JMNIC BAP50-03 General purpose pin diode Datasheet

DISCRETE SEMICONDUCTORS
DATA SHEET
k, halfpage
M3D049
BAP50-03
General purpose PIN diode
Product specification
Supersedes data of 1999 Feb 01
1999 May 10
Philips Semiconductors
Product specification
General purpose PIN diode
BAP50-03
FEATURES
PINNING
• Low diode capacitance
PIN
• Low diode forward resistance.
DESCRIPTION
1
cathode
2
anode
APPLICATIONS
• General RF applications.
handbook, halfpage
1
DESCRIPTION
2
General purpose PIN diode in a SOD323 small plastic
SMD package.
MAM406
Marking code: A8.
Fig.1 Simplified outline (SOD323) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
VR
continuous reverse voltage
IF
continuous forward current
Ptot
total power dissipation
Tstg
Tj
1999 May 10
CONDITIONS
MIN.
−
MAX.
50
UNIT
V
−
50
mA
−
500
mW
storage temperature
−65
+150
°C
junction temperature
−65
+150
°C
Ts = 90 °C
2
Philips Semiconductors
Product specification
General purpose PIN diode
BAP50-03
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VF
forward voltage
IF = 50 mA
−
0.95
1.1
V
VR
reverse voltage
IR = 10 µA
50
−
−
V
IR
reverse current
VR = 50 V
−
−
100
nA
Cd
diode capacitance
VR = 0; f = 1 MHz
−
0.4
−
pF
VR = 1 V; f = 1 MHz
−
0.3
0.55
pF
VR = 5 V; f = 1 MHz
−
0.2
0.35
pF
IF = 0.5 mA; f = 100 MHz; note 1
−
25
40
Ω
IF = 1 mA; f = 100 MHz; note 1
−
14
25
Ω
IF = 10 mA; f = 100 MHz; note 1
−
3
5
Ω
rD
diode forward resistance
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-s
1999 May 10
PARAMETER
thermal resistance from junction to soldering point
3
VALUE
UNIT
85
K/W
Philips Semiconductors
Product specification
General purpose PIN diode
BAP50-03
GRAPHICAL DATA
MGS317
103
handbook, halfpage
MGS323
500
handbook, halfpage
Cd
(fF)
rD
(Ω)
400
102
300
200
10
100
1
10 −2
10 −1
1
I F (mA)
0
10
8
12
16
20
VR (V)
f = 100 MHz; Tj = 25 °C.
Fig.2
4
0
f = 1 MHz; Tj = 25 °C.
Forward resistance as a function of
forward current; typical values.
Fig.3
MGS319
0
handbook, halfpage
2
(dB)
−1
MGS316
0
handbook, halfpage
2
(1)
|S21|
Diode capacitance as a function of reverse
voltage; typical values.
|S21|
(dB)
−5
(2)
(3)
−2
−10
−3
−15
−4
−20
−5
0.5
1
1.5
2
2.5
−25
0.5
3
f (GHz)
(1) IF = 10 mA.
(2) IF = 1 mA.
2
2.5
3
(3) IF = 0.5 mA.
Diode zero biased and inserted in series with a 50 Ω stripline circuit.
Tamb = 25 °C.
Insertion loss (|S21|2) of the diode as a
function of frequency; typical values.
1999 May 10
1.5
f (GHz)
Diode inserted in series with a 50 Ω stripline circuit and
biased via the analyzer Tee network.
Tamb = 25 °C.
Fig.4
1
Fig.5
4
Isolation (|S21|2) of the diode as a function
of frequency; typical values.
Philips Semiconductors
Product specification
General purpose PIN diode
BAP50-03
PACKAGE OUTLINE
SOD323
Plastic surface mounted package; 2 leads
A
A1
,
Q
c
Lp
v M A
HE
A
D
1
E
bp
2
(1)
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
mm
1.1
0.8
+ 0.05
− 0.05
0.40
0.25
c
D
E
HE
Lp
Q
v
0.25
0.10
1.8
1.6
1.35
1.15
2.7
2.3
0.45
0.15
0.25
0.15
0.2
Note
1. The marking bar indicates the cathode.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
SOD323
1999 May 10
EUROPEAN
PROJECTION
ISSUE DATE
98-09-14
5
Philips Semiconductors
Product specification
General purpose PIN diode
BAP50-03
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 May 10
6
Philips Semiconductors
Product specification
General purpose PIN diode
BAP50-03
NOTES
1999 May 10
7
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© Philips Electronics N.V. 1999
SCA 64
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Printed in The Netherlands
125004/00/02/pp8
Date of release: 1999 May 10
Document order number:
9397 750 05439
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