GSI GS72116AJ 128k x 16 2mb asynchronous sram Datasheet

GS72116ATP/J/T/U
128K x 16
2Mb Asynchronous SRAM
SOJ, TSOP, FP-BGA, TQFP
Commercial Temp
Industrial Temp
7, 8, 10, 12 ns
3.3 V VDD
Center VDD and VSS
Features
SOJ 128K x 16-Pin Configuration
• Fast access time: 7, 8, 10, 12 ns
• CMOS low power operation: 145/125/100/85 mA at
minimum cycle time
• Single 3.3 V power supply
• All inputs and outputs are TTL-compatible
• Byte control
• Fully static operation
• Industrial Temperature Option: –40° to 85°C
• Package line up
J: 400 mil, 44-pin SOJ package
TP: 400 mil, 44-pin TSOP Type II package
T: 10 mm x 10 mm, 44-pin TQFP
U: 6 mm x 8 mm Fine Pitch Ball Grid Array package
A4
A3
A2
A1
A0
CE
DQ1
DQ2
DQ3
DQ4
VDD
VSS
Description
The GS72116A is a high speed CMOS Static RAM organized
as 131,072 words by 16 bits. Static design eliminates the need
for external clocks or timing strobes. The GS operates on a single 3.3 V power supply and all inputs and outputs are TTLcompatible. The GS72116A is available in a 6 mm x 8 mm
Fine Pitch BGA package, a 10 mm x 10 mm TQFP package, as
well as in 400 mil SOJ and 400 mil TSOP Type-II packages.
DQ5
DQ6
DQ7
DQ8
WE
A15
A14
A13
A12
A16
1
2
3
4
5
6
7
8
9
10
11
12
Top view
44-pin
SOJ
13
14
15
16
17
18
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
19
20
21
22
A5
A6
A7
OE
UB
LB
DQ16
DQ15
DQ14
DQ13
VSS
VDD
DQ12
DQ11
DQ10
DQ9
NC
A8
A9
A10
A11
NC
Package J
Pin Descriptions
Symbol
Description
A0–A16
Address input
DQ1–DQ16
Data input/output
CE
Chip enable input
LB
Lower byte enable input
(DQ1 to DQ8)
UB
Upper byte enable input
(DQ9 to DQ16)
WE
Write enable input
OE
Output enable input
VDD
+3.3 V power supply
VSS
Ground
NC
No connect
Rev: 1.04a 10/2002
1/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
44-Pin TQFP 128K x 16-Pin Configuration
A16 A15 A14 A13 A12 A11 A10 A9 OE UB LB
CE
1
DQ1
DQ2
44 43 42 41 40 39 38 37 36 35 34
33
DQ16
2
32
DQ15
3
31
DQ14
DQ3
4
30
DQ13
DQ4
5
29
VSS
VDD
6
28
VDD
VSS
7
27
DQ12
DQ5
8
26
DQ11
DQ6
9
25
DQ10
DQ7
10
24
DQ9
11
12 13 14 15 16 17 18 19 20 21 22
23
NC
DQ8
WE A0 A1 A2 A3 A4 NC A5 A6 A7 A8
Package T
Fine Pitch BGA 128K x 16-Bump Configuration
1
2
3
4
5
6
A
LB
OE
A0
A1
A2
NC
B
DQ16
UB
A3
A4
CE
DQ1
C
DQ14 DQ15
A5
A6
DQ2
DQ3
D
VSS
DQ13
NC
A7
DQ4
VDD
E
VDD
DQ12
NC
A16
DQ5
VSS
F
DQ11 DQ10
A8
A9
DQ7
DQ6
G
DQ9
NC
A10
A11
WE
DQ8
H
NC
A12
A13
A14
A15
NC
6 mm x 8 mm, 0.75 mm Bump Pitch
Top View
Package U
Rev: 1.04a 10/2002
2/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
TSOP-II 128K x 16-Pin Configuration
A4
A3
A2
A1
A0
CE
DQ1
DQ2
DQ3
DQ4
VDD
VSS
DQ5
DQ6
DQ7
DQ8
WE
A15
A14
A13
A12
A16
1
2
3
4
5
6
7
8
9
10
11
12
Top view
44-pin
TSOP II
13
14
15
16
17
18
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
A5
A6
A7
OE
UB
LB
DQ16
DQ15
DQ14
DQ13
VSS
VDD
DQ12
DQ11
DQ10
DQ9
NC
A8
A9
