CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V FLEx36™ 3.3V 32K/64K/128K/256K/512 x 36 Synchronous Dual-Port RAM Features Functional Description ■ True dual-ported memory cells that allow simultaneous access of the same memory location ■ Synchronous pipelined operation ■ Family of 1-Mbit, 2-Mbit, 4-Mbit, 9-Mbit and 18-Mbit devices ■ Pipelined output mode allows fast operation ■ 0.18 micron CMOS for optimum speed and power The FLEx36 family includes 1-Mbit, 2-Mbit, 4-Mbit, 9-Mbit, and 18-Mbit pipelined, synchronous, true dual-port static RAMs that are high-speed, low-power 3.3V CMOS. Two ports are provided, permitting independent, simultaneous access to any location in memory. A particular port can write to a certain location while another port is reading that location. The result of writing to the same location by more than one port at the same time is undefined. Registers on control, address, and data lines allow for minimal setup and hold time. ■ High-speed clock to data access ■ 3.3V low power ❐ Active as low as 225 mA (typ.) ❐ Standby as low as 55 mA (typ.) ■ Mailbox function for message passing ■ Global master reset ■ Separate byte enables on both ports ■ Commercial and industrial temperature ranges ■ IEEE 1149.1-compatible JTAG boundary scan ■ 256 Ball FBGA (1-mm pitch) ■ Counter wrap around control ❐ Internal mask register controls counter wrap-around ❐ Counter-interrupt flags to indicate wrap-around ❐ Memory block retransmit operation ■ Counter readback on address lines ■ Mask register readback on address lines ■ Dual Chip Enables on both ports for easy depth expansion ■ Seamless migration to next-generation dual-port family During a Read operation, data is registered for decreased cycle time. Each port contains a burst counter on the input address register. After externally loading the counter with the initial address, the counter increments the address internally (more details to follow). The internal Write pulse width is independent of the duration of the R/W input signal. The internal Write pulse is self-timed to allow the shortest possible cycle times. A HIGH on CE0 or LOW on CE1 for one clock cycle powers down the internal circuitry to reduce the static power consumption. One cycle with chip enables asserted is required to reactivate the outputs. Additional features include: readback of burst-counter internal address value on address lines, counter-mask registers to control the counter wrap-around, counter interrupt (CNTINT) flags, readback of mask register value on address lines, retransmit functionality, interrupt flags for message passing, JTAG for boundary scan, and asynchronous Master Reset (MRST). The CYD18S36V devices in this family has limited features. Please see Address Counter and Mask Register Operations[19] on page 5 for details. Seamless Migration to Next-Generation Dual-Port Family Cypress offers a migration path for all devices in this family to the next-generation devices in the Dual-Port family with a compatible footprint. Please contact Cypress Sales for more details. Table 1. Product Selection Guide 1 Mbit (32K x 36) 2 Mbit (64K x 36) 4 Mbit (128K x 36) 9 Mbit (256K x 36) 18 Mbit (512K x 36) CYD01S36V CYD02S36V CYD04S36V CYD09S36V CYD18S36V Max. Speed (MHz) 167 167 167 167 133 Max. Access Time – Clock to Data (ns) 4.0 4.4 4.0 4.0 5.0 Typical Operating Current (mA) 225 225 225 270 315 Density Part Number Package 256 FBGA 256 FBGA 256 FBGA 256 FBGA 256 FBGA (17 mm x 17 mm) (17 mm x 17 mm) (17 mm x 17 mm) (17 mm x 17 mm) (23 mm x 23 mm) Cypress Semiconductor Corporation Document Number: 38-06076 Rev. *F • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised March 12, 2008 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Logic Block Diagram[1] FTSELL FTSELR CONFIG Block CONFIG Block PORTSTD[1:0]R PORTSTD[1:0]L DQ [35:0]L BE [3:0]L CE0L CE1L OEL IO Control IO Control DQ [35:0]R BE [3:0]R CE0R CE1R OER R/WR R/WL Dual Ported Array BUSYL A [18:0]L CNT/MSKL ADSL CNTENL CNTRSTL RETL CNTINTL CL Arbitration Logic Address & Counter Logic BUSYR Address & Counter Logic WRPL A [18:0]R CNT/MSKR ADSR CNTENR CNTRSTR RETR CNTINTR CR WRPR JTAG TRST TMS TDI TDO TCK RESET LOGIC MRST READYR LowSPDR Mailboxes INTL INTR READYL LowSPDL Note 1. 18-Mbit device has 19 address bits, 9-Mbit device has 18 address bits, 4-Mbit device has 17 address bits, 2-Mbit device has 16 address bits, and 1-Mbit device has 15 address bits. Document Number: 38-06076 Rev. *F Page 2 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Pin Configurations Figure 1. Pin Diagram - 256-Ball FBGA (Top View) CYD01S36V/CYD02S36V/CYD04S36V/CYD09S36V/CYD18S36V 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A DQ32L DQ30L DQ28L DQ26L DQ24L DQ22L DQ20L DQ18L DQ18R DQ20R DQ22R DQ24R DQ26R DQ28R DQ30R DQ32R B DQ33L DQ31L DQ29L DQ27L DQ25L DQ23L DQ21L DQ19L DQ19R DQ21R DQ23R DQ25R DQ27R DQ29R DQ31R DQ33R C DQ34L DQ35L RETL [2,3] INTL NC [2,5] NC [2,5] REVL [2,4] TRST [2,5] MRST NC [2,5] NC [2,5] NC [2,5] INTR RETR [2,3] DQ35R DQ34R D A0L A1L WRPL [2,3] VREFL [2,4] FTSELL [2,3] LOWSPDL [2,4] VSS VTTL VTTL VSS LOWSPDR [2,4] FTSELR [2,3] VREFL [2,4] WRPR [2,3] A1R A0R E A2L A3L CE0L [11] CE1L [10] VDDIOL VDDIOL VDDIOL VCORE VCORE VDDIOR VDDIOR VDDIOR CE1R [10] CE0R [11] A3R A2R F A4L A5L CNTINTL [12] BE3L VDDIOL VSS VSS VSS VSS VSS VSS VDDIOR BE3R CNTINTR [12] A5R A4R G A6L A7L BUSYL [2,5] BE2L REVL [2,3] VSS VSS VSS VSS VSS VSS VDDIOR BE2R BUSYR [2,5] A7R A6R H A8L A9L CL VTTL VCORE VSS VSS VSS VSS VSS VSS VCORE VTTL CR A9R A8R J A10L A11L VSS PORTSTD1 L[2,4] VCORE VSS VSS VSS VSS VSS VSS VCORE PORTSTD1 R[2,4] VSS A11R A10R K A12L A13L OEL BE1L VDDIOL VSS VSS VSS VSS VSS VSS VDDIOR BE1R OER A13R A12R L A14L A15L [6] ADSL [11] BE0L VDDIOL VSS VSS VSS VSS VSS VSS VDDIOR BE0R ADSR [11] A15R [6] A14R M A16L [7] A17L [8] R/WL REVL [2,4] VDDIOL VDDIOL VDDIOL VCORE VCORE VDDIOR VDDIOR VDDIOR REVR [2,4] R/WR A17R [8] A16R [7] N A18L [9] A19L [2,5] CNT/MSKL [10] VREFL [2,4] PortSTD0L [2,4] READYL [2,5] REVL [2,3] VTTL VTTL REVR [2,3] READYR [2,5] PortSTD0R [2,4] VREFR [2,4] CNT/MSKR [10] A19R [2,5] A18R [9] P DQ16L DQ17L CNTENL [11] CNTRSTL [10] NC [2,5] NC [2,5] TCK TMS TDO TDI NC [2,5] NC [2,5] CNTRSTR [10] CNTENR [11] DQ17R DQ16R R DQ15L DQ13L DQ11L DQ9L DQ7L DQ5L DQ3L DQ1L DQ1R DQ3R DQ5R DQ7R DQ9R DQ11R DQ13R DQ15R T DQ14L DQ12L DQ10L DQ8L DQ6L DQ4L DQ2L DQ0L DQ0R DQ2R DQ4R DQ6R DQ8R DQ10R DQ12R DQ14R Notes 2. This ball represents a next generation Dual-Port feature. For more information about this feature, contact Cypress Sales. 