LINER LTC6084HDD-TRPBF Dual/quad 1.5mhz, rail-to-rail, cmos amplifi er Datasheet

LTC6084/LTC6085
Dual/Quad 1.5MHz,
Rail-to-Rail, CMOS
Amplifiers
DESCRIPTION
FEATURES
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Low Offset Voltage: 750μV Maximum
Low Offset Drift: 5μV/°C Maximum
Low Input Bias Current:
1pA (Typical at 25°C)
40pA (≤85°C)
Rail-to-Rail Inputs and Outputs
2.5V to 5.5V Operation Voltage
Gain Bandwidth Product: 1.5MHz
CMRR: 70dB Minimum
PSRR: 95dB Minimum
Supply Current: 110μA per Amplifier
Shutdown Current: 1.1μA per Amplifier
Available in 8-Lead MSOP and 10-Lead DFN
Packages (LTC6084) and 16-Lead SSOP and DFN
Packages (LTC6085)
APPLICATIONS
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Portable Test Equipment
Medical Equipment
Consumer Electronics
Data Acquisition
The LTC®6084/LTC6085 are dual/quad, low cost, low offset,
rail-to-rail input/output, unity-gain stable CMOS operational
amplifiers that feature 1pA of input bias current.
A 1.5MHz gain bandwidth, and 0.5V/μs slew rate, along
with the wide supply range and a low 0.75mV offset, make
the LTC6084/LTC6085 useful in an extensive variety of applications from data acquisition to medical equipment and
consumer electronics. The 110μA supply current and the
shutdown mode are ideal for signal processing applications
which demand performance with minimal power.
The LTC6084/LTC6085 have an output stage which swings
within 5mV of either supply rail to maximize signal dynamic
range in low supply applications. The input common
mode range includes the entire supply voltage. These op
amps are specified on power supply voltages of 2.5V and
5V from –40°C to 125°C. The dual amplifier LTC6084 is
available in 8-lead MSOP and 10-lead DFN packages. The
quad amplifier LTC6085 is available in 16-lead SSOP and
DFN packages.
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
Shock Sensor Amplifier
Input Bias Current
vs Common Mode Voltage
200k
470pF
20M
–
100k
2k
*
1/2
LTC6084
+
3V
VS = 5V
1000
3V
VOUT = 120mV/g
100k
0.22μF
60845 TA01
INPUT BIAS CURRENT (pA)
20M
10000
TA = 125°C
100
TA = 85°C
10
TA = 25°C
1
0.1
7Hz TO 5kHz
*SHOCK SENSOR MURATA ERIE PKGS-OOMX1
www.murata.com
0.01
0
0.5
1 1.5 2 2.5 3 3.5 4 4.5
COMMON MODE VOLTAGE (V)
5
60845 TA01b
60845f
1
LTC6084/LTC6085
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Total Supply Voltage (V+ to V–) ...................................6V
Input Voltage......................................................V – to V+
Input Current........................................................±10mA
SHDNA/SHDNB Voltage .....................................V – to V+
Output Short Circuit Duration (Note 2)............. Indefinite
Operating Temperature Range (Note 3)
LTC6084C/LTC6085C ........................... –40°C to 85°C
LTC6084H/LTC6085H ......................... –40°C to 125°C
Specified Temperature Range (Note 4)
LTC6084C/LTC6085C ............................... 0°C to 70°C
LTC6084H/LTC6085H ........................... –40°C to 125°
Junction Temperature ........................................... 150°C
Storage Temperature Range................... –65°C to 125°C
Lead Temperature (Soldering, 10 sec)
MS8, GN Only ................................................... 300°C
