CREE MLBAWT-A1-0000-000W51 Xlamp ml-b leds ansi-compatible sub-bins electrically neutral thermal path Datasheet

®
CLD-DS39 Rev 6
Product family data sheet
®
Cree XLamp ML-B LEDs
Product Description
The
Cree
brings
and
XLamp
Table of Contents
• Available in white (2200 K and
Characteristics............................ 2
reliability
2600 K to 8300 K CCT) and
Flux Characteristics...................... 2
1/4-watt
80-, 85- and 90-CRI minimum
Relative Spectral Power
ML-B
lighting-class
performance
FEATURES
to
LED
LEDs. The XLamp ML-B expands
• ANSI-compatible sub-bins
Distribution................................ 3
Cree’s
• Maximum drive current:
Relative Flux vs. Junction
lighting-class
leadership
to linear and distributed lighting
applications. With XLamp lightingclass reliability, a wide viewing
angle, uniform light output, and
industry-leading
chromaticity
175 mA
• 120° viewing angle, uniform
chromaticity profile
• Electrically neutral thermal
path
Temperature............................... 3
Electrical Characteristics............... 4
Relative Flux vs. Current.............. 4
Thermal Design........................... 5
Typical Spatial Distribution............ 5
binning in a 3.5-mm X 3.5‑mm
• RoHS and REACh-compliant
Reflow Soldering Characteristics.... 6
package,
• UL-recognized component
Notes......................................... 7
LED
of
the
continues
XLamp
Cree’s
segment-focused
ML-B
history
(E349212)
Mechanical Dimensions................ 9
product
Tape and Reel............................10
innovation in LEDs for lighting
Packaging..................................11
applications.
The
XLamp
ML-B
LED
brings
high performance and a smooth
look to a wide range of lighting
www. cree.com/Xlamp
applications,
including
linear
lighting, fluorescent retrofits and
retail-display lighting.
Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the
Cree logo and XLamp® are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
XLamp ML-B LEDs
Characteristics
Characteristics
Unit
Thermal resistance, junction to solder point
°C/W
25
degrees
120
Viewing angle (FWHM)
Temperature coefficient of voltage
Minimum
mV/°C
Typical
Maximum
-3.5
ESD classification (HBM per Mil-Std-883D)
Class 2
DC forward current
mA
175
Reverse voltage
V
5
Forward voltage (@ 80 mA)
V
LED junction temperature
°C
3.3
3.5
150
Flux Characteristics (TJ = 25 °C)
The following table provides several base order codes for XLamp ML-B LEDs. It is important to note that the base order
codes listed here are a subset of the total available order codes for the product family. For more order codes, as well
as a complete description of the order-code nomenclature, please consult the XLamp ML-B LED Binning and Labeling
document.
Color
Cool White
Warm White
80-CRI
Warm White
85-CRI
Warm White
90-CRI
Warm White
CCT Range
Base Order Codes
Min. Luminous Flux
(lm) @ 80 mA
Order Code
Min.
Max.
Group
Flux (lm)
4500 K
8300 K
J0
23.5
MLBAWT-A1-0000-000W51
3700 K
4300 K
J0
23.5
MLBAWT-A1-0000-000WE5
H0
18.1
MLBAWT-A1-0000-000VE5
2800 K
3200 K
J0
23.5
MLBAWT-A1-0000-000WE7
H0
18.1
MLBAWT-A1-0000-000VE7
2000 K
2400 K
G0
13.9
MLBAWT-A1-0000-000UEA
3700 K
4300 K
H0
18.1
MLBAWT-H1-0000-000VE5
2800 K
3200 K
H0
18.1
MLBAWT-H1-0000-000VE7
3700 K
4300 K
H0
18.1
MLBAWT-P1-0000-000VE5
2800 K
3200 K
H0
18.1
MLBAWT-P1-0000-000VE7
3700 K
4300 K
H0
18.1
MLBAWT-U1-0000-000VE5
2800 K
3200 K
H0
18.1
MLBAWT-U1-0000-000VE7
Notes:
• Cree maintains a tolerance of ± 7% on flux measurements, ±0.005 on chromaticity (CCx, CCy) measurements and
± 2% for CRI measurements,
• Typical CRI for Cool White (4300 K – 8300 K CCT) is 75.
• Typical CRI for Warm White (2600 K – 4300 K CCT) is 80.
• Minimum CRI for 80-CRI White is 80.