3. Connect this ball to VDDIO. For more information about this next generation Dual-Port feature contact Cypress Sales. 4. Connect this ball to VSS. For more information about this next generation Dual-Port feature, contact Cypress Sales. 5. Leave this ball unconnected. For more information about this feature, contact Cypress Sales. 6. Leave this ball unconnected for 32K x 36configuration. 7. Leave this ball unconnected for a 64K x 36, 32K x 36 configurations. 8. Leave this ball unconnected for a 128K x 36, 64K x 36 and 32K x 36 configurations. 9. Leave this ball unconnected for a 256K x 36, 128K x 36, 64K x 36, and 32K x 36 configurations. 10. These balls are not applicable for CYD18S36V device. They need to be tied to VDDIO. 11. These balls are not applicable for CYD18S36V device. They need to be tied to VSS. 12. These balls are not applicable for CYD18S36V device. They need to be no connected. Document Number: 38-06076 Rev. *F Page 3 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Pin Definitions Left Port Right Port A0L–A18L A0R–A18R BE0L–BE3L BE0R–BE3R Byte Enable Inputs. Asserting these signals enables Read and Write operations to the corresponding bytes of the memory array. BUSYL[2,5] BUSYR[2,5] Port Busy Output. When the collision is detected, a BUSY is asserted. CL CR [11] Description Address Inputs. Input Clock Signal. CE1L[10] CE0R[11] CE1R[10] DQ0L–DQ35L DQ0R–DQ35R OEL OER Output Enable Input. This asynchronous signal must be asserted LOW to enable the DQ data pins during Read operations. INTL INTR Mailbox Interrupt Flag Output. The mailbox permits communications between ports. The upper two memory locations can be used for message passing. INTL is asserted LOW when the right port writes to the mailbox location of the left port, and vice versa. An interrupt to a port is deasserted HIGH when it reads the contents of its mailbox. LowSPDL[2,4] LowSPDR[2,4] CE0L PORTSTD[1:0]L [2,4] PORTSTD[1:0]R R/WL R/WR READYL[2,5] READYR[2,5] Active High Chip Enable Input. [2,4] Data Bus Input/Output. Port Low Speed Select Input. Port Address/Control/Data IO Standard Select Inputs. Read/Write Enable Input. Assert this pin LOW to write to, or HIGH to Read from the dual port memory array. Port Ready Output. This signal is asserted when a port is ready for normal operation. CNTENL[11] CNTRSTL[10] CNTINTL[12] CNT/MSKR[10] ADSR[11] CNTENR[11] CNTRSTR[10] CNTINTR[12] WRPL[2,3] WRPR[2,3] Port Counter Wrap Input. The burst counter wrap control input. [2,3] RETR[2,3] Port Counter Retransmit Input. Counter control input. CNT/MSKL [10] Active Low Chip Enable Input. ADSL[11] RETL FTSELL[2,3] FTSELR VREFL[2,4] VREFR[2,4] VDDIOL VDDIOR REVL [2,3] REVR[2, 3, 4] [2, 3, 4] MRST TRST[2,5] Port Counter/Mask Select Input. Counter control input. Port Counter Address Load Strobe Input. Counter control input. Port Counter Enable Input. Counter control input. Port Counter Reset Input. Counter control input. Port Counter Interrupt Output. This pin is asserted LOW when the unmasked portion of the counter is incremented to all “1s”. Flow-Through Select. Use this pin to select Flow-Through mode. When is de-asserted, the device is in pipelined mode. Port External High-Speed IO Reference Input. Port IO Power Supply. Reserved pins for future features. Master Reset Input. MRST is an asynchronous input signal and affects both ports. A maser reset operation is required at power up. JTAG Reset Input. TMS JTAG Test Mode Select Input. It controls the advance of JTAG TAP state machine. State machine transitions occur on the rising edge of TCK. TDI JTAG Test Data Input. Data on the TDI input is shifted serially into selected registers. TCK JTAG Test Clock Input. TDO JTAG Test Data Output. TDO transitions occur on the falling edge of TCK. TDO is normally three-stated except when captured data is shifted out of the JTAG TAP. VSS Ground Inputs. VCORE[13] VTTL Document Number: 38-06076 Rev. *F Core Power Supply. LVTTL Power Supply for JTAG IOs Page 4 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Master Reset The FLEx36 family devices undergo a complete reset by taking its MRST input LOW. The MRST input can switch asynchronously to the clocks. An MRST initializes the internal burst counters to zero, and the counter mask registers to all ones (completely unmasked). MRST also forces the Mailbox Interrupt (INT) flags and the Counter Interrupt (CNTINT) flags HIGH. MRST must be performed on the FLEx36 family devices after power up. Mailbox Interrupts The upper two memory locations may be used for message passing and permit communications between ports. Table 2 shows the interrupt operation for both ports of CYD18S36V. The highest memory location, 7FFFF is the mailbox for the right port and 7FFFE is the mailbox for the left port. Table 2 shows that to set the INTR flag, a Write operation by the left port to address 7FFFF asserts INTR LOW. At least one byte must be active for a Write to generate an interrupt. A valid Read of the 7FFFF location by the right port resets INTR HIGH. At least one byte must be active in order for a Read to reset the interrupt. When one port Writes to the other port’s mailbox, the INT of the port that the mailbox belongs to is asserted LOW. The INT is reset when the owner (port) of the mailbox Reads the contents of the mailbox. The interrupt flag is set in a flow-thru mode (i.e., it follows the clock edge of the writing port). Also, the flag is reset in a