A10
A11
NC
27
26
25
24
23
19
20
21
22
Package TP
Block Diagram
A0
Address
Input
Buffer
Row
Decoder
Column
Decoder
A16
CE
WE
Control
OE
UB _____
LB _____
Rev: 1.04a 10/2002
Memory Array
I/O Buffer
DQ1
DQ16
3/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
Truth Table
CE
OE
WE
LB
UB
DQ1 to DQ8
DQ9 to DQ16
VDD Current
H
X
X
X
X
Not Selected
Not Selected
ISB1, ISB2
L
L
Read
Read
L
H
Read
High Z
H
L
High Z
Read
L
L
Write
Write
L
H
Write
Not Write, High Z
H
L
Not Write, High Z
Write
L
L
L
H
X
L
L
H
H
X
X
High Z
High Z
L
X
X
H
H
High Z
High Z
IDD
Note: X: “H” or “L”
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply Voltage
VDD
–0.5 to +4.6
V
Input Voltage
VIN
–0.5 to VDD +0.5
(≤ 4.6 V max.)
V
Output Voltage
VOUT
–0.5 to VDD +0.5
(≤ 4.6 V max.)
V
Allowable power dissipation
PD
0.7
W
Storage temperature
TSTG
–55 to 150
o
C
Note:
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device
reliability.
Rev: 1.04a 10/2002
4/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage for -7/-8/-10/12
VDD
3.0
3.3
3.6
V
Input High Voltage
VIH
2.0
—
VDD +0.3
V
Input Low Voltage
VIL
–0.3
—
0.8
V
Ambient Temperature,
Commercial Range
TAc
0
—
70
o
Ambient Temperature,
Industrial Range
TAI
–40
—
85
oC
C
Note:
1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns.
2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns.
Capacitance
Parameter
Symbol
Test Condition
Max
Unit
Input Capacitance
CIN
VIN = 0 V
5
pF
Output Capacitance
COUT
VOUT = 0 V
7
pF
Notes:
1. Tested at TA = 25°C, f = 1 MHz
2. These parameters are sampled and are not 100% tested.
DC I/O Pin Characteristics
Parameter
Symbol
Test Conditions
Min
Max
Input Leakage
Current
IIL
VIN = 0 to VDD
– 1 uA
1 uA
Output Leakage
Current
ILO
Output High Z
VOUT = 0 to VDD
–1 uA
1 uA
Output High Voltage
VOH
IOH = –4mA
2.4
—
Output Low Voltage
VOL
ILO = +4mA
—
0.4 V
Rev: 1.04a 10/2002
5/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
Power Supply Currents
Parameter
Symbol
Test Conditions
Operating
Supply
Current
0 to 70°C
–40 to 85°C
7 ns
8 ns
10 ns
12 ns
7 ns
8 ns
10 ns
12 ns
IDD (max)
CE ≤ VIL
All other inputs
≥ VIH or ≤ VIL
Min. cycle time
IOUT = 0 mA
145 mA
125 mA
100 mA
85 mA
150 mA
130 mA
105 mA
90 mA
Standby
Current
ISB1
(max)
CE ≥ VIH
All other inputs
≥ VIH or ≤VIL
Min. cycle time
25 mA
20 mA
20 mA
15 mA
30 mA
25 mA
25 mA
20 mA
Standby
Current
ISB2
(max)
CE ≥ VDD – 0.2 V
All other inputs
≥ VDD – 0.2 V or
≤ 0.2 V
5 mA
10 mA
AC Test Conditions
Output Load 1
Parameter
Conditions
Input high level
VIH = 2.4 V
Input low level
VIL = 0.4 V
50Ω
Input rise time
tr = 1 V/ns
VT = 1.4 V
Input fall time
tf = 1 V/ns
Input reference level
1.4 V
Output Load 2
Output reference level
1.4 V
3.3 V
Output load
Fig. 1& 2
DQ
Rev: 1.04a 10/2002
589Ω
DQ
Note:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted.
