6
6
2
6
6
Rev.5.00 Nov. 02, 2005 Page 443 of 500
REJ09B0027-0500
Appendix
6. Branching Instructions
Bcc
No. of
States*1
Condition Code
BRA d:8 (BT d:8)
—
2
BRA d:16 (BT d:16)
—
4
BRN d:8 (BF d:8)
—
2
BRN d:16 (BF d:16)
—
4
BHI d:8
—
2
BHI d:16
—
4
BLS d:8
—
2
BLS d:16
—
4
BCC d:8 (BHS d:8)
—
2
BCC d:16 (BHS d:16)
—
4
BCS d:8 (BLO d:8)
—
2
BCS d:16 (BLO d:16)
—
4
BNE d:8
—
2
BNE d:16
—
4
BEQ d:8
—
2
BEQ d:16
—
4
BVC d:8
—
2
BVC d:16
—
4
BVS d:8
—
2
BVS d:16
—
4
BPL d:8
—
2
BPL d:16
—
4
BMI d:8
—
2
BMI d:16
—
4
BGE d:8
—
2
BGE d:16
—
4
BLT d:8
—
2
BLT d:16
—
BGT d:8
I
H
N
Z
V
C
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
4
— — — — — —
6
—
2
Z∨ (N⊕V) = 0 — — — — — —
4
BGT d:16
—
4
— — — — — —
6
BLE d:8
—
2
Z∨ (N⊕V) = 1 — — — — — —
4
BLE d:16
—
4
— — — — — —
6
Rev.5.00 Nov. 02, 2005 Page 444 of 500
REJ09B0027-0500
If condition Always
is true then
PC ← PC+d
Never
else next;
Advanced
Branch
Condition
Normal
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
C∨ Z = 0
C∨ Z = 1
C=0
C=1
Z=0
Z=1
V=0
V=1
N=0
N=1
N⊕V = 0
N⊕V = 1
Appendix
JMP
BSR
JSR
RTS
JMP @ERn
—
JMP @aa:24
—
JMP @@aa:8
—
BSR d:8
—
BSR d:16
—
JSR @ERn
—
JSR @aa:24
—
JSR @@aa:8
—
RTS
—
No. of
States*1
Condition Code
H
N
Z
V
C
Advanced
I
Normal
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
PC ← ERn
— — — — — —
PC ← aa:24
— — — — — —
PC ← @aa:8
— — — — — —
8
10
2
PC → @–SP
PC ← PC+d:8
— — — — — —
6
8
4
PC → @–SP
PC ← PC+d:16
— — — — — —
8
10
PC → @–SP
PC ← ERn
— — — — — —
6
8
PC → @–SP
PC ← aa:24
— — — — — —
8
10
PC → @–SP
PC ← @aa:8
— — — — — —
8
12
2 PC ← @SP+
— — — — — —
8
10
2
4
2
2
4
2
4
6
Rev.5.00 Nov. 02, 2005 Page 445 of 500
REJ09B0027-0500
Appendix
7. System Control Instructions
No. of
States*1
Condition Code
Normal
Advanced
—
CCR ← @SP+
PC ← @SP+
↔
↔
10
—
Transition to powerdown state
— — — — — —
2
#xx:8 → CCR
↔
W
6
@(d:16, ERs) → CCR
LDC @(d:24, ERs), CCR
W
10
@(d:24, ERs) → CCR
LDC @ERs+, CCR
W
↔
↔
↔
↔
LDC @aa:16, CCR
W
6
@aa:16 → CCR
LDC @aa:24, CCR
W
8
@aa:24 → CCR
↔ ↔
↔ ↔
↔ ↔ ↔ ↔ ↔
↔
LDC @(d:16, ERs), CCR
↔ ↔
↔ ↔ ↔ ↔ ↔
↔
W
↔
↔ ↔ ↔ ↔ ↔
↔
LDC @ERs, CCR
↔
↔ ↔ ↔ ↔ ↔
B
↔ ↔
↔ ↔ ↔ ↔ ↔
C
B
W
STC CCR, @aa:16
W
STC CCR, @aa:24
W
ANDC ANDC #xx:8, CCR
B
B
B
ORC #xx:8, CCR
XORC XORC #xx:8, CCR
NOP
6
8
12
8
10
CCR → Rd8
— — — — — —
2
CCR → @ERd
— — — — — —
6
6
CCR → @(d:16, ERd)
— — — — — —
8
10
CCR → @(d:24, ERd)
— — — — — —
12
ERd32–2 → ERd32
CCR → @ERd
— — — — — —
8
6
CCR → @aa:16
— — — — — —
8
8
CCR → @aa:24
— — — — — —
10
2
CCR∧#xx:8 → CCR
2
CCR∨#xx:8 → CCR
2
CCR⊕#xx:8 → CCR
2
4
4
—
Rev.5.00 Nov. 02, 2005 Page 446 of 500
REJ09B0027-0500
2
↔ ↔
STC CCR, @–ERd
2
2 PC ← PC+2
8
↔ ↔ ↔
W
@ERs → CCR
ERs32+2 → ERs32
4
↔ ↔ ↔
STC CCR, @(d:24, ERd)
@ERs → CCR
4
↔ ↔ ↔
W
Rs8 → CCR
2
↔ ↔ ↔
STC CCR, @(d:16, ERd)
2
↔ ↔ ↔
B
W
NOP
V
LDC Rs, CCR
STC CCR, @ERd
ORC
Z
LDC #xx:8, CCR
STC CCR, Rd
STC
N
↔ ↔ ↔
LDC
H
↔ ↔
SLEEP SLEEP
@@aa
RTE
RTE
@(d, PC)
16
@aa
1 — — — — — 14
@ERn
2 PC → @–SP
CCR → @–SP
<vector> → PC
Rn
—
#xx
I
TRAPA TRAPA #x:2
↔ ↔ ↔ ↔ ↔
Operation
—
@–ERn/@ERn+
@(d, ERn)
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
— — — — — —
2
2
2
Appendix
8. Block Transfer Instructions
EEPMOV
No. of
States*1
H
N
Z
V
C
Normal
—
@@aa
@(d, PC)
I
EEPMOV. B
—
4 if R4L ≠ 0 then
repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4L–1 → R4L
until
R4L=0
else next
— — — — — — 8+
4n*2
EEPMOV. W
—
4 if R4 ≠ 0 then
repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4–1 → R4
until
R4=0
else next
— — — — — — 8+
4n*2
Advanced
Condition Code
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
Notes: 1. The number of states in cases where the instruction code and its operands are located
in on-chip memory is shown here. For other cases see appendix A.3, Number of
Execution States.
2. n is the value set in register R4L or R4.
(1) Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0.
(2) Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0.
(3) Retains its previous value when the result is zero; otherwise cleared to 0.
(4) Set to 1 when the adjustment produces a carry; otherwise retains its previous value.
(5) The number of states required for execution of an instruction that transfers data in
synchronization with the E clock is variable.
(6) Set to 1 when the divisor is negative; otherwise cleared to 0.
(7) Set to 1 when the divisor is zero; otherwise cleared to 0.
(8) Set to 1 when the quotient is negative; otherwise cleared to 0.