flow-thru mode (i.e., it follows the clock edge of the reading port). Each port can read the other port’s mailbox without resetting the interrupt. And each port can write to its own mailbox without setting the interrupt. If an application does not require message passing, INT pins must be left open. Address Counter and Mask Register Operations[19] This section describes the features only apply to 1Mbit, 2 Mbit, 4 Mbit and 9 Mbit devices. It does not apply to 18Mbit device. Each port of these devices has a programmable burst address counter. The burst counter contains three registers: a counter register, a mask register, and a mirror register. The counter register contains the address used to access the RAM array. It is changed only by the Counter Load, Increment, Counter Reset, and by master reset (MRST) operations. The mask register value affects the Increment and Counter Reset operations by preventing the corresponding bits of the counter register from changing. It also affects the counter interrupt output (CNTINT). The mask register is changed only by the Mask Load and Mask Reset operations, and by the MRST. The mask register defines the counting range of the counter register. It divides the counter register into two regions: zero or more “0s” in the most significant bits define the masked region, one or more “1s” in the least significant bits define the unmasked region. Bit 0 may also be “0,” masking the least significant counter bit and causing the counter to increment by two instead of one.l The mirror register is used to reload the counter register on increment operations (see “retransmit,” below). It always contains the value last loaded into the counter register, and is changed only by the Counter Load, and Counter Reset operations, and by the MRST. Table 3 on page 6 summarizes the operation of these registers and the required input control signals. The MRST control signal is asynchronous. All the other control signals in Table 3 on page 6 (CNT/MSK, CNTRST, ADS, CNTEN) are synchronized to the port’s CLK. All these counter and mask operations are independent of the port’s chip enable inputs (CE0 and CE1). Table 2. Interrupt Operation Example [1, 14, 15, 16, 17, 18] Function Left Port Right Port R/WL CEL A0L–18L INTL R/WR CER A0R–18R INTR Set Right INTR Flag L L 7FFFF X X X X L Reset Right INTR Flag X X X X H L 7FFFF H Set Left INTL Flag X X X L L L 7FFFE X Reset Left INTL Flag H L 7FFFE H X X X X Notes 13. This family of Dual-Ports does not use VCORE, and these pins are internally NC. The next generation Dual-Port family, the FLEx36-E™, uses VCORE of 1.5V or 1.8V. Please contact local Cypress FAE for more information. 14. CE is internal signal. CE = LOW if CE0 = LOW and CE1 = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK and can be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge. 15. OE is “Don’t Care” for mailbox operation. 16. At least one of BE0, BE1, BE2, or BE3 must be LOW. 17. A17x is a NC for CYD04S36V, therefore the Interrupt Addresses are 1FFFF and 1FFFE. A17x and A16x are NC for CYD02S36V, therefore the Interrupt Addresses are FFFF and FFFE; A17x, A16x and A15x are NC for CYD01S36V, therefore the Interrupt Addresses are 7FFF and 7FFE. 18. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW. 19. This section describes the CYD09S36V, CYD04S36V, CYD02S36V, and CYD01S36V which have 18, 17, 16 and 15 address bits. Document Number: 38-06076 Rev. *F Page 5 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Counter Reset Operation Counter enable (CNTEN) inputs are provided to stall the operation of the address input and use the internal address generated by the internal counter for fast, interleaved memory applications. A port’s burst counter is loaded when the port’s address strobe (ADS) and CNTEN signals are LOW. When the port’s CNTEN is asserted and the ADS is deasserted, the address counter increments on each LOW to HIGH transition of that port’s clock signal. This Read’s or Write’s one word from/into each successive address location until CNTEN is deasserted. The counter can address the entire memory array, and loops back to the start. Counter reset (CNTRST) is used to reset the unmasked portion of the burst counter to 0s. A counter-mask register is used to control the counter wrap. All unmasked bits of the counter and mirror registers are reset to “0.” All masked bits remain unchanged. A Mask Reset followed by a Counter Reset resets the counter and mirror registers to 00000, as does master reset (MRST). Counter Load Operation The address counter and mirror registers are both loaded with the address value presented at the address lines. Table 3. Address Counter and Counter-Mask Register Control Operation (Any Port) [18, 20] CLK MRST CNT/MSK CNTRST ADS CNTEN X L X X X X Master Reset Operation Reset address counter to all 0s and mask register to all 1s. Description H H L X X Counter Reset Reset counter unmasked portion to all 0s. H H H L L Counter Load Load counter with external address value presented on address lines. H H H L H Counter Readback Read out counter internal value on address lines. H H H H L Counter Increment Internally increment address counter value. H H H H H Counter Hold Constantly hold the address value for multiple clock cycles. H L L X X Mask Reset Reset mask register to all 1s. H L H L L Mask Load Load mask register with value presented on the address lines. H L H L H Mask Readback Read out mask register value on address lines. H L H H X Reserved Operation undefined Note 20. Counter operation and mask register operation is independent of chip enables. Document Number: 38-06076 Rev. *F Page 6 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Counter Increment Operation Once the address counter register is initially loaded with an external address, the counter can internally increment the address value, potentially addressing the entire memory array. Only the unmasked bits of the counter register are incremented. The corresponding bit in the mask register must be a “1” for a counter bit to change. The counter register is incremented by 1 if the least significant bit is unmasked, and by 2 if it is masked. If all unmasked bits are “1,” the next increment wraps the counter back to the initially loaded value. If an Increment results in all the unmasked bits of the counter being “1s,” a counter interrupt flag (CNTINT) is asserted. The next Increment returns the counter register to its initial value, which was stored in the mirror register. The counter address can instead be forced to loop to 00000 by externally connecting CNTINT to CNTRST.