ICST MK2049-45 3.3v communications clock pll Datasheet

MK2049-45
3.3V Communications Clock PLL
Description
Features
The MK2049-45 is a dual Phase-Locked Loop (PLL)
device which can provide frequency synthesis and jitter
attenuation. The first PLL is VCXO based and uses a
pullable crystal to track signal wander and attenuate
input jitter. The second PLL is a translator for frequency
multiplication. Basic configuration is determined by a
Mode/Frequency Selection Table. Loop bandwidth and
damping factor are programmable via external loop
filter component selection.
• Packaged in 20 pin SOIC
• 3.3 V + 5% operation
• Meets the TR62411, ETS300 011, and GR-1244
Buffer Mode accepts a 10 to 50MHz input and will
provide a jitter attenuated output at 0.5 x ICLK, 1 x
ICLK or 2 x ICLK. In this mode the MK2049-45 is ideal
for filtering jitter from high frequency clocks.
In External Mode, ICLK accepts an 8 kHz clock and will
produce output frequencies from a table of common
communciations clock rates, CLK and CLK/2. This
allows for the generation of clocks frequency-locked to
an 8 kHz backplane clock, simplifying clock
synchronization in communications systems.
•
•
•
•
•
•
•
specification for MTIE, Pull-in/Hold-in Range, Phase
Transients, and Jitter Generation for Stratum 3, 4,
and 4E
Accepts multiple inputs: 8 kHz backplane clock, or 10
to 50 MHz
Locks to 8 kHz + 100 ppm (External mode)
Buffer Mode allows jitter attenuation of 10 - 50 MHz
input and x1 / x0.5 or x1 / x2 outputs
Exact internal ratios enable zero ppm error
Output rates include T1, E1, T3, E3, and OC3
submultiples
Available in Pb (lead) free package
See also the MK2049-34 and MK2049-36
The MK2049-45 can be dynamically switched between
T1, E1, T3, E3 outputs with the same 24.576 MHz
crystal.
ICS can customize these devices for many other
different frequencies. Contact your ICS representative
for more details.
Block Diagram
RSET
ISET
Reference
Divider
(used in buffer
mode only)
ICLK
CS
CP
CL
RS
CAP2
CL Optional Crystal Load Caps
External Pullable Crystal
CAP1 X1
X2
Phase
Detector
VCXO
Charge
Pump
VCXO
PLL
Reference
Divider
Feedback
Divider (N)
VCO
Translator
PLL
Feedback
Divider
Output
Divider
CLK
Divide
by 2
CLK/2
8k
4
FS3:0
Divider Value
Look-up Table
MDS 2049-45 G
1
Revision 101904
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MK2049-45
3.3V Communications Clock PLL
Pin Assignment
FS1
X2
1
2
20
19
FS0
RES
X1
VDD
3
4
18
17
CAP2
GND
FCAP
VDD
GND
CLK
CLK/2
8k
5
6
16
15
CAP1
VDD
7
8
9
10
14
13
GND
ICLK
FS3
FS2
12
11
Pin Descriptions
Pin
Number
Pin
Name
Pin
Type
1
FS1
Input
Frequency select 1. Determines CLK input/outputs per table on page 2.
Internal pull-up resistor.
2
X2
Input
Crystal connection. Connect to a MHz crystal as shown in table on page 2.
3
X1
Input
Crystal connection. Connect to a MHz crystal as shown in table on page 2.
4
VDD
Power
Power supply. Connect to +3.3V.
5
FCAP
-
6
VDD
Power
Power supply. Connect to +3.3V.
7
GND
Power
Connect to ground
8
CLK
Output
Clock output determined by status of FS3:0 per tables on page 2.
9
CLK/2
Output
Clock output determined by status of FS3:0 per tables page 2. Always 1/2 of
CLK.
10
8k
Output
Recovered 8 kHz clock output.
11
FS2
Input
Frequency select 2. Determines CLK input/outputs per table on page 2.
Internal pull-up resistor.
12
FS3
Input
Frequency select 3. Determines CLK input/outputs per table on page 2.
Internal pull-up resistor.
13
ICLK
Input
Input clock connection. Connect to 8 kHz backplane or MHz clock.
14
GND
Power
Connect to ground.
15
VDD
Power
Power Supply. Connect to +3.3V.
16
CAP1
Loop
Filter
Connect the loop filter capacitors and resistor between this pin and CAP2.
17
GND
Power
Connect to ground.
MDS 2049-45 G
Pin Description
Filter capacitor. Connect a 1000 pF ceramic capacitor to ground.