PIN CONFIGURATION
TOP VIEW
1
2
3
4
–
+A
+
–
OUTA
–INA
+INA
V–
B
OUTA
–INA
2
7 OUTB
6 –INB
5 +INB
+INA
V–
3
SHDNA
5
MS8 PACKAGE
8-LEAD PLASTIC MSOP
10 V+
1
8 V+
–
+A
9 OUTB
11
8 –INB
+
–
TOP VIEW
B
4
7 +INB
6 SHDNB
DD PACKAGE
10-LEAD (3mm × 3mm) PLASTIC DFN
TJMAX = 150°C, θJA = 200°C/W
TJMAX = 150°C, θJA = 43°C/W
EXPOSED PAD (PIN 11) IS V–, MUST BE SOLDERED TO PCB
TOP VIEW
TOP VIEW
1
2
+INA
3
V+
4
+INB
5
–INB
6
OUTB
7
NC
8
–
+A
+
–
–INA
D
16 OUTD
OUTA
1
15 –IND
–INA
2
14 +IND
+INA
3
V+
4
12 +INC
+INB
5
11 –INC
–INB
6
10 OUTC
OUTB
7
10 OUTC
NC
8
9
13
+
–B
+
C–
9
V–
NC
GN PACKAGE
16-LEAD PLASTIC SSOP NARROW
TJMAX = 150°C, θJA = 110°C/W
16 OUTD
–
+A
+
–
OUTA
D
14 +IND
13 V–
17
+
–B
15 –IND
+
C–
12 +INC
11 –INC
NC
DHC PACKAGE
16-LEAD (5mm × 3mm) PLASTIC DFN
TJMAX = 150°C, θJA = 43°C/W
EXPOSED PAD (PIN 17) IS V–, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
SPECIFIED TEMPERATURE RANGE
LTC6084CMS8#PBF
LTC6084CMS8#TRPBF
LTDNG
8-Lead Plastic MSOP
0°C to 70°C
LTC6084HMS8#PBF
LTC6084HMS8#TRPBF
LTDNG
8-Lead Plastic MSOP
–40°C to 125°C
LTC6084CDD#PBF
LTC6084CDD#TRPBF
LDNH
10-Lead (3mm × 3mm) Plastic DFN
0°C to 70°C
LTC6084HDD#PBF
LTC6084HDD#TRPBF
LDNH
10-Lead (3mm × 3mm) Plastic DFN
–40°C to 125°C
60845f
2
LTC6084/LTC6085
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
SPECIFIED TEMPERATURE RANGE
LTC6085CGN#PBF
LTC6085CGN#TRPBF
6085
16-Lead Plastic SSOP
0°C to 70°C
LTC6085HGN#PBF
LTC6085HGN#TRPBF
6085
16-Lead Plastic SSOP
–40°C to 125°C
LTC6085CDHC#PBF
LTC6085CDHC#TRPBF
6085
16-Lead (5mm × 3mm) Plastic DFN
0°C to 70°C
LTC6085HDHC#PBF
LTC6085HDHC#TRPBF
6085
16-Lead (5mm × 3mm) Plastic DFN
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. Test conditions are V+ = 2.5V, V– = 0V, VCM = 0.5V unless otherwise noted.
C SUFFIX
SYMBOL
PARAMETER
CONDITIONS
VOS
Offset Voltage (Note 5)
LTC6084MS8, LTC6085GN
LTC6084DD, LTC6085DHC
LTC6084MS8, LTC6085GN
LTC6084DD, LTC6085DHC
MIN
l
l
l
H SUFFIX
TYP
MAX
300
300
2
MIN
TYP
MAX
UNITS
750
1100
900
1350
300
300
750
1100
1100
1600
μV
μV
μV
μV
5
2
5
ΔVOS/ΔT
Input Offset Voltage Drift
(Note 6)
IB
Input Bias Current
(Notes 5, 7)
Guaranteed by 5V Test
Input Offset Current
(Notes 5, 7)
Guaranteed by 5V Test
Input Noise Voltage
Density
f = 1kHz
f = 10kHz
31
27
31
27
nV/√Hz
nV/√Hz
Input Noise Voltage
0.1Hz to 10Hz
3
3
μVP-P
0.56
0.56
fA/√Hz
IOS
en
in
0.5
l
l
Input Capacitance
Differential Mode
Common Mode
1
40
V–
750
pA
pA
150
pA
pA
0.5
30
Input Noise Current
Density (Note 8)
Input Common Mode
Range
CIN
1
l
V+
V–
μV/°C
V+
V
f = 100kHz
5
9
5
9
pF
pF
CMRR
Common Mode Rejection 0 ≤ VCM ≤ 2.5V
Ratio
l
64
63
80
64
61
80
dB
dB
PSRR
Power Supply Rejection
Ratio
VS = 2.5V to 5.5V
l
94
91
115
94
89
115
dB
dB
VOUT
Output Voltage, High,
(Referred to V+)
No Load
ISOURCE = 1mA
ISOURCE = 5mA
l
l
l
0.5
39
220
5
85
460
0.5
39
220
10
100
mV
mV
mV
Output Voltage, Low,
(Referred to V–)
No Load
ISINK = 1mA
ISINK = 5mA
l
l
l
0.5
36
200
5
85
460
0.5
36
200
10
100
mV
mV
mV
AVOL
Large-Signal Voltage Gain RLOAD = 10k
l
400
200
2000
400
150
2000
V/mV
V/mV
60845f
3
LTC6084/LTC6085
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. Test conditions are V+ = 2.5V, V– = 0V, VCM = 0.5V unless otherwise noted.
