TI1 INA169NA/250 High-side measurement current shunt monitor Datasheet

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INA139, INA169
SBOS181E – DECEMBER 2000 – REVISED DECEMBER 2015
INA1x9 High-Side Measurement Current Shunt Monitor
1 Features
3 Description
•
The INA139 and INA169 are high-side, unipolar,
current shunt monitors. Wide input common-mode
voltage range, high-speed, low quiescent current, and
tiny SOT-23 packaging enable use in a variety of
applications.
1
•
•
•
•
•
•
•
Complete Unipolar High-side Current
Measurement Circuit
Wide Supply and Common-Mode Range
INA139: 2.7 V to 40 V
INA169: 2.7 V to 60 V
Independent Supply and Input Common-Mode
Voltages
Single Resistor Gain Set
Low Quiescent Current: 60 µA (Typical)
5-Pin, SOT-23 Packages
Input common-mode and power-supply voltages are
independent and can range from 2.7 V to 40 V for the
INA139 and 2.7 V to 60 V for the INA169. Quiescent
current is only 60 µA, which permits connecting the
power supply to either side of the current
measurement shunt with minimal error.
The device converts a differential input voltage to a
current output. This current is converted back to a
voltage with an external load resistor that sets any
gain from 1 to over 100. Although designed for
current shunt measurement, the circuit invites
creative applications in measurement and level
shifting.
2 Applications
•
•
•
•
•
•
Current Shunt Measurement:
– Automotive, Telephone, Computers
Portable and Battery-Backup Systems
Battery Chargers
Power Management
Cell Phones
Precision Current Source
Both the INA139 and INA169 are available in 5-pin
SOT-23 packages, and are specified for the –40°C to
85°C temperature range.
Device Information(1)
PART NUMBER
INA139
PACKAGE
SOT-23 (5)
INA169
BODY SIZE (NOM)
2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Circuit
IS
RS
VIN+
Up to 60V
4
3
VIN+
VIN–
1kΩ
Load
1kΩ
V+
5
OUT
GND
2
VO = ISRSRL/1kΩ
1
RL
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
INA139, INA169
SBOS181E – DECEMBER 2000 – REVISED DECEMBER 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information .................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
7.4 Device Functional Modes.......................................... 9
8
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Applications ............................................... 11
9 Power Supply Recommendations...................... 16
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 17
11 Device and Documentation Support ................. 18
11.1
11.2
11.3
11.4
11.5
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
18
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (November 2005) to Revision E
•
2
Page
Changed ESD Ratings table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
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5 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
OUT
1
GND
2
VIN+
3
5
V+
4
VIN–
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
OUT
1
O
Output current
GND
2
—
Ground
VIN+
3
I
Positive input voltage
VIN-
4
I
Negative input voltage
V+
5
I
Power supply voltage
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
V+
Supply voltage
Analog inputs, INA139
VIN+, VIN–
Analog inputs, INA169
MIN
MAX
UNIT
INA139
–0.3
60
V
INA169
–0.3
75
V
Common mode (2)
–0.3
60
Differential (VIN+) – (VIN–)
–40
2
Common mode (2)
–0.3
75
Differential (VIN+) – (VIN–)
–40
2
–0.3
40
V
10
mA
–55
125
°C
150
°C
125
°C
Analog output, Out (2)
Input current into any pin
Operating temperature
TJ
Junction temperature
Tstg
Storage temperature
(1)
(2)
–65
V
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input voltage at any pin may exceed the voltage shown if the current at that pin is limited to 10mA.
6.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
V(ESD)
(1)
(2)
Electrostatic discharge
(1)
UNIT
±1000
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins (2)
±500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
INA139
V+
2.7
5
40
V
Common mode voltage
2.7
12
40
V
INA169
V+
2.7
5
60
V
Common mode voltage
2.7
12
60
V
6.4 Thermal Information
INA1x9
THERMAL METRIC (1)
DBV (SOT-23)
UNIT
5 PINS
RθJA
Junction-to-ambient thermal resistance
168.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
73.8
°C/W
RθJB
Junction-to-board thermal resistance
28.1
°C/W
ψJT
Junction-to-top characterization parameter
2.5
°C/W
ψJB
Junction-to-board characterization parameter
27.6
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
All other characteristics at TA = –40°C to 85°C, V+ = 5 V, VIN+ = 12 V, and ROUT = 25 kΩ, unless otherwise noted.