Rev.5.00 Nov. 02, 2005 Page 447 of 500
REJ09B0027-0500
REJ09B0027-0500
Rev.5.00 Nov. 02, 2005 Page 448 of 500
MULXU
5
STC
Table A.2
(2)
LDC
3
BVC
8
SUBX
OR
XOR
AND
MOV
C
D
E
F
BILD
BIST
BLD
BST
MOV
BVS
9
B
JMP
BPL
BMI
MOV
Table A.2 Table A.2
(2)
(2)
Table A.2 Table A.2
(2)
(2)
A
Table A.2 Table A.2
EEPMOV
(2)
(2)
SUB
ADD
Table A.2
TRAPA
(2)
BEQ
B
BIAND
BAND
AND
RTE
BNE
CMP
BIXOR
BXOR
XOR
BSR
BCS
A
BIOR
BOR
OR
RTS
BCC
MOV.B
Table A.2
(2)
LDC
7
ADDX
BTST
DIVXU
BLS
AND.B
ANDC
6
9
BCLR
MULXU
BHI
XOR.B
XORC
5
ADD
BNOT
DIVXU
BRN
OR.B
ORC
4
8
7
BSET
BRA
6
2
1
Table A.2 Table A.2 Table A.2 Table A.2
(2)
(2)
(2)
(2)
NOP
4
3
2
1
0
0
BSR
BGE
C
CMP
MOV
Instruction when most significant bit of BH is 1.
Instruction when most significant bit of BH is 0.
E
JSR
BGT
SUBX
ADDX
Table A.2
(3)
BLT
D
BLE
Table A.2
(2)
Table A.2
(2)
F
Table A.2
AL
1st byte 2nd byte
AH AL BH BL
A.2
AH
Instruction code:
Appendix
Operation Code Map
Operation Code Map (1)
ADD
MOV
7A
BRN
ADD
BRA
58
MOV
DAS
1F
1
79
SUBS
1B
NOT
17
DEC
ROTXR
13
1A
ROTXL
12
DAA
0F
SHLR
ADDS
0B
11
INC
0A
SHLL
MOV
01
10
0
CMP
CMP
BHI
2
SUB
SUB
BLS
NOT
ROTXR
ROTXL
SHLR
SHLL
3
4
OR
OR
BCC
LDC/STC
1st byte 2nd byte
AH AL BH BL
XOR
XOR
BCS
DEC
EXTU
INC
5
AND
AND
BNE
6
BEQ
DEC
EXTU
INC
7
BVC
SUB
NEG
9
BVS
ROTR
ROTL
SHAR
SHAL
ADDS
SLEEP
8
BPL
A
MOV
BMI
NEG
CMP
SUB
ROTR
ROTL
SHAR
C
D
BGE
BLT
DEC
EXTS
INC
Table A.2 Table A.2
(3)
(3)
ADD
SHAL
B
BGT
E
F
BLE
DEC
EXTS
INC
Table A.2
(3)
Table A.2
BH
AH AL
Instruction code:
Appendix
Operation Code Map (2)
Rev.5.00 Nov. 02, 2005 Page 449 of 500
REJ09B0027-0500
REJ09B0027-0500
Rev.5.00 Nov. 02, 2005 Page 450 of 500
DIVXS
3
BSET
7Faa7 * 2
BNOT
BNOT
BCLR
BCLR
Notes: 1. r is the register designation field.
2. aa is the absolute address field.
BSET
7Faa6 * 2
BTST
BCLR
7Eaa7 * 2
BNOT
BTST
BSET
7Dr07 * 1
7Eaa6 * 2
BSET
7Dr06 * 1
BTST
BCLR
MULXS
2
7Cr07 * 1
BNOT
DIVXS
1
BTST
MULXS
0
7Cr06 * 1
01F06
01D05
01C05
01406
CL
BIOR
BOR
BIOR
BOR
OR
4
BIXOR
BXOR
BIXOR
BXOR
XOR
5
BIAND
BAND
BIAND
BAND
AND
6
7
BIST
BILD
BST
BLD
BIST
BILD
BST
BLD
1st byte 2nd byte 3rd byte 4th byte
AH AL BH BL CH CL DH DL
8
LDC
STC
9
A
LDC
STC
B
C
LDC
STC
D
E
LDC
STC
F
Instruction when most significant bit of DH is 1.
Instruction when most significant bit of DH is 0.
Table A.2
AH
ALBH
BLCH
Instruction code:
Appendix
Operation Code Map (3)
Appendix
A.3
Number of Execution States
The status of execution for each instruction of the H8/300H CPU and the method of calculating
the number of states required for instruction execution are shown below. Table A.4 shows the
number of cycles of each type occurring in each instruction, such as instruction fetch and data
read/write. Table A.3 shows the number of states required for each cycle. The total number of
states required for execution of an instruction can be calculated by the following expression:
Execution states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN
Examples: When instruction is fetched from on-chip ROM, and an on-chip RAM is accessed.
BSET #0, @FF00
From table A.4:
I = L = 2, J = K = M = N= 0
From table A.3:
SI = 2, SL = 2
Number of states required for execution = 2 × 2 + 2 × 2 = 8
When instruction is fetched from on-chip ROM, branch address is read from on-chip ROM, and
on-chip RAM is used for stack area.
JSR @@ 30
From table A.4:
I = 2, J = K = 1,
L=M=N=0
From table A.3:
SI = SJ = SK = 2
Number of states required for execution = 2 × 2 + 1 × 2+ 1 × 2 = 8
Rev.5.00 Nov. 02, 2005 Page 451 of 500
REJ09B0027-0500
Appendix
Table A.3
Number of Cycles in Each Instruction
Access Location
Execution Status
(Instruction Cycle)
On-Chip Memory
On-Chip Peripheral Module
2
—
Instruction fetch
SI
Branch address read
SJ
Stack operation
SK
Byte data access
SL
2 or 3*
Word data access
SM
2 or 3*
Internal operation
SN
Note:
*
1
Depends on which on-chip peripheral module is accessed. See section 22.1, Register
Addresses (Address Order).