C SUFFIX
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
ISC
Output Short-Circuit
Current
Source and Sink
7.7
6
12.5
SR
Slew Rate
AV = 1
GBW
Gain Bandwidth Product
(fTEST = 10kHz)
RLOAD = 50k
Φ0
Phase Margin
RL = 10k, CL = 150pF, AV = 1
tS
Settling Time 0.1%
VSTEP = 1V, AV = 1
IS
Supply Current
(Per Amplifier)
No Load
Shutdown Current
(Per Amplifier)
Shutdown, VSHDNx ≤ 0.5V
l
Supply Voltage Range
Guaranteed by the PSRR Test
l
Channel Separation
fS = 10kHz
Shutdown Logic
SHDNx High
SHDNx Low
VS
tON
Turn On Time
tOFF
Turn Off Time
VSHDNx = 1.8V to 0.5V
Leakage of SHDN Pin
VSHDNx = 0V
l
H SUFFIX
MAX
MIN
TYP
7.7
4.5
12.5
mA
mA
0.5
V/μs
1.5
MHz
45
45
Deg
6
6
μs
0.5
l
0.9
0.7
l
1.5
0.9
0.6
130
140
110
130
145
μA
μA
0.2
0.3
0.2
0.5
μA
5.5
V
5.5
2.5
–120
–120
1.8
dB
1.8
0.5
0.5
7
7
1
l
UNITS
110
2.5
VSHDNx = 0.5V to 1.8V
MAX
0.2
μs
1
0.3
0.2
V
V
μs
0.5
μA
The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. Test
conditions are V+ = 5V, V– = 0V, VCM = 0.5V unless otherwise noted.
C SUFFIX
SYMBOL
PARAMETER
CONDITIONS
VOS
Offset Voltage (Note 5)
LTC6084MS8, LTC6085GN
LTC6084DD, LTC6085DHC
LTC6084MS8, LTC6085GN
LTC6084DD, LTC6085DHC
MIN
l
l
l
ΔVOS/ΔT
Input Offset Voltage Drift
(Note 6)
IB
Input Bias Current
(Notes 5, 7)
l
Input Offset Current
(Notes 5, 7)
l
IOS
en
in
Input Noise Voltage
Density
f = 1kHz
f = 10kHz
Input Noise Voltage
0.1Hz to 10Hz
CIN
Input Capacitance
Differential Mode
Common Mode
TYP
MAX
300
300
2
MIN
TYP
MAX
UNITS
750
1100
900
1350
300
300
750
1100
1100
1600
μV
μV
μV
μV
5
2
5
1
1
40
0.5
31
27
l
μV/°C
750
pA
pA
150
pA
pA
0.5
30
Input Noise Current
Density (Note 8)
Input Common Mode
Range
H SUFFIX
31
27
nV/√Hz
nV/√Hz
3
3
μVP-P
0.56
0.56
fA/√Hz
V–
V+
V–
V+
V
f = 100kHz
5
9
5
9
pF
pF
60845f
4
LTC6084/LTC6085
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. Test conditions are V+ = 5V, V– = 0V, VCM = 0.5V unless otherwise noted.
