AD AD7545AUQ Cmos 12-bit buffered multiplying dac Datasheet

a
CMOS 12-Bit
Buffered Multiplying DAC
AD7545A
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Improved Version of AD7545
Fast Interface Timing
All Grades 12-Bit Accurate
20-Lead DIP and Surface Mount Packages
Low Cost
GENERAL DESCRIPTION
The AD7545A, a 12-bit CMOS multiplying DAC with internal
data latches, is an improved version of the industry standard
AD7545. This new design features a WR pulse width of 100 ns,
which allows interfacing to a much wider range of fast 8-bit and
16-bit microprocessors. It is loaded by a single 12-bit-wide word
under the control of the CS and WR inputs; tying these control
inputs low makes the input latches transparent, allowing unbuffered operation of the DAC.
PIN CONFIGURATIONS
DIP/SOIC
LCCC
PLCC
REV. C
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© Analog Devices, Inc., 2000
AD7545A* PRODUCT PAGE QUICK LINKS
Last Content Update: 02/23/2017
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DOCUMENTATION
• Quality And Reliability
Application Notes
• Symbols and Footprints
• AN-225: 12-Bit Voltage-Output DACs for Single-Supply 5V
and 12V Systems
DISCUSSIONS
Data Sheet
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• AD7545A: CMOS 12-Bit Buffered Multiplying DAC Data
Sheet
REFERENCE MATERIALS
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AD7545A–SPECIFICATIONS (V
REF
= ⴞ10 V, VOUT1 = O V, AGND = DGND unless otherwise noted)
Version
VDD = +5 V
Limits
TA = + 25ⴗC TMIN –TMAX1
VDD = +15 V
Limits
TA = + 25ⴗC TMIN –TMAX1
Units
All
K, B, T
L, C, U
All
12
± 1/2
± 1/2
±1
12
± 1/2
± 1/2
±1
12
± 1/2
± 1/2
±1
12
± 1/2
± 1/2
±1
Bits
LSB max
LSB max
LSB max
K, B, T
L, C, U
All
All
±3
±1
±5
±2
±4
±2
±5
±2
±3
±1
±5
±2
±4
±2
±5
±2
LSB max
LSB max
ppm/°C max
ppm/°C typ
All
K, L
B, C
T, U
0.002
10
10
10
0.004
50
50
200
0.002
10
10
10
0.004
50
50
200
% per % max
nA max
nA max
nA max
∆VDD = ± 5%
DB0–DB11 = 0 V; WR, CS = 0 V
All
1
1
1
1
µs max
To 1/2 LSB. OUT1 Load = 100 Ω,
CEXT = 13 pF. DAC Output Measured
from Falling Edge of WR, CS = 0 V.
Propagation Delay 2 (from Digital
Input Change to 90%
of Final Analog Output)
Digital-to-Analog Glitch Impulse
All
All
200
5
–
–
150
5
–
–
ns max
nV sec typ
OUT1 Load = 100 Ω, CEXT = 13 pF3
VREF = AGND. OUT1 Load = 100 Ω,
Alternately Loaded with All 0s and 1s.