3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ
6/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
30pF1
5pF1
434Ω
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
AC Characteristics
Read Cycle
Parameter
Symbol
Read cycle time
-7
-8
-10
-12
Unit
Min
Max
Min
Max
Min
Max
Min
Max
tRC
7
—
8
—
10
—
12
—
ns
Address access time
tAA
—
7
—
8
—
10
—
12
ns
Chip enable access time (CE)
tAC
—
7
—
8
—
10
—
12
ns
Byte enable access time (UB, LB)
tAB
—
3
—
3.5
—
4
—
5
ns
Output enable to output valid (OE)
tOE
—
3
—
3.5
—
4
—
5
ns
Output hold from address change
tOH
3
—
3
—
3
—
3
—
ns
Chip enable to output in low Z (CE)
tLZ*
3
—
3
—
3
—
3
—
ns
Output enable to output in low Z (OE)
tOLZ*
0
—
0
—
0
—
0
—
ns
Byte enable to output in low Z (UB, LB)
tBLZ*
0
—
0
—
0
—
0
—
ns
Chip disable to output in High Z (CE)
tHZ*
—
3.5
—
4
—
5
—
6
ns
Output disable to output in High Z (OE)
tOHZ*
—
3
—
3.5
—
4
—
5
ns
Byte disable to output in High Z (UB, LB)
tBHZ*
—
3
—
3.5
—
4
—
5
ns
* These parameters are sampled and are not 100% tested.
Read Cycle 1: CE = OE = VIL, WE = VIH, UB and, or LB = VIL
tRC
Address
tAA
tOH
Data Out
Rev: 1.04a 10/2002
Previous Data
Data valid
7/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
Read Cycle 2: WE = VIH
tRC
Address
tAA
CE
tAC
tHZ
tLZ
tAB
UB, LB
tBHZ
tBLZ
OE
tOE
tOHZ
Data valid
tOLZ
High impedance
Data Out
Write Cycle
Parameter
Symbol
Write cycle time
-7
-8
-10
-12
Unit
Min
Max
Min
Max
Min
Max
Min
Max
tWC
7
—
8
—
10
—
12
—
ns
Address valid to end of write
tAW
5
—
5.5
—
7
—
8
—
ns
Chip enable to end of write
tCW
5
—
5.5
—
7
—
8
—
ns
Byte enable to end of write
tBW
5
—
5.5
—
7
—
8
—
ns
Data set up time
tDW
3.5
—
4
—
5
—
6
—
ns
Data hold time
tDH
0
—
0
—
0
—
0
—
ns
Write pulse width
tWP
5
—
5.5
—
7
—
8
—
ns
Address set up time
tAS
0
—
0
—
0
—
0
—
ns
Write recovery time (WE)
tWR
0
—
0
—
0
—
0
—
ns
Write recovery time (CE)
tWR1
0
—
0
—
0
—
0
—
ns
Output Low Z from end of write
tWLZ*
3
—
3
—
3
—
3
—
ns
Write to output in High Z
tWHZ*
—
3
—
3.5
—
4
—
5
ns
* These parameters are sampled and are not 100% tested.