PARAMETER
TEST CONDITIONS
INA139NA
MIN
INA169NA
TYP
MAX
100
500
MIN
UNIT
TYP
MAX
100
500
mV
60
V
INPUT
Full-Scale Sense Voltage
VSENSE = VIN+ – VIN–
Common-Mode Input Range
Common-Mode Rejection
2.7
VIN+ = 2.7 V to 40 V, VSENSE = 50
mV
VIN+ = 2.7 V to 60 V, VSENSE = 50
mV
100
115
dB
±0.2
TMIN to TMAX
vs Power Supply, V+
2.7
100
Offset Voltage (1) RTI
vs Temperature
40
±1
1
V+ = 2.7 V to 40 V, VSENSE = 50 mV
120
±0.2
mV
1
0.5
µV/°C
10
V+ = 2.7 V to 60 V, VSENSE = 50 mV
0.1
Input Bias Current
dB
±1
10
µV/V
10
10
µA
OUTPUT
Transconductance vs Temperature
VSENSE = 10 mV – 150 mV
VSENSE = 10 mV,
Nonlinearity Error
VSENSE = 10 mV to 150 mV
Total Output Error
VSENSE = 100 mV
990
1010
990
10
Output Impedance
Voltage Output
1000
1000
1010
µA/V
10
nA/°C
±0.01%
±0.1%
±0.01%
±0.1%
±0.5%
±2%
±0.5%
±2%
1 || 5
1 || 5
GΩ || pF
Swing to Power
Supply, V+
(V+) –
0.9
(V+) – 1.2
(V+) – 0.9
(V+) – 1.2
V
Swing to Common
Mode, VCM
VCM –
0.6
VCM –1
VCM – 0.6
VCM – 1
V
FREQUENCY RESPONSE
Bandwidth
Settling Time (0.1%)
ROUT = 10 kΩ
440
440
kHz
ROUT = 20 kΩ
220
220
kHz
5-V Step, ROUT = 10 kΩ
2.5
2.5
µs
5-V Step, ROUT = 20 kΩ
5
5
µs
20
20
pA/√Hz
7
7
nA RMS
NOISE
Output-Current Noise Density
Total Output-Current Noise
BW = 100 kHz
POWER SUPPLY
Operating Range, V+
Quiescent Current
2.7
VSENSE = 0, IO = 0
40
60
2.7
125
60
60
V
125
µA
TEMPERATURE RANGE
Specification, TMIN to TMAX
–40
85
–40
85
°C
Operating
–55
125
–55
125
°C
Storage
–65
150
–65
150
Thermal Resistance, θJA
(1)
200
200
°C
°C/W
Defined as the amount of input voltage, VSENSE, to drive the output to zero.
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6.6 Typical Characteristics
At TA = 25°C, V+ = 5 V, VIN+ = 12 V, and RL = 125 kΩ, unless otherwise noted.
120
40
Common-Mode Rejection (dB)
RL = 100kΩ
30
RL = 10kΩ
Gain (dB)
20
10
RL = 1kΩ
0
–10
G = 100
100
80
G = 10
60
G=1
40
20
0
–20
100
10k
1k
100k
0.1
10M
1M
10
1
100
10k
1k
100k
Frequency (Hz)
Frequency (Hz)
Figure 1. Gain vs Frequency
Figure 2. Common-Mode Rejection vs Frequency
5
140
VIN = (VIN+ − VIN−)
–55°C
Total Output Error (%)
120
G = 100
PSR (dB)
100
G = 10
80
G=1
60
0
+150°C
–5
+25°C
–10
40
–15
20
1
100
10
1k
50
25
0
100k
10k
Frequency (Hz)
Figure 3. Power-Supply Rejection vs Frequency
125
150
200
Figure 4. Total Output Error vs VIN
100
Output error is essentially
independent of both
V+ supply voltage and
input common-mode voltage.