Rev.5.00 Nov. 02, 2005 Page 452 of 500
REJ09B0027-0500
Appendix
Table A.4
Number of Cycles in Each Instruction
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
ADD
ADD.B #xx:8, Rd
1
ADD.B Rs, Rd
1
ADD.W #xx:16, Rd
2
ADD.W Rs, Rd
1
ADD.L #xx:32, ERd
3
ADD.L ERs, ERd
1
ADDS
ADDS #1/2/4, ERd
1
ADDX
ADDX #xx:8, Rd
1
ADDX Rs, Rd
1
AND
AND.B #xx:8, Rd
1
AND.B Rs, Rd
1
AND.W #xx:16, Rd
2
AND.W Rs, Rd
1
AND.L #xx:32, ERd
3
AND.L ERs, ERd
2
ANDC #xx:8, CCR
1
ANDC
BAND
Bcc
Stack
K
BAND #xx:3, Rd
1
BAND #xx:3, @ERd
2
1
BAND #xx:3, @aa:8
2
1
BRA d:8 (BT d:8)
2
BRN d:8 (BF d:8)
2
BHI d:8
2
BLS d:8
2
BCC d:8 (BHS d:8)
2
BCS d:8 (BLO d:8)
2
BNE d:8
2
BEQ d:8
2
BVC d:8
2
BVS d:8
2
BPL d:8
2
BMI d:8
2
BGE d:8
2
Rev.5.00 Nov. 02, 2005 Page 453 of 500
REJ09B0027-0500
Appendix
Instruction Mnemonic
Bcc
BCLR
BIAND
BILD
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Stack
Access
Access
Operation
I
J
L
M
N
K
BLT d:8
2
BGT d:8
2
BLE d:8
2
BRA d:16(BT d:16)
2
2
BRN d:16(BF d:16)
2
2
BHI d:16
2
2
BLS d:16
2
2
BCC d:16(BHS d:16)
2
2
BCS d:16(BLO d:16)
2
2
BNE d:16
2
2
BEQ d:16
2
2
BVC d:16
2
2
BVS d:16
2
2
BPL d:16
2
2
BMI d:16
2
2
BGE d:16
2
2
BLT d:16
2
2
BGT d:16
2
2
BLE d:16
2
2
BCLR #xx:3, Rd
1
BCLR #xx:3, @ERd
2
2
BCLR #xx:3, @aa:8
2
2
BCLR Rn, Rd
1
BCLR Rn, @ERd
2
2
BCLR Rn, @aa:8
2
2
BIAND #xx:3, Rd
1
BIAND #xx:3, @ERd
2
1
BIAND #xx:3, @aa:8
2
1
BILD #xx:3, Rd
1
BILD #xx:3, @ERd
2
1
BILD #xx:3, @aa:8
2
1
Rev.5.00 Nov. 02, 2005 Page 454 of 500
REJ09B0027-0500
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
BIOR
BIOR #xx:8, Rd
1
BIOR #xx:8, @ERd
2
1
BIOR #xx:8, @aa:8
2
1
BIST #xx:3, Rd
1
BIST #xx:3, @ERd
2
2
BIST #xx:3, @aa:8
2
2
BIXOR #xx:3, Rd
1
BIXOR #xx:3, @ERd
2
1
BIXOR #xx:3, @aa:8
2
1
BLD #xx:3, Rd
1
BLD #xx:3, @ERd
2
1
BLD #xx:3, @aa:8
2
1
BIST
BIXOR
BLD
BNOT
BOR
BSET
BSR
BST
Stack
K
BNOT #xx:3, Rd
1
BNOT #xx:3, @ERd
2
2
BNOT #xx:3, @aa:8
2
2
BNOT Rn, Rd
1
BNOT Rn, @ERd
2
2
BNOT Rn, @aa:8
2
2
BOR #xx:3, Rd
1
BOR #xx:3, @ERd
2
1
BOR #xx:3, @aa:8
2
1
BSET #xx:3, Rd
1
BSET #xx:3, @ERd
2
2
BSET #xx:3, @aa:8
2
2
BSET Rn, Rd
1
BSET Rn, @ERd
2
BSET Rn, @aa:8
2
BSR d:8
2
1
BSR d:16
2
1
2
2
2
BST #xx:3, Rd
1
BST #xx:3, @ERd
2
2
BST #xx:3, @aa:8
2
2
Rev.5.00 Nov. 02, 2005 Page 455 of 500
REJ09B0027-0500
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
BTST
BTST #xx:3, Rd
1
BTST #xx:3, @ERd
2
1
BTST #xx:3, @aa:8
2
1
BTST Rn, Rd
1
BTST Rn, @ERd
2
1
1
BXOR
CMP
Stack
K
BTST Rn, @aa:8
2
BXOR #xx:3, Rd
1
BXOR #xx:3, @ERd
2
1
BXOR #xx:3, @aa:8
2
1
CMP.B #xx:8, Rd
1
CMP.B Rs, Rd
1
CMP.W #xx:16, Rd
2
CMP.W Rs, Rd
1
CMP.L #xx:32, ERd
3
CMP.L ERs, ERd
1
DAA
DAA Rd
1
DAS
DAS Rd
1
DEC
DEC.B Rd
1
DEC.W #1/2, Rd
1
DEC.L #1/2, ERd
1
DIVXS.B Rs, Rd
2
12
DIVXS.W Rs, ERd
2
20
DIVXU.B Rs, Rd
1
12
DIVXU.W Rs, ERd
1
DUVXS
DIVXU
EEPMOV
EXTS
EXTU
20
1
EEPMOV.B
2
2n+2*
EEPMOV.W
2
2n+2*1
EXTS.W Rd
1
EXTS.L ERd
1
EXTU.W Rd
1
EXTU.L ERd
1
Rev.5.00 Nov. 02, 2005 Page 456 of 500
REJ09B0027-0500
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
INC
INC.B Rd
1
INC.W #1/2, Rd
1
INC.L #1/2, ERd
1
JMP @ERn
2
JMP @aa:24
2
JMP @@aa:8
2
JSR @ERn
2
1
JSR @aa:24
2
1
JSR @@aa:8
2
LDC #xx:8, CCR
1
LDC Rs, CCR
1
LDC@ERs, CCR
2
1
LDC@(d:16, ERs), CCR
3
1
LDC@(d:24,ERs), CCR
5
1
LDC@ERs+, CCR
2
1
LDC@aa:16, CCR
3
1
LDC@aa:24, CCR
4
1
MOV.B #xx:8, Rd
1
MOV.B Rs, Rd
1
MOV.B @ERs, Rd
1
1
MOV.B @(d:16, ERs), Rd
2
1
MOV.B @(d:24, ERs), Rd
4
1
MOV.B @ERs+, Rd
1
1
MOV.B @aa:8, Rd
1
1
MOV.B @aa:16, Rd
2
1
MOV.B @aa:24, Rd
3
1
MOV.B Rs, @Erd
1
1
MOV.B Rs, @(d:16, ERd)
2
1
MOV.B Rs, @(d:24, ERd)
4
1
MOV.B Rs, @-ERd
1
1
MOV.B Rs, @aa:8
1
1
JMP
JSR
LDC
MOV
Stack
K
2
2
1
1
2
1
2
2
2
Rev.5.00 Nov. 02, 2005 Page 457 of 500
REJ09B0027-0500
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
MOV
MOV.B Rs, @aa:16
2
1
MOV.B Rs, @aa:24
3
1
MOV.W #xx:16, Rd
2
MOV.W Rs, Rd
1
MOV.W @ERs, Rd
1
1
MOV.W @(d:16,ERs), Rd
2
1
MOV.W @(d:24,ERs), Rd
4
1
MOV.W @ERs+, Rd
1
1
MOV.W @aa:16, Rd
2
1
MOV.W @aa:24, Rd
3
1
MOV.W Rs, @ERd
1
1
MOV.W Rs, @(d:16,ERd)
2
1
MOV.W Rs, @(d:24,ERd)
4
1
MOV.W Rs, @-ERd
1
1
MOV.W Rs, @aa:16
2
1
MOV.W Rs, @aa:24
3
1
MOV.L #xx:32, ERd
3
MOV.L ERs, ERd
1
MOV.L @ERs, ERd
2
2
MOV.L @(d:16,ERs), ERd
3
2
MOV.L @(d:24,ERs), ERd
5
2
MOV.L @ERs+, ERd
2
2
MOV.L @aa:16, ERd
3
2
MOV.L @aa:24, ERd
4
2
MOV.L ERs,@ERd
2
2
MOV.L ERs, @(d:16,ERd)
3
2
MOV.L ERs, @(d:24,ERd)
5
2
MOV.L ERs, @-ERd
2
2
MOV.L ERs, @aa:16
3
2
4
2
MOV
MOV.L ERs, @aa:24
2
Stack
K
MOVFPE
MOVFPE @aa:16, Rd*
2
1
MOVTPE
MOVTPE Rs,@aa:16*2
2
1
Rev.5.00 Nov. 02, 2005 Page 458 of 500
REJ09B0027-0500
2
2
2
2
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
MULXS
MULXS.B Rs, Rd
2
12
MULXS.W Rs, ERd
2
20
MULXU
MULXU.B Rs, Rd
1
12
MULXU.W Rs, ERd
1
20
NEG.B Rd
1
NEG.W Rd
1
NEG
NEG.L ERd
1
NOP
NOP
1
NOT
NOT.B Rd
1
NOT.W Rd
1
NOT.L ERd
1
OR
Stack
K
OR.B #xx:8, Rd
1
OR.B Rs, Rd
1
OR.W #xx:16, Rd
2
OR.W Rs, Rd
1
OR.L #xx:32, ERd
3
OR.L ERs, ERd
2
ORC
ORC #xx:8, CCR
1
POP
POP.W Rn
1
1
2
POP.L ERn
2
2
2
PUSH.W Rn
1
1
2
PUSH.L ERn
2
2
2
ROTL.B Rd
1
ROTL.W Rd
1
ROTL.L ERd
1
ROTR.B Rd
1
ROTR.W Rd
1
ROTR.L ERd
1
ROTXL.B Rd
1
ROTXL.W Rd
1
ROTXL.L ERd
1
PUSH
ROTL
ROTR
ROTXL