[21] An increment that results in one or more of the unmasked bits of the counter being “0” de-asserts the counter interrupt flag. The example in Figure 3 on page 9 shows the counter mask register loaded with a mask value of 0003Fh unmasking the first 6 bits with bit “0” as the LSB and bit “16” as the MSB. The maximum value the mask register can be loaded with is 3FFFFh. Setting the mask register to this value allows the counter to access the entire memory space. The address counter is then loaded with an initial value of 8h. The base address bits (in this case, the 6th address through the 16th address) are loaded with an address value but do not increment once the counter is configured for increment operation. The counter address starts at address 8h. The counter increments its internal address value till it reaches the mask register value of 3Fh. The counter wraps around the memory block to location 8h at the next count. CNTINT is issued when the counter reaches its maximum value. Counter Hold Operation The value of all three registers can be constantly maintained unchanged for an unlimited number of clock cycles. Such operation is useful in applications where wait states are needed, or when address is available a few cycles ahead of data in a shared bus interface. Counter Interrupt The counter interrupt (CNTINT) is asserted LOW when an increment operation results in the unmasked portion of the counter register being all “1s.” It is deasserted HIGH when an Increment operation results in any other value. It is also de-asserted by Counter Reset, Counter Load, Mask Reset and Mask Load operations, and by MRST. Counter Readback Operation The internal value of the counter register can be read out on the address lines. Readback is pipelined; the address is valid tCA2 after the next rising edge of the port’s clock. If address readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) are three-stated. Figure 2 on page 8 shows a block diagram of the operation. Retransmit Retransmit is a feature that allows the Read of a block of memory more than once without the need to reload the initial address. This eliminates the need for external logic to store and route data. It also reduces the complexity of the system design and saves board space. An internal “mirror register” is used to store the initially loaded address counter value. When the counter unmasked portion reaches its maximum value set by the mask register, it wraps back to the initial value stored in this “mirror register.” If the counter is continuously configured in increment mode, it increments again to its maximum value and wraps back to the value initially stored into the “mirror register.” Thus, the repeated access of the same data is allowed without the need for any external logic. Mask Reset Operation The mask register is reset to all “1s,” which unmasks every bit of the counter. Master reset (MRST) also resets the mask register to all “1s.” Mask Load Operation The mask register is loaded with the address value presented at the address lines. Not all values permit correct increment operations. Permitted values are of the form 2n – 1 or 2n – 2. From the most significant bit to the least significant bit, permitted values have zero or more “0s,” one or more “1s,” or one “0.” Thus 7FFFF, 003FE, and 00001 are permitted values, but 7F0FF, 003FC, and 00000 are not. Mask Readback Operation The internal value of the mask register can be read out on the address lines. Readback is pipelined; the address is valid tCM2 after the next rising edge of the port’s clock. If mask readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) are three-stated. Figure 2 on page 8 shows a block diagram of the operation. Counting by Two When the least significant bit of the mask register is “0,” the counter increments by two. This may be used to connect the x36 devices as a 72-bit single port SRAM in which the counter of one port counts even addresses and the counter of the other port counts odd addresses. This even-odd address scheme stores one half of the 72-bit data in even memory locations, and the other half in odd memory locations. Note 21. CNTINT and CNTRST specs are guaranteed by design to operate properly at speed grade operating frequency when tied together. Document Number: 38-06076 Rev. *F Page 7 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Figure 2. Counter, Mask, and Mirror Logic Block Diagram[1] CNT/MSK CNTEN Decode Logic ADS CNTRST MRST Bidirectional Address Lines Mask Register Counter/ Address Register Address RAM Decode Array CLK From Address Lines Load/Increment 17 Mirror Counter 1 To Readback and Address Decode 1 0 From Mask Register From Mask From Counter 0 17 Increment Logic Wrap 17 17 17 Bit 0 17 +1 Wrap Detect 1 +2 0 1 0 Document Number: 38-06076 Rev. *F Wrap 17 To Counter Page 8 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Figure 3. Programmable Counter-Mask Register Operation[1, 22] Example: Load Counter-Mask Register = 3F CNTINT H 0 0 0s 216 215 H X X Xs 216 215 Max Address Register L X X H X X 216 215 IEEE 1149.1 Serial Boundary Scan (JTAG)[23] The FLEx36 family devices incorporate an IEEE 1149.1 serial boundary scan test access port (TAP). The TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1-compliant TAPs. The TAP operates using JEDEC-standard 3.3V IO logic levels. It is composed of three input connections and one output connection required by the test logic defined by the standard. Performing a TAP Reset A reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This reset does not affect the operation of the devices, and may be performed while the device is operating. An MRST must be performed on the devices after power up. Performing a Pause/Restart When a SHIFT-DR PAUSE-DR SHIFT-DR is performed the scan chain outputs the next bit in the chain twice. For example, if the value expected from the chain is 1010101, the device outputs a 11010101. This extra bit causes some testers to report an erroneous failure for the devices in a scan test. Therefore the tester must be configured to never enter the PAUSE-DR state. 