G=1
0
G = 10
G = 25
–1
+150°
80
–2
+125°
+25°
60
–55°
40
µ
A)
1
Quiescent Current (
Total Output Error (%)
100
VIN (mV)
2
20
Use the INA169 with
(V+) > 40V
0
0
10
20
30
40
50
60
70
0
10
Power-Supply Voltage (V)
20
30
40
50
60
70
Power-Supply Voltage (V)
Figure 5. Total Output Error vs Power-Supply Voltage
6
75
Figure 6. Quiescent Current vs Power-Supply Voltage
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Typical Characteristics (continued)
At TA = 25°C, V+ = 5 V, VIN+ = 12 V, and RL = 125 kΩ, unless otherwise noted.
1.5V
1V
G = 100
G = 50
0.5V
0V
1V
2V
G = 100
G = 10
0V
0V
20µs/div
10µs/div
Figure 7. Step Response
Figure 8. Step Response
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7 Detailed Description
7.1 Overview
The INA139 and INA169 devices are comprised of a high voltage, precision operational amplifier, precision thin
film resistors trimmed in production to an absolute tolerance and a low noise output transistor. The INA139 and
INA169 devices can be powered from a single power supply and their input voltages can exceed the power
supply voltage. The INA139 and INA169 devices are ideal for measuring small differential voltages, such as
those generated across a shunt resistor in the presence of large, common-mode voltages. See Functional Block
Diagram, which illustrates the functional components within both the INA139 and INA169 devices.
7.2 Functional Block Diagram
VIN+
VIN-
V+
+
OUT
GND
7.3 Feature Description
7.3.1 Output Voltage Range
The output of the INA139 is a current, which is converted to a voltage by the load resistor, RL. The output current
remains accurate within the compliance voltage range of the output circuitry. The shunt voltage and the input
common-mode and power-supply voltages limit the maximum possible output swing. The maximum output
voltage compliance is limited by the lower of Equation 1 and Equation 2.
Vout max = (V+) – 0.7 V – (VIN+ – VIN–)
(1)
Vout max = VIN– – 0.5 V
(2)
or
(whichever is lower)
7.3.2 Bandwidth
Measurement bandwidth is affected by the value of the load resistor, RL. High gain produced by high values of
RL will yield a narrower measurement bandwidth (see Typical Characteristics). For widest possible bandwidth,
keep the capacitive load on the output to a minimum. Reduction in bandwidth due to capacitive load is shown in
the Typical Characteristics.
8
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Feature Description (continued)
If bandwidth limiting (filtering) is desired, a capacitor can be added to the output (see Figure 12). This will not
cause instability.
7.4 Device Functional Modes
For proper operation the INA139 and INA169 devices must operate within their specified limits. Operating either
device outside of their specified power supply voltage range or their specified common-mode range will result in
unexpected behavior and is not recommended. Additionally operating the output beyond their specified limits with
respect to power supply voltage and input common-mode voltage will also produce unexpected results. See
Electrical Characteristics for the device specifications.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Operation
Figure 9 illustrates the basic circuit diagram for both the INA139 and INA169. Load current IS is drawn from
supply VS through shunt resistor RS. The voltage drop in shunt resistor VS is forced across RG1 by the internal
operational amplifier, causing current to flow into the collector of Q1. The external resistor RL converts the output
current to a voltage, VOUT, at the OUT pin.
The transfer function for the INA139 is given by Equation 3:
IO = gm(VIN+ – VIN–)
(3)
where gm = 1000 µA/V.
In the circuit of Figure 9, the input voltage, (VIN+ – VIN–), is equal to IS × RS and the output voltage, VOUT, is equal
to IO × RL. The transconductance, gm, of the INA139 is 1000 µA/V. The complete transfer function for the current
measurement amplifier in this application is given by Equation 4:
VOUT = (IS) (RS) (1000 µA/V) (RL)
(4)
The maximum differential input voltage for accurate measurements is 0.5 V, which produces a 500-µA output
current. A differential input voltage of up to 2 V will not cause damage. Differential measurements (pins 3 and 4)
must be unipolar with a more-positive voltage applied to pin 3. If a more-negative voltage is applied to pin 3, the
output current, IO, is zero, but it will not cause damage.
VP
Load Power Supply
+2.7V to 40V(1)
V+ power can be
common or
independent of
load supply.
Shunt
RS
VIN+
IS
VIN–
4
3
Load
V+
RG1
1kΩ
RG2
1kΩ
2.7V ≤ (V+) ≤ 40V(1)
5
Q1
VOLTAGE GAIN
EXACT R L ( Ω)
NEAREST 1% RL ( Ω)
1
1k
1k
2
2k
2k
5
5k
4.99k
10
10k
10k
20
20k
20k
50
50k
49k
100
100k
100k
INA139
2
OUT
1
+
IO
RL
VO
–
NOTE: (1) Maximum VP and V+ voltage is 60V with the INA169.