• Minimum CRI for 85-CRI White is 85.
• Minimum CRI for 90-CRI White is 90.
Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
2
XLamp ML-B LEDs
Relative Spectral Power Distribution
Relative Radiant Power (%)
100
80
5000K - 8300K CCT
3500K - 5000K CCT
60
2600K - 3500K CCT
40
20
0
400
450
500
550
600
650
700
750
Wavelength (nm)
Relative Flux vs. Junction Temperature (IF = 80 mA)
100%
Relative Luminous Flux
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
25
50
75
100
125
150
Junction Temperature (ºC)
Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
3
XLamp ML-B LEDs
Electrical Characteristics (TJ = 25 °C)
180
Forward Current (mA)
160
140
120
100
80
60
40
20
0
2.50
2.75
3.00
3.25
3.50
3.75
4.00
Forward Voltage (V)
Relative Flux vs. Current (TJ = 25 °C)
Relative Luminous Flux (%)
200%
180%
160%
140%
120%
100%
80%
60%
40%
20%
0%
0
25
50
75
100
125
150
175
Forward Current (mA)
Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
4
XLamp ML-B LEDs
Thermal Design
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is
crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to
ambient in order to optimize lamp life and optical characteristics.
200
180
Maximum Current (mA)
160
140
120
100
80
Rj-a = 30°C/W
60
Rj-a = 40°C/W
40
Rj-a = 50°C/W
20
Rj-a = 60°C/W
0
0
25
50
75
100
125
150
Ambient Temperature (ºC)
Typical Spatial Distribution
Relative Luminous Intensity (%)
100
80
60
40
20
0
-90
-70
-50
-30
-10
10
30
50
70
90
Angle (º)
Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
5
XLamp ML-B LEDs
Reflow Soldering Characteristics
In testing, Cree has found XLamp ML-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
Profile Feature
Lead-Based Solder
Lead-Free Solder
3 °C/second max.
3 °C/second max.
Preheat: Temperature Min (Tsmin)
100 °C
150 °C
Preheat: Temperature Max (Tsmax)
150 °C
200 °C
60-120 seconds
60-180 seconds
183 °C
217 °C
60-150 seconds
60-150 seconds
215 °C
260 °C
10-30 seconds
20-40 seconds
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Average Ramp-Up Rate (Tsmax to Tp)
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
Time Within 5 °C of Actual Peak Temperature (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Note: All temperatures refer to topside of the package, measured on the package body surface.
Note: While the high reflow temperatures (above) have been approved, Cree’s best practice guideline for reflow is to use
as low a temperature as possible during the reflow soldering process for these LEDs.
Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
6
XLamp ML-B LEDs
Notes
Lumen Maintenance Projections
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED
lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80
results document at www.cree.com/xlamp_app_notes/LM80_results.
Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/lumen_
maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal
Management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal
design, ambient temperature, and drive current affect the LED junction temperature.
Moisture Sensitivity
Maximum Percent Relative Humidity
XLamp ML-B LEDs are shipped in sealed, moisture-barrier
Temp.
bags (MBB) designed for long shelf life. If XLamp ML-B LEDs
30%
40%
50%
60%
70%
80%
90%
35 ºC
-
-
-
17
1
.5
.5
are exposed to moist environments after opening the MBB
30 ºC
-
-
-
28
1
1
1
packaging but before soldering, damage to the LED may occur
25 ºC
-
-
-
-
2
1
1
during the soldering operation. The derating table at right
20 ºC
-
-
-
-
2
1
1
defines the maximum exposure time (in days) for an XLamp
ML-B LED in the listed humidity and temperature conditions. LEDs with exposure time longer than the time specified
below must be baked according to the baking conditions listed below.
Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree
also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately
after use.
Baking Conditions
It is not necessary to bake all XLamp ML-B LEDs. Only the LEDs that meet all of the following criteria must be baked:
1.
LEDs that have been removed from the original MBB packaging.
2.
LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
3.
LEDs that have not been soldered.
LEDs should be baked at 70 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from MBB packaging
before baking. Do not bake parts at temperatures higher than 70 ºC. This baking operation resets the exposure time as
defined in the Moisture Sensitivity section above.
Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
7
XLamp ML-B LEDs
Storage Conditions
XLamp ML-B LEDs that have been removed from the original MBB packaging but not soldered should be stored in one
of the following ways:
•
Store the parts in a rigid metal container with a tight-fitting lid. Verify that the storage temperature is <30 °C, and
place fresh desiccant and an RH indicator in the container to verify that the RH is no greater than 60%.
•
Store the parts in a dry, nitrogen-purged cabinet or container that actively maintains the temperature at <30° and
the RH at no greater than 60%.
•
For short-term store only: LEDs can be resealed in the original MBB bag soon after opening. Fresh desiccant may be
needed. Use the included humidity indicator card to verify <60% RH.
If an environment of <60% RH is not available for storage, XLamp ML-B LEDs should be baked (described above) before
reflow soldering.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to
as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU
Directive 2011/65/EC (RoHS2), as amended through June 8, 2011. RoHS Declarations for this product can be obtain
from your Cree representative or obtained from the Product Ecology section of www.cree.com.
REACh Compliance
REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical
Agency (ECHA) has published notices of their intent to frequently revise the SVHC listing for the foreseeable future,
please contact a Cree representative to insure you get the most up-to-date REACh Declaration. Historical REACh banned
substance information (substances restricted or banned in the EU prior to 2010) is also available upon request.
UL Recognized Component
Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical
enclosure per ANSI/UL 8750.
Vision Advisory Claim
WARNING. Do not look at exposed LED lamps in operation. Eye injury can result. For more information about LEDs and
eye safety, please refer to the Cree LED Eye Safety Application Note (www.cree.com/xlamp_app_notes/led_eye_safety).
Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
8
XLamp ML-B LEDs
Mechanical Dimensions (TA = 25 °C)
MX3535 Pad
Layout are ±.13 mm unless otherwise indicated.
All measurements
Top View
Top View
Bottom View
Side View
Recommended FR4 Solder Pad
Recommended MCPCB Solder Pad
Alternative Solder Pad
Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
9
6
5
4
3
2
1
REVISONS
NOTICE
EE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
NTAINED WITHIN ARE THE PROPRIETARY AND
NFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
Y NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
AUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT
CREE INC.
REV
DESCRIPTION
BY
DATE
A
Released
J.L.
7/1/09
B
ADDED CATHODE AND ANODE NOTES
DC
2/26/12
1.5±.1
4.0±.1
XLamp ML-B LEDs
8.0±.1
1.75±.10
APP'D
2.5±.1
D
Cathode Side
Tape and Reel
+.3
12.0 tapes conform to EIA-481D, Automated Component Handling Systems Standard.
All Cree carrier
.0
All dimensions in mm.
Cathode
Anode
Side Mark
(denoted by + and circle)
(4 )
(
(8 )
1.5 )
C
User Feed Direction
(1.75 )
CATHODE SIDE
END
(1.55 )
START
(12 )
Trailer
160mm (min) of
empty
Trailerpockets
160mm with
(min) oftape
sealed
empty pockets
(20sealed
pockets
with tapemin.)
Loaded Pockets
(1,000 Lamps)
Loaded Pockets
(1,400 pcs /Reel
(20 pockets min.)
ANODE SIDE
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(50 empty pockets min.)
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(50 empty pockets min.)
B
User Feed Direction
Cover Tape
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
.XX ±
.25
.XXX ±
.125
X°
±
.5 °
FOR SHEET METAL PARTS ONLY
.X
±
1.5
.XX ±
.75
.XXX ±
.25
X°
±
.5 °
DATE
DRAWN BY
D. Seibel
DATE
APPROVED
DATE
5
4
3
Phone (919) 313-5300
Fax (919) 313-5558
A
TITLE
Carrier Loading Specification-MX6
MATERIAL
SIZE
FINAL PROTECTIVE FINISH
SCALE
SURFACE FINISH: 1.6
6
4600 Silicon Drive
Durham, N.C 27703
7/1/09
CHECK
Pocket Tape
2
C
4.000
REV.
DRAWING NO.
2402-00005
SHEET
1
13mm
7"
Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
10
B
OF
1 /2
XLamp ML-B LEDs
Packaging
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin
Code, Qty, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Dessicant
(inside bag)
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Qty, Reel ID, PO #
Humidity Indicator Card
(inside bag)
Label with Cree Bin
Code, Qty, Reel ID
Boxed Reel
Label with Cree Order Code,
Qty, Reel ID, PO #
Label with Cree Bin
Code, Qty, Reel ID
Patent Label
(on bottom of box)
Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
11
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