C SUFFIX
CONDITIONS
H SUFFIX
SYMBOL
PARAMETER
CMRR
Common Mode Rejection 0 ≤ VCM ≤ 5V
Ratio
MIN
TYP
MIN
TYP
l
70
68
84
70
66
84
dB
dB
PSRR
Power Supply Rejection
Ratio
VS = 2.5V to 5.5V
l
94
91
115
94
89
115
dB
dB
VOUT
Output Voltage, High,
(Referred to V+)
No Load
ISOURCE = 1mA
ISOURCE = 5mA
l
l
l
0.5
39
220
5
85
460
0.5
39
220
10
100
mV
mV
mV
Output Voltage, Low,
(Referred to V–)
No Load
ISINK = 1mA
ISINK = 5mA
l
l
l
0.5
36
200
5
85
460
0.5
36
200
10
100
mV
mV
mV
AVOL
Large-Signal Voltage Gain RLOAD = 10k
ISC
Output Short-Circuit
Current
Source and Sink
SR
Slew Rate
AV = 1
GBW
Gain Bandwidth Product
(fTEST = 10kHz)
RLOAD = 50k
Φ0
Phase Margin
RL = 10k, CL = 150pF, AV = 1
tS
Settling Time 0.1%
VSTEP = 1V, AV = 1
IS
Supply Current
(Per Amplifier)
No Load
Shutdown Current
(Per Amplifier)
Shutdown, VSHDNx ≤ 1.2V
l
Supply Voltage Range
Guaranteed by the PSRR Test
l
VS
Channel Separation
fS = 10kHz
Shutdown Logic
SHDNx High
SHDNx Low
MAX
MAX
UNITS
l
1000
400
5000
1000
300
5000
V/mV
V/mV
l
7.7
6
12.5
7.7
4.5
12.5
mA
mA
0.5
V/μs
1.5
MHz
45
Deg
0.5
l
0.9
0.7
1.5
0.9
0.6
45
5
l
5
μs
110
130
140
110
130
145
μA
μA
1.1
1.8
1.1
2
μA
5.5
V
2.5
5.5
2.5
–120
–120
3.5
dB
3.5
1.2
1.2
V
V
tON
Turn On Time
VSHDNx = 1.2V to 3.5V
7
7
μs
tOFF
Turn Off Time
VSHDNx = 3.5V to 1.2V
1
1
μs
Leakage of SHDN Pin
VSHDNx = 0V
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: A heat sink may be required to keep the junction temperature
below the absolute maximum. This depends on the power supply voltage
and the total output current.
Note 3: The LTC6084C/LTC6085C are guaranteed functional over the
operating temperature range of –40°C to 85°C. The LTC6084H/LTC6085H
are guaranteed functional over the operating temperature range of –40°C
to 125°C.
Note 4: The LTC6084C/LTC6085C are guaranteed to meet specified
performance from 0°C to 70°C. The LTC6084C/LTC6085C are designed,
characterized and expected to meet specified performance from –40°C
l
0.5
0.9
0.5
1.2
μA
to 85°C but are not tested or QA sampled at these temperatures. The
LTC6084H/LTC6085H are guaranteed to meet specified performance from
–40°C to 125°C.
Note 5: ESD (Electrostatic Discharge) sensitive device. ESD protection
devices are used extensively internal to the LTC6084/LTC6085; however,
high electrostatic discharge can damage or degrade the device. Use proper
ESD handling precautions.
Note 6: This parameter is not 100% tested.
Note 7: This specification is limited by high speed automated test
capability. See Typical Performance Characteristic curves for actual
performance.
Note 8: Current noise is calculated from in = √2qIB, where q = 1.6 • 10–19
coulombs.
60845f
5
LTC6084/LTC6085
TYPICAL PERFORMANCE CHARACTERISTICS
VOS Distribution
VOS vs VCM
VS = 5V
0.8 TA = 25°C
REPRESENTATIVE PARTS
0.6
PERCENT OF UNITS (%)
LTC6084 MS8
18 VS = 5V
VCM = 0.5V
16 T = 25°C
A
14 100 UNITS
0.4
12
10
8
0.2
0.0
–0.2
6
–0.4
4
–0.6
2
–0.8
0
VOS Drift Distribution
1.0
VOS (mV)
PERCENTAGE OF UNITS (%)
20
–1 –0.8 –0.6 –0.4 –0.2 0 0.2 0.4 0.6 0.8
VOS (mV)
–1.0
1
0
0.5
1
1.5
2
2.5 3
VCM (V)
3.5
4
60845 G01
10000
INPUT BIAS CURRENT (pA)
100
10
Input Noise Voltage vs Frequency
100
VS = 5V
VS = 5V
VCM = 2.5V
TA = 25°C
90
INPUT NOISE VOLTAGE (nV/√Hz)
VS = 5V
VCM = 2.5V
–1 –0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
DISTRIBUTION (μV/°C)
60845 G03
Input Bias Current
vs Common Mode Voltage
1000
INPUT BIAS CURRENT (pA)