1 1 1 1 Unmasked Address X 0 0 1 0 0 Xs X 1 1 1 1 Mask Register bit-0 0 26 25 24 23 22 21 20 216 215 Max + 1 Address Register 1 26 25 24 23 22 21 20 Masked Address Load Address Counter = 8 0 1 1 Address Counter bit-0 1 26 25 24 23 22 21 20 Xs X 0 0 1 0 0 0 26 25 24 23 22 21 20 Boundary Scan Hierarchy for 9-Mbit and 18-Mbit Devices Internally, the devices have multiple DIEs. Each DIE contains all the circuitry required to support boundary scan testing. The circuitry includes the TAP, TAP controller, instruction register, and data registers. The circuity and operation of the DIE boundary scan are described in detail below. The scan chain for 9-Mbit and 18-Mbit devices uses a hierarchical approach as shown in Figure 4 on page 10 and Figure 5 on page 10. TMS and TCK are connected in parallel to each DIE to drive all 2- or 4-TAP controllers in unison. In many cases, each DIE is supplied with the same instruction. In other cases, it might be useful to supply different instructions to each DIE. One example would be testing the device ID of one DIE while bypassing the rest. Each pin of the devices is typically connected to multiple DIEs. For connectivity testing with the EXTEST instruction, it is desirable to check the internal connections between DIEs and the external connections to the package. This can be accomplished by merging the netlist of the devices with the netlist of the user’s circuit board. To facilitate boundary scan testing of the devices, Cypress provides the BSDL file for each DIE, the internal netlist of the device, and a description of the device scan chain. The user can use these materials to easily integrate the devices into the board’s boundary scan environment. Further information can be found in the Cypress application note Using JTAG Boundary Scan For System in a Package (SIP) Dual-Port SRAMs. Notes 22. The “X” in this diagram represents the counter upper bits. 23. Boundary scan is IEEE 1149.1-compatible. See “Performing a Pause/Restart” for deviation from strict 1149.1 compliance. Document Number: 38-06076 Rev. *F Page 9 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Figure 4. Scan Chain for 18-Mbit Device TDO TDO TDO D2 D4 TDI TDI TDO TDO D1 D3 TDI TDI TDI Figure 5. Scan Chain for 9-Mbit Device TDO TDO D2 TDI TDO D1 TDI TDI Table 4. Identification Register Definitions Instruction Field Value Revision Number (31:28) Cypress Device ID (27:12) Description 0h Reserved for version number. C002h Defines Cypress part number for CYD04S36V, CYD09S36V and CYD18S36V C001h Defines Cypress part number for CYD02S36V C092h Defines Cypress part number for CYD01S36V Cypress JEDEC ID (11:1) 034h Allows unique identification of the DP family device vendor. ID Register Presence (0) 1 Indicates the presence of an ID register. Table 5. Scan Register Sizes Register Name Bit Size Instruction 4 Bypass 1 Identification 32 Boundary Scan n[24] Note 24. See details in the device BSDL files. Document Number: 38-06076 Rev. *F Page 10 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Table 6. Instruction Identification Codes Instruction Code Description EXTEST 0000 Captures the Input/Output ring contents. Places the BSR between the TDI and TDO. BYPASS 1111 Places the BYR between TDI and TDO. IDCODE 1011 Loads the IDR with the vendor ID code and places the register between TDI and TDO. HIGHZ 0111 Places BYR between TDI and TDO. Forces all device output drivers to a High-Z state. CLAMP 0100 Controls boundary to 1/0. Places BYR between TDI and TDO. SAMPLE/PRELOAD 1000 Captures the input/output ring contents. Places BSR between TDI and TDO. NBSRST 1100 Resets the non-boundary scan logic. Places BYR between TDI and TDO. RESERVED All other codes Other combinations are reserved. Do not use other than the above. Document Number: 38-06076 Rev. *F Page 11 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Maximum Ratings Output Current into Outputs (LOW)............................. 20 mA Exceeding maximum ratings[25] may shorten the useful life of the device. User guidelines are not tested. (JEDEC JESD22-A114-2000B) Storage Temperature .................................. –65°C to +150°C Latch-up Current..................................................... > 200 mA Ambient Temperature with Operating Range Static Discharge Voltage........................................... > 2000V Power Applied ............................................ –55°C to +125°C Supply Voltage to Ground Potential................