AC Feedthrough 2, 4
At OUT1
All
5
5
5
5
mV p-p typ
VREF = ± 10 V, 10 kHz Sine Wave
All
10
20
10
20
10
20
10
20
kΩ min
kΩ max
Input Resistance TC = –300 ppm/°C typ
Typical Input Resistance = 15 kΩ
All
70
150
70
150
70
150
70
150
pF max
pF max
DB0–DB11 = 0 V, WR, CS = 0 V
DB0–DB11 = VDD, WR, CS = 0 V
All
2.4
2.4
13.5
13.5
V min
All
0.8
0.8
1.5
1.5
V max
All
±1
± 10
±1
± 10
µA max
All
8
8
8
8
pF max
K, B, L, C
T, U
100
100
130
170
75
75
85
95
ns min
ns min
All
K, B, L, C
T, U
0
100
100
0
130
170
0
75
75
0
85
95
ns min
ns min
ns min
All
100
150
60
80
ns min
All
5
5
5
5
ns min
All
All
5
2
100
10
5
2
100
10
15
2
100
10
15
2
100
10
V
mA max
µA max
µA typ
Parameter
STATIC PERFORMANCE
Resolution
Relative Accuracy
Differential Nonlinearity
Gain Error
Gain Temperature Coefficient 2
∆Gain/∆Temperature
DC Supply Rejection 2
∆Gain/∆VDD
Output Leakage Current at OUT1
DYNAMIC PERFORMANCE
Current Settling Time 2
REFERENCE INPUT
Input Resistance
(Pin 19 to GND)
ANALOG OUTPUTS
Output Capacitance 2
COUT1
COUT1
DIGITAL INPUTS
Input High Voltage
VIH
Input Low Voltage
VIL
Input Current5
IIN
Input Capacitance2
DB0–DB11, WR, CS
SWITCHING CHARACTERISTICS 2
Chip Select to Write Setup Time
tCS
Chip Select to Write Hold Time
tCH
Write Pulse Width
tWR
Data Setup Time
tDS
Data Hold Time
tDH
POWER SUPPLY
VDD
IDD
Test Conditions/Comments
Endpoint Measurement
All Grades Guaranteed 12-Bit
Monotonic Over Temperature
Measured Using Internal RFB.
DAC Register Loaded with All 1s.
VIN = 0 or VDD
See Timing Diagram
tCS ≥ tWR, TCH ≥ 0
± 5% For Specified Performance
All Digital Inputs VIL or VIH
All Digital Inputs 0 V or V DD
All Digital Inputs 0 V or V DD
NOTES
1
Temperature range as follows: K, L Versions = 0°C to +70°C; B, C Versions = –25°C to +85°C; T, U Versions = –55°C to +125°C.
2
Sample tested to ensure compliance.
3
DB0–DB11 = 0 V to VDD or VDD to 0 V.
4
Feedthrough can be further reduced by connecting the metal lid on the ceramic package to DGND.
6
Logic inputs are MOS gates. Typical input current (+25°C) is less than 1 nA.
Specifications subject to change without notice.
–2–
REV. C
AD7545A
WRITE CYCLE TIMING DIAGRAM
Operating Temperature Range
Commercial (KN, LN, KP, LP) Grades . . . 0°C to +70°C
Industrial (BQ, CQ, BE, CE) Grades . . . . –25°C to +85°C
Extended (TQ, UQ, TE, UE) Grades . . . –55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . +300°C
ABSOLUTE MAXIMUM RATINGS*
(TA = + 25°C unless otherwise noted)
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
Digital Input Voltage to DGND . . . . . . . –0.3 V, VDD +0.3 V
VRFB, VREF to DGND . . . . . . . . . . . . . . . . . . . . . . . . . ± 25 V
VPIN1 to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V
Power Dissipation (Any Package) to 75°C . . . . . . . . . 450 mW
Derates above 75°C by . . . . . . . . . . . . . . . . . . . . . 6 mW/°C
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. The digital control inputs are diode protected;
however, permanent damage may occur on unconnected devices subject to high energy electrostatic fields. Unused devices must be stored in conductive foam or shunts. The protective foam
should be discharged to the destination socket before devices are removed.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Model1
Temperature
Range
Relative
Gain
Accuracy
Error
TMIN –TMAX TMIN –TMAX
Package
Options2
AD7545AKN
AD7545ALN
AD7545AKR
AD7545AKP
AD7545ALP
AD7545ABQ
AD7545ACQ
AD7545ABE
AD7545ACE
AD7545ATQ
AD7545AUQ
AD7545ATE
AD7545AUE
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
± 1/2
± 1/2
± 1/2
± 1/2
± 1/2
± 1/2
± 1/2
± 1/2
± 1/2
± 1/2
± 1/2
± 1/2
± 1/2
N-20
N-20
R-20
P-20A
P-20A
Q-20
Q-20
E-20A
E-20A
Q-20
Q-20
E-20A
E-20A
±4
±2
±4
±4
±2
±4
±2
±4
±2
±4
±2
±4
±2
NOTES
1
To order MIL-STD-883, Class B process parts, add /883B to part number.