5
LTC6084 MS8
VS = 5V
VCM = 2.5V
TA = –40°C TO 125°C
78 UNITS
60845 G02
Input Bias vs Temperature
1000
4.5
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
TA = 125°C
100
TA = 85°C
10
TA = 25°C
1
0.1
80
70
60
50
40
30
20
10
1
25
40
55
70
85 100
TEMPERATURE (°C)
115
0.01
130
0
0
0.5
1 1.5 2 2.5 3 3.5 4 4.5
COMMON MODE VOLTAGE (V)
60845 G04
5
OUTPUT HIGH SATURATION VOLTAGE (V)
5.0
NOISE CURRENT (fA/√Hz)
500
400
300
200
100
0
100k
Output Saturation Voltage
vs Load Current (Output High)
600
VS = 5V
VCM = 2.5V
INPUT NOISE VOLTAGE (2μV/DIV)
1k
10k
FREQUENCY (Hz)
60845 G06
Input Noise Current vs Frequency
60845 G07
100
60845 G05
0.1Hz to 10Hz Output Voltage
Noise
TIME (1s/DIV)
10
1
10
100
1k
FREQUENCY (Hz)
10k
100k
60845 G08
VS = 5V
4.5 V = 2.5V
CM
SOURCE
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
TA = –55°C
TA = 25°C
TA = 125°C
1
10
LOAD CURRENT (mA)
SINK
100
60845 G09
60845f
6
LTC6084/LTC6085
TYPICAL PERFORMANCE CHARACTERISTICS
Supply Current vs Supply Voltage
Supply Current vs Temperature
140
140
120
PER AMPLIFIER
VCM = 0.5V
SUPPLY CURRENT (μA)
SUPPLY CURRENT (μA)
130
100
80
60
40
0
0
0.5
1 1.5 2 2.5 3 3.5 4
TOTAL SUPPLY VOLTAGE (V)
4.5
VS = 5V
110
VS = 2.5V
100
PER AMPLIFIER
VCM = 0.5V
TA = 25°C
20
120
90
–55 –40 –25 –10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
5
60845 G10
CMRR vs Frequency
120
110
100
90
80
70
60
50
40
30
20
10
0
–10
100
40
GAIN
20
0
–20
VS = 5V
VS = 2.5V
1k
10k
–40
10M
100k
1M
FREQUENCY (Hz)
VS = 5V
VCM = 2.5V
RL = 1k
TA = 25°C
50
40
10
0
1k
10k
100k
1M
FREQUENCY (Hz)
–10
100
10M
AV = 10
AV = 2
AV = 1
0.1
1k
10k
100k
FREQUENCY (Hz)
1M
Capacitive Load Handling
40
VS = 5V
VCM = 1V
AV = 1
TA = 25°C
100
10M
60845 G14
VS = 5V
35 VCM = 2.5V
AV = 1
10
1
RS = 10Ω
30
OVERSHOOT (%)
OUTPUT IMPEDANCE (kΩ)
OUTPUT IMPEDANCE (Ω)
60
20
1000
VS = 5V
V = 2.5V
1000 T CM= 25°C
A
–
+
25
20
RS
CL
RS = 50Ω
15
10
0.01
0.001
100
70
Disabled Output Impedance
vs Frequency
10000
1
80
60845 G13
Output Impedance vs Frequency
100
VS = 5V
VCM = 2.5V
TA = 25°C
90
30
60845 G12
10
100
PSRR (dB)
PHASE
PSRR vs Frequency
CMRR (dB)
CL = 5pF
RL = 10k
VCM = VS/2 80
TA = 25°C
60
PHASE (DEG)
GAIN (dB)
Open-Loop Gain vs Frequency
100
90
80
70
60
50
40
30
20
10
0
–10
–20
–30
–40
60845 G11
5
1k
10k 100k
1M
FREQUENCY (Hz)
10M
100M
60845 G14
0.1
100
1k
10k
100k
FREQUENCY (Hz)
1M
10M
60845 G16
0
10
100
CAPACITIVE LOAD (pF)
1000
60845 G17
60845f
7
LTC6084/LTC6085
TYPICAL PERFORMANCE CHARACTERISTICS
Capacitive Load Handling
–90
50
OVERSHOOT (%)
RS = 50Ω
25
20
1k
15
10
–
+
1k
5
RS
100
1000
CAPACITIVE LOAD (pF)
–105
–110
–115
–120
0.01
0.1
1
FREQUENCY (MHz)
AV = 1,
VIN = 1VP-P
0.001
0.01
10
0.01
AV = –2, VIN = 1VP-P
1
10
FREQUENCY (kHz)
100
Total Harmonic Distortion and
Noise vs Load Resistance
0.1
VS = 3V AT 20kHz
0.1
VS = 5V AT 20kHz
0.01
VS = 3V AT 1kHz
0.001
AV = 1, VIN = 1VP-P
0.1
60845 G20
RL = 10k
VCM = VS/2
AV = 1
1
THD AND NOISE (%)
THD AND NOISE (%)
10
AV = 2, VIN = 1VP-P
AV = 1
VCM = VS/2 AT 1kHz
0.01
VS = 3V, VIN = 1VP-P
0.001
VS = 5V, VIN = 2VP-P
0.001
VS = 5V AT 1kHz
1
10
FREQUENCY (kHz)
100
0.0001
0
60845 G21
0.5
1
1.5 2 2.5 3 3.5 4
OUTPUT VOLTAGE (VP-P)
4.5
5
0.0001
0.1
Large Signal Response
1V/DIV
100mV/DIV
2μs/DIV
60845 G24
100
60845 G23
Small Signal Response
100mV/DIV
1
10
LOAD RESISTANCE TO GROUND (kΩ)
60845 G22
Small Signal Response
VS = 5V
AV = 1
RL = ∞
0.01
Total Harmonic Distortion and