Figure 9. Basic Circuit Connections
10
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8.2 Typical Applications
The INA139 is designed for current shunt measurement circuits, as shown in Figure 9, but its basic function is
useful in a wide range of circuitry. A creative engineer will find many unforeseen uses in measurement and level
shifting circuits. A few ideas are illustrated in Figure 14 through Figure 18.
8.2.1 Buffering Output to Drive an ADC
IS
3
4
INA139
OPA340
RL
ZIN
Buffer of amp drives the A/D converter
without affecting gain.
Figure 10. Buffering Output to Drive the A/D Converter
8.2.1.1 Design Requirements
Digitize the output of the INA139 or INA169 devices using a 1-MSPS analog-to-digital converter (ADC).
8.2.1.2 Detailed Design Procedure
8.2.1.2.1 Selecting RS and RL
In Figure 9 the value chosen for the shunt resistor, RS, depends on the application and is a compromise between
small-signal accuracy and maximum permissible voltage loss in the measurement line. High values of RS provide
better accuracy at lower currents by minimizing the effects of offset, while low values of RS minimize voltage loss
in the supply line. For most applications, best performance is attained with an RS value that provides a full-scale
shunt voltage of 50 mV to 100 mV; maximum input voltage for accurate measurements is 500 mV.
RL is chosen to provide the desired full-scale output voltage. The output impedance of the INA139 and INA169
OUT terminal is very high, which permits using values of RL up to 100 kΩ with excellent accuracy. The input
impedance of any additional circuitry at the output must be much higher than the value of RL to avoid degrading
accuracy.
Some Analog-to-Digital converters (ADC) have input impedances that will significantly affect measurement gain.
The input impedance of the ADC can be included as part of the effective RL if its input can be modeled as a
resistor to ground. Alternatively, an operational amplifier can be used to buffer the ADC input, as shown in
Figure 10. The INA139 and INA169 are current output devices, and as such have an inherently large output
impedance. The output currents from the amplifier are converted to an output voltage through the load resistor,
RL, connected from the amplifier output to ground. The ratio of the load resistor value to that of the internal
resistor value determines the voltage gain of the system.
In many applications digitizing the output of the INA139 or INA169 devices is required. This is accomplished by
connecting the output of the amplifier to an ADC. It is very common for an ADC to have a dynamic input
impedance. If the INA139 or INA169 output is connected directly to an ADC input, the input impedance of the
ADC is effectively connected in parallel with the gain setting resistor RL. This parallel impedance combination will
affect the gain of the system and the impact on the gain is difficult to estimate accurately. A simple solution that
eliminates the paralleling of impedances, simplifying the gain of the circuit is to place a buffer amplifier, such as
the OPA340, between the output of the INA139 or INA169 devices and the input to the ADC.
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Typical Applications (continued)
Figure 10 illustrates this concept. A low pass filter can be placed between the OPA340 output and the input to
the ADC. The filter capacitor is required to provide any instantaneous demand for current required by the input
stage of the ADC. The filter resistor is required to isolate the OPA340 output from the filter capacitor to maintain
circuit stability. The values for the filter components will vary according to the operational amplifier used for the
buffer and the particular ADC selected. More information can be found regarding the design of the low pass filter
in the TI Precision Design 16-bit 1-MSPS Data Acquisition Reference Design for Single-Ended Multiplexed
Applications, TIPD173.
Figure 11 shows the expected results when driving an analog-to-digital converter at 1 MSPS with and without
buffering the INA139 or INA169 output. Without the buffer, the high impedance of the INA139 or INA169 will
react with the input capacitance and sample and hold (S/H) capacitance of the analog-to-digital converter and will
not allow the S/H to reach the correct final value before it is reset and the next conversion starts. Adding the
buffer amplifier significantly reduces the output impedance driving the S/H and allows for higher conversion rates
than can be achieved without adding the buffer.