Contact local sales office for military data sheet.
2
E = Leadless Ceramic Chip Carrier (LCCC); N = Plastic DIP; P = Plastic
Leaded Chip Carrier (PLCC); Q = Cerdip; R = Small Outline IC.
REV. C
–3–
AD7545A
input buffers operate in their linear region and draw current
from the power supply. To minimize power supply currents it is
recommended that the digital input voltages be as close to the
supply rails (VDD and DGND) as is practically possible.
CIRCUIT INFORMATION—D/A CONVERTER SECTION
Figure 1 shows a simplified circuit of the D/A converter section
of the AD7545A, and Figure 2 gives an approximate equivalent
circuit. Note that the ladder termination resistor is connected to
AGND. R is typically 15 kΩ.
The AD7545A may be operated with any supply voltage in the
range 5 ≤ VDD ≤ 15 volts. With VDD = +15 V the input logic
levels are CMOS compatible only, i.e., 1.5 V and 13.5 V.
The binary weighted currents are switched between the OUT1
bus line and AGND by N-channel switches, thus maintaining a
constant current in each ladder leg independent of the switch
state.
BASIC APPLICATIONS
Figures 4 and 5 show simple unipolar and bipolar circuits using
the AD7545A. Resistor R1 is used to trim for full scale. The L,
C, U grades have a guaranteed maximum gain error of ± 1 LSB
at +25°C, and in many applications it should be possible to
dispense with gain trim resistors altogether. Capacitor C1 provides phase compensation and helps prevent overshoot and
ringing when using high speed op amps. Note that all the circuits of Figures 4, 5 and 6 have constant input impedance at the
VREF terminal.
The circuit of Figure 4 can either be used as a fixed reference
D/A converter so that it provides an analog output voltage in the
range 0 to –VIN (note the inversion introduced by the op amp)
or VIN can be an ac signal in which case the circuit behaves as
an attenuator (2-Quadrant Multiplier). VIN can be any voltage
in the range –20 ≤ VIN ≤ +20 volts (provided the op amp can
handle such voltages) since VREF is permitted to exceed VDD.
Table II shows the code relationship for the circuit of Figure 4.
Figure 1. Simplified D/A Circuit of AD7545A
The capacitance at the OUT1 bus line, COUT1, is codedependent and varies from 70 pF (all switches to AGND) to
150 pF (all switches to OUT1).
One of the current switches is shown in Figure 2. The input
resistance at VREF (Figure 1) is always equal to R. Since RIN at
the VREF pin is constant, the reference terminal can be driven by
a reference voltage or a reference current, ac or dc, of positive or
negative polarity. (If a current source is used, a low temperature
coefficient external RFB is recommended to define scale factor.)
Figure 4. Unipolar Binary Operation
Table I. Recommended Trim Resistor Values vs. Grades
Figure 2. N-Channel Current Steering Switch
CIRCUIT INFORMATION—DIGITAL SECTION
Trim Resistor
K/B/T
L/C/U
R1
R2
200 Ω
68 Ω
100 Ω
33 Ω
Figure 3 shows the digital structure for one bit.
Table II. Unipolar Binary Code Table for Circuit of Figure 4
The digital signals CONTROL and CONTROL are generated
from CS and WR.