–0.5V to +4.6V Range DC Voltage Applied to Outputs in High-Z State .......................... –0.5V to VDD +0.5V Commercial Industrial DC Input Voltage .............................. –0.5V to VDD + 0.5V[26] Electrical Characteristics Over the Operating Range Parameter Ambient Temperature 0°C to +70°C Output HIGH Voltage (VDD = Min, IOH= –4.0 mA) VOL Output LOW Voltage (VDD = Min, IOL= +4.0 mA) VIH Input HIGH Voltage VIL Input LOW Voltage IOZ Output Leakage Current 3.3V±165 mV 1.8V±100 mV -133 Min Typ. Max Min VOH 2.4 Typ. -100 Max 2.4 Typ. Max Unit V 0.4 2.0 0.4 V 2.0 0.8 10 Min 2.4 0.4 2.0 –10 VCORE[13] –40°C to +85°C 3.3V±165 mV 1.8V±100 mV -167 Description VDDIO/VTTL V 0.8 –10 10 –10 0.8 V 10 μA IIX1 Input Leakage Current Except TDI, TMS, MRST –10 10 –10 10 –10 10 μA IIX2 Input Leakage Current TDI, TMS, MRST –1.0 0.1 –1.0 0.1 –1.0 0.1 mA ICC Operating Current for CYD01S36V (VDD = Max.,IOUT = 0 mA), Outputs CYD02S36V/ Disabled CYD04S36V 225 300 225 300 mA CYD09S36V 450 600 370 540 mA 410 580 CYD18S36V [27] 315 450 mA Standby Current (Both Ports TTL Level) CEL and CER ≥ VIH, f = fMAX 90 115 90 115 mA ISB2[27] Standby Current (One Port TTL Level) CEL | CER ≥ VIH, f = fMAX 160 210 160 210 mA ISB3[27] Standby Current (Both Ports CMOS Level) CEL and CER ≥ VDD – 0.2V, f = 0 55 75 55 75 mA ISB4[27] Standby Current (One Port CMOS Level) CEL | CER ≥ VIH, f = fMAX 160 210 160 210 mA ISB5 Operating Current (VDDIO = Max, CYD18S36V Iout = 0 mA, f = 0) Outputs Disabled ICORE[13] Core Operating Current for (VDD = Max, IOUT = 0 mA), Outputs Disabled ISB1 75 0 0 0 0 0 75 mA 0 mA Capacitance Part Number Parameter[28] Description CYD01S36/ CYD02S36V/ CYD04S36V CIN Input Capacitance COUT Output Capacitance CYD09S36V CIN Input Capacitance COUT Output Capacitance Test Conditions TA = 25°C, f = 1 MHz, VDD = 3.3V Max Unit 13 pF 10 pF 22 pF 10[29] pF Notes 25. The voltage on any input or IO pin cannot exceed the power pin during power up. 26. Pulse width < 20 ns. 27. ISB1, ISB2, ISB3 and ISB4 are not applicable for CYD18S36V because it cannot be powered down by using chip enable pins. 28. COUT also references CIO. 29. Except INT and CNTINT which are 20 pF. Document Number: 38-06076 Rev. *F Page 12 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Capacitance (continued) Parameter[28] Part Number CYD18S36V Description Test Conditions Max Unit CIN Input Capacitance 40 pF COUT Output Capacitance 20 pF AC Test Load and Waveforms Z0 = 50Ω 3.3V R = 50Ω R1 = 590 Ω OUTPUT OUTPUT C = 10 pF C = 5 pF VTH = 1.5V (a) Normal Load (Load 1) R2 = 435 Ω (b) Three-state Delay (Load 2) 3.0V 90% ALL INPUT PULSES 90% 10% 10% Vss < 2 ns < 2 ns Switching Characteristics Over the Operating Range -167 Parameter Description -133 -100 CYD01S36V CYD02S36V CYD04S36V CYD09S36V CYD01S36V CYD02S36V CYD04S36V CYD09S36V CYD18S36V CYD18S36V Min Min Min Min Max 167 Max fMAX2 Maximum Operating Frequency Clock Cycle Time tCH2 Clock HIGH Time 2.7 3.0 3.4 4.5 ns tCL2 Clock LOW Time 2.7 3.0 3.4 4.5 ns tR[30] Clock Rise Time 2.0 2.0 2.0 3.0 ns tF[30] Clock Fall Time 2.0 2.0 2.0 3.0 ns tSA Address Setup Time 2.3 2.5 2.2 2.7 ns tHA Address Hold Time 0.6 0.6 1.0 1.0 ns tSB Byte Select Setup Time 2.3 2.5 2.2 2.7 ns tHB Byte Select Hold Time 0.6 0.6 1.0 1.0 ns tSC Chip Enable Setup Time 2.3 2.5 NA NA ns tHC Chip Enable Hold Time 0.6 0.6 NA NA ns tSW R/W Setup Time 2.3 2.5 2.2 2.7 ns tHW R/W Hold Time 0.6 0.6 1.0 1.0 ns tSD Input Data Setup Time 2.3 2.5 2.2 2.7 ns tHD Input Data Hold Time 0.6 0.6 1.0 1.0 ns tSAD ADS Setup Time 2.3 2.5 NA NA ns tHAD ADS Hold Time 0.6 0.6 NA NA ns tSCN CNTEN Setup Time 2.3 2.5 NA NA ns tHCN CNTEN Hold Time 0.6 0.6 NA NA ns 7.5 133 Max tCYC2 6.0 133 Max Unit 7.5 100 10.0 MHz ns Note 30. Except JTAG signals (tr and tf < 10 ns [max.]). Document Number: 38-06076 Rev. *F Page 13 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Switching Characteristics Over the Operating Range (continued) -167 Parameter Description -133 -100 CYD01S36V CYD02S36V CYD04S36V CYD09S36V CYD01S36V CYD02S36V CYD04S36V CYD09S36V CYD18S36V CYD18S36V Min Min Min Min Max 2.3 Max 2.5 Max Max tSRST CNTRST Setup Time tHRST CNTRST Hold Time 0.6 0.6 NA NA ns tSCM CNT/MSK Setup Time 2.3 2.5 NA NA ns tHCM CNT/MSK Hold Time 0.6 tOE Output Enable to Data Valid tOLZ[31, 32] OE to Low Z 0 tOHZ[31, 32] OE to High Z 0 tCD2 Clock to Data Valid 4.4 4.4 tCA2 Clock to Counter Address Valid 4.0 4.4 tCM2 Clock to Mask Register Readback Valid 4.0 4.4 NA tDC Data Output Hold After Clock HIGH 0.6 4.4 tCKHZ[31, 32] Clock HIGH to Output High Z NA 0 0 NA ns 5.5 ns 5.5 ns 5.0 5.2 ns NA NA ns NA ns 0 0 5.5 1.0 4.4 ns 5.5 0 4.4 1.0 4.0 NA 4.4 0 4.0 1.0 0 NA Unit ns 0 1.0 0 4.7 ns 0 5.0 ns tCKLZ[31, 32] Clock HIGH to Output Low Z 1.0 4.0 1.0 4.4 1.0 4.7 1.0 5.0 ns tSINT Clock to INT Set Time 0.5 6.7 0.5 7.5 0.5 7.5 0.5 10.0 ns tRINT Clock to INT Reset Time 0.5 6.7 0.5 7.5 0.5 7.5 0.5 10.0 ns tSCINT Clock to CNTINT Set Time 0.5 5.0 0.5 5.7 NA NA NA NA ns tRCINT Clock to CNTINT Reset time 0.5 5.0 0.5 5.7 NA NA NA NA ns Port to Port Delays tCCS Clock to Clock Skew 5.2 6.0 5.7 8.0 ns Master Reset Timing tRS Master Reset Pulse Width 5.0 5.0 5.0 5.0 cycles tRS Master Reset Setup Time 6.0 6.0 6.0 8.5 ns tRSR Master Reset Recovery Time 5.0 tRSF Master Reset to Outputs Inactive 10.0 10.0 10.0 10.0 ns tRSINT Master Reset to Counter and Mailbox Interrupt Flag Reset Time 10.0 10.0 NA NA ns 5.0 5.0 5.0 cycles JTAG Timing Parameter Description 167/133/100 Min Max Unit fJTAG Maximum JTAG TAP Controller Frequency tTCYC TCK Clock Cycle Time 100 ns tTH TCK Clock HIGH Time 40 ns tTL TCK Clock LOW Time 40 ns tTMSS TMS Setup to TCK Clock Rise 10 ns tTMSH TMS Hold After TCK Clock Rise 10 ns 10 MHz Notes 31. This parameter is guaranteed by design, but it is not production tested. 32. Test conditions used are Load 2. Document Number: 38-06076 Rev. *F Page 14 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V JTAG Timing (continued) Parameter 167/133/100 Description Min tTDIS TDI Setup to TCK Clock Rise 10 tTDIH TDI Hold After TCK Clock Rise 10 tTDOV TCK Clock LOW to TDO Valid tTDOX TCK Clock LOW to TDO Invalid Max ns ns 30 0 Unit ns ns JTAG Switching Waveform tTH Test Clock TCK tTMSS tTL tTCYC tTMSH Test Mode Select TMS tTDIS tTDIH Test Data-In TDI Test Data-Out TDO tTDOX tTDOV Switching Waveforms Figure 6. Master Reset tRS MRST ALL ADDRESS/ DATA LINES tRSF tRSS ALL OTHER INPUTS tRSR INACTIVE ACTIVE TMS tRSINT CNTINT INT TDO Document Number: 38-06076 Rev. *F Page 15 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Switching Waveforms (continued) Figure 7. Read Cycle[14, 33, 34, 35, 36] tCH2 tCYC2 tCL2 CLK CE tSC tHC tSB tHB tSW tSA tHW tHA tSC tHC BE0–BE3 R/W ADDRESS DATAOUT An An+1 1 Latency An+2 tDC tCD2 Qn tCKLZ An+3 Qn+1 tOHZ Qn+2 tOLZ OE tOE Notes 33. OE is asynchronously controlled; all other inputs (excluding MRST and JTAG) are synchronous to the rising clock edge. 34. ADS = CNTEN = LOW, and MRST = CNTRST = CNT/MSK = HIGH. 35. The output is disabled (high-impedance state) by CE = VIH following the next rising edge of the clock. 