2
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MK2049-45
3.3V Communications Clock PLL
Pin
Number
Pin
Name
Pin
Type
18
CAP2
Loop
Filter
19
RES
-
20
FS0
Input
Pin Description
Connect the loop filter capacitors and resistor between this pin and CAP1.
Connect a resistor to ground. See table.
Frequency select 0. Determines CLK input/outputs per table on page 2.
Internal pull-up resistor.
Output Decoding Table - External Mode (MHz)
ICLK
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
FS3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
FS2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
FS1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
FS0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
CLK/2
1.544
2.048
22.368
17.184
19.44
12.8
25.92
4.096
18.528
12.352
24.576
16.384
17.28
62.5
CLK
3.088
4.096
44.736
34.368
38.88
25.6
51.84
8.192
37.056
24.704
49.152
32.768
34.56
125
8k
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
8 kHz
Crystal
Used (MHz)
24.576
24.576
24.576
24.576
19.44
25.6
17.28
16.384
24.704
24.704
16.384
16.384
17.28
25
N
3072
3072
3072
3072
2430
3200
2160
2048
3088
3088
2048
2048
2160
3125
Output Decoding Table - Buffer Mode (MHz)
ICLK
FS3
FS2
FS1
FS0
CLK/2
CLK
8k
Crystal
N
20 - 50
1
1
1
0
ICLK
2*ICLK
N/A
ICLK/2
3
10 - 25
1
1
1
1
ICLK/2
ICLK
N/A
ICLK
3
0 = connect directly to ground, 1 = connect directly to VDD
Crystal is connected to pins 2 and 3; clock input is applied to pin 13.
Functional Description
The MK2049-45 is a clock generator IC that generates
an output clock directly from an internal VCXO circuit
which works in conjunction with an external quartz
crystal. The VCXO is controlled by an internal PLL
(Phase Locked Loop) circuit, enabling the device to
perform clock regeneration from an input reference
clock. The MK2049-45 is configured to provide a high
frequency communications reference clock output from
MDS 2049-45 G
3
an 8 kHz input clock or to jitter attenuate and buffer a
high frequency input clock. There are 14 selectable
output frequencies and two buffer mode selections.
Please refer to the Output Clock Selection Table on
Page 2.
Most typical PLL clock devices use an internal VCO
(Voltage Controlled Oscillator) for output clock
generation. By using a VCXO with an external crystal,
Revision 101904
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MK2049-45
3.3V Communications Clock PLL
the MK2049-45 is able to generate a low jitter, low
phase-noise output clock within a low bandwidth PLL.
This serves to provide input clock jitter attenuation and
enables stable operation with a low frequency
reference clock.
To obtain a list of qualified crystal devices please visit
our website at:
The VCXO circuit requires an external pullable crystal
for operation. External loop filter components enable a
PLL configuration with low loop bandwidth.
All analog PLL circuits use a loop filter to establish
operating stability. The MK2049-45 uses external loop
filter components for the following reasons:
Application Information
Output Frequency Configuration
The MK2049-45 is configured to generate a set of
output frequencies from an 8 kHz input clock. Please
refer to the Output Clock Selection Table on Page 2.
Input bits FS3:0 are set according to this table, as is the
external crystal frequency. Please refer to the Quartz
Crystal section on this page regarding external crystal
requirements.
Quartz Crystal
It is important that the correct type of quartz crystal is
used with the MK2049-45. Failure to do so may result in
reduced frequency pullability range, inability of the loop
to lock, or excessive output phase jitter.
The MK2049-45 operates by phase-locking the VCXO
circuit to the input signal of the selected ICLK input.
The VCXO consists of the external crystal and the
integrated VCXO oscillator circuit. To achieve the best
performance and reliability, a crystal device with the
recommended parameters (shown below) must be
used, and the layout guidelines discussed in the PCB
Layout Recommendations section must be followed.
The frequency of oscillation of a quartz crystal is
determined by its cut and by the external load
capacitance. The MK2049-45 incorporates variable
load capacitors on-chip which “pull”, or change, the
frequency of the crystal. The crystals specified for use
with the MK2049-45 are designed to have zero
frequency error when the total of on-chip + stray
capacitance is 14 pF. To achieve this, the layout should
use short traces between the MK2049-45 and the
crystal.
http://www.icst.com/products/telecom/vcxocrystals.htm
PLL Loop Filter Components
1) Larger loop filter capacitor values can be used,
allowing a lower loop bandwidth. This enables the use
of lower input clock reference frequencies and also
input clock jitter attenuation capabilities. Larger loop
filter capacitors also allow higher loop damping factors
when less passband peaking is desired.
2) The loop filter values can be user selected to
optimize loop response characteristics for a given
application.
Referencing the External Component Schematic on
this page, the external loop filter is made up of
components RS, CS and CP. RSET establishes PLL
charge pump current and therefore influences loop
filter characteristics.