8.2.1.3 Application Curve
Input to ADC (0.25 V/div)
with buffer
without Buffer
Time
Figure 11. Driving an ADC With and Without a Buffer
8.2.2 Output Filter
3
4
f–3dB
INA139
1
f–3dB =
2pRLCL
VO
RL
CL
Figure 12. Output Filter
8.2.2.1 Design Requirements
Filter the output of the INA139 or INA169 devices.
8.2.2.2 Detailed Design Procedure
A low-pass filter can be formed at the output of the INA139 or INA169 devices simply by placing a capacitor of
the desired value in parallel with the load resistor. First determine the value of the load resistor needed to
achieve the desired gain. See the table in Figure 9. Next, determine the capacitor value that will result in the
desired cutoff frequency according to the equation shown in Figure 12. Figure 13 illustrates various combinations
of gain settings (determined by RL) and filter capacitors.
12
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Typical Applications (continued)
8.2.2.3 Application Curve
40
RL = 100kΩ
30
RL = 10kΩ
Gain (dB)
20
10
RL = 1kΩ
0
–10
–20
100
1k
10k
100k
10M
1M
Frequency (Hz)
Figure 13. Gain vs Frequency
8.2.3 Offsetting the Output Voltage
For many applications using only a single power supply it may be required to level shift the output voltage away
from ground when there is no load current flowing in the shunt resistor. Level shifting the output of the INA139 or
INA169 devices is easily accomplished by one of two simple methods shown in Figure 14. The method on the
left hand side of Figure 14 illustrates a simple voltage divider method. This method is useful for applications that
require the output of the INA138 or INA168 devices to remain centered with respect to the power supply at zero
load current through the shunt resistor. Using this method the gain is determine by the parallel combination of R1
and R2 while the output offset is determined by the voltage divider ratio R1 and R2. For applications that may
require a fixed value of output offset, independent of the power supply voltage, the current source method shown
on the right-hand side of Figure 14 is recommended. With this method a REF200 constant current source is used
to generate a constant output offset. Using his method the gain is determined by RL and the offset is determined
by the product of the value of the current source and RL.
3
4
3
VR
INA139
4
REF200
100µA
INA139
R1
VO
1
V+
VO
1
R2
RL
Gain Set by R1 | | R2
(V )R
Output Offset = R 2
R1 + R 2
Gain Set by RL
Output Offset = (100µA)(RL)
(independent of V+)
a) Using resistor divider.
b) Using current source.
Figure 14. Offsetting the Output Voltage
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Typical Applications (continued)
8.2.4 Bipolar Current Measurement
The INA139 or INA169 devices can be configured as shown in Figure 15 in applications where measuring current
bi-directionally is required. Two INA devices are required connecting their inputs across the shunt resistor as
shown in Figure 15. A comparator, such as the TLV3201, is used to detect the polarity of the load current. The
magnitude of the load current is monitored across the resistor connected between ground and the connection
labeled Output. In this example the 20-kΩ resistor results in a gain of 20 V/V. The 10-kΩ resistors connected in
series with the INA139 or INA169 output current are used to develop a voltage across the comparator inputs.
Two diodes are required to prevent current flow into the INA139 or INA169 output, as only one device at a time is
providing current to the Output connection of the circuit. The circuit functionality is illustrated in Figure 16.
+/-1 A
Load Curent
RSH
1
VIN+
VIN-
VIN-
VIN+
Bus
Voltage
1k
+5 V
1k
1k
1k
V+
+5 V
V+
+
+
INA139
or
INA169
Load
Current
OUT
OUT
GND
GND
1N4148
INA139
or
INA169
1N4148
+
Sign
TLV3201
10 k
10 k
Output
20 k
Figure 15. Bipolar Current Measurement
14
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Typical Applications (continued)
8.2.4.1 Application Curve
Voltage
Load Current
Output
Sign
Time
Figure 16. Bipolar Current Measurement Results (Arbitrary Scale)
8.2.5 Bipolar Current Measurement Using a Differential Input of the A/D Converter
The INA139 or INA169 devices can be used with an ADC such as the ADS7870 programmed for differential
mode operation. Figure 17 illustrates this configuration. In this configuration, the use of two INAs allows for bidirectional current measurement. Depending upon the polarity of the current, one of the INAs will provide an
output voltage while the other output is zero. In this way the ADC will read the polarity of current directly, without
the need for additional circuitry.