Rev.5.00 Nov. 02, 2005 Page 459 of 500
REJ09B0027-0500
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
ROTXR
ROTXR.B Rd
1
ROTXR.W Rd
1
ROTXR.L ERd
1
RTE
RTE
2
2
2
RTS
RTS
2
1
2
SHAL
SHAL.B Rd
1
SHAL.W Rd
1
SHAL.L ERd
1
SHAR.B Rd
1
SHAR.W Rd
1
SHAR.L ERd
1
SHAR
SHLL
SHLR
SHLL.B Rd
1
SHLL.W Rd
1
SHLL.L ERd
1
SHLR.B Rd
1
SHLR.W Rd
1
Stack
K
SHLR.L ERd
1
SLEEP
SLEEP
1
STC
STC CCR, Rd
1
STC CCR, @ERd
2
1
STC CCR, @(d:16,ERd)
3
1
STC CCR, @(d:24,ERd)
5
1
STC CCR,@-ERd
2
1
STC CCR, @aa:16
3
1
STC CCR, @aa:24
4
1
SUB.B Rs, Rd
1
SUB.W #xx:16, Rd
2
SUB.W Rs, Rd
1
SUB.L #xx:32, ERd
3
SUB.L ERs, ERd
1
SUBS #1/2/4, ERd
1
SUB
SUBS
Rev.5.00 Nov. 02, 2005 Page 460 of 500
REJ09B0027-0500
2
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
K
L
M
N
SUBX
SUBX #xx:8, Rd
1
1
2
SUBX. Rs, Rd
1
TRAPA
TRAPA #xx:2
2
XOR
XOR.B #xx:8, Rd
1
XOR.B Rs, Rd
1
XOR.W #xx:16, Rd
2
XOR.W Rs, Rd
1
XOR.L #xx:32, ERd
3
XOR.L ERs, ERd
2
XORC #xx:8, CCR
1
XORC
Stack
4
Notes: 1. n: Specified value in R4L and R4. The source and destination operands are accessed
n+1 times respectively.
2. Cannot be used in this LSI.
Rev.5.00 Nov. 02, 2005 Page 461 of 500
REJ09B0027-0500
Appendix
A.4
Combinations of Instructions and Addressing Modes
Table A.5
Combinations of Instructions and Addressing Modes
—
WL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
W
W
—
W
W
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BW
B
—
—
BWL
WL
B
—
—
—
—
BWL
BWL
B
L
BWL
B
BW
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
B
—
B
BWL
WL
BWL
BWL
BWL
B
—
—
—
—
—
—
—
—
—
—
—
B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
B
—
—
—
—
—
—
B
B
—
W
W
—
W
W
—
W
W
—
W
W
—
—
—
—
—
—
—
—
—
—
—
—
—
@aa:24
—
—
—
@aa:16
—
—
—
@aa:8
@ERn+/@ERn
@(d:24.ERn)
@ERn
—
—
—
BWL BWL BWL BWL BWL BWL
—
—
—
—
—
—
—
—
—
—
—
—
Rev.5.00 Nov. 02, 2005 Page 462 of 500
REJ09B0027-0500
—
LDC
STC
ANDC, ORC,
XORC
NOP
Block data transfer instructions
@@aa:8
Bit manipulations
BCC, BSR
Branching
instructions JMP, JSR
RTS
TRAPA
System
control
RTE
instructions
SLEEP
@(d:16.PC)
Shift operations
@(d:8.PC)
Data
MOV
transfer
POP, PUSH
instructions
MOVFPE,
MOVTPE
ADD, CMP
Arithmetic
operations SUB
ADDX, SUBX
ADDS, SUBS
INC, DEC
DAA, DAS
MULXU,
MULXS,
DIVXU,
DIVXS
NEG
EXTU, EXTS
AND, OR, XOR
Logical
operations NOT
Rn
Instructions
#xx
Functions
@(d:16.ERn)
Addressing Mode
BWL BWL
—
—
—
—
Appendix
Appendix B I/O Port Block Diagrams
B.1
I/O Port Block Diagrams
RES goes low in a reset, and SBY goes low at reset and in standby mode.
Internal data bus
RES
SBY
PUCR
Pull-up MOS
PMR
PDR
PCR
IRQ
TRGV
[Legend]
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.1 Port 1 Block Diagram (P17)
Rev.5.00 Nov. 02, 2005 Page 463 of 500
REJ09B0027-0500
Appendix
Internal data bus
RES
SBY
PUCR
Pull-up MOS
PMR
PDR
PCR
IRQ
[Legend]
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.2 Port 1 Block Diagram (P14, P16)
Rev.5.00 Nov. 02, 2005 Page 464 of 500
REJ09B0027-0500
Appendix
Internal data bus
RES
SBY
PUCR
Pull-up MOS
PMR
PDR
PCR
IRQ
TMIB1
[Legend]
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.3 Port 1 Block Diagram (P15)
Rev.5.00 Nov. 02, 2005 Page 465 of 500
REJ09B0027-0500
Appendix
Internal data bus
RES
SBY
PUCR
Pull-up MOS
PDR
PCR
[Legend]
PUCR: Port pull-up control register
PDR: Port data register
PCR: Port control register
Figure B.4 Port 1 Block Diagram (P12)
Rev.5.00 Nov. 02, 2005 Page 466 of 500
REJ09B0027-0500
Appendix
Internal data bus
RES
SBY
PUCR
Pull-up MOS
PMR
PDR
PCR
14-bit PWM
PWM
[Legend]
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.5 Port 2 Block Diagram (P11)
Rev.5.00 Nov. 02, 2005 Page 467 of 500
REJ09B0027-0500
Appendix
Internal data bus
RES
SBY
PUCR
Pull-up MOS
PMR
PDR
PCR
RTC
TMOW
[Legend]
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.6 Port 1 Block Diagram (P10)
Rev.5.00 Nov. 02, 2005 Page 468 of 500
REJ09B0027-0500
Appendix
Internal data bus
SBY
PMR
PDR
PCR
[Legend]
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.7 Port 2 Block Diagram (P24, P23)
Rev.5.00 Nov. 02, 2005 Page 469 of 500
REJ09B0027-0500
Appendix
Internal data bus
SBY
PMR
PDR
PCR
SCI3
TxD
[Legend]
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.8 Port 2 Block Diagram (P22)
Rev.5.00 Nov. 02, 2005 Page 470 of 500
REJ09B0027-0500
Appendix
SBY
Internal data bus
PDR
PCR
SCI3
RE
RxD
[Legend]
PDR: Port data register
PCR: Port control register
Figure B.9 Port 2 Block Diagram (P21)
Rev.5.00 Nov. 02, 2005 Page 471 of 500
REJ09B0027-0500
Appendix
SBY
SCI3
SCKIE
SCKOE
Internal data bus
PDR
PCR
SCKO
SCKI
[Legend]
PDR: Port data register
PCR: Port control register
Figure B.10 Port 2 Block Diagram (P20)
Rev.5.00 Nov. 02, 2005 Page 472 of 500
REJ09B0027-0500
Appendix
Internal data bus
SBY
PDR
PCR
[Legend]
PDR: Port data register
PCR: Port control register
Figure B.11 Port 3 Block Diagram (P37 to P30)
Rev.5.00 Nov. 02, 2005 Page 473 of 500
REJ09B0027-0500
Appendix
Internal data bus
SBY
PMR
PDR
PCR
IIC2
ICE
SDAO/SCLO
SDAI/SCLI
[Legend]
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.12 Port 5 Block Diagram (P57, P56)*
Note: * This diagram is applied to the SCL and SDA pins in the H8/3687N.