Rev: 1.04a 10/2002
8/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
Write Cycle 1: WE control
tWC
Address
tAW
tWR
OE
tCW
CE
tBW
UB, LB
tAS
tWP
WE
tDW
tDH
Data valid
Data In
tWHZ
tWLZ
Data Out
High impedance
Write Cycle 2: CE control
tWC
Address
tAW
tWR1
OE
tAS
tCW
CE
tBW
UB, LB
tWP
WE
tDW
Data valid
Data In
Data Out
Rev: 1.04a 10/2002
tDH
High impedance
9/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
Write Cycle 3: UB, LB control
tWC
Address
tAW
tWR1
OE
tAS
tCW
CE
tBW
UB, LB
tWP
WE
tDW
Data valid
Data In
Data Out
Rev: 1.04a 10/2002
tDH
High impedance
10/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
44-Pin, 400 mil SOJ
Symbol
L
D
c
HE
GE
23
E
44
nom
max
min
nom
max
A
—
—
0.148
—
—
3.759
A1
0.025
—
—
0.635
—
—
A2
0.105 0.110 0.115
2.667
2.794
2.921
0.018
—
0.457
—
0.026 0.028 0.032
0.660
0.711
0.813
0.008
—
0.203
—
28.44
28.58
28.70
B
c
22
e
A
A2
A1
A
B
B1
Detail A
Q
—
—
—
—
D
1.120 1.125 1.130
E
0.395 0.400 0.405 10.033 10.160 10.287
e
y
Dimension in mm
min
B1
1
Dimension in inch
—
0.05
—
—
1.27
—
HE
0.435 0.440 0.445 11.049 11.176 11.303
GE
0.360 0.370 0.380
9.144
9.398
9.652
L
0.082 0.087 0.106
2.083
2.210
2.70
y
—
Q
0o
—
0.004
—
—
0.102
—
7o
0o
—
7o
Note:
1. Dimension D& E do not include interlead flash.
2. Dimension B1 does not include dambar protrusion/intrusion.
3. Controlling dimension: inches
Rev: 1.04a 10/2002
11/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
44-Pin, 400 mil TSOP-II
Dimension in inch
D
c
22
e
B
y
L
L1
A1
A
A2
1
A
HE
23
E
44
Detail A
Rev: 1.04a 10/2002
Q
Dimension in mm
Symbol
min
nom
max
min
nom
max
A
—
—
0.047
—
—
1.20
A1
0.002
—
—
0.05
—
—
A2
0.037
0.039
0.041
0.95
1.00
1.05
B
0.01
0.014
0.018
0.25
0.35
0.45
c
—
0.006
—
—
0.15
—
D
0.721
0.725
0.729
18.31
18.41
18.51
E
0.396
0.400
0.404
10.06
10.16
10.26
e
—
0.031
—
—
0.80
—
HE
0.455
0.463
0.471
11.56
11.76
11.96
L
0.016
0.020
0.024
0.40
0.50
0.60
L1
—
0.031
—
—
0.80
—
y
—
—
0.004
—
—
0.10
Q
o
—
o
o
—
5o
0
5
0
Note:
1. Dimension D& E do not include interlead flash.
2. Dimension B does not include dambar protrusion/intrusion.
3. Controlling dimension: mm
12/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
44-Pin TQFP (LQFP) Package
A2
D1
A1
E1
L1
C
e
Body Size
E1
D1
10
10
Lead Count
44
b
Standoff
Body Thickness
Lead Length
Lead Width
Lead Thickness
Lead Pitch
A1
A2
L1
b
c
e
0.1
1.4
1.0
0.3
0.127
0.8
Units: mm
Rev: 1.04a 10/2002
13/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
44 Pin TQFP (LQFP) Package
A2
D1
A1
E1
L1
C
e
Body Size
Standoff
Lead Count
E1 D1
A1
10
10
44
0.1
Body Thickness
A2
1.4
b
Lead Length Lead Width
L1
b
1.0
0.3
Lead Thickness
c
Lead Pitch
e
0.127
0.8
Units: mm
Rev: 1.04a 10/2002
14/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
6 mm x 10 mm Fine Pitch BGA
0.36(typ)
D
H
G
F
E
D
C
B
A
0.22 ± 0.05
1
0.75(typ).
