Spec. No. : C899N3 Issued Date : 2009.12.23 Revised Date : Page No. : 1/6 CYStech Electronics Corp. High Voltage NPN Epitaxial Planar Transistor Built-in Base Resistor BTD2498N3 Description • High breakdown voltage. (BVCEO=400V) • Low saturation voltage, typical VCE(sat) =0.13V at Ic/IB =20mA/1mA. • Complementary to BTB1498N3 • Pb-free package Equivalent Circuit Outline BTD2498N3 SOT-23 B : Base C : Collector E : Emitter Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Total Power Dissipation Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature VCBO VCEO VEBO IC Pd RθJA Tj Tstg 400 400 7 300 225 556 150 -55~+150 V V V mA mW °C/W °C °C BTD2498N3 Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C899N3 Issued Date : 2009.12.23 Revised Date : Page No. : 2/6 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO ICER IEBO *VCE(sat) *VCE(sat) *VCE(sat) *VBE(sat) *hFE *hFE R fT Cob Min. 400 400 7 50 50 0.7 - Typ. 0.13 0.11 0.16 100 13 Max. 100 10 100 0.18 0.18 0.3 3.7 270 1.3 - Unit V V V nA nA nA V V V V kΩ MHz pF Test Conditions IC=50μA IC=1mA IE=50μA VCB=400V VCE=300V, REB=4kΩ VEB=6V IC=20mA, IB=1mA IC=50mA, IB=5mA IC=100mA, IB=10mA IC=20mA, IB=2mA VCE=10V, IC=10mA VCE=10V, IC=100mA VCE=10V, IC=10mA, f=5MHz VCB=10V, IE=0A, f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2% Ordering Information Device BTD2498N3 Package SOT-23 (Pb-free) Shipping 3000 pcs / Tape & Reel Recommended Soldering Footprint BTD2498N3 Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C899N3 Issued Date : 2009.12.23 Revised Date : Page No. : 3/6 Typical Characteristics Current Gian vs Collector Current Saturation Voltage vs Collector Current 100000 Saturation Voltage---(mV) Current Gain---HFE 100 VCE = 10V VCE = 5V 10000 VCE(SAT) @ IC = 20IB 1000 100 VCE(SAT) @ IC =10IB 10 10 1 10 100 Collector Current---IC(mA) 1 1000 1000 Power Derating Curve Saturation Voltage vs Collector Current 0.25 Power Dissipation---PD(W) 10000 Saturation Voltage---(mV) 10 100 Collector Current---IC(mA) IC=10IB IC=20IB 1000 0.2 0.15 0.1 0.05 VBE(SAT) 0 100 1 BTD2498N3 10 100 Collector Current---IC(mA) 1000 0 Preliminary 50 100 150 Ambient Temperature---TA(℃) 200 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C899N3 Issued Date : 2009.12.23 Revised Date : Page No. : 4/6 Reel Dimension Carrier Tape Dimension BTD2498N3 Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C899N3 Issued Date : 2009.12.23 Revised Date : Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTD2498N3 Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C899N3 Issued Date : 2009.12.23 Revised Date : Page No. : 6/6 SOT-23 Dimension Marking: A L DH TE 3 B S 2 1 G V 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 C D K H Style: Pin 1.Base 2.Emitter 3.Collector J *: Typical Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 DIM A B C D G H Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.85 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD2498N3 Preliminary CYStek Product Specification