Binary Number in
DAC Register
Analog Output
1111
1111
1111
 4095 
–VIN  4096 


1000
0000
0000
 2048 
–VIN  4096  = –1/2 VIN


0000
0000
0001
0000
0000
0000
 1 
–VIN  4096 


0 Volts
Figure 3. Digital Input Structure
The input buffers are simple CMOS inverters designed such
that when the AD7545A is operated with VDD = 5 V, the buffers
convert TTL input levels (2.4 V and 0.8 V) into CMOS logic
levels. When VIN is in the region of 2.0 volts to 3.5 volts, the
–4–
REV. C
AD7545A
Figure 5 and Table III illustrate the recommended circuit and
code relationship for bipolar operation. The D/A function itself
uses offset binary code and inverter U1 on the MSB line converts twos complement input code to offset binary code. If appropriate, inversion of the MSB may be done in software using
an exclusive –OR instruction and the inverter omitted. R3, R4
and R5 must be selected to match within 0.01%, and they
should be the same type of resistor (preferably wire-wound or
metal foil), so that their temperature coefficients match. Mismatch of R3 value to R4 causes both offset and full-scale error.
Mismatch of R5 to R4 and R3 causes full-scale error.
Figure 6. 12-Bit Plus Sign Magnitude Converter
Table IV. 12-Bit Plus Sign Magnitude Code Table for Circuit
of Figure 6
Sign
Bit
Binary Numbers in
DAC Register
0
1111 1111 1111
0
1
0000 0000 0000
0000 0000 0000
1
1111 1111 1111
Figure 5. Bipolar Operation (Twos Complement Code)
Analog Output
 4095 
+ VIN ×  4096 


0 Volts
0 Volts
 4095 
– VIN × 

 4096 
Note: Sign bit of “0” connects R3 to GND.
Table III. Twos Complement Code Table for Circuit of
Figure 5
Data Input
APPLICATIONS HINTS
Output Offset: CMOS D/A converters such as Figures 4, 5
and 6 exhibit a code dependent output resistance which, in turn,
can cause a code dependent error voltage at the output of the
amplifier. The maximum amplitude of this error, which adds
to the D/A converter nonlinearity, depends on VOS, where VOS
is the amplifier input offset voltage. To maintain specified accuracy
with VREF at 10 V, it is recommended that VOS be no greater than
0.25 mV, or (25 × 10–6 ) (VREF), over the temperature range of
operation. Suitable op amps are AD517 and AD711. The AD517
is best suited for fixed reference applications with low bandwidth requirements: it has extremely low offset (150 µV max for
lowest grade) and in most applications will not require an offset
trim. The AD711 has a much wider bandwidth and higher slew
rate and is recommended for multiplying and other applications
requiring fast settling. An offset trim on the AD711 may be
necessary in some circuits.
Analog Output
0111
1111
1111
 2047 
+VIN ×  2048 


0000
0000
0001
0000
0000
0000
 1 
+VIN ×  2048 


0 Volts
1111
1111
1111
 1 
–VIN × 

 2048 
1000
0000
0000
 2048 
–VIN × 

 2048 
General Ground Management: AC or transient voltages
between AGND and DGND can cause noise injection into the
analog output. The simplest method of ensuring that voltages at
AGND and DGND are equal is to tie AGND and DGND
together at the AD7545A. In more complex systems where the
AGND and DGND intertie is on the backplane, it is recommended that two diodes be connected in inverse parallel between
the AD7545A AGND and DGND pins (1N914 or equivalent).
Figure 6 and Table IV show an alternative method of achieving
bipolar output. The circuit operates with sign plus magnitude
code and has the advantage that it gives 12-bit resolution in
each quadrant compared with 11-bit resolution per quadrant for
the circuit of Figure 5. The AD7592 is a fully protected CMOS
change-over switch with data latches. R4 and R5 should match
each other to 0.01% to maintain the accuracy of the D/A converter. Mismatch between R4 and R5 introduces a gain error.
Refer to Reference 1 (supplemental application material) for
additional information on these circuits.