36. Addresses do not have to be accessed sequentially since ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only. Document Number: 38-06076 Rev. *F Page 16 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Switching Waveforms (continued) Figure 8. Bank Select Read[37, 38] tCH2 tCYC2 tCL2 CLK tHA tSA ADDRESS(B1) A0 A1 A3 A2 A4 A5 tHC tSC CE(B1) tCD2 tHC tSC tCD2 tHA tSA A0 ADDRESS(B2) tDC A1 tDC tCKLZ A3 A2 tCKHZ Q3 Q1 Q0 DATAOUT(B1) tCD2 tCKHZ A4 A5 tHC tSC CE(B2) tSC tCD2 tHC tCKHZ DATAOUT(B2) tCD2 Q4 Q2 tCKLZ Figure 9. Read-to-Write-to-Read (OE = tCH2 tCYC2 tCKLZ LOW)[36, 39, 40, 41, 42] tCL2 CLK CE tSC tHC tSW tHW R/W tSW tHW An ADDRESS tSA An+1 An+2 An+2 An+3 tSD tHD tHA DATAIN An+2 tCD2 tDC Dn+2 tCKHZ Qn DATAOUT READ NO OPERATION WRITE Notes 37. In this depth-expansion example, B1 represents Bank #1 and B2 is Bank #2; each bank consists of one Cypress FLEx36 device from this data sheet. ADDRESS(B1) = ADDRESS(B2). 38. ADS = CNTEN= BE0 – BE3 = OE = LOW; MRST = CNTRST = CNT/MSK = HIGH. 39. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals. 40. During “No Operation,” data in memory at the selected address may be corrupted and must be rewritten to ensure data integrity. 41. CE0 = OE = BE0 – BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 42. CE0 = BE0 – BE3 = R/W = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, since OE = LOW, the Write operation cannot be completed (labelled as no operation). One clock cycle is required to three-state the IO for the Write operation on the next rising edge of CLK. Document Number: 38-06076 Rev. *F Page 17 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Switching Waveforms (continued) Figure 10. Read-to-Write-to-Read (OE Controlled)[36, 39, 41, 42] tCH2 tCYC2 tCL2 CLK CE tSC tHC tSW tHW R/W tSW tHW An An+1 An+2 An+3 An+4 An+5 ADDRESS tSA tHA tSD tHD Dn+2 DATAIN Dn+3 tCD2 DATAOUT tCD2 Qn Qn+4 tOHZ OE READ WRITE READ Figure 11. Read with Address Counter Advance[41] tCH2 tCYC2 tCL2 CLK tSA ADDRESS tHA An tSAD tHAD ADS tSAD tHAD tSCN tHCN CNTEN tSCN DATAOUT tHCN Qx–1 tCD2 Qx READ EXTERNAL ADDRESS Document Number: 38-06076 Rev. *F Qn tDC READ WITH COUNTER Qn+1 COUNTER HOLD Qn+2 Qn+3 READ WITH COUNTER Page 18 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Switching Waveforms (continued) Figure 12. Write with Address Counter Advance [42] tCH2 tCYC2 tCL2 CLK tSA tHA An ADDRESS INTERNAL ADDRESS An tSAD tHAD tSCN tHCN An+1 An+2 An+3 An+4 ADS CNTEN Dn DATAIN tSD tHD WRITE EXTERNAL ADDRESS Document Number: 38-06076 Rev. *F Dn+1 Dn+1 WRITE WITH COUNTER Dn+2 WRITE COUNTER HOLD Dn+3 Dn+4 WRITE WITH COUNTER Page 19 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Switching Waveforms (continued) Figure 13. Counter Reset [43, 44] tCYC2 tCH2 tCL2 CLK tSA INTERNAL ADDRESS Ax tSW tHW tSD tHD An 1 0 Ap Am An ADDRESS tHA Ap Am R/W ADS CNTEN tSRST tHRST CNTRST DATAIN D0 tCD2 tCD2 [45] DATAOUT Q0 COUNTER RESET WRITE ADDRESS 0 tCKLZ READ ADDRESS 0 READ ADDRESS 1 Q1 READ ADDRESS An Qn READ ADDRESS Am Notes 43. CE0 = BE0 – BE3 = LOW; CE1 = MRST = CNT/MSK = HIGH. 44. No dead cycle exists during counter reset. A Read or Write cycle may be coincidental with the counter reset. 45. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value Document Number: 38-06076 Rev. *F Page 20 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Switching Waveforms (continued) Figure 14. Readback State of Address Counter or Mask Register[46, 47, 48, 49] tCYC2 tCH2 tCL2 CLK tCA2 or tCM2 tSA tHA EXTERNAL ADDRESS A0–A16 An* An INTERNAL ADDRESS An+1 An An+2 An+3 An+4 tSAD tHAD ADS tSCN tHCN CNTEN tCD2 DATAOUT Qx-2 LOAD EXTERNAL ADDRESS tCKHZ Qx-1 Qn READBACK COUNTER INTERNAL ADDRESS INCREMENT tCKLZ Qn+1 Qn+2 Qn+3 Notes 46. CE0 = OE = BE0 – BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 47. Address in output mode. Host must not be driving address bus after tCKLZ in next clock cycle. 48. Address in input mode. Host can drive address bus after tCKHZ. 49. An * is the internal value of the address counter (or the mask register depending on the CNT/MSK level) being Read out on the address lines. Document Number: 38-06076 Rev. *F Page 21 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Switching Waveforms (continued) Figure 15. Left_Port (L_Port) Write to Right_Port (R_Port) Read[50, 51, 52] tCH2 tCYC2 tCL2 CLKL tHA tSA L_PORT ADDRESS An tSW tHW R/WL tCKHZ tSD L_PORT tCKLZ Dn DATAIN CLKR tHD tCYC2 tCL2 tCCS tCH2 tSA R_PORT ADDRESS tHA An R/WR tCD2 R_PORT Qn DATAOUT tDC Notes 50. CE0 = OE = ADS = CNTEN = BE0 – BE3 = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 51. This timing is valid when one port is writing, and other port is reading the same location at the same time. If tCCS is violated, indeterminate data is Read out. 52. If tCCS < minimum specified value, then R_Port Reads the most recent data (written by L_Port) only (2 * tCYC2 + tCD2) after the rising edge of R_Port's clock. If tCCS > minimum specified value, then R_Port Reads the most recent data (written by L_Port) (tCYC2 + tCD2) after the rising edge of R_Port's clock. Document Number: 38-06076 Rev. *F Page 22 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Switching Waveforms (continued) Figure 16. Counter Interrupt and Retransmit[17, 45, 53, 54, 55, 56] tCH2 tCYC2 tCL2 CLK tSCM tHCM CNT/MSK ADS CNTEN COUNTER INTERNAL ADDRESS 3FFFC 3FFFD 3FFFE tSCINT 3FFFF Last_Loaded Last_Loaded +1 tRCINT CNTINT Notes 53. CE0 = OE = BE0 – BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 54. CNTINT is always driven. 55. CNTINT goes LOW when the unmasked portion of the address counter is incremented to the maximum value. 