RS
V+
4
3
4
3
+5V
+5V
+5V
REFOUT BUFIN
5
5
Digital
I/O
INA139
2
1
REF
BUFOUT
BUF
INA139
2
RL
25kΩ
1
MUX
RL
25kΩ
Clock
Divider
Oscillator
12-Bit
A/D
Converter
PGIA
Serial
I/O
ADS7870
The A/D converter is programmed for differential input.
Depending on the polarity of the current, one INA139 provides
an output voltage whereas the output of the other is zero.
Figure 17. Bipolar Current Measurement Using a Differential Input of the A/D Converter
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Typical Applications (continued)
8.2.6 Multiplexed Measurement Using Logic Signal for Power
Multiple loads can be measured as illustrated in Figure 18. In this configuration each INA139 or INA169 device is
powered by the Digital I/O from the ADS7870. Multiplexing is achieved by switching on or off each the desired
I/O.
Other INA169s
Digital I/O on the ADS7870 provides power to
select the desired INA169. Diodes prevent
output current of an on INA169 from flowing
into an off INA169.
INA169
V+
+5V
––
REFOUT BUFIN
Digital
I/O
REF
BUFOUT
BUF
INA169
V+
––
MUX
12-Bit
A/D
Converter
PGIA
1N4148
RL
Clock
Divider
Oscillator
Serial
I/O
ADS7870
Figure 18. Multiplexed Measurement Using Logic Signal for Power
9 Power Supply Recommendations
The input circuitry of the INA139 can accurately measure beyond its power-supply voltage, V+. For example, the
V+ power supply can be 5 V, whereas the load power supply voltage is up to 40 V (or 60 V with the INA169).
However, the output voltage range of the OUT terminal is limited by the lesser of the two voltages (see Output
Voltage Range). TI recommends placing a 0.1-µF capacitor near the V+ pin on the INA139 or INA169. Additional
capacitance may be required for applications with noisy supply voltages.
16
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INA139, INA169
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SBOS181E – DECEMBER 2000 – REVISED DECEMBER 2015
10 Layout
10.1 Layout Guidelines
Figure 19 shows the basic connection of the INA139. The input pins, VIN+ and VIN–, must be connected as closely
as possible to the shunt resistor to minimize any resistance in series with the shunt resistance. The output
resistor, RL, is shown connected between pin 1 and ground. Best accuracy is achieved with the output voltage
measured directly across RL. This is especially important in high-current systems where load current could flow in
the ground connections, affecting the measurement accuracy.
No power-supply bypass capacitors are required for stability of the INA139. However, applications with noisy or
high-impedance power supplies may require decoupling capacitors to reject power-supply noise; connect the
bypass capacitors close to the device pins.
10.2 Layout Example
VIA to Ground Plane
INA139
INA169
Output
OUT
0.1 µF
GND
RL
To Bus
Voltage
Supply Voltage
V+
VIN+
VIN-
PCB pad
PCB pad
To Load
RSHUNT
Figure 19. Typical Layout Example
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INA139, INA169
SBOS181E – DECEMBER 2000 – REVISED DECEMBER 2015
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11 Device and Documentation Support
11.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
INA139
Click here
Click here
Click here
Click here
Click here
INA169
Click here
Click here
Click here
Click here
Click here
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Jan-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
INA139NA/250
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
E39
INA139NA/250G4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
E39
INA139NA/3K
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
E39
INA139NA/3KG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
E39
INA169NA/250
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A69
INA169NA/250G4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A69
INA169NA/3K
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A69
INA169NA/3KG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A69
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
9-Jan-2017
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF INA139, INA169 :
• Automotive: INA139-Q1, INA169-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Dec-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
INA139NA/250
SOT-23
DBV
5
250
178.0
9.0
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.3
3.2
1.4
4.0
8.0
Q3
INA139NA/3K
SOT-23
DBV
5
3000
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
INA169NA/250
SOT-23
DBV
5
250
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
INA169NA/3K
SOT-23
DBV
5
3000
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Dec-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
INA139NA/250
SOT-23
DBV
INA139NA/3K
SOT-23
DBV
5
250
180.0
180.0
18.0
5
3000
180.0
180.0
18.0
INA169NA/250
SOT-23
DBV
INA169NA/3K
SOT-23
DBV
5
250
180.0
180.0
18.0
5
3000
180.0
180.0
18.0
Pack Materials-Page 2
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