Rev.5.00 Nov. 02, 2005 Page 474 of 500
REJ09B0027-0500
Appendix
Internal data bus
RES
SBY
PUCR
Pull-up MOS
PMR
PDR
PCR
WKP
ADTRG
[Legend]
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.13 Port 5 Block Diagram (P55)
Rev.5.00 Nov. 02, 2005 Page 475 of 500
REJ09B0027-0500
Appendix
Internal data bus
RES
SBY
PUCR
Pull-up MOS
PMR
PDR
PCR
WKP
[Legend]
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.14 Port 5 Block Diagram (P54 to P50)
Rev.5.00 Nov. 02, 2005 Page 476 of 500
REJ09B0027-0500
Appendix
Internal data bus
SBY
Timer Z
Output control
signals A to D
PDR
PCR
FTIOA to
FTIOD
[Legend]
PDR: Port data register
PCR: Port control register
Figure B.15 Port 6 Block Diagram (P67 to P60)
Rev.5.00 Nov. 02, 2005 Page 477 of 500
REJ09B0027-0500
Appendix
Internal data bus
SBY
Timer V
OS3
OS2
OS1
OS0
PDR
PCR
TMOV
[Legend]
PDR: Port data register
PCR: Port control register
Figure B.16 Port 7 Block Diagram (P76)
Rev.5.00 Nov. 02, 2005 Page 478 of 500
REJ09B0027-0500
Appendix
Internal data bus
SBY
PDR
PCR
Timer V
TMCIV
[Legend]
PDR: Port data register
PCR: Port control register
Figure B.17 Port 7 Block Diagram (P75)
Rev.5.00 Nov. 02, 2005 Page 479 of 500
REJ09B0027-0500
Appendix
Internal data bus
SBY
PDR
PCR
Timer V
TMRIV
[Legend]
PDR: Port data register
PCR: Port control register
Figure B.18 Port 7 Block Diagram (P74)
Rev.5.00 Nov. 02, 2005 Page 480 of 500
REJ09B0027-0500
Appendix
Internal data bus
SBY
PMR
PDR
PCR
SCI3_2
TxD
[Legend]
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.19 Port 7 Block Diagram (P72)
Rev.5.00 Nov. 02, 2005 Page 481 of 500
REJ09B0027-0500
Appendix
SBY
Internal data bus
PDR
PCR
SCI3_2
RE
RxD
[Legend]
PDR: Port data register
PCR: Port control register
Figure B.20 Port 7 Block Diagram (P71)
SBY
SCI3_2
SCKIE
SCKOE
Internal data bus
PDR
PCR
SCKO
SCKI
[Legend]
PDR: Port data register
PCR: Port control register
Figure B.21 Port 7 Block Diagram (P70)
Rev.5.00 Nov. 02, 2005 Page 482 of 500
REJ09B0027-0500
Appendix
Internal data bus
SBY
PDR
PCR
[Legend]
PDR: Port data register
PCR: Port control register
Figure B.22 Port 8 Block Diagram (P87 to P85)
Rev.5.00 Nov. 02, 2005 Page 483 of 500
REJ09B0027-0500
Appendix
Internal data bus
A/D converter
DEC
CH3 to CH0
VIN
Figure B.23 Port B Block Diagram (PB7 to PB0)
Rev.5.00 Nov. 02, 2005 Page 484 of 500
REJ09B0027-0500
Appendix
B.2
Port States in Each Operating State
Port
Reset
Sleep
Subsleep
Standby
Subactive
Active
P17 to P14,
P12 to P10
High
impedance
Retained
Retained
High
Functioning
impedance*1
Functioning
P24 to P20
High
impedance
Retained
Retained
High
impedance
Functioning
Functioning
P37 to P30
High
impedance
Retained
Retained
High
impedance
Functioning
Functioning
P57 to P50*2 High
impedance
Retained
Retained
High
Functioning
impedance*1
Functioning
P67 to P60
High
impedance
Retained
Retained
High
impedance
Functioning
Functioning
P76 to P74,
P72 to P70
High
impedance
Retained
Retained
High
impedance
Functioning
Functioning
P87 to P85
High
impedance
Retained
Retained
High
impedance
Functioning
Functioning
PB7 to PB0
High
impedance
High
impedance
High
impedance
High
impedance
High
impedance
High
impedance
Notes: 1. High level output when the pull-up MOS is in on state.
2. The P55 to P50 pins are applied to the H8/3687N.
Rev.5.00 Nov. 02, 2005 Page 485 of 500
REJ09B0027-0500
Appendix
Appendix C Product Code Lineup
Product Classification
Product Code Model Marking
Package Code
H8/3687
HD64F3687H
HD64F3687H
QFP-64 (FP-64A)
HD64F3687FP
HD64F3687FP
LQFP-64 (FP-64E)
Flash memory Standard
version
product
Product with HD64F3687GH HD64F3687GH
POR & LVDC HD64F3687GFP HD64F3687GFP
Mask ROM
version
Standard
product
QFP-64 (FP-64A)
LQFP-64 (FP-64E)
HD6433687H
HD6433687(***)H
QFP-64 (FP-64A)
HD6433687FP
HD6433687(***)FP
LQFP-64 (FP-64E)
Product with HD6433687GH HD6433687G(***)H QFP-64 (FP-64A)
POR & LVDC HD6433687GFP HD6433687G(***)FP LQFP-64 (FP-64E)
H8/3686
Mask ROM
version
Standard
product
HD6433686H
HD6433686(***)H
QFP-64 (FP-64A)
HD6433686FP
HD6433686(***)FP
LQFP-64 (FP-64E)
Product with HD6433686GH HD6433686G(***)H QFP-64 (FP-64A)
POR & LVDC HD6433686GFP HD6433686G(***)FP LQFP-64 (FP-64E)
H8/3685
Mask ROM
version
Standard
product
HD6433685H
HD6433685(***)H
QFP-64 (FP-64A)
HD6433685FP
HD6433685(***)FP
LQFP-64 (FP-64E)
Product with HD6433685GH HD6433685G(***)H QFP-64 (FP-64A)
POR & LVDC HD6433685GFP HD6433685G(***)FP LQFP-64 (FP-64E)
H8/3684
Flash memory Standard
version
product
HD64F3684H
HD64F3684H
QFP-64 (FP-64A)
HD64F3684FP
HD64F3684FP
LQFP-64 (FP-64E)
Product with HD64F3684GH HD64F3684GH
POR & LVDC HD64F3684GFP HD64F3684GFP
Mask ROM
version
Standard
product
QFP-64 (FP-64A)
LQFP-64 (FP-64E)
HD6433684H
HD6433684(***)H
QFP-64 (FP-64A)
HD6433684FP
HD6433684(***)FP
LQFP-64 (FP-64E)
Product with HD6433684GH HD6433684G(***)H QFP-64 (FP-64A)
POR & LVDC HD6433684GFP HD6433684G(***)FP LQFP-64 (FP-64E)
H8/3683
Mask ROM
version
Standard
product
HD6433683H
HD6433683(***)H
QFP-64 (FP-64A)
HD6433683FP
HD6433683(***)FP
LQFP-64 (FP-64E)
Product with HD6433683GH HD6433683G(***)H QFP-64 (FP-64A)
POR & LVDC HD6433683GFP HD6433683G(***)FP LQFP-64 (FP-64E)
H8/3682
Mask ROM
version
Standard
product
HD6433682H
HD6433682(***)H
QFP-64 (FP-64A)
HD6433682FP
HD6433682(***)FP
LQFP-64 (FP-64E)
Product with HD6433682GH HD6433682G(***)H QFP-64 (FP-64A)
POR & LVDC HD6433682GFP HD6433682G(***)FP LQFP-64 (FP-64E)
Rev.5.00 Nov. 02, 2005 Page 486 of 500
REJ09B0027-0500
Appendix
Product Classification
Product Code Model Marking
H8/3687 EEPROM Flash
Product with HD64N3687GFP HD64N3687GFP
stacked memory POR &
version
version LVDC
Mask
ROM
version
Package Code
LQFP-64 (FP64E)
HD6483687GFP HD6483687G(***)FP LQFP-64 (FP64E)
Legend:
(***): ROM code.