REV. C
–5–
AD7545A
Invalid Data: When WR and CS are both low, the latches are
transparent and the D/A converter inputs follow the data inputs.
In some bus systems, data on the data bus is not always valid for
the whole period during which WR is low, and as a result invalid
data can briefly occur at the D/A converter inputs during a write
cycle. Such invalid data can cause unwanted signals or glitches
at the output of the D/A converter. The solution to this problem, if it occurs, is to retime the write pulse, WR, so it only
occurs when data is valid.
The loading on the reference voltage source is code-dependent
and the response time of the circuit is often determined by the
behavior of the reference voltage with changing load conditions.
To maintain linearity, the voltages at OUT1 and AGND should
remain within 2.5 volts of each other, for a VDD of 15 volts. If
VDD is reduced from 15 V, or the differential voltage between
OUT1 and AGND is increased to more than 2.5 V, the differential nonlinearity of the DAC will increase and the linearity of
the DAC will be degraded. Figures 8 and 9 show typical curves
illustrating this effect for various values of reference voltage and
VDD. If the output voltage is required to be offset from ground
by some value, then OUT1 and AGND may be biased up. The
effect on linearity and differential nonlinearity will be the same
as reducing VDD by the amount of the offset.
Digital Glitches: Digital glitches result due to capacitive coupling from the digital lines to the OUT1 and AGND terminals.
This should be minimized by screening the analog pins of the
AD7545A (Pins 1, 2, 19, 20) from the digital pins by a ground
track run between Pins 2 and 3 and between Pins 18 and 19 of
the AD7545A.
Note how the analog pins are at one end (DIP) or side (LCC
and PLCC) of the package and separated from the digital pins
by VDD and DGND to aid screening at the board level. On-chip
capacitive coupling can also give rise to crosstalk from the digitalto-analog sections of the AD7545A, particularly in circuits with
high currents and fast rise and fall times. This type of crosstalk is
minimized by using VDD = +5 volts. However, great care should
be taken to ensure that the +5 V used to power the AD7545A is
free from digitally induced noise.
Temperature Coefficients: The gain temperature coefficient
of the AD7545A has a maximum value of 5 ppm/°C and a typical value of 2 ppm/°C. This corresponds to worst case gain shifts
of 2 LSBs and 0.8 LSBs respectively over a 100°C temperature
range. When trim resistors R1 and R2 (such as in Figure 4) are
used to adjust full-scale range, the temperature coefficient of R1
and R2 should also be taken into account. The reader is referred
to Analog Devices Application Note “Gain Error and Gain
Temperature Coefficient to CMOS Multiplying DACs,” Publication Number E630c–5–3/86.
Figure 8. Differential Nonlinearity vs. VDD for Figure 7
Circuit. Reference Voltage = 2.5 Volts. Shaded Area Shows
Range of Values of Differential Nonlinearity that Typically
Occur for all Grades.
SINGLE SUPPLY OPERATION
The ladder termination resistor of the AD7545A (Figure 1) is
connected to AGND. This arrangement is particularly suitable
for single supply operation because OUT1 and AGND may be
biased at any voltage between DGND and VDD. OUT1 and
AGND should never go more than 0.3 volts less than DGND or
an internal diode will be turned on and a heavy current may
flow that will damage the device. (The AD7545A is, however,
protected from the SCR latchup phenomenon prevalent in many
CMOS devices.)
Figure 7 shows the AD7545A connected in a voltage switching
mode. OUT1 is connected to the reference voltage and AGND
is connected to DGND. The D/A converter output voltage is
available at the VREF pin and has a constant output impedance
equal to R. RFB is not used in this circuit and should be tied to
OUT1 to minimize stray capacitance effects.
Figure 9. Differential Nonlinearity vs. Reference Voltage
for Figure 7 Circuit. VDD = 15 Volts. Shaded Area Shows
Range of Values of Differential Nonlinearity that Typically
Occur for all Grades.
