NP383 Series (Open Top) Chip Scale Package -TH Specifications (CSP, 0.50mm Pitch) Part Number (Details) NP383 - *** 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –40°C to +150°C 10gf per pin approx. Contact Force: 2.2kg ±0.5 Operating Force: Series No. No. of Contact Pins Design Number Positioning Pin: N = Without P = With Materials and Finish Features Housing: Polyetherimide (PEI), glass-filled Polyetherssulphone (PES), glass-filled ➭ Open top socket for BGA ➭ Through hole 0.5mm pitch ➭ 2-point Tweezer Contacts Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel 09 * Example Socket Dimensions Contact Details Recommended PC Board Layout Arrays Top View from Socket 2-point Tweezer Style Contact Free Part Number NP383-18010-* NP383-28804-* NP383-84107-* Grid Size 10x18 18x18 29x29 Body size 11.0x12.5 10.0x10.0 15.0x15.0 Open Socket Dimensions Test Centre Grid size 19.5x26.0 36.0x36.0 33.0x33 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER no grid centre 6x6 7x7 Test & Burn-In