POR & LVDC: Power-on reset and low-voltage detection circuits.
Rev.5.00 Nov. 02, 2005 Page 487 of 500
REJ09B0027-0500
64
49
Figure D.1 FP-64E Package Dimensions
e
ZD
1
48
*1
y
*3
bp
Index mark
D
16
33
x
F
M
17
32
E
*2
HD
Previous Code
FP-64E/FP-64EV
MASS[Typ.]
0.4g
Detail F
L1
L
Terminal cross section
b1
bp
θ
0.20
L1
1.0
0.5
1.25
ZE
L
1.25
ZD
0.7
0.08
8°
0.22
0.27
0.10
0.5
0.15
0.17
0.20
0.22
1.70
y
0.3
0°
0.12
0.17
0.10
12.2
12.2
Max
x
e
θ
c1
c
b1
bp
A1
0.00
12.0
11.8
A
12.0
11.8
A2
HE
10
1.45
E
HD
10
Nom
Dimension in Millimeters
Min
D
Reference
Symbol
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
c1
HE
ZE
RENESAS Code
PLQP0064KC-A
c
REJ09B0027-0500
A2
A1
Rev.5.00 Nov. 02, 2005 Page 488 of 500
c
JEITA Package Code
P-LQFP64-10x10-0.50
Appendix
Appendix D Package Dimensions
The package dimensions that are shown in the Renesas Semiconductor Packages Data Book have
priority.
A
64
e
1
ZD
D
y
*3
bp
16
33
x
F
M
17
32
MASS[Typ.]
1.2g
bp
Detail F
L1
L
Terminal cross section
b1
θ
L
1.6
1.0
0.8
ZE
L1
1.0
ZD
1.1
0.10
8°
0.15
0.8
y
0.5
0°
0.22
x
e
θ
0.15
c
c1
0.35
0.17
b1
0.12
0.25
0.45
0.29
bp
0.37
3.05
0.00
A1
17.5
17.5
Max
A
0.10
17.2
17.2
16.9
16.9
HD
HE
14
2.70
A2
14
Nom
Dimension in Millimeters
Min
E
D
Reference
Symbol
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
c1
HD
E
*2
49
48
*1
Previous Code
FP-64A/FP-64AV
A2
A1
c
HE
ZE
RENESAS Code
PRQP0064GB-A
c
JEITA Package Code
P-QFP64-14x14-0.80
Appendix
Figure D.2 FP-64A Package Dimensions
Rev.5.00 Nov. 02, 2005 Page 489 of 500
REJ09B0027-0500
A
Appendix
Appendix E EEPROM Stacked-Structure Cross-Sectional
View
Figure E.1 EEPROM Stacked-Structure Cross-Sectional View
Rev.5.00 Nov. 02, 2005 Page 490 of 500
REJ09B0027-0500
Main Revisions and Additions in this Edition
Item
Page Revision (See Manual for Details)
Preface
vi, vii
Notes:
When using the on-chip emulator (E7, E8) for H8/3687
program development and debugging, the following restrictions
must be noted.
1. The NMI pin is reserved for the E7 or E8, and cannot be
used.
3. Area H'D000 to H'DFFF is used by the E7 or E8, and is not
available to the user.
5. When the E7 or E8 is used, address breaks can be set as
either available to the user or for use by the E7 or E8. If
address breaks are set as being used by the E7 or E8, the
address break control registers must not be accessed.
6. When the E7 or E8 is used, NMI is an input/output pin
(open-drain in output mode), P85 and P87 are input pins,
and P86 is an output pin.
7. Use channel 1 of the SCI3 (P21/RXD, P22/TXD) in onboard programming mode by boot mode.
Note has been deleted.
Section 1 Overview
4
Figure 1.2 Internal Block
Diagram of H8/3687N
(EEPROM Stacked
Version)
A/D converter
POR/LVD
(optional)
Data bus (upper)
Address bus
Port B
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
AVCC
Section 5 Clock Pulse
Generators
70
Figure 5.3 Typical
Connection to Crystal
Resonator
Figure 5.5 Typical
Connection to Ceramic
Resonator
C1
OSC 1
OSC 2
71
C2
C1 = C 2 = 10 to 22 pF
C1
OSC1
C2
OSC2
C1 = 5 to 30 pF
C2 = 5 to 30 pF
Rev.5.00 Nov. 02, 2005 Page 491 of 500
REJ09B0027-0500
Item
Page Revision (See Manual for Details)
Section 6 Power-Down
Modes
6.1.1 System Control
Register 1 (SYSCR1)
76
Bit
Bit
Name
3
NESEL
Description
Noise Elimination Sampling Frequency
Select
The subclock pulse generator generates the
watch clock signal (φW) and the system clock
pulse generator generates the oscillator
clock (φOSC). This bit selects the sampling
frequency of the oscillator clock when the
watch clock signal (φW) is sampled. When
φOSC = 4 to 20 MHz, clear NESEL to 0.
Section 8 RAM
107
Section 13 Timer Z
208
Note: * When the E7 or E8 is used, area H'F780 to H'FB7F
must not be accessed.
TCNT value
Figure 13.17 Example of
Input Capture Operation
Counter cleared by FTIOB input (falling edge)
H'0180
H'0160
13.4.4 Synchronous
Operation
211
Figure 13.20 shows an example of synchronous operation. In
this example, synchronous operation has been selected,
FTIOB0 and FTIOB1 have been designated for PWM mode,
GRA_0 compare match has been set as the channel 0 counter
clearing source, and synchronous clearing has been set for the
channel 1 counter clearing source. In addition, the same input
clock has been set as the counter input clock for channel 0 and
channel 1. Two-phase PWM waveforms are output from pins
FTIOB0 and FTIOB1.
13.4.5 PWM Mode
213
Figure 13.22 shows an example of operation in PWM mode.
The output signals go to 1 and TCNT is reset at compare
match A, and the output signals go to 0 at compare match B,
C, and D (TOB, TOC, and TOD = 1, POLB, POLC, and POLD
= 0).
214
Figures 13.24 (when TOB, TOC, and TOD = 1, POLB, POLC,
and POLD = 0) and 13.25 (when TOB, TOC, and TOD = 0,
POLB, POLC, and POLD = 1) show examples of the output of
PWM waveforms with duty cycles of 0% and 100% in PWM
mode.
