TI1 BQ24202DGNR Single-chip li-ion and li-pol charge management ic for current-limited application Datasheet

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bq24200, bq24201
bq24202, bq24203
bq24204, bq24205
SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
SINGLE-CHIP LI-ION AND LI-POL CHARGE MANAGEMENT IC FOR CURRENT-LIMITED
APPLICATIONS
FEATURES
1
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•
•
•
•
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Designed Specifically to Work With
Current-Limited Wall Supplies
Ideal for Low Dropout Charger Design for
Single-Cell Li-Ion Packs With Coke or Graphite
Anodes
Integrated PowerFET for 500 mA
Integrated Voltage Regulation With 0.5%
Accuracy
Battery Insertion and Removal Detection
Charge Termination by Minimum Current and
Time
Pre-Charge Conditioning With Safety Timer
Sleep Mode for Low-Power Consumption
Charge Status Output for LED or Host
Processor Interface Indicates
Charge-in-Progress, Charge Completion, and
Fault Conditions
Optional Temperature Monitoring Before and
During Charge
Small, 8-Pin Power-Pad MSOP Package
TYPICAL APPLICATION
DESCRIPTION
The bq2420x series are simple Li-Ion linear charge
management devices targeted at low-cost and space
limited charger applications. The bq2420x series offer
integrated
powerFET,
high-accuracy
voltage
regulation, temperature monitoring, charge status,
and charge termination, in a single monolithic device.
The bq2420x is designed to work with a
current-limited wall-mount transformer and therefore
does not provide any current regulation. However,
these devices offer a fixed internal current limit to
prevent damage to the internal powerFET. A
time-limited pre-conditioning phase is provided to
condition deeply discharged cells. Once the battery
reaches the charge voltage, the high accuracy
voltage regulation loop takes over and completes the
charge cycle. Charge is terminated based on
minimum current. An internal charge timer provides a
backup safety for charge termination.
Other standard features include an automatic sleep
mode activated when VCC falls below the battery
voltage and a recharge feature activated when the
battery voltage falls below the VRCH threshold.
In addition to the standard features, the core product
provides two additional enhancements: temperature
monitoring and status display. The temperaturesense circuit continuously measures battery
temperature using an external thermistor and inhibits
charge until the battery temperature is within the
user-defined thresholds. The STAT pin indicates
three conditions of operation of the charger. These
conditions are charge-in-progress, charge complete,
and fault. This output can be used to drive an LED or
an interface to a microcontroller.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2008, Texas Instruments Incorporated
bq24200, bq24201
bq24202, bq24203
bq24204, bq24205
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SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTIONS
TJ
CHARGE
REGULATION
VOLTAGE
OPTIONAL
FUNCTIONS
MARKING
PACKAGED
DEVICES
(DGN) (1)
4.2 V
STAT and TS
AZC
bq24200DGN
4.1 V
STAT and TS
AZD
bq24201DGN
4.2 V
STAT
AZE
bq24202DGN
4.1 V
STAT
AZF
bq24203DGN
4.2 V
–
AZG
bq24204DGN
4.1 V
–
AZI
bq24205DGN
–40°C to 125°C
(1)
The DGN package is available taped and reeled. Add TR suffix to device type (e.g. bq24200DGNTR) to order. Quantities 2500 devices
per reel.
TERMINAL FUNCTIONS
TERMINAL
NO.