Tools for optimizing the values of these four
components can be found at:
http://www.icst.com/products/telecom/
CAP2
CP
0.0003 µF
RS 820 kohms
CS 0.1 µF
CAP1
Figure 3. Typical Loop Filter
A complete description of the recommended crystal
parameters in the ICS application note, MAN05.
MDS 2049-45 G
4
Revision 101904
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MK2049-45
3.3V Communications Clock PLL
Charge Pump Current Table
RSET
(kΩ)
13.02
15
16
18
20
22
24
27
36
47
56
75
100
150
200
Recommended Power Supply Connection
for Optimal Device Performance
Charge Pump Current
(ICP) (µA)
139
125
119
109
100
93
86
68
56
43
35
28
22
15
12
Connection to 3.3V
Power Plane
VDD Pin
Bulk Decoupling Capacitor
(such as 1 µF Tantalum)
VDD Pin
0.01 µF Decoupling Capacitors
Crystal Load Capacitors
Special considerations must be made in choosing loop
components CS and CP. These recommendations can
be found at
http://www.icst.com/products/telecom/loopfiltercap.htm
Series Termination Resistor
Clock output traces over one inch should use series
termination. To series terminate a 50Ω trace (a
commonly used trace impedance), place a 33Ω resistor
in series with the clock line, as close to the clock output
pin as possible. The nominal impedance of the clock
output is 20Ω. (The optional series termination resistor
is not shown in the External Component Schematic.)
Decoupling Capacitors
As with any high performance mixed-signal IC, the
MK2049-45 must be isolated from system power
supply noise to perform optimally.
Decoupling capacitors of 0.01µF must be connected
between each VDD and the PCB ground plane. To
further guard against interfering system supply noise,
the MK2049-45 should use one common connection to
the PCB power plane as shown in the diagram on the
next page. The ferrite bead and bulk capacitor help
reduce lower frequency noise in the supply that can
lead to output clock phase modulation.
MDS 2049-45 G
VDD Pin
Ferrite
Bead
5
The device crystal connections should include pads for
small capacitors from X1 to ground and from X2 to
ground, shown as CL in the External Component
Schematic. These capacitors are used to adjust the
stray capacitance of the board to match the nominally
required crystal load capacitance. Because load
capacitance can only be increased in this trimming
process, it is important to keep stray capacitance to a
minimum by using very short PCB traces (and no vias)
been the crystal and device.
Please refer to MAN05 for the procedure to determine
capacitor values.
PCB Layout Recommendations
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed. Please also refer to the Recommended PCB
Layout drawing on Page 7.
1) Each 0.01 µF decoupling capacitor should be
mounted on the component side of the board as close
to the VDD pin as possible. No via’s should be used
between decoupling capacitor and VDD pin. The PCB
trace to VDD pin should be kept as short as possible,
as should the PCB trace to the ground via. Distance of
the ferrite bead and bulk decoupling from the device is
less critical.
2) The loop filter components must also be placed
close to the CHGP and VIN pins. CP should be closest
to the device. Coupling of noise from other system
Revision 101904
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MK2049-45
3.3V Communications Clock PLL
signal traces should be minimized by keeping traces
short and away from active signal traces. Use of vias
should be avoided.
3) The external crystal should be mounted just next to
the device with short traces. The X1 and X2 traces
should not be routed next to each other with minimum
spaces, instead they should be separated and away
from other traces.
signal layers (the ferrite bead and bulk decoupling
capacitor can be mounted on the back). Other signal
traces should be routed away from the MK2049-45.
This includes signal traces just underneath the device,
or on layers adjacent to the ground plane layer used by
the device.
MAN05 may also be referenced for additional
suggestions on layout of the crystal section.
4) To minimize EMI the 33 Ω series termination resistor,
if needed, should be placed close to the clock output.
5) An optimum layout is one with all components on the
same side of the board, minimizing vias through other
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the MK2049-45. These ratings,
which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of
the device at these or any other conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can
affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.
Item
Rating
Supply Voltage, VDD
7V
All Inputs and Outputs
-0.5 V to VDD+0.5 V
Ambient Operating Temperature
-40 to +85°C
Storage Temperature
-65 to +150°C
Junction Temperature
125°C
Soldering Temperature
250°C
Recommended Operation Conditions
Parameter
Min.
Ambient Operating Temperature
-40
Power Supply Voltage (measured in respect to GND)
MDS 2049-45 G
Typ.
6
+3.15
+3.3
Max.