56. The mask register assumed to have the value of 3FFFFh. Document Number: 38-06076 Rev. *F Page 23 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Switching Waveforms (continued) Figure 17. MailBox Interrupt Timing[57, 58, 59, 60, 61] tCH2 tCYC2 tCL2 CLKL tSA L_PORT ADDRESS tHA 7FFFF An+1 An An+2 An+3 tSINT tRINT INTR tCH2 tCYC2 tCL2 CLKR tSA R_PORT ADDRESS tHA Am+1 Am 7FFFF Am+3 Am+4 Table 7. Read/Write and Enable Operation (Any Port)[1, 18, 62, 63, 64] Inputs OE Operation CE0 CE1 R/W DQ0 – DQ35 X H X X High-Z Deselected X X L X High-Z Deselected X L H L DIN Write L L H H DOUT Read L H X High-Z Outputs Disabled H CLK Outputs X Notes 57. CE0 = OE = ADS = CNTEN = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 58. Address “7FFFF” is the mailbox location for R_Port of the 9-Mbit device. 59. L_Port is configured for Write operation, and R_Port is configured for Read operation. 60. At least one byte enable (BE0 – BE3) is required to be active during interrupt operations. 61. Interrupt flag is set with respect to the rising edge of the Write clock, and is reset with respect to the rising edge of the Read clock. 62. OE is an asynchronous input signal. 63. When CE changes state, deselection and Read happen after one cycle of latency. 64. CE0 = OE = LOW; CE1 = R/W = HIGH. Document Number: 38-06076 Rev. *F Page 24 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Ordering Information 512K × 36 (18-Mbit) 3.3V Synchronous CYD18S36V Dual-Port SRAM Speed( MHz) Ordering Code Package Name 133 CYD18S36V-133BBC BB256B 256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA) Commercial CYD18S36V-133BBI BB256B 256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA) Industrial CYD18S36V-100BBC BB256B 256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA) Commercial CYD18S36V-100BBI BB256B 256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA) Industrial 100 Package Type Operating Range 256K × 36 (9-Mbit) 3.3V Synchronous CYD09S36V Dual-Port SRAM Speed( MHz) Ordering Code Package Name 167 CYD09S36V-167BBC BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial 133 CYD09S36V-133BBC BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial CYD09S36V-133BBI BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Industrial Package Type Operating Range 128K × 36 (4-Mbit) 3.3V Synchronous CYD04S36V Dual-Port SRAM Speed( MHz) Ordering Code Package Name 167 CYD04S36V-167BBC BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial 133 CYD04S36V-133BBC BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial CYD04S36V-133BBI BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Industrial Package Type Operating Range 64K × 36 (2-Mbit) 3.3V Synchronous CYD02S36V Dual-Port SRAM Speed( MHz) Ordering Code Package Name 167 CYD02S36V-167BBC BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial 133 CYD02S36V-133BBC BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial CYD02S36V-133BBI BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Industrial Package Type Operating Range 32K × 36 (1-Mbit) 3.3V Synchronous CYD01S36V Dual-Port SRAM Speed( MHz) Ordering Code Package Name 167 CYD01S36V-167BBC BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial 133 CYD01S36V-133BBC BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial CYD01S36V-133BBI BB256 256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Industrial Document Number: 38-06076 Rev. *F Package Type Operating Range Page 25 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Package Diagrams Figure 18. 256-Ball FBGA (17 x 17 mm) BB256 TOP VIEW BOTTOM VIEW Ø0.05 M C Ø0.25 M C A B PIN 1 CORNER Ø0.45±0.05(256X)-CPLD DEVICES (37K & 39K) PIN 1 CORNER +0.10 -0.05 Ø0.50 (256X)-ALL OTHER DEVICES 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B B C C D D 1.00 A E E F F G H J K H 15.00 17.00±0.10 G J K L M 7.50 L M N N P P R R T T 1.00 7.50 0.15 C 0.70±0.05 0.25 C B 15.00 A 17.00±0.10 A 0.20(4X) SEATING PLANE +0.10 -0.05 C A1 0.36 0.56 REFERENCE JEDEC MO-192 0.35 A1 A 1.40 MAX. 1.70 MAX. 51-85108-*F Document Number: 38-06076 Rev. *F Page 26 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Package Diagrams (continued) Figure 19. 256-ball FBGA (23 mm x 23 mm x 1.7 mm) BB256B TOP VIEW Ø0.05 M C Ø0.25 M C A B PIN 1 CORNER +0.10 -0.05 Ø0.50 (256X) PIN 1 CORNER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A A B B C D 1.00 C D E E F F G J K H 15.00 23.00±0.10 G H J K L M 7.50 L M N N P P R R T T 1.00 B 7.50 0.15 C 1.70 MAX. 0.70±0.05 0.25 C 15.00 A 23.00±0.10 0.20(4X) +0.10 -0.05 51-85201-*A 0.35 0.56 SEATING PLANE C JEDEC MO-192 Document Number: 38-06076 Rev. *F Page 27 of 28 [+] Feedback CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V Document History Page Document Title: CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V FLEx36™ 3.3V 32K/64K/128K/256K/512 x 36 Synchronous Dual-Port RAM Document Number: 38-06076 REV. ECN NO. Orig. of Change ** 232012 WWZ New data sheet *A 244232 WWZ Changed pinout Changed FTSEL# to FTSEL in the block diagram *B 313156 YDT Changed pinout D10 from NC to VSS to reflect test mode pin swap, C10 from rev[2,4] to VSS to reflect SC removal. Changed tRSCNTINT to tRSINT Added tRSINT to the master reset timing diagram Added CYD01S36V to data sheet Added ISB5 and changed IIX2 *C 321033 YDT Added CYD18S36V-133BBI to the Ordering Information Section *D 327338 AEQ Change Pinout C10 from VSS to NC[2,5] Change Pinout G5 from VDDIOL to REVL[2,3] *E 365315 YDT Added note for VCORE Removed preliminary status *F 2193427 Description of Change NXR/AESA Changed tCD2 and tOE Spec from 4ns to 4.4ns for -167. Template Update. © Cypress Semiconductor Corporation, 2005-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 38-06076 Rev. *F Revised March 12, 2008 Page 28 of 28 FLEx36 and FLEx36-E are trademarks of Cypress Semiconductor Corporation. All other trademarks or registered trademarks referenced herein are property of the respective corporations. All products and company names mentioned in this document may be the trademarks of their respective holders. [+] Feedback