NAME
I/O
DESCRIPTION
bq24200
bq24201
bq24202
bq24203
bq24204
bq24205
BAT
7
7
7
I
Battery voltage sense input
CE
–
6
6
I
Charge enable input (active low)
IN
1
1
1
I
Charge input voltage
N/C
5
5
3, 5
–
No connection. Must be left floating
OUT
8
8
8
O
Charge current output
STAT
3
3
–
O
Charge status output
TS
6
–
–
I
Temperature sense input
VCC
2
2
2
I
VCC input
VSS
4
4
4
–
Ground input
2
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bq24202, bq24203
bq24204, bq24205
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SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
Supply voltage (Vcc with respect to GND)
16.5
V
Input voltage, IN, STAT, TS (all with respect to GND)
16.5
V
Input voltage, BAT, OUT (all with respect to GND)
7
V
Output sink/source current (STAT)
15
mA
Tstg
Storage temperature range
–65 to 150
°C
TJ
Junction temperature range
–40 to 125
°C
300
°C
Lead temperature (soldering, 10 sec)
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
(1)
PACKAGE
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT (θJA)
THERMAL IMPEDANCE
JUNCTION-TO-CASE (θJC)
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
8 Pin DGN (1)
57.20°C/W
4.4°C/W
1.75 W
0.017 W/°C
This data is based on using JEDEC High-K board and topside traces, top and bottom thermal pad (2 mm × 3 mm), internal 1 oz. power
and ground planes, four thermal via underneath the die connecting to ground plane.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
VCC
Supply voltage
V(LOWV-MIN)
13.5
UNIT
VIN
Input voltage
V(LOWV-MIN)
13.5
TJ
Operating junction temperature range
–40
125
°C
TYP
MAX
UNIT
1.7
2.5
mA
Sum of currents into OUT and BAT pins, Vcc <
V(SLP), 0°C ≤ TJ ≤ 85°C
5
µA
Sum of currents into OUT and BAT pins, Vcc <
V(SLP)
10
µA
1
mA
1
µA
1
µA
V
ELECTRICAL CHARACTERISTICS
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
PARAMETER
ICC(VCC)
ICC(SLP)
TEST CONDITIONS
Vcc Current
MIN
Vcc > Vcc(min)
Sleep current
ICC(STDBY Standby current
Sum of currents into Vcc, IN and TS pins,
(Vcc–VI(TS)) ≤ 300 mV
)
IIB(BAT)
Input bias current on BAT pin
IIB(TB)
Input bias current on TS pin
0.1 × Vcc ≤ VI(TS) ≤ 0.8 × Vcc
VOLTAGE REGULATION
VO(REG) + V(DO.MAX) ≤ VCC, I(TERM) < IO(OUT) ≤500 mA, over 0°C ≤ TJ ≤125°C and supply voltage range (unless otherwise noted)
PARAMETER
VO(REG)
V(DO)
Output voltage
MIN
TYP
MAX
VO(REG) + V(DO–MAX) ≤ 10 V, I(TERM) < IO(OUT) ≤ 250 mA
TEST CONDITIONS
4.0795
4.10
4.1205
V
4.05
4.10
4.15
V
VO(REG) + V(DO–MAX) ≤ 10 V, I(TERM) < IO(OUT) ≤ 250 mA
4.1790
4.20
4.2210
V
4.15
4.20
4.25
V
200
350
500
mV
Dropout voltage (V(IN) – V(OUT)) VO(REG) + V(DO–MAX) ≤ Vcc, IO(OUT) = 500 mA
Copyright © 2001–2008, Texas Instruments Incorporated
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UNIT
3
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SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
OUTPUT CURRENT
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IO(OUT)
Output current
See
(1)
I(SC)
Short-circuit trip current
See
(1)
(1)
MIN
TYP
1
MAX
UNIT
500
mA
1.6
A
Assured by design, not production tested.
PRE-CHARGE CURRENT REGULATION
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
I(PRECHG)
Pre-charge current
VI(BAT) < V(LOWV), t < t(30min)
I(DETECT)
Battery detection current
VI(BAT) < 2.5 V, t < t(30min)
MIN
TYP
MAX
10
13.5
19
UNIT
mA
160
210
300
µA
UNIT
CHARGE TERMINATION DETECTION
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
MIN
TYP
MAX
I(TAPER)
Taper current detect threshold
PARAMETER
VI(BAT) > V(RCH)
TEST CONDITIONS
21
25.5
31
mA
I(TERM)
Charge termination current detect
threshold
VI(BAT) > V(RCH)
0.8
1.1
1.4
mA
MIN
TYP
MAX
TEMPERATURE COMPARATOR
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
UNIT
V(TS1)
Lower temperature threshold
TS pin voltage
30
%VCC
V(TS2)
Upper temperature threshold
TS pin voltage
60
%VCC
Accuracy
–0.7
0.7
Hysteresis
1
%VCC
%VCC
LOW VOLTAGE BATTERY THRESHOLD
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
PARAMETER
V(LOWV)
TEST CONDITIONS
0°C ≤ TJ ≤ 85°C
LowV threshold
MIN
TYP
MAX
2.8
2.95
3.1
UNIT
V
2.8
3.0
3.2
V
BATTERY RECHARGE THRESHOLD
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Recharge threshold, VRCH (typically 100 mV below
regulation)
MIN
TYP
MAX
VO(REG)
–0.115
VO(RE
VO(REG)
–0.085
G)
UNIT
V
–0.1
STAT OUTPUT
Vcc ≥ VO(REG) , over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOL(STAT)
Output (low) saturation voltage
IO = 10 mA
VOH(STAT)
Output (high) saturation voltage
IO = –5 mA
4
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MIN
TYP
MAX
0.5
Vcc–1.5
UNIT
V
V
Copyright © 2001–2008, Texas Instruments Incorporated
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bq24204, bq24205
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SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
CE
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
PARAMETER
VIL(CE)
VIH(CE)
TEST CONDITIONS
Input (low) voltage
IIL = 5 µA
Input (high) voltage
IIH = 20 µA
MIN
TYP
0
MAX
UNIT
Vcc–1
V
Vcc–0
.3
V
TIMERS
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
MIN
TYP
MAX
UNIT
Pre-charge and taper timer
PARAMETER
1,548
2,065
2,581
sec
t(TAPER)
Taper timer
1,548
2,065
2,581
sec
t(CHG)
Charge timer
9,292
12,38
9
15,48
6
sec
MIN
TYP
MAX
UNIT
t(PRECH
TEST CONDITIONS
G)
SLEEP COMPARATOR
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
PARAMETER
V(SLP)
Sleep-mode threshold
TEST CONDITIONS
2.3 V ≤ VI(BAT) ≤ VO(REG)
V(BAT)
–10mV
V
POWER-ON-RESET AND VIN RAMP RATE
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
PARAMETER
VPOR
(1)
TEST CONDITIONS
POR threshold
See
(1)
Slew rate
See
(1)
MIN
TYP
2.3
2.4
5
MAX
2.5
5×10–5
UNIT
V
V/µs
Ensured by design, not production tested.