Units
+85
°C
+3.45
V
Revision 101904
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MK2049-45
3.3V Communications Clock PLL
DC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85°C
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
3.15
3.3
3.45
V
Operating Voltage
VDD
Supply Current
IDD
Input High Voltage
VIH
Input Low Voltage
VIL
Input High Current
IIH
VIH = VDD
Input Low Current
IIL
VIL = 0
Input Capacitance, except X1
CIN
Output High Voltage (CMOS
Level)
VOH
IOH = -4 mA
VDD-0.4
V
Output High Voltage
VOH
IOH = -8 mA
2.4
V
Output Low Voltage
VOL
IOL = 8 mA
Short Circuit Current
IOS
VIN, VCXO Control Voltage
VXC
Clock outputs
unloaded, VDD = 3.3V
25
mA
2
V
0.8
V
-10
+10
µA
-10
+10
µA
7
pF
0.4
±50
0
V
mA
VDD
V
AC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C
Parameter
VCXO Crystal Pull Range
Symbol
fXP
Conditions
Using Recommended
Crystal
Min.
Typ.
-115
Max. Units
+115
ppm
0.4
UI
Input Jitter Tolerance
tji
Input pulse width (1)
tpi
Output Duty Cycle (% high
time)
tOD
Measured at VDD/2,
CL=15pF
Output Rise Time
tOR
0.8 to 2.0V, CL=15 pF
1.0
ns
Output Fall Time
tOF
2.0 to 0.8V, CL=15 pF
1.0
ns
Skew, ICLK to Output Clock
Note 2
tIO
All output clock
selections except 1.544
and 2.048 MHz
Timing Jitter, Filtered
500Hz-1.3MHz (OC-3)
tjf
Referenced to
Mitel/Zarlink MT9045,
Note 3
MDS 2049-45 G
In reference to input
clock period
10
7
ns
40
60
-5
+5
400
%
ns
ps
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MK2049-45
3.3V Communications Clock PLL
Parameter
Symbol
Timing Jitter, Filtered
65kHz-1.3MHz (OC-3)
tjf
Conditions
Referenced to
Mitel/Zarlink MT9045,
Note 3
Frequency Error
Relative to ICLK
Nominal Output Impedance
ZOUT
Min.
Typ.
Max. Units
230
ps
0
ppm
20
Ω
Note 1: Minimum high or low time of input clock.
Note 2: For the 1.544 MHz and 2.048 MHz output selections, the input to output clock skew is not
controlled nor predictable and will change between power up cycles. Because it is dependent on the phase
relationship between the output and feedback divider states following power up, the input to output clock
skew will remain stable during a given power up cycle. If controlled input to output skew is desired for this
output clock frequency please refer to the MK2049 or MK2069 products.
Note 3: Input reference is the 8 kHz output from a Mitel/Zarlink MT9045 device in freerun mode
(SEL2:0 = 100, 19.44 MHz external crystal).
Marking Diagram
20
11
MK2049-45SI
######
YYWW
10
1
Marking Diagram (Pb free)
20
11
MK2049-45SILF
######
YYWW
1
10
Notes:
1. ###### is the lot number.
2. YYWW is the last two digits of the year and the week
that the part was assembled.
3. “LF” designates Pb (lead) free package.
MDS 2049-45 G
8
Revision 101904
Integrated Circuit Systems, Inc. ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
MK2049-45
3.3V Communications Clock PLL
Package Outline and Package Dimensions (20 pin SOIC, 300 Mil. Wide Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
Symbol
A
A1
A2
B
C
D
E
e
H
h
L
α
In d e x
A re a
E
H
1
2
h x 45o
D
Min
A2
A1
Max
-2.65
1.10
-2.05
2.55
0.33
0.51
0.18
0.32
12.60
13.00
7.40
7.60
1.27 Basic
10.00
10.65
0.25
0.75
0.40
1.27
0°
8°
Inches
Min
Max
-0.104
0.0040
-0.081
0.100
0.013
0.020
0.007
0.013
0.496
0.512
0.291
0.299
0.050 Basic
0.394
0.419
0.010
0.029
0.016
0.050
0°
8°
A
e
L C
B
Ordering Information
Part / Order Number
Marking
Shipping Packaging
Package
Temperature
MK2049-45SI
MK2049-45SI
Tubes
20-pin SOIC
-40 to +85° C
MK2049-45SITR
MK2049-45SI
Tape and Reel
20-pin SOIC
-40 to +85° C
MK2049-45SILF
MK2049-45SILF
Tubes
20-pin SOIC
-40 to +85° C
MK2049-45SILFTR
MK2049-45SILF
Tape and Reel
20-pin SOIC
-40 to +85° C
“LF” denotes Pb (lead) free package.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)
assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any
circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or
critical medical instruments.
MDS 2049-45 G
9
Revision 101904
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