Rev.5.00 Nov. 02, 2005 Page 492 of 500
REJ09B0027-0500
Item
Page Revision (See Manual for Details)
13.4.9 Timer Z Output
Timing
Figure 13.44 Example of
Output Disable Timing of
Timer Z by Writing to
TOER
238
T1
T2
φ
Address bus
TOER address
Timer Z
output pin
I/O port
Timer output
I/O port
Timer Z output
Figure 13.45 Example of
Output Disable Timing of
Timer Z by External
Trigger
238
φ
TOER
Timer Z
output pin
N
H'FF
I/O port
Timer Z output
Timer Z output
Section 14 Watchdog
Timer
14.2.1 Timer
Control/Status Register
WD (TCSRWD)
252
Section 17 I2C Bus
Interface 2 (IIC2)
17.3.5 I2C Bus Status
Register (ICSR)
314
I/O port
Bit
Bit Name
Description
4
TCSRWE
Timer Control/Status Register WD Write
Enable
Bit
Bit Name
Description
3
STOP
Stop Condition Detection Flag
[Setting conditions]
•
In master mode, when a stop condition is
detected after frame transfer
•
In slave mode, when a stop condition is
detected after the general call address or
the first byte slave address, next to
detection of start condition, accords with
the address set in SAR
17.7 Usage Notes
336
Section 18 A/D Converter 340
18.3.1 A/D Data Registers
A to D (ADDRA to
ADDRD)
Added
Therefore byte access to ADDR should be done by reading the
upper byte first then the lower one. Word access is also
possible. ADDR is initialized to H'0000.
Rev.5.00 Nov. 02, 2005 Page 493 of 500
REJ09B0027-0500
Item
Page Revision (See Manual for Details)
Section 20 Power-On
Reset and Low-Voltage
Detection Circuits
(Optional)
362
RES
Figure 20.1 Block
Diagram of Power-On
Reset Circuit and LowVoltage Detection Circuit
Section 23 Electrical
Characteristics
Table 23.2 DC
Characteristics (1)
CRES
394,
395
Item
Input high
voltage
Values
Applicable
Symbol Pins
Test Condition
Min
VIH
VCC = 4.0 to 5.5 V
VCC × 0.7
PB0 to PB7
VCC × 0.8
Input low
voltage
398
VIL
RXD, RXD2, VCC = 4.0 to 5.5 V
SCL, SDA,
P10 to P12,
:
P85 to P87,
PB0 to PB7
Mode
RES Pin
Internal State
Active mode 1
VCC
Operates
Active mode 2
Sleep mode 1
Sleep mode 2
Rev.5.00 Nov. 02, 2005 Page 494 of 500
REJ09B0027-0500
–0.3
–0.3
Operates
(φOSC/64)
VCC
Only timers operate
Only timers operate
(φOSC/64)
Item
Page Revision (See Manual for Details)
Table 23.12 DC
Characteristics (1)
413,
414
Item
Applicable
Symbol Pins
Values
Test Condition
Min
VCC = 4.0 to 5.5 V
VCC × 0.7
Input high VIH
voltage
PB0 to PB7
Input low
voltage
RXD, RXD_2, VCC = 4.0 to 5.5 V
SCL, SDA,
P10 to P12,
:
P85 to P87,
PB0 to PB7
VCC × 0.8
417
VIL
–0.3
Mode
RES Pin
Internal State
Active mode 1
VCC
Operates
Operates
(φOSC/64)
Active mode 2
Sleep mode 1
VCC
Only timers operate
Sleep mode 2
Only timers operate
(φOSC/64)
Table 23.16 A/D
424
Converter Characteristics
Figure 23.4 I2C Bus
Interface Input/Output
Timing
–0.3
Values
Item
Test Condition
Min
Conversion time
(single mode)
AVCC = 3.3 to 5.5 V
134
429
tSTAH
tSCLH
SCL
P*
Appendix D Package
Dimensions
488,
489
S*
tSf
tSCLL
tSCL
Swapped with new ones.
Rev.5.00 Nov. 02, 2005 Page 495 of 500
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Rev.5.00 Nov. 02, 2005 Page 496 of 500
REJ09B0027-0500
Index
Numerics
14-bit PWM ............................................ 255
Register settings.................................. 257
Waveform output................................ 258
A
A/D converter ......................................... 337
Sample-and-hold circuit...................... 344
Scan mode........................................... 343
Single mode ........................................ 343
Address break ........................................... 63
Addressing modes..................................... 33
Absolute address................................... 34
Immediate ............................................. 35
Memory indirect ................................... 35
Program-counter relative ...................... 35
Register direct....................................... 33
Register indirect.................................... 34
Register indirect with displacement...... 34
Register indirect with post-increment... 34
Register indirect with pre-decrement.... 34
C
Clock pulse generators.............................. 69
Prescaler S ............................................ 73
Prescaler W........................................... 73
Subclock generator ............................... 72
System clock generator......................... 70
Condition field.......................................... 32
Condition-code register (CCR)................. 17
CPU .......................................................... 11
E
Acknowledge ...................................... 353
Acknowledge polling .......................... 356
Byte write............................................ 354
Current address read ........................... 356
EEPROM interface ............................. 352
Page write ........................................... 355
Random address read .......................... 357
Sequential read.................................... 358
Slave address reference register
(ESAR)................................................ 353
Slave addressing.................................. 353
Start condition..................................... 352
Stop condition ..................................... 353
Effective address....................................... 36
Effective address extension....................... 32
Exception handling ................................... 47
Reset exception handling ...................... 57
Stack status ........................................... 60
Trap instruction..................................... 47
F
Flash memory ........................................... 89
Boot mode............................................. 95
Boot program ........................................ 95
Erase/erase-verify ............................... 102
Erasing units ......................................... 89
Error protection................................... 105
Hardware protection............................ 105
Power-down states .............................. 106
Program/program-verify ..................... 100
Programmer mode............................... 106
Programming units................................ 89
Programming/erasing in user
program mode ....................................... 98
Software protection............................. 105
EEPROM................................................ 349
Rev.5.00 Nov. 02, 2005 Page 497 of 500
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G
General registers ....................................... 16
I
I/O ports.................................................. 109
I/O port block diagrams ...................... 463
2
I C bus format......................................... 318
I2C bus interface 2 (IIC2) ....................... 303
Acknowledge...................................... 319
Bit synchronous circuit....................... 335
Clocked synchronous serial format..... 327
Noise canceler .................................... 329
Slave address ...................................... 318
Start condition .................................... 318
Stop condition..................................... 319
Transfer rate........................................ 307
Instruction set ........................................... 22
Arithmetic operations instructions........ 24
Bit manipulation instructions................ 27
Block data transfer instructions ............ 31
Branch instructions ............................... 29
Data transfer instructions...................... 23
Logic operations instructions................ 26
Shift instructions................................... 26
System control instructions................... 30
Internal power supply
step-down circuit .................................... 371
Interrupt
Internal interrupts ................................. 59
Interrupt response time ......................... 60
IRQ3 to IRQ0 interrupts ....................... 57
NMI interrupt........................................ 57
WKP5 to WKP0 interrupts ................... 58
Interrupt mask bit ..................................... 18
L
Large current ports...................................... 2
Low-voltage detection circuit ................. 361
Rev.5.00 Nov. 02, 2005 Page 498 of 500
REJ09B0027-0500
LVDI....................................................... 367
LVDI (interrupt by low
voltage detect) circuit.............................. 367
LVDR ..................................................... 366
LVDR (reset by low
voltage detect) circuit.............................. 366
M
Memory map............................................. 12
Module standby function .......................... 87
O
On-board programming modes ................. 95
Operation field .......................................... 32
P
Package ....................................................... 2
Package dimensions................................ 488