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SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
FUNCTIONAL BLOCK DIAGRAM
DETAILED DESCRIPTION
IN: This pin is connected to the source of the internal P-channel powerFET.
OUT: This pin is connected to the drain of the internal P-channel powerFET.
Battery voltage sense (BAT): Voltage sense-input tied directly to the positive side of the battery.
Temperature sense input (TS): Input for an external battery-temperature monitoring circuit.
Charge status output (STAT): High-impedance indication of various charge conditions.
Supply voltage input (VCC): Power supply input
6
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SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
JUNCTION TEMPERATURE
DROPOUT VOLTAGE
vs
JUNCTION TEMPERATURE
Figure 1.
Figure 2.
DROPOUT VOLTAGE
vs
OUTPUT VOLTAGE
SUPPLY CURRENT
vs
JUNCTION TEMPERATURE
Figure 3.
Figure 4.
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bq24204, bq24205
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SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
APPLICATION INFORMATION
Figure 5. Low Dropout Single-Cell Li-Ion/Li-Pol Charger
FUNCTIONAL DESCRIPTION
The bq2420x supports a precision Li-Ion or Li-Pol charging system suitable for single-cells with either coke or
graphite anodes. Figure 5 shows an application schematic and Figure 6 shows the typical charge profile.
TEMPERATURE QUALIFICATION (bq24200 and bq24202 only)
The bq24200 and bq24201 continuously monitors battery temperature by measuring the voltage between the TS
and VSS pins. A negative- or a positive-temperature coefficient thermistor (NTC, PTC) and an external voltage
divider typically develop this voltage (see Figure 5). The bq24200 and bq24201 compare this voltage against the
internal V(TS1) and V(TS2) thresholds to determine if charging is allowed (see Figure 7). The temperature sensing
circuit is immune to any fluctuation in Vcc since both the external voltage divider and the internal thresholds are
referenced to Vcc.
Once a temperature outside the V(TS1) and V(TS2) thresholds is detected the bq24200 and bq24201 immediately
suspend the charge. The bq24200 and bq24201 suspend the charge by turning off the power FET and holding
the timer value (i.e., timers are NOT reset). Charge is resumed when the temperature returns to the normal
range.
8
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bq24200, bq24201
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bq24204, bq24205
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SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
Figure 6. Typical Charge Profile
Figure 7. TS Pin Thresholds
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SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
OPERATIONAL FLOW DIAGRAM
Figure 8. Operational Flow Chart
The resistor values of RT1 and RT2 are calculated by the following equations:
For NTC Thermistors:
10
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R T1 +
R T2 +
SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
ǒ5
RT CǓ
RT H
ǒ3
ǒRT C * RT HǓǓ
ǒ5
ǒ2
(1)
RT CǓ
RT H
RT CǓ * ǒ7
RT HǓ
(2)
For PTC Thermisters:
R T1 +
R T2 +
ǒ5
ǒ3
ǒRT H * RT CǓǓ
ǒ5
ǒ2
RT CǓ
RT H
RT H
RT HǓ * ǒ7
(3)
RT CǓ
RT CǓ
(4)
Where RTC is the cold temperature resistance and RTH is the hot temperature resistance of thermistor, as
specified by the thermistor manufacturer.
RT1 or RT2 can be omitted If only one temperature (hot or cold) setting is required. Applying a voltage between
the VTS1 and VTS2 thresholds to pin TS disables the temperature-sensing feature. Also applying a voltage
between (VCC – 0.3 V) and Vcc suspends the charge and places the IC in the low-power standby mode.
BATTERY PRE-CONDITIONING
Figure 7 shows the operational flow chart for the bq2420x.