Noise vs Output Voltage
0.1
0.1
AV = 2, VIN = 1VP-P
60845 G19
VS = 5V
VCM = 2.5V
RL = 10k
0.0001
0.01
AV = –2, VIN = 1VP-P
AV = 1, VIN = 2VP-P
–135
0.001
10000
Total Harmonic Distortion and
Noise vs Frequency
AV = 1, VIN = 2VP-P
0.1
–125
60845 G17
1
VS = 3V
VCM = 1.5V
RL = 10k
–130
CL
10
–100
THD AND NOISE (%)
RS = 10Ω
30
0
CHANNEL SEPARATION (dB)
–95
35
1
VS = 5V
VCM = 2.5V
TA = 25°C
THD AND NOISE (%)
VS = 5V
45 VCM = 2.5V
A = –1
40 V
Total Harmonic Distortion and
Noise vs Frequency
Channel Separation vs Frequency
VS = 5V
AV = 1
RL = ∞
CL = 220pF
2μs/DIV
60845 G25
VS = 5V
AV = 1
RL = ∞
20μs/DIV
60845 G26
60845f
8
LTC6084/LTC6085
TYPICAL PERFORMANCE CHARACTERISTICS
Large Signal Response
Large Signal Response
1V/DIV
Large Signal Response
1V/DIV
1V/DIV
VS = 5V
AV = –1
RL = 1k
20μs/DIV
60845 G27
VS = 5V
AV = 1
RL = ∞
20μs/DIV
60845 G28
VS = 5V
AV = –1
RL = 1k
20μs/DIV
60845 G29
PIN FUNCTIONS
OUT: Amplifier Output.
–IN: Inverting Input.
+IN: Noninverting Input.
V+: Positive Supply.
V–: Negative Supply.
SHDNB: Shutdown Pin of Amplifier B, active low and only
available with the LTC6084DD. An internal current source
pulls the pin to V+ when floating.
NC: Not Internally Connected.
Exposed Pad: Connected to V–.
SHDNA: Shutdown Pin of Amplifier A, active low and only
available with the LTC6084DD. An internal current source
pulls the pin to V+ when floating.
60845f
9
LTC6084/LTC6085
APPLICATIONS INFORMATION
OUT
R
NO SOLDER MASK
OVER THE GUARD RING
NO LEAKAGE
CURRENT
OUT
LTC6084
IN–
R
LTC6084
R
IN–
VIN
IN+
IN+
LEAKAGE
CURRENT
GUARD
RING
GND
V–
V–
60845 F01
60845 F02
Figure 1. Sample Layout. Unity-Gain Configuration. Using Guard
Ring to Shield High Impedance Input from Board Leakage
Figure 2. Sample Layout. Inverting Gain Configuration. Using
Guard Ring to Shield High Impedance Input from Board Leakage
Rail-to-Rail Input
than the bias current of the operational amplifier. A guard
ring around the high impedance input traces driven by a
low impedance source equal to the input voltage prevents
such leakage problems. The guard ring should extend
as far as necessary to shield the high impedance signal
from any and all leakage paths. Figure 1 shows the use
of a guard ring in a unity-gain configuration. In this case
the guard ring is connected to the output and is shielding
the high impedance noninverting input from V–. Figure 2
shows the inverting gain configuration.
The input stage of LTC6084/LTC6085 combines both PMOS
and NMOS differential pairs, extending its input common
mode voltage to both positive and negative supply voltages. At high input common mode range, NMOS pair is
on. At low common mode range, the PMOS pair is on. The
transition happens when the common voltage is between
1.3 and 0.9V below the positive supply.
Achieving Low Input Bias Current
The DD and DHC packages are leadless and make contact
to the PCB beneath the package. Solder flux used during
the attachment of the part to the PCB can create leakage
current paths and can degrade the input bias current performance of the part. All inputs are susceptible because
the backside paddle is connected to V– internally. As the
input voltage or V– changes, a leakage path can be formed
and alter the observed input bias current. For lowest bias
current use the LTC6084/LTC6085 in the leaded MSOP/GN
package. With fine PCB design rules, you can also provide
a guard ring around the inputs.