Pin arrangement .......................................... 5
Power-down modes................................... 75
Sleep mode............................................ 84
Standby mode ....................................... 84
Subactive mode..................................... 85
Subsleep mode ...................................... 84
Power-on reset ........................................ 361
Power-on reset circuit ............................. 365
Product code lineup ................................ 486
Program counter (PC) ............................... 17
R
Realtime clock (RTC) ............................. 141
Data reading procedure ....................... 151
Initial setting procedure ...................... 150
Register
ABRKCR...................... 64, 378, 384, 388
ABRKSR ...................... 65, 378, 384, 388
ADCR ......................... 342, 377, 384, 388
ADCSR....................... 341, 377, 384, 388
ADDRA ...................... 340, 377, 383, 388
ADDRB ...................... 340, 377, 384, 388
ADDRC ...................... 340, 377, 384, 388
ADDRD ...................... 340, 377, 384, 388
BARH ........................... 65, 378, 384, 388
BARL ........................... 65, 378, 384, 388
BDRH ........................... 66, 378, 384, 388
BDRL ........................... 66, 378, 384, 388
BRR ............................ 269, 377, 383, 388
EBR1 ............................ 93, 376, 383, 387
EKR ............................ 351, 380, 385, 390
FENR............................ 94, 376, 383, 387
FLMCR1....................... 91, 376, 383, 387
FLMCR2....................... 92, 376, 383, 387
FLPWCR ...................... 94, 376, 383, 387
GRA............................ 190, 374, 381, 386
GRB............................ 190, 374, 381, 386
GRC............................ 190, 374, 381, 386
GRD............................ 190, 374, 381, 386
ICCR1......................... 306, 376, 382, 387
ICCR2......................... 308, 376, 382, 387
ICDRR........................ 317, 376, 383, 387
ICDRS ................................................ 317
ICDRT ........................ 317, 376, 383, 387
ICIER.......................... 311, 376, 383, 387
ICMR.......................... 309, 376, 382, 387
ICSR ........................... 313, 376, 383, 387
IEGR1........................... 50, 379, 385, 389
IEGR2........................... 51, 379, 385, 389
IENR1........................... 52, 379, 385, 389
IENR2........................... 53, 379, 385, 389
IRR1 ............................. 53, 379, 385, 389
IRR2 ............................. 55, 379, 385, 389
IWPR ............................ 55, 379, 385, 389
LVDCR....................... 362, 375, 382, 387
LVDSR ....................... 364, 375, 382, 387
MSTCR1....................... 79, 379, 385, 389
MSTCR2....................... 80, 379, 385, 389
PCR1........................... 111, 379, 385, 389
PCR2........................... 115, 379, 385, 389
PCR3........................... 119, 379, 385, 389
PCR5........................... 124, 379, 385, 389
PCR6........................... 128, 379, 385, 389
PCR7........................... 134, 379, 385, 389
PCR8........................... 137, 379, 385, 389
PDR1........................... 111, 378, 384, 388
PDR2........................... 116, 378, 384, 389
PDR3........................... 120, 378, 384, 389
PDR5........................... 124, 378, 384, 389
PDR6........................... 129, 378, 384, 389
PDR7........................... 135, 378, 384, 389
PDR8........................... 137, 378, 385, 389
PDRB .......................... 139, 379, 385, 389
PMR1 .......................... 110, 379, 385, 389
PMR3 .......................... 116, 379, 385, 389
PMR5 .......................... 123, 379, 385, 389
POCR .......................... 197, 374, 381, 386
PUCR1 ........................ 112, 378, 384, 388
PUCR5 ........................ 125, 378, 384, 388
PWCR ......................... 256, 377, 384, 388
PWDRL ...................... 257, 377, 384, 388
PWDRU ...................... 257, 377, 384, 388
RDR ............................ 263, 377, 383, 388
RHRDR....................... 145, 375, 382, 387
RMINDR .................... 144, 375, 382, 387
RSECDR..................... 143, 375, 382, 386
RSR..................................................... 263
RTCCR1 ..................... 147, 375, 382, 387
RTCCR2 ..................... 148, 375, 382, 387
RTCCSR ..................... 149, 375, 382, 387
RWKDR...................... 146, 375, 382, 387
SAR............................. 316, 376, 383, 387
SCR3........................... 265, 377, 383, 388
SMR ............................ 264, 377, 383, 388
SSR ............................. 267, 377, 383, 388
SYSCR1........................ 76, 379, 385, 389
SYSCR2........................ 78, 379, 385, 389
TCB1........................... 155, 376, 383, 387
Rev.5.00 Nov. 02, 2005 Page 499 of 500
REJ09B0027-0500
TCNT...........................189, 374, 381, 386
TCNTV........................161, 377, 383, 388
TCORA .......................161, 377, 383, 388
TCORB........................161, 377, 383, 388
TCR .............................191, 374, 381, 386
TCRV0 ........................162, 376, 383, 387
TCRV1 ........................165, 377, 383, 388
TCSRV ........................164, 376, 383, 387
TCSRWD ....................252, 378, 384, 388
TCWD .........................253, 378, 384, 388
TDR .............................263, 377, 383, 388
TFCR ...........................185, 375, 382, 386
TIER ............................196, 374, 381, 386
TIORA.........................192, 374, 381, 386
TIORC .........................193, 374, 381, 386
TLB1 .................................................. 156
TMB1 ..........................155, 376, 383, 387
TMDR .........................183, 375, 382, 386
TMWD ........................253, 378, 384, 388
TOCR ..........................188, 375, 382, 386
TOER...........................187, 375, 382, 386
TPMR ..........................184, 375, 382, 386
TSR..............................194, 374, 381, 386
TSTR ...........................182, 375, 382, 386
Register field ............................................ 32
Framing error ...................................... 280
Multiprocessor communication
function ............................................... 292
Overrun error ...................................... 280
Parity error .......................................... 280
Stacked-structure cross-sectional
view of H8/3687N .................................. 491
Stack pointer (SP) ..................................... 17
T
Timer B1................................................. 153
Auto-reload timer operation................ 156
Event counter operation ...................... 157
Interval timer operation....................... 156
Timer V................................................... 159
Timer Z ................................................... 175
Buffer operation.................................. 230
Complementary PWM mode .............. 221
Input capture function ......................... 207
PWM mode ......................................... 211
Reset synchronous PWM mode .......... 217
Synchronous operation........................ 210
Waveform output by
compare match.................................... 203
S
V
Serial communication interface 3
(SCI3) ..................................................... 259
Asynchronous mode ........................... 276
Bit rate ................................................ 269
Break .................................................. 300
Clocked synchronous mode................ 284
Vector address........................................... 48
Rev.5.00 Nov. 02, 2005 Page 500 of 500
REJ09B0027-0500
W
Watchdog timer....................................... 251
Renesas 16-Bit Single-Chip Microcomputer
Hardware Manual
H8/3687 Group
Publication Date: 1st Edition, Jul, 2001
Rev.5.00, Nov. 02, 2005
Published by:
Sales Strategic Planning Div.
Renesas Technology Corp.
Edited by:
Customer Support Department
Global Strategic Communication Div.
Renesas Solutions Corp.
2005. Renesas Technology Corp. All rights reserved. Printed in Japan.
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
RENESAS SALES OFFICES
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
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Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
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Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
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Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
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Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
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Colophon 4.0
H8/3687 Group
Hardware Manual