Upon power-up, if the battery voltage is below the V(LOWV) threshold, the bq2420x applies a pre-charge current,
I(PRECHG), to the battery. This feature revives deeply discharged cells. The bq2420x activates a safety timer,
t(PRECHG), during the conditioning phase. If V(LOWV) threshold is not reached within the timer period, the bq2420x
turns off the charger and enunciates FAULT on the STAT pin. In the case of a FAULT condition, the bq2420x
reduces the current to I(DETECT). I(DETECT) is used to detect a battery replacement condition. Fault condition is
cleared by POR or battery replacement.
BATTERY CHARGE CURRENT
Following a successful pre-conditioning, the bq2420x relies on an external current-limited supply to limit the
charge current to the cell. The bq2420x continues this phase until the battery reaches the voltage regulation
phase.
During this phase (and all other phases of operation) in order to protect the integrated powerFET, the internal
short circuit and thermal protection circuits are active.
BATTERY VOLTAGE REGULATION
The voltage regulation feedback is through the BAT pin. This input is tied directly to the positive side of the
battery pack. The bq2420x monitors the battery-pack voltage between the BAT and VSS pins. The bq2420x is
offered in two fixed-voltage versions: 4.1 V and 4.2 V.
As a safety backup, the bq2420x also monitors the charge time in the voltage regulation mode. If taper current is
not detected within this time period, t(CHG), the bq2420x turns off the charger and enunciates FAULT on the STAT
pin. Fault condition is cleared by POR or battery replacement. Note that the safety timer is reset if the bq2420x is
forced out of the voltage regulation mode.
CHARGE TERMINATION AND RECHARGE
The bq2420x monitors the charging current during the voltage regulation phase. Once the taper threshold,
I(TAPER), is detected the bq2420x initiates the taper timer, t(TAPER). Charge is terminated after the timer expires.
The bq2420x resets the taper timer in the event that the charge current returns above the taper threshold,
I(TAPER).
In addition to the taper current detection, the bq2420x terminates charge in the event that the charge current falls
below the I(TERM) threshold. This feature allows for quick recognition of a battery removal condition.
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SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
After a charge termination, the bq2420x restarts the charge once the voltage on the BAT pin falls below the
V(RCH) threshold. This feature keeps the battery at full capacity at all times.
SLEEP MODE
The bq2420x enters the low-power sleep mode if the Vcc is removed from the circuit (i.e., the Vcc and IN pins
are floating). For applications where these pins are not floating, placing a low-power 10 Ω (1/16 W) between the
IN and VCC pins ensures the V(SLP) conditions are met (see Figure 9).This feature prevents draining the battery
during the absence of VCC.
Figure 9. Sleep Mode
CHARGE ENABLE PIN
The CE pin on bq24202, bq24203, bq24204 and bq24205 can be used to enable or suspend the charge. Charge
is enabled if the voltage VIL(CE) is applied to the pin. Applying the VIH(CE) suspends the charge. During a charge
suspend mode, the internal powerFET is turned off and all timers are reset.
CHARGE STATUS OUTPUT
The STAT pin on the bq2420x, indicates various conditions of operation. These conditions are summarized in
Table 1.
Table 1. STAT Pin
12
CONDITION
STAT
Pre-charge
High
Fast-charge
High
Charge-complete
Low
Taper timer done
Low
Charge suspend (due to temperature or CE input)
Hi-Z
Thermal shutdown
Hi-Z
Pre-charge timer fault
Hi-Z
Sleep mode
Hi-Z
Charge timer fault
Hi-Z
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
BQ24200DGN
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZC
BQ24200DGNG4
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZC
BQ24200DGNR
ACTIVE
MSOPPowerPAD
DGN
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZC
BQ24200DGNRG4
ACTIVE
MSOPPowerPAD
DGN
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZC
BQ24201DGN
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZD
BQ24201DGNG4
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZD
BQ24202DGN
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZE
BQ24202DGNG4
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZE
BQ24202DGNR
ACTIVE
MSOPPowerPAD
DGN
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZE
BQ24202DGNRG4
ACTIVE
MSOPPowerPAD
DGN
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZE
BQ24203DGN
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZF
BQ24203DGNG4
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZF
BQ24204DGN
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZG
BQ24204DGNG4
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZG
BQ24204DGNRG4
OBSOLETE
MSOPPowerPAD
DGN
8
TBD
Call TI
Call TI
-40 to 85
BQ24205DGN
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZI
BQ24205DGNG4
ACTIVE
MSOPPowerPAD
DGN
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AZI
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
13-Oct-2013
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Aug-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BQ24200DGNR
MSOPPower
PAD
DGN
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
BQ24202DGNR
MSOPPower
PAD
DGN
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Aug-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ24200DGNR
MSOP-PowerPAD
DGN
8
2500
358.0
335.0
35.0
BQ24202DGNR
MSOP-PowerPAD
DGN
8
2500
358.0
335.0
35.0
Pack Materials-Page 2
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