3.75
3
4
5.25
Rev: 1.04a 10/2002
15/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Ball Dia. 0.35
Pitch 0.75
6
5
Bottom View
2
pin A1 index
1.20(max)
pin A1 index
units: mm
Top View
6.00 ± 0.10
8.00 ± 0.10
0.10
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
Ordering Information
Part Number*
Package
Access Time
Temp. Range
GS72116ATP-7
400 mil TSOP-II
7 ns
Commercial
GS72116ATP-8
400 mil TSOP-II
8 ns
Commercial
GS72116ATP-10
400 mil TSOP-II
10 ns
Commercial
GS72116ATP-12
400 mil TSOP-II
12 ns
Commercial
GS72116ATP-7I
400 mil TSOP-II
7 ns
Industrial
GS72116ATP-8I
400 mil TSOP-II
8 ns
Industrial
GS72116ATP-10I
400 mil TSOP-II
10 ns
Industrial
GS72116ATP-12I
400 mil TSOP-II
12 ns
Industrial
GS72116AJ-7
400 mil SOJ
7 ns
Commercial
GS72116AJ-8
400 mil SOJ
8 ns
Commercial
GS72116AJ-10
400 mil SOJ
10 ns
Commercial
GS72116AJ-12
400 mil SOJ
12 ns
Commercial
GS72116AJ-7I
400 mil SOJ
7 ns
Industrial
GS72116AJ-8I
400 mil SOJ
8 ns
Industrial
GS72116AJ-10I
400 mil SOJ
10 ns
Industrial
GS72116AJ-12I
400 mil SOJ
12 ns
Industrial
GS72116AT-7
44-pin TQFP
7 ns
Commercial
GS72116AT-8
44-pin TQFP
8 ns
Commercial
GS72116AT-10
44-pin TQFP
10 ns
Commercial
GS72116AT-12
44-pin TQFP
12 ns
Commercial
GS72116AT-7I
44-pin TQFP
7 ns
Industrial
GS72116AT-8I
44-pin TQFP
8 ns
Industrial
GS72116AT-10I
44-pin TQFP
10 ns
Industrial
GS72116AT-12I
44-pin TQFP
12 ns
Industrial
Rev: 1.04a 10/2002
16/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Status
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
Ordering Information
Part Number*
Package
Access Time
Temp. Range
GS72116AU-7
6 mm x 8 mm Fine Pitch BGA
7 ns
Commercial
GS72116AU-8
6 mm x 8 mm Fine Pitch BGA
8 ns
Commercial
GS72116AU-10
6 mm x 8 mm Fine Pitch BGA
10 ns
Commercial
GS72116AU-12
6 mm x 8 mm Fine Pitch BGA
12 ns
Commercial
GS72116AU-7I
6 mm x 8 mm Fine Pitch BGA
7 ns
Industrial
GS72116AU-8I
6 mm x 8 mm Fine Pitch BGA
8 ns
Industrial
GS72116AU-10I
6 mm x 8 mm Fine Pitch BGA
10 ns
Industrial
GS72116AU-12I
6 mm x 8 mm Fine Pitch BGA
12 ns
Industrial
Status
*
Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example:
GS72116ATP-8T
Rev: 1.04a 10/2002
17/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
GS72116ATP/J/T/U
2Mb Asynchronous Datasheet Revision History
Rev. Code: Old;
New
Types of Changes
Format or Content
Page #/Revisions/Reason
• Creation of new datasheet
72116A_r1
72116A_r1; 72116A_r1_01
Content
• Added 6 ns speed bin to entire document
72116A_r1_01; 72116A_r1_02
Content
• Updated all power numbers
• Changed 6 mm x 10 mm FP_BGA package designator from U to X
72116A_r1_02; 72116A_r1_03
Content
• Updated Recommended Operating Conditions table on page 5
• Removed 15 ns bin
• Changed FPBGA package from 6 x 10 to 6 x 8 (package U)
72116A_r1_03; 72116A_r1_04
Content
• Removed 6 ns speed bin from entire document
• Added 7 ns speed bin to entire document
Rev: 1.04a 10/2002
18/18
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
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