Rail-to-Rail Output
For example, in high source impedance applications such as
pH probes, photo diodes, strain gauges, etc., the low input
bias current of these parts requires a clean board layout to
minimize additional leakage current into a high impedance
signal node. A mere 100GΩ of PC board resistance between
a 5V supply trace and input trace near ground potential
adds 50pA of leakage current. This leakage is far greater
Capacitive Load
The output stage of the LTC6084/LTC6085 swings within
5mV of the supply rails when driving high impedance
loads, in other words when no DC load current is present.
See the Typical Performance Characteristics for curves of
output swing versus load current. The class AB design of
the output stage enables the op amp to supply load currents which are much greater than the quiescent supply
current. For example, the room temperature short circuit
current is typically 12.5mA.
LTC6084/LTC6085 can drive a capacitive load up to 300pF in
unity gain. The capacitive load driving capability increases
as the amplifier is used in higher gain configurations. A
small series resistance between the output and the load
further increases the amount of capacitance the amplifier
can drive.
60845f
10
LTC6084/LTC6085
APPLICATIONS INFORMATION
SHDN Pins
ESD
Pins 5 and 6 are used for power shutdown of the LTC6084
in the DD package. If they are floating, internal current
sources pull pins 5 and 6 to V+ and the amplifiers operate
normally. In shutdown the amplifier output is high impedance, and each amplifier draws less than 1μA current.
This feature allows the part to be used in muxed output
applications as shown in Figure 3.
The LTC6084/LTC6085 has reverse-biased ESD protection
diodes on all inputs and outputs as shown in the Simplified Schematic. If these pins are forced beyond either
supply, unlimited current will flow through these diodes.
If the current is transient and limited to 100mA or less,
no damage to the device will occur.
10k
10k
5V
5V
The amplifier input bias current is the leakage current of
these ESD diodes. This leakage is a function of the temperature and common mode voltage of the amplifier, as
shown in the Typical Performance Characteristics.
+
A
10k
–
INA
LTC6084
(DD PACKAGE)
Noise
OUT
In the frequency region above 1kHz, the LTC6084/LTC6085
shows good noise voltage performance. In this region,
noise can be dominated by the total source resistance of the
particular application. Specifically, these amplifiers exhibit
the noise of a 58k resistor, meaning it is desirable to keep
the source and feedback resistance at or below this value,
i.e., RS + RG||RFB ≤ 58k. Above this total source impedance,
the noise voltage is dominated by the resistors.
SHDN
A
10k
10k
+
5V
10k
B
10k
–
INB
SEL = 5V, OUT = –INA
SEL = 0V, OUT = –INB
10k
5V
SEL
SHDN
B
FAIRCHILD
NC7SZ04 OR
EQUIVALENT
60845 F03
Figure 3. Inverting Amplifier with Muxed Output
At low frequency, noise current can be estimated from the
expression in = √2qIB, where q = 1.6 • 10–19 coulombs.
Equating √4kTRΔf and R√2qIBΔf shows that for a source
resistor below 50GΩ the amplifier noise is dominated by
the source resistance. Noise current rises with frequency.
See the curve Input Noise Current vs Frequency in the
Typical Performance Characteristics section.
60845f
11
LTC6084/LTC6085
SIMPLIFIED SCHEMATIC
Simplified Schematic of the Amplifier
V+
R1
M10
R2
M11
M8
I1
1μA
I2
V–
C1
+
–
V+
A1
VBIAS
D4
M5
V+
+IN
V+
D7
V+
D3
OUTPUT
CONTROL
M6 M7
M1 M2
D8
–IN
V–
D5
D2
BIAS
GENERATION
SHDN
A2
+
–
V–
C2
D1
V–
OUT
D6
V–
NOTE: SHDN IS ONLY AVAILABLE
IN THE DFN PACKAGE
M9
M4
M3
R3
V–
R4
60845 SS
TYPICAL APPLICATIONS
Gain Selectable Amplifier
5V
10k
+
A
–
VIN
SHDNA
4.02k
1k
10k
+
–
VOUT
B
SHDNB
24.3k
1k
5V
SEL
SEL = 5V, GAIN = 25
SEL = 0V, GAIN = 5
A, B: LTC6084 in DFN10
FAIRCHILD NC7SZ04 OR EQUIVALENT
60845 TA02
60845f
12
LTC6084/LTC6085
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ±0.05
3.50 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.115
TYP
6
3.00 ±0.10
(4 SIDES)
0.38 ± 0.10
10
1.65 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
(DD) DFN 1103
5
0.200 REF
1
0.25 ± 0.05
0.50 BSC
0.75 ±0.05
0.00 – 0.05
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
60845f
13
LTC6084/LTC6085
PACKAGE DESCRIPTION
DHC Package
16-Lead Plastic DFN (5mm × 3mm)
(Reference LTC DWG # 05-08-1706)
0.65 ±0.05
3.50 ±0.05
1.65 ±0.05
2.20 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
4.40 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.115
TYP
5.00 ±0.10
(2 SIDES)
R = 0.20
TYP
3.00 ±0.10
(2 SIDES)
9
0.40 ± 0.10
16
1.65 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
PIN 1
NOTCH
(DHC16) DFN 1103
8
0.200 REF
1
0.25 ± 0.05
0.50 BSC
0.75 ±0.05
4.40 ±0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
60845f
14
LTC6084/LTC6085
PACKAGE DESCRIPTION
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
0.889 ± 0.127
(.035 ± .005)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
0.65
(.0256)
BSC
0.42 ± 0.038
(.0165 ± .0015)
TYP
8
0.52
(.0205)
REF
7 6 5
RECOMMENDED SOLDER PAD LAYOUT
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
4.90 ± 0.152
(.193 ± .006)
DETAIL “A”
0.254
(.010)
0° – 6° TYP
GAUGE PLANE
1
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
2 3
4
1.10
(.043)
MAX
0.86
(.034)
REF
0.18
(.007)
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.1016 ± 0.0508
(.004 ± .002)
0.65
(.0256)
BSC
MSOP (MS8) 0307 REV F
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.189 – .196*
(4.801 – 4.978)
.045 ±.005
.009
(0.229)
REF
16 15 14 13 12 11 10 9
.254 MIN
.150 – .165
.229 – .244
(5.817 – 6.198)
.0165 ± .0015
.150 – .157**
(3.810 – 3.988)
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
1
.015 ± .004
× 45°
(0.38 ± 0.10)
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
2 3
4
5 6
7
8
.004 – .0098
(0.102 – 0.249)
0° – 8° TYP
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
INCHES
2. DIMENSIONS ARE IN
(MILLIMETERS)
.008 – .012
(0.203 – 0.305)
TYP
.0250
(0.635)
BSC
GN16 (SSOP) 0204
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
60845f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
LTC6084/LTC6085
TYPICAL APPLICATION
Bipolar Analog Isolation Amplifier
VCC
1M
1%
10pF
OC1
VCC
OC1
–
+
VIN
1M
1%
1M
3pF
2k
+5V
1/2 LTC6084
OC1
OC2
10pF
–
+
VOUT = VIN
LTC6240HV
–5V
OC2
–
+
1/2 LTC6084
GNDB
2k
GNDA
OC2
VCC = 5V,
VIN = ±5V
RELATIVE TO GNDA
BW ≈ 40kHz, EITHER POLARITY
LARGE SIGNAL TRANSITION DELAY ≈ 50μs
SMALL SIGNAL DEAD ZONE: |VIN| ≤ 10mV
OC1, OC2: AVAGO TECHNOLOGIES HCNR201
www.avagotech.com
VOUT = ±5V,
RELATIVE TO GNDB
60845 TA03
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC6078/LTC6079
Dual/Quad Micropower Precision Rail-to-Rail Op Amps
25μV VOS(MAX), 0.7μV/°C VOS Drift(MAX), 1pA IBIAS(MAX)
LTC6081/LTC6082
Dual/Quad Precision Rail-to-Rail Input/Output Amps
70μV VOS(MAX), 0.8μV/°C VOS Drift(MAX), 1pA IBIAS(MAX)
LTC6087/LTC6088
Dual/Quad 14MHz Rail-to-Rail Input/Output Amps
750μV VOS(MAX), 5μV/°C VOS Drift(MAX), 1pA IBIAS
LTC6240/LTC6241/
LTC6242
Single/Dual/Quad Low Noise Rail-to-Rail Output Op Amps 7nV/√Hz Noise, 0.2pA IBIAS, 18MHz Gain Bandwidth
LTC6244
Dual Low Noise Rail-to-Rail Output Op Amps
8nV/√Hz Noise, 1pA IBIAS, 50MHz Gain Bandwidth
60845f
16 Linear Technology Corporation
LT 0708 • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2008
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