DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D049 BAP50-03 General purpose PIN diode Product specification Supersedes data of 1999 Feb 01 1999 May 10 Philips Semiconductors Product specification General purpose PIN diode BAP50-03 FEATURES PINNING • Low diode capacitance PIN • Low diode forward resistance. DESCRIPTION 1 cathode 2 anode APPLICATIONS • General RF applications. handbook, halfpage 1 DESCRIPTION 2 General purpose PIN diode in a SOD323 small plastic SMD package. MAM406 Marking code: A8. Fig.1 Simplified outline (SOD323) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER VR continuous reverse voltage IF continuous forward current Ptot total power dissipation Tstg Tj 1999 May 10 CONDITIONS MIN. − MAX. 50 UNIT V − 50 mA − 500 mW storage temperature −65 +150 °C junction temperature −65 +150 °C Ts = 90 °C 2 Philips Semiconductors Product specification General purpose PIN diode BAP50-03 ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF forward voltage IF = 50 mA − 0.95 1.1 V VR reverse voltage IR = 10 µA 50 − − V IR reverse current VR = 50 V − − 100 nA Cd diode capacitance VR = 0; f = 1 MHz − 0.4 − pF VR = 1 V; f = 1 MHz − 0.3 0.55 pF VR = 5 V; f = 1 MHz − 0.2 0.35 pF IF = 0.5 mA; f = 100 MHz; note 1 − 25 40 Ω IF = 1 mA; f = 100 MHz; note 1 − 14 25 Ω IF = 10 mA; f = 100 MHz; note 1 − 3 5 Ω rD diode forward resistance Note 1. Guaranteed on AQL basis: inspection level S4, AQL 1.0. THERMAL CHARACTERISTICS SYMBOL Rth j-s 1999 May 10 PARAMETER thermal resistance from junction to soldering point 3 VALUE UNIT 85 K/W Philips Semiconductors Product specification General purpose PIN diode BAP50-03 GRAPHICAL DATA MGS317 103 handbook, halfpage MGS323 500 handbook, halfpage Cd (fF) rD (Ω) 400 102 300 200 10 100 1 10 −2 10 −1 1 I F (mA) 0 10 8 12 16 20 VR (V) f = 100 MHz; Tj = 25 °C. Fig.2 4 0 f = 1 MHz; Tj = 25 °C. Forward resistance as a function of forward current; typical values. Fig.3 MGS319 0 handbook, halfpage 2 (dB) −1 MGS316 0 handbook, halfpage 2 (1) |S21| Diode capacitance as a function of reverse voltage; typical values. |S21| (dB) −5 (2) (3) −2 −10 −3 −15 −4 −20 −5 0.5 1 1.5 2 2.5 −25 0.5 3 f (GHz) (1) IF = 10 mA. (2) IF = 1 mA. 2 2.5 3 (3) IF = 0.5 mA. Diode zero biased and inserted in series with a 50 Ω stripline circuit. Tamb = 25 °C. Insertion loss (|S21|2) of the diode as a function of frequency; typical values. 1999 May 10 1.5 f (GHz) Diode inserted in series with a 50 Ω stripline circuit and biased via the analyzer Tee network. Tamb = 25 °C. Fig.4 1 Fig.5 4 Isolation (|S21|2) of the diode as a function of frequency; typical values. Philips Semiconductors Product specification General purpose PIN diode BAP50-03 PACKAGE OUTLINE SOD323 Plastic surface mounted package; 2 leads A A1 , Q c Lp v M A HE A D 1 E bp 2 (1) 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max. bp mm 1.1 0.8 + 0.05 − 0.05 0.40 0.25 c D E HE Lp Q v 0.25 0.10 1.8 1.6 1.35 1.15 2.7 2.3 0.45 0.15 0.25 0.15 0.2 Note 1. The marking bar indicates the cathode. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOD323 1999 May 10 EUROPEAN PROJECTION ISSUE DATE 98-09-14 5 Philips Semiconductors Product specification General purpose PIN diode BAP50-03 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 May 10 6 Philips Semiconductors Product specification General purpose PIN diode BAP50-03 NOTES 1999 May 10 7 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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