Figure 7. Single Supply Operation Using Voltage Switching Mode
–6–
REV. C
AD7545A
The circuits of Figures 4, 5 and 6 can all be converted to single
supply operation by biasing AGND to some voltage between
VDD and DGND. Figure 10 shows the 2s Complement Bipolar
circuit of Figure 5 modified to give a range from +2 V to +8 V
about a “pseudo-analog ground” of 5 V. This voltage range
would allow operation from a single VDD of +10 V to +15 V.
The AD584 pin-programmable reference fixes AGND at +5 V.
VIN is set at +2 V by means of the series resistors R1 and R2.
Figure 12 shows an alternative approach for use with 8-bit processors which have a full 16-bit wide address bus such as 6800,
8080, Z80. This technique uses the 12 lower address lines of the
processor address bus to supply data to the DAC, thus each
AD7545A connected in this way uses 4k bytes of address locations. Data is written to the DAC using a single memory write
instruction. The address field of the instruction is organized so
that the lower 12 bits contain the data for the DAC and the
upper 4 bits contain the address of the 4k block at which the
DAC resides.
There is no need to buffer the VREF input to the AD7545A with
an amplifier because the input impedance of the D/A converter
is constant. Note, however, that since the temperature coefficient
of the D/A reference input resistance is typically –300 ppm/°C,
applications which experience wide temperature variations may
require a buffer amplifier to generate the +2.0 V at the AD7545A
VREF pin. Other output voltage ranges can be obtained by changing
R4 to shift the zero point and (R1 + R2) to change the slope, or
gain of the D/A transfer function. VDD must be kept at least 5 V
above OUT1 to ensure that linearity is preserved.
Figure 12. Connecting the AD7545A to 8-Bit Processors
via the Address Bus
SUPPLEMENTAL APPLICATION MATERIAL
For further information on CMOS multiplying D/A converters
the reader is referred to the following texts:
Figure 10. Single Supply "Bipolar" 2s Complement D/A
Converter
Reference 1
CMOS DAC Application Guide available from Analog Devices,
Publication Number G872a-15-4/86.
MICROPROCESSOR INTERFACING OF THE AD7545A
The AD7545A can interface directly to both 8- and 16-bit
microprocessors via its 12-bit wide data latch using standard CS
and WR control signals.
Reference 2
Gain Error and Gain Temperature Coefficient of CMOS
Multiplying DACs – Application Note, Publication Number
E630c–5–3/86.
A typical interface circuit for an 8-bit processor is shown in
Figure 11. This arrangement uses two memory addresses, one
for the lower 8 bits of data to the DAC and one for the upper 4
bits of data into the DAC via the latch.
Reference 3
Analog-Digital Conversion Handbook (Third Edition) available
from Prentice-Hall.
Figure 11. 8-Bit Processor to AD7545 Interface
REV. C
–7–
AD7545A
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
20-Lead SOIC
(R-20)
20-Lead Plastic DIP
(N-20)
1
10
0.0118 (0.30)
0.0040 (0.10)
0.1043 (2.65)
0.0926 (2.35)
0.0291 (0.74)
x 45°
0.0098 (0.25)
8°
0.0500 0.0192 (0.49)
0°
(1.27) 0.0138 (0.35) SEATING 0.0125 (0.32)
PLANE
BSC
0.0091 (0.23)
0.0500 (1.27)
0.0157 (0.40)
20-Lead Cerdip
(Q-20)
20-Terminal Leadless Ceramic Chip Carrier
(E-20A)
20-Terminal Plastic Leadless Chip Carrier
(P-20A)
PRINTED IN U.S.A.
PIN 1
C1022–0–3/00 (rev. C)
11
0.4193 (10.65)
0.3937 (10.00)
20
0.2992 (7.60)
0.2914 (7.40)
0.5118 (13.00)
0.4961 (